WO2025088750A1 - Light-emitting element, display device, and method for manufacturing light-emitting element - Google Patents
Light-emitting element, display device, and method for manufacturing light-emitting element Download PDFInfo
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- WO2025088750A1 WO2025088750A1 PCT/JP2023/038665 JP2023038665W WO2025088750A1 WO 2025088750 A1 WO2025088750 A1 WO 2025088750A1 JP 2023038665 W JP2023038665 W JP 2023038665W WO 2025088750 A1 WO2025088750 A1 WO 2025088750A1
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- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
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- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
- H05B33/24—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers of metallic reflective layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/26—Light sources with substantially two-dimensional radiating surfaces characterised by the composition or arrangement of the conductive material used as an electrode
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/26—Light sources with substantially two-dimensional radiating surfaces characterised by the composition or arrangement of the conductive material used as an electrode
- H05B33/28—Light sources with substantially two-dimensional radiating surfaces characterised by the composition or arrangement of the conductive material used as an electrode of translucent electrodes
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
- H10K50/115—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers comprising active inorganic nanostructures, e.g. luminescent quantum dots
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
- H10K50/828—Transparent cathodes, e.g. comprising thin metal layers
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/852—Arrangements for extracting light from the devices comprising a resonant cavity structure, e.g. Bragg reflector pair
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- H—ELECTRICITY
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
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- H—ELECTRICITY
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/10—Transparent electrodes, e.g. using graphene
Definitions
- This disclosure relates to a light-emitting device, a display device, and a method for manufacturing a light-emitting device.
- Patent Document 1 discloses an organic EL display device that uses a microcavity structure to improve light extraction efficiency.
- a light-emitting element includes a first electrode, a second electrode including a non-transparent conductive material having a thickness that allows light to pass through, and a functional layer including a light-emitting layer located between the first electrode and the second electrode, the second electrode including a first portion and a second portion having a thickness greater than that of the first portion, and the functional layer including a thin film portion located between the first electrode and the first portion, and a thick film portion located between the first electrode and the second portion having a thickness greater than that of the thin film portion.
- a light-emitting element includes a first electrode, a second electrode that includes a translucent conductive material and is light-transmitting, and a functional layer that is located between the first electrode and the second electrode and includes a light-emitting layer, the second electrode includes a first portion and a second portion that is thicker than the first portion, and the functional layer includes a thin film portion that is located between the first electrode and the second portion, and a thick film portion that is located between the first electrode and the first portion and is thicker than the thin film portion.
- the display device is configured to include red light-emitting elements, green light-emitting elements, and blue light-emitting elements, each of which is a light-emitting element according to one embodiment of the present disclosure.
- the method for manufacturing a light-emitting element is a method for manufacturing a light-emitting element having a first electrode, a second electrode, and a functional layer including a light-emitting layer, located between the first electrode and the second electrode, and includes the steps of forming the functional layer having a thin film portion and a thick film portion having a thickness greater than that of the thin film portion, and forming the second electrode having a first portion and a second portion having a thickness greater than that of the first portion, and in the step of forming the second electrode, the first portion and the second portion are formed by performing a deposition process multiple times.
- the light extraction efficiency is improved.
- 1 is a cross-sectional view illustrating a configuration example of a light-emitting device according to an embodiment of the present disclosure.
- 2 is a cross-sectional view showing an example of a functional layer shown in FIG. 1 .
- 1A to 1C are cross-sectional views illustrating an example of a method for manufacturing a light-emitting device according to an embodiment of the present disclosure.
- 5A to 5C are cross-sectional views showing an example of a step of forming a second electrode.
- 5A to 5C are cross-sectional views showing an example of a step of forming a second electrode.
- 5A to 5C are cross-sectional views showing an example of a step of forming a second electrode.
- FIG. 1 is a plan view illustrating a configuration example of a display device according to an embodiment of the present disclosure. 1 is a cross-sectional view illustrating a configuration example of a display device according to an embodiment of the present disclosure.
- FIG. 1 is a plan view illustrating a configuration example of a display device according to an embodiment of the present disclosure. 1 is a cross-sectional view illustrating a configuration example of a display device according to an embodiment of the present disclosure.
- 11 is a plan view showing a modified example of the configuration of a display device according to an embodiment of the present disclosure.
- 13 is a graph showing the relationship between the thickness of the second electrode and the luminance front extraction efficiency in a red light emitting element.
- 13 is a graph showing the relationship between the thickness of the second electrode and the luminance front extraction efficiency in a green light emitting element.
- Fig. 1 is a cross-sectional view showing a configuration example of a light-emitting element according to an embodiment of the present disclosure.
- the light-emitting element 10 includes a first electrode 11, a second electrode 12 including a non-translucent conductive material having a thickness that allows light to pass through, and a functional layer 13 located between the first electrode 11 and the second electrode 12.
- the second electrode 12 includes a first portion P1 and a second portion P2 having a thickness greater than that of the first portion P1.
- the functional layer 13 includes a thin film portion Q1 located between the first electrode 11 and the first portion P1, and a thick film portion Q2 located between the first electrode 11 and the second portion P2 and having a thickness greater than that of the thin film portion Q1.
- the light-emitting element 10 may be formed on a support substrate BP, and a circuit layer CL may be formed between the support substrate BP and the light-emitting element 10.
- the light-emitting element 10 may further include a transparent layer 14 located between the first electrode 11 and the functional layer 13.
- the light-emitting element 10 may further include an edge cover 15 that covers the edge of the first electrode 11 or the second electrode 12.
- the functional layer 13 may include an emitting layer EML.
- a portion EM1 located in the thin film portion Q1 has a smaller thickness than a portion EM2 located in the thick film portion Q2.
- the emitting layer EML may include luminescent quantum dots or may include a luminescent organic material.
- the quantum dots may emit light, for example, by electroluminescence.
- the functional layer 13 may additionally include one or more of a hole injection layer, a hole transport layer HTL, an electron blocking layer, a hole blocking layer, an electron transport layer ETL, and an electron injection layer.
- the additional layers may have a substantially constant thickness, or the portion located in the thin film portion Q1 may have a smaller thickness than the portion located in the thick film portion Q2.
- the thin film portion Q1 may be located outside the thick film portion Q2.
- the thin film portion Q1 may be a peripheral portion of the functional layer 13.
- the first portion P1 and the second portion P2 may be located within the light-emitting region where the light-emitting layer EML emits light.
- the non-transparent conductive material contained in the second electrode 12 has a front reflectance of 50% or more in the bulk.
- the front reflectance in the bulk is the reflectance when visible light is incident from a vacuum onto the bulk of the material in the normal direction to the incident surface.
- the non-transparent conductive material may be a metal material, and may have an extinction coefficient of 1 or more at the peak wavelength of the emitting layer EML.
- the metal material may include one or more selected from aluminum, magnesium, silver, chromium, nickel, copper, tungsten, platinum, tin, gold, and silver.
- the first electrode 11 may be a light-reflecting electrode.
- the second electrode 12 may be located above the first electrode 11, and an optical resonator that reinforces light in a specific wavelength range may be formed between the upper surface of the first electrode 11 and the lower surface of the second electrode 12.
- a light-reflecting layer may be provided separately from the first electrode 11.
- the second electrode 12 may be located above the light-reflecting layer, and an optical resonator that reinforces light in a specific wavelength range may be formed between the upper surface of the light-reflecting layer and the lower surface of the second electrode 12.
- the specific wavelength range may be, for example, the peak wavelength of the light-emitting layer EML and a wavelength range of ⁇ 10 nm therebetween.
- the optical resonator may be formed anywhere in the light-emitting region of the functional layer 13, and may be formed in either the thin film portion Q1 or the thick film portion Q2.
- the light-emitting element 10 is a top-emission type.
- the non-transparent conductive material contained in the second electrode 12 may have a so-called "fixed end reflection" in its bulk. Reflection in the bulk is the reflection that occurs when visible light is incident from a vacuum into the bulk of the material in the normal direction to the incident surface. Since the thickness of the second electrode 12 is small enough to allow light to pass through, the phase difference due to reflection depends on the thickness of the reflected portion of the second electrode 12. The thicker the second electrode 12, the greater the phase difference.
- L is the optical distance between the first electrode 11 and the second electrode 12
- ⁇ is the peak wavelength of the emission spectrum of the emitting layer EML
- ⁇ is the phase shift (rad) due to reflection at the second electrode 12
- m is an integer.
- the optical distance L is the product of the refractive index n and the thickness d between the first electrode 11 and the second electrode 12.
- the difference between the optical path length LA1 of the thin film portion Q1 and the optical path length LA2 of the thick film portion Q2 is 5% or more of the optical path length LA1
- the difference between the thickness of the thin film portion Q1 and the thickness of the thick film portion Q2 is 5% or more of the thickness of the thin film portion Q1
- uneven brightness and color within the pixel will become noticeable.
- the difference in the peak wavelength within the pixel of the light emitted from the light emitting element 10 exceeds 10 nm, uneven color will become noticeable. Therefore, it is preferable that the difference between the maximum peak wavelength and the minimum peak wavelength within one light emitting element be 10 nm or less.
- the second portion P2 of the second electrode 12 is formed to correspond to the thick film portion Q2, thereby making it possible to suppress at least one of brightness unevenness and color unevenness within the pixel.
- the phase shift ⁇ due to reflection at the second electrode 12 can be approximated by the following equation (2).
- tan ⁇ (2 ⁇ nf ⁇ k)/(nf 2 -ns 2 +k 2 )...(2)
- the refractive index of the second electrode 12 is ns
- the extinction coefficient of the second electrode 12 is k
- the refractive index of the portion of the functional layer 13 adjacent to the second electrode 12 is nf.
- the second electrode 12 is silver
- the refractive index ns is smaller than 1
- the extinction coefficient k is 1 or more and increases as the wavelength becomes longer. Therefore, the phase shift ⁇ increases in the order of red pixel, green pixel, and blue pixel.
- the thickness of the second portion P2 of the second electrode 12 may be formed so that it decreases in the order of red pixel, green pixel, and blue pixel.
- the thickness of the second portion P2 of the second electrode 12 is formed to be 1000 nm or less, and more preferably 500 nm or less. This is because the transmittance of the second electrode 12, which contains a non-transparent conductive material, drops significantly as the thickness increases.
- FIG. 3 is a cross-sectional view showing an example of a method for manufacturing a light-emitting element according to an embodiment of the present disclosure.
- Fig. 3 shows a method for manufacturing a light-emitting element 10 including a first electrode 11, a second electrode 12, and a functional layer 13 located between the first electrode 11 and the second electrode 12.
- a support substrate BP is first prepared, and a circuit layer CL, a first electrode 11, an edge cover 15 that covers the edge of the first electrode 11, and a transparent layer 14 are formed in this order on the support substrate BP.
- a functional layer 13 having a thin film portion Q1 and a thick film portion Q2 having a thickness greater than that of the thin film portion Q1 is formed on the transparent layer 14 (step S10).
- the process of forming the functional layer 13 may include a process of forming one or more of a hole injection layer, a hole transport layer HTL, and an electron blocking layer (step S12).
- the process of forming the functional layer 13 may include a process of drying a coating liquid of the quantum dot dispersion liquid to form an emission layer EML (step S14).
- the process of forming the functional layer 13 may include a process of forming one or more of a hole blocking layer, an electron transport layer ETL, and an electron injection layer (step S16).
- a second electrode 12 having a first portion P1 and a second portion P2 having a thickness greater than that of the first portion P1 is formed on the functional layer 13 (step S20).
- the first portion P1 and the second portion P2 can be formed by performing a deposition process multiple times.
- FIG. 4 is a cross-sectional view showing an example of a process for forming a second electrode.
- a first evaporated film F1 can be formed in a planar shape (step S22), and then a second evaporated film F2 can be patterned (step S24).
- the first evaporated film F1 and the second evaporated film F2 constitute the second electrode 12.
- FIG. 5 is a cross-sectional view showing another example of the process of forming the second electrode.
- the first vapor-deposited film F1 can be patterned (step S122), and then the second vapor-deposited film F2 can be formed in a planar shape (step S124).
- FIG. 6 is a cross-sectional view showing another example of the process of forming the second electrode.
- the first deposited film F1 is patterned (step S122), and then the second deposited film F2 is patterned (step S126) so as to overlap a part of the first deposited film F1 and the opening A1 of the first deposited film F1.
- the first deposited film F1 also overlaps a part of the second deposited film F2 and the opening A2 of the second deposited film F2.
- it is beneficial that the patterns of the first deposited film F1 and the second deposited film F2 are the same in a plan view, but are different in position.
- the first deposited film F1 and the second deposited film F2 may have the same thickness.
- FIG. 7 is a cross-sectional view showing another example of the process of forming the second electrode.
- the first deposited film F1 is patterned (step S122), and then a second deposited film F2 having a thickness different from that of the first deposited film F1 is patterned (step S128) so as to overlap the opening A1 of the first deposited film F1.
- the first deposited film F1 overlaps the opening A2 of the second deposited film F2.
- the patterns of the first deposited film F1 and the second deposited film F2 may be complementary in a planar view.
- FIG. 8 is a cross-sectional view showing a modified example of the configuration of the light-emitting element according to an embodiment of the present disclosure.
- the second electrode 12 is located in a lower layer than the first electrode 11, and an optical resonator that reinforces light in a specific wavelength range may be formed between the lower surface of the first electrode 11 and the upper surface of the second electrode 12.
- the light-emitting element 10 is a bottom emission type.
- the light-emitting element 20 includes a first electrode 11, a second electrode 22 containing a transparent conductive material and capable of transmitting light, and a functional layer 13 located between the first electrode 11 and the second electrode 22, the second electrode 22 including a first portion P3 and a second portion P4 having a thickness greater than that of the first portion P3, and the functional layer 13 including a thin film portion Q1 located between the first electrode 11 and the first portion P3, and a thick film portion Q2 located between the first electrode 11 and the second portion P4 and having a thickness greater than that of the thin film portion Q1.
- the light-emitting element 20 may be formed on a support substrate BP, and a circuit layer CL may be formed between the support substrate BP and the light-emitting element 20.
- the light-emitting element 20 may further include a transparent layer 14 located between the first electrode 11 and the functional layer 13.
- the functional layer 13 includes an emitting layer EML, and the emitting layer EML has a portion EM1 located in the thin film portion Q1 that is thinner than a portion EM2 located in the thick film portion Q2.
- the emitting layer EML may include luminescent quantum dots, or may include a luminescent organic material.
- the functional layer 13 may further include one or more of a hole injection layer, a hole transport layer HTL, an electron blocking layer, a hole blocking layer, an electron transport layer ETL, and an electron injection layer.
- the thin film portion Q1 may be located outside the thick film portion Q2.
- the thin film portion Q1 may be a peripheral portion of the functional layer 13.
- the first portion P3 and the second portion P4 may be located within the light-emitting region where the light-emitting layer EML emits light.
- the translucent conductive material contained in the second electrode 22 has a visible light transmittance of 50% or more.
- the translucent conductive material may be a metal oxide material and may have an extinction coefficient of less than 1 at the peak wavelength of the light-emitting layer EML.
- the translucent conductive material may include one or more selected from the group including indium tin oxide, indium zinc oxide, zinc oxide, titanium oxide, graphene, silver nanowires, carbon nanotubes, and polyethylenedioxythiophene.
- the first electrode 11 may be a light-reflecting electrode.
- the second electrode 22 may be located in a layer above the first electrode 11, and an optical resonator that reinforces light of a specific wavelength range may be formed between the upper surface of the second electrode 22 and the upper surface of the second electrode 12.
- a light-reflecting layer may be provided separately from the first electrode 11.
- the second electrode 22 may be located in a layer above the light-reflecting layer, and an optical resonator that reinforces light of a specific wavelength range may be formed between the upper surface of the light-reflecting layer and the upper surface of the second electrode 12.
- the light-emitting element 20 is a top-emission type.
- the light-transmitting conductive material contained in the second electrode 22 may have a so-called "free-end reflection" in its bulk. Reflection in the bulk is the reflection that occurs when visible light is incident from a vacuum into the bulk of the material in the normal direction to the plane of incidence.
- the second electrode 22 includes the first portion P3 and the second portion P4 having a thickness greater than that of the first portion P3.
- the third portion P3 of the second electrode 22 is formed to correspond to the thick portion Q2
- the second portion P4 of the second electrode 22 is formed to correspond to the thin portion Q1, so that the phase shift ⁇ differs between the thin portion Q1 and the thick portion Q2.
- the difference between the thickness of the thin portion Q1 and the thickness of the thick portion Q2 may be 5% or more with respect to the thickness of the thin portion Q1.
- the difference between the maximum peak wavelength and the minimum peak wavelength of the multiple peak wavelengths obtained by spatially resolving the peak wavelength of the emitted light in the pixel is preferable to reduce the difference between the maximum peak wavelength and the minimum peak wavelength of the multiple peak wavelengths obtained by spatially resolving the peak wavelength of the emitted light in the pixel to 10 nm or less by adjusting the film thickness of the second portion P4. It is also preferable to reduce the front brightness unevenness in the pixel to 20% or less by adjusting the film thickness of the second portion P4.
- the upper surface of the second electrode 22 is formed to be flat, for example.
- FIG. 10 is a cross-sectional view showing a modified example of the configuration of the light-emitting element according to an embodiment of the present disclosure.
- the second electrode 22 is located in a lower layer than the first electrode 11, and an optical resonator that reinforces light of a specific wavelength range may be formed between the lower surface of the first electrode 11 and the lower surface of the second electrode 12.
- the light-emitting element 20 is a bottom emission type.
- Fig. 11 is a plan view showing a configuration example of a display device according to an embodiment of the present disclosure.
- the display device 100 includes a display section DA in which a plurality of pixels PX are provided, and a drive circuit DC for driving the display section DA.
- the pixels PX include a red pixel PR including a red light emitting element 30 and a pixel circuit 39, a green pixel PG including a green light emitting element 40 and a pixel circuit 49, and a blue pixel PB including a blue light emitting element 50 and a pixel circuit 59.
- FIG. 12 is a cross-sectional view showing an example of the configuration of a display device according to an embodiment of the present disclosure.
- the display device 100 according to the present disclosure includes a red light-emitting element 30, a green light-emitting element 40, and a blue light-emitting element 50, and each of the red light-emitting element 30, the green light-emitting element 40, and the blue light-emitting element 50 is the light-emitting element 10 according to the above-mentioned embodiment 1.
- the thickness of the first portion P1 of the second electrode 12 may be different in the red light-emitting element 30, the green light-emitting element 40, and the blue light-emitting element 50. Additionally or alternatively, the thickness of the second portion P2 of the second electrode 12 may be different.
- the second portions P2 may be formed such that the thickness of each second portion P2 decreases in the order of the red light-emitting element 30, the green light-emitting element 40, and the blue light-emitting element 50.
- the thickness of the thin film portion Q1 of the functional layer 13 may be different in the red light-emitting element 30, the green light-emitting element 40, and the blue light-emitting element 50. Additionally or alternatively, the thickness of the thick film portion Q2 of the functional layer 13 may be different.
- the red light-emitting element 30, the green light-emitting element 40, and the blue light-emitting element 50 may each further include a transparent layer 14 located between the first electrode 11 and the functional layer 13.
- the thickness of the transparent layer 14 may be different from each other in the red light-emitting element 30, the green light-emitting element 40, and the blue light-emitting element 50.
- the transparent layer 14 may be conductive or have charge transport properties.
- Modification 13 is a plan view showing a modified example of the configuration of the display device according to the embodiment of the present disclosure. As shown in Fig. 13, each of the red light emitting element 30, the green light emitting element 40, and the blue light emitting element 50 may be the light emitting element 20 according to the second embodiment described above.
- the thicknesses of the first portion P3 of the second electrode 22 may be different from each other in the red light-emitting element 30, the green light-emitting element 40, and the blue light-emitting element 50. Additionally or alternatively, the thicknesses of the second portion P4 of the second electrode 22 may be different from each other.
- Fig. 14 shows a graph showing the relationship between the thickness of the second electrode in a red light-emitting element and the luminance front extraction efficiency.
- Fig. 15 shows a graph showing the relationship between the thickness of the second electrode in a green light-emitting element and the luminance front extraction efficiency.
- the suitable thickness of the second electrode 12 varies depending on the thickness of the functional layer 13.
- the thickness of the second electrode 12 By varying the thickness of the second electrode 12 according to the uneven thickness of the functional layer 13, the light extraction efficiency of the light-emitting element 10 can be improved.
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Abstract
Description
本開示は、発光素子、表示装置、発光素子の製造方法に関する。 This disclosure relates to a light-emitting device, a display device, and a method for manufacturing a light-emitting device.
特許文献1は、マイクロキャビティ構造を利用して光の取り出し効率を向上する有機EL表示装置を開示している。
マイクロキャビティ構造を有する発光素子において、電極間の機能層の膜厚ムラに起因して、光の取出し効率が低下する。 In light-emitting devices with a microcavity structure, unevenness in the thickness of the functional layer between the electrodes reduces the light extraction efficiency.
本開示の一態様に係る発光素子は、第1電極と、光透過可能な厚さの非透光性導電材料を含む第2電極と、前記第1電極および前記第2電極の間に位置し、発光層を含む機能層とを備え、前記第2電極は、第1部分と、前記第1部分よりも厚さの大きい第2部分とを含み、前記機能層は、前記第1電極および前記第1部分の間に位置する薄膜部と、前記第1電極および前記第2部分の間に位置し、前記薄膜部よりも厚さの大きい厚膜部とを含む、構成である。 A light-emitting element according to one embodiment of the present disclosure includes a first electrode, a second electrode including a non-transparent conductive material having a thickness that allows light to pass through, and a functional layer including a light-emitting layer located between the first electrode and the second electrode, the second electrode including a first portion and a second portion having a thickness greater than that of the first portion, and the functional layer including a thin film portion located between the first electrode and the first portion, and a thick film portion located between the first electrode and the second portion having a thickness greater than that of the thin film portion.
本開示の一態様に係る発光素子は、第1電極と、透光性導電材料を含み、光透過可能な第2電極と、第1電極および第2電極の間に位置し、発光層を含む機能層とを備え、前記第2電極は、第1部分と、前記第1部分よりも厚さの大きい第2部分とを含み、前記機能層は、前記第1電極および前記第2部分の間に位置する薄膜部と、前記第1電極および前記第1部分の間に位置し、前記薄膜部よりも厚さの大きい厚膜部とを含む、構成である。 A light-emitting element according to one embodiment of the present disclosure includes a first electrode, a second electrode that includes a translucent conductive material and is light-transmitting, and a functional layer that is located between the first electrode and the second electrode and includes a light-emitting layer, the second electrode includes a first portion and a second portion that is thicker than the first portion, and the functional layer includes a thin film portion that is located between the first electrode and the second portion, and a thick film portion that is located between the first electrode and the first portion and is thicker than the thin film portion.
本開示の一態様に係る表示装置は、赤色発光素子、緑色発光素子および青色発光素子を備え、前記赤色発光素子、前記緑色発光素子および前記青色発光素子それぞれが、本開示の一態様に係る発光素子である、構成である。 The display device according to one embodiment of the present disclosure is configured to include red light-emitting elements, green light-emitting elements, and blue light-emitting elements, each of which is a light-emitting element according to one embodiment of the present disclosure.
本開示に一態様に係る発光素子の製造方法は、第1電極および第2電極と、前記第1電極および前記第2電極の間に位置し、発光層を含む機能層とを備える発光素子の製造方法であって、薄膜部と、前記薄膜部よりも厚さの大きい厚膜部とを有する前記機能層を形成する工程と、第1部分と、前記第1部分よりも厚さの大きい第2部分とを有する前記第2電極を形成する工程とを含み、前記第2電極を形成する工程では、複数回の蒸着工程を行うことで前記第1部分および前記第2部分を形成する、方法である。 The method for manufacturing a light-emitting element according to one embodiment of the present disclosure is a method for manufacturing a light-emitting element having a first electrode, a second electrode, and a functional layer including a light-emitting layer, located between the first electrode and the second electrode, and includes the steps of forming the functional layer having a thin film portion and a thick film portion having a thickness greater than that of the thin film portion, and forming the second electrode having a first portion and a second portion having a thickness greater than that of the first portion, and in the step of forming the second electrode, the first portion and the second portion are formed by performing a deposition process multiple times.
本開示の一態様によれば、光の取出し効率が向上する。 According to one aspect of the present disclosure, the light extraction efficiency is improved.
〔実施形態1〕
(構成)
図1は、本開示の一実施形態に係る発光素子の構成例を示す断面図である。図1に示すように、本開示に係る発光素子10は、第1電極11と、光透過可能な厚さの非透光性導電材料を含む第2電極12と、第1電極11および第2電極12の間に位置する機能層13とを備える。第2電極12は、第1部分P1と、第1部分P1よりも厚さの大きい第2部分P2とを含む。機能層13は、第1電極11および第1部分P1の間に位置する薄膜部Q1と、第1電極11および第2部分P2の間に位置し、薄膜部Q1よりも厚さの大きい厚膜部Q2とを含む。
[Embodiment 1]
(composition)
Fig. 1 is a cross-sectional view showing a configuration example of a light-emitting element according to an embodiment of the present disclosure. As shown in Fig. 1, the light-emitting
発光素子10は、支持基板BP上に形成されていてよく、支持基板BPと発光素子10との間に回路層CLが形成されていてよい。発光素子10は、第1電極11および機能層13の間に位置する透明層14をさらに備えてよい。発光素子10は、第1電極11または第2電極12のエッジを覆うエッジカバー15をさらに備えてよい。
The light-emitting
図2は、図1に示した機能層の一例を示す断面図である。図2に示すように、機能層13は、発光層EMLを含んでよい。発光層EMLは、薄膜部Q1に位置する部分EM1が、厚膜部Q2に位置する部分EM2よりも厚さが小さい。発光層EMLは、発光性の量子ドットを含んでよく、発光性の有機材料を含んでもよい。量子ドットは、例えば電界発光により発光してもよい。機能層13は、正孔注入層、正孔輸送層HTL、電子ブロック層、正孔ブロック層、電子輸送層ETL、および電子注入層のうちの1つ以上を追加で含んでよい。追加の層は、厚みが略一定であっても、薄膜部Q1に位置する部分が厚膜部Q2に位置する部分よりも厚さが小さくてもよい。
2 is a cross-sectional view showing an example of the functional layer shown in FIG. 1. As shown in FIG. 2, the
機能層13において、薄膜部Q1は厚膜部Q2よりも外側に位置してよい。薄膜部Q1は、機能層13の周縁部であってよい。平面視において、第1部分P1および第2部分P2は、発光層EMLが発光する発光領域内に位置してよい。
In the
第2電極12に含まれる非透光性導電材料は、バルクでの正面反射率が50%以上である。バルクでの正面反射率は、真空から当該材料のバルクへ、入射面の法線方向で可視光が入射したときの反射率である。非透光性導電材料は、金属材料であってよく、発光層EMLのピーク波長における消衰係数が1以上であってよい。金属材料は、アルミニウム、マグネシウム、銀、クロム、ニッケル、銅、タングステン、白金、錫、金、および銀から選択された1つ以上を含んでよい。
The non-transparent conductive material contained in the
第1電極11は光反射電極であってよい。第2電極12は、第1電極11よりも上層に位置し、第1電極11の上面と第2電極12の下面との間に、特定波長域の光を強め合う光共振器が形成されてよい。あるいは、第1電極11と別に光反射層が設けられてもよい。第2電極12は、光反射層よりも上層に位置し、光反射層の上面と第2電極12の下面との間に、特定波長域の光を強め合う光共振器が形成されてよい。特定波長域は、例えば発光層EMLのピーク波長における及びこの±10nmの波長範囲であってもよい。また、光共振器は、機能層13の発光領域内のいずれかの位置に形成されていてもよく、薄膜部Q1又は厚膜部Q2のどちらかに形成されてもよい。
The
本開示において「上」は、支持基板BPに対して機能層13が在る方向を示し、「下」は、機能層13に対して支持基板BPが在る方向を示す。図1に示す例において、発光素子10はトップエミッション型である。
In this disclosure, "upper" refers to the direction in which the
第2電極12での反射において、入射光と反射光との間に位相差が生じる。第2電極12に含まれる非透光性導電材料は、バルクでの反射が、いわゆる「固定端反射」であってよい。バルクでの反射は、真空から当該材料のバルクへ、入射面の法線方向で可視光が入射したときの反射である。第2電極12の厚さが光透過可能なほど小さいため、反射による位相差は、第2電極12の反射した部分における厚さに依存する。第2電極12の厚さが大きいほど、位相差が大きい。
When reflected from the
光共振器の形成のためには、以下の条件が満たされることが好ましい。
2L/λ+Φ/2π=m・・・(1)
Lは、第1電極11および第2電極12間の光学的距離、λは、発光層EMLの発光スペクトルのピーク波長、Φは、第2電極12での反射による位相シフト(rad)、mは整数である。光学的距離Lは、第1電極11および第2電極12間における屈折率nおよび厚さdの積である。
In order to form an optical resonator, it is preferable that the following conditions are satisfied:
2L/λ+Φ/2π=m...(1)
L is the optical distance between the
第1電極11および第2電極12の間に位置する機能層13では、薄膜部Q1および厚膜部Q2の厚さが異なる。このため、例えば、薄膜部Q1を含む部分に光共振器が形成されるように設計した場合は、厚膜部Q2を含む部分で光共振器の条件からずれてしまい、厚膜部Q2では光の取り出し効率が低下し、結果として発光素子の光の取り出し効率が低下する。
In the
また、薄膜部Q1の光路長LA1と厚膜部Q2の光路長LA2との差が光路長LA1に対して5%以上、又は、薄膜部Q1の厚さと厚膜部Q2の厚さとの差が薄膜部Q1の厚さに対して5%以上ある場合には、画素内の輝度ムラ及び色ムラが目立ってくる。特に、発光素子10から出る出射光の画素内のピーク波長の差が10nmを超えると色ムラが目立ってくる。そのため、1つの発光素子内では最大となるピーク波長と最小となるピーク波長と差が10nm以下となることが好ましい。
Furthermore, if the difference between the optical path length LA1 of the thin film portion Q1 and the optical path length LA2 of the thick film portion Q2 is 5% or more of the optical path length LA1, or if the difference between the thickness of the thin film portion Q1 and the thickness of the thick film portion Q2 is 5% or more of the thickness of the thin film portion Q1, uneven brightness and color within the pixel will become noticeable. In particular, if the difference in the peak wavelength within the pixel of the light emitted from the
発光素子10では、厚膜部Q2に対応するように第2電極12の第2部分P2が形成されることにより、画素内の輝度ムラ及び色ムラの少なくとも一方を抑えることができる。特に、第2部分P2の膜厚を調整することにより、画素内のピーク波長の分布を10nm以下に抑えることが好ましい。また、第2部分P2の膜厚を調整することにより、画素内の正面輝度ムラを20%以下に抑えることが好ましい。
In the light-emitting
第2電極12での反射による位相シフトΦは、以下の式(2)で近似できる。
tanΦ=(2×nf×k)/(nf2-ns2+k2)・・・(2)
ここで、第2電極12の屈折率をns、第2電極12の消衰係数をk、機能層13の第2電極12に隣接する部分の屈折率をnfとする。第2電極12が銀である場合、可視光の波長範囲では、屈折率nsは1より小さく、消衰係数kは1以上であって波長が長くなるにしたがって大きくなる。従って、位相シフトΦは、赤色画素、緑色画素、青色画素の順で大きくなる。そのため、後述されるような赤色画素、緑色画素、及び青色画素を有する表示装置において、各画素の薄膜部Q1における光路長LA1と厚膜部Q2における光路長LA2との差、又は薄膜部Q1の厚さと厚膜部Q2の厚さとの差が同程度である場合、第2電極12の第2部分P2の厚さを、赤色画素、緑色画素、青色画素の順で小さくなるように形成しても良い。
The phase shift Φ due to reflection at the
tanΦ=(2×nf×k)/(nf 2 -ns 2 +k 2 )...(2)
Here, the refractive index of the
また、第2電極12の第2部分P2の厚さが、1000nm以下に形成されることが好ましく、500nm以下に形成されることがより好ましい。非透光性導電材料を含む第2電極12は、厚さが厚くなると透過率が大幅に下がるためである。
Furthermore, it is preferable that the thickness of the second portion P2 of the
(製造方法)
図3は、本開示の一実施形態に係る発光素子の製造方法の一例を示す断面図である。図3は、第1電極11および第2電極12と、第1電極11および第2電極12の間に位置する機能層13とを備える発光素子10の製造方法を示す。図3に示すように、まず、製造方法の一例において、支持基板BPを用意し、支持基板BPの上に回路層CL、第1電極11、第1電極11のエッジを覆うエッジカバー15、透明層14をこの順に形成する。
(Production method)
Fig. 3 is a cross-sectional view showing an example of a method for manufacturing a light-emitting element according to an embodiment of the present disclosure. Fig. 3 shows a method for manufacturing a light-emitting
続いて、透明層14の上に、薄膜部Q1と薄膜部Q1よりも厚さの大きい厚膜部Q2とを有する機能層13を形成する(ステップS10)。機能層13を形成する工程は、正孔注入層、正孔輸送層HTLおよび電子ブロック層の1つ以上を形成する工程(ステップS12)を含んでよい。機能層13を形成する工程は、量子ドット分散液の塗液を乾燥させて発光層EMLを形成する工程(ステップS14)を含んでよい。機能層13を形成する工程は、正孔ブロック層、電子輸送層ETL、および電子注入層の1つ以上を形成する工程(ステップS16)を含んでよい。
Subsequently, a
続いて、機能層13の上に、第1部分P1と、第1部分P1よりも厚さの大きい第2部分P2とを有する第2電極12を形成する(ステップS20)。第2電極12を形成する工程では、複数回の蒸着工程を行うことで第1部分P1および第2部分P2を形成することができる。
Next, a
図4は、第2電極を形成する工程の一例を示す断面図である。図4に示すように、第2電極12を形成する工程では、第1蒸着膜F1を面状形成し(ステップS22)、その後に第2蒸着膜F2をパターン形成する(ステップS24)ことができる。第1蒸着膜F1および第2蒸着膜F2が第2電極12を構成する。
FIG. 4 is a cross-sectional view showing an example of a process for forming a second electrode. As shown in FIG. 4, in the process for forming the
図5は、第2電極を形成する工程の別の一例を示す断面図である。図5に示すように、第2電極12を形成する工程では、第1蒸着膜F1をパターン形成し(ステップS122)、その後に第2蒸着膜F2を面状形成する(ステップS124)ことができる。
FIG. 5 is a cross-sectional view showing another example of the process of forming the second electrode. As shown in FIG. 5, in the process of forming the
図6は、第2電極を形成する工程の別の一例を示す断面図である。図6に示すように、第2電極12を形成する工程では、第1蒸着膜F1をパターン形成し(ステップS122)、その後に、第1蒸着膜F1の一部および第1蒸着膜F1の開口A1と重畳するように、第2蒸着膜F2をパターン形成する(ステップS126)ことができる。また、第1蒸着膜F1が、第2蒸着膜F2の一部および第2蒸着膜F2の開口A2と重畳する。この場合、第1蒸着膜F1および第2蒸着膜F2のパターンが平面視で同一であり、位置が異なることが有益である。第1蒸着膜F1および第2蒸着膜F2の厚さが同一であってよい。
FIG. 6 is a cross-sectional view showing another example of the process of forming the second electrode. As shown in FIG. 6, in the process of forming the
図7は、第2電極を形成する工程の別の一例を示す断面図である。図7に示すように、第2電極12を形成する工程では、第1蒸着膜F1をパターン形成し(ステップS122)、その後に、第1蒸着膜F1の開口A1と重畳するように、第1蒸着膜F1と異なる厚さの第2蒸着膜F2をパターン形成する(ステップS128)ことができる。また、第1蒸着膜F1が、第2蒸着膜F2の開口A2と重畳する。この場合、第1蒸着膜F1および第2蒸着膜F2のパターンが平面視で相補的であってよい。
FIG. 7 is a cross-sectional view showing another example of the process of forming the second electrode. As shown in FIG. 7, in the process of forming the
(変形例)
図8は、本開示の一実施形態に係る発光素子の構成の変形例を示す断面図である。図8に示すように、第2電極12が、第1電極11よりも下層に位置し、第1電極11の下面と第2電極12の上面との間に、特定波長域の光を強め合う光共振器が形成されてよい。図8に示す例において、発光素子10はボトムエミッション型である。
(Modification)
Fig. 8 is a cross-sectional view showing a modified example of the configuration of the light-emitting element according to an embodiment of the present disclosure. As shown in Fig. 8, the
〔実施形態2〕
本開示の他の実施形態について、以下に説明する。なお、説明の便宜上、上記実施形態にて説明した部材と同じ機能を有する部材については、同じ符号を付記し、その説明を繰り返さない。
[Embodiment 2]
Other embodiments of the present disclosure will be described below. For convenience of explanation, the same reference numerals will be given to members having the same functions as those described in the above embodiment, and the description thereof will not be repeated.
(構成)
図9は、本開示の一実施形態に係る発光素子の構成例を示す断面図である。図9に示すように、本開示に係る発光素子20は、第1電極11と、透光性導電材料を含み、光透過可能な第2電極22と、第1電極11および第2電極22の間に位置する機能層13とを備え、第2電極22は、第1部分P3と、第1部分P3よりも厚さの大きい第2部分P4とを含み、機能層13は、第1電極11および第1部分P3の間に位置する薄膜部Q1と、第1電極11および第2部分P4の間に位置し、薄膜部Q1よりも厚さの大きい厚膜部Q2とを含む。
(composition)
9 is a cross-sectional view showing a configuration example of a light-emitting element according to an embodiment of the present disclosure. As shown in FIG. 9, the light-emitting
発光素子20は、支持基板BP上に形成されていてよく、支持基板BPと発光素子20との間に回路層CLが形成されていてよい。発光素子20は、第1電極11および機能層13の間に位置する透明層14をさらに備えてよい。
The light-emitting
機能層13は、発光層EMLを含み、発光層EMLは、薄膜部Q1に位置する部分EM1が、厚膜部Q2に位置する部分EM2よりも厚さが小さい。発光層EMLは、発光性の量子ドットを含んでよく、発光性の有機材料を含んでもよい。機能層13はさらに、正孔注入層、正孔輸送層HTL、電子ブロック層、正孔ブロック層、電子輸送層ETL、および電子注入層のうちの1つ以上を含んでよい。
The
機能層13において、薄膜部Q1は厚膜部Q2よりも外側に位置してよい。薄膜部Q1は、機能層13の周縁部であってよい。平面視において、第1部分P3および第2部分P4は、発光層EMLが発光する発光領域内に位置してよい。
In the
第2電極22に含まれる透光性導電材料は、可視光透過率が50%以上である。透光性導電材料は、酸化金属材料であってよく、発光層EMLのピーク波長における消衰係数が1未満であってよい。透光性導電材料は、酸化インジウムスズ、酸化インジウム亜鉛、酸化亜鉛、酸化チタン、グラフェン、銀ナノワイヤ、カーボンナノチューブ、およびポリエチレンジオキシチオフェンを含む群から選択された1つ以上を含んでよい。
The translucent conductive material contained in the
第1電極11は光反射電極であってよい。第2電極22は、第1電極11よりも上層に位置し、第2電極22の上面と第2電極12の上面との間に、特定波長域の光を強め合う光共振器が形成されてよい。あるいは、第1電極11と別に光反射層が設けられてよい。第2電極22は、光反射層よりも上層に位置し、光反射層の上面と第2電極12の上面との間に、特定波長域の光を強め合う光共振器が形成されてよい。図9に示す例において、発光素子20はトップエミッション型である。
The
第2電極22での反射において、入射光と反射光との間に位相差が生じない。第2電極22に含まれる透光性導電材料は、バルクでの反射が、いわゆる「自由端反射」であってよい。バルクでの反射は、真空から当該材料のバルクへ、入射面の法線方向で可視光が入射したときの反射である。
No phase difference occurs between the incident light and the reflected light when reflected from the
本実施形態に係る構成によれば、第2電極22は、第1部分P3と、第1部分P3よりも厚さの大きい第2部分P4とを含む。発光素子20では、厚膜部Q2に対応するように第2電極22の第3部分P3が形成され、薄膜部Q1に対応するように第2電極22の第2部分P4が形成されることにより、位相シフトΦが薄膜部Q1と厚膜部Q2とで異なる。そして、光学的距離の差異を位相シフトΦの差異によって少なくとも部分的に相殺する結果、画素内の輝度ムラ及び色ムラの少なくとも一方を低減することができる。したがって、薄膜部Q1の厚さと厚膜部Q2の厚さとの差が薄膜部Q1の厚さに対して5%以上あってもよい。特に、第2部分P4の膜厚を調整することにより、画素内の出射光のピーク波長を空間分解測定して取得した複数のピーク波長のうち、最大となるピーク波長と最小となるピーク波長との差を10nm以下に低減することが好ましい。また、第2部分P4の膜厚を調整することにより、画素内の正面輝度ムラを20%以下に低減することが好ましい。第2電極22の上面は、例えば平坦になるように形成される。
According to the configuration of this embodiment, the
(製造方法)
本実施形態2に係る発光素子20の製造方法および第2電極22の形成工程は、前述の実施形態1を参照して当業者にとって明確であるので、その説明を繰り返さない。
(Production method)
The method of manufacturing the
(変形例)
図10は、本開示の一実施形態に係る発光素子の構成の変形例を示す断面図である。図10に示すように、第2電極22が、第1電極11よりも下層に位置し、第1電極11の下面と第2電極12の下面との間に、特定波長域の光を強め合う光共振器が形成されてよい。図10に示す例において、発光素子20はボトムエミッション型である。
(Modification)
Fig. 10 is a cross-sectional view showing a modified example of the configuration of the light-emitting element according to an embodiment of the present disclosure. As shown in Fig. 10, the
〔実施形態3〕
図11は、本開示の一実施形態に係る表示装置の構成例を示す平面図である。図11に示すように、本開示に係る表示装置100は、複数の画素PXが設けられた表示部DAと、表示部DAを駆動するための駆動回路DCとを備える。画素PXは、赤色発光素子30および画素回路39を含む赤色画素PRと、緑色発光素子40および画素回路49を含む緑色画素PGと、青色発光素子50および画素回路59を含む青色画素PBと、を含む。
[Embodiment 3]
Fig. 11 is a plan view showing a configuration example of a display device according to an embodiment of the present disclosure. As shown in Fig. 11, the
図12は、本開示の一実施形態に係る表示装置の構成例を示す断面図である。図12に示すように、本開示に係る表示装置100は、赤色発光素子30、緑色発光素子40および青色発光素子50を備え、赤色発光素子30、緑色発光素子40および青色発光素子50それぞれが、前述の実施形態1に係る発光素子10である。
FIG. 12 is a cross-sectional view showing an example of the configuration of a display device according to an embodiment of the present disclosure. As shown in FIG. 12, the
赤色発光素子30、緑色発光素子40および青色発光素子50において、第2電極12の第1部分P1の厚さが互いに異なってよい。加えて、または或いは、第2電極12の第2部分P2の厚さが互いに異なってよい。それぞれの第2部分P2の厚さが、赤色発光素子30、緑色発光素子40および青色発光素子50の順で小さくなるように、それぞれの第2部分P2が形成されてよい。赤色発光素子30、緑色発光素子40および青色発光素子50において、機能層13の薄膜部Q1の厚さが互いに異なってよい。加えて、または或いは、機能層13の厚膜部Q2の厚さが互いに異なってよい。
The thickness of the first portion P1 of the
赤色発光素子30、緑色発光素子40および青色発光素子50はそれぞれ、第1電極11および機能層13の間に位置する透明層14をさらに備えてよい。赤色発光素子30、緑色発光素子40および青色発光素子50において、透明層14の厚さが互いに異なってよい。透明層14は、導電性または電荷輸送性を有してよい。
The red light-emitting
(変形例)
図13は、本開示の一実施形態に係る表示装置の構成の変形例を示す平面図である。図13に示すように、赤色発光素子30、緑色発光素子40および青色発光素子50それぞれが、前述の実施形態2に係る発光素子20であってよい。
(Modification)
13 is a plan view showing a modified example of the configuration of the display device according to the embodiment of the present disclosure. As shown in Fig. 13, each of the red
赤色発光素子30、緑色発光素子40および青色発光素子50において、第2電極22の第1部分P3の厚さが互いに異なってよい。加えて、または或いは、第2電極22の第2部分P4の厚さが互いに異なってよい。
The thicknesses of the first portion P3 of the
(実施例)
図14は、赤色発光素子における第2電極の厚さと輝度正面取出し効率との関係を示すグラフを示す。図15は、緑色発光素子における第2電極の厚さと輝度正面取出し効率との関係を示すグラフを示す。これらのグラフは、赤色発光素子30および緑色発光素子40が前述の実施形態1に係る発光素子10である場合について、発明者らが光学計算した結果に基づく。図14および図15において、横軸「上部電極厚さ」が第2電極12の厚さを示し、各軌跡に付記している厚さが機能層13の厚さを示す。
(Example)
Fig. 14 shows a graph showing the relationship between the thickness of the second electrode in a red light-emitting element and the luminance front extraction efficiency. Fig. 15 shows a graph showing the relationship between the thickness of the second electrode in a green light-emitting element and the luminance front extraction efficiency. These graphs are based on the results of optical calculations performed by the inventors when the red light-emitting
図14および図15に示すように、機能層13の厚みによって、好適な第2電極12の厚みが異なる。そして、機能層13の厚みむらに応じて、第2電極12の厚みを異ならせることによって、発光素子10の光取り出し効率を向上することができる。
As shown in Figures 14 and 15, the suitable thickness of the
本開示は上述した各実施形態に限定されるものではなく、請求項に示した範囲で種々の変更が可能であり、異なる実施形態にそれぞれ開示された技術的手段を適宜組み合わせて得られる実施形態についても本開示の技術的範囲に含まれる。さらに、各実施形態にそれぞれ開示された技術的手段を組み合わせることにより、新しい技術的特徴を形成することができる。 This disclosure is not limited to the above-described embodiments, and various modifications are possible within the scope of the claims. The technical scope of this disclosure also includes embodiments obtained by appropriately combining the technical means disclosed in different embodiments. Furthermore, new technical features can be formed by combining the technical means disclosed in each embodiment.
10,20 発光素子
11 第1電極
12、22 第2電極
13 機能層
14 透明層
15 エッジカバー
A1,A2 開口
DA 表示部
DC 駆動回路
EML 発光層
EM1,EM2 部分
F1 第1蒸着膜
F2 第2蒸着膜
P1 第1部分
P2 第2部分
Q1 薄膜部
Q2 厚膜部
10, 20
Claims (34)
光透過可能な厚さの非透光性導電材料を含む第2電極と、
前記第1電極および前記第2電極の間に位置し、発光層を含む機能層とを備え、
前記第2電極は、第1部分と、前記第1部分よりも厚さの大きい第2部分とを含み、
前記機能層は、前記第1電極および前記第1部分の間に位置する薄膜部と、前記第1電極および前記第2部分の間に位置し、前記薄膜部よりも厚さの大きい厚膜部とを含む、発光素子。 A first electrode;
a second electrode including a non-light-transmitting conductive material having a thickness allowing light to pass therethrough;
a functional layer including a light-emitting layer, the functional layer being located between the first electrode and the second electrode;
the second electrode includes a first portion and a second portion having a thickness greater than that of the first portion;
A light-emitting element, wherein the functional layer includes a thin film portion located between the first electrode and the first portion, and a thick film portion located between the first electrode and the second portion and having a thickness greater than that of the thin film portion.
前記第1電極の上面と前記第2電極の下面との間に、前記発光層のピーク波長の±10nmの範囲の光を強め合う光共振器が形成される、請求項1~8のいずれか1項に記載の発光素子。 The second electrode is located in a layer above the first electrode,
The light-emitting element according to any one of claims 1 to 8, wherein an optical resonator is formed between an upper surface of the first electrode and a lower surface of the second electrode, which reinforces light within a range of ±10 nm of a peak wavelength of the light-emitting layer.
透光性導電材料を含み、光透過可能な第2電極と、
第1電極および第2電極の間に位置し、発光層を含む機能層とを備え、
前記第2電極は、第1部分と、前記第1部分よりも厚さの大きい第2部分とを含み、
前記機能層は、前記第1電極および前記第2部分の間に位置する薄膜部と、前記第1電極および前記第1部分の間に位置し、前記薄膜部よりも厚さの大きい厚膜部とを含む、発光素子。 A first electrode;
a second electrode including a transparent conductive material and capable of transmitting light;
a functional layer including a light-emitting layer, the functional layer being located between the first electrode and the second electrode;
the second electrode includes a first portion and a second portion having a thickness greater than that of the first portion;
A light-emitting element, wherein the functional layer includes a thin film portion located between the first electrode and the second portion, and a thick film portion located between the first electrode and the first portion and having a thickness greater than that of the thin film portion.
前記発光層は、前記薄膜部に位置する部分が、前記厚膜部に位置する部分よりも厚さが小さい、請求項12に記載の発光素子。 The functional layer includes a light-emitting layer,
The light-emitting element according to claim 12 , wherein the light-emitting layer has a thickness smaller in a portion located in the thin film portion than in a portion located in the thick film portion.
前記第1電極の上面と前記第2電極の上面との間に、前記発光層のピーク波長の±10nmの波長範囲の光を強め合う光共振器が形成される、請求項12~18のいずれか1項に記載の発光素子。 The second electrode is located in a layer above the first electrode,
The light-emitting element according to any one of claims 12 to 18, wherein an optical resonator is formed between an upper surface of the first electrode and an upper surface of the second electrode, which reinforces light in a wavelength range of ±10 nm of a peak wavelength of the light-emitting layer.
前記赤色発光素子、前記緑色発光素子および前記青色発光素子それぞれが、請求項1~23のいずれか1項に記載の発光素子である、表示装置。 A red light emitting element, a green light emitting element and a blue light emitting element are provided,
A display device, wherein each of the red light emitting element, the green light emitting element and the blue light emitting element is the light emitting element according to any one of claims 1 to 23.
前記緑色発光素子の第2部分の厚さが、前記青色発光素子の第2部分の厚さよりも小さい、請求項25に記載の表示装置。 a thickness of the second portion of the red light emitting element is smaller than a thickness of the second portion of the green light emitting element;
26. The display of claim 25, wherein a thickness of the second portion of the green light-emitting element is less than a thickness of the second portion of the blue light-emitting element.
前記赤色発光素子、前記緑色発光素子および前記青色発光素子において、前記透明層の厚さが互いに異なる、請求項24~27のいずれか1項に記載の表示装置。 each of the red light emitting element, the green light emitting element and the blue light emitting element further includes a transparent layer located between the first electrode and the functional layer;
28. The display device according to claim 24, wherein the transparent layer has a thickness different from one another in the red light emitting element, the green light emitting element, and the blue light emitting element.
薄膜部と、前記薄膜部よりも厚さの大きい厚膜部とを有する前記機能層を形成する工程と、
第1部分と、前記第1部分よりも厚さの大きい第2部分とを有する前記第2電極を形成する工程とを含み、
前記第2電極を形成する工程では、複数回の蒸着工程を行うことで前記第1部分および前記第2部分を形成する、発光素子の製造方法。 A method for manufacturing a light-emitting device comprising: a first electrode, a second electrode; and a functional layer including a light-emitting layer and located between the first electrode and the second electrode, the method comprising the steps of:
forming the functional layer having a thin film portion and a thick film portion having a thickness greater than that of the thin film portion;
forming the second electrode having a first portion and a second portion having a thickness greater than that of the first portion;
The method for manufacturing a light-emitting element, wherein in the step of forming the second electrode, the first portion and the second portion are formed by performing a vapor deposition step multiple times.
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