WO2025069578A1 - Electronic component and method for manufacturing same - Google Patents

Abstract

[Problem] To provide an electronic component with a structure that facilitates dispersion of stress applied to terminal electrodes from the outside. [Solution] An electronic component 100 includes terminal electrodes E1, E2 located in a conductor layer 71 in a base body 110 and exposed from an outer surface 111, and a coil C1 at least a part of which is located in a conductor layer 74 in the base body 110, one end of which is connected to the terminal electrode E1 via a via conductor 81V, and the other end of which is connected to the terminal electrode E2 via a via conductor 84V. The via conductor 81V has a shape with a diameter that narrows toward the terminal electrode E1, and the via conductor 84V has a shape with a diameter that narrows toward the terminal electrode E2.

Description

Electronic components and their manufacturing method

This disclosure relates to electronic components and methods for manufacturing the same.

Patent Document 1 discloses a surface-mount type inductor component with terminal electrodes on its bottom surface. The inductor component disclosed in Patent Document 1 is manufactured by forming a linear internal magnetic path portion on a base member, and then forming terminal electrodes on both ends of the internal magnetic path.

JP 2022-038326 A

In the inductor component disclosed in Patent Document 1, when external stress is applied to the terminal electrodes, the stress is applied directly to the vertical wiring.

This disclosure describes an electronic component that has a structure that makes it easy to disperse stress applied to the terminal electrodes from the outside, and a method for manufacturing the electronic component.

An electronic component according to one aspect of the present disclosure comprises an element body having a first surface and a second surface located opposite the first surface, a first terminal electrode and a second terminal electrode located on a first conductor layer within the element body, both of which are exposed from the first surface, and a coil, at least a portion of which is located on a second conductor layer within the element body, one end of which is connected to the first terminal electrode via a first via conductor and the other end of which is connected to the second terminal electrode via a second via conductor, wherein at least a portion of the first via conductor has a shape whose diameter decreases toward the first terminal electrode, and at least a portion of the second via conductor has a shape whose diameter decreases toward the second terminal electrode.

A method for manufacturing an electronic component according to one aspect of the present disclosure includes a first step of forming a first conductor layer on a support, the first conductor layer including a first terminal electrode, a second terminal electrode, and a first sacrificial pattern; a second step of forming a second conductor layer on the first conductor layer, the second sacrificial pattern including at least a portion of a coil having one end connected to the first terminal electrode and the other end connected to the second terminal electrode; a third step of removing the first sacrificial pattern and the second sacrificial pattern; a fourth step of forming an element body in the area from which at least the first sacrificial pattern and the second sacrificial pattern have been removed, thereby embedding the first terminal electrode, the second terminal electrode, and the coil in the element body; and a fifth step of exposing the first terminal electrode and the second terminal electrode by peeling off the support.

This disclosure provides an electronic component and a method for manufacturing the same that have a structure that makes it easy to disperse stress applied to the terminal electrodes from the outside.

FIG. 1 is a schematic perspective view showing the appearance of an electronic component (coil component) 100 according to an embodiment of the technology disclosed herein. FIG. 2 is a schematic perspective top view of the coil device 100. FIG. 3 is a schematic cross-sectional view of the coil device 100 taken along the imaginary line L1 shown in FIG. FIG. 4 is a schematic bottom view of the coil device 100. As shown in FIG. Fig. 5(a) is an enlarged cross-sectional view for explaining the structure of the connection portion V1 in more detail, and Fig. 5(b) is an enlarged cross-sectional view for explaining the structure of the connection portion V4 in more detail. 6A is an enlarged cross-sectional view for explaining the structure of the connection portion V2 in more detail, and FIG 6B is an enlarged cross-sectional view for explaining the structure of the connection portion V3 in more detail. FIG. 7 is a schematic exploded perspective view of a circuit module 200 including the coil component 100. As shown in FIG. 8(a) to 8(c) are process diagrams for explaining a manufacturing method of the coil component 100. FIG. FIG. 9 is a schematic cross-sectional view for illustrating the structure of a coil component 101 according to a first modified example. FIG. 10 is a schematic cross-sectional view for illustrating the structure of a coil component 102 according to a second modified example. FIG. 11 is a schematic cross-sectional view for illustrating the structure of a coil component 103 according to a third modified example.

Below, an embodiment of the technology disclosed herein will be described in detail with reference to the attached drawings.

Fig. 1 is a schematic perspective view showing the appearance of an electronic component (coil component) 100 according to one embodiment of the technology disclosed herein. Fig. 2 is a schematic perspective top view of the coil component 100, Fig. 3 is a schematic cross-sectional view of the coil component 100 taken along the imaginary line L1 shown in Fig. 2, and Fig. 4 is a schematic bottom view of the coil component 100.

As shown in Figs. 1 to 4, the coil component 100 according to this embodiment includes a base body 110, four coils C1 to C4 embedded in the base body 110, and terminal electrodes E1 to E8 exposed on the surface of the base body 110. The base body 110 may be made of a composite magnetic material in which magnetic particles made of a high magnetic permeability material such as ferrite or permalloy are bound by a resin binder. As shown in Fig. 3, the base body 110 forms an XY plane and has outer surfaces 111 and 112 located opposite each other. The outer surface 111 forms the mounting surface of the coil component 100. Eight terminal electrodes E1 to E8 are exposed from the outer surface 111. The surfaces of the terminal electrodes E1 to E8 exposed from the outer surface 111 may be flush with the outer surface 111. The outer surface 112 is the upper surface located opposite the outer surface 111.

In the example shown in FIG. 3, four conductor layers 71 to 74 are embedded in the element body 110. Terminal electrodes E1 to E8 are all located in the conductor layer 71. An insulating film 90 made of resin or the like is provided between the conductor layers 71 to 74 so that they do not come into contact with the element body 110.

Note that, hereinafter, the direction from terminal electrode E1 toward terminal electrode E2 may be referred to as the X direction (or +X direction), and the opposite direction may be referred to as the -X direction. Similarly, the direction from terminal electrode E1 toward terminal electrode E7 may be referred to as the Y direction (or +Y direction), and the opposite direction may be referred to as the -Y direction. Similarly, the direction from outer surface 111 toward outer surface 112 may be referred to as the Z direction (or +Z direction), and the opposite direction may be referred to as the -Z direction. In the specific examples shown in Figures 1 to 4, the X direction, Y direction, and Z direction are each perpendicular to each other. Note that, cases where the angles formed by the X direction, Y direction, and Z direction differ from a right angle due to manufacturing errors of coil component 100 or the like (for example, a difference of about 5° from a right angle) are also included in the present disclosure.

As shown in FIG. 4, not only the terminal electrodes E1 to E8 but also the conductor patterns 11, 24, 37, and 40 are exposed on the outer surface 111. The terminal electrodes E1 to E8 and the conductor patterns 11, 24, 37, and 40 are located on the same conductor layer 71. The surfaces of the conductor patterns 11, 24, 37, and 40 exposed from the element body 110 may be flush with the outer surface 111 of the element body 110. As shown in FIG. 4, the terminal electrodes E1 and E2 are arranged in the X direction, and the conductor pattern 11 extending in the X direction is located between them. The terminal electrodes E3 and E4 are arranged in the X direction, and the conductor pattern 24 extending in the X direction is located between them. The terminal electrodes E5 and E6 are arranged in the X direction, and the conductor pattern 37 extending in the X direction is located between them. The terminal electrodes E7 and E8 are arranged in the X direction, and the conductor pattern 40 extending in the X direction is located between them.

In the example shown in Figures 1 to 4, terminal electrodes E1, E3, E5, and E7 are arranged in the Y direction, and terminal electrodes E2, E4, E6, and E8 are arranged in the Y direction. This allows the size of element body 110 in the X direction to be reduced.

1 to 4, the positions of conductor patterns 11 and 37 in the X direction may be the same, and the positions of conductor patterns 24 and conductor patterns 40 in the X direction may be the same. In contrast, the positions of conductor patterns 11 and 37 in the X direction are different from the positions of conductor patterns 24 and 40 in the X direction. In the example shown in FIG. 4, the positions of conductor patterns 11 and 37 in the X direction do not overlap with the positions of conductor patterns 24 and 40 in the X direction. The edge positions of conductor patterns 11 and 37 in the -X direction (the side on which terminal electrodes E1, E3, E5, and E7 are formed in FIG. 4) and the edge positions of conductor patterns 24 and 40 in the +X direction (the side on which terminal electrodes E2, E4, E6, and E8 are formed in FIG. 4) may be approximately the same. However, this is not limited to the above, and the positions of the conductor patterns 11 and 37 in the X direction and the positions of the conductor patterns 24 and 40 in the X direction may partially overlap in the X direction.

The coil C1 is connected between the terminal electrode E1 and the terminal electrode E2. One end of the coil C1 is electrically connected to the terminal electrode E1, and the other end of the coil C1 is electrically connected to the terminal electrode E2. The coil C1 has a conductor pattern 11 located on the conductor layer 71, conductor patterns 12 and 13 located on the conductor layer 74, and conductor patterns 81 to 88 located on the conductor layer 72 or conductor layer 73. The conductor patterns 12 and 13 located on the conductor layer 74 are embedded in the element body 110 without being exposed from either of the outer surfaces 111 and 112. The conductor patterns that overlap in a plan view seen from the Z direction are connected through via conductors. When viewed from the Z direction, the conductor pattern 11 extends linearly in the X direction, whereas the conductor patterns 12 and 13 extend in the X direction while meandering in the Y direction. Also, as shown in FIG. 3, the conductor pattern 12 may be curved toward the outer surface 111 of the element body 110 when viewed from the Y direction. Although not shown, the conductor pattern 13 may also be curved toward the outer surface 111 of the element body 110 when viewed from the Y direction.

In the example shown in FIG. 3, conductor layer 72 includes conductor patterns 81 to 84, and conductor layer 73 includes conductor patterns 85 to 88. Conductor patterns 81 and 85 form connection portion V1, conductor patterns 82 and 86 form connection portion V2, conductor patterns 83 and 87 form connection portion V3, and conductor patterns 84 and 88 form connection portion V4. Connection portions V1 to V4 may be arranged in this order in the X direction.

In addition, in a cross section taken along imaginary line L2 in FIG. 2, connection parts V5 to V8 are formed by conductor patterns located on conductor layers 72 and 73. Connection parts V5 to V8 may be arranged in this order in the X direction. In a cross section taken along imaginary line L3 in FIG. 2, connection parts V9 to V12 are formed by conductor patterns located on conductor layers 72 and 73. Connection parts V9 to V12 may be arranged in this order in the X direction. In a cross section taken along imaginary line L4 in FIG. 2, connection parts V13 to V16 are formed by conductor patterns located on conductor layers 72 and 73. Connection parts V13 to V16 may be arranged in this order in the X direction.

In the case of the embodiment illustrated in FIG. 2, in a plan view seen from the Z direction, the conductor pattern 12 has a first straight portion 51 that is formed linearly in the X direction and has an end in the -X direction connected to the connection portion V1. The conductor pattern 12 further has a second straight portion 52 that extends linearly in the X direction and has an end in the -X direction connected to an end in the +X direction of the first straight portion 51 via a first bend 61 and an end in the +X direction connected to the connection portion V3 via a second bend 62. The first bend 61 illustrated in FIG. 2 may include a bend from the +X direction to the -Y direction and a bend from the -Y direction to the +X direction from the connection portion V1 to the connection portion V3. The second bend 62 illustrated in FIG. 2 may include a bend from the +X direction to the +Y direction from the connection portion V1 to the connection portion V3. In the embodiment illustrated in FIG. 2, the conductor pattern 13 also has a third straight portion 53 that extends linearly in the X direction, with the end in the -X direction connected to the connection portion V2 via the third bend 63, and the end in the +X direction connected to the connection portion V4 via the fourth bend 64.

Then, one end of conductor pattern 12 in the -X direction is connected to terminal electrode E1 via connection part V1. One end of conductor pattern 13 in the +X direction is connected to terminal electrode E2 via connection part V4. One end of conductor pattern 11 located on the terminal electrode E1 side (-X direction side) is connected to the other end of conductor pattern 13 via connection part V2. The other end of conductor pattern 11 located on the terminal electrode E2 side (+X direction side) is connected to the other end of conductor pattern 12 via connection part V3.

As a result, a current input from the outside to the terminal electrode E1 flows to the terminal electrode E2 via the connection part V1, the conductor pattern 12, the connection part V3, the conductor pattern 11, the connection part V2, the conductor pattern 13, and the connection part V4. Here, the current mainly flows in the +X direction in the conductor patterns 12 and 13, while the current flows in the -X direction in the conductor pattern 11. Also, the current flows in the -Z direction in the connection part V3, while the current flows in the +Z direction in the connection part V2. As a result, the conductor pattern 12, the connection part V3, the conductor pattern 11, the connection part V2, and the conductor pattern 13 form a loop with the axial direction being the Y direction. A part of the element body 110 is embedded in the area surrounded by the above loop when viewed from the Y direction. The part surrounded by this loop becomes the area (the core of the inductor) where a magnetic flux is generated when a current flows through the coil C1. Also, in a plan view viewed from the Z direction, the area surrounded by the conductor patterns 12 and 13 overlaps with a part of the conductor pattern 11.

Coil C2 is disposed adjacent to coils C1 and C3 so as to be sandwiched between them in the Y direction, and is connected between terminal electrodes E3 and E4. One end of coil C2 is electrically connected to terminal electrode E3, and the other end of coil C2 is electrically connected to terminal electrode E4. Coil C2 has conductor pattern 24 located on conductor layer 71, conductor patterns 25 and 26 located on conductor layer 74, and connection parts V5 to V8 located on conductor layer 72 or conductor layer 73. Connection parts V5 to V8 may be arranged in this order in the X direction. Conductor pattern 24 extends linearly in the X direction, while conductor patterns 25 and 26 extend in the X direction while meandering in the Y direction.

In the case of the embodiment illustrated in FIG. 2, in a plan view seen from the Z direction, the conductor pattern 26 has a fourth straight portion 54 that is formed linearly in the X direction and has an end in the +X direction connected to the connection portion V8. The conductor pattern 26 further has a fifth straight portion 55 that extends linearly in the X direction and has an end in the +X direction connected to an end in the -X direction of the fourth straight portion 54 via a fifth bend 65 and an end in the -X direction connected to the connection portion V6 via a sixth bend 66. The fifth bend 65 illustrated in FIG. 2 may include a bend from the -X direction to the -Y direction and a bend from the -Y direction to the -X direction from the connection portion V8 toward the connection portion V6. The sixth bend 66 illustrated in FIG. 2 may include a bend from the -X direction to the +Y direction from the connection portion V8 toward the connection portion V6. In the embodiment illustrated in FIG. 2, the conductor pattern 25 also has a sixth straight portion 56 that extends linearly in the X direction, with the end in the +X direction connected to the connection portion V7 via the seventh bend 67, and the end in the -X direction connected to the connection portion V5 via the eighth bend 68.

Then, one end of conductor pattern 25 in the -X direction is connected to terminal electrode E3 via connection part V5. One end of conductor pattern 26 in the +X direction is connected to terminal electrode E4 via connection part V8. One end of conductor pattern 24 located on the terminal electrode E3 side (-X direction side) is connected to the other end of conductor pattern 26 via connection part V6. The other end of conductor pattern 24 located on the terminal electrode E4 side (+X direction side) is connected to the other end of conductor pattern 25 via connection part V7.

As a result, a current input from the outside to the terminal electrode E3 flows to the terminal electrode E4 via the connection part V5, the conductor pattern 25, the connection part V7, the conductor pattern 24, the connection part V6, the conductor pattern 26, and the connection part V8. Here, the current mainly flows in the +X direction in the conductor patterns 25 and 26, while the current flows in the -X direction in the conductor pattern 24. Also, the current flows in the -Z direction in the connection part V7, while the current flows in the +Z direction in the connection part V6. As a result, the conductor pattern 25, the connection part V7, the conductor pattern 24, the connection part V6, and the conductor pattern 26 form a loop with the axial direction being the Y direction. The part surrounded by this loop becomes the area (the core of the inductor) where a magnetic flux is generated when a current flows through the coil C2. A part of the element body 110 is embedded in the area surrounded by the loop when viewed from the Y direction. Also, the area surrounded by the conductor patterns 25 and 26 overlaps with a part of the conductor pattern 24 in a plan view when viewed from the Z direction.

Coil C3 is disposed adjacent to coils C2 and C4 so as to be sandwiched between them in the Y direction, and is connected between terminal electrodes E5 and E6. One end of coil C3 is electrically connected to terminal electrode E5, and the other end of coil C3 is electrically connected to terminal electrode E6. Coil C3 has conductor pattern 37 located on conductor layer 71, conductor patterns 38 and 39 located on conductor layer 74, and connection parts V9 to V12 located on conductor layer 72 or conductor layer 73. Connection parts V9 to V12 may be arranged in this order in the X direction. Conductor pattern 37 extends linearly in the X direction, while conductor patterns 38 and 39 extend in the X direction while meandering in the Y direction.

The conductor pattern 38 has two straight portions and two bends, similar to the conductor pattern 12. The conductor pattern 39 has one straight portion and two bends, similar to the conductor pattern 13. One end of the conductor pattern 38 in the -X direction is connected to the terminal electrode E5 via the connection part V9. One end of the conductor pattern 39 in the +X direction is connected to the terminal electrode E6 via the connection part V12. One end of the conductor pattern 37 located on the terminal electrode E5 side (-X direction side) is connected to the other end of the conductor pattern 39 via the connection part V10. The other end of the conductor pattern 37 located on the terminal electrode E6 side (+X direction side) is connected to the other end of the conductor pattern 38 via the connection part V11.

As a result, a current input from the outside to the terminal electrode E5 flows to the terminal electrode E6 via the connection part V9, the conductor pattern 38, the connection part V11, the conductor pattern 37, the connection part V10, the conductor pattern 39, and the connection part V12. Here, the current mainly flows in the +X direction in the conductor patterns 38 and 39, while the current flows in the -X direction in the conductor pattern 37. Also, the current flows in the -Z direction in the connection part V11, while the current flows in the +Z direction in the connection part V10. As a result, the conductor pattern 38, the connection part V11, the conductor pattern 37, the connection part V10, and the conductor pattern 39 form a loop with the axial direction being the Y direction. The part surrounded by this loop becomes the area (the core of the inductor) where a magnetic flux is generated when a current flows through the coil C3. A part of the element body 110 is embedded in the area surrounded by the loop when viewed from the Y direction. Also, the area surrounded by the conductor patterns 38 and 39 overlaps with a part of the conductor pattern 37 in a plan view when viewed from the Z direction.

Coil C4 is disposed adjacent to coil C3 in the Y direction and is connected between terminal electrodes E7 and E8. One end of coil C4 is electrically connected to terminal electrode E7, and the other end of coil C4 is electrically connected to terminal electrode E8. Coil C4 has conductor pattern 40 located on conductor layer 71, conductor patterns 41 and 42 located on conductor layer 74, and connection parts V13 to V16 located on conductor layer 72 or conductor layer 73. Connection parts V13 to V16 may be arranged in this order in the X direction. Conductor pattern 40 extends linearly in the X direction, while conductor patterns 41 and 42 extend in the X direction while meandering in the Y direction.

The conductor pattern 41, like the conductor pattern 25, has one straight portion and two bends. The conductor pattern 42, like the conductor pattern 26, has two straight portions and two bends. One end of the conductor pattern 41 in the -X direction is connected to the terminal electrode E7 via the connection part V13. One end of the conductor pattern 42 in the +X direction is connected to the terminal electrode E8 via the connection part V16. One end of the conductor pattern 40 located on the terminal electrode E7 side (-X direction side) is connected to the other end of the conductor pattern 42 via the connection part V14. The other end of the conductor pattern 40 located on the terminal electrode E8 side (+X direction side) is connected to the other end of the conductor pattern 41 via the connection part V15.

As a result, a current input from the outside to the terminal electrode E7 flows to the terminal electrode E8 via the connection part V13, the conductor pattern 41, the connection part V15, the conductor pattern 40, the connection part V14, the conductor pattern 42, and the connection part V16. Here, the current mainly flows in the +X direction in the conductor patterns 41 and 42, while the current flows in the -X direction in the conductor pattern 40. Also, the current flows in the -Z direction in the connection part V15, while the current flows in the +Z direction in the connection part V14. As a result, the conductor pattern 41, the connection part V15, the conductor pattern 40, the connection part V14, and the conductor pattern 42 form a loop with the Y direction as the axial direction. The part surrounded by this loop becomes the area (the core of the inductor) where a magnetic flux is generated when a current flows through the coil C4. A part of the element body 110 is embedded in the area surrounded by the loop when viewed from the Y direction. Also, the area surrounded by the conductor patterns 41 and 42 overlaps with a part of the conductor pattern 40 in a plan view when viewed from the Z direction.

Figure 5(a) is an enlarged cross-sectional view to explain the structure of connection part V1 in more detail.

As shown in FIG. 5(a), the conductor pattern 81 located on the conductor layer 72 is connected to the terminal electrode E1 located on the conductor layer 71 through a via conductor 81V consisting of a part of the conductor pattern 81. The via conductor 81V is provided to penetrate the insulating film 90, and has a shape in which the diameter decreases toward the terminal electrode E1. The conductor pattern 85 located on the conductor layer 73 is connected to the conductor pattern 81 located on the conductor layer 72 through a via conductor 85V consisting of a part of the conductor pattern 85. The via conductor 85V is provided to penetrate the insulating film 90, and has a shape in which the diameter decreases toward the conductor pattern 81. The conductor pattern 12 located on the conductor layer 74 is connected to the conductor pattern 85 located on the conductor layer 73 through a via conductor 12V consisting of a part of the conductor pattern 12. The via conductor 12V is provided to penetrate the insulating film 90, and has a shape in which the diameter decreases toward the conductor pattern 85.

As a result, when stress is applied from the outside to terminal electrode E1 in the +Z direction, the stress applied to conductor pattern 81 is dispersed because the diameter of via conductor 81V is expanded in the direction in which the stress is transmitted. The stress applied to conductor pattern 81 is transmitted to conductor pattern 85 through via conductor 85V, but because the diameter of via conductor 85V is expanded in the direction in which the stress is transmitted, the stress applied to conductor pattern 85 is dispersed. Furthermore, the stress applied to conductor pattern 85 is transmitted to conductor pattern 12 through via conductor 12V, but because the diameter of via conductor 12V is expanded in the direction in which the stress is transmitted, the stress applied to conductor pattern 12 is dispersed. This mechanism causes the stress applied to terminal electrode E1 from the outside to be dispersed internally, improving the reliability of the product.

Figure 5(b) is an enlarged cross-sectional view to explain the structure of connection part V4 in more detail.

As shown in FIG. 5(b), the conductor pattern 84 located on the conductor layer 72 is connected to the terminal electrode E2 located on the conductor layer 71 through a via conductor 84V consisting of a part of the conductor pattern 84. The via conductor 84V is provided so as to penetrate the insulating film 90, and has a shape in which the diameter decreases toward the terminal electrode E2. The conductor pattern 88 located on the conductor layer 73 is connected to the conductor pattern 84 located on the conductor layer 72 through a via conductor 88V consisting of a part of the conductor pattern 88. The via conductor 88V is provided so as to penetrate the insulating film 90, and has a shape in which the diameter decreases toward the conductor pattern 84. The conductor pattern 13 located on the conductor layer 74 is connected to the conductor pattern 88 located on the conductor layer 73 through a via conductor 13V consisting of a part of the conductor pattern 13. The via conductor 13V is provided so as to penetrate the insulating film 90, and has a shape in which the diameter decreases toward the conductor pattern 88.

As a result, when stress is applied from the outside to terminal electrode E2 in the +Z direction, the stress applied to conductor pattern 84 is dispersed because the diameter of via conductor 84V is expanded in the direction in which the stress is transmitted. The stress applied to conductor pattern 84 is transmitted to conductor pattern 88 through via conductor 88V, but because the diameter of via conductor 88V is expanded in the direction in which the stress is transmitted, the stress applied to conductor pattern 88 is dispersed. Furthermore, the stress applied to conductor pattern 88 is transmitted to conductor pattern 13 through via conductor 13V, but because the diameter of via conductor 13V is expanded in the direction in which the stress is transmitted, the stress applied to conductor pattern 13 is dispersed. This mechanism causes the stress applied to terminal electrode E2 from the outside to be dispersed internally, thereby improving the reliability of the product.

Although not shown, stress applied to the other terminal electrodes E3 to E8 is also dispersed internally by a similar mechanism. In other words, the via conductors included in the connections V5, V8, V9, V12, V13, and V16 also have a shape in which the diameter expands in the +Z direction (the diameter contracts in the -Z direction), so that even if stress in the +Z direction is applied to the terminal electrodes E3 to E8, the stress is dispersed internally.

Figure 6(a) is an enlarged cross-sectional view to explain the structure of connection part V2 in more detail.

As shown in FIG. 6(a), the conductor pattern 82 located on the conductor layer 72 is connected to the conductor pattern 11 located on the conductor layer 71 through a via conductor 82V consisting of a part of the conductor pattern 82. The via conductor 82V is provided to penetrate the insulating film 90, and has a shape in which the diameter decreases toward the conductor pattern 11. The conductor pattern 86 located on the conductor layer 73 is connected to the conductor pattern 82 located on the conductor layer 72 through a via conductor 86V consisting of a part of the conductor pattern 86. The via conductor 86V is provided to penetrate the insulating film 90, and has a shape in which the diameter decreases toward the conductor pattern 82. The conductor pattern 13 located on the conductor layer 74 is connected to the conductor pattern 86 located on the conductor layer 73 through a via conductor 13V consisting of a part of the conductor pattern 13. The via conductor 13V is provided to penetrate the insulating film 90, and has a shape in which the diameter decreases toward the conductor pattern 86.

As a result, if external stress is applied to connection pattern 11 in the +Z direction, the stress applied to conductor pattern 82 is dispersed because the diameter of via conductor 82V is enlarged in the direction in which the stress is transmitted. The stress applied to conductor pattern 82 is transmitted to conductor pattern 86 through via conductor 86V, but the stress applied to conductor pattern 86 is dispersed because the diameter of via conductor 86V is enlarged in the direction in which the stress is transmitted. Furthermore, the stress applied to conductor pattern 86 is transmitted to conductor pattern 13 through via conductor 13V, but the stress applied to conductor pattern 13 is dispersed because the diameter of via conductor 13V is enlarged in the direction in which the stress is transmitted. This mechanism allows external stress applied to connection pattern 11 to be dispersed internally, improving product reliability.

Figure 6(b) is an enlarged cross-sectional view to explain the structure of connection part V3 in more detail.

As shown in FIG. 6(b), the conductor pattern 83 located on the conductor layer 72 is connected to the conductor pattern 11 located on the conductor layer 71 through a via conductor 83V consisting of a part of the conductor pattern 83. The via conductor 83V is provided so as to penetrate the insulating film 90, and has a shape in which the diameter decreases toward the conductor pattern 11. The conductor pattern 87 located on the conductor layer 73 is connected to the conductor pattern 83 located on the conductor layer 72 through a via conductor 87V consisting of a part of the conductor pattern 87. The via conductor 87V is provided so as to penetrate the insulating film 90, and has a shape in which the diameter decreases toward the conductor pattern 83. The conductor pattern 12 located on the conductor layer 74 is connected to the conductor pattern 87 located on the conductor layer 73 through a via conductor 12V consisting of a part of the conductor pattern 12. The via conductor 12V is provided so as to penetrate the insulating film 90, and has a shape in which the diameter decreases toward the conductor pattern 87.

As a result, if external stress is applied to connection pattern 11 in the +Z direction, the stress applied to conductor pattern 83 is dispersed because the diameter of via conductor 83V is enlarged in the direction in which the stress is transmitted. The stress applied to conductor pattern 83 is transmitted to conductor pattern 87 through via conductor 87V, but the stress applied to conductor pattern 87 is dispersed because the diameter of via conductor 87V is enlarged in the direction in which the stress is transmitted. Furthermore, the stress applied to conductor pattern 87 is transmitted to conductor pattern 12 through via conductor 12V, but the stress applied to conductor pattern 12 is dispersed because the diameter of via conductor 12V is enlarged in the direction in which the stress is transmitted. This mechanism allows external stress applied to connection pattern 11 to be dispersed internally, improving product reliability.

Although not shown, the via conductors included in the connection parts V6, V7, V10, V11, V14, and V15 connected to the other conductor patterns 24, 37, and 40 located on the conductor layer 71 also have a shape in which the diameter expands in the +Z direction (the diameter contracts in the -Z direction), so that even if stress in the +Z direction is applied to the conductor patterns 24, 37, and 40, the stress is dispersed internally.

With the above configuration, the coil component 100 according to this embodiment forms an eight-terminal coil array with four built-in coils. The coil component 100 can be mounted on the mounting area 100A on the substrate 130 shown in FIG. 7 to form a circuit module 200. Land patterns P1 to P8 are provided on the surface of the substrate 130, and the coil component 100 is mounted on the substrate 130 so that the terminal electrodes E1 to E8 are connected to the land patterns P1 to P8, respectively.

In the coil component 100 according to this embodiment, the coils C1 to C4 are arranged in the Y direction, and each has a loop with its axial direction in the Y direction, so that the size of the base body 110 in the Y direction can be reduced. In particular, in two coils adjacent in the Y direction, the positions in the X direction of the conductor patterns provided on the outer surface 111 are different from each other, so that the sections in which the conductor patterns provided on the conductor layer 74 in each coil overlap in the Y direction can be shifted in the X direction in the adjacent coils. For example, the section in which the conductor patterns 12, 13 constituting coil C1 overlap in the Y direction and the section in which the conductor patterns 25, 26 constituting coil C2 overlap in the Y direction can be shifted in the X direction. This makes it possible to incorporate multiple coils in the base body 110 with higher density.

Moreover, since the stacking direction of the conductor patterns inside the base body 110 is the Z direction, even if the number of coils built into the base body 110 increases, the number of stacked conductor patterns does not increase, and manufacturing costs are reduced.

Here, as shown in Figure 2, if we define a virtual line L0 that passes through the center of coils C1 to C4 in the X direction and extends in the Y direction, conductor patterns 12 and 13 constituting coil C1 and conductor patterns 25 and 26 constituting coil C2 have shapes that are linearly symmetrical with respect to the virtual line L0, and conductor patterns 38 and 39 constituting coil C3 and conductor patterns 41 and 42 constituting coil C4 have shapes that are linearly symmetrical with respect to the virtual line L0. In other words, when conductor patterns 12 and 13 constituting coil C1 are inverted with respect to the virtual line L0 as the axis of symmetry, they have the same shape as conductor patterns 25 and 26 constituting coil C2, and when conductor patterns 38 and 39 constituting coil C3 are inverted with respect to the virtual line L0 as the axis of symmetry, they have the same shape as conductor patterns 41 and 42 constituting coil C4.

Furthermore, when imaginary lines L1 to L4 are defined as passing through the centers of coils C1 to C4 in the Y direction and extending in the X direction, conductor patterns 12 and 13 constituting coil C1 and conductor patterns 38 and 39 constituting coil C3 have shapes that are linearly symmetrical with respect to imaginary lines L1 and L3, respectively, and conductor patterns 25 and 26 constituting coil C2 and conductor patterns 41 and 42 constituting coil C4 have shapes that are linearly symmetrical with respect to imaginary lines L2 and L4, respectively. In other words, when conductor patterns 12 and 13 constituting coil C1 are inverted with respect to imaginary line L1 as the axis of symmetry, they have the same shape as conductor patterns 38 and 39 constituting coil C3, and when conductor patterns 38 and 39 constituting coil C3 are inverted with respect to imaginary line L3 as the axis of symmetry, they have the same shape as conductor patterns 12 and 13 constituting coil C1. Similarly, when the conductor patterns 25 and 26 constituting the coil C2 are inverted with the virtual line L2 as the axis of symmetry, they have the same shape as the conductor patterns 41 and 42 constituting the coil C4, and when the conductor patterns 41 and 42 constituting the coil C4 are inverted with the virtual line L4 as the axis of symmetry, they have the same shape as the conductor patterns 25 and 26 constituting the coil C2. In other words, the conductor patterns 38 and 39 constituting the coil C3 are formed to have straight portions and bent portions similar to the conductor patterns 12 and 13 constituting the coil C1, and the conductor patterns 41 and 42 constituting C4 may be formed to have straight portions and bent portions similar to the conductor patterns 25 and 26 constituting the coil C2, respectively.

Furthermore, if the intersections of virtual line L0 and virtual lines L1 to L4 are designated Q1 to Q4, respectively, coils C1 and C4 have shapes that are point-symmetrical to each other with intersections Q1 and Q4 as their center points, and coils C2 and C3 have shapes that are point-symmetrical to each other with intersections Q2 and Q3 as their center points. In other words, when coil C1 is rotated 180° around intersection Q1 as its center point, it will have the same shape as coil C4, and when coil C4 is rotated 180° around intersection Q4 as its center point, it will have the same shape as coil C1. Similarly, when coil C2 is rotated 180° around intersection Q2 as its center point, it will have the same shape as coil C3, and when coil C3 is rotated 180° around intersection Q3 as its center point, it will have the same shape as coil C2.

As such, because coils C1 to C4 have the above-mentioned shapes, coils C1 to C4, each having the same inductance, can be arranged at high density, and the pattern design of the conductor pattern becomes easier.

FIGS. 8(a) to 8(c) are process diagrams for explaining the manufacturing method of the coil component 100 according to this embodiment. The cross sections shown in FIG. 8(a) to FIG. 8(c) correspond to the cross section shown in FIG. 3.

First, as shown in FIG. 8(a), a support S is prepared, and conductor layers 71 to 74 are formed in this order on the support S. Focusing on the coil C1, the conductor layer 71 includes terminal electrodes E1 and E2, and a conductor pattern 11. Furthermore, the conductor layer 71 includes a sacrificial pattern 91. The terminal electrodes E1 and E2, the conductor pattern 11, and the sacrificial pattern 91 are separated from one another by an insulating film 90. Focusing on the coil C1, the conductor layer 72 includes conductor patterns 81 to 84. Furthermore, the conductor layer 72 includes a sacrificial pattern 92. The conductor patterns 81 to 84 and the sacrificial pattern 92 are separated from one another by an insulating film 90. The sacrificial pattern 92 located on the conductor layer 72 is connected to the sacrificial pattern 91 located on the conductor layer 71.

Focusing on coil C1, conductor layer 73 includes conductor patterns 85-88. Furthermore, conductor layer 73 includes sacrificial pattern 93. Conductor patterns 85-88 and sacrificial pattern 93 are separated from each other by insulating film 90. Sacrificial pattern 93 located on conductor layer 73 is connected to sacrificial pattern 92 located on conductor layer 72. Focusing on coil C1, conductor layer 74 includes conductor patterns 12 and 13. Furthermore, conductor layer 74 includes sacrificial pattern 94. Conductor patterns 12 and 13 and sacrificial pattern 94 are separated from each other by insulating film 90. Sacrificial pattern 94 located on conductor layer 74 is connected to sacrificial pattern 93 located on conductor layer 73.

Next, as shown in FIG. 8(b), the sacrificial patterns 91-94 are removed using acid or the like. This forms a space between the conductor patterns 12, 13 located on the conductor layer 74 and the support S. In other words, both ends of the conductor pattern 12 are supported by the connection parts V1, V3, and the portion located between the ends is suspended in mid-air. Also, both ends of the conductor pattern 13 are supported by the connection parts V2, V4, and the portion located between the ends is suspended in mid-air.

Next, as shown in FIG. 8(c), a base body 110 made of a magnetic material is formed in the area where the sacrificial patterns 91-94 have been removed and in the layer above it, thereby embedding the conductor layers 71-74 in the base body 110. In forming the base body 110, the conductor layers 71-74 are embedded in the uncured base body 110, and then the base body 110 is hardened by applying pressure to the support S. Depending on the pressure conditions applied to the base body 110, the conductor patterns 12 and 13 that are suspended in mid-air are deformed and curved toward the support S. This changes the length of the conductor patterns 12 and 13, and therefore the inductance of the conductor patterns 12 and 13. The support S is then peeled off to expose the terminal electrodes E1-E8 and conductor patterns 11, 24, 37, and 40 located in the conductor layer 71, and the coil component 100 according to this embodiment is completed.

In this way, according to the manufacturing method of the coil component 100 of this embodiment, since the conductor layers 71 to 74 are formed in this order from the conductor layer 71 side where the terminal electrodes E1 to E8 are located, it is possible to complete the process of forming the element body 110 in one step, compared to a method of forming the conductor layers 74 to 71 in this order from the conductor layer 74 side. In other words, in the method of forming the conductor layers 74 to 71 in this order from the conductor layer 74 side, after forming the conductor layers 74 to 71 on the support S in this order, the element body 110 in which the conductor layers 74 to 71 are embedded is formed, and after peeling off the support S, another part of the element body 110 is formed from the conductor layer 74 side, so two steps are required to form the element body 110. Furthermore, if the element body 110 is formed in two steps, an interface is formed in the element body 110, and the magnetic properties of this part are reduced. In contrast, the manufacturing method for the coil component 100 according to this embodiment completes the process of forming the base body 110 in one step, which reduces manufacturing costs, and because no interface is formed inside the base body 110, it is possible to ensure high magnetic properties.

Moreover, according to the method shown in Figures 8(a) to 8(c), the terminal electrodes E1 to E8 and the conductor patterns 11, 24, 37, and 40 form substantially the same plane as the outer surface 111 of the base body 110, so it is also possible to reduce the height of the coil component 100 in the Z direction.

FIG. 9 is a schematic cross-sectional view for explaining the structure of the coil component 101 according to the first modified example. The cross-sectional position in FIG. 9 is the same as the cross-sectional position in FIG. 3.

As shown in FIG. 9, the coil component 101 according to the first modified example differs from the coil component 100 according to the above embodiment in that the outer surface 111 of the base body 110 is covered with a coating layer 95 made of resin or the like. The rest of the basic configuration is the same as that of the coil component 100 according to the above embodiment, so the same elements are given the same reference numerals and redundant explanations are omitted.

The coating layer 95 is provided on the outer surface 111 of the element body 110 so as to expose at least a portion of the terminal electrodes E1 to E8. The conductor patterns 11, 24, 37, and 40 located on the conductor layer 71 may be entirely covered with the coating layer 95. By providing such a coating layer 95, it is possible to prevent short circuit defects through the conductor patterns 11, 24, 37, and 40, and to increase the dielectric strength voltage on the outer surface 111 side of the element body 110.

FIG. 10 is a schematic cross-sectional view for explaining the structure of the coil component 102 according to the second modified example. The cross-sectional position in FIG. 10 is the same as the cross-sectional position in FIG. 3.

As shown in FIG. 10, in the coil component 102 according to the second modified example, the coil C1 is made of a linear conductor pattern 44. In the example shown in FIG. 10, the conductor pattern 44 is located on the conductor layer 74. One end of the conductor pattern 44 is connected to the terminal electrode E1 via a connection portion V1, and the other end of the conductor pattern 44 is connected to the terminal electrode E2 via a connection portion V4. Although not shown, the other coils C2 to C4 also each consist of a linear conductor pattern.

As exemplified by coil component 102 according to the second modified example, the shape of coils C1 to C4 is not particularly limited, and may be a linear conductor pattern. This increases the length of conductor pattern 44 in the X direction, making it possible to increase the amount of curvature of conductor pattern 44. Furthermore, the conductor layer on which the linear conductor pattern is arranged is not limited to conductor layer 74, and may be conductor layer 73 or conductor layer 72. When the linear conductor pattern is arranged on conductor layer 73, conductor layer 74 may be omitted. When the linear conductor pattern is arranged on conductor layer 72, conductor layers 73 and 74 may be omitted.

FIG. 11 is a schematic cross-sectional view for explaining the structure of coil component 103 according to the third modified example. The cross-sectional position in FIG. 11 is the same as the cross-sectional position in FIG. 3.

As shown in FIG. 11, in the coil component 103 according to the third modified example, the coil C1 is composed of two linear conductor patterns 43, 44. In the example shown in FIG. 11, the conductor pattern 43 is located on the conductor layer 73, and the conductor pattern 44 is located on the conductor layer 74. One end of the conductor patterns 43, 44 is connected to the terminal electrode E1 via the connection portion V1, and the other end of the conductor patterns 43, 44 is connected to the terminal electrode E2 via the connection portion V4. Although not shown, the other coils C2 to C4 also each consist of a linear conductor pattern.

As exemplified by coil component 103 according to the third modified example, multiple conductor patterns may be connected in parallel. This makes it possible to reduce the DC resistance of coils C1 to C4.

　Although the above describes embodiments of the technology disclosed herein, the technology disclosed herein is not limited to the above embodiments, and various modifications are possible without departing from the spirit of the technology, and it goes without saying that these modifications are also included within the scope of the technology disclosed herein.

For example, in the embodiment illustrated in Figures 1 to 4, a coil component including four coils C1 to C4 is disclosed, but the technology disclosed herein does not limit the number of coils included in the electronic component (coil component).

In addition, in the embodiment illustrated in Figures 1 to 4, four conductor layers 71 to 74 are embedded in the element body 110, but in the technology disclosed herein, there is no particular limit to the number of conductor layers embedded in the element body.

Furthermore, two or more types of coils, the coil shown in FIG. 3, the coil shown in FIG. 10, and the coil shown in FIG. 11, may be mixed in one element.

The technology disclosed herein includes, but is not limited to, the following configuration examples.

An electronic component according to one aspect of the present disclosure comprises an element body having a first surface and a second surface located opposite the first surface, a first terminal electrode and a second terminal electrode located on a first conductor layer within the element body, both exposed from the first surface, and a coil, at least a portion of which is located on a second conductor layer within the element body, one end of which is connected to the first terminal electrode via a first via conductor and the other end of which is connected to the second terminal electrode via a second via conductor, wherein at least a portion of the first via conductor has a shape whose diameter decreases toward the first terminal electrode, and at least a portion of the second via conductor has a shape whose diameter decreases toward the second terminal electrode. This allows stress applied from the outside to the first and second terminal electrodes to be dispersed internally.

In the above electronic component, the surface of the first terminal electrode and the surface of the second terminal electrode exposed from the body may be flush with the first surface of the body. This allows the electronic component to be made low-profile.

In the above electronic component, the coil may include a first conductor pattern formed on the first conductor layer, one end of which is located on the first terminal electrode side and the other end of which is located on the second terminal electrode side; a second conductor pattern formed on the second conductor layer, one end of which is electrically connected to the first terminal electrode through the first via conductor and the other end of which is electrically connected to the other end of the first conductor pattern through a third via conductor; and a third conductor pattern formed on the second conductor layer, one end of which is electrically connected to the second terminal electrode through the second via conductor and the other end of which is electrically connected to one end of the first conductor pattern through a fourth via conductor. This makes it possible to obtain a larger inductance.

In the above electronic component, the second conductor pattern and the third conductor pattern may be embedded in the body without being exposed from either the first or second surface. This makes it possible to obtain a larger inductance.

In the above electronic component, the first conductor pattern is exposed from the first surface, and the surface of the first conductor pattern exposed from the base body may be flush with the first surface of the base body. This allows the electronic component to be made low-profile.

In the electronic component described above, at least a portion of the third via conductor may have a shape whose diameter decreases toward the other end of the first conductor pattern, and at least a portion of the fourth via conductor may have a shape whose diameter decreases toward one end of the first conductor pattern. In this way, stress applied from the outside to the first conductor pattern is dispersed internally.

In the electronic component described above, the portion of the coil located on the second conductor layer may be curved toward the first surface. This makes it possible to fine-tune the inductance by adjusting the amount of curvature.

In the above electronic component, one end of the coil is connected to the first terminal electrode through a first via conductor group including a first via conductor, and the other end of the coil is connected to the second terminal electrode through a second via conductor group including a second via conductor, and the multiple via conductors included in the first via conductor group may all have at least a portion of a shape whose diameter decreases toward the first terminal electrode, and the multiple via conductors included in the second via conductor group may all have at least a portion of a shape whose diameter decreases toward the second terminal electrode. This allows stress applied from the outside to the first and second terminal electrodes to be more effectively distributed inside.

A method for manufacturing an electronic component according to one aspect of the present disclosure includes a first step of forming a first conductor layer on a support, the first conductor layer including a first terminal electrode, a second terminal electrode, and a first sacrificial pattern; a second step of forming a second conductor layer on the first conductor layer, the second sacrificial pattern including at least a part of a coil having one end connected to the first terminal electrode and the other end connected to the second terminal electrode; a third step of removing the first sacrificial pattern and the second sacrificial pattern; a fourth step of forming an element body in the area where at least the first sacrificial pattern and the second sacrificial pattern have been removed, thereby embedding the first terminal electrode, the second terminal electrode, and the coil in the element body; and a fifth step of exposing the first terminal electrode and the second terminal electrode by peeling off the support. This makes it possible to manufacture an electronic component with a small number of steps.

In the third step, a space may be formed between at least a portion of the coil located on the second conductor layer and the support. This makes it possible to embed the element in the space.

In the fourth step, the element may be pressurized to bend at least a portion of the coil toward the support. This makes it possible to fine-tune the inductance by adjusting the amount of bending.

This application claims the benefit of Japanese Patent Application No. 2023-162952, filed on September 26, 2023, the entire disclosure of which is incorporated herein by reference.

11 to 13, 24 to 26, 37 to 44, 81 to 88 Conductor patterns 12V, 13V, 81V, 84V, 85V, 88V Via conductors 51 to 56 Straight portions 61 to 68 Bent portions 71 to 74 Conductor layer 90 Insulating films 91 to 94 Sacrificial patterns 95 Coating layers 100 to 103 Coil components (electronic components)
100A Mounting area 110 Body 111, 112 Outer surface 130 Substrate 200 Circuit modules C1 to C4 Coils E1 to E8 Terminal electrodes L0 to L4 Virtual lines P1 to P8 Land patterns Q1 to Q4 Intersections S Supports V1 to V16 Connections

Claims (11)

an element body having a first surface and a second surface located opposite to the first surface;
a first terminal electrode and a second terminal electrode located in a first conductor layer within the element body, both of which are exposed from the first surface;
a coil, at least a portion of which is located in a second conductor layer within the element body, one end of which is connected to the first terminal electrode through a first via conductor and the other end of which is connected to the second terminal electrode through a second via conductor;
Equipped with
At least a portion of the first via conductor has a shape whose diameter decreases toward the first terminal electrode,
At least a portion of the second via conductor has a shape whose diameter decreases toward the second terminal electrode.
Electronic components. a surface of the first terminal electrode and a surface of the second terminal electrode exposed from the element body are flush with the first surface of the element body.
The electronic component according to claim 1 . The coil is
a first conductor pattern formed on the first conductor layer, one end of which is located on the first terminal electrode side and the other end of which is located on the second terminal electrode side;
a second conductor pattern formed on the second conductor layer, one end of which is electrically connected to the first terminal electrode through the first via conductor and the other end of which is electrically connected to the other end of the first conductor pattern through a third via conductor;
a third conductor pattern formed on the second conductor layer, one end of which is electrically connected to the second terminal electrode through the second via conductor and the other end of which is electrically connected to the one end of the first conductor pattern through a fourth via conductor;
Including,
The electronic component according to claim 1 . the second conductor pattern and the third conductor pattern are embedded in the element body without being exposed from either the first surface or the second surface.
The electronic component according to claim 3 . the first conductor pattern is exposed from the first surface,
a surface of the first conductor pattern exposed from the element body is flush with the first surface of the element body;
The electronic component according to claim 3 . At least a portion of the third via conductor has a shape whose diameter decreases toward the other end of the first conductor pattern,
At least a portion of the fourth via conductor has a shape whose diameter decreases toward the one end of the first conductor pattern.
The electronic component according to claim 3 . A portion of the coil located on the second conductor layer is curved toward the first surface.
The electronic component according to claim 1 . the one end of the coil is connected to the first terminal electrode through a first via conductor group including the first via conductor;
the other end of the coil is connected to the second terminal electrode through a second via conductor group including the second via conductor;
each of the plurality of via conductors included in the first via conductor group has a shape in which at least a portion of the via conductors decreases in diameter toward the first terminal electrode;
At least a portion of each of the plurality of via conductors included in the second via conductor group has a shape in which a diameter thereof decreases toward the second terminal electrode.
The electronic component according to any one of claims 1 to 6. A first step of forming a first conductor layer on a support, the first conductor layer including a first terminal electrode, a second terminal electrode, and a first sacrificial pattern;
a second step of forming a second conductor layer on the first conductor layer, the second conductor layer including at least a portion of a coil having one end connected to the first terminal electrode and the other end connected to the second terminal electrode, and a second sacrificial pattern;
a third step of removing the first sacrificial pattern and the second sacrificial pattern;
a fourth step of forming an element body in a region from which at least the first sacrificial pattern and the second sacrificial pattern have been removed, thereby embedding the first terminal electrode, the second terminal electrode, and the coil in the element body;
a fifth step of peeling off the support to expose the first terminal electrode and the second terminal electrode;
A method for manufacturing an electronic component comprising the steps of: In the third step, a space is formed between the support and the at least a portion of the coil located on the second conductor layer.
The method for manufacturing an electronic component according to claim 9 . In the fourth step, the element body is pressed to bend at least the portion of the coil toward the support body.
The method for manufacturing an electronic component according to claim 9 or 10.

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