[go: up one dir, main page]

WO2025068161A1 - Tête de sonde pourvue de trous de guidage métallisés - Google Patents

Tête de sonde pourvue de trous de guidage métallisés Download PDF

Info

Publication number
WO2025068161A1
WO2025068161A1 PCT/EP2024/076750 EP2024076750W WO2025068161A1 WO 2025068161 A1 WO2025068161 A1 WO 2025068161A1 EP 2024076750 W EP2024076750 W EP 2024076750W WO 2025068161 A1 WO2025068161 A1 WO 2025068161A1
Authority
WO
WIPO (PCT)
Prior art keywords
guide
face
probe head
conductive portion
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/EP2024/076750
Other languages
English (en)
Inventor
Stefano Felici
Mario SOTTOCORNO
Riccardo BOLIS
Francesco GUIDO
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Technoprobe SpA
Original Assignee
Technoprobe SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technoprobe SpA filed Critical Technoprobe SpA
Publication of WO2025068161A1 publication Critical patent/WO2025068161A1/fr
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass

Definitions

  • the conductive portion 30 is made of a material selected from gold or other conductive materials, without being limited by the particular material selected, that may vary based on the needs and/or circumstances.
  • the present invention is not limited by the number and / or the arrangement of the conductive portions, which may be selected based on the needs and/or circumstances, as described for example in the international patent application no. PCT/EP2017 / 082180 in the name of the Applicant.
  • the walls of the guide hole 40h are shaped so as to define the above-mentioned hole tapered portion 40hr which extends from the second face FB to a given position on the wall 40hw of the guide hole, herein referred to as hole inner position Z, said tapered portion 40hr having a variation of its sectional dimensions from the second face FB up to the hole inner position Z, whereas the guide hole 40h has substantially constant sectional dimensions from said hole inner position Z up to the first face FA.
  • the tapered portion 40hr has a decrease in its cross-sectional dimensions from the second face FB to the hole inner position Z ( Figure 2A shows in greater detail a guide hole 40h according to this embodiment, wherein the tapered portion 40hr gradually narrows going up along the longitudinal axis L-L toward the hole inner position Z).
  • both holes shaped as in Figure 2A and holes shaped as in Figure 2B may be provided on the same guide.
  • the tapered portion 40hr of the guide hole 40h is precisely the uncovered portion 40hp of said guide hole 40h, so that said tapered portion 40hr of the hole does not comprise any conductive coating.
  • the tapered portion 40hr of the hole comprises the uncovered portion 40hp of the walls (in particular, only said uncovered portion 40hp of the walls), and the conductive portion 30 extends into the guide hole 40h from the hole inner position Z, at which the terminal portion 30t thereof is located, up to the first face FA of the guide 40 (so that the part of the hole provided with the metallization is only the part being substantially constant in section) .
  • the tapered portion 40hr comprises at least one pair of walls that are slanted (tilted) in an opposite manner to each other with respect to the longitudinal axis L-L of the guide hole 40h.
  • said longitudinal axis L-L of the guide hole is substantially parallel to the longitudinal axis H-H of the contact probes 10.
  • the conductive portion 30 may be configured to carry a given power supply signal, thus forming a given power domain, or it may be configured to carry a ground signal, thus forming a given ground domain, without limitation of the scope of the present invention.
  • the probe head 100 may comprise at least one further conductive portion (indicated with reference 30bis) configured to include and electrically connect a further group (indicated with 40hgbis) of the guide holes that houses further contact probes (indicated with lObis), the contact probes 10 and the further contact probes lObis being connectable with respective different sources for carrying a respective different type of signal.
  • a conductive portion may be dedicated to a power signal and the other conductive portion may be dedicated to a ground signal or to another power signal, as detailed below.
  • a plurality of conductive portions may be provided, each portion being dedicated to a respective power supply, which is different from the power supplies of the other conductive portions, and there may also be conductive portions configured to carry ground signals and/or operational signals from/to the device under test DUT, without limitation of the scope of the present invention, wherein said conductive portions may be distributed also on both faces of the guide in the manner illustrated above.
  • the conductive portions on one face of the guide 40 are separated from each other by at least one non- conductive region, so as to prevent the electrical connection between them.
  • the advantageous configuration used in the present invention which does not leave exposed metallization portions on the lower face, definitely avoids formation of short-circuits and other unwanted effects.
  • the guide 40 may be a lower guide of the probe head 100.
  • there may also be an upper guide wherein, in this case, the configuration of the guide holes according to the invention is reversed compared to what was described for the lower guide.
  • the face FA is an upper face and the tapered portion 40hr is at the lower face FB, this does not limit the scope of the present invention in any way, and the situation can also be reversed.
  • the present invention thus allows to brilliantly overcome the technical problem, providing the above probe head and solving all the drawbacks of the prior art.
  • a post-drilling metallization is provided at a face of the guide, and it is avoided that said metallization is visible from the opposite side (i.e., it does not emerge from the guide hole at the opposite face of the guide) .
  • the metal tracks are not exposed, and for example short-circuits are avoided at the opposite side of the guide (for example when other metallizations are formed at said opposite side of the guide); the presence of the tapered portion also contributes to further improve this aspect.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

Tête de sonde (100) pour tester un dispositif sous test (DUT), ladite tête de sonde ayant une pluralité de sondes de contact (10) dotées d'un corps (10p) s'étendant entre une première partie d'extrémité (10a) et une seconde partie d'extrémité (10b), qui sont conçues pour entrer en contact avec des plots de contact respectifs, au moins un guide (40) comprenant des trous de guidage (40h) pour loger au moins une partie des sondes de contact (10), chaque trou de guidage (40h) étant défini par une pluralité de parois, et au moins une partie conductrice (30) qui est formée sur une première face (FA) du guide (40) et comprend au moins un groupe (40 hg) des trous de guidage (40h), ladite partie conductrice (30) étant configurée pour entrer en contact avec et court-circuiter un groupe correspondant (10g) de sondes de contact qui sont logées dans ledit groupe (40 hg) de trous de guidage et sont destinées à transporter un même type de signal. Au moins un des trous de guidage du groupe (40hg) de trous de guidage comprend au moins une paroi (40hw) desdites parois qui est revêtue par la partie conductrice (30) par le biais d'une partie de celle-ci s'étendant à l'intérieur dudit trou de guidage (40h), ladite paroi (40hw) du trou de guidage (40h) n'étant revêtue que partiellement par la partie conductrice (30), qui s'étend le long de ladite paroi (40hw) jusqu'à une partie terminale (30t) de ladite partie conductrice, ladite paroi (40hw) comprenant ainsi une partie découverte (40hp) qui s'étend depuis la partie terminale (30t) de la partie conductrice (30) jusqu'à une deuxième face (FB) du guide (40), ladite deuxième face étant opposée à la première face (FA) sur laquelle est formée la partie conductrice (30), et les parois dudit trou de guidage (40h) étant façonnées de manière à définir une partie tronconique (40hr) qui s'étend depuis la deuxième face (FB) jusqu'à une position intérieure de trou (Z), ladite portion tronconique (40hr) du trou présentant une variation de ses dimensions de section depuis la deuxième face (FB) jusqu'à la position intérieure de trou (Z), le trou de guidage (40h) présentant des dimensions de section sensiblement constantes depuis ladite position intérieure de trou (Z) jusqu'à la première face (FA).
PCT/EP2024/076750 2023-09-26 2024-09-24 Tête de sonde pourvue de trous de guidage métallisés Pending WO2025068161A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT102023000019776 2023-09-26
IT102023000019776A IT202300019776A1 (it) 2023-09-26 2023-09-26 Testa di misura dotata di fori guida metallizzati

Publications (1)

Publication Number Publication Date
WO2025068161A1 true WO2025068161A1 (fr) 2025-04-03

Family

ID=89068568

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2024/076750 Pending WO2025068161A1 (fr) 2023-09-26 2024-09-24 Tête de sonde pourvue de trous de guidage métallisés

Country Status (3)

Country Link
IT (1) IT202300019776A1 (fr)
TW (1) TW202516183A (fr)
WO (1) WO2025068161A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008081704A1 (fr) * 2006-12-28 2008-07-10 Nhk Spring Co., Ltd. Procédé de fixation d'un câblage d'unité de sonde, et unité de sonde
US20150198632A1 (en) * 2014-01-14 2015-07-16 Willtechnology Co., Ltd. Semiconductor testing apparatus
KR20160075286A (ko) * 2014-12-21 2016-06-29 김일 검사접촉장치
WO2018108790A1 (fr) * 2016-12-16 2018-06-21 Technoprobe S.P.A. Tête de réalisation d'essais à propriétés de fréquence améliorées
WO2018153963A1 (fr) * 2017-02-24 2018-08-30 Technoprobe S.P.A. Tête d'essai de sonde verticale à propriétés de fréquence améliorées
JP2022036615A (ja) * 2020-08-24 2022-03-08 株式会社日本マイクロニクス 電気的接触子の電気的接触構造及び電気的接続装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008081704A1 (fr) * 2006-12-28 2008-07-10 Nhk Spring Co., Ltd. Procédé de fixation d'un câblage d'unité de sonde, et unité de sonde
US20150198632A1 (en) * 2014-01-14 2015-07-16 Willtechnology Co., Ltd. Semiconductor testing apparatus
KR20160075286A (ko) * 2014-12-21 2016-06-29 김일 검사접촉장치
WO2018108790A1 (fr) * 2016-12-16 2018-06-21 Technoprobe S.P.A. Tête de réalisation d'essais à propriétés de fréquence améliorées
WO2018153963A1 (fr) * 2017-02-24 2018-08-30 Technoprobe S.P.A. Tête d'essai de sonde verticale à propriétés de fréquence améliorées
JP2022036615A (ja) * 2020-08-24 2022-03-08 株式会社日本マイクロニクス 電気的接触子の電気的接触構造及び電気的接続装置

Also Published As

Publication number Publication date
IT202300019776A1 (it) 2025-03-26
TW202516183A (zh) 2025-04-16

Similar Documents

Publication Publication Date Title
US11921133B2 (en) Testing head having improved frequency properties
US12105118B2 (en) Testing head with an improved contact between contact probes and guide holes
US11971449B2 (en) Probe head for a testing apparatus of electronic devices with enhanced filtering properties
US11402428B2 (en) High-performance probe card in high-frequency
TWI708061B (zh) 具有增進頻率性質之測試頭
US11340262B2 (en) Contact probe for a testing head for testing high-frequency devices
JP2023549204A (ja) 高周波電子デバイスを試験するためのプローブヘッド用に改良されたコンタクト要素および関連するプローブヘッド
US12498396B2 (en) Probe unit
US20240012027A1 (en) Probe head with an improved contact between contact probes and metallized guide holes
WO2025068161A1 (fr) Tête de sonde pourvue de trous de guidage métallisés
WO2025061688A1 (fr) Tête de sonde pourvue d'une pluralité de métallisations
WO2025031940A1 (fr) Carte sonde avec guide pourvu de métallisations
KR102894364B1 (ko) 릴레이 회로 및 전기적 접속 장치
WO2024133250A1 (fr) Tête de sonde avec guide de métallisation et procédé d'utilisation
KR102184792B1 (ko) 부싱을 이용한 전자 부품 검사용 장치
KR100293422B1 (ko) 회로기판
WO2025257004A1 (fr) Tête de sonde à hautes performances à hautes fréquences et en termes de conductivité électrique

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 24775922

Country of ref document: EP

Kind code of ref document: A1