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WO2024228184A1 - Procédé de formation de couches polymères non conductrices avec un coefficient contrôlé de dilatation thermique - Google Patents

Procédé de formation de couches polymères non conductrices avec un coefficient contrôlé de dilatation thermique Download PDF

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Publication number
WO2024228184A1
WO2024228184A1 PCT/IL2024/050386 IL2024050386W WO2024228184A1 WO 2024228184 A1 WO2024228184 A1 WO 2024228184A1 IL 2024050386 W IL2024050386 W IL 2024050386W WO 2024228184 A1 WO2024228184 A1 WO 2024228184A1
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Prior art keywords
cte
nanoparticles
dielectric
resin
dielectric nanoparticles
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Joseph Kaplun
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Inpack Technologies LP
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Inpack Technologies LP
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Priority to CN202480039343.0A priority Critical patent/CN121400152A/zh
Publication of WO2024228184A1 publication Critical patent/WO2024228184A1/fr
Priority to IL324281A priority patent/IL324281A/en
Anticipated expiration legal-status Critical
Pending legal-status Critical Current

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    • H10W74/01—
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/0427—Coating with only one layer of a composition containing a polymer binder
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C08J7/123—Treatment by wave energy or particle radiation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H10W74/47—
    • H10W74/473—
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2400/00—Characterised by the use of unspecified polymers
    • C08J2400/24—Thermosetting resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2465/00—Characterised by the use of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
    • C08J2479/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2479/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2258—Oxides; Hydroxides of metals of tungsten
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely

Definitions

  • the present disclosure relates generally to semiconductor devices, and more particularly, to methods for forming a semiconductor device having a non-conductive polymer layer with a controlled coefficient of thermal expansion.
  • Non-conductive (dielectric) layers are a crucial component in the functionality, performance and reliability of integrated circuits and semiconductor devices. These layers are used to isolate the various components of the semiconductor device, thereby preventing undesired electrical interactions therebetween. Consequently, ensuring proper operation of the device, minimizing performance degradation and failure.
  • the non-conductive layers are made of silicon dioxide and are applied/deposited on top of a conductive region/layer, such as copper, aluminum, or other metals.
  • a conductive region/layer such as copper, aluminum, or other metals.
  • non- conductive layers are implemented in a system-on-a-chip module to separate different layers of the module.
  • the non- conductive layers may also improve the reliability of the module (or the semiconductor device) by protecting components from moisture, dust, and other contaminants.
  • aspects of the disclosure relate to semiconductor devices. More specifically, but not exclusively, aspects of the disclosure, according to some embodiments thereof, relate to methods for forming a semiconductor device having a non-conductive polymer layer with a controlled coefficient of thermal expansion (CTE).
  • CTE controlled coefficient of thermal expansion
  • the disclosed method enables selecting a desired CTE value of the non- conductive layer, controlling and tailoring the desired CTE according to a design and requirements of the semiconductor device or components/elements thereof.
  • the disclosed method enables obtaining a matching CTE value to various materials of semiconductor devices and components/elements thereof (e.g., integrated circuits, printed circuit boards, and the like), such as but not limited to, Si, semiconductors made of or comprising III-V compounds of the periodic table, semiconductors made of or comprising II-VI compounds, and the like, or any combination thereof. Consequently, in some embodiments, reducing thermal stress between components of the semiconductor device, facilitating signal integrity, performance, and thermal management, such as heat dissipation, thereof.
  • the disclosed method enables forming a semiconductor device (e.g., printed circuit board) having a wide variety of non-conductive (dielectric) layers having tailored/controlled values of CTE (such as but not limited to, descending/ascending CTE values thereof), thereby facilitating the performance, reliability and increasing the lifetime of the semiconductor device.
  • a semiconductor device e.g., printed circuit board
  • non-conductive (dielectric) layers having tailored/controlled values of CTE (such as but not limited to, descending/ascending CTE values thereof), thereby facilitating the performance, reliability and increasing the lifetime of the semiconductor device.
  • a method for forming a semiconductor device comprising a non-conductive polymer layer with a desired coefficient of thermal expansion (CTE)
  • the method including: selecting/obtaining a desired CTE value, formulating a suspension comprising a mixture of dielectric nanoparticles and a curable polymer, the curable polymer is made of or comprises a resin and a hardener, wherein the resin of the curable polymer has a positive CTE, and the dielectric nanoparticles have a different CTE than the resin, wherein the formulating comprises determining a weight ratio the curable polymers and the dielectric nanoparticles, applying the suspension on a surface of a substrate, and curing the suspension to form a non-conductive polymer layer with the desired CTE value.
  • CTE coefficient of thermal expansion
  • the dielectric nanoparticles have a negative CTE.
  • the CTE of the dielectric nanoparticles may be lower by at least one order of magnitude than the CTE of the resin.
  • the curing may include electron beam radiation.
  • the curing may include applying photon radiation.
  • the photon radiation may include UV radiation.
  • the photon radiation may include heating.
  • the resin of the curable polymer may be made of or include one or more of: an epoxy resin, a polyimide resin, benzocyclobutene (BCB).
  • the dielectric nanoparticles may include Kevlar nanoparticles.
  • the dielectric nanoparticles may include SiCh nanoparticles.
  • the dielectric nanoparticles may include a-ZrW20s nanoparticles.
  • the dielectric nanoparticles may include - ZrW20s nanoparticles.
  • the selecting/obtaining may include the desired CTE of about 17 ppm/°C, thereby matching a CTE of copper (Cu).
  • the selecting/obtaining may include the desired CTE of about 20 ppm/°C, thereby matching a CTE of silver (Ag).
  • the selecting/obtaining may include the desired CTE of about 23 ppm/°C, thereby matching a CTE of aluminum (Al).
  • the selecting/obtaining may include the desired CTE of about 3.5 ppm/°C, thereby matching a CTE of silicon (Si).
  • the selecting/obtaining may include the desired CTE of about 7.2 ppm/°C, thereby matching a CTE of gallium arsenide (GaAs).
  • GaAs gallium arsenide
  • the selecting/obtaining may include the desired CTE of about 8 ppm/°C, thereby matching a CTE of indium phosphide (InP).
  • the selecting/obtaining may include the desired CTE of about 5 ppm/°C, thereby matching a CTE of any one of: aluminum nitride (AIN), gallium nitride (GaN), 3C, 4H and/or 6H silicon carbide (SiC).
  • the method may further include removing an excess portion of the non-conductive polymer layer.
  • the method may further include planarizing the non- conductive polymer layer.
  • a semiconductor or a component thereof including a dielectric layer having a controlled coefficient of thermal expansion (CTE), the dielectric layer including a mixture of dielectric nanoparticles and a curable polymer, the curable polymer including a resin and a hardener; wherein the resin of the curable polymer has a positive CTE; and wherein the dielectric nanoparticles have a different CTE than the resin.
  • CTE controlled coefficient of thermal expansion
  • the dielectric nanoparticles of the semiconductor device or component thereof may include Kevlar nanoparticles.
  • the dielectric nanoparticles of the semiconductor device or component thereof may include SiCh nanoparticles.
  • the dielectric nanoparticles of the semiconductor device or component thereof may include a-ZrW20s nanoparticles.
  • the dielectric nanoparticles of the semiconductor device or component thereof may include P-ZrW2Os nanoparticles.
  • Figure 1 schematically illustrates an example of a method for manufacturing a semiconductor device comprising a non-conductive polymer layer with a desired coefficient of thermal expansion (CTE), according to some embodiments.
  • CTE coefficient of thermal expansion
  • the words “include” and “have”, and forms thereof, are not limited to members in a list with which the words may be associated.
  • the term “about” may be used to specify a value of a quantity or parameter (e.g. the length of an element) to within a continuous range of values in the neighborhood of (and including) a given (stated) value. According to some embodiments, “about” may specify the value of a parameter to be between 80 % and 120 % of the given value. For example, the statement “the length of the element is equal to about 1 m” is equivalent to the statement “the length of the element is between 0.8 m and 1.2 m”. According to some embodiments, “about” may specify the value of a parameter to be between 90 % and 110 % of the given value. According to some embodiments, “about” may specify the value of a parameter to be between 95 % and 105 % of the given value. As used herein, according to some embodiments, the terms “substantially” and “about may be interchangeable.
  • the term “electronic device” may refer to any device including electronic components therein, such as, but not limited to, a wearable device (e.g., a smart watch, a fitness tracker, and the like), a mobile phone (e.g., a smartphone), a tablet, a computer (e.g., a laptop), a camera, a screen (e.g., a touch screen), a television, a robot (e.g., a robotic arm, and the like), a memory device, a power storage device, a light-emitting device, and the like.
  • the electronic device may be portable.
  • the electronic device may refer to a non-mobile device.
  • the electronic device may refer to a household appliance, an industrial appliance/system, a car, and the like. Each possibility is a separate embodiment.
  • the terms “electronic device” and “semiconductor device” may be interchangeably.
  • the semiconductor device may include semiconductor dies, chips, integrated circuits, modules (such as but not limited to, system on a chip, system in a package, package on a package, system/computer on a module, and the like), core components (e.g., processor cores), communication interfaces, memory blocks, and the like, or any combination thereof.
  • modules such as but not limited to, system on a chip, system in a package, package on a package, system/computer on a module, and the like
  • core components e.g., processor cores
  • communication interfaces e.g., communication interfaces, memory blocks, and the like, or any combination thereof.
  • the term “component of a semiconductor device” may refer to any section, portion, or an element of the semiconductor device having or being connected/attached to an insulating/dielectric material.
  • the term “component of a semiconductor device” refer to, among others, a die (e.g., transistor or portions thereof), a chip, a chip carrier, a passive component, an active component, an interconnecting section/component (e.g., interposer, contact pads, lines, traces, vias, and the like), an interface, a module (e.g., chip module), a semiconductor package or components thereof, a substrate, and the like, or any combination thereof.
  • a die e.g., transistor or portions thereof
  • a chip e.g., a chip carrier
  • a passive component e.g., an active component
  • an interconnecting section/component e.g., interposer, contact pads, lines, traces, vias, and the like
  • an interface e.g.,
  • the term “component of a semiconductor device” may refer to an interposer. According to some embodiments, the term “component of a semiconductor device” may refer to any portion/ component of a printed circuit board. According to some embodiments, the term “component of a semiconductor device” may refer to any portion/component/element of an integrated circuit. Each possibility is a separate embodiment. According to some embodiments, the term “component of a semiconductor device” may refer to any portion/component of an RF circuit.
  • a method for forming a non- conductive polymer layer with a controlled coefficient of thermal expansion including: selecting/obtaining a desired CTE value, formulating a suspension including a mixture of dielectric nanoparticles and a curable polymer, the curable polymer is made of or includes a resin and a hardener, wherein the resin of the curable polymer has a positive CTE, and the dielectric nanoparticles have a different CTE than the resin, wherein the formulating comprises determining a weight ratio between the curable polymers and the dielectric nanoparticles, applying the suspension on a surface of a substrate, and curing the suspension to form a non-conductive polymer layer with the desired CTE value.
  • CTE controlled coefficient of thermal expansion
  • size (e.g., diameter, longest cross-sectional dimension, or any other dimension) of the dielectric nanoparticles may be about 250 nm or less. According to some embodiment, size of the dielectric nanoparticles may be in a range of about 100 nm to about 250 nm, about 150 nm to about 250 nm, about 5 nm to about 200 nm, about 5 nm to about 250 nm, about 20 nm to about 200 nm, about 5 nm to about 100 nm, about 5 nm to about 150 nm. Each possibility is a separate embodiment.
  • size of the dielectric nanoparticles may be about 250 nm or less, about 200 nm or less, about 150 nm or less, about 100 nm or less, about 50 nm or less. Each possibility is a separate embodiment.
  • the disclosed method advantageously enables obtaining a matching CTE value to various materials of integrated circuits, such as but not limited to, Si, semiconductors made of or comprising III-V compounds of the periodic table (e.g., GaAs, GaSb, GaN, AIN, InP, and the like), SiC (e.g., 3C SiC, 4H SiC, 6H SiC), and the like, or any combination thereof.
  • the III-V compounds may include, among others, binary, ternary, and/or quatemity compounds, wherein at least one element is from main group III and at least one element from main group V of the periodic table.
  • the disclosed method advantageously enables obtaining a matching CTE value to semiconductors made of or comprising II-VI compounds of the periodic table. Each possibility is a separate embodiment.
  • the disclosed method enables obtaining a matching CTE to various materials of integrated circuits, such as but not limited to, copper (Cu), silver (Ag), aluminium (Al), and the like, or any combination thereof. Each possibility is a separate embodiment.
  • the disclosed method enables tailoring the CTE of the non-conductive polymer layer, thereby facilitating thermal properties/thermal management (such as but not limited to heat dissipation) of the semiconductor device.
  • matching the CTE in integrated circuits facilitates minimizing/preventing thermal stress between one or more electronic components or elements thereof in an electronic device, thereby minimizing/preventing cracking, warpage, and/or undesired deformation and/or defects (e.g., bending, twisting, and the like) of electronic components/elements of the electronic device, thereby enhancing the performance, the yield and the reliability of the electronic device.
  • thermal stress between one or more electronic components or elements thereof in an electronic device, thereby minimizing/preventing cracking, warpage, and/or undesired deformation and/or defects (e.g., bending, twisting, and the like) of electronic components/elements of the electronic device, thereby enhancing the performance, the yield and the reliability of the electronic device.
  • tailoring the CTE enables incorporating various materials in an electronic device obtaining matching CTEs with various components thereof, thereby enhancing the performance and the yield of the electronic device.
  • incorporating various materials may include incorporating various types of chips, such as different generations, materials, and the like, in an integrated circuit and/or in a semiconductor/electronic device.
  • adjusting/tailoring the CTE of the non- conductive polymer layer facilitates the thermal management (i.e., facilitates heat dissipation) of the electronic device.
  • adjusting/tailoring the CTE of the non- conductive polymer layer minimizes thermal stress between one or more components (such as, but not limited to, dies, chips, integrated circuits, passive/active components, traces, contact pads, and the like or any elements thereof) of the electronic device. According to some embodiments, this may improve the performance, signal integrity and durability of the electronic device. In some embodiments, adjusting/tailoring the CTE of the non-conductive layer may be particularly important in RF circuits, such as but not limited to, printed RF circuits (e.g., operating/supporting frequency range of about 100 MHz to about 300 GHz), and the like, to facilitate RF signal propagation and signal integrity thereof.
  • RF circuits such as but not limited to, printed RF circuits (e.g., operating/supporting frequency range of about 100 MHz to about 300 GHz), and the like, to facilitate RF signal propagation and signal integrity thereof.
  • a method for forming a non- conductive polymer layer with a controlled/adjustable coefficient of thermal expansion including: selecting/obtaining a desired CTE value, formulating a suspension including a mixture of dielectric nanoparticles and a curable polymer, wherein the dielectric nanoparticles include Kevlar nanoparticles, and the curable polymer is made of or includes a resin and a hardener, wherein the resin of the curable polymer has a positive CTE, and the dielectric nanoparticles have a different CTE than the resin, wherein the formulating comprises determining a weight ratio between the curable polymers and the dielectric nanoparticles, applying the suspension on a surface of a substrate, and curing the suspension to form a non-conductive polymer layer with the desired CTE value.
  • CTE controlled/adjustable coefficient of thermal expansion
  • a method for forming a non- conductive polymer layer with a controlled/adjustable coefficient of thermal expansion including: selecting/obtaining a desired CTE value, formulating a suspension including a mixture of dielectric nanoparticles and a curable polymer, wherein the dielectric nanoparticles include a-ZrWiOx nanoparticles, and the curable polymer is made of or includes a resin and a hardener, wherein the resin of the curable polymer has a positive CTE, and the dielectric nanoparticles have a different CTE than the resin, wherein the formulating comprises determining a weight ratio between the curable polymers and the dielectric nanoparticles, applying the suspension on a surface of a substrate, and curing the suspension to form a non-conductive polymer layer with the desired CTE value.
  • CTE controlled/adjustable coefficient of thermal expansion
  • a method for forming a non- conductive polymer layer with a controlled/adjustable thermal expansion coefficient including: selecting/obtaining a desired CTE value, formulating a suspension including a mixture of dielectric nanoparticles and a curable polymer, wherein the dielectric nanoparticles include P-ZrW2Os nanoparticles, and the curable polymer is made of or includes a resin and a hardener, wherein the resin of the curable polymer has a positive CTE, and the dielectric nanoparticles have a different CTE than the resin, wherein the formulating comprises determining a weight ratio between the curable polymers and the dielectric nanoparticles, applying the suspension on a surface of a substrate, and curing the suspension to form a non-conductive polymer layer with the desired CTE value.
  • CTE controlled/adjustable thermal expansion coefficient
  • a method for forming a non- conductive polymer layer with a controlled/adjustable thermal expansion coefficient including: selecting/obtaining a desired CTE value, formulating a suspension including a mixture of dielectric nanoparticles and a curable polymer, wherein the dielectric nanoparticles include SiCh nanoparticles, and the curable polymer is made of or includes a resin and a hardener, wherein the resin of the curable polymer has a positive CTE, and the dielectric nanoparticles have a different CTE than the resin, wherein the formulating comprises determining a weight ratio between the curable polymers and the dielectric nanoparticles, applying the suspension on a surface of a substrate, and curing the suspension to form a non-conductive polymer layer with the desired CTE value.
  • CTE controlled/adjustable thermal expansion coefficient
  • Fig. 1 schematically illustrates a flowchart 100 of a method for manufacturing a semiconductor device comprising a non-conductive polymer layer with a desired coefficient of thermal expansion (CTE), according to some embodiments.
  • CTE coefficient of thermal expansion
  • the method may include selecting/obtaining a desired value of the CTE of a non-conductive polymer layer.
  • selecting/obtaining the desired CTE value may be based, at least in part of, among others, on materials incorporated/included in an electronic device or components thereof (such as but not limited to, materials forming an integrated circuit, electronic elements, die/chip, chip module, and the like, or any combination thereof).
  • selecting/obtaining the CTE value may be based, among others, the desired properties of the electronic device.
  • the desired properties of the electronic device may include, among others, power consumption, yield, speed, heat dissipation requirements, and the like, or any combination thereof. Each possibility is a separate embodiment.
  • the desired CTE value may be configured to match to various materials of integrated circuits, such as but not limited to, Si, III-V compounds of the periodic table (e.g., GaAs, GaSb, GaN, AIN, InP, and the like), SiC (e.g., (e.g., 3C SiC, 4H SiC, 6H SiC), and the like, or any combination thereof.
  • Si Si
  • III-V compounds of the periodic table e.g., GaAs, GaSb, GaN, AIN, InP, and the like
  • SiC e.g., (e.g., 3C SiC, 4H SiC, 6H SiC
  • the desired CTE value may match to a CTE of various materials of integrated circuits, such as but not limited to, copper (Cu), silver (Ag), aluminium (Al), and the like, or any combination thereof.
  • Cu copper
  • silver Ag
  • Al aluminium
  • the desired CTE value may be configured to match to various materials of integrated
  • the desired CTE value of the polymer layer may be in a range of about 1-30 ppm/°C, about 3-30 ppm/°C, about 10-30 ppm/°C, about 15-30 ppm/°C, about 1-25 ppm/°C, about 15-25 ppm/°C, about 1-15 ppm/°C, about 1-20 ppm/°C, about 1-10 ppm/°C, about 2-10 ppm/°C, about 2-25 ppm/°C, about 2-8 ppm/°C, or any other desired/required value.
  • Each possibility is a separate embodiment.
  • the desired CTE value of the polymer layer may be about 3 ppm/°C, about 4 ppm/°C, about 5 ppm/°C, about 3-6 ppm/°C, about 7-8 ppm/°C, about 17 ppm/°C, about 20 ppm/°C, about 23 ppm/°C, and the like. Each possibility is a separate embodiment.
  • the desired CTE value of the polymer layer may be about 17 ppm/°C, thereby matching a CTE of copper (Cu). According to some embodiments, the desired CTE value of the polymer layer may be about 20 ppm/°C, thereby matching a CTE of silver (Ag). According to some embodiments, the desired CTE value of the polymer layer may be about 23 ppm/°C, thereby matching a CTE of aluminium (Al). According to some embodiments, the desired CTE value of the polymer layer may be about 3.5 ppm/°C, thereby matching a CTE of silicon (Si).
  • the desired CTE value of the polymer layer may be about about 7.2 ppm/°C, thereby matching a CTE of gallium arsenide (GaAs).
  • the desired CTE value of the polymer layer may be about 8 ppm/°C, thereby matching a CTE of indium phosphide (InP).
  • the desired CTE value of the polymer layer may be about 5 ppm/°C, thereby matching a CTE of any one of: aluminum nitride (AIN), gallium nitride (GaN), 3C, 4H and/or 6H silicon carbide (SiC). Each possibility is a separate embodiment.
  • the method may include formulating a suspension (e.g., a suspension 140, as depicted in Fig. 1).
  • the suspension includes a mixture of dielectric nanoparticles 138 and a curable polymer.
  • the curable polymer may be made of or include a resin and a hardener.
  • the formulating includes determining a ratio between the curable polymer and the dielectric nanoparticles 138.
  • the ratio may be, among others, a mole ratio.
  • the ratio may be, among others, a weight ratio.
  • the ratio may be, among others, an atomic ratio. Each possibility is a separate embodiment.
  • the ratio between the curable polymer and the dielectric nanoparticles 138 may include any value in a range of about 5% to about 95% of the curable polymer.
  • the range may include, among others, about 5% to about 20%, about 5% to about 50%, about 20% to about 80%, about 5% to about 90%, about 30% to about 50% of the curable polymer. Each possibility is a separate embodiment.
  • the ratio between the curable polymer and dielectric nanoparticles 138 may be about 60% to about 80% of the curable polymer and about 40% to about 20%, respectively, of dielectric nanoparticles 138. According to some embodiments, the ratio between the curable polymer and dielectric nanoparticles 138 may be about 5% to about 10% of the curable polymer and about 95% to about 90%, respectively, of dielectric nanoparticles 138. Each possibility is a separate embodiment.
  • the ratio between the curable polymer and dielectric nanoparticles 138 may be about 1:30, about 1 :25, about 1 :20, about 1: 10, about 1:9, about 1:8, about 1:7, about 1:6, about 1:5, about 1:4, about 1:3, about 1:2, about 3:7, about 2:3, about 1: 1, and any reciprocal ratio thereof.
  • Each possibility is a separate embodiment.
  • dielectric nanoparticles 138 may have a positive CTE. According to some embodiments, dielectric nanoparticles 138 may have a negative CTE. Each possibility is a separate embodiment.
  • the resin of the curable polymer may have a positive CTE, while the dielectric nanoparticles have a different CTE than the resin.
  • the CTE of dielectric nanoparticles 138 may be lower than the CTE of the resin. According to some embodiments, the CTE of dielectric nanoparticles 138 may be lower than the CTE of the resin by about: at least one order of magnitude, at least two orders of magnitude, at least three orders of magnitude, at least four orders of magnitude, at least five orders of magnitude, or more. Each possibility is a separate embodiment. According to some embodiments, the CTE of dielectric nanoparticles 138 may be lower than the CTE of the resin by about one order of magnitude to about four orders of magnitude. According to some embodiments, the CTE of dielectric nanoparticles 138 may be lower than the CTE of the resin by about one order of magnitude to about three orders of magnitude. According to some embodiments, the CTE of dielectric nanoparticles 138 may be lower than the CTE of the resin by about one order of magnitude to about two orders of magnitude. Each possibility is a separate embodiment.
  • dielectric nanoparticles 138 may be made of or include Kevlar nanoparticles. According to some embodiments, the dielectric nanoparticles may be made of or include SiCh nanoparticles. According to some embodiments, the dielectric nanoparticles may be made of or include a-ZrW2Ch nanoparticles.
  • dielectric nanoparticles 138 may be made of or include P-ZrW2C>8 nanoparticles. According to some embodiments, dielectric nanoparticles 138 may be made of or include one or more of: Kevlar, SiCh, a-ZrWhCh. P-ZrW2Os nanoparticles. Each possibility is a separate embodiment.
  • the resin of the curable polymer may be made of or include an epoxy resin. According to some embodiments, the resin of the curable polymer may be made of or include a polyimide resin. According to some embodiments, the resin of the curable polymer may be made of or include benzocyclobutene (BCB). Each possibility is a separate embodiment.
  • the resin of the curable polymer may be made of or include one or more of: an epoxy resin, a polyimide resin, (BCB). Each possibility is a separate embodiment.
  • the method may include applying suspension 140 on a semiconductor device or a portion/component thereof.
  • suspension 140 may be applied, among others, on a substrate, conductive portions/elements such as traces, pads, and the like, or any other passive/active components, dies, and the like, or any combination thereof.
  • the method may include applying suspension 140 on a substrate 130.
  • substrate 130 may be an inert substrate.
  • substrate 130 may be made of or include, among others, glass (e.g., coated glass, uncoated glass, and the like), Si, ceramic materials, polymers, stainless steels, and the like, or any combination thereof. Each possibility is a separate embodiment.
  • substrate 130 may be rigid. As a non-limiting example, wherein substrate 130 is rigid, a Shore hardness thereof may be in a range of about 85D- 96D. According to some embodiments, substrate 130 may be flexible/bendable. As anon- limiting example, wherein substrate 130 is flexible/bendable, a Shore hardness thereof may be in a range of about 45D-70D. According to some embodiments, substrate 130 may be semi-rigid (e.g., of a combined hardness of the rigid and the flexible substrates). Each possibility is a separate embodiment.
  • substrate 130 may be a temporary substrate (i.e., removable/detachable substrate). Alternatively, in some embodiments, substrate 130 may be a non-temporary substrate. According to some embodiments, substrate 130 may optionally be a coated substrate. According to some embodiments, a coating of substrate 130 may facilitate adhesion of conductive lines. According to some embodiments, coating 132 of substrate 130 may be made of or include, among others, a seed layer of TiW and Cu. According to some embodiments, coating 132 may include an adhesive. As a non-limiting example, the adhesive may include a permanent adhesive fdm/layer. According to some embodiments, coating 132 may include a die attach film. According to some embodiments, coating 132 may include athermal interface material.
  • substrate 130 may be uncoated. Put differently, in some embodiments, substrate 130 may be devoid of coating 132.
  • substrate 130 may optionally include one or more electrically conductive lines/pads 134.
  • one or more electrically conductive lines/pads 134 are configured to electrically interconnect an integrated circuit (e.g., analog integrated circuits, RF integrated circuits, and the like) to external components, input/output devices, thereby allowing signals transmission between electronic components.
  • electrically conductive lines/pads 134 may be configured to enable signals transmission between dies, chips, passive or active components such as inductors and/or capacitors, processors, and the like, or any combination thereof.
  • substrate 130 may be made of or include a system in a package module (or a section/component thereof), and suspension 140 may be applied during one or more steps of a manufacturing process thereof.
  • suspension 140 may be applied on at least a section of substrate 130, wherein substrate 130 includes an interconnecting structure, such as an interposer. It may be understood by skilled in the art that the suspension may be applied at any step of manufacturing of the electronic device (e.g., any step requiring forming a dielectric region/layer during the electronic device manufacturing process).
  • applying suspension 140 may include pouring suspension 140 (e.g., on an electronic device or a section thereof, on a temporary carrier, a substrate, and the like) during the manufacturing process.
  • applying suspension 140 may optionally include using a spin coater or any other tool/device, to facilitate forming a substantially uniform layer of suspension 140 on substrate 130.
  • the method may include curing suspension 142, thereby obtaining a first non-conductive (dielectric) polymer layer 142.
  • the method may include thermally treating suspension 142, thereby obtaining a first non-conductive (dielectric) polymer layer 142.
  • the method may include polymerizing suspension 142, thereby obtaining a first non-conductive (dielectric) polymer layer 142.
  • curing suspension 142 may include, among others, one or more of: applying electron beam radiation, photon radiation (such as but not limited to ultraviolet (UV) radiation, heating/thermal radiation, and the like) of suspension 142. Each possibility is a separate embodiment.
  • photon radiation such as but not limited to ultraviolet (UV) radiation, heating/thermal radiation, and the like
  • heating of suspension 142 may be performed, among others, at any temperature in a range of about 100°C to about 300°C, about 100°C to about 200°C, about 150°C to about 300°C, about 200°C to about 300°C, about 150°C to about 250°C.
  • heating of suspension 142 may be performed, among others, for about 3 minutes to about 3 hours, about 3 minutes to about 1 hour, about 5 minutes to about 2 hours, about 3 minutes to about 30 minutes, about 3 minutes to about 10 minutes, about 1 hour to about 3 hours, about 30 minutes to about 1.5 hours, about 20 minutes to about 1 hour, about 2 hours to about 3 hours.
  • heating of suspension 142 may be performed, among others, for about 3 minutes to about 3 hours, about 3 minutes to about 1 hour, about 5 minutes to about 2 hours, about 3 minutes to about 30 minutes, about 3 minutes to about 10 minutes, about 1 hour to about 3 hours, about 30 minutes to about 1.5 hours, about 20 minutes to about 1 hour, about 2 hours to about 3 hours.
  • Each possibility is a separate embodiment.
  • curing suspension 142 may include, among others, heating suspension 142 at about 120°C for about 4 minutes. As another non-limiting example, curing suspension 142 may include, among others, heating suspension 142 at about 250°C for about 3 minutes.
  • the method may optionally include removing/scraping an excess portion of polymer layer 142.
  • removing/scraping off the excess portion of polymer layer 142 may include planarizing using a surface planer device/machine, such that a substantially flat surface of the first layer (and/or of each of additional one or more layers) of polymer layer 142 is formed.
  • the excess of polymer layer 142 may be removed until a portion one or more electrically conductive lines/pads 134 (e.g., surface or top layer thereof) is exposed, thereby allowing electrical conductivity while preventing short-circuits therebetween.
  • the method may include repeating at least a portion of the abovementioned steps to produce additional one or more layers of non-conductive (dielectric) polymer.
  • the steps may be repeated to produce a multi-layered structure of an electronic component.
  • at least a portion of the abovementioned steps may be repeated until the required number of a plurality of non- conductive (i.e., insulating) layers is obtained (e.g., until the required height/depth of the polymer layers is achieved).
  • each of the one or more non-conductive (dielectric) polymer layers may have a substantially same CTE value. According to some embodiments, at least a portion of the one or more non-conductive (dielectric) polymer layers of have a different CTE value. As a non-limiting example, each of the one or more non-conductive (dielectric) polymer layers may have ascending, descending or alternating CTE values. Each possibility is a separate embodiment.
  • the repeating may optionally include aligning non- conductive regions of a previous/bottom layer of the plurality of non-conductive layers with an additional layer of the plurality of non-conductive layers.
  • the method may provide an “on-the-fly” formation of a plurality of non-conductive regions (formed by polymer 142) between electrically conductive material (e.g., as depicted in Fig. 1).
  • the method enables forming the plurality of non- conductive regions according to a predefined pattern (e.g., present on substrate 130).
  • a predefined pattern e.g., present on substrate 130.
  • a wide range of complex and/or high-density patterns of the non-conductive regions may be obtained, thereby allowing, for example, achieving a wide variety of signal routing.
  • stages of methods may be described in a specific sequence, the methods of the disclosure may include some or all of the described stages carried out in a different order.
  • the order of stages and sub-stages of any of the described methods may be reordered unless the context clearly dictates otherwise, for example, when a latter stage requires as input an output of a former stage or when a latter stage requires a product of a former stage.
  • a method of the disclosure may include a few of the stages described or all of the stages described. No particular stage in a disclosed method is to be considered an essential stage of that method, unless explicitly specified as such.
  • a semiconductor device or a component thereof including a dielectric layer having a controlled coefficient of thermal expansion (CTE), the dielectric layer including a mixture of dielectric nanoparticles and a curable polymer, the curable polymer including a resin and a hardener; wherein the resin of the curable polymer has a positive CTE; and wherein the dielectric nanoparticles have a different CTE than the resin.
  • CTE controlled coefficient of thermal expansion
  • the semiconductor device or the component thereof may include, among others, an integrated circuit, an interposer, a die/chip, an interface, a printed circuit board, and the like or any combination thereof. Each possibility is a separate embodiment.
  • the semiconductor device or the component thereof may include, among others, a multi-layered structure, a patterned structure, and the like, or a combination thereof.
  • the dielectric nanoparticles of the semiconductor device or component thereof may include one or more of: Kevlar nanoparticles, SiCh nanoparticles, a-ZrW20s nanoparticles, P- ZrW20s nanoparticles. Each possibility is a separate embodiment.
  • the dielectric layer of the semiconductor device may be manufactured by “in-the-fly” formation, e.g., as described in greater detail in Fig. 1.

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  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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Abstract

L'invention concerne un procédé de formation d'un dispositif à semi-conducteur comprenant une couche polymère non conductrice ayant un coefficient de dilatation thermique souhaité (CTE). Ledit procédé comprend : la sélection/l'obtention d'une valeur de CTE souhaitée; et la formulation d'une suspension comprenant un mélange de nanoparticules diélectriques et d'un polymère durcissable. Le polymère durcissable est constitué ou comprend une résine et un durcisseur et la résine du polymère durcissable présente un CTE positif, et les nanoparticules diélectriques présentent un CTE différent de celui de la résine. La formulation comprend la détermination d'un rapport en poids des polymères durcissables et des nanoparticules diélectriques, l'application de la suspension sur une surface d'un substrat, et le durcissement de la suspension pour former une couche polymère non conductrice avec la valeur de CTE souhaitée.
PCT/IL2024/050386 2023-05-04 2024-04-18 Procédé de formation de couches polymères non conductrices avec un coefficient contrôlé de dilatation thermique Pending WO2024228184A1 (fr)

Priority Applications (2)

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CN202480039343.0A CN121400152A (zh) 2023-05-04 2024-04-18 形成具有受控热膨胀系数的非导电聚合物层的方法
IL324281A IL324281A (en) 2023-05-04 2025-10-27 Method for creating non-conductive polymer layers with a controlled coefficient of thermal expansion

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US202363463988P 2023-05-04 2023-05-04
US63/463,988 2023-05-04

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013012587A2 (fr) * 2011-07-15 2013-01-24 3M Innovative Properties Company Composition de résine pour boîtier de semi-conducteur et procédé pour l'utiliser
EP2032634B1 (fr) * 2006-06-26 2015-05-13 General Electric Company Films coulés à l'aide d'un solvant polyimide et présentant un coefficient de dilatation thermique bas, et leur procédé de fabrication
JP2016065214A (ja) * 2014-09-23 2016-04-28 ザ・ボーイング・カンパニーＴｈｅ Ｂｏｅｉｎｇ Ｃｏｍｐａｎｙ 樹脂改質分野における高分子ナノ粒子の添加

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2032634B1 (fr) * 2006-06-26 2015-05-13 General Electric Company Films coulés à l'aide d'un solvant polyimide et présentant un coefficient de dilatation thermique bas, et leur procédé de fabrication
WO2013012587A2 (fr) * 2011-07-15 2013-01-24 3M Innovative Properties Company Composition de résine pour boîtier de semi-conducteur et procédé pour l'utiliser
JP2016065214A (ja) * 2014-09-23 2016-04-28 ザ・ボーイング・カンパニーＴｈｅ Ｂｏｅｉｎｇ Ｃｏｍｐａｎｙ 樹脂改質分野における高分子ナノ粒子の添加

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