WO2024008352A1 - Optische baugruppe, projektionsbelichtungsanlage für die halbleiterlithographie und verfahren - Google Patents
Optische baugruppe, projektionsbelichtungsanlage für die halbleiterlithographie und verfahren Download PDFInfo
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- WO2024008352A1 WO2024008352A1 PCT/EP2023/062473 EP2023062473W WO2024008352A1 WO 2024008352 A1 WO2024008352 A1 WO 2024008352A1 EP 2023062473 W EP2023062473 W EP 2023062473W WO 2024008352 A1 WO2024008352 A1 WO 2024008352A1
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- base body
- optical assembly
- actuators
- back plate
- optical
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0825—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a flexible sheet or membrane, e.g. for varying the focus
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/08—Mirrors
- G02B5/10—Mirrors with curved faces
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
- G02B7/181—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
- G03F7/70266—Adaptive optics, e.g. deformable optical elements for wavefront control, e.g. for aberration adjustment or correction
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70316—Details of optical elements, e.g. of Bragg reflectors, extreme ultraviolet [EUV] multilayer or bilayer mirrors or diffractive optical elements
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
- G03F7/70891—Temperature
Definitions
- the invention relates to an optical assembly, a projection exposure system for semiconductor lithography and a method for producing an optical assembly.
- microscopically small structures are imaged onto a wafer coated with photoresist using photolithographic processes, starting from a mask as a template.
- desired structures such as memory or logic elements are created on the wafer, which is then divided into individual chips for use in electronic devices.
- optical elements used Due to the extremely small structures that need to be created, down to the nanometer range, extreme demands are placed on the optics of the projection exposure systems and thus on the optical elements used.
- imaging errors regularly occur during the operation of a corresponding system, which often result from changing environmental conditions such as temperature changes in the optics.
- the optical elements used such as lenses or mirrors, are designed to be movable or deformable in order to be able to correct the aforementioned imaging errors during operation of the system.
- mechanical actuators are generally used, which can, for example, be suitable for specifically deforming the surface of an optical element that is used for imaging, i.e. the so-called optical effective surface.
- This deformation can come from the back of a base body using the corresponding optical element.
- the mechanical action of the actuators is typically made possible by the actuators being mechanically supported on a back plate in the rear area of the base body.
- This back plate, and in particular its mounting, in turn causes parasitic deformations when the optical element is actuated.
- the resulting requirements for the manufacturing and assembly tolerances of the actuators and the back plate can only be met with a very high level of effort.
- the object of the present invention is to provide an optical assembly and a projection exposure system in which disadvantageous effects resulting from back plates connected to actuators are reduced compared to the prior art.
- a further object of the invention is to provide a method for producing such an assembly.
- An optical assembly according to the invention comprises an optical element, wherein the optical element comprises a base body, and at least one actuator for deforming the base body is arranged on the back of the base body.
- the at least two actuators are connected to the back of the base body at a first connecting surface and to a back plate at a second connecting surface, the back plate being supported exclusively via the actuators.
- the backplate's only connection to the "solid world” is the at least two actuators, or typically a plurality of actuators.
- the actuators can in particular be solid-state actuators such as piezo actuators or magnetostrictive, electrostrictive or thermal actuators.
- a homogeneous, for example thermally induced, expansion of all solid-state actuators perpendicular to a connecting surface only leads to a displacement of the back plate and has no effect the shape and position of the optical effective surface.
- actuator creep often occurs, ie the actuators are not immediately stable after switching on, but rather move towards the desired state.
- the actuators typically behave similarly, the free back plate largely compensates for this effect and does not produce any undesirable deformation.
- a joining material is any material that creates the joint between the actuator and the adjacent component (here base body and back plate). Examples of this are adhesives, glass frit, solders, welding filler materials, reactive layers from reactive bonding, etc.
- a particularly preferred embodiment there is at least one decoupling element for lateral decoupling between the actuator and at least the base body and / or the back plate arranged.
- This lateral decoupling also makes it possible to compensate for thermal expansion of the joining material in the transverse direction as well as moisture-induced geometry changes in these directions; The same applies to pressure-induced volume changes.
- the back of the base body has at least one flat partial area.
- the flat joints created in this way enable the use of simple manufacturing processes with good roughness and very good shape tolerance or flatness.
- grinding, lapping and plan honing as well as plan polishing should be mentioned here. This means that joining driving applications that only allow the compensation of small mechanical tolerances. This includes in particular the joining processes already mentioned above.
- the base body can have a thickness that changes over its lateral course. For example, due to space requirements, it may be necessary to make the base body locally thinner. In this case, it may be necessary to adapt the respective actuators and/or the design of the back plate accordingly.
- the back plate can have a thickness that changes over its lateral course.
- the back plate can have an increased thickness in its areas near the edge compared to the inner areas in order to compensate for the loss of rigidity of the back plate caused by the proximity to the edge.
- the back plate and/or the base body has recesses in which actuators are at least partially arranged.
- the back of the base body has several flat partial areas which do not run parallel to one another. This can ensure that the overall thickness of the base body changes to a limited extent, so that its mechanical properties also move within a manageable range over its extent.
- the surface of the back plate facing the base body and the surface facing away from the base body each extend at a constant distance from the back of the base body.
- a back plate with a constant thickness can be created.
- the optical element is spherical Mirror is formed with a base body of constant thickness.
- the backplate would essentially be a similar representation of the base body.
- the present invention particularly includes cases in which the effective direction of at least one of the actuators is designed to be normal to the connecting surface of the actuator with the base body. However, it can also be used in situations in which the effective direction of at least one of the actuators is designed to be normal to the optical effective surface.
- the base body is not designed with a uniform thickness
- the actuators used can be adapted to the mechanical conditions of the base body at the respective position with regard to, for example, their inherent rigidity, their travel path or the maximum force they can apply.
- the optical element can be a mirror, in particular a multilayer mirror.
- the mirror can also be a concave mirror with a radius of curvature of 180mm-260mm, in particular in the range of 220mm.
- Such mirrors are used in particular in DUV projection exposure systems to fold the beam path.
- the back plate has a lower rigidity than the base body and can, for example, be provided with at least one sensor.
- the sensor can be a strain or a temperature sensor.
- the back plate can have a lower rigidity than the base body, it can be achieved that when the actuator system is controlled to achieve a desired deformation of the optical effective surface, a higher deformation of the back plate compared to the deformation of the effective surface sets. This higher deformation has a particularly positive effect on the signal-to-noise ratio of a strain measurement of the back plate, for example using fiber Bragg grating sensors. If the mechanical properties of the actuators, base body and back plate are known, a corresponding deformation of the optical effective surface can then be inferred based on a model from a local deformation of the back plate.
- the properties can be selected so that a defined temperature profile (e.g. the main thermal mode of the system) does not lead to a parasitic deformation or displacement of the optical effective surface.
- a parasitic deformation can arise, for example, from the fact that heating of the actuators influences their efficiency, i.e. their respective mechanical response to a changing control voltage.
- parasitic deformations can be caused simply due to the usual thermal expansion or contraction of the materials involved. It is possible to achieve at least partial mutual compensation of the effects mentioned through a suitable choice of the material used and/or design of the respective geometry.
- the invention is particularly suitable for use in a projection exposure system for semiconductor lithography.
- a method according to the invention for producing a corresponding optical assembly comprises the following process steps:
- the optical effective surface can be processed after the actuator has been installed.
- the method can be implemented particularly advantageously if several actuators are arranged on the back plate, the connecting surfaces of which can be processed together.
- FIG. 1 shows a schematic meridional section of a projection exposure system for EUV projection lithography
- FIG. 2 shows a schematic meridional section of a projection exposure system for DUV projection lithography
- Figure 3 is a schematic representation of a first embodiment of the invention
- FIG. 4 shows a further embodiment of the invention
- FIG. 5 shows a further embodiment of the invention
- FIG. 6 shows a further embodiment of the invention
- FIGS 7a, b show a further embodiment of the invention
- FIGS. 8a-c show a detailed representation of further embodiments of the invention.
- Figure 9 shows a schematic representation of possible decoupling elements
- Figure 10 shows a variant of the design of the back plate
- Figure 11 shows a flowchart for a manufacturing method according to the invention.
- a lighting system 2 of the projection exposure system 1 has, in addition to a radiation source 3, lighting optics 4 for illuminating an object field 5 in an object plane 6.
- the light source 3 can also be provided as a module separate from the other lighting system. In this case, the lighting system does not include the light source 3.
- a reticle 7 arranged in the object field 5 is illuminated.
- the reticle 7 is held by a reticle holder 8.
- the reticle holder 8 can be displaced in particular in a scanning direction via a reticle displacement drive 9.
- FIG. 1 A Cartesian xyz coordinate system is shown in FIG. 1 for explanation purposes.
- the x direction runs perpendicular to the drawing plane.
- the y-direction is horizontal and the z-direction is vertical.
- the scanning direction in FIG. 1 runs along the y-direction.
- the z direction runs perpendicular to the object plane 6.
- the projection exposure system 1 includes projection optics 10.
- the projection optics 10 is used to image the object field 5 into an image field 11 in an image plane 12.
- the image plane 12 runs parallel to the object plane 6. Alternatively, an angle other than 0 ° is also between the object plane 6 and the Image level 12 possible.
- a structure on the reticle 7 is imaged on a light-sensitive layer of a wafer 13 arranged in the area of the image field 11 in the image plane 12.
- the wafer 13 is held by a wafer holder 14.
- the wafer holder 14 can be displaced in particular along the y direction via a wafer displacement drive 15.
- the displacement, on the one hand, of the reticle 7 via the reticle displacement drive 9 and, on the other hand, of the wafer 13 via the wafer displacement drive 15 can take place in synchronization with one another.
- the radiation source 3 is an EUV radiation source.
- the radiation source 3 emits in particular EUV radiation 16, which is also referred to below as useful radiation, illumination radiation or illumination light.
- the useful radiation in particular has a wavelength in the range between 5 nm and 30 nm.
- the radiation source 3 can be a plasma source, for example an LPP source (Laser Produced Plasma) or a DPP source. Source (Gas Discharged Produced Plasma, plasma produced by gas discharge). It can also be a synchrotron-based radiation source.
- the radiation source 3 can be a free electron laser (FEL).
- the illumination radiation 16, which emanates from the radiation source 3, is focused by a collector 17.
- the collector 17 can be a collector with one or more ellipsoidal and/or hyperboloid reflection surfaces.
- the at least one reflection surface of the collector 17 can be in grazing incidence (Grazing Incidence, Gl), i.e. with angles of incidence greater than 45° compared to the normal direction of the mirror surface, or in normal incidence (Normal Incidence, NI), i.e. with angles of incidence smaller than 45°. with the lighting radiation 16 are applied.
- Gl grazing Incidence
- NI normal incidence
- the collector 17 can be structured and/or coated on the one hand to optimize its reflectivity for the useful radiation and on the other hand to suppress false light.
- the intermediate focus plane 18 can represent a separation between a radiation source module, having the radiation source 3 and the collector 17, and the illumination optics 4.
- the lighting optics 4 comprises a deflection mirror 19 and, downstream of it in the beam path, a first facet mirror 20.
- the deflection mirror 19 can be a flat deflection mirror or alternatively a mirror with an effect that influences the bundle beyond the pure deflection effect. Alternatively or additionally, the deflection mirror 19 can be designed as a spectral filter which separates a useful light wavelength of the illumination radiation 16 from false light of a wavelength that deviates from this.
- the first facet If the mirror 20 is arranged in a plane of the illumination optics 4, which is optically conjugate to the object plane 6 as a field plane, this is also referred to as a field facet mirror.
- the first facet mirror 20 includes a large number of individual first facets 21, which are also referred to below as field facets. Some of these facets 21 are shown in FIG. 1 only as examples.
- the first facets 21 can be designed as macroscopic facets, in particular as rectangular facets or as facets with an arcuate or part-circular edge contour.
- the first facets 21 can be designed as flat facets or alternatively as convex or concave curved facets.
- the first facets 21 themselves can also each be composed of a large number of individual mirrors, in particular a large number of micromirrors.
- the first facet mirror 20 can in particular be designed as a microelectromechanical system (MEMS system).
- MEMS system microelectromechanical system
- the illumination radiation 16 runs horizontally, i.e. along the y-direction.
- a second facet mirror 22 is located downstream of the first facet mirror 20 in the beam path of the illumination optics 4. If the second facet mirror 22 is arranged in a pupil plane of the illumination optics 4, it is also referred to as a pupil facet mirror. The second facet mirror 22 can also be arranged at a distance from a pupil plane of the lighting optics 4. In this case, the combination of the first facet mirror 20 and the second facet mirror 22 is also referred to as a specular reflector. Specular reflectors are known from US 2006/0132747 A1, EP 1 614 008 B1 and US 6,573,978.
- the second facet mirror 22 comprises a plurality of second facets 23.
- the second facets 23 are also referred to as pupil facets.
- the second facets 23 can also be macroscopic facets, which can have, for example, round, rectangular or even hexagonal edges, or alternatively, they can be facets composed of micromirrors.
- macroscopic facets which can have, for example, round, rectangular or even hexagonal edges, or alternatively, they can be facets composed of micromirrors.
- the second facets 23 can have flat or alternatively convex or concave curved reflection surfaces.
- the lighting optics 4 thus forms a double faceted system.
- This basic principle is also known as the honeycomb condenser (fly's eye integrator).
- the second facet mirror 22 may be arranged tilted relative to a pupil plane of the projection optics 10, as described for example in DE 10 2017 220 586 A1.
- the second facet mirror 22 is the last beam-forming mirror or actually the last mirror for the illumination radiation 16 in the beam path in front of the object field 5.
- transmission optics can be arranged in the beam path between the second facet mirror 22 and the object field 5, which contributes in particular to the imaging of the first facets 21 into the object field 5.
- the transmission optics can have exactly one mirror, but alternatively also two or more mirrors, which are arranged one behind the other in the beam path of the lighting optics 4.
- the transmission optics can in particular comprise one or two mirrors for perpendicular incidence (NL mirror, normal incidence mirror) and/or one or two mirrors for grazing incidence (Gl mirror, gracing incidence mirror).
- the lighting optics 4 has exactly three mirrors after the collector 17, namely the deflection mirror 19, the field facet mirror 20 and the pupil facet mirror 22.
- the deflection mirror 19 can also be omitted, so that the lighting optics 4 then exactly after the collector 17 can have two mirrors, namely the first facet mirror 20 and the second facet mirror 22.
- the imaging of the first facets 21 into the object plane 6 by means of the second facets 23 or with the second facets 23 and a transmission optics is generally only an approximate image.
- the projection optics 10 comprises a plurality of mirrors Mi, which are numbered consecutively according to their arrangement in the beam path of the projection exposure system 1.
- the projection optics 10 comprises six mirrors M1 to M6. Alternatives with four, eight, ten, twelve or another number of mirrors Mi are also possible.
- the penultimate mirror M5 and the last mirror M6 each have a passage opening for the illumination radiation 16.
- the projection optics 10 are double-obscured optics.
- the projection optics 10 has an image-side numerical aperture that is larger than 0.5 and which can also be larger than 0.6 and which can be, for example, 0.7 or 0.75.
- Reflection surfaces of the mirrors Mi can be designed as free-form surfaces without an axis of rotational symmetry.
- the reflection surfaces of the mirrors Mi can be designed as aspherical surfaces with exactly one axis of rotational symmetry of the reflection surface shape.
- the mirrors Mi just like the mirrors of the lighting optics 4, can have highly reflective coatings for the lighting radiation 16. These coatings can be designed as multilayer coatings, in particular with alternating layers of molybdenum and silicon.
- the projection optics 10 has a large object image offset in the y direction between a y coordinate of a center of the object field 5 and a y coordinate of the center of the image field 11.
- This object-image offset in the y direction can be approximately as large as a z distance between the object plane 6 and the image plane 12.
- the projection optics 10 can in particular be anamorphic. In particular, it has different imaging scales ßx, ßy in x and y Direction up.
- a positive magnification ß means an image without image reversal.
- a negative sign for the image scale ß means an image with image reversal.
- the projection optics 10 thus leads to a reduction in size in the x direction, that is to say in the direction perpendicular to the scanning direction, in a ratio of 4:1.
- the projection optics 10 leads to a reduction of 8:1 in the y direction, that is to say in the scanning direction.
- Image scales are also possible. Image scales of the same sign and absolutely the same in the x and y directions, for example with absolute values of 0.125 or 0.25, are also possible.
- the number of intermediate image planes in the x and y directions in the beam path between the object field 5 and the image field 11 can be the same or, depending on the design of the projection optics 10, can be different. Examples of projection optics with different numbers of such intermediate images in the x and y directions are known from US 2018/0074303 A1.
- One of the pupil facets 23 is assigned to exactly one of the field facets 21 to form an illumination channel for illuminating the object field 5. This can in particular result in lighting based on Köhler's principle.
- the far field is broken down into a large number of object fields 5 using the field facets 21.
- the field facets 21 generate a plurality of images of the intermediate focus on the pupil facets 23 assigned to them.
- the field facets 21 are each imaged onto the reticle 7 by an assigned pupil facet 23, superimposed on one another, in order to illuminate the object field 5.
- the illumination of the object field 5 is in particular as homogeneous as possible.
- the illumination of the entrance pupil of the projection optics 10 can be geometrically defined by an arrangement of the pupil facets. By selecting the illumination channels, in particular the subset of the pupil facets that guide light, the intensity distribution in the entrance pupil of the projection optics 10 can be adjusted. This intensity distribution is also referred to as the lighting setting.
- a likewise preferred pupil uniformity in the area of defined illuminated sections of an illumination pupil of the illumination optics 4 can be achieved by redistributing the illumination channels.
- the projection optics 10 can in particular have a homocentric entrance pupil. This can be accessible. It can also be inaccessible.
- the entrance pupil of the projection optics 10 cannot regularly be illuminated precisely with the pupil facet mirror 22.
- the aperture rays often do not intersect at a single point.
- an area can be found in which the pairwise distance of the aperture beams becomes minimal.
- This surface represents the entrance pupil or a surface conjugate to it in local space. In particular, this surface shows a finite curvature.
- the projection optics have 10 different positions of the entrance pupil for the tangential and sagittal beam paths.
- an imaging element in particular an optical component of the transmission optics, should be provided between the second facet mirror 22 and the reticle 7. With the help of this optical element, the different positions of the tangential entrance pupil and the sagittal entrance pupil can be taken into account.
- the pupil facet mirror 22 is arranged in a surface conjugate to the entrance pupil of the projection optics 10.
- the field facet mirror 20 is tilted towards Object level 6 arranged.
- the first facet mirror 20 is arranged tilted to an arrangement plane that is defined by the deflection mirror 19.
- the first facet mirror 20 is arranged tilted to an arrangement plane that is defined by the second facet mirror 22.
- Figure 2 shows a schematic meridional section of another projection exposure system 101 for DUV projection lithography, in which the invention can also be used.
- the structure of the projection exposure system 101 and the principle of the imaging is comparable to the structure and procedure described in Figure 1.
- the same components are designated with a reference number increased by 100 compared to Figure 1, so the reference numbers in Figure 2 begin with 101.
- the projection exposure system 101 essentially comprises an illumination system 102, a reticle holder 108 for holding and precisely positioning a reticle 107 provided with a structure, through which the later structures on a wafer 113 are determined, and a wafer holder 114 for holding, moving and precisely positioning this wafer 113 and a projection lens 110, with a plurality of optical elements 117, which are held via mounts 118 in a lens housing 119 of the projection lens 110.
- the illumination system 102 provides DUV radiation 116 required for imaging the reticle 107 on the wafer 113.
- a laser, a plasma source or the like can be used as the source for this radiation 116.
- the radiation 116 is shaped in the lighting system 102 via optical elements in such a way that the DUV radiation 116 has the desired effect when it hits the reticle 107. desired properties in terms of diameter, polarization, shape of the wavefront and the like.
- the structure of the subsequent projection optics 110 with the lens housing 119 does not differ in principle from the structure described in Figure 1 except for the additional use of refractive optical elements 117 such as lenses, prisms, end plates and is therefore not described further.
- FIG. 3 shows a schematic representation of a first embodiment of the invention, in which an optical assembly 30 is shown.
- This comprises an optical element designed as a mirror Mx, 117, as can be used in one of the projection exposure systems 1, 101 explained in FIG. 1 and FIG. 2, actuators 35 and a support structure designed as a back plate 36.
- the mirror Mx, 117 comprises a base body 31 with an optical effective surface 32, the base body 31 being mounted on a bearing 34, such as a frame of a projection exposure system 1, 101.
- the actuators 35 are arranged between the base body 31 and the back plate 36 and are connected to the base body 31 on the back side 33 of the base body 31 opposite the optical active surface 32.
- the actuators 35 can be connected to the base body 31 and the back plate 36 via an adhesive connection, not shown separately in the figure, although other types of connection, such as bonding or soldering, can also be used.
- the actuators 35 are controlled by a control (also not shown in the figure) in such a way that the deflection of the actuators 35 causes a deformation of the optical effective surface 32.
- the back plate 36 is deformed by deflections of the actuators 35 of different sizes, which results in a deformation of the base body 31 and thus of the optical effective surface 32 that is dependent on the ratio of the rigidity of the base body 31 and the rigidity of the back plate 36.
- a part of the actuators 35 holds the back plate in its position, whereby the other part of the actuators 35 can be supported on the back plate 36 and thereby cause the deformation.
- the back plate 36 is supported exclusively by the actuators 35 and is therefore not connected to a frame or to the base body 31 of the mirror Mx, 117 or to other components.
- FIG 4 shows a further embodiment of the invention, in which an optical assembly 30 with an optical element designed as a mirror Mx, 117, as can be used in one of the projection exposure systems 1, 101 explained in Figure 1 and Figure 2, is shown is.
- the mirror Mx, 117 comprises a base body 31 with a concave optical effective surface 32.
- the optical assembly 30 further comprises a back plate 36 and actuators 35 arranged between the back plate 36 and the back 33 of the base body 31.
- the back 33 and the back plate 36 are just trained. This has the advantage that the actuators 35 are also arranged in one plane and, after they have first been connected to the back plate 36, can be reworked in order to achieve an optimal adaptation to the back 33.
- the adhesive gap of the adhesive connection between the actuators 35 and the base body 31 can be designed in such a way that the influence of the adhesive on the connection rigidity is negligible.
- the laterally changing material thickness of the base body 31 can be compensated for using differently designed actuators and the control of the actuators 35.
- FIG. 5 shows a further embodiment of the invention, in which an optical assembly 30 with an optical element designed as a mirror Mx, 117, as can be used in one of the projection exposure systems 1, 101 explained in Figure 1 and Figure 2, is shown is.
- the mirror Mx, 117 comprises a base body 31 with a concave optical effective surface 32.
- the optical assembly 30 further comprises three back plates 37.1, 37.2, 37.3 and actuators 35, which are located between the back plates 37.1, 37.2, 37.3 and the back 33 of the base body 31 are arranged.
- the base body 31 is designed in such a way that the differences in the distance between the backs, which are designed as three flat surfaces side 33 of the base body 31 from the optical effective surface 32 are minimized in comparison to the embodiment explained in Figure 4.
- the back plates 37.1, 37.2, 37.3 are, as already explained in FIG. 4, flat and can be easily manufactured and the actuators 35 can be designed as standard actuators.
- FIG 6 shows a further embodiment of the invention, in which an optical assembly 30 with an optical element designed as a mirror Mx, 117, as can be used in one of the projection exposure systems 1, 101 explained in Figure 1 and Figure 2, is shown is.
- the mirror Mx, 117 comprises a base body 31 with a concave optical effective surface 32.
- the base body 31 unlike the base body shown in Figure 5, has a constant thickness, so that a convex or spherical back 33 results.
- the optical assembly 30 further comprises a concave back plate 39 which corresponds to the optical effective surface 32 and the geometry of the base body 31.
- the actuators 35 comprise a spherical joining surface 38 on both sides in order to ensure an adhesive gap of constant thickness in the adhesive connection.
- the constant thickness of the back plate 39 and the base body 31 have the advantage that they have a constant rigidity, whereby all actuators have to apply a comparable force to an identical deformation of the optical effective surface 32. This increases the number of identical parts and thereby reduces manufacturing costs.
- FIGs 7a and 7b show a further embodiment of the invention in two operating states, in which an optical assembly 30 with an optical element designed as a mirror Mx, 117, as in one of the projection exposure systems 1, 101 explained in Figure 1 and Figure 2 Can be used is shown.
- the mirror Mx, 117 comprises a base body 31 with a flat optical effective surface 32.
- the optical assembly 30 further comprises four back plates 40.1, 40.2, 40.3, 40.4.
- Two shear actuators 41 are arranged between each back plate 40.1, 40.2, 40.3, 40.4 and the back 33 of the base body 31, which execute a shearing movement parallel to the optical active surface 32 when an electrical voltage is applied.
- Figure 7a shows a so-called zero state in which the optical effective surface 32 of the base body 31 has no deformations, i.e. corresponds to its target surface shape.
- the shear actuators 41 are deflected from a tension-free zero position, whereby the base body 31 is deformed from its zero position in one direction depending on the voltage applied. This has the advantage that the optical effective surface 32 can be finished before the actuators 41 are installed.
- Figure 7b shows the same optical assembly 30 in a deflected operating state.
- the actuators 41 arranged between the two middle back plates 40.2, 40.3 and the base body 31 are deflected and cause a deformation of the base body 31 and thus the optical active surface 32. While in Figure 7b both actuators of a back plate 40.2, 40.3 are deflected towards one another, can also only one actuator 41 of a back plate 40.1, 40.2, 40.3, 40.4 can be deflected or one actuator 41 can be deflected by two back plates 40.1, 40.2, 40.3, 40.4 arranged next to one another.
- FIGS 8a, 8b and 8c show different embodiments of actuators 42, 44, 46, which are deflected parallel to the optical effective surface 32.
- Figure 8a shows an optical element designed as a mirror Mx, 117, which has an actuator 42 on the left side, which is connected with its end face 43 to the back 33 of the base body 31.
- the electric field of the actuator 42 is formed perpendicular to the optical effective surface 32, whereas the deflection, as already mentioned above, runs parallel to the optical effective surface 32.
- the actuator 44 on the right side of the mirror Mx is connected to the base body 31 with its long side 45.
- the actuator 44 is designed as a stack actuator with piezoelectric material, in which the electric field and the deflection are formed parallel to the optical effective surface 32 in the embodiment shown in FIG. 8a.
- Figure 8b shows the schematic structure of a bimorph actuator 46, which has a first actuator layer 47 and a second actuator layer 48.
- the two actuator layers 47, 48 can be in opposite directions (in Figure 8b shown by arrows) are deflected so that one actuator layer 47 expands and the other actuator layer 48 contracts, causing a deformation in the actuator 46.
- Figure 8c shows an optical element designed as a mirror Mx, 117 with a bimorph actuator 46 explained in Figure 8b.
- This is connected to the back 33 of the base body 31 via an adhesive connection and deforms it when it is deflected.
- the functionality is similar to that of an actuator arranged normal to the surface, which uses the deformation through the secondary effect of a change in geometry perpendicular to the main deflection. However, it differs in that the main contribution of the deformation is caused by the deformation of the bimorph actuator 46 itself, as explained in FIG. 8b, and not by a contraction of the material in the base body 31 due to the change in geometry of the actuator.
- Figure 9 shows an advantageous variant of the invention in which a decoupling element 120 is used.
- a base body 31 is connected to a free back plate 36 via actuators 35.
- a mechanical decoupling in the area of the connection of the actuators 35 to the base body 31 is achieved in the example shown by the decoupling elements designed as free cuts 120 in the base body 31.
- the actuators 35 are designed as cylindrical solid-state actuators
- the decoupling elements 120 can be implemented as circumferential annular grooves.
- the decoupling elements 120 are only formed in the base body 31. It goes without saying that a corresponding measure is also conceivable for the back plate 36.
- Figure 10 shows an embodiment of the invention in which a back plate 36' is designed such that its thickness changes laterally. Furthermore, the back plate 36 'shows recesses 121 in which the actuators 35 are partially arranged.
- the laterally changing thickness of the back plate 36' ensures that the rigidity of the back plate 31', even in its edge regions, is comparable to the rigidity in the inner regions. Furthermore, the arrangement of the actuators 35 in the recesses 121 can save a certain amount of installation space can be achieved.
- the measures shown in FIG. 10 do not necessarily have to be used in combination; It is of course also conceivable to use only one back plate with a laterally changing thickness or also a back plate with recesses.
- Figure 11 describes a possible method for producing an optical assembly according to the invention.
- a first method step 51 the actuators are connected to the back plate.
- a second method step 52 the surface tolerance of the connecting surfaces of the actuators facing away from the back plate is determined.
- a third method step 53 the connecting surfaces are processed.
- a fourth method step 54 the two previous steps are repeated until the area tolerance is below a predetermined threshold value.
- a fifth method step 55 the actuators are connected to the base body.
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Environmental & Geological Engineering (AREA)
- Engineering & Computer Science (AREA)
- Public Health (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
- Optical Elements Other Than Lenses (AREA)
Abstract
Description
Claims
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202380050991.1A CN119487448A (zh) | 2022-07-05 | 2023-05-10 | 光学组件、用于半导体光刻的投射曝光系统及方法 |
| JP2024576478A JP2025524485A (ja) | 2022-07-05 | 2023-05-10 | 光学アセンブリ、半導体リソグラフィ用の投影露光装置、及び方法 |
| US19/004,166 US20250138302A1 (en) | 2022-07-05 | 2024-12-27 | Optical assembly, projection exposure system for semiconductor lithography, and method |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102022116700.3 | 2022-07-05 | ||
| DE102022116700.3A DE102022116700A1 (de) | 2022-07-05 | 2022-07-05 | Optische Baugruppe, Projektionsbelichtungsanlage für die Halbleiterlithographie und Verfahren |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US19/004,166 Continuation US20250138302A1 (en) | 2022-07-05 | 2024-12-27 | Optical assembly, projection exposure system for semiconductor lithography, and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2024008352A1 true WO2024008352A1 (de) | 2024-01-11 |
Family
ID=86604874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/EP2023/062473 Ceased WO2024008352A1 (de) | 2022-07-05 | 2023-05-10 | Optische baugruppe, projektionsbelichtungsanlage für die halbleiterlithographie und verfahren |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250138302A1 (de) |
| JP (1) | JP2025524485A (de) |
| CN (1) | CN119487448A (de) |
| DE (1) | DE102022116700A1 (de) |
| WO (1) | WO2024008352A1 (de) |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4940318A (en) * | 1988-11-03 | 1990-07-10 | Itek Corporation | Gradient membrane deformable mirror having replaceable actuators |
| EP0410686A2 (de) * | 1989-07-25 | 1991-01-30 | Chromex, Inc., | Asphärische optische Oberflächen |
| EP0471362A2 (de) * | 1990-08-15 | 1992-02-19 | Mitsubishi Denki Kabushiki Kaisha | Reflektor mit passiver und aktiver Temperaturkompensation |
| US6573978B1 (en) | 1999-01-26 | 2003-06-03 | Mcguire, Jr. James P. | EUV condenser with non-imaging optics |
| EP1640329A2 (de) * | 2004-09-27 | 2006-03-29 | Idc, Llc | System und Verfahren zum Schutz einer Matrix aus mikroelektromechanischen Systemen unter Benutzung einer Rückplatte mit Verstärkungsstruktur |
| US20060132747A1 (en) | 2003-04-17 | 2006-06-22 | Carl Zeiss Smt Ag | Optical element for an illumination system |
| DE102008009600A1 (de) | 2008-02-15 | 2009-08-20 | Carl Zeiss Smt Ag | Facettenspiegel zum Einsatz in einer Projektionsbelichtungsanlage für die Mikro-Lithographie |
| US20110019295A1 (en) * | 2007-11-02 | 2011-01-27 | Ujf-Filiale | Deformable mirror with distributed stiffness, tool and method for producing such a mirror |
| EP2378345A1 (de) * | 2010-04-14 | 2011-10-19 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Verformbare Spiegelvorrichtung mit austauschbarer Spiegelfolie und Verfahren zum Kleben einer Spiegelfolie |
| US20140232984A1 (en) * | 2013-02-18 | 2014-08-21 | Canon Kabushiki Kaisha | Deformable mirror and method for manufacturing the same |
| US20180074303A1 (en) | 2015-04-14 | 2018-03-15 | Carl Zeiss Smt Gmbh | Imaging optical unit and projection exposure unit including same |
| DE102017220586A1 (de) | 2017-11-17 | 2019-05-23 | Carl Zeiss Smt Gmbh | Pupillenfacettenspiegel, Beleuchtungsoptik und optisches System für eine Projek-tionsbelichtungsanlage |
| DE102019203838A1 (de) * | 2019-03-20 | 2020-09-24 | Carl Zeiss Smt Gmbh | Projektionsbelichtungsanlage für die Halbleiterlithographie mit einem optischen Element mit Sensorreferenz und Verfahren zur Ausrichtung der Sensorreferenz |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060018045A1 (en) * | 2003-10-23 | 2006-01-26 | Carl Zeiss Smt Ag | Mirror arrangement and method of manufacturing thereof, optical system and lithographic method of manufacturing a miniaturized device |
| JP5875537B2 (ja) * | 2013-01-28 | 2016-03-02 | 三菱電機株式会社 | 形状可変鏡装置 |
| JP6168957B2 (ja) * | 2013-09-30 | 2017-07-26 | キヤノン株式会社 | 光学装置、投影光学系、露光装置および物品の製造方法 |
| JP6501793B2 (ja) * | 2014-04-04 | 2019-04-17 | カール・ツァイス・エスエムティー・ゲーエムベーハー | 変形装置を備えた光学モジュール及び光学素子を変形させる方法 |
| DE102015201020A1 (de) * | 2015-01-22 | 2016-07-28 | Carl Zeiss Smt Gmbh | Projektionsbelichtungsanlage mit Manipulator sowie Verfahren zum Steuern einer Projektionsbelichtungsanlage |
| DE102020210024B4 (de) * | 2020-08-07 | 2024-02-08 | Carl Zeiss Smt Gmbh | Optische Baugruppe und Projektionsbelichtungsanlage |
| DE102020210771A1 (de) * | 2020-08-26 | 2021-08-19 | Carl Zeiss Smt Gmbh | Facettenspiegel für eine projektionsbelichtungsanlage und projektionsbelichtungsanlage mit entsprechendem facettenspiegel sowie verfahren zum betrieb derselben |
| DE102020210773B4 (de) * | 2020-08-26 | 2024-04-18 | Carl Zeiss Smt Gmbh | Optische Baugruppe, Verfahren zur Ansteuerung einer optischen Baugruppe und Projektionsbelichtungsanlage |
-
2022
- 2022-07-05 DE DE102022116700.3A patent/DE102022116700A1/de not_active Ceased
-
2023
- 2023-05-10 CN CN202380050991.1A patent/CN119487448A/zh active Pending
- 2023-05-10 WO PCT/EP2023/062473 patent/WO2024008352A1/de not_active Ceased
- 2023-05-10 JP JP2024576478A patent/JP2025524485A/ja active Pending
-
2024
- 2024-12-27 US US19/004,166 patent/US20250138302A1/en active Pending
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4940318A (en) * | 1988-11-03 | 1990-07-10 | Itek Corporation | Gradient membrane deformable mirror having replaceable actuators |
| EP0410686A2 (de) * | 1989-07-25 | 1991-01-30 | Chromex, Inc., | Asphärische optische Oberflächen |
| EP0471362A2 (de) * | 1990-08-15 | 1992-02-19 | Mitsubishi Denki Kabushiki Kaisha | Reflektor mit passiver und aktiver Temperaturkompensation |
| US6573978B1 (en) | 1999-01-26 | 2003-06-03 | Mcguire, Jr. James P. | EUV condenser with non-imaging optics |
| US20060132747A1 (en) | 2003-04-17 | 2006-06-22 | Carl Zeiss Smt Ag | Optical element for an illumination system |
| EP1614008B1 (de) | 2003-04-17 | 2009-12-02 | Carl Zeiss SMT AG | Optisches element für ein beleuchtungssystem |
| EP1640329A2 (de) * | 2004-09-27 | 2006-03-29 | Idc, Llc | System und Verfahren zum Schutz einer Matrix aus mikroelektromechanischen Systemen unter Benutzung einer Rückplatte mit Verstärkungsstruktur |
| US20110019295A1 (en) * | 2007-11-02 | 2011-01-27 | Ujf-Filiale | Deformable mirror with distributed stiffness, tool and method for producing such a mirror |
| DE102008009600A1 (de) | 2008-02-15 | 2009-08-20 | Carl Zeiss Smt Ag | Facettenspiegel zum Einsatz in einer Projektionsbelichtungsanlage für die Mikro-Lithographie |
| EP2378345A1 (de) * | 2010-04-14 | 2011-10-19 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Verformbare Spiegelvorrichtung mit austauschbarer Spiegelfolie und Verfahren zum Kleben einer Spiegelfolie |
| US20140232984A1 (en) * | 2013-02-18 | 2014-08-21 | Canon Kabushiki Kaisha | Deformable mirror and method for manufacturing the same |
| US20180074303A1 (en) | 2015-04-14 | 2018-03-15 | Carl Zeiss Smt Gmbh | Imaging optical unit and projection exposure unit including same |
| DE102017220586A1 (de) | 2017-11-17 | 2019-05-23 | Carl Zeiss Smt Gmbh | Pupillenfacettenspiegel, Beleuchtungsoptik und optisches System für eine Projek-tionsbelichtungsanlage |
| DE102019203838A1 (de) * | 2019-03-20 | 2020-09-24 | Carl Zeiss Smt Gmbh | Projektionsbelichtungsanlage für die Halbleiterlithographie mit einem optischen Element mit Sensorreferenz und Verfahren zur Ausrichtung der Sensorreferenz |
Non-Patent Citations (1)
| Title |
|---|
| BINAL POYYATHURUTHY BRUNO ET AL: "Micro Fresnel mirror array with individual mirror control", SMART MATERIALS AND STRUCTURES, IOP PUBLISHING LTD., BRISTOL, GB, vol. 29, no. 7, 26 May 2020 (2020-05-26), pages 75003, XP020354453, ISSN: 0964-1726, [retrieved on 20200526], DOI: 10.1088/1361-665X/AB85A3 * |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102022116700A1 (de) | 2024-01-11 |
| CN119487448A (zh) | 2025-02-18 |
| US20250138302A1 (en) | 2025-05-01 |
| JP2025524485A (ja) | 2025-07-30 |
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