WO2024099378A1 - Conformal-shielding packaging method and structure for substrate - Google Patents

Abstract

Disclosed in the present invention are a conformal-shielding packaging method and structure for a substrate. The packaging method comprises the following steps: mounting a plurality of electronic elements on a substrate to form a plurality of electronic modules, wherein a cutting channel is formed between every two adjacent electronic modules; performing plastic packaging on the plurality of electronic modules, and mounting the plastically packaged electronic modules on a carrier plate to which an adhesive film is attached; performing cutting at the cutting channels to separate the plurality of electronic modules; performing electromagnetic shielding processing on each electronic module to form an electromagnetic shielding layer, and grounding the electromagnetic shielding layer; and separating the electromagnetically shielded electronic modules from the adhesive film, and performing packaging. In the packaging method, by using the carrier plate, the plastically packaged electronic modules are mounted on the adhesive film of the carrier plate, such that metal coating for the electronic modules is directly completed, and then the electronic modules are separated. During the process, half-dicing of the electronic modules is not required, sufficient grounding is achieved, and double-sided plastic packaging is not required, thereby simplifying the whole packaging process.

Description

Substrate conformal shielding packaging method and structure Technical Field

The invention relates to a substrate conformal shielding packaging method, and also to a packaging structure realized by using the substrate conformal shielding packaging method, belonging to the technical field of semiconductor packaging.

Background technique

With the development of the mobile phone market, the space inside the mobile phone is getting smaller and smaller, which requires the RF chip on the motherboard to develop in the direction of modular integration. Modular RF chips have serious electromagnetic interference between them, which affects their performance, so electromagnetic interference (EMI) shielding technology will play an increasingly important role.

On the other hand, conformal shielding is mainly used in the packaging of SIP (System In a Package) modules such as WiFi and Memory to isolate the interference between the internal circuit of the package and the external system. At present, the industry mainly adopts magnetron sputtering (Sputter) for conformal shielding. However, this method uses half-cut plastic package, with less ground layer; the purchase of gradual plating machine and its auxiliary equipment is expensive, the production cost is high, and the process flow is complicated.

Summary of the invention

The primary technical problem to be solved by the present invention is to provide a substrate conformal shielding packaging method.

Another technical problem to be solved by the present invention is to provide a substrate conformal shielding packaging structure.

In order to achieve the above technical objectives, the present invention adopts the following technical solutions:

According to a first aspect of an embodiment of the present invention, a substrate conformal shielding packaging method is provided, comprising:

Mounting a plurality of electronic components on a substrate to form a plurality of electronic modules, wherein a cutting path is formed between two adjacent electronic modules;

Plastic-sealing the plurality of electronic modules, and mounting the plastic-sealed electronic modules on a carrier board with an adhesive film;

Performing cutting at the cutting streets to separate the plurality of electronic modules;

Perform electromagnetic shielding treatment on each of the electronic modules to form an electromagnetic shielding layer, and The electromagnetic shielding layer is grounded;

The electronic modules after electromagnetic shielding are separated from the adhesive film and packaged separately.

Preferably, a plurality of grounding posts are preset in the substrate, each of the electronic modules corresponds to at least one of the grounding posts, metal wires are connected to the grounding posts, and the metal wires are led out to the cutting paths corresponding to the electronic modules.

Preferably, when cutting is performed at the cutting street, the adhesive film is cut into but not cut through.

Preferably, the method of cutting the cutting path at least includes: mechanical cutting by a cutting knife or laser cutting by a laser beam.

Preferably, performing electromagnetic shielding treatment on each of the electronic modules to form an electromagnetic shielding layer, and grounding the electromagnetic shielding layer comprises:

Metal material is electroplated or sputtered on the top and around the electronic module to form the electromagnetic shielding layer, and the electromagnetic shielding layer is made to contact with the exposed metal wires in the cutting path, so as to be grounded through the grounding column.

Preferably, the step of separating the electromagnetically shielded electronic module from the adhesive film and packaging the module comprises:

Covering the top of the plurality of electronic modules after electromagnetic shielding with flip films to separate the plurality of electronic modules after electromagnetic shielding from the adhesive film on the carrier board;

Each of the electronic modules is separated from the flip film to be packaged separately.

Preferably, after covering with the flip film, the viscosity of the adhesive film is reduced by light or heat so that the viscosity of the adhesive film is lower than that of the flip film, thereby separating the plurality of electronic modules after electromagnetic shielding from the adhesive film on the carrier board.

Preferably, the flip film is made of a light-curing material or a heat-curing material, and the adhesive film is made of a light-curing material or a heat-curing material.

Preferably, the cutting width of the cutting road is 150um to 500um.

According to a second aspect of an embodiment of the present invention, there is provided a substrate conformal shielding packaging structure, comprising:

A carrier plate, a surface of which is provided with an adhesive film;

A substrate is mounted on the adhesive film, and a plurality of electronic components are mounted on the substrate to form a plurality of electronic modules; wherein a cutting path is formed between two adjacent electronic modules, A plurality of grounding posts are preset in the substrate, each of the electronic modules corresponds to at least one of the grounding posts, a metal wire is connected to the grounding post, and the metal wire is led out to the cutting path corresponding to the electronic module;

A plastic sealing body filled on the substrate to plastic seal the multiple electronic modules;

An electromagnetic shielding layer, coated on the surface of the plastic package body, and the electromagnetic shielding layer is in contact with the metal wire led out into the cutting path;

The flip-over film covers the electromagnetic shielding layer.

Compared with the prior art, the substrate conformal shielding packaging method and structure provided in the embodiment of the present invention uses a carrier board to mount the plastic-sealed electronic module on the adhesive film of the carrier board 1. After completing PKG saw (process stability improvement, process optimization and yield improvement), the metal plating of the electronic module is directly completed, and then the electronic module can be separated. In this process, the electronic module does not need to be half-cut, the grounding is sufficient, and double-sided plastic sealing is not required, which simplifies the entire packaging process.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG1 is a flow chart of a substrate conformal shielding packaging method provided by an embodiment of the present invention;

FIG2 is a schematic diagram of a structure in which electronic components are mounted on a substrate to form an electronic module in an embodiment of the present invention;

FIG3 is a schematic diagram of a structure for plastic-sealing an electronic module in an embodiment of the present invention;

FIG4 is a schematic structural diagram of mounting a plastic-sealed electronic module on a carrier board with an adhesive film in an embodiment of the present invention;

FIG5 is a schematic structural diagram of cutting a plastic-sealed electronic module in an embodiment of the present invention;

FIG6 is a schematic diagram of a structure for performing electromagnetic shielding treatment on each electronic module in an embodiment of the present invention;

FIG7 is a schematic diagram of a structure in which a flip film is covered on top of a plurality of electronic modules in an embodiment of the present invention;

FIG8 is a schematic diagram of a structure in which a plurality of electronic modules are separated from an adhesive film of a carrier board in an embodiment of the present invention;

FIG. 9 is a schematic diagram of the structure of packaging a single electronic module in an embodiment of the present invention.

Detailed ways

The technical content of the present invention is described in detail below with reference to the accompanying drawings and specific embodiments. illustrate.

In one embodiment of the present invention, the substrate required for implementing the substrate conformal shielding packaging method includes: a carrier 1, an adhesive film 2, a substrate 3, an electronic component 4, a plastic package 5, an electromagnetic shielding layer 6, a flip film 7 and a cutting knife 30. The specific implementation process is as follows:

As shown in FIG1 , a substrate conformal shielding packaging method provided by an embodiment of the present invention specifically includes steps S1 to S5:

S1: mounting a plurality of electronic components 4 on a substrate 3 to form a plurality of electronic modules 10 .

Specifically, as shown in FIG2 , after the substrate 3 is prefabricated, multiple electronic modules 10 (indicated by the dotted line in FIG2 ) can be formed by mounting electronic components 4 (e.g., chips or components) on the surface of the substrate 3. A cutting path 20 (indicated by the dotted line in FIG2 ) is formed between two adjacent electronic modules 10.

In addition, in this embodiment, a plurality of grounding posts 31 are preset in the substrate 3, and each electronic module 10 corresponds to at least one grounding post 31. A metal wire 32 is connected to the grounding post 31, and the metal wire 32 is led out to the cutting path 20 corresponding to the electronic module 10. Therefore, when the cutting is completed, the metal wire 32 will be exposed in the cutting path 20, so as to be connected to the electromagnetic shielding layer for electromagnetic signal shielding (described in detail below).

The types of the electronic components 4 can be adaptively adjusted as needed. For example, the multiple electronic components 4 can be the same, different, or partially the same and partially different, which is not specifically limited here.

S2: plastic-encapsulating a plurality of electronic modules 10, and mounting the plastic-encapsulated electronic modules 10 on a carrier board 1 with an adhesive film 2 attached thereto.

Specifically, as shown in FIG3 , after a plurality of electronic components 4 are mounted on different regions of a substrate 3 to form a plurality of electronic modules 10, a plastic encapsulation material is filled on the surface of the substrate 3 so that the plastic encapsulation material completely covers each electronic module 10, thereby forming a plastic encapsulation layer 5. The specific type of the plastic encapsulation material can be adaptively selected according to needs and is not limited herein.

In addition, the plastic encapsulation layer 5 formed after plastic encapsulation should have a set size. In this embodiment, the height of the plastic encapsulation layer 5 is 0.2 mm to 0.5 mm and completely covers the surface of the substrate 3, thereby ensuring the stability of the electronic module 10 after plastic encapsulation on the one hand and avoiding occupying too much space on the other hand.

As shown in FIG4 , after the multiple electronic modules 10 are sealed, the sealed electronic modules are mounted on a carrier board 1 with an adhesive film 2 attached thereto. The component is used to contact the bearing surface (for example, the ground or the work surface); the adhesive film 2 is a layer of film with a certain viscosity covering the carrier 1, and both sides of the adhesive film 2 are adhesive, so that one side is adhered to the carrier 1 and the other side is adhered to the plastic-sealed electronic module, so that the plastic-sealed electronic module is bonded to the carrier 1.

S3 : Cutting is performed at the cutting streets 20 to separate the plurality of electronic modules 10 .

Specifically, as shown in FIG. 5 , in this embodiment, after the plastic-sealed electronic module 10 is mounted on a carrier board 1 with an adhesive film 2, a cutting knife 30 is used to cut at a cutting path 20. During cutting, the cutting knife 30 needs to cut into the adhesive film 2 but not through the adhesive film 2, thereby separating a plurality of electronic modules 10.

It is understandable that, since the metal wire 32 is led out to the cutting path 20 corresponding to the electronic module 10 in step S1, when the cutting blade 30 cuts in the cutting path 20, a portion of the metal wire 32 introduced into the cutting path 20 will be cut off, so that the end of the metal wire 32 is exposed in the cutting path 20. Therefore, the cutting width of the cutting path needs to be within a certain range to ensure that the cutting blade 30 can cut the metal wire 32 when cutting in the cutting path 20. In this embodiment, the cutting width of the cutting path is 150um to 500um, but is not limited to the specific range of the cutting path, and can be adaptively adjusted according to the actual layout form.

In addition, it is understood that in another embodiment, laser cutting using laser light may be used to replace mechanical cutting using the cutting blade 30. However, no matter which cutting method is used, a portion of the metal wire 32 introduced into the cutting path 20 needs to be cut off, so that the end of the metal wire 32 is exposed in the cutting path 20.

S4: Perform electromagnetic shielding treatment on each electronic module 10 to form an electromagnetic shielding layer 6, and ground the electromagnetic shielding layer 6.

Specifically, as shown in FIG6 , after each electronic module 10 is separated from each other, a metal material is electroplated or sputtered on the top and around each electronic module 10 to form an electromagnetic shielding layer 6 (i.e., a metal layer). In addition, since the end of the metal wire 32 is exposed in the cutting path 20 in step S3, the inner wall of the electromagnetic shielding layer 6 can contact the exposed metal wire 32 in the cutting path 20, thereby being grounded through the grounding column 31 to form an electromagnetic shielding effect.

It can be understood that in this embodiment, by presetting the grounding post 31 in the substrate 3 and coordinating the metal wire 32 to contact the electromagnetic shielding layer 6 to achieve grounding operation, not only the grounding method is simple, but also the grounding area is larger, which can effectively improve the electromagnetic shielding effect. In addition, when the grounding post 31 is preset in the substrate 3, the bottom area of the grounding post 31 can be selected. The larger the bottom area, the better the electromagnetic shielding effect. The larger the value, the more sufficient the grounding is. It can be adaptively adjusted according to the grounding requirements.

S5: Separating the electromagnetically shielded electronic modules from the adhesive film and packaging them separately.

Specifically, as shown in FIG. 7 , after the electromagnetic shielding process is completed for each electronic module 10 , the electromagnetically shielded electronic modules 10 need to be separated from the adhesive film 2 for separate packaging.

In this embodiment, the following is specifically achieved through steps S51 to S53:

S51: Covering the top of the plurality of electronic modules 10 after electromagnetic shielding with a flip film 7 (as shown in FIG. 7 ).

S52: After covering with the flip film 7, the viscosity of the adhesive film 2 is reduced by light or heat so that the viscosity of the adhesive film 2 is lower than that of the flip film 7, thereby separating the multiple electronic modules 10 after electromagnetic shielding from the adhesive film 2 of the carrier board (as shown in FIG. 8 ).

S53: Separate each electronic module 10 from the flip film 7 to package them separately (as shown in FIG. 9 ).

In this embodiment, the flip film 7 is made of a light-curing material or a heat-curing material, and the adhesive film 2 is made of a light-curing material or a heat-curing material, but the specific materials of the flip film 7 and the adhesive film 2 are not limited and can be adaptively adjusted according to actual needs.

It is understandable that the use of the flip film 7 to separate the electronic module 10 from the adhesive film 2 in this embodiment is only a preferred real-time method. In other embodiments, other process means can also be used to separate the electronic module 10 from the adhesive film 2, which will not be described in detail here.

Based on the above-mentioned substrate conformal shielding packaging method, an embodiment of the present invention also provides a substrate conformal shielding packaging structure, including a carrier 1, an adhesive film 2, a substrate 3, an electronic component 4, a plastic package 5, an electromagnetic shielding layer 6 and a flip film 7.

Specifically, as shown in FIG7 , an adhesive film 2 is provided on the surface of the carrier 1. A substrate 3 is mounted on the adhesive film 2, and a plurality of electronic components 4 are mounted on the substrate 3 to form a plurality of electronic modules 10. A cutting path 20 is formed between two adjacent electronic modules 10, and a plurality of grounding posts 31 are preset in the substrate 3. Each electronic module 10 corresponds to at least one grounding post 31, and a metal wire 32 is connected to the grounding post 31, and the metal wire 32 is led out to the cutting path 20 corresponding to the electronic module 10. A plastic encapsulation body 5 is filled on the substrate 3 to encapsulate a plurality of electronic modules 10. An electromagnetic shielding layer 6 is coated on the surface of the plastic encapsulation body 5, and the electromagnetic shielding layer 3 is in contact with the metal wire 32 led out to the cutting path 20. A flip film 7 covers the electromagnetic shielding layer 6.

In summary, the substrate conformal shielding packaging method and structure provided by the embodiment of the present invention uses the carrier board 1 so that the plastic-sealed electronic module 10 is mounted on the adhesive film 2 of the carrier board 1. After completing PKG saw (process stability improvement, process optimization and yield improvement), the metal plating of the electronic module 10 is directly completed, and then the electronic module 10 can be separated. In this process, the electronic module 10 does not need to be half-cut, the grounding is sufficient, and double-sided plastic packaging is not required, which simplifies the entire packaging process.

The above is a detailed description of the substrate conformal shielding packaging method and structure provided by the present invention. For those skilled in the art, any obvious changes made to it without departing from the essence of the present invention will constitute an infringement of the patent right of the present invention and will bear corresponding legal responsibilities.

Claims (10)

A substrate conformal shielding packaging method, characterized by comprising the following steps: Mounting a plurality of electronic components on a substrate to form a plurality of electronic modules, wherein a cutting path is formed between two adjacent electronic modules; Plastic-sealing the plurality of electronic modules, and mounting the plastic-sealed electronic modules on a carrier board with an adhesive film; Performing cutting at the cutting streets to separate the plurality of electronic modules; Performing electromagnetic shielding treatment on each of the electronic modules to form an electromagnetic shielding layer, and grounding the electromagnetic shielding layer; The electronic modules after electromagnetic shielding are separated from the adhesive film and packaged separately. The substrate conformal shielding packaging method according to claim 1, characterized in that: A plurality of grounding posts are preset in the substrate, and each of the electronic modules corresponds to at least one of the grounding posts. Metal wires are connected to the grounding posts, and the metal wires are led out to the cutting paths corresponding to the electronic modules. The substrate conformal shielding packaging method according to claim 1, characterized in that: When cutting at the dicing street, the adhesive film is cut into but not through. The substrate conformal shielding packaging method according to claim 1, characterized in that: The method of cutting the cutting path at least includes: mechanical cutting by a cutting knife or laser cutting by a laser beam. The substrate conformal shielding packaging method according to claim 2, characterized in that performing electromagnetic shielding treatment on each of the electronic modules to form an electromagnetic shielding layer, and grounding the electromagnetic shielding layer comprises: Metal material is electroplated or sputtered on the top and around the electronic module to form the electromagnetic shielding layer, and the electromagnetic shielding layer is made to contact with the exposed metal wires in the cutting path, so as to be grounded through the grounding column. The substrate conformal shielding packaging method according to claim 1, characterized in that the step of separating the electromagnetically shielded electronic module from the adhesive film and packaging the module comprises: Covering the top of the plurality of electronic modules after electromagnetic shielding with flip films to separate the plurality of electronic modules after electromagnetic shielding from the adhesive film of the carrier board; Each of the electronic modules is separated from the flip film to be packaged separately. The substrate conformal shielding packaging method according to claim 6, characterized in that: After covering with the flip film, the viscosity of the adhesive film is reduced by light or heat so that the viscosity of the adhesive film is lower than that of the flip film, thereby separating the multiple electronic modules after electromagnetic shielding from the adhesive film on the carrier board. The substrate conformal shielding packaging method according to claim 6, characterized in that: The flip-over film is made of a light-curing material or a heat-curing material, and the adhesive film is made of a light-curing material or a heat-curing material. The substrate conformal shielding packaging method according to any one of claims 1 to 8, characterized in that: The cutting width of the cutting road is 150um to 500um. A substrate conformal shielding packaging structure, characterized by comprising: A carrier plate, a surface of which is provided with an adhesive film; A substrate is mounted on the adhesive film, and a plurality of electronic components are mounted on the substrate to form a plurality of electronic modules; wherein a cutting path is formed between two adjacent electronic modules, a plurality of grounding posts are preset in the substrate, each of the electronic modules corresponds to at least one grounding post, a metal wire is connected to the grounding post, and the metal wire is led out to the cutting path corresponding to the electronic module; A plastic sealing body filled on the substrate to plastic seal the multiple electronic modules; An electromagnetic shielding layer, coated on the surface of the plastic package body, and the electromagnetic shielding layer is in contact with the metal wire led out into the cutting path; The flip-over film covers the electromagnetic shielding layer.