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WO2024096362A1 - Structure étanche à l'eau et dispositif électronique la comprenant - Google Patents

Structure étanche à l'eau et dispositif électronique la comprenant Download PDF

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Publication number
WO2024096362A1
WO2024096362A1 PCT/KR2023/015596 KR2023015596W WO2024096362A1 WO 2024096362 A1 WO2024096362 A1 WO 2024096362A1 KR 2023015596 W KR2023015596 W KR 2023015596W WO 2024096362 A1 WO2024096362 A1 WO 2024096362A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic device
housing
receiving member
bonding
support member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2023/015596
Other languages
English (en)
Korean (ko)
Inventor
최관모
정해우
김상현
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020220149749A external-priority patent/KR20240061520A/ko
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of WO2024096362A1 publication Critical patent/WO2024096362A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/03—Covers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings

Definitions

  • Various embodiments disclosed in this document relate to electronic devices, for example, waterproof structures and electronic devices including the same.
  • Electronic devices refer to devices that perform specific functions according to installed programs, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, video/audio devices, desktop/laptop computers, and vehicle navigation devices. It can mean. For example, these electronic devices can output stored information as sound or video.
  • various functions can be installed in a single electronic device such as a mobile communication terminal. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music/video playback, communication and security functions such as mobile banking, schedule management and electronic wallet functions are being integrated into a single electronic device. .
  • These electronic devices are being miniaturized so that users can conveniently carry them.
  • an electronic device includes a housing, a display disposed on the housing, a cover window stacked on the display and configured to cover an outer surface of the display, and disposed between the housing and the cover window. It may include a receiving member and a bonding member filled in the receiving member and bonding the cover window and the housing.
  • an electronic device includes a housing including a side structure and a first support member, a display disposed on the first support member, stacked on the display, and configured to cover an outer surface of the display.
  • FIG. 1 is a block diagram of an electronic device in a network environment, according to various embodiments.
  • Figure 2 is a perspective view showing the front of an electronic device, according to an embodiment of the present disclosure.
  • Figure 3 is a perspective view showing the rear of an electronic device, according to an embodiment of the present disclosure.
  • Figure 4 is an exploded perspective view showing the front of an electronic device according to an embodiment of the present disclosure.
  • Figure 5 is an exploded perspective view showing the back of an electronic device, according to an embodiment of the present disclosure.
  • Figure 6 is an exploded perspective view of an electronic device including a waterproof structure, according to an embodiment of the present disclosure.
  • FIG. 7 is a plan view of an electronic device according to an embodiment of the present disclosure.
  • 8A, 8B, and 8C are cross-sectional views of an electronic device according to an embodiment of the present disclosure.
  • 9A, 9B, and 9C are perspective views of an electronic device according to an embodiment of the present disclosure.
  • 10A and 10B are plan views showing partial areas of an electronic device according to an embodiment of the present disclosure.
  • Figure 11 is a perspective view of a receiving member, according to one embodiment of the present disclosure.
  • FIG. 1 is a block diagram of an electronic device 101 in a network environment 100, according to various embodiments.
  • the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with at least one of the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108.
  • a first network 198 e.g., a short-range wireless communication network
  • a second network 199 e.g., a long-distance wireless communication network.
  • the electronic device 101 may communicate with the electronic device 104 through the server 108.
  • the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or may include an antenna module 197.
  • at least one of these components eg, the connection terminal 178) may be omitted or one or more other components may be added to the electronic device 101.
  • some of these components e.g., sensor module 176, camera module 180, or antenna module 197) are integrated into one component (e.g., display module 160). It can be.
  • the processor 120 for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, the processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134.
  • software e.g., program 140
  • the processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132.
  • the commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134.
  • the processor 120 includes a main processor 121 (e.g., a central processing unit or an application processor) or an auxiliary processor 123 that can operate independently or together (e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor).
  • a main processor 121 e.g., a central processing unit or an application processor
  • auxiliary processor 123 e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor.
  • the electronic device 101 includes a main processor 121 and a secondary processor 123
  • the secondary processor 123 may be set to use lower power than the main processor 121 or be specialized for a designated function. You can.
  • the auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.
  • the auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled.
  • co-processor 123 e.g., image signal processor or communication processor
  • may be implemented as part of another functionally related component e.g., camera module 180 or communication module 190. there is.
  • the auxiliary processor 123 may include a hardware structure specialized for processing artificial intelligence models.
  • Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself on which the artificial intelligence model is performed, or may be performed through a separate server (e.g., server 108).
  • Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited.
  • An artificial intelligence model may include multiple artificial neural network layers.
  • Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above.
  • artificial intelligence models may additionally or alternatively include software structures.
  • the memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto.
  • Memory 130 may include volatile memory 132 or non-volatile memory 134.
  • the program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.
  • the input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user).
  • the input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).
  • the sound output module 155 may output sound signals to the outside of the electronic device 101.
  • the sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback.
  • the receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.
  • the display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user).
  • the display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device.
  • the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.
  • the audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g., directly or wirelessly connected to the electronic device 101). Sound may be output through the electronic device 102 (e.g., speaker or headphone).
  • the electronic device 102 e.g., speaker or headphone
  • the sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do.
  • the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.
  • the interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 directly or wirelessly with an external electronic device (eg, the electronic device 102).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card interface
  • audio interface audio interface
  • connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 can capture still images and moving images.
  • the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 can manage power supplied to the electronic device 101.
  • the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101.
  • the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.
  • Communication module 190 is configured to provide a direct (e.g., wired) communication channel or wireless communication channel between electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108). It can support establishment and communication through established communication channels. Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication.
  • processor 120 e.g., an application processor
  • the communication module 190 is a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included.
  • a wireless communication module 192 e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module 194 e.g., : LAN (local area network) communication module, or power line communication module
  • the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., legacy It may communicate with an external electronic device 104 through a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network
  • the wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199.
  • subscriber information e.g., International Mobile Subscriber Identifier (IMSI)
  • IMSI International Mobile Subscriber Identifier
  • the wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology).
  • NR access technology provides high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and access to multiple terminals (massive machine type communications (mMTC)), or ultra-reliable and low-latency (URLLC). -latency communications)) can be supported.
  • the wireless communication module 192 may support high frequency bands (eg, mmWave bands), for example, to achieve high data rates.
  • the wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing.
  • MIMO massive array multiple-input and multiple-output
  • the wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199). According to one embodiment, the wireless communication module 192 supports Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC.
  • Peak data rate e.g., 20 Gbps or more
  • loss coverage e.g., 164 dB or less
  • U-plane latency e.g., 164 dB or less
  • the antenna module 197 may transmit or receive signals or power to or from the outside (eg, an external electronic device).
  • the antenna module 197 may include an antenna including a radiator made of a conductor or conductive pattern formed on a substrate (eg, PCB).
  • the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected to the plurality of antennas by, for example, the communication module 190. can be selected. Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna.
  • other components eg, radio frequency integrated circuit (RFIC) may be additionally formed as part of the antenna module 197.
  • RFIC radio frequency integrated circuit
  • the antenna module 197 may form a mmWave antenna module.
  • a mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., mmWave band); And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. can do.
  • a mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., mmWave band); And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side)
  • peripheral devices e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • signal e.g. commands or data
  • commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199.
  • Each of the external electronic devices 102 or 104 may be of the same or different type as the electronic device 101.
  • all or part of the operations performed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108.
  • the electronic device 101 may perform the function or service instead of executing the function or service on its own.
  • one or more external electronic devices may be requested to perform at least part of the function or service.
  • One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101.
  • the electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request.
  • cloud computing distributed computing, mobile edge computing (MEC), or client-server computing technology can be used.
  • the electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 104 may include an Internet of Things (IoT) device.
  • Server 108 may be an intelligent server using machine learning and/or neural networks.
  • the external electronic device 104 or server 108 may be included in the second network 199.
  • the electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.
  • Electronic devices may be of various types.
  • Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances.
  • Electronic devices according to embodiments of this document are not limited to the above-described devices.
  • first, second, or first or second may be used simply to distinguish one component from another, and to refer to those components in other respects (e.g., importance or order) is not limited.
  • One (e.g., first) component is said to be “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicatively.” Where mentioned, it means that any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.
  • module used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as logic, logic block, component, or circuit, for example. It can be used as A module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • Various embodiments of the present document are one or more instructions stored in a storage medium (e.g., built-in memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). It may be implemented as software (e.g., program 140) including these.
  • a processor e.g., processor 120
  • the one or more instructions may include code generated by a compiler or code that can be executed by an interpreter.
  • a storage medium that can be read by a device may be provided in the form of a non-transitory storage medium.
  • 'non-transitory' only means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves). This term refers to cases where data is stored semi-permanently in the storage medium. There is no distinction between temporary storage cases.
  • Computer program products are commodities and can be traded between sellers and buyers.
  • the computer program product may be distributed in the form of a machine-readable storage medium (e.g. compact disc read only memory (CD-ROM)) or through an application store (e.g. Play StoreTM) or on two user devices (e.g. It can be distributed (e.g. downloaded or uploaded) directly between smart phones) or online.
  • a machine-readable storage medium e.g. compact disc read only memory (CD-ROM)
  • an application store e.g. Play StoreTM
  • two user devices e.g. It can be distributed (e.g. downloaded or uploaded) directly between smart phones) or online.
  • at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.
  • each component (e.g., module or program) of the above-described components may include a single or plural entity, and some of the plurality of entities may be separately placed in other components. there is.
  • one or more of the components or operations described above may be omitted, or one or more other components or operations may be added.
  • multiple components eg, modules or programs
  • the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component of the plurality of components prior to the integration. .
  • operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, or omitted. Alternatively, one or more other operations may be added.
  • Figure 2 is a perspective view showing the front of an electronic device, according to an embodiment of the present disclosure.
  • Figure 3 is a perspective view showing the rear of an electronic device, according to an embodiment of the present disclosure.
  • FIGS. 2 and 3 may be combined with the embodiment of FIG. 1 or the embodiments of FIGS. 4 to 11 .
  • the electronic device 101 (e.g., the electronic device 101 of FIG. 1) according to an embodiment has a first side (or front) 210A and a second side (or back). It may include a housing 210 including (210B) and a side (210C) surrounding the space between the first side (210A) and the second side (210B).
  • housing 210 may refer to a structure that forms part of the first side 210A of FIG. 2, the second side 210B and the side surfaces 210C of FIG. 3. there is.
  • the first surface 210A may be formed at least in part by a substantially transparent front plate 202 (eg, a glass plate including various coating layers, or a polymer plate).
  • the second surface 210B may be formed by a substantially opaque back plate 211.
  • the back plate 211 is formed, for example, by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of these materials. It can be.
  • the side 210C is joined to the front plate 202 and the back plate 211 and may be formed by a side structure (or “side bezel structure”) 218 including metal and/or polymer.
  • the back plate 211 and the side structure 218 may be formed as a single piece and include the same material (eg, a metallic material such as aluminum).
  • the front plate 202 may include a region(s) that is curved toward the rear plate 211 at least a portion of an edge and extends seamlessly.
  • the front plate 202 (or the rear plate 211) is curved toward the rear plate 211 (or the front plate 202) to form only one of the extended areas on the first surface ( 210A) can be included on one edge.
  • the front plate 202 or the rear plate 211 may have a substantially flat shape. For example, it may not include a curved and extended area. When it includes a curved and extended area, the thickness of the electronic device 101 in the part containing the curved and extended area may be smaller than the thickness of other parts.
  • the electronic device 101 includes a display 220, an audio module 203, 207, and 214, a sensor module 204 and 219, a camera module 205, 212, and 213, and a key input device ( 217), a light emitting element 206, and connector holes 208 and 209.
  • the electronic device 101 may omit at least one of the components (eg, the key input device 217 or the light emitting device 206) or may additionally include another component.
  • Display 220 may be visually exposed, for example, through a significant portion of front plate 202 .
  • at least a portion of the display 220 may be visually exposed through the front plate 202 forming the first surface 210A or through a portion of the side surface 210C.
  • the edges of the display 220 may be formed to be substantially the same as the adjacent outer shape of the front plate 202.
  • the distance between the outer edge of the display 220 and the outer edge of the front plate 202 may be formed to be substantially the same.
  • a recess or opening is formed in a portion of the screen display area of the display 220, and an audio module 214 and a sensor are aligned with the recess or opening. It may include at least one of a module 204, a camera module 205, and a light emitting device 206. In one embodiment (not shown), an audio module 214, a sensor module 204, a camera module 205, a fingerprint sensor (not shown), and a light emitting element ( 206) may include at least one of the following.
  • the display 220 is coupled to or adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of touch, and/or a digitizer that detects a magnetic field-type stylus pen. can be placed.
  • a touch detection circuit capable of measuring the intensity (pressure) of touch
  • a digitizer that detects a magnetic field-type stylus pen.
  • at least a portion of the sensor modules 204, 219, and/or at least a portion of the key input device 217 are located in the first regions 210D and/or the second regions 210E. can be placed in the field.
  • the audio modules 203, 207, and 214 may include a microphone hole 203 and speaker holes 207 and 214.
  • a microphone for acquiring external sound may be placed inside the microphone hole 203, and in one embodiment, a plurality of microphones may be placed to detect the direction of the sound.
  • the speaker holes 207 and 214 may include an external speaker hole 207 and a receiver hole 214 for calls.
  • the speaker holes 207 and 214 and the microphone hole 203 may be implemented as one hole, or a speaker may be included without the speaker holes 207 and 214 (e.g., piezo speaker).
  • the sensor modules 204 and 219 may generate electrical signals or data values corresponding to the internal operating state of the electronic device 101 or the external environmental state.
  • Sensor modules 204, 219 may include, for example, a first sensor module 204 (e.g., a proximity sensor) and/or a second sensor module (not shown) disposed on the first side 210A of housing 210. ) (e.g., a fingerprint sensor), and/or a third sensor module 219 and/or a fourth sensor module (e.g., a fingerprint sensor) disposed on the second surface 210B of the housing 210.
  • the fingerprint sensor may be disposed on the first side 210A (eg, display 220) as well as the second side 210B or side 210C of the housing 210.
  • the electronic device 101 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor. It may include at least one more.
  • the camera modules 205, 212, and 213 include a first camera device 205 disposed on the first side 210A of the electronic device 101, and a second camera device 212 disposed on the second side 210B. ), and/or a flash 213.
  • the camera devices 205 and 212 may include one or more lenses, an image sensor, and/or an image signal processor.
  • the flash 213 may include, for example, a light emitting diode or a xenon lamp. In one embodiment, two or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and image sensors may be placed on one side of the electronic device 101.
  • the flash 213 may emit infrared rays, and the infrared rays emitted by the flash 213 and reflected by the subject may be received through the third sensor module 219.
  • the electronic device 101 or the processor of the electronic device 101 may detect depth information of the subject based on the point in time when infrared rays are received from the third sensor module 219.
  • the key input device 217 may be disposed on the side 210C of the housing 210.
  • the electronic device 101 may not include some or all of the key input devices 217 mentioned above, and the key input devices 217 not included may be other than soft keys on the display 220. It can be implemented in the form
  • the key input device may include a sensor module disposed on the second side 210B of the housing 210.
  • the light emitting device 206 may be disposed on the first side 210A of the housing 210.
  • the light emitting device 206 may provide status information of the electronic device 101 in the form of light.
  • the light emitting device 206 may provide a light source that is linked to the operation of the camera module 205, for example.
  • the light emitting device 206 may include, for example, an LED, an IR LED, and a xenon lamp.
  • the connector holes 208 and 209 are a first connector hole 208 that can accommodate a connector (for example, a USB connector) for transmitting and receiving power and/or data with an external electronic device, and/or an external electronic device. and a second connector hole (eg, earphone jack) 209 that can accommodate a connector for transmitting and receiving audio signals.
  • a connector for example, a USB connector
  • a second connector hole eg, earphone jack
  • Figure 4 is an exploded perspective view showing the front of an electronic device according to an embodiment of the present disclosure.
  • Figure 5 is an exploded perspective view showing the back of an electronic device, according to an embodiment of the present disclosure.
  • FIGS. 4 to 5 may be combined with the embodiments of FIGS. 1 to 3 or the embodiments of FIGS. 6 to 11 .
  • the electronic device 101 (e.g., the electronic device 101 of FIG. 1 or 2) includes a side structure 310, a first support member 311 (e.g., a bracket), A front plate 320 (e.g., front plate 202 in FIG. 1), a display 330 (e.g., display 220 in FIG. 1), and at least one printed circuit board (or substrate assembly) 340a, 340b. , it may include a battery 350, a second support member 360 (e.g., rear case), an antenna, a camera assembly 307, and a back plate 380 (e.g., back plate 211 in FIG. 2). .
  • a first support member 311 e.g., a bracket
  • a front plate 320 e.g., front plate 202 in FIG. 1
  • a display 330 e.g., display 220 in FIG. 1
  • at least one printed circuit board (or substrate assembly) 340a, 340b it may include a battery 350, a second support
  • the electronic device 101 can electrically connect different printed circuit boards by including at least one flexible printed circuit board 340c.
  • the printed circuit boards 340a and 340b may include a first circuit board 340a disposed above and a second circuit board 340b disposed below the battery 350, and may include flexible printing.
  • the circuit board 340c may electrically connect the first circuit board 340a and the second circuit board 340b.
  • the electronic device 101 may omit at least one of the components (e.g., the first support member 311 or the second support member 360) or may additionally include another component. there is. At least one of the components of the electronic device 101 may be the same or similar to at least one of the components of the electronic device 101 of FIG. 1 or 2, and overlapping descriptions will be omitted below.
  • Printed circuit boards 340a and 340b may be equipped with a processor, memory, and/or interface.
  • the processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.
  • the first support member 311 and the side structure 310 may be combined and referred to as a front case or housing 301.
  • the housing 301 may be generally understood as a structure for accommodating, protecting, or disposing the printed circuit boards 340a and 340b or the battery 350.
  • the housing 301 includes a structure that can be visually or tactilely recognized by the user on the exterior of the electronic device 101, for example, a side structure 310, a front plate 320, and/or It may be understood as including a rear plate 380.
  • 'the front or back of the housing 301' may refer to the first side 210A of FIG. 1 or the second side 210B of FIG. 2.
  • the first support member 311 includes a front plate 320 (e.g., first side 210A in FIG. 1) and a back plate 380 (e.g., second side 210B in FIG. 2). It is disposed between them and may function as a structure for arranging electrical/electronic components such as printed circuit boards 340a and 340b or the camera assembly 307.
  • Memory may include, for example, volatile memory or non-volatile memory.
  • the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • the interface may electrically or physically connect the electronic device 101 to an external electronic device and may include a USB connector, SD card/MMC connector, or audio connector.
  • Circuit devices e.g., processors, communication modules, or memory
  • various electrical/electronic components implemented in the form of integrated circuit chips may be disposed on the printed circuit boards 340a and 340b.
  • the printed circuit boards 340a , 340b) may receive an electromagnetic shielding environment from the second support member 360.
  • the lower support member 360b may be utilized as a structure that can place electrical/electronic components such as a speaker module and an interface (e.g., USB connector, SD card/MMC connector, or audio connector).
  • electrical/electronic components such as speaker modules and interfaces (eg, USB connectors, SD card/MMC connectors, or audio connectors) may be placed on additional printed circuit boards, not shown.
  • the lower support member 360b may be arranged to surround an additional printed circuit board together with another portion of the first support member 311.
  • a speaker module or interface disposed on an additional printed circuit board or lower support member 360b may be disposed correspondingly to the audio module 207 or the connector holes 208 and 309 of FIG. 1 .
  • the battery 350 is a device for supplying power to at least one component of the electronic device 101 and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. . At least a portion of the battery 350 may be disposed, for example, on substantially the same plane as the printed circuit boards 340a and 340b. The battery 350 may be placed integrally within the electronic device 101, or may be placed to be detachable from the electronic device 101.
  • the antenna may include a conductor pattern implemented on the surface of the second support member 360 through, for example, a laser direct structuring method.
  • the antenna may include a printed circuit pattern formed on the surface of the thin film, and the antenna in the form of a thin film may be disposed between the rear plate 380 and the battery 350.
  • Antennas may include, for example, near field communication (NFC) antennas, wireless charging antennas, and/or magnetic secure transmission (MST) antennas.
  • NFC near field communication
  • MST magnetic secure transmission
  • the antenna can perform short-distance communication with an external device or wirelessly transmit and receive power required for charging.
  • another antenna structure may be formed by part or a combination of the side structure 310 and/or the first support member 311.
  • the camera assembly may include at least one camera module. Inside electronic device 101, camera assembly 307 (or at least one camera module) may receive at least a portion of light incident through an optical hole or camera window. In one embodiment, camera assembly 307 may be disposed on first support member 311 at a location adjacent printed circuit boards 340a and 340b. In one embodiment, the camera module(s) of camera assembly 307 may be generally aligned with any one of the camera windows, at least partially with second support member 360 (e.g., upper support member 360a). can be wrapped in
  • Figure 6 is an exploded perspective view of an electronic device including a waterproof structure, according to an embodiment of the present disclosure.
  • FIG. 7 is a plan view of an electronic device according to an embodiment of the present disclosure.
  • FIGS. 6 to 7 may be combined with the embodiments of FIGS. 1 to 5 or the embodiments of FIGS. 7 to 11 .
  • the electronic device 101 (e.g., the electronic device 101 of FIGS. 1 to 5) includes a housing 401 including a side structure 410 or a first support member 411. ), a first adhesive member 440, a receiving member 450, and a bonding member 460.
  • the configuration of the housing 401, the side structure 410, or the first support member 411 of FIGS. 6 to 7 is similar to that of the housing 301, the side structure 310, or the first support member of FIGS. 4 to 5. It may be partially or entirely the same as the configuration of member 311.
  • the housing 401 may include a side structure 410 or a first support member 411 connected to the side structure 410 .
  • the side structure 410 may form the side (eg, side 210C of FIGS. 2 and 3 ) of the electronic device 101 (or housing 401).
  • the first support member 411 may have a substantially flat shape and may be made of a metallic material and/or a non-metallic (eg, polymer) material.
  • the side structure 410 may include a first side 410a, a second side 410b, or a third side 410c.
  • the first side 410a may be defined and interpreted as a side wall extending in the width direction of the electronic device 101 (eg, the X-axis direction in FIG. 6).
  • the second side 410b may extend from one end of the first side 410a (e.g., the end facing the -X direction in FIG. 6) and is disposed in a direction substantially perpendicular to the first side 410a. It can be.
  • the third side 410c may extend from the other end of the first side 410a (e.g., the end facing the +X direction in FIG.
  • the side structure 410 is connected to the second side 410b and the third side 410c and may further include a fourth side disposed substantially parallel to the first side 410a. .
  • the first support member 411 may have a flat plate shape connected to the first side 410a, the second side 410b, the third side 410c, and the fourth side.
  • one surface of the first support member 411 e.g., the surface facing the +Z direction in FIG. 6
  • a display of the electronic device 101 e.g., the display 230 in FIGS. 4 and 5).
  • the first adhesive member 440 may adhere a display (eg, the display 430 of FIG. 8C) to at least a portion of the first support member 411.
  • the first adhesive member 440 may include double-sided tape.
  • first adhesive member 440 may be disposed on an edge area 403 of the first support member 411 adjacent to the second side 410b.
  • an additional first adhesive member may be disposed at an edge area of the first support member 411 adjacent to the third side 410c.
  • first adhesive member 440 disposed on the edge area 403 adjacent to the second side 410b will be described as an example, but the description will be made on the edge adjacent to the third side 410c. The same may be applied and understood to the first adhesive member disposed in the area.
  • the first adhesive member 440 may extend along the second side 410b. Additionally, the first adhesive member 440 may adhere a display (eg, the display 430 of FIG. 8C) to the first support member 411.
  • a display eg, the display 430 of FIG. 8C
  • the first adhesive member 440 is attached to the outside of the electronic device 101 through a gap between the second side 410b and the display (e.g., the display 430 in FIG. 8C). It can block foreign substances from entering.
  • the first adhesive member 440 may provide a waterproof structure.
  • the receiving member 450 together with the bonding member 460, includes a housing 401 and a front plate (e.g., the front plate 302 in FIGS. 4 and 5 or the cover window 420 in FIG. 8C). )) It is possible to block external foreign substances from entering the electronic device 101 through the gap.
  • a front plate e.g., the front plate 302 in FIGS. 4 and 5 or the cover window 420 in FIG. 8C.
  • the receiving member 450 may include a porous sponge member or a mesh member to accommodate the bonding member 460. Additionally, the receiving member 450 is not limited to this and may include various materials or members for accommodating the bonding member 460. According to one embodiment, the receiving member 450 may be a tape formed in a lattice pattern.
  • the receiving member 450 is located in a corner area 402 (corner) of the first support member 411 adjacent to the corner where the first side 410a and the second side 410b are connected. area).
  • an additional receiving member may be disposed in a corner area of the first support member 411 adjacent to the corner where the first side 410a and the third side 410c are connected.
  • the receiving member 450 disposed in the corner area 402 of the first support member 411 adjacent to the corner where the first side 410a and the second side 410b are connected is taken as an example. However, this description can be equally applied and understood to the receiving member disposed in the corner area of the first support member 411 adjacent to the corner where the first side 410a and the third side 410c are connected. there is.
  • the receiving member 450 may be disposed on the first support member 411 in the corner area 402 of the housing 401.
  • the receiving member 450 may be attached to at least a portion of the first support member 411 through a second adhesive member (eg, the second adhesive member 470 in FIG. 8C).
  • the receiving member 450 may accommodate the first bonding area (eg, the first bonding area 461 in FIG. 8C) of the bonding member 460.
  • the first bonding area may be defined as where the receiving member 450 is applied.
  • the bonding member 460 prevents foreign substances from outside the electronic device 101 from entering the electronic device 101 through a gap between the housing 401 and the cover window (e.g., the cover window 420 in FIG. 8C). Inflow can be blocked.
  • the bonding member 460 may include a bond applied (or filled) to an area of the first support member 411 adjacent to the first side 410a. According to one embodiment, the bonding member 460 may be applied to at least a portion of the first support member 411 along the first side 410a. For example, the bonding member 460 may bond the first support member 411 and the cover window. Additionally, the bonding member 460 can seal the gap between the first support member 411 and the cover window.
  • At least a portion of the bonding member 460 (e.g., the first bonding area 461 in FIG. 7) is accommodated in the receiving member 450 and is stored in the housing 401 together with the receiving member 450.
  • a waterproof structure in the corner area 402 can be provided.
  • the first support member 411 may include a non-metallic portion 411a and a metallic portion 411b.
  • the non-metallic portion 411a may be formed of a polymer material
  • the metallic portion 411b may be formed of aluminum, stainless steel (STS), or magnesium material, but are not limited thereto.
  • the receiving member 450 may be inserted into at least a portion of the first support member 411. According to the illustrated embodiment, the receiving member 450 may be inserted into at least one portion of the non-metallic portion 411a. Although not shown, the receiving member 450 may be inserted into at least one part of the metal portion 411b.
  • the bonding member 460 may include a first bonding area 461, a second bonding area 462, or a third bonding area 463.
  • the first bonding area 461 may be a bond configured to be applied (or filled) to the receiving member 450.
  • the first bonding area 461 may be accommodated in the receiving member 450 to bond the receiving member 450 and the cover window (eg, the cover window 420 in FIG. 8C).
  • the second bonding area 462 may be a bond configured to be applied to the first support member 411.
  • the second bonding area 462 may be applied to a portion of the first support member 411 adjacent to the first side 410a and may be applied long along the first side 410a.
  • the second bonding area 462 may bond the first support member 411 and the cover window (eg, the cover window 420 in FIG. 8C). According to one embodiment, the second bonding area 462 seals the space between the first support member 411 and the cover window, thereby preventing external foreign substances from entering through the gap between the first side 410a and the cover window. can be blocked.
  • the third bonding area 463 may be configured to connect the first bonding area 461 and the second bonding area 462.
  • the third bonding area 463 may bond the first support member 411 and the cover window.
  • connection structure of the first bonding area 461, the third bonding area 463, and the second bonding area 462 may have a ring shape or a bent shape, but is not limited thereto.
  • 8A to 8C are cross-sectional views of an electronic device according to an embodiment of the present disclosure.
  • FIGS. 8A to 8C are cross-sectional views taken along line A-A' of FIG. 2, and are diagrams for explaining a process of combining a receiving member and a bonding member.
  • FIGS. 8A to 8C may be combined with the embodiments of FIGS. 1 to 7 or the embodiments of FIGS. 9A to 11 .
  • the electronic device 101 (e.g., the electronic device 101 of FIGS. 1 to 7) includes a housing 401, a side structure 410, a first support member 411, It may include a display 430, a first adhesive member 440, a receiving member 450, or a second adhesive member 470.
  • the configuration of the housing 401, the side structure 410, the first support member 411, the first adhesive member 440, or the receiving member 450 in FIGS. 8A to 8C is similar to that of the housing in FIGS. 6 to 7. Some or all of the configurations of 401, the side structure 410, the first support member 411, the first adhesive member 440, or the receiving member 450 may be the same.
  • the configuration of the display 430 of FIGS. 8A to 8C may be partially or entirely the same as the configuration of the display 230 of FIGS. 4 to 5 .
  • the display 430 may be placed on the first support member 411. According to one embodiment, the display 430 may be adhered to the first support member 411 through the first adhesive member 440.
  • the display 430 is shown as disposed on a non-metallic portion 411a (e.g., non-metallic portion 411a in FIG. 7), but the display 430 is disposed on a metallic portion 411b (e.g. : It may be placed on the metal part 411b in FIG. 7.
  • the electronic device 101 may further include a second adhesive member 470.
  • the second adhesive member 470 may be a double-sided tape for fixing the receiving member 450 to the first support member 411.
  • the second adhesive member 470 may be inserted into a recess (eg, recess 412 in FIG. 9A) recessed in the first support member 411.
  • a bond may be applied to at least a portion of the first support member 411 and the receiving member 450.
  • the applied bond is the first bond portion 4611 applied to the receiving member 450, and the first side 410a of the first support member 411 (e.g., the first side 410a in FIG. 7). It may include a second bond portion 4621 applied to a portion adjacent to the side surface 410a).
  • the first bond part 4611 and the second bond part 4621 may be applied separately, and in contrast, as shown in FIG. 7, the third bonding area (e.g., the third bonding area in FIG. 7 3 It may be applied integrally with the third bond portion (not shown) forming the bonding area 463).
  • the third bonding area e.g., the third bonding area in FIG. 7 3 It may be applied integrally with the third bond portion (not shown) forming the bonding area 463).
  • the first bond portion 4611 when the first bond portion 4611 is applied to the receiving member 450, the first bond portion 4611 may be overly applied to the receiving member 450.
  • the first bond portion 4611 may penetrate into the interior of the receiving member 450 and fill the receiving member 450 (4611a). Additionally, the receiving member 450 may be defined as absorbing the first bond portion 4611.
  • the cover window 420 in a state in which the first bond portion 4611 is sufficiently filled (or accommodated) in the receiving member 450, the cover window 420 (e.g., the front surface of FIGS. 4 and 5) as shown in FIG. 8C Plate 420) may be coupled to the display 430 and the first support member 411.
  • the cover window 420 may be laminated on the display 430 and configured to cover the outer surface of the display 430 (eg, the surface facing the +Z direction in FIG. 8C). The cover window 420 may be pressed and coupled to the display 430 and the first support member 411 .
  • the second bond portion 4612 couples the first support member 411 and the cover window 420 and forms a second bond portion 4612.
  • a bonding area 462 (eg, the second bonding area 462 in FIG. 7) may be formed.
  • the first bond portion 4611 may couple the receiving member 450 and the cover window 420 and form a first bonding area 461 (e.g., the first bonding area 461 in FIG. 7). .
  • the first bond portion 4611 when the first bond portion 4611 is overly applied to the receiving member 450 as shown in FIG. 8B and the cover window 420 is pressed and coupled as shown in FIG. 8C, it is attached to the receiving member 450.
  • the received first bond portion 4611 may be pushed out from the receiving member 450.
  • the first bond portion pushed out from the receiving member 450 fills the space between the first support member 411 and the receiving member 450, or between the display 430 and the second adhesive member 470 and the receiving member. (450) can be filled in.
  • the first bonding area 461 includes a first part 461a that couples the cover window 420 and the receiving member 450, the first support member 411, and the receiving member 450.
  • the second part 461b for coupling, the third part 461c for coupling the display 430 and the second adhesive member 470 with the receiving member 450, or the fourth part 461d accommodated in the receiving member 450. ) may include.
  • the first bonding area 461 is a corner area of the housing 401 together with the second bonding area 462 and the third bonding area (e.g., the third bonding area 463 in FIG. 7).
  • a waterproof structure in the shape of a closed loop with one side open can be formed in the corner area 402 of FIG. 6 (e.g., the corner area 402 in FIG. 6).
  • the bonding member 460 may provide a waterproof structure in the corner area (eg, corner area 402 in FIG. 6).
  • the space between the first support member 411 adjacent to the first side 410a and the cover window 420 may be sealed by the second bonding area 462 and the first bonding area 461.
  • a third bonding area e.g., the second side 410b in FIGS. 6 and 7) is formed between the first support member 411 adjacent to the second side (e.g., the second side 410b in FIGS. 6 and 7) and the cover window 420. It can be sealed by 3 bonding area 463).
  • the first bonding area 461 may be filled between the first adhesive member 440 and the display 430 and the first support member 411 through the receiving member 450. Accordingly, the stepped portion (H) formed in the first support member 411 to accommodate the display 430 may be sealed by the receiving member 450 and the first bonding area 461.
  • FIGS 9A to 9C are perspective views of an electronic device according to an embodiment of the present disclosure.
  • FIGS. 9A to 9C may be combined with the embodiments of FIGS. 1 to 8C or the embodiments of FIGS. 10A to 11 .
  • the electronic device 101 (e.g., the electronic device 101 of FIGS. 1 to 8C) includes a first support member ( 411), a second adhesive member 470, or a receiving member 450.
  • the non-metallic portion 411a, the metallic portion 411b, the first support member 411, the second adhesive member 470, or the receiving member 450 in FIGS. 9A to 9C are the non-metallic portions in FIGS. 6 to 8C. Some or all of the configurations of 411a, metal part 411b, first support member 411, second adhesive member 470, or receiving member 450 may be the same.
  • the first support member 411 may further include a recess 412 recessed in at least a portion of the first support member 411 .
  • the recess 412 may be formed in a corner area (eg, corner area 402 in FIG. 6) of the first support member 411.
  • the recess 412 may have a shape corresponding to that of the second adhesive member 470, but is not limited thereto.
  • a second adhesive member 470 may be inserted into the recess 412 .
  • the second adhesive member 470 may be adhered to the recess 412 .
  • the receiving member 450 may be coupled to the second adhesive member 470 adhered to the recess 412.
  • the receiving member 450 may be adhered to the second adhesive member 470 inserted into the recess 412 .
  • 10A to 10B are plan views showing partial areas of an electronic device according to an embodiment of the present disclosure.
  • Figure 11 is a perspective view of a receiving member, according to one embodiment of the present disclosure.
  • FIGS. 10A to 11 may be combined with the embodiments of FIGS. 1 to 9C.
  • the electronic device 101 (e.g., the electronic device 101 of FIGS. 1 to 8C) includes a housing 401 including a side structure 410 and a first support member 411. ), a receiving member 550, or a bonding member 560.
  • the configuration of the housing 401, the side structure 410, the first support member 411, the housing 401, the receiving member 550, or the bonding member 560 of FIGS. 10A to 11 is similar to that of FIGS. 6 to 11. Some or all of the configuration of the housing 401, side structure 410, first support member 411, receiving member 450, or bonding member 460 may be the same as that of 8c.
  • the side structure 410 is a first side 410a (e.g., the first side 410a of FIGS. 6 to 7), or a second side 410b (e.g., FIG. It may include the second side 410b of FIGS. 6 to 7).
  • the first support member 411 has a non-metallic portion 411a (e.g., non-metallic portion 411a in FIG. 7), a metallic portion 411b (e.g., metallic portion 411b in FIG. 7), or a recess (e.g. : May include the recess 412 in FIG. 9A).
  • the receiving member 550 may be inserted into the recess 412.
  • the receiving member 550 may include a tape made of Gore-Tex or a joint tape configured to be adhered to the recess 412.
  • the receiving member 550 includes a plurality of first extension portions 551 extending in a first direction (e.g., Y-axis direction of FIGS. 10A to 10B), and It may include a plurality of second extension portions 552 extending in a second direction (eg, the X-axis direction of FIGS. 10A to 10B).
  • first direction e.g., Y-axis direction of FIGS. 10A to 10B
  • second extension portions 552 extending in a second direction (eg, the X-axis direction of FIGS. 10A to 10B).
  • the plurality of first extension parts 551 may be spaced apart from each other and arranged in parallel. Additionally, the plurality of second extension portions 552 may be spaced apart from each other and arranged in parallel.
  • the receiving member 550 may have a plurality of first extension parts 551 and a plurality of second extension parts 552 crossing each other to form a lattice pattern.
  • the bonding member 560 includes a first bonding area 561 (e.g., the first bonding area 461 in FIG. 7) and a second bonding area 562 (e.g., the second bonding area 562 in FIG. 7). It may include a bonding area 462), or a third bonding area 563 (eg, the third bonding area 463 in FIG. 7).
  • the first bonding area 561 may be a bond overly applied to the receiving member 550 adhered to the recess 412 .
  • the first bonding area 561 couples the cover window (e.g., the cover window 420 of FIG. 8C) and the receiving member 550, as described with FIG. 8C as an example, or 1
  • the support member 411 and the receiving member 550 may be combined, or the display (eg, display 430 in FIG. 8C) and the first adhesive member 440 and the receiving member 550 may be combined.
  • the first bonding area 561 may provide a waterproof structure to the corner area of the housing 401 (eg, the corner area 402 in FIG. 6).
  • Electronic devices may include electrical components with various functions and a housing to support a display.
  • the display may be disposed on one side of the housing, and a cover window may be disposed on the outer surface of the display to cover (or protect) the display.
  • electronic devices may include a waterproof structure to prevent or reduce external liquids or foreign substances from entering the electronic device.
  • an electronic device in which durability of the housing is secured and a waterproof structure is implemented between the housing and the cover window.
  • Electronic devices can even implement a waterproof function through an adhesive structure of the housing, cover window, and display.
  • an electronic device e.g., electronic device 101 in FIGS. 6 to 8C
  • a housing e.g., housing 401 in FIGS. 6 to 8C
  • a display e.g., FIG. 6 to 8C
  • a cover window e.g., cover window 420 in FIG. 8C
  • a receiving member e.g., accommodating member 450 in FIGS. 6 to 8C
  • a bonding member e.g., FIG. It may include the bonding member 460 of FIGS. 6 to 8C.
  • the display may be placed on the housing.
  • the cover window may be laminated on the display.
  • the cover window may be configured to cover the outer surface of the display.
  • the receiving member may be disposed between the housing and the cover window.
  • the bonding member may be filled in the receiving member.
  • the bonding member may bond the cover window and the housing.
  • the bonding member is a first bonding area (e.g., the first bonding area 461 in FIGS. 7 to 8C), or a second bonding area (e.g., the second bonding area in FIGS. 7 to 8C). Area 462) may be included.
  • the first bonding area may bond the cover window and the housing.
  • the second bonding area may bond the housing and the cover window.
  • the bonding member may further include a third bonding area (eg, the third bonding area 463 in FIGS. 7 to 8C).
  • the third bonding area may connect the first bonding area and the second bonding area.
  • the first bonding area, the second bonding area, and the third bonding area may be arranged in a loop shape with one side open in the corner area 402 of the housing.
  • the first bonding area is a first part (e.g., the first part 461a in FIG. 8C), a second part (e.g., the second part 461b in FIG. 8C), or a third part. It may include a portion (e.g., the third portion 461c in FIG. 8C).
  • the first part may adhere the cover window and the receiving member.
  • the second part may adhere the housing and the receiving member.
  • the third part may adhere the display and the receiving member.
  • the housing includes a first support member (e.g., the first support member 411 in FIGS. 6 to 8C), or a side structure (e.g., the side structure 410 in FIGS. 6 to 8C).
  • the first support member may have a flat shape.
  • the side structure may be connected to the first support member.
  • the side structure may form a side surface of the electronic device.
  • the receiving member may be coupled to the first support member.
  • the receiving member may be coupled to a portion of the first support member adjacent to the side structure.
  • the receiving member may be coupled to the first support member at a portion adjacent to a corner area formed by the side structure (eg, corner area 402 in FIG. 6).
  • the receiving member may include at least one of a porous sponge member or a porous mesh member.
  • the receiving member (eg, the receiving member 550 of FIGS. 10A to 11 ) may include a tape member formed in a grid pattern.
  • the electronic device may further include a first adhesive member (eg, the first adhesive member 440 of FIGS. 6 to 8C) that adheres the display to the housing.
  • a first adhesive member eg, the first adhesive member 440 of FIGS. 6 to 8C
  • At least a portion of the bonding member may adhere the first adhesive member and the receiving member.
  • At least a portion of the bonding member may couple the display and the receiving member.
  • the electronic device may further include a second adhesive member (eg, the second adhesive member 470 of FIGS. 8A to 8C) that secures the receiving member to the housing.
  • a second adhesive member eg, the second adhesive member 470 of FIGS. 8A to 8C
  • the housing may include a recess (eg, recess 412 in FIG. 9A) recessed in at least one portion.
  • the second adhesive member may be disposed in the recess.
  • the bonding member may be configured to block external foreign substances from entering the electronic device through a gap between the cover window and the housing.
  • an electronic device e.g., electronic device 101 in FIGS. 6 to 8C
  • a housing e.g., housing 401 in FIGS. 6 to 8C
  • a display e.g., FIG. 6 to 8C
  • a cover window e.g., cover window 420 in FIG. 8C
  • a receiving member e.g., accommodating member 450 in FIGS. 6 to 8C
  • a bonding member e.g., FIG. It may include the bonding member 460 of FIGS. 6 to 8C.
  • the housing may include a side structure (eg, the side structure 410 in FIGS. 6 to 8C) or a first support member (eg, the first support member 411 in FIGS.
  • the display may be disposed on the first support member.
  • the cover window may be laminated on the display.
  • the cover window may be configured to cover the outer surface of the display.
  • the receiving member may be disposed between the housing and the cover window.
  • the bonding member may be filled in the receiving member.
  • the bonding member may bond the cover window and the housing.
  • the bonding member includes a first bonding area (e.g., first bonding area 461 in FIGS. 7 to 8C) or a second bonding area (e.g., second bonding area 462 in FIGS. 7 to 8C). It can be included.
  • the first bonding area may bond the cover window and the receiving member.
  • the second bonding area may bond the cover window and the first support member.
  • the receiving member may include at least one of a porous sponge member or a porous mesh member.
  • the receiving member (eg, the receiving member 550 of FIGS. 10A to 11 ) may include a tape member formed in a grid pattern.
  • the receiving member includes a plurality of first extension parts (e.g., the first extension parts 551 in FIGS. 10A to 11), or a plurality of second extension parts (e.g., the first extension parts 551 in FIGS. 10A to 11). It may include second extension portions 552 of 11).
  • the plurality of first extension parts may extend in a first direction.
  • the plurality of second extension parts may extend in a second direction that is different from the first direction.
  • the plurality of second extension parts may intersect with the plurality of first extension parts to form the grid pattern.
  • the first bonding area may be a bond overly applied to the receiving member.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Signal Processing (AREA)
  • Telephone Set Structure (AREA)

Abstract

Selon un mode de réalisation divulgué ici, un dispositif électronique peut comprendre : un boîtier ; un affichage disposé sur le boîtier ; une fenêtre de couvercle stratifiée sur l'affichage et configurée pour recouvrir la surface externe de l'affichage ; un élément de réception disposé entre le boîtier et la fenêtre de couvercle ; et un élément de liaison rempli dans l'élément de réception et liant la fenêtre de couvercle et le boîtier. Divers autres modes de réalisation sont possibles.
PCT/KR2023/015596 2022-10-31 2023-10-11 Structure étanche à l'eau et dispositif électronique la comprenant Ceased WO2024096362A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20220142271 2022-10-31
KR10-2022-0142271 2022-10-31
KR10-2022-0149749 2022-11-10
KR1020220149749A KR20240061520A (ko) 2022-10-31 2022-11-10 방수 구조 및 이를 포함하는 전자 장치

Publications (1)

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WO2024096362A1 true WO2024096362A1 (fr) 2024-05-10

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013524331A (ja) * 2010-03-31 2013-06-17 ヴァレオ システム テルミク ヒューマンマシンインタフェース
KR20160063677A (ko) * 2014-11-27 2016-06-07 엘지전자 주식회사 이동 단말기
JP2016139318A (ja) * 2015-01-28 2016-08-04 アルパイン株式会社 表示装置
KR20210018584A (ko) * 2019-08-05 2021-02-18 삼성전자주식회사 하우징 구조물을 포함하는 전자 장치
KR20210069596A (ko) * 2019-12-03 2021-06-11 애플 인크. 핸드헬드 전자 디바이스

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013524331A (ja) * 2010-03-31 2013-06-17 ヴァレオ システム テルミク ヒューマンマシンインタフェース
KR20160063677A (ko) * 2014-11-27 2016-06-07 엘지전자 주식회사 이동 단말기
JP2016139318A (ja) * 2015-01-28 2016-08-04 アルパイン株式会社 表示装置
KR20210018584A (ko) * 2019-08-05 2021-02-18 삼성전자주식회사 하우징 구조물을 포함하는 전자 장치
KR20210069596A (ko) * 2019-12-03 2021-06-11 애플 인크. 핸드헬드 전자 디바이스

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