WO2024051393A1 - Audio circuit, circuit board and electronic device - Google Patents

Abstract

Embodiments of the present application disclose an audio circuit, a circuit board and an electronic device. The audio circuit comprises a primary chip which is used for decoding audio information to obtain digital audio information; an audio chip which is connected to the primary chip and used for carrying out digital-to-analog conversion on the digital audio information to obtain analog audio information, amplifying the analog audio information to obtain driving information, and outputting the driving information to a loudspeaker; a first grounding terminal which is connected to the grounding terminal of the primary chip; and a second grounding terminal which is connected to the grounding terminal of the audio chip. The first grounding terminal and the second grounding terminal are isolated from each other.

Description

Audio circuits, circuit boards and electronic equipment

This application claims priority to the Chinese patent application filed with the China Patent Office on September 5, 2022, with the application number 202211080573.0 and the application name "Audio Circuits, Circuit Boards and Electronic Equipment", the entire content of which is incorporated into this application by reference. middle.

Technical field

The present application relates to the field of electronic technology, and in particular to an audio circuit, a circuit board and an electronic device.

Background technique

With the improvement of the quality of life, people's use of various electronic devices to play audio has become an indispensable part of daily life, and people's requirements for the sound quality of audio played by electronic devices are also getting higher and higher. Currently, electronic devices The functions of equipment are becoming more and more abundant, and there are more and more corresponding functional circuits, such as display circuits, radio frequency circuits, touch circuits, camera circuits, charging circuits, etc.

technical problem

However, other functional circuits are prone to noise interference on the audio circuit, and the noise is perceived by the user, thereby reducing the user's audio experience.

Technical solutions

Embodiments of the present application provide an audio circuit, a circuit board and an electronic device, which can reduce noise interference to the audio circuit and improve the user's audio experience.

In a first aspect, embodiments of the present application provide an audio circuit, including:

The main chip is used to decode audio information to obtain digital audio information;

An audio chip, connected to the main chip, is used to perform digital-to-analog conversion on the digital audio information to obtain analog audio information, amplify the analog audio information to obtain driving information, and output the driving information to speaker;

The first ground terminal is connected to the ground terminal of the main chip;

The second ground terminal is connected to the ground terminal of the audio chip, and the first ground terminal and the second ground terminal are arranged in isolation.

Optionally, the main chip also includes a first power supply terminal for receiving the first operating voltage;

The audio chip also includes a second power supply terminal for receiving a second operating voltage.

Optionally, the audio circuit also includes:

A power management chip includes a first power output terminal and a second power output terminal. The first power output terminal is connected to the first power supply terminal, and the second power output terminal is connected to the second power supply terminal. The first working voltage output by the first power supply output terminal is different from the second working voltage output by the second power supply output terminal.

Optionally, the audio chip includes:

A digital-to-analog conversion module, used to perform digital-to-analog conversion on the digital audio information to obtain analog audio information;

An audio power amplifier module is used to amplify the analog audio information to obtain driving information.

In a second aspect, embodiments of the present application provide a circuit board, including:

a circuit area, where an audio circuit is provided;

The signal wiring area includes first signal wiring and second signal wiring spaced apart from each other. The first signal wiring and the second signal wiring are electrically connected to the audio chip of the audio circuit respectively, for transmit the driver information;

Wherein, a first ground wire is provided between the first signal wire and the second signal wire, and the first ground wire is electrically connected to the second ground terminal of the audio circuit.

Optionally, the audio circuit includes:

The main chip is used to decode audio information to obtain digital audio information;

An audio chip, connected to the main chip, is used to perform digital-to-analog conversion on the digital audio information to obtain analog audio information, amplify the analog audio information to obtain driving information, and output the driving information to speaker;

The first ground terminal is connected to the ground terminal of the main chip;

The second ground terminal is connected to the ground terminal of the audio chip, the first ground terminal and the Second ground terminal isolation setting.

Optionally, the main chip also includes a first power supply terminal for receiving the first operating voltage;

The audio chip also includes a second power supply terminal for receiving a second operating voltage.

Optionally, the audio circuit also includes:

A power management chip includes a first power output terminal and a second power output terminal. The first power output terminal is connected to the first power supply terminal, and the second power output terminal is connected to the second power supply terminal. The first working voltage output by the first power supply output terminal is different from the second working voltage output by the second power supply output terminal.

Optionally, the audio chip includes:

A digital-to-analog conversion module, used to perform digital-to-analog conversion on the digital audio information to obtain analog audio information;

An audio power amplifier module is used to amplify the analog audio information to obtain driving information.

Optionally, the signal routing area also includes:

The fourth ground trace is arranged on the same layer as the first ground trace and is spaced apart from each other. The fourth ground trace is arranged on the side of the first signal trace away from the first ground trace. A fourth ground trace is connected to the first ground terminal;

The fifth ground trace is arranged on the same layer as the first ground trace and is spaced apart from each other. The fifth ground trace is arranged on the side of the second signal trace away from the first ground trace. The fifth ground trace is connected to the first ground terminal.

Optionally, the circuit board further includes a first shielding protective layer disposed on one side of the signal wiring area, including a second grounding line, and the second grounding line is located in front of the signal wiring area. The projection covers the first signal trace, the first ground trace and the second signal trace, and the second ground trace is connected to the second ground terminal.

Optionally, the circuit board further includes a second shielding protective layer disposed on the other side of the signal wiring area, including a third grounding line, and the third grounding line is on the signal wiring area. The orthographic projection covers the first signal trace, the first ground trace and the second signal trace, and the third ground trace is connected to the second ground terminal.

Optionally, the first shielding protection layer also includes a sixth ground trace and a seventh ground trace, and the sixth ground trace and the seventh ground trace are on the same layer as the second ground trace. Arranged and spaced apart from each other, the sixth ground trace and the seventh ground trace are respectively disposed on both sides of the second ground trace.

Optionally, the second shielding protection layer also includes an eighth ground trace and a ninth ground trace, and the eighth ground trace and the ninth ground trace are on the same layer as the third ground trace. Arranged and spaced apart from each other, the eighth ground trace and the ninth ground trace are respectively disposed on both sides of the third ground trace.

Optionally, the circuit board also includes:

a first grounding area, the first grounding terminal is connected to the first grounding area;

a second grounding area, the second grounding terminal is connected to the second grounding area;

A main grounding area, the first grounding area and the second grounding area are respectively connected to the main grounding area, and the main grounding area is larger than the first grounding area and the second grounding area.

In a third aspect, embodiments of the present application provide an electronic device, including:

A circuit board, the circuit board includes a circuit area and a signal wiring area; an audio circuit is provided on the circuit area;

The audio circuit includes:

The main chip is used to decode audio information to obtain digital audio information;

An audio chip, connected to the main chip, is used to perform digital-to-analog conversion on the digital audio information to obtain analog audio information, amplify the analog audio information to obtain driving information, and output the driving information to speaker;

The first ground terminal is connected to the ground terminal of the main chip;

A second ground terminal is connected to the ground terminal of the audio chip, and the first ground terminal and the second ground terminal are arranged in isolation;

A speaker, the speaker is electrically connected to the audio chip of the circuit board.

Optionally, the second ground terminal is also used for electrical connection with the speaker.

Optionally, the signal wiring area includes first signal wiring and second signal wiring that are spaced apart from each other. The first signal wiring and the second signal wiring are respectively connected to the audio chip of the audio circuit. Electrical connection for transmitting the driving information;

Wherein, a first ground wire is provided between the first signal wire and the second signal wire, and the first ground wire is electrically connected to the second ground terminal of the audio circuit.

Optionally, the main chip also includes a first power supply terminal for receiving the first operating voltage;

The audio chip also includes a second power supply terminal for receiving a second operating voltage.

Optionally, the audio circuit also includes:

A power management chip includes a first power output terminal and a second power output terminal. The first power output terminal is connected to the first power supply terminal, and the second power output terminal is connected to the second power supply terminal. The first working voltage output by the first power supply output terminal is different from the second working voltage output by the second power supply output terminal.

beneficial effects

In the embodiment of this application, the ground terminal of the main chip is connected to the first ground terminal, and the ground terminal of the audio chip is connected to the second ground terminal. The first ground terminal and the second ground terminal are isolated and arranged. The first ground terminal can be used to connect to the main chip. As well as the ground terminal of other functional circuits, the second ground terminal is only used to connect the audio circuit and is not connected to the main chip and other functional circuits. Therefore, the second ground terminal has no interference noise from the main chip or other functional circuits, thereby connecting the The audio chip is connected to the second ground terminal, which can reduce noise interference to the audio circuit and improve the user's audio experience.

Description of the drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those skilled in the art, other drawings can also be obtained based on these drawings without exerting creative efforts.

Figure 1 is a first structural schematic diagram of an audio circuit provided by an embodiment of the present application.

Figure 2 is a first structural schematic diagram of a circuit board provided by an embodiment of the present application.

Figure 3 is a second structural diagram of an audio circuit provided by an embodiment of the present application.

Figure 4 is a second structural schematic diagram of a circuit board provided by an embodiment of the present application.

FIG. 5 is a third structural schematic diagram of an audio circuit provided by an embodiment of the present application.

FIG. 6 is a first structural schematic diagram of a signal routing area provided by an embodiment of the present application.

FIG. 7 is a second structural schematic diagram of a signal wiring area provided by an embodiment of the present application.

FIG. 8 is a third structural schematic diagram of a circuit board provided by an embodiment of the present application.

FIG. 9 is a first structural schematic diagram of the first shielding protective layer and the second shielding protective layer provided by the embodiment of the present application.

FIG. 10 is a third structural schematic diagram of a signal wiring area provided by an embodiment of the present application.

Figure 11 is a second structural schematic diagram of the first shielding protective layer and the second shielding protective layer provided by the embodiment of the present application.

Figure 12 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all of the embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the application or its application or uses. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of this application.

People use a variety of electronic devices to play audio, such as head-mounted audio devices, VR/AR devices, speakers, mobile phones, tablets, TVs and other electronic devices that can be used to play audio. The functions of electronic devices are becoming more and more abundant, and there are more and more corresponding functional circuits, such as display circuits corresponding to display functions, radio frequency circuits corresponding to radio frequency functions, touch circuits corresponding to touch functions, camera circuits corresponding to camera functions, etc. etc. However, circuits with other functions of electronic equipment can easily cause noise interference to the audio circuit. When the electronic equipment plays audio, the noise is perceived by the user, thereby affecting the user's audio experience.

The embodiment of the present application provides an audio circuit that can reduce the impact of other functional circuits on the audio circuit. Noise interference is generated, thereby improving the sound quality of electronic equipment. This will be explained below with reference to the accompanying drawings.

Please refer to FIG. 1 , which is a first structural schematic diagram of an audio circuit provided by an embodiment of the present application. The audio circuit 100 includes a main chip 110, an audio chip 120, a first ground terminal 130 and a second ground terminal 140. The main chip 110 is used to decode audio information to obtain digital audio information; the audio chip 120 is connected to the main chip 110 , used to perform digital-to-analog conversion of digital audio information to obtain analog audio information, amplify the analog audio information to obtain driving information, and output the driving information to the speaker 200; the first ground terminal 130 is connected to the ground of the main chip 110 terminal; the second ground terminal 140 is connected to the ground terminal of the audio chip 120, and the first ground terminal 130 and the second ground terminal 140 are isolated.

The main chip 110 can be considered as the central processing unit of the electronic device 10 , which can process and process various data of various functional circuits of the electronic device 10 . Regarding the audio circuit 100, the main chip 110 can be used to decode audio information, such as parsing MP3/AAC and other format audio files into digital audio information. The main chip 110 can also perform algorithm processing on the digital audio information, such as processing the digital audio information. Signal equalization, dynamic range processing, bass enhancement, spatial sound effect enhancement and other processing.

The audio chip 120 converts the digital audio information to obtain analog audio information. The analog audio information is susceptible to noise interference from other functional circuits, and the audio chip 120 amplifies the analog audio information to obtain driving information for driving the speaker 200 to play. This will Therefore, even a small noise can be easily perceived by the user after being amplified and played by the speaker 200 .

In the embodiment of the present application, the ground terminal of the main chip 110 is connected to the first ground terminal 130, and the ground terminal of the audio chip 120 is connected to the second ground terminal 140. The second ground terminal 140 is used to connect the audio chip 120, and the first ground terminal 130 can be used to connect the ground terminals of the main chip 110 and other functional circuits. For example, the first ground terminal 130 can be connected to the ground terminals of the main chip 110, display circuit, radio frequency circuit, touch circuit, and camera circuit.

For example, please refer to FIG. 2 , which is a first structural schematic diagram of a circuit board provided by an embodiment of the present application. The audio circuit 100 may be disposed on a circuit board 300. The circuit board 300 includes a first ground area 150 connected to the first ground terminal 130, and a second ground area 140 connected to the second ground terminal 140. Second ground area 160.

The circuit board 300 can be a multi-layer board, such as a 3-layer board, a 5-layer board, or an 8-layer board. The circuit board 300 is provided with multiple metal grounds, such as multiple copper foils printed on the circuit board 300 as metal. Ground, multiple pieces of copper foil are arranged separately, for example, multiple copper foils are arranged at different positions or different layers of the same layer of the circuit board 300. Multiple pieces of copper foil include one large-area copper foil and at least two small-area copper foils. Each small-area copper foil is connected to the large-area copper foil. There is no direct connection between the small-area copper foils. Small-area copper foil and large-area copper foil can be connected through printed traces or via 180 traces. A large area of copper foil serves as the main ground area 170 , a small area of copper foil serves as the first ground area 150 , and another small area of copper foil serves as the second ground area 160 . The first ground area 150 and the second ground area 160 may be located on the same layer of the circuit board 300 , or may be located on different layers of the circuit board 300 .

Each functional circuit will generate interference noise to other functional circuits during operation, such as interference noise generated by electromagnetic coupling between functional circuits. This interference noise will interfere with other functional circuits through the first ground area 150 of the common connection. In the audio circuit 100, analog audio information is more susceptible to noise interference than digital audio information. Therefore, this embodiment isolates the first ground terminal 130 and the second ground terminal 140 so that interference signals generated by other functional circuits, such as display circuits, radio frequency circuits, touch circuits, camera circuits, etc., will not pass through the first ground area. 150 produces noise interference to the analog audio information of the audio chip 120 . Moreover, the second ground terminal 140 is only used to connect the audio circuit 100 and is not connected to the main chip 110 or other functional circuits. The second ground area 160 itself is very clean and will not cause interference from the main chip 110 and other functional circuits. Noise, thereby reducing noise interference to the audio circuit 100, ensuring the quality of audio information, and improving the user's audio experience.

In one embodiment, please refer to FIG. 3 , which is a second structural diagram of an audio circuit provided by an embodiment of the present application. The main chip 110 also includes a first power supply terminal 111 for receiving the first operating voltage VSYS; the audio chip 120 further includes a second power supply terminal 121 for receiving the second operating voltage VCC. The main chip 110 receives the first operating voltage VSYS through the first power supply terminal 111 to perform normal operation, and the audio chip 120 receives the second operating voltage VCC through the second power supply terminal 121 to perform normal operation. In operation, the first working voltage VSYS and the second working voltage VCC can be different. For example, the first working voltage VSYS is 3.8V and the second working voltage VCC is 3.3V.

Please refer to FIG. 4 , which is a second structural schematic diagram of a circuit board provided by an embodiment of the present application. The circuit board 300 may include a power management chip 310, including a first power output terminal 311 and a second power output terminal 312. The first power output terminal 311 is connected to the first power supply terminal 111 of the main chip 110, and the second power output terminal 312 is connected to the first power supply terminal 111 of the main chip 110. The second power supply terminal 121 of the audio chip 120 is connected, and the first working voltage VSYS output by the first power output terminal 311 is different from the second working voltage VCC output by the second power output terminal 312 .

Exemplarily, the electronic device 10 also includes a power supply circuit 320. The power supply circuit 320 is connected to the power management chip 310. The power supply circuit 320 may be a battery circuit or a conversion circuit that converts commercial power such as 220V into the working voltage of the power management chip 310. , the power management chip 310 converts the voltage of the power circuit 320 into the working voltage required by each functional circuit in the electronic device 10, and outputs different working voltages to the corresponding functional circuits through different power output terminals. For example: the power management chip 310 outputs a first operating voltage VSYS of 3.8V to the first power supply terminal 111 of the main chip 110 through the first power output terminal 311, and the power management chip 310 outputs a second operating voltage VSYS of 3.3V through the second power output terminal 312. The working voltage VCC is supplied to the second power supply terminal 121 of the audio chip 120 so that the main chip 110 and the audio chip 120 can operate normally. Of course, the values of the first working voltage VSYS and the second working voltage VCC may be the same as needed, but the first working voltage VSYS and the second working voltage VCC are provided by different power output terminals of the power management chip 310 .

The first power output terminal 311 of the power management chip 310 can be connected to the first power supply terminal 111 of the main chip 110 or to the power supply terminals of other functional circuits. For example, the first power output terminal 311 can also be used directly or through other components. Connect the power supply terminals of display circuits, radio frequency circuits, touch circuits, and camera circuits. During operation, each functional circuit will generate interference noise to other functional circuits, such as interference noise caused by power supply jitter. These interference noises will also pass through the public connection. The first power output terminal 311 interferes with other functional circuits. For example, the first power output terminal 311 can be connected to different functional circuits through the first power trace 330. These functional circuits can draw current from the first operating voltage VSYS output by the first power output terminal 311. These interference noises will The first power trace 330 through the common connection interferes with other functional circuits.

In the audio circuit 100, analog audio information is more susceptible to noise interference than digital audio information. In this embodiment, the first power output terminal 311 is connected to the first power supply terminal 111 of the main chip 110 and the power supply terminals of other functional circuits through the first power trace 330 , and the second power output terminal 312 is connected to the audio signal through the second power trace 340 The second power supply terminal 121 of the chip 120, the first power supply trace 330 and the second power supply trace 340 are independent of each other and have no electrical connection between them. Therefore, the second power supply trace 340 is only used to connect to the second power supply terminal 121 of the audio chip 120 and is not connected to the first ground terminal 130 of the main chip 110 and the power supply terminals of other functional circuits. Therefore, the second power supply trace 340 is The line 340 will basically have no interference noise generated by the main chip 110 or other functional circuits, or the power jitter of the first power supply line 330 will not affect the working voltage of the second power supply line 340, so that the power supply end can reduce Noise interference to the audio circuit 100 further improves the quality of audio information and enhances the user's audio experience.

In one embodiment, please refer to FIG. 5 , which is a third structural schematic diagram of an audio circuit provided by an embodiment of the present application. The audio chip 120 includes a digital-to-analog conversion module 121 and an audio power amplifier module 122. The digital-to-analog conversion module 121 is used to perform digital-to-analog conversion on digital audio information to obtain analog audio information; the audio power amplifier module 122 is used to perform digital-to-analog conversion on the analog audio information. Zoom in to get driver information.

The digital-to-analog conversion module 121 converts digital audio information into analog audio information, and the audio power amplifier module 122 amplifies the analog audio information to obtain driving information. Since the analog audio information is susceptible to noise interference from other functional circuits, even small noises can be After the audio power amplifier module 122 amplifies, the speaker 200 can easily be perceived by the user when playing, thereby affecting the user's audio experience.

It should be noted that if the number of speakers 200 of the electronic device 10 is 1 or 2, the audio chip 120 may include a digital-to-analog conversion module 121 and an audio power amplifier module 122; if the number of speakers 200 of the electronic device 10 is more When there are, for example, 4 or 5, the number of corresponding digital-to-analog conversion modules 121 and audio power amplifier modules 122 can be increased accordingly to control the corresponding speakers 200 respectively.

In this embodiment, the digital-to-analog conversion module 121 and the audio power amplifier module 122 serve as the audio chip 120 The circuit module is also grounded by being electrically connected to the second ground terminal 140, and is electrically connected to the second power output terminal 312 to input the working voltage, thereby reducing or eliminating the main chip 110 and other components from the power supply terminal and the ground terminal at the same time. The functional circuit interferes with the noise of the analog audio information, thereby improving the sound quality of the audio played by the speaker 200 .

An embodiment of the present application also provides a circuit board 300 including the audio circuit 100 of any of the above embodiments. The circuit board 300 is an important electronic component and is a support body for electronic components and a carrier for electrical connection of electronic components. The function realization of the electronic device does not leave the hardware physical basis of the circuit board 300 . Among them, the circuit board 300 can be a flexible circuit board (FPC). The flexible circuit board is a flexible printed circuit board made of polyimide or polyester film as a base material. It is thin in thickness and has good bendability. Flexible design and product form innovation are often used to connect different functional components and functional circuits of electronic equipment, especially suitable for small and irregular spaces.

Please refer to FIG. 6 , which is a first structural schematic diagram of a signal routing area provided by an embodiment of the present application. The circuit board 300 includes a circuit area and a signal routing area 360. The audio circuit 100 is disposed in the circuit area. The signal routing area 360 includes first signal routing 361 and second signal routing 362 spaced apart from each other. The first signal routing 361 and second signal traces 362 are respectively electrically connected to the audio chip 120 of the audio circuit 100 for transmitting driving information; wherein, a first ground trace 363 is provided between the first signal trace 361 and the second signal trace 362 , the first ground trace 363 is electrically connected to the second ground terminal 140 of the audio circuit 100 .

By way of example, the electronic device 10 has two speakers 200 , including a first speaker 210 and a second speaker 220 . The driving information output by the audio chip 120 includes first driving information and second driving information. The first driving information includes left channel audio information, and the second driving information includes right channel audio information. The first signal trace 361 is connected to the audio circuit 100 The audio chip 120 is used to transmit the first driving information to the first speaker 210 to drive the first speaker 210 to play the left channel audio information; the second signal trace 362 is connected to the audio chip 120 of the audio circuit 100 and is used to transmit the driving information. The information is sent to the second speaker 220 to drive the second speaker 220 to play the right channel audio information, so that the electronic device 10 can play two-channel audio, thereby providing the user with a stereo audio effect.

In one embodiment, please continue to refer to FIG. 2 , the circuit board 300 includes a first ground region 150, The second ground area 160 and the main ground area 170, the first ground terminal 130 is connected to the first ground area 150, the second ground terminal 140 is connected to the second ground area 160; the first ground area 150 and the second ground area 160 are respectively connected to the main ground Area 170 , the main ground area 170 is larger than the first ground area 150 and the second ground area 160 .

Exemplarily, the circuit board 300 is provided with multiple pieces of metal ground, such as multiple pieces of copper foil printed on the circuit board 300 as the metal ground, and the multiple pieces of copper foil are arranged separately. For example, multiple pieces of copper foil are arranged on the same surface of the circuit board 300. Different positions of the layer or different layers. Multiple pieces of copper foil include one large-area copper foil and at least two small-area copper foils. Each small-area copper foil is connected to the large-area copper foil. There is no direct connection between the small-area copper foils. Small-area copper foil and large-area copper foil can be connected through printed traces or via-hole traces. A large area of copper foil serves as the main ground area 170 , a small area of copper foil serves as the first ground area 150 , and another small area of copper foil serves as the second ground area 160 .

In this embodiment, a first ground wire 363 is provided between the first signal wire 361 and the second signal wire 362, so that the audio information between the first signal wire 361 and the second signal wire 362 can be reduced or eliminated. mutual crosstalk, and the first ground trace 363 is electrically connected to the second ground terminal 140 of the audio circuit 100. The second ground terminal 140 is only used to connect the audio circuit 100 and is not connected to the main chip 110 and other functional circuits. Therefore, The second ground area 160 connected to the second ground terminal 140 has basically no interference noise generated by the main chip 110 or other functional circuits. Therefore, the first ground trace 363 itself is very clean and will not introduce noise to interfere with the first signal trace 361 and the first signal trace 361. The driving information transmitted by the second signal line 362 ensures the quality of the audio information. It should be noted that the first ground trace 363 and the first signal trace 361 and the second signal trace 362 are close to each other on the circuit board 300 but are also isolated from each other.

It should be noted that the electronic device 10 may have only one speaker, the corresponding signal wiring area may have only one signal wiring, and the speaker may play monophonic audio information. The electronic device 10 may also have a larger number of speakers, respectively used to play more channels of audio information, and the signal wiring area has more signal wiring, respectively, used to transmit different channels of audio information to the corresponding speakers. , for example, the signal routing area may also have a third signal routing, a fourth signal routing No. wiring, etc., which can provide users with more channels of audio information, making users closer to the on-site experience. If there are multiple signal traces, a ground trace electrically connected to the second ground terminal 140 can be provided between every two adjacent signal traces to prevent crosstalk between the multiple signal traces.

Please continue to refer to FIG. 6 . In one embodiment, the signal wiring area 360 also includes a fourth ground wiring 364 and a fifth ground wiring 365 . The fourth ground trace 364 and the first ground trace 363 are arranged on the same layer and spaced apart from each other. The fourth ground trace 364 is arranged on the side of the first signal trace 361 away from the first ground trace 363. The fourth ground trace 364 Connect the first ground terminal 130; the fifth ground trace 365 and the first ground trace 363 are arranged on the same layer and spaced apart from each other. The fifth ground trace 365 is arranged on the side of the second signal trace 362 away from the first ground trace 363. , the fifth ground trace 365 is connected to the first ground terminal 130 .

The fourth ground trace 364 can shield the interference noise located on the side of the first signal trace 361 away from the first ground trace 363; the fifth ground trace 365 can shield the second signal trace 362 away from the first ground trace 363. Interference noise on one side. Therefore, on the layer where the signal trace area 360 is located, the first ground trace 363 can shield the mutual crosstalk of audio information between the first signal trace 361 and the second signal trace 362, and the fourth ground trace 364 and the fifth The ground trace 365 can shield the interference noise located on both sides of the first signal trace 361 and the second signal trace 362, thereby connecting the first signal trace 361 and the second signal trace 360 on the layer where the signal trace area 360 is located. 362 performs package ground isolation so that the driving information transmitted by the first signal trace 361 and the second signal trace 362 is not susceptible to noise interference on the layer where the signal trace area 360 is located.

For example, the fourth ground trace 364 and the fifth ground trace 365 may be connected to the first ground terminal 130. Although the first ground terminal 130 is connected to the first ground area 150, the first ground area 150 is present in the main chip 110 or Interference noise from other functional circuits, but due to the smaller thickness on both sides of the first signal trace 361 and the second signal trace 362, that is, the area facing the fourth ground trace 364 and the fifth ground trace 365 is small. , is relatively less susceptible to the interference noise existing in the first ground area 150 itself; in addition, the first ground area 150 is connected to the main chip 110 and other functional circuits, and the second ground area 160 is only used to connect the audio circuit 100, so the first ground area The area of 150 is larger than the area of the second ground area 160. In order to simplify the layout of the ground traces of the circuit board 300, the fourth ground trace 364 and the fifth ground trace 365 can be directly connected to the first ground terminal 130.

In another example, please refer to FIG. 7 , which is a second structural schematic diagram of a signal routing area provided by an embodiment of the present application. The fourth ground trace 364 and the fifth ground trace 365 can also be connected to the second ground terminal 140. Then on the layer where the signal trace area 360 is located, the first ground trace 363, the fourth ground trace 364, the fifth The ground traces 365 are all connected to the second ground terminal 140. The second ground terminal 140 is only used to connect the audio circuit 100. It is very clean and will not introduce interference noise from the main chip 110 or other functional circuits. Therefore, the first ground terminal 140 can be connected to the second ground terminal 140. The signal trace 361 and the second signal trace 362 are better isolated from each other, so that the driving information transmitted by the first signal trace 361 and the second signal trace 362 is less susceptible to interference from the layer where the signal trace area 360 is located. Noise interference. It should be noted that the fourth ground trace 364, the first signal trace 361, the first ground trace 363, the second signal trace 362 and the fifth ground trace 365 are close to each other on the circuit board 300 but are also close to each other. isolated from each other.

In one embodiment, please refer to Figures 8 and 9. Figure 8 is a third structural schematic diagram of a circuit board provided by an embodiment of the present application. Figure 9 is a first shielding protective layer and a second shielding layer provided by an embodiment of the present application. Schematic diagram of the structure of the protective layer. The circuit board 300 also includes a first shielding protective layer 370 , which is disposed on one side of the signal wiring area 360 . The first shielding protective layer 370 includes a second grounding trace 371 , and the second grounding trace 371 is located in front of the signal wiring area 360 . The projection covers the first signal trace 361 , the first ground trace 363 and the second signal trace 362 , and the second ground trace 371 is connected to the second ground terminal 140 .

The circuit board 300 may be a multi-layer board, in which the signal wiring area 360 is provided on one of the layers, and the first shielding protection layer 370 is provided on a layer above or below the layer where the signal wiring area 360 is located. The orthographic projection of the second ground trace 371 of the layer 370 in the signal trace area 360 covers the first signal trace 361, the first ground trace 363 and the second signal trace 362. The second ground trace 371 can shield the main chip. 110 or other functional circuits, making the first signal trace 361 and the second signal trace 362 less susceptible to interference from the upper or lower layer in the space. Noise effects. Moreover, the second ground trace 371 is electrically connected to the second ground terminal 140 of the audio circuit 100. The second ground terminal 140 is only used to connect the audio circuit 100 and is not connected to the main chip 110 and other functional circuits. Therefore, the second ground The trace 371 is also very clean and will not introduce interference noise from the main chip 110 and other functional circuits.

In one embodiment, the circuit board 300 further includes a second shielding protective layer 380 , which is disposed on the other side of the signal wiring area 360 . The second shielding protective layer 380 includes a third ground trace 381 , and the third ground trace 381 The orthographic projection of the signal trace area 360 covers the first signal trace 361 , the first ground trace 363 and the second signal trace 362 , and the third ground trace 381 is connected to the second ground terminal 140 . For example, the first shielding protective layer 370 is provided on a layer above the layer where the signal wiring area 360 is located, and the second shielding protective layer 380 is provided on a layer below the layer where the signal wiring area 360 is located. Then the third ground trace 381 can shield the interference noise generated by the main chip 110 or other functional circuits, so that the first signal trace 361 and the second signal trace 362 are not easily affected by the interference noise of the next layer in the space. Moreover, the third ground trace 381 is electrically connected to the second ground terminal 140 of the audio circuit 100. The second ground terminal 140 is only used to connect the audio circuit 100 and is not connected to the main chip 110 and other functional circuits. Therefore, the third ground wire 381 is electrically connected to the second ground terminal 140 of the audio circuit 100. The trace 381 is also very clean and will not introduce interference noise from the main chip 110 and other functional circuits.

It should be noted that the first shielding protective layer 370 can also be provided on a layer below the layer where the signal wiring area 360 is located, and correspondingly, the second shielding protective layer 380 is provided on a layer above the layer where the signal wiring area 360 is located. The signal wiring area 360, the first shielding protection layer 370 and the second shielding protection layer 380 are close to each other but are also isolated from each other.

The first shielding protective layer 370 is provided on the upper layer of the layer where the signal wiring area 360 is located. The second ground wiring 371 of the first shielding protective layer 370 can be shielded on the first signal wiring 361 and the second signal wiring 362. To prevent interference noise on one layer, the second shielding protective layer 380 is provided on the layer below the signal wiring area 360. The third ground wiring 381 of the second shielding protective layer 380 can shield the first signal wiring 361 and the third ground wiring 381. The interference noise on the next layer of the second signal trace 362 forms a ground-covering isolation for the first signal trace 361 and the second signal trace 362 in space, protecting the first signal trace 361 and the second signal trace 362 Not affected by noise from peripheral circuits. thus to The first signal trace 361 and the second signal trace 362 can not only shield the interference noise from the same layer, but also shield the interference noise from the upper or lower layer in the space, and the first ground trace 363 , the second ground trace 371 and the third ground trace 381 are both connected to the second ground terminal 140. These ground traces themselves are relatively clean and will not induce interference signals from the main chip 110 or other functional circuits, causing the first signal to The driving information transmitted by the wiring 361 and the second signal wiring 362 is cleaner, thereby ensuring the quality of audio information transmission and improving the sound quality of the audio played by the speaker 200.

It should be noted that if the signal wiring area 360 only has one signal wiring, then the orthographic projection of the second ground wiring 371 and the third ground wiring 381 in the signal wiring area 360 can cover one signal wiring. lines, if the signal wiring area 360 has more signal wiring, such as the third signal wiring, the fourth signal wiring, etc., then the second ground wiring 371 and the third ground wiring 381 are in the signal wiring area. The 360-degree orthographic projection can cover all signal traces, thereby shielding all signal traces from interference noise.

In one embodiment, the first shielding protection layer 370 also includes a sixth ground trace 372 and a seventh ground trace 373. The sixth ground trace 372 and the seventh ground trace 373 are on the same layer as the second ground trace 371. Disposed and spaced apart from each other, the sixth ground trace 372 and the seventh ground trace 373 are respectively disposed on both sides of the second ground trace 371 .

The second ground trace 371 of the first shielding protection layer 370 shields the interference noise located on the upper layer of the first signal trace 361 and the second signal trace 362. Sixth ground traces 371 are spaced apart on both sides of the second ground trace 371. The ground trace 372 and the seventh ground trace 373 can further shield the interference signals on both sides of the second ground trace 371, thereby better shielding the layer above the first signal trace 361 and the second signal trace 362. interference noise, reducing the impact of interference noise on the driving information transmitted by the first signal line 361 and the second signal line 362. To simplify the layout of the ground traces in the circuit, the sixth ground trace 372 and the seventh ground trace 373 may be connected to the first ground terminal 130 .

In one embodiment, the second shielding protection layer 380 also includes an eighth ground trace 382 and a ninth ground trace 383. The eighth ground trace 382, the ninth ground trace 383 and the third ground trace 381 are on the same layer. are arranged and spaced apart from each other, and the eighth ground trace 382 and the ninth ground trace 383 are respectively arranged at Both sides of the third ground trace 381.

The third ground trace 381 of the second shielding protective layer 380 shields the interference noise located on the layer below the first signal trace 361 and the second signal trace 362. Eighth ground traces 381 are spaced apart on both sides of the third ground trace 381. The ground trace 382 and the ninth ground trace 383 can further shield the interference signals on both sides of the third ground trace 381, thereby better shielding the layer below the first signal trace 361 and the second signal trace 362. interference noise, reducing the impact of interference noise on the driving information transmitted by the first signal line 361 and the second signal line 362. To simplify the ground trace layout in the circuit, the eighth ground trace 382 and the ninth ground trace 383 can be connected to the first ground terminal 130 . The first shielding protection layer 370 and the second shielding protection layer 380 may be the same, or may be adjusted to different sizes according to the wiring layout of the actual circuit board.

In one embodiment, please refer to Figures 10 and 11. Figure 10 is a third structural schematic diagram of a signal wiring area provided by an embodiment of the present application. Figure 11 is a first shielding protective layer and a third protective layer provided by an embodiment of the present application. Schematic diagram of the second structure of the second shielding protective layer. The tenth ground trace 366 provided between the first signal trace 361 and the second signal trace 362 in the signal trace area 360 can also be connected to the first ground terminal 130 of the audio circuit 100 through the tenth ground trace 366 The mutual crosstalk of audio information between the first signal trace 361 and the second signal trace 362 can be shielded, but the tenth ground trace 366 connected to the first ground terminal 130 itself has interference generated by the main chip 110 or other functional circuits. Interference noise occurs, so the anti-interference effect of connecting the first ground terminal 130 to the tenth ground trace 366 is not as good as the anti-interference effect of connecting the second ground terminal 140 .

In addition, the first shielding protection layer 370 may also include only the eleventh ground trace 374 connected to the first ground terminal 130 , and the first shielding protection layer 380 may also include only the twelfth grounding wire connected to the first ground terminal 130 The trace 384, the eleventh ground trace 374 and the twelfth ground trace 384 can shield the peripheral interference noise located on the next layer and the next layer of the first signal trace 361 and the second signal trace 362, but due to the The eleventh ground trace 374 and the twelfth ground trace 384 themselves have interference noise generated by the main chip 110 or other functional circuits. Therefore, the anti-interference effect of the first shielding protective layer 370 only having the eleventh ground trace 374 is not as good. The first shielding protective layer 370 has the anti-interference effect of the second ground trace 371, and the second shielding protective layer 380 only has the twelfth ground The anti-interference effect of the trace 384 is also not as good as the anti-interference effect of the second shielding protective layer 380 and the third ground trace 381 .

Please refer to FIG. 12 , which is a schematic structural diagram of an electronic device provided by an embodiment of the present application. An embodiment of the present application also provides an electronic device 10. The electronic device 10 includes the circuit board 300 of any of the above embodiments. The electronic device 10 further includes a speaker 200. The speaker 200 is electrically connected to the audio chip 120 of the circuit board 300. The number of speakers 200 can be set as needed, and can be 1, 2, 3, 4, 5, etc.

The electronic device 10 may be, for example, a head-mounted audio device, a stereo, a mobile phone, a tablet computer, a television, or other electronic device 10 that can be used to play audio. For example, the electronic device 10 may be a head-mounted audio device. Head-mounted audio devices are more and more widely penetrated into people's lives, such as head-mounted TWS headphones, which no longer only meet the user's personal audio-visual entertainment needs. , the function has changed from wired connection to wireless connection, the degree of portability has been upgraded, and the degree of personalization has been upgraded; with the upgrade of audio codec and sound effect processing technology, the sound effect achieved by TWS headphones has crossed from stereo sound to spatial sound effect, and the sound experience has been upgraded, and users have Wearing TWS headphones can experience the immersive audio experience of a large theater system. Another example: head-mounted AR/VR equipment, focusing on the audio-visual entertainment experience in the virtual world, and the recently emerged metaverse, which creates a connection between the virtual and real world through head-mounted AR/VR equipment.

The functional applications of head-mounted audio devices are becoming more and more abundant. In addition to playing audio, they also include display functions, charging functions, noise reduction functions, motion detection functions, in-ear detection functions, voice control functions, touch functions, etc. Corresponding functions There are more and more circuits and they are becoming more and more complex. At the same time, the shape and size of head-mounted audio devices are becoming increasingly smaller. This means that the design space of head-mounted audio equipment is becoming more and more limited, and there are more interference factors in the circuit. Since the speakers of head-mounted audio equipment are close to the ears, the sound can be directly transmitted into the user's ears, and even the smallest noise will be perceived by the user. Therefore, head-mounted audio equipment must try to avoid noise interference from other functional circuits on the speakers.

In another example, the electronic device 10 can also be a speaker with a large power amplification factor. Due to the large power amplification factor, even a very small noise is amplified, and it is easy for the speaker to play audio. The noise is perceived by the user and affects the sound quality of the audio played by the speaker. In addition, electronic devices 10 such as mobile phones, tablets, and televisions also need to avoid noise interference from other functional circuits on the speakers to improve the sound quality of the electronic devices.

In one embodiment, the second ground terminal 140 is also used for electrical connection with the speaker 200 . When the speaker 200 plays audio, if it receives noise interference from the main chip 110 or other functional circuits, the played audio will be noisy, which will affect the user's audio experience.

Therefore, in this embodiment, the second ground terminal 140 is also used to electrically connect with the speaker 200. The second ground terminal 140 is only used to connect the audio circuit 100 and is not connected to the main chip 110 and other functional circuits. Therefore, the second ground terminal 140 is not connected to the main chip 110 or other functional circuits. 140 itself is very clean and does not introduce interference noise generated by other functional circuits. The speaker 200 is grounded through the second ground terminal 140, which can reduce the noise interference to the speaker 200, so that the audio played by the speaker 200 is very clean, and the user does not perceive interference. noise, further improving the sound quality of the audio played by the speaker 200.

In the above embodiments, each embodiment is described with its own emphasis. For parts that are not described in detail in a certain embodiment, please refer to the detailed description of the display device above and will not be described again here.

The audio circuits, circuit boards and electronic equipment provided by the embodiments of the present application have been introduced in detail. This article uses specific examples to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the present application. The application method and its core idea; at the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the ideas of this application. In summary, the content of this specification should not be understood as an infringement of this application. limits.

Claims (20)

An audio circuit, including: The main chip is used to decode audio information to obtain digital audio information; An audio chip, connected to the main chip, is used to perform digital-to-analog conversion on the digital audio information to obtain analog audio information, amplify the analog audio information to obtain driving information, and output the driving information to speaker; The first ground terminal is connected to the ground terminal of the main chip; The second ground terminal is connected to the ground terminal of the audio chip, and the first ground terminal and the second ground terminal are arranged in isolation. The audio circuit according to claim 1, wherein The main chip also includes a first power supply terminal for receiving a first working voltage; The audio chip also includes a second power supply terminal for receiving a second operating voltage. The audio circuit of claim 2, wherein the audio circuit further includes: A power management chip includes a first power output terminal and a second power output terminal. The first power output terminal is connected to the first power supply terminal, and the second power output terminal is connected to the second power supply terminal. The first working voltage output by the first power supply output terminal is different from the second working voltage output by the second power supply output terminal. The audio circuit according to claim 1, wherein the audio chip includes: A digital-to-analog conversion module, used to perform digital-to-analog conversion on the digital audio information to obtain analog audio information; An audio power amplifier module is used to amplify the analog audio information to obtain driving information. A circuit board, including: a circuit area, where an audio circuit is provided; The signal wiring area includes first signal wiring and second signal wiring spaced apart from each other. The first signal wiring and the second signal wiring are electrically connected to the audio chip of the audio circuit respectively, for transmit the driver information; Wherein, a first ground trace is provided between the first signal trace and the second signal trace. wire, the first ground wire is electrically connected to the second ground terminal of the audio circuit. The circuit board of claim 5, wherein the audio circuit includes: The main chip is used to decode audio information to obtain digital audio information; An audio chip, connected to the main chip, is used to perform digital-to-analog conversion on the digital audio information to obtain analog audio information, amplify the analog audio information to obtain driving information, and output the driving information to speaker; The first ground terminal is connected to the ground terminal of the main chip; The second ground terminal is connected to the ground terminal of the audio chip, and the first ground terminal and the second ground terminal are arranged in isolation. The circuit board according to claim 6, wherein The main chip also includes a first power supply terminal for receiving a first operating voltage; The audio chip also includes a second power supply terminal for receiving a second operating voltage. The circuit board of claim 7, wherein the audio circuit further includes: A power management chip includes a first power output terminal and a second power output terminal. The first power output terminal is connected to the first power supply terminal, and the second power output terminal is connected to the second power supply terminal. The first working voltage output by the first power supply output terminal is different from the second working voltage output by the second power supply output terminal. The circuit board of claim 5, wherein the audio chip includes: A digital-to-analog conversion module, used to perform digital-to-analog conversion on the digital audio information to obtain analog audio information; An audio power amplifier module is used to amplify the analog audio information to obtain driving information. The circuit board according to claim 5, wherein the signal routing area further includes: The fourth ground trace is arranged on the same layer as the first ground trace and is spaced apart from each other. The fourth ground trace is arranged on the side of the first signal trace away from the first ground trace. A fourth ground trace is connected to the first ground terminal; The fifth ground trace is arranged on the same layer as the first ground trace and is spaced apart from each other. The fifth ground trace is arranged on the side of the second signal trace away from the first ground trace. fifth The ground trace is connected to the first ground terminal. The circuit board according to claim 5, wherein the circuit board further includes a first shielding protective layer disposed on one side of the signal wiring area, and includes a second ground wiring, and the second ground wiring is on The orthographic projection of the signal trace area covers the first signal trace, the first ground trace and the second signal trace, and the second ground trace is connected to the second ground terminal. The circuit board according to claim 11, wherein the circuit board further includes a second shielding protection layer disposed on the other side of the signal wiring area, including a third ground trace, the third ground trace The orthographic projection in the signal trace area covers the first signal trace, the first ground trace and the second signal trace, and the third ground trace is connected to the second ground terminal. The circuit board according to claim 11, wherein the first shielding protection layer further includes sixth ground traces and seventh ground traces, the sixth ground traces, the seventh ground traces and the The second ground traces are arranged on the same layer and spaced apart from each other. The sixth ground trace and the seventh ground trace are respectively arranged on both sides of the second ground trace. The circuit board according to claim 12, wherein the second shielding protective layer further includes eighth ground traces and ninth ground traces, the eighth ground traces, the ninth ground traces and the The third ground traces are arranged on the same layer and spaced apart from each other. The eighth ground trace and the ninth ground trace are respectively arranged on both sides of the third ground trace. The circuit board of claim 5, wherein the circuit board further includes: a first grounding area, the first grounding terminal is connected to the first grounding area; a second grounding area, the second grounding terminal is connected to the second grounding area; A main grounding area, the first grounding area and the second grounding area are respectively connected to the main grounding area, and the main grounding area is larger than the first grounding area and the second grounding area. An electronic device, including: A circuit board, the circuit board includes a circuit area and a signal wiring area; an audio circuit is provided on the circuit area; The audio circuit includes: The main chip is used to decode audio information to obtain digital audio information; An audio chip, connected to the main chip, is used to perform digital-to-analog conversion on the digital audio information to obtain analog audio information, amplify the analog audio information to obtain driving information, and output the driving information to speaker; The first ground terminal is connected to the ground terminal of the main chip; A second ground terminal is connected to the ground terminal of the audio chip, and the first ground terminal and the second ground terminal are arranged in isolation; A speaker, the speaker is electrically connected to the audio chip of the circuit board. The electronic device according to claim 16, wherein the second ground terminal is also used for electrical connection with the speaker. The electronic device according to claim 16, wherein the signal trace area includes first signal traces and second signal traces spaced apart from each other, and the first signal traces and the second signal traces are respectively Electrically connected to the audio chip of the audio circuit for transmitting the driving information; Wherein, a first ground wire is provided between the first signal wire and the second signal wire, and the first ground wire is electrically connected to the second ground terminal of the audio circuit. The electronic device according to claim 16, wherein The main chip also includes a first power supply terminal for receiving a first working voltage; The audio chip also includes a second power supply terminal for receiving a second operating voltage. The electronic device of claim 19, wherein the audio circuit further includes: A power management chip includes a first power output terminal and a second power output terminal. The first power output terminal is connected to the first power supply terminal, and the second power output terminal is connected to the second power supply terminal. The first working voltage output by the first power supply output terminal is different from the second working voltage output by the second power supply output terminal.