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WO2024049340A1 - Dispositif d'imagerie biométrique et procédé de fabrication de dispositif d'imagerie biométrique - Google Patents

Dispositif d'imagerie biométrique et procédé de fabrication de dispositif d'imagerie biométrique Download PDF

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Publication number
WO2024049340A1
WO2024049340A1 PCT/SE2023/050828 SE2023050828W WO2024049340A1 WO 2024049340 A1 WO2024049340 A1 WO 2024049340A1 SE 2023050828 W SE2023050828 W SE 2023050828W WO 2024049340 A1 WO2024049340 A1 WO 2024049340A1
Authority
WO
WIPO (PCT)
Prior art keywords
reel
substrate
pcb
imaging device
biometric imaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/SE2023/050828
Other languages
English (en)
Inventor
Zhimin MO
Mats Slottner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fingerprint Cards Anacatum IP AB
Original Assignee
Fingerprint Cards Anacatum IP AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fingerprint Cards Anacatum IP AB filed Critical Fingerprint Cards Anacatum IP AB
Publication of WO2024049340A1 publication Critical patent/WO2024049340A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0716—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor
    • G06K19/0718—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor the sensor being of the biometric kind, e.g. fingerprint sensors
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger

Definitions

  • the present invention relates to a biometric imaging device and to a method of manufacturing the biometric imaging device.
  • the invention relates to a fingerprint sensor module comprising a thin-film- transistor (TFT) fingerprint sensor.
  • TFT thin-film- transistor
  • capacitive fingerprint sensing devices have been adopted more and more in for example consumer electronic devices due to small form factor, relatively beneficial cost/performance factor and high user acceptance.
  • fingerprint sensors in smartcards to enable biometric identification in a card such as a bank card where other types of biometric systems are not applicable.
  • Capacitive fingerprint sensors can be manufactured in large numbers and at low cost using a thin film transistor (TFT) process.
  • TFT thin film transistor
  • current TFT-circuits are often very thin, having a thickness of about 5 pm, and a total thickness of about 30 pm including a carrier substrate, which requires careful handling of the TFT-circuits during manufacturing of a fingerprint sensing module to prevent wrapping, cracking or other damages.
  • an object of the present invention to provide an improved biometric imaging device and a method for manufacturing a biometric imaging device based on thin-film transistor technology.
  • a biometric imaging device comprising: a flexible reel-to-reel substrate comprising a plurality of through-openings; a thin-film transistor, TFT, circuit attached to a first side of the reel-to-reel substrate, the TFT-circuit comprising a capacitive fingerprint sensing device having a sensing side on a first side thereof, facing away from the reel-to-reel substrate, the capacitive fingerprint sensing device comprising electrically conductive contact pads on a second side thereof, facing the reel-to-reel substrate and aligned with the openings of the reel-to- reel substrate; a printed circuit board, PCB, substrate attached to a second side of the reel-to-reel substrate, the PCB-substrate comprising a conductive trace located on an exposed side of the PCB-substrate facing away from the reel-to-reel substrate and through-openings at locations corresponding to the through openings of the reel-to-
  • the flexible reel-to-reel substrate can for example be a polyimide tape provided in a roll to be used in a reel-to-reel manufacturing process.
  • Polyimide is a preferable material, since it can withstand higher temperatures compared to many other plastic materials, which may be required during subsequent steps of the manufacturing process.
  • the reel-to-reel substrate is in the present context a layer of material or materials which is flexible, and which can be provided as sheets or on a roll.
  • the substrate may comprise a plurality of different layers. It would also be possible to use a flexible PCB-film as a reel-to-reel substrate.
  • the PCB-substrate further comprises through-openings at locations corresponding to the through openings of the reel-to-reel substrate which allows a direct electrical connection from the PCB-substrate to the TFT-circuit comprising the capacitive fingerprint sensing device.
  • the present invention is based on the realization that it is preferable to provide a biometric imaging device comprising a capacitive fingerprint sensing device based on TFT-technology where a finger does not have to be sensed through connection layers of the TFT-circuit.
  • the capacitive fingerprint sensing device is arranged on one side of the reel-to-reel substrate and PCB-substrate is arranged on the other side of the reel-to-reel substrate, where the PCB-substrate is used to provide contact pads for connecting the biometric imaging device to external circuitry.
  • PCB substrate provides structural stability to the very thin TFT-circuit and facilitates connection of the TFT-circuit to external circuitry since an electrical connection can easily be formed through the PCB substrate.
  • a further advantage of the present invention is that the integration of a reel-to-reel substrate facilitates mass production of the biometric imaging device.
  • the electrical connection from the PCB-substrate to the TFT-circuit may for example comprise a bond wire reaching from the conductive trace of the PCB-substrate to the contact pad of the fingerprint sensing device.
  • wire-bonding can be used to form the electrical connection between pre-made conductive traces on the top surface of the PCB-substrate and the conductive contact pads of the capacitive fingerprint sensing device.
  • the PCB-substrate comprises a first section having a first thickness and a second section having a second thickness different from the first thickness.
  • the first and second section of the PCB-substrate for the biometric imaging device can in principle be provided as two separate PCB-substrates which are not joined together at any point.
  • the two sections of different thickness can also be achieved by reducing the thickness of selected area portions of a PCB-substrate.
  • a bond wire can be used to form an electrical connection between the first section and second section of the PCB- substrate, thereby allowing communication therebetween.
  • the biometric imaging device further comprises at least one component arranged on the PCB- substrate, wherein the PCB-substrate comprises conductive traces arranged on the top surface of the PCB-substrate configured to form an electrical connection to the at least one component.
  • the conductive traces can in turn be contacted to form an electrical connection between the component and the fingerprint sensing device through the through openings of the flexible reel-to- reel substrate.
  • the component may for example be a surface mounted discrete component and/or an integrated circuit.
  • the at least one component arranged on the PCB-substrate can be a surface mounted discrete component and/or an integrated circuit for example to be used to provide functionality required for the fingerprint sensing device of the TFT-circuit.
  • the TFT-circuit may comprise a cover layer covering the sensing side of the fingerprint sensing device.
  • the cover layer can for example be a plastic film arranged on the capacitive fingerprint sensing device to protect the device form wear and tear.
  • the PCB-substrate comprises a contact pad arranged on the first surface of the PCB-substrate and configured to electrically connect the biometric imaging device to external circuitry.
  • the biometric imaging device is integrated in a smartcard comprising a card body in which the biometric imaging device according to any one of the aforementioned embodiments is arranged; and a conductive layer electrically connected to contact pads of the PCB-substrate.
  • a smartcard can be considered to be any card comprising functionality such as biometric sensing, and smartcards may be used as payment cards, identification cards, access cards and in other applications where a card with built-in functionality is desirable.
  • the smartcard comprises a biometric imaging device.
  • FIGs. 1A-B schematically illustrate a biometric imaging device according to an embodiment of the invention
  • FIGs. 2A-B schematically illustrate a biometric imaging device according to an embodiment of the invention
  • Figs. 3A-B schematically illustrate an example biometric imaging device
  • FIGs. 4A-B schematically illustrate a biometric imaging device according to an embodiment of the invention
  • Fig. 5 schematically illustrates details of capacitive fingerprint sensing device in a biometric imaging device according to an embodiment of the invention
  • Fig 6. schematically illustrate details of a smartcard comprising a biometric imaging device according to an embodiment of the invention.
  • Fig. 7 schematically illustrates a a smartcard comprising a biometric imaging device according to an embodiment of the invention.
  • biometric imaging device comprising a capacitive fingerprint sensing device.
  • Fig. 1 A is a schematic cross section view of a biometric imaging device 100 according to an example embodiment and Fig. 1 B is a schematic top view of the device 100.
  • the biometric imaging device 100 comprises a flexible reel-to-reel substrate which in turn 102 has a plurality of through-openings 103.
  • the flexible reel-to-reel substrate can for example be a polyimide film and the term substrate refer to a structure which carries and supports the remaining parts of the biometric imaging device, and which is suitable for use in a reel-to-reel manufacturing process.
  • the biometric imaging device 100 further comprises a thin-film transistor, TFT, circuit 104 attached to a first side 109 of the reel-to-reel substrate102, the TFT-circuit 104 comprising a capacitive fingerprint sensing device 106 having a sensing side 108 on a first side thereof, facing away from the reel-to-reel substrate 102.
  • the capacitive fingerprint sensing device 106 further comprises electrically conductive contact pads 110 on a second side 112 thereof opposite the sensing side 108. The electrically conductive contact pads 110 thereby face the reel-to-reel substrate 102 and are further aligned with the through-openings 103 of the reel-to-reel substrate 102.
  • the steps of manufacturing a TFT-based capacitive fingerprint sensing device 106 are generally known and will not be described in further detail herein. That the sensing side 108 of the fingerprint sensing device 106 is arranged on a side of the TFT-circuit 104 facing away from the reel-to-reel substrate 102 means that connection layers of the TFT-circuit 104 are arranged above an active sensing portion of the sensing transistors in the TFT-circuit 104, and that a distance between an active sensing portion of the fingerprint sensing device 106 and a finger placed on a sensing surface of the biometric imaging device 100 is minimized.
  • the capacitive fingerprint sensing device 106 comprises an array of electrically conductive sensing elements connected to thin-film transistors.
  • a capacitive fingerprint sensing device 106 should be understood to further comprise sensing circuitry connected to the sensing elements for reading a signal from the sensing elements.
  • the sensing circuitry may in turn comprise internal readout circuitry or be connected to external readout circuitry for providing a result of the sensing elements to an external device for further processing. Such readout circuitry may be included in the biometric imaging device.
  • the capacitive fingerprint sensing device 106 further comprises a plurality of electrically conductive contact pads 110 for electrically connecting the fingerprint sensing device 106 to external circuitry.
  • External circuitry here refers to circuitry outside of the fingerprint sensing device 106 and may thus include both internal components and circuits which provide functionality of the biometric imaging device as well as components and circuitry outside of the biometric imaging device.
  • the contact pads 110 are not necessarily arranged to be directly connected to such circuitry, an electrical connection may instead be formed via additional conductive elements.
  • the contact pads 110 are arranged on a second side 112 of the TFT-circuit 104 opposite the sensing side and the contact pads can be accessed via the through openings 103 of the reel-to-reel substrate as illustrated in Figs. 1A-B.
  • a base metal layer of the contact pads 110 can be formed together with a connection layer which is a part of the TFT-circuit 104.
  • further surface metallization of the contact pads 110 such as electro-plating of Ni and Au may be required to prevent oxidation and to facilitate interconnection.
  • the biometric imaging device further comprises a printed circuit board, PCB, substrate 114 attached to a second side 115 of the reel-to-reel substrate102, the PCB-substrate 114 comprising a conductive trace 116 or conductive pad located on an exposed side of the PCB-substrate 114 facing away from the reel-to-reel substrate 102.
  • the PCB-substrate 114 further comprises through-openings 105 at locations corresponding to the through openings 103 of the reel-to-reel substrate.
  • An electrical connection is formed between the conductive trace 116 of the PCB-substrate 114 and the conductive contact pads 110 of the capacitive fingerprint sensing device via the through-openings 105 of the PCB-substrate and further via the aligned through-openings 103 of the reel-to-reel substrate 102 by means of a bond wire 120.
  • the bond wires 120 are preferably protected by forming an encapsulation 118 covering the bond wires.
  • Forming an electrical connection through the reel-to-reel substrate 102 may in principle also comprise depositing a metal layer in the openings 103 such that the metal layer forms an electrical connection between the conductive contact pads 110 of the fingerprint sensing device 106 and a top surface of the PCB-substrate 114.
  • the conductive traces would need to either be protected during metal deposition or new conductive traces would need to be patterned after metal deposition.
  • the biometric imaging device 100 further comprises a component 126 arranged on the PCB-substrate 114 as illustrated in Figs. 1A-B.
  • the component 124 arranged on the PCB-substrate 114 can be a surface mounted discrete component 124 such as a decoupling capacitor or the component may be an integrated circuit such as a readout circuit for the fingerprint sensing device 106, a secure element (SE) or micro control unit (MCU). Direct soldering of extra components onto the PCB-substrate 114 provides a short connection length between the component and the fingerprint sensing device 106 and good electrical performance.
  • SE secure element
  • MCU micro control unit
  • the integration of components and circuits in the biometric imaging device 100 limits the total number of separate devices which need to be integrated together with the biometric imaging device, which is advantageous for example in a smartcard implementation where manufacturing and assembly can be simplified by reducing the number of separate components.
  • Fig. 1 B is a schematic top view of the biometric imaging device 100 illustrating the conductive traces 116 of the PCB-substrate 114 which in turn are contacted by a bond wire 120 reaching the contact pad 110 of the TFT- circuit 104 to form an electrical connection between the component 126 and the capacitive fingerprint sensing device 106.
  • the centrally arranged component 126 may comprise both one or more integrated circuits and one or more discrete components.
  • the exposed side in Fig. 1 B is thus the side opposite the sensing side 108 of the biometric imaging device 100.
  • the PCB-substrate 114 further comprises one or more contact pads 130 arranged on the exposed side 117 of the PCB-substrate 114 and configured to electrically connect the biometric imaging device 100 to external circuitry such as circuitry of a smartcard or of an electronic user device.
  • Figs. 2A-B schematically illustrate a biometric imaging device 200 which in most respects is similar to the biometric imaging device 100 of Figs. 1A-B.
  • the PCB-substrate comprises a first section 202 having a first thickness and a second section 204 having a second thickness lower than the first thickness.
  • the biometric imaging device 200 further comprises a bond wire 206 forming an electrical connection between a contact pad 208 of the first section 102 and a contact pad 210 of the second section 204 of the PCB-substrate.
  • the first and second sections 202, 204 of the PCB-substrate consist of a central PCB- substrate arranged in an opening of a surrounding PCB-substrate 204.
  • the centrally arranged first section 202 of the PCB-substrate has more metal layers and finer features suitable for high density interconnection required to connect to e.g. an integrated circuit 126.
  • the outer PCB-substrate is both thinner and has fewer metal layers, which means that both cost and complexity is lower compared to for the first section 202.
  • the overall cost and complexity of the biometric imaging device 200 can thereby be reduced by using two different types of PCB-substrates as illustrated by the first and second sections 202, 204.
  • the skilled person readily realizes that many different configurations using two or more separate PCB-substrates are possible, for example by arranging several PCB-substrates side by side, and the illustrated implementation provides an example implementation to highlight the advantages of the described imaging device 200.
  • the gap between the two sections 202, 204 exposes the through opening of the reel-to-reel substrate 102 and also the contact pads 110 of the TFT-circuit 104 for wire bonding 120.
  • Figs. 3A-B schematically illustrate a biometric imaging device 300 which in most respects is similar to the device illustrated in Figs. 1-2, but with the difference that the reel-to-reel substrate is a functional substrate.
  • the reel-to-reel substrate 102 may comprise one or more conductive contact pads 302 and or conductive traces used to form electrical connections between components of the biometric imaging device and/or between the biometric imaging device and external circuitry.
  • Figs. 3A-B further illustrate that an electrical connection in the form of a bond wire 304 is formed between a contact pad 306 of the PCB-substrate 114 and the conductive contact pad 302 of the reel-to-reel substrate 102.
  • the functional reel-to- reel substrate can be combined with various examples of a a PCB-substrate comprising through-openings.
  • Figs. 4A-B illustrate a biometric imaging device 400 where a component 126 is arranged in an opening of the PCB-substrate 114 and thus directly on the reel-to-reel substrate 102.
  • the component 126 is in turn electrically connected to the PCB-substrate 114 using a first bond wire 402 and to the TFT-circuit 104 via the through opening 103 of the reel-to-reel substrate 102 using a second bond wire 404.
  • This solution reduces the total area of the PCB-substrate which in turn can reduce the cost of the device.
  • the overall thickness of the device can be reduced compared to if the component 126 is arranged on a PCB-substrate. Wire-bonding from the component 126 to other features of the imaging device can also be included in any of the aforementioned embodiments if required.
  • Fig. 5 is a schematic view of different layers of the TFT-circuit 104 which is here illustrated as being arranged on a polyimide film 512.
  • the lower layer 502 arranged closest to the polyimide film 512 is here described as an active layer 502 where the transistors are formed, illustrated by the active sensing portion 508 of the TFT-circuit.
  • the active layer 502 consist of a plurality of conducting and insulating layers to form the desired transistors and capacitive sensing functionality.
  • first and second connection layers 504, 506 where electrical connections to the active layer 502 are formed.
  • connection layers can be selected based on the requirements of a given application, and that the two connection layers in the presently described TFT-circuit should be seen as an illustrative example.
  • the contact pads are not shown in Fig. 5 but they may be formed in the second connection layer 506.
  • the sensing side 108 of the capacitive fingerprint sensing device formed by the TFT-circuit is thus defined as the side of the TFT-circuit where the active region 508 is closest to the surface of the circuit.
  • the finger 510 to be imaged is placed on the outer surface of the polyimide film 512 to thereby minimize the distance between the finger 510 and the active region 508.
  • the total thickness of the TFT-circuit 104 can be approximately 5 pm or below and it therefore requires structural support in the form of the polyimide film 512 and the reel-to-reel substrate in order to be manageable in an assembly process. Thereby, all of the aforementioned embodiments may comprise the described polyimide film if required for a specific manufacturing process.
  • the TFT-circuit 104 may also comprise an ink layer which is arranged on the polyimide film, and which is mainly provided for esthetic purposes.
  • Fig. 6 schematically illustrates a biometric imaging device 100 integrated in the body 602 of a smartcard 600. Here it can be seen that only an outer layer of the smartcard 600 separates the finger 510 from the biometric imaging device 100. Electrical connections are formed between the biometric imaging device 100 and a conductive layer 604 of the smartcard 600. As illustrated in Fig.
  • the electrical connection can be formed by forming a vertical connection between the conductive layer 604 and a contact pad 130 of the imaging device which in turn connects to the contact pad 110 of the fingerprint sensing device 106, thereby enabling an electrical connection between the fingerprint sensing device 106 and circuitry of the smartcard 600.
  • Fig. 7 schematically illustrates a smartcard 600 comprising a biometric imaging device 100, 200, 300, 400 according to embodiments of the invention.
  • the smartcard 600 is provided with means for wireless communication with a smartcard reader such as a point-of-sale (POS) terminal 700 and with a contact plate 702 for communication via physical contact with the terminal 700.
  • POS point-of-sale
  • the biometric imaging device can be connected to functionality in the smartcard such as a secure element, SE, used in fingerprint authentication and/or to the contact plate 702.
  • a secure element SE

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • Multimedia (AREA)
  • Automation & Control Theory (AREA)
  • Image Input (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)

Abstract

La présente invention concerne un dispositif d'imagerie biométrique (100, 200, 300, 400) comprenant : un substrat de bobine à bobine flexible (102) comprenant une pluralité d'ouvertures traversantes (103); un transistor à couches minces (TFT) (104) fixé à un premier côté (109) du substrat de bobine à bobine, le circuit TFT comprenant un dispositif capacitif de détection d'empreintes digitales (106) ayant un côté de détection (108) sur un premier côté de celui-ci, opposé au substrat de bobine à bobine (102), le dispositif capacitif de détection d'empreintes digitales comprenant des plots de contact électriquement conducteurs (110) sur un second côté (112) de celui-ci, faisant face au substrat de bobine à bobine et alignés avec les ouvertures du substrat de bobine à bobine ; un substrat de carte de circuit imprimé (RVB) (114) fixé à un second côté (115) du substrat de bobine à bobine, le substrat de PCB comprenant une trace conductrice (116) située sur un côté exposé (117) du substrat de PCB opposé au substrat de bobine à bobine ; et une connexion électrique entre la trace conductrice du substrat de PCB et les plots de contact conducteurs (110) du dispositif capacitif de détection d'empreintes digitales, par l'intermédiaire des ouvertures traversantes (103) du substrat de bobine à bobine.
PCT/SE2023/050828 2022-08-29 2023-08-16 Dispositif d'imagerie biométrique et procédé de fabrication de dispositif d'imagerie biométrique Ceased WO2024049340A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE2251002-8 2022-08-29
SE2251002 2022-08-29

Publications (1)

Publication Number Publication Date
WO2024049340A1 true WO2024049340A1 (fr) 2024-03-07

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Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080085038A1 (en) * 2006-10-05 2008-04-10 Chipmos Technologies (Bermuda) Ltd. Flim type package for fingerprint sensor
US20140352440A1 (en) * 2013-06-03 2014-12-04 Qualcomm Mems Technologies, Inc. Ultrasonic sensor with bonded piezoelectric layer
WO2015013530A1 (fr) * 2013-07-24 2015-01-29 Synaptics Incorporated Amélioration d'intensité de signal dans un réseau de capteurs biométriques
EP3336759A1 (fr) * 2016-12-15 2018-06-20 Fingerprint Cards AB Module de détection d'empreintes digitales et procédé de fabrication du module de détection d'empreintes digitales
US20200125815A1 (en) * 2018-10-17 2020-04-23 Qualcomm Incorporated Ultrasonic fingerprint sensor with flexible substrate
US20200279087A1 (en) * 2019-02-28 2020-09-03 Qualcomm Incorporated Module architecture for large area ultrasonic fingerprint sensor
WO2020212660A1 (fr) * 2019-04-19 2020-10-22 Linxens Holding Module de capteur biométrique pour carte à puce et procédé de fabrication d'un tel module
US20210150175A1 (en) * 2016-12-15 2021-05-20 Fingerprint Cards Ab Fingerprint sensing module and method for manufacturing the fingerprint sensing module
US20210296562A1 (en) * 2020-03-23 2021-09-23 Apple Inc. Thin-Film Acoustic Imaging System for Imaging Through an Exterior Surface of an Electronic Device Housing
EP3933697A1 (fr) * 2020-07-01 2022-01-05 Fingerprint Cards Anacatum IP AB Module d'imagerie biométrique et procédé de fabrication d'un module d'imagerie biométrique
US20220327856A1 (en) * 2021-03-31 2022-10-13 Gordon S. Franza Signal Processing for Segmented Thin-Film Acoustic Imaging Systems for Portable Electronic Devices
WO2022243432A1 (fr) * 2021-05-21 2022-11-24 Zwipe As Fabrication d'une carte à puce

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080085038A1 (en) * 2006-10-05 2008-04-10 Chipmos Technologies (Bermuda) Ltd. Flim type package for fingerprint sensor
US20140352440A1 (en) * 2013-06-03 2014-12-04 Qualcomm Mems Technologies, Inc. Ultrasonic sensor with bonded piezoelectric layer
WO2015013530A1 (fr) * 2013-07-24 2015-01-29 Synaptics Incorporated Amélioration d'intensité de signal dans un réseau de capteurs biométriques
EP3336759A1 (fr) * 2016-12-15 2018-06-20 Fingerprint Cards AB Module de détection d'empreintes digitales et procédé de fabrication du module de détection d'empreintes digitales
US20210150175A1 (en) * 2016-12-15 2021-05-20 Fingerprint Cards Ab Fingerprint sensing module and method for manufacturing the fingerprint sensing module
US20200125815A1 (en) * 2018-10-17 2020-04-23 Qualcomm Incorporated Ultrasonic fingerprint sensor with flexible substrate
US20200279087A1 (en) * 2019-02-28 2020-09-03 Qualcomm Incorporated Module architecture for large area ultrasonic fingerprint sensor
WO2020212660A1 (fr) * 2019-04-19 2020-10-22 Linxens Holding Module de capteur biométrique pour carte à puce et procédé de fabrication d'un tel module
US20210296562A1 (en) * 2020-03-23 2021-09-23 Apple Inc. Thin-Film Acoustic Imaging System for Imaging Through an Exterior Surface of an Electronic Device Housing
EP3933697A1 (fr) * 2020-07-01 2022-01-05 Fingerprint Cards Anacatum IP AB Module d'imagerie biométrique et procédé de fabrication d'un module d'imagerie biométrique
US20220327856A1 (en) * 2021-03-31 2022-10-13 Gordon S. Franza Signal Processing for Segmented Thin-Film Acoustic Imaging Systems for Portable Electronic Devices
WO2022243432A1 (fr) * 2021-05-21 2022-11-24 Zwipe As Fabrication d'une carte à puce

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