WO2024048612A1 - 硬化性組成物、硬化物、及び硬化物の製造方法 - Google Patents
硬化性組成物、硬化物、及び硬化物の製造方法 Download PDFInfo
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- WO2024048612A1 WO2024048612A1 PCT/JP2023/031333 JP2023031333W WO2024048612A1 WO 2024048612 A1 WO2024048612 A1 WO 2024048612A1 JP 2023031333 W JP2023031333 W JP 2023031333W WO 2024048612 A1 WO2024048612 A1 WO 2024048612A1
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- hydrogen compound
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- pka
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/66—Mercaptans
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
Definitions
- the present invention relates to a curable composition, a cured product, and a method for producing a cured product.
- Epoxy resins are used in various electrical and electronic parts. Among them, alicyclic epoxy resins have low viscosity and high transparency and weather resistance of cured products, so they are used for optical applications such as encapsulants and surface protective films for optical semiconductor devices and organic electroluminescent devices. ing.
- alicyclic epoxy resins have significantly lower reactivity than general-purpose epoxy resins such as bisphenol-type epoxy resins. Therefore, with active hydrogen compounds such as amines, the curing reaction does not proceed or takes a long time to cure. Therefore, attempts are being made to facilitate the curing reaction of alicyclic epoxy resins by using acid anhydride curing agents or by modifying the structure of epoxy resins (first study). .
- Patent Document 1 discloses a curable composition containing an alicyclic epoxy resin having a specific structure and an active hydrogen compound. Aliphatic amine curing agents are used as active hydrogen compounds. According to this document, it is said that by using an alicyclic epoxy resin having a specific structure, it is possible to cure even an active hydrogen compound.
- Patent Document 2 discloses a curable composition containing an alicyclic epoxy resin, a polyfunctional thiol, a curing agent, and a curing accelerator.
- Aliphatic thiol is used as a polyfunctional thiol
- acid anhydride is used as a curing agent
- p-toluenesulfonate of DBU is used as a curing accelerator.
- Patent Document 3 discloses a curable composition containing hexahydrophthalic acid diglycidyl ester, an alicyclic epoxy resin, a polythiol curing agent, and a curing accelerator.
- epoxy resin is a thermosetting resin that is cured by reacting with a curing agent.
- Most thermosetting resins are usually liquid before curing. Therefore, thermosetting resins have high adhesion to the adherend, making it easy to improve adhesive strength, and because they are liquid and have fluidity, the amount of filler added can be increased compared to thermoplastic resins. , it has advantages such as high dispersion of the filler.
- thermoplastic resins can be recycled by melting them again.
- thermosetting resins cannot be recycled because they do not melt once they have been cured. In other words, it is difficult to peel off the cured thermosetting resin after it has been adhered to the adherend. Therefore, studies have been conducted to impart thermoplasticity to cured products of thermosetting resins such as epoxy resins (second study).
- Patent Document 4 discloses a composition containing a bifunctional aromatic epoxy resin (A), a bifunctional phenol compound (B), and reinforcing fibers.
- Patent Document 5 discloses an adhesive containing a bifunctional aromatic epoxy resin, a bifunctional curing agent, and a curing catalyst.
- Patent Document 6 discloses an epoxy resin composition containing a bifunctional aromatic epoxy resin and at least one of a bifunctional amine compound, a phenol compound, and a thiol compound. It is said that by curing any of these compositions, a thermoplastic resin in which a bifunctional aromatic epoxy resin and a bifunctional curing agent are linearly polymerized can be obtained.
- Patent Document 1 requires the use of an alicyclic epoxy resin having a specific structure. It is desired that various alicyclic epoxy resins can be used without being limited to such a specific structure.
- the curable composition of Patent Document 2 contains a large amount of an acid anhydride curing agent, although the curing reaction proceeds, it takes a long time to obtain a cured product.
- the curable composition of Patent Document 3 contains a large amount of aromatic epoxy resin, the curing reaction progresses relatively easily, but when it contains a large amount of alicyclic epoxy resin, it takes a long time to obtain a cured product. It takes.
- the epoxy resins contained in the compositions shown in Patent Documents 4 to 6 are aromatic epoxy resins, the compositions cannot be cured. In this case, not only a reaction between the aromatic epoxy resin and the curing agent but also a reaction between the aromatic epoxy resins is likely to occur. Therefore, a part of the aromatic epoxy resin is easily crosslinked, and the resulting cured product is unlikely to be a highly linear polymer and does not have sufficient thermoplasticity.
- the cured product has sufficient thermoplasticity, the cured product can be remelted, making recycling and self-repair possible.
- the cured product can be peeled off from the adherend and can be easily dismantled.
- the composition before curing is liquid, it is possible to perform shear kneading such as three-roll dispersion, thereby making it possible to highly disperse the filler.
- thermoplastic resins For example, if it is possible to disperse a filler-containing composition by shear kneading and then melt the cured product, fillers that are difficult to disperse in an extruder for thermoplastic resins can be dispersed as a masterbatch. This makes it possible to add it in the same state. Therefore, it is further desired to be able to provide a cured product having thermoplasticity while having good workability similar to that of thermosetting resins.
- the present invention has been made in view of the above circumstances, and provides a curable composition, a cured product, and a method for producing the cured product that exhibits good curing reactivity even if it contains a large amount of alicyclic epoxy resin.
- the present invention relates to the following curable composition, cured product, method for producing the cured product, and thermoplastic resin.
- [1] Contains an alicyclic epoxy resin (A) and an active hydrogen compound (B1) having a pKa of 10 or less. Curable composition. [2] The curable composition according to [1], wherein the active hydrogen compound (B1) contains an aromatic thiol compound. [3] The alicyclic epoxy resin (A) is a bifunctional alicyclic epoxy resin (A'), and the active hydrogen compound (B1) with a pKa of 10 or less is a bifunctional alicyclic epoxy resin (A') with a pKa of 10 or less. The curable composition according to [1] or [2], which is an active hydrogen compound (B1').
- [4] Contains an alicyclic epoxy resin (A), an active hydrogen compound (B2) having a pKa of more than 10, and a cationic catalyst (C1), and the activity per 100 parts by mass of the alicyclic epoxy resin (A).
- the active hydrogen compound (B2) contains an aliphatic thiol compound.
- a curable composition comprising a bifunctional alicyclic epoxy resin (A'), a bifunctional active hydrogen compound (B2') having a pKa of more than 10, and a cationic catalyst (C1).
- a curable composition comprising: [8] The curable composition according to [7], wherein the active hydrogen compound (B2) contains an aliphatic thiol compound. [9] The curable composition according to [7] or [8], wherein the catalyst (C2) is a catalyst that generates cations by reaction with the active hydrogen compound (B2), and contains dicyandiamide.
- the alicyclic epoxy resin (A) is a bifunctional alicyclic epoxy resin (A'), and the active hydrogen compound (B2) with a pKa of more than 10 is a bifunctional alicyclic epoxy resin (A') with a pKa of more than 10.
- the curable composition according to any one of [7] to [9], which is an active hydrogen compound (B2').
- thermoplastic resin containing a structural unit derived from a bifunctional alicyclic epoxy resin (A') and a structural unit derived from a bifunctional active hydrogen compound (B').
- a curable composition it is possible to provide a curable composition, a cured product, and a method for producing a cured product that exhibits good curing reactivity even if it contains a large amount of alicyclic epoxy resin.
- a curable composition and a thermoplastic resin that can provide a cured product having thermoplasticity while having good workability similar to that of a thermosetting resin.
- FIGS. 1A and 1B are photographs showing the appearance of the cured product obtained with composition 2-6 before and after heating.
- FIGS. 2A and 2B are photographs showing the appearance of the cured product obtained with Composition 2-7 before and after heating.
- FIG. 3A is a diagram showing the curing reaction mechanism of Composition 2-6
- FIG. 3B is a diagram showing the TOF-MS spectrum of the cured product.
- FIG. 4A is a photograph showing the SEM observation results of the sample sheet surface of Composition 2-6
- FIGS. 4B and 4C are photographs showing the EDX results.
- alicyclic epoxy resin especially a bifunctional alicyclic resin having an epoxy group (hereinafter also referred to as "alicyclic epoxy group") composed of two adjacent carbon atoms and an oxygen atom constituting the alicyclic Formula epoxy resins have lower curing reactivity than general-purpose epoxy resins such as bisphenol-type epoxy resins.
- the present inventors 1) Whether to use an active hydrogen compound that easily releases H + (i.e., an active hydrogen compound with a low pKa) as a curing agent; 2) Use an active hydrogen compound that is difficult to release H + as a curing agent (i.e., an active hydrogen compound with a high pKa) and a cationic catalyst (C1); or 3)
- an active hydrogen compound with a high pKa as a curing agent together with a catalyst (C2) that generates cations by reaction with it or by light irradiation, the alicyclic epoxy resin can be easily activated and the curing reaction can be accelerated.
- a cured product with a high refractive index can be obtained; furthermore, by using an aliphatic thiol-based compound, a cured product with a high refractive index, flexibility and high bendability can be obtained. It has been found that a cured product having a high elastic modulus can be obtained.
- the curable composition according to one embodiment of the present invention includes an alicyclic epoxy resin (A) and components for curing it.
- Active hydrogen compound (B1) with pKa of 10 or less 2) A combination of an active hydrogen compound (B2) with a pKa of more than 10 and a cationic catalyst (C1), or 3) Contains a combination of an active hydrogen compound (B2) with a pKa of over 10 and a catalyst (C2) that generates cations by reaction or light irradiation.
- the present inventors have found that in the above curing system, the bifunctional alicyclic epoxy resin (A') tends to linearly polymerize with the bifunctional active hydrogen compound (B').
- the epoxy group of the alicyclic epoxy resin after reacting with the acid anhydride, opens the ring and becomes an oxygen anion (-O - ). It also reacts with other alicyclic epoxy resins and is likely to be three-dimensionally crosslinked (see below).
- the epoxy group of the alicyclic epoxy resin becomes -OH by cations (H + ) after reacting with the active hydrogen compound. It does not react with epoxy resins, only with active hydrogen compounds (see below). In other words, since the reaction proceeds without going through oxygen anions, it is difficult for alicyclic epoxy resins to react with each other. Therefore, it is possible to linearly bond in the order of alicyclic epoxy resin, active hydrogen compound, alicyclic epoxy resin, etc. without three-dimensional crosslinking. Thereby, a cured product having thermoplasticity can be obtained.
- the above-mentioned curable composition can provide a cured product having thermoplasticity while having good workability equivalent to that of a thermosetting resin. Further, such a cured product having thermoplasticity exhibits self-healing properties such that even if a crack occurs, the crack disappears by being softened or melted by heating. Therefore, for example, a cured product adhered to an adherend can be peeled off from the adherend by softening or melting it by heating, and can be recycled.
- Curable Composition The curable composition according to one embodiment of the present invention includes an alicyclic epoxy resin (A), an active hydrogen compound (B), and an arbitrary curing catalyst (C).
- Alicyclic epoxy resin (A) is a compound having two or more epoxy groups in one molecule, preferably an epoxy group (hereinafter referred to as an epoxy group) composed of two or more adjacent carbon atoms and oxygen atoms constituting an alicyclic ring. , also referred to as "alicyclic epoxy group").
- an epoxy group hereinafter referred to as an epoxy group
- the epoxy group composed of carbon atoms and oxygen atoms constituting the alicyclic ring has low curing reactivity, so it is hardened by the active hydrogen compound (B)/curing catalyst (C) of 1) to 3) above. This is particularly effective.
- the number of epoxy groups contained in one molecule of the alicyclic epoxy resin (A) is not particularly limited, but is preferably 2 or more, more preferably 2 to 4. That is, the alicyclic epoxy resin (A) may be a bifunctional alicyclic epoxy resin (A') having two epoxy groups in one molecule, or a bifunctional alicyclic epoxy resin (A') having three or more epoxy groups in one molecule. It may be a trifunctional or more functional alicyclic epoxy resin.
- the alicyclic epoxy group in the compound having an alicyclic epoxy group includes a cyclohexene oxide group, a cyclopentene oxide group, and the like.
- Examples of compounds having an alicyclic epoxy group include compounds represented by the following formula (i).
- X represents a single bond or a connecting group.
- linking groups include divalent hydrocarbon groups, alkenylene groups in which part or all of the carbon-carbon double bond is epoxidized (hereinafter also referred to as "epoxidized alkenylene groups"), carbonyl groups, ether bonds, and esters. Examples include bonds, siloxane bonds, carbonate groups, amide groups, and groups in which a plurality of these are connected.
- a substituent for example, an alkyl group, etc. may be bonded to the cyclohexene oxide group in formula (i).
- Examples of the divalent hydrocarbon group include a linear or branched alkylene group having 1 to 18 carbon atoms and a divalent alicyclic hydrocarbon group.
- Examples of the linear or branched alkylene group having 1 to 18 carbon atoms include methylene group, methylmethylene group, dimethylmethylene group, ethylene group, propylene group, and trimethylene group.
- Examples of divalent alicyclic hydrocarbon groups include 1,2-cyclopentylene group, 1,3-cyclopentylene group, cyclopentylidene group, 1,2-cyclohexylene group, and 1,3-cyclohexylene group. Cycloalkylene groups (including cycloalkylidene groups) such as silene group, 1,4-cyclohexylene group, and cyclohexylidene group are included.
- alkenylene group in the epoxidized alkenylene group examples include a vinylene group, a propenylene group, a 1-butenylene group, a 2-butenylene group, a butadienylene group, a pentenylene group, a hexenylene group, a heptenylene group, an octenylene group, etc. Includes linear or branched alkenylene groups.
- the epoxidized alkenylene group is preferably an alkenylene group in which all carbon-carbon double bonds are epoxidized, more preferably an alkenylene group having 2 to 4 carbon atoms in which all carbon-carbon double bonds are epoxidized. It is.
- Examples of the compound represented by formula (i) include (3,4,3',4'-diepoxy)bicyclohexyl, bis(3,4-epoxycyclohexylmethyl)ether, 1,2-epoxy-1, 2-bis(3,4-epoxycyclohexan-1-yl)ethane, 2,2-bis(3,4-epoxycyclohexan-1-yl)propane, 1,2-bis(3,4-epoxycyclohexane-1) -yl)ethane and compounds represented by the following formulas (i-1) to (i-9).
- l and m in the following formulas (i-5) and (i-7) each represent an integer from 1 to 30.
- R' in the following formula (i-5) is an alkylene group having 1 to 8 carbon atoms, and among them, a linear or Branched alkylene groups are preferred.
- Examples of compounds having an alicyclic epoxy group include, for example, the following compounds in addition to the compound represented by the above formula (i).
- Examples of compounds having an alicyclic epoxy group include, in addition to compounds represented by formula (i), compounds having an alicyclic epoxy group in the molecule, such as those represented by the following formulas (ii-1) to (ii-3). Compounds having three or more groups and compounds having one alicyclic epoxy group in the molecule represented by the following formulas (iii-1) to (iii-3) are also included.
- n1 to n6 in the following formulas (ii-1) and (ii-2) each represent an integer of 1 to 30.
- the epoxy equivalent of the alicyclic epoxy resin (A) is not particularly limited, but for example, if the purpose is to improve the refractive index, the epoxy equivalent is preferably moderately low. Similarly, for the purpose of improving the flexural modulus, it is preferable that the epoxy equivalent is appropriately low in order to increase the content of the polyfunctional active hydrogen compound. From these viewpoints, the epoxy equivalent of the alicyclic epoxy resin (A) is preferably 70 to 200 g/eq, more preferably 80 to 140 g/eq. Epoxy equivalent can be measured according to JIS K 7236.
- the content of the alicyclic epoxy resin (A) depends on the use, the presence or absence of a filler, etc., but may be, for example, 1 to 70 parts by mass based on 100 parts by mass of the nonvolatile components of the curable composition.
- a curable composition with a lower viscosity can be easily obtained, and a cured product with higher transparency and weather resistance can be easily obtained.
- the nonvolatile component refers to a component that does not volatilize at room temperature, and specifically refers to a component other than the solvent.
- the active hydrogen compound (B) is a compound containing a functional group having active hydrogen.
- functional groups having active hydrogen include phenolic hydroxyl groups, thiol groups, amino groups, and the like.
- the number of functional groups having active hydrogen contained in one molecule of the active hydrogen compound (B) may be 2 or more.
- the active hydrogen compound (B) may be a bifunctional active hydrogen compound (B') having two functional groups having active hydrogen in one molecule, or it may be a bifunctional active hydrogen compound (B') having two functional groups having active hydrogen in one molecule, or it may have three or more functional groups having active hydrogen in one molecule. It may be a trifunctional or more functional active hydrogen compound.
- the curable composition contains, as a component for curing the alicyclic epoxy resin (A), 1) an active hydrogen compound (B1) having a pKa of 10 or less, or 2) a pKa having a 3) contains an active hydrogen compound (B2) with a pKa of more than 10 and a cation catalyst (C1), or 3) an active hydrogen compound (B2) with a pKa of more than 10, and a catalyst (C2) that generates cations by reaction or light irradiation. ).
- the pKa of the active hydrogen compound (B1) in 1) above is 10 or less, preferably 6 to 10.
- An active hydrogen compound having such a low pKa easily releases H + and therefore easily activates the alicyclic epoxy resin. Therefore, the alicyclic epoxy resin can be cured even in the absence of a catalyst.
- the active hydrogen compound (B1) may be a bifunctional active hydrogen compound (B1') or a trifunctional or more functional active hydrogen compound.
- pKa is an acid dissociation equilibrium constant
- pKa -logKa
- Ka [H 3 O + ] [B ⁇ ]/[BH] (BH: organic acid, B ⁇ : conjugate base of organic acid)
- pKa means the first dissociation constant pKa1 when two or more acidic groups are contained in one molecule of the curing agent.
- the acid dissociation constant (pKa) of an active hydrogen compound differs depending on the structure of the active hydrogen compound. That is, the pKa of a compound in which a functional group having active hydrogen is directly bonded to an aromatic group (aromatic ring) is lower than the pKa of a compound in which a functional group having an active hydrogen is directly bonded to an aliphatic group. Furthermore, pKa is lower in the order of thiol ⁇ alcohol ⁇ amine.
- the acid dissociation constant (pKa) also differs depending on the type of solvent surrounding the active hydrogen compound.
- pKa in water is used as an index.
- pKa can be calculated from the concentration of the relevant substance and the hydrogen ion concentration by measuring the hydrogen ion concentration in water using, for example, a pH meter.
- the pKa value is known in the literature (for example, pKa Data Compiled by R. Williams, https://organicchemistrydata.org/hansreich/resources/pka/pka_data/pka-compilation-williams.pdf).
- pKa is not known in literature, etc., describe the active hydrogen compound in a demonstrative formula and calculate the number of carbon atoms from the carbon atom bonded to the functional group having active hydrogen by two or more carbon atoms.
- the pKa value of a matching compound (a compound corresponding to a site having two or more carbon atoms starting from the carbon atom bonded to the functional group having active hydrogen) may be employed.
- the pKa of 4,4'-thiobisbenzenethiol can be the pKa value of thiophenol.
- Examples of the active hydrogen compound (B1) having a pKa of 10 or less include thiol compounds having a pKa of 10 or less and bisphenol compounds having a pKa of 10 or less.
- These curing agents may be compounds in which an active hydrogen functional group such as thiol or alcohol is directly bonded to a conjugated structure such as a benzene ring. In a curing agent in which a conjugated structure and an active hydrogen functional group are bonded in this way, the conjugated base state is stabilized, so that hydrogen ions are easily released.
- Bisphenol compounds with a pKa of 10 or less are compounds that have two phenolic hydroxyl groups in one molecule; examples include 2,2-bis(4-hydroxyphenyl)propane (bisphenol A), 1,1 -Bisphenols such as bis(4-hydroxyphenyl)ethane (bisphenol AD), bis(hydroxyphenyl)methane (bisphenol F), bisphenol fluorene, and biscresol fluorene are included.
- the thiol-based compound with a pKa of 10 or less may be any compound that has two or more thiol groups in one molecule and has a pKa that satisfies the above range, preferably a thiol-based compound containing an aromatic ring (aromatic thiol-based compound). ).
- the number of aromatic rings contained in one molecule of the aromatic thiol compound may be at least 1, preferably 1 to 3, and more preferably 1 to 2.
- aromatic thiol compounds include 1,2-dimercaptobenzene, 1,3-dimercaptobenzene, 1,4-dimercaptobenzene, 1,2-bis(mercaptomethyl)benzene, 1,3-bis(mercaptomethyl)benzene, 1,4- Bis(mercaptomethyl)benzene, 1,3-bis(mercaptoethyl)benzene, 1,4-bis(mercaptoethyl)benzene, 1,2-bis(mercaptomethoxy)benzene, 1,3-bis(mercaptomethoxy)benzene , 1,4-bis(mercaptomethoxy)benzene, 1,2-bis(mercaptoethoxy)benzene, 1,3-bis(mercaptoethoxy)benzene, 1,4-bis(mercaptoethoxy)benzene, 2,2'- Dimercaptobiphenyl, 4,4'-dimercaptobiphenyl, 4,4'-dimercaptobibenzyl, 2,
- the aromatic thiol compound may further contain a sulfur atom in addition to the thiol group.
- aromatic thiol compounds include: 1,2-bis(mercaptomethylthio)benzene, 1,3-bis(mercaptomethylthio)benzene, 1,4-bis(mercaptomethylthio)benzene, 1,2-bis(mercaptoethylthio)benzene, 1,3-bis Difunctional aromatic thiol compounds such as (mercaptoethylthio)benzene, 1,4-bis(mercaptoethylthio)benzene, and 4,4'-thiobisbenzenethiol; 1,2,3-tris(mercaptomethylthio)benzene, 1,2,4-tris(mercaptomethylthio)benzene, 1,3,5-tris(mercaptomethylthio)benzene, 1,2,3-tris(mercaptoethylthio) ) benzene, 1,2,4-tris(mercaptoethy
- the thiol equivalent of the thiol-based compound having a pKa of 10 or less is not particularly limited, but is, for example, 300 g/eq or less, preferably 150 g/eq or less. When the thiol equivalent is within this range, the curing reactivity of the curable composition and the refractive index of the cured product can be further increased.
- the number of thiol groups (number of functional groups) contained in one molecule of a thiol compound having a pKa of 10 or less is 2 (bifunctional) or 3 or more (trifunctional or more), preferably 2 to 10, More preferably 2 to 4, more preferably 3.
- the number of thiol groups is within this range, the curing reactivity of the curable composition and the refractive index of the cured product can be further increased.
- the weight average molecular weight of the thiol compound having a pKa of 10 or less is not particularly limited, but is preferably from 100 to 10,000, more preferably from 100 to 1,000.
- the weight average molecular weight can be measured by GPC in terms of polystyrene.
- the active hydrogen compound (B1) with a pKa of 10 or less preferably contains a thiol compound with a pKa of 10 or less, and more preferably contains a thiol compound with a pKa of 7 or less.
- the content of the active hydrogen compound (B1) having a pKa of 10 or less is 15 to 400 parts by mass based on 100 parts by mass of the total amount of the resin containing epoxy groups (preferably the total amount of the alicyclic epoxy resin (A)). It is preferable. When the content of the active hydrogen compound (B1) is 15 parts by mass or more, the alicyclic epoxy resin is more easily activated and sufficient curing reactivity is easily obtained. When the content of the active hydrogen compound (B1) is 400 parts by mass or less, the increase in viscosity of the cured composition is easily suppressed, so that the handleability is less likely to be impaired. From the same viewpoint, the content of the active hydrogen compound (B1) is 30 to 200 parts by mass based on 100 parts by mass of the total amount of resin containing epoxy groups (preferably the total amount of alicyclic epoxy resin (A)). It is more preferable.
- an active hydrogen compound (B2) having a pKa of more than 10 and a cationic catalyst (C1) are included as components for curing the alicyclic epoxy resin.
- the active hydrogen compound (B2) in 2) above has a pKa of more than 10, preferably 10 to 14. Since active hydrogen compounds having such a high pKa hardly release H + , it is difficult to activate the alicyclic epoxy resin alone. Therefore, the alicyclic epoxy resin can be cured by further combining the cationic catalyst (C1) that can generate H + .
- the active hydrogen compound (B2) may be a bifunctional active hydrogen compound (B2') or a trifunctional or more functional active hydrogen compound.
- the active hydrogen compound (B2) with a pKa of more than 10 preferably contains an amine compound with a pKa of more than 10 or a thiol compound with a pKa of more than 10.
- the amine compound having a pKa of more than 10 may be a compound having two or more amino groups in one molecule and having a pKa satisfying the above range, preferably 11 or more, more preferably 15 or more, and preferably has an aromatic ring.
- aromatic amine compounds include 4,4'-diaminodiphenylsulfide (manufactured by Seika, ASD) and 4,4'-diaminodiphenylsulfone (manufactured by Seika, Seika Cure S).
- primary amines can also be used.
- the thiol-based compound having a pKa of more than 10 may be any compound that has two or more thiol groups in one molecule and has a pKa that satisfies the above range, and is preferably a thiol-based compound that does not contain an aromatic ring (an aliphatic thiol-based compound). compound).
- the aliphatic thiol compound may be an aliphatic thiol compound having an ester bond in the molecule, or may be an aliphatic thiol compound having no ester bond in the molecule.
- aliphatic thiol compounds having an ester bond in the molecule include: Difunctional aliphatic thiol compounds such as 1,4-bis(3-mercaptobutyryloxy)butane (manufactured by Showa Denko, Karenz MT (registered trademark) BD1); Trimethylolpropane tris(3-mercaptopropionate) (manufactured by SC Organic Chemical Co., Ltd., TMMP), tris-[(3-mercaptopropionyloxy)-ethyl]-isocyanurate (manufactured by SC Organic Chemical Co., Ltd., TEMPIC), pentaerythritol Tetrakis(3-mercaptopropionate) (manufactured by SC Organic Chemical Co., Ltd., PEMP), tetraethylene glycol bis(3-mercaptopropionate) (manufactured by SC Organic Chemical Co., Ltd., EGMP-4), dipentaerythri
- Examples of aliphatic thiol compounds having no ester bond in the molecule include compounds represented by the following formula (1) or (2).
- R 1 and R 2 are each independently selected from the group consisting of a hydrogen atom and an alkyl group having 1 to 12 carbon atoms.
- R 3 , R 4 , R 5 and R 6 are each independently selected from the group consisting of mercaptomethyl, mercaptoethyl and mercaptopropyl.
- Examples of the compound represented by formula (1) include 1,3,4,6-tetrakis(2-mercaptoethyl)glycoluril (manufactured by Shikoku Kasei Kogyo Co., Ltd., TS-G), (1,3,4, 6-tetrakis (3-mercaptopropyl) glycoluril (manufactured by Shikoku Kasei Kogyo Co., Ltd., C3 TS-G), 1,3,4,6-tetrakis (mercaptomethyl) glycoluril, 1,3,4,6-tetrakis ( Mercaptomethyl)-3a-methylglycoluril, 1,3,4,6-tetrakis(2-mercaptoethyl)-3a-methylglycoluril, 1,3,4,6-tetrakis(3-mercaptopropyl)-3a- Methylglycoluril, 1,3,4,6-tetrakis(mercaptomethyl)-3a,6a-dimethylglycoluri
- A is a residue of a polyhydric alcohol having n+m hydroxyl groups.
- R 7 is independently an alkylene group having 1 to 10 carbon atoms.
- R 8 is independently a hydrogen atom or an alkyl group having 1 to 10 carbon atoms.
- m is an integer greater than or equal to 0.
- n is an integer of 3 or more.
- Examples of the compound represented by formula (2) include pentaerythritol tripropanethiol (manufactured by SC Organic Chemical Co., Ltd., Multiol Y-3), pentaerythritol tetrapropanethiol, and the like. Among these, pentaerythritol tripropanethiol is particularly preferred.
- trifunctional or higher functional polythiol compounds having two or more sulfide bonds in the molecule can also be used as aliphatic thiol compounds having no ester bonds in the molecule.
- thiol compounds include 1,2,3-tris(mercaptomethylthio)propane, 1,2,3-tris(2-mercaptoethylthio)propane, and 1,2,3-tris(3-mercaptoethylthio)propane.
- the thiol equivalent of the thiol compound having a pKa of more than 10 is not particularly limited, but is, for example, 90 to 160 g/eq, preferably 90 to 140 g/eq.
- the curing reactivity of the curable composition is good. It is easier to increase the curing reactivity of the curable composition, and it is also easier to increase the refractive index, flexural modulus, etc. of the cured product.
- the number of thiol groups (number of functional groups) contained in one molecule of a thiol compound having a pKa of more than 10 is, as described above, 2 (bifunctional) or 3 (trifunctional) or more, preferably 2 to 4, or more. Preferably it is 3 to 4, more preferably 4.
- the number of thiol groups is at least the lower limit, it is easier to increase the curing reactivity of the curable composition, and it is also easier to increase the refractive index, flexural modulus, etc. of the cured product. Further, when the number of thiol groups is 4 or less, the number of thiol groups remaining unreacted can be further reduced, and deterioration of physical properties can be suppressed.
- the weight average molecular weight of the thiol compound having a pKa of more than 10 is not particularly limited, but is preferably from 100 to 10,000, more preferably from 100 to 1,000.
- the weight average molecular weight can be measured by the same method as above.
- the content of the active hydrogen compound (B2) having a pKa of more than 10 is 40 to 200 parts by mass based on 100 parts by mass of the total amount of resin containing epoxy groups (preferably the total amount of alicyclic epoxy resin).
- the content of the curing agent (B2) is 40 parts by mass or more, the alicyclic epoxy resin is more easily activated and the curing reactivity is more easily increased.
- the content of the active hydrogen compound (B2) is 200 parts by mass or less, the increase in viscosity of the cured composition can be further suppressed, so that handling properties are less likely to be impaired.
- the content of the curing agent (B2) is preferably 50 to 150 parts by mass based on 100 parts by mass of the total amount of resin containing epoxy groups (preferably the total amount of alicyclic epoxy resin). preferable.
- the cationic catalyst (C1) is a compound that promotes the release of H + and is a compound that promotes the reaction between the epoxy resin and the active hydrogen compound without promoting self-polymerization of the epoxy resin alone.
- the fact that self-polymerization is not promoted can be confirmed by the fact that a mixture of only an epoxy resin and a catalyst does not generate heat (cure) due to heat.
- two epoxy groups react with one epoxy group, that is, in alicyclic epoxy resins that have two epoxy groups, each molecule reacts with four epoxy groups, so the degree of crosslinking increases. Toughness tends to decrease.
- the cationic catalyst (C1) plays a role in promoting the activation of epoxy groups and the activation of active hydrogen compounds without causing such a self-polymerization reaction.
- the reaction can proceed quickly. Therefore, it can also be used as a catalyst for two-component curable compositions in environments where heating is not possible, such as in cold regions, or when it is desired to suppress the heating/light irradiation energy required to generate cations such as catalyst (C2). .
- Activation of an epoxy group means that it interacts with the oxygen of the epoxy group and facilitates nucleophilic attack on the carbon of the epoxy group.
- Examples of compounds that can interact with the oxygen of the epoxy group include positively charged compounds.
- the reaction mechanism is that the oxygen atom of the epoxy group interacts with the positively charged catalyst, and the carbon atom of the epoxy group becomes slightly positively charged, promoting nucleophilic attack by the activated hydrogen compound.
- Activation of an active hydrogen compound means abstracting hydrogen from the active hydrogen compound. Therefore, the cationic catalyst (C1) is a base used during curing of the epoxy resin, and preferably maintains a positively charged state after abstracting hydrogen and has a three-dimensional structure capable of interacting with the oxygen of the epoxy group. It is a compound.
- Such a cationic catalyst (C1) is preferably an amine.
- the amines include ammonium salts, amines having an amidine structure, amines having a guanidine structure, and the like.
- the ammonium salt include triethylmethylammonium 2-ethylhexane salt (product name: U-CAT 18X, manufactured by San-Apro).
- Examples of amines having an amidine structure include diazabicycloundecene (DBU) and diazabicyclononene (DBN), and salts of the amines include DBU 2-ethylhexanoate (product name: SA1, San-Apro Co., Ltd.). (manufactured by), etc.
- Amines having a guanidine structure include tetramethylguanidine, and salts include 1,2-Dicyclohexyl-4,4,5,5-tetramethylbiguanidium n-butyltriphenylborate (product name: WPGK-300 (Fuji Film Wako)), etc.
- amines having an amidine structure or salts thereof amines having a guanidine structure or salts thereof are preferable, and amines having a guanidine structure or salts thereof are more preferable.
- the content of the cationic catalyst (C1) is preferably 1 to 10 parts by mass based on 100 parts by mass of the total amount of resin containing epoxy groups (preferably the total amount of alicyclic epoxy resin).
- the content of the cationic catalyst (C1) is 1 part by mass or more, the alicyclic epoxy resin is more easily activated and sufficient curing reactivity is easily obtained.
- the content of the cationic catalyst (C1) is 10 parts by mass or less, the time during which the catalyst can be used without curing after addition (referred to as pot life) can be extended. Further, it is possible to further suppress deterioration of physical properties such as glass transition temperature and elastic modulus due to excessive residual of the catalyst in the cured product.
- the content of the cationic catalyst (C1) is more preferably 1 to 5 parts by mass based on 100 parts by mass of the total amount of resin containing epoxy groups (preferably the total amount of alicyclic epoxy resin). .
- the components for curing the alicyclic epoxy resin include an active hydrogen compound (B2) with a pKa of more than 10 and a catalyst (C2) that generates cations by reaction or light irradiation.
- an active hydrogen compound having a high pKa is difficult to release H + , so it is difficult to activate an alicyclic epoxy resin alone. Therefore, by further combining a catalyst (C2) that can generate H + by reaction or light irradiation, the curing reactivity of the alicyclic epoxy resin can be increased.
- the curing timing can be adjusted by the timing of reaction and light irradiation, it is easy to achieve both storage stability and storage stability.
- the curable composition containing the catalyst (C2) has fluidity even when stored at 40° C. for 24 hours, and has excellent storage stability. Therefore, catalyst (C2) is particularly suitable as a catalyst for a one-component curable composition.
- the active hydrogen compound (B2) having a pKa of more than 10 can be the same as mentioned above, and is selected depending on the type of catalyst (C2).
- the active hydrogen compound (B2) is preferably an active hydrogen compound that reacts with dicyandiamide to produce guanidine (reaction promoter).
- the active hydrogen compound (B2) is a thiol compound
- dicyandiamide reacts with heating as follows to produce guanidine.
- the generated guanidine further reacts with a thiol-based compound to become a guanidium ion, which promotes ring opening of the alicyclic epoxy resin (see below).
- the compound that reacts with dicyandiamide to produce guanidine is preferably an aliphatic thiol compound, more preferably a tetrafunctional or higher aliphatic thiol compound, and 1,3,4,6-tetrakis(2 More preferred are -mercaptoethyl)glycoluril and 1,3,4,6-tetrakis(3-mercaptopropyl)glycoluril.
- the content of the active hydrogen compound (B2) having a pKa of more than 10 may be the same as in the case of 2) above.
- the catalyst (C2) that generates cations by reaction or light irradiation is a catalyst that generates cations by reaction with the active hydrogen compound (B2) or by light irradiation.
- the catalyst that generates cations by reaction has the same function as the cationic catalyst (C1) except that it contributes to the activation of the epoxy group by becoming positively charged after activating the active hydrogen compound (B2).
- Examples of such catalysts include dicyandiamide and the like. Controlling the reaction with the active hydrogen compound (B2) is desirable in that the start of curing can be controlled.
- Examples of catalysts that generate cations by light irradiation include photobase generators.
- Examples of the photobase generator include carboxylic acid salts, salts containing borate anions, and quaternary ammonium salts.
- a strong base such as amidine, guanidine, or phosphazene base can be generated from a weak base such as an aliphatic amine compound. Therefore, the reaction with the alicyclic epoxy resin tends to proceed in a chain manner, and the curing reactivity tends to increase.
- a quaternary ammonium salt one containing imidazole or amidine as a base-reactive substance is preferable from the viewpoint of increasing curing reactivity.
- the content of the catalyst (C2) is preferably 0.5 to 10 parts by mass based on 100 parts by mass of the total amount of resin containing epoxy groups (preferably the total amount of alicyclic epoxy resin).
- the content of the catalyst (C2) is 0.5 parts by mass or more, the alicyclic epoxy resin is more easily activated and sufficient curing reactivity is easily obtained.
- the content of the catalyst (C2) is 10 parts by mass or less, deterioration of physical properties such as glass transition temperature and elastic modulus due to excessive residual of the catalyst in the cured product can be further suppressed.
- the content of the catalyst (C2) is more preferably 1 to 5 parts by mass based on 100 parts by mass of the total amount of resin containing epoxy groups (preferably the total amount of alicyclic epoxy resin).
- the content of the catalyst (C2) is preferably 0.5 to 10 parts by mass based on 100 parts by mass of the active hydrogen compound (B2). , more preferably 1 to 5 parts by mass.
- the content of the catalyst (C2) is within the above range, a sufficient amount of guanidine is easily produced by reaction with the active hydrogen compound (B2), and the curing reactivity is more likely to be increased.
- the curable composition may further contain other components depending on the application.
- examples of other components include other epoxy resins, sensitizers, antioxidants, surfactants, coupling agents, stabilizers, fillers, solvents, and the like.
- Examples of other epoxy resins include aliphatic epoxy resins, aromatic epoxy resins, and the like.
- the content of the other epoxy resins is lower than the content of the alicyclic epoxy resin, for example, from the viewpoint of suppressing storage stability and reduction in flexural modulus. It is preferable.
- a sensitizer when using a catalyst (C2) that generates cations upon irradiation with light, a sensitizer may be further used in combination.
- the sensitizer has the function of improving the sensitivity of the curing reaction.
- the sensitizer may be any compound that can transfer stimulation energy such as heat or light to another substance, and sensitizers containing a naphthalene structure, anthracene structure, or thioxanthone structure, etc. can be used.
- the mass ratio of the sensitizer to the catalyst (C2) (sensitizer/catalyst (C2)) may be, for example, 0.1 to 0.5 from the viewpoint of increasing the activity of the catalyst (C2).
- the pot life can be extended by using a stabilizer as a curing accelerator.
- stabilizers include borates such as triethylborate, triisopropylborate, trimethylborate, tri-n-propylborate, tri-n-butylborate, and the like.
- the alicyclic epoxy resin (A) when using the curable composition in paints, etc., it is expected that the alicyclic epoxy resin (A) can be used without adding a solvent because it has a low viscosity, but if a lower viscosity is required. may further contain a solvent.
- the content of the solvent is preferably 0 to 100%, more preferably 0 to 50%, even more preferably 0 to 20%, based on the nonvolatile components of the curable composition.
- the content of the acid anhydride curing agent is small.
- the content of the acid anhydride curing agent may be 40 parts by mass or less, preferably 20 parts by mass or less, and more preferably 10 parts by mass or less, based on 100 parts by mass of the curable composition.
- a curable composition containing an alicyclic epoxy resin (A), an active hydrogen compound (B), and an arbitrary curing catalyst (C) is shown, but the use is not limited to this. It is also possible to use a two-part curable composition that combines a first part and a second part, which are sometimes mixed together.
- a cationic catalyst (C1) when using a cationic catalyst (C1), a combination of a first liquid containing an alicyclic epoxy resin (A), a cationic catalyst (C1), and a second liquid containing an active hydrogen compound (B2) It may also be a liquid type curable composition.
- the alicyclic epoxy resin (A) only needs to be contained in at least one of the first liquid and the second liquid.
- the first and second parts have similar viscosities. That is, the alicyclic epoxy resin (A) may be contained in both the first liquid and the second liquid in order to adjust the viscosity of the first liquid and the second liquid.
- a two-part type combining a first part containing the alicyclic epoxy resin (A) and a second part containing the active hydrogen compound (B2) and the catalyst (C2) may be used. It may also be a curable composition. In the two-part curable composition, from the viewpoint of ease of mixing, it is preferable that the first and second parts have similar viscosities.
- a two-component curable composition may be prepared by combining a first solution containing the above and a second solution containing the alicyclic epoxy resin (A) and the active hydrogen compound (B2).
- components (A) and (B) can be combined with any number of functional groups, but while having good curing reactivity, From the viewpoint of imparting a thermoplastic resin to the cured product, it is preferable to combine the bifunctional (A) component and the bifunctional (B) component.
- the curable composition can include a bifunctional alicyclic epoxy resin (A'), a bifunctional active hydrogen compound (B'), and an arbitrary curing catalyst (C).
- the curable composition contains, as a component for curing the bifunctional alicyclic epoxy resin (A'), 1) Contains a bifunctional active hydrogen compound (B1') with a pKa of 10 or less, 2) contains a bifunctional active hydrogen compound (B2') with a pKa of more than 10 and a cationic catalyst (C1), or 3) reacts with a bifunctional active hydrogen compound (B2') with a pKa of more than 10.
- it may contain a catalyst (C2) that generates cations upon irradiation with light.
- the bifunctional alicyclic epoxy resin (A') is the above-mentioned bifunctional alicyclic epoxy resin (A').
- Examples of the bifunctional alicyclic epoxy resin (A') include the compound represented by the above formula (i).
- the bifunctional active hydrogen compound (B1') is the above-mentioned bifunctional active hydrogen compound (B1').
- Examples of the bifunctional active hydrogen compound (B1') include the above-mentioned bifunctional bisphenol compounds having a pKa of 10 or less and bifunctional thiol compounds having a pKa of 10 or less.
- the thiol equivalent of the bifunctional thiol compound having a pKa of 10 or less is not particularly limited, but is, for example, 2000 g/eq or less, preferably 60 to 250 g/eq. When the thiol equivalent is within this range, the curing reactivity of the curable composition and the refractive index of the cured product can be further increased.
- the bifunctional active hydrogen compound (B2') is the above-mentioned bifunctional active hydrogen compound (B2').
- Examples of the bifunctional active hydrogen compound (B2') include the above-mentioned bifunctional amine compounds having a pKa of more than 10 and bifunctional thiol compounds having a pKa of more than 10.
- the thiol equivalent of the bifunctional thiol compound having a pKa of more than 10 is not particularly limited, but is, for example, 90 to 180 g/eq, preferably 110 to 160 g/eq. When the thiol equivalent is within this range, the curing reactivity of the curable composition is good.
- the cation catalyst (C1) and the catalyst (C2) that generates cations by reaction or light irradiation are the same as the cation catalyst (C1) and the catalyst (C2) that generates cations by reaction or light irradiation described above.
- the specific example and content of the catalyst (C2) can be the same as in the above embodiment.
- the content mass ratio of the bifunctional alicyclic epoxy resin (A') and the bifunctional active hydrogen compound (B1') or the bifunctional active hydrogen compound (B2') is The content mass ratio of the resin (A) and the active hydrogen compound (B1) or the active hydrogen compound (B2) can be the same.
- a cured product according to one embodiment of the present invention is a cured product of the above-mentioned curable composition.
- a cured product of an alicyclic epoxy resin has good transparency, since it does not have an aromatic ring, it tends to have a lower refractive index than a cured product of an aromatic epoxy resin.
- the active hydrogen compound (B) of the curable composition contains a thiol compound, the cured product contains the sulfur element and therefore has a high refractive index.
- a cured product having a high refractive index is suitable for, for example, optical applications.
- the refractive index at a wavelength of 589 nm (D-line wavelength approximation) of a cured product composed only of resin is preferably 1.52 or more, more preferably 1.52 to 1.70, and 1.56 to More preferably, it is 1.66. Furthermore, inorganic particles may be added to increase the refractive index.
- the refractive index can be measured using an Abbe refractometer at a wavelength of 589 nm.
- the refractive index of the cured product can be adjusted by the type and content of the thiol compound contained in the curable composition, the number of functional groups (the number of thiol groups), etc.
- aromatic thiol compounds tend to increase the refractive index of a cured product more easily than aliphatic thiol compounds.
- the refractive index of the cured product tends to be high.
- the first reason is that thiol compounds do not react via oxygen anions due to their reaction mechanism, and therefore no reaction occurs between alicyclic epoxy resins. Therefore, the flexible structure derived from the thiol-based compound is likely to be relatively uniformly incorporated into the molecular structure.
- the second reason is that the curing reactivity between the alicyclic epoxy resin and the thiol compound is high, so many hydroxyl groups are generated by ring opening. Therefore, due to the hydrogen bonds between the generated hydroxyl groups, it exhibits a high elastic modulus against the initial stress. On the other hand, when a stress greater than the hydrogen bond is applied, the hydrogen bond is broken and the elastic modulus is low, which is thought to result in a high strain rate and yield point.
- the cured product of the curable composition may have a yield point in a stress-strain curve of a bending test in accordance with JIS K 7171.
- the bending elastic modulus of the cured product containing no filler measured by the above bending test is preferably 2900 to 4000 N/mm 2 , more preferably 3100 to 3600 N/mm 2 , and 3200 to 3500 N/mm 2 . More preferably, it is mm2 .
- the bending strength of the cured product measured by the above bending test is preferably 100 to 180 N/mm 2 , more preferably 110 to 180 N/mm 2 , and 130 to 170 N/mm 2 It is even more preferable.
- the strain rate of the cured product measured by the bending test is preferably 4 to 10%, more preferably 5 to 10%, and even more preferably 8 to 10%.
- a bending test of the cured product can be performed in accordance with JIS K 7171. That is, a cured product with a thickness of 3 mm is cut into a size of 80 mm x 10 mm, and used as a test piece. Using this test piece, a three-point bending test was conducted using a method compliant with JIS K 7171 with a distance between supports of 50 mm and a test speed of 1.5 mm/min to determine the bending elastic modulus, bending strength, and bending strain (hereinafter referred to as strain rate). ) was measured. The yield point is the first point during a test where an increase in strain occurs without an increase in stress.
- the flexural modulus, strain rate, and flexural strength of the cured product can be adjusted by the type and number of functional groups of the thiol compound. For example, if the thiol compound has a ring structure or has a large number of functional groups, the flexural modulus of the cured product tends to be high.
- the cured product of the curable composition containing the active hydrogen compound (B2) and dicyandiamide as the catalyst (C2) in 3) above has guanidine, which is the main product, due to the reaction with the active hydrogen compound (B2), Contains thiocyanic acid, a by-product.
- the content of guanidine in the cured product is, for example, 0.005 to 1% by mass, preferably 0.01 to 0.2% by mass.
- the content of guanidine can be measured by ion chromatography. Specifically, it can be measured by the following procedure. 1) First, the cured product is pre-pulverized with a hammer to a size that can fit into a crusher (if it cannot be crushed, it is crushed under freezing). A M22 blade is set on an IKA universal pulverizer M20, and the pre-pulverized material is placed in a water-cooled state and pulverized for 1 minute. The pulverized hardened product is sieved through a 60-mesh sieve, and the process is repeated until about 2 g of fine powder is obtained. 2) Next, 5 times the amount of water as the obtained fine powder is added, heated in a PCT pressure vessel at 120° C.
- the obtained extract is weighed into a test tube, made up to a constant volume with water, dissolved or extracted using ultrasonic waves for 10 minutes, and filtered with a membrane filter. 3) Perform ion chromatography measurement on the obtained solution.
- the measurement conditions are as follows.
- the cured product is a bifunctional alicyclic epoxy resin (A') and a bifunctional active hydrogen compound (B'). Since it has a structure in which A') and the bifunctional active hydrogen compound (B') are linearly polymerized, it has sufficient thermoplasticity. That is, the cured product is a thermoplastic resin containing a structural unit derived from a bifunctional alicyclic epoxy resin (A') and a structural unit derived from a bifunctional active hydrogen compound (B').
- thermoplastic resin a structural unit derived from a bifunctional alicyclic epoxy resin (A') and a bifunctional active hydrogen compound (B') (a bifunctional active hydrogen compound (B1') or a bifunctional active
- the content mass ratio of the structural units derived from the hydrogen compound (B2') is the ratio by mass of the structural unit derived from the bifunctional alicyclic epoxy resin (A') to the bifunctional active hydrogen compound (B') (2 It is the same as the content mass ratio of the functional active hydrogen compound (B1') or the bifunctional active hydrogen compound (B2').
- the total content of the structural units derived from the bifunctional alicyclic epoxy resin (A') and the structural units derived from the bifunctional active hydrogen compound (B') is equal to The amount may be 4% by mass or more, preferably 60% by mass or more based on the nonvolatile content. When the total content is within the above range, higher thermoplasticity is likely to be obtained. Furthermore, when the active hydrogen compound (B') is a thiol compound, the refractive index of the thermoplastic resin can be further increased.
- thermoplastic resin has self-healing properties. That is, the thermoplastic resin has sufficient thermoplasticity because the bifunctional alicyclic epoxy resin (A') and the bifunctional active hydrogen compound (B') are highly linearly polymerized. The molecules move easily when heated. As a result, it exhibits physical self-healing properties.
- thermoplastic resin has many hydroxyl groups generated by the reaction of the epoxy group of the alicyclic epoxy resin (A') with the bifunctional active hydrogen compound (B'), so hydrogen bonds are formed between molecules. Easy to form.
- the active hydrogen compound (B') contains an aromatic ring, ⁇ - ⁇ bonds are likely to be formed between molecules. These reversible bonds exhibit chemical self-healing properties. Due to these effects, the thermoplastic resin is considered to exhibit self-healing properties.
- Method for producing cured product The cured product can be produced by heating and curing the curable composition.
- the heating temperature depends on the type of active hydrogen compound (B), for example, when a thiol compound is used, it may be 0 to 250°C, preferably 60 to 120°C, more preferably 100 to 120°C.
- the heating time may be 0.02 to 3 hours, preferably 0.1 to 1 hour.
- the curable composition contains a catalyst (C2) that generates cations through the reaction of 3) above, the alicyclic epoxy resin (A), the active hydrogen compound (B2), and the catalyst (C2) are simultaneously combined. After mixing, it may be heated and cured; after the active hydrogen compound (B2) and the catalyst (C2) are reacted first, the alicyclic epoxy resin (A) is mixed and heated and cured. You may let them.
- a catalyst (C2) that generates cations through the reaction of 3) above
- the cured product includes a step of reacting the active hydrogen compound (B2) with dicyandiamide under heating to obtain a composition containing guanidine, and a step of reacting the composition with the alicyclic epoxy resin (A) by heating. It can also be obtained through a step of allowing the cured product to be obtained.
- the curing reaction can be started in a shorter time, and the curing reaction can be further accelerated. It can be made more likely to occur.
- the heating temperature for reacting the active hydrogen compound (B2) with dicyandiamide may be within a range where the active hydrogen compound (B2) and dicyandiamide react, for example, 60 to 120°C, more preferably 100 to 120°C. sell.
- the reaction time may be, for example, as long as a certain amount or more of guazinium ions can be produced, and may be, for example, 0.1 to 1 hour, depending on the temperature.
- After heating to a temperature at which dicyandiamide and thiol can react it may be cooled and cured at a low temperature below room temperature, or it may be cured in a short period of time by maintaining the heated temperature or increasing the temperature to the above-mentioned heating temperature range. It may be hardened.
- the light irradiation conditions may be within a range that allows a base to be generated from the photobase generator.
- the wavelength of the irradiated light is preferably 200 to 500 nm.
- the irradiation amount may be 10 to 10,000 mJ/cm 2 .
- the cured product has good transparency and weather resistance because it is obtained from a curable composition containing the alicyclic epoxy resin (A).
- a thiol compound as the active hydrogen compound (B)
- it also has a high refractive index and has appropriate flexibility and flexural modulus.
- a cured product having the following properties can be obtained. Therefore, for example, in optical applications such as encapsulants and adhesives for optical semiconductor devices and organic electroluminescent devices, surface protective films, and transparent display substrates, and in manufacturing environments where it is difficult to heat the entire adherend, such as in the automobile industry.
- the cured product can be preferably used for structural adhesives that can withstand damage such as collisions, protective films for touch panel sensors, and paints that protect the surfaces of electronic devices, automobiles, etc.
- the cured product since the cured product has a high modulus of elasticity, it can maintain the adhesion position of the adherend under weak external forces, and since it has a yield point, it can be bent without cracking under strong external forces. Therefore, it is suitable for structural adhesives in the automobile industry, etc.
- A-6 KR-470 (manufactured by Shin-Etsu Chemical Co., Ltd., tetrafunctional, epoxy equivalent 200 g/eq)
- B1-2 4,4'-thiobisbenzenethiol (manufactured by Fuji Film Wako Co., Ltd., aromatic thiol (bifunctional), thiol equivalent weight 126.2 g/eq, C 6 H 5 SH: pKa 6.52-8.2)
- B1-3 Bisphenol A (manufactured by Mitsui Chemicals, phenol (bifunctional), hydroxyl equivalent 114 g/eq, literature value: pKa9.6)
- B2 ⁇ Active hydrogen compound (B2) with pKa greater than 10>
- B2-1 TS-G (manufactured by Shikoku Kasei Co., Ltd., aliphatic thiol (tetrafunctional), thiol equivalent 96 g/eq, CH 3 CH 2 SH: pKa 10.5)
- B2-2 PEMP (manufactured by SC Organic Chemical Co., Ltd., aliphatic thiol (tetrafunctional), thiol equivalent 127 g/eq, CH 3 CH 2 SH: pKa 10.5)
- B2-3 Multiol Y-3 (manufactured by SC Organic Chemical Co., Ltd., aliphatic thiol (trifunctional), thiol equivalent 124 g/eq, CH 3 CH 2 SH: pKa 10.5)
- B2-4 Karenz MT BD1 (manufactured by Showa Denko, aliphatic thiol (bifunctional), thiol equivalent 147
- ⁇ Aliphatic amine compound > Isophorone diamine (manufactured by Fuji Film Wako Co., Ltd., aliphatic amine (bifunctional), amine equivalent weight 42.575 g/eq, reference Et 2 NH: pKa 36)
- pKa was determined by the following method.
- pKa is the pKa value described in the literature. It was adopted.
- the active hydrogen compound was described using a demonstrative formula, and the pKa value of the compound whose number of carbon atoms corresponds to at least 2 from the functional group having active hydrogen was adopted.
- HSDB Hazardous Substances Data Bank
- Curing catalyst ⁇ Cation catalyst (C1)> C1-1: SA1 (manufactured by San-Apro, DBU phenol salt, thermal base catalyst)
- DBU manufactured by Tokyo Kasei Kogyo Co., Ltd., diazabicycloundecene, base catalyst
- C1-6:2E4MZ manufactured by Shikoku Kasei Co., Ltd., 2-ethyl-4-methylimidazole, general-purpose
- C2 that generates cations by reaction or light irradiation>
- C2-1 DDA5 (dicyandiamide, latent catalyst)
- C2-2 WPBG-266 (manufactured by Fuji Film Wako Co., Ltd., 1,2-diisopropyl-3-[bis(dimethylamino)methylene]guanidium 2-(3-benzoylphenyl)propinate, photobase catalyst)
- C2-3 WPBG-300 (manufactured by Fuji Film Wako Co., Ltd., 1,2-dicyclohexyl-4,4,5,5-tetramethyldiguadium n-butyltriphenylborate, photobase catalyst)
- C2-4 2-(9-oxoxanthen-2-yl)propionic acid 1,5,7-triazabicyclo[4.4.0]dec-5-ene (photobase catalyst)
- Sensitizer Kayacure DETX-S (manufactured by Nippon Kayaku Co., Ltd., 2,4-diethylthioxanthone)
- compositions 1 to 47 were prepared.
- Example 2 Example 2 (Exothermic peak temperature by DSC) The obtained composition was placed in a 3.0 mg aluminum sample pan and subjected to differential calorimetry (DSC) measurement. Specifically, using DSC-60 manufactured by Shimadzu Corporation, the exothermic peak temperature (thermal curing temperature) observed when measuring at a temperature increase of 20° C./min from room temperature (25° C.) was measured. Then, evaluation was made based on the following criteria.
- the exothermic peak temperature in DSC measurement is lower than 199°C (exothermic peak temperature of acid anhydride)
- ⁇ The exothermic peak temperature in DSC measurement is 199°C or more and less than 250°C
- An exothermic peak is confirmed in DSC measurement However, if the exothermic peak temperature was 250° C. or higher ⁇ : no exothermic peak was observed in DSC measurement ⁇ or higher, the reactivity was judged to be good.
- Table 1 shows the evaluation results for Compositions 1 to 13
- Table 2 shows the evaluation results for Compositions 14 to 29,
- Table 3 shows the evaluation results for Compositions 30 to 47.
- "1" is the curing form using an active hydrogen compound (B1)
- "2” is the curing form using an active hydrogen compound (B2) and a cationic catalyst (C1)
- “2” is the curing form using an active hydrogen compound (B2) and a cationic catalyst (C1).
- the curing mode using (B2) and a catalyst (C2) that generates cations by reaction etc. was designated as "3".
- compositions 37 to 41 and 44 (Examples) containing an active hydrogen compound (B1) with a pKa of 10 or less, an active hydrogen compound (B2) with a pKa of more than 10, and a cationic catalyst (C1) compositions 23, 25 to 29, 33, 34, 36 and 45 (examples), compositions 14 to 20 and 24 (examples) containing active hydrogen compound (B2) and dicyandiamide, and active hydrogen
- Compositions 30 to 32 and 35 (Examples) containing compound (B2) and a photobase catalyst used a cycloaliphatic epoxy resin, compositions containing an acid anhydride curing agent (Comparative Examples) )
- the curing reactivity is equivalent to or better than that.
- compositions other than Compositions 24 and 45 had exothermic peak temperatures lower than the exothermic peak temperatures of the acid anhydrides, indicating that they had good curing reactivity.
- compositions exhibited excellent curing reactivity (comparison between compositions 37 to 41 and compositions 2 and 4).
- aliphatic thiol active hydrogen compound (B2)
- B2 active hydrogen compound
- C1 cationic catalyst
- aliphatic thiol active hydrogen compound (B2)
- B2 active hydrogen compound
- C2 dicyandiamide
- compositions 14, 15, R0, R1, and R4 prepared above were cured by heating under the conditions shown in Table 4 to obtain cured product samples.
- the other compositions were used as samples as they were.
- guanidine was not detected in compositions R1 to R3. In addition, only trace amounts of guanidine were detected in the cured product of composition R0 and composition R5. On the other hand, in the cured products of Compositions 14, 15, and R4, guanidine was detected in a predetermined amount or more.
- Preparation of cured product ⁇ Preparation of cured product 1> A composition was prepared by uniformly stirring and degassing each material at the blending ratio shown in Table 5 at 2000 rpm for 100 seconds using a vacuum stirrer Awatori Rentaro ARV-310P. The obtained composition was poured into a frame mold, heated at 90° C. for 3 hours, and then heated at 120° C. for 4 hours to be cured to obtain a cured product 1 with a thickness of 3 mm.
- a composition was prepared by uniformly stirring and degassing each material at the blending ratio shown in Table 5 at 2000 rpm for 100 seconds using a vacuum stirrer Awatori Rentaro ARV-310P.
- the obtained composition was poured into a frame mold and cured by heating at 120° C. for 1 hour to obtain cured products 2 and 3 with a thickness of 3 mm.
- composition 24 prepared above was poured into a frame mold and heated at 130° C. for 1 hour to be cured to obtain a cured product 5 with a thickness of 3 mm.
- a composition was prepared by uniformly stirring and degassing each material at the blending ratio shown in Table 5 at 2000 rpm for 100 seconds using a vacuum stirrer Awatori Rentaro ARV-310P. The obtained composition was poured into a frame mold and heated at 100° C. for 1 hour to be cured to obtain cured products 6 and 7 with a thickness of 3 mm.
- the refractive index of the cured product was measured using Abbe Refractometer DR-A1-Plus at a wavelength of 589 nm. Monobromonaphthalene was used as the intermediate liquid.
- cured products 6 and 7 (Example) of compositions containing an active hydrogen compound (B1) with a pKa of 10 or less, and a combination of an active hydrogen compound (B2) with a pKa of more than 10 and a cationic catalyst.
- Cured product 4 of the composition (Example) and cured products 2, 3, and 5 of the composition containing an active hydrogen compound and dicyandiamide (Example) are all cured compositions containing an acid anhydride curing agent. It can be seen that the refractive index is higher than that of Product 1 (comparative example).
- a composition was prepared by uniformly stirring and defoaming each material at the blending ratio shown in Table 6 at 2000 rpm for 100 seconds using a vacuum stirrer Awatori Rentaro ARV-310P.
- the obtained composition was poured into a frame mold, heated at 100° C. for 0.5 hours, and then further heated at 120° C. for 0.5 hours to be cured to obtain cured products 8 to 10 with a thickness of 3 mm.
- the obtained cured product was cut into a size of 80 mm x 10 mm and used as a test piece. Using this test piece, the bending elastic modulus, bending strength, and strain rate were determined by a method based on JIS K 7171.
- cured product 4 (example) of a composition using a combination of an active hydrogen compound with a pKa of more than 10 and a cationic catalyst, and cured products 2, 3 and 3 of a composition containing an active hydrogen compound and dicyandiamide.
- Samples No. 5 (Example) have higher bending strength and flexural modulus, as well as higher strain rate and yield point, than cured product No. 1 (Comparative Example) of a composition containing an acid anhydride curing agent.
- cured products 2 to 5 (examples) have higher flexural modulus and strain rate than cured products 9 and 10 (comparative examples) using aromatic epoxy resin.
- thermoplasticity 6-1 Preparation of Compositions 2-1 to 2-11 The components shown in Table 7 were blended at the mixing ratios shown in the table, and mixed under the following mixing conditions 1 or 2.
- Mixing condition 1 A composition was prepared by uniformly stirring, mixing and defoaming for 100 seconds at 2000 rpm using a vacuum stirrer Awatori Rentaro (ARV-310P).
- Mating condition 2 A composition was prepared by uniformly stirring and mixing for 30 seconds at a stirring mode of 2000 rpm using a vacuum stirrer Awatori Rentaro (ARE-310). Note that compositions 2-2, 2-3, 2-5, 2-6, 2-8 and 2-9 correspond to the above-mentioned compositions 34, 35, 38, 39, 44 and 47, respectively.
- Viscosity of the composition The viscosity (value at 25°C, 5 rpm, 30 sec.) of each composition prepared under the conditions of mixing condition 1 was measured using a cone plate viscometer (TVE-35H, cone rotor: 3° x R9.7, East (manufactured by Kisangyo).
- thermoplasticity and self-healing properties were evaluated by the following methods.
- the cured product of Composition 2-6 was further subjected to TOF-MS analysis.
- Thermoplasticity was poured into a frame mold with 1 mm thick silicone rubber sandwiched between two slide glasses (manufactured by Matsunami Glass Industries Co., Ltd., Matsunami Slide Glass Model S7214), and the composition shown in the table was It was heated and cured under curing conditions to obtain a cured product with a thickness of 1 mm.
- curing condition 2 of composition 2-3 after pouring into a frame mold and irradiating with a high-pressure mercury lamp UV irradiation machine (manufactured by I-Graphic Co., Ltd., (registered trademark) ECS-4011GX) at a irradiation amount of 9000 mJ, It was heated at 120° C. for 1 hour to obtain a cured product with a thickness of 1 mm.
- the obtained cured product was placed in an oven heated to 120° C. while being held upright with a clip, and after heating at 120°C for 1 hour, the state of the upright cured product was visually observed to evaluate thermoplasticity. Then, evaluation was made based on the following criteria. 4: The cured product has fallen down, indicating thermoplasticity. 3: The cured product can be removed from the frame while maintaining the shape of the mold, but the cured product does not melt before heating at 120°C for 1 hour. If you leave it upright for a certain period of time, the cured product will collapse (it is not fully cured, but it shows thermoplasticity) 2: It has thickened, but cannot be removed from the frame (not hardened) 1: Remains upright and does not exhibit thermoplasticity
- Composition B was prepared by kneading and defoaming at a mixing ratio of Composition 2-6 or 8 using a vacuum stirrer Awatori Rentaro (ARV-310P) at a stirring mode of 2000 rpm/100 seconds. Then, the composition B prepared above was poured between the two cured products prepared above, and heated under the respective conditions listed in Table 7. As a result, a cured product having a three-layer structure (cured product A (for exterior walls)/cured product B (for evaluation)/cured product A (for exterior walls)) with a total thickness of 3 mm was obtained.
- ARV-310P vacuum stirrer Awatori Rentaro
- the obtained cured product was subjected to a bending test in accordance with JIS K 6911. That is, a cured product with a thickness of 3 mm was cut into a size of 80 x 10 mm to prepare a test piece. Using this test piece, the bending elastic modulus was measured in a three-point bending test in accordance with JIS K 6911, with a distance between fulcrums of 50 mm and a test speed of 1.5 mm/min. The bending elastic modulus was calculated using the following formula.
- Elastic modulus (N/mm 2 ) slope x distance between fulcrums / cross-sectional area of test piece The slope is calculated using all data between two points of test force 10N and 20N, with vertical axis: test force and horizontal axis: displacement. Calculated using the least squares method. After cutting the cured product into a size suitable for bending tests, cellophane tape was attached only to the four thick sides of the test piece in order to prevent the inner layer structure from sliding off due to impact during the test. The tests were conducted in the following order. After heating, the test was performed after cooling for 1 hour at room temperature. 1. Initial heating: Place in an oven heated to 120°C for 10 minutes (to repair cracks that occurred when cutting to the size of the test piece) 2.
- the above-mentioned repair rate When the above-mentioned repair rate is positive, it indicates that self-repairability was expressed, and the temperature at which the above-mentioned repair rate became positive was defined as the temperature at which self-repair was possible. In addition, when the above-mentioned repair rate is negative, it is set as 0%, indicating that self-repairability was not expressed.
- the cured product of Composition 2-6 was structurally analyzed by TOF-MS analysis. Specifically, 10 mg of the cured product was weighed, 5 mL of chloroform was added, and ultrasonication was performed for 10 minutes. 1 ⁇ L of the sample solution was applied to the FD emitter and measured using JMS-T100GCV manufactured by JEOL Ltd. (JEOL) under the following conditions. Sample: Chloroform dilution Ionization mode: FD+ Analysis m/z range: 29.00-3000.00
- Table 7 shows the evaluation results for Compositions 2-1 to 2-11.
- the appearance before heating of the cured product obtained with composition 2-6 is shown in FIG. 1A, and the appearance after heating is shown in FIG. 1B; the appearance before heating of the cured product obtained with composition 2-7 is shown.
- FIG. 2A shows the appearance after heating
- FIG. 2B shows the appearance after heating.
- the reaction mechanism of Composition 2-6 is shown in FIG. 3A, and the TOF-MS spectrum of the cured product is shown in FIG. 3B.
- Table 8 shows the evaluation results of (3) self-healing properties - bending test for compositions 2-6 and 2-8.
- compositions 2-1 to 2-8 soften when heated at 120° C. for 1 hour and exhibit thermoplasticity. Moreover, the cured product after heating at 120° C. for 5 minutes was soft and cracks had disappeared. This shows that it has self-healing properties (see Table 7). It can also be seen that compositions 2-6 and 8 have improved repair rates, particularly at 120° C. and 140° C., and exhibit good self-healing properties (see Table 8).
- the epoxy group of the alicyclic epoxy resin reacts with the active hydrogen compound and then opens the ring to become an oxygen anion (-O-). It reacts not only with active hydrogen compounds (but also with other alicyclic epoxy resins) and tends to be three-dimensionally crosslinked.
- the epoxy group of the alicyclic epoxy resin reacts with an active hydrogen compound and then becomes -OH by cations (H+ in this case), so it does not react with other alicyclic epoxy resins. reacts only with active hydrogen compounds.
- the difference between the structure of the normal reaction and the structure of the present invention is that the oxygen derived from the epoxy group is -O- or -OH, and therefore the weight of one H is different. Therefore, when reacting with -O-, the weight of one H is subtracted from the molecular weight of the epoxy resin + active hydrogen compound, but in the case of -OH, the molecular weight remains the same as that of the epoxy resin + active hydrogen compound, and the molecular weight increases. It turns out.
- the molecular weight of the epoxy resin + active hydrogen compound in the composition of Composition 2-6 is 444.1, as shown in FIG. 3A. In the TOF-MS spectrum of Example 6 shown in FIG.
- the main peaks are 444.1143, 888.2360, and 1332.3430, and the molecular weight can be confirmed in units of 444.1, which is the molecular weight containing -OH.
- a peak derived from A-2 (molecular weight 194.1), which is an alicyclic epoxy resin (A)
- B1-1 (molecular weight 249.9), which is an active hydrogen compound (B1), alternate.
- a repeating structure molecular weight 444.1 bonded in the order of alicyclic epoxy resin (A), thiol compound (B1), and so on was detected.
- sample sheet 14.25 g of PP (MA3) (Novatec PP manufactured by Polypro Co., Ltd., general injection molding grade, polypropylene resin) and 0.0 g of the cured product of Composition 2-6 (thermoplastic resin). 75 g were melt-mixed at 180°C for 10 minutes using a kneading device Labo Plastomill [roller mixer R30] (manufactured by Toyo Seiki Co., Ltd.), and then press-molded at 180°C to obtain a sample sheet with a thickness of 0.31 mm. Ta.
- FIG. 4A The SEM observation results of the sample sheet surface of composition 2-6 are shown in FIG. 4A, and the EDX analysis results are shown in FIGS. 4B and 4C. Further, the image analysis results are shown in Table 9.
- Figure 4B is a mapping image in which the portion where carbon element (C) is detected (continuous phase) is displayed in gray
- Figure 4C is a mapping image where the portion where sulfur element (S) is detected (dispersed phase) is displayed in gray. This is the displayed mapping image.
- thermoplastic resin obtained by curing the above-mentioned curable composition containing the bifunctional epoxy resin (A') and the bifunctional active hydrogen compound (B') has good properties in the matrix resin. It can be seen that it can be dispersed and is suitable as a masterbatch.
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Abstract
Description
また、硬化前の組成物が液状であれば、例えば3本ロール分散等のせん断混錬が可能であるため、フィラーの高分散化が可能となる。例えば、フィラーを含有する組成物をせん断混錬によって分散させた後、硬化させた硬化物を溶融させることができれば、熱可塑樹脂用の押出機内では分散が困難なフィラーを、マスターバッチとして分散させた状態で添加することが可能となる。そのため、熱硬化性樹脂と同様の良好な作業性を有しつつ、熱可塑性を有する硬化物を付与できることもさらに望まれている。
[2] 前記活性水素化合物(B1)は、芳香族チオール系化合物を含む、[1]に記載の硬化性組成物。
[3] 前記脂環式エポキシ樹脂(A)は、2官能の脂環式エポキシ樹脂(A')であり、前記pKaが10以下の活性水素化合物(B1)は、pKaが10以下の2官能の活性水素化合物(B1')である、[1]又は[2]に記載の硬化性組成物。
[5] 前記活性水素化合物(B2)は、脂肪族チオール系化合物を含む、[4]に記載の硬化性組成物。
[6] 2官能の脂環式エポキシ樹脂(A')と、pKaが10を超える2官能の活性水素化合物(B2')と、カチオン触媒(C1)とを含む、硬化性組成物。
[8] 前記活性水素化合物(B2)は、脂肪族チオール系化合物を含む、[7]に記載の硬化性組成物。
[9] 前記触媒(C2)は、前記活性水素化合物(B2)との反応によりカチオン類を生成する触媒であって、ジシアンジアミドを含む、[7]又は[8]に記載の硬化性組成物。
[10] 前記脂環式エポキシ樹脂(A)は、2官能の脂環式エポキシ樹脂(A')であり、前記pKaが10を超える活性水素化合物(B2)は、pKaが10を超える2官能の活性水素化合物(B2')である、[7]~[9]のいずれかに記載の硬化性組成物。
そして、本発明者らは、
1)硬化剤としてH+を放出しやすい活性水素化合物(即ち、pKaが低い活性水素化合物)を用いるか;
2)硬化剤としてH+を放出しにくい活性水素化合物(即ち、pKaが高い活性水素化合物)と、カチオン触媒(C1)とを併用するか;又は、
3)硬化剤としてpKaが高い活性水素化合物と、それとの反応又は光照射によりカチオン類を生成する触媒(C2)とを併用すること
により、脂環式エポキシ樹脂を活性化させやすくし、硬化反応性を高めることができることを見出した。特に、活性水素化合物としてチオール系化合物を用いることで、高い屈折率を有する硬化物が得られること;さらに脂肪族チオール系化合物を用いることで、高い屈折率を有しつつ、柔軟性と高い曲げ弾性率とを有する硬化物が得られることを見出した。
1)pKaが10以下の活性水素化合物(B1)
2)pKaが10を超える活性水素化合物(B2)と、カチオン触媒(C1)の組み合わせ、又は、
3)pKaが10を超える活性水素化合物(B2)と、反応若しくは光照射によりカチオン類を生成する触媒(C2)との組み合わせ、を含む。
本発明の一実施形態に係る硬化性組成物は、脂環式エポキシ樹脂(A)と、活性水素化合物(B)と、任意の硬化触媒(C)とを含む。
脂環式エポキシ樹脂(A)は、1分子内に2以上のエポキシ基を有する化合物であり、好ましくは脂環を構成する隣接する2以上の炭素原子と酸素原子で構成されるエポキシ基(以下、「脂環エポキシ基」ともいう)を有する化合物である。このように、脂環を構成する炭素原子と酸素原子で構成されるエポキシ基は、硬化反応性が低いため、上記1)~3)の活性水素化合物(B)/硬化触媒(C)によって硬化させることが特に有効である。
炭素数1~18の直鎖状又は分岐状のアルキレン基の例には、メチレン基、メチルメチレン基、ジメチルメチレン基、エチレン基、プロピレン基、トリメチレン基が含まれる。
2価の脂環式炭化水素基の例には、1,2-シクロペンチレン基、1,3-シクロペンチレン基、シクロペンチリデン基、1,2-シクロヘキシレン基、1,3-シクロヘキシレン基、1,4-シクロヘキシレン基、シクロヘキシリデン基等のシクロアルキレン基(シクロアルキリデン基を含む)が含まれる。
活性水素化合物(B)は、活性水素を有する官能基を含有する化合物である。活性水素を有する官能基の例には、フェノール性水酸基、チオール基、アミノ基等が挙げられる。活性水素化合物(B)の1分子に含まれる活性水素を有する官能基の数は、2以上であればよい。つまり、活性水素化合物(B)は、1分子中に活性水素を有する官能基を2つ有する2官能の活性水素化合物(B’)であってもよいし、活性水素を有する官能基を3以上有する3官能以上の活性水素化合物であってもよい。
(活性水素化合物(B1))
上記1)における活性水素化合物(B1)のpKaは、10以下であり、6~10であることが好ましい。このような低いpKaを有する活性水素化合物はH+を放出しやすいため、脂環式エポキシ樹脂を活性化させやすい。そのため、触媒が存在しなくても、脂環式エポキシ樹脂を硬化させうる。活性水素化合物(B1)は、2官能の活性水素化合物(B1’)であってもよいし、3官能以上の活性水素化合物であってもよい。
1,2-ジメルカプトベンゼン、1,3-ジメルカプトベンゼン、1,4-ジメルカプトベンゼン、1,2-ビス(メルカプトメチル)ベンゼン、1,3-ビス(メルカプトメチル)ベンゼン、1,4-ビス(メルカプトメチル)ベンゼン、1,3-ビス(メルカプトエチル)ベンゼン、1,4-ビス(メルカプトエチル)ベンゼン、1,2-ビス(メルカプトメトキシ)ベンゼン、1,3-ビス(メルカプトメトキシ)ベンゼン、1,4-ビス(メルカプトメトキシ)ベンゼン、1,2-ビス(メルカプトエトキシ)ベンゼン、1,3-ビス(メルカプトエトキシ)ベンゼン、1,4-ビス(メルカプトエトキシ)ベンゼン、2,2’-ジメルカプトビフェニル、4,4’-ジメルカプトビフェニル、4,4’-ジメルカプトビベンジル、2,5-トルエンジチオール、3,4-トルエンジチオール、1,4-ナフタレンジチオール、1,5-ナフタレンジチオール、2,6-ナフタレンジチオール、2,7-ナフタレンジチオール、2,4-ジメチルベンゼン-1,3-ジチオール、4,5-ジメチルベンゼン-1,3-ジチオール、9,10-アントラセンジメタンチオール、1,3-ジ(p-メトキシフェニル)プロパン-2,2-ジチオール、1,3-ジフェニルプロパン-2,2-ジチオール、フェニルメタン-1,1-ジチオール、2,4-ジ(p-メルカプトフェニル)ペンタン等の2官能の芳香族チオール系化合物;
1,2,3-トリメルカプトベンゼン、1,2,4-トリメルカプトベンゼン、1,3,5-トリメルカプトベンゼン、1,2,3-トリス(メルカプトメチル)ベンゼン、1,2,4-トリス(メルカプトメチル)ベンゼン、1,3,5-トリス(メルカプトメチル)ベンゼン、1,2,3-トリス(メルカプトエチル)ベンゼン、1,2,4-トリス(メルカプトエチル)ベンゼン、1,3,5-トリス(メルカプトエチル)ベンゼン、1,2,3-トリス(メルカプトメトキシ)ベンゼン、1,2,4-トリス(メルカプトメトキシ)ベンゼン、1,3,5-トリス(メルカプトメトキシ)ベンゼン、1,2,3-トリス(メルカプトエトキシ)ベンゼン、1,2,4-トリス(メルカプトエトキシ)ベンゼン、1,3,5-トリス(メルカプトエトキシ)ベンゼン、
1,2,3,4-テトラメルカプトベンゼン、1,2,3,5-テトラメルカプトベンゼン、1,2,4,5-テトラメルカプトベンゼン、1,2,3,4-テトラキス(メルカプトメチル)ベンゼン、1,2,3,5-テトラキス(メルカプトメチル)ベンゼン、1,2,4,5-テトラキス(メルカプトメチル)ベンゼン、1,2,3,4-テトラキス(メルカプトエチル)ベンゼン、1,2,3,5-テトラキス(メルカプトエチル)ベンゼン、1,2,4,5-テトラキス(メルカプトエチル)ベンゼン、1,2,3,4-テトラキス(メルカプトエチル)ベンゼン、1,2,3,5-テトラキス(メルカプトメトキシ)ベンゼン、1,2,4,5-テトラキス(メルカプトメトキシ)ベンゼン、1,2,3,4-テトラキス(メルカプトエトキシ)ベンゼン、1,2,3,5-テトラキス(メルカプトエトキシ)ベンゼン、1,2,4,5-テトラキス(メルカプトエトキシ)ベンゼン等の3官能以上の芳香族チオール系化合物
等が挙げられる。
1,2-ビス(メルカプトメチルチオ)ベンゼン、1,3-ビス(メルカプトメチルチオ)ベンゼン、1,4-ビス(メルカプトメチルチオ)ベンゼン、1,2-ビス(メルカプトエチルチオ)ベンゼン、1,3-ビス(メルカプトエチルチオ)ベンゼン、1,4-ビス(メルカプトエチルチオ)ベンゼン、4,4’-チオビスベンゼンチオール等の2官能の芳香族チオール系化合物;
1,2,3-トリス(メルカプトメチルチオ)ベンゼン、1,2,4-トリス(メルカプトメチルチオ)ベンゼン、1,3,5-トリス(メルカプトメチルチオ)ベンゼン、1,2,3-トリス(メルカプトエチルチオ)ベンゼン、1,2,4-トリス(メルカプトエチルチオ)ベンゼン、1,3,5-トリス(メルカプトエチルチオ)ベンゼン、1,2,3,4-テトラキス(メルカプトメチルチオ)ベンゼン、1,2,3,5-テトラキス(メルカプトメチルチオ)ベンゼン、1,2,4,5-テトラキス(メルカプトメチルチオ)ベンゼン、1,2,3,4-テトラキス(メルカプトエチルチオ)ベンゼン、1,2,3,5-テトラキス(メルカプトエチルチオ)ベンゼン、1,2,4,5-テトラキス(メルカプトエチルチオ)ベンゼン、1,3,5-トリアジン-2,4,6-トリチオール(チオシアヌル酸)等の3官能以上の芳香族チオール系化合物
が挙げられる。これらは、1種のみ使用してもよく又は2種以上を併用することもできる。
上記2)の場合、脂環式エポキシ樹脂を硬化させる成分として、pKaが10を超える活性水素化合物(B2)と、カチオン触媒(C1)とを含む。
上記2)における活性水素化合物(B2)のpKaは、10を超え、好ましくは10~14である。このような高いpKaを有する活性水素化合物はH+を放出しにくいため、単独では脂環式エポキシ樹脂を活性化させにくい。そのため、H+を生成しうるカチオン触媒(C1)をさらに組み合わせることで、脂環式エポキシ樹脂を硬化させることができる。活性水素化合物(B2)は、2官能の活性水素化合物(B2’)であってもよいし、3官能以上の活性水素化合物であってもよい。
芳香族アミン系化合物の例には、4,4’-ジアミノジフェニルスルフィド(セイカ社製、ASD)、4,4’-ジアミノジフェニルスルホン(セイカ社製、セイカキュアS)が含まれる。本発明では、1級アミンでも使用することができる。これは、1級アミンが反応した後、2級アミンとなることで、pKaが変化することや、脂環式エポキシ樹脂が芳香族エポキシ樹脂と比べて、エポキシ基の立体障害が大きいことが要因と考える。
1,4-ビス(3-メルカプトブチリルオキシ)ブタン(昭和電工社製、カレンズMT(登録商標)BD1)等の2官能の脂肪族チオール系化合物;
トリメチロールプロパントリス(3-メルカプトプロピオネート)(SC有機化学社製、TMMP)、トリス-[(3-メルカプトプロピオニルオキシ)-エチル]-イソシアヌレート(SC有機化学社製、TEMPIC)、ペンタエリスリトールテトラキス(3-メルカプトプロピオネート)(SC有機化学社製、PEMP)、テトラエチレングリコールビス(3-メルカプトプロピオネート)(SC有機化学社製、EGMP-4)、ジペンタエリスリトールヘキサキス(3-メルカプトプロピオネート)(SC有機化学社製、DPMP)、ペンタエリスリトールテトラキス(3-メルカプトブチレート)(昭和電工社製、カレンズMT(登録商標)PE1)、1,3,5-トリス(3-メルカプトブチリルオキシエチル)-1,3,5-トリアジン-2,4,6(1H,3H,5H)-トリオン(昭和電工社製、カレンズMT(登録商標)NR1)等の3官能以上の脂肪族チオール系化合物を挙げることができる。
Aは、n+m個の水酸基を有する多価アルコールの残基である。
R7は、独立に炭素数1~10のアルキレン基である。
R8は、独立に水素原子又は炭素数1~10のアルキル基である。
mは、0以上の整数である。
nは、3以上の整数である。
4,6-ビス[4-(6-メルカプトメチルチオ)-1,3-ジチアニルチオ]-6-[4-(6-メルカプトメチルチオ)-1,3-ジチアニルチオ]-1,3-ジチアン、4-[3,4,8,9‐テトラキス(メルカプトメチルチオ)-11-メルカプト-2,5,7,10-テトラチアウンデシル]-5-メルカプトメチルチオ-1,3-ジチオラン、4,5-ビス[3,4-ビス(メルカプトメチルチオ)-6-メルカプト-2,5-ジチアヘキシルチオ]-1,3-ジチオラン、4-[3,4-ビス(メルカプトメチルチオ)-6-メルカプト-2,5-ジチアヘキシルチオ]-5-メルカプトメチルチオ-1,3-ジチオラン、4-[3-ビス(メルカプトメチルチオ)メチル-5,6-ビス(メルカプトメチルチオ)-8-メルカプト-2,4,7-トリチアオクチル]-5-メルカプトメチルチオ-1,3-ジチオラン、2-{ビス[3,4-ビス(メルカプトメチルチオ)-6-メルカプト-2,5-ジチアヘキシルチオ]メチル}-1,3-ジチエタン、2-[3,4-ビス(メルカプトメチルチオ)-6-メルカプト-2,5-ジチアヘキシルチオ]メルカプトメチルチオメチル-1,3-ジチエタン、2-[3,4,8,9-テトラキス(メルカプトメチルチオ)-11-メルカプト-2,5,7,10-テトラチアウンデシルチオ]メルカプトメチルチオメチル-1,3-ジチエタン、2-[3-ビス(メルカプトメチルチオ)メチル-5,6-ビス(メルカプトメチルチオ)-8-メルカプト-2,4,7-トリチアオクチル]メルカプトメチルチオメチル-1,3-ジチエタン、4-{1-[2-(1,3-ジチエタニル)]-3-メルカプト-2-チアプロピルチオ}-5-[1,2-ビス(メルカプトメチルチオ)-4-メルカプト-3-チアブチルチオ]-1,3-ジチオラン等の環式構造を有するポリチオール化合物が挙げられる。
カチオン触媒(C1)は、H+の放出を促進する化合物であり、エポキシ樹脂単体の自己重合を促進せずに、エポキシ樹脂と、活性水素化合物の反応を促進する化合物である。自己重合を促進しないとは、エポキシ樹脂と触媒のみの混合物で、熱によって発熱(硬化)しないことによって確認できる。自己重合反応では、エポキシ基1つに対して2つのエポキシ基が反応する、即ち、2つのエポキシ基を有する脂環式エポキシ樹脂では1分子あたり4つのエポキシ基と反応するため、架橋度が高まり靭性が低下しやすい。これに対し、カチオン触媒(C1)は、そのような自己重合反応を生じることなく、エポキシ基の活性化と、活性水素化合物の活性化を促進する役割を担う。カチオン類となるカチオン触媒(C1)を直接添加することで、速やかに反応を進行できる。従って、寒冷地等の加熱ができない環境や触媒(C2)のようなカチオン類発生に必要な加熱/光照射エネルギーを抑制したい場合に、2液型の硬化性組成物の触媒として用いることもできる。
従って、カチオン触媒(C1)は、エポキシ樹脂の硬化時に使用される塩基であり、好ましくは水素を引き抜き後に正電荷を帯びた状態を維持し、エポキシ基の酸素と相互作用可能な立体構造を有する化合物である。
アンモニウム塩としては、トリエチルメチルアンモニウム2-エチルヘキサン塩(製品名:U-CAT 18X、サンアプロ社製)等が挙げられる。
アミジン構造を有するアミン類としては、ジアザビシクロウンデセン(DBU)やジアザビシクロノネン(DBN)、当該アミン類の塩としては、DBUの2-エチルヘキサン酸塩(製品名:SA1、サンアプロ社製)等が挙げられる。
グアニジン構造を有するアミン類(ピグアニドも含む)としては、テトラメチルグアニジン、塩としては、1,2-Dicyclohexyl-4,4,5,5-tetramethylbiguanidium n-butyltriphenylborate(製品名:WPGK-300(富士フィルム和光))等が挙げられる。
これらの中でも、アミジン構造を有するアミン類若しくはその塩、グアニジン構造を有するアミン類若しくはその塩が好ましく、グアニジン構造を有するアミン類若しくはその塩がより好ましい。
上記3)の場合、脂環式エポキシ樹脂を硬化させる成分として、pKaが10を超える活性水素化合物(B2)と、反応又は光照射によりカチオン類を生成する触媒(C2)とを含む。
上記の通り、高いpKaを有する活性水素化合物はH+を放出しにくいため、単独では脂環式エポキシ樹脂を活性化させにくい。そのため、反応や光照射によりH+を生成しうる触媒(C2)をさらに組み合わせることで、脂環式エポキシ樹脂の硬化反応性を高めることができる。また、反応や光照射のタイミングにより硬化タイミングを調整できるため、保存安定性との両立もしやすい。また、触媒(C2)を含む硬化性組成物は、例えば40℃/24h保管していても流動性があり、保存安定性に優れている。そのため、触媒(C2)は、1液型の硬化性組成物の触媒として特に適している。
pKaが10を超える活性水素化合物(B2)は、上記と同様のものを使用することができ、触媒(C2)の種類に応じて選択される。例えば、触媒(C2)がジシアンジアミドである場合、活性水素化合物(B2)は、ジシアンジアミドと反応して、グアニジン(反応促進物)を生成する活性水素化合物であることが好ましい。
反応又は光照射によりカチオン類を生成する触媒(C2)は、上記活性水素化合物(B2)との反応又は光照射によりカチオン類を生成する触媒である。
第4級アンモニウム塩を用いる場合、硬化反応性を高める観点では、イミダゾール又はアミジンを塩基反応性物質として含むものが好ましい。
上記硬化性組成物は、用途に応じて他の成分をさらに含んでもよい。他の成分の例には、他のエポキシ樹脂や増感剤、酸化防止剤、界面活性剤、カップリング剤、安定化剤、フィラー、溶剤等が含まれる。
また、触媒(C2)を用いる場合、脂環式エポキシ樹脂(A)を含む第1液と、活性水素化合物(B2)と触媒(C2)とを含む第2液とを組み合わせた2液型の硬化性組成物としてもよい。2液型の硬化性組成物は、混合しやすさの観点から、第1液と第2液の粘度が近いことが好ましい。第1液と第2液の粘度調整のため、第1液と第2液の両方に脂環式エポキシ樹脂(A)を添加する場合、脂環式エポキシ樹脂(A)と触媒(C2)とを含む第1液と、脂環式エポキシ樹脂(A)と活性水素化合物(B2)を含む第2液とを組み合わせた2液型の硬化性組成物としてもよい。
1)pKaが10以下の2官能の活性水素化合物(B1’)を含むか、
2)pKaが10を超える2官能の活性水素化合物(B2’)と、カチオン触媒(C1)とを含むか、又は
3)pKaが10を超える2官能の活性水素化合物(B2’)と、反応若しくは光照射によりカチオン類を生成する触媒(C2)とを含むことができる。
本発明の一実施形態に係る硬化物は、上記硬化性組成物の硬化物である。
脂環式エポキシ樹脂の硬化物は良好な透明性を有するものの、芳香環を有さないため、芳香族エポキシ樹脂の硬化物よりも屈折率は低くなりやすい。これに対し、上記硬化性組成物の活性水素化合物(B)がチオール系化合物を含む場合、硬化物は硫黄元素を含むため、高い屈折率を有する。高い屈折率を有する硬化物は、例えば光学用途に適している。
従来の酸無水物系硬化剤又はカチオン系硬化剤を含む硬化性組成物の硬化物は高い架橋密度を有するため、脆くなりやすい。これに対し、上記硬化性組成物は、硬化剤として活性水素化合物(B)としてチオール系化合物、特に脂肪族チオール系化合物を含む場合(上記2)及び3)参照)、硬化物に柔軟性を付与しうるため、靭性を高めやすい。即ち、チオール系化合物を含む硬化性組成物の硬化物は、良好な柔軟性を有しつつ、酸無水物系硬化剤を用いた場合と同等の高い曲げ弾性率を示す。この理由は明らかではないが、以下のように推測される。
2つ目の理由としては、脂環式エポキシ樹脂とチオール系化合物との硬化反応性が高いため、開環により生成する水酸基も多い。そのため、生成した水酸基同士の水素結合により、初期の応力に対して高い弾性率を示す。一方、水素結合以上の応力が加わると、水素結合が切れて低い弾性率を示すため、高いひずみ率や降伏点を示すと考えられる。
即ち、厚み3mmの硬化物を80mm×10mmの大きさに切り取り、試験片とする。この試験片を用いて、支点間距離を50mm、試験速度1.5mm/minとしてJIS K 7171準拠の方法で3点曲げ試験にて、曲げ弾性率、曲げ強さ、曲げひずみ(以降、ひずみ率とよぶ)を測定した。降伏点とは、試験中に、応力の増加を伴わずにひずみの増加が生じる最初の地点である。
1)まず、硬化物をハンマーにより粉砕機に入る大きさまで、予備粉砕する(砕けない場合は、冷凍下で粉砕する)。IKA製万能粉砕機M20でM22のブレードをセットし、水冷状態で予備粉砕物を投入し、1分粉砕する。粉砕した硬化物を60メッシュで篩分し、微粉体を約2g得られるまで繰り返す。
2)次いで、得られた微粉体の5倍量の水を添加し、PCT圧力容器で、120℃/20時間加熱し、室温まで放冷後にろ紙(5C)を用いてろ過する。得られた抽出液を試験管に秤量し、水で定容した後、超音波で10分間溶解又は抽出し、メンブレンフィルターでろ過する。
3)得られた溶液についてイオンクロマトグラフィー測定を行う。測定条件は、以下の通りとする。
(測定条件)
装置:TOSOH IC-2010
カラム:Shodex IC YS-50(125×4.6mm I.D.)
ショートカラム:Shodex IC YS-G(10×4.6mm I.D.)
サプレッサー:ノンサプレッサー
溶離液:4mM CH3SO3H
溶離液流量:1.0mL/min
カラム温度:40℃
注入量:30μl
検出器:電気伝導度(CD)
即ち、当該熱可塑性樹脂は、2官能の脂環式エポキシ樹脂(A’)と2官能の活性水素化合物(B’)とが、高度に直線状に重合していることから、十分な熱可塑性を有し、加熱により分子が動きやすい。それにより、物理的な自己修復性を示す。
また、当該熱可塑性樹脂は、脂環式エポキシ樹脂(A’)のエポキシ基が、2官能の活性水素化合物(B’)との反応により生成する水酸基を多く有するため、分子間で水素結合を形成しやすい。また、活性水素化合物(B’)が芳香環を含む場合、分子間でπ-π結合を形成しやすい。これらの可逆的な結合により、化学的な自己修復性を示す。
これらの作用により、上記熱可塑性樹脂は、自己修復性を示すと考えられる。
上記硬化物は、上記硬化性組成物を加熱して硬化させて製造することができる。
上記硬化物は、脂環式エポキシ樹脂(A)を含む硬化性組成物から得られるため、良好な透明性や耐候性を有する。特に、活性水素化合物(B)としてチオール系化合物を用いることで、光照射または低温加熱で硬化が可能であることに加えて、高い屈折率を有し、適度な柔軟性や曲げ弾性率等を有する硬化物を得ることができる。従って、例えば光半導体素子や有機エレクトロルミネッセンス素子の封止材や接着剤、表面保護膜、透明表示基板等の光学用途や、自動車産業等の被着体全体を加熱することが困難な製造環境且つ衝突のような破損に耐えられる構造用接着材用途、タッチパネルセンサー用の保護フィルムや電子機器や自動車等の表面を保護する塗料用途に好ましく使用することができる。特に、硬化物が高い弾性率を有するため、弱い外力では被着材の接着位置を維持しつつ、硬化物が降伏点を有するため、強い外力では割れずに曲がることができる。そのため、自動車産業の構造用接着材等に適している。
1-1.エポキシ樹脂
<脂環式エポキシ樹脂(A)>
A-1:セロキサイド2021P(ダイセル社製、2官能、エポキシ当量130g/eq)
A-4:THI-DE(エネオス社製、2官能、エポキシ当量80g/eq)
835LV(DIC社製、ビスA/F型エポキシ樹脂、エポキシ当量165g/eq)
JER604(三菱ケミカル社製、4官能、エポキシ当量120g/eq)
JER630(三菱ケミカル社製、3官能、エポキシ当量98g/eq)
850S(DIC社製、2官能、エポキシ当量189g/eq)
<pKaが10以下の活性水素化合物(B1)>
B1-1:1,3,5-トリアジン-2,4,6-トリチオール(チオシアヌル酸)(東京化成工業社製、芳香族チオール(3官能)、チオール当量59.1g/eq、pKa4~6.5)
B1-2:4,4’-チオビスベンゼンチオール(富士フィルム和光社製、芳香族チオール(2官能)、チオール当量126.2g/eq、C6H5SH:pKa6.52~8.2)
B1-3:ビスフェノールA(三井化学社製、フェノール(2官能)、水酸基当量114g/eq、文献値:pKa9.6)
B2-1:TS-G(四国化成社製、脂肪族チオール(4官能)、チオール当量96g/eq、CH3CH2SH:pKa10.5)
イソホロンジアミン(富士フィルム和光社製、脂肪族アミン(2官能)、アミン当量42.575g/eq、参考Et2NH:pKa36)
リカシッドMH-700(新日本理化社製、当量163.5g/eq)
pKaは、文献(https://organicchemistrydata.org/hansreich/resources/pka/pka_data/pka-compilation-williams.pdf)でpKaの値が公知である化合物については、当該文献に記載されたpKaの値を採用した。また、上記文献でpKaの値が公知でない化合物については、活性水素化合物を示性式で記述し、活性水素を有する官能基から炭素数2個分以上と一致する化合物のpKaの値を採用した。なお、B1-3のpKaは、Hazardous Substances Data Bank (HSDB) :513- PubChem (nih.gov)に記載の値を採用した。
<カチオン触媒(C1)>
C1-1:SA1(サンアプロ社製、DBUのフェノール塩、熱塩基触媒)
C1-2:SA102(サンアプロ社製、DBUの2-エチルヘキサン塩、熱塩基触媒)
C1-3:テトラメチルグアニジン(東京化成工業社製、塩基触媒)
C1-4:DBU(東京化成工業社製、ジアザビシクロウンデセン、塩基触媒)
C1-5:TPP-MK(北興化学工業社製、テトラフェニルホスホニウムテトラーpートリルボレート、リン系硬化促進剤)
C1-6:2E4MZ(四国化成社製、2-エチル-4-メチルイミダゾール、汎用カチオン触媒)
C2-1:DDA5(ジシアンジアミド、潜在触媒)
C2-2:WPBG-266(富士フィルム和光社製、1,2-ジイソプロピル-3-[ビス(ジメチルアミノ)メチレン]グアニジウム2-(3-ベンゾイルフェニル)プロピネート、光塩基触媒)
C2-3:WPBG-300(富士フィルム和光社製、1,2-ジシクロヘキシル-4,4,5,5-テトラメチルジグアジウムn-ブチルトリフェニルボレート、光塩基触媒)
C2-4:2-(9-オキソキサンテン-2-イル)プロピオン酸1,5,7-トリアザビシクロ[4.4.0]デカ-5-エン(光塩基触媒)
カヤキュアDETX-S(日本化薬社製、2,4-ジエチルチオキサントン)
<組成物1~47の調製>
エポキシ樹脂の質量を3gとして表1~3に示される配合比で、各材料を、攪拌練太郎(ARE-310)を用いて攪拌モードにて2000rpmの条件で30秒間均一に撹拌混合して、組成物1~47を作製した。
得られた組成物の硬化反応性を、以下の方法で評価した。
得られた組成物を3.0mgアルミサンプルパンに入れ、示差熱量分析(DSC)測定を行った。具体的には、島津製作所製DSC-60を用い、室温(25℃)から20℃/分の昇温条件で測定した際に観測される発熱ピーク温度(熱硬化温度)を測定した。
そして、以下の基準で評価した。
◎:DSC測定における発熱ピーク温度が199℃(酸無水物の発熱ピーク温度)よりも低い
○:DSC測定における発熱ピーク温度が、199℃以上250℃未満
△:DSC測定における発熱ピークが確認されるが、発熱ピーク温度が250℃以上
×:DSC測定において発熱ピークが確認されない
○以上であれば、反応性は良好と判断した。
なお、硬化タイプ(形態)として、活性水素化合物(B1)を用いた硬化形態を「1」、活性水素化合物(B2)とカチオン触媒(C1)を用いた硬化形態を「2」、活性水素化合物(B2)と、反応等によりカチオン類を生成する触媒(C2)を用いた硬化形態を「3」とした。
また、光塩基触媒(触媒(C2))との併用により、良好な硬化反応性を示すことがわかる(組成物4と組成物30~32及び35との対比)。中でも、光照射後の発熱ピーク温度のほうが、光照射前の発熱ピーク温度よりも低いことが示される。これらのことから、光照射により硬化性がさらに高まることが示される(組成物30~32及び35参照)。
3-1.組成物の調製
<組成物R0~R5の調製>
表4に示される配合比で、各材料を、真空攪拌機 あわとり練太郎ARV-310Pで、2000rpm/100秒で均一に撹拌混合及び脱泡して、組成物を作製した。
上記作製した組成物14、15、R0、R1及びR4については、表4に示される条件で加熱して硬化させて、硬化物サンプルとした。それ以外の組成物は、そのままサンプルとした。
(粉砕)
硬化物サンプルについて、万能粉砕機M20でM22のブレードをセットし、水冷状態で、ハンマーで粉砕した硬化物を投入し、1分粉砕、粉砕物を60メッシュ-ステンレス網に乗せて篩分した。60メッシュ-パス品を回収し、60メッシュ-オン品を再びM20に投入し、パス品が2gになるまで繰り返した。
微粉体の5倍量の水10gを添加し、圧力容器で、120℃/20時間加熱し、室温まで放冷後にろ紙(5C)を用いてろ過した。
得られた抽出液又はサンプルを試験管に秤量し、水で定容した後、超音波で10分間溶解又は抽出し、メンブレンフィルターでろ過した。得られた溶液についてイオンクロマトグラフ測定を行った。測定条件は、以下の通りとした。(測定条件)
装置:TOSOH IC-2010
カラム:Shodex IC YS-50(125×4.6mm I.D.)
ショートカラム:Shodex IC YS-G(10×4.6mm I.D.)
サプレッサー:ノンサプレッサー
溶離液:4mM CH3SO3H
溶離液流量:1.0mL/min
カラム温度:40℃
注入量:30μl
検出器:電気伝導度(CD)
これに対し、組成物14、15、R4の硬化物からは、所定以上の量のグアニジンが検出された。これらのことから、脂肪族チオール系化合物(B2-1)とジシアンジアミド(C2-1)とが反応して、グアジニンが生成されていることがわかる。
4-1.硬化物の調製
<硬化物1の調製>
表5に示される配合比で、各材料を、真空攪拌機 あわとり練太郎ARV-310Pで、2000rpmで100秒間均一に撹拌混合及び脱泡して、組成物を作製した。
得られた組成物を枠型に流し込み、90℃で3時間加熱した後、120℃で4時間加熱して硬化させて、厚み3mmの硬化物1を得た。
表5に示される配合比で、各材料を、真空攪拌機 あわとり練太郎ARV-310Pで、2000rpmで100秒間均一に撹拌混合及び脱泡して、組成物を作製した。
得られた組成物を枠型に流し込み、120℃で1時間加熱して硬化させて、厚み3mmの硬化物2及び3を得た。
上記作製した組成物23を枠型に流し込み、60℃で1時間加熱して硬化させて、硬化物4を得た。
上記作製した組成物24を枠型に流し込み、130℃で1時間加熱して硬化させて、厚み3mmの硬化物5を得た。
表5に示される配合比で、各材料を、真空攪拌機 あわとり練太郎ARV-310Pで、2000rpmで100秒間均一に撹拌混合及び脱泡して、組成物を作製した。
得られた組成物を枠型に流し込み、100℃で1時間加熱して硬化させて、厚み3mmの硬化物6及び7を得た。
上記作製した硬化物1~7の屈折率を、以下の方法で評価した。
硬化物の屈折率は、Abbe Refractometer DR-A1-Plusを用いて波長589nmの条件で測定した。中間液はモノブロモナフタレンを使用した。
5-1.硬化物の調製
<硬化物1~5の調製>
上記作製した硬化物1~5を準備した。
表6に示される配合比で、各材料を、真空攪拌機 あわとり練太郎ARV-310Pで、2000rpmで100秒間均一に撹拌混合及び脱泡して、組成物を作製した。
得られた組成物を枠型に流し込み、100℃で0.5時間加熱した後、120℃で0.5時間さらに加熱して硬化させて、厚み3mmの硬化物8~10を得た。
上記作製した硬化物1~5及び8~10の曲げ特性を、以下の方法で評価した。
得られた硬化物を80mm×10mmの大きさに切り取り、試験片とした。この試験片を用いて、JIS K 7171準拠の方法で、曲げ弾性率、曲げ強さ、ひずみ率を求めた。
上記試験片の降伏点の有無は、上記応力-歪み曲線から応力が増加せず、ひずみが増加する点の有無から判断した。
また、硬化物2~5(実施例)は、芳香族エポキシ樹脂を用いた硬化物9及び10(比較例)よりも曲げ弾性率、ひずみ率ともに高いことがわかる。
6-1.組成物2-1~2-11の作製
表7に示される各成分を、同表に示される配合比で配合し、以下の混合条件1又は2で混合した。
(混合条件1)
真空攪拌機 あわとり練太郎(ARV-310P)を用いて2000rpmで100秒間均一に撹拌混合及び脱泡して、組成物を作製した。
(混合条件2)
真空攪拌機 あわとり練太郎(ARE-310)を用いて攪拌モード2000rpmで30秒間均一に撹拌混合して、組成物を作製した。
なお、組成物2-2、2-3、2-5、2-6、2-8及び2-9は、上述の組成物34、35、38、39、44及び47にそれぞれ対応する。
得られた組成物について、以下の評価を行った。
混合条件1の条件で調製した各組成物の粘度(25℃、5rpm、30sec.の値)をコーンプレート型粘度計(TVE-35H、コーンローター:3°×R9.7、東機産業製)で測定した。
混合条件2の条件で調製した各組成物の硬化物について、熱可塑性及び自己修復性(外観、曲げ試験)を、以下の方法で評価した。組成物2-6の硬化物については、さらにTOF-MS分析を行った。
得られた組成物を、スライドグラス(松浪硝子工業社製、松浪スライドグラス 型式S7214)2枚の間に1mm厚のシリコンゴムを挟んだ枠型に流し込み、同表に示される硬化条件で加熱し、硬化させて、厚み1mmの硬化物を得た。なお、組成物2-3の硬化条件2については、枠型に流し込み、高圧水銀灯のUV照射機(アイグラフィック社製、(登録商標)ECS-4011GX)で照射量9000mJの条件で照射した後、120℃で1時間加熱して、厚み1mmの硬化物を得た。
4:硬化物が倒れており、熱可塑性を示す
3:型枠通りの形状を維持した状態で枠型から硬化物を外すことができるが、120℃で1時間加熱前の段階で、硬化物を立てた状態で一定時間おくと、硬化物が倒れる(硬化が十分ではないが、熱可塑性は示している)
2:増粘しているが、枠型から外すことができない(硬化していない)
1:立てた状態を維持しており、熱可塑性を示さない
上記(1)と同様にして得られた硬化物を、スライドグラスに挟んだまま各硬化温度から-30℃の冷凍庫に投入して、ヒビを入れた。ヒビが入らない場合は、スライドグラスが割れない程度まで屈曲させてヒビを入れた。そして、室温状態のヒビを入れた硬化物を120℃で5分加熱した後のヒビ割れの状態を目視により観察した。そして、以下の基準に基づいて評価した。
3:ヒビ割れが消滅した
2:屈曲でもヒビが入らない
1:硬いままであり、ヒビ割れは消滅しなかった
(評価用サンプルの作製)
セロキサイド2021P(ダイセル)を100質量部、TS-G(四国化成)を80質量部、DDA5を1質量部の配合比で真空攪拌機 あわとり練太郎(ARV-310P)を用いて攪拌モード2000rpm/180秒間で混錬および脱泡し、組成物Aを調製した。得られた組成物Aを型枠に流し込み、120℃で1時間加熱して、厚み1mmの硬化物を2枚得た。
一方、組成物2-6又は8の配合比で真空攪拌機 あわとり練太郎(ARV-310P)を用いて攪拌モード2000rpm/100秒間で混錬および脱泡し、組成物Bを調製した。
そして、上記調製した組成物Bを、上記作製した2枚の硬化物間に流し込み、表7に記載のそれぞれの条件で加熱した。それにより、3層構造(硬化物A(外壁用)/硬化物B(評価対象)/硬化物A(外壁用))の合計厚み3mmの硬化物を得た。
得られた硬化物の曲げ試験を、JIS K 6911に準拠して行った。即ち、厚み3mmの硬化物を80×10mmの大きさに切り取り、試験片とした。この試験片を用いて、支点間距離を50mm、試験速度1.5mm/分としてJIS K 6911準拠の方法で3点曲げ試験にて、曲げ弾性率を測定した。曲げ弾性率は下記の計算式から算出した。
弾性率(N/mm2)=傾き×支点間距離/試験片の断面積
傾きは、縦軸:試験力、横軸:変位とし、試験力10N及び20Nの2点間の全データを用いて最小二乗法より算出した。
硬化物を曲げ試験用の大きさに切り取った後、試験時の衝撃による内層構造の滑落を防ぐため、試験片の厚み側となる4つの側面にのみセロハンテープを貼り付けた。
試験は、以下の1~9の順序で実施した。加熱後は、室温下で1時間冷却後に試験した。
1.初期加熱:120℃に加熱されたオーブンに10分間投入(試験片の大きさに切り取る際に生じたクラックを修復するため)
2.初期測定:曲げ試験
3.破壊時測定:曲げ試験
4.120℃修復:120℃に加熱されたオーブンに10分間投入
5.120℃-弾性率測定:曲げ試験
6.100℃修復:100℃に加熱されたオーブンに10分間投入
7.100℃測定:曲げ試験
8.140℃修復:140℃に加熱されたオーブンに10分間投入
9.140℃測定:曲げ試験
各温度における修復率(%)を、下記式に基づいて評価した。
修復率(%)=(各温度での測定値-破壊時の測定値)/(初期測定値-破壊時測定値)×100
なお、測定値は、曲げ試験で測定される曲げ弾性率を意味する。
上記修復率がプラスの場合は、自己修復性が発現されたことを示し、上記修復率がプラスとなった温度を自己修復が可能な温度とした。なお、上記修復率がマイナスの場合は、0%とし、自己修復性が発現されなかったことを示している。
組成物2-6の硬化物について、TOF-MS分析により構造解析を行った。
具体的には、硬化物を10mg秤量し、5mLのクロロホルムを加え、超音波処理を10分行った。試料溶液1μLをFDエミッターに塗布し、日本電子株式会社(JEOL)製、JMS-T100GCVを用いて、以下の条件で測定した。
サンプル:クロロホルム希釈
イオン化モード:FD+
分析m/z範囲:29.00~3000.00
また、組成物2-6の反応機構を図3Aに示し、その硬化物のTOF-MSのスペクトルを図3Bに示す。また、組成物2-6及び2-8の(3)自己修復性-曲げ試験の評価結果を表8に示す。
なお、表7では、硬化タイプ(形態)として、活性水素化合物(B1)を用いた硬化形態を「1」、活性水素化合物(B2)とカチオン触媒(C1)を用いた硬化形態を「2」、活性水素化合物(B2)と、反応等によりカチオン類を生成する触媒(C2)を用いた硬化形態を「3」とした。
組成物2-6の配合におけるエポキシ樹脂+活性水素化合物の分子量は、図3Aに示すように444.1である。図3Bに示される実施例6のTOF-MSスペクトルでは、主要なピークとして444.1143、888.2360、1332.3430で―OHを含む分子量である444.1の単位で分子量が確認できる。また、脂環式エポキシ樹脂(A)であるA-2(分子量194.1)に由来するピークと、活性水素化合物(B1)であるB1-1(分子量249.9)に由来するピークが交互に現れていることがわかる(図3参照)。つまり、脂環式エポキシ樹脂(A)-チオール系化合物(B1)-・・・の順で結合している繰り返し構造(分子量444.1)が検出されている。これらのことから、想定通りの反応が起こっていること、即ち、脂環式エポキシ樹脂とチオール系化合物が直線的に重合していることがわかる。
(1)試料シートの作製
PP(MA3)(ポリプロ社製ノバテックPP、一般射出成形グレード、ポリプロピレン樹脂)14.25gと、組成物2-6の硬化物(熱可塑性樹脂)0.75gとを、混練装置ラボプラストミル〔ローラーミキサーR30〕(東洋精機社製)を用いて180℃で10分間溶融混した後、180℃でプレス成形して、厚み0.31mmの試料シートを得た。
得られた試料シートの一部を、剃刃で短冊状に切り出した。中央に予め亀裂を入れた後、液体窒素中で割断した。これを、カーボンテープを貼り付けた試料台上に、観察面が上になるように配置し、Osで金属蒸着した。
そして、金属蒸着した試料シートの表面を、SEM観察及びEDS分析し、画像解析を行った。画像解析では、試料を3kのSマッピング像を用いて3つの視野について実施した。なお、表9の球状粒子の面積、長径、平均近傍間距離は、123個の球状粒子について測定したときの最大値(Max)、最小値(Min)、中間値(Med)、標準偏差(S.D.)及び平均値(Ave)を示す。
また、表9に示すように、熱可塑性樹脂の球状粒子の面積、長径及び平均近傍間距離はいずれも小さく、良好に分散している様子がわかる。
これらのことから、2官能のエポキシ樹脂(A’)と2官能の活性水素化合物(B’)とを含む上記硬化性組成物を硬化させて得られる熱可塑性樹脂は、マトリクス樹脂中に良好に分散し、マスターバッチとして好適であることがわかる。
Claims (15)
- 脂環式エポキシ樹脂(A)と、pKaが10以下の活性水素化合物(B1)とを含む、
硬化性組成物。 - 前記活性水素化合物(B1)は、芳香族チオール系化合物を含む、
請求項1に記載の硬化性組成物。 - 前記脂環式エポキシ樹脂(A)は、2官能の脂環式エポキシ樹脂(A')であり、
前記pKaが10以下の活性水素化合物(B1)は、pKaが10以下の2官能の活性水素化合物(B1')である、
請求項1に記載の硬化性組成物。 - 脂環式エポキシ樹脂(A)と、pKaが10を超える活性水素化合物(B2)と、カチオン触媒(C1)とを含み、
前記脂環式エポキシ樹脂(A)100質量部に対する前記活性水素化合物(B2)の含有比率は、40~200(質量比)である、
硬化性組成物。 - 前記活性水素化合物(B2)は、脂肪族チオール系化合物を含む、
請求項4に記載の硬化性組成物。 - 2官能の脂環式エポキシ樹脂(A')と、pKaが10を超える2官能の活性水素化合物(B2')と、カチオン触媒(C1)とを含む、
硬化性組成物。 - 脂環式エポキシ樹脂(A)と、pKaが10を超える活性水素化合物(B2)と、前記活性水素化合物(B2)との反応又は光照射によりカチオン類を生成する触媒(C2)とを含む、
硬化性組成物。 - 前記活性水素化合物(B2)は、脂肪族チオール系化合物を含む、
請求項7に記載の硬化性組成物。 - 前記触媒(C2)は、前記活性水素化合物(B2)との反応によりカチオン類を生成する触媒であって、
ジシアンジアミドを含む、
請求項7に記載の硬化性組成物。 - 前記脂環式エポキシ樹脂(A)は、2官能の脂環式エポキシ樹脂(A')であり、
前記pKaが10を超える活性水素化合物(B2)は、pKaが10を超える2官能の活性水素化合物(B2')である、
請求項7に記載の硬化性組成物。 - 請求項1に記載の硬化性組成物の硬化物。
- 請求項4に記載の硬化性組成物の硬化物。
- 請求項7に記載の硬化性組成物の硬化物。
- 活性水素化合物(B2)とジシアンジアミドとを加熱下で反応させて、グアニジンを含む組成物を得る工程と、
前記組成物と、脂環式エポキシ樹脂(A)とを加熱下で反応させて、前記脂環式エポキシ樹脂(A)を含む硬化性組成物の硬化物を得る工程と、を含む、
硬化物の製造方法。 - 2官能の脂環式エポキシ樹脂(A')に由来する構造単位と、2官能の活性水素化合物(B')に由来する構造単位とを含む、熱可塑性樹脂。
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| CN202380061358.2A CN119768447A (zh) | 2022-08-31 | 2023-08-29 | 固化性组合物、固化物以及固化物的制造方法 |
| EP23860374.0A EP4582463A1 (en) | 2022-08-31 | 2023-08-29 | Curable composition, cured product, and method for producing cured product |
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- 2023-08-29 WO PCT/JP2023/031333 patent/WO2024048612A1/ja not_active Ceased
- 2023-08-29 EP EP23860374.0A patent/EP4582463A1/en active Pending
- 2023-08-29 CN CN202380061358.2A patent/CN119768447A/zh active Pending
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| JPWO2024048612A1 (ja) | 2024-03-07 |
| EP4582463A1 (en) | 2025-07-09 |
| CN119768447A (zh) | 2025-04-04 |
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