WO2023120511A1 - 接着剤組成物および積層体 - Google Patents
接着剤組成物および積層体 Download PDFInfo
- Publication number
- WO2023120511A1 WO2023120511A1 PCT/JP2022/046837 JP2022046837W WO2023120511A1 WO 2023120511 A1 WO2023120511 A1 WO 2023120511A1 JP 2022046837 W JP2022046837 W JP 2022046837W WO 2023120511 A1 WO2023120511 A1 WO 2023120511A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- epoxy resin
- adhesive composition
- mass
- curing
- bisphenol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
- C08K5/3445—Five-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/50—Phosphorus bound to carbon only
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2206—Oxides; Hydroxides of metals of calcium, strontium or barium
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
Definitions
- the present invention relates to adhesive compositions. More particularly, the present invention relates to an epoxy-based adhesive composition excellent in properties such as shear property, curability and heat resistance, and a laminate using the same.
- epoxy adhesives have excellent properties such as mechanical properties, water resistance, chemical resistance, and heat resistance, and are used in a wide range of fields such as paints, molding materials, heat dissipation materials, and adhesives. It is an indispensable material.
- Reactive diluents are widely used in epoxy adhesives to reduce viscosity, improve workability, and provide flexibility.
- Examples of reactive diluents include epoxies with low viscosity such as monofunctional and aliphatic. It is Further, Patent Document 2 reports that adding an epoxy resin having an aliphatic hydrocarbon structure with 6 or more carbon atoms improves flexibility.
- an object of the present invention is to provide an epoxy-based adhesive excellent in tensile shear and curability with a substrate.
- the present invention consists of the following configurations.
- [1] Contains a bifunctional or higher aromatic epoxy resin (A), a bifunctional or higher aliphatic epoxy resin (B), an epoxy resin curing agent (C), a curing catalyst (D) and a thixotropic agent (E) ,
- the adhesive composition wherein the total chlorine content of the bifunctional or higher aliphatic epoxy resin (B) is 1.0% by mass or less.
- the aliphatic epoxy resin (B) with a functionality of 1 or more is 1 to The adhesive composition according to [1] above, which is 30 parts by mass.
- the adhesive composition of the present invention is excellent in tensile shear and curability with substrates. Therefore, the adhesive composition of the present invention can be suitably used as a structural adhesive.
- the adhesive composition of the present invention comprises an aromatic epoxy resin (A) having a functionality of 2 or more, an aliphatic epoxy resin having a functionality of 2 or more (B), an epoxy resin curing agent (C), a curing catalyst (D), and It contains a thixotropic agent (E) as an essential ingredient.
- A aromatic epoxy resin
- B aliphatic epoxy resin having a functionality of 2 or more
- C epoxy resin curing agent
- D curing catalyst
- E thixotropic agent
- the bifunctional or higher aromatic epoxy resin (A) (hereinafter also referred to as aromatic epoxy resin (A) or simply component (A)) contains one or more aromatic rings and two or more oxiranes in one molecule. It is not particularly limited as long as it contains a ring.
- Examples of the bifunctional or higher aromatic epoxy resin (A) used in the present invention include monocyclic aromatic glycidyl ether compounds obtained by glycidyl-etherifying polyhydric aromatic alcohols such as catechol, resorcinol, hydroquinone, and phthalic acid; Bisphenol-type epoxy obtained by glycidyl-etherifying bisphenol compounds such as bisphenol A, bisphenol F, bisphenol AP, bisphenol AF, bisphenol B, bisphenol BP, bisphenol C, bisphenol E, bisphenol M, bisphenol S, bisphenol P, bisphenol PH and bisphenol Z.
- monocyclic aromatic glycidyl ether compounds obtained by glycidyl-etherifying polyhydric aromatic alcohols such as catechol, resorcinol, hydroquinone, and phthalic acid
- Bisphenol-type epoxy obtained by glycidyl-etherifying bisphenol compounds such as bisphenol A, bisphenol F, bisphenol AP, bisphenol AF, bisphenol B, bisphenol BP, bis
- Polycyclic aromatic epoxy resin obtained by glycidyl-etherifying a polycyclic aromatic compound such as naphthalene, biphenyl, tetramethylbiphenyl, bisphenolfluorene, biscresolfluorene, tetraphenylolethane; phenol novolak, cresol novolak, bisphenol A Novolac-type epoxy resins obtained by epoxidizing novolak-type compounds such as novolacs, glycidylamine-type epoxy resins obtained by glycidyl-etherifying aromatic amino compounds such as aniline, o-methylaniline, p-aminophenol, and m-phenylenediamine; triglycidyl Polyfunctional epoxy resins such as isocyanurate, triphenylglycidyl ether methane type epoxy resin, xylylene type epoxy resin, tetrakisphenolethane type epoxy resin, naphthalene type epoxy resin; ethylene oxide a polycycl
- bisphenol-type epoxy resins are preferable from the viewpoint of mechanical properties such as adhesiveness and heat resistance, and among them, bisphenol-A-type epoxy resins and bisphenol-F-type epoxy resins are preferable because the viscosity of the composition can be easily adjusted.
- the bisphenol A type epoxy resin changes its state depending on its molecular weight, but it is preferably liquid to semi-solid at room temperature, and particularly preferably liquid.
- a bifunctional or higher aliphatic epoxy resin (B) (hereinafter also referred to as an aliphatic epoxy resin (B) or simply (B) component) contains an aliphatic hydrocarbon group and two or more oxirane rings in one molecule. is not particularly limited as long as it contains an alicyclic skeleton as the aliphatic hydrocarbon group. However, aromatic groups are not included.
- Aliphatic epoxy resins (B) used in the present invention include, for example, diepoxy compounds of cycloaliphatic alcohols such as dimethylol dicyclopentadiene diglycidyl ether; diglycidyl hexahydrophthalate, diglycidyl hexahydroterephthalate diepoxy compounds of cycloaliphatic dicarboxylic acids such as; diepoxy compounds of aliphatic alcohols such as 1,4-butanediol diglycidyl ether and 1,6-hexanediol diglycidyl ether; ), jER872 (trade name, manufactured by Mitsubishi Chemical Corporation) and other difunctional epoxy resins having a dimer acid skeleton.
- diepoxy compounds of cycloaliphatic alcohols such as dimethylol dicyclopentadiene diglycidyl ether
- diglycidyl hexahydrophthalate diglycidyl hexahydroterephthalate diepoxy
- the aliphatic epoxy resin (B) used in the present invention preferably has a total chlorine content of 1.0% by mass or less from the viewpoint of curability of the adhesive composition. It is more preferably 0.8% by mass or less, and particularly preferably 0.7% by mass or less.
- the total amount of chlorine means the amount (% by mass) of chlorine atoms contained in the aliphatic epoxy resin (B), and can be measured by the method described in JIS K 7243-3:2005.
- Such an aliphatic epoxy resin (B) include EX212L (1,6-hexanediol type, total chlorine content of 0.4% by mass), EX214L (1,4-butanediol type, total chlorine content of 0 .4% by mass), EX216L (cyclohexanedimethanol type, total chlorine content 0.4% by mass), EX211L (2,2-dimethylpropanediol type, total chlorine content 0.7% by mass), EX321L (trimethylolpropane type , total chlorine content 0.4% by mass) (manufactured by Nagase ChemteX); YX-8000 (hydrogenated bisphenol A type, total chlorine content 0.011% by mass), YX-8034 (hydrogenated bisphenol A type, total chlorine content 0.006% by mass), (manufactured by Mitsubishi Chemical), EP-4088S (dicyclopentadiene dimethanol type, total chlorine content 0.3% by mass), EP-4088L (dicyclopent
- bifunctional or higher aliphatic epoxy resins with a high total chlorine content It is presumed that this is because the resin (B) contains an impurity in which a part of the epoxy group is substituted with another group, which inhibits the cross-linking reaction.
- an intermediate product of the reaction to obtain an epoxy resin for example, a compound having a 3-chloro-2-hydroxypropyl group instead of a glycidyl group is known.
- one of the bifunctional aliphatic epoxy resins A compound in which the glycidyl group of is a 3-chloro-2-hydroxypropyl group is included as an impurity.
- the impurities listed on the left although the glycidyl group at one end of the molecule consumes the reaction point where the cross-linking reaction should have originally occurred, there is no glycidyl group at the other end of the molecule, so no cross-linking structure is formed, and the cross-linking density of the cured product is decreases. It is believed that the same is true in the case of using a tri- or higher functional aliphatic epoxy resin (B) in that it inhibits the cross-linking reaction.
- the content of the aliphatic epoxy resin (B) in the adhesive composition of the present invention is 1- It is preferably 30 parts by mass, more preferably 5 to 30 parts by mass.
- the content of the aliphatic epoxy resin (B) is at least the lower limit, workability is improved due to the dilution effect.
- cured material becomes it favorable that it is below the said upper limit.
- epoxy resin curing agent (C) used in the present invention, known compounds capable of curing epoxy resins can be used, such as dicyandiamide; bisphenol compounds such as bisphenol A, bisphenol F and bisphenol E; catechol compounds such as catechol, resorcinol and methylcatechol; biphenol compounds such as biphenol and tetramethylbiphenol; biscresol compounds such as biscresol fluorene; hydroquinone compounds; liquid phenol compounds such as trisdimethylaminomethylphenol; Novolac compounds; aliphatic amines such as diethylenetriamine, triethylenetetramine, tetraethylenepentamine, m-xylenediamine, trimethylhexamethylenediamine, 2-methylpentamethylenediamine, diethylaminopropylamine; isophoronediamine, 1,3-bis Alicyclic polyamines such as aminomethylcyclohexane, bis(4-aminocyclohe
- the content of the epoxy resin curing agent (C) in the adhesive composition of the present invention is the epoxy resin curing agent (
- the ratio of the number of active hydrogen groups in C) is preferably from 1.00 to 1.10:1.00, more preferably from 1.05 to 1.10:1.00. This is because when the epoxy groups are in excess of the active hydrogen groups, a branching reaction occurs and the heat resistance of the cured product is improved.
- curing catalyst (D) used in the present invention, known compounds known as curing catalysts for epoxy resins can be used, for example, 3-(4-chlorophenyl)-1,1-dimethylurea, 3-(3,4-dichlorophenyl)-1,1-dimethylurea, N,N'-(4-methyl-1,3-phenylene)bis[N,N'-dimethylurea], N'-[3- Ureas such as [[[(dimethylamino)carbonyl]amino]methyl]-3,5,5-trimethylcyclohexyl]-N,N-dimethylurea; DBU (1,8-diazabicyclo[5.4.0]undecene -7), DBU-type amines such as DBU-phenol salt, DBU-octylate, DBU-formate, DBU-p-toluenesulfonate; DBN (1,5-diazabicyclo
- the content of the curing catalyst (D) in the adhesive composition of the present invention is preferably 0.1 to 20 parts by mass with respect to a total of 100 parts by mass of the aromatic epoxy resin (A) and the aliphatic epoxy resin (B). It is more preferably 0.5 to 10 parts by mass, still more preferably 1 to 5 parts by mass. Within the above range, good curability and stability are obtained from the viewpoint of catalytic activity and reaction rate.
- thixotropic agent (E) As the thixotropic agent (E) used in the present invention, known compounds known as thixotropic agents for epoxy resins can be used, for example, hydrophilic fumed silica and surface-treated hydrophobic fumed silicas such as fumed silica; carbon blacks such as ketjen black; fine particles such as fine calcium carbonate, sepiolite, various metal powders; wollastonite, mica, talc, kaolin, barium sulfate, calcium carbonate , magnesium hydroxide, inorganic fillers having a high aspect ratio such as clay, and the like.
- fumed silicas are preferred because of their small particle size and large effect of imparting thixotropic properties, and hydrophobic fumed silicas are particularly preferred.
- the content of the thixotropic agent (E) in the adhesive composition of the present invention is preferably 1 to 20 parts by mass with respect to a total of 100 parts by mass of the aromatic epoxy resin (A) and the aliphatic epoxy resin (B), and more It is preferably 0.5 to 10 parts by mass, more preferably 1 to 5 parts by mass. Within the above range, the thixotropic property is good and the workability is good.
- the adhesive composition of the present invention preferably further contains a hygroscopic inorganic filler (F) (hereinafter also referred to as inorganic filler (F) or simply component (F)).
- a hygroscopic inorganic filler (F) hereinafter also referred to as inorganic filler (F) or simply component (F)
- foaming during curing can be suppressed.
- the hygroscopic inorganic filler (F) include an inorganic filler that chemically reacts with water, an inorganic filler that absorbs moisture due to its porosity, and the like.
- Examples of the inorganic filler (F) used in the present invention include metal oxides and metal hydroxides such as magnesium oxide, calcium oxide, and silicon dioxide. Of these, calcium oxide is preferred because it can effectively reduce the curing time and can chemically react with water, although the reason is not clear.
- the content of the inorganic filler (F) in the adhesive composition of the present invention is 1 to 20 parts by mass with respect to a total of 100 parts by mass of the aromatic epoxy resin (A) and the aliphatic epoxy resin (B). is preferred, more preferably 0.5 to 10 parts by mass, still more preferably 1 to 5 parts by mass. Within the above range, suppression of foaming during curing can be expected, and the toughness of the cured product is improved.
- the adhesive composition of the present invention may further contain elastomers, core-shell rubbers, coupling agents, inorganic fillers, spacers, various additives, etc., in addition to the components described above.
- Elastomers are used to modify adhesives.
- NBR acrylonitrile-butadiene rubber
- SBR styrene-butadiene rubber
- polybutadiene rubber-modified epoxy resins such as terminal carboxylic acid-modified acrylonitrile-butadiene
- Hypox RA series manufactured by CVC
- ADEKA RESIN EPU series such as ADEKA RESIN EPU73B
- Hypox UA series manufactured by CVC
- Liquid rubbers such as NBR, SBR, polybutadiene
- Silicone resins Carboxylic acid or amino terminal acrylonitrile-butadiene rubber (CTBN, ATBN); NBR rubber having carboxylic acid in the main chain; carboxylic acid terminal polybutadiene; liquid polysulfide; various
- Core-shell rubber is used to temporarily fix parts using modified adhesives and physical cross-linking.
- Kaneace MX153, MX154, MX-257, MX-960, MX-136, MX-217 (all manufactured by Kaneka), Ganz Pearl (manufactured by Aica Kogyo) and the like can be mentioned.
- the core-shell rubber is a particle having at least a two-layer structure of a core layer made of a rubber component and a hard shell layer.
- a rubber-like substance is used, for example, a polymer obtained by polymerizing a conjugated diene such as polybutadiene and/or a lower alkyl acrylate, a polymer obtained by copolymerizing a monomer that can be copolymerized with these polymers, or polysiloxane. Consists of rubber or the like.
- the core layer preferably has a glass transition temperature of ⁇ 20° C. or less from the viewpoint of improving impact resistance at low temperatures and peeling strength.
- the shell layer it is preferable to use a component that has a high affinity with the epoxy resin and does not exhibit rubber elasticity.
- graft polymerization is a polymer obtained by polymerizing methyl methacrylate and / or a styrene monomer, or a polymer obtained by copolymerizing a monomer copolymerizable with these. It is preferable from the viewpoint of the properties and the affinity with the epoxy resin. From the viewpoint of adhesiveness, the shell layer is preferably made of a material having a glass transition point of 50° C. or higher.
- Coupling agents are used to improve adhesion to substrates, fillers, resins, etc.
- Inorganic fillers are used for purposes such as filling and improving mechanical properties.
- a spacer is used to adjust the thickness of the adhesive.
- examples include glass beads, fibers, resin beads, and inorganic fillers having hardness and particle size above a certain level. These may be used alone or in combination of two or more.
- the particle size of the spacer is preferably 1-200 ⁇ m, more preferably 10-150 ⁇ m. If the particle size of the spacer is less than 1 ⁇ m, it may be difficult to control the thickness of the adhesive, and if it exceeds 200 ⁇ m, the stress of the adhesive may become too large.
- the shape of the spacer includes, for example, spherical particles and fibrous particles. Among these, spherical particles are preferable because the particle size can be easily controlled.
- the amount used is preferably 0.2 to 1.5 parts by mass, preferably 0.5 to 1 part by mass, per 100 parts by mass of the aromatic epoxy resin (A) and the aliphatic epoxy resin (B). is more preferred.
- additives include, for example, plasticizers, reactive diluents, storage stabilizers, anti-aging agents, antioxidants, pigments, dyes, colorants, coupling agents, leveling agents, tackifiers, flame retardants. , antistatic agents, conductivity imparting agents, lubricants, slidability imparting agents, ultraviolet absorbers, surfactants, dispersants, dispersion stabilizers, antifoaming agents, dehydrating agents, cross-linking agents, rust inhibitors, solvents, etc. can be blended.
- the adhesive composition of the present invention can be produced by mixing each component described above.
- Mixing methods include a disper, a double planetary mixer, a rotation/revolution mixer, a homogenizer, a three-roll mixer, a kneader, and a kneader.
- Examples of the method of applying the adhesive composition of the present invention include a method of applying the adhesive composition filled in a syringe or the like with a dispenser, a method of spraying, a gun, a brush, and the like.
- the application temperature of the adhesive composition is preferably 30 to 60°C.
- the curing temperature of the adhesive composition is preferably 120-220°C, more preferably 140-200°C.
- the curing time is preferably 20 to 120 minutes, more preferably 30 to 90 minutes, still more preferably 30 to 60 minutes.
- the laminate of the present invention comprises an adhesive layer obtained by placing the adhesive composition of the present invention between substrates 1 and 2 and curing the adhesive composition.
- the base material 1 and the base material 2 are metals such as iron, aluminum, steel, etc.; fiber reinforced plastics such as CFRP (carbon fiber reinforced plastic) and GFRP (glass fiber reinforced plastic); PET (polyethylene terephthalate); engineering plastic resins such as PBT (polybutylene terephthalate), PC (polycarbonate), PI (polyimide), PA (polyamide); and glass.
- ⁇ Tensile shear strength> A test piece was prepared and measured in accordance with JIS K6850:1999 by using an adherend obtained by degreasing the following base material with acetone. The tensile speed was set to 10 mm/min. The tensile shear strength of the test piece prepared by coating the adhesive composition so that the thickness of the adhesive layer is 0.1 mm and curing at 170 ° C. for 30 minutes is ⁇ , and the level of less than 20 MPa. x.
- Base material SPCC-SD (cold-rolled steel plate) (1.6 mm ⁇ 25 mm ⁇ 100 mm, manufactured by Engineering Test Piece)
- ⁇ tan ⁇ peak> It was measured with a dynamic viscoelasticity measuring device (DVA-220, manufactured by IT Keisoku Co., Ltd.). The dynamic viscoelasticity of the adhesive composition was cured at 170° C. for 30 minutes and cut into strips under conditions of a frequency of 10 Hz and a heating rate of 4° C./min. The tan ⁇ peak obtained by the measurement was used as an index of heat resistance, and the level of tan ⁇ peak of 80°C or higher was indicated by ⁇ , and the level of lower than 80°C was indicated by x.
- DVA-220 dynamic viscoelasticity measuring device
- ⁇ Measurement of curing time> The viscoelasticity during the curing process was measured using a rigid pendulum physical property tester (RPT-3000W, A&D Co., Ltd.), and the curing time was measured.
- the prepared adhesive composition was applied to a 60 mm long ⁇ 20 mm wide aluminum plate to a thickness of 100 ⁇ m using an applicator. Then, a pendulum and a flat knife edge were selected so that the inertia ratio was 4000, the temperature was raised from room temperature to 170°C at a heating rate of 10°C/min, and the measurement was performed by heating at 170°C for 60 minutes.
- the curing time was measured from the time obtained in the process until the cycle stabilized. A level at which the cycle was stabilized within 60 minutes was judged to be ⁇ , and a level at which the cycle was not stabilized within the time or a decrease in the cycle before and after curing was less than 0.3 s was judged to be x.
- Total chlorine content The total chlorine content (mass%) of the aliphatic epoxy resin (B) was measured by the method described in JIS K 7243-3:2005.
- Epoxy resin composition (A-1) 80.4 parts by mass, aliphatic epoxy resin (B-3) 19.6 parts by mass, epoxy resin curing agent (C-1) 60.7 parts by mass, curing catalyst (D- 1) 2.8 parts by mass of the thixotropic agent (E-1) and 2.8 parts by mass of the thixotropic agent (E-1) were mixed by a rotation-revolution mixer to obtain an adhesive composition 1.
- the adhesive composition 1 thus obtained was evaluated for tensile shear strength, tan ⁇ peak, curing time and gel fraction. Table 1 shows the results.
- Adhesive compositions 2 to 11 were prepared in the same manner as in Example 1, except that the content shown in Table 1 was changed as the composition of the adhesive composition. The tensile shear strength, tan ⁇ peak, curing time and gel fraction of each obtained adhesive composition were evaluated. Table 1 shows the results.
- Aromatic epoxy resin A-1 jER-828 (bisphenol A type epoxy resin, epoxy equivalent 185 g / eq, manufactured by Mitsubishi Chemical)
- Aliphatic epoxy resin B-1 EX-211 (neopentyl glycol diglycidyl ether, total chlorine content 5.7%, epoxy equivalent 138 g / eq, manufactured by Nagase ChemteX)
- Aliphatic epoxy resin B-2 ED-505: Trimethylolpropane polyglycidyl ether, total chlorine content 8.0%, epoxy equivalent 150 g / eq, manufactured by ADEKA
- Aliphatic epoxy resin B-3 EX-211L: neopentyl glycol Diglycidyl ether, total chlorine content 0.7%, epoxy equivalent 130 g/eq, Nagase ChemteX aliphatic epoxy resin B-4: EX-321L: trimethylolpropane polyglycidyl ether, total chlorine content 0.3%
- the adhesive composition of the present invention can be suitably used as an adhesive with excellent adhesion and curability, it is expected to greatly contribute to the industrial world, especially as a structural adhesive.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Epoxy Resins (AREA)
Abstract
Description
[2] 2官能以上の芳香族エポキシ樹脂(A)および2官能以上の脂肪族エポキシ樹脂(B)の合計を100質量部としたとき、2官能以上の脂肪族エポキシ樹脂(B)が1~30質量部である、前記[1]に記載の接着剤組成物。
[3] さらに吸湿性を有する無機充填剤(F)を含有する前記[1]または[2]に記載の接着剤組成物。
[4] 前記吸湿性を有する無機充填剤(F)が酸化カルシウムである前記[3]に記載の接着剤組成物。
[5] 前記[1]~[4]のいずれかに記載の接着剤組成物を硬化してなる接着剤層を有する積層体。
2官能以上の芳香族エポキシ樹脂(A)(以下、芳香族エポキシ樹脂(A)または単に(A)成分とも言う)としては、1分子内に1つ以上の芳香族環と2つ以上のオキシラン環を含んでいれば特に限定されない。本発明に用いられる2官能以上の芳香族エポキシ樹脂(A)としては、例えば、カテコール、レゾルシノール、ヒドロキノン、フタル酸等の多価芳香族アルコールをグリシジルエーテル化した単環式芳香族グリシジルエーテル化合物;ビスフェノールA、ビスフェノールF、ビスフェノールAP、ビスフェノールAF、ビスフェノールB、ビスフェノールBP、ビスフェノールC、ビスフェノールE、ビスフェノールM、ビスフェノールS、ビスフェノールP、ビスフェノールPH、ビスフェノールZ等のビスフェノール化合物をグリシジルエーテル化したビスフェノール型エポキシ樹脂;ナフタレン、ビフェニル、テトラメチルビフェニル、ビスフェノールフルオレン、ビスクレゾールフルオレン、テトラフェニロールエタン等の多環式芳香族化合物をグリシジルエーテル化した多環式芳香族エポキシ樹脂;フェノールノボラック、クレゾールノボラック、ビスフェノールAノボラック等のノボラック型化合物をエポキシ化したノボラック型エポキシ樹脂、アニリン、o-メチルアニリン、p-アミノフェノール、m-フェニレンジアミン等の芳香族アミノ化合物をグリシジルエーテル化したグリシジルアミン型エポキシ樹脂;トリグリシジルイソシアヌレート、トリフェニルグリシジルエーテルメタン型エポキシ樹脂、キシリレン型エポキシ樹脂、テトラキスフェノールエタン型エポキシ樹脂、ナフタレン型エポキシ樹脂等の多官能エポキシ樹脂;ビスフェノールAのエチレンオキサイド付加物、ビスフェノールAのプロピレンオキサイド付加物等のアルキレンオキサイド付加物をグリシジル化したアルキレンオキサイドグリシジル化合物、および上記した化合物が部分的に縮合した混合物等が挙げられる。これらのうち、接着性および耐熱性等の機械特性の観点から、ビスフェノール型エポキシ樹脂が好ましく、中でもビスフェノールA型エポキシ樹脂及びビスフェノールF型エポキシ樹脂が組成物の粘度調整が容易となるため好ましい。このビスフェノールA型エポキシ樹脂は、分子量に応じて状態が変化するが、室温で液状~半固形状のものが好ましく、特に液状のものが好ましい。
2官能以上の脂肪族エポキシ樹脂(B)(以下、脂肪族エポキシ樹脂(B)または単に(B)成分とも言う)は1分子内に脂肪族炭化水素基と2つ以上のオキシラン環を含んでいれば特に限定されず、脂肪族炭化水素基として脂環式骨格を含んでいても良い。ただし芳香族基は含まない。本発明に用いられる脂肪族エポキシ樹脂(B)としては、例えば、ジメチロールジシクロペンタジエンジグリシジルエーテル等の環状脂肪族アルコールのジエポキシ化合物;ヘキサヒドロフタル酸ジグリシジルエステル、ヘキサヒドロテレフタル酸ジグリシジルエステル等の環状脂肪族ジカルボン酸のジエポキシ化合物;1,4-ブタンジオールジグリシジルエーテル、1,6-ヘキサンジオールジグリシジルエーテル等の脂肪族アルコールのジエポキシ化合物;jER871(商品名、三菱ケミカル(株)製)、jER872(商品名、三菱ケミカル(株)製)等のダイマー酸を骨格とするエポキシ樹脂等の2官能のエポキシ樹脂を挙げることができる。
本発明に用いられるエポキシ樹脂用硬化剤(C)としては、既知のエポキシ樹脂を硬化できる化合物を用いることができ、例えば、ジシアンジアミド;アジピン酸ジヒドラジド、イソフタル酸ジヒドラジド、二塩基酸ジヒドラジド等のヒドラジド類;ビスフェノールA、ビスフェノールF、ビスフェノールE等のビスフェノール類化合物;カテコール、レゾルシノール、メチルカテコール等のカテコール類化合物;ビフェノール、テトラメチルビフェノール等のビフェノール類化合物;ビスクレゾールフルオレン等のビスクレゾール類化合物;ヒドロキノン等のヒドロキノン類化合物;トリスジメチルアミノメチルフェノール等の液状フェノール類化合物;フェノールノボラック、クレゾールノボラック、ビスフェノールAノボラック、キシリレンノボラック、トリフェニルメタンノボラック、ビフェニルノボラック、ジシクロペンタジエンフェノールノボラック、テルペンフェノールノボラック等のノボラック類化合物;ジエチレントリアミン、トリエチレンテトラミン、テトラエチレンペンタミン、m-キシレンジアミン、トリメチルヘキサメチレンジアミン、2-メチルペンタメチレンジアミン、ジエチルアミノプロピルアミン等の脂肪族アミン類;イソホロンジアミン、1,3-ビスアミノメチルシクロヘキサン、ビス(4-アミノシクロヘキシル)メタン、ノルボルネンジアミン、1,2-ジアミノシクロヘキサン、4,4’-メチレンビス(2-メチルシクロヘキサンアミン)等の脂環式ポリアミン類;ポリオキシプロピレンジアミン、ポリオキシプロピレントリアミン等のポリエーテル型ポリアミン類;ポリシクロヘキシルポリアミン混合物;ピペラジン、N-アミノエチルピペラジン等のピペラジン類;セミカルバジド、シアノアセトアミド等のポリアミノアミド類;ダイマー酸や脂肪酸とポリアミンを縮合したポリアミドアミン類;アミンとアクリル化合物を反応させたマイケル付加ポリアミン類;マンニッヒ反応物;ケチミン類;メラミン類、アセトグアナミンやベンゾグアナミン等のグアナミン類、グアニジン類、4,4’-ジアミノジフェニルメタン、4,4’-ジアミノジフェニルスルホン、メタフェニレンジアミン等の芳香族アミン類;テトラヒドロ無水フタル酸、ヘキサヒドロ無水フタル酸、メチルテトラヒドロ無水フタル酸、メチルヘキサヒドロフタル酸、ベンゾフェノンテトラカルボン酸無水物、無水ピロメリット酸、無水トリメリット酸、メチルナジック酸、水素化メチルナジック酸無水物、ドデセニル無水コハク酸、無水コハク酸、無水フタル酸、脂肪族二塩基酸ポリ無水物、エチレングリコールビスアンヒドロトリメリテート、等の酸無水物類;三フッ化ホウ素錯化合物、三塩化ホウ素錯化合物、スルホニウム塩、オニウム塩、多価カルボン酸の活性エステル類;ポリチオール類等が挙げられる。これらのうち、作業性や耐熱性の観点から、硬化剤としてはビスフェノール類化合物が好ましく、特にビスフェノール化合物、フェノールノボラック化合物が好ましい。
本発明に用いられる硬化触媒(D)としては、エポキシ樹脂用の硬化触媒として知られている既知の化合物を用いることができ、例えば、3-(4-クロロフェニル)-1,1-ジメチル尿素、3-(3,4-ジクロロフェニル)-1,1-ジメチル尿素、N,N’-(4-メチル-1,3-フェニレン)ビス[N,N’-ジメチルウレア]、N’-[3-[[[(ジメチルアミノ)カルボニル]アミノ]メチル]-3,5,5-トリメチルシクロヘキシル]-N,N-ジメチルウレア等のウレア類;DBU(1,8-ジアザビシクロ[5.4.0]ウンデセン-7)、DBU-フェノール塩、DBU-オクチル酸塩、DBU-ギ酸塩、DBU-p-トルエンスルホン酸塩等のDBU型アミン類;DBN(1,5-ジアザビシクロ[4.3.0]ノネン-5);トリエチルアミンやN,N,N’,N’-テトラメチルエチレンジアミン、テトラメチルグアニジン、トリエチレンジアミン等の3級アミン系;ジメチルアミノメタノール、ジメチルアミノエタノール等のアルコールアミン類;ビス(2-ジメチルアミノエチル)エーテル等のエーテルアミン類;2,4,6-トリス(ジメチルアミノメチル)フェノール(DMP-30)等のフェノール基を有する3級アミン類;アミンアダクト類;1,2-ジメチルイミダゾール、2-エチル-4-メチルイミダゾール、2-フェニルイミダゾール、2-フェニル-4-メチルイミダゾール、N-ベンジル-2-メチルイミダゾール、N-ベンジル-2-フェニルイミダゾール、2,4-ジメチルイミダゾール、イミダゾール、1-メチルイミダゾール、2-メチルイミダゾール、2,4-ジアミノ-6-[2’-メチルイミダゾリル-(1’)]-エチル-s-トリアジンイソシアヌル酸付加物、2-フェニル-4,5-ジヒドロキシメチルイミダゾール、2,4-ジアミノ-6-[2’-メチルイミダゾリル-(1’)]-エチル-s-トリアジン、1-シアノエチル-2-フェニルイミダゾリウムトリメリテイト等のイミダゾール類;アミキュアPN-23、PN-23J、PN-H、PN-31、PN-31J、PN-40,PN-40J、PN-50(いずれも味の素ファインテクノ製)や、ノバキュアHX-3722、HX-3742、HX-3792(いずれも旭化成製)等のイミダゾールアダクト類:トリフェニルホスフィン、トリ-o-トリルホスフィン、トリ-m-トリルホスフィン、トリ-p-トリルホスフィン、トリ-2,4-キシリルホスフィン、トリ-2,5-キシリルホスフィン、トリ-3,5-キシリルホスフィン、トリス(p-メトキシフェニル)ホスフィン、トリス(o-メトキシフェニル)ホスフィン、トリフェニルホスフィントリフェニルボラン、テトラフェニルホスホニウムテトラフェニルボレート、テトラフェニルホスホニウムテトラ-p-トリルボレート、トリス(2,6-ジメトキシフェニル)ホスフィン、等のリン類、等が挙げられる。これらのうち、3級アミン類やイミダゾール類、リン類が活性の点から好ましい。
本発明に用いられるチキソトロピック剤(E)としては、エポキシ樹脂に対してチキソトロピック剤として知られている既知の化合物を用いることができ、例えば、親水性ヒュームドシリカや表面処理を施した疎水性ヒュームドシリカ等のヒュームドシリカ類;ケッチェンブラック等のカーボンブラック類、微粒炭酸カルシウム、セピオライト、各金属粉、等の微細粒子類;ウォラスナイト、マイカ、タルク、カオリン、硫酸バリウム、炭酸カルシウム、水酸化マグネシウム、クレー等のアスペクト比が高い無機フィラー類、等が挙げられる。これらのうち、粒径が小さくチキソトロピック性の付与効果が大きいことからヒュームドシリカ類が好ましく、中でも疎水性ヒュームドシリカが好ましい。
本発明の接着剤組成物は、さらに吸湿性を有する無機充填剤(F)(以下、無機充填剤(F)または単に(F)成分とも言う)を含有することも好ましい。吸湿性を有する無機充填剤(F)を含有することで、硬化時の発泡を抑制することができる。吸湿性を有する無機充填剤(F)としては、化学的に水と反応する無機充填剤、多孔質により吸湿する無機充填剤等が挙げられる。
本発明の接着剤組成物は、前記した各成分に加えて、エラストマーやコアシェルゴム、カップリング剤、無機フィラー、スペーサー、各種添加剤等をさらに含有していても良い。
本発明の接着剤組成物は、上述した各成分を混合して製造することができる。混合方法としては、ディスパー、ダブルプラネタリーミキサー、自公転ミキサー、ホモジナイザー、3本ロール、混練機、ニーダー等が挙げられる。
本発明の接着剤組成物の塗布方法としては、シリンジ等に充填した接着剤組成物をディスペンサーによって塗布する方法、スプレー、ガン、刷毛塗り等の方法等が挙げられる。本工程において、接着剤組成物の塗布温度は30~60℃であることが好ましい。また、接着剤組成物の硬化温度は、120~220℃が好ましく、より好ましくは140~200℃である。硬化時間は20~120分が好ましく、より好ましくは30~90分、さらに好ましくは30~60分である。
本発明の積層体は、本発明の接着剤組成物を基材1と基材2との間に配置し、硬化させた接着剤層から成るものである。基材1と基材2は、それぞれ、鉄、アルミ、鋼、等の金属類;CFRP(炭素繊維強化プラスチック)やGFRP(ガラス繊維強化プラスチック)、等の繊維強化プラスチック;PET(ポリエチレンテレフタレート)やPBT(ポリブチレンテレフタレート)、PC(ポリカーボネート)、PI(ポリイミド)、PA(ポリアミド)等のエンプラ樹脂類;ガラス等が挙げられる。
下記基材をアセトンで脱脂したものを被着材として用い、JIS K6850:1999に準拠して試験片の調製と測定を行った。引張速度は10mm/minとした。接着剤組成物を接着剤層の厚みが0.1mmとなるように塗布し、170℃30分で硬化させて調製した試験片の引張せん断強度が20MPa以上の水準を〇、20MPa未満の水準を×とした。
基材:SPCC-SD(冷間圧延鋼板)(1.6mm×25mm×100mm,エンジニアリングテストピース社製)
170℃30分で硬化させた接着剤組成物を縦2.5cm横5cm厚み0.1mmの短冊状に切り取って重量を測定し(この重量をAとする)、テトラヒドロフラン100mLに25℃で1時間浸漬させた。短冊状の硬化させた接着剤組成物を取り出して100℃で1時間熱風乾燥機で乾燥させ、重量を測定した(この重量をBとする)。以下の式で算出した数値をゲル分率(%)とした。ゲル分率が90%以上の水準を〇、90%未満の水準を×とした。
ゲル分率(%)=B/A×100
動的粘弾性測定装置(DVA-220,アイティー計測制御社製)により測定した。170℃30分で硬化させ、短冊状に切り取った接着剤組成物を、周波数10Hz、昇温速度4℃/minの条件にて動的粘弾性を測定した。測定により得られたtanδピークを耐熱性の指標とし、tanδピークが80℃以上の水準を〇、80℃未満の水準を×とした。
剛体振り子型物性試験器(エー・アンド・ディー社、RPT-3000W)により硬化過程の粘弾性を測定し、硬化時間を測定した。調製した接着剤組成物を縦60mm×横20mmのアルミ板にアプリケーターを用いて100μmに塗布した。そして、慣性能率4000となるよう振り子と平型ナイフエッジを選択し、室温から昇温速度10℃/分にて170℃まで昇温し、170℃で60分間加熱させて測定を行った。その過程で得られた、周期が安定するまでの時間から、硬化時間を測定した。60分以内に周期が安定した水準を〇、時間内に安定しなかった水準や硬化前後の周期の低下が0.3s未満の場合を×と判断した。
脂肪族エポキシ樹脂(B)の全塩素量(質量%)は、JIS K 7243-3:2005に記載される方法により測定した。
エポキシ樹脂組成物(A-1)80.4質量部、脂肪族エポキシ樹脂(B-3)19.6質量部、エポキシ樹脂硬化剤(C-1)60.7質量部、硬化触媒(D-1)2.8質量部およびチキソトロピック剤(E-1)2.8質量部を自転公転ミキサーにより混合し、接着剤組成物1を得た。得られた接着剤組成物1の引張せん断強度、tanδピーク、硬化時間およびゲル分率の各評価を実施した。結果を表1に示す。
接着剤組成物の配合組成として、表1に示す内容に変更した以外は実施例1と同様の方法で、接着剤組成物2~11を調製した。得られた各接着剤組成物の引張せん断強度、tanδピーク、硬化時間およびゲル分率の各評価を実施した。結果を表1に示す。
表1に記載の原料として、下記のものを使用した。
芳香族エポキシ樹脂A-1:jER-828(ビスフェノールA型エポキシ樹脂、エポキシ当量185g/eq、三菱ケミカル製)
脂肪族エポキシ樹脂B-1:EX-211(ネオペンチルグリコールジグリシジルエーテル、全塩素量5.7%、エポキシ当量138g/eq、ナガセケムテックス製)
脂肪族エポキシ樹脂B-2:ED-505:トリメチロールプロパンポリグリシジルエーテル、全塩素量8.0%、エポキシ当量150g/eq、ADEKA製
脂肪族エポキシ樹脂B-3:EX-211L:ネオペンチルグリコールジグリシジルエーテル、全塩素量0.7%、エポキシ当量130g/eq、ナガセケムテックス製
脂肪族エポキシ樹脂B-4:EX-321L:トリメチロールプロパンポリグリシジルエーテル、全塩素量0.3%、エポキシ当量130g/eq、ナガセケムテックス製
エポキシ樹脂用硬化剤C-1:ビスフェノールA(活性水素基当量114g/eq、三菱ケミカル製)
硬化触媒D-1:HX3742(イミダゾールアダクト型触媒、旭化成製)
硬化触媒D-2:PN-23(イミダゾールアダクト型触媒、味の素ファインテクノ製)
硬化触媒D-3:2E4MZ(2-エチル-4-メチルイミダゾール、四国化成製)
硬化触媒D-4:TPP(トリフェニルホスフィン、東京化成製)
チキソトロピック剤E-1:アエロジルR805(疎水性ヒュームドシリカ、日本アエロジル製)
無機充填剤F-1:CML#35(酸化カルシウム、近江化学製)
Claims (5)
- 2官能以上の芳香族エポキシ樹脂(A)、2官能以上の脂肪族エポキシ樹脂(B)、エポキシ樹脂用硬化剤(C)、硬化触媒(D)およびチキソトロピック剤(E)を含み、前記2官能以上の脂肪族エポキシ樹脂(B)の全塩素量が1.0質量%以下である接着剤組成物。
- 2官能以上の芳香族エポキシ樹脂(A)および2官能以上の脂肪族エポキシ樹脂(B)の合計を100質量部としたとき、2官能以上の脂肪族エポキシ樹脂(B)が1~30質量部である、請求項1に記載の接着剤組成物。
- さらに吸湿性を有する無機充填剤(F)を含有する請求項1または2に記載の接着剤組成物。
- 前記吸湿性を有する無機充填剤(F)が酸化カルシウムである請求項3に記載の接着剤組成物。
- 請求項1~4のいずれかに記載の接着剤組成物を硬化してなる接着剤層を有する積層体。
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023569456A JPWO2023120511A1 (ja) | 2021-12-20 | 2022-12-20 | |
| KR1020247022286A KR20240124938A (ko) | 2021-12-20 | 2022-12-20 | 접착제 조성물 및 적층체 |
| CN202280082737.5A CN118414395A (zh) | 2021-12-20 | 2022-12-20 | 粘合剂组合物和层叠体 |
| US18/720,880 US20250101280A1 (en) | 2021-12-20 | 2022-12-20 | Adhesive composition and laminate |
| EP22911213.1A EP4455242A1 (en) | 2021-12-20 | 2022-12-20 | Adhesive composition and laminate |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021205733 | 2021-12-20 | ||
| JP2021-205733 | 2021-12-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2023120511A1 true WO2023120511A1 (ja) | 2023-06-29 |
Family
ID=86902437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2022/046837 Ceased WO2023120511A1 (ja) | 2021-12-20 | 2022-12-20 | 接着剤組成物および積層体 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20250101280A1 (ja) |
| EP (1) | EP4455242A1 (ja) |
| JP (1) | JPWO2023120511A1 (ja) |
| KR (1) | KR20240124938A (ja) |
| CN (1) | CN118414395A (ja) |
| WO (1) | WO2023120511A1 (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119351025B (zh) * | 2024-12-25 | 2025-08-22 | 清华大学 | 双组分承重型胶粘剂及其制备方法 |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007203670A (ja) * | 2006-02-03 | 2007-08-16 | Japan Epoxy Resin Kk | エポキシ樹脂硬化層と構造体構成材料が一体化した複合体 |
| JP2008174577A (ja) * | 2007-01-16 | 2008-07-31 | Kyocera Chemical Corp | ダイボンディングペーストおよびそれを用いた半導体装置 |
| JP2015504457A (ja) * | 2011-11-14 | 2015-02-12 | エルジー・ケム・リミテッド | 接着フィルム |
| WO2015064561A1 (ja) * | 2013-10-29 | 2015-05-07 | 株式会社カネカ | 貯蔵安定性の改善されたポリマー微粒子含有硬化性樹脂組成物 |
| JP2017186483A (ja) * | 2016-04-08 | 2017-10-12 | 積水化学工業株式会社 | 積層シート、接着層及び金属材付き半導体チップの製造方法、及び半導体装置の製造方法 |
| WO2017191801A1 (ja) | 2016-05-06 | 2017-11-09 | Dic株式会社 | 樹脂組成物、成形体、積層体及び接着剤 |
| JP2018030981A (ja) * | 2016-08-26 | 2018-03-01 | 味の素株式会社 | 樹脂組成物 |
| JP2019083225A (ja) * | 2017-10-27 | 2019-05-30 | 日立化成株式会社 | アンダーフィル用液状樹脂組成物、電子部品装置、及び電子部品装置の製造方法 |
| WO2019188202A1 (ja) * | 2018-03-28 | 2019-10-03 | 積水化学工業株式会社 | エポキシ接着剤組成物 |
| JP2020500234A (ja) * | 2016-10-24 | 2020-01-09 | ダウ グローバル テクノロジーズ エルエルシー | 開ビード湿度曝露に耐性のエポキシ接着剤 |
| JP6632401B2 (ja) | 2016-01-29 | 2020-01-22 | アイシン化工株式会社 | 構造用接着剤組成物 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017191801A (ja) | 2016-04-11 | 2017-10-19 | 株式会社小森コーポレーション | 電子デバイス製造装置 |
-
2022
- 2022-12-20 KR KR1020247022286A patent/KR20240124938A/ko active Pending
- 2022-12-20 EP EP22911213.1A patent/EP4455242A1/en not_active Withdrawn
- 2022-12-20 US US18/720,880 patent/US20250101280A1/en active Pending
- 2022-12-20 WO PCT/JP2022/046837 patent/WO2023120511A1/ja not_active Ceased
- 2022-12-20 CN CN202280082737.5A patent/CN118414395A/zh not_active Withdrawn
- 2022-12-20 JP JP2023569456A patent/JPWO2023120511A1/ja active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007203670A (ja) * | 2006-02-03 | 2007-08-16 | Japan Epoxy Resin Kk | エポキシ樹脂硬化層と構造体構成材料が一体化した複合体 |
| JP2008174577A (ja) * | 2007-01-16 | 2008-07-31 | Kyocera Chemical Corp | ダイボンディングペーストおよびそれを用いた半導体装置 |
| JP2015504457A (ja) * | 2011-11-14 | 2015-02-12 | エルジー・ケム・リミテッド | 接着フィルム |
| WO2015064561A1 (ja) * | 2013-10-29 | 2015-05-07 | 株式会社カネカ | 貯蔵安定性の改善されたポリマー微粒子含有硬化性樹脂組成物 |
| JP6632401B2 (ja) | 2016-01-29 | 2020-01-22 | アイシン化工株式会社 | 構造用接着剤組成物 |
| JP2017186483A (ja) * | 2016-04-08 | 2017-10-12 | 積水化学工業株式会社 | 積層シート、接着層及び金属材付き半導体チップの製造方法、及び半導体装置の製造方法 |
| WO2017191801A1 (ja) | 2016-05-06 | 2017-11-09 | Dic株式会社 | 樹脂組成物、成形体、積層体及び接着剤 |
| JP2018030981A (ja) * | 2016-08-26 | 2018-03-01 | 味の素株式会社 | 樹脂組成物 |
| JP2021185239A (ja) * | 2016-08-26 | 2021-12-09 | 味の素株式会社 | 樹脂組成物 |
| JP2020500234A (ja) * | 2016-10-24 | 2020-01-09 | ダウ グローバル テクノロジーズ エルエルシー | 開ビード湿度曝露に耐性のエポキシ接着剤 |
| JP2019083225A (ja) * | 2017-10-27 | 2019-05-30 | 日立化成株式会社 | アンダーフィル用液状樹脂組成物、電子部品装置、及び電子部品装置の製造方法 |
| WO2019188202A1 (ja) * | 2018-03-28 | 2019-10-03 | 積水化学工業株式会社 | エポキシ接着剤組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP4455242A1 (en) | 2024-10-30 |
| US20250101280A1 (en) | 2025-03-27 |
| CN118414395A (zh) | 2024-07-30 |
| JPWO2023120511A1 (ja) | 2023-06-29 |
| KR20240124938A (ko) | 2024-08-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5964980B2 (ja) | 構造用接着剤およびその接合への適用 | |
| JP6712402B2 (ja) | 被覆粒子 | |
| US11441015B2 (en) | Coated particle | |
| JP5736122B2 (ja) | 構造用接着剤 | |
| KR101994355B1 (ko) | 구조용 에폭시 접착제 조성물 | |
| KR101885703B1 (ko) | 피라진-함유 화합물을 포함하는 에폭시 수지 | |
| US20250178245A1 (en) | Liquid compression molding material, electronic component, semiconductor device and method for producing semiconductor device | |
| JP2011137092A (ja) | 硬化性組成物 | |
| WO2023120511A1 (ja) | 接着剤組成物および積層体 | |
| JP2017171902A (ja) | エポキシ樹脂組成物及びその硬化物 | |
| JP2019194322A (ja) | 接着剤 | |
| KR101373035B1 (ko) | 초고내열성 에폭시 수지 조성물 | |
| KR102425139B1 (ko) | 우레탄 함유 에폭시 수지, 이를 포함하는 에폭시 수지 조성물 및 이를 포함하는 에폭시 접착제 조성물 | |
| US20240254373A1 (en) | Adhesive composition and method for producing adhesive composition | |
| KR20240051645A (ko) | 비스페놀-z기반 폴리우레탄을 포함하는 일액형 에폭시 접착제 조성물 | |
| JP2019056057A (ja) | エポキシ樹脂組成物および構造部材 | |
| JP2022139977A (ja) | エポキシ樹脂組成物 | |
| JP2007203670A (ja) | エポキシ樹脂硬化層と構造体構成材料が一体化した複合体 | |
| US20250145872A1 (en) | Adhesive composition | |
| JP2016176030A (ja) | 硬化性組成物及びその硬化物 | |
| KR102706217B1 (ko) | 다관능성 아민경화제를 포함하는 일액형 에폭시 접착제 조성물 | |
| WO2024038816A1 (ja) | 接着剤組成物 | |
| WO2025249411A1 (ja) | 硬化性樹脂組成物、硬化性樹脂組成物の使用、硬化物および硬化物の製造方法 | |
| JP5480006B2 (ja) | 構造用接着剤 | |
| JP2015147903A (ja) | エポキシ系接着剤 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 22911213 Country of ref document: EP Kind code of ref document: A1 |
|
| WWE | Wipo information: entry into national phase |
Ref document number: 2023569456 Country of ref document: JP |
|
| WWE | Wipo information: entry into national phase |
Ref document number: 202280082737.5 Country of ref document: CN |
|
| WWE | Wipo information: entry into national phase |
Ref document number: 18720880 Country of ref document: US |
|
| ENP | Entry into the national phase |
Ref document number: 20247022286 Country of ref document: KR Kind code of ref document: A |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| ENP | Entry into the national phase |
Ref document number: 2022911213 Country of ref document: EP Effective date: 20240722 |
|
| WWP | Wipo information: published in national office |
Ref document number: 18720880 Country of ref document: US |