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WO2023119280A1 - Connecteur optique côté arrière pour coupler une fibre monomodale à une puce photonique en silicium - Google Patents

Connecteur optique côté arrière pour coupler une fibre monomodale à une puce photonique en silicium Download PDF

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Publication number
WO2023119280A1
WO2023119280A1 PCT/IL2022/051360 IL2022051360W WO2023119280A1 WO 2023119280 A1 WO2023119280 A1 WO 2023119280A1 IL 2022051360 W IL2022051360 W IL 2022051360W WO 2023119280 A1 WO2023119280 A1 WO 2023119280A1
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WO
WIPO (PCT)
Prior art keywords
chip
connector
siph
mirror
tilted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IL2022/051360
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English (en)
Inventor
Hesham TAHA
Abraham ISRAEL
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teramount Ltd
Original Assignee
Teramount Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US17/645,667 external-priority patent/US12164159B2/en
Priority claimed from US17/645,673 external-priority patent/US20230194806A1/en
Application filed by Teramount Ltd filed Critical Teramount Ltd
Publication of WO2023119280A1 publication Critical patent/WO2023119280A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G02B6/138—Integrated optical circuits characterised by the manufacturing method by using polymerisation
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping

Definitions

  • the present disclosure relates generally to coupling an optical fiber connector to a silicon photonics chip, and more particularly to where the coupling is done through the bottom of the silicon photonics chip.
  • SiPh chip is a device that integrates multiple photonic functions in a manner that is similar to the way an electronic IC or radio frequency (RF) IC integrates different electronic or RF functions onto a single chip.
  • SiPh chips are typically fabricated using indium phosphide or silicon dioxide (SiO2), which allows for the integration of various optically active and passive functions on the same chip.
  • Certain aspects disclosed herein include a connector for use in coupling an optical signal between an optical fiber in an optical plug mounted to a bottom of a silicon photonics (SiPh) chip, comprising: a curved mirror; and a tilted flat mirror; wherein at least one of the curved mirror and the tilted flat mirror is formed on a hardened stamped imprint material that was deposited on the SiPh chip at least in a cavity thereof.
  • SiPh silicon photonics
  • Certain aspects disclosed herein include a connector for use in coupling an optical signal between an optical fiber in an optical plug mounted to a bottom of a silicon photonics (SiPh) chip, comprising: at least one curved mirror; and at least one tilted mirror; wherein the at least one curved mirror and the at least one tilted mirror is formed on a hardened stamped imprint material placed at least partly in a cavity of the SiPh chip.
  • SiPh silicon photonics
  • Certain aspects disclosed herein include a connector for use in coupling an optical signal between an optical fiber in an optical plug mounted to a bottom of a silicon photonics (SiPh) chip, comprising: at least one curved mirror; and
  • At least one grating coupler wherein the at least one curved mirror is formed on a hardened stamped imprint material placed at least partly in a cavity of the SiPh chip; and wherein the grating coupler is adapted to couple light with a wave guide of the SiPh chip.
  • FIG. 1 shows an example process for making a structure and coupling of single-mode fiber to a silicon photonics chip that is flip-chip mounted using backside optical coupling;
  • FIG. 2 shows an example cavity formed in the top of a SiPh chip
  • FIG. 3 shows antireflective coating layers are applied along the bottom of the cavity of FIG. 2 and also along a portion of the bottom of the SiPh chip;
  • FIG. 4 shows imprint material in the cavity of FIG. 2
  • FIG. 5 shows the shaped and hardened imprint material of FIG. 4
  • FIG. 6 shows reflective material deposited on the shaped and harden imprint material of FIG. 5 to form mirrors
  • FIG. 7 shows the structure of FIG. 6 with electrical microbumps placed on top of the SiPh chip
  • FIG. 8 shows the SiPh chip flipped and mounted to a substrate
  • FIG. 9 shows a photonic plug coupled to the bottom of the SiPh chip of FIG. 8;
  • FIG. 10 shows a portion of an example surface usable for a photonic plug ;
  • FIG. 1 1 is an example diagram utilized to describe the angles and distances of the coupling aspect shown in FIG. 9;
  • FIG 12 shows another example that uses a detachable plug die having a spacer
  • FIG. 13 shows the individual fibers of a fiber ribbon are inserted into trenches as described in FIG. 10;
  • FIG. 14 shows a receptacle mounted on an SiPh chip with a detachable plug die inserted therein;
  • FIG. 15 shows an exploded view of FIG. 14 but without the fibers
  • FIG. 16 shows a flowchart of an example process for assembling a detachable plug and connecting an end of fibers to a SiPh chip in accordance with one or more aspects of the present disclosure.
  • the “bottom” of the SiPh chip will always refer to herein to the bottom surface of the SiPh chip prior to the SiPh chip being flipped.
  • the bottom surface of the SiPh chip is typically the surface of the SiPh chip opposite that on which the optical circuitry is developed.
  • the “top” of the SiPh chip will always refer to herein to the top surface of the SiPh chip prior to the SiPh chip being flipped.
  • the top surface of the SiPh chip is typically the surface of the SiPh chip on which the optical circuitry is developed.
  • the thickness of the optical chip is turned from a disadvantage to an advantage for a flip-chip mounted SiPh chip by a unique structure and arrangement of optical components including a photonic plug so that light from a single-mode fiber that is being coupled to an SiPh chip need pass through only a portion of the thickness of the SiPh chip’s substrate.
  • a cavity is etched out of the top of the substrate of the SiPh chip in an area of the SiPh chip referred to as a photonic bump and a tilted flat mirror and a curved mirror are formed by stamping and curing an imprint material placed in and possibly over the cavity.
  • a photonic plug including a tilted flat mirror and a curved mirror is placed over a spacer which is in turn over the bottom of the flipped SiPh chip in the area of the photonic bump.
  • the one or more fibers for which light is to be coupled with the SiPh chip are fixed to the photonic plug.
  • the resulting optical path couples light between the optical fiber and the SiPh chip.
  • the structures of the photonic bump portion of the SiPh chip need not be manufactured at the same time that the SiPh chip is manufactured. Therefore, the structures of such a photonic bump can be added by another party, i.e., a party who did not manufacture the rest of SiPh chip.
  • the bottom of the SiPh chip and the photonic plug may be arranged such that the photonic plug is detachable from the SiPh chip.
  • FIG. 1 shows an example process for making a structure and coupling of single-mode fiber to a silicon photonics chip that is flip-chip mounted using backside optical coupling.
  • a cavity is formed in the top of a SiPh chip in the optical bump area.
  • the cavity may be formed by etching down from the top of the SiPh chip.
  • FIG. 2 shows an example such cavity 203 as having been formed in top 207 of SiPh chip 201.
  • SiPh chip 201 already, e.g., prior to formation of the cavity, may have waveguide 205 formed thereon.
  • Cavity 203 typically has a depth in the range of 10 to 20 microns while it may have a width in a range from 150 microns to a few hundred microns. In an example, the width may be 200 microns.
  • FIG. 2 Also shown in FIG. 2 is bottom 209 of SiPh chip 201. Note that the above references to “backside” optical coupling refer to coupling the light at least once through bottom 209 of SiPh chip 201
  • antireflective coating layers 311 are applied along the bottom of cavity 203 and also along a portion of bottom 209 of SiPh chip 201 , at least under the portion of bottom 209 that is under cavity 203, in step 103.
  • Such antireflective coating maybe a dielectric material such as a layer of magnesium fluoride, although those of ordinary skill in the art will be able to select an antireflective coating suitable to the materials and structure employed which is described further hereinbelow.
  • the antireflective coating layers may substantially overcome the difference, i.e., a mismatch, in the index of refraction as light propagates from one medium to another.
  • step 105 a imprint material, e.g., a liquid, suitable to be formed by stamping is deposited on SiPh chip 201 and at least in cavity 203 thereof.
  • the deposited imprint material may also extend over at least a portion of top 207 of SiPh chip 201 .
  • One material that may be used as the imprint material is a siloxane, which may be obtained from INKRON or other well known sources which is a UV sensitive resin used for nanoimprinting.
  • the imprint material should be such that it is substantially transparent to light at the wavelength or wavelengths of interest after it hardens. Imprint materials and stamping are well known in the art and may be selected at the discretion of the implementer for the particular application.
  • An imprint stamp is then employed in step 107 to shape the imprint material to have a curved surface and a tilted flat surface suitable to be used as a base for a curved mirror and a tilted flat mirror respectively.
  • FIG. 4 shows imprint material 413 in cavity 203 and also some imprint material being on top 207 of SiPh chip 201 along with imprint stamp 415 such as may be used in step 107.
  • the imprint material is then hardened in step 109, such as by curing, which may be through the use of a catalyst, e.g., ultraviolet (UV) light, heat, and so forth as well as combinations of the forgoing, so as to retain the imprinted shape.
  • a catalyst e.g., ultraviolet (UV) light, heat, and so forth as well as combinations of the forgoing.
  • UV light ultraviolet
  • mask 416 of FIG. 4 is employed to block UV light from reaching areas of SiPh chip 201 on which the imprint material was deposited but which are not desired to be hardened.
  • Mask 416 should block the catalyst from reaching the imprint material, e.g., when the catalyst is UV light
  • mask 416 may be made of UV light blocking metal, e.g., bronze, as is well known in the art.
  • Mask 416 may be a part of imprint stamp 415 or it may be separate there from and placed on top of imprint stamp 415. After hardening of the desired portion of the imprint the material, mask 416 and imprint stamp 415 may be removed and then any non-hardened imprint material, e.g., that which was under mask 416 may be cleaned away.
  • FIG. 5 shows the shaped and hardened imprint material 413 with curved surface 517 and tilted flat surface 519 after the non-hardened imprint material is cleaned away.
  • a reflective material e.g., metal
  • the metal deposited is selected so as to be reflective to the light of interest and to thereby form curved mirror 621 and tilted flat mirror 623 shown in FIG. 6.
  • the metal employed may be gold or copper.
  • the curve of imprint stamp 415 that is used to form curved surface 517 should conform to the desired shape of curved mirror 621 and the portion of imprint stamp 415 that is used to form tilted flat surface 519 should conform to the desired shape and tilt of tilted flat mirror 623.
  • curved mirror 621 may be referred to as first curved mirror 621 and tilted flat mirror 623 may be referred to as first tilted flat mirror 623.
  • step 1 13 electrical microbumps are deposited on top 207 of SiPh chip 201 .
  • the electrical microbumps are employed at least to couple SiPh chip 201 to a substrate when SiPh chip 201 is flipped and placed against a substrate.
  • the electrical microbumps may be a type of metal, e.g., solder, that is placed on conductive pads, e.g., metallic pads, such as copper, or another conductive substance, on top 207 of SiPh chip 201 and then reflowed when SiPh chip 201 is flipped and placed on the substrate to which it is being mounted.
  • FIG. 7 shows the structure of FIG. 6 with electrical microbumps 725 placed on top 207 of SiPh chip 201 .
  • electrical microbumps 725 are high enough so that they will extend beyond top portion 727 of the structured formed of hardened imprint material 413.
  • one or more of microbumps 725 may consist of a downsized copper pillar and solder with height of, for example, around 30 m. The pads on which microbumps 725 are placed are not shown but are well known in the art.
  • SiPh chip 201 is flipped and mounted to a substrate.
  • the substrate may have additional devices, e.g., optical and or electrical devices, mounted thereon as well.
  • the substrate may be an interposer that is then further mounted to a substrate.
  • SiPh chip may be attached to the substrate by reflowing the microbumps.
  • FIG. 8 shows SiPh chip 201 flipped and mounted to substrate 829 after reflow of solder microbumps 725.
  • the pads of substrate 829 are not shown but are well known in the art.
  • substrate 829 may be a multichip module (MCM) that provides for various electrical functions.
  • MCM 829 provides the base for multiple chips mounted thereon that perform various electrical and optical functions.
  • MCM 829 may be mounted on MCM 829 although in FIG. 8 only SiPh chip 201 is shown as a non-limiting example.
  • One or more electronic circuits e.g., switches and application specific integrated circuits (ASICs), may also be mounted on MCM 829.
  • MCM 829 may itself be mounted on a board, not shown but well known in the art.
  • the substrate may be an interposer that is then further coupled to the MCM.
  • FIG. 9 shows photonic plug 931 so coupled, and more specifically, photonic plug 931 is stacked on top of spacer 933 which is in turn on top of bottom 209 of SiPh chip 201 .
  • Photonic plug 931 includes second curved mirror 935 and second tilted flat mirror 937.
  • Optical fiber 939 is inserted into photonic plug 931 so that light may be coupled between optical fiber 939 and second tilted mirror 937.
  • Only a single optical fiber 939 is shown in FIG. 9, it is expected that generally there will be a plurality of fibers arranged in parallel in the photonic plug, as will be shown and described further hereinbelow. It is generally expected that optical fiber 939 will be a single-mode fiber.
  • spacer 933 is glued, e.g., using an adhesive, to photonic plug 931. In some aspects of the present disclosure, spacer 933 is glued, e.g., using an adhesive, to SiPh chip 201 . Spacer 933 may be made of any transparent and non-conductive material, such as glass, polydimethylsiloxane, or any other index matching material.
  • the adhesive should have an appropriate index of refraction so as to minimize optical losses.
  • the index of refraction of the adhesive should be around 1 .5 as well.
  • Spacer 933 is optically transparent to at least one wavelength of light being carried by optical fibers 113 and employed by Si Ph chip 201 .
  • Spacer 933 may be made of any transparent and non-conductive material, such as glass, polydimethylsiloxane, or any other encapsulation material with appropriate refractive index.
  • Spacer 933 is used at least in part to control the distance between photonic plug 931 and SiPh chip 201 so as to enable the proper optical operation of the system. Spacer 933 may also be used to at least partially encapsulate and help hold in place optical fiber 939. To this end, in some aspects of the present disclosure an adhesive may be employed between at least a portion of spacer 933 and at least a portion of photonic plug 931 to keep spacer 933 attached to photonic plug 931 .
  • At least one of first curved mirror 621 and second curved mirror 935 is structured to reflect all wavelengths of light incident thereupon.
  • FIG. 10 shows a portion of an example surface 1071 usable for photonic plug 931 in which second curved mirrors 935 and tilted flat mirrors 937 are formed, each corresponding set of a one of curved mirror 935 and a one of tilted flat mirrors 937 being for a respective one of optical fibers 939. Also, shown in FIG. 10 are trenches, 1041 , e.g., V-grooves, for guiding optical fibers 939. FIG. 10 shows four fiber trenches 1041 -1 through 1041 -4.
  • Each fiber trench 1041 adjoins a corresponding one of second tilted flat mirrors 937, i.e., second tilted flat mirrors 937-1 through second tilted flat mirrors 937-4.
  • each of fiber trenches 1041 are shaped as a V-groove formed in a substrate layer of photonic plug 931.
  • Each of fiber trenches 1041 may be formed by etching.
  • Each of second tilted flat mirrors 937-1 through 937-4 is oriented so as to be able to direct light between optical fiber 939 and a corresponding respective first curved mirror 621 formed on SiPh chip 201 .
  • FIG. 10 also shows four second curved mirrors 935-1 through 935-4.
  • Each of second curved mirrors 935 is oriented so that when photonic plug 931 is coupled to spacer 931 which is in turn coupled to bottom 209 of SiPh chip 201 , the interior of each of second curved mirror 935 is facing toward bottom 209 of SiPh chip 201.
  • FIG. 10 For example purposes only. Other numbers of optical fibers and trenches may be utilized without departing from the scope of the present disclosure.
  • trenches 1041 are described as V-grooves. However, any type of groove shape can be utilized, such as square, cylinder, diamond, and the like.
  • FIG. 10 shows optical fibers 939-1 and 939-2 are placed in the fiber trenches 1041 -1 and 1041 -2, respectively.
  • the height of at least one of fiber trenches 1041 is substantially the same as the diameter of a one of optical fibers 939 that is placed therein. Doing so with all of fibers 939 enables spacer 933 to have a flat surface that can be flush against photonic plug 931. Additionally or alternatively, spacer 933 may be shaped so as to accommodate other heights for fiber trenches 1041 . Second tilted flat mirrors 937 and second curved mirrors 935 should be positioned to provide for a proper optical path with respect to the depth and orientation of fiber trenches 1041 .
  • trenches 1041 shown in FIG. 10 and the diameter of fibers 939 shown in FIG. 10 are simply for pedagogical purposes to make it easy to facilitate explanation of the concept and do not reflect any particular preferred or real-world depth, diameter, or optical path.
  • adhesive may also be placed within trenches 1041 or around optical fibers 939 to secure optical fibers 939 with photonic plug 931 .
  • FIG. 11 depicts an example diagram utilized to describe the angles and distances of the coupling example shown in FIG. 9.
  • a drain is optical fiber 939 and an exit point of a waveguide of SiPh chip 1141 is the source for the light beam. Note that that the arrangement shown works in the reverse direction as well.
  • the light beam’s radius is determined by the light beam’s radius at the source 1141 , the medium in which the beam propagates, and the wavelength of the light beam.
  • the angle of divergence (0) is selected as the angle where the intensity of the light beam is 1 % of the intensity at the center of the beam.
  • the main propagation angles (a, p, y) are set to meet the following constraints:
  • the value of 0 is 11 e -12 e . It should be noted that other constraints may be set to different target tolerances.
  • the separation height 1163 i.e., the height between curved mirrors 621 and 935, which is made up of the height of spacer 933, part of the height of SiPh chip 201 , the height of hardened imprint material 413, and the heights of any antireflective coatings and which is represented as L in the equations below, is set based on the allowed tolerances, e.g., for rotation and leveling errors. In an example configuration , L may equal 300pm.
  • first and second curved mirrors 621 and 935 are designed so that when assembled each mirror’s respective centers are located where the main propagation axis intersects each respective mirror. Specifically, the mirrors are designed such that the center of first curved mirror 621 is at a distance Di from the source 1141. In one or more examples, the distance Di is computed as follows:
  • the center of second curved mirror 935 is at a distance D2 from optical fiber 939 acting as the drain.
  • the distance D2 is computed as follows:
  • the lateral distance, to have a substantially 0 pm misalignment between first and second curved mirrors 621 and 935 is computed as follows:
  • first and second curved mirrors 621 and 935 are shaped in such a way that all light beams from the source 1141 are reflected and collimated at the angle a after second curved mirror 935 and focused to optical fiber 939 acting as the drain after being reflected by first curved mirror 621 .
  • the surfaces of first and second curved mirrors 621 and 935 are large enough to cover the divergence axis. It should be noted that all calculations are performed under 0 misalignment conditions.
  • the examples disclosed herein describe the use of curved mirrors for propagating light beams, other arrangements can be realized using other reflective or focusing elements, such as optical lenses, zone plates, e.g., Fresnel zone plates, and the like.
  • First and second curved mirrors 621 and 935 are placed so that their respective reflective curved surfaces face in opposite directions to each other. Specifically, first curved mirror 621 is on SiPh chip 201 with its curved reflective surface facing generally toward photonic plug 931 while second curved mirror 935 is on photonic plug 931 with its curved reflective surface facing generally toward SiPh chip 201. As a result of the arrangement of the mirrors, light from waveguide 205 of SiPh chip 201 ultimately is directed into fiber 939 and vice-versa, depending on the application.
  • the total spacing height between SiPh chip 201 and photonic plug 931 determines, in part, the efficiency of the transference of a light beam, i.e. , optical signal, that is propagating along the optical path. Specifically, the greater the total height is, the less the efficient is the transference.
  • the total height may be set to 300 pm.
  • optical path was described regarding a connection between a single fiber and SiPh chip 605, it will be clear to those of ordinary skill in that the example path may be repeated and applied to a plurality of fibers, e.g., all fibers 939 in in photonic plug 931 , e.g., as shown in FIG. 10.
  • FIG. 12 shows another example in which fixed photonic plug 931 and spacer 933 are replaced by detachable plug die 1231 and spacer 1233. These may be inserted into receptacle 1481 shown in FIG. 14.
  • Detachable plug die 1231 is described further hereinbelow. Detachable plug die 1231 is detachable due to its ability to be inserted into and correspondingly removed from receptacle 1481.
  • an additional air gap 1255 results.
  • Such an air gap may necessitate an additional layer of antireflective coating 1211 which may be applied to the surface of spacer 1233 that is facing SiPh chip 201 .
  • the height of separation must now also add in the height of air gap 1255 and antireflective coating 1211 if employed.
  • the new height of separation is shown in FIG. 12 as height of separation 1263, which would be the value of L for such an example in the calculations explained above for determining the geometry of configurations.
  • FIG. 13 shows that the individual fibers 939 of fiber ribbon 1339 are inserted into trenches, e.g., V-grooves, shown, e.g., as described in more detail hereinabove regarding FIG. 10, formed in detachable plug die 1231 to keep them aligned and the trenches are typically in parallel and typically each trench extends part-way across detachable plug die 1231.
  • the trenches hold the fibers and keeps them aligned, which may be in cooperation with spacer 1233 and an adhesive.
  • Detachable plug die 1231 , spacer 1233, and fiber ribbon 1339 taken together may be considered to be a detachable photonic plug that can be used to connect optical signals between SiPh chip 201 and fibers, not shown, to which the opposite end of fiber ribbon connector 1339 are connected, such opposite ends also being not shown.
  • the components of the detachable photonic plug, including detachable plug die 1231 , fibers 1339, and spacer 1233 are assembled, e.g., as shown in FIG. 13, prior to being inserted into receptacle 1481. Also shown in FIG. 13 is clip 1361 which is used to hold the detachable photonic plug within receptacle 1481.
  • spacer 1233 is used at least in part to control the distance between detachable plug die 1231 and SiPh chip 201 so as to enable the proper optical design of the system.
  • Spacer 1233 may also be used to at least partially encapsulate and help hold in place fibers 939 of fiber ribbon 1339.
  • an adhesive may be employed between at least a portion of glass spacer 121 and at least a portion of plug die 1231 to keep spacer 1233 attached to plug die 1231 .
  • adhesive may also be placed within the trenches or around optical fibers 939.
  • the adhesive should have an appropriate index of refraction so as to minimize optical losses, as noted above.
  • Spacer 1233 is optically transparent to at least one wavelength of light being carried by optical fibers 939 and employed by SiPh chip 201.
  • Spacer 1233 may be made of any transparent and non-conductive material, such as glass, polydimethylsiloxane, or any other encapsulation material with appropriate refractive index.
  • FIG. 14 shows detachable plug die 1231 and spacer 1233 inserted into receptacle 1481 which is in turn mounted over at least a portion of SiPh chip 201.
  • Receptacle 1481 is reflow soldered or glued, e.g., using an adhesive, to SiPh chip 201 , substrate 829, or a combination thereof. This may be performed using a standard pick and place machine and as such, advantageously, it can be placed with high accuracy. It may be placed during the packaging process, e.g., during the placing of one or more chips, e.g., an ASIC on the substrate 829.
  • FIG. 14 further shows removable clip 1361 over receptacle 1481 so as to hold removable plug die 1231 and spacer 1233 within receptacle 1481.
  • removable clip 1361 substantially blocks detachable plug die 1231 and spacer 1233 from being seen in FIG. 14.
  • Removable clip 1361 extends over the top of receptacle 1481 and may press down on detachable plug die 1231 in order to keep the components in place.
  • removable clip 1361 extends over the top and around two opposing sides of receptacle 1481 which it grips to stay in position.
  • Receptacle 1481 may have one or more indentations, not shown, to aid clip 1361 to remain in place.
  • clip 1361 remains in place due to friction.
  • clip 1361 may be attached to SiPh chip 201 or substrate 829. After being placed, removable clip may be removed to allow detachable plug die 1231 and fibers 939 to be separated from SiPh chip 201.
  • removable clip may be removed to allow detachable plug die 1231 and fibers 939 to be separated from SiPh chip 201.
  • at least one end of clip 1361 may be arranged to be permanently attached to receptacle 1481 , e.g., using a hinge mechanism.
  • fine alignment male features 1587 and fine alignment female features 1589 may be produced by wafer level manufacturing processes on both SiPh chip 201 and the detachable plug die 1231.
  • such a mechanical structure where the alignment is performed using such alignment features produced at the wafer level provides for superior control of the alignment.
  • fine alignment features may be incorporated into spacer 1233 in addition to or in lieu of those of detachable plug die 1231 . Illustrative such fine alignment features 1287 of spacer 1233 are shown in FIG. 12. Detachable plug die 1231 may include alignment features to help insure proper placement of spacer 1233.
  • FIG. 16 shows a flowchart of an example process for assembling a detachable plug and connecting an end of fibers to a SiPh chip in accordance with one or more aspects of the present disclosure.
  • the process is entered in step 1601 in which a receptacle, e.g., receptacle 1481 , a SiPh chip, e.g. SiPh chip 201 and any other optional components not part of the detachable fiber plug, are coupled to a substrate, e.g. substrate 829, which may be an MOM.
  • a substrate e.g. substrate 829
  • Such coupling may be performed using soldering, adhesive, a combination thereof, and the like and may be different for various items being coupled together.
  • a portion of receptacle 1481 may be glued, e.g., using an adhesive, to SiPh chip 201 .
  • a portion of receptacle 1481 may be soldered, e.g., using reflow soldering, to substrate 829.
  • SiPh chip 201 may be soldered to the substrate 829, e.g., as described hereinabove in connection with FIG. 8.
  • the receptacle is permanently mounted so that at least a portion of the receptacle extends over at least a portion of the SiPh chip.
  • the receptacle should be mounted such that the fine alignment features on SiPh 201 are exposed within the internal area of the receptacle into which detachable plug die 1231 will be placed when it is inserted into the receptacle, e.g., area 1591 of FIG. 15.
  • step 1603 the detachable photonic plug is inserted into the receptacle.
  • this step may be performed after any soldering, e.g., reflow soldering, that may be required to form all of the components coupled together in step 1601 as well as to perform the coupling of step 1601.
  • coupling fibers e.g., fibers 939, to SiPh chip 201 , is performed after all soldering, e.g., used to assemble an MOM should substrate 829 be an MOM, is completed.
  • a clip e.g., clip 1361 , is employed to close the detachable photonic plug by fastening or securing the detachable plug die 1231 within the receptacle.
  • step 1607 the opposite ends of the fibers, i.e., the fiber ends not within receptacle 1481 and not seen in FIG. 13, are connected to their destination.
  • Tilted flat mirror 623 may, according to some configurations, be replaced by a tilted curved mirror.
  • a tilted curved mirror may act as a focusing element that can change the mode size of the light beam.
  • the tilted flat mirror may be used in configurations when the mode field diameter of the waveguide is substantially 9um.
  • the titled curved mirror may be employed.
  • the tilted curved mirror is shaped and oriented so that not only does it change the direction of the light, similar in this regard to titled flat mirror 623, but due to its curvature it also converts the light’s mode size.
  • tilted curved mirror may be formed by imprint stamping in the same manner as described above for tilted flat mirror 623 and curved mirror 621 but using an imprint stamp that is shaped so as to form a tilted curved mirror surface in lieu of tilted flat surface 519.
  • tilted flat mirror 623 may be employed but mode conversion may be achieved by forming of the imprint material a mode converter between the end of wave guide 205 and tilted flat mirror 623.
  • the mode converter may be made of an inverted taper and a linear taper which are formed of the imprint material at the same time as the formation curved surface 517 and tilted flat surface 519 takes place, i.e., as part of the same steps that are used to form curved surface 517 and tilted flat surface 519, by using an appropriately shape imprint stamp.
  • the imprinted structure could be formed as a separate part, e.g., formed on glass or other substrate that is transparent to light at the wavelength of interest, and then installed, e.g., glued, onto the SiPh chip, e.g, so as to extend at least partly within a cavity formed therein as disclosed above.
  • Clause 1 An apparatus comprising: a curved mirror; and a tilted flat mirror, wherein at least one of the curved mirror and the tilted flat mirror is formed on a hardened stamped imprint material that was deposited on a silicon photonics (SiPh) chip at least in a cavity thereof.
  • SiPh silicon photonics
  • Clause 2 The apparatus of clause 1 , wherein the apparatus is configured to couple an optical signal between an optical fiber in an optical plug, the optical plug mounted to a bottom of the SiPh chip.
  • Clause 3 The apparatus of clauses 1 or 2, wherein both of the mirror and the tilted flat mirror are formed on a hardened imprint material that was deposited in the cavity on the SiPh chip.
  • Clause 4 The apparatus of any of clauses 1 to 3, wherein the SiPh chip further comprises a waveguide and wherein light is couplable between the waveguide and the tilted flat mirror.
  • Clause 5 The apparatus of any of clauses 1 to 4, wherein the cavity, the curved mirror, and the tilted flat mirror are formed on a photonic bump of the SiPh chip.
  • Clause 6 The apparatus of any of clauses 1 to 5, wherein the cavity is formed from a top surface of the SiPh chip downward.
  • Clause 7 The apparatus of any of clauses 1 to 6, wherein the SiPh chip further comprises a layer of antireflective coating between at least a portion of a bottom of the cavity and the hardened imprint material.
  • Clause 8 The apparatus of any of clauses 1 to 7, wherein the SiPh chip further comprises a layer of antireflective coating on a portion of its bottom surface.
  • Clause 9 The apparatus of any of clauses 1 to 8, wherein the SiPh chip is flip-chip mounted to a substrate, wherein a top surface of the SiPh chip is attached to the substrate via microbumps.
  • Clause 10 The apparatus of any of clauses 1 to 10, further comprising a spacer having a first surface of the spacer coupled to a bottom surface of the SiPh chip and a photonic plug mounted to a second surface of the spacer opposing the first surface of the spacer.
  • Clause 11 The apparatus of clause 10, wherein the spacer is substantially optically transparent to at least one frequency of light.
  • Clause 12 The apparatus of any of clauses 10 to 11 , wherein the photonic plug comprises a second curved mirror and a second tilted flat mirror, wherein the second tilted flat mirror and the second curved mirror are laterally spaced from each other by a predefined distance.
  • Clause 13 The apparatus of clause 12, wherein the second tilted flat mirror is positioned at a predefined lateral distance from an end of at least one optical fiber that is held within the photonic plug, the second tilted flat mirror being oriented so as to redirect a light beam from a substantially horizontal orientation to an orientation at an angle from the substantially horizontal orientation.
  • Clause 14 The apparatus of any of clauses 1 to 13, further comprising: a receptacle configured to receive a detachable photonic plug, the photonic plug configured to couple at least one optical fiber to the SiPh chip.
  • Clause 15 The apparatus of clause 14, wherein the receptacle is disposed over at least a portion of a bottom of the SiPh chip.
  • Clause 16 The apparatus of clause 14, wherein the receptacle extends over at least one fine alignment feature formed on a bottom surface of the SiPh chip.
  • Clause 17 The apparatus of clause 14, further comprising: a clip, wherein the clip is removable coupled to the receptacle to secure the detachable photonic plug within the receptacle.
  • Clause 18 The apparatus of clause 14, further comprising: a spacer, wherein the detachable photonic plug comprises: at least a second tilted flat mirror and a second curved mirror, wherein the second tilted flat mirror and the second curved mirror are laterally spaced from each other by a predefined distance; and wherein the second tilted flat mirror at a predefined lateral distance from an end of at least one single-mode optical fiber that is held within the detachable photonic plug, the second tilted flat mirror being oriented so as to change a light beam from a horizontal orientation defined by a trench of the detachable photonic plug in which is located at an end of the at least one single-mode optical fiber that is held within the detachable photonic plug to a substantially vertical orientation with respect to the horizontal orientation and vice-versa.
  • the detachable photonic plug comprises: at least a second tilted flat mirror and a second curved mirror, wherein the second tilted flat mirror and the second curved mirror are laterally spaced
  • Clause 19 The apparatus of clause 18, wherein at least one fine alignment feature is implemented on at least one of the group consisting of the detachable photonic plug and the spacer, the fine alignment feature being adapted to mate to a corresponding fine alignment feature of the SiPh chip.
  • Clause 20 The apparatus of clause 19, further comprising an antireflective coating, coating a portion of a surface of the spacer that faced a bottom of the SiPh chip.
  • a connector for use in coupling an optical signal between an optical fiber in an optical plug mounted to a bottom of a silicon photonics (SiPh) chip comprising: at least one curved mirror; and at least one tilted mirror, wherein the at least one curved mirror and the at least one tilted mirror are formed on a hardened stamped imprint material placed at least partly in a cavity of the SiPh chip.
  • Clause 22 The connector of clause 21 , wherein the hardened stamped imprint material is formed on a substrate separate from the SiPh chip.
  • Clause 23 The connector of clauses 21 or 22, wherein the at least one tilted mirror comprises at least one tilted curved mirror.
  • Clause 24 The connector of any of clauses 21 - 23, wherein the at least one tilted mirror comprises at least one flat tilted mirror.
  • Clause 25 The connector of any of clauses 21 to 24, further comprising a mode converter formed at least in part of the hardened stamped imprint material.
  • Clause 26 The connector of clause 25, wherein the mode converter comprises: an inverted taper; and a linear taper, the inverted taper and the linear taper being coupled together and being optically coupled to the at least one tilted mirror.
  • a connector comprising: at least one curved mirror; and at least one grating coupler; wherein the at least one curved mirror is formed on a hardened stamped imprint material placed at least partly in a cavity of a silicon photonics (SiPh) chip, and wherein the grating coupler is adapted to couple light with a wave guide of the SiPh chip.
  • SiPh silicon photonics
  • any reference to an element herein using a designation such as “first,” “second,” and so forth does not generally limit the quantity or order of those elements. Rather, these designations are generally used herein as a convenient method of distinguishing between two or more elements or instances of an element. Thus, a reference to first and second elements does not mean that only two elements may be employed there or that the first element must precede the second element in some manner. Also, unless stated otherwise a set of elements comprises one or more elements.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

L'invention concerne un connecteur destiné à être utilisé pour coupler un signal optique entre une fibre optique dans un connecteur optique monté sur un fond d'une puce photonique en silicium (SiPh). Le connecteur comprend : un miroir incurvé ; et un miroir plat incliné ; au moins l'un du miroir incurvé et du miroir plat incliné étant formé sur un matériau d'impression estampé durci qui a été déposé sur la puce SiPh au moins dans une cavité de celle-ci.
PCT/IL2022/051360 2021-12-22 2022-12-21 Connecteur optique côté arrière pour coupler une fibre monomodale à une puce photonique en silicium Ceased WO2023119280A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US17/645,667 US12164159B2 (en) 2021-12-22 2021-12-22 Backside optical connector
US17/645,667 2021-12-22
US17/645,673 2021-12-22
US17/645,673 US20230194806A1 (en) 2021-12-22 2021-12-22 Method of making and using a backside optical coupler for coupling of single-mode fiber to a silicon photonics chip

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WO2023119280A1 true WO2023119280A1 (fr) 2023-06-29

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PCT/IL2022/051358 Ceased WO2023119278A1 (fr) 2021-12-22 2022-12-21 Procédé de fabrication et d'utilisation d'un coupleur optique côté arrière pour coupler une fibre monomode à une puce photonique en silicium
PCT/IL2022/051360 Ceased WO2023119280A1 (fr) 2021-12-22 2022-12-21 Connecteur optique côté arrière pour coupler une fibre monomodale à une puce photonique en silicium

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WO2016172202A1 (fr) * 2015-04-20 2016-10-27 Skorpios Technologies, Inc. Coupleurs à sortie verticale pour des dispositifs photoniques
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US11644618B2 (en) * 2018-06-22 2023-05-09 Apple Inc. Discrete optical unit on a substrate of an integrated photonics chip

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US20130182998A1 (en) * 2012-01-18 2013-07-18 International Business Machines Corporation Silicon photonic chip optical coupling structures
US20170102503A1 (en) * 2015-10-08 2017-04-13 Teramount Ltd. Fiber to chip optical coupler
US20190324211A1 (en) * 2018-04-18 2019-10-24 Teramount Ltd. Wideband surface coupling
US20200278508A1 (en) * 2019-02-28 2020-09-03 Teramount Ltd. Fiberless co-packaged optics

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