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WO2023038105A1 - Procédé de production d'élément de génération d'énergie, élément de génération d'énergie, dispositif de génération d'énergie et dispositif électronique - Google Patents

Procédé de production d'élément de génération d'énergie, élément de génération d'énergie, dispositif de génération d'énergie et dispositif électronique Download PDF

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Publication number
WO2023038105A1
WO2023038105A1 PCT/JP2022/033833 JP2022033833W WO2023038105A1 WO 2023038105 A1 WO2023038105 A1 WO 2023038105A1 JP 2022033833 W JP2022033833 W JP 2022033833W WO 2023038105 A1 WO2023038105 A1 WO 2023038105A1
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Prior art keywords
electrode
power generation
forming step
generation element
conductor layer
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PCT/JP2022/033833
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English (en)
Japanese (ja)
Inventor
博史 後藤
稔 坂田
拓夫 安田
ラーシュ マティアス アンダーソン
誠司 岡田
貴宏 中村
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GCE Institute Co Ltd
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GCE Institute Co Ltd
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Priority claimed from JP2021147809A external-priority patent/JP7011361B1/ja
Application filed by GCE Institute Co Ltd filed Critical GCE Institute Co Ltd
Publication of WO2023038105A1 publication Critical patent/WO2023038105A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N11/00—Generators or motors not provided for elsewhere; Alleged perpetua mobilia obtained by electric or magnetic means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N15/00—Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using the Nernst-Ettingshausen effect

Definitions

  • the present invention relates to a method for manufacturing a power generation element, a power generation element, a power generation device, and an electronic device that eliminate the need for a temperature difference between electrodes when converting thermal energy into electrical energy.
  • Patent Document 1 discloses a generation step of generating nanoparticles dispersed in a solvent or an organic solvent using a femtosecond pulse laser, a first electrode portion forming step of forming a first electrode portion on a first substrate, a second electrode portion forming step of forming a second electrode portion on a second substrate; and the first substrate with the solvent or the organic solvent sandwiched between the first electrode portion and the second electrode portion. and a bonding step of bonding the second substrate and the like.
  • the present invention has been devised in view of the above-described problems, and its object is to provide a method for manufacturing a power generation element, a power generation element, a power generation device, and a power generation device capable of stabilizing the amount of power generation. It is to provide an electronic device.
  • a method for manufacturing a power generation element according to a first aspect of the present invention is a method for manufacturing a power generation element that does not require a temperature difference between electrodes when converting thermal energy into electrical energy, wherein the first electrode and the first electrode are An element forming step of forming a second electrode having a different work function and an intermediate portion sandwiched between the first electrode and the second electrode, wherein the intermediate portion contains fine particles, and the A non-conductor layer supporting the first electrode and the second electrode is included.
  • a method of manufacturing a power generation element according to a second invention is characterized in that, in the first invention, the element forming step includes a film forming step of forming the nonconductor layer.
  • a method for manufacturing a power generation element according to a third invention is characterized in that, in the second invention, the film forming step includes a coating step of coating a non-conductor material.
  • a method for manufacturing a power generating element according to a fourth aspect of the invention is the method according to the third aspect, wherein the film formation step includes a curing step of curing the nonconductor material to form the nonconductor layer after the coating step. characterized by
  • a method for manufacturing a power generation element according to a fifth aspect of the invention is characterized in that, in the third aspect of the invention or the fourth aspect of the invention, the film forming step includes forming the nonconductor layer on the first electrode. .
  • a method for manufacturing a power generating element according to a sixth invention is characterized in that, in the third invention or the fourth invention, the film forming step includes forming the nonconductor layer on a substrate.
  • a method for manufacturing a power generating element according to a seventh aspect of the invention is characterized in that, in the sixth aspect of the invention, the element forming step comprises: a substrate separating step of separating the substrate; and forming the first electrode before the substrate separating step. and a second electrode forming step of forming the second electrode after the substrate separating step.
  • a method for manufacturing a power generating element according to an eighth aspect of the invention is the method according to the sixth aspect, wherein the element forming step includes forming the first electrode after the substrate separating step of separating the substrate and the substrate separating step. It is characterized by including a first electrode forming step and a second electrode forming step of forming the second electrode after the substrate separating step.
  • a method for manufacturing a power generation element according to a ninth aspect of the invention is the method according to any one of the third to eighth aspects of the invention, wherein the film forming step includes a processing step of smoothing the surface of the non-conductor material after the coating step. characterized by comprising
  • a method for manufacturing a power generation element according to a tenth invention is the method according to any one of the third invention to the ninth invention, wherein the film forming step is a drying step of removing a diluent contained in the non-conductor material after the coating step. characterized by comprising
  • a power generation element according to the eleventh invention is characterized by being formed by the method for manufacturing a power generation element according to the first invention.
  • a power generating device includes the power generating element according to the eleventh aspect of the invention, a first wiring electrically connected to the first electrode, and a second wiring electrically connected to the second electrode. It is characterized by having
  • An electronic device is characterized by comprising the power generation element according to the eleventh invention and an electronic component driven by using the power generation element as a power supply.
  • the intermediate portion includes a non-conductor layer containing fine particles. That is, the non-conductor layer suppresses movement of the fine particles between the electrodes. For this reason, it is possible to prevent the fine particles from becoming unevenly distributed on one electrode side over time and reducing the amount of movement of electrons. This makes it possible to stabilize the power generation amount.
  • the intermediate portion includes a non-conductor layer that supports the first electrode and the second electrode. Therefore, compared to the case where a solvent or the like is used instead of the non-conductive layer, there is no need to provide a support portion or the like for maintaining the distance (gap) between the electrodes, and the gap resulting from the formation accuracy of the support portion is eliminated. Distortion can be removed. This makes it possible to improve the amount of power generation.
  • the element forming step includes a film forming step of forming a non-conductor layer. That is, compared with the case where the material of the non-conductor layer is processed into layers and laminated, it becomes easier to form the non-conductor layer thinner and to narrow the distance (gap) between the electrodes. Therefore, the electric field generated between the electrodes can be increased. This makes it possible to further improve the power generation amount.
  • the film forming step includes a coating step of coating a non-conductor material. That is, the non-conductor layer can be formed over a larger area than the dry film forming method without requiring a vacuum device. Therefore, it is possible to increase the size of the power generating element. This makes it possible to further improve the power generation amount.
  • the film formation step includes a curing step of curing the non-conductor material to form a non-conductor layer after the application step. That is, the hardened non-conductor layer further suppresses movement of the particles between the electrodes. For this reason, it is possible to further suppress the decrease in the amount of movement of electrons due to uneven distribution of the fine particles on the one electrode side over time. This makes it possible to further stabilize the power generation amount.
  • the film forming step includes forming a non-conductor layer on the first electrode. That is, it is possible to easily improve the contact area of the interface between the non-conductor layer and the first electrode. Therefore, it is possible to suppress variations in resistance at the interface between the non-conductor layer and the first electrode. This makes it possible to further improve the power generation amount.
  • the film forming step includes forming a non-conductor layer on the substrate. That is, the first electrode is not affected by the formation of the non-conductor layer. For this reason, it is possible to suppress deterioration in quality such as a change in the work function of the first electrode, for example. This makes it possible to further improve the power generation amount.
  • the element forming step includes a substrate separating step of separating the substrates, a first electrode forming step of forming the first electrode before the substrate separating step, and a substrate separating step. and a second electrode forming step of forming a second electrode after. That is, before the first electrode is formed, the time during which the surface of the non-conductor layer in contact with the first electrode is exposed to the atmosphere can be reduced. For this reason, it is possible to suppress foreign matter from entering the non-conductor layer. As a result, it is possible to improve the non-defective product rate.
  • the element forming step includes a substrate separating step of separating the substrates, a first electrode forming step of forming the first electrode after the substrate separating step, and a substrate separating step. and a second electrode forming step of forming a second electrode later. That is, since the first electrode and the second electrode can be freely selected after separating the base material, the film forming process included in the plurality of element forming processes can be collectively carried out in advance. Therefore, the number of times the film forming process is performed can be reduced with respect to the number of times the element forming process is performed. This makes it possible to simplify the manufacturing process.
  • the film forming step includes a processing step of smoothing the surface of the non-conductor material after the coating step. That is, the contact area of the interface between the non-conductor layer and the first electrode or the interface between the non-conductor layer and the second electrode can be easily improved. Therefore, it is possible to suppress variation in resistance at the interface between the non-conductor layer and each electrode. This makes it possible to further improve the power generation amount.
  • the film forming process includes a drying process for removing the diluent contained in the non-conductor material after the coating process. That is, the region in which the diluent is contained in the non-conductor layer can be reduced, and the movement of fine particles via the diluent can be suppressed. For this reason, it is possible to further suppress the decrease in the amount of movement of electrons due to uneven distribution of the fine particles on the one electrode side over time. This makes it possible to further stabilize the power generation amount.
  • the power generator includes the power generation element according to the eleventh invention. Therefore, it is possible to realize a power generation device that stabilizes the power generation amount.
  • an electronic device includes the power generation element according to the eleventh invention. Therefore, it is possible to realize an electronic device that stabilizes the amount of power generation.
  • FIG. 1(a) is a schematic cross-sectional view showing an example of a power generation element and a power generation device in the first embodiment
  • FIG. 1(b) is a schematic cross-sectional view along AA in FIG. 1(a).
  • FIG. 2 is a schematic cross-sectional view showing an example of the intermediate portion
  • FIG. 3(a) is a flowchart showing an example of a method for manufacturing a power generating element according to the first embodiment
  • FIG. 3(b) is a flowchart showing a first modification of the method for manufacturing a power generating element according to the first embodiment.
  • 4(a) to 4(d) are schematic cross-sectional views showing an example of the method for manufacturing the power generation element according to the first embodiment.
  • FIG. 1(a) is a schematic cross-sectional view showing an example of a power generation element and a power generation device in the first embodiment
  • FIG. 1(b) is a schematic cross-sectional view along AA in FIG. 1(a).
  • FIG. 5 is a flow chart showing an example of a method for manufacturing a power generation element according to the second embodiment.
  • 6(a) and 6(b) are schematic cross-sectional views showing an example of a method for manufacturing a power generation element according to the second embodiment.
  • FIG. 7 is a flow chart showing an example of a method for manufacturing a power generating element according to the third embodiment.
  • 8(a) to 8(e) are schematic cross-sectional views showing an example of a method for manufacturing a power generation element according to the third embodiment.
  • 9(a) and 9(b) are schematic cross-sectional views showing an example of a method for manufacturing a power generation element according to the fourth embodiment.
  • FIGS. 13(a) to 13(d) are schematic block diagrams showing examples of electronic devices having power generation elements
  • FIGS. 13(e) to 13(h) show power generation devices including power generation elements. It is a schematic block diagram which shows the example of the electronic device provided.
  • the height direction in which each electrode is stacked is defined as a first direction Z
  • one planar direction that intersects, for example, is orthogonal to the first direction Z is defined as a second direction X.
  • a third direction Y is another planar direction that intersects, for example, is orthogonal to each of the directions X.
  • the configuration in each drawing is schematically described for explanation, and for example, the size of each configuration and the comparison of the size of each configuration may differ from those in the drawings.
  • FIG. 1 is a schematic diagram showing an example of a power generation element 1 and a power generation device 100 in this embodiment.
  • FIG. 1(a) is a schematic cross-sectional view showing an example of a power generation element 1 and a power generation device 100 in this embodiment
  • FIG. 1(b) is a schematic cross section along AA in FIG. 1(a). It is a diagram.
  • the power generation device 100 includes a power generation element 1 , first wiring 101 and second wiring 102 .
  • the power generation element 1 converts thermal energy into electrical energy.
  • the power generation device 100 including such a power generation element 1 is mounted or installed on a heat source (not shown), and based on the thermal energy of the heat source, the electrical energy generated from the power generation element 1 is transferred to the first wiring 101 and the second wiring 101. 2 output to the load R via the wiring 102 .
  • One end of the load R is electrically connected to the first wiring 101 and the other end is electrically connected to the second wiring 102 .
  • a load R indicates, for example, an electrical device.
  • the load R is driven, for example, using the generator 100 as a main power source or an auxiliary power source.
  • heat sources for the power generation element 1 include electronic devices or electronic parts such as CPUs (Central Processing Units), light emitting elements such as LEDs (Light Emitting Diodes), engines such as automobiles, production equipment in factories, human bodies, sunlight, and environmental temperature.
  • electronic devices, electronic parts, light-emitting elements, engines, production equipment, etc. are artificial heat sources.
  • the human body, sunlight, ambient temperature, etc. are natural heat sources.
  • the power generation device 100 including the power generation element 1 can be provided inside mobile devices such as IoT (Internet of Things) devices and wearable devices and self-supporting sensor terminals, and can be used as an alternative or supplement to batteries. Furthermore, the power generation device 100 can also be applied to larger power generation devices such as solar power generation.
  • the power generation element 1 converts, for example, thermal energy generated by the artificial heat source or thermal energy possessed by the natural heat source into electrical energy to generate current.
  • the power generation element 1 can be provided not only inside the power generation device 100, but also inside the mobile device, the self-contained sensor terminal, or the like. In this case, the power generation element 1 itself can serve as an alternative or auxiliary part of the battery, such as the mobile device or the self-contained sensor terminal.
  • the power generation element 1 includes, for example, a first electrode 11, a second electrode 12, and an intermediate portion 14, as shown in FIG. 1(a).
  • the power generation element 1 may include at least one of the first substrate 15 and the second substrate 16, for example.
  • the first electrode 11 and the second electrode 12 are provided facing each other.
  • the first electrode 11 and the second electrode 12 have different work functions.
  • the intermediate portion 14 is provided in a space 140 including a gap G between the first electrode 11 and the second electrode 12, as shown in FIG. 2, for example.
  • the intermediate portion 14 includes fine particles 141 and a non-conductor layer 142 .
  • the non-conductor layer 142 contains the fine particles 141 . In this case, movement of the particles 141 in the gap G is suppressed. Therefore, it is possible to prevent the fine particles 141 from becoming unevenly distributed on the side of one of the electrodes 11 and 12 over time and reducing the amount of movement of electrons. This makes it possible to stabilize the power generation amount.
  • the non-conductor layer 142 is formed, for example, by curing a non-conductor material 142a.
  • the non-conductor layer 142 exhibits a solid, for example.
  • the non-conducting layer 142 may include, for example, diluent residue and uncured portions of the non-conducting material 142a.
  • the fine particles 141 are fixed in a dispersed state in the non-conductor layer 142, for example. In this case as well, it is possible to stabilize the power generation amount in the same manner as described above.
  • the intermediate portion 14 is provided on the first electrode 11 .
  • the second electrode 12 is provided on the non-conductor layer 142 . That is, the non-conductor layer 142 supports the first electrode 11 and the second electrode 12 .
  • the power generation element 1 that does not require a temperature difference between the electrodes (the first electrode 11 and the second electrode 12) when converting thermal energy into electrical energy, along the second direction X and the third direction Y
  • a liquid such as a solvent
  • the non-conductor layer 142 supports the first electrode 11 and the second electrode 12, so there is no need to provide a support portion or the like for maintaining the gap G, and the non-conductor layer 142 supports the first electrode 11 and the second electrode 12. It is possible to eliminate variations in the gap due to the accuracy of forming the parts. This makes it possible to increase the amount of power generation.
  • the fine particles 141 may come into contact with the support and aggregate around the support.
  • the power generating element 1 of the present embodiment it is possible to eliminate the state in which the fine particles 141 aggregate due to the supporting portion. This makes it possible to maintain a stable power generation amount.
  • the first electrode 11 and the second electrode 12 are spaced apart in the first direction Z, as shown in FIG. 1(a), for example.
  • Each of the electrodes 11 and 12 may extend in the second direction X and the third direction Y, for example, and may be provided in plurality.
  • one second electrode 12 may be provided facing the plurality of first electrodes 11 at different positions.
  • one first electrode 11 may be provided facing the plurality of second electrodes 12 at different positions.
  • a conductive material is used as the material of the first electrode 11 and the second electrode 12 .
  • materials for the first electrode 11 and the second electrode 12 for example, materials having different work functions are used. The same material may be used for the electrodes 11 and 12, and in this case, the electrodes 11 and 12 may have different work functions.
  • non-metallic conductor As the material of the electrodes 11 and 12, for example, a material composed of a single element such as iron, aluminum, or copper may be used, or an alloy material composed of, for example, two or more elements may be used.
  • a non-metallic conductor for example, may be used as the material of the electrodes 11 and 12 .
  • Examples of nonmetallic conductors include silicon (Si: for example, p-type Si or n-type Si) and carbon-based materials such as graphene.
  • the thickness of the first electrode 11 and the second electrode 12 along the first direction Z is, for example, 4 nm or more and 1 ⁇ m or less.
  • the thickness of the first electrode 11 and the second electrode 12 along the first direction Z may be, for example, 4 nm or more and 50 nm or less.
  • a gap G that indicates the distance between the first electrode 11 and the second electrode 12 can be arbitrarily set by changing the thickness of the non-conductor layer 142 . For example, by narrowing the gap G, the electric field generated between the electrodes 11 and 12 can be increased, so that the power generation amount of the power generation element 1 can be increased. Further, for example, by narrowing the gap G, the thickness of the power generation element 1 along the first direction Z can be reduced.
  • the gap G is a finite value of 500 ⁇ m or less, for example.
  • the gap G is, for example, 10 nm or more and 1 ⁇ m or less.
  • variations in the gap G on the surfaces along the second direction X and the third direction Y may lead to a decrease in the power generation amount.
  • the gap G is larger than 1 ⁇ m, the electric field generated between the electrodes 11 and 12 may weaken.
  • the gap G is preferably larger than 200 nm and 1 ⁇ m or less.
  • the intermediate portion 14 extends on a plane along the second direction X and the third direction Y, as shown in FIG. 1B, for example.
  • the intermediate portion 14 is provided within a space 140 formed between the electrodes 11 , 12 .
  • the intermediate portion 14 may be in contact with the main surfaces of the electrodes 11 and 12 facing each other, and may also be in contact with the side surfaces of the electrodes 11 and 12, for example.
  • the fine particles 141 may be dispersed, for example, in the non-conductor layer 142 and partially exposed from the non-conductor layer 142 .
  • the particles 141 may be filled, for example, in the gap G, and the gaps between the particles 141 may be filled with the non-conductor layer 142 .
  • the particle diameter of the fine particles 141 is smaller than the gap G, for example.
  • the particle diameter of the fine particles 141 is set to a finite value of 1/10 or less of the gap G, for example. If the particle diameter of the fine particles 141 is set to 1/10 or less of the gap G, it becomes easier to form the intermediate portion 14 containing the fine particles 141 in the space 140 . This makes it possible to improve the workability when generating the power generation element 1 .
  • the fine particles 141 include particles having a particle diameter of, for example, 2 nm or more and 1000 nm or less.
  • the fine particles 141 may include, for example, particles having a median diameter (median diameter: D50) of 3 nm or more and 8 nm or less, or particles having an average particle diameter of 3 nm or more and 8 nm or less.
  • the median diameter or average particle diameter can be measured, for example, by using a particle size distribution analyzer.
  • a particle size distribution measuring instrument for example, a particle size distribution measuring instrument using a dynamic light scattering method (eg, Zetasizer Ultra manufactured by Malvern Panalytical, etc.) may be used.
  • the fine particles 141 include, for example, a conductive material, and any material is used depending on the application.
  • the fine particles 141 may contain one type of material, or may contain a plurality of materials depending on the application.
  • the work function value of the fine particles 141 is, for example, between the work function value of the first electrode 11 and the work function value of the second electrode 12.
  • the work function value of the first electrode 11 and It may be other than between the value of the work function of the second electrode 12 and is arbitrary.
  • the fine particles 141 contain, for example, metal.
  • As the fine particles 141 for example, in addition to particles containing one kind of material such as gold or silver, particles of an alloy containing two or more kinds of materials may be used.
  • Fine particles 141 contain, for example, a metal oxide.
  • Examples of fine particles 141 containing metal oxides include zirconia (ZrO 2 ), titania (TiO 2 ), silica (SiO 2 ), alumina (Al 2 O 3 ), iron oxides (Fe 2 O 3 , Fe 2 O 5 ), Copper oxide (CuO ) , zinc oxide (ZnO), yttria ( Y2O3 ), niobium oxide ( Nb2O5 ) , molybdenum oxide ( MoO3 ), indium oxide ( In2O3 ), tin oxide ( SnO2 ), tantalum oxide (Ta 2 O 5 ), tungsten oxide (WO 3 ), lead oxide (PbO), bismuth oxide (Bi 2 O 3 ), ceria (CeO 2 ), antimony oxide (Sb 2 O 5 , Sb 2 O 3 ), barium titanate ( BaTiO3 ), strontium titanate (SrT
  • the fine particles 141 may contain, for example, metal oxides other than magnetic substances.
  • the fine particles 141 may contain a metal oxide exhibiting a magnetic substance, the movement of the fine particles 141 may be restricted by the magnetic field generated due to the environment in which the power generating element 1 is installed. Therefore, by including a metal oxide other than a magnetic material, the fine particles 141 are not affected by the magnetic field caused by the external environment, and it is possible to suppress the decrease in the power generation amount over time.
  • the microparticles 141 include, for example, a coating 141a on the surface.
  • the thickness of the coating 141a is, for example, a finite value of 20 nm or less.
  • a material having, for example, a thiol group or a disulfide group is used as the coating 141a.
  • Alkanethiol such as dodecanethiol is used as the material having a thiol group.
  • a material having a disulfide group for example, an alkane disulfide or the like is used.
  • the non-conductor layer 142 is provided between the electrodes 11 and 12 and is in contact with the electrodes 11 and 12, for example.
  • the thickness of the non-conductor layer 142 is a finite value of 500 ⁇ m or less, for example.
  • the thickness of the non-conductor layer 142 affects the value and variation of the gap G described above. Therefore, for example, when the thickness of the non-conductor layer 142 is 200 nm or less, variations in the gap G in the planes along the second direction X and the third direction Y may lead to a decrease in power generation. Also, if the thickness of the non-conductor layer 142 is greater than 1 ⁇ m, the electric field generated between the electrodes 11 and 12 may weaken. For these reasons, the thickness of the non-conductor layer 142 is preferably greater than 200 nm and equal to or less than 1 ⁇ m.
  • the non-conductor layer 142 may contain, for example, one type of material, or may contain a plurality of materials depending on the application. Materials described in ISO 1043-1 or JIS K 6899-1, for example, may be used as the non-conductor layer 142 .
  • the non-conductor layer 142 may include a plurality of layers containing different materials, for example, and may include a structure in which each layer is laminated. When the non-conductor layer 142 includes a plurality of layers, for example, particles 141 containing different materials may be included (eg, dispersed) in each layer.
  • the non-conductor layer 142 has insulating properties, for example. Any material can be used for the non-conductor layer 142 as long as it can suppress movement of the fine particles 141, but an organic polymer compound is preferable. When the non-conductor layer 142 contains an organic polymer compound, the non-conductor layer 142 can be formed flexibly, so that the power generating element 1 can be formed in a shape such as curved or bent according to the application.
  • organic polymer compounds include polyimides, polyamides, polyesters, polycarbonates, poly(meth)acrylates, radically polymerizable photo- or thermosetting resins, photo-cationically polymerizable photo- or thermosetting resins, epoxy resins, and acrylonitrile components.
  • An inorganic substance may be used as the non-conductor layer 142, for example.
  • inorganic substances include porous inorganic substances such as zeolite and diatomaceous earth, as well as cage-like molecules.
  • the first substrate 15 and the second substrate 16 are spaced apart in the first direction Z with the electrodes 11 and 12 and the intermediate portion 14 interposed therebetween, as shown in FIG. 1A, for example.
  • the first substrate 15 is, for example, in contact with the first electrode 11 and separated from the second electrode 12 .
  • the first substrate 15 fixes the first electrode 11 .
  • the second substrate 16 is in contact with the second electrode 12 and separated from the first electrode 11 .
  • a second substrate 16 fixes the second electrode 12 .
  • each of the substrates 15 and 16 along the first direction Z is, for example, 10 ⁇ m or more and 2 mm or less.
  • the thickness of each substrate 15, 16 can be set arbitrarily.
  • the shape of each of the substrates 15 and 16 may be, for example, square, rectangular, or disk-like, and can be arbitrarily set according to the application.
  • the substrates 15 and 16 for example, plate-shaped members having insulation properties can be used, and known members such as silicon, quartz, and Pyrex (registered trademark) can be used.
  • a film-like member may be used, and for example, a known film-like member such as PET (polyethylene terephthalate), PC (polycarbonate), polyimide, or the like may be used.
  • a member having conductivity can be used, such as iron, aluminum, copper, or an alloy of aluminum and copper.
  • a member such as a conductive polymer may be used in addition to a conductive semiconductor such as Si or GaN. If conductive members are used for the substrates 15 and 16, wiring for connecting to the electrodes 11 and 12 becomes unnecessary.
  • the first substrate 15 may have a degenerate portion that contacts the first electrode 11 .
  • the contact resistance between the first electrode 11 and the first substrate 15 can be reduced as compared with the case without the degenerate portion.
  • the first substrate 15 may have a recessed portion on a surface different from the surface in contact with the first electrode 11 . In this case, the contact resistance between the wiring (for example, the first wiring 101) electrically connected to the first substrate 15 can be reduced.
  • contact resistance can be reduced by providing contraction portions on the contact surfaces of the substrates 15 and 16 that are in contact with each other as the power generation elements 1 are stacked.
  • the above-mentioned degenerate portion is generated, for example, by ion-implanting an n-type dopant into a semiconductor at a high concentration, coating a semiconductor with a material such as glass containing an n-type dopant, and performing heat treatment after coating.
  • impurities to be doped into the semiconductor first substrate 15 known impurities such as P, As, Sb, etc. for n-type, and B, Ba, Al, etc. for p-type are mentioned. Further, electrons can be efficiently emitted when the impurity concentration in the degenerate portion is, for example, 1 ⁇ 10 19 ions/cm 3 .
  • the specific resistance value of the first substrate 15 may be, for example, 1 ⁇ 10 ⁇ 6 ⁇ cm or more and 1 ⁇ 10 6 ⁇ cm or less. If the resistivity value of the first substrate 15 is less than 1 ⁇ 10 ⁇ 6 ⁇ cm, it is difficult to select the material. Also, if the specific resistance value of the first substrate 15 is greater than 1 ⁇ 10 6 ⁇ cm, there is a concern that current loss may increase.
  • the second substrate 16 may be a semiconductor. In this case, the description is omitted because it is the same as the above.
  • the power generation element 1 may include only the first substrate 15 as shown in FIG. 12(a), or may include only the second substrate 16, for example. Further, as shown in FIG. 12B, for example, the power generation element 1 has a laminated structure in which the first electrode 11, the intermediate portion 14, and the second electrode 12 are laminated in this order without the respective substrates 15 and 16. (e.g. 1a, 1b, 1c, etc.), for example, a laminated structure comprising at least one of the substrates 15, 16 may be indicated.
  • ⁇ Example of operation of power generation element 1> For example, when thermal energy is applied to the power generation element 1, a current is generated between the first electrode 11 and the second electrode 12, and the thermal energy is converted into electrical energy. The amount of current generated between the first electrode 11 and the second electrode 12 depends on thermal energy and also depends on the difference between the work function of the second electrode 12 and the work function of the first electrode 11 .
  • the amount of current generated can be increased, for example, by increasing the work function difference between the first electrode 11 and the second electrode 12 and by decreasing the gap G.
  • the amount of electrical energy generated by the power generation element 1 can be increased by considering at least one of increasing the work function difference and decreasing the gap G.
  • the amount of electrons moving between the electrodes 11 and 12 can be increased, which can lead to an increase in the amount of current.
  • the "work function” indicates the minimum energy required to extract electrons in a solid into a vacuum.
  • the work function is measured using, for example, ultraviolet photoelectron spectroscopy (UPS), X-ray photoelectron spectroscopy (XPS), or Auger electron spectroscopy (AES). can be done.
  • UPS ultraviolet photoelectron spectroscopy
  • XPS X-ray photoelectron spectroscopy
  • AES Auger electron spectroscopy
  • FIG. 3(a) is a flowchart showing an example of a method for manufacturing the power generation element 1 according to this embodiment.
  • 4(a) to 4(d) are schematic cross-sectional views showing an example of a method for manufacturing the power generating element 1 according to this embodiment.
  • the method for manufacturing the power generating element 1 includes an element forming step S100, and may include, for example, a sealing material forming step S140.
  • the element forming step S100 forms the first electrode 11, the intermediate portion 14, and the second electrode 12, respectively.
  • a plurality of first electrodes 11, intermediate portions 14, and second electrodes 12 may be formed.
  • the first electrode 11, the intermediate portion 14, and the second electrode 12 are formed using, for example, a known forming technique.
  • the element forming step S100 includes, for example, as shown in FIG. 3A, a first electrode forming step S110, an intermediate portion forming step S120, and a second electrode forming step S130.
  • the order in which steps S110, S120, and S130 are performed is arbitrary.
  • the first electrode forming step S110 forms the first electrode 11 .
  • the first electrode 11 is formed on the first substrate 15, as shown in FIG. 4A, for example.
  • the first electrode 11 is formed, for example, by a sputtering method or a vacuum deposition method under a reduced pressure environment, or is formed by using a known electrode forming technique.
  • the first electrode 11 may be formed by processing a stretched electrode material into an arbitrary size. In this case, the first substrate 15 may not be used.
  • the first electrode 11 may be formed on the first substrate 15, for example.
  • the first electrode 11 can be applied onto the first substrate 15, and the first substrate 15 and the first electrodes 11 can be rolled up.
  • the substrate may be cut into areas according to the application.
  • the intermediate portion 14 including the non-conductor layer 142 is formed on the first electrode 11, as shown in FIG. 4B, for example.
  • a non-conductor material 142a containing fine particles 141 is formed on the surface of the first electrode 11 to form a non-conductor layer 142.
  • the intermediate portion 14 including the non-conductor layer 142 containing the fine particles 141 is formed.
  • a known film forming method such as a dry film forming method (eg, sputtering method or vapor deposition method) or a wet film forming method (eg, coating method) is used.
  • the surface of the first electrode 11 is coated with the non-conductor material 142a by a known coating technique such as screen printing or spin coating.
  • the film thickness of the non-conductor material 142a can be arbitrarily set according to the design of the gap G described above.
  • the non-conductor material 142a a known polymeric material having insulating properties such as epoxy resin is used.
  • a thermosetting resin is used, and for example, an ultraviolet curable resin is used.
  • the non-conductor layer 142 may be formed by heating, UV irradiation, or the like on the applied non-conductor material 142a according to the properties of the non-conductor material 142a.
  • the non-conducting material 142a for example, a resin classified as a two-component adhesive according to JIS K 6800 may be used.
  • the non-conductor layer 142 may be formed by mixing the base material of the non-conductor material 142a and a curing agent, leaving the mixture at room temperature for a certain period of time to cure.
  • the non-conductor layer 142 may be formed by processing a solid material or the like into layers and laminating them. In this case, the mechanical strength of the non-conductor layer 142 is likely to be improved as compared with the case of using the film forming method described above. This makes it possible to improve the durability.
  • a nanoparticle material may be mixed in any inorganic material and laser irradiation may be performed. Thereby, the nanoparticles 141 dispersed in the insulating layer 142 are formed to form the intermediate portion 14 .
  • the second electrode forming step S130 forms the second electrode 12 on the non-conductor layer 142, as shown in FIG. 4C, for example.
  • the second electrode 12 is formed using a material having a work function lower than that of the first electrode 11, for example.
  • the second electrode 12 is formed using a known electrode forming technique such as nanoimprinting.
  • the second electrode forming step S130 is formed, for example, on the surface of the non-conductor layer 142 by sputtering or vacuum deposition under a reduced pressure environment.
  • the main surface of the second electrode 12 is in contact with the non-conductor layer 142 without being exposed to the air or the like. Therefore, fluctuations in the work function of the second electrode 12 can be suppressed. This makes it possible to further stabilize the power generation amount.
  • the surface of the second electrode 12 provided in advance on the second substrate 16 is brought into contact with the surface of the non-conductor layer 142 to form the second electrode 12. good too.
  • variations in the surface state of the second electrode 12 due to the surface state of the non-conductor layer 142 can be suppressed compared to the case where the second electrode 12 is formed directly on the surface of the non-conductor layer 142 . This makes it possible to increase the amount of power generation.
  • the second substrate 16 when a film member is used as the second substrate 16, it can be realized by preparing the second substrate 16 coated with the second electrode 12.
  • the second substrate 16 and the second electrode 12 are wound into a roll. It can be prepared as is. After that, for example, before or after the sealing material forming step S140, which will be described later, it may be cut into areas according to the application.
  • the intermediate portion 14 and the second electrode 12 may be heated.
  • the heating of the intermediate portion 14 and the second electrode 12 may be performed, for example, instead of the heating in the intermediate portion forming step S120, or may be performed in addition to the heating in the intermediate portion forming step S120.
  • the surface of the nonconductor layer 142 in contact with the second electrode 12 is easily flattened. Therefore, it is possible to suppress the generation of a slight gap between the non-conductor layer 142 and the second electrode 12 . This makes it possible to increase the amount of power generation.
  • the sealing material forming step S140 may be performed after the element forming step S100.
  • the encapsulant 17 is formed in contact with the first electrode 11, the intermediate portion 14, and the second electrode 12, as shown in FIG. 4D, for example.
  • the encapsulant 17 may be formed using a known technique such as nanoimprinting.
  • an insulating material is used, for example, a known insulating resin such as a fluorine-based insulating resin is used.
  • a known insulating resin such as a fluorine-based insulating resin is used.
  • the sealing material 17 is formed so as to cover the intermediate portion 14, the intermediate portion 14 is not exposed to the outside, so durability can be further improved.
  • the power generating element 1 in the present embodiment is formed by performing the steps described above.
  • a second substrate 16 shown in FIG. 1A may be formed on the second electrode 12 .
  • the power generator 100 in the present embodiment is formed.
  • FIG. 3(b) is a flow chart showing a first modification of the method for manufacturing the power generation element 1 according to this embodiment.
  • the intermediate portion forming step S120 in this modified example includes a film forming step S120a.
  • the film-forming step S ⁇ b>120 a forms the non-conductor layer 142 to form the intermediate portion 14 including the non-conductor layer 142 .
  • the film forming step S120 includes a dry film forming method and a wet film forming method among the methods used in the intermediate portion forming step S120 described above.
  • the non-conductor layer 142 may be formed on the surface of the first electrode 11 by a known coating technique such as screen printing or spin coating.
  • the non-conductor layer 142 may be formed on the first electrode 11, or the non-conductor layer 142 may be formed on a substrate or the like prepared in advance.
  • the non-conductor material 142a described above is formed on the surface of the first electrode 11 or the surface of the substrate, and the non-conductor layer 142 is formed by curing or drying the non-conductor material 142a. You may
  • the intermediate portion 14 includes a non-conductor layer 142 containing fine particles 141 . That is, the non-conductor layer 142 suppresses movement of the fine particles 141 between the electrodes (the first electrode 11 and the second electrode 12). Therefore, it is possible to prevent the fine particles 141 from becoming unevenly distributed on the one electrode side over time and reducing the amount of movement of electrons. This makes it possible to stabilize the power generation amount.
  • the intermediate portion 14 includes the non-conductor layer 142 that supports the first electrode 11 and the second electrode 12 . Therefore, it is necessary to provide a supporting portion or the like for maintaining the distance (gap G) between the electrodes (the first electrode 11 and the second electrode 12) compared to the case where a solvent or the like is used instead of the non-conductor layer 142. Therefore, it is possible to eliminate the variation in the gap G caused by the accuracy of forming the supporting portion. This makes it possible to increase the amount of power generation.
  • the element forming step S100 includes the film forming step S120a of forming the non-conductor layer 142. That is, compared to the case where the material of the non-conductor layer 142 is processed into layers and laminated, the thickness of the non-conductor layer 142 can be easily formed thin, and the distance between the electrodes (first electrode 11, second electrode 12) ( It is easy to narrow the gap G). Therefore, the electric field generated between the electrodes (the first electrode 11 and the second electrode 12) can be increased. This makes it possible to further improve the power generation amount.
  • the film forming step S120a includes forming the non-conductor layer 142 on the first electrode 11 . That is, the contact area of the interface between the non-conductor layer 142 and the first electrode 11 can be easily improved. Therefore, variation in resistance at the interface between the non-conductor layer 142 and the first electrode 11 can be suppressed. This makes it possible to further improve the power generation amount.
  • the sealing material forming step S140 may form the sealing material 17 in contact with the first electrode 11, the intermediate portion 14, and the second electrode 12 after the element forming step S100, for example. good. In this case, deterioration of the non-conductor layer 142 and the fine particles 141 due to the external environment can be suppressed. This makes it possible to improve the durability.
  • the second electrode forming step S130 may form the second electrode 12 on the surface of the non-conductor layer 142 under a reduced pressure environment. In this case, fluctuations in the work function of the second electrode 12 can be suppressed. This makes it possible to further stabilize the power generation amount.
  • the second electrode forming step S130 may bring the surface of the second electrode 12 previously provided on the second substrate 16 into contact with the surface of the non-conductor layer 142. .
  • variations in the surface state of the second electrode 12 due to the surface state of the non-conductor layer 142 can be suppressed compared to the case where the second electrode 12 is formed directly on the surface of the non-conductor layer 142 . This makes it possible to improve the amount of power generation.
  • the non-conductor layer 142 may contain an organic polymer compound.
  • the non-conductor layer 142 can be formed flexibly. Thereby, it is possible to form the power generation element 1 having a shape according to the application.
  • the fine particles 141 may contain metal oxides other than magnetic substances. In this case, it is possible to suppress the decrease in the power generation amount over time without being affected by the magnetic field caused by the external environment.
  • FIG. 5 is a flow chart showing an example of a method for manufacturing a power generating element according to this embodiment.
  • 6(a) and 6(b) are schematic cross-sectional views showing an example of the method for manufacturing the power generating element according to this embodiment.
  • This embodiment differs from the above-described embodiments in that the film forming step S120a includes the coating step S120b and the curing step S120c. The steps other than the film formation step S120a are the same as the steps described above, and thus descriptions thereof are omitted.
  • the film forming step S120a includes a coating step S120b and a curing step S120c.
  • the film forming step S120a may include a curing step S120c after the coating step S120b and the second electrode forming step S130, as shown in FIG. 5, for example.
  • the film forming step S120a may include a curing step S120c before or after at least one of the first electrode forming step S110 and the second electrode forming step S130 after the coating step S120b. can be carried out separately.
  • the film forming step S120a may not include the curing step S120c, and the non-conductor layer 142 may be formed arbitrarily.
  • the applying step S120b applies, for example, the non-conductor material 142a.
  • the non-conductor material 142a is coated on the first electrode 11, as shown in FIG. 6A, for example.
  • the non-conductor material 142a is coated by a known coating technique such as a screen printing method or a spin coating method included in the wet film forming method described above.
  • ⁇ Curing step S120c> In the curing step S120c, for example, as shown in FIG. 6B, the non-conductor material 142a applied in the coating step S120b is cured to form a non-conductor layer 142. As shown in FIG. In the curing step S120c, the nonconductor layer 142 is formed by curing the nonconductor material 142a by a known curing method such as heating or UV irradiation as described above.
  • the non-conductor material 142a may not be completely cured, leaving an uncured portion.
  • the curing step S120c may be performed after the second electrode forming step S130.
  • the curing is facilitated while the contact area between the non-conductor layer 142 and the second electrode 12 is increased. Therefore, variations in resistance at the interfaces between the hardened non-conductor layer 142 and the electrodes 11 and 12 can be suppressed. This makes it possible to further improve the power generation amount.
  • the film forming step S120a includes a coating step S120b of coating the non-conductor material 142a. That is, the non-conductor layer 142 can be formed over a larger area than the dry film forming method without requiring a vacuum device. Therefore, the size of the power generation element 1 can be increased. This makes it possible to further improve the power generation amount.
  • the film formation step S120a includes a curing step S120c for curing the non-conductor material 142a to form the non-conductor layer 142 after the application step 120b. That is, the hardened non-conductor layer 142 further suppresses movement of the fine particles 141 between the electrodes (the first electrode 11 and the second electrode 12). Therefore, it is possible to further suppress the decrease in the amount of movement of electrons due to uneven distribution of the fine particles 141 on the one electrode side over time. This makes it possible to further stabilize the power generation amount.
  • FIG. 7 is a flow chart showing an example of a method for manufacturing the power generating element 1 according to this embodiment.
  • 8A to 8E are schematic cross-sectional views showing an example of a method for manufacturing the power generation element 1 according to this embodiment.
  • This embodiment includes the point that the applying step S120b is performed before the first electrode forming step S110 and the second electrode forming step S130, and the substrate separating step S120b' for separating the substrate 18 from the non-conductive material 142a. This is different from the above-described embodiment in this respect.
  • description is abbreviate
  • the film forming step S120a includes a substrate separating step S120b' for separating the substrate 18 from the applied non-conductive material 142a after the applying step S120b, as shown in FIG. 7, for example.
  • the coating step S120b is performed before the first electrode forming step S110 and the second electrode forming step S130, as shown in FIG. 7, for example.
  • the coating step S120b for example, as shown in FIG.
  • the first electrode 11 is formed before the substrate separation step S120b' described later.
  • the first electrode 11 is formed on the first main surface 142f of the non-conductive material 142a applied on the substrate 18, as shown in FIG. 8B, for example.
  • the applied nonconductor material 142a may be subjected to any method including the curing step S120c to form the nonconductor layer 142.
  • the first electrode forming step S110 may form the first electrode 11 on the first major surface 142f of the non-conductor layer 142 .
  • the surface of the first electrode 11 provided in advance on the first substrate 15 is brought into contact with the surface of the non-conductor layer 142 to form the first electrode. good.
  • the first electrode 11 is directly formed on the surface of the non-conductor layer 142
  • variations in the surface state of the first electrode 11 due to the surface state of the non-conductor layer 142 can be suppressed. This makes it possible to increase the amount of power generation.
  • ⁇ Base material separation step S120b'> the substrate 18 is separated from the non-conductor material 142a after the application step S120b and the first electrode formation step S110, as shown in FIG. 8C, for example. Note that the dotted arrow in FIG. 8C illustrates the direction in which the substrate 18 is separated.
  • the nonconductor layer 142 may be formed by performing any method including the curing step S120c on the applied nonconductor material 142a.
  • the substrate separating step S120b' may separate the substrate 18 from the non-conductor layer 142.
  • the second electrode 12 is formed after the substrate separation step S120b', as shown in FIGS. 8(c) and 8(d), for example.
  • the second electrode 12 is formed on the second main surface 142g of the non-conductor material 142a.
  • the nonconductor layer 142 may be formed by performing any method including the curing step S120c on the applied nonconductor material 142a.
  • the second electrode forming step S ⁇ b>130 may form the second electrode 12 on the second main surface 142 g of the nonconductor layer 142 .
  • ⁇ Curing step S120c> the non-conductor material 142a is cured to form the non-conductor layer 142 after the second electrode formation step S130, as shown in FIG. 8E, for example.
  • the curing step S120c may be performed after the applying step S120b, for example, before or after the first electrode forming step S120, the substrate separating step S120b′, and the second electrode forming step S130. can be carried out separately.
  • the deposition step S120a includes depositing the non-conductor layer 142 on the base material 18 . That is, the first electrode 11 is not affected by the formation of the non-conductor layer 142 . For this reason, quality deterioration such as a change in the work function of the first electrode 11 can be suppressed. This makes it possible to further improve the power generation amount.
  • the element forming step S100 includes the substrate separating step S120b′ for separating the substrate 18 and the first electrode forming step S120b′ for forming the first electrode 11 before the substrate separating step S120b′. It includes a step S110 and a second electrode forming step S130 of forming the second electrode 12 after the substrate separating step S120b'. That is, before the first electrode 11 is formed, the surface of the non-conductor layer 142 that is in contact with the first electrode 11 is exposed to the air for a short period of time. For this reason, it is possible to suppress the entry of foreign matter into the non-conductor layer 142 and the like. As a result, it is possible to improve the non-defective product rate.
  • FIG. 9(a) and 9(b) are schematic cross-sectional views showing an example of a method for manufacturing the power generating element 1 according to this embodiment.
  • This embodiment is different from the above-described embodiments in that the substrate separating step S120b' is performed before the first electrode forming step S110.
  • the steps other than the substrate separating step S120b' and the first electrode forming step S110 are the same as the steps described above, and thus descriptions thereof are omitted.
  • the substrate 18 is separated from the non-conductor material 142a after the application step S120b and before the first electrode formation step S110, as shown in FIG. 9A, for example.
  • the dotted arrow in FIG. 9A illustrates the direction in which the substrate 18 is separated.
  • the first electrode 11 is formed after the substrate separation step S120b', as shown in FIGS. 9A and 9B, for example.
  • the first electrode 11 is formed on the first main surface 142f of the non-conductor material 142a separated from the substrate 18. As shown in FIG. 9B, the first electrode 11 is formed on the first main surface 142f of the non-conductor material 142a separated from the substrate 18. As shown in FIG. 9B, the first electrode 11 is formed on the first main surface 142f of the non-conductor material 142a separated from the substrate 18. As shown in FIG.
  • the above-described second electrode forming step S130 is performed.
  • the element forming step S100 includes a substrate separating step S120b′ for separating the substrate 18, and a first electrode forming step S110 for forming the first electrode 11 after the substrate separating step S120b′. and a second electrode forming step S130 of forming the second electrode 12 after the substrate separating step S120b′. That is, since the first electrode 11 and the second electrode 12 can be freely selected after the substrate 18 is separated, the film forming step S120a included in the plurality of element forming steps S100 can be collectively performed in advance. Therefore, the number of times the film formation step S120a is performed can be reduced with respect to the number of times the element formation step S100 is performed. This makes it possible to simplify the manufacturing process.
  • FIG. 10(a) and 10(b) are schematic cross-sectional views showing an example of a method for manufacturing the power generation element 1 according to this embodiment.
  • This embodiment differs from the above-described embodiments in that the film formation step S120a includes a processing step S120d for smoothing the surface of the non-conductor material 142a after the coating step S120b.
  • the steps other than the film formation step S120a are the same as the steps described above, and thus descriptions thereof are omitted.
  • the film forming step S120a includes a processing step S120d.
  • the film forming step S120a may include a curing step S120c after the coating step S120b, for example, after the processing step S120d, and the curing step S120c may be divided into a plurality of steps.
  • the surface of the non-conductor material 142a is smoothed.
  • the processing member 19 is applied to the second main surface 142g of the non-conductor material 142a, and, for example, as shown in FIG.
  • the surface of the non-conducting material 142a may be smoothed by a drawing method.
  • a water-repellent glass material is used as the processing member 19, for example.
  • the dotted arrow in FIG. 10(a) illustrates the direction in which the glass material is pulled out.
  • the processing step S120d is performed after the applying step S120b and before forming the second electrode 12 on the second main surface 142g of the non-conductor material 142a, as shown in FIGS. 10A and 10B, for example.
  • the surface of the second main surface 142g of the non-conductor material 142a may be smoothed.
  • the contact area of the interface between the non-conductor layer 142 and the second electrode 12 can be easily improved. Therefore, variation in resistance at the interface between the non-conductor layer 142 and the second electrode 12 can be suppressed. This makes it possible to improve the amount of power generation.
  • the surface of the first main surface 142f of the non-conductor material 142a is smoothed. May be processed.
  • the contact area of the interface between the non-conductor layer 142 and the first electrode 11 can be easily improved. Therefore, variation in resistance at the interface between the non-conductor layer 142 and the first electrode 11 can be suppressed. This makes it possible to improve the amount of power generation.
  • the film forming step S120a includes a processing step S120d for smoothing the surface of the non-conductor material 142a after the coating step S120b. That is, the contact area of the interface between the non-conductor layer 142 and the first electrode 11 or the interface between the non-conductor layer 142 and the second electrode 12 can be easily improved. Therefore, variations in resistance at the interfaces between the non-conductor layer 142 and the electrodes 11 and 12 can be suppressed. This makes it possible to further improve the power generation amount.
  • FIG. 11(a) is a flowchart showing an example of the method for manufacturing the power generation element 1 according to this embodiment
  • FIG. 11(b) is a flowchart showing a first modification of the method for manufacturing the power generation element 1 according to this embodiment. is.
  • This embodiment differs from the above-described embodiments in that the film formation step S120a includes a drying step S120e for removing the diluent contained in the non-conductor material 142a after the coating step S120b.
  • the steps other than the film formation step S120a are the same as the steps described above, and thus descriptions thereof are omitted.
  • the film formation step S120a includes a drying step S120e, as shown in FIGS. 11(a) to 11(b), for example.
  • the film forming step S120a may include a curing step S120c after the coating step S120b, for example, after the drying step S120e, and the curing step S120c may be divided into a plurality of steps.
  • the drying step S120e removes the diluent contained in the non-conducting material 142a, for example after the applying step 120b.
  • the drying step S120e is performed using a known drying device such as a hot air drying furnace.
  • the drying step S120e may not, for example, completely remove the diluent contained in the non-conductive material 142a, leaving a diluent residue.
  • the drying step S120e is performed before or after at least one of the first electrode forming step S110, the applying step S120b, the substrate separation step S120b', the processing step S120d, and the second electrode forming step S130, if the drying step S120e is after the coating step S120b. It may be divided into multiple parts and implemented.
  • the drying step S120e may be performed, for example, before the first electrode forming step S110.
  • the first electrode 11 is not affected by the drying of the non-conducting material 142a. Therefore, change in the work function of the first electrode 11 can be suppressed. This makes it possible to improve the amount of power generation.
  • the drying step S120e may be performed, for example, before the second electrode forming step S130.
  • the diluent is less likely to remain than when the second electrode 12 is formed on the second main surface 142g of the non-conductor material 142a. That is, the region containing the diluent in the intermediate portion 14 can be reduced, and the movement of the fine particles 141 via the diluent can be suppressed. Therefore, it is possible to further suppress the decrease in the amount of movement of electrons due to uneven distribution of the fine particles 141 on the one electrode side over time. This makes it possible to further stabilize the power generation amount.
  • the drying step S120e may be performed, for example, after the second electrode forming step S130.
  • the contact area between the non-conductor layer 142 and the second electrode 12 can be easily improved compared to the case where the second electrode 12 is not formed on the second main surface 142g of the non-conductor material 142a. Therefore, variations in resistance at the interfaces between the non-conductor layer 142 and the electrodes 11 and 12 can be suppressed. This makes it possible to improve the amount of power generation.
  • the film forming step S120a includes a drying step S120e for removing the diluent contained in the non-conductor material 142a after the applying step 120b. That is, the region containing the diluent in the non-conductor layer 142 can be reduced, and the movement of the fine particles 141 via the diluent can be suppressed. Therefore, it is possible to further suppress the decrease in the amount of movement of electrons due to uneven distribution of the fine particles 141 on the one electrode side over time. This makes it possible to further stabilize the power generation amount.
  • the power generation element 1 and the power generation device 100 described above can be mounted on, for example, an electronic device. Some embodiments of the electronic device are described below.
  • FIGS. 13(a) to 13(d) are schematic block diagrams showing an example of an electronic device 500 including the power generation element 1.
  • FIG. 13(e) to 13(h) are schematic block diagrams showing an example of an electronic device 500 having a power generation device 100 including the power generation element 1.
  • FIG. 13(e) to 13(h) are schematic block diagrams showing an example of an electronic device 500 having a power generation device 100 including the power generation element 1.
  • an electronic device 500 (electric product) includes an electronic component 501 (electronic component), a main power supply 502 and an auxiliary power supply 503 .
  • Each of the electronic device 500 and the electronic component 501 is an electrical device.
  • the electronic component 501 is driven using the main power supply 502 as a power supply.
  • Examples of the electronic component 501 include, for example, a CPU, motors, sensor terminals, lighting, and the like. If electronic component 501 is, for example, a CPU, electronic device 500 includes an electronic device that can be controlled by a built-in master (CPU). If the electronic components 501 include at least one of, for example, motors, sensor terminals, and lighting, the electronic device 500 includes electronic devices that can be controlled by an external master or person.
  • the main power supply 502 is, for example, a battery. Batteries also include rechargeable batteries. A plus terminal (+) of the main power supply 502 is electrically connected to a Vcc terminal (Vcc) of the electronic component 501 . A negative terminal ( ⁇ ) of the main power supply 502 is electrically connected to a GND terminal (GND) of the electronic component 501 .
  • Vcc Vcc terminal
  • GND GND terminal
  • the auxiliary power supply 503 is the power generation element 1.
  • the power generation element 1 includes at least one power generation element 1 described above.
  • the auxiliary power supply 503 is used, for example, together with the main power supply 502, and is used as a power supply for assisting the main power supply 502 or as a power supply for backing up the main power supply 502 when the capacity of the main power supply 502 runs out. be able to. If the main power source 502 is a rechargeable battery, the auxiliary power source 503 can also be used as a power source for charging the battery.
  • the main power supply 502 may be the power generating element 1.
  • An electronic device 500 shown in FIG. 13B includes a power generation element 1 used as a main power supply 502 and an electronic component 501 that can be driven using the power generation element 1 .
  • the power generation element 1 is an independent power supply (for example, an off-grid power supply). Therefore, the electronic device 500 can be, for example, an independent type (standalone type).
  • the power generating element 1 is of the energy harvesting type.
  • the electronic device 500 shown in FIG. 13B does not require battery replacement.
  • the electronic component 501 may include the power generation element 1 as shown in FIG. 13(c).
  • the anode of the power generation element 1 is electrically connected to, for example, a GND wiring of a circuit board (not shown).
  • the cathode of the power generation element 1 is electrically connected to, for example, Vcc wiring of a circuit board (not shown).
  • the power generating element 1 can be used as, for example, an auxiliary power source 503 for the electronic component 501 .
  • the power generation element 1 can be used as the main power source 502 of the electronic component 501, for example.
  • the electronic device 500 may include the power generator 100.
  • the power generation device 100 includes a power generation element 1 as a source of electrical energy.
  • the embodiment shown in FIG. 13(d) includes a power generation element 1 in which an electronic component 501 is used as a main power supply 502.
  • the embodiment shown in FIG. 13(h) comprises a generator 100 in which electronic component 501 is used as the main power source.
  • electronic component 501 has an independent power supply. Therefore, the electronic component 501 can be made self-supporting, for example. Free-standing electronic component 501 can be effectively used, for example, in an electronic device that includes multiple electronic components and in which at least one electronic component is separate from another electronic component.
  • An example of such electronics 500 is a sensor.
  • the sensor has a sensor terminal (slave) and a controller (master) remote from the sensor terminal. Each of the sensor terminals and controller is an electronic component 501 .
  • a sensor terminal can also be regarded as one of the electronic devices 500 .
  • the sensor terminals considered electronic equipment 500 further include, for example, IoT wireless tags, etc., in addition to sensor terminals of sensors.
  • the electronic device 500 includes a power generation element 1 that converts thermal energy into electrical energy, and uses the power generation element 1 as a power source. and an electronic component 501 that can be driven.
  • the electronic device 500 may be an autonomous type with an independent power supply.
  • autonomous electronic devices include, for example, robots.
  • the electronic component 501 with the power generation element 1 or the power generation device 100 may be autonomous with an independent power supply.
  • autonomous electronic components include, for example, movable sensor terminals.

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Abstract

Le problème décrit par la présente invention est de fournir un procédé de production d'un élément de génération d'énergie, un élément de génération d'énergie, un dispositif de génération d'énergie et un dispositif électronique qui permettent d'améliorer la stabilité de quantité de génération d'énergie. La solution selon l'invention porte sur un procédé de production d'un élément de génération d'énergie qui rend inutile une différence de température entre des électrodes (première électrode 11, seconde électrode 12) lors de la conversion de l'énergie thermique en énergie électrique, ledit procédé étant caractérisé en ce qu'il comporte une étape de formation d'élément consistant à former une première électrode 11, une seconde électrode qui a une fonction de travail différente de celle de la première électrode, et une partie intermédiaire 14 qui est prise en sandwich entre la première électrode 11 et la seconde électrode 12, et en ce que la partie intermédiaire 14 comprend une couche non conductrice qui contient en son sein de fines particules et qui supporte la première électrode 11 et la seconde électrode 12. L'étape de formation d'éléments est caractérisée en ce qu'elle comprend une étape de formation de film pour former la couche non conductrice.
PCT/JP2022/033833 2021-09-10 2022-09-09 Procédé de production d'élément de génération d'énergie, élément de génération d'énergie, dispositif de génération d'énergie et dispositif électronique Ceased WO2023038105A1 (fr)

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JP2021147809A JP7011361B1 (ja) 2021-09-10 2021-09-10 発電素子の製造方法、発電素子、発電装置、及び電子機器
JP2021-147809 2021-09-10
JP2021211371 2021-12-24
JP2021-211371 2021-12-24

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006273948A (ja) * 2005-03-28 2006-10-12 Mitsui Chemicals Inc 熱伝導性樹脂組成物およびその用途
JP2010245299A (ja) * 2009-04-06 2010-10-28 Three M Innovative Properties Co 複合材熱電材料及びその製造方法
WO2019088001A1 (fr) * 2017-10-31 2019-05-09 株式会社Ｇｃｅインスティチュート Élément thermoélectrique, dispositif de production d'énergie et procédé de production d'élément thermoélectrique
WO2019088002A1 (fr) * 2017-10-31 2019-05-09 株式会社Ｇｃｅインスティチュート Élément thermoélectrique, dispositif de production d'énergie et procédé de production d'élément thermoélectrique

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006273948A (ja) * 2005-03-28 2006-10-12 Mitsui Chemicals Inc 熱伝導性樹脂組成物およびその用途
JP2010245299A (ja) * 2009-04-06 2010-10-28 Three M Innovative Properties Co 複合材熱電材料及びその製造方法
WO2019088001A1 (fr) * 2017-10-31 2019-05-09 株式会社Ｇｃｅインスティチュート Élément thermoélectrique, dispositif de production d'énergie et procédé de production d'élément thermoélectrique
WO2019088002A1 (fr) * 2017-10-31 2019-05-09 株式会社Ｇｃｅインスティチュート Élément thermoélectrique, dispositif de production d'énergie et procédé de production d'élément thermoélectrique

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