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WO2023035761A1 - 散热器固定结构及板级散热装置 - Google Patents

散热器固定结构及板级散热装置 Download PDF

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Publication number
WO2023035761A1
WO2023035761A1 PCT/CN2022/104895 CN2022104895W WO2023035761A1 WO 2023035761 A1 WO2023035761 A1 WO 2023035761A1 CN 2022104895 W CN2022104895 W CN 2022104895W WO 2023035761 A1 WO2023035761 A1 WO 2023035761A1
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WO
WIPO (PCT)
Prior art keywords
floating
radiator
frame
heat sink
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2022/104895
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English (en)
French (fr)
Inventor
张伟锋
张显明
王志达
伍锡杰
郭彦华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZTE Corp
Original Assignee
ZTE Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZTE Corp filed Critical ZTE Corp
Priority to EP22866236.7A priority Critical patent/EP4401129A4/en
Priority to US18/689,584 priority patent/US20250125219A1/en
Publication of WO2023035761A1 publication Critical patent/WO2023035761A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H10W40/60—
    • H10W40/641—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H10W40/226—
    • H10W40/77—
    • H10W70/60—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10522—Adjacent components
    • H10W40/22—

Definitions

  • the present disclosure relates to the technical field of heat dissipation, and in particular to a radiator fixing structure and a board-level heat dissipation device.
  • a heat sink covers multiple semiconductor elements, some semiconductor elements will not be in contact with the heat sink substrate. Usually, it is necessary to fill a thermal pad between the upper surface of the semiconductor element and the bottom of the heat sink, but this will increase the thermal resistance, making the The heat dissipation effect of semiconductor components is not ideal. If each semiconductor element is provided with a heat sink, although the heat dissipation of the semiconductor element is guaranteed, it is necessary to increase the number of openings on the printed integrated circuit board, and more openings will increase the layout and wiring of the integrated circuit board. The difficulty will also increase the probability of failure of the integrated circuit board.
  • the embodiment of the present disclosure provides a heat sink fixing structure and a board-level heat dissipation device, aiming to solve how to efficiently dissipate heat from semiconductor elements on an integrated circuit board without increasing the difficulty of layout and wiring of the integrated circuit board, so as to ensure the long-term reliability of the integrated circuit board .
  • an embodiment of the present disclosure provides a radiator fixing structure, including: a support structure and a floating structure; the support structure includes a first support for providing support for semiconductor elements, and a second support arranged at a distance from the first support.
  • the second supporting member; the radiator is arranged corresponding to the semiconductor element, and is floatingly connected with the second supporting member through a floating structure.
  • an embodiment of the present disclosure provides a board-level heat dissipation device, including: an integrated circuit board, the integrated circuit board is provided with a plurality of semiconductor elements; the above-mentioned radiator fixing structure, the radiator fixing structure and the radiator and the integrated circuit board connected so that the heat sink dissipates heat from the semiconductor components.
  • the disclosure provides a radiator fixing structure and a board-level heat dissipation device.
  • the semiconductor element is carried by the first support member, and the radiator is carried by the second support member, so that the radiator and the semiconductor element are separately arranged, so as to reduce The number of openings near the semiconductor element reduces the difficulty of routing the integrated circuit board, and at the same time reduces the stress on the integrated circuit board.
  • the radiator is connected to the second supporting member in a floating structure, so that the radiator can be adapted to semiconductor elements of different heights and tolerances, effectively reducing the temperature of the semiconductor element and improving its long-term reliability.
  • FIG. 1 is a schematic structural diagram of a first viewing angle of a board-level heat sink provided according to an embodiment of the present disclosure
  • FIG. 2 is a schematic structural diagram of a second viewing angle of a board-level heat sink provided according to an embodiment of the present disclosure
  • FIG. 3 is a schematic structural diagram of a board-level heat sink provided according to an embodiment of the present disclosure
  • Fig. 4 is a partial schematic diagram of area A in Fig. 3;
  • Fig. 5 is a schematic structural diagram of a first floating member provided according to an embodiment of the present disclosure.
  • FIG. 6 is a schematic structural diagram of another board-level heat sink provided according to an embodiment of the present disclosure.
  • Fig. 7 is a schematic diagram of coordination of a floating positioning member, a heat sink, and a second floating member according to an embodiment of the present disclosure
  • FIG. 8 is a schematic diagram of cooperation of another floating positioning element, a heat sink, and a second floating element according to an embodiment of the present disclosure.
  • 201 printed circuit board
  • 202 semiconductor element
  • 203 heat conduction layer
  • connection part connection part
  • 1212 deformation part
  • 141 contact part
  • the board-level heat sink 1 provided by the embodiment of the present disclosure includes a heat sink fixing structure 100 and an integrated circuit board 200 .
  • the radiator fixing structure 100 includes a supporting structure 11 and a floating structure 12 for connecting the radiator 13 and the integrated circuit board 200 .
  • the support structure 11 is used to provide support for the integrated circuit board 200 and the radiator 13.
  • the integrated circuit board 200 is provided with a plurality of semiconductor elements 202, and the radiator 13 is arranged corresponding to the semiconductor elements 202, and is floatingly connected to the support structure 11 through the floating structure 12. So that the heat sink 13 can adapt to semiconductor elements 202 of different heights.
  • the support structure 11 includes a first support piece 111 and a second support piece 112 , and the first support piece 111 and the second support piece 112 are connected and arranged at intervals.
  • the first support 111 is used to carry the integrated circuit board 200
  • the second support 112 is floatingly connected with the heat sink 13 through the floating structure 12, so that when the heat sink 13 performs heat dissipation treatment on semiconductor elements 202 of different heights, it can pass through the floating structure 12 moves in the first direction to adapt to semiconductor elements 202 of different heights, and at the same time, the elastic force provided by the floating structure 12 makes the heat sink 13 close to the semiconductor element 202 to ensure the heat dissipation effect.
  • the first direction is the thickness direction of the radiator 13 .
  • the integrated circuit board 200 includes a printed circuit board 201 and a semiconductor element 202 connected to the printed circuit board 201 , and the radiator 13 is disposed corresponding to the semiconductor element 202 .
  • the printed circuit board 201 is provided with a plurality of through holes, and the corresponding through holes are provided with connectors 113, and the connectors 113 are respectively connected to the first supporting member 111 and the second supporting member 112 through the through holes, and the printed circuit board 201 is provided with Between the first supporting member 111 and the second supporting member 112 , the integrated circuit board 200 is limited by through holes. By separating the first support member 111 from the integrated circuit board 200 , the stress on the integrated circuit board 200 is reduced, preventing the integrated circuit board 200 from being deformed by external force, and prolonging the service life of the integrated circuit board 200 .
  • a heat conduction layer 203 is arranged between the heat sink 13 and the semiconductor element 202, the first surface of the heat conduction layer 203 is in contact with the heat sink 13, and the second surface of the heat conduction layer 203 opposite to the first surface is in contact with the semiconductor element 202. touch.
  • the heat conduction layer 203 is used to transmit the heat generated by the semiconductor element 202 , and transfer the heat generated by the semiconductor element 202 to the heat sink 13 , so as to complete the heat dissipation of the semiconductor element 202 through the heat sink 13 .
  • the heat conduction layer 203 includes but not limited to heat conduction silica gel.
  • the radiator 13 is floatingly connected to the second support member 112 through the floating structure 12, so that the radiator 13 is adapted to semiconductor elements 202 of different heights, thereby reducing the thickness of the heat conduction layer 203, so that the heat generated by the semiconductor element 202 is transferred to
  • the thermal resistance during the transfer process of the heat sink 13 is reduced, that is, it avoids the situation that the heat transfer is hindered because the heat conduction layer 203 is too thick, and the heat dissipation effect of the semiconductor element 202 is improved.
  • the radiator fixing device 100 can be connected to multiple radiators 13, and the multiple radiators 13 can be arranged on the second support member 112 in series or in parallel, so as to support the first support member 111 at the same time.
  • the plurality of semiconductor elements 202 on the top are dissipating heat at the same time.
  • the radiator 13 includes but is not limited to a liquid-cooled radiator, an air-cooled radiator, etc.
  • the number and arrangement of the radiators 13 can be selected according to specific usage scenarios, which are not limited in the embodiments of the present disclosure.
  • the support structure 11 may include different materials, such as metal, plastic, and ceramics, which may be selected according to specific usage scenarios, which are not limited in this embodiment of the present disclosure.
  • the integrated circuit board 200 is carried by the first support member 111, and the radiator 13 is carried by the second support member 112.
  • the radiator 13 and the integrated circuit board 200 are separately arranged to reduce the number of openings on the integrated circuit board 200, thereby reducing the The wiring difficulty of the integrated circuit board 200 is reduced, and the stress on the integrated circuit board 200 is reduced, thereby ensuring the long-term reliability of the integrated circuit board 200 .
  • the radiator 13 is floatingly connected to the second support member 112 through the floating structure 12 , so that the radiator 13 can adapt to semiconductor elements 202 of different heights while ensuring the heat dissipation effect.
  • the second support member 112 is disposed between the radiator 13 and the first support member 111
  • the floating structure 12 includes at least two first floating members 121
  • the radiator 13 and the first support member 111 One of the second support members 112 is provided with a limiting hole 14
  • the other of the radiator 13 and the second support member 112 is connected to the first floating member 121 .
  • the limiting hole 14 and the first floating member 121 form a limiting fit, so as to make the second supporting member 112 and the radiator 13 float and fit through the limiting hole 14 and the first floating member 121 .
  • the second supporting member 112 is connected to the first floating member 121 .
  • the radiator 13 is connected to the first floating member 121 .
  • the distance between the first support 111 and the second support 112 is smaller than the height of the semiconductor element 202 .
  • the heat sink 13 can float relative to the semiconductor device 202 through the first floating member 121 and the limiting hole 14 to adapt to semiconductor devices 202 of different heights.
  • the first floating member 121 includes a connection portion 1211 and a deformation portion 1212, the deformation portion 1212 and the connection portion 1211 are arranged at an angle, and one end of the connection portion 1211 is connected to the second support member 112 is connected to one of the heat sinks 13 , and the other end of the connecting portion 1211 passes through the limiting hole 14 and is connected to one end of the deforming portion 1212 .
  • the heat sink 13 is provided with the limiting hole 14 and the second supporting member 112 is connected to the first floating member 121 as an example for illustration.
  • an abutment portion 141 is provided around the limiting hole 14 , and the other end of the deformation portion 1212 abuts on the abutment portion 141 , and the deformation portion 1212 is limited by the abutment portion 141 .
  • the heat sink 13 moves away from the second supporting member 112, and at the same time, the angle between the connecting portion 1211 and the deforming portion 1212 of the first floating member 121 increases, and through the first The elastic force provided by the floating member 121 makes the heat sink 13 close to the semiconductor device 202 .
  • the heat sink 13 moves toward the second supporting member 112, and at the same time, the angle between the connecting portion 1211 and the deforming portion 1212 of the first floating member 121 decreases, and through the first The elastic force provided by the floating member 121 makes the heat sink 13 close to the semiconductor element 202 .
  • the heat sink 13 is adapted to semiconductor elements 202 of different heights, so as to ensure the heat dissipation effect of the heat sink 13 .
  • first floating members 121 there are multiple first floating members 121, and the plurality of first floating members 121 are arranged in a ring shape, so that the connecting part 1211 is provided with a plurality of deformation parts 1212, and then the radiator When the heat sink 13 is subjected to an external force, the plurality of deformation portions 1212 provide elastic force at the same time, so as to prevent the unbalanced assembly between the heat sink 13 and the semiconductor element 202 due to unbalanced force.
  • the first floating elements 121 are at least disposed on opposite sides of the heat sink 13, and each side is provided with at least two first floating elements 121, so as to prevent the heat sink 13 and the semiconductor element 202 from being affected by Unbalanced force, resulting in an unbalanced assembly.
  • the radiator 13 can be floated by changing the included angle.
  • the use of screws is avoided, so that there is no stress concentration in the second support member 112 , thereby avoiding the deformation of the second support member 112 due to stress, and prolonging the service life of the second support member 112 .
  • the radiator 13 is disposed between the first support 111 and the second support 112
  • the floating structure 12 includes a second floating 122 and a floating positioning 123, the floating positioning The part 123 is connected with the second supporting part 112, one end of the second floating part 122 is connected with the floating positioning part 123, and the other end of the second floating part 122 is connected with the radiator 13, so that the radiator 13 and the radiator 122 are connected by the second floating part 122.
  • the second support 112 is a floating fit.
  • the radiator 13 By disposing the radiator 13 between the first support member 111 and the second support member 112, and fixing the second floating member 122 through the floating positioning member 123 connected with the second support member 112, not only the second floating member 122 is reduced In addition, the pressure transmitted by the second floating member 122 is distributed to the second supporting member 112 through the floating positioning member 123, so that the overall structure of the radiator fixing device 100 is more firm.
  • the second supporting member 112 includes a first frame 1121 , a second frame 1122 , a third frame 1123 , and a fourth frame 1124 .
  • the first frame 1121 is connected with the second frame 1122 and the fourth frame 1124, and the second frame 1122 and the fourth frame 1124 are arranged at intervals
  • the third frame 1123 is connected with the second frame 1122 and the fourth frame 1124
  • the third frame 1123 Set apart from the first frame 1121 .
  • the first frame 1121 , the second frame 1122 , the third frame 1123 , and the fourth frame 1124 form an opening 15
  • the radiator 13 is disposed corresponding to the opening 15 .
  • the floating positioning part 123 includes a first positioning part 1231 and a second positioning part 1232 , and the first positioning part 1231 and the second positioning part 1232 intersect. Wherein, opposite ends of the first positioning member 1231 are respectively connected to at least two of the first frame 1121, the second frame 1122, the third frame 1123, and the fourth frame 1124, and the two ends of the second positioning member 1232 are respectively connected to At least two of the first frame 1121 , the second frame 1122 , the third frame 1123 , and the fourth frame 1124 are connected, and the second floating member 122 is disposed at the intersection of the first positioning member 1231 and the second positioning member 1232 .
  • one end of the first positioning member 1231 is connected to the junction of the first frame 1121 and the second frame 1122, and the other end of the first positioning member 1231 is connected to the third frame 1123 and the second frame 1123.
  • the joints of the four frames 1124 are connected, one end of the second positioning member 1232 is connected to the joints of the second frame 1122 and the third frame 1123, and the other end of the second positioning member 1232 is connected to the first frame 1121 and the fourth frame 1124 are connected, the first positioning member 1231 and the second positioning member 1232 intersect at point C, and the second floating member 122 is disposed at point C.
  • first positioning member 1231 and the second positioning member 1232 may be integrally provided with the second support member 112 or independently provided with the second support member 112 , which is not limited in this embodiment of the present disclosure.
  • the contact area between the radiator 13 and the outside air is increased, which is beneficial to the air circulation of the radiator 13, thereby improving the heat dissipation efficiency.
  • the pressure transmitted by the second floating member 122 is evenly distributed to the second supporting member 112, and the pressure passed by the first positioning member.
  • the intersection design of 1231 and the second positioning part 1232 divides the second supporting part 112 into multiple triangles, so as to make the second supporting part 112 stronger and prolong the service life of the second supporting part 112 .
  • the intersection point C of the first positioning member 1231 and the second positioning member 1232 is located in the center area of the projection of the radiator 13 in the first direction, that is, the second floating member 122 is set In the central area of the heat sink 13 projected in the first direction.
  • the second floating member 122 includes a first limiting member 1221 , a second limiting member 1222 , and an elastic member 1223 .
  • the first limiting member 1221 is connected to one of the floating positioning member 123 and the radiator 13, and the second limiting member 1222 is connected to the other of the floating positioning member 123 and the radiator 13, and is connected to the first limiting member.
  • 1221 forms a position-limiting fit
  • the elastic member 1223 is arranged between the first position-limiting unit 1221 and the second position-limiting unit 1222 , and the radiator 13 and the second supporting member 112 are float-fitted through the elastic unit 1223 .
  • the elastic member 1223 includes but is not limited to a spring, a shrapnel and the like.
  • the first limiting member 1221 is formed with an accommodating chamber 1224 with an opening, one end of the elastic member 1223 and the second limiting member 1222 are accommodated in the accommodating cavity 1224, the other end of the second limiting member 1222 is connected to the second One of the support member 112 and the heat sink 13 is connected.
  • the elastic force provided by the elastic member 1223 makes one end of the second limiting member 1222 move in the receiving cavity 1224 .
  • the size and shape of the accommodating cavity 1224 are adapted to the size and shape of the second limiting member 1222 .
  • the size and shape of the second limiting member 1222 can be selected according to a specific use scenario, which is not limited in this embodiment of the present disclosure.
  • first limiting part 1221 is provided with a first limiting part 1225
  • second limiting part 1222 is provided with a second limiting part 1226, through the first limiting part 1225 and the second The limiting portion 1226 forms a limiting fit.
  • the heat sink 13 can move stably under the action of external force, further preventing the radiator 13 from being out of balance with the semiconductor element 202 .
  • the disassembly and assembly of the first limiting member 1221, the second limiting member 1222, and the elastic member 1223 is simple, and at the same time, the radiator 13 and the second supporting member 112 are avoided from being perforated, and the first limiting member 1221, the second supporting member 112 are directly passed through.
  • the second limiting part 1222 and the elastic part 1223 can realize the floating fit between the radiator 13 and the second supporting part 112, so that there is no stress concentration in the radiator 13 and the second supporting part 112, and the length of the radiator is extended. 13 and the service life of the second support 112.
  • connection can be a fixed connection, a detachable connection, or an integral connection ; It can be directly connected or indirectly connected through an intermediary.
  • connection can be a fixed connection, a detachable connection, or an integral connection ; It can be directly connected or indirectly connected through an intermediary.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

本公开实施例公开了一种散热器固定结构及板级散热装置，散热器固定结构包括支撑结构及浮动结构；支撑结构包括用于为半导体元件提供支撑的第一支撑件、及与第一支撑件间隔设置的第二支撑件；散热器对应半导体元件设置，并通过浮动结构与第二支撑件浮动连接。通过第一支撑件承载半导体元件，第二支撑件承载散热器，将散热器和半导体元件进行分离设置，以减少集成电路板上半导体元件附近的开孔数量，进而减小了集成电路板的布线难度，同时减小了集成电路板承受的应力，提高长期可靠性。且通过浮动结构将散热器与第二支撑件进行浮动连接，使散热器适配不同高度和公差的半导体元件，有效降低半导体元件温度，提升其长期可靠性。

Description

散热器固定结构及板级散热装置
相关申请的交叉引用
本公开基于2021年9月7日提交的发明名称为“散热器固定结构及板级散热装置”的中国专利申请CN202111041133.X，并且要求该专利申请的优先权，通过引用将其所公开的内容全部并入本公开。
技术领域
本公开涉及散热技术领域，尤其涉及一种散热器固定结构及板级散热装置。
背景技术
随着科技的进步，集成电路在不断的改进、发展下，体积不断减小，在功能上则不断提高，但是在提升功能的同时，集成电路所需要的半导体元件越来越多，半导体空间的设计也愈趋严谨与重要。
且因为印制集成电路板上通常集成有多个半导体元件，这些半导体元件在工作时会产生大量热量，所以需要对半导体元件进行散热处理。由于散热器基板和半导体元件底部集成电路板之间的距离是固定的，而每个半导体元件之间会存在高度差异。
如果一个散热器覆盖多个半导体元件，则会造成部分半导体元件不能和散热器基板接触，通常需要在半导体元件上表面与散热器底部之间填充导热垫，但是这会导致热阻增大，使半导体元件的散热效果不理想。如果每个半导体元件对应设置一个散热器，虽然保证了半导体元件的散热，但是需要在印制集成电路板上增加更多的开孔数量，而更多的开孔会增加集成电路板布局布线的难度，也会增加集成电路板失效的概率。
因此，如何对印制集成电路板上的半导体元件进行有效散热，且不增加集成电路板的布局布线难度，保证集成电路板长期可靠性，是本领域技术人员亟待解决的技术问题。
发明内容
本公开实施例了提供一种散热器固定结构及板级散热装置，旨在解决如何使集成电路板上的半导体元件高效散热，且不增加集成电路板布局布线难度，保证集成电路板长期可靠性。
第一方面，本公开实施例提供一种散热器固定结构，包括：支撑结构及浮动结构；支撑结构包括用于为半导体元件提供支撑的第一支撑件、及与第一支撑件间隔设置的第二支撑件；散热器对应半导体元件设置，并通过浮动结构与第二支撑件浮动连接。
第二方面，本公开实施例提供一种板级散热装置，包括：集成电路板，集成电路板设置有多个半导体元件；上述的散热器固定结构，散热器固定结构与散热器及集成电路板连接，以使散热器为半导体元件散热。
本公开提供的一种散热器固定结构及板级散热装置，通过第一支撑件承载半导体元件，第二支撑件承载散热器，以将散热器和半导体元件进行分离设置，以减少集成电路板上半导体元件附近的开孔数量，进而减小了集成电路板的布线难度，同时减小了集成电路板承受的 应力。且通过浮动结构将散热器与第二支撑件进行浮动连接，使散热器适配不同高度和公差的半导体元件，有效降低半导体元件温度，提升其长期可靠性。
附图说明
为了更清楚地说明本公开实施例技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为根据本公开实施例提供的一种板级散热装置第一视角的结构示意图；
图2为根据本公开实施例提供的一种板级散热装置第二视角的结构示意图；
图3为根据本公开实施例提供的一种板级散热装置的结构示意图；
图4为图3中A区域的局部示意图；
图5为根据本公开实施例提供的一种第一浮动件的结构示意图；
图6为根据本公开实施例提供的另一种板级散热装置的结构示意图；
图7为根据本公开实施例提供的一种浮动定位件、散热器、及第二浮动件的配合示意图；
图8为根据本公开实施例提供的另一种浮动定位件、散热器、及第二浮动件的配合示意图。
附图标记：1、板级散热装置；
100、散热器固定结构；200、集成电路板；
201、印制电路板；202、半导体元件；203、导热层；
11、支撑结构；12、浮动结构；13、散热器；
111、第一支撑件；112、第二支撑件；113、连接件；121、第一浮动件；14、限位孔；122、第二浮动件；123、浮动定位件；
1211、连接部；1212、形变部；141、抵接部；
1121、第一边框；1122、第二边框；1123、第三边框；1124、第四边框；15、开口；1231、第一定位件；1232、第二定位件；1221、第一限位件；1222、第二限位件；1223、弹性件；1224、容纳腔；1225、第一限位部；1226、第二限位部。
具体实施方式
下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。
应当理解，在此本公开说明书中所使用的术语仅仅是出于描述特定实施例的目的而并不意在限制本公开。如在本公开说明书和所附权利要求书中所使用的那样，除非上下文清楚地指明其它情况，否则单数形式的“一”、“一个”及“该”意在包括复数形式。
应当理解，在本公开说明书和所附权利要求书中使用的术语“和/或”是指相关联列出的项中的一个或多个的任何组合以及所有可能组合，并且包括这些组合。需要说明的是，在本文中，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者系统不仅包括那些要素，而且还包括没有明确列出的其他 要素，或者是还包括为这种过程、方法、物品或者系统所固有的要素。在没有更多限制的情况下，由语句“包括一个......”限定的要素，并不排除在包括该要素的过程、方法、物品或者系统中还存在另外的相同要素。
下面结合附图，对本公开的一些实施例作详细说明。在不冲突的情况下，下述的实施例及实施例中的特征可以相互组合。
请参阅图1和图2，本公开实施例提供的板级散热装置1，包括散热器固定结构100及集成电路板200。
具体地，散热器固定结构100包括支撑结构11及浮动结构12，用于连接散热器13和集成电路板200。支撑结构11用于为集成电路板200及散热器13提供支撑，集成电路板200设置有多个半导体元件202，散热器13对应半导体元件202设置，并通过浮动结构12与支撑结构11浮动连接，以使散热器13可以适配不同高度的半导体元件202。
其中，支撑结构11包括第一支撑件111及第二支撑件112，第一支撑件111与第二支撑件112连接并间隔设置。第一支撑件111用于承载集成电路板200，第二支撑件112通过浮动结构12与散热器13浮动连接，以使散热器13对不同高度的半导体元件202进行散热处理时，可通过浮动结构12在第一方向上运动，进而在适配不同高度的半导体元件202，同时通过浮动结构12提供的弹力，使散热器13紧贴半导体元件202，保证了散热效果。其中，第一方向为散热器13的厚度方向。
集成电路板200包括印制电路板201及与印制电路板201连接的半导体元件202，散热器13对应半导体元件202设置。其中，印制电路板201上开设有多个通孔，对应通孔设有连接件113，连接件113通过通孔分别连接第一支撑件111及第二支撑件112，印制电路板201设于第一支撑件111及第二支撑件112之间，并通过通孔对集成电路板200进行限位。通过将第一支撑件111和集成电路板200分离设置，减小了集成电路板200承受的应力，防止集成电路板200因受到外力而变形，以延长集成电路板200的使用寿命。
在一些实施方式中，散热器13与半导体元件202之间设置有导热层203，导热层203的第一面与散热器13相接触，导热层203相对第一面的第二面与半导体元件202相接触。导热层203用于传递半导体元件202产生的热量，将半导体元件202产生的热量传递至散热器13，以通过散热器13完成对半导体元件202的散热。其中，导热层203包括但不限于导热硅胶。
通过浮动结构12使散热器13与第二支撑件112浮动连接，以使散热器13适配不同高度的半导体元件202，进而减小了导热层203的厚度，使半导体元件202产生的热量在向散热器13传递的过程中的热阻减小，即避免了因为导热层203过厚而阻碍热量传递的情况，改善了半导体元件202的散热效果。
可以理解的是，散热器固定装置100可以与多个散热器13连接，多个散热器13之间可以通过串联或并联等方式排列在第二支撑件112上，以同时对第一支撑件111上的多个半导体元件202同时进行散热。其中，散热器13包括但不限于液冷散热器、风冷散热器等，散热器13的数量及排列方式可以根据具体使用场景进行选择，本公开实施例对此不做限定。
可以理解的是，支撑结构11可以包括不同的材质，如金属、塑料及陶瓷等，可以根据具体使用场景进行选择，本公开实施例对此不做限定。
通过第一支撑件111承载集成电路板200，第二支撑件112承载散热器13，将散热器13和集成电路板200进行分离设置，以减少集成电路板200上的开孔数量，进而减小了集成电 路板200的布线难度，同时减小了集成电路板200承受的应力，保证了集成电路板200的长期可靠性。且通过浮动结构12将散热器13与第二支撑件112进行浮动连接，使散热器13在保证散热效果的同时，适配不同高度的半导体元件202。
请参阅图3和图4，在一些实施方式中，第二支撑件112设置于散热器13及第一支撑件111之间，浮动结构12包括至少两个第一浮动件121，散热器13和第二支撑件112中的一者设置有限位孔14，散热器13和第二支撑件112中的另一者和第一浮动件121连接。其中，限位孔14和第一浮动件121形成限位配合，以通过限位孔14和第一浮动件121使第二支撑件112和散热器13浮动配合。
例如，当散热器13设置有限位孔14时，第二支撑件112和第一浮动件121连接。当第二支撑件112当设置有限位孔14时，散热器13和第一浮动件121连接。
可以理解的是，为了保证散热器13和半导体元件202接触以进行散热，第一支撑件111和第二支撑件112之间的间隔小于半导体元件202的高度。
通过将第二支撑件112设置于散热器13及第一支撑件111之间，避免了散热器13因为被外物遮挡而导致的通风不畅的情况，以提高散热器13的散热效率。且通过第一浮动件121及限位孔14使散热器13可相对半导体元件202浮动，以适配不同高度的半导体元件202。
在一些实施方式中，如图4所示，第一浮动件121包括连接部1211、及形变部1212，形变部1212与连接部1211呈夹角设置的，连接部1211的一端与第二支撑件112及散热器13中的一者连接，连接部1211的另一端穿设于限位孔14，并与形变部1212的一端连接。
具体地，以散热器13设置有限位孔14，第二支撑件112和第一浮动件121连接为例进行说明。
如图4所示，限位孔14的周侧设置有抵接部141，形变部1212的另一端抵接在抵接部141上，通过抵接部141对形变部1212进行限位。当半导体元件202的高度过高时，散热器13向远离第二支撑件112的方向运动，同时第一浮动件121的连接部1211及形变部1212之间的夹角增大，且通过第一浮动件121提供的弹力使散热器13紧贴半导体元件202。当半导体元件202的高度过低时，散热器13向靠近第二支撑件112的方向运动，同时第一浮动件121的连接部1211及形变部1212之间的夹角减小，且通过第一浮动件121提供的弹力使散热器13紧贴半导体元件202。
通过连接部1211及形变部1212之间的夹角变化，使散热器13适配不同高度的半导体元件202，以保证散热器13的散热效果。
请参阅图5，在一些实施方式中，第一浮动件121为多个，且多个第一浮动件121呈环形设置，以使连接部1211对应设有多个形变部1212，进而在散热器13受到外力作用时，多个形变部1212同时提供弹力，以防止散热器13与半导体元件202之间因为受力不均衡，而导致装配失衡的情况。
在一些实施方式中，第一浮动件121至少设置在散热器13的相对两侧，且每一侧设置有至少两个第一浮动件121，以防止散热器13与半导体元件202之间因为受力不均衡，而导致装配失衡的情况。
通过呈夹角设置的形变部1212与连接部1211，以通过夹角变化实现散热器13的浮动。在装配过程中，直接将第一浮动件121的形变部1212按压进限位孔14即可，方便了散热器13和第二支撑件112之间的拆装。且避免了螺钉的使用，使第二支撑件112不存在应力集中， 进而避免了第二支撑件112因承受应力而变形的情况，延长了第二支撑件112的使用寿命。
请参阅图6和图7，在一些实施方式中，散热器13设置于第一支撑件111及第二支撑件112之间，浮动结构12包括第二浮动件122及浮动定位件123，浮动定位件123与第二支撑件112连接，第二浮动件122的一端与浮动定位件123连接，第二浮动件122的另一端与散热器13连接，以通过第二浮动件122使散热器13与第二支撑件112浮动配合。
通过将散热器13设置于第一支撑件111及第二支撑件112之间，并通过与第二支撑件112连接的浮动定位件123固定第二浮动件122，不仅减少了第二浮动件122的设置数量，还通过浮动定位件123将第二浮动件122传递过来的压力分摊至第二支撑件112上，使散热器固定装置100的整体结构更加牢固。
具体地，如图6所示，第二支撑件112包括第一边框1121、第二边框1122、第三边框1123、及第四边框1124。第一边框1121与第二边框1122及第四边框1124连接，且第二边框1122与第四边框1124间隔设置，第三边框1123与第二边框1122及第四边框1124连接，且第三边框1123与第一边框1121间隔设置。其中，第一边框1121、第二边框1122、第三边框1123、及第四边框1124形成有一开口15，散热器13对应开口15设置。
浮动定位件123件包括第一定位件1231和第二定位件1232，第一定位件1231和第二定位件1232相交。其中，第一定位件1231的相对两端分别与第一边框1121、第二边框1122、第三边框1123、及第四边框1124中的至少两者连接，第二定位件1232的两端分别与第一边框1121、第二边框1122、第三边框1123、及第四边框1124中的至少两者连接，第二浮动件122设置在第一定位件1231和第二定位件1232的交点处。
示例性地，如图6和图7所示，第一定位件1231的一端与第一边框1121及第二边框1122的连接处连接，第一定位件1231的另一端与第三边框1123及第四边框1124的连接处连接，第二定位件1232的一端与第二边框1122及第三边框1123的连接处连接，第二定位件1232的另一端与第一边框1121及第四边框1124的连接处连接，第一定位件1231和第二定位件1232相交于点C，第二浮动件122设置在点C处。
可以理解的是，第一定位件1231和第二定位件1232可以与第二支撑件112一体设置，也可以与第二支撑件112独立设置，本公开实施例对此不做限定。
通过设置开口15，增加了散热器13和外部空气的接触面积，有利于散热器13的空气流通，进而提高了散热效率。通过将第二浮动件122设置在第一定位件1231和第二定位件1232的交点处，将第二浮动件122传递过来的压力均匀分摊至第二支撑件112上，且通过第一定位件1231和第二定位件1232的交叉设计，将第二支撑件112分割成多个三角形，以使第二支撑件112更加牢固，延长第二支撑件112的使用寿命。
在一些实施方式中，如图6所示，第一定位件1231和第二定位件1232相交的点C位于散热器13在第一方向上投影的中心区域，也即，第二浮动件122设置于散热器13在第一方向上投影的中心区域。通过将第二浮动件122设置在散热器13的中心区域，避免了散热器13与半导体元件202出现装配失衡的情况，使散热器13与半导体元件202的相对面能紧密贴合，以提高散热效率。
在一些实施方式中，如图7所示，第二浮动件122包括第一限位件1221、第二限位件1222、及弹性件1223。第一限位件1221与浮动定位件123及散热器13中的一者连接，第二限位件1222与浮动定位件123及散热器13中的另一者连接，并和第一限位件1221形成限位配合， 弹性件1223设置于第一限位件1221和第二限位件1222之间，通过弹性件1223使散热器13与第二支撑件112浮动配合。其中，弹性件1223包括但不限于弹簧、弹片等。
示例性地，第一限位件1221形成有一具有开口的容纳腔1224，弹性件1223和第二限位件1222的一端收容与容纳腔1224内，第二限位件1222的另一端与第二支撑件112及散热器13中的一者连接。通过弹性件1223提供的弹力使第二限位件1222的一端在容纳腔1224内运动。
可以理解的是，为了保证第一限位件1221及第二限位件1222之间不存在晃动，容纳腔1224的大小及形状适配于第二限位件1222的大小及形状。
可以理解的是，第二限位件1222的大小及形状可以根据具体使用场景进行选择，本公开实施例在此不做限制。
其中，对于第一限位件1221和第二限位件1222形成限位配合的具体方式在此不做限制，可以是将弹性件1223的一端与容纳腔1224中远离开口的一侧连接，并将弹性件1223的另一端与第二限位件1222连接，进而通过弹性件1223的弹力实现第一限位件1221和第二限位件1222之间的限位配合。请参阅图8，也可以是第一限位件1221上设置有第一限位部1225，第二限位件1222上设置有第二限位部1226，通过第一限位部1225和第二限位部1226形成限位配合。
通过第一限位件1221和第二限位件1222之间的限位配合，使散热器13在外力作用下稳定运动，进一步避免散热器13与半导体元件202出现装配失衡的情况。且第一限位件1221、第二限位件1222、及弹性件1223的拆装简单，同时避免了对散热器13及第二支撑件112进行打孔，直接通过第一限位件1221、第二限位件1222、及弹性件1223，便可实现散热器13和第二支撑件112之间的浮动配合，使散热器13和第二支撑件112均不存在应力集中，延长了散热器13和第二支撑件112的使用寿命。
本公开的描述中，术语“安装”、“相连”、“连接”、“固定”等均应做广义理解，例如，“连接”可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是直接相连，也可以通过中间媒介间接相连。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本公开中的具体含义。在本说明书的描述中，术语“一个实施例”、“一些实施例”、“具体实施例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或特点包含于本公开的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例或实例。而且，描述的具体特征、结构、材料或特点可以在任何的一个或多个实施例或示例中以合适的方式结合。虽然本公开所揭露的实施方式如上，但所述的内容仅为便于理解本公开而采用的实施方式，并非用以限定本公开。任何本发明所属领域内的技术人员，在不脱离本公开所揭露的精神和范围的前提下，可以在实施的形式及细节上进行任何的修改与变化，但本公开的专利保护范围，仍须以所附的权利要求书所界定的范围为准。
上述本公开实施例序号仅仅为了描述，不代表实施例的优劣。以上所述，仅为本公开的具体实施例，但本公开的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，可轻易想到各种等效的修改或替换，这些修改或替换都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以权利要求的保护范围为准。

Claims (10)

  1. 一种散热器固定结构，包括：
    支撑结构及浮动结构；
    所述支撑结构包括用于为半导体元件提供支撑的第一支撑件、及与所述第一支撑件间隔设置的第二支撑件；
    散热器对应所述半导体元件设置，并通过所述浮动结构与所述第二支撑件浮动连接。
  2. 根据权利要求1所述的散热器固定结构，其中：
    所述第二支撑件设置于所述散热器及所述第一支撑件之间；
    所述浮动结构包括至少两个第一浮动件；
    所述散热器、及所述第二支撑件中一者设置有限位孔，另一者与所述第一浮动件连接，且所述第一浮动件通过所述限位孔使所述散热器与所述第二支撑件浮动配合。
  3. 根据权利要求2所述的散热器固定结构，其中：
    所述第一浮动件包括连接部、及与所述连接部呈夹角设置的形变部；
    所述连接部的一端与所述第二支撑件及所述散热器中一者连接，所述连接部的另一端穿设于所述限位孔，并与所述形变部的一端连接。
  4. 根据权利要求3所述的散热器固定结构，其中：
    所述限位孔的周侧设置有抵接部；
    所述形变部的另一端抵接于所述抵接部，并与所述抵接部形成限位配合。
  5. 根据权利要求3所述的散热器固定结构，其中：所述第一浮动件为多个，且多个所述第一浮动件呈环形设置。
  6. 根据权利要求1所述的散热器固定结构，其中：
    所述散热器设置于所述第二支撑件及所述第一支撑件之间；
    所述浮动结构包括浮动定位件、及第二浮动件；
    所述浮动定位件与所述第二支撑件连接，所述第二浮动件的一端与所述浮动定位件连接，所述第二浮动件的另一端与所述散热器连接，通过所述第二浮动件使所述散热器与所述第二支撑件浮动配合。
  7. 根据权利要求6所述的散热器固定结构，其中：
    所述第二支撑件包括第一边框、与所述第一边框连接的第二边框、与所述第二边框连接并与所述第一边框间隔设置的第三边框、及与所述第三边框和所述第一边框连接并与所述第二边框间隔设置的第四边框；
    所述第一边框、第二边框、第三边框、及第四边框形成有一开口，所述散热器对应所述开口设置。
  8. 根据权利要求6或7所述的散热器固定结构，其中：
    所述第二浮动件设置于所述散热器在第一方向上投影的中心区域，所述第一方向为所述散热器的厚度方向。
  9. 根据权利要求8所述的散热器固定结构，其中：
    所述第二浮动件包括第一限位件、第二限位件、及弹性件；
    所述第一限位件与所述浮动定位件及所述散热器中的一者连接；
    所述第二限位件与所述浮动定位件及所述散热器中的另一者连接，并和所述第一限位件形成限位配合；
    所述弹性件设置于所述第一限位件和所述第二限位件之间，以使所述散热器与所述第二支撑件浮动配合。
  10. 一种板级散热装置，包括：
    集成电路板，所述集成电路板设置有多个半导体元件；
    如权利要求1至9中任一项所述的散热器固定结构，所述散热器固定结构与散热器及所述集成电路板连接，以使所述散热器为所述半导体元件散热。
PCT/CN2022/104895 2021-09-07 2022-07-11 散热器固定结构及板级散热装置 Ceased WO2023035761A1 (zh)

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