WO2023032962A1 - Direct-drawing device and method for controlling the same - Google Patents

Abstract

The purpose of the present invention is to provide a direct-drawing device and a method for controlling the direct-drawing device, each of which makes it possible to improve the accuracy of interlayer superposition.　Provided is a direct-drawing device which draws a pattern on a substrate that has been processed by a processing device in a previous step, wherein the position at which the pattern is drawn is corrected on the basis of error data corresponding to the processing accuracy of the processing device.

Description

Direct drawing device and its control method

The present invention relates to a direct drawing device and its control method.

Conventionally, in order to form a conductive pattern or the like on an exposure surface of a substrate having a photosensitive layer on its surface, the substrate and a photomask on which the pattern is drawn are placed one on top of the other, and the substrate is irradiated with light through the photomask. An exposure method has been widely used in which a pattern is transferred to a photosensitive layer on the surface of a substrate. On the other hand, there has been proposed a direct drawing apparatus using a maskless exposure (direct exposure) method that directly draws a predetermined pattern on a substrate without using a photomask (see, for example, Patent Document 1). According to this type of direct drawing apparatus, since a photomask is not required, it is advantageous in terms of cost, and high-precision exposure is possible.

In addition, in the manufacture of multi-layer substrates, etc., in which multiple pattern layers are laminated, there is an extremely high demand for improved interlayer overlay accuracy. Various methods have been proposed in order to improve the accuracy of via processing devices and the like.

Japanese Patent Application Laid-Open No. 2006-250982

However, via processing devices and direct writing devices each have their own processing and drawing errors. Therefore, when vias C are formed in a substrate by a via processing apparatus in the arrangement shown by dots in FIG. 5A, processing errors actually occur as shown in FIG. 5B. Similarly, even if the direct writing apparatus writes on the substrate in the arrangement shown in FIG. 5A, the actually written pattern D has writing errors as shown in FIG. put away. Therefore, the position of the via C formed by the via processing apparatus and the pattern D drawn by the direct writing apparatus have a large positional relationship between the via C and the portion of the pattern D corresponding to the via C, as shown in FIG. There is a risk that an error will occur and that the via C and the drawing position of the pattern D corresponding to this via C will not match.

It is an object of the present invention to provide a direct drawing apparatus and a control method thereof that can solve the above-described problems of the conventional techniques and improve the interlayer overlay accuracy.

According to the present invention, in a direct writing apparatus for writing a pattern on a substrate processed by a processing apparatus in a previous process, the pattern writing position is corrected based on error data corresponding to the processing accuracy of the processing apparatus. Characterized by

In this case, the error data may be generated by measuring a measurement substrate processed by the processing apparatus. The error data may be generated by measuring the substrate prior to pattern writing. When the substrate is a multilayer substrate in which a plurality of pattern layers are laminated, the correction amount of the pattern drawing position may be adjusted according to the number of remaining layers up to the final layer. The pattern drawing position correction amount may be adjusted so that the pattern layer closer to the final layer approaches the design value. The error data may include via position information corresponding to positions where vias are formed, and the pattern drawing positions may be adjusted based on the via position information.

Further, the present invention provides a method of controlling a direct writing apparatus for writing a pattern on a substrate processed by a processing apparatus in a previous process, wherein error data corresponding to the processing accuracy of the processing apparatus is read, and based on the error data. and correcting the drawing position of the pattern.

In this case, the error data may be generated by measuring a measurement substrate processed by the processing apparatus. The error data may be generated by measuring the substrate prior to pattern writing. When the substrate is a multilayer substrate in which a plurality of pattern layers are laminated, the correction amount of the pattern drawing position may be adjusted according to the number of remaining layers up to the final layer. The pattern drawing position correction amount may be adjusted so that the pattern layer closer to the final layer approaches the design value. The error data may include via position information corresponding to positions where vias are formed, and the pattern drawing positions may be adjusted based on the via position information.

1 shows a perspective view of a direct writing apparatus according to a first embodiment of the present invention; FIG. 4 schematically shows how the direct writing apparatus corrects the pattern writing position. 4 schematically shows how the pattern drawing position is corrected according to the number of remaining pattern layers to be laminated. FIG. 8 schematically shows how the direct writing apparatus according to the second embodiment of the present invention corrects the pattern writing position. 4 schematically shows how a pattern is drawn according to a conventional technique; 2 schematically shows the result of drawing a pattern according to the conventional technique;

Preferred embodiments of the present invention will be described below with reference to the drawings.
(First embodiment)

FIG. 1 shows a perspective view of a direct drawing apparatus according to a first embodiment of the present invention.
The direct drawing apparatus 1 includes a pedestal 2, a bed 3, a drawing head 4, a pair of drawing stages 5A and 5B, and a pair of substrate measurement system cameras 6A and 6B.

The bed 3 extends in the arrow A direction and the arrow B direction on the pedestal 2. Arranged on the bed 3 are a drawing head 4, a pair of drawing stages 5A and 5B, and a pair of substrate measurement system cameras 6A and 6B.

A drawing stage 5A on which the substrate 10A is mounted and a substrate measurement system camera 6A are arranged on the arrow A direction side of the drawing head 4 arranged in the center of the bed 3, and on the arrow B direction side of the drawing head 4. , a drawing stage 5B on which a substrate 10B is placed and a substrate measurement system camera 6B are arranged.

The drawing head 4 has a drawing head coordinate system for drawing patterns of conductive portions on the substrates 10A and 10B, and the substrate measurement system camera 6 has a substrate position detection coordinate system for detecting the position of the substrate 10. ing. The drawing head 4 is provided so as to be reciprocally movable not only in the main scanning direction, ie, the directions of arrows A and B, but also in the sub-scanning direction, which is perpendicular to the directions of arrows A and B. As shown in FIG. Note that the direct drawing apparatus 1 according to the present embodiment places one substrate 10A, 10B on each of the two drawing stages 5A, 5B, and draws patterns on the two substrates 10A, 10B. However, one drawing stage may be provided to draw a pattern on one substrate.

The drawing stages 5A and 5B are mounted on a carriage 7A or a carriage 7B, respectively, and the drawing stages 5A and 5B and the substrate measurement system cameras 6A and 6B are provided so as to be reciprocally movable in the directions of arrows A and B, respectively. ing. In order to detect the positions of the substrates 10A and 10B, the substrate measurement system cameras 6A and 6B are provided so as to be reciprocally movable not only in the directions of the arrows A and B, but also in directions perpendicular to the directions of the arrows A and B. It is

FIG. 2 schematically shows how the direct writing apparatus corrects the pattern writing position. FIG. 2(a) shows a state in which the pattern writing position is not corrected, viewed from a direction perpendicular to the substrate surface, and FIG. 2(b) shows a state in which the pattern writing position is corrected on the substrate surface. It shows how it looks from the vertical direction.

A multilayer substrate in which a plurality of pattern layers are laminated is provided so that different pattern layers are electrically connected to each other through vias, which are through holes. When forming such an electrical connection between the pattern layers, first, vias are formed in the insulating layers between the pattern layers of the substrates 10A and 10B using a laser or the like by a via processing device (not shown) in the preceding process. Form. Next, after the substrates 10A and 10B having vias formed thereon were plated with copper, a photosensitive material was applied to the pattern drawing surfaces of the substrates 10A and 10B, and the patterns were drawn by the direct drawing device 1 and developed. The patterns drawn on the substrates 10A and 10B are electrically connected through vias after the processes of copper plating, peeling of the photosensitive material, and etching are performed later.

In this embodiment, for ease of understanding, the manufacturing of the substrates 10A and 10B in which the pattern as shown in FIG. .

In FIG. 2(a), vias C formed on the same substrates 10A and 10B by the via processing device are illustrated by black dots, and patterns D drawn by the direct drawing device 1 at positions corresponding to the respective vias C are illustrated by white dots. indicated by dots. As can be seen from the arrangement of the black dots, the vias C processed by the via processing device are shifted in the vertical and horizontal directions due to errors caused by the processing accuracy of the via processing device. Also, as can be seen from the arrangement of the white dots, an error occurs due to the drawing precision of the direct drawing device 1, so the drawing is performed in a state of being shifted in the vertical and horizontal directions. Due to the difference between the processing accuracy of the via processing device and the drawing accuracy of the direct drawing device 1, even if the pattern D is drawn by the direct drawing device 1 after alignment is performed using the positioning vias C1 to C4 at the four corners, for example, In some vias C, the positions of the formed vias C and the drawing positions of the patterns D corresponding to the vias C are greatly deviated.

The direct writing apparatus 1 according to the present embodiment is equipped with a storage unit (not shown), reads out error data corresponding to the processing accuracy of the via processing apparatus from the storage unit, and creates a pattern D based on the read error data. The drawing position can be corrected. The error data includes via position information corresponding to the position where the via C is formed, and this via position information allows the via position deviation that occurs when the via processing apparatus forms the via C to be known. . Based on the via position information included in the error data, the direct drawing apparatus 1 determines the drawing position of the pattern D corresponding to the via C as shown in FIG. Correction is made so as to approach the position of the via C. FIG. As a result, the direct drawing apparatus 1 can draw the pattern D indicated by white dots so that the drawing position of the pattern overlaps with high accuracy the position of the via C indicated by the black dots formed by the via processing apparatus. .

The error data is generated by measuring the substrates 10A and 10B on which the vias C are formed by the via processing device, using the substrate measurement system cameras 6A and 6B. In this embodiment, the error data is stored in the storage unit after actually measuring the substrates 10A and 10B using the substrate measurement system cameras 6A and 6B. By measuring the substrate for measurement processed by the via processing device using the substrate measurement system camera 6A or 6B and storing the corresponding error data in the storage unit, it is possible to cope without measuring the substrates 10A and 10B. can be

When correcting the drawing position of the pattern D indicated by the white dots, the amount of deviation of the via C included in the error data is directly used as the correction value. y)=(−0.004, 0.002), the value of this error is directly reflected in drawing by the drawing device 1 as a correction value. That is, the drawing position of the corresponding portion of the pattern D drawn by the direct writing device 1 is corrected, offset by -0.004 in the x direction and offset by 0.002 in the y direction. At this time, the portion formed between each point is corrected by linear interpolation using a linear linear function. For example, point A whose global coordinates are x = 50 mm and y = 10 mm, and point B whose global coordinates are x = 50 mm and y = 20 mm. The value is corrected as it is, but the portion between the A point and the B point is linearly interpolated by a linear function passing through the corrected A point and the B point.

FIG. 3 schematically shows how the pattern drawing position is corrected according to the number of remaining pattern layers to be laminated. FIG. 3(a) schematically shows the pattern of the lower layers of the multilayer substrate, and FIG. 3(b) schematically shows the pattern of the last layer of the multilayer substrate.

When the substrates 10A and 10B are multilayer substrates in which a plurality of pattern layers are laminated, the direct drawing apparatus 1 generates error data according to the remaining number of pattern layers to be laminated up to the final layer of the completed multilayer substrate. , the degree of correction of the pattern drawing position can be adjusted. As a result, as shown in FIG. 3A, the pattern D of the lower layer of the multilayer substrate is drawn in a state of being shifted in the vertical and horizontal directions as a result of drawing in accordance with the formed via C. Even in this case, as shown in FIG. 3B, the pattern D can be drawn in the final layer after correction so that the pattern D is aligned in the vertical and horizontal directions. Specifically, another pattern D further laminated on the pattern D in the lower layer of the multilayer substrate is corrected step by step for each pattern layer toward the final layer. , the final layer has a pattern D as shown in FIG. 3(b). That is, the direct drawing apparatus 1 adjusts the correction amount of the drawing position of the pattern D so that the pattern layer closer to the final layer approaches the design value. For example, if the remaining number of processed layers, that is, the remaining number of pattern layers to be laminated from now on is n, and the accuracy difference is d, the correction amount for each pattern layer to be laminated from now on is d/n. At this time, the drawing position of the pattern D after correction is obtained by multiplying the coordinates of the portions other than the portions where the vias C are formed, such as the intermediate portions of the points, by the correction coefficients that are linear function complements.

The direct writing apparatus 1 according to this embodiment corrects the writing position of the pattern D based on error data corresponding to the processing accuracy of the via processing apparatus. As a result, even if the position of the via C formed by the via processing device is shifted, the drawing position of the pattern D can be brought closer to the position of the via C actually formed by the via processing device. Therefore, the direct drawing apparatus 1 can improve the interlayer overlay accuracy.

(Second embodiment)
FIG. 4 schematically shows how the direct writing apparatus according to the second embodiment of the present invention corrects the pattern writing position. In this drawing, FIG. 4(a) shows a substrate processed by a via processing device, and FIG. 4(b) shows a substrate on which a pattern is drawn by a direct drawing device. In addition, in the second embodiment, portions different from the first embodiment will be explained, and the same reference numerals are used for substantially the same configurations as in the first embodiment in the drawing.

In the present embodiment, the direct drawing apparatus 1 acquires error data using a gauge substrate (measurement substrate) 10C used only for error measurement before starting writing on the substrates 10A and 10B used for actual products. generated in advance. The gauge substrate 10C is processed by the same via processing apparatus as that for processing the substrates 10A and 10B, which are actual products.

First, as shown in FIG. 4(a), the direct drawing apparatus 1 measures the gauge substrate 10C on which the vias C are formed by the via processing apparatus, using the substrate measurement system cameras 6A and 6B. As a result, via position data based on the position information of the vias C is generated for the gauge substrate 10C processed by the via processing apparatus.

When the position information data of the via C formed by the via processing device is generated, the direct drawing device 1 prepares another gauge substrate (measurement substrate) on which the via C is not formed, as shown in FIG. 4(b). ) The pattern D is drawn on 10D, and the drawn pattern D is measured using the substrate measurement system cameras 6A and 6B. As a result, the pattern position data based on the position information of the pattern D is generated for the gauge substrate 10D on which the pattern D is drawn by the direct writing device 1. FIG.

When the via position data and the pattern position data are generated, the direct drawing device 1 compares the via position data and the pattern position data, and determines the positions of the vias C formed in the gauge substrate 10C and the positions of the vias C. Error data is generated based on the difference from the position of the pattern D formed on the corresponding gauge substrate 10D, and stored in the storage unit.

The direct drawing apparatus 1 generates error data for the entire surfaces of the gauge substrates 10C and 10D. For example, when correcting the position of a small area as shown in FIG. is read from the error data, and the position for writing the pattern D is corrected.

The direct drawing apparatus 1 according to this embodiment generates error data in advance by measuring the gauge substrates 10C and 10D that are used only for measurement. This eliminates the need to measure the substrates 10A and 10B, which are actual products, each time the pattern D is drawn on the substrates 10A and 10B, thereby shortening the time required to manufacture the product.

Although the present invention has been described above based on the embodiments, the present invention is not limited thereto. For example, in the second embodiment, via position data and pattern position data are measured using separate gauge substrates, but they may be measured using the same gauge substrate. Furthermore, in the second embodiment, error data is generated based on via position data and pattern position data, but the present invention is not limited to this. If the direct drawing device 1 can correct the position of the pattern D according to the position of the via C formed by the via processing device, the error data may be generated based only on the via position data.

DESCRIPTION OF SYMBOLS 1... Direct drawing apparatus 2... Base 3... Bed 4... Drawing head 5A... Drawing stage 5B... Drawing stage 6A... Substrate measurement system camera 6B... Substrate measurement system camera 7A... Carriage 7B... Carriage 10A... Substrate 10B... Substrate 10C... Gauge Substrate (measurement substrate)
10D... Gauge substrate (measurement substrate)
C...Via D...Pattern

Claims (12)

In a direct drawing device that draws a pattern on a substrate processed by a processing device in a previous process,
1. A direct writing apparatus, wherein a pattern writing position is corrected based on error data corresponding to the processing accuracy of said processing apparatus. 3. The direct writing apparatus according to claim 1, wherein said error data is generated by measuring a substrate for measurement processed by said processing apparatus. 3. The direct writing apparatus according to claim 1, wherein said error data is generated by measuring said substrate before writing a pattern. 2. The direct writing apparatus according to claim 1, wherein when the substrate is a multilayer substrate in which a plurality of pattern layers are laminated, adjusting the correction amount of the pattern writing position according to the number of remaining layers up to the final layer. A direct-writing device, characterized by: The direct writing apparatus according to claim 4, wherein the correction amount of the pattern writing position is adjusted so that the closer the pattern is to the final layer, the closer to the design value. 2. The direct writing apparatus according to claim 1, wherein said error data includes via position information corresponding to positions where vias are formed, and said pattern drawing position is adjusted based on said via position information. , a direct drawing device. In a control method of a direct drawing device for drawing a pattern on a substrate processed by a processing device in a previous process,
reading error data corresponding to the processing accuracy of the processing device;
characterized by correcting the drawing position of the pattern based on the error data,
A control method for a direct writing device. A control method for a direct writing apparatus according to claim 7, wherein said error data is generated by measuring a substrate for measurement processed by said processing apparatus. A control method for a direct writing apparatus according to claim 7, wherein said error data is generated by measuring said substrate before writing a pattern. 8. The method of controlling a direct writing apparatus according to claim 7, wherein when the substrate is a multilayer substrate in which a plurality of pattern layers are laminated, the correction amount of the pattern writing position is adjusted according to the number of remaining layers up to the final layer. A control method for a direct drawing device, characterized in that: A control method for a direct writing apparatus according to claim 10, wherein the correction amount of the pattern writing position is adjusted so that the closer the pattern is to the final layer, the closer to the design value. 8. The method of controlling a direct writing apparatus according to claim 7, wherein said error data includes via position information corresponding to positions at which vias are formed, and said pattern drawing position is adjusted based on said via position information. A control method for a direct writing device, characterized by:

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