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WO2023000733A1 - 天线装置的接地结构、天线装置及电子设备 - Google Patents

天线装置的接地结构、天线装置及电子设备 Download PDF

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Publication number
WO2023000733A1
WO2023000733A1 PCT/CN2022/087940 CN2022087940W WO2023000733A1 WO 2023000733 A1 WO2023000733 A1 WO 2023000733A1 CN 2022087940 W CN2022087940 W CN 2022087940W WO 2023000733 A1 WO2023000733 A1 WO 2023000733A1
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WIPO (PCT)
Prior art keywords
circuit module
antenna
antenna radiator
electrically connected
conductive member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2022/087940
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English (en)
French (fr)
Inventor
张彩文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Oppo Mobile Telecommunications Corp Ltd
Original Assignee
Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong Oppo Mobile Telecommunications Corp Ltd filed Critical Guangdong Oppo Mobile Telecommunications Corp Ltd
Publication of WO2023000733A1 publication Critical patent/WO2023000733A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/48—Earthing means; Earth screens; Counterpoises
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith

Definitions

  • the present application relates to the technical field of communication, and in particular to a grounding structure of an antenna device, the antenna device and electronic equipment.
  • electronic devices such as smartphones can achieve more and more functions, and more and more antenna radiators are installed inside electronic devices.
  • Tuning circuits, matching circuits, and frequency modulation circuits that are electrically connected to antenna radiators
  • circuit structures such as circuits, isolation circuits, and filter circuits.
  • the present application provides a grounding structure of an antenna device, the antenna device and electronic equipment.
  • the antenna device can be grounded through the circuit module of the grounding structure without being limited to the installation position of the circuit board.
  • the present application provides a grounding structure of an antenna device, including:
  • an insulating substrate including a first surface and a second surface opposite to each other;
  • a first conductive member disposed on the first surface, and the first conductive member is used to electrically connect with the antenna radiator;
  • a second conductive element disposed on the second surface, and the second conductive element is used to electrically connect to the ground plane;
  • a circuit module the insulating substrate carries the circuit module, the first end of the circuit module is electrically connected to the first conductive member, the second end of the circuit module is electrically connected to the second conductive member, and the The antenna radiator is grounded through the circuit module.
  • the present application also provides an antenna device, including:
  • a grounding structure includes an insulating substrate, a first conductive member, a second conductive member and a circuit module, the insulating substrate carries the circuit module, the insulating substrate includes a first surface and a second surface oppositely arranged, The first conductive element is arranged on the first surface, and the second conductive element is arranged on the second surface; the first conductive element is electrically connected to the antenna radiator, and the second conductive element is connected to the antenna radiator.
  • the ground plane is electrically connected, the first end of the circuit module is electrically connected to the first conductive member, the second end of the circuit module is electrically connected to the second conductive member, and the antenna radiator passes through the circuit Module ground.
  • the present application also provides an electronic device, including an antenna device, and the antenna device includes:
  • a grounding structure includes an insulating substrate, a first conductive member, a second conductive member and a circuit module, the insulating substrate carries the circuit module, the insulating substrate includes a first surface and a second surface oppositely arranged, The first conductive element is arranged on the first surface, and the second conductive element is arranged on the second surface; the first conductive element is electrically connected to the antenna radiator, and the second conductive element is connected to the antenna radiator.
  • the ground plane is electrically connected, the first end of the circuit module is electrically connected to the first conductive member, the second end of the circuit module is electrically connected to the second conductive member, and the antenna radiator passes through the circuit Module ground.
  • FIG. 1 is a schematic diagram of a first structure of an antenna device provided by an embodiment of the present application.
  • FIG. 2 is a schematic diagram of a second structure of an antenna device provided by an embodiment of the present application.
  • FIG. 3 is a first structural schematic diagram of the grounding structure shown in FIG. 1 .
  • FIG. 4 is a schematic diagram of a third structure of an antenna device provided by an embodiment of the present application.
  • FIG. 5 is a structural schematic diagram of the grounding structure shown in FIG. 4 .
  • FIG. 6 is a schematic diagram of a second structure of the grounding structure shown in FIG. 1 .
  • FIG. 7 is a schematic structural comparison diagram of an antenna device including the ground structure shown in FIG. 6 and an antenna device not including the ground structure shown in FIG. 6 .
  • FIG. 8 is a schematic diagram of a comparison of standing wave ratios between an antenna device including the ground structure shown in FIG. 6 and an antenna device not including the ground structure shown in FIG. 6 .
  • FIG. 9 is a schematic diagram of a third structure of the grounding structure shown in FIG. 1 .
  • FIG. 10 is a schematic structural comparison diagram of an antenna device including the ground structure shown in FIG. 9 and an antenna device not including the ground structure shown in FIG. 9 .
  • Fig. 11 is a schematic diagram of a comparison of the standing wave ratio between the antenna device including the ground structure shown in Fig. 9 and the antenna device not including the ground structure shown in Fig. 9 .
  • FIG. 12 is a schematic diagram of a fourth structure of the grounding structure shown in FIG. 1 .
  • FIG. 13 is a schematic diagram of structural comparison between an antenna device including the ground structure shown in FIG. 12 and an antenna device not including the ground structure shown in FIG. 12 .
  • FIG. 14 is a schematic diagram of a comparison of the standing wave ratio between the antenna device including the ground structure shown in FIG. 12 and the antenna device not including the ground structure shown in FIG. 12 .
  • FIG. 15 is a schematic diagram of a first structure of an electronic device provided by an embodiment of the present application.
  • FIG. 16 is a schematic diagram of a second structure of an electronic device provided by an embodiment of the present application.
  • An embodiment of the present application provides an antenna device, which can implement a wireless communication function.
  • the antenna device can transmit Wireless Fidelity (Wi-Fi) signals, Global Positioning System (GPS) signals, third-generation mobile communication technology (3rd-Generation, 3G for short), fourth-generation Mobile communication technology (4th-Generation, referred to as 4G), fifth-generation mobile communication technology (5th-Generation, referred to as 5G), near field communication (Near field communication, referred to as NFC) signal, Bluetooth signal, ultra-wideband communication signal, etc.
  • Wi-Fi Wireless Fidelity
  • GPS Global Positioning System
  • 3rd-Generation 3rd-Generation, 3G for short
  • fourth-generation Mobile communication technology (4th-Generation, referred to as 4G
  • 5G fifth-generation mobile communication technology
  • NFC near field communication
  • Bluetooth signal Bluetooth signal
  • ultra-wideband communication signal ultra-wideband communication signal
  • FIG. 1 is a schematic structural diagram of a first type of antenna device provided by an embodiment of the present application.
  • the antenna device 100 may include an antenna radiator 110 , a feed 120 , a ground structure 130 and a ground plane 140 .
  • the feed source 120 can be directly or indirectly electrically connected to the antenna radiator 110, and the feed source 120 can provide a radio frequency signal to the antenna radiator 110, and the radio frequency signal can stimulate the antenna radiator 110 to transmit wireless signals, such as but not limited to transmission of 3G, 4G, 5G, GPS, Wi-Fi, NFC signals.
  • the ground plane 140 is used to form a common ground.
  • the ground plane 140 may be formed by electronic devices, conductors in the antenna device 100 , printed lines or metal printed layers, and the like.
  • the ground plane 140 may be disposed on the circuit board of the electronic device, the ground plane 140 may also be formed on the middle frame of the electronic device, or the ground plane 140 may also be formed through a metal back shell.
  • ground plane 140 is only an example of the formation method of the ground plane 140, and it is not limited thereto. Other methods for forming the ground plane 140 are within the protection scope of the embodiment of the present application. Not specifically limited.
  • the antenna radiator 110 may transmit wireless signals.
  • the antenna radiator 110 may be directly or indirectly electrically connected to the feed source 120 , for example, an electrical connection point 111 may be provided on the antenna radiator 110 , and the feed source 120 may be electrically connected to the antenna radiator 110 through the electrical connection point 111 .
  • the antenna radiator 110 can also be directly or indirectly electrically connected to the ground plane 140 through the ground structure 130.
  • a ground point 112 can be set on the antenna radiator 110
  • a ground terminal (not shown in FIG. 1 ) can be set on the ground plane 140.
  • the structure 130 may be electrically connected to the ground point 112 and the ground terminal, respectively.
  • the antenna radiator 110 may be grounded through one or more ground structures 130 .
  • the antenna device 100 may be grounded through a ground structure 130 .
  • FIG. 2 is a schematic diagram of the second structure of the antenna device provided by the embodiment of the present application.
  • the antenna radiator 110 can be grounded through multiple ground structures 130, for example, the antenna radiator 110 is grounded through two ground structures 130 in FIG. Signal.
  • the ground structure 130 can be electrically connected to the antenna radiator 110 and the ground plane 140 respectively, so that the antenna radiator 110 can be grounded through the ground structure 130 .
  • FIG. 3 is a schematic diagram of a first structure of the grounding structure shown in FIG. 1 .
  • the ground structure 130 may include an insulating substrate 131 , a first conductive member 132 , a second conductive member 133 and a circuit module 134 .
  • the insulating substrate 131 may include a first surface 1311 and a second surface 1312 oppositely disposed, the first surface 1311 may be disposed close to the antenna radiator 110 , and the second surface 1312 may be disposed close to the ground plane 140 .
  • the first surface 1311 and the second surface 1312 can be insulated from each other.
  • the insulating substrate 131 may be a dielectric substrate.
  • the dielectric substrate can be made of polytetrafluoroethylene (FR4), and of course, the dielectric substrate can also be made of other materials.
  • FR4 polytetrafluoroethylene
  • the embodiment of the present application does not limit the specific structure of the insulating substrate 131 .
  • the first conductive member 132 may be disposed on the first surface 1311 , and one end of the first conductive member 132 may be electrically connected to the antenna radiator 110 , for example, electrically connected to the ground point 112 on the antenna radiator 110 . The other end of the first conductive member 132 can be electrically connected to the first end n of the circuit module 134 .
  • the ground structure 130 may include one or more first conductive elements 132 , for example, the ground structure 130 in FIG. 3 includes two first conductive elements 132 . Wherein, one end of each first conductive element 132 can be electrically connected to the antenna radiator 110 , and the other end of each first conductive element 132 can be electrically connected to the first terminal n of the circuit module 134 .
  • the antenna radiator 110 When the antenna radiator 110 is electrically connected to the circuit module 134 through a plurality of first conductive members 132, the electrical contact area between the antenna radiator 110 and the circuit module 134 is larger, and the electrical connection between the antenna radiator 110 and the circuit module 134 is stable. Sex is better.
  • the first conductive member 132 may be a conductive elastic piece.
  • the elastic first conductive member 132 can further make the electrical connection between the antenna radiator 110 and the circuit module 134 more stable.
  • the first conductive member 132 may also have other structures, such as but not limited to a wire cable, and the embodiment of the present application does not limit the specific structure of the first conductive member 132 .
  • the second conductive member 133 can be disposed on the second surface 1312, and one end of the second conductive member 133 can be electrically connected to the ground plane 140, for example, electrically connected to a ground terminal on the ground plane 140, and the other end of the second conductive member 133 can be connected to the ground plane 140.
  • the second end r of the circuit module 134 is electrically connected.
  • the ground structure 130 may include one or more second conductive elements 133 , for example, the ground structure 130 in FIG. 3 includes two second conductive elements 133 .
  • One end of each second conductive element 133 can be electrically connected to the second end r of the circuit module 134 , and the other end of each first conductive element 132 can be electrically connected to the ground plane 140 .
  • the circuit module 134 When the circuit module 134 is electrically connected to the ground plane 140 through a plurality of second conductive members 133, the electrical contact area between the circuit module 134 and the ground plane 140 is larger, and the electrical connection stability between the circuit module 134 and the ground plane 140 is better. .
  • the second conductive member 133 may be a conductive elastic piece.
  • the elastic second conductive member 133 can further make the electrical connection between the circuit module 134 and the ground plane 140 more stable.
  • the second conductive member 133 may also have other structures, such as but not limited to a wire cable, and the embodiment of the present application does not limit the specific structure of the second conductive member 133 .
  • the circuit module 134 can be arranged on the insulating substrate 131, for example, the circuit module 134 can be arranged on the first surface 1311 of the insulating substrate 131, can also be arranged on the second surface 1312 of the insulating substrate 131, and can also be arranged inside the insulating substrate 131 .
  • the insulating substrate 131 may carry a circuit module 134 .
  • circuit module 134 can be formed on the insulating substrate 131 by etching, bonding, etc., and the circuit module 134 can also be connected to the insulating substrate 131 by screws or other connectors. It should be noted that, the embodiment of the present application does not limit the arrangement position of the circuit module 134 and the formation method of the circuit module 134 .
  • the circuit module 134 can be connected in series between the first conductive member 132 and the second conductive member 133, and the radio frequency signal on the antenna radiator 110 can flow into the ground plane through the first conductive member 132, the circuit module 134, and the second conductive member 133 In 140 , the antenna radiator 110 can be grounded through the circuit module 134 .
  • circuit module 134 can be electrically connected to the first conductive member 132 and the second conductive member 133 through wires.
  • the circuit module 134 can be electrically connected to the first conductive member 132 and the second conductive member 133 through wires.
  • the substrate 131 On the first surface 1311 or the second surface 1312 of the substrate 131 .
  • circuit module 134 can be electrically connected to the first conductive member 132 and the second conductive member 133 in other ways.
  • the element 132 and the second conductive element 133 are electrically connected.
  • the embodiment of the present application does not limit the specific electrical connection manner between the circuit module 134 and the first conductive member 132 and the second conductive member 133 .
  • circuit module 134 may include any series or parallel combination of one or more resistors, capacitors, inductors, and switching elements.
  • the circuit module 134 may be, but not limited to, a filter circuit, a tuning circuit, a frequency modulation circuit, a DC blocking circuit, etc., which will not be described in detail here.
  • the insulating substrate 131 of the grounding structure 130 includes a first surface 1311 and a second surface 1312 oppositely arranged, the first conductive member 132 is arranged on the first surface 1311, and the second conductive member 133 is disposed on the second surface 1312, the insulating substrate 131 carries the circuit module 134, the first end n of the circuit module 134 is electrically connected to the first conductive member 132, and the second end r of the circuit module 134 is electrically connected to the second conductive member 133,
  • the antenna radiator 110 can be grounded through the circuit module 134 .
  • the circuit module 134 does not need to be arranged on the circuit board of the antenna device 100 or electronic equipment, and the circuit module 134 does not need to be limited by the location of the circuit board.
  • 134 and the insulating substrate 131 can be arranged at the corner of the electronic device or the antenna device 100 or other positions where the circuit board is not easy to extend.
  • the location of the circuit module 134 and the insulating substrate 131 is more flexible.
  • the grounding structure 130 can be set at this position and electrically connected to the antenna radiator 110, the electrical connection between the antenna radiator 110 and the circuit module 134 is less difficult, the antenna radiator 110 can be grounded through the circuit module 134, and the antenna radiator
  • the grounding design of 110 is easier to implement.
  • FIG. 4 is a schematic structural diagram of a third antenna device provided by an embodiment of the present application
  • FIG. 5 is a schematic structural diagram of the grounding structure shown in FIG. 4
  • the antenna device 100 may further include a detection module 150 .
  • the detection module 150 may be electrically connected to the antenna radiator 110 directly or indirectly.
  • the detection module 150 can be electrically connected to the electrical connection point 111 of the antenna radiator 110 .
  • the number of electrical connection points 111 can be reduced.
  • the detection module 150 can provide a detection signal to the antenna radiator 110 to detect the electromagnetic wave absorption ratio value (Specific absorption rate, "SAR" for short) of the antenna radiator 110, and the detection module 150 can be a SAR sensor.
  • SAR Specific absorption rate
  • the SAR value can be used to evaluate the impact of electromagnetic radiation generated by electronic equipment on the human body.
  • the detection module 150 is electrically connected to the antenna radiator 110 and can detect the SAR value when the antenna radiator 110 transmits wireless signals.
  • the detection signal may be an electrical signal different from the radio frequency signal, for example, when the radio frequency signal is an AC signal.
  • the detection signal can be a DC signal or a low frequency/ultra low frequency signal.
  • the detection signal can flow on the antenna radiator 110 , and the detection signal does not need to flow into the ground plane 140 to return to the ground.
  • the detection module 150 can detect the capacitance value of the capacitor formed by the antenna radiator 110 and the ground plane 140 through the detection signal. When obstacles such as a human body or a desktop approach the antenna radiator 110, the detection signal will change, so that the antenna radiator can be detected. SAR value of 110.
  • the circuit module 134 of the grounding structure 130 can prevent the detection signal from passing through and allow the radio frequency signal to pass through, the detection signal can flow on the antenna radiator 110 without being grounded, and the radio frequency signal It can flow on the antenna radiator 110 and be grounded through the circuit module 134 , so that both the detection module 150 and the antenna radiator 110 can work normally.
  • the circuit module 134 of the ground structure 130 may be a DC blocking circuit.
  • the circuit module 134 may include a first capacitor C1, which may be a DC blocking capacitor, and the first capacitor C1 may prevent the detection signal of the DC characteristic from passing through and allow the RF signal of the AC characteristic to pass through, and the antenna
  • the device 100 can realize the integrated design of the SAR sensor and the antenna radiator 110 .
  • the circuit module 134 may also be a band-pass and band-stop circuit, for example, the circuit module 134 may be an LC oscillator circuit (not shown in FIG. 5 ). Since the detection module 150 is generally a low-frequency or ultra-low-frequency signal, and the radio-frequency signal is generally a high-frequency signal, the circuit module 134 can be an LC oscillator circuit that passes high frequency and blocks low frequency/ultra-low frequency, and the antenna device 100 can also realize SAR sensor and antenna Common body design of the radiator 110 .
  • circuit module 134 is not limited to the above-mentioned distance, and any structure that can prevent the passage of the detection signal and allow the passage of the radio frequency signal is within the protection scope of the embodiment of the present application.
  • the specific structure is not limited.
  • the circuit module 134 of the grounding structure 130 can prevent the detection signal from passing through and allow the radio frequency signal to pass through, so that the detection signal will not be grounded through the circuit module 134 and the radio frequency signal can pass through the circuit module 134 Grounded, the antenna device 100 can realize the integrated design of the SAR sensor and the antenna radiator 110; at the same time, since the circuit module 134 does not need to be limited by the location of the circuit board, the SAR sensor can detect the antenna radiator 110 arranged at any position. The detection of the SAR value of the antenna device 100 is more accurate.
  • the antenna device 100 may further include a first isolation circuit 160 and a second isolation circuit 170 .
  • the first isolation circuit 160 can be connected in series between the feed source 120 and the antenna radiator 110 , and the first isolation circuit 160 can prevent the detection signal from passing through and allow the radio frequency signal to pass through.
  • the first isolation circuit 160 may include a second capacitor C2, one end of the second capacitor C2 may be electrically connected to the feed source 120, and the other end of the second capacitor C2 may be electrically connected to the antenna radiator 110. 111 is electrically connected.
  • the second capacitor C2 can be a DC blocking capacitor or a large capacitor (capacitance value greater than 33pF), and the second capacitor C2 can prevent the detection signal from passing through and allow the radio frequency signal to pass through.
  • the second isolation circuit 170 can be connected in series between the detection module 150 and the antenna radiator 110 , and the second isolation circuit 170 can allow the detection signal to pass through and prevent the radio frequency signal from passing through.
  • the second isolation circuit 170 may include a first inductor L1, one end of the first inductor L1 may be electrically connected to the detection module 150, and the other end of the first inductor L1 may be electrically connected to the antenna radiator 110.
  • the first inductance L1 may be a DC-blocking inductance, and the first inductance L1 may prevent the radio frequency signal from passing through and allow the detection signal to pass through.
  • first isolation circuit 160 and the second isolation circuit 170 are not limited to the above examples, any structure of the first isolation circuit 160 that can prevent the detection signal from passing through and allow the radio frequency signal to pass through can be realized to prevent the radio frequency
  • the structure of the second isolation circuit 170 through which the signal passes to allow the detection signal to pass is within the protection scope of the embodiment of the present application, which is not limited in the embodiment of the present application.
  • the first isolation circuit 160 can prevent the detection signal from flowing into the feed source 120 and affect the normal operation of the feed source 120
  • the second isolation circuit 170 can prevent the radio frequency signal from flowing into the detection module 150 and affect the normal operation of the feed source 120.
  • the detection module 150 works normally, so that the antenna device 100 of the embodiment of the present application can have better radio frequency performance, and at the same time, the SAR value of the antenna radiator 110 detected by the detection module 150 is also more accurate.
  • the circuit module 134 of the grounding structure 130 can prevent the detection signal of the detection module 150 from passing through and allow the radio frequency signal to pass through to realize the common design of the SAR sensor and the antenna radiator 110, the circuit module 134 of the grounding structure 130 can also adjust the antenna The frequency of the wireless signal transmitted by the radiator 110 may also be adjusted to adjust the mode when the antenna radiator 110 transmits the wireless signal.
  • FIG. 6 is a second structural schematic diagram of the grounding structure shown in FIG. 1
  • FIG. 7 is an antenna device including the grounding structure shown in FIG. 6.
  • FIG. 8 is a schematic comparison diagram of the standing wave ratio between the antenna device including the grounding structure shown in FIG. 6 and the antenna device not including the grounding structure shown in FIG. 6 .
  • the circuit module 134 of the ground structure 130 can change the effective electrical length of the antenna radiator 110 and change the frequency of the wireless signal transmitted by the antenna radiator 110 , and the circuit module 134 can be a frequency modulation circuit.
  • the frequency modulation circuit can include a third capacitor C3, which can be connected in series between the first conductive member 132 and the second conductive member 133, and the third capacitor C3 can be a large capacitor (generally, the capacitance value is greater than 33pF).
  • the effective electrical length of the antenna radiator 110 is D1.
  • the antenna radiation The frequency of the wireless signal transmitted by the body 110 is f1.
  • the effective electrical length of the antenna radiator 110 is D2
  • the antenna radiator The frequency of the wireless signal transmitted by 110 is f2.
  • the circuit module 134 functioning as a frequency modulation circuit in the embodiment of the present application can change the electrical length of the antenna radiator 110 and can adjust the frequency of the wireless signal transmitted by the antenna radiator 110.
  • circuit module 134 functioning as a frequency modulation circuit may also be provided with a 0 ohm resistor in addition to a large capacitor, that is, the circuit module 134 functioning as a frequency modulation circuit may include a 0 ohm resistance. Any solution that can change the electrical length of the antenna radiator 110 is within the protection scope of the embodiment of the present application, and the embodiment of the present application does not limit the specific structure of the circuit module 134 that functions as a frequency modulation circuit.
  • FIG. 9 is a schematic diagram of a third structure of the grounding structure shown in FIG. 1
  • FIG. 10 is an antenna device including the grounding structure shown in FIG. 9
  • FIG. 11 is a comparison of standing wave ratios between the antenna device including the grounding structure shown in FIG. 9 and the antenna device not including the grounding structure shown in FIG. 9 schematic diagram.
  • the circuit module 134 of the grounding structure 130 can adjust the frequency of the wireless signal transmitted by the antenna radiator 110 according to the frequency selection characteristics of the inductance and capacitance, and realize the adjustment of the antenna mode.
  • the circuit module 134 can be tuned circuit.
  • the circuit module 134 may include a second inductor L2, and the second inductor L2 may be connected in series between the first conductive element 132 and the second conductive element 133 .
  • the frequency of the wireless signal transmitted by the antenna radiator 110 is f3, and the antenna radiator 110 can transmit The first type of wireless signal (such as an intermediate frequency signal); as shown in the figure f of the bottom part of Figure 10 and the figure h of the bottom part of Figure 11, when the antenna radiator 110 returns to the ground by the circuit module 134, the wireless signal transmitted by the antenna radiator 110 The frequency is f4, and the antenna radiator 110 can transmit a second type of wireless signal (eg, a high frequency signal).
  • the circuit module 134 functioning as a tuning circuit can adjust the frequency of the wireless signal transmitted by the antenna radiator 110 to realize the adjustment of the antenna mode.
  • FIG. 12 is a schematic diagram of a fourth structure of the grounding structure shown in FIG. 1
  • FIG. 13 is an antenna device including the grounding structure shown in FIG. 12 and Structural comparison diagram of an antenna device not including the ground structure shown in FIG. 12
  • FIG. 14 is a schematic diagram of a comparison of standing wave ratio between the antenna device including the ground structure shown in FIG. 12 and the antenna device not including the ground structure shown in FIG. 12 .
  • the circuit module 134 of the grounding structure 130 can be based on the frequency selection characteristics of the inductance and capacitance, the circuit module 134 can also make the antenna radiator 110 form a new resonance, and realize the adjustment of the antenna mode, the circuit module 134 can be tuned circuit.
  • the circuit module 134 may include a third inductor L3 and a fourth capacitor C4, the third inductor L3 and the fourth capacitor C4 form an LC oscillation circuit, the third inductor L3 and the fourth capacitor C4 may be connected in series between the first conductive member 132 and the second Between the conductive members 133.
  • the antenna radiator 110 when the antenna radiator 110 does not return to the ground through the circuit module 134, the antenna radiator 110 can form a first resonance, and the antenna radiator 110 can transmit frequency f5 wireless signal; as shown in Figure j in the lower part of Figure 13 and Figure l in the lower part of Figure 14, when the antenna radiator 110 returns to the ground through the circuit module 134, the antenna radiator 110 can form a first resonance and a second resonance, and the antenna radiates Body 110 may transmit wireless signals at frequencies f5 and f6.
  • the tuning circuit module 134 in this embodiment of the present application can adjust the mode of the wireless signal transmitted by the antenna radiator 110 .
  • circuit module 134 of the grounding structure 130 is only an exemplary example of the circuit module 134 of the grounding structure 130, and the specific structure of the circuit module 134 is not limited to the above example, and other schemes that can realize the grounding of the radio frequency signal transmitted by the antenna radiator 110 are all described in this application. Within the protection scope of the embodiments, no further details are given here.
  • the embodiment of the present application also provides an electronic device.
  • the electronic device may be a smart phone, a tablet computer, etc., or a game device or an augmented reality (Augmented Reality, AR) device.
  • automotive devices data storage devices, audio playback devices, video playback devices, notebook computers, desktop computing devices, etc.
  • FIG. 15 is a schematic diagram of a first structure of an electronic device provided by an embodiment of the present application.
  • the electronic device 10 may include a display screen 200 , a middle frame 300 , a circuit board 400 , a battery 500 and a rear case 600 .
  • the display screen 200 can be arranged on the middle frame 300 and connected to the rear case 600 through the middle frame 300 to form the display surface of the electronic device 10 .
  • the display screen 200 is used for displaying information such as images and texts.
  • the display screen 200 may include a liquid crystal display 200 (Liquid Crystal Display, LCD) or an organic light-emitting diode (Organic Light-Emitting Diode, OLED) display 200 and other types of display devices.
  • LCD Liquid Crystal Display
  • OLED Organic Light-Emitting Diode
  • the middle frame 300 may be a thin plate or sheet structure, or a hollow frame structure.
  • the middle frame 300 can include a middle board 320 and a frame 310, the frame 310 can be arranged around the middle board 320, the middle board 320 can provide support for the electronic devices or functional components in the electronic device 10, so that the electronic devices and functions of the electronic device 10 components fit together.
  • the circuit board 400 may be disposed on the middle frame 300 for fixing, and the circuit board 400 is sealed inside the electronic device 10 through the rear case 600 .
  • the circuit board 400 may be a main board of the electronic device 10 .
  • the feed source 120 and the detection module 150 can be disposed on the circuit board 400 .
  • a processor may also be integrated on the circuit board 400, and one or more of functional components such as an earphone jack, an acceleration detection module 150, a gyroscope, and a motor may also be integrated.
  • the display screen 200 may be electrically connected to the circuit board 400 so as to control the display of the display screen 200 through the processor on the circuit board 400 .
  • the battery 500 is disposed on the middle frame 300 , and the battery 500 is sealed inside the electronic device 10 through the rear case 600 . Meanwhile, the battery 500 is electrically connected to the circuit board 400 so that the battery 500 supplies power to the electronic device 10 .
  • the circuit board 400 may be provided with a power management circuit. The power management circuit is used to distribute the voltage provided by the battery 500 to various electronic devices in the electronic device 10 .
  • the rear case 600 is connected to the middle frame 300 .
  • the rear case 600 may be bonded to the middle frame 300 by an adhesive such as double-sided tape to achieve connection with the middle frame 300 .
  • the rear case 600 is used to seal the electronic devices and functional components of the electronic device 10 together with the middle frame 300 and the display screen 200 to protect the electronic devices and functional components of the electronic device 10 .
  • the electronic device 10 may include the antenna device 100 in the foregoing embodiments, and the antenna device 100 may be disposed on the electronic device 10 .
  • the antenna device 100 can be arranged on the casing of the electronic device 10 (that is, the surface of the electronic device 10); the antenna device 100 can also be arranged on the middle frame 300 of the electronic device 10, and the antenna device 100 can also be arranged on the electronic device 10 internal.
  • the antenna device 100 may be, but not limited to, disposed on the bottom plate of the middle frame 300 of the electronic device 10 , the circuit board 400 , a small board of the electronic device 10 , a main board, an antenna bracket of the electronic device 10 , and the like.
  • any structure that can carry the antenna device 100 can be used as the supporting part of the antenna device 100 in the embodiment of the present application, and the embodiment of the present application does not limit the specific position where the antenna device 100 is disposed on the electronic device 10 .
  • FIG. 16 is a schematic diagram of a second structure of the electronic device provided by the embodiment of the present application.
  • the middle board 320 of the electronic device 10 can form the ground plane 140
  • the electronic device 10 can include a frame 310
  • the frame 310 can be arranged around the middle board 320
  • the first gap 101 and the second gap 102 can be opened on the frame 310
  • the first gap 101 and the The second slit 102 can make the frame 310 form a metal branch 311
  • the antenna radiator 110 of the antenna device 100 can include the metal branch 311
  • the metal branch 311 can form the antenna radiator 110 .
  • a third gap 103 can be set up between the metal branch 311 and the middle plate 320.
  • the first gap 101, the second gap 102 and the third gap 103 can make the metal branch 311 in a suspended state.
  • An accommodating space 104 may be formed between them, and the ground structure 130 of the antenna device 100 may be disposed in the accommodating space 104 .
  • the grounding structure 130 can be inserted into the receiving space 104 , that is, the grounding structure 130 can be plugged into the middle plate 320 or the metal branch 311 , and the two can be detachably connected.
  • the grounding structure 130 may also be disposed in the accommodation space 104 in other ways, and the embodiment of the present application does not limit the manner in which the grounding structure 130 is disposed in the accommodation space 104 .
  • the first surface 1311 of the insulating substrate 131 can be arranged toward the metal branch 311, and the second surface 1312 of the insulating substrate 131 can be arranged toward the middle plate 320, so that the first conductive member 132 can be connected to the middle plate 320.
  • the metal branch 311 contacts and realizes electrical connection, and the second conductive member 133 can contact and realize electrical connection with the ground plane 140 .
  • the shape and structure of the insulating substrate 131 can be designed according to the actual situation of the electronic device 10 .
  • the insulating substrate 131 can be set as a rectangular structure with the same size, and the insulating substrate 131 can be inserted into the accommodation space 104 formed by the metal branch 311 and the middle frame 300 at any position.
  • the grounding structure 130 can form a standard component, which is applicable anywhere on the electronic device 10.
  • the insulating substrate 131 can also be shaped according to the specific position of the antenna radiator 110.
  • the insulating substrate 131 can also be an arc-shaped structure similar to the arc of the corner.
  • the first surface 1311 and the second surface 1312 of the insulating substrate 131 can be attached to the corners of the electronic device 10, which is more conducive to the first conductive member 132, the second conductive member 133 on the insulating substrate 131 and the antenna radiator 110 , the electrical connection of the ground plane 140 .
  • the antenna device 100 of the present application is provided with the grounding structure 130, the antenna device 100 can be arranged at the corner of the electronic device 10 as shown in FIG.
  • the insulating substrate 131 of the grounding structure 130 can carry the circuit module 134 of the grounding structure 130, the antenna device 100 can be grounded through the circuit module 134 of the grounding structure 130, and the grounding of the antenna device 100 The design is simpler.
  • the grounding structure 130 of the antenna device 100 does not need to be limited to the installation position of the circuit board 400, the antenna device 100 can be installed at any position of the electronic device 10, and the position design of the antenna device 100 is more flexible.

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Abstract

一种天线装置的接地结构、天线装置及电子设备，接地结构的绝缘基板包括相对设置的第一面和第二面，第一导电件设置于第一面，第二导电件设置于第二面，绝缘基板承载电路模块，电路模块的第一端与第一导电件电连接，电路模块的第二端与第二导电件电连接，天线辐射体可以通过电路模块实现接地。

Description

天线装置的接地结构、天线装置及电子设备
本申请要求于2021年07月23日提交中国专利局、申请号为202110839182.1、发明名称为“天线装置的接地结构、天线装置及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及通信技术领域，特别涉及一种天线装置的接地结构、天线装置及电子设备。
背景技术
随着通信技术的发展，诸如智能手机等电子设备能够实现的功能越来越多，电子设备内部设置的天线辐射体也越来越多，与天线辐射体电连接的调谐电路、匹配电路、调频电路、隔离电路、滤波电路等电路结构也越来越多。
发明内容
本申请提供一种天线装置的接地结构、天线装置及电子设备，天线装置可以不受限于电路板的设置位置而可以通过接地结构的电路模块实现接地。
第一方面，本申请提供一种天线装置的接地结构，包括：
绝缘基板，包括相对设置的第一面和第二面；
第一导电件，设置于所述第一面，所述第一导电件用于与天线辐射体电连接；
第二导电件，设置于所述第二面，所述第二导电件用于与接地平面电连接；
电路模块，所述绝缘基板承载所述电路模块，所述电路模块的第一端与所述第一导电件电连接，所述电路模块的第二端与所述第二导电件电连接，所述天线辐射体通过所述电路模块接地。
第二方面，本申请还提供了一种天线装置，包括：
天线辐射体；及
接地结构，所述接地结构包括绝缘基板、第一导电件、第二导电件和电路模块，所述绝缘基板承载所述电路模块，所述绝缘基板包括相对设置的第一面和第二面，所述第一导电件设置于所述第一面，所述第二导电件设置于所述第二面；所述第一导电件与所述天线辐射体电连接，所述第二导电件与接地平面电连接，所述电路模块的第一端与所述第一导电件电连接，所述电路模块的第 二端与所述第二导电件电连接，所述天线辐射体通过所述电路模块接地。
第三方面，本申请还提供了一种电子设备，包括天线装置，所述天线装置包括：
天线辐射体；及
接地结构，所述接地结构包括绝缘基板、第一导电件、第二导电件和电路模块，所述绝缘基板承载所述电路模块，所述绝缘基板包括相对设置的第一面和第二面，所述第一导电件设置于所述第一面，所述第二导电件设置于所述第二面；所述第一导电件与所述天线辐射体电连接，所述第二导电件与接地平面电连接，所述电路模块的第一端与所述第一导电件电连接，所述电路模块的第二端与所述第二导电件电连接，所述天线辐射体通过所述电路模块接地。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍。显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的天线装置的第一种结构示意图。
图2为本申请实施例提供的天线装置的第二种结构示意图。
图3为图1所示的接地结构的第一种结构示意图。
图4为本申请实施例提供的天线装置的第三种结构示意图。
图5为图4所示的接地结构的一种结构示意图。
图6为图1所示的接地结构的第二种结构示意图。
图7为包括图6所示的接地结构的天线装置与不包括图6所示的接地结构的天线装置的结构对比示意图。
图8为包括图6所示的接地结构的天线装置与不包括图6所示的接地结构的天线装置的驻波比对比示意图。
图9为图1所示的接地结构的第三种结构示意图。
图10为包括图9所示的接地结构的天线装置与不包括图9所示的接地结构的天线装置的结构对比示意图。
图11为包括图9所示的接地结构的天线装置与不包括图9所示的接地结 构的天线装置的驻波比对比示意图。
图12为图1所示的接地结构的第四种结构示意图。
图13为包括图12所示的接地结构的天线装置与不包括图12所示的接地结构的天线装置的结构对比示意图。
图14为包括图12所示的接地结构的天线装置与不包括图12所示的接地结构的天线装置的驻波比对比示意图。
图15为本申请实施例提供的电子设备的第一种结构示意图。
图16为本申请实施例提供的电子设备的第二种结构示意图。
具体实施方式
下面将结合本申请实施例中的附图1至附图16对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有付出创造性劳动前提下所获得的所有其他实施例，都属于本申请的保护范围。
在本文中提及“实施例”意味着，结合实施例描述的特定特征、结构或特性可以包含在本申请的至少一个实施例中。在说明书中的各个位置出现该短语并不一定均是指相同的实施例，也不是与其它实施例互斥的独立的或备选的实施例。本领域技术人员显式地和隐式地理解的是，本文所描述的实施例可以与其它实施例相结合。
本申请实施例提供一种天线装置，天线装置可以实现无线通信功能。例如天线装置可以传输无线保真(Wireless Fidelity，简称Wi-Fi)信号、全球定位系统(Global Positioning System，简称GPS)信号、第三代移动通信技术(3rd-Generation，简称3G)、第四代移动通信技术(4th-Generation，简称4G)、第五代移动通信技术(5th-Generation，简称5G)、近场通信(Near field communication，简称NFC)信号、蓝牙信号、超宽带通信信号等。
请参考图1，图1为本申请实施例提供的天线装置的第一种结构示意图。天线装置100可以包括天线辐射体110、馈源120、接地结构130和接地平面140。
馈源120可与天线辐射体110直接或间接电连接，馈源120可向天线辐射体110提供射频信号，该射频信号可激励天线辐射体110传输无线信号，例如但不 限于传输3G、4G、5G、GPS、Wi-Fi、NFC信号。
接地平面140用于形成公共地。接地平面140可以通过电子设备、天线装置100中的导体、印刷线路或者金属印刷层等形成。例如，接地平面140可以设置在电子设备的电路板上，接地平面140还可以形成在电子设备的中框上，或者也可以通过金属后壳来形成接地平面140。
需要说明的是，以上仅为接地平面140的形成方式的示例性举例，其并不限于此，其他可形成接地平面140的方式均在本申请实施例的保护范围内，本申请实施例对此不进行具体限定。
天线辐射体110可以传输无线信号。天线辐射体110可与馈源120直接或间接电连接，例如，天线辐射体110上可以设置电连接点111，馈源120可通过该电连接点111与天线辐射体110电连接。
天线辐射体110也可通过接地结构130可与接地平面140直接或间接电连接，例如，天线辐射体110上可以设置接地点112，接地平面140上可设置接地端(图1未示)，接地结构130可分别与该接地点112和接地端电连接。当馈源120向天线辐射体110馈入射频信号时，射频信号可以在天线辐射体110上流动并可通过接地结构130流入接地平面140中实现回地。
可以理解的是，天线辐射体110可以通过一个或多个接地结构130实现接地。例如，如图1所示，天线装置100可通过一个接地结构130实现接地。再例如，请参考图2，图2为本申请实施例提供的天线装置的第二种结构示意图，当天线辐射体110的辐射枝节较长，或者天线辐射体110可以形成多个天线模态时，天线辐射体110可以通过多个接地结构130接地，例如图2中天线辐射体110通过两个接地结构130接地，此时，天线辐射体110可形成多个谐振并传输多种不同频段的无线信号。
接地结构130可以分别与天线辐射体110和接地平面140电连接，以使天线辐射体110可通过接地结构130实现接地。请结合图1并请参考图3，图3为图1所示的接地结构的第一种结构示意图。接地结构130可以包括绝缘基板131、第一导电件132、第二导电件133和电路模块134。
绝缘基板131可以包括相对设置的第一面1311和第二面1312，第一面1311可以靠近天线辐射体110设置，该第二面1312可以靠近接地平面140设置。该第 一面1311和第二面1312之间可以相互绝缘。
可以理解的是，绝缘基板131可以是介质基板。介质基板可以采用聚四氟乙烯(FR4)材料制作，当然，介质基板也可以采用其他材料制作。本申请实施例对绝缘基板131的具体结构不进行限定。
第一导电件132可以设置于第一面1311，第一导电件132的一端可与天线辐射体110电连接，例如与天线辐射体110上接地点112电连接。第一导电件132的另一端可与电路模块134的第一端n电连接。
可以理解的是，接地结构130可以包括一个或多个第一导电件132，例如图3中接地结构130包括两个第一导电件132。其中，每一第一导电件132的一端可与天线辐射体110电连接，每一第一导电件132的另一端可电连接于电路模块134的第一端n。
当天线辐射体110通过多个第一导电件132与电路模块134电连接时，天线辐射体110与电路模块134的电接触面积较大，天线辐射体110与电路模块134之间的电连接稳定性更优。
可以理解的是，第一导电件132可以为导电弹片。具有弹性的第一导电件132可进一步使天线辐射体110与电路模块134的电连接更稳定。当然，第一导电件132也可以为其他的结构，例如但不限于为导线线缆，本申请实施例对第一导电件132的具体结构不进行限定。
第二导电件133可以设置于第二面1312，第二导电件133的一端可与接地平面140电连接，例如与接地平面140上的接地端电连接，第二导电件133的另一端可与电路模块134的第二端r电连接。
可以理解的是，接地结构130可以包括一个或多个第二导电件133，例如图3中接地结构130包括两个第二导电件133。每一第二导电件133的一端可与电路模块134的第二端r电连接，每一第一导电件132的另一端可电连接于接地平面140。
当电路模块134通过多个第二导电件133与接地平面140电连接时，电路模块134与接地平面140的电接触面积较大，电路模块134与接地平面140之间的电连接稳定性更优。
可以理解的是，第二导电件133可以为导电弹片。具有弹性的第二导电件 133可进一步使电路模块134与接地平面140的电连接更稳定。当然，第二导电件133也可以为其他的结构，例如但不限于为导线线缆，本申请实施例对第二导电件133的具体结构不进行限定。
电路模块134可以设置于绝缘基板131上，例如，电路模块134可以设置于绝缘基板131的第一面1311，也可以设置于绝缘基板131的第二面1312，还可以设置于绝缘基板131的内部。绝缘基板131可以承载电路模块134。
可以理解的是，电路模块134可以但不限于通过蚀刻、粘接等方式形成在绝缘基板131上，电路模块134也可以但不限于通过螺钉等连接件连接于绝缘基板131。需要说明的是，本申请实施例对电路模块134的设置位置以及电路模块134的形成方式不进行限定。
电路模块134可以串联于第一导电件132和第二导电件133之间，天线辐射体110上的射频信号可以通过第一导电件132、电路模块134、第二导电件133而流入至接地平面140内，天线辐射体110可通过电路模块134实现接地。
可以理解的是，电路模块134可以通过导线与第一导电件132、第二导电件133电连接，例如，电路模块134可以是印制电路，电路模块134及导线可以通过蚀刻等方式形成在绝缘基板131的第一面1311或第二面1312上。
当然，电路模块134可以通过其他的方式与第一导电件132、第二导电件133电连接，例如，电路模块134可以通过贯穿第一面1311和第二面1312的金属镀孔与第一导电件132、第二导电件133电连接。本申请实施例对电路模块134与第一导电件132、第二导电件133的具体电连接方式不进行限定。
可以理解的是，电路模块134可以包括一个或多个电阻、电容、电感、开关元件的任意串联、并联的组合。电路模块134可以但不限于为滤波电路、调谐电路、调频电路、隔直电路等，在此不再详述。
本申请实施例的天线装置100及接地结构130，接地结构130的绝缘基板131包括相对设置的第一面1311和第二面1312，第一导电件132设置于第一面1311，第二导电件133设置于第二面1312，绝缘基板131承载电路模块134，电路模块134的第一端n与第一导电件132电连接，电路模块134的第二端r与第二导电件133电连接，天线辐射体110可以通过电路模块134实现接地。基于此，本申请实施例的天线装置100及接地结构130，电路模块134不需要设置于天线装置100 或电子设备的电路板上，电路模块134不需要受限于电路板的设置位置，电路模块134和绝缘基板131可以设置在电子设备或天线装置100的拐角或者其他电路板不易延伸的位置，电路模块134和绝缘基板131的设置位置更灵活，当天线辐射体110设置于电路板不易延伸的位置时，接地结构130可以设置于该位置并与天线辐射体110电连接，天线辐射体110与电路模块134的电连接难度较低，天线辐射体110可以通过电路模块134实现接地，天线辐射体110的接地设计更容易实现。
请参考图4和5，图4为本申请实施例提供的天线装置的第三种结构示意图，图5为图4所示的接地结构的一种结构示意图。天线装置100还可以包括检测模块150。
检测模块150可以与天线辐射体110直接或间接的电连接。例如，检测模块150可以电连接于天线辐射体110的电连接点111，此时，当检测模块150和馈源120均电连接于同一电连接点111，可以减少电连接点111的数量。
检测模块150可以向天线辐射体110提供检测信号，以检测天线辐射体110的电磁波吸收比率值(Specific absorption rate，简称“SAR”)，检测模块150可以是SAR传感器。
可以理解的是，可以用SAR值来评价电子设备产生的电磁辐射对人体的影响。SAR值越大，表示对人体的影响越大。检测模块150与天线辐射体110电连接，可以检测天线辐射体110传输无线信号时的SAR值。
可以理解的是，检测信号可以是区别于射频信号的电信号，例如当射频信号为交流信号。中高频信号时，检测信号可以是直流信号或者低频/超低频信号。检测信号可以在天线辐射体110上流动，并且，检测信号不需要流入接地平面140而实现回地。检测模块150可以通过该检测信号检测天线辐射体110与接地平面140构成电容的电容值，当人体、桌面等障碍物靠近天线辐射体110时，检测信号会产生变化，从而可以检测出天线辐射体110的SAR值。
当天线装置100同时包括检测模块150和馈源120时，接地结构130的电路模块134可以阻止检测信号通过而允许射频信号通过，检测信号可以在天线辐射体110上流动并不接地，而射频信号可以在天线辐射体110上流动并通过电路模块134接地，从而检测模块150与天线辐射体110均可以正常工作。
可以理解的是，接地结构130的电路模块134可以是隔直电路。如图5所示，电路模块134可以包括第一电容C1，该第一电容C1可以是隔直电容，第一电容C1可以阻止直流特性的检测信号通过而可以允许交流特性的射频信号通过，天线装置100可以实现SAR传感器与天线辐射体110的共体设计。
可以理解的是，电路模块134也可以是带通带阻电路，例如电路模块134可以为LC振荡电路(图5未示)。由于检测模块150一般为低频或超低频信号，而射频信号一般为高频信号，电路模块134可以是通高频而阻低频/超低频的LC振荡电路，天线装置100也可以实现SAR传感器与天线辐射体110的共体设计。
需要说明的是，电路模块134的具体结构并不局限于上述距离，凡是可阻止检测信号通过而允许射频信号通过的结构均在本申请实施例的保护范围内，本申请实施例对电路模块134的具体结构不进行限定。
本申请实施例的天线装置100及接地结构130，接地结构130的电路模块134可以阻止检测信号通过而允许射频信号通过，从而，检测信号不会通过电路模块134接地而射频信号可通过电路模块134接地，天线装置100可以实现SAR传感器与天线辐射体110的共体设计；同时，由于电路模块134不需要受限于电路板的设置位置，SAR传感器可以检测设置于任意位置处的天线辐射体110的SAR值，天线装置100的SAR值的检测更准确。
其中，请再次参考图4，天线装置100还可以包括第一隔离电路160和第二隔离电路170。
第一隔离电路160可以串联于馈源120与天线辐射体110之间，第一隔离电路160可以阻止检测信号通过而允许射频信号通过。
可以理解的是，第一隔离电路160可以包括第二电容C2，该第二电容C2的一端可与馈源120电连接，该第二电容C2的另一端可与天线辐射体110的电连接点111电连接。
可以理解的是，该第二电容C2可以是隔直电容，也可以是大电容(电容值大于33pF)，第二电容C2可以阻止检测信号通过而允许射频信号通过。
第二隔离电路170可以串联于检测模块150与天线辐射体110之间，第二隔离电路170可以允许检测信号通过而阻止射频信号通过。
可以理解的是，第二隔离电路170可以包括第一电感L1，该第一电感L1的 一端可与检测模块150电连接，该第一电感L1的另一端可与天线辐射体110的电连接点111连接，该第一电感L1可以是通直隔交电感，第一电感L1可以阻止射频信号通过而允许检测信号通过。
可以理解的是，第一隔离电路160、第二隔离电路170的结构并不局限于上述举例，凡是可实现阻止检测信号通过而允许射频信号通过的第一隔离电路160的结构、可实现阻止射频信号通过而允许检测信号通过的第二隔离电路170的结构均在本申请实施例的保护范围内，本申请实施例对此不进行限定。
本申请实施例的天线装置100，第一隔离电路160可以阻止检测信号流入至馈源120中而影响馈源120的正常工作，第二隔离电路170可以阻止射频信号流入至检测模块150中而影响检测模块150的正常工作，从而本申请实施例的天线装置100可以具有较优的射频性能，同时，检测模块150检测的天线辐射体110的SAR值也更准确。
其中，接地结构130的电路模块134除了可以阻止检测模块150的检测信号通过而允许射频信号通过以实现SAR传感器与天线辐射体110的共体设计外，接地结构130的电路模块134还可以调节天线辐射体110传输的无线信号的频率，或者还可以调节天线辐射体110传输无线信号时的模态。
示例性的，请结合图1并请参考图6至图8，图6为图1所示的接地结构的第二种结构示意图，图7为包括图6所示的接地结构的天线装置与不包括图6所示的接地结构的天线装置的结构对比示意图，图8为包括图6所示的接地结构的天线装置与不包括图6所示的接地结构的天线装置的驻波比对比示意图。
如图6所示，接地结构130的电路模块134可以改变天线辐射体110的有效电长度并改变天线辐射体110传输无线信号的频率，电路模块134可为调频电路。调频电路可包括第三电容C3，第三电容C3可串联在第一导电件132和第二导电件133之间，该第三电容C3可为大电容(一般指电容值大于33pF)。如图7上部的图a所示，当天线辐射体110不通过电路模块134回地时，天线辐射体110的有效电长度为D1，此时，如图8上部的图c所示，天线辐射体110传输的无线信号的频率为f1。如图7下部的图b所示，当天线辐射体110通过电路模块134回地时，天线辐射体110的有效电长度为D2，此时，如图8下部的图所d示，天线辐射体110传输的无线信号的频率为f2。本申请实施例的起调频电路作用的电路模块 134，可以改变天线辐射体110的电长度，并可调节天线辐射体110传输的无线信号的频率。
需要说明的是，起调频电路作用的电路模块134除了设置大电容外，还可以设置0欧姆电阻，也即，起调频电路作用的电路模块134可以包括0欧姆电阻。凡是可改变天线辐射体110的电长度的方案均在本申请实施例的保护范围内，本申请实施例对起调频电路作用的电路模块134的具体结构不进行限定。
再示例性的，请结合图1并请参考图9至和图11，图9为图1所示的接地结构的第三种结构示意图，图10为包括图9所示的接地结构的天线装置与不包括图9所示的接地结构的天线装置的结构对比示意图，图11为包括图9所示的接地结构的天线装置与不包括图9所示的接地结构的天线装置的驻波比对比示意图。
如图9所示，接地结构130的电路模块134可以根据电感、电容的频选特性，电路模块134可以调节天线辐射体110传输无线信号的频率，实现天线模态的调节，电路模块134可为调谐电路。电路模块134可包括第二电感L2，第二电感L2可串联在第一导电件132和第二导电件133之间。如图10上部的图e和图11上部的图g所示，当天线辐射体110不通过电路模块134回地时，天线辐射体110传输的无线信号的频率为f3，天线辐射体110可传输第一类型的无线信号(例如中频信号)；如图10下部的图f和图11下部的图h所示，当天线辐射体110通过电路模块134回地时，天线辐射体110传输的无线信号的频率为f4，天线辐射体110可传输第二类型的无线信号(例如高频信号)。本申请实施例起调谐电路作用的电路模块134可以调节天线辐射体110传输无线信号的频率，实现天线模态的调节。
又示例性的，请结合图1并请参考图12至图14，图12为图1所示的接地结构的第四种结构示意图，图13为包括图12所示的接地结构的天线装置与不包括图12所示的接地结构的天线装置的结构对比示意图，图14为包括图12所示的接地结构的天线装置与不包括图12所示的接地结构的天线装置的驻波比对比示意图。
如图12所示，接地结构130的电路模块134可以根据电感、电容的频选特性，电路模块134还可以使天线辐射体110形成新的谐振，实现天线模态的调节，电路模块134可为调谐电路。电路模块134可包括第三电感L3和第四电容C4，第 三电感L3和第四电容C4和形成LC振荡电路，第三电感L3和第四电容C4可串联在第一导电件132和第二导电件133之间。如图13上部的图i和图14上部的图k所示，当天线辐射体110不通过电路模块134回地时，天线辐射体110可形成第一谐振，天线辐射体110可传输频率为f5的无线信号；如图13下部的图j和图14下部的图l所示，当天线辐射体110通过电路模块134回地时，天线辐射体110可形成第一谐振和第二谐振，天线辐射体110可传输频率为f5和f6的无线信号。本申请实施例起调谐作用的电路模块134可以对天线辐射体110传输无线信号模态进行调节。
可以理解的是，以上仅为接地结构130的电路模块134的示例性举例，电路模块134的具体结构不局限于上述举例，其他可实现天线辐射体110传输的射频信号接地的方案均在本申请实施例的保护范围内，在此不再详述。
基于上述接地结构130及天线装置100，本申请实施例还提供了一种电子设备，电子设备可以是智能手机、平板电脑等设备，还可以是游戏设备、增强现实(Augmented Reality，简称AR)设备、汽车装置、数据存储装置、音频播放装置、视频播放装置、笔记本电脑、桌面计算设备等。
请参考图15，图15为本申请实施例提供的电子设备的第一种结构示意图。电子设备10可以包括显示屏200、中框300、电路板400、电池500和后壳600。
显示屏200可以设置在中框300上，并通过中框300连接至后壳600上，以形成电子设备10的显示面。显示屏200用于显示图像、文本等信息。其中，显示屏200可以包括液晶显示屏200(Liquid Crystal Display，LCD)或有机发光二极管(Organic Light-Emitting Diode，OLED)显示屏200等类型的显示器件。
中框300可以为薄板状或薄片状的结构，也可以为中空的框体结构。中框300可以包括中板320和边框310，边框310可围绕中板320设置，中板320可为电子设备10中的电子器件或功能组件提供支撑作用，以将电子设备10的电子器件、功能组件安装到一起。
电路板400可以设置在中框300上以进行固定，并通过后壳600将电路板400密封在电子设备10的内部。其中，电路板400可以为电子设备10的主板。馈源120和检测模块150可以设置于电路板400上。电路板400上也可以集成有处理器，此外还可以集成耳机接口、加速度检测模块150、陀螺仪、马达等功能组件中 的一个或多个。同时，显示屏200可以电连接至电路板400，以通过电路板400上的处理器对显示屏200的显示进行控制。
电池500设置在中框300上，并通过后壳600将电池500密封在电子设备10的内部。同时，电池500电连接至电路板400，以实现电池500为电子设备10供电。其中，电路板400上可以设置有电源管理电路。电源管理电路用于将电池500提供的电压分配到电子设备10中的各个电子器件。
后壳600与中框300连接。例如，后壳600可以通过诸如双面胶等粘接剂贴合到中框300上以实现与中框300的连接。其中，后壳600用于与中框300、显示屏200共同将电子设备10的电子器件和功能组件密封在电子设备10内部，以对电子设备10的电子器件和功能组件形成保护作用。
其中，电子设备10可以包括前述实施例中的天线装置100，天线装置100可以设置于电子设备10。例如，天线装置100可以设置于电子设备10的壳体上(即电子设备10的表面)；天线装置100也可以设置于电子设备10的中框300上，天线装置100还可以设置于电子设备10的内部。天线装置100可以但不限于设置于电子设备10的中框300的底板、电路板400、电子设备10的小板、主板、电子设备10的天线支架等。
需要说明的是，凡是可承载天线装置100的结构均可以作为本申请实施例的天线装置100的承载部件，本申请实施例对天线装置100设置于电子设备10的具体位置不进行限定。
基于上述天线装置100及电子设备10的结构，请参考图16，图16为本申请实施例提供的电子设备的第二种结构示意图。
电子设备10的中板320可以形成接地平面140，电子设备10可以包括边框310，边框310可以环绕中板320设置，边框310上可以开设第一缝隙101和第二缝隙102，第一缝隙101和第二缝隙102可使边框310形成金属枝节311，天线装置100的天线辐射体110可以包括该金属枝节311，该金属枝节311可形成天线辐射体110。
同时，金属枝节311与中板320之间可以开设第三缝隙103，该第一缝隙101、第二缝隙102和第三缝隙103可使金属枝节311呈悬浮状态，金属枝节311与中板320之间可形成容纳空间104，天线装置100的接地结构130可设置在该容纳空间 104内。
可以理解的是，接地结构130可以插入容纳空间104内，也即，接地结构130可与中板320或金属枝节311插入式卡接，二者可为可拆卸式连接。当然，接地结构130也可以通过其他的方式设置于容纳空间104，本申请实施例对接地结构130设置于容纳空间104的方式不进行限定。
当接地结构130设置于容纳空间104时，绝缘基板131的第一面1311可以朝向金属枝节311设置，绝缘基板131的第二面1312可以朝向中板320设置，以使得第一导电件132可与金属枝节311接触并实现电连接，第二导电件133可与接地平面140接触并实现电连接。
可以理解的是，绝缘基板131的形状、结构可以根据电子设备10的实际情况进行设计。例如，绝缘基板131可以设置为同一尺寸的矩形结构，绝缘基板131可以插入任意位置处的金属枝节311与中框300形成的容纳空间104内，此时，接地结构130可形成标准部件，可适用于电子设备10的任意位置。
当然，绝缘基板131也可以根据天线辐射体110的具体位置而进行形状设计，例如，当天线辐射体110设置于电子设备10的拐角时，绝缘基板131也可以为与拐角弧度近似的弧形结构，此时，绝缘基板131的第一面1311和第二面1312可与电子设备10的拐角贴合，更利于绝缘基板131上的第一导电件132、第二导电件133与天线辐射体110、接地平面140的电连接。
可以理解的是，由于本申请的天线装置100设置了接地结构130，因此，天线装置100可以如图12所示而设置于电子设备10的拐角处，虽然，电子设备10的电路板400受到前置摄像头的影响而不能延伸至拐角，但是，由于接地结构130的绝缘基板131可以承载接地结构130的电路模块134，天线装置100可以通过接地结构130的电路模块134实现接地，天线装置100的接地设计更简单。
本申请实施例的电子设备10，天线装置100的接地结构130不需要受限于电路板400的设置位置，天线装置100可以设置于电子设备10的任意位置，天线装置100的位置设计更灵活。
需要理解的是，在本申请的描述中，诸如“第一”、“第二”等术语仅用于区分类似的对象，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。
以上对本申请实施例所提供的天线装置的接地结构、天线装置及电子设备进行了详细介绍。本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种天线装置的接地结构，包括：
    绝缘基板，包括相对设置的第一面和第二面；
    第一导电件，设置于所述第一面，所述第一导电件用于与天线辐射体电连接；
    第二导电件，设置于所述第二面，所述第二导电件用于与接地平面电连接；
    电路模块，所述绝缘基板承载所述电路模块，所述电路模块的第一端与所述第一导电件电连接，所述电路模块的第二端与所述第二导电件电连接，所述天线辐射体通过所述电路模块接地。
  2. 根据权利要求1所述的天线装置的接地结构，其中，所述接地结构包括多个第一导电件，每一所述第一导电件电连接于所述第一端；和/或，所述接地结构包括多个第二导电件，每一所述第二导电件电连接于所述第二端。
  3. 根据权利要求1所述的天线装置的接地结构，其中，所述第一导电件为导电弹片；和/或，所述第二导电件为导电弹片。
  4. 根据权利要求1所述的天线装置的接地结构，其中，所述天线辐射体用于传输馈源提供的射频信号及检测模块提供的检测信号；
    所述电路模块用于阻止所述检测信号通过而允许所述射频信号通过，所述射频信号通过所述电路模块接地。
  5. 根据权利要求1所述的天线装置的接地结构，其中，所述电路模块用于调节所述天线辐射体传输的无线信号的频率；和/或，所述电路模块用于调节所述天线辐射体传输无线信号时的模态。
  6. 一种天线装置，包括：
    天线辐射体；及
    接地结构，所述接地结构包括绝缘基板、第一导电件、第二导电件和电路模块，所述绝缘基板承载所述电路模块，所述绝缘基板包括相对设置的第一面和第二面，所述第一导电件设置于所述第一面，所述第二导电件设置于所述第二面；所述第一导电件与所述天线辐射体电连接，所述第二导电件与接地平面电连接，所述电路模块的第一端与所述第一导电件电连接，所述电路模块的第二端与所述第二导电件电连接，所述天线辐射体通过所述电路模块接地。
  7. 根据权利要求6所述的天线装置，其中，所述天线装置还包括：
    馈源，与所述天线辐射体电连接，所述馈源用于向所述天线辐射体提供射频信号；及
    检测模块，与所述天线辐射体电连接，所述检测模块用于向所述天线辐射体提供检测信号；其中，
    所述电路模块用于阻止所述检测信号通过而允许所述射频信号通过，所述射频信号通过所述电路模块接地。
  8. 根据权利要求7所述的天线装置，其中，所述天线装置还包括：
    第一隔离电路，串联于所述馈源与所述天线辐射体之间，所述第一隔离电路用于阻止所述检测信号通过而允许所述射频信号通过；及
    第二隔离电路，串联于所述检测模块与所述天线辐射体之间，所述第二隔离电路用于允许所述检测信号通过而阻止所述射频信号通过。
  9. 根据权利要求8所述的天线装置，其中，所述天线辐射体上设有电连接点，所述馈源和所述检测模块与所述电连接点电连接。
  10. 根据权利要求6所述的天线装置，其中，所述电路模块用于调节所述天线辐射体传输的无线信号的频率；和/或，所述电路模块用于调节所述天线辐射体传输无线信号时的模态。
  11. 根据权利要求6所述的天线装置，其中，所述接地结构包括多个第一导电件，每一所述第一导电件电连接于所述第一端；和/或，所述接地结构包括多个第二导电件，每一所述第二导电件电连接于所述第二端。
  12. 根据权利要求6所述的天线装置，其中，所述第一导电件为导电弹片；和/或，所述第二导电件为导电弹片。
  13. 一种电子设备，包括天线装置，所述天线装置包括：
    天线辐射体；及
    接地结构，所述接地结构包括绝缘基板、第一导电件、第二导电件和电路模块，所述绝缘基板承载所述电路模块，所述绝缘基板包括相对设置的第一面和第二面，所述第一导电件设置于所述第一面，所述第二导电件设置于所述第二面；所述第一导电件与所述天线辐射体电连接，所述第二导电件与接地平面电连接，所述电路模块的第一端与所述第一导电件电连接，所述电路模块的第 二端与所述第二导电件电连接，所述天线辐射体通过所述电路模块接地。
  14. 根据权利要求13所述的电子设备，其中，所述电子设备还包括：
    中板，所述中板上形成有接地平面；及
    边框，环绕所述中板设置，所述边框上形成有金属枝节，所述天线辐射体包括所述金属枝节，所述金属枝节与所述中板之间形成有容纳空间，所述接地结构设置于所述容纳空间内。
  15. 根据权利要求13所述的电子设备，其中，所述天线装置还包括：
    馈源，与所述天线辐射体电连接，所述馈源用于向所述天线辐射体提供射频信号；及
    检测模块，与所述天线辐射体电连接，所述检测模块用于向所述天线辐射体提供检测信号；其中，
    所述电路模块用于阻止所述检测信号通过而允许所述射频信号通过，所述射频信号通过所述电路模块接地。
  16. 根据权利要求15所述的电子设备，其中，所述天线装置还包括：
    第一隔离电路，串联于所述馈源与所述天线辐射体之间，所述第一隔离电路用于阻止所述检测信号通过而允许所述射频信号通过；及
    第二隔离电路，串联于所述检测模块与所述天线辐射体之间，所述第二隔离电路用于允许所述检测信号通过而阻止所述射频信号通过。
  17. 根据权利要求16所述的电子设备，其中，所述天线辐射体上设有电连接点，所述馈源和所述检测模块与所述电连接点电连接。
  18. 根据权利要求13所述的电子设备，其中，所述电路模块用于调节所述天线辐射体传输的无线信号的频率；和/或，所述电路模块用于调节所述天线辐射体传输无线信号时的模态。
  19. 根据权利要求13所述的电子设备，其中，所述接地结构包括多个第一导电件，每一所述第一导电件电连接于所述第一端；和/或，所述接地结构包括多个第二导电件，每一所述第二导电件电连接于所述第二端。
  20. 根据权利要求13所述的电子设备，其中，所述第一导电件为导电弹片；和/或，所述第二导电件为导电弹片。
PCT/CN2022/087940 2021-07-23 2022-04-20 天线装置的接地结构、天线装置及电子设备 Ceased WO2023000733A1 (zh)

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