WO2022269979A1 - 3次元造形装置及び3次元造形方法 - Google Patents
3次元造形装置及び3次元造形方法 Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
- B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
- B29C64/124—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
- B29C64/129—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask
- B29C64/135—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask the energy source being concentrated, e.g. scanning lasers or focused light sources
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/264—Arrangements for irradiation
- B29C64/268—Arrangements for irradiation using laser beams; using electron beams [EB]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/386—Data acquisition or data processing for additive manufacturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/386—Data acquisition or data processing for additive manufacturing
- B29C64/393—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
Definitions
- the embodiments of the present invention relate to a three-dimensional modeling apparatus and a three-dimensional modeling method.
- the lithography resin is cured and layered layer by layer to form a layered structure, and by changing the laser output, AOM (Acoustic-Optical Modulator), and laser scanning speed, The exposure dose of the focused spot was adjusted to change the voxel size in which the lithographic material was cured to obtain the desired surface structure for the layered structure.
- AOM Acoustic-Optical Modulator
- the surface structure formation accuracy depends on the voxel size, galvanometer mirror, acousto-optical element (AOM), stage movement accuracy, etc., and it is said that it is not always possible to form the desired surface structure. There was a problem.
- an object of the embodiments of the present invention is to provide a three-dimensional modeling apparatus and a three-dimensional modeling method capable of realizing a desired surface structure without reducing the modeling speed.
- the three-dimensional modeling apparatus of the embodiment includes a laser light source that emits processing light, and the processing light at a predetermined processing position in a photocurable resin bath based on a predetermined three-dimensional data set. and a phase control unit for generating a phase control signal for making the wavefront shape of the three-dimensional surface shape body that constitutes the surface of the three-dimensional modeled object corresponding to the three-dimensional data set; a phase conversion unit that modulates the phase of the machining light based on the signal and emits it to the photocurable resin bath side.
- FIG. 1 is a block diagram showing a configuration example of an optical shaping apparatus as a three-dimensional shaping apparatus according to the first embodiment.
- FIG. 2 is an external perspective view of an example of a three-dimensional structure.
- FIG. 3 is a cross-sectional view of a three-dimensional structure.
- FIG. 4 is a diagram (part 1) for explaining the relationship between the total exposure area and the exposable area.
- FIG. 5 is a diagram (part 2) for explaining the relationship between the total exposure area and the exposable area.
- FIG. 6 is an explanatory diagram of a case where the three-dimensional surface profile is large and multiple exposures are required.
- FIG. 7 is an explanatory diagram of a three-dimensional surface profile for each exposure unit.
- FIG. 1 is a block diagram showing a configuration example of an optical shaping apparatus as a three-dimensional shaping apparatus according to the first embodiment.
- FIG. 2 is an external perspective view of an example of a three-dimensional structure.
- FIG. 3 is a cross-sectional
- FIG. 8 is a block diagram showing a configuration example of an optical shaping apparatus according to the second embodiment.
- FIG. 9 is a block diagram showing a configuration example of an optical shaping apparatus according to the third embodiment.
- FIG. 10 is a block diagram showing a configuration example of an optical shaping apparatus according to the fourth embodiment.
- FIG. 1 is a block diagram showing a configuration example of an optical shaping apparatus as a three-dimensional shaping apparatus according to the first embodiment.
- the stereolithography apparatus 10 of the first embodiment includes a laser light source 11, a beam splitter 12, a spatial light modulator (SLM) 13, a first lens 14, a mirror 15, and a second lens. 16 , a photocurable resin bath 17 and a controller 18 .
- the first lens 14, the mirror 15, and the second lens 16 constitute a reduction imaging system (reduction optical system).
- the lithography resin liquid as the photo-curing resin contained in the photo-curing resin bath 17 is exposed to light, and a wavelength capable of curing the lithography resin using multiphoton (for example, two-photon) absorption is used.
- a laser diode that emits processing light L having a is used.
- examples of materials for the lithography resin include epoxy-based resins and acrylic-based resins.
- the beam splitter 12 guides the processing light L emitted from the laser light source 11 to the spatial light modulator 13 side, and guides the phase-modulated processing light L to the mirror 15 .
- the processing light L may be incident on the spatial light modulator 13 at an angle without using the beam splitter.
- the spatial light modulator 13 phase-modulates the incident processing light L based on the three-dimensional data set D3D input from the control unit 18, forms an intermediate image IMM via the beam splitter 12, and forms a reduced image. It leads to the first lens 14 that constitutes the system.
- the first lens 14 functions as a condensing lens, collects the processing light L, and guides it to the mirror 15 .
- the mirror 15 reflects the processing light L and guides it to the second lens 16 .
- the second lens 16 functions as an imaging lens and forms a reduced image IM at a predetermined focal position of the photocurable resin bath 17 . As a result, the lithography resin is cured in a three-dimensional shape corresponding to the reduced image IM.
- the photocurable resin bath 17 has a water tank shape and is capable of holding the lithography resin liquid.
- the resin bath may have a top lid structure that is transparent to processing light and prevents oxygen from entering. Alternatively, it may be directly held in the space between the second lens and the stage by surface tension.
- the photocurable resin bath 17 is provided with a stage 17S that supports the cured lithography resin and that can be moved three-dimensionally (vertically, horizontally, forward and backward) under the control of the control unit 18. ing.
- the stage 17S can change the effective focus position (modeling position) of the reduction optical system by moving in the vertical direction, the horizontal direction, or the front-rear direction.
- the control unit 18 functions as a phase control unit, controls the spatial light modulator 13, and generates and outputs a three-dimensional data set D3D for forming a three-dimensional modeled object to be modeled.
- the data format of the three-dimensional data set D3D can be any data format as long as it can express the three-dimensional shape including the internal structure.
- a three-dimensional modeled object is composed of a laminated structure representing its internal structure and one or more three-dimensional surface shape bodies covering the laminated structure. Therefore, a data format capable of expressing the laminated structure and the three-dimensional surface shape is adopted as the data format of the three-dimensional data set D3D.
- control unit 18 controls the output of the processing light L emitted by controlling the laser light source 11 according to the three-dimensional modeled object or the lithography resin. Further, the control unit 18 controls the stage 17S to control the curing position of the lithography resin according to the formation state of the three-dimensional modeled object.
- FIG. 2 is an external perspective view of an example of a three-dimensional structure.
- a three-dimensional structure OBJ in FIG. 2 is a microlens.
- a microlens as the three-dimensional modeled object OBJ constitutes a so-called plano-convex lens, and has a circular shape in plan view.
- the surface of the convex portion of the microlens has a smooth curved surface, and optically does not have unevenness on the surface. Even if the three-dimensional structure OBJ is not an optical element, the same applies if the three-dimensional structure OBJ has a smooth surface.
- FIG. 3 is a cross-sectional view of a three-dimensional structure.
- the three-dimensional structure OBJ is composed of a layered structure BOD and one or more three-dimensional surface shapes SUR covering the layered structure BOD.
- the three-dimensional surface body SUR forms the surface of the three-dimensional structure OBJ and has a smooth surface.
- FIG. 4 is a diagram (part 1) for explaining the relationship between the total exposure area and the exposable area.
- FIG. 4A when the entire exposure area AR2 of the three-dimensional surface structure SUR is included in the exposable area AR1 that can be exposed by one irradiation of the processing light L, that is, the target
- the shape of the three-dimensional surface structure body SUR fits within a single exposure area, as shown in the cross-sectional view of FIG.
- the three-dimensional surface structure body SUR constituting .
- FIG. 5 is a diagram (part 2) for explaining the relationship between the total exposure area and the exposable area.
- FIG. 5 when the entire exposure area AR2 of the three-dimensional surface figure SUR is not included in the single exposable area AR1, that is, when the shape of the target dimensional surface figure SUR is does not fit within a single exposable area, a seam between exposures will occur.
- an ineffective area an area that does not function effectively as a three-dimensional model
- a joint should be provided in the ineffective area NEN.
- the joint may be provided in an area where the inclination of the tangent line of the cross section changes little. In other words, it is sufficient to provide a joint in a region in which the slope of the surface does not change abruptly. Furthermore, as shown in FIG. 4, in the case of having a repeating structure, it is considered that in-plane characteristic variations can be suppressed by curing the repeating structure unit.
- control unit 18 raises the stage 17S to a predetermined position, exposes the lowermost layer LY constituting the laminated structure BOD, and sequentially drives the stage 17S in the left-right direction and the front-rear direction to deposit the lithography resin. Curing is performed to form one layer LY on the stage 17S.
- the processing light L emitted from the laser light source 11 is incident on the beam splitter 12 and guided to the spatial light modulator 13 side by the beam splitter 12 .
- the spatial light modulator 13 directs the processing light L to the beam splitter 12 while keeping the wavefront flat without performing phase modulation.
- the beam splitter 12 forms an intermediate image IMM of the layer LY with the processing light L as it is, and guides it to the first lens 14 that constitutes the reduction imaging system.
- the first lens 14 functions as a condenser lens, condenses the processing light L and guides it to the mirror 15 , and the mirror 15 reflects the processing light L and guides it to the second lens 16 .
- the second lens 16 functions as an imaging lens and forms a reduced image IM at a predetermined focal position of the photocurable resin bath 17 .
- the lithography resin is cured in the shape (plate shape) of the layer LY corresponding to the reduced image IM.
- control unit 18 moves the stage 17S in the left-right direction and the front-rear direction in consideration of the curing time of the lithography resin, thereby forming the flat layer LY.
- the controller 18 lowers the stage 17S by one step corresponding to the thickness of the layer LY, and similarly exposes and forms the second layer LY.
- control unit 18 shifts to the process of forming the three-dimensional surface body SUR.
- the stage 17S is raised to a predetermined position corresponding to the formation of the three-dimensional surface body SUR.
- the processing light L emitted from the laser light source 11 is incident on the beam splitter 12 and guided to the spatial light modulator 13 side by the beam splitter 12 .
- the spatial light modulator 13 phase-modulates the incident processing light L according to the shape of the three-dimensional surface structure SUR based on the three-dimensional data set D3D input from the control unit 18, and transmits the intermediate light L through the beam splitter 12.
- the image is formed as an image IMM and led to a first lens 14 that constitutes a reduction imaging system.
- the first lens 14 functions as a condensing lens, collects the processing light L, and guides it to the mirror 15 .
- the mirror 15 reflects the processing light L and guides it to the second lens 16 .
- the second lens 16 functions as an imaging lens and forms a reduced image IM at a predetermined focal position of the photocurable resin bath 17 .
- the lithography resin is cured in the shape of the three-dimensional surface body SUR corresponding to the reduced image IM.
- the exposure is performed, and as shown in FIG. A three-dimensional surface body SUR is integrally formed.
- FIG. 6 is an explanatory diagram of a case where the three-dimensional surface profile is large and multiple exposures are required.
- FIG. 7 is an explanatory diagram of a three-dimensional surface profile for each exposure unit.
- the control unit 18 sequentially updates the three-dimensional data set D3D to the shape of the desired three-dimensional surface shape body SURx according to the exposure position.
- stage 17S is driven vertically, horizontally, and longitudinally to cure the lithography resin so that the focus position corresponds to the updated three-dimensional data set D3D.
- the boundary line BL that defines the joint between the three-dimensional surface bodies SURx is set in a region where the inclinations of the surfaces of the adjacent three-dimensional surface bodies SURx do not change abruptly.
- a plurality of three-dimensional surface features SURx as shown in FIG. 7 are sequentially formed on the surface of the laminated structure BOD on the stage 17S, and finally the three-dimensional surface feature SUR is formed.
- the solid line represents the shape of the ideal three-dimensional surface shape body SUR.
- overlapping exposure areas are set to reliably form the three-dimensional surface body SUR.
- the already cured lithography resin (another cured three-dimensional surface structure SURx) does not affect curing, so that the final state is the same as in FIG. It can be hardened.
- the spatial light modulator 13 creates a three-dimensional intermediate image IMM, which is reduced and projected using a high-magnification lens to create a desired three-dimensional image in the lithography resin.
- a desired surface structure without steps can be obtained.
- the processing can be performed with one exposure regardless of the fineness of the surface of the three-dimensional modeled object within a single exposure area. It does not cause a decrease in processing speed due to hardness.
- the joint portion between the regions is the inclination between the regions (the change in the inclination between the regions) when the three-dimensional data set D3D is generated.
- the three-dimensional data set D3D as exposure data includes data (two-dimensional data) corresponding to the laminated structure BOD and data (three-dimensional data) corresponding to the three-dimensional surface structure SUR. ), so that not only can the molding process be speeded up, but also the data volume can be reduced and the data can be easily compressed.
- FIG. 8 is a block diagram showing a configuration example of an optical shaping apparatus according to the second embodiment.
- the stereolithography apparatus 10A of the second embodiment includes a laser light source 11, a beam splitter 12, a spatial light modulator 13, a first lens 14, a half mirror 15A, a second lens 16, and a photocurable resin.
- a bath 17 , a control section 18 , a half mirror 19 , a first light receiving section 20 , an observation light source 21 , a third lens 22 , a second light receiving section 23 and a display section 24 are provided.
- the first lens 14, the half mirror 15A, and the second lens 16 constitute a reduction imaging system (reduction optical system).
- the beam splitter 12 guides the processing light L emitted from the laser light source 11 to the spatial light modulator 13 side, and guides the phase-modulated processing light L to the half mirror 19 .
- the half mirror 19 reflects part of the phase-modulated processing light L to the first light receiving unit 20 and transmits the rest to the first lens 14 side.
- the first light receiving unit 20 outputs an image signal corresponding to the intermediate image IMM to the control unit 18 based on the processing light L that has entered. Therefore, the operator of the control unit 18 can grasp the modulation state of the spatial light modulator 13 at the stage of the intermediate image IMM and obtain a better intermediate image IMM.
- the processing light L that has passed through the half mirror 19 and passed through the first lens 14 functioning as a condensing lens is reflected by the half mirror 15A and formed into a reduced image IM by the second lens 16 functioning as an imaging lens.
- An image is formed at a predetermined focal position of the photocurable resin bath 17 .
- the lithography resin is cured in a three-dimensional shape corresponding to the reduced image IM.
- the observation light emitted from the observation light source 21 enters the photocurable resin bath 17, and part of it passes through the half mirror 15A to form a third lens functioning as an objective lens. 22.
- the third lens 22 forms an image of the cured lithography resin on the second light receiving section 23 in a three-dimensional shape corresponding to the reduced image IM.
- the second light receiving unit 23 Based on the incident observation light, the second light receiving unit 23 outputs an image signal corresponding to an image of the lithographic resin cured in a three-dimensional shape corresponding to the reduced image IM to the control unit 18 . Therefore, the operator of the control unit 18 can grasp the state of the lithographic resin cured in the three-dimensional shape corresponding to the reduced image IM, and can control the spatial light modulator 13 more realistically.
- the image obtained by the first light receiving unit 20 corresponding to the intermediate image IMM or the second light receiving unit 23 corresponding to the reduced image (condensed image) IM is compared with the target image, and the phase distribution of the spatial light modulator 13 is determined. By updating , a condensing pattern closer to the target can be obtained.
- the degree of divergence between the actual image and the target image can be measured using an index such as least square error or PSNR (Peak Signal to Noise Ratio).
- the phase distribution can be updated by, for example, using the generation position (6 axes) of the intermediate image IMM as an adjustment value and analytically searching for the lowest value with the smallest divergence.
- the state of the intermediate image IMM and the curing state of the actual lithography resin (three-dimensional modeled object) can be easily grasped. Therefore, the operator can set more suitable processing conditions (light amount, phase modulation state, etc.), and it is possible to improve the processing accuracy and processing yield of the obtained three-dimensional structure OBJ.
- FIG. 9 is a block diagram showing a configuration example of an optical shaping apparatus according to the third embodiment.
- the same reference numerals are given to the same parts as in the first embodiment of FIG.
- the stereolithography apparatus 10B of the third embodiment includes a laser light source 31 having a first wavelength that causes two-photon absorption curing of resin, and a second wavelength that causes one-photon absorption curing of resin.
- SLM spatial light modulator
- the first lens 14, the half mirror 15A, and the second lens 16 constitute a reduction imaging system (reduction optical system).
- the two-photon laser light source 31 emits a first processing light L1 corresponding to the processing light L in the first embodiment.
- the one-photon laser light source 32 emits the second processing light L2 which is lower in processing accuracy than the first processing light L1 but capable of processing a large area. Therefore, it is more suitable for exposure of the laminated structure BOD.
- the half mirror 33 transmits the first processing light L 1 emitted from the two-photon laser light source 31 , reflects the second processing light L 2 emitted from the one-photon laser light source 32 , and guides it to the beam splitter 12 .
- the beam splitter 12 guides the first processing light L1 and the second processing light L2 to the spatial light modulator 13 side, and guides the phase-modulated first processing light L1 and the second processing light L2 to the half mirror 19 .
- the half mirror 19 reflects part of the phase-modulated first processing light L1 and second processing light L2 to the first light receiving unit 20, and transmits the rest to the first lens 14 side.
- the first light receiving section 20 outputs an image signal corresponding to the intermediate image IMM to the control section 18 based on the incident first processing light L1 and second processing light L2. Therefore, the operator of the control unit 18 can grasp the modulation state of the spatial light modulator 13 at the stage of the intermediate image IMM and obtain a better intermediate image IMM.
- the processing light LP and the processing suppressing light NP that have passed through the half mirror 19 and passed through the first lens 14 functioning as a condensing lens are reflected by the half mirror 15A and are reflected by the second lens 16 functioning as an imaging lens.
- the reduced image IM is formed at a predetermined focal position of the photocurable resin bath 17 .
- the lithography resin is cured in a three-dimensional shape corresponding to the reduced image IM.
- the observation light emitted from the observation light source 21 enters the photocurable resin bath 17, and part of it passes through the half mirror 15A to form a third lens functioning as an objective lens. 22.
- the third lens 22 forms an image of the cured lithography resin on the second light receiving section 23 in a three-dimensional shape corresponding to the reduced image IM.
- the second light receiving unit 23 Based on the incident observation light, the second light receiving unit 23 outputs an image signal corresponding to an image of the lithographic resin cured in a three-dimensional shape corresponding to the reduced image IM to the control unit 18 . Therefore, the operator of the control unit 18 can grasp the state of the lithographic resin cured in the three-dimensional shape corresponding to the reduced image IM, and can control the spatial light modulator 13 more realistically.
- the processing light L1 and the processing light L2 are cooperated to have a more complicated structure. It becomes possible to obtain a three-dimensional modeled object OBJ.
- the two-photon laser light source 31 and the one-photon laser light source 32 were used as the laser light sources.
- L2 are irradiated with the processing suppression light NP by providing a processing suppression laser light source that emits the processing suppression light NP (wavelength different from that of the processing light L1 and L2) that hinders the curing of the lithography resin. Since the hardening of the lithography resin is inhibited at the position, it is also possible to form a three-dimensional structure OBJ with a complicated structure that cannot be realized only with the processing light beams L1 and L2.
- the processing lights L1 and L2 and the processing suppressing light LN are combined. It is possible to obtain a three-dimensional structure OBJ having a more complicated structure.
- FIG. 10 is a block diagram showing a configuration example of an optical shaping apparatus according to the fourth embodiment.
- the same reference numerals are given to the same parts as in the first embodiment of FIG.
- the optical shaping apparatus 10C of the fourth embodiment includes a laser light source 11, a beam splitter 12, a spatial light modulator (SLM) 13, a first lens 14, a mirror 15, a photocurable A resin bath 17 and a controller 18 are provided.
- SLM spatial light modulator
- the beam splitter 12 guides the processing light L emitted from the laser light source 11 to the spatial light modulator 13 side, and guides the phase-modulated processing light L to the mirror 15 .
- the spatial light modulator 13 phase-modulates the incident processing light L based on the three-dimensional data set D3D input from the control unit 18 and guides it to the mirror 15 via the beam splitter 12 .
- the mirror 15 reflects the processing light L and forms an image at a predetermined position of the photocurable resin bath 17 .
- the lithography resin is cured in a three-dimensional shape corresponding to the projected image PIM.
- stereolithography is performed based on the image PIM projected by the spatial light modulator 13, so the processing accuracy depends on the modulation accuracy of the spatial light modulator 13.
- the device configuration can be simplified, the cost of the device can be reduced, and maintenance can be facilitated.
- the intermediate image IMM obtained by the spatial light modulator 13 has a fixed projection magnification.
- a variable magnification mechanism capable of changing the projection magnification, it is possible to speed up the processing.
- stage 17S is drivable in three axial directions, ie, the vertical direction, the horizontal direction, and the front-rear direction. Higher accuracy and improved resolution can be achieved.
- tilt correction and focus adjustment are automatically performed based on the state of the reference laser of the reference laser irradiation mechanism.
- the present technology can be configured as follows. (1) a laser light source that emits processing light; Based on a predetermined three-dimensional data set, the wavefront shape of the processing light at a predetermined processing position in the photocurable resin bath is measured on a three-dimensional surface constituting the surface of the three-dimensional model corresponding to the three-dimensional data set.
- phase control unit that generates a phase control signal for the shape of the shaped body
- phase conversion unit into which the processing light is incident, which modulates the phase of the processing light based on the phase control signal and emits the processing light toward the photocurable resin bath
- a three-dimensional modeling device with (2) A reduction optical system for reducing an intermediate image obtained by condensing the processing light emitted from the phase conversion unit, The three-dimensional modeling apparatus according to (1).
- (3) a light receiving unit that receives a part of the processing light emitted from the phase conversion unit to obtain the intermediate image, The three-dimensional modeling apparatus according to (2).
- the wavefront shape of the processing light is different from the other three-dimensional surface shape body formed adjacent to the one three-dimensional surface shape body corresponding to the wavefront shape along the surface of the three-dimensional surface shape body. is a shape that at least partially overlaps with The three-dimensional modeling apparatus according to any one of (1) to (3).
- the three-dimensional structure is composed of a laminated structure and one or more of the three-dimensional surface shapes covering the laminated structure, The three-dimensional modeling apparatus according to any one of (1) to (4).
- the three-dimensional structure is composed of a laminated structure and a plurality of the three-dimensional surface shape bodies covering the laminated structure,
- the phase control unit sets the boundary of the adjacent three-dimensional surface features to a region in which the inclination of the surfaces of the three-dimensional surface features does not change abruptly.
- the three-dimensional modeling apparatus according to any one of (1) to (4).
- the three-dimensional structure is composed of a laminated structure and a plurality of the three-dimensional surface shape bodies covering the laminated structure, When the exposable area that can be exposed by one irradiation of the processing light includes an ineffective area that does not function effectively as the three-dimensional structure, the phase control unit is arranged to be adjacent to the ineffective area.
- the three-dimensional modeling apparatus according to any one of (1) to (4).
- a laser light source that emits processing light; and a phase conversion unit that receives the processing light, modulates the phase of the processing light based on a phase control signal, and outputs the processing light to the photocurable resin bath side.
- a three-dimensional printing method executed by a three-dimensional printing apparatus, a process of inputting a predetermined three-dimensional data set corresponding to a predetermined three-dimensional object; Based on the three-dimensional data set, the wavefront shape of the processing light at a predetermined processing position in the photocurable resin bath is calculated as a three-dimensional surface shape that constitutes the surface of the three-dimensional model corresponding to the three-dimensional data set.
- a three-dimensional modeling method comprising (9) An intermediate image obtained by condensing the processing light emitted from the phase conversion unit is reduced and formed into an image in the photocurable resin bath, The three-dimensional modeling method according to (8). (10) receiving part of the processing light emitted from the phase conversion unit to obtain the intermediate image; The three-dimensional modeling method according to (9). (11) The wavefront shape of the processing light is different from the other three-dimensional surface shape body formed adjacent to the one three-dimensional surface shape body corresponding to the wavefront shape along the surface of the three-dimensional surface shape body. is a shape that at least partially overlaps with The three-dimensional modeling method according to any one of (8) to (10).
- the three-dimensional structure is composed of a laminated structure and a plurality of the three-dimensional surface shape bodies covering the laminated structure, In the step of generating the phase control signal, a step of setting a boundary of the adjacent three-dimensional surface features to a region where the surface inclinations of the three-dimensional surface features do not change abruptly, The three-dimensional modeling method according to any one of (8) to (11). (13) The three-dimensional structure is composed of a laminated structure and a plurality of the three-dimensional surface shape bodies covering the laminated structure, If the exposable region that can be exposed by one irradiation of the processing light includes an ineffective region that does not function effectively as the three-dimensional structure, the ineffective region is generated in the process of generating the phase control signal. setting boundaries of the three-dimensional surface features adjacent to the region; The three-dimensional modeling method according to any one of (8) to (11).
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Abstract
Description
上記課題に鑑み、本発明の実施形態は、所望の表面構造を造形速度の低下を招くことなく実現することが可能な3次元造形装置及び3次元造形方法を提供することを目的としている。
[1]第1実施形態
図1は、第1実施形態の3次元造形装置としての光造形装置の構成例を示すブロック図である。
上記構成において、第1レンズ14、ミラー15、第2レンズ16は、縮小結像系(縮小光学系)を構成している。
この場合において、リソグラフィ樹脂の材料としては、エポキシ系樹脂、アクリル系樹脂等が挙げられる。
空間光変調器13は、入射された加工光Lを制御部18から入力された3次元データセットD3Dに基づいて位相変調してビームスプリッタ12を介して中間像IMMとして結像し、縮小結像系を構成する第1レンズ14に導く。
ミラー15は、加工光Lを反射して、第2レンズ16に導く。
第2レンズ16は、結像レンズとして機能し、縮小像IMを光硬化性樹脂浴17の所定焦点位置において、結像する。この結果、縮小像IMに対応する3次元形状でリソグラフィ樹脂が硬化することとなる。
この場合において、光硬化性樹脂浴17内には、硬化したリソグラフィ樹脂を支持するとともに、位置を制御部18の制御下で3次元的(上下、左右、前後)に移動可能なステージ17Sを備えている。
この場合において、3次元データセットD3Dのデータフォーマットは任意のものが可能であり、内部構造も含めた3次元形状を表現可能なデータであればよい。
さらに制御部18は、3次元造形物の形成状態に応じて、ステージ17Sを制御して、リソグラフィ樹脂の硬化位置を制御する。
図2は、3次元造形物の一例の外観斜視図である。
図2の3次元造形物OBJは、マイクロレンズである。
3次元造形物OBJとしてのマイクロレンズは、いわゆる平凸レンズを構成しており、平面視円形となっている。
本実施形態においては、3次元造形物OBJは、積層構造体BODと、積層構造体BODを覆う一又は複数の3次元表面形状体SURと、により構成される。
この場合において、3次元表面形状体SURは、3次元造形物OBJの表面を形成しており、なめらかな表面を有している。
図4(A)に示すように、1回の加工光Lの照射で露光が可能な露光可能領域AR1内に3次元表面形状体SURの全露光領域AR2が含まれる場合、すなわち、目標とする3次元表面形状体SURの形状が1回の露光可能領域内に収まる場合、図4(B)の断面図に示すように、隣接する複数(図4(A)では、9個)のマイクロレンズを構成する3次元表面形状体SURには、露光のつなぎ目は生じることなく一体に露光が行える。
これに対し、図5)に示すように、1回の露光可能領域AR1内に3次元表面形状体SURの全露光領域AR2が含まれない場合、すなわち、目標とする次元表面形状体SURの形状が1回の露光可能領域内に収まらない場合、露光のつなぎ目が生じることとなる。
さらに図4に示した様に、繰り返し構造を持つ場合は、繰り返し構造単位で硬化することで面内の特性ばらつきを抑えることができると考えられる。
この場合において、既に硬化したリソグラフィ樹脂は、硬化に影響を与えることはないので、確実に硬化させることが可能となる。
まず制御部18は、ステージ17Sを所定の位置まで上昇させ、積層構造体BODを構成する最下層の層LYの露光を行い、順次ステージ17Sを左右方向及び前後方向に駆動して、リソグラフィ樹脂の硬化を行って、ステージ17S上に一つの層LYを形成する。
この場合においては、積層構造体BODを形成する段階であるので、空間光変調器13は、位相変調を行わずに、加工光Lの波面が平らなままビームスプリッタ12側に導く。
これらの結果、第2レンズ16は、結像レンズとして機能し、縮小像IMを光硬化性樹脂浴17の所定焦点位置において、結像する。この結果、縮小像IMに対応する層LYの形状(平板形状)でリソグラフィ樹脂が硬化することとなる。
当該層LYの形成が完了すると、制御部18は、層LYの厚さに相当する1ステップ分ステージ17Sを下降させ、第2層目の層LYを同様に露光し、形成する。
まずステージ17Sを3次元表面形状体SURの形成に対応する所定の位置まで上昇させる。
そして、レーザ光源11を出射した加工光Lは、ビームスプリッタ12に入射されて、ビームスプリッタ12により空間光変調器13側に導かれる。
ミラー15は、加工光Lを反射して、第2レンズ16に導く。
第2レンズ16は、結像レンズとして機能し、縮小像IMを光硬化性樹脂浴17の所定焦点位置において、結像する。この結果、縮小像IMに対応する3次元表面形状体SURの形状でリソグラフィ樹脂が硬化することとなる。
図7は、露光単位毎の3次元表面形状体の説明図である。
次に第2実施形態について説明する。
図8は、第2実施形態の光造形装置の構成例を示すブロック図である。
図8において、図1の第1実施形態と同様の部分には、同一の符号を付すものとする。
第2実施形態の光造形装置10Aは、図8に示すように、レーザ光源11、ビームスプリッタ12、空間光変調器13、第1レンズ14、ハーフミラー15A、第2レンズ16、光硬化性樹脂浴17、制御部18、ハーフミラー19、第1受光部20、観察用光源21、第3レンズ22、第2受光部23及び表示部24を備えている。
上記構成においても、第1実施形態と同様に、第1レンズ14、ハーフミラー15A、第2レンズ16は、縮小結像系(縮小光学系)を構成している。
ビームスプリッタ12は、レーザ光源11から出射された加工光Lを空間光変調器13側に導き、位相変調後の加工光Lをハーフミラー19に導く。
第1受光部20は、入射した加工光Lに基づいて、中間像IMMに相当する画像信号を制御部18に出力する。したがって、制御部18のオペレータは、中間像IMMの段階で空間光変調器13の変調状態を把握して、より良い中間像IMMを得ることが可能となる。
この結果、第3レンズ22は、第2受光部23上に縮小像IMに対応する3次元形状で硬化したリソグラフィ樹脂の画像を結像する。
したがって、制御部18のオペレータは、縮小像IMに対応する3次元形状で硬化したリソグラフィ樹脂の状態を把握して、より現実的に空間光変調器13の制御を行うことができる。
中間像IMMに相当する第1受光部20、あるいは、縮小像(集光像)IMに相当する第2受光部23で得られた画像と目標画像を比較し、空間光変調器13の位相分布を更新することでより目標に近い集光パターンを得ることができる。
また、位相分布の更新は、例えば中間像IMMの生成位置(6軸)を調整値とし、乖離の程度が小さい最も下がる値を解析的に探索することができる。
例えば、点像などいくつかの集光パターンから、光学系の持つ収差量、ボケ量を演算し、収差を補償する位相分布を考慮して位相分布を更新することが考えられる。
次に第3実施形態について説明する。
図9は、第3実施形態の光造形装置の構成例を示すブロック図である。
図9において、図1の第1実施形態と同様の部分には、同一の符号を付すものとする。
第3実施形態の光造形装置10Bは、図9に示すように、樹脂に対して2光子吸収硬化を起こす第一の波長を持つレーザ光源31、樹脂に対して1光子吸収硬化を起こす第二の波長を持つレーザ光源32、ハーフミラー33、ビームスプリッタ12、空間光変調器(SLM:Spatial Light Modulator)13、第1レンズ14、ハーフミラー15A、第2レンズ16、光硬化性樹脂浴17、制御部18、ハーフミラー19、第1受光部20、観察用光源21、第3レンズ22、第2受光部23及び表示部24を備えている。
2光子レーザ光源31は、第1実施形態における加工光Lに相当する第1加工光L1を出射する。
1光子レーザ光源32は、第1加工光L1よりも加工精度は低いが、大面積の加工が行える第2加工光L2を出射する。したがって、積層構造体BODの露光により向いている。
ビームスプリッタ12は、第1加工光L1及び第2加工L2を空間光変調器13側に導き、位相変調後の第1加工光L1及び第2加工光L2をハーフミラー19に導く。
この結果、第3レンズ22は、第2受光部23上に縮小像IMに対応する3次元形状で硬化したリソグラフィ樹脂の画像を結像する。
したがって、制御部18のオペレータは、縮小像IMに対応する3次元形状で硬化したリソグラフィ樹脂の状態を把握して、より現実的に空間光変調器13の制御を行うことができる。
以上の説明においては、レーザ光源として、2光子レーザ光源31及び1光子レーザ光源32を用いていたが、これらに加えて、さらに加工光L1,L2とは、逆に、リソグラフィ樹脂の硬化を妨げる加工抑制光NP(加工光L1、L2とは、異なる波長)を出射する加工抑制レーザ光源を設けることにより、加工抑制光NPが照射される位置においては、リソグラフィ樹脂の硬化が阻害されるため、加工光L1,L2だけでは実現できない複雑な構造の3次元造形物OBJを形成することも可能となる。
以上の説明においては、レーザ光源として、2光子レーザ光源31及び1光子レーザ光源32を用いていたが、1光子レーザ光源32に代えて、加工光L1とは、逆に、リソグラフィ樹脂の硬化を妨げる加工抑制光NPを出射する加工抑制レーザ光源を設けるようにすることも可能である。
この構成によれば、第3実施形態の変形例よりは、加工速度は低下するが、より簡易な構成で、複雑な形状の3次元造形物OBJを得ることが可能となる。
本第4実施形態は、第1実施例の光造形装置をより簡素化して、より安価に構成した場合の実施形態である。
図10は、第4実施形態の光造形装置の構成例を示すブロック図である。
図10において、図1の第1実施形態と同様の部分には、同一の符号を付すものとする。
第4実施形態の光造形装置10Cは、図10に示すように、レーザ光源11、ビームスプリッタ12、空間光変調器(SLM:Spatial Light Modulator)13、第1レンズ14、ミラー15、光硬化性樹脂浴17及び制御部18を備えている。
空間光変調器13は、入射された加工光Lを制御部18から入力された3次元データセットD3Dに基づいて位相変調してビームスプリッタ12を介してミラー15に導く。
[5.1]第1変形例
以上の説明においては、空間光変調器13により得られる中間像IMMの投影倍率は固定のものとして説明したが、中間像IMMの投影倍率を変更可能な倍率可変機構を設けることにより、処理の高速化を図ることが可能となる。
以上の説明においては、ステージ17Sは、上下方向、左右方向、前後方向の3軸方向に駆動可能としていたが、さらにステージ17Sの傾き補正機構を設けることにより、より高精度で解像度の向上が図れる。
以上の説明においては、フォーカス調整については述べていなかったが、フォーカス調整機構を設けることで、より高精度で解像度の向上を図ることが可能となる。
以上の説明においては、硬化状態を把握するために観察用光源を設けていたが、これに代えて、参照用レーザを照射する参照用レーザ照射機構を設け、ステージ17Sの傾き補正及びフォーカス調整を行うことにより、より高精度で解像度の向上を図ることが可能となる。
さらに、本技術は、以下のような態様(構成)とすることも可能である。
(1)
加工光を出射するレーザ光源と、
所定の3次元データセットに基づいて、光硬化性樹脂浴中の所定の加工位置における前記加工光の波面形状を、前記3次元データセットに対応する3次元造形物の表面を構成する3次元表面形状体の形状とする位相制御信号を生成する位相制御部と、
前記加工光が入射され、前記位相制御信号に基づいて前記加工光の位相変調を行って前記光硬化性樹脂浴側に出射する位相変換部と、
を備えた3次元造形装置。
(2)
前記位相変換部を出射した前記加工光を集光して得られる中間像を、縮小する縮小光学系を備えた、
(1)に記載の3次元造形装置。
(3)
前記位相変換部を出射した前記加工光の一部を受光して、前記中間像を得る受光部を備えた、
(2)に記載の3次元造形装置。
(4)
前記加工光の波面形状は、当該波面形状に対応する一の前記3次元表面形状体に隣接して形成される他の前記3次元表面形状体に対し、前記3次元表面形状体の表面に沿って少なくとも一部重なる形状とされている、
(1)乃至(3)のいずれかに記載の3次元造形装置。
(5)
前記3次元造形物は、積層構造体と、前記積層構造体を覆う一又は複数の前記3次元表面形状体と、により構成される、
(1)乃至(4)のいずれかに記載の3次元造形装置。
(6)
前記3次元造形物は、積層構造体と、前記積層構造体を覆う複数の前記3次元表面形状体と、により構成され、
前記位相制御部は、隣設される前記3次元表面形状体の境界は、前記3次元表面形状体同士の表面の傾斜が急激に変化しない領域に設定する、
(1)乃至(4)のいずれかに記載の3次元造形装置。
(7)
前記3次元造形物は、積層構造体と、前記積層構造体を覆う複数の前記3次元表面形状体と、により構成され、
1回の前記加工光の照射で露光が可能な露光可能領域内に前記3次元造形物として有効に機能しない非有効領域が含まれる場合には、前記位相制御部は、前記非有効領域に隣設される前記3次元表面形状体の境界を設定する、
(1)乃至(4)のいずれかに記載の3次元造形装置。
(8)
加工光を出射するレーザ光源と、前記加工光が入射され、位相制御信号に基づいて前記加工光の位相変調を行って前記光硬化性樹脂浴側に出射する位相変換部と、を備えた3次元造形装置で実行される3次元造形方法であって、
所定の3次元造形物に対応する所定の3次元データセットが入力される過程と、
前記3次元データセットに基づいて、光硬化性樹脂浴中の所定の加工位置における前記加工光の波面形状を、前記3次元データセットに対応する3次元造形物の表面を構成する3次元表面形状体の形状とする位相制御信号を生成する過程と、
を備えた3次元造形方法。
(9)
前記位相変換部を出射した前記加工光を集光して得られる中間像を、縮小して前記光硬化性樹脂浴中で結像する過程を備えた、
(8)に記載の3次元造形方法。
(10)
前記位相変換部を出射した前記加工光の一部を受光して、前記中間像を得る過程を備えた、
(9)に記載の3次元造形方法。
(11)
前記加工光の波面形状は、当該波面形状に対応する一の前記3次元表面形状体に隣接して形成される他の前記3次元表面形状体に対し、前記3次元表面形状体の表面に沿って少なくとも一部重なる形状とされている、
(8)乃至(10)のいずれかに記載の3次元造形方法。
(12)
前記3次元造形物は、積層構造体と、前記積層構造体を覆う複数の前記3次元表面形状体と、により構成され、
前記位相制御信号を生成する過程において、隣設される前記3次元表面形状体の境界を、前記3次元表面形状体同士の表面の傾斜が急激に変化しない領域に設定する過程を備えた、
(8)乃至(11)のいずれかに記載の3次元造形方法。
(13)
前記3次元造形物は、積層構造体と、前記積層構造体を覆う複数の前記3次元表面形状体と、により構成され、
1回の前記加工光の照射で露光が可能な露光可能領域内に前記3次元造形物として有効に機能しない非有効領域が含まれる場合には、前記位相制御信号を生成する過程において前記非有効領域に隣設される前記3次元表面形状体の境界を設定する、
(8)乃至(11)のいずれかに記載の3次元造形方法。
11 レーザ光源
12 ビームスプリッタ
13 空間光変調器
14 第1レンズ
15 ミラー
15A ハーフミラー
16 第2レンズ
17 光硬化性樹脂浴
17S ステージ
18 制御部
19 ハーフミラー
20 第1受光部
21 観察用光源
22 第3レンズ
23 第2受光部
24 表示部
31 2光子レーザ光源
32 1光子レーザ光源
33 ハーフミラー
AR1 露光可能領域
AR2 全露光領域
BL 境界線
BOD 積層構造体
D3D 3次元データセット
L1 第1加工光
L2 第2加工光
IM 縮小像
IMM 中間像
L 加工光
LY 層
NEN 非有効領域
NP 加工抑制光
OBJ 3次元造形物
PIM 投影像
SUR 3次元表面形状体
SURx 3次元表面形状体
Claims (8)
- 加工光を出射するレーザ光源と、
所定の3次元データセットに基づいて、光硬化性樹脂浴中の所定の加工位置における前記加工光の波面形状を、前記3次元データセットに対応する3次元造形物の表面を構成する3次元表面形状体の形状とする位相制御信号を生成する位相制御部と、
前記加工光が入射され、前記位相制御信号に基づいて前記加工光の位相変調を行って前記光硬化性樹脂浴側に出射する位相変換部と、
を備えた3次元造形装置。 - 前記位相変換部を出射した前記加工光を集光して得られる中間像を、縮小する縮小光学系を備えた、
請求項1に記載の3次元造形装置。 - 前記位相変換部を出射した前記加工光の一部を受光して、前記中間像を得る受光部を備えた、
請求項2に記載の3次元造形装置。 - 前記加工光の波面形状は、当該波面形状に対応する一の前記3次元表面形状体に隣接して形成される他の前記3次元表面形状体に対し、前記3次元表面形状体の表面に沿って少なくとも一部重なる形状とされている、
請求項1に記載の3次元造形装置。 - 前記3次元造形物は、積層構造体と、前記積層構造体を覆う一又は複数の前記3次元表面形状体と、により構成される、
請求項1に記載の3次元造形装置。 - 前記3次元造形物は、積層構造体と、前記積層構造体を覆う複数の前記3次元表面形状体と、により構成され、
前記位相制御部は、隣設される前記3次元表面形状体の境界は、前記3次元表面形状体同士の表面の傾斜が急激に変化しない領域に設定する、
請求項1に記載の3次元造形装置。 - 前記3次元造形物は、積層構造体と、前記積層構造体を覆う複数の前記3次元表面形状体と、により構成され、
1回の前記加工光の照射で露光が可能な露光可能領域内に前記3次元造形物として有効に機能しない非有効領域が含まれる場合には、前記位相制御部は、前記非有効領域に隣設される前記3次元表面形状体の境界を設定する、
請求項1に記載の3次元造形装置。 - 加工光を出射するレーザ光源と、前記加工光が入射され、位相制御信号に基づいて前記加工光の位相変調を行って前記光硬化性樹脂浴側に出射する位相変換部と、を備えた3次元造形装置で実行される3次元造形方法であって、
所定の3次元造形物に対応する所定の3次元データセットが入力される過程と、
前記3次元データセットに基づいて、光硬化性樹脂浴中の所定の加工位置における前記加工光の波面形状を、前記3次元データセットに対応する3次元造形物の表面を構成する3次元表面形状体の形状とする位相制御信号を生成する過程と、
を備えた3次元造形方法。
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| US18/571,434 US20240286354A1 (en) | 2021-06-25 | 2022-02-04 | Three-dimensional molding apparatus and three-dimensional molding method |
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Citations (4)
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|---|---|---|---|---|
| JP2004223790A (ja) * | 2003-01-21 | 2004-08-12 | Seiko Instruments Inc | 曲線形状をもつ微細造形物を光造形法により滑らかに作製する方法および装置 |
| JP2009083240A (ja) * | 2007-09-28 | 2009-04-23 | Sony Corp | 光造形装置 |
| JP2009137230A (ja) * | 2007-12-10 | 2009-06-25 | Sony Corp | 光造形装置 |
| JP2016060071A (ja) * | 2014-09-17 | 2016-04-25 | 株式会社東芝 | 光造形装置および光造形方法 |
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| JP4761432B2 (ja) * | 2004-10-13 | 2011-08-31 | 株式会社リコー | レーザ加工装置 |
| WO2017047222A1 (ja) * | 2015-09-17 | 2017-03-23 | ソニー株式会社 | 光造形装置、および造形物の製造方法 |
| US12246382B2 (en) * | 2018-11-09 | 2025-03-11 | Mitsubishi Electric Corporation | Additive manufacturing apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004223790A (ja) * | 2003-01-21 | 2004-08-12 | Seiko Instruments Inc | 曲線形状をもつ微細造形物を光造形法により滑らかに作製する方法および装置 |
| JP2009083240A (ja) * | 2007-09-28 | 2009-04-23 | Sony Corp | 光造形装置 |
| JP2009137230A (ja) * | 2007-12-10 | 2009-06-25 | Sony Corp | 光造形装置 |
| JP2016060071A (ja) * | 2014-09-17 | 2016-04-25 | 株式会社東芝 | 光造形装置および光造形方法 |
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| CN117500657A (zh) | 2024-02-02 |
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