WO2022257679A1 - Heat-dissipation assembly, preparation method, housing assembly, and electronic device - Google Patents

Abstract

Disclosed in the present invention are a heat-dissipation assembly, a preparation method, a housing assembly, and an electronic device. The heat-dissipation assembly comprises: a base body, the base body comprising a first cover plate, a second cover plate, and at least one sandwich plate, in a direction perpendicular to the plane where the first cover plate and the second cover plate are located, the sandwich plate being located between the first cover plate and the second cover plate, a first cooling liquid flow channel being provided between the first cover plate and the sandwich plate, a second cooling liquid flow channel being provided between the second cover plate and the sandwich plate, the sandwich plate being provided with through holes, and the first cooling liquid flow channel being communicated with the second cooling liquid flow channel by means of the through holes; and a piezoelectric ceramic pump, the piezoelectric ceramic pump being located on the first cover plate, the second cover plate or the sandwich plate and communicated with the cooling liquid flow channels.

Description

Heat dissipation component, preparation method, housing component and electronic device technical field

The invention relates to the field of electronic equipment, in particular to a heat dissipation component, a preparation method, a shell component and electronic equipment.

Background technique

With the continuous improvement of Internet technology, the proportion of electronic equipment in people's daily life is getting higher and higher. Although the large-scale popularization of electronic equipment promotes its design styles to become more and more abundant, it is still not enough to meet the increasingly diverse needs of people. In recent years, people's functional requirements for terminal electronic consumer products have become increasingly apparent. In product design, engineers will stack a large number of modules and structures to meet user needs in order to further increase the functions of the product.

Contents of the invention

In this application, the inventors found that with the increase of internal modules and structures of electronic equipment, the power consumption of electronic equipment is gradually increasing. Electronic devices in the related art usually meet the heat dissipation requirements of products through passive heat dissipation (natural convection). However, with the further increase in the power of electronic equipment, it is difficult to rely on natural convection to meet the temperature rise requirements of the product while ensuring that the volume of the electronic equipment remains unchanged, which in turn reduces the performance of electronic products and brings unfriendly user experience.

The present application aims to alleviate or solve at least one of the above-mentioned problems at least to a certain extent

In one aspect of the present invention, the present invention provides a heat dissipation assembly, including: a base body, the base body including a first cover plate, a second cover plate and at least one interlayer plate, perpendicular to the first cover plate and the In the direction of the plane where the second cover plate is located, the sandwich plate is located between the first cover plate and the second cover plate, and there is a first cooling plate between the first cover plate and the sandwich plate A liquid flow path, and a second cooling liquid flow path is provided between the second cover plate and the sandwich plate, and a through hole is formed on the sandwich plate, the first cooling liquid flow path and the second cooling liquid flow path The flow channel communicates with the piezoelectric ceramic pump through the through hole, and the piezoelectric ceramic pump is located on the first cover plate, the second cover plate or the sandwich plate, and communicates with the cooling liquid flow channel.

In another aspect of the present invention, the present invention proposes a method for preparing the aforementioned heat dissipation assembly, comprising: providing a first cover plate, disposing at least one interlayer plate on one side of the first cover plate, placing The second cover plate is arranged on the side of the interlayer plate away from the second cover plate, so that the interlayer plate is attached to the first cover plate and the second cover plate to define a cooling liquid flow channel The piezoelectric ceramic pump is arranged on the first cover plate, the second cover plate or the interlayer plate, and communicated with the cooling liquid channel. Therefore, the above-mentioned heat dissipation component can be manufactured through a relatively simple method, so the preparation method has all the features and advantages of the foregoing heat dissipation component, and will not be repeated here.

In yet another aspect of the present invention, the present invention provides an electronic device, comprising: a casing assembly, the casing assembly includes a casing base, the casing base defines an accommodation space, and the casing base faces There is a heat dissipation assembly on one side of the accommodation space; a battery and the main board, the battery and the main board are located inside the accommodation space defined by the housing assembly, the main board and the battery are electrically connected, wherein the The heat dissipation assembly includes: a base body, the base body includes a first cover plate, a second cover plate and at least one interlayer plate, and in a direction perpendicular to the plane where the first cover plate and the second cover plate are located, the The sandwich plate is located between the first cover plate and the second cover plate, and there is a first cooling liquid channel between the first cover plate and the sandwich plate, and the second cover plate and the There is a second cooling liquid channel between the interlayer plates, the interlayer plate has a through hole, the first cooling liquid channel and the second cooling liquid channel communicate through the through hole, and the piezoelectric ceramic pump , the piezoelectric ceramic pump is located on the first cover plate, the second cover plate or the sandwich plate, and communicates with the cooling liquid channel. Therefore, the electronic device has the aforementioned heat dissipation component, so the electronic device has all the features and advantages of the aforementioned heat dissipation component, which will not be repeated here.

Description of drawings

The above and/or additional aspects and advantages of the present invention will become apparent and comprehensible from the description of the embodiments in conjunction with the following drawings, wherein:

FIG. 1 shows a schematic structural view of a heat dissipation assembly according to an embodiment of the present invention;

FIG. 2 shows a schematic structural diagram of a heat dissipation component in the related art;

FIG. 3 shows a schematic structural view of a heat dissipation assembly according to yet another embodiment of the present invention;

FIG. 4 shows a schematic structural view of a heat dissipation assembly according to yet another embodiment of the present invention;

FIG. 5 shows a schematic structural view of a heat dissipation assembly according to yet another embodiment of the present invention;

FIG. 6 shows a schematic structural view of a heat dissipation assembly according to yet another embodiment of the present invention;

Figure 7 shows a schematic structural view of a cooling liquid channel according to an embodiment of the present invention;

FIG. 8 shows a schematic structural diagram of a heat dissipation assembly according to yet another embodiment of the present invention;

FIG. 9 shows a schematic structural diagram of a heat dissipation assembly according to yet another embodiment of the present invention;

FIG. 10 shows a partial flow diagram of a method for preparing a heat dissipation assembly according to an embodiment of the present invention;

Fig. 11 shows a partial flowchart of a method for preparing a heat dissipation assembly according to yet another embodiment of the present invention;

Fig. 12 shows a partial flowchart of a method for preparing a heat dissipation assembly according to yet another embodiment of the present invention;

FIG. 13 shows a schematic flowchart of a method for preparing a heat dissipation component according to an embodiment of the present invention.

Detailed description of the invention

Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

In one aspect of the present invention, the present invention proposes a heat dissipation assembly, referring to FIG. 1 , including: a base body, the base body includes a first cover plate 100, a second cover plate 200 and at least one interlayer plate 300, perpendicular to the first cover plate In the direction of the plane where the plate 100 and the second cover plate 200 are located, the sandwich plate 300 is located between the first cover plate 100 and the second cover plate 200, and there is a first cooling liquid flow between the first cover plate 100 and the sandwich plate 300 channel, and there is a second cooling liquid flow channel between the second cover plate 200 and the sandwich plate 300, the sandwich plate 300 has a through hole 301, the first cooling liquid flow channel and the second cooling liquid flow channel communicate through the through hole 301, The piezoelectric ceramic pump 600. The piezoelectric ceramic pump 600 is located on the first cover plate 100, the second cover plate 200 or the interlayer plate 300, and communicates with the cooling liquid channel. Through the upper and lower layers of the first cooling liquid flow channel and the second cooling liquid flow channel, while improving the heat dissipation effect through the extension of the cooling liquid flow channel, the heat dissipation assembly can also have a more excellent appearance effect.

For ease of understanding, the principle of the heat dissipation component capable of achieving the above-mentioned beneficial effects is briefly described below:

The inventors have found that heat dissipation components currently used in electronic equipment mostly adopt the composite method of multi-layer polymer film materials. The flow channel of the cooling liquid is layered, and the flow of the cooling liquid in the channel is planar flow. Through the flow of cooling liquid in the flow channel, the heat from the heat source is brought to the cold source to realize heat dissipation and cooling. However, since the cooling liquid flow channel is a single-layer planar structure, there will be a large gap between the heat dissipation component and the heat source, resulting in The heat from the heat source is difficult to be effectively conducted to the heat dissipation component, and ultimately due to the small bonding area between the heat dissipation component and the heat source, effective bonding and heat dissipation cannot be achieved. Moreover, since the flow of the cooling liquid can only be in the plane where the cooling liquid flow channel is located, the appearance effect of the heat dissipation component can only be the flow effect of the cooling liquid in a single flow direction in the plane, and the staggered flow of the cooling liquid and the depth of field cannot be realized. Change, single appearance effect.

Specifically, referring to FIG. 2 , heat dissipation components in the related art usually adopt a first cover plate 100 ′ formed by a polymer film, a second cover plate 200 ′, and a flow channel layer 300 ′ in the middle to form a single-layer cooling system. In the liquid channel, the flow of the cooling liquid can only be in-plane, and the heat of the heat source 10 is taken to the cold source 20 through the flow of the liquid in the cooling liquid channel. There is a large gap between the heat source 10 and the heat dissipation component, which makes it difficult for the heat of the heat source 10 to be effectively conducted to the first cover plate and the second cover plate, and thus it is difficult to effectively conduct the heat to the cooling liquid in the cooling liquid channel. It is not conducive to heat dissipation and cooling. In addition, the appearance effect achieved by the heat dissipation component in the related art can only be a fluid flow effect of a single flow direction in a plane, which is relatively single, and cannot realize the interlaced flow of fluid and the change of depth of field.

The multi-layer cooling liquid channel preparation process in the related art usually requires multiple welding, for example, two heat dissipation components with a single-layer cooling liquid channel are obtained through one-time welding respectively, and then the two heat-dissipating components with a single-layer Weld the cooling component of the cooling liquid flow channel to obtain a cooling component with two layers of cooling liquid flow channels. For the cooling component with multi-layer cooling liquid flow channels, it needs to be welded many times, while the multi-layer flow channel is achieved. The multiple welding involved requires multiple high-temperature treatments for the material forming the heat dissipation component. Taking the biaxially oriented polyethylene terephthalate as an example, the heat dissipation component is formed after one welding and two times of welding. There is a large gap in properties. The elastic modulus of the original state of biaxially stretched polyethylene terephthalate is 4.7GPa, the tensile strength is 230MPa, the elongation at break is 180%, and the haze is 3.5%. For example, after one welding, the elastic modulus is 4.7GPa, the tensile strength is 231MPa, the elongation at break is 175%, and the haze is 3.8%; after two welding, the elastic modulus is measured The tensile strength is 5.1GPa, the tensile strength is 95MPa, the elongation at break is 70%, and the haze is 12%. After two times of welding, the material will obviously become brittle and fracture, and the haze will become high, which greatly affects the appearance and cannot meet Requirements.

In this application, with reference to Fig. 3, Fig. 4, Fig. 5, Fig. 6 and Fig. 7, on the premise of not damaging the performance of the material forming the heat dissipating component, the heat dissipating component with multi-layer cooling liquid channels is molded at one time, and passed The structural design of the multi-layer cooling liquid flow channel makes the heat dissipation component fit the heat source as much as possible, thereby reducing the gap between the heat dissipation component and the heat source, and effectively conducting the heat of the heat source to the first cover plate 100 or the second cover plate 200, Then it is conducted to the cooling liquid in the cooling liquid flow channel, and finally carried by the cooling liquid to the cold source to realize heat dissipation and cooling. Moreover, since the light path lengths are different at the intersection of the multi-layer cooling liquid channels, a special optical effect will be formed at the intersection. The cooling liquid with a specific color or the setting of the decorative film layer can be used to make the Cooling liquid runners have the appearance of darker colors, visual effects of staggered flow, and more.

According to some embodiments of the present invention, the structure of the piezoelectric ceramic pump is not particularly limited. For example, the piezoelectric ceramic pump may include: a piezoelectric diaphragm, and the piezoelectric diaphragm may include a piezoelectric ceramic sheet and be in contact with the piezoelectric ceramic sheet. The support plate, the surface of the piezoelectric ceramic sheet has electrodes that can generate an electric field, and the electric field can control the oscillation of the piezoelectric ceramic sheet; and the valve body structure, the valve body structure is arranged between the piezoelectric diaphragm and the liquid cooling plate, the valve body The structure can control one of the pump-in port and the pump-out port to open and the other to close. By utilizing the advantages of piezoelectric ceramic pumps such as low power consumption, small size, and easy assembly, a heat dissipation component with better temperature uniformity can be obtained.

According to a specific embodiment of the present invention, the piezoelectric ceramic pump may include a piezoelectric diaphragm, a base and a valve body structure, the piezoelectric diaphragm includes a piezoelectric ceramic sheet and a support plate in contact with the piezoelectric ceramic sheet, and the piezoelectric ceramic sheet There are electrodes on the surface that can generate an electric field that can control the vibration of the piezoelectric ceramic sheet. Specifically, two opposite surfaces of the piezoelectric ceramic sheet can have two electrodes, and the piezoelectric ceramic sheet can be placed in an electric field under the condition of electrification. In this way, the controllable vibration of the piezoelectric ceramic sheet can be realized to generate the power to make the cooling liquid flow. The support plate is located between the piezoelectric ceramic sheet and the base, for example, the support plate can be a stainless steel plate. The thickness of the support plate can be relatively thin, as long as it can play a certain role in supporting the piezoelectric ceramic sheet and increasing the vibration amplitude. For example, the support plate and the piezoelectric ceramic sheet can be tightly attached together, and the valve body structure is arranged inside the fluid containing space, and when the piezoelectric diaphragm vibrates, one of the pump-in port and the pump-out port can be cyclically controlled to open, and the other one off. The specific structure of the valve body structure is not particularly limited, as long as the pumping and pumping of the cooling liquid in and out of the fluid containing space can be realized by circulation control.

According to some embodiments of the present invention, in order to ensure that the piezoelectric ceramic pump has a sufficient pressure head to obtain a flow rate of cooling liquid sufficient for sufficient heat dissipation, the volume of the piezoelectric ceramic pump and the cooling liquid flow channel is not particularly limited, for example, the piezoelectric ceramic pump The ceramic pump and the volume of the cooling liquid channel can be configured to make the flow rate of the cooling liquid in the cooling liquid channel not less than 0.5ml/min. When the flow rate of the cooling liquid in the cooling liquid channel is less than 0.5ml/min, the cooling liquid (such as water, etc.) medium will not be able to effectively dissipate the heat of the heat source. Specifically, the inventors found that at least one of the thickness H and the diameter D of the piezoelectric ceramic sheet in the piezoelectric ceramic pump needs to meet the requirements: 0.1mm≤H≤0.5mm; 3mm≤D≤12mm. Specifically, the piezoelectric ceramic sheet can vibrate under the action of an electric field, and the mechanical vibration can provide the power for the cooling fluid to flow. The upper and lower surfaces of the usual piezoelectric ceramic sheet are coated with conductive materials (used to form electrodes) ) sheet, the material and size of the piezoelectric ceramic sheet determine the power that the piezoelectric ceramic pump can provide. The specific material of the piezoelectric ceramic sheet is not particularly limited, for example, it may be zirconium-based ceramics. For electronic equipment, the area of the heat dissipation component should not be too small, otherwise the heat cannot be effectively uniformed from the heat source to the area outside the heat source, that is, the size of the heat dissipation component should at least cover at least one heat source in the electronic device, and the area outside the heat source Sufficiently large non-heat source area. The inventors found that, in terms of the volume of commonly used electronic equipment (such as mobile terminals such as mobile phones, PADs and notebook computers, etc.), the thickness of the piezoelectric ceramic sheet is not less than 0.1mm and not more than 0.5mm, and the diameter is not less than 3mm and not more than 0.5mm. If it is larger than 12mm, it can provide enough power for the heat dissipation component to ensure that the flow rate of the cooling liquid sealed in the heat dissipation component is not less than 0.5ml/min. At the same time, it can also ensure that the volume and weight of the heat dissipation component are moderate. placed in the device.

According to some embodiments of the present invention, the structure of the heat dissipation assembly is not particularly limited. For example, the heat dissipation assembly may have at least one of the following structures: For example, referring to FIGS. One side of the second cover plate 200 may have a protrusion; or, the heat dissipation component may have a protrusion on a side of the second cover plate 200 away from the sandwich plate. When the heat dissipation assembly has a protrusion on the side of the first cover plate away from the interlayer plate, or has a protrusion on the side of the second cover plate away from the interlayer plate, or has a protrusion on the side of the first cover plate away from the interlayer plate and at the same time When the two cover plates have protrusions on the side away from the interlayer plate, the distance between the heat dissipation assembly and the heat source can be further reduced by setting the protrusions, that is, the heat source can be arranged in the concave part of the protrusion side of the heat dissipation assembly so that The heat dissipation component is further attached to the heat source, so that the heat of the heat source is effectively conducted to the first cover plate or the second cover plate, and then to the cooling liquid in the cooling liquid flow channel, and finally heat dissipation and cooling are realized through the circulating flow of the cooling liquid.

According to some embodiments of the present invention, the flow direction of the first cooling liquid flow channel and the second cooling liquid flow channel is not particularly limited, for example, the angle formed by the first cooling liquid flow channel and the second cooling liquid flow channel can be is not zero. When the angle formed by the flow path direction of the first cooling liquid flow channel and the second cooling liquid flow channel is not zero, because the first cooling liquid flow channel and the second cooling liquid flow channel do not completely overlap, the cooling liquid flow At the intersection of the channels, due to the different path lengths of the light, a special optical effect will be formed at the intersection, while for the cooling liquid channel not located at the intersection of the cooling liquid channel, it will appear as a more conventional fluid flow The optical effect, through the combination of the two optical effects, further improves the appearance effect of the heat dissipation component.

According to some embodiments of the present invention, the structure of the interlayer plate is not particularly limited, as long as the interlayer plate can respectively form cooling liquid channels with the first cover plate and the second cover plate. For example, referring to FIG. 3 and FIG. 4 , the sandwich panel may include a plate body 310 and an isolation portion, the isolation portion is located on the plate body 310 , and the plate body 310 , the isolation portion and the cover plate define a cooling liquid flow channel. For example, according to some specific embodiments of the present invention, the isolation part may include a first isolation part 321 and a second isolation part 322 . The material forming the first isolation part 321 and the second isolation part 322 is not particularly limited, for example, the material forming the first isolation part may be an infrared response material, and the material forming the second isolation part may be a high frequency response material. Fig. 3 and Fig. 4 only show a part of the structure of the sandwich panel for easy understanding, and should not be construed as a limitation to the sandwich panel proposed in this application. For example, a sandwich panel may have two second partitions. In some other embodiments, when the heat dissipation assembly has a plurality of interlayer plates, one or more of the plurality of interlayer plates may only have one isolation portion. According to some embodiments of the present invention, the materials forming the first cover plate, the second cover plate and the plate body are not particularly limited, for example, the materials forming the first cover plate, the second cover plate and the plate body can all be biaxially stretched Polyethylene terephthalate.

According to some embodiments of the present invention, the number of interlayer plates in the heat dissipation assembly is not particularly limited. For example, referring to FIG. , the first cover plate 100 , a first isolation portion 321 and the plate body 310 form a first cooling liquid channel, and the second cover plate 200 , another first isolation portion 321 and the plate body 310 form a second cooling liquid channel.

According to some embodiments of the present invention, the number of interlayer boards in the heat dissipation assembly is not particularly limited. For example, referring to FIG. 4, FIG. 5, and FIG. The sandwich panel includes a panel body 310, a first isolation part 321 and a second isolation part 322, the first isolation part 321 and the second isolation part 322 are respectively located on both sides of the panel body 310, and the rest of the sandwich panels have a panel body 310 and a first partition 321, wherein the sandwich panel with the second partition 322 is not located at the outermost side among the plurality of sandwich panels. Therefore, a heat dissipation assembly with multi-layer cooling liquid flow channels can be prepared by a relatively simple method, which not only prolongs the flow distance of the cooling liquid, improves the heat dissipation effect of the heat dissipation assembly, but also further improves the heat dissipation of the heat dissipation assembly through the setting of multi-layer flow channels. appearance effect.

According to some embodiments of the present invention, the material forming the first isolation part can be an infrared responsive material, that is, a material that can be applied to an infrared welding process. Stretched polyethylene terephthalate masterbatches are doped and blended and then melt-extruded to obtain infrared responsive materials. Specifically, infrared responsive materials can include: tungsten vanadium oxide modified biaxially stretched polyethylene terephthalic acid At least one of ethylene glycol ester and tungsten titanium oxide modified biaxially stretched polyethylene terephthalate.

According to some embodiments of the present invention, the material forming the second isolation part may be a high-frequency response material, that is, a material that can be applied to a high-frequency welding process. For example, a material with high dielectric loss and biaxially oriented polyphenylene The ethylene glycol diformate masterbatch is doped and blended and then melt-extruded to obtain a high-frequency response material. Specifically, the high-frequency response material may include: indium tin oxide modified biaxially oriented polyethylene terephthalate and at least one of tin antimony oxide modified biaxially oriented polyethylene terephthalate.

According to some embodiments of the present invention, the mass fraction of the dopant material in the infrared responsive material is not particularly limited, for example, the mass fraction of tungsten vanadium oxide in biaxially oriented polyethylene terephthalate can be The mass fraction of tungsten oxide and titanium in the biaxially stretched polyethylene terephthalate modified by tungsten oxide and titanium can be 4% to 10%. When the mass fraction of the doping material in the infrared responsive material is within the above range, it can not only make the material have a higher response to infrared waves, but also help shorten the duration of infrared welding, simplify the infrared welding process, and make the material have better Color and haze, the appearance effect is better.

According to some embodiments of the present invention, the mass fraction of the dopant material in the high frequency response material is not particularly limited, for example, the mass fraction of indium tin oxide in indium tin oxide modified biaxially oriented polyethylene terephthalate can be The mass fraction of tin antimony oxide in the biaxially stretched polyethylene terephthalate modified by tin antimony oxide can be 4% to 10%. When the mass fraction of the dopant material in the high frequency response material is within the above range, the material can have a high response to high frequency, which is beneficial to shorten the high frequency welding time, simplify the high frequency welding process, and make the material have better color and Haze, good appearance effect.

According to some embodiments of the present invention, the structure of the heat dissipation assembly is not particularly limited. For example, the heat dissipation assembly may further include: a decorative film layer, wherein the decorative film layer is located on the side of the first cover plate away from the second cover plate, or on the side of the second cover plate. The side of the second cover plate away from the first cover plate. When the heat dissipation component is arranged on the back cover of the electronic device or used as the back cover of the electronic device, the side cover plate with the decorative film layer should be located on the side close to the internal structure of the electronic device, and the heat dissipation can be further enriched by the setting of the decorative film layer Improve the appearance of components and improve aesthetics.

According to some embodiments of the present invention, the structure of the decorative film layer is not particularly limited. For example, the decorative film layer may include: a decorative film layer base, and a texture sublayer, a coating sublayer, a color sublayer, and an ink sublayer. At least one of, wherein, the positions of the texture sublayer, the coating sublayer, the color sublayer and the cover ink sublayer are not particularly limited, and when the decorative film layer has a cover ink sublayer, the cover ink sublayer should be located The outermost side, to avoid covering the bottom ink sub-layer to the other sub-layers of the decorative film layer. The material forming the base of the decorative film layer is not particularly limited, for example, the material forming the base of the decorative film layer may be polyethylene terephthalate.

Specifically, the decorative film layer may have a decorative film layer base, and a texture sub-layer, a coating sub-layer, a color sub-layer and a cover ink sub-layer. At this time, the cover ink sub-layer can be located on the side away from the first cover or the second cover, and the side of the decorative film layer that is not provided with the cover ink sub-layer can be attached to the first or second cover. superior. Or, the decorative film layer can also not be provided with the sub-layer of cover bottom ink, but the sub-layer of cover bottom ink is arranged on the side of the first or second cover plate away from the cooling liquid flow channel, and the decorative film layer is pasted on the side where the bottom cover ink is not provided. Overlay on the cover ink sublayer. Thus, the decorative film layer can be arranged on the side of the heat dissipation component away from the heat source.

According to some embodiments of the present invention, it is also possible to directly form a decorative film sub-layer with an appearance effect on at least one of the first cover plate and the second cover plate without providing a decorative film layer base. For example, the first cover plate or the second cover plate may have a cover bottom ink layer, wherein the cover bottom ink layer is located on the side of the cover plate away from the sandwich plate; the heat dissipation assembly may further include a decorative film layer, and the decorative film layer is located The cover plate of the bottom ink layer is away from the side of the sandwich plate, and the transmittance of the decorative film layer is not less than 80%. Therefore, when the heat dissipation component is arranged on or used as the back cover of the electronic device, the thickness of the electronic device can be further reduced by arranging the bottom ink layer on the cover plate of the heat dissipation component.

According to some specific embodiments of the present invention, for example, referring to FIG. 8 and FIG. 9 , the first cover plate 100 or the second cover plate 200 may have at least one of the following structures on the side away from the sandwich plate: a textured layer 710; The coating layer 720; the color layer 730; the bottom ink layer 740, wherein, when the heat dissipation component has at least one of the texture layer 710, the coating layer 720 and the color layer 730, the bottom ink layer 740 is located farthest from the first cover plate or side of the second cover. Specifically, referring to FIG. 8, when the texture layer 710 is located on the side of the first cover 100 away from the second cover 200, the coating layer 720 is located on the side of the texture layer 710 away from the first cover 100, and the color layer 730 is located on the coating layer. When 720 is away from the side of the texture layer 710, the cover ink layer 740 can be located on the side of the color layer 730 away from the coating layer 720; referring to FIG. side, the coating layer 720 is located on the side of the coating layer 730 away from the second cover 200 , and the texture layer 710 is located on the side of the coating layer 720 away from the coating layer 730 , the bottom ink layer of the cover can be located on the first cover 100 away from the second cover One side of the board 200, and when the heat dissipation component is arranged on the back cover of the electronic device or used as the back cover of the electronic device, the first cover plate should be located on the side close to the internal structure of the electronic device.

It should be noted that the above descriptions of the positions of the decorative film layer, the cover ink layer, the texture layer, the coating layer, and the color layer are only exemplary. The bottom ink layer is located on the side closest to the internal structure of the electronic device, so as to avoid covering the bottom ink layer from covering other decorative layers. Those skilled in the art can select the structure of the decorative layer according to the actual situation.

In yet another aspect of the present invention, the present invention proposes a method for preparing the aforementioned heat dissipation assembly, referring to FIG. 13 , comprising:

S100: Provide the first cover

According to some embodiments of the present invention, the first cover plate is provided in this step, and the material forming the first cover plate is kept the same as before, and will not be repeated here.

S200: disposing at least one interlayer board on one side of the first cover board

According to some embodiments of the present invention, at least one sandwich panel is provided in this step, and the sandwich panel is placed on one side of the first cover plate, specifically, a sandwich panel may be provided, and the sandwich panel includes a board body and two first partition; alternatively, a plurality of sandwich panels may be provided, wherein one sandwich panel in the plurality of sandwich panels has a panel body, a first partition and a second partition, and the sandwich panel is not located in the plurality of sandwich panels The outermost of the panels, the rest of the plurality of sandwich panels each have a panel body and a first partition.

S300: disposing the second cover plate on the side of the sandwich panel away from the second cover plate

According to some embodiments of the present invention, a second cover plate is provided in this step, and the second cover plate is placed on the side of the sandwich panel away from the first cover plate, and the material forming the second cover plate is kept consistent with the previous one, here No longer.

S400: adhering the interlayer plate to the first cover plate and the second cover plate to define a cooling liquid flow channel

According to some embodiments of the present invention, the cooling liquid channel is formed in this step. Referring to FIG. The method for attaching the second cover plate to define the cooling liquid channel includes: when the interlayer plate has a plate body 310 and two first isolation parts 321, emitting infrared waves to the first isolation parts 321 so that the first isolation parts 321 are respectively connected to the first isolation part 321. The cover plate is attached to the plate body 310 . Because the materials forming the first cover plate, the second cover plate, and the plate body are highly transparent to infrared waves, the material forming the first isolation portion 321 is an infrared responsive material, that is, a high calorific value when irradiated by infrared waves. When the 400 emits infrared waves from one side of the first cover 100 and one side of the second cover 200 to the two first isolation parts 321, the two first isolation parts 321 are heated, and the After the first isolation part is softened, it is bonded to the first cover plate and the plate body, and after the first isolation part close to the second cover plate is softened, it is bonded to the second cover plate and the plate body. Finally, the two-layer flow channel is realized by one infrared wave irradiation. One-time welding molding.

According to the embodiments of the present invention, the structure of the infrared emitting device is not particularly limited, for example, the side of the infrared emitting device close to the substrate can have multiple infrared generator arrays, and the side of the infrared emitting device close to the substrate can have multiple infrared generator arrays. When the generator array is used, the infrared wave emission power of the infrared welding process can be further accelerated to speed up the process.

According to some embodiments of the present invention, in order to further improve the lamination effect of the sandwich panel and the first cover plate and the second cover plate, referring to FIG. , the pressure can be applied simultaneously along the direction of the first cover plate 100 towards the second cover plate 200 and along the direction of the second cover plate 200 towards the first cover plate 100 (that is, the direction shown by the arrow in the figure), thereby further improving The lamination effect between the sandwich panel and the first cover panel, and between the sandwich panel and the second cover panel.

According to some other embodiments of the present invention, when there is a sandwich plate between the first cover plate and the second cover plate, one of the two isolation parts of the sandwich plate may also be formed by a high frequency response material, That is, the sandwich panel has a first partition and a second partition. At this time, one of the first cover plate or the second cover plate, the second isolation part and the plate body can be put into the high-frequency welding jig, and the high-frequency electric field is formed on the positive electrode plate and the negative electrode plate to form the second isolation part. The high-frequency response material is heated to realize welding bonding between the first cover plate or the second cover plate and the plate body.

According to some embodiments of the present invention, referring to FIG. 11 , when there are multiple sandwich panels between the first cover plate 100 and the second cover plate 200, at least one of the two sandwich panels closest to the cover plate among the multiple sandwich panels The isolation part of the sandwich panel may be formed of an infrared responsive material. Because the high-frequency response material can completely absorb the high-frequency electric field, if the isolation parts of multiple sandwich plates are all made of high-frequency materials, and the effect of high-frequency waves on the isolation parts can only be realized by using two plates to form a high-frequency electric field, then it is located in The isolated part of the high frequency response material in the center will not fit properly. The high-frequency response material has high reflection for infrared waves, and the effect of infrared waves on the isolation part can be realized only by a single-side infrared source, so the high-frequency response material located in the center of the cover plate will not affect the formation of infrared response materials located on the outside. Welding of the isolated part.

Specifically, when one of the multiple sandwich panels includes a panel body 310, a first isolation part 321 and a second isolation part 322, when the sandwich panel is attached to the first cover panel 100 and the second cover panel 200 Before defining the cooling liquid flow channel, it further includes: bonding the two sandwich plates, the bonding is by placing the second isolation portion 322 of one sandwich plate between the plate bodies 310 of the two sandwich plates, and performing high-frequency welding processing, so that the second isolation part 322 is attached to the two boards 310 . Specifically, because the material forming the plates has no response to high frequency waves, the second isolation portion 322 can be placed between the two plate bodies 310 and put into a high frequency welding jig, and formed on the positive plate 520 and the negative plate 510 The high-frequency electric field heats the high-frequency response material forming the second isolation part 322 through high-frequency waves. Further, in order to further improve the bonding effect between the second isolation part 322 and the two plates 310, the high-frequency electric field heats the second isolation part. 322 while performing high-frequency heating, pressure can be applied simultaneously along the direction of the positive plate 520 toward the negative plate 510 and the direction of the negative plate 510 toward the positive plate 520 (that is, the direction shown by the arrow in the figure), thereby further improving the second isolation The bonding effect between the head and the two boards.

According to some embodiments of the present invention, after laminating the two sandwich panels, with reference to FIG. The first isolation part 321 of the interlayer board in contact emits infrared waves, so that the first isolation part 321 is attached to the cover board and the board body respectively. Since the materials forming the first cover plate, the second cover plate and the plate body are highly transparent to infrared waves, the material forming the second isolation portion 322 is a high-frequency response material, that is, it generates high heat under high-frequency waves and highly reflects infrared waves. The material forming the first isolation portion 321 is an infrared responsive material, that is, a high calorific value when irradiated by infrared waves. When the two first isolation parts 321 emit infrared waves, the two first isolation parts 321 are heated, and the first isolation part close to the first cover plate is softened and bonded to the first cover plate and the plate body, and close to the second cover plate After softening, the first isolation part is bonded to the second cover plate and the board body, and the second isolation part 322 does not respond to infrared waves, that is, it does not generate heat, which avoids the material forming the isolation part due to multiple high-temperature processes. The performance was greatly attenuated, and finally a heat dissipation assembly with three layers of cooling liquid flow channels was formed through a high-frequency welding of the second isolation part and an infrared welding of the first isolation part.

According to some embodiments of the present invention, the number of layers of the flow channel of the heat dissipation component is not particularly limited, for example, the flow channel of the heat dissipation component may have 4 layers, for example, it may include a layer of cooling liquid formed by the second isolation part and the plate body The cooling liquid flow channel is formed by the flow channel and the third layer by the first isolation part and the plate body or the cover plate. The method of preparing the heat dissipation assembly with the above-mentioned cooling liquid flow channel is similar to the method of preparing the heat dissipation assembly with three layers of cooling liquid flow channels, as long as the cooling liquid flow channel with the second partition and two plate bodies is prepared, The stacking preparation of the first isolation part and the plate body can be carried out on one or both sides close to the first cover plate or the second cover plate, and those skilled in the art can select the number of cooling liquid flow channel layers according to the actual situation.

S500: The piezoelectric ceramic pump is arranged on the first cover plate, the second cover plate or the sandwich plate, and communicated with the cooling liquid flow channel

According to an embodiment of the present invention, in this step, the piezoelectric ceramic pump is arranged on the first cover plate, the second cover plate or the interlayer plate, and communicated with the cooling liquid channel, so that the piezoelectric ceramic pump can be set as The flow of the cooling liquid in the cooling liquid channel provides power to accelerate the flow of the cooling liquid, thereby speeding up the heat transfer at the heat source and improving the overall heat dissipation effect of the heat dissipation component.

It should be noted here that the specific sequence of setting the piezoelectric ceramic pumps is not particularly limited. For example, on the premise that welding processes such as infrared welding do not affect the piezoelectric ceramic pumps, the piezoelectric ceramic pumps can also be set in advance. On the first cover plate or the second cover plate, the aforementioned operation of forming the cooling liquid flow channel is performed.

According to other embodiments of the present invention, the method may further include the step of providing a decorative film layer, specifically, when the heat dissipation component is on the side of the first cover plate away from the interlayer plate or the heat dissipation component is on the side of the second cover plate away from the interlayer plate When one side has a protrusion, the decorative film layer can be arranged on the side with the heat dissipation component having the protrusion, wherein the base of the decorative film layer can be arranged on the protrusion, and the texture sub-layers can be sequentially arranged on the base of the decorative film layer , the coating sublayer, the color sublayer and the cover ink sublayer, wherein the cover ink sublayer should be located on the outermost side, that is, the side farthest away from the protrusion, so as to avoid the influence of the cover ink sublayer on the rest of the decorative film layer sublayers. of occlusion.

Or, when the heat dissipation component has a protrusion on the side of the first cover plate away from the interlayer plate or the heat dissipation component has a protrusion on the side of the second cover plate away from the interlayer plate, the decorative film layer can be arranged on the side with the heat dissipation component having the protrusion. side, wherein the cover bottom ink sub-layer can be arranged on the side with the protrusion, and the decorative film layer substrate can be arranged on the other side, and the texture sub-layer, the coating sub-layer and the color sub-layer can be sequentially arranged on the decorative film layer substrate. layer to avoid covering the bottom ink sub-layer for the remaining decorative film sub-layers.

Of course, when the decorative film layer needs to be pasted, one side of the first cover plate or the second cover plate can also be flat without protrusions. When the heat dissipation component is used in an electronic device as a housing component or attached to the housing component, the side with the undercoating ink layer can be located on the side facing the interior of the electronic device.

The specific sequence of the operation of laminating the decorative film layer is not particularly limited. For example, after the cooling liquid flow channel is formed, the lamination of the decorative film layer can be carried out, or a cover can be formed on one side of the first cover plate or the second cover plate. bottom ink layer; or, when the aforementioned operation (infrared welding or high-frequency welding) of forming the cooling liquid channel does not affect the formation of the decorative film layer, the decorative film layer can also be bonded in advance, or in advance in the first On one side of the cover plate or the second cover plate, structures such as a bottom ink layer are formed.

Alternatively, the decorative film base may not be provided, but the decorative film sub-layer with an appearance effect is directly arranged on at least one of the first and second cover plates, such as shown in Figures 8 and 9 of. The specific order of forming the sub-layers of the decorative film layer with appearance effects is not particularly limited, for example, it can be before the operation of forming the cooling liquid flow channel (infrared welding or high frequency welding), or it can be before forming the cooling liquid flow channel. After the passage, each sub-layer is formed. Those skilled in the art can choose according to the actual situation.

In yet another aspect of the present invention, the present invention provides a housing assembly, including: a housing base, the housing base defines an accommodation space, and the housing base has the aforementioned heat dissipation assembly on the side facing the accommodation space; and a display and the motherboard, the display and the motherboard are located in the accommodation space. In this way, the flow of the cooling fluid in the cooling liquid channel can be accelerated through the piezoelectric ceramic pump on the heat dissipation component, thereby accelerating the heat transfer between the cooling fluids, and finally obtaining a cooling fluid with a uniform temperature, thereby achieving rapid heat dissipation, uniform temperature, Miniaturized housing assembly.

In yet another aspect of the present invention, the present invention proposes an electronic device, including: a housing assembly, the housing assembly is the aforementioned, the housing assembly is electrically connected to the main board, the battery and the main board, and the battery and the main board are located in the housing assembly. Inside the defined accommodating space, the motherboard and the battery are electrically connected. Therefore, since the electronic device has the aforementioned housing assembly with better temperature uniformity performance, local overheating will not occur during use, and the user experience is better.

According to some embodiments of the present invention, the housing assembly has a piezoelectric ceramic pump, so an external circuit is required to control the operation of the piezoelectric ceramic pump. Therefore, the electrodes in the piezoelectric ceramic pump of the shell assembly can be electrically connected to the main board, specifically, the electrodes capable of generating an electric field in the piezoelectric diaphragm of the piezoelectric ceramic pump can be connected to the main board through metal shrapnel. Thus, the control of the piezoelectric ceramic pump can be easily realized.

In still another aspect of the present invention, the present invention provides an electronic device, comprising: a housing assembly, the housing assembly includes a housing base, the housing base defines an accommodation space, and the side of the housing base facing the accommodation space has a heat dissipation Components; battery and main board, the battery and the main board are located inside the accommodation space defined by the housing assembly, the main board and the battery are electrically connected, wherein the heat dissipation assembly includes: a base body, the base body includes a first cover plate, a second cover plate and at least one interlayer Plate, in the direction perpendicular to the plane where the first cover plate and the second cover plate are located, the sandwich plate is located between the first cover plate and the second cover plate, and there is a first cooling liquid between the first cover plate and the sandwich plate flow channel, and there is a second cooling liquid flow channel between the second cover plate and the interlayer plate, the interlayer plate has a through hole, the first cooling liquid flow channel and the second cooling liquid flow channel are communicated through the through hole, and the piezoelectric ceramic pump , the piezoelectric ceramic pump is located on the first cover plate, the second cover plate or the sandwich plate, and communicates with the cooling liquid channel. Therefore, the electronic device has the aforementioned heat dissipation component, so the electronic device has all the features and advantages of the aforementioned heat dissipation component, which will not be repeated here. In a word, the electronic device not only has a good temperature touch feeling, but also has a good appearance effect during use.

In the description of the present invention, the orientations or positional relationships indicated by the terms "upper", "lower" and the like are based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present invention and do not require that the present invention must be based on a specific Azimuth configuration and operation, therefore, should not be construed as limiting the invention.

In the description of this specification, description with reference to the terms "one embodiment", "another embodiment", etc. means that a particular feature, structure, material, or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention . In this specification, the schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the described specific features, structures, materials or characteristics may be combined in any suitable manner in any one or more embodiments or examples. In addition, those skilled in the art can combine and combine different embodiments or examples and features of different embodiments or examples described in this specification without conflicting with each other. In addition, it should be noted that in this specification, the terms "first" and "second" are used for description purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features.

Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention, those skilled in the art can make the above-mentioned The embodiments are subject to changes, modifications, substitutions and variations.

Claims (20)

A cooling assembly, comprising: a base body comprising a first cover sheet, a second cover sheet and at least one sandwich sheet, In a direction perpendicular to the plane where the first cover plate and the second cover plate are located, the sandwich panel is located between the first cover plate and the second cover plate, And there is a first cooling liquid flow channel between the first cover plate and the sandwich plate, and there is a second cooling liquid flow channel between the second cover plate and the sandwich plate, There is a through hole on the sandwich plate, and the first cooling liquid channel and the second cooling liquid channel communicate through the through hole, A piezoelectric ceramic pump, the piezoelectric ceramic pump is located on the first cover plate, the second cover plate or the interlayer plate, and communicates with the cooling liquid channel. The heat dissipation assembly according to claim 1, which has at least one of the following structures: There is a protrusion on the side of the first cover plate away from the sandwich plate; There is a protrusion on the side of the second cover plate away from the interlayer plate. According to the heat dissipation assembly according to claim 1, the included angle formed between the first cooling liquid flow channel and the second cooling liquid flow channel is not zero. According to the heat dissipation assembly according to claim 1, the sandwich plate comprises a plate body and an isolation part, the isolation part is located on the plate body, and the plate body, the isolation part and the cover plate define a cooling liquid flow channel, The isolation part includes a first isolation part and a second isolation part, The material forming the first isolation part is an infrared response material, and the material forming the second isolation part is a high frequency response material. According to the heat dissipation assembly according to claim 4, the material forming the first cover plate, the second cover plate and the plate body is biaxially stretched polyethylene terephthalate. The heat dissipation assembly according to claim 5, the interlayer board comprises the board body and two first isolation parts, The first cover plate, one of the first isolation parts and the plate body constitute the first cooling liquid channel, and the second cover plate, the other first isolation part and the plate body constitute the The second cooling liquid channel. According to the heat dissipation assembly according to claim 5, there are multiple sandwich plates; One of the sandwich panels includes the panel body, one of the first isolation parts and one of the second isolation parts, and the first isolation part and the second isolation part are respectively located on both sides of the board, The rest of the sandwich panels all have the panel body and one of the first isolation parts, Wherein, the sandwich panel having the second isolation portion is not located at the outermost side among the plurality of sandwich panels. According to claim 4, the infrared response material comprises: tungsten vanadium oxide modified biaxially stretched polyethylene terephthalate and tungsten titanium oxide modified biaxially stretched polyethylene terephthalate at least one of alcohol esters. The heat dissipation assembly according to claim 4, wherein the high-frequency response material comprises: indium tin oxide modified biaxially oriented polyethylene terephthalate and tin antimony oxide modified biaxially oriented polyethylene terephthalate at least one of alcohol esters. According to the heat dissipation assembly according to claim 8, the mass fraction of tungsten vanadium oxide in the biaxially oriented polyethylene terephthalate modified by tungsten vanadium oxide is 4%-10%, and the modified tungsten titanium oxide The mass fraction of tungsten titanium oxide in the biaxially stretched polyethylene terephthalate is 4%-10%. The heat dissipation assembly according to claim 9, wherein the mass fraction of indium tin oxide in the biaxially oriented polyethylene terephthalate modified by indium tin oxide is 4%-10%, and the modified tin antimony oxide The mass fraction of tin antimony oxide in the biaxially stretched polyethylene terephthalate is 4%-10%. The heat dissipation assembly according to claim 1, further comprising: A decorative film layer, the decorative film layer is located on a side of the first cover plate away from the second cover plate, or on a side of the second cover plate away from the first cover plate. According to the heat dissipation assembly according to claim 1, the first cover plate or the second cover plate has an undercoat ink layer, and the undercover ink layer is located on a side of the cover plate away from the sandwich plate; The heat dissipation assembly further includes a decorative film layer, the decorative film layer is located on the side of the cover plate that is not provided with the bottom ink layer away from the interlayer board, and the transmittance of the decorative film layer is not lower than 80%. According to the heat dissipation assembly according to claim 1, the first cover plate or the second cover plate has at least one of the following structures on a side away from the sandwich plate: texture layer; coating layer; color layer; cover ink layer, Wherein, when there is at least one of the texture layer, the coating layer and the color layer, the cover ink layer is located on the side farthest from the first cover plate or the second cover plate. A method of preparing a heat dissipation component, comprising: Provide the first cover plate, disposing at least one sandwich panel on one side of the first cover panel, disposing the second cover plate on the side of the sandwich panel away from the second cover plate, adhering the sandwich panel to the first cover plate and the second cover plate to define a cooling liquid flow channel, The piezoelectric ceramic pump is arranged on the first cover plate, the second cover plate or the interlayer plate, and communicated with the cooling liquid channel. The method according to claim 15, wherein there is a sandwich panel between the first cover plate and the second cover plate, so that the sandwich plate and the first cover plate and the second cover plate A method of fitting to define the cooling liquid flow path includes: The interlayer board has a board body and two first partitions, and infrared waves are emitted to the first partitions so that the first partitions are attached to the cover plate and the board body respectively. According to the method according to claim 15, there are a plurality of sandwich panels between the first cover plate and the second cover panel, and one of the sandwich panels includes a plate body and a plurality of sandwich panels. The first isolation part and one second isolation part further include: before making the interlayer board and the first cover plate and the second cover plate stick together to define the cooling liquid channel: The above sandwich panels are bonded together, The lamination is made by placing the second isolation part of one sandwich panel between the body of the two sandwich panels and performing high-frequency welding so that the second isolation part and the second isolation part are connected to each other. The two boards are bonded together. According to the method according to claim 17, after laminating the two sandwich panels, further comprising: the first isolation part of the sandwich panel in contact with the first cover panel, and the second The first isolation part of the interlayer plate which the cover plate is in contact with emits infrared waves, so that the first isolation part is attached to the cover plate and the board body respectively. An electronic device comprising: A housing assembly, the housing assembly includes a housing base, the housing base defines an accommodating space, and the housing base has a heat dissipation assembly on one side facing the accommodating space; The battery and the main board, the battery and the main board are located inside the accommodation space defined by the housing assembly, the main board and the battery are electrically connected, Wherein, the heat dissipation assembly includes: a base body, the base body includes a first cover plate, a second cover plate and at least one interlayer plate, In a direction perpendicular to the plane where the first cover plate and the second cover plate are located, the sandwich panel is located between the first cover plate and the second cover plate, And there is a first cooling liquid flow channel between the first cover plate and the sandwich plate, and there is a second cooling liquid flow channel between the second cover plate and the sandwich plate, There is a through hole on the sandwich plate, and the first cooling liquid channel and the second cooling liquid channel communicate through the through hole, A piezoelectric ceramic pump, the piezoelectric ceramic pump is located on the first cover plate, the second cover plate or the interlayer plate, and communicates with the cooling liquid channel. The electronic device according to claim 19, the piezoelectric ceramic pump of the heat dissipation component is electrically connected to the main board.

Images