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WO2022128999A1 - Onduleur - Google Patents

Onduleur Download PDF

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Publication number
WO2022128999A1
WO2022128999A1 PCT/EP2021/085619 EP2021085619W WO2022128999A1 WO 2022128999 A1 WO2022128999 A1 WO 2022128999A1 EP 2021085619 W EP2021085619 W EP 2021085619W WO 2022128999 A1 WO2022128999 A1 WO 2022128999A1
Authority
WO
WIPO (PCT)
Prior art keywords
switching
inverter
carrier
current
carriers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2021/085619
Other languages
German (de)
English (en)
Inventor
Thomas Hessler
Samy Arnaout
Jochen Kurfiss
Reiner Holp
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of WO2022128999A1 publication Critical patent/WO2022128999A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/42—Conversion of DC power input into AC power output without possibility of reversal
    • H02M7/44—Conversion of DC power input into AC power output without possibility of reversal by static converters
    • H02M7/48—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H10W70/611—
    • H10W70/65—
    • H10W90/00—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45014—Ribbon connectors, e.g. rectangular cross-section
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H10W40/255—
    • H10W72/07533—
    • H10W72/07536—
    • H10W72/07537—
    • H10W72/07551—
    • H10W72/07552—
    • H10W72/07636—
    • H10W72/07637—
    • H10W72/50—
    • H10W72/527—
    • H10W72/5445—
    • H10W72/59—
    • H10W72/652—
    • H10W72/691—
    • H10W72/851—
    • H10W90/754—

Definitions

  • the invention relates to an inverter.
  • the inverter has at least two commutation circuits for generating at least two current phases for energizing an electrical machine.
  • a commutation circuit with a half bridge and at least one intermediate circuit capacitor is assigned to each current phase.
  • each current phase is controlled by a half-bridge, having two switches, such as semiconductor switches, which the phases Connect alternately to the supply voltage and the ground as reference potential. Together with an intermediate capacitor, these form the commutation circuit, also known as the commutation cell.
  • switches such as semiconductor switches
  • these Connect alternately to the supply voltage and the ground as reference potential.
  • these form the commutation circuit, also known as the commutation cell.
  • high currents are switched between the two switches and very high voltages occur due to parasitic power inductances.
  • parasitic power inductances These lead to switching losses and can damage the switches themselves or surrounding components. Accordingly, not only the purely ohmic components arise at the output stages, which heat up the switches, but also the switching losses, which arise due to the commutating during linear operation.
  • the proportions of the total losses can be quite high.
  • the switches and the intermediate circuit capacitors which have different limit temperatures above which the switch or the capacitor is damaged, are arranged on different circuit carriers in order to separate them thermally.
  • An example of such an arrangement is known from DE 10 2014 219 998 A1.
  • the half bridges are arranged on a switching carrier for each current phase and the intermediate circuit capacitor is arranged on a stamped part, here a copper rail.
  • the stamped part also has the function of a busbar, via which the switching carrier with the intermediate circuit capacitor and the switching carrier of the various current phases are electrically connected to one another and to the input-side voltage connection of the inverter.
  • the stamped part must be pretreated in preparation for bonding, such as roll-cladding the contact surfaces on the stamped part with aluminum. As a result, an additional manufacturing step is necessary.
  • stamped parts are overmoulded with a plastic. This can result in a thermal incident. The heat generated can cause the overmolding plastic to carbonize and start to burn.
  • 48V applications e.g. an inverter for a 48V drive
  • No Thermal Incident the so-called No Thermal Incident (NoTI)
  • 12V applications e.g. inverters for a 12V drive
  • voltage flashovers can occur in the 48V application in the form of an arc with a length of up to 3 mm, with the arc migrating in relation to the heat sink which is at ground potential and destroys the inverter.
  • the arc is only about 150 pm long and does not move.
  • HV high-voltage applications
  • the vehicle electrical system and the heat sink which is at ground potential, are galvanically isolated and there is residual current monitoring, so that an arc is detected and disconnected the battery is interrupted.
  • 48V applications neither galvanic isolation nor residual current monitoring is provided.
  • this object is achieved according to the invention in that the half-bridge and the at least one intermediate circuit capacitor of a commutation circuit are arranged on a common circuit substrate and the commutation circuit of each current phase is arranged on a separate circuit substrate, and that by means of at least one connecting element the Switch carrier two current phases are electrically contacted with each other, wherein the at least one connecting element is directly connected to the switch carrier of the current phases cohesively.
  • the inverter according to the invention has at least two commutation circuits for generating at least two phases for energizing an electrical machine.
  • each current phase is assigned a commutation circuit with a half bridge and at least one intermediate circuit capacitor and vice versa.
  • inverters have a housing with various connections, a cooler and switching carriers.
  • inverters have a voltage connection on the input side, such as a DC voltage connection, and phase connections on the output side, from which the various current phases generated in the inverter are routed to the electrical machine.
  • the inverter typically has multiple commutation circuits for generating different current phases.
  • the inverter typically has a control unit that controls the commutation circuits and, if necessary, also regulates them.
  • the half-bridge and the at least one intermediate circuit capacitor of a commutation circuit are arranged on a common switching substrate.
  • the commutation circuit is spatially as small as possible and thus also has the lowest possible switching losses, which are radiated as heat, for example.
  • a circuit carrier is a substrate on which one or more different layers are applied, from which the conductor track structure Ren and / or contact surfaces for different electrical potentials arise.
  • a circuit carrier can be equipped with different electrical components. The electrical current is conducted via the conductor tracks and/or contact surfaces to the electrical components that are arranged on the switch carrier, such as resistors, capacitors or semiconductor switches.
  • the conductor tracks and/or contact areas on the switching carrier serve as current paths.
  • the commutation circuit of each current phase is arranged on a separate switching carrier, i.e. each current phase has its own switching carrier with the commutation circuit belonging to the current phase.
  • each current phase has its own switching carrier with the commutation circuit belonging to the current phase.
  • the switching carriers of two current phases are electrically contacted with one another by means of at least one connecting element, the at least one connecting element being directly connected to the switching carrier of the current phases in a materially bonded manner.
  • a connecting element only connects two switching carriers to one another and not three or more switching carriers to one another.
  • the conductor tracks and/or contact areas on the respective switch carriers together with the connecting element form the current path for energizing the inverter.
  • This has the advantage that an additional, in particular plastic-encapsulated, stamped part can be dispensed with, which in turn eliminates the risk of a voltage flashover due to carbonized plastic encapsulation and increases the NoTI robustness.
  • the direct connection of the switching carriers also shortens the connection paths in comparison to a stamped part, which typically electrically connects more than two switching carriers to one another. Shorter connections are less inductive, which has a positive effect on the oscillation behavior of the intermediate circuit.
  • each switch carrier has at least two conductor tracks with different potentials (B+, B-), the conductor tracks of the same potential of two switch carriers being electrically contacted by means of at least one connecting element.
  • B+, B- the conductor tracks of the same potential of two switch carriers being electrically contacted by means of at least one connecting element.
  • the conductor tracks of the switching carriers are used to conduct current in the inverter, which means that an extra component for current conduction, such as a busbar, is not necessary.
  • the connecting element or the connecting elements are a bond, a wire and/or a metallic strip.
  • a wire typically has a round or quasi-round cross section and a strip has a rectangular or polygonal cross section.
  • a bond can be in the form of a wire or a metallic strip.
  • Bonds, wire and metallic strips have the advantage that they enable short connection paths.
  • the connecting element or the connecting elements are made of copper or a copper alloy. This has the advantage that the connecting elements can be cooled very well and at the same time have good electrical conductivity.
  • the integral connection between the switch carrier and the connecting element is a bonded connection, a welded connection, a soldered connection and/or an adhesive connection.
  • the bonding wire is bonded to the circuit carrier by means of ultrasound.
  • the wire, the bond or a metallic strip can also be welded or soldered or glued to the circuit carrier. This creates a thermally stable and robust and electrically highly conductive material connection between the switching carrier and the connecting element and overall between the switching carriers.
  • the commutation circuit consists of two, three or four intermediate circuit capacitors.
  • the advantage of using a plurality of capacitors instead of one capacitor is that the total capacitance of the commutation circuit can be divided among a number of intermediate circuit capacitors. Capacitors with a smaller capacity are usually more compact and spatially smaller than capacitors with a larger capacitance of the same type of capacitor. Smaller capacitors require less installation space, so that they can be arranged closer to the half-bridge, which in turn reduces the commutation circuit and thus the switching losses.
  • the intermediate circuit capacitor is an electrolytic capacitor, in particular a polymer hybrid electrolytic capacitor.
  • Electrolytic capacitors and in particular polymer hybrid electrolytic capacitors have the advantage that they are spatially small and can therefore be arranged on a circuit carrier in a very space-saving manner.
  • the inverter has three or six current phases, with the commutation circuit for each current phase being arranged on its own switching carrier.
  • a switching carrier of a current phase is electrically connected to the switching carriers of two other current phases, the switching carriers of the two other current phases not being directly electrically connected to one another. This makes a very compact structure possible.
  • the switching carriers are arranged spatially and electrically one behind the other, so that the current flow in the inverter takes place from the first switching carrier via the second switching carrier to the third switching carrier.
  • the second switching carrier is electrically connected to the first switching carrier via at least one connecting element and is connected to the third switching carrier via at least one other connecting element.
  • the first switching carrier and the third switching carrier are not electrically connected to one another directly, but via the second switching carrier.
  • the switching carrier of one current phase is electrically connected to the switching carrier of one of the two other current phases via more connecting elements than to the switching carrier of the other of the two other current phases.
  • This is particularly advantageous if the connection to the other of the two other current phases is not primarily used for current conduction, but for potential equalization. Due to the different number of connecting elements in the connection to two different switching carriers depending on the primary purpose of the connection, material and, by simplifying production, production costs can also be saved.
  • three switching carriers are arranged one behind the other with six current phases, as well as in the example described above for three current phases, whereby two groups each with three current phases result and the two groups with each three current phases are arranged parallel to one another.
  • the switching carriers are electrically connected, for example, via connecting elements to a switching carrier of the same group and to a switching carrier of the other group.
  • a switching carrier has more connecting elements to another switching carrier in the same group than to a switching carrier in the other group.
  • the connecting elements between two switching carriers of the same group serve to conduct current, while the connecting elements between two switching carriers of different groups serve to equalize the potential between the switching carrier groups.
  • current peaks of the intermediate circuit capacitors are reduced, which also reduces the oscillations in the inverter and, overall, the inverter has lower losses and is more stable.
  • the circuit carrier is a Direct Bonded Copper substrate (DBC), a Printed Circuit Board (PCB) or Insulated Metal Substrate (IMS).
  • DBC Direct Bonded Copper substrate
  • PCB Printed Circuit Board
  • IMS Insulated Metal Substrate
  • the conductor tracks or the line structures on the switching carrier can be used to conduct current, so that they only have to be electrically contacted with one another using at least one connecting element. This means that there is no need for an extra conductor rail, such as a stamped part, for making electrical contact between the various switch carriers. This saves space and costs in material and production.
  • the DBC substrate in particular has the advantage that it can be cooled very easily. A good thermal connection of the BDC substrate with simultaneous electrical insulation to the heat sink is possible.
  • the DBC substrate can be glued or soldered to the cooler, for example.
  • the half-bridge is preferably constructed from two semiconductor switches, the semiconductor switches in particular being MOSFETs.
  • FIG. 1 shows a section of the inverter according to the invention for 2 current phases
  • FIG. 2 shows an example of an inverter according to the invention for 6 current phases
  • FIG. 1 shows a section of the inverter 1 according to the invention.
  • Two commutation circuits on their respective switching carriers 2a, 2b and the electrical contacting with one another are shown schematically in the section.
  • the housing not shown is the housing, a heat sink or the connections, for example to a voltage source, to an electric motor or to a control unit that controls and, if necessary, also regulates the commutation circuits.
  • the switching carriers 2a, 2b conductor track structures are formed as potential surfaces.
  • the switching carriers are DBC substrates, which, with their large potential areas made of copper, can be easily cooled and used to conduct current in the inverter.
  • the first potential surface 21 is at a negative potential B-.
  • the second potential area 22 is at a positive potential B+.
  • the respective current phase is discharged via the third potential surface 23 .
  • the first and the second potential area 21, 22 are connected to a voltage connection (not shown) of the inverter, as the connection elements 43, 44 indicate.
  • the third potential area 23 is electrically contacted via connecting elements 45 with a phase rail 231, which leads the current phase to an electric machine or an electric motor.
  • three polymer hybrid electrolytic capacitors 10 are arranged on the switching carrier 2a and form the intermediate circuit capacitors
  • the first semiconductor switch 31, the so-called low-side switch is arranged in the region of the third potential surface 23 on the switch carrier 2a and is electrically connected to the first potential surface 21 by means of connecting elements 431.
  • the second semiconductor switch 32 the so-called high-side switch, is arranged on the switch carrier in the region of the second potential surface 22 and is electrically connected to the third potential surface 23 by means of connecting elements 432.
  • the third potential area 23 is connected to a stamped part 231 by means of a plurality of metal strips 45 .
  • the current phase of the commutation circuit is routed to an electric motor or an electric machine via the third potential area 23 and the stamped part 231 .
  • the second switching carrier 2b is constructed and equipped like the first switching carrier 2a. One difference is that the second switching carrier 2b has no direct electrical contact with the voltage connection of the inverter like the first switching carrier 2a.
  • the first and the second switching carrier 2a, 2b are electrically connected to one another via a total of 6 connecting elements in this example.
  • Two connecting elements 41 connect the two first potential areas 21 to the negative potential B ⁇ of the two switching carriers 2a, 2b.
  • Four connecting elements 42 connect the two second potential areas 21 to the positive potential B+ of the two switching carriers 2a, 2b.
  • more or fewer connecting elements can also be used for electrical contacting.
  • all connecting elements 41, 42, 43, 44, 45, 431, 432 are bonds that are bonded to the potential pads 21, 22, 23, switches 31, 32 and phase rail 321.
  • FIG. 2 shows an example of the inverter according to the invention with 6 commutation circuits, ie for 6 current phases. Identical or functionally identical parts are denoted by the same reference symbols. For the sake of clarity, not all of the elements on a switching carrier are always provided with reference numbers, but rather a different group of elements in the case of different switching carriers. However, the arrangement and representation show the same elements in different switching carriers and the corresponding reference symbols can be deduced. in the The differences between the two versions according to FIG. 1 and FIG. 2 are primarily discussed below.
  • the inverter has 6 switching carriers 2.
  • Each switching carrier 2 has the commutation circuit for a current phase.
  • the switching carriers 2 correspond to the switching carriers 2a, 2b described in FIG.
  • the 6 switching carriers 2 can be divided into two groups of 3 switching carriers 2 each.
  • the three switching carriers 2 arranged on the left in FIG. 2 form a first group and the three switching carriers 2 arranged on the right in FIG. 2 form a second group.
  • a first switch carrier 2 (in Figure 2 the lower switch carrier per group) is electrically contacted via connecting elements 43, 44 with the stamped parts 211, 221, as a result of which the first and second potential area 21, 22 of the first switch carrier 2 can be connected to a voltage source are.
  • the first switching carrier 2 is electrically connected to a second switching carrier 2 , which in turn is connected to a third switching carrier 2 .
  • the second switching carrier 2 is arranged spatially and electrically between the first and the third switching carrier 2 .
  • the switching carriers 2 make electrical contact with one another via connecting elements 41 , 42 , the first and the third switching carrier 2 not having direct electrical contact with one another, but rather being electrically connected via the second switching carrier 2 .
  • the switching carrier 2 of the first and second group are also electrically connected to one another.
  • the first switching carrier 2 of the two groups, the second switching carrier 2 of the two groups and the third switching carrier 2 of the two groups are each electrically connected to one another.
  • the electrical connection or contact is produced by one or more connecting elements 46, 47.
  • the first potential areas 21 of the switch carrier 2 are connected to a connecting element 47 and the second potential areas 22 of the switch carrier 2 are connected to another connecting element 46 .
  • the electrical connection of the switching carriers of the two groups is used for equipotential bonding between the switching carriers 2 of the first and second group and is less used for conducting current than with the switching carriers 2 within a group.
  • the switching carriers 2 have more connecting elements to adjacent switching carriers 2 of the same group than to adjacent switching carriers 2 of the other group.
  • a part of the housing 100 and the 6 phase rails 231 and the stamped parts 211 and 221 for the voltage supply of the first and the second potential areas 21, 22 on the switch carriers 2 can also be seen.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Inverter Devices (AREA)

Abstract

Onduleur (1) ayant au moins deux circuits de commutation pour générer au moins deux phases de courant pour alimenter une machine électrique, un circuit de commutation avec un demi-pont (31, 32) et au moins un condensateur de circuit intermédiaire (10) est associé à chaque phase de courant, le demi-pont (31, 32) et le ou les condensateurs de circuit intermédiaire (10) d'un circuit de commutation étant disposés sur une porteuse de circuit commun (2) et le circuit de commutation de chaque phase de courant étant disposé sur un support de circuit séparé, et au moyen d'au moins un élément de liaison (41, 42), les porteuses de circuit (2) de deux phases de courant étant mises en contact électrique l'une avec l'autre, le ou les éléments de liaison (41, 42) étant directement liés à la porteuse de circuit (2) de la première phase de courant et à la porteuse de circuit (2) de la seconde phase de courant.
PCT/EP2021/085619 2020-12-17 2021-12-14 Onduleur Ceased WO2022128999A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102020216111.9A DE102020216111A1 (de) 2020-12-17 2020-12-17 Inverter
DE102020216111.9 2020-12-17

Publications (1)

Publication Number Publication Date
WO2022128999A1 true WO2022128999A1 (fr) 2022-06-23

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2021/085619 Ceased WO2022128999A1 (fr) 2020-12-17 2021-12-14 Onduleur

Country Status (2)

Country Link
DE (1) DE102020216111A1 (fr)
WO (1) WO2022128999A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022209806A1 (de) 2022-09-19 2024-03-21 Robert Bosch Gesellschaft mit beschränkter Haftung Kondensatorbauelement und Bauteilanordnung

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US20060138993A1 (en) * 2004-12-29 2006-06-29 Sauer-Danfoss Inc. Tandem battery powered inverter and method of implementing the same
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EP2608393A1 (fr) 2011-12-19 2013-06-26 Siemens Aktiengesellschaft Convertisseur de puissance
EP3032581B1 (fr) 2014-12-11 2019-10-09 Dr. Johannes Heidenhain GmbH Agencement de cellule de commutation pour onduleur
DE102015115271B4 (de) 2015-09-10 2021-07-15 Infineon Technologies Ag Elektronikbaugruppe mit entstörkondensatoren und verfahren zum betrieb der elektronikbaugruppe
EP3361836B1 (fr) 2017-02-08 2020-06-17 Siemens Aktiengesellschaft Système de demi-pont à faible inductance
DE102018201206A1 (de) 2018-01-26 2019-08-01 Siemens Aktiengesellschaft Modulare Anordnung eines Umrichters und Luftfahrzeug mit einer derartigen Anordnung
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Publication number Priority date Publication date Assignee Title
EP1401089A1 (fr) * 2002-09-18 2004-03-24 Continental ISAD Electronic Systems GmbH & Co. KG Machine électrique comme générateur, stator ou starter-générateur pour un véhicule
US20060138993A1 (en) * 2004-12-29 2006-06-29 Sauer-Danfoss Inc. Tandem battery powered inverter and method of implementing the same
DE102013217258A1 (de) * 2013-08-29 2015-03-05 Bayerische Motoren Werke Aktiengesellschaft Vorrichtung zur Umrichtung eines Gleichstroms in einen einphasigen oder mehrphasigen Wechselstrom
DE102014219998A1 (de) 2014-10-02 2016-04-07 Continental Automotive Gmbh Leistungsmodul, Leistungsmodulgruppe, Leistungsendstufe sowie Antriebssystem mit einer Leistungsendstufe
CN204886717U (zh) * 2015-08-21 2015-12-16 永济新时速电机电器有限责任公司 带过压吸收的组合水冷功率装置

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