WO2022039410A1 - Electronic device including antenna module - Google Patents

Abstract

An electronic device according to various embodiments of the present disclosure comprises a housing and an antenna module arranged in the housing, wherein the antenna module can comprise: a first patch antenna; a second patch antenna spaced from the first patch antenna; and a first director extending from the first patch antenna and facing at least a portion of the second patch antenna.

Description

Electronic device including antenna module

Various embodiments of the present disclosure relate to an electronic device including an antenna module.

Due to the development of information and communication technology and semiconductor technology, the distribution and use of various electronic devices is rapidly increasing. In particular, recent electronic devices are being developed to be portable and to be able to communicate. In addition, electronic devices may output stored information as sound or image. As the degree of integration of electronic devices increases and high-speed and large-capacity wireless communication becomes common, various functions may be mounted in one electronic device such as a mobile communication terminal in recent years. For example, not only communication functions, but also entertainment functions such as games, multimedia functions such as music/video playback, communication and security functions for mobile banking, schedule management, and electronic wallet functions are being integrated into one electronic device. . Such electronic devices are being miniaturized so that users can conveniently carry them.

Recently, research on an antenna structure for efficiently communicating with an external electronic device in a miniaturized electronic device is continuously being conducted.

An electronic device having a communication function, such as a portable terminal, may communicate with an external electronic device. For example, the electronic device may calculate an angle of an external electronic device with respect to the electronic device by using a phase difference between radio signals arriving at two reception antennas. However, depending on the location of the external electronic device, a phase of a signal arriving at the electronic device may be formed non-linearly, so that accuracy of angle determination of the external electronic device may be reduced.

The electronic device according to various embodiments of the present disclosure may provide a director positioned between patch antennas in order to increase a range for receiving a signal of an external electronic device.

A director according to various embodiments of the present disclosure may tune a signal radiated from an antenna to increase a linear interval of a phase difference of arrival (PDoA).

However, the problems to be solved in the present disclosure are not limited to the above-mentioned problems, and may be variously expanded without departing from the spirit and scope of the present disclosure.

According to various embodiments of the present disclosure, an electronic device includes a housing and an antenna module disposed in the housing, wherein the antenna module includes a first patch antenna, a second patch antenna spaced apart from the first patch antenna, and and a first director extending from the first patch antenna and facing at least a portion of the second patch antenna.

According to various embodiments of the present disclosure, an electronic device includes a housing and an antenna module disposed in the housing, wherein the antenna module includes a first patch antenna, a second patch antenna spaced apart from the first patch antenna, and and a first director connecting the first patch antenna and the second patch antenna.

According to various embodiments of the present disclosure, the electronic device may acquire a signal having a phase difference of arrival (PDoA) having an increased linear section by using an antenna module including a director. An electronic device that acquires a signal in which the linear section of the arrival phase difference is increased may increase a range of an angle of arrival (AoA) that can be used, so that a range of measuring positions of other electronic devices may be increased.

1 is a block diagram of an electronic device in a network environment, according to various embodiments of the present disclosure;

2 is a front perspective view of an electronic device, according to various embodiments of the present disclosure;

3 is a rear perspective view of an electronic device, according to various embodiments of the present disclosure;

4 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure;

5 is a view for explaining an antenna module disposed in an electronic device, according to various embodiments of the present disclosure.

6 is a view for explaining a method of measuring an angle of arrival of an antenna module according to various embodiments of the present disclosure.

7 is a view for explaining a phase value of a radiation pattern of an antenna module according to the prior art.

8A and 8B are diagrams for explaining a measurement range of an antenna module according to the related art.

9 is a schematic diagram of an antenna module, according to various embodiments of the present disclosure;

10 is a diagram for explaining a phase pattern of an antenna module according to various embodiments of the present disclosure.

11A and 11B are diagrams for explaining a measurement range of an antenna module according to various embodiments of the present disclosure.

12 is a diagram for describing a phase change according to a distance between a first patch antenna and a first director, according to various embodiments of the present disclosure.

13 is a front view of an antenna module according to various embodiments of the present disclosure;

14 is a perspective view of an antenna module according to an embodiment of the present disclosure;

15 is a perspective view of an antenna module according to another embodiment of the present disclosure.

16 is a perspective view of an antenna module according to another embodiment of the present disclosure;

17 is a schematic diagram for explaining a connection state between an antenna module and a processor in a first deferment mode, according to various embodiments of the present disclosure;

18 is a schematic diagram for explaining a connection state between an antenna module and a processor in a second deferment mode according to various embodiments of the present disclosure;

19 is a cross-sectional view of an antenna module according to various embodiments of the present disclosure;

1 is a block diagram of an electronic device in a network environment, according to various embodiments of the present disclosure;

Referring to FIG. 1 , in a network environment 100 , an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120 , a memory 130 , an input module 150 , a sound output module 155 , a display module 160 , an audio module 170 , and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or an antenna module 197 may be included. In some embodiments, at least one of these components (eg, the connection terminal 178 ) may be omitted or one or more other components may be added to the electronic device 101 . In some embodiments, some of these components (eg, sensor module 176 , camera module 180 , or antenna module 197 ) are integrated into one component (eg, display module 160 ). can be

The processor 120, for example, executes software (eg, the program 140 ) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120 . It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or operation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be stored in the volatile memory 132 , and may process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 . According to an embodiment, the processor 120 is the main processor 121 (eg, a central processing unit or an application processor), or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit) that can operate independently or together with the main processor 121 . (NPU: neural processing unit), image signal processor, sensor hub processor, or communication processor). For example, when the electronic device 101 includes the main processor 121 and the sub-processor 123 , the sub-processor 123 uses less power than the main processor 121 or is set to be specialized for a specified function. can be The auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .

The auxiliary processor 123 is, for example, on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to an embodiment, the co-processor 123 (eg, an image signal processor or a communication processor) may be implemented as part of another functionally related component (eg, the camera module 180 or the communication module 190). there is. According to an embodiment, the auxiliary processor 123 (eg, a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself on which artificial intelligence is performed, or may be performed through a separate server (eg, the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but in the above example not limited The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the above example. The artificial intelligence model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.

The memory 130 may store various data used by at least one component of the electronic device 101 (eg, the processor 120 or the sensor module 176 ). The data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input module 150 may receive a command or data to be used in a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 . The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).

The sound output module 155 may output a sound signal to the outside of the electronic device 101 . The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. The receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.

The display module 160 may visually provide information to the outside (eg, a user) of the electronic device 101 . The display module 160 may include, for example, a control circuit for controlling a display, a hologram device, or a projector and a corresponding device. According to an embodiment, the display module 160 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of a force generated by the touch.

The audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input module 150 or an external electronic device (eg, a sound output module 155 ) directly or wirelessly connected to the electronic device 101 . The sound may be output through the electronic device 102 (eg, a speaker or headphones).

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, user state), and generates an electrical signal or data value corresponding to the sensed state. can do. According to one embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 177 may support one or more specified protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ). According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication performance through the established communication channel. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a LAN (local area network) communication module, or a power line communication module). A corresponding communication module among these communication modules is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with an external electronic device through a cellular network, a 5G network, a next-generation communication network, the Internet, or a telecommunication network such as a computer network (eg, LAN or WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented as a plurality of components (eg, multiple chips) separate from each other. The wireless communication module 192 uses the subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 . The electronic device 101 may be identified or authenticated.

The wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR). NR access technology includes high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency) -latency communications)). The wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example. The wireless communication module 192 includes various technologies for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. It may support technologies such as full dimensional MIMO (FD-MIMO), an array antenna, analog beam-forming, or a large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101 , an external electronic device (eg, the electronic device 104 ), or a network system (eg, the second network 199 ). According to an embodiment, the wireless communication module 192 may include a peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency for realizing URLLC ( Example: downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less).

The antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern. According to an embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) other than the radiator may be additionally formed as a part of the antenna module 197 .

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, the mmWave antenna module comprises a printed circuit board, an RFIC disposed on or adjacent to a first side (eg, bottom side) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, an array antenna) disposed on or adjacent to a second side (eg, top or side) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and a signal ( eg commands or data) can be exchanged with each other.

According to an embodiment, the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or part of the operations performed by the electronic device 101 may be executed by one or more external devices among the external electronic devices 102 , 104 , or 108 . For example, when the electronic device 101 is to perform a function or service automatically or in response to a request from a user or other device, the electronic device 101 may perform the function or service itself instead of executing the function or service itself. Alternatively or additionally, one or more external electronic devices may be requested to perform at least a part of the function or the service. One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 . The electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request. For this, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199 . The electronic device 101 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

The electronic device according to various embodiments disclosed in this document may have various types of devices. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic device according to the embodiment of the present document is not limited to the above-described devices.

The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, but it should be understood to include various modifications, equivalents, or substitutions of the embodiments. In connection with the description of the drawings, like reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the item, unless the relevant context clearly dictates otherwise. In this document, "A or B", "at least one of A and B", "at least one of A or B," "A, B or C," "at least one of A, B and C," and "A , B, or C" each may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof. Terms such as "first", "second", or "first" or "second" may simply be used to distinguish an element from other such elements, and may refer elements to other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is "coupled" or "connected" to another (eg, second) component, with or without the terms "functionally" or "communicatively". When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.

As used herein, the term “module” may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as, for example, logic, logic block, component, or circuit. A module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

According to various embodiments, each component (eg, a module or a program) of the above-described components may include a singular or a plurality of entities. According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, or omitted. or one or more other operations may be added.

2 is a front perspective view of an electronic device, according to various embodiments of the present disclosure; 3 is a rear perspective view of an electronic device, according to various embodiments of the present disclosure;

2 and 3 , the electronic device 101 according to an exemplary embodiment has a front surface 310A, a rear surface 310B, and a side surface 310C surrounding a space between the front surface 310A and the rear surface 310B. ) may include a housing 310 including a. In another embodiment (not shown), the housing 310 may refer to a structure that forms part of the front surface 310A of FIG. 2 , the rear surface 310B of FIG. 3 , and the side surfaces 310C. According to an embodiment, the front surface 310A may be formed by a front plate 302 (eg, a glass plate including various coating layers or a polymer plate) at least a portion of which is substantially transparent. The rear surface 310B may be formed by the rear surface plate 311 . The back plate 311 may be formed of, for example, glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side surface 310C is coupled to the front plate 302 and the rear plate 311 and may be formed by a side bezel structure (or “side member”) 318 including a metal and/or a polymer. In some embodiments, the back plate 311 and the side bezel structure 318 are integrally formed and may include the same material (eg, glass, a metallic material such as aluminum, or ceramic).

In the illustrated embodiment, the front plate 302 includes two first edge regions 310D extending seamlessly from the front surface 310A toward the rear plate 311, the front plate ( 302) may be included at both ends of the long edge. In the illustrated embodiment (refer to FIG. 3 ), the rear plate 311 includes two second edge regions 310E extending seamlessly from the rear surface 310B toward the front plate 302 at both ends of the long edge. can be included in In some embodiments, the front plate 302 (or the back plate 311 ) may include only one of the first edge regions 310D (or the second edge regions 310E). In another embodiment, some of the first edge areas 310D or the second edge areas 310E may not be included. In the above embodiments, when viewed from the side of the electronic device 101 , the side bezel structure 318 does not include the first edge regions 310D or the second edge regions 310E as described above. The side may have a first thickness (or width), and the side including the first edge regions 310D or the second edge regions 310E may have a second thickness that is thinner than the first thickness.

According to an embodiment, the electronic device 101 includes a display 301 , audio modules 303 , 307 , 314 (eg, the audio module 170 of FIG. 1 ), and a sensor module (eg, the sensor module of FIG. 1 ). 176), camera modules 305, 312, 313 (eg, camera module 180 in FIG. 1), key input device 317 (eg, input module 150 in FIG. 1), and a connector hole ( 308 and 309 (eg, the connection terminal 178 of FIG. 1 ). In some embodiments, the electronic device 101 may omit at least one of the components (eg, the connector hole 309 ) or additionally include other components.

According to one embodiment, the display 301 may be visually exposed through, for example, the front plate 302 .

According to an embodiment, the surface (or the front plate 302 ) of the housing 310 may include a screen display area formed as the display 301 is visually exposed. For example, the screen display area may include a front surface 310A and first edge areas 310D.

In another embodiment (not shown), a recess or opening is formed in a part of the screen display area (eg, the front surface 310A and the first edge area 310D) of the display 301 , and the recess Alternatively, it may include at least one of an audio module 314 aligned with the opening, a sensor module (not shown), a light emitting device (not shown), and a camera module 305 . In another embodiment (not shown), on the rear surface of the screen display area of the display 301 , an audio module 314 , a sensor module (not shown), a camera module 305 , a fingerprint sensor (not shown), and a light emitting element (not shown) may include at least one or more of.

In another embodiment (not shown), the display 301 is coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer detecting a magnetic field type stylus pen. can be placed.

In some embodiments, at least a portion of the key input device 317 may be disposed in the first edge regions 310D and/or the second edge regions 310E.

According to an embodiment, the audio modules 303 , 307 , and 314 may include, for example, a microphone hole 303 and speaker holes 307 and 314 . In the microphone hole 303, a microphone for acquiring an external sound may be disposed therein, and in some embodiments, a plurality of microphones may be disposed to detect the direction of the sound. The speaker holes 307 and 314 may include an external speaker hole 307 and a call receiver hole 314 . In some embodiments, the speaker holes 307 and 314 and the microphone hole 303 may be implemented as a single hole, or a speaker may be included without the speaker holes 307 and 314 (eg, a piezo speaker).

According to an embodiment, the sensor module (not shown) may generate, for example, an electrical signal or data value corresponding to an internal operating state of the electronic device 101 or an external environmental state. The sensor module (not shown) includes, for example, a first sensor module (not shown) (eg, proximity sensor) and/or a second sensor module (not shown) disposed on the front surface 310A of the housing 310 ( Example: a fingerprint sensor), and/or a third sensor module (not shown) (eg, HRM sensor) and/or a fourth sensor module (not shown) disposed on the rear surface 310B of the housing 310 (eg: fingerprint sensor). In some embodiments (not shown), the fingerprint sensor may be disposed on the back 310B as well as the front 310A (eg, the display 301 ) of the housing 310 . The electronic device 101 may include a sensor module not shown, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, It may further include at least one of a humidity sensor and an illuminance sensor (not shown).

According to an embodiment, the camera modules 305 , 312 , and 313 are, for example, a front camera module 305 disposed on the front surface 310A of the electronic device 101 , and a rear surface disposed on the rear surface 310B of the electronic device 101 . It may include a camera module 312 , and/or a flash 313 . The camera module 305, 312 may include one or more lenses, an image sensor, and/or an image signal processor. The flash 313 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared cameras, wide angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 101 .

According to an embodiment, the key input device 317 may be disposed on the side surface 310C of the housing 310 . In another embodiment, the electronic device 101 may not include some or all of the above-mentioned key input devices 317 and the not included key input devices 317 are displayed on the display 301 , such as soft keys. It may be implemented in other forms.

According to an embodiment, a light emitting device (not shown) may be disposed on, for example, the front surface 310A of the housing 310 . The light emitting device (not shown) may provide, for example, state information of the electronic device 101 in the form of light. In another embodiment, the light emitting device (not shown) may provide, for example, a light source linked to the operation of the front camera module 305 . The light emitting device (not shown) may include, for example, an LED, an IR LED, and/or a xenon lamp.

According to one embodiment, the connector holes 308 and 309 are, for example, a first connector hole capable of receiving a connector (eg, a USB connector) for transmitting and receiving power and/or data with an external electronic device. 308 , and/or a second connector hole (eg, earphone jack) 309 capable of accommodating a connector for transmitting and receiving audio signals to and from an external electronic device.

4 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure;

Referring to FIG. 4 , the electronic device 101 (eg, the electronic device 101 of FIGS. 1 to 2 ) includes a front plate 210 (eg, the front plate 302 of FIG. 2 ) and a display 220 . (eg, the display 301 of FIG. 2 ), a first supporting member 232 (eg, a bracket), a main printed circuit board 240 , a battery 250 , a second supporting member 260 (eg, a rear case) ), and a rear plate 270 (eg, the rear plate 311 of FIG. 2 ). In some embodiments, the electronic device 101 may omit at least one of the components (eg, the first support member 232 or the second support member 260 ) or additionally include other components. . At least one of the components of the electronic device 101 may be the same as or similar to at least one of the components of the electronic device 101 of FIG. 1 or 2 , and overlapping descriptions will be omitted below.

According to an embodiment, the first support member 232 may be disposed inside the electronic device 101 and connected to the side bezel structure 231 , or may be integrally formed with the side bezel structure 231 . The first support member 232 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material. One surface of the first support member 232 may be coupled to the display 220 and the other surface may be coupled to the printed circuit board 240 . The printed circuit board 240 may be equipped with a processor, memory, and/or an interface. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

According to an embodiment, the memory may include, for example, a volatile memory or a non-volatile memory.

According to an embodiment, the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. The interface may, for example, electrically or physically connect the electronic device 101 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.

According to an embodiment, the printed circuit board 240 may be electrically connected to an antenna (not shown). According to an embodiment, the antenna may be disposed between the rear plate 270 and the battery 250 . An antenna (not shown) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. An antenna (not shown) may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging. For example, the antenna (not shown) may include a coil for wireless charging. In another embodiment, an antenna structure may be formed by a part of the side bezel structure 231 and/or the first support member 232 or a combination thereof.

According to one embodiment, the battery 250 is a device for supplying power to at least one component of the electronic device 101 , for example, a non-rechargeable primary cell, or a rechargeable secondary cell, or fuel. It may include a battery. At least a portion of the battery 250 may be disposed substantially coplanar with the printed circuit board 240 , for example. The battery 250 may be integrally disposed inside the electronic device 101 , or may be disposed detachably from the electronic device 101 . According to an embodiment, the battery 250 may be disposed in a housing (eg, the housing 310 of FIG. 1 ).

Although the electronic device 101 disclosed in FIGS. 1 to 3 has a bar-type or plate-type appearance, the present invention is not limited thereto. For example, the illustrated electronic device may be a rollable electronic device or a part of a foldable electronic device. The term “rollable electronic device” means that bending deformation of the display (eg, the display 220 of FIG. 3 ) is possible, so that at least a part of it is wound or rolled or the housing (eg, of FIG. 2 ) It may refer to an electronic device that can be accommodated inside the housing 310 . According to a user's need, the rollable electronic device can be used by expanding the screen display area by unfolding the display or exposing a larger area of the display to the outside. A “foldable electronic device” may refer to an electronic device that is foldable to face two different regions of a display or to face each other in opposite directions. In general, in a foldable electronic device in a portable state, the display is folded with two different areas facing each other or in opposite directions. can In some embodiments, the electronic device 101 according to various embodiments disclosed in this document may be interpreted to include not only a portable electronic device such as a smart phone, but also various other electronic devices such as a notebook computer or home appliance. there is.

5 is a view for explaining an antenna module disposed in an electronic device, according to various embodiments of the present disclosure.

Referring to FIG. 5 , the electronic device 101 may include an antenna module 400 and a camera module 500 . The configuration of the antenna module 400 and the camera module 500 of FIG. 5 may be all or partly the same as the configuration of the antenna module 197 and the camera module 180 of FIG. 1 .

According to various embodiments, the antenna module 400 and the camera module 500 may be disposed in the housing 310 . For example, the antenna module 400 and the camera module 500 may be disposed to face at least a portion of the rear plate 270 or the rear surface (eg, the rear surface 310B of FIG. 3 ) of the electronic device 101 . . According to an embodiment, the antenna module 400 and the camera module 500 may be disposed on a second support member (eg, the second support member 260 of FIG. 4 ).

According to various embodiments, the antenna module 400 may communicate with another electronic device (eg, the electronic device 102 of FIG. 1 ). According to an embodiment, the antenna module 400 may measure the position of the external object S. For example, the antenna module 400 includes at least one patch antenna 410, 420, 430 capable of resonating in a frequency band of about 3 GHz to 10 GHz, and the patch antennas 410, 420, 430 are other electrons. A signal from a device (eg, the electronic device 102 of FIG. 1 ) may be received.

According to various embodiments, the antenna module 400 may include a plurality of patch antennas 410 , 420 , and 430 . For example, the antenna module 400 includes a first patch antenna 410 , a second patch antenna 420 spaced apart from the first patch antenna 410 , and a first patch antenna 410 and a second patch antenna ( It may include a third patch antenna 430 spaced apart from the 420 . The first patch antenna 410 , the second patch antenna 420 , and the third patch antenna 430 may be disposed on substantially the same plane (eg, an XY plane).

According to various embodiments, the first patch antenna 410 and the third patch antenna 430 may be disposed to be spaced apart from the second patch antenna 420 by a specified distance. For example, the first feed of the first patch antenna 410 (eg, the first feeding 912 in FIG. 17 ) and the second feeding of the second patch antenna 420 (eg, the second feeding of FIG. 17 ) 922 )) and/or a third feed of the third patch antenna 430 (eg, the third feed 932 in FIG. 17 ) and a second feed of the second patch antenna 420 (eg, FIG. 17 ) The distance between the second feeds 922) may be arranged to be less than or equal to a half-wavelength (λ/2) distance of a radio frequency (RF) signal or the half-wavelength distance. For example, the distance between the first feed 912 of the first patch antenna 410 and the second feed 922 of the second patch antenna 420 may be formed to have a length of about 10 mm to 30 mm. , but is not limited thereto. According to an embodiment, the first patch antenna 410 , the second patch antenna 420 , or the third patch antenna 430 are disposed to be spaced apart by a specified distance, thereby achieving isolation of the antenna module 400 ( or "isolation") can be secured.

6 is a view for explaining a method of measuring an angle of arrival of an antenna module according to various embodiments of the present disclosure. 7 is a view for explaining a phase value of a radiation pattern of an antenna module according to the prior art. 8A and 8B are diagrams for explaining a measurement range of an antenna module according to the related art.

Referring to FIG. 6 , the electronic device 101 obtains the location of another electronic device (eg, the other electronic device 102 of FIG. 1 ) through the first patch antenna 410 and the second patch antenna 420 . can The configuration of the electronic device 101 , the first patch antenna 410 , and the second patch antenna 420 of FIG. 6 is the electronic device 101 , the first patch antenna 410 , and the second patch antenna of FIG. 5 . All or part of the configuration of 420 may be the same as that of the processor 120 of FIG. 6 , and all or part of the configuration of the processor 120 of FIG. 1 may be the same. According to an embodiment, another electronic device (eg, the electronic device 102 of FIG. 1 ) may be an authenticated device. For example, the other electronic device 102 may be a device connected to the electronic device 101 by BLE or a device registered by a user of the electronic device 101 . According to an embodiment, the other electronic device may be a device capable of performing ultra wide band (UWB) communication.

According to various embodiments, the electronic device 101 uses an antenna (eg, the antenna module 400 of FIG. 5 ) capable of detecting a signal in a predetermined angular range, and a predetermined angular range (eg, angle of arrival). The position of another electronic device (eg, the electronic device 102 of FIG. 1 ) located within (angle of arrival, θ) may be measured. The angle of arrival θ may be an angle of another electronic device (eg, the electronic device 102 of FIG. 1 ) with respect to the electronic device 101 . For example, the angle of arrival θ may be an angle at which the electronic device 101 receives a signal transmitted from another electronic device (eg, the electronic device 102 of FIG. 1 ).

According to an embodiment, the processor 120 uses an antenna capable of receiving or transmitting a ranging signal (eg, the first patch antenna 410 and the second patch antenna 420 ) to obtain an angle of arrival. can be measured. According to another embodiment, the processor 120 uses a single sided-two way ranging (SS-TWR) method or a double sided-two way ranging (DS-TWR) method to configure an external object (eg, the S)) of the external electronic device (eg, the electronic device 102 of FIG. 1 ) and the electronic device 101 may be measured. According to an embodiment, the ranging signal may include at least one of a ranging request message (eg, a polling message), a ranging response message, and a ranging control message. The ranging response message may be a signal transmitted by the other electronic device 102 in response to the ranging request message. The ranging control message may be a signal for activating a patch antenna of a combination corresponding to a stationary mode of the electronic device 101 based on a measurement value regarding an angle of the electronic device 101 .

According to various embodiments, the processor 120 transmits the signal from the transmitting device of the other electronic device 102 based on the phase difference of arrival (PDoA) (eg, the arrival phase difference ΔP of FIG. 8B ). The electronic device 101 determines the difference (Δd) between the arrival distances of the signals transmitted to the receiving device (the first patch antenna 410 and the second patch antenna 420), and the determined other electronic device 102 . The angle of arrival θ can be derived based on the difference Δd between the arrival distances of the signal transmitted from the transmitter to the receiver, The arrival phase difference ΔP is the first arrival phase P1 and the second arrival phase P2. As another example, the processor 120 may determine the angle of arrival θ using Equation 1, Equation 2, and Equation 3 below. In [Equation 1], D is a distance between a plurality of antennas (eg, the first patch antenna 410 and the second patch antenna 420), and Δd is an external electronic device ( For example, it may be a difference in arrival distances of signals transmitted from the transmitting device of the electronic device 102 of FIG. 1 to a plurality of antennas (eg, the first patch antenna 410 and the second patch antenna 420 ). In [Equation 2], ΔP may be the phase difference of the signal transmitted from the external object, and λ may be the length of the wavelength of the signal transmitted from the external object.

)는 프로세서(예: 도 1의 프로세서(120)) 또는 통신 모듈(예: 도 1의 통신 모듈(190))에서 감별하기에 충분히 크게 발생될 수 있다.According to various embodiments, the first patch antenna 410 , the second patch antenna 420 , or the third patch antenna 430 are disposed to be spaced apart by a specified distance, so that the phase difference (

) may be generated large enough to be discriminated in a processor (eg, the processor 120 of FIG. 1 ) or a communication module (eg, the communication module 190 of FIG. 1 ).

7, 8A, and 8B , the electronic device 101 may include an antenna (eg, the antenna module 600) configured to transmit or receive a signal in a spatial direction (Sd). . According to an embodiment, the spatial direction Sd may be a polar coordinate system. For example, the spatial direction Sd is a plane (eg, XZ of FIG. 12 ) on which the antennas of the electronic device 101 (eg, the first patch antenna 410 and the second patch antenna 420 of FIG. 6 ) are disposed. It may be a coordinate system in which the coordinates of a plane) are expressed as angles.

According to various embodiments, the electronic device 101 uses a plurality (eg, two) of antennas to locate another electronic device (eg, the electronic device 102 of FIG. 1 ) with respect to the electronic device 101 . (eg, angle of arrival (θ)) can be determined. For example, the antenna module 400 of the electronic device 101 includes a plurality of spaced apart antennas (eg, the first patch antenna 410 and the second patch antenna 420 of FIG. 6 ), and the other A signal transmitted from the electronic device 102 may be transmitted to the plurality of spaced apart antennas in different phases. For example, at a position corresponding to the spatial direction Sd, the first patch antenna 410 receives a signal having a first arrival phase P1, and a second patch antenna 410 and a second spaced apart signal are received. The two-patch antenna 420 may receive a signal having the second arrival phase P2 . The electronic device 101 uses the difference ΔP between the signal having the first arrival phase P1 and the signal having the second phase P2 to determine the arrival phase difference PDoA (eg: 8B), the angle of arrival θ may be determined based on the determined arrival phase difference PDoA. As the arrival phase difference PDoA or the angle of arrival θ is closer to the ideal linear structure I, the accuracy at which the electronic device 101 determines the position (eg, angle) of the other electronic device 102 increases. can

According to various embodiments, a range in which the electronic device 101 can determine the angle of arrival θ of another electronic device 102 may be determined by a linearity arrival phase difference (PDoA) region. According to a conventional antenna structure (eg, the first patch antenna 410 and the second patch antenna 420 of FIG. 7 ), the phase difference of arrival (PDoA) and/or the angle of arrival (θ) is the first patch antenna 410 . ) and the second patch antenna 420 and is formed in a linear shape in the first area A1, which is an area in a direction perpendicular to the virtual line of the electronic device 101 (eg, -40 degrees to 40 degrees), In the second area A2, which is an area in one lateral direction (eg, -90 degrees to -40 degrees), and the third area A3, which is an area in the other side direction (eg, 40 degrees to 90 degrees), the nonlinear formation can be formed.

Hereinafter, the structure of the antenna for increasing the size of the linearity region of the arrival satellite difference (PDoA) will be described.

9 is a schematic diagram of an antenna module, according to various embodiments of the present disclosure; 10 is a diagram for explaining a phase pattern of an antenna module according to various embodiments of the present disclosure. 11A and 11B are diagrams for explaining a measurement range of an antenna module according to various embodiments of the present disclosure. 12 is a diagram for describing a phase change according to a distance between a first patch antenna and a first director, according to various embodiments of the present disclosure.

9 to 12 , the antenna module 600 may include a patch antenna 610 and a director 620 . The configuration of the antenna module 600 of FIGS. 9 , 10 , and 12 may be all or partly the same as the configuration of the antenna module 400 of FIG. 5 .

According to various embodiments, the director 620 may include a connection region 622 connected to the patch antenna 610 and a director region 624 extending from the connection region 622 . According to an embodiment, the director region 624 may be spaced apart from the patch antenna 610 . For example, the antenna module 600 may include a slit 602 formed between the patch antenna 610 and the director region 624 . According to an embodiment, the director 620 may guide a signal transmitted or received from the patch antenna 610 .

According to various embodiments, the slit 602 may be formed in various shapes. In FIG. 9 , the director region 624 of the director 620 and the patch antenna 610 are shown to be spaced apart by a uniform distance, and the slit 602 is shown in a rectangular shape, but the present invention is not limited thereto. For example, the slit 602 may be formed in at least one of a trapezoidal shape, an oblique shape, an irregular shape, or an arc shape.

According to various embodiments, the patch antenna 610 and the director 620 may be formed of a conductive material (eg, metal). According to an embodiment, the patch antenna 610 and the director 620 may be integrally formed.

According to various embodiments, the antenna module 600 may include a printed circuit board 630 on which the patch antenna 610 is formed. According to an embodiment, the printed circuit board 630 is a flexible printed circuit board, and the printed circuit board 630 is a feed connected to the patch antenna 610 (eg, the feed unit 456 in FIG. 19). 612a)) and a ground (eg, the ground layer 464 of FIG. 19 ). The structure of the printed circuit board 630 will be described in detail with reference to FIG. 19 .

According to various embodiments, the director 620 may adjust or tune the direction of a signal radiated or received from the patch antenna 610 . For example, in the antenna module 600 including the director 620 , the fourth arrival phase of the signal received in the region (eg, 0 degrees to -80 degrees) in the spatial direction sd where the director 620 is located The magnitude of the phase value of (P4) is greater than the magnitude of the phase value of the third arrival phase P3 of the signal received in the region (eg, 0 degrees to 80 degrees) in the spatial direction sd where the patch antenna 610 is located. can be small According to an embodiment, the fourth arrival phase P4 of the signal radiated from the antenna module 600 including the director 620 is the second arrival phase P4 of the signal radiated from the antenna module 600 excluding the director 620 . 3 may be different from the arrival phase P3. For example, in all spatial directions sd, the magnitude of the fourth arrival phase P4 of the signal received from the antenna module 600 including the director 620 is the antenna module not including the director 620 . It may be smaller than the magnitude of the third arrival phase P3 of the signal received at . The third arrival phase P3 of the signal received from the antenna module 600 excluding the director 620 may be the same as or similar to the first arriving phase P1 or the second arriving phase P2 of FIG. 7 . there is.

According to various embodiments, the electronic device (eg, the electronic device 101 of FIG. 5 ) may determine the angle of arrival θ using the plurality of antenna modules 600 including the director 620 . For example, the electronic device 101 has a first antenna (eg, the antenna module 600 of FIG. 12 ) for transmitting or receiving a signal having a fifth arrival phase P5 and a sixth arrival phase P6 A second antenna for transmitting or receiving a signal (eg, the antenna module 600 of FIG. 5 ) may be included. The configuration of the fifth arriving phase P5 and the sixth arriving phase P6 of FIG. 11A may be all or partly identical to the configuration of the fourth arriving phase P4 of FIG. 10 . For example, the fifth arriving phase P6 or the sixth arriving phase P6 may be a phase in which the fourth arriving phase P4 is inverted.

According to various embodiments, the linearity of the arrival phase difference (PDoA) of the antenna module 600 including the director 620 is the antenna module not including the director 620 (eg, the first patch antenna 410 of FIG. 7 ). ) and the second patch antenna 420) may be larger than the linearity of the arrival phase difference PDoA. According to an embodiment, the fifth arriving phase P5 and the sixth arriving phase P6 may be adjusted by the director 620 of each antenna. For example, in one region (eg, -90 degrees to 0 degrees) in the spatial direction sd or spatial angle, one patch antenna (eg, the first patch antenna 811 in FIG. 14 ) transmits Alternatively, the value of the fifth arriving phase P5 of the received signal increases, and the value of the sixth arriving phase P6 of the signal transmitted or received by another antenna (eg, the second patch antenna 815 of FIG. 14 ) can be reduced. As another example, in another area (eg, 0 degrees to 90 degrees) in the spatial direction sd or spatial angle, one patch antenna (eg, the first patch antenna 811 in FIG. 14) transmits or The value of the fifth arriving phase P5 of the received signal decreases, and the value of the sixth arriving phase P6 of the signal transmitted or received by another antenna (eg, the second patch antenna 815 of FIG. 14 ) is can be increased.

According to various embodiments, the range in which the electronic device 101 including the director 620 of the antenna module 600 can determine the angle of arrival θ of the other electronic device 102 is the director 620 . The angle of arrival θ of the electronic device that does not include may be larger than a range in which it can be determined. For example, in the electronic device 101 including the director 620 , the linear section of the arrival phase difference PDoA and the linear section of the angle of arrival θ may be expanded. According to an exemplary embodiment ( FIG. 11B ), in the electronic device 101 including the director 620 , a fourth area A4 in which the linear section of the arrival phase difference PDoA and/or the angle of arrival θ have linearity. may have linearity between about -80 degrees and 80 degrees.

According to various embodiments, based on the width of the slit 602 or the slit distance d5 between the patch antenna 610 and the director region 624 , the phase P of the signal of the antenna module 600 changes can be According to an embodiment, when the slit distance d5 increases, the phase P of the signal of the antenna module 600 may increase. For example, when the distance between the patch antenna 610 and the director 620 is greater than the slit distance d5, the antenna module 600 moves to the seventh arrival phase P7 which is greater than the value of the arrival phase P. can be formed. For another example, when the distance between the patch antenna 610 and the director 620 is less than the slit distance d5, the antenna module 600 may perform an eighth arrival phase P8 that is smaller than the value of the arrival phase P. can be formed with

13 is a front view of an antenna module according to various embodiments of the present disclosure;

Referring to FIG. 13 , the antenna module 700 may include a first patch antenna 720 , a first director 730 , and a second patch antenna 750 . The configuration of the antenna module 700 of FIG. 13 may be all or part the same as the configuration of the antenna module 400 of FIG. 5 or the configuration of the antenna module 600 of FIGS. 9 and 10 .

According to various embodiments, the first patch antenna 720 and the second patch antenna 750 may be spaced apart. According to an embodiment, the first patch antenna 720 may be spaced apart from the second patch antenna 750 in the width direction (eg, the X-axis direction) of the electronic device (eg, the electronic device 101 of FIG. 5 ). can

According to various embodiments, the first director 730 may extend from the first patch antenna 720 and may face at least a portion of the second patch antenna 750 . For example, the first director 730 may be positioned between the first patch antenna 720 and the second patch antenna 750 . According to an embodiment, the first director 730 may include a first connection area 731 connected to the first patch antenna 720 and a first director area 732 extending from the first connection area 731 . can According to an embodiment, the first director area 732 may extend along the edge of the first patch antenna 720 . According to an embodiment, the first director 730 adjusts the phase of the signal transmitted or received by the first patch antenna 720 (eg, the fourth arrival phase P4 of FIG. 10 ), thereby adjusting the antenna module 700 . ) can increase the linear section of the arrival phase difference (PDoA).

According to various embodiments, the first patch antenna 720 may be formed in various shapes. According to an embodiment, the first patch antenna 720 may include a plurality of regions extending in different directions with respect to the first central region 725 . According to an embodiment, the first patch antenna 720 includes a first central region 725 , a 1-1 region 721 extending in the first direction d1 from the first central region 725 , and a first A first-second region 722 extending in a second direction d2 different from the first direction d1 in the central region 725 , a direction opposite to the first direction d1 in the first central region 725 , The first to third regions 723 extending in the third direction d3 and the first extending in the fourth direction d4 opposite to the second direction d2 from the first central region 725 are -4 region 724 .

According to various embodiments, the first patch antenna 720 and the first director 730 may be integrally formed. For example, the first patch antenna 720 and the first director 730 may be formed as an integrated first antenna module 710 .

According to various embodiments, the first antenna module 710 of the antenna module 700 may include a first slit 712 formed between the first patch antenna 720 and the first director 730 . For example, the first director region 732 of the first director 730 may be formed with a portion of the first patch antenna 720 (eg, the 1-1 region 721 and the 1-2 th region 722 ) and the first director region 732 of the first director 730 . You can face each other in a separated state.

According to various embodiments, the first patch antenna 720 may include at least one slit. For example, the first patch antenna 720 includes a 1-1 patch antenna slit 726a and a 1-2 th region 722 formed between the 1-1 region 721 and the 1-2 th region 722 . ) and the 1-3 th patch antenna slit 726b formed between the 1-3 th region 723 and the 1-3 th patch antenna formed between the 1-3 th region 723 and the 1-4 th region 724 . At least one of a slit 726c or a 1-4 th patch antenna slit 726d formed between the 1-4 th region 724 and the 1-1 th region 721 may be included.

According to various embodiments, the second patch antenna 750 may be formed in various shapes. According to an embodiment, the second patch antenna 750 may include a plurality of regions extending in different directions with respect to the first central region 755 . According to an embodiment, the second patch antenna 750 includes a second central region 755 , a 2-1 th region 751 extending in the first direction d1 from the second central region 755 , and a second A 2-2 region 752 extending in a second direction d2 different from the first direction d1 in the central region 755 , a direction opposite to the first direction d1 in the second central region 755 . A second region 753 extending in a third direction d3 and a second region 753 extending in a fourth direction d4 opposite to the second direction d2 from the second central region 755 -4 region 754 .

According to various embodiments, the second patch antenna 750 may include at least one slit. For example, the second patch antenna 750 may include a 2-1 th patch antenna slit 756a and a 2-2 th region 752 formed between the 2-1 th region 751 and the 2-2 th region 752 . ) and a 2-2 nd patch antenna slit 756b formed between the 2-3 th region 753 , and a 2-3 th patch antenna formed between the 2-3 th region 753 and the 2-4 th region 754 . At least one of a slit 756c or a 2-4 th patch antenna slit 756d formed between the 2-4 th region 754 and the 2-1 th region 751 may be included.

According to various embodiments, the first antenna module 710 and the second patch antenna 750 may overlap. For example, when the antenna module 700 is viewed in the width direction (eg, the X-axis direction) of the electronic device (eg, the electronic device 101 of FIG. 3 ), the first- The first region 721 and the 1-4 th region 724 may overlap the 2-1 th region 751 and the 2-4 th region 754 of the second patch antenna 750 . As another example, when the antenna module 700 is viewed from the electronic device (eg, in the width direction (eg, the X-axis direction) of the electronic device 101 of FIG. 3 ), the first director 730 is the second patch antenna ( 750) may overlap with at least a portion.

According to various embodiments, the antenna module 700 may include three patch antennas. For example, the antenna module 700 may further include a third antenna module 770 including a third patch antenna 780 and a third director 790 .

According to various embodiments, the third patch antenna 780 may be spaced apart from the first patch antenna 720 and the second patch antenna 750 . According to an embodiment, the third patch antenna 780 may be spaced apart from the first patch antenna 720 in a different direction with respect to the second patch antenna 750 . For example, the first patch antenna 720 is spaced apart from the second patch antenna 750 in the width direction (eg, the X-axis direction) of the electronic device (eg, the electronic device 101 of FIG. 5 ), and the second patch antenna 750 is spaced apart from each other. The 3 patch antenna 780 has a longitudinal direction (eg, Y) of the electronic device (eg, the electronic device 101 of FIG. 5 ) perpendicular to the width direction (eg, the X-axis direction) with respect to the second patch antenna 750 . axial) may be spaced apart. According to an embodiment, the first patch antenna 720 , the second patch antenna 750 , and the third patch antenna 780 may be disposed on the printed circuit board 702 .

According to various embodiments, the third director 790 may extend from the third patch antenna 780 and may face at least a portion of the second patch antenna 750 . For example, the third director 790 may be positioned between the third patch antenna 780 and the second patch antenna 750 . According to an embodiment, the third director 790 may include a third connection region 792 connected to the third patch antenna 780 and a third director region 794 connected to the third connection region 792 . there is. According to an embodiment, the third director region 794 may extend along the edge of the third patch antenna 780 . According to an embodiment, the third director 790 adjusts the phase of the signal transmitted or received by the third patch antenna 780 (eg, the fourth arrival phase P4 of FIG. 10 ), thereby adjusting the antenna module 700 . ) can increase the linear section of the arrival phase difference (PDoA).

According to various embodiments, the third patch antenna 780 may be formed in various shapes. According to an embodiment, the third patch antenna 780 may include a plurality of regions extending in different directions with respect to the third central region 785 . According to an embodiment, the third patch antenna 780 includes a third central region 785 , a third region 781 extending in the first direction d1 from the third central region 785 , and a third A 3-2 region 782 extending in a second direction d2 different from the first direction d1 from the central region 785, and a direction opposite to the first direction d1 in the third central region 785 A third region 783 extending in a third direction d3, and a third region 783 extending in a fourth direction d4 opposite to the second direction d2 from the third central region 785 -4 region 784 .

According to various embodiments, the third antenna module 770 of the antenna module 700 may include a third slit 772 formed between the third patch antenna 780 and the third director 790 . For example, the third director region 792 of the third director 790 may be formed with a portion of the third patch antenna 780 (eg, the 3-2 region 782 and the 3-3 region 783 ) and the third director region 792 of the third director 790 . You can face each other in a separated state.

According to various embodiments, the third patch antenna 780 may include at least one slit. For example, the third patch antenna 780 includes a 3-1 th patch antenna slit 786a and a 3-2 th region 782 formed between the 3-1 th region 781 and the 3-2 th region 782 . ) and the 3-2 th patch antenna slit 786b formed between the 3-3 region 783 , and the 3-3 th patch antenna formed between the 3-3 th region 783 and the 3-4 th region 784 . It may include at least one of a slit 786c or a 3-4th patch antenna slit 786d formed between the 3-4th region 784 and the 3-1 th region 781 .

According to various embodiments, the third antenna module 770 may overlap at least a portion of the second patch antenna 750 . For example, the antenna module 700 or the side surface (eg, the side surface 310C of FIG. 2 ) of the electronic device (eg, the electronic device 101 of FIG. 3 ) may be viewed in the longitudinal direction (eg, the Y-axis direction). In this case, the 3-1 th region 781 and the 3-2 th region 782 of the third patch antenna 780 are the 2-3 th region 753 and the 2-4 th region of the second patch antenna 750 . It may overlap with (754). As another example, when the antenna module 700 is viewed from the electronic device (eg, in the longitudinal direction (eg, the Y-axis direction) of the electronic device 101 of FIG. 3 ), the third director 780 is connected to the second patch antenna ( A portion of the 750 , for example, the 2-3 th region 753 and the 2-4 th region 754 may overlap.

According to various embodiments, conductive components of the antenna module 700 may be disposed on the same plane (eg, XY plane). For example, the first patch antenna 720 , the second patch antenna 750 , the third patch antenna 780 , the first director 730 , and the third director 790 may be located on the same plane. there is.

14 is a perspective view of an antenna module according to an embodiment of the present disclosure;

Referring to FIG. 14 , the antenna module 810 may include a first patch antenna 811 , a second patch antenna 815 , a first director 813 , and a second director 817 . The configuration of the antenna module 810 , the first patch antenna 811 , the second patch antenna 815 , and the first director 813 of FIG. 14 is the antenna module 700 and the first patch antenna 720 of FIG. 13 . ), the second patch antenna 750 , and the first director 730 may all or partly have the same configuration.

According to various embodiments, the second director 817 may extend from the second patch antenna 815 and may face the first patch antenna 811 and/or the first director 813 . For example, the second director 817 may be positioned between the first patch antenna 811 and the second patch antenna 815 . According to an embodiment, the first patch antenna 811 may be symmetrical to the second patch antenna 815 , and the first director 813 may be symmetrical to the second director 817 .

According to various embodiments, the second director 817 includes a second connection region 817a connected to the second patch antenna 815 and a second director region 817b extending from the second connection region 817a. can do. According to an embodiment, the second director 817 may extend along the edge of the second patch antenna 815 . According to an embodiment, the second director 817 adjusts the phase of the signal transmitted or received by the second patch antenna 815 (eg, the fourth arrival phase P4 in FIG. 10 ), thereby adjusting the antenna module 800 . ) can increase the linear section of the arrival phase difference (PDoA).

According to various embodiments, the antenna module 810 includes a first slit 814 formed between the first patch antenna 811 and the first director 813 , and a second patch antenna 815 and a second director ( 817) may include a second slit 818 formed between. According to an embodiment, the first director region 813b extending from the first connection region 813a of the first director 813 is spaced apart from the first patch antenna 811 by a uniform distance, and the second director ( The second director region 815b of the 817 may be spaced apart from the second patch antenna 815 by a uniform distance. The configuration of the first patch antenna 811 , the first director 813 , and the first slit 814 of FIG. 14 is the first patch antenna 720 , the first director 730 , and the first slit 814 of FIG. 13 . 712), all or part of the configuration may be the same.

15 is a perspective view of an antenna module according to another embodiment of the present disclosure.

15 , the antenna module 820 includes a first patch antenna 821 , a second patch antenna 823 , and a first director connected to the first patch antenna 821 and the second patch antenna 823 ( 825) may be included. The configuration of the antenna module 820 of FIG. 15 may be the same in whole or part as the configuration of the antenna module 700 of FIG. 13 .

According to various embodiments, the first director 825 includes a 1-1 connection region 826 connected to the first patch antenna 821 and a 1-2 connection region 827 connected to the second patch antenna 823 . ), and a first director region 828 facing the first patch antenna 821 and the second patch antenna 823 . According to one embodiment, the first director region 828 may include a first side 828a facing the first patch antenna 821 and a second side 828b facing the second patch antenna 823 . can According to an embodiment, the first patch antenna 821 and the second patch antenna 823 may be symmetric with respect to the first director 825 .

According to various embodiments, the antenna module 820 may include a plurality of slits. For example, the antenna module 820 includes a first slit 820a and a second patch antenna 823 formed between the first patch antenna 821 and the first director region 828 of the first director 825 and A second slit 820b formed between the first director region 828 of the first director 825 may be included.

According to various embodiments, the first patch antenna 821 , the second patch antenna 823 , and the first director 825 may overlap. For example, when the antenna module 810 is viewed in the width direction (eg, the X-axis direction) of the electronic device (eg, the electronic device 101 of FIG. 3 ), the first patch antenna 821 and the second patch The antenna 823 and the first director 825 may overlap.

According to various embodiments, the antenna module 820 includes a third patch antenna (not shown) spaced apart from the first patch antenna 821 and the second patch antenna 823 , and a second patch antenna 823 and a third A sixth director (not shown) for connecting a patch antenna (not shown) may be further included. The configuration of the third patch antenna (not shown) and the sixth director (not shown) may be all or partly the same as the configuration of the third patch antenna 780 and the third director 790 of FIG. 13 .

16 is a perspective view of an antenna module according to another embodiment of the present disclosure;

Referring to FIG. 16 , the antenna module 830 includes a first patch antenna 831 , a second patch antenna 833 , and a first director connecting the first patch antenna 831 and the second patch antenna 833 . (835). The configuration of the antenna module 830 of FIG. 16 may be the same in whole or part as the configuration of the antenna module 820 of FIG. 15 .

According to various embodiments, the first patch antenna 831 may be connected to the second patch antenna 833 through the first director 835 . According to an embodiment, the first patch antenna 831 may use the second patch antenna 833 as a director, and the second patch antenna 833 may use the first patch antenna 831 as a director. For example, the first director 835 transmits at least a portion of a signal transmitted from the first patch antenna 831 to the outside of the antenna module 830 through the first director 835 and the second patch antenna 833 . At least a portion of the emitted signal and transmitted from the second patch antenna 833 may be radiated to the outside of the antenna module 830 through the first director 835 and the first patch antenna 831 .

According to various embodiments, the first patch antenna 831 and the second patch antenna 833 may directly face each other. For example, the first director 835 may have a rod or bar shape extending from the first patch antenna 831 toward the second patch antenna 833 .

17 is a schematic diagram for explaining a connection state between an antenna module and a processor in a first deferment mode, according to various embodiments of the present disclosure; 18 is a schematic diagram for explaining a connection state between an antenna module and a processor in a second deferment mode according to various embodiments of the present disclosure;

17 and 18 , the electronic device 101 may include a processor 120 , an antenna module 900 , an antenna circuit 940 , a switching circuit 950 , and a sensor module 960 . The configuration of the antenna module 900 of FIGS. 17 and 18 is all or part the same as the configuration of the antenna module 700 of FIG. 13 , and the processor 120 of FIGS. 17 and 18 and the sensor module 960 of FIG. The configuration may be all or part the same as the configuration of the processor 120 and the sensor module 176 of FIG. 1 .

According to various embodiments, the antenna module 900 may include a plurality of patch antennas (a first patch antenna 910 , a second patch antenna 920 , and a third patch antenna 930 ). The plurality of patch antennas 910 , 920 , and 930 may be arranged in various ways. For example, a direction in which the first patch antenna 910 is spaced apart from the second patch antenna 920 may be different from a direction in which the third patch antenna 930 is spaced apart from the second patch antenna 920 . there is. According to an embodiment, the first patch antenna 910 is spaced apart from the second patch antenna 920 in the first axis Ax1 direction, and the third patch antenna 930 is connected to the second patch antenna 920 . It may be spaced apart from each other in a third axis Ax3 direction perpendicular to the first axis Ax1. According to an embodiment, the first axis Ax1 is a virtual axis formed by the first patch antenna 910 and the second patch antenna 920 , and the third axis Ax3 is the second patch antenna 920 and It may be a virtual axis formed by the third patch antenna 930 .

According to various embodiments, the antenna module 900 may include an antenna connection terminal 902 . According to an embodiment, at least one of the first patch antenna 910 , the second patch antenna 920 , or the third patch antenna 930 is electrically connected to the processor 120 through the antenna connection terminal 902 . can do.

According to various embodiments, the antenna circuit 940 may be electrically connected to the antenna module 900 and may control the connection of the patch antennas 910 , 920 , and 930 of the antenna module 900 . According to an embodiment, the electronic device 101 may select any one of the first patch antenna 910 , the second patch antenna 920 , and the third patch antenna 930 that operates as an antenna radiator in a designated frequency band (eg: Ultra-wideband (UWB)) may be used as a radiator for transmitting and receiving RF signals, and the other antenna radiators may be used as radiators for receiving RF signals of a designated frequency band. For example, the electronic device 101 determines the distance between the first patch antenna 910 , the second patch antenna 920 , and the third patch antenna 930 operating as an antenna radiator, and the distance between the first patch antenna and the other antenna radiator 930 . An antenna radiator having the smallest sum (eg, the second patch antenna 920) is used as an antenna radiator for transmitting and receiving RF signals of a specified frequency band, and the first patch antenna 910 and the third patch antenna 930 are used. can be used as an antenna radiator that receives an RF signal in a specified frequency band.

According to various embodiments, a signal obtained using the patch antennas 910 , 920 , and 930 of the antenna module 900 may be transmitted to the antenna circuit 940 through the antenna connection terminal 902 . The antenna circuit 940 is electrically connected to the processor 120 or the communication module (eg, the communication module 190 of FIG. 1 ), and transmits the signal obtained from the antenna module 900 to the processor 120 or the communication module ( 190) can be transferred. For example, the first patch antenna 910 is electrically connected to the antenna connection terminal 902 through the first feed 912 and the 1-1 antenna wire 914a, and the second patch antenna 920 is The second feed 922 and the 2-1 antenna wire 924a are electrically connected to the antenna connection terminal 902, and the third patch antenna 930 is connected to the third feed 932 and the 3-1 antenna. It may be electrically connected to the antenna connection terminal 902 through the wiring 934a.

According to various embodiments, the switching circuit 950 may be electrically connected to the patch antennas 910 and 930 and the antenna circuit 940 . According to an embodiment, the switching circuit 950 may include a switch 952 for selecting whether to operate the patch antennas 910 and 930 . For example, the switching circuit 950 uses the switch 952 to connect the first patch antenna 910 or the third patch antenna 930 to the processor 120 and/or the processor 120 and an antenna electrically connected to the processor 120 . It may be selectively connected to the circuit 940 . According to an embodiment, the switch 952 may connect the first patch antenna 910 or the third patch antenna 930 to the antenna circuit 940 according to a stationary mode (or rotation mode). The first patch antenna 910 or the third patch antenna 930 connected to the antenna circuit 940 may receive a ranging response signal. According to an embodiment, the processor 120 and/or the antenna circuit 940 transmits a switching signal (not shown) for controlling the switching circuit 950 to the switching circuit 950 , and the patch antenna (first patch) The connection state between the antenna 910 or the third patch antenna 930 ) and the antenna circuit 940 may be changed.

According to various embodiments, the sensor module 960 may include various sensors. For example, the sensor module 960 may include at least one of a gyro sensor, an acceleration sensor, and a geomagnetic sensor. According to an embodiment, the sensor module 960 may detect an angle of the electronic device 101 with respect to the ground, and transmit information reflecting the detected angle to the processor 120 .

According to various embodiments, the electronic device 101 may sense the mounting mode of the electronic device 101 using the sensor module 960 . According to an embodiment, the electronic device 101 uses the sensor module 960 to determine whether the posture of the electronic device 101 is a portrait state (eg, the first mounting mode of FIG. 17 ) or a landscape state (eg: It is possible to detect whether it is in the second deferment mode of FIG. 17 ). For example, the sensor module 960 may be a 9-axis motion sensor, and the electronic device 101 measures an azimuth (or “yaw”) measured by the 9-axis motion sensor, a pitch, Alternatively, a virtual coordinate space may be formed based on at least one of roll values, one area of the coordinate space may be divided into a landscape range, and another area of the coordinate space may be divided as a portrait range. The electronic device 101 determines whether the mounting mode of the electronic device 101 is a portrait state or a landscape state based on whether the current posture of the electronic device 101 is within the landscape range or the portrait range. can detect

According to various embodiments, the patch antennas 910 , 920 , and 930 used in the antenna module 900 may be changed based on the stationary mode of the electronic device 101 . For example, the patch antennas 910 , 920 , and 930 used in the antenna module 900 may be changed based on an angle between the electronic device 101 and the ground (eg, ZX plane). According to an embodiment, in the portrait state (eg, the first mounting mode of FIG. 17 ), the first axis Ax1 passing through the first patch antenna 910 and the second patch antenna 920 is the second patch antenna ( 920) and the third axis (Ax3) passing through the third patch antenna 930 may be in a state where the angle formed with the ground (eg, ZX plane) is smaller (eg, the first axis (Ax1) is parallel to the ground) there is. According to an embodiment, in the landscape state (eg, the second mounting mode of FIG. 18 ), the angle between the third axis Ax3 and the ground (eg, ZX plane) is smaller than that of the first axis Ax1. (eg, a state in which the third axis Ax3 is parallel to the ground).

According to various embodiments, in the first stationary mode (eg, FIG. 17 ), the first patch antenna 910 and the second patch antenna 920 are connected to an external object (eg, the external object S of FIG. 5 ). position can be measured. For example, when the antenna circuit 940 receives information reflecting the first deferred mode from the processor 120 , the antenna circuit 940 switches the switch 952 of the switching circuit 950 to the 1-2 th antenna. A first connection state connected to the wire 914b and not connected to the 3-2 antenna wire 934b may be controlled. In the first mounting mode, the first patch antenna 910 and the second patch antenna 920 are electrically connected to the antenna circuit 940 , and the third patch antenna 930 is electrically connected to the antenna circuit 940 . may not be connected. According to an embodiment, in the first mounting mode, a long edge (eg, an edge in the Y-axis direction) among edges of the housing (eg, the housing 310 of FIG. 2 ) of the electronic device 101 formed in a substantially rectangular shape. may be in a state (eg, a portrait state) located in a vertical direction with respect to the ground.

According to various embodiments, in the second stationary mode (eg, FIG. 18 ), the second patch antenna 920 and the third patch antenna 930 are connected to an external object (eg, the external object S of FIG. 5 ). position can be measured. For example, when the antenna circuit 940 receives information reflecting the second deferred mode from the processor 120 , the antenna circuit 940 switches the switch 952 of the switching circuit 950 to the 3-2 antenna A second connection state connected to the wiring 934b and not connected to the 1-2th antenna wiring 914b may be controlled. In the second mounting mode, the third patch antenna 930 and the second patch antenna 920 are electrically connected to the antenna circuit 940 , and the first patch antenna 910 is electrically connected to the antenna circuit 940 . may not be connected. According to an embodiment, in the second mounting mode, a shorter edge (eg, an X-axis direction) among edges of the housing (eg, the housing 310 of FIG. 2 ) of the electronic device 101 formed in a substantially rectangular shape. may be in a state (eg, a landscape state) located in a vertical direction with respect to the ground.

19 is a cross-sectional view of an antenna module according to various embodiments of the present disclosure;

Referring to FIG. 19 , the antenna module 400 may include a circuit board 440 , and the circuit board 440 may include an antenna layer 450 and a network layer 460 . The configuration of the antenna module 400 of FIG. 19 may be all or partly the same as that of the antenna module 900 of FIG. 9 .

According to various embodiments, the antenna layer 450 includes at least one dielectric layer 452 and an antenna element 454 and/or a feeder 456 located on or within the outer surface of the dielectric layer 452 . may include The feeding unit 456 may include a feeding point 457 and/or a feeding line 458 .

According to various embodiments, the network layer 460 includes at least one dielectric layer 462, at least one ground layer 464 located on or within the outer surface of the dielectric layer 462, at least one conductive via ( 466 , and/or a transmission line 467 . The feeder 456 and the transmission line 467 are electrically connected, and the feeder 456 may be a conductive via.

According to various embodiments, the network layer 460 includes a first connection unit 460-1 and a second connection unit 460-2, and the connection units 460-1 and 460-2 include a processor (eg, : It may be electrically connected to the processor 120 of FIG. 1 ) or a communication module (eg, the communication module 190 of FIG. 1 ). For example, the network layer 460 connects the connection parts 460-1 and 460-2 to a connector, and the RFIC (not shown) disposed on the main printed circuit board (eg, the main printed circuit board 240 of FIG. 4 ). city) can be electrically connected to. According to an embodiment, the connection parts 460-1 and 460-2 may include solder or a ball grid array (BGA).

According to various embodiments of the present disclosure, an electronic device (eg, the electronic device 101 of FIG. 2 ) includes a housing (eg, the housing 310 of FIG. 2 ), and an antenna module disposed within the housing (eg, FIG. 5 ) of an antenna module 400), wherein the antenna module includes a first patch antenna (eg, the first patch antenna 720 of FIG. 13), and a second patch antenna spaced apart from the first patch antenna (eg: The second patch antenna 750 of FIG. 13 ), and a first director (eg, the first director 730 of FIG. 13 ) extending from the first patch antenna and facing at least a portion of the second patch antenna may include

According to various embodiments, the first director may include a first connection area (eg, a first connection area 731 ) connected to the first patch antenna, and a first director area extending from the first connection area ( Example: a first director region 732), and the antenna module includes a first slit (eg, a first slit 712 in FIG. 13) formed between the first patch antenna and the first director region. can do.

According to various embodiments, the first patch antenna, the second patch antenna, and the first director may be located on the same plane.

According to various embodiments, the antenna module includes a third patch antenna (eg, the third patch antenna 780 of FIG. 13 ) and a third director extending from the third patch antenna (eg, the third director of FIG. 13 ) 790), wherein the third director may face at least a portion of the second patch antenna module.

According to various embodiments, the electronic device determines a mounting mode of the electronic device based on a sensor module (eg, the sensor module 960 of FIG. 17 ) configured to detect an angle of the electronic device with respect to the ground, and the angle. a processor configured to determine (eg, processor 120 in FIG. 17 ), and an antenna circuit electrically coupled to the processor (eg, antenna circuit 940 in FIG. 17 ) of the first or third patch antennas; It may further include a switching circuit configured to selectively connect (eg, the switching circuit 950 of FIG. 17 ).

According to various embodiments, the first patch antenna is spaced apart in a width direction (eg, an X-axis direction in FIG. 13 ) with respect to the second patch antenna, and the third patch antenna is spaced apart from the second patch antenna. An electronic device spaced apart from each other in a longitudinal direction (eg, the Y-axis direction of FIG. 13 ) perpendicular to the width direction.

According to various embodiments, the third director may include a third connection region connected to the third patch antenna (eg, a third connection region 791 of FIG. 13 ), and a third connection region extending from the third connection region. a director region (eg, the third director region 792 of FIG. 13 ), and the antenna module includes a third slit (eg, a third slit of FIG. 13 ) formed between the third patch antenna and the third director region. slit 772).

According to various embodiments, the first patch antenna may have a first central region (eg, the first central region 725 of FIG. 13 ) and a first direction (eg, the first direction ( eg, the first direction ( ) of FIG. 13 ) in the first central region d1)) extending in a 1-1 region (eg, region 1-1 721 in FIG. 13 ), in the first central region in a second direction different from the first direction (eg, in the second direction in FIG. 13 ) a region 1-2 (eg, region 1-22 of FIG. 13 ) extending in the direction d2), and a third direction (eg, region 722 of FIG. 13 ) opposite to the first direction in the first central region 13 th region 1-3 (eg, region 1-3 723 of FIG. 13 ) extending in the third direction d3 of FIG. 13 , and a fourth region opposite to the second direction in the first central region and a 1-4 th region (eg, a 1-4 th region 724 of FIG. 13 ) extending in a direction (eg, a fourth direction d4 of FIG. 13 ), wherein the second patch antenna includes a second a central region (eg, the second central region 755 in FIG. 13 ), a 2-1 region extending in the first direction from the second central region (eg, the 2-1 region 751 in FIG. 13 ); A second region (eg, region 2-2 752 of FIG. 13 ) extending in a second direction from the second central region, a third direction opposite to the first direction in the second central region area 2-3 (eg, area 2-3 of FIG. 13 ) extending to , and area 2-4 extending in a fourth direction opposite to the second direction from the second central area (eg, region 2-4 of FIG. 13 ), and the third patch antenna is disposed in a third central region (eg, third central region 785 of FIG. 13 ) in the third central region. Region 3-1 extending in the first direction (eg, region 3-1 781 of FIG. 13 ), region 3-2 extending in the second direction from the third central region (eg, region 781 of FIG. 13 ) 3-2 region 782), a 3-3 region extending in a third direction opposite to the first direction from the third central region (eg, a 3-3 region 783 of FIG. 13) , and the third center The region may include a 3-4th region (eg, a 3-4th region 784 of FIG. 13 ) extending in a fourth direction opposite to the second direction.

According to various embodiments, the first director is connected to the 1-1 region, extends along the 1-1 region and the 1-2 region, and the 2-3 th region and the second region You can face -4 realms.

According to various embodiments, the third director is connected to the 3-3 region, extends along the 3-3 region and the 3-2 region, and faces the 2-4 region; When the antenna module is viewed in the longitudinal direction of the electronic device, the 3-1 th region, the 3-2 th region, the 2-3 th region, and the 2-4 th region may overlap.

According to various embodiments, the antenna module may include a second director (eg, the second director 817 of FIG. 14 ) extending from the second patch antenna and facing the first director.

According to various embodiments, the second director may include a second connection area (eg, the second connection area 817a of FIG. 14 ) connected to the second patch antenna, and a second extension from the second connection area. and a director region (eg, the second director region 817b of FIG. 14 ), and the antenna module includes a first slit (eg, the first slit of FIG. 14 ) formed between the first patch antenna and the second director region. 814 ), and a second slit (eg, a second slit 818 of FIG. 14 ) formed between the second patch antenna and the second director region.

According to various embodiments, when the antenna module is viewed from a side surface of the electronic device (eg, side 310C in FIG. 2 ), the first patch antenna, the first director, and the second patch antenna can be nested.

According to various embodiments, the first patch antenna may be integral with the first director.

According to various embodiments, the housing may include a front surface (eg, a front surface 310A in FIG. 2 ), a rear surface (eg, a rear surface 310B in FIG. 2 ), and a side surface (eg, a side surface surrounding at least a portion of the front surface and the rear surface) Example: side 310C of FIG. 2 ), and the antenna module may face the rear surface.

According to various embodiments of the present disclosure, in an electronic device (eg, the electronic device 101 of FIG. 2 ), a housing (eg, the housing 310 of FIG. 2 ) and an antenna module (eg, the housing 310 of FIG. 2 ) disposed in the housing 5), wherein the antenna module includes a first patch antenna (eg, the first patch antenna 821 of FIG. 15), a second patch antenna spaced apart from the first patch antenna ( For example: the second patch antenna 823 of FIG. 15 ), and a first director (eg, the first director 825 of FIG. 15 ) connecting the first patch antenna and the second patch antenna may be included. .

According to various embodiments, the first director includes a first director area (eg, the first director area 828 of FIG. 15 ) facing the first patch antenna and the second patch antenna, and the The antenna module may include a third slit (eg, the third slit 820a of FIG. 15 ) formed between the first patch antenna and the first director region, and a third slit formed between the second patch antenna and the first director region. A fourth slit (eg, the fourth slit 820b of FIG. 15 ) may be included.

According to various embodiments, when the antenna module is viewed from the side of the electronic device, the first patch antenna, the first director, and the second patch antenna may overlap.

According to various embodiments, the first patch antenna, the second patch antenna, and the first director may be integrally formed.

According to various embodiments, the first director may have a rod or bar shape.

The electronic device including the various antenna modules of the present disclosure described above is not limited by the above-described embodiments and drawings, and various substitutions, modifications and changes are possible within the technical scope of the present disclosure. It will be clear to one of ordinary skill in the art.

Claims (15)

In an electronic device, housing; and An antenna module disposed in the housing, The antenna module is An electronic device comprising: a first patch antenna; a second patch antenna spaced apart from the first patch antenna; and a first director extending from the first patch antenna and facing at least a portion of the second patch antenna. According to claim 1, The first director includes a first connection region connected to the first patch antenna, and a first director region extending from the first connection region; The antenna module includes a first slit formed between the first patch antenna and the first director area. According to claim 1, The first patch antenna, the second patch antenna, and the first director are positioned on the same plane. According to claim 1, The antenna module includes a third patch antenna and a third director extending from the third patch antenna, The third director faces at least a portion of the second patch antenna module. 5. The method of claim 4, a sensor module configured to detect an angle of the electronic device with respect to the ground; a processor configured to determine a mounting mode of the electronic device based on the angle; and and a switching circuit configured to selectively couple the first patch antenna or the third patch antenna with an antenna circuit electrically coupled to the processor. 5. The method of claim 4, The first patch antenna is spaced apart in a width direction with respect to the second patch antenna, and the third patch antenna is spaced apart in a length direction perpendicular to the width direction with respect to the second patch antenna. 5. The method of claim 4, the third director includes a third connection region connected to the third patch antenna, and a third director region extending from the third connection region; The antenna module includes a third slit formed between the third patch antenna and the third director region. 5. The method of claim 4, The first patch antenna, a first central region, a 1-1 region extending from the first central region in a first direction, a 1-2 region extending from the first central region in a second direction, and the first region in the first central region a first 1-3 region extending in a third direction opposite to the direction, and a 1-4 th region extending in a fourth direction opposite to the second direction from the first central region; The second patch antenna is a second central region, a 2-1 region extending in a first direction from the second central region, a 2-2 region extending in a second direction from the second central region, and the first region in the second central region a region 2-3 extending in a third direction opposite to the direction, and regions 2-4 extending in a fourth direction opposite to the second direction from the second central region; The third patch antenna is A third central region, a 3-1 region extending from the third central region in a first direction, a 3-2 region extending from the third central region in a second direction, and the first region in the third central region An electronic device comprising: a third region extending in a third direction opposite to the direction; and a third region extending in a fourth direction opposite to the second direction from the third central region. 9. The method of claim 8, The first director is connected to the 1-1 region, extends along the 1-1 region and the 1-2 region, and faces the 2-3 th region and the 2-4 region Device. 9. The method of claim 8, the third director is connected to the 3-3 region, extends along the 3-3 region and the 3-2 region, and faces the 2-4 region; When the antenna module is viewed in the longitudinal direction of the electronic device, the 3-1 th region, the 3-2 region, the 2-3 th region, and the 2-4 region overlap the electronic device. According to claim 1, The antenna module includes a second director extending from the second patch antenna and facing the first director. 12. The method of claim 11, the second director includes a second connection area connected to the second patch antenna, and a second director area extending from the second connection area; The antenna module includes a first slit formed between the first patch antenna and the second director area, and a second slit formed between the second patch antenna and the second director area. According to claim 1, When the antenna module is viewed from the side of the electronic device, The first patch antenna, the first director, and the second patch antenna overlap an electronic device. According to claim 1, The first patch antenna is integral with the first director. According to claim 1, The housing includes a front surface, a rear surface, and a side surface surrounding at least a portion of the front surface and the rear surface, The antenna module faces the rear surface of the electronic device.

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