WO2022030460A1 - Polyphenylene sulfide resin composition and damping material comprising same - Google Patents

Abstract

Provided is a polyphenylene sulfide resin composition having a high loss factor near 70 °C and a high loss factor in a wide range of temperatures.　The polyphenylene sulfide resin composition comprises a polyphenylene sulfide resin (A) having a weight average molecular weight of greater than 4000 and a phenylene sulfide-based compound (B) having a weight average molecular weight of 4000 or less and including at least two phenylene sulfide structures, and has a glass transition temperature of 80 °C or less.

Description

Polyphenylene sulfide resin composition and damping material containing it

The present invention relates to a polyphenylene sulfide resin composition and a vibration damping material containing the same.

In recent years, many electric vehicles have been developed. Compared to conventional vehicles, electric vehicles are required to have a higher level of quietness in the vehicle interior when driven. Therefore, for the purpose of improving the quietness of the vehicle interior space, vibration damping of each member in the vehicle is being studied.

Here, polyphenylene sulfide (hereinafter, also referred to as "PPS") is widely used as a material for automobile members because it has excellent heat resistance and chemical resistance. Therefore, it is conceivable to use PPS as the vibration damping material. However, PPS shows a high loss factor at relatively high temperatures (eg, above 100 ° C.) but a low loss factor below 100 ° C. Therefore, there is a problem that it is difficult to use PPS as a damping material in an environment of 100 ° C. or lower.

On the other hand, various methods of adding a thermoplastic resin or an elastomer resin to PPS have been proposed for the purpose of further improving the processability, heat resistance, and dimensional stability of PPS (for example, Patent Documents 1 and 2). ..

Japanese Unexamined Patent Publication No. 2016-147960 Japanese Unexamined Patent Publication No. 2018-35230

However, even if PPS is mixed with a thermoplastic resin or an elastomer resin as in Patent Document 1 and Patent Document 2, it is difficult to increase the loss coefficient of the resin composition at about 70 ° C. Further, in order to exhibit vibration damping properties in various environments, the damping material is required to have a high loss coefficient in a wide temperature range. However, conventional PPS does not have a high loss factor over a wide temperature range.

The present invention has been made in view of the above problems. That is, it is an object of the present invention to provide a polyphenylene sulfide resin composition having a high loss coefficient in the vicinity of 70 ° C. and a high loss coefficient in a wide temperature range, and a vibration damping material containing the same.

The present invention provides the following polyphenylene sulfide resin compositions.
It contains a polyphenylene sulfide resin (A) having a weight average molecular weight of more than 4000 and a phenylene sulfide compound (B) having a weight average molecular weight of 4000 or less and containing two or more phenylene sulfide structures, and has a glass transition temperature. A polyphenylene sulfide resin composition having a temperature of 80 ° C. or lower.

The present invention also provides the following damping materials.
A vibration damping material containing the above polyphenylene sulfide resin composition.

The polyphenylene sulfide resin composition of the present invention has a high loss coefficient near 70 ° C. and a high loss coefficient in a wide temperature range. Therefore, the polyphenylene sulfide resin composition can be applied to damping materials used at various temperatures.

In the present specification, the numerical range indicated by "-" means a numerical range including the numerical values described before and after "-".

Hereinafter, a polyphenylene sulfide resin composition (hereinafter, also simply referred to as “resin composition”) that can be used as a damping material or the like will be described. However, the use of the resin composition is not limited to the use.

The polyphenylene sulfide resin has a high loss coefficient at a temperature of 100 ° C. or higher, but has a low loss coefficient at a temperature of less than 100 ° C. Even if the polyphenylene sulfide resin is mixed with other resins, elastomers, etc., it is difficult to increase the loss coefficient near 70 ° C.
The loss coefficient in the present specification is the loss elastic modulus (E ") with respect to the storage elastic modulus (E') of the resin or the resin composition. Specifically, the loss coefficient is the loss elastic modulus (E") / storage. It is a value expressed by elastic modulus (E'). The loss coefficient is a value indicating whether or not the energy of the resin when the resin or the resin composition is deformed can be absorbed. In other words, it can be said that the higher the loss coefficient, the higher the damping property.

Further, when the loss coefficient of the resin or the resin composition is high only at a specific temperature, it is difficult to exhibit sufficient vibration damping properties at a temperature away from that temperature. Therefore, it is also desired to provide a resin composition having high vibration damping property (high loss coefficient) in a wide range of temperatures.

As a result of diligent studies by the present inventors in view of the above-mentioned problems, the polyphenylene sulfide resin (A) having a molecular weight of more than 4000 (hereinafter, also referred to as “PPS resin (A)”) and the molecular weight of 4000 or less. A polyphenylene sulfide resin composition containing a phenylene sulfide compound containing two or more phenylene sulfide structures (hereinafter, also referred to as “compound (B)”) and having a glass transition temperature of 80 ° C. or lower is at 70 ° C. It has been revealed that it has a high loss coefficient and has a high loss coefficient in a wide temperature range (particularly in the range of 100 ° C. or lower). The reason why the above-mentioned problems are solved by the above-mentioned polyphenylene sulfide resin composition is considered as follows.

The PPS resin (A) has a relatively highly crystalline structure. Therefore, it is excellent in heat resistance and moldability, but its flexibility is low. On the other hand, when the compound (B) having a structure common to or very close to that of the PPS resin (A) and having a relatively low molecular weight is mixed with the PPS resin (A), the compound (B) becomes. It easily penetrates between the crystals of the PPS resin (A). At this time, when the PPS resin (A) and the compound (B) are mixed at a ratio such that the glass transition temperature of the resin composition is 80 ° C. or lower, the temperature of the resin composition is relatively low 70. It has a high loss coefficient at about ° C. Further, when the compound (B) is mixed, the loss coefficient becomes high not only in the vicinity of 70 ° C. but also in a wide temperature range. Therefore, the resin composition can be applied to a damping material used at a wide range of temperatures.

The PPS resin (A) and the compound (B) contained in the polyphenylene sulfide resin composition will be described in detail.

(1) Polyphenylene sulfide resin (PPS resin (A))
The PPS resin (A) is, for example, a resin containing a structural unit represented by the following formula (1). The weight average molecular weight of the PPS resin (A) is more than 4000.

The PPS resin (A) may contain a structural unit other than the structural unit represented by the above formula (1) as a part thereof as long as the desired effect is not impaired. However, the PPS resin (A) generally contains 99% by mass or more of the structural units represented by the above formula (1) with respect to the mass of one molecule of the PPS resin (A).

The weight average molecular weight of the PPS resin (A) may be more than 4000. The weight average molecular weight of the PPS resin (A) is preferably 10,000 or more and 100,000 or less, more preferably 15,000 or more and 90,000 or less, and preferably 20,000 or more and 80,000 or less. When the weight average molecular weight of the PPS resin (A) is more than 4000, the strength of the molded product (for example, damping material) obtained from the resin composition is high. The weight average molecular weight of the PPS resin (A) is a value measured as a polystyrene-equivalent value by gel permeation chromatography (GPC). Specifically, the weight average molecular weight is measured by the following method. 10 mg of the above PPS resin (A) is dissolved in 10 g of 1-chloronaphthalene at 230 ° C. The obtained solution is hot-filtered with a membrane filter and cooled to room temperature. Using 2 μL of a sample separated from the obtained solution, the weight average molecular weight is measured by high temperature GPC under the conditions of column temperature: 250 ° C., solvent: 1-chloronaphthalene, and flow velocity: 0.7 mL / min.

When the above GPC measurement is performed on the above resin composition, a peak having a maximum value in a region having a molecular weight of more than 4000 and a peak having a maximum value in a region having a molecular weight of 4000 or less are observed. The weight average molecular weight of the PPS resin (A) can be specified from the peak having the maximum value in the region having a molecular weight of more than 4000.

The glass transition temperature of the PPS resin (A) is preferably 70 ° C. or higher and 100 ° C. or lower, and more preferably 80 ° C. or higher and 90 ° C. or lower. When the glass transition temperature of the PPS resin (A) is within the above range, it is easy to obtain a resin composition having good processability and heat resistance.

The melting point of the PPS resin (A) is preferably 260 ° C. or higher and 300 ° C. or lower, more preferably 270 ° C. or higher and 290 ° C. or lower. When the melting point of the PPS resin (A) is 260 ° C. or higher, it is easy to obtain a resin composition having good heat resistance. On the other hand, when the melting point of the PPS resin (A) is 300 ° C. or lower, it can be melt-kneaded with the compound (B) described later without excessively increasing the temperature. The glass transition temperature and melting point of the PPS resin (A) can be measured by differential scanning calorimetry (DSC) or the like. Specifically, first, the PPS resin (A) is pressed at 320 ° C. for molding, and then the obtained molded product is rapidly cooled to room temperature. 5 mg of PPS resin (A) is taken from the cooled molded product. 5 mg of PPS resin (A) is sealed in an aluminum pan to obtain a measurement sample. The measurement sample is heated from room temperature to 340 ° C., and a DSC curve in the meantime is obtained. The heating rate from 50 ° C. to 340 ° C. is 10 ° C./min. From the obtained DSC curve, the glass transition temperature and the melting point are obtained.

The method for preparing the PPS resin (A) is not particularly limited. For example, the PPS resin (A) can be obtained by a known method of polymerizing benzene having two halogens at the para position and a sulfur source containing an alkali metal in an organic amide solvent. However, the method for preparing the PPS resin (A) is not limited to this method.

(2) Phenylene sulfide compound (Compound (B))
The weight average molecular weight of the compound (B) contained in the resin composition is 4000 or less. Compound (B) Has two or more phenylene sulfide structures. The phenylene sulfide structure is, for example, a structure represented by the following formula (1). In the structure represented by the following formula (1), a substituent such as a halogen atom may be bonded to the benzene ring. Compound (B) may contain two or more phenylene sulfide structures. The compound (B) may be, for example, a dimer (for example, dichlorodiphenyl sulfide, etc.) or a multimer containing 3 or more phenylene sulfide structures. In the present specification, two adjacent phenylene sulfide structures may share a sulfide bond (—S—). Therefore, the compound (B) also includes a compound such as dichlorophenyl sulfide and the like.

The compound (B) may partially contain a structure other than the structure represented by the above formula (1) as long as the desired effect is not impaired. The ratio of the mass of the phenylene sulfide structure in one molecule of compound (B) to the mass of one molecule of compound (B) is preferably 98% by mass or more, more preferably 99% by mass or more. When the mass ratio of the phenylene sulfide structure is 98% by mass or more, the compound (B) easily enters between the PPS resin (A), and the above effect is easily obtained.

The weight average molecular weight of compound (B) may be 4000 or less, preferably 200 or more and 2000 or less. When the weight average molecular weight of the compound (B) is 4000 or less, it is easy to penetrate into the crystal of the PPS resin (A), and it is easy to obtain a resin composition having a high loss coefficient over a wide temperature range. The weight average molecular weight of compound (B) is a value measured as a polystyrene-equivalent value by gel permeation chromatography (GPC). The specific measurement method is the same as the above-mentioned method for measuring the weight average molecular weight of the PPS resin (A).

The difference between the weight average molecular weight of the PPS resin (A) and the weight average molecular weight of the compound (B) is preferably 6000 or more, and more preferably 8000 or more. The larger the difference between the weight average molecular weight of the PPS resin (A) and the weight average molecular weight of the compound (B), the easier it is to obtain a resin composition having a high loss coefficient at a relatively low temperature.

The glass transition temperature of compound (B) depends on the weight average molecular weight of compound (B). For example, when the weight average molecular weight of compound (B) is about 4000, the glass transition temperature of compound (B) is about 49 ° C. When the weight average molecular weight of compound (B) is, for example, about 1700, the glass transition temperature of compound (B) is room temperature or lower.

The melting point of compound (B) is preferably 90 ° C. or higher and 275 ° C. or lower, and more preferably 95 ° C. or higher and 248 ° C. or lower. When the melting point of the compound (B) is 90 ° C. or higher, it is easy to obtain a resin composition having excellent strength and the like. When the melting point of the compound (B) is 275 ° C. or lower, the above-mentioned PPS resin (A) and the compound (B) can be melt-kneaded without excessively increasing the temperature. The glass transition temperature and melting point of the compound (B) can be measured in the same manner as the glass transition temperature and melting point of the PPS resin (A).

The method for preparing the compound (B) is not particularly limited. For example, compound (B) can be obtained by a known method of polymerizing benzene having two halogens and a sulfur source containing an alkali metal in an organic amide solvent. When compound (B) is prepared by such a method, the weight average molecular weight of compound (B) can be adjusted by adding an end-capping agent to the polymerization system. The method for preparing compound (B) is not limited to this method.

(3) Physical Properties of Resin Composition The resin composition may contain other components together with the above-mentioned PPS resin (A) and compound (B) as long as the desired effect is not impaired. The total amount of the PPS resin (A) and the compound (B) in the resin composition is preferably 20% by mass or more, more preferably 40% by mass or more, based on the total mass of the resin composition.

The content ratio (mass ratio) of the PPS resin (A) and the compound (B) in the resin composition is preferably 99: 1 to 60:40 as the mass of the PPS resin (A): the mass of the compound (B), 97. : 3 to 70:30 is more preferable, and 95: 5 to 80:20 is even more preferable. When the content ratio of the PPS resin (A) and the compound (B) in the resin composition is within the above range, it is easy to obtain a resin composition having a desired suitable glass transition temperature. When the content ratio of the compound (B) increases, the loss coefficient of the resin composition described later at 70 ° C. tends to be high, or the loss coefficient of the resin composition tends to be high in a wide temperature range. Considering the strength and moldability of the obtained resin composition, it is preferable that the resin composition contains a certain amount or more of the PPS resin (A). The content ratio (mass ratio) of the PPS resin (A) and the compound (B) may be specified from the charged amount. The content ratio (mass ratio) of the PPS resin (A) and the compound (B) may be specified, for example, from the molecular weight distribution measured by GPC described above. Specifically, for example, the content ratios of the PPS resin (A) and the compound (B) can be specified from the ratio of the peak area of the region having a molecular weight of more than 4000 to the peak area of the region having a molecular weight of 4000 or less.

The glass transition temperature of the resin composition may be 80 ° C. or lower, preferably 25 ° C. or higher and 80 ° C. or lower, and more preferably 29 ° C. or higher and 77 ° C. or lower. When the glass transition temperature of the resin composition is 70 ° C. or higher, it is easy to obtain a resin composition having excellent strength. On the other hand, when the glass transition temperature is 69 ° C. or lower, it is easy to obtain a resin composition having a wide 80% price range, which will be described later.

The loss coefficient of the resin composition at 70 ° C., that is, (loss elastic modulus (E ″) / storage elastic modulus (E ′)) is preferably 0.014 or more, and the loss coefficient at 70 ° C. is 0.014 or more. The resin composition has sufficient vibration damping properties at about 70 ° C. Therefore, the resin composition can also be applied to a vibration damping material used at around 70 ° C.

The loss coefficient can be calculated as follows. First, the resin composition is compression-molded to obtain a press sheet having a thickness of 1 mm. .. Specifically, a press sheet is obtained by performing compression at 320 ° C. for 1 minute under the condition of 5 MPa and then compression at 150 ° C. for 3 minutes under the condition of 10 MPa. A strip-shaped sample of 10 mm × 5 mm × 1 mm is cut out from the press sheet obtained by compression molding. Then, the strip-shaped sample is annealed at 150 ° C. for 1 hour. Then, using the obtained sample, the dynamic viscoelasticity measuring device was used to change the temperature from 20 ° C. to 240 ° C. at a heating rate of 2 ° C./min in a tensile mode, and the storage elastic modulus was stored every 10 ° C. at a frequency of 10 Hz. The rate (E') and the loss elastic modulus (E ") are specified. Then, the storage elastic modulus (E') and the loss elastic modulus (E") at 70 ° C. are specified, and the loss coefficient at 70 ° C. is obtained.

In the loss coefficient measured by the dynamic viscoelasticity measuring device, the temperature range in the region where the loss coefficient is 80% or more with respect to the maximum value of the loss coefficient (hereinafter, also referred to as "80% price range") is 26 ° C. or higher is preferable, 30 ° C. or higher is more preferable, and 35 ° C. or higher is even more preferable. When the 80% price range is 26 ° C. or higher, the resin composition exhibits a high loss coefficient over a wide temperature range. Therefore, the resin composition having a wide 80% price range is applicable to the damping material used at various temperatures. The 80% price range can be easily obtained, for example, by graphing the relationship between the loss coefficient and the temperature.

The temperature at which the loss coefficient of the resin composition is maximum is preferably 85 ° C. or higher and 135 ° C. or lower, and more preferably 95 ° C. or higher and 125 ° C. or lower. The maximum value of the loss coefficient is preferably 0.06 or more and 0.12 or less, and more preferably 0.07 or more and 0.09 or less. When the temperature at which the loss coefficient becomes maximum or the maximum value of the loss coefficient is within the above range, the resin composition can be easily used as a vibration damping material.

(4) Method for preparing resin composition The method for preparing the resin composition is not particularly limited. Typically, the resin composition is prepared by mixing the PPS resin (A) and the compound (B) with any component, if necessary, in a desired ratio. As a mixing method in such a method, melt-kneading is preferable because each component can be mixed uniformly and sufficiently.

As a specific example of a suitable method, the PPS resin (A) and the compound (B) and, if necessary, any component are premixed with a mixer such as a Henschel mixer or a tumbler, and then uniaxial or biaxial. A method of kneading using an extruder of the above and extruding to form a desired shape (for example, pellet shape, sheet shape, etc.) can be mentioned. A part of the PPS resin (A) and / or the compound (B) may be used as a masterbatch, and the masterbatch may be mixed with the remaining components and kneaded. In order to enhance the dispersibility of the PPS resin (A) and the compound (B), the particles of the PPS resin (A) and the compound (B) adjusted to the desired particle diameters by a method such as pulverization are mixed or melt-kneaded. The resin composition may be prepared by squeezing.

The temperature at the time of melt-kneading is preferably 280 ° C. or higher and 330 ° C. or lower, and more preferably 290 ° C. or higher and 320 ° C. or lower. When the temperature at the time of melt-kneading is 280 ° C. or higher, the PPS resin (A) and the compound (B) can be sufficiently melted, and a resin composition in which each component is uniformly mixed can be obtained . When the temperature at the time of melt -kneading is 330 ° C. or lower, kneading can be performed without decomposing the components of the resin composition such as the PPS resin (A) and the compound (B).

(5) Uses of Resin Composition As described above, the resin composition can be suitably used as a vibration damping material. The damping material may contain the above resin composition. The damping material may contain a filler in order to increase the strength of the damping material and the moldability. The vibration damping material may contain various additives and the like, if necessary.

Examples of fillers are fibrous fillers such as glass fiber, carbon fiber, silicon carbide fiber, silica fiber, alumina fiber, zirconia fiber, and aramid fiber, potassium titanate whiskers, calcium silicate whiskers (wolastonite), etc. Whiskers such as calcium sulfate whiskers, carbon whiskers, and boron whiskers, talc, mica, kaolin, clay, glass, magnesium carbonate, magnesium phosphate, calcium carbonate, calcium silicate, calcium sulfate, calcium phosphate, silicon oxide, aluminum oxide, oxidation. Examples thereof include powder inorganic fillers such as titanium, iron oxide (containing ferrite), copper oxide, disilconia, zinc oxide, silicon carbide, carbon, graphite, boron nitride, molybdenum disulfide, and silicon. The damping material may contain only one type of filler, or may contain two or more types of filler.

The shape of the filler is not particularly limited, and may be spherical, plate-shaped, fibrous, or the like. Further, the dimensions of the filler such as the particle size, the fiber diameter, and the fiber length are appropriately selected according to the use of the damping material, the required strength, and the like.

When the filler is mixed with the resin composition, the amount of the filler is preferably 0.1 part by mass or more and 400 parts by mass or less with respect to 100 parts by mass of the resin composition, and 1 part by mass or more and 300 parts by mass or less. More preferred. When the amount of the filler is 0.1 part by mass or more, the strength and moldability of the damping material can be enhanced. On the other hand, when the amount of the filler is 400 parts by mass or less, the performance derived from the resin composition (for example, vibration damping property) is not easily lost.

The damping material for mixing the filler and the resin composition can be prepared, for example, by kneading the above resin composition and the filler by melt kneading or the like.

Hereinafter, the present invention will be described in more detail with reference to examples. These examples do not limit the scope of the invention to be construed.

1. 1. Preparation of Material (1) Preparation of PPS Resin (A) As the PPS resin (A), W-214A (weight average molecular weight: 48500, glass transition temperature: 79 ° C.) manufactured by Kureha Corporation was used.

(2) Preparation and preparation of compounds (B1) to (B4) Sodium sulfide (Na ₂ S), sodium hydroxide (NaOH), N-methyl-2-pyrrolidone (NMP), ion exchange in a 1 L autoclave equipped with a stirrer. Water, 1,4-dichlorobenzene (p-DCB), and sodium thiophenolate were charged as shown in Table 1 below, respectively. Then, the autoclave was sealed under nitrogen gas, gradually heated to 240 ° C. over about 30 minutes with stirring, and held at 240 ° C. for 2 hours. Then, the contents cooled to near room temperature were taken out. Then, 1 L of acetone containing 3% pure water was added, and the mixture was stirred at room temperature for 30 minutes, and the operation of filtering the solid matter was performed three times. Subsequently, 1 L of pure water was further added, the mixture was stirred at room temperature for 30 minutes, and the operation of filtering was performed once. Further, 1 L of 0.18 mass% acetic acid aqueous solution was added, and the operation of stirring at room temperature for 30 minutes and then filtering was performed once, and 1 L of pure water was added, and the operation of stirring at room temperature for 20 minutes and then filtering was performed 4 times. The obtained solid material was dried with hot air at 120 ° C. for 4 hours to obtain compounds (B1) to (B3). As the compound (B4), a commercially available dichlorodiphenyl sulfide (B) was used. Table 1 shows the weight average molecular weights of the compounds (B1) to (B4) and the glass transition temperature (Tg).

The weight average molecular weights (styrene equivalent values) of the above compounds (B1) to (B4) were measured by gel permeation chromatography (GPC) according to the above method.

The glass transition temperature (Tg) of the above compounds (B1) to (B4) was measured with a differential scanning calorimeter (DSC) according to the above method. In the table, n. The description d. Means that Tg was not observed above 25 ° C.

[Examples 1 to 6]
The PPS resin (A) and any of the above compounds (B1) to (B4) were dry-blended at the ratios shown in Table 2. Then, the PPS resin (A) and the compounds (B1) to (B4) were melt-kneaded using a R60 (capacity 60 ml) barrel and a laboplast mill (Toyo Seiki Seisakusho) equipped with a full-flight screw. .. The temperature of the laboplast mill was set to 320 ° C., the time was set to 5 minutes, and the rotation speed was set to 100 rpm. The obtained resin composition was compressed at 320 ° C. for 1 minute at 5 MPa and further compressed at 150 ° C. for 3 minutes at 10 MPa to prepare a 55 mm × 55 mm × 1 mm press sheet.

[Comparative Example 1]
A press sheet was prepared in the same manner as in Example 1 using only the PPS resin (A).

[evaluation]
The loss coefficient at 70 ° C., the 80% price range of the loss coefficient, and the glass transition temperature (Tg) of the obtained resin composition were specified by the following methods. The results are shown in Table 2.

(1) Loss coefficient at 70 ° C. A strip-shaped sample of 10 mm × 5 mm × 1 mm was cut out from the above press sheet with a cutter knife. The obtained sample was annealed at 150 ° C. for 1 hour. For the sample, the storage elastic modulus (E') and loss elastic modulus (E ") were specified every 10 ° C. at a frequency of 10 Hz while raising the temperature from 20 ° C. to 240 ° C. at a heating rate of 2 ° C./min in a tensile mode. Then, the loss coefficient at 70 ° C. was obtained from the storage elastic modulus (E') and the loss elastic modulus (E press) at 70 ° C.

(2) 80% price range at the peak of the loss coefficient When the loss coefficient is measured by the above method, the temperature range in the region where the loss coefficient is 80% or more with respect to the maximum value of the loss coefficient is specified, and this is 80. % Price range.

(3) Glass transition temperature (Tg)
It was measured by the same method as the glass transition temperature (Tg) of the compounds (B1) to (B4).

As shown in Table 2, the resin compositions of Examples 1 to 6 containing the PPS resin (A) and the compounds (B1) to (B4) and having a Tg of 80 ° C. or lower are the PPS resin (A). It shows a higher loss coefficient at 70 ° C. as compared with the case of a single substance (Comparative Example 1). Further, the resin compositions of Examples 1 to 6 show a particularly high 80% price range.

Claims (4)

Polyphenylene sulfide resin (A) having a weight average molecular weight of more than 4000 and
A phenylene sulfide compound (B) having a weight average molecular weight of 4000 or less and containing two or more phenylene sulfide structures.
A polyphenylene sulfide resin composition comprising the above and having a glass transition temperature of 80 ° C. or lower. The weight average molecular weight of the phenylene sulfide compound (B) is 2000 or less.
The polyphenylene sulfide resin composition according to claim 1. The loss coefficient at 70 ° C. is 0.014 or more, and the loss coefficient is 0.014 or more.
The temperature range in the region where the loss coefficient is 80% or more with respect to the maximum value of the loss coefficient is 26 ° C. or more.
The polyphenylene sulfide resin composition according to claim 1 or 2. The polyphenylene sulfide resin composition according to any one of claims 1 to 3 is included.
Damping material.