WO2022017159A1 - Gimbal driving apparatus for camera module, camera module, and terminal device - Google Patents

Abstract

The present application provides a gimbal driving apparatus for a camera module, a camera module and a terminal device. The gimbal driving apparatus comprises: a first frame having a hollow first inner chamber; a second frame hinged to the first frame; a third frame which has a second inner chamber used for accommodating the camera module and provided in the first inner chamber of the first frame and is hinged to the second frame; a driving assembly, comprising: a group of magnetic bodies provided at the junctions of side walls of the second frame; and a group of coils provided on the first frame and provided corresponding to the positions of the group of magnetic bodies. The driving assembly is provided at the corner of the first frame, so that the volume of the camera module can be effectively reduced.

Description

PTZ drive device for camera module, camera module and terminal equipment technical field

The present application belongs to the field of camera modules, and in particular relates to a pan-tilt drive device for a camera module, a camera module and a terminal device.

Background technique

With the development of periscope camera module and multi-camera technology, the camera module itself can achieve more than 5 times the focal length adjustment. Combined with the existing electronic anti-shake technology, the current camera module can basically achieve a hybrid of about 50 times. The zoom greatly improves the pixel level of the camera module. The development of high-magnification zoom and ultra-high pixel camera module technology has made the camera module's requirements for anti-shake technology correspondingly increased. The larger the zoom factor, the higher the requirements for anti-shake, especially in the process of low-light shooting and macro shooting, due to the need for long exposure, slight jitter will have a huge impact on the image quality.

At present, the commonly used anti-shake technology is motor-driven lens anti-shake. On the one hand, with the development of lens technology, the original plastic lenses are gradually replaced by glass lenses, so the weight of the lens continues to increase. Compared with a lens with an increased weight, the driving force provided by the motor-driven structure is obviously insufficient, which affects the accuracy of the shake correction and reduces the quality of the captured images. On the other hand, the existing motor drive structure is complex, and the design cost is high, and its improvement requires high investment and low cost performance.

Among the emerging gimbal anti-shake technology, the micro gimbal anti-shake structure has a larger anti-shake angle than the traditional motor anti-shake structure. At the same time, because it drives the entire module structure to move, the reliability of the overall operation of the module can be guaranteed. In addition, the lens and the sensor move as a whole, and there is no relative displacement inside the module during the anti-shake movement, which can realize the overall anti-shake of the module and solve the problem of image quality loss at the edge of the motor anti-shake. Under the clamping of the micro-gimbal anti-shake structure, the main lens has a larger rotation angle, and the anti-shake range can reach 3.2 times that of optical anti-shake.

SUMMARY OF THE INVENTION

The present application aims to provide a pan-tilt driving device for a camera module, and the driving components are arranged at the corner of the first frame instead of the side wall, which can effectively reduce the volume of the camera module.

According to a first aspect of the present application, a pan-tilt driving device for a camera module is provided, comprising:

a first frame having a hollow first inner cavity;

a second frame hinged to the first frame;

The third frame has a second inner cavity for accommodating the camera module, is arranged in the first inner cavity, and is hinged with the second frame;

Drive components, including:

a group of magnetic bodies, arranged at the junction of the side walls of the third frame;

A group of coils is arranged on the first frame and is arranged corresponding to the position of the group of magnetic bodies.

According to some embodiments of the present application, the first framework includes:

The first installation hole is arranged at the bottom of the side wall of the first frame.

According to some embodiments of the present application, the PTZ driving device further includes:

The bottom plate of the driving device cooperates with the first frame and accommodates the camera module in the second inner cavity.

According to some embodiments of the present application, the third framework further includes:

The latching device is arranged on the side wall of the third frame, one end away from the bottom plate of the driving device, and is used to adjust the flatness of the lens assembly during assembly.

According to some embodiments of the present application, the drive assembly further includes:

A drive circuit board, including a T-FPC circuit board, is connected to the set of coils and supplies power to the drive assembly.

According to some embodiments of the present application, the first frame includes: a set of first grooves disposed on the inner wall of the first frame; the third frame includes: a set of second grooves disposed on the inner wall of the first frame The outer wall of the third frame and the set of first grooves form a set of sliding guide rails; the pan-tilt driving device further includes: a set of rolling bodies arranged in the set of sliding guide rails.

According to some embodiments of the present application, the group of first grooves and/or the group of second grooves include: magnetic grooves, which are used to define the initial positions of the group of rolling elements by magnetic force.

According to some embodiments of the present application, the height of the third frame is lower than the height of the first frame.

According to some embodiments of the present application, the second framework includes:

The second main body structure;

A first group of cantilevers, one end is fixedly connected with the second main body structure, and the other end is hinged with the first frame;

One end of the second group of cantilevers is fixedly connected to the second main body structure, and the other end is hinged to the third frame.

According to some embodiments of the present application, the second main body structure includes: a second limiting hole disposed in the center of the second main body structure.

According to a second aspect of the present application, a camera module is provided, comprising:

The above-mentioned PTZ drive device;

The main body of the lens module is accommodated in the second inner cavity of the third frame, and is connected with the third frame.

According to some embodiments of the present application, the camera module body includes:

a lens carrier or a motor, which is fixedly connected to the third frame and rotates with the third frame;

an optical lens, connected with the lens carrier or the motor, and extending out of the second frame from the second inner cavity of the third frame;

The photosensitive component is connected with the lens carrier or the motor.

According to some embodiments of the present application, the lens carrier or the motor is in contact with the lower surface of the positioning device of the third frame.

According to some embodiments of the present application, the photosensitive assembly includes:

the first circuit board;

One end of the circuit board connecting strip is connected to the external power supply device, and the other end is connected to the first circuit board through the first installation hole.

According to some embodiments of the present application, the circuit board connecting tape includes:

the bent second circuit board;

One end of the connector is connected with the bent second circuit board, and the other end is connected with an external power supply device.

According to some embodiments of the present application, the bent second circuit board includes:

The hollow structure is arranged between the lines arranged on the bent second circuit board.

According to a third aspect of the present application, a terminal device is provided, including the above camera module.

In the pan-tilt driving device for a camera module provided by the present application, on the one hand, the driving components are arranged at the corners of the first frame instead of the side walls, thereby effectively reducing the volume of the camera module; in addition, the first frame is arranged on the Mounting holes, so that the circuit board connecting belt that supplies power to the lens module is connected to the external power supply device through the mounting hole, so as to reduce the resistance of the connecting belt during the movement of the module; Separate power supply, so that the two will not interfere with each other during the working process, and improve the working efficiency of the module.

Additional aspects and advantages of the present application will be set forth, in part, from the following description, and in part will become apparent from the following description, or may be learned by practice of the present application.

Description of drawings

In order to illustrate the technical solutions in the embodiments of the present application more clearly, the following briefly introduces the drawings used in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application.

FIG. 1 shows a first structural schematic diagram of a pan-tilt driving device according to an exemplary embodiment of the present application.

FIG. 2 shows a second structural schematic diagram of a pan-tilt driving device according to an exemplary embodiment of the present application.

FIG. 3 shows a schematic diagram of the connection between the third frame and the first frame according to an exemplary embodiment of the present application.

FIG. 4 shows a perspective view of the photosensitive assembly of the camera module.

FIG. 5 shows a schematic structural diagram of a photosensitive assembly of a camera module.

Figure 6 shows a top view of the molded support structure.

FIG. 7 shows a cross-sectional view of the structure of the molded support base.

FIG. 8 shows a schematic diagram of a circuit board of a photosensitive assembly of a camera module according to an exemplary embodiment of the present application.

FIG. 9 shows a perspective view of a camera module lens assembly according to an exemplary embodiment of the present application.

FIG. 10 shows a cross-sectional view of a lens assembly of a camera module according to an exemplary embodiment of the present application.

FIG. 11 shows a perspective view of a main body of a camera module according to an exemplary embodiment of the present application.

FIG. 12 shows a side view of a camera module body according to an exemplary embodiment of the present application.

FIG. 13 shows an exploded view of a camera module according to an example embodiment of the present application.

FIG. 14 shows a perspective view of a camera module according to an example embodiment of the present application.

FIG. 15 shows a schematic diagram of the composition of a terminal device according to an exemplary embodiment of the present application.

detailed description

Example embodiments are described more fully below with reference to the accompanying drawings. Example embodiments, however, can be embodied in various forms and should not be construed as limited to the embodiments set forth herein. These embodiments are provided so that this application will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar parts, and thus their repeated descriptions will be omitted.

Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided in order to give a thorough understanding of the embodiments of the present application. However, those skilled in the art will appreciate that the technical solutions of the present application may be practiced without one or more of the specific details, or other methods, components, devices, steps, etc. may be employed. In other instances, well-known methods, devices, implementations, or operations have not been shown or described in detail to avoid obscuring aspects of the present application.

It will be understood that, although the terms first, second, etc. may be used herein to describe various components, these components should not be limited by these terms. These terms are used to distinguish one component from another. Accordingly, a first component discussed below could be referred to as a second component without departing from the teachings of the concepts herein. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Those skilled in the art will appreciate that the drawings are merely schematic representations of example embodiments and may not be to scale. The modules or processes in the drawings are not necessarily necessary to implement the present application, and therefore cannot be used to limit the protection scope of the present application.

With the improvement of the pixel level of the camera, the technical requirements for the camera module are also higher. As we all know, the larger the zoom factor, the higher the requirements for the anti-shake performance of the module. Slight jitter during the shooting process will affect the image quality of the module. Therefore, it is necessary to add an anti-shake structure to the camera module structure.

The inventors of the present invention found that, in the existing anti-shake structure of the micro pan/tilt head, the driving structure needs to drive the camera module to move as a whole. Therefore, in order to provide sufficient driving force, the volume of the driving structure is generally relatively large. In addition, the circuit board connection belt of the camera module needs to supply power to the driving device and the photosensitive chip at the same time, which not only affects the driving effect of the gimbal driving structure, but also affects the working efficiency of the module, thus restricting the accuracy of shake correction.

In view of the above technical problems, the present application provides a pan-tilt driving device, which can realize the miniaturization of the micro pan-tilt structure on the premise of ensuring the driving force; on the other hand, the driving device and the power supply circuit of the photosensitive chip are separately arranged, So that the two do not affect each other, so as to ensure the anti-shake accuracy.

The technical solutions of the present application will be described in detail below with reference to the accompanying drawings.

FIG. 1 shows a first structural schematic diagram of a pan-tilt driving device according to an exemplary embodiment of the present application.

FIG. 2 shows a second structural schematic diagram of a pan-tilt driving device according to an exemplary embodiment of the present application.

According to a first aspect of the present application, a pan-tilt driving device 1000 for a camera module is provided, as shown in FIG. 1 and FIG. 2 . The PTZ driving device 1000 includes: a first frame 1100 , a second frame 1200 , a third frame 1300 and a driving assembly 1400 . The first frame 1100 has a hollow first inner cavity 1110 . The second frame 1200 is hinged with the first frame 1100 through the first connecting shaft 1250 , and can rotate around the first connecting shaft 1250 . The third frame 1300 is disposed in the first inner cavity 1110 of the first frame 1100 , is hinged with the second frame 1200 through the second connecting shaft 1260 , and can rotate around the second connecting shaft 1260 . The driving assembly 1400 includes a set of magnetic bodies 1410 , a set of coils 1420 and a driving circuit board 1430 . A set of magnetic bodies 1410 are disposed at the junction of the side walls of the third frame. A group of coils 1420 are disposed on the first frame 1100 and are disposed corresponding to the positions of a group of magnetic bodies 1420 . The driving circuit board 1430 is connected to a group of coils 1420 to provide a working current for the group of coils 1420 . The third frame 1300 has a second inner cavity 1310 for accommodating the camera module.

When the pan-tilt driving device 1000 is assembled with the camera module, the camera module is installed in the second inner cavity 1310 and is fixedly connected with the third frame 1300 . Therefore, when the third frame 1300 moves under the driving of the driving assembly 1400 , it will drive the camera module to move, so as to perform shake correction by adjusting the position of the camera module. For example, taking the lens axis of the camera module as the Z axis, in the process of adjusting the position of the camera module, the second frame 1200 can rotate around the X axis along with the camera module to achieve position adjustment in one direction. In another adjustment direction, the inner third frame 1300 drives the camera module to rotate around the Y axis under the force of the magnetic body and the coil, and the second frame 1200 is fixed at this time.

As shown in FIG. 1 and FIG. 2 , according to an exemplary embodiment of the present application, the number of a set of magnetic bodies 1410 of the driving assembly 1400 may be two, and they are installed at two corners of the third frame 1300 . According to other embodiments of the present application, the number of a set of magnetic bodies 1410 may also be four, which are respectively installed at four corners of the third frame 1300 . The number of a set of magnetic bodies 1410 can be set according to the requirements of the driving force, which is not limited in this application. The magnetic body is arranged at the corner of the third frame 1300 and fixed together with the third frame 1300 , compared with being arranged at the side of the third frame 1300 , the miniaturization of the overall structure can be achieved.

A set of coils 1420 is disposed on the first frame 1100 corresponding to the positions of the set of magnetic bodies 1410 . According to some embodiments of the present application, the driving circuit board 1430 may be a T-FPC circuit board. After passing current into a set of coils 1420 through the T-FPC circuit board, due to the interaction force between the coils and the magnetic body, the third frame 1300 in the driving device 1000 will surround the hinge position relative to the first frame 1100 Movement occurs to drive the camera module fixed with it to move, so as to realize the adjustment of the position of the camera module. When currents of different magnitudes and directions are passed into the coil 1420, the interaction force between the magnetic body and the coil will also change accordingly, thereby realizing the position adjustment of the camera module in different directions.

In the pan-tilt drive device provided by the present application, the power supply circuits of the camera module and the drive assembly are provided separately. The camera module is powered by the circuit board connection belt of the photosensitive component. The drive components are powered independently by the T-FPC circuit board. Therefore, the two complement each other in the working process, which can not only ensure the working efficiency of the camera module, but also ensure the stability of the driving device.

As shown in FIG. 1 , the first frame 1100 further includes a first mounting hole 1120 disposed at the bottom of the side wall of the first frame 1100 . When the camera module is assembled with the pan/tilt driving device 1000, the circuit board connecting tape for powering the camera module needs to pass through the first frame 1100 to be connected to the main board of the equipment, so as to realize the current supply during the operation of the module. During the movement of the camera module in the first frame 1100, it will drive the circuit board connecting belt to move accordingly. By reserving the position of the mounting hole for the circuit board connecting belt at the bottom of the side wall of the first frame 1100, the camera module can reduce the resistance effect of the circuit board connecting belt and the equipment main board on the movement of the camera module during the moving process.

Referring to FIG. 1 , the second frame 1200 includes a second body structure 1210 , a first group of cantilever arms 1220 and a second group of cantilever arms 1230 . The main function of the second frame 1200 is to restrict the camera module, so that the camera module always moves inside the second frame 1200 during the movement process. The center of the second body structure 1210 is provided with a second limiting hole 1240 , and after the camera module is installed, the lens assembly protrudes from the second limiting hole 1240 . One end of the first group of cantilevers 1220 is fixedly connected with the second main body structure 1210 , and the other end has a mounting hole matching the connecting shaft, and is hinged with the first connecting shaft 1250 through the mounting hole. One end of the second group of cantilevers 1230 is fixedly connected with the second main body structure 1210 , and the other end has a mounting hole matching the connecting shaft, and is hinged with the second connecting shaft 1260 through the mounting hole. The first group of cantilever arms 1220 and the second group of cantilever arms 1230 extend outward from the periphery of the second main body structure 1210 and are evenly distributed. According to an example embodiment of the present application, the number of cantilevers is 4, and the numbers of the first group of cantilevers 1220 and the number of the second group of cantilevers 1230 are 2 respectively. The number and connection positions of the cantilevers can be set according to actual requirements, as long as two cantilevers disposed opposite to each other are connected to the same component, which is not limited in this application. The third frame 1300 is connected with the first frame 1100 through the second frame 1200 .

According to some embodiments of the present application, in order to protect the camera module inside the pan-tilt driving device, the pan-tilt driving device 1000 may further include a driving device bottom plate (not shown in the figure), which cooperates with the first frame 1100 to accommodate the camera module in the second inner cavity 1310 of the third frame 1300 . The bottom plate of the driving device is arranged at the bottom of the pan-tilt driving device 1000, and its shape can be directly adapted to the shape of the opening at the bottom of the first frame 1100, so as to cover the space at the bottom of the pan-tilt driving device 1000, so as to reduce the thickness of the camera module after assembling . Referring to FIG. 2 , the third frame 1300 further includes a locking device 1320 , which is disposed on the side wall of the third frame 1300 and is away from one end of the bottom plate of the driving device. The main function of the clamping device 1320 is to ensure the flatness of the lens assembly after the camera module is assembled. According to some embodiments of the present application, the card position device 1320 may be a card position sheet. When the camera module is installed in the pan-tilt driving device 1000, the upper surface of the motor in the lens assembly directly contacts with the card position piece. The use of the card position sheet can also effectively correct the flatness of the lens installation. For example, the flatness between the camera module and the pan-tilt driving device 1000 can be determined by observing the gap between the card position piece and the upper surface of the motor.

According to some embodiments of the present application, the height of the third frame 1300 is lower than that of the first frame 1100 . When the camera module and the pan-tilt driving device 1000 are assembled together, due to the function of the second frame 1200, only the lens structure part is higher than the overall pan-tilt driving device 1000 and extends out of the second frame 1200. The circuit board structure at the bottom of the module is also higher than the frame at the bottom of the driving device, that is, higher than the bottom position of the first frame 1100 . Therefore, an active space can be reserved for the movement of the camera module in the pan-tilt driving device 1000, so as to realize the adjustment of the camera module along different directions.

FIG. 3 shows a schematic diagram of the connection between the third frame and the first frame according to an exemplary embodiment of the present application.

During the operation of the drive device of the pan/tilt head, the third frame moves relative to the first frame under the action of the magnetic force of the coil of the drive assembly. Therefore, a corresponding support structure is required between the third frame and the first frame to connect the two and ensure the relative movement between the two. As shown in FIG. 3 , an example implementation of the present application provides an achievable manner in which the connection between the third frame and the first frame can be made through a rolling body and guide rail structure. For example, the first frame 1100 includes a set of first grooves 1130 disposed on the inner wall of the first frame 1100 . The third frame may accordingly include a group of second grooves (not shown in the figure), which are arranged on the outer wall of the third frame. A group of first grooves 1130 are arranged corresponding to the positions of a group of second first grooves, and together form a group of sliding guide rails. The pan-tilt driving device further includes a set of rolling bodies 1140 disposed in the set of sliding guide rails. The rolling bodies 1140 can move in the corresponding sliding guide rails, so as to ensure the relative movement between the third frame and the first frame.

After the third frame is connected with the first frame through the guide rail chute and the rolling body, when the magnetic body on the third frame interacts with the coil on the first frame, the generated force pushes the third frame to slide along the guide rail. slot movement. The third frame and the camera module are fixed together, and will also drive the camera module to move accordingly, so as to correct the module shake during the shooting process.

According to some embodiments of the present application, a set of first grooves 1130 and/or a set of second grooves may include a segment of magnetic grooves, as limit grooves, for determining the initial position of the rolling elements 1140 by magnetic force, That is, the initial relative position of the third frame and the first frame. Since the limit groove has a certain degree of magnetism, when there is no interaction force between the third frame and the first frame, the rolling element will slide to the position of the limit groove due to the magnetic effect of the limit groove. Or, when the drive device of the pan/tilt stops working, because the interaction force between the coil and the magnetic body disappears, the rolling body will return to the initial position under the magnetic attraction of the limit slot, keeping the third frame and the first frame. relative stillness.

The magnetic force at the magnetic groove does not need to be very large, and it only needs to overcome the structural gravity combined with the third frame. Therefore, the position adjustment of the main body of the subsequent camera module will not have a great impact. When the third frame drives the camera module to move under the force of the coil and the magnetic body, it needs to overcome the magnetic force of the limit slot first, and then drive the third frame to drive the camera module to move relative to the first frame, so as to realize the camera Correction of module jitter.

FIG. 4 shows a perspective view of the photosensitive assembly of the camera module.

FIG. 5 shows a schematic structural diagram of a photosensitive assembly of a camera module.

The photosensitive component is an important part of the camera module, its function is to convert the light signal into an electrical signal, and then output the information of the image. As shown in FIGS. 4 and 5 , the photosensitive assembly 2200 may include a circuit board 2210, a photosensitive chip 2220, a support base 2230, a filter 2240 and other electronic components. The photosensitive chip 2220 is fixed on the upper surface of the circuit board 2210 and is mainly used for the conversion of optical signals. The circuit board 2210 and the photosensitive chip 2220 mounted on it are electrically connected by means of wire bonding, for example, the photosensitive chip 2220 and the circuit board 2210 are electrically connected through an electrical connection wire 2250 (which can be a gold wire), so as to realize the operation of the photosensitive chip 2220 Power supply and signal transmission in the process. The circuit board 2210 is made by a lamination process, and corresponding circuit structures are arranged inside the circuit board 2210 .

The support base 2230 is fixed on the circuit board 2210, accommodates the photosensitive chip 2220 in the inner space thereof, and molds the electrical connection wires 2250 in the inner space thereof. A filter 2240 is mounted on the top of the support base 2230 . The main function of the filter 2240 is to filter out stray light and effectively improve the quality of imaging. Thus, the photosensitive chip 2220 is accommodated in the inner space composed of the circuit board 2210 , the support base 2230 and the filter 2240 .

The circuit board 2210 may include a first circuit board 2211 and a circuit board connection tape. The circuit board connecting strip includes a second circuit board 2212 and a connector 2213 . The first wiring board 2211 may be a rigid wiring board. The second wiring board 2212 may be a flexible printed wiring board. Among them, the first circuit board 2211 is connected to the photosensitive chip 2220 and is arranged on the back side of the photosensitive chip 2220; the second circuit board 2212 and the connector 2213 are used to connect the first circuit board 2211 with the external motherboard, and are the first circuit board 2211 and the camera module photosensitive assembly 2200 provide working power.

Photosensitive components are packaged in a variety of ways. In the solution provided in this application, since the driving device needs to drive the entire camera module to move, it is required that the weight of each part of the camera module should be as small as possible. Therefore, the photosensitive components shown in FIG. 4 and FIG. 5 adopt a molding packaging method. During the molding process, after the photosensitive chip 2220 and the first circuit board 2211 are fixed and the gold wires 2250 are used for conduction, molding is performed directly at the position where the gold wires 2250 are connected to form a molding seat, and the gold wires 2250 are accommodated in the molding seat. internal. The molded seat formed on the circuit board 2211 can be directly used as the support seat 2230 for installing the optical filter 2240 without installing separate components. The molded support base 2230 can effectively reduce the height of the photosensitive assembly and the quality of the photosensitive assembly, thereby reducing the requirement for the driving force of the gimbal driving device.

Figure 6 shows a top view of the molded support structure.

FIG. 7 shows a cross-sectional view of the structure of the molded support base.

As shown in FIG. 6 and FIG. 7 , the overall structure of the support base 2230 is a frame-shaped structure matched with the periphery of the circuit board, including an inner frame 2231 and an outer frame 2232 . The position between the inner frame 2231 and the outer frame 2232 can effectively accommodate gold wires and some other electronic components inside its frame. The inner frame 2231 and the outer frame 2232 have a certain thickness and width, and the width and thickness are suitable for completely accommodating the gold wire structure and some other small electronic components therein, which can be set according to actual conditions. There is a certain height difference between the inner frame 2231 and the outer frame 2232 . For example, as shown in FIG. 7 , the height of the inner frame 2231 is lower than that of the outer frame 2232 . The filter is mounted in the middle position 2233 of the molding support base 2230. The height of the upper surface of the filter is lower than or equal to the height of the outer frame 2232 . There is a certain space at the four corners of the installed filter, mainly to prevent the occurrence of vignetting, and also to function as a glue overflow groove during the bonding process of the filter and the support seat.

FIG. 8 shows a schematic diagram of a circuit board of a photosensitive assembly of a camera module according to an exemplary embodiment of the present application.

During the anti-shake correction process of the camera module, the camera module moves under the driving of the third frame. The circuit board connecting belt of the photosensitive component of the camera module is fixedly connected with the main board of the device. Therefore, during the movement of the camera module, the circuit board connecting strip will form a resistance to the movement of the camera module, thereby affecting the accuracy of the position adjustment of the camera module. To solve this problem, according to the embodiment of the present application, the circuit board structure described in FIG. 8 can be adopted.

As shown in FIG. 8 , the second circuit board 2212 can be connected to the connector 2213 after being bent. The movable range of the camera module can be reserved by the bending process. When the camera module moves frequently, the movement of the camera module will not affect the connection at the connector 2213 because a sufficient range of motion is reserved. At the same time, the connection between the second circuit board 2212 and the first circuit board 2211 is also in a relatively fixed state. As a result, during the movement of the camera module, there will be no problems such as breakage of the connection due to resistance caused by frequent movement.

In addition, in order to further reduce the resistance of the second circuit board 2212 to the movement of the first circuit board 2211 , according to some embodiments of the present application, the part of the second circuit board 2212 where no lines are arranged may also be hollowed out. Using the hollow structure 2214 in the middle of the second circuit board 2212 can effectively reduce the resistance of the second circuit board 2212 to it during the movement of the module.

FIG. 9 shows a perspective view of a camera module lens assembly according to an exemplary embodiment of the present application.

FIG. 10 shows a cross-sectional view of a lens assembly of a camera module according to an exemplary embodiment of the present application.

The lens assembly is another important part of the camera module. As shown in FIGS. 9 and 10 , the lens assembly 2100 includes an optical lens 2110 and a lens carrier or a motor 2120 that drives the lens to move along the optical axis direction, such as a voice coil motor. The voice coil motor is mainly used to drive the optical lens to adjust, so as to realize the focusing function in the process of taking pictures. The motor 2120 and the optical lens 2110 are directly combined together, and can be directly used as a component constituting the camera module. During the shooting process of the camera module, the light first passes through the lens assembly, and then reaches the photosensitive chip after being filtered by the light filter, and then outputs the image signal after being processed by the photosensitive chip. During this process, because there is a certain distance between the lens and the photosensitive chip, in order to make the image clear, the motor will drive the optical lens to move accordingly, making the image clearer.

The optical lens 2110 and the motor 2120 may be connected in a screw manner, that is, the optical lens 2110 has an external thread, and the motor 2120 has an external thread adapted to it. The two are fixed by the threaded structure between them. The optical lens 2110 and the motor 2120 can also be fixed by means of bonding. That is, the outer diameter of the optical lens 2110 matches the inner diameter of the motor 2120 , the optical lens 2110 is installed inside the motor 2120 , and the optical lens 2110 and the motor 2120 are fixed by glue. During the assembly process, the optical lens 2110 and the motor 2120 can be combined to form the lens assembly 2100, and then the lens assembly and the photosensitive assembly can be assembled to obtain the main body of the camera module.

As shown in FIGS. 9 and 10 , after the optical lens 2110 and the motor 2120 are installed, the optical lens 2110 exceeds the installation space of the motor 2120 . When taking pictures, the motor 2120 can drive the optical lens 2110 to quickly realize the auto-focusing function.

FIG. 11 shows a perspective view of a main body of a camera module according to an exemplary embodiment of the present application.

FIG. 12 shows a side view of a camera module body according to an exemplary embodiment of the present application.

As shown in FIGS. 11 and 12 , the lens assembly 2100 and the photosensitive assembly 2200 are assembled together to form the camera module body 2000 . The second circuit board 2212 is connected to the connector 2213 after being bent. The range of movement of the module is reserved by bending. When the camera module moves frequently, the movement of the module will not affect its connection with the connector 2213 due to a sufficient range of motion reserved. At the same time, the connection between the second circuit board 2212 circuit board and the main body of the camera module is also in a relatively fixed state, so that during the movement of the camera module, there will be no resistance due to frequent movement that causes the connection to tear. cracks, etc.

Generally, the circuit of the camera module is arranged in the second circuit board 2212 . The part of the second circuit board 2212 that is not wired is hollowed out. When the circuit board moves under the force of the driving device, the hollow structure 2214 in the middle of the second circuit board 2212 can effectively reduce the force of the second circuit board 2212 on it during the movement of the module.

FIG. 13 shows an exploded view of a camera module according to an example embodiment of the present application.

FIG. 14 shows a perspective view of a camera module according to an example embodiment of the present application.

According to another aspect of the present application, a camera module 3000 with a pan-tilt anti-shake function is provided, including the above-mentioned pan-tilt driving device 1000 and a camera module body 2000 . The camera module body 2000 includes a lens assembly 2100 and a photosensitive assembly 2200 . The camera module body 2000 is accommodated in the second inner cavity of the third frame of the stage driving device 1000, and is fixedly connected to the third frame. The PTZ driving device 1000 provides driving force for the camera module main body 2000 . When the camera module shakes during the shooting process, the third frame in the driving device 1000 drives the camera module main body 2000 to perform different orientations under the interaction force between the coil and the magnetic body by passing the corresponding current into the coil. Adjustment to achieve module shake correction.

In the process of driving the camera module main body 2000 to move by the pan-tilt driving device 1000, the first frame 1100 outside the pan-tilt driving device 1000 is fixed, and only the inner third frame is under the force of the coil 1420 and the magnetic body The rack moves relative to the first frame 1100 . The third frame drives the camera module main body 2000 to perform corresponding position adjustment. The second circuit board 2212 of the camera module main body 2000 is connected to the main board of the device through the first mounting hole 1120 to realize current supply during the working process of the module. The circuit board connecting strip includes a second circuit board 2212 and a connector 2213 . One end of the second circuit board 2212 is fixed to the camera module body 2000 , and the other end is fixed to the main board through the connector 2213 to supply operating current. During the movement of the camera module body 2000 , the second circuit board 2212 fixed therewith also moves correspondingly. Therefore, the circuit board connecting belt will form a resistance to the movement of the module, thereby affecting the accuracy of the position adjustment of the main body of the module. The above resistance effect can be effectively reduced by bending the second circuit board 2212 .

In the camera module 3000 , the T-FPC circuit board 1430 provides current for the gimbal driving device 1000 , and the first circuit board 2211 , the second circuit board 2212 and the connector 2213 provide current for the camera module body 2000 . By setting the two power supplies separately, mutual interference in the working process can be avoided. The T-FPC circuit board 1430 may be disposed at different positions of the first frame 1100. According to an example embodiment of the present application, in order to achieve reliability during assembly and power-on performance, the T-FPC circuit board 1430 may be disposed on the first frame 1100. A position on the frame 1100 close to the main board of the device. Similarly, the circuit board scheme of the camera module main body 2000 can also be used, and the T-FPC circuit board can be connected to the main board of the device, so as to realize the current supply during the operation of the driving device. The position of the T-FPC circuit board 1430 can be designed according to actual requirements, which is not limited in this application.

FIG. 15 shows a schematic diagram of the composition of a terminal device according to an exemplary embodiment of the present application.

In addition, as shown in FIG. 15 , the present application further provides a terminal device 4000 , which includes the above-mentioned camera module.

Referring to FIG. 15 , the terminal device 4000 may include: at least one processor 4001 , at least one network interface 4004 , user interface 4003 , memory 4005 , and at least one communication bus 4002 .

Among them, the communication bus 4002 is used to realize the connection and communication between these components.

The user interface 4003 may include a display screen (Display) and the above-mentioned camera module 3000 (Camera), and the optional user interface 4003 may also include a standard wired interface and a wireless interface.

The optional network interface 4004 may include a standard wired interface and a wireless interface (eg, a WI-FI interface).

The processor 4001 may include one or more processing cores. The processor 4001 uses various interfaces and lines to connect various parts of the entire terminal device 4000, and executes by running or executing the instructions, programs, code sets or instruction sets stored in the memory 4005, and calling the data stored in the memory 4005. Various functions of the terminal device 3000 and processing data. Optionally, the processor 4001 may adopt at least one of digital signal processing (Digital Signal Processing, DSP), field-programmable gate array (Field-Programmable Gate Array, FPGA), and programmable logic array (Programmable Logic Array, PLA). A hardware form is implemented. The processor 4001 may integrate one or a combination of a central processing unit (Central Processing Unit, CPU), a graphics processing unit (Graphics Processing Unit, GPU), a modem, and the like. Among them, the CPU mainly handles the operating system, user interface, and application programs; the GPU is used to render and draw the content that needs to be displayed on the display screen; the modem is used to handle wireless communication. It can be understood that, the above-mentioned modem may not be integrated into the processor 4001, but is implemented by a single chip.

The memory 4005 may include random access memory (Random Access Memory, RAM), or may include read-only memory (Read-Only Memory). Optionally, the memory 4005 includes a non-transitory computer-readable storage medium. Memory 4005 may be used to store instructions, programs, codes, sets of codes, or sets of instructions. The memory 4005 may include a stored program area and a stored data area, wherein the stored program area may store instructions for implementing an operating system, instructions for at least one function (such as a touch function, a sound playback function, an image playback function, etc.), Instructions and the like used to implement the above method embodiments; the storage data area may store the data and the like involved in the above method embodiments. Optionally, the memory 4005 may also be at least one storage device located away from the aforementioned processor 4001 . As shown in FIG. 15 , the memory 4005 as a computer storage medium may include an operating system, a network communication module, a user interface module, and a video image processing application program.

The present application provides a pan-tilt driving device for a camera module and a camera module. The pan-tilt driving device can drive the movement of the main body of the camera module in different directions, so as to realize the anti-shake function during the shooting process and improve the shooting. the quality of the picture. The structure of the pan/tilt driving device is directly designed outside the main body of the module, which changes the previous stacking arrangement and can reduce the thickness of the module. Moreover, the drive device of the pan/tilt has a simple structure, is convenient for design, and can realize mass production. In the camera module provided by the present application, the power supply circuit of the camera module main body and the power supply circuit of the driving device are arranged separately to avoid mutual disturbance and effectively improve the working efficiency of the module structure. In addition, bending and hollowing out the connection belt of the main circuit board of the camera module can reduce the resistance of the main body of the camera module during the driving process of the gimbal.

Obviously, the above-mentioned embodiments are only examples for clearly illustrating the present application, and are not intended to limit the implementation manner. For those of ordinary skill in the art, changes or modifications in other different forms can also be made on the basis of the above description. There is no need and cannot be exhaustive of all implementations here. However, the obvious changes or changes derived from this are still within the protection scope of the present application.

Claims (17)

A pan-tilt drive device for a camera module, characterized in that it includes: a first frame having a hollow first inner cavity; a second frame hinged to the first frame; The third frame has a second inner cavity for accommodating the camera module, is arranged in the first inner cavity of the first frame, and is hinged with the second frame; Drive components, including: a group of magnetic bodies, arranged at the junction of the side walls of the third frame; A group of coils is arranged on the first frame and is arranged corresponding to the position of the group of magnetic bodies. The PTZ driving device according to claim 1, wherein the first frame comprises: The first installation hole is arranged at the bottom of the side wall of the first frame. The PTZ driving device according to claim 2, further comprising: The bottom plate of the driving device cooperates with the first frame and accommodates the camera module in the second inner cavity. The PTZ driving device according to claim 3, wherein the third frame further comprises: The latching device is arranged on the side wall of the third frame and is away from one end of the bottom plate of the driving device, and is used to adjust the flatness of the lens assembly during assembly. The PTZ driving device according to claim 4, wherein the driving assembly further comprises: A drive circuit board, including a T-FPC circuit board, is connected to the set of coils and supplies power to the drive assembly. The PTZ driving device according to claim 4, characterized in that: The first frame includes: a set of first grooves arranged on the inner wall of the first frame; The third frame includes: a set of second grooves, which are arranged on the outer wall of the third frame, and form a set of sliding guide rails with the set of first grooves; The pan-tilt driving device further includes: a set of rolling bodies arranged in the set of sliding guide rails. The pan-tilt driving device according to claim 6, wherein the set of first grooves and/or the set of second grooves comprises: The magnetic groove is used to define the initial position of the group of rolling elements by magnetic force. The pan-tilt driving device according to claim 4, wherein the height of the third frame is lower than the height of the first frame. The PTZ driving device according to claim 4, wherein the second frame comprises: The second main body structure; A first group of cantilevers, one end is fixedly connected with the second main body structure, and the other end is hinged with the first frame; One end of the second group of cantilevers is fixedly connected to the second main body structure, and the other end is hinged to the third frame. The PTZ driving device according to claim 9, wherein the second main structure comprises: The second limiting hole is arranged in the center of the second main body structure. A camera module, comprising: The PTZ driving device according to any one of claims 4-10; The main body of the camera module is accommodated in the second inner cavity of the third frame, and is connected with the third frame. The camera module according to claim 11, wherein the main body of the camera module comprises: a lens carrier or a motor, which is fixedly connected to the third frame and rotates with the third frame; an optical lens, connected with the lens carrier or the motor, and extending out of the second frame from the second inner cavity of the third frame; The photosensitive component is connected with the lens carrier or the motor. The camera module according to claim 12, wherein the lens carrier or the motor is in contact with the lower surface of the positioning device of the third frame. The camera module according to claim 11, wherein the photosensitive assembly comprises: the first circuit board; One end of the circuit board connecting strip is connected to the external power supply device, and the other end is connected to the first circuit board through the first installation hole. The camera module according to claim 14, wherein the circuit board connecting tape comprises: the bent second circuit board; One end of the connector is connected with the bent second circuit board, and the other end is connected with an external power supply device. The camera module according to claim 15, wherein the bent second circuit board comprises: The hollow structure is arranged between the lines arranged on the bent second circuit board. A terminal device, characterized by comprising the camera module according to any one of claims 11-16.

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