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WO2022014919A1 - Dispositif électronique comprenant une antenne - Google Patents

Dispositif électronique comprenant une antenne Download PDF

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Publication number
WO2022014919A1
WO2022014919A1 PCT/KR2021/008396 KR2021008396W WO2022014919A1 WO 2022014919 A1 WO2022014919 A1 WO 2022014919A1 KR 2021008396 W KR2021008396 W KR 2021008396W WO 2022014919 A1 WO2022014919 A1 WO 2022014919A1
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WO
WIPO (PCT)
Prior art keywords
electronic device
antenna
electrical path
module
wireless communication
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2021/008396
Other languages
English (en)
Korean (ko)
Inventor
김승순
장준원
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of WO2022014919A1 publication Critical patent/WO2022014919A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q3/00—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
    • H01Q3/26—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture
    • H01Q3/30—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the relative phase between the radiating elements of an array
    • H01Q3/34—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the relative phase between the radiating elements of an array by electrical means
    • H01Q3/36—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the relative phase between the radiating elements of an array by electrical means with variable phase-shifters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/16—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
    • H01Q9/28—Conical, cylindrical, cage, strip, gauze, or like elements having an extended radiating surface; Elements comprising two conical surfaces having collinear axes and adjacent apices and fed by two-conductor transmission lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/16—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
    • H01Q9/28—Conical, cylindrical, cage, strip, gauze, or like elements having an extended radiating surface; Elements comprising two conical surfaces having collinear axes and adjacent apices and fed by two-conductor transmission lines
    • H01Q9/285—Planar dipole

Definitions

  • Various embodiments of the present disclosure relate to an electronic device including an antenna.
  • the electronic device may transmit or receive various types of information such as text, image, video, or voice by using a wireless communication service.
  • An electronic device capable of wireless communication may include at least one antenna to support various frequencies of various wireless communication services (eg, LTE, mmWave, Wi-Fi, NFC, or Bluetooth).
  • various wireless communication services eg, LTE, mmWave, Wi-Fi, NFC, or Bluetooth.
  • Existing electronic devices may include a module-type antenna (hereinafter, referred to as an “antenna module”) in order to support a millimeter wave (mmWave) frequency band.
  • the antenna module may have an input impedance value fixed by a communication circuit, a power amplifier, a low noise amplifier, a divider, a phase converter, and/or a switch constituting the antenna module.
  • An impedance value for impedance matching may be different according to a frequency band supported by the antenna module.
  • impedance matching is not performed according to the frequency band of the RF signal transmitted and/or received from the antenna module, so that the radiation performance of the antenna module may be deteriorated.
  • noise may be generated according to the occurrence of a specified event (eg, camera operation, charging of an electronic device), and the generated noise is generated by the antenna module. radiation performance.
  • a specified event eg, camera operation, charging of an electronic device
  • the impedance value of the antenna module may be changed according to the arrangement position of the antenna module, and the radiation performance of the antenna module may be deteriorated due to the change of the impedance value. have.
  • the impedance value of the input terminal of the antenna module is fixed as described above, it is difficult to prevent deterioration of the radiation performance of the antenna module except by changing the position at which the antenna module is disposed.
  • various embodiments of the present disclosure provide an electronic device capable of changing an input impedance value by changing an electrical length between an antenna and a wireless communication circuit.
  • An electronic device includes a plurality of antenna elements and a radio frequency integrated circuit (RFIC) for processing a signal of a first frequency band transmitted or received through the plurality of antenna elements.
  • An antenna module comprising: and a wireless communication circuit electrically connected to the antenna module, wherein the RFIC includes: a first electrical path formed between a first antenna element of the plurality of antenna elements and the wireless communication circuit; a first phase converter disposed on a first electrical path and configured to transform a phase of a signal transmitted from the wireless communication circuit to the first antenna element and branching at a first point in the first electrical path, the first electrical It may include a variable-length element connected between the first point of the path and the ground, and changing the electrical length of the first electrical path.
  • An electronic device includes an antenna module including a plurality of antenna elements and a radio frequency integrated circuit (RFIC) for processing a signal of a first frequency band transmitted or received through the plurality of antenna elements and a wireless communication circuit electrically connected to the antenna module, wherein the RFIC is an electrical path formed between the wireless communication circuit and the antenna module, the electrical path being branched from a first point of the electrical path A first path connected to a first antenna element, a second path branched from the first point of the electrical path and connected to a second antenna element, a second path branched from the first point of the electrical path and connected to a third antenna element and a fourth path branched from the first point of the electrical path and connected to a fourth antenna element, disposed at the first point of the electrical path, and transmitted through the electrical path a combiner and divider configured to combine or distribute a first phase transformer disposed on the first path and configured to transform a phase of a signal transmitted from the wireless communication circuitry to the first antenna element, on the
  • the electronic device may change an input impedance value by changing an electrical length of an electrical path between an antenna and a wireless communication circuit.
  • the electronic device may reduce noise due to interference and improve antenna performance (eg, radiation performance) by changing the input impedance value.
  • antenna performance eg, radiation performance
  • FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure
  • FIG. 2 is a block diagram of an electronic device in a network environment including a plurality of cellular networks, according to various embodiments of the present disclosure
  • 3A is a perspective view illustrating a front surface of an electronic device according to an exemplary embodiment.
  • 3B is a perspective view illustrating a rear surface of the electronic device of FIG. 3A .
  • FIG. 4 is a perspective view of an electronic device according to another exemplary embodiment.
  • 5A is a perspective view illustrating an electronic device in a closed state, according to another exemplary embodiment.
  • 5B is a perspective view illustrating an electronic device in an open state, according to another exemplary embodiment.
  • 6A is a diagram illustrating an electrical connection relationship between components of an electronic device, according to an exemplary embodiment.
  • 6B is a diagram illustrating an electrical connection relationship between components of an electronic device, according to another exemplary embodiment.
  • 7A is a graph illustrating a change in a resonance frequency of an antenna module according to a change in an electrical length of an electrical path between an antenna of an electronic device and a wireless communication circuit according to an exemplary embodiment.
  • 7B is a graph illustrating a change in a resonance frequency of an antenna module according to a change in an electrical length of an electrical path between an antenna of an electronic device and a wireless communication circuit according to another exemplary embodiment.
  • FIG. 8 is a graph illustrating a gain change of an antenna module according to a change in an electrical length of an electrical path between an antenna of an electronic device and a wireless communication circuit according to an exemplary embodiment.
  • FIG. 9 is a diagram illustrating an electrical connection relationship between components of an electronic device, according to an exemplary embodiment.
  • FIG. 10 is a flowchart illustrating an operation of controlling a variable-length element of an electronic device according to an exemplary embodiment.
  • FIG. 11 is a flowchart illustrating an operation of controlling a variable-length element of an electronic device according to another exemplary embodiment.
  • FIG. 12 is a flowchart illustrating an operation of controlling a variable-length element of an electronic device according to another exemplary embodiment.
  • FIG. 13 is a flowchart illustrating an operation of controlling a variable-length element of an electronic device according to another exemplary embodiment.
  • FIG. 1 is a block diagram of an electronic device in a network environment, according to various embodiments of the present disclosure
  • an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • a first network 198 eg, a short-range wireless communication network
  • a second network 199 e.g., a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • the electronic device 101 includes a processor 120 , a memory 130 , an input module 150 , a sound output module 155 , a display module 160 , an audio module 170 , and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or an antenna module 197 may be included.
  • at least one of these components eg, the connection terminal 178
  • may be omitted or one or more other components may be added to the electronic device 101 .
  • some of these components are integrated into one component (eg, display module 160 ). can be
  • the processor 120 for example, executes software (eg, a program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120 . It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or operation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be stored in the volatile memory 132 , and may process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 .
  • software eg, a program 140
  • the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 .
  • the volatile memory 132 may be stored in the volatile memory 132 , and may process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 .
  • the processor 120 is the main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit) a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor).
  • the main processor 121 e.g, a central processing unit or an application processor
  • a secondary processor 123 eg, a graphic processing unit, a neural network processing unit
  • NPU neural processing unit
  • an image signal processor e.g., a sensor hub processor, or a communication processor.
  • the main processor 121 e.g, a central processing unit or an application processor
  • a secondary processor 123 eg, a graphic processing unit, a neural network processing unit
  • NPU neural processing unit
  • an image signal processor e.g., a sensor hub processor, or a communication processor.
  • the main processor 121 e.g, a central processing unit or an application processor
  • a secondary processor 123
  • the auxiliary processor 123 is, for example, on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states.
  • the coprocessor 123 eg, an image signal processor or a communication processor
  • may be implemented as part of another functionally related component eg, the camera module 180 or the communication module 190. have.
  • the auxiliary processor 123 may include a hardware structure specialized for processing an artificial intelligence model.
  • Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself on which artificial intelligence is performed, or may be performed through a separate server (eg, the server 108).
  • the learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but in the above example not limited
  • the artificial intelligence model may include a plurality of artificial neural network layers.
  • Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the above example.
  • the artificial intelligence model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.
  • the memory 130 may store various data used by at least one component of the electronic device 101 (eg, the processor 120 or the sensor module 176 ).
  • the data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto.
  • the memory 130 may include a volatile memory 132 or a non-volatile memory 134 .
  • the program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .
  • the input module 150 may receive a command or data to be used in a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 .
  • the input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).
  • the sound output module 155 may output a sound signal to the outside of the electronic device 101 .
  • the sound output module 155 may include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes such as multimedia playback or recording playback.
  • the receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.
  • the display module 160 may visually provide information to the outside (eg, a user) of the electronic device 101 .
  • the display module 160 may include, for example, a control circuit for controlling a display, a hologram device, or a projector and a corresponding device.
  • the display module 160 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of a force generated by the touch.
  • the audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input module 150 or an external electronic device (eg, a sound output module 155 ) directly or wirelessly connected to the electronic device 101 . A sound may be output through the electronic device 102 (eg, a speaker or headphones).
  • an external electronic device eg, a sound output module 155
  • a sound may be output through the electronic device 102 (eg, a speaker or headphones).
  • the sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, user state), and generates an electrical signal or data value corresponding to the sensed state. can do.
  • the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the interface 177 may support one or more designated protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card
  • the connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 may manage power supplied to the electronic device 101 .
  • the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101 .
  • battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
  • the communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication performance through the established communication channel.
  • the communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication.
  • the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a LAN (local area network) communication module, or a power line communication module).
  • GNSS global navigation satellite system
  • a corresponding communication module among these communication modules is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or a WAN).
  • a first network 198 eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)
  • a second network 199 eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or a WAN).
  • a telecommunication network
  • the wireless communication module 192 uses the subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 .
  • the electronic device 101 may be identified or authenticated.
  • the wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR).
  • NR access technology includes high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency) -latency communications)).
  • eMBB enhanced mobile broadband
  • mMTC massive machine type communications
  • URLLC ultra-reliable and low-latency
  • the wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example.
  • a high frequency band eg, mmWave band
  • the wireless communication module 192 includes various technologies for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. It may support technologies such as full dimensional MIMO (FD-MIMO), an array antenna, analog beam-forming, or a large scale antenna.
  • the wireless communication module 192 may support various requirements specified in the electronic device 101 , an external electronic device (eg, the electronic device 104 ), or a network system (eg, the second network 199 ).
  • the wireless communication module 192 may include a peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency for realizing URLLC ( Example: downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less).
  • a peak data rate eg, 20 Gbps or more
  • loss coverage eg, 164 dB or less
  • U-plane latency for realizing URLLC
  • the antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device).
  • the antenna module 197 may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern.
  • the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna.
  • other components eg, a radio frequency integrated circuit (RFIC)
  • RFIC radio frequency integrated circuit
  • the antenna module 197 may form a mmWave antenna module.
  • the mmWave antenna module comprises a printed circuit board, an RFIC disposed on or adjacent to a first side (eg, underside) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, an array antenna) disposed on or adjacent to a second side (eg, top or side) of the printed circuit board and capable of transmitting or receiving a signal of the designated high frequency band.
  • a first side eg, underside
  • a designated high frequency band eg, mmWave band
  • a plurality of antennas eg, an array antenna
  • peripheral devices eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • GPIO general purpose input and output
  • SPI serial peripheral interface
  • MIPI mobile industry processor interface
  • the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 .
  • Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 .
  • all or part of the operations executed in the electronic device 101 may be executed in one or more external electronic devices 102 , 104 , or the server 108 .
  • the electronic device 101 may perform the function or service itself instead of executing the function or service itself.
  • one or more external electronic devices may be requested to perform at least a part of the function or the service.
  • One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 .
  • the electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request.
  • cloud computing distributed computing, mobile edge computing (MEC), or client-server computing technology may be used.
  • the electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 104 may include an Internet of things (IoT) device.
  • Server 108 may be an intelligent server using machine learning and/or neural networks.
  • the external electronic device 104 or the server 108 may be included in the second network 199 .
  • the electronic device 101 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.
  • FIG. 2 is a block diagram of an electronic device in a network environment including a plurality of cellular networks, according to various embodiments of the present disclosure
  • the electronic device 101 (eg, the electronic device 101 of FIG. 1 ) includes a first communication processor 212 , a second communication processor 214 , and a first radio frequency integrated circuit (RFIC) ( 222), second RFIC 224, third RFIC 226, fourth RFIC 228, first radio frequency front end (RFEE) 232, second RFFE 234, first antenna module 242 ), a second antenna module 244 , and an antenna 248 .
  • the electronic device 101 may further include a processor 120 and a memory 130 .
  • the second network 199 may include a first cellular network 292 and a second cellular network 294 .
  • the electronic device 101 may further include at least one component among the components illustrated in FIG.
  • the second network 199 may further include at least one other network.
  • a first communication processor 212 , a second communication processor 214 , a first RFIC 222 , a second RFIC 224 , a fourth RFIC 228 , a first RFFE 232 , and the second RFFE 234 may form at least a part of the wireless communication module 192 .
  • the fourth RFIC 228 may be omitted or may be included as a part of the third RFIC 226 .
  • the first communication processor 212 may support establishment of a communication channel of a band to be used for wireless communication with the first cellular network 292 and legacy network communication through the established communication channel.
  • the first cellular network may be a legacy network including a second generation (2G), 3G, 4G, or long term evolution (LTE) network.
  • the second communication processor 214 establishes a communication channel corresponding to a designated band (eg, about 6 GHz to about 60 GHz) among bands to be used for wireless communication with the second cellular network 294 , and a 5G network through the established communication channel communication can be supported.
  • the second cellular network 294 may be a 5G network defined by 3GPP.
  • the first communication processor 212 or the second communication processor 214 corresponds to another designated band (eg, about 6 GHz or less) among bands to be used for wireless communication with the second cellular network 294 .
  • 5G network communication through the establishment of a communication channel and the established communication channel can be supported.
  • the first communication processor 212 and the second communication processor 214 may be implemented in a single chip or a single package.
  • the first communication processor 212 or the second communication processor 214 may be formed in a single chip or a single package with the processor 120 , the co-processor 123 , or the communication module 190 . have.
  • the first communication processor 212 and the second communication processor 214 are directly or indirectly connected to each other by an interface (not shown), so as to provide data or control signals in either or both directions. may provide or receive
  • the first RFIC 222 when transmitting, transmits a baseband signal generated by the first communication processor 212 from about 700 MHz to about 700 MHz used for the first cellular network 292 (eg, a legacy network). It can be converted to a radio frequency (RF) signal of 3 GHz.
  • RF radio frequency
  • an RF signal is obtained from a first cellular network 292 (eg, a legacy network) via an antenna (eg, a first antenna module 242), and an RFFE (eg, a first RFFE 232) It can be preprocessed through
  • the first RFIC 222 may convert the preprocessed RF signal into a baseband signal to be processed by the first communication processor 212 .
  • the second RFIC 224 when transmitting, uses the baseband signal generated by the first communication processor 212 or the second communication processor 214 to the second cellular network 294 (eg, a 5G network). It can be converted into an RF signal (hereinafter, 5G Sub6 RF signal) of the Sub6 band (eg, about 6 GHz or less).
  • 5G Sub6 RF signal RF signal
  • a 5G Sub6 RF signal is obtained from a second cellular network 294 (eg, 5G network) via an antenna (eg, second antenna module 244 ), and an RFFE (eg, second RFFE 234 ) ) can be preprocessed.
  • the second RFIC 224 may convert the preprocessed 5G Sub6 RF signal into a baseband signal to be processed by a corresponding one of the first communication processor 212 or the second communication processor 214 .
  • the third RFIC 226 transmits the baseband signal generated by the second communication processor 214 to the 5G Above6 band (eg, about 6 GHz to about 60 GHz) to be used in the second cellular network 294 (eg, 5G network). It can be converted into an RF signal (hereinafter referred to as 5G Above6 RF signal).
  • a 5G Above6 RF signal may be obtained from the second cellular network 294 (eg, 5G network) via an antenna (eg, antenna 248 ) and pre-processed via a third RFFE 236 .
  • the third RFIC 226 may convert the preprocessed 5G Above6 RF signal into a baseband signal to be processed by the second communication processor 214 .
  • the third RFFE 236 may be formed as part of the third RFIC 226 .
  • the electronic device 101 may include the fourth RFIC 228 separately from or as at least a part of the third RFIC 226 .
  • the fourth RFIC 228 converts the baseband signal generated by the second communication processor 214 into an RF signal (hereinafter, IF signal) of an intermediate frequency band (eg, about 9 GHz to about 11 GHz). After conversion, the IF signal may be transmitted to the third RFIC 226 .
  • the third RFIC 226 may convert the IF signal into a 5G Above6 RF signal.
  • a 5G Above6 RF signal may be received from the second cellular network 294 (eg, 5G network) via an antenna (eg, antenna 248 ) and converted to an IF signal by a third RFIC 226 .
  • the fourth RFIC 228 may convert the IF signal into a baseband signal for processing by the second communication processor 214 .
  • the first RFIC 222 and the second RFIC 224 may be implemented as at least a part of a single chip or a single package.
  • the first RFFE 232 and the second RFFE 234 may be implemented as at least a part of a single chip or a single package.
  • at least one antenna module of the first antenna module 242 or the second antenna module 244 may be omitted or may be combined with another antenna module to process RF signals of a plurality of corresponding bands.
  • the third RFIC 226 and the antenna 248 may be disposed on the same substrate to form the third antenna module 246 .
  • the wireless communication module 192 or the processor 120 may be disposed on the first substrate (eg, main PCB).
  • the third RFIC 226 is located in a partial area (eg, the bottom surface) of the second substrate (eg, sub PCB) separate from the first substrate, and the antenna 248 is located in another partial region (eg, the top surface). is disposed, the third antenna module 246 may be formed.
  • a high-frequency band eg, about 6 GHz to about 60 GHz
  • the electronic device 101 may improve the quality or speed of communication with the second cellular network 294 (eg, a 5G network).
  • the antenna 248 may be formed as an antenna array including a plurality of antenna elements that can be used for beamforming.
  • the third RFIC 226 may include, for example, as a part of the third RFFE 236 , a plurality of phase shifters 238 corresponding to a plurality of antenna elements.
  • each of the plurality of phase shifters 238 may transform the phase of a 5G Above6 RF signal to be transmitted to the outside of the electronic device 101 (eg, a base station of a 5G network) through a corresponding antenna element. .
  • each of the plurality of phase shifters 238 may convert the phase of the 5G Above6 RF signal received from the outside through a corresponding antenna element into the same or substantially the same phase. This enables transmission or reception through beamforming between the electronic device 101 and the outside.
  • the second cellular network 294 may be operated independently (eg, Stand-Alone (SA)) or connected to the first cellular network 292 (eg, legacy network).
  • SA Stand-Alone
  • the 5G network may have only an access network (eg, a 5G radio access network (RAN) or a next generation RAN (NG RAN)), and may not have a core network (eg, a next generation core (NGC)).
  • the electronic device 101 may access an external network (eg, the Internet) under the control of a core network (eg, evolved packed core (EPC)) of the legacy network.
  • SA Stand-Alone
  • NG RAN next generation RAN
  • NGC next generation core
  • the electronic device 101 may access an external network (eg, the Internet) under the control of a core network (eg, evolved packed core (EPC)) of the legacy network.
  • EPC evolved packed core
  • Protocol information for communication with a legacy network eg, LTE protocol information
  • protocol information for communication with a 5G network eg, New Radio (NR) protocol information
  • other components eg, a processor 120 , the first communication processor 212 , or the second communication processor 214 .
  • the electronic device may have various types of devices.
  • the electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device.
  • a portable communication device eg, a smart phone
  • a computer device e.g., a smart phone
  • a portable multimedia device e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a wearable device e.g., a smart bracelet
  • a home appliance device e.g., a home appliance
  • first, second, or first or second may be used simply to distinguish the element from other elements in question, and may refer to elements in other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively”. When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.
  • module used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as, for example, logic, logic block, component, or circuit.
  • a module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • one or more instructions stored in a storage medium may be implemented as software (eg, the program 140) including
  • a processor eg, processor 120
  • a device eg, electronic device 101
  • the one or more instructions may include code generated by a compiler or code executable by an interpreter.
  • the device-readable storage medium may be provided in the form of a non-transitory storage medium.
  • 'non-transitory' only means that the storage medium is a tangible device and does not include a signal (eg, electromagnetic wave), and this term is used in cases where data is semi-permanently stored in the storage medium and It does not distinguish between temporary storage cases.
  • a signal eg, electromagnetic wave
  • the method according to various embodiments disclosed in this document may be included and provided in a computer program product.
  • Computer program products may be traded between sellers and buyers as commodities.
  • the computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or via an application store (eg Play Store TM ) or on two user devices ( It can be distributed (eg downloaded or uploaded) directly between smartphones (eg: smartphones) and online.
  • a part of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a relay server.
  • each component (eg, module or program) of the above-described components may include a singular or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. have.
  • one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added.
  • a plurality of components eg, a module or a program
  • the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. .
  • operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, or omitted. or one or more other operations may be added.
  • FIG. 3A is a perspective view illustrating a front surface of an electronic device according to an exemplary embodiment
  • FIG. 3B is a perspective view illustrating a rear surface of the electronic device of FIG. 3A .
  • the electronic device 300 (eg, the electronic device 101 of FIGS. 1 and 2 ) according to an embodiment has a first surface (or front surface) 310A and a second surface ( or a rear surface) 310B, and a housing 310 including a side surface (or sidewall) 310C surrounding a space between the first surface 310A and the second surface 310B.
  • the housing may refer to a structure that forms part of the first surface 310A, the second surface 310B, and the side surface 310C of FIGS. 3A and 3B .
  • the first surface 310A may be formed by a front plate 302 (eg, a glass plate including various coating layers, or a polymer plate) at least a portion of which is substantially transparent.
  • the front plate 302 may include a curved portion extending seamlessly from the first surface 310A toward the rear plate 311 at at least one side edge portion.
  • the second surface 310B may be formed by a substantially opaque back plate 311 .
  • the back plate 311 may be formed, for example, by coated or tinted glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing.
  • the rear plate 311 may include a curved portion that extends seamlessly from the second surface 310B toward the front plate 302 at at least one end.
  • side 310C engages front plate 302 and back plate 311 and includes a side bezel structure (or “side member or sidewall”) 318 comprising a metal and/or polymer.
  • a side bezel structure or “side member or sidewall”
  • the back plate 311 and the side bezel structure 318 are integrally formed and may include the same material (eg, a metal material such as aluminum).
  • the electronic device 300 includes a display 301 , an audio module 303 , a sensor module (not shown), camera modules 305 , 312 , 313 , 306 , a key input device 317 , and At least one of the connector holes 308 may be included.
  • the electronic device 300 may omit at least one of the components (eg, the key input device 317 ) or additionally include other components.
  • the electronic device 300 may include a sensor module (not shown).
  • a sensor such as a proximity sensor or an illuminance sensor may be integrated into the display 301 , or disposed adjacent to the display 301 .
  • the electronic device 300 may further include a light emitting element, and the light emitting element may be disposed at a position adjacent to the display 301 within an area provided by the front plate 302 .
  • the light emitting device may provide, for example, state information of the electronic device 300 in the form of light.
  • the light emitting device may provide, for example, a light source that is interlocked with the operation of the camera module 305 .
  • the light emitting element may include, for example, an LED, an IR LED, and a xenon lamp.
  • the display 301 may be viewed outside of the electronic device 300 through, for example, a substantial portion of the front plate 302 .
  • an edge of the display 301 may be formed to be substantially identical to an adjacent outer shape (eg, a curved surface) of the front plate 302 .
  • the distance between the periphery of the display 301 and the periphery of the front plate 302 may be substantially the same.
  • a recess or an opening is formed in a part of the screen display area of the display 301 and another electronic component aligned with the recess or the opening, for example, , the camera module 305 may include a proximity sensor or an illuminance sensor (not shown).
  • At least one of a camera module (eg, 312 and 313 ), a fingerprint sensor, and a flash (eg, 306 ) may be included on the rear surface of the screen display area of the display 301 .
  • the display 301 is coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic field type stylus pen. can be placed.
  • the audio module 303 may include a microphone hole and a speaker hole.
  • a microphone for acquiring an external sound may be disposed therein, and in some embodiments, a plurality of microphones may be disposed to detect the direction of the sound.
  • the speaker hole and the microphone hole may be implemented as a single hole 303 , or a speaker may be included without a speaker hole (eg, a piezo speaker).
  • the speaker hole may include an external speaker hole and a receiver hole 314 for a call.
  • the electronic device 300 may generate an electrical signal or data value corresponding to an internal operating state or an external environmental state.
  • the sensor module may include, for example, a proximity sensor disposed on the first side 310A of the housing 310 , a fingerprint sensor integrated into or disposed adjacent to the display 301 , and/or a second side of the housing 310 .
  • a biometric sensor eg, an HRM sensor
  • a biometric sensor eg, an HRM sensor
  • the electronic device 300 includes a sensor module not shown, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, It may further include at least one of a humidity sensor and an illuminance sensor.
  • a sensor module not shown, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, It may further include at least one of a humidity sensor and an illuminance sensor.
  • the camera modules 305 , 312 , 313 , and 306 are a first camera module 305 disposed on the first surface 310A of the electronic device 300 , and a second camera module disposed on the second surface 310B of the electronic device 300 . 312 , 313 , and/or flash 306 .
  • the above-described camera modules 305 , 312 , 313 may include one or more lenses, an image sensor, and/or an image signal processor.
  • Flash 306 may include, for example, a light emitting diode or a xenon lamp.
  • two or more lenses (infrared cameras, wide angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 300 .
  • the key input device 317 may be disposed on the side surface 310C of the housing 310 .
  • the electronic device 300 may not include some or all of the above-mentioned key input devices 317 and the not included key input devices 317 are displayed on the display 301 in a different form (eg, : soft key).
  • the key input device may include at least a portion of a fingerprint sensor (not shown) disposed on the second surface 310B of the housing 310 .
  • the connector hole 308 may accommodate a connector for transmitting/receiving power and/or data to/from an external electronic device, and/or a connector for transmitting/receiving an audio signal to/from an external electronic device.
  • the connector hole 308 may include a USB connector or an earphone jack.
  • FIG. 4 is a perspective view of an electronic device according to another exemplary embodiment.
  • an electronic device 400 (eg, the electronic device 101 of FIG. 1 ) according to another exemplary embodiment includes a foldable housing 402 and a foldable portion covering a foldable portion of the foldable housing 402 .
  • a flexible display or foldable display 403 (hereinafter, abbreviated as “display” 403) disposed in the space formed by the hinge cover 404 and the foldable housing 402. may include
  • the surface on which the display 403 is disposed is defined as the first surface or the front surface of the electronic device 400
  • the surface facing the first surface or the front surface is defined as the second surface or the rear surface of the electronic device 400 .
  • a surface surrounding the space between the front surface and the rear surface is defined as the third surface or the side surface of the electronic device 400 .
  • the foldable housing 402 may include a first housing structure 402a, a second housing structure 402b, a first rear cover 402c, and a second rear cover 402d.
  • first housing structure 402a and the first rear cover 402c may be integrally formed
  • second housing structure 402b and the second rear cover 402d may be integrally formed.
  • first housing structure 402a and the second housing structure 402b may be disposed on both sides about the folding axis (axis A), and may have an overall symmetrical shape with respect to the folding axis (axis A). .
  • first housing structure 402a and the second housing structure 402b may determine whether the electronic device 400 is in an unfolded state (“unfolded state” or “flat state”), a folded state (“folded state”). ) or an intermediate state, the angle or distance between each other may vary.
  • the first housing structure 402a and the second housing structure 402b may together form a recess for receiving the display 403 , and the display 403 may be disposed in the recess described above. have. At least a portion of the above-described first housing structure 402a and second housing structure 402b may be formed of a metallic material or a non-metallic material having a size selected to support the display 403 .
  • the first rear cover 402c may be disposed on one side of the folding axis (A-axis) of the rear surface of the electronic device 400 .
  • the first back cover 402c may have a substantially rectangular periphery, and the periphery described above may be surrounded by the first housing structure 402a.
  • the second rear cover 402d may be disposed on the other side of the folding axis (A axis) of the rear surface of the electronic device 400 , and an edge thereof may be surrounded by the second housing structure 402b. .
  • the first back cover 402c and the second back cover 402d may have a substantially symmetrical shape with respect to the folding axis (A axis).
  • the shapes of the first back cover 402c and the second back cover 402d are not limited to mutually symmetrical shapes, and in another embodiment, the electronic device 400 may have various shapes of the first back cover 402c ) and a second rear cover 402d.
  • the first rear cover 402c may be integrally formed with the first housing structure 402a
  • the second rear cover 402d may be integrally formed with the second housing structure 402b. have.
  • the first back cover 402c , the second back cover 402d , the first housing structure 402a , and the second housing structure 402b are the various components (eg, printing) of the electronic device 400 .
  • circuit boards and/or batteries) may form a space in which they may be placed.
  • one or more components may be disposed or visually exposed on the rear surface of the electronic device 400 .
  • at least a portion of the sub-display 405 may be visually exposed through at least one area of the first rear cover 402c.
  • one or more components or sensors may be visually exposed through at least one area of the second rear cover 402d.
  • the above-described sensor may include, for example, a proximity sensor and/or a rear camera, but is not limited thereto.
  • the electronic device 400 may further include a hinge cover 404 .
  • the hinge cover 404 may be disposed between the first housing structure 402a and the second housing structure 402b to cover an internal component (eg, a hinge structure).
  • the hinge cover 404 includes a first housing structure 402a and a second housing structure 402b according to a state (a flat state or a folded state) of the electronic device 400 . It may be covered by a portion of or exposed to the outside For example, when the electronic device 400 is in an unfolded state, the hinge cover 404 may include the first housing structure 402a and the second housing structure 402b.
  • the hinge cover 404 when the electronic device 400 is in a folded state (eg, a fully folded state), the hinge cover 404 may include the first housing structure 402a and It may be exposed to the outside between the second housing structures 402b As another example, the middle of the first housing structure 402a and the second housing structure 402b folded with a certain angle In the intermediate state, the hinge cover 404 may be partially exposed to the outside between the first housing structure 402a and the second housing structure 402b However, in this case, the exposed area is fully folded In one example, the hinge cover 404 may include a curved surface for protecting the internal configuration of the electronic device 400, but is not limited thereto.
  • the display 403 may be disposed on a space formed by the foldable housing 402 .
  • the display 403 is seated on a recess formed by the first housing structure 402a and/or the second housing structure 402b of the foldable housing 402, and the electronic device ( 400) can make up most of the front surface.
  • the front surface of the electronic device 400 may include the display 403 and a partial area of the first housing structure 402a and a partial area of the second housing structure 402b adjacent to the display 403 .
  • the rear surface of the electronic device 400 includes a first back cover 402c, a partial region of the first housing structure 402a adjacent to the first back cover 402c, a second back cover 402d, and a second A partial region of the second housing structure 402b adjacent to the rear cover 402d may be included.
  • the display 403 may refer to a display in which at least a portion of the area can be deformed into a flat surface or a curved surface.
  • the display 403 includes a folding area 403c, a first area 403a disposed on one side (eg, one side in the -x direction in FIG. 4 ) with respect to the folding area 403c, and the other side (
  • the second region 403b one side in the +x direction of FIG. 4 ) may be included.
  • the division of regions of the display 403 illustrated in FIG. 4 is exemplary, and the display 403 may be divided into a plurality of regions (eg, two, four, or four or more) according to a structure or function.
  • the region of the display 403 may be divided by the folding region 403c extending parallel to the +y-axis or the folding axis (A-axis), but in another embodiment ( In the display 403 (not shown), regions may be divided based on another folding area (eg, a folding area parallel to the +x axis) or another folding axis (eg, a folding axis parallel to the +x axis).
  • the first housing structure 402a and the second housing structure 402b may be disposed to form an angle of 180° and face the same direction.
  • the surface of the first area 403a and the surface of the second area 403b of the display 403 form 180° with each other and face the same direction (eg, the front direction of the electronic device 400 ).
  • the folding area 403c may form the same plane as the first area 403a and the second area 403b.
  • the first housing structure 402a and the second housing structure 402b may be disposed to face each other.
  • the surface of the first area 403a and the surface of the second area 403b of the display 403 form a narrow angle (eg, between 0° and 10°) and may face each other.
  • At least a portion of the folding area 403c may be formed of a curved surface having a predetermined curvature.
  • the first housing structure 402a and the second housing structure 402b may be disposed at a certain angle to each other.
  • the surface of the first area 403a and the surface of the second area 403b of the display 403 may form an angle greater than that in the folded state and smaller than that of the unfolded state.
  • At least a portion of the folding region 403c may be formed of a curved surface having a predetermined curvature, and the curvature in this case may be smaller than that in a folded state.
  • FIG. 5A is a perspective view illustrating an electronic device in a closed state according to another embodiment
  • FIG. 5B is a perspective view illustrating an electronic device in an open state according to another embodiment. to be.
  • an electronic device 500 (eg, the electronic device 101 of FIG. 1 ) according to another embodiment includes a housing 510 and/or a flexible display 520 . (hereinafter, “display” for short).
  • the housing 510 may include a first structure 511 and/or a second structure 512 that is movably assembled (or coupled) to the first structure 511 .
  • the second structure 512 may slide within a specified range with respect to the first structure 511 .
  • the second structure 512 may move away from the first structure 511 by sliding in the first direction (eg, the +y direction of FIGS. 5A and 5B ) with respect to the first structure 511 .
  • the first structure 511 may be moved closer to the first structure 511 by sliding in a second direction opposite to the first direction (eg, the -y direction of FIGS. 5A and 5B ).
  • the housing 510 when the second structure 512 moves away from the first structure 511 by sliding movement of the second structure 512 in the first direction, the housing 510 may be expanded. In another example, when the second structure 512 approaches the first structure 511 by sliding movement of the second structure 512 in the second direction, the housing 510 may be reduced.
  • a state in which the second structure 512 is maximally separated from the first structure 511 is defined as an "open state” (or “open state”)
  • the second structure 512 is defined as a “closed state” (or “closed state”) as a state (or adjacent state) that is maximally close to the first structure 511
  • the expressions "open state” and “closed state” are the same hereafter can be used for meaning.
  • the first structure 511 includes a first sidewall 511a, a second sidewall 511b, a third sidewall 511c, a fourth sidewall 511d, and/or a back plate (not shown). and at least one area on the side surface and/or at least one area on the rear surface of the electronic device 500 may be formed.
  • the first sidewall 511a may form a side surface facing the second direction (eg, the -y direction of FIGS. 5A and 5B ) of the electronic device 500 .
  • the second sidewall 511b forms a part of a side surface facing the third direction (eg, the +x direction of FIGS. 5A and 5B ) of the electronic device 500
  • the third sidewall 511c is the electronic device 500 .
  • a portion of a side surface of the device 500 that faces a fourth direction opposite to the third direction (eg, the -x direction of FIGS. 5A and 5B ) may be formed.
  • the fourth sidewall 511d may form at least one region of the side facing the first direction (eg, the +y direction of FIGS. 5A and 5B ) opposite to the second direction of the electronic device 500 .
  • the first sidewall 511a may be disposed to face the fourth sidewall 511d
  • the second sidewall 511b may be disposed to face the third sidewall 511c.
  • the second sidewall 511b may include one end of the first sidewall 511a (eg, one end in the +x direction in FIGS. 5A and 5B ) and/or one end of the fourth sidewall 511d (eg, FIG. 5A , FIG. 5A , It is connected to one end in the +x direction of FIG.
  • the third sidewall 511c is the other end of the first sidewall 511a (eg, one end in the -x direction in FIGS. 5A and 5B ) and/or a fourth sidewall ( 511d) (eg, one end in the -x direction of FIGS. 5A and 5B ).
  • the rear plate may form the rear surface of the electronic device 500 facing the sixth direction (eg, the -z direction of FIGS. 5A and 5B ).
  • the first structure 511 by the first sidewall 511a , the second sidewall 511b , the third sidewall 511c , the fourth sidewall 511d and/or the back plate of the first structure 511 . ) may have an internal space formed therein, and the second structure 512 may be accommodated in the aforementioned internal space.
  • the first sidewall 511a, the second sidewall 511b, the third sidewall 511c, the fourth sidewall 511d, and/or the rear plate of the first structure 511 may be integrally formed. , but is not limited thereto.
  • the second structure 512 may include a fifth sidewall 512a , a sixth sidewall 512b , a seventh sidewall 512c , and/or a support plate 513 .
  • the fifth sidewall 512a of the second structure 512 may form a portion of a side surface facing the first direction (eg, the +y direction of FIGS. 5A and 5B ) of the electronic device 500 .
  • the fifth sidewall 512a may form, for example, a side surface facing the first direction of the electronic device 500 together with the fourth sidewall of the first structure 511 .
  • the sixth sidewall 512b forms a portion of a side surface facing the third direction (eg, the +x direction of FIGS. 5A and 5B ) of the electronic device 500
  • the seventh sidewall 512c is the electronic device 500 . It may form a part of the side surface facing the fourth direction (eg, the -x direction of FIGS. 5A and 5B ) of the device 500 .
  • the support plate 513 may include a first surface 513a facing a fifth direction (eg, a +z direction in FIGS. 5A and 5B ) and/or a sixth direction facing the fifth direction opposite to the fifth direction. It may include two surfaces 513b.
  • a fifth direction eg, a +z direction in FIGS. 5A and 5B
  • a sixth direction facing the fifth direction opposite to the fifth direction. It may include two surfaces 513b.
  • at least a partial area of the display 520 may be disposed on the first surface 513a of the support plate 513
  • the second surface 513b of the support plate 513 is the electronic device 500 . It may form part of the back surface.
  • the second structure 512 is formed by a first sidewall 511a , a second sidewall 511b , a third sidewall 511c , a fourth sidewall and/or a back plate of the first structure 511 .
  • a portion of the sixth sidewall 512b and/or the seventh sidewall 512c of the second structure 512 is obscured by the first structure 511 to the outside of the electronic device 500 .
  • the fifth sidewall 512a, the sixth sidewall 512b, the seventh sidewall 512c, and/or the support plate 513 of the second structure 512 may be integrally formed, but are limited thereto. it is not
  • the second structure 512 may slide based on the first structure 511 within a predetermined range.
  • the second structure 512 may slide in a first direction with respect to the first structure 511 , and the first structure 511 of the first structure 511 may slide by the sliding movement of the second structure 512 .
  • the distance between the sidewall 511a and the fifth sidewall 512a of the second structure 512 may increase.
  • the second structure 512 may slide in a second direction opposite to the first direction with respect to the first structure 511 , and by the above-described sliding movement of the second structure 512 , the first structure 512 .
  • the distance between the first sidewall 511a of the structure 511 and the fifth sidewall 512a of the second structure 512 may be close.
  • the distance between the first sidewall 511a of the first structure 511 and the fifth sidewall 512a of the second structure 512 may be the shortest. In another example, when the electronic device 500 is in an open state, the distance between the first sidewall 511a and the fifth sidewall 512a of the second structure 512 may be the longest.
  • the lengths of the first sidewall 511a and the fourth sidewall 511d of the first structure 511 are greater than the lengths of the second sidewall 511b and the third sidewall 511c. It may be formed into a long structure.
  • the electronic device 500 may be formed to have a structure in which the length of a side surface parallel to the +x direction or the -x direction is longer than the length of the side surface parallel to the +y direction or the -y direction.
  • the structure of the electronic device 500 is not limited to the above-described embodiment.
  • the display 520 may have a flexible characteristic so that some shapes and structures can be deformed, and the front surface of the electronic device 500 (eg, the +z direction of FIGS. 5A and 5B ) It may form at least a part of the one surface facing toward
  • the display 520 is disposed on at least one region of the outer circumferential surface of the second structure 512 , and when the second structure 512 slides with respect to the first structure 511 , the second structure 512 . You can slide with
  • the display 520 may include a flat region 520a and/or a rolling region 520b.
  • the flat area 520a of the display 520 is disposed on the first surface 513a of the support plate 513 of the second structure 512 , so that the electronic device 500 is in a state (eg, a closed state). Alternatively, it may mean an area that is always visible outside the electronic device 500 irrespective of the open state).
  • the rolling area 520b of the display 520 may mean an area selectively viewed outside the electronic device 500 according to the state of the electronic device 500 .
  • the flat area 520a of the display 520 is, for example, at least at one side edge portion (eg, an end in the +y direction of FIGS.
  • a fourth sidewall of the first structure 511 may include a curved portion that is curved toward 511d and extends seamlessly.
  • the rolling region 520b of the display 520 is accommodated in the inner space of the first structure 511 when the electronic device 500 is in a closed state, so that it is not visible from the outside of the electronic device 500 . can
  • the rolling area 520b of the display 520 is moved inside the first structure 511 by sliding movement of the second structure 512 . It may be withdrawn from space to the outside of the electronic device 500 .
  • the entire display 520 viewed from the outside of the electronic device 500 is area can be increased.
  • the area of the display 520 viewed from the outside of the electronic device 500 may be the first area A 1 .
  • the area of the display 520 viewed from the outside of the electronic device 500 may be a second area A 2 that is larger than the first area A 1 .
  • the rolling area 520b of the display 520 is moved by sliding movement of the second structure 512 of the first structure 511 . It may be introduced into the interior space.
  • the rolling region 520b is introduced into the inner space of the first structure 511 , the display 520 viewed from the outside of the electronic device 500 .
  • the total area of can be reduced.
  • the electronic device 500 may provide a screen of the display 520 having a size corresponding to an externally viewed area of the electronic device 500 .
  • the electronic device 500 displays a screen having an area corresponding to the size of the flat area 520a of the display 520 (eg, A 1 in FIG. 5A ).
  • the electronic device 500 when the electronic device 500 is in an open state, the electronic device 500 has an area corresponding to the sum of the partial areas of the flat area 520a and the rolling area 520b of the display 520 (eg, in FIG. A screen having A 2 ) of 5b may be provided.
  • the electronic device 500 includes one of a key input device (not shown), a sensor module 504 , an audio module 503 , 506 , and 507 , a camera module 505 , and/or a connector hole 508 . It may further include at least one or more. In another embodiment, the electronic device 500 may omit at least one (eg, a key input device) from among the above-described components or may additionally include other components.
  • the key input device may be disposed on at least one side of the housing 510 , and the electronic device 500 may sense a user input through the key input device.
  • the key input device may be disposed on at least one region of the second sidewall 511b of the first structure 511 , but is not limited thereto.
  • the electronic device 500 may not include some or all of the key input devices, and the not included key input devices may be implemented in other forms such as soft keys on the display 520 .
  • the electronic device 500 may include the sensor module 504 to generate an electrical signal or data value corresponding to an internal operating state or an external environmental state.
  • the sensor module 504 may include a distance sensor (eg, TOF sensor), a proximity sensor, a fingerprint sensor, and a biometric sensor (eg, a TOF sensor) for measuring a distance between the first structure 511 and the second structure 512 .
  • HRM sensor a gesture sensor
  • a gyro sensor a barometric pressure sensor
  • a magnetic sensor e.g., an acceleration sensor, a grip sensor, a color sensor, an infrared (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the type of the sensor module is not limited to the above-described example.
  • the audio module 503 , 506 , 507 may include a microphone hole 503 and/or a speaker hole 506 , 507 .
  • a microphone for acquiring an external sound may be disposed therein, and in some embodiments, a plurality of microphones may be disposed to sense the direction of the sound.
  • the speaker holes 506 and 507 may include an external speaker hole 506 and/or a receiver hole 507 for a call.
  • the speaker holes 506 and 507 and the microphone hole 503 may be implemented as a single hole, or a speaker may be included without a speaker hole (eg, a piezo speaker).
  • the camera module 505 may include at least one camera module 505 and/or a flash (not shown) disposed on the front and/or rear of the electronic device 500 .
  • the at least one camera module 505 may include one or a plurality of lenses, an image sensor, and/or an image signal processor.
  • the flash may include a light emitting diode or a xenon lamp.
  • two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 500 (eg, the rear side of the electronic device 500 ).
  • the connector hole 508 may accommodate a connector for transmitting and receiving power and/or data to and from an external electronic device, and/or a connector for transmitting and receiving audio signals to and from an external electronic device.
  • the connector hole 508 may include a USB connector and/or an earphone jack disposed on at least one side of the electronic device 500 .
  • the USB connector and the earphone jack may be implemented as a single hole, and according to another embodiment, the electronic device 500 is an external electronic device (eg, the electronic device 102 of FIG. 1 , without a separate connector hole). 104)) and power and/or data, or an audio signal.
  • FIG. 6A is a diagram illustrating an electrical connection relationship between components of an electronic device according to an exemplary embodiment
  • FIG. 6B is a diagram illustrating an electrical connection relationship between components of an electronic device according to another exemplary embodiment.
  • FIGS. 6A and/or 6B Components shown in FIGS. 6A and/or 6B are an example of components of the electronic device 300 of FIGS. 3A and 3B , the electronic device 400 of FIG. 4 , and/or the electronic device 500 of FIG. 5 . , and repeated descriptions will be omitted below.
  • an electronic device 600 (eg, the electronic device 300 of FIG. 3A , the electronic device 400 of FIG. 4 , and/or the electronic device 500 of FIG. 5 ) according to an embodiment ), the antenna module 700 (eg, the third antenna module 246 of FIG. 2 ), the wireless communication circuit 800 (eg, the wireless communication module 192 of FIGS. 1 and 2 ) and/or at least one of the processor 810 (eg, the processor 120 of FIGS. 1 and 2 ).
  • the antenna module 700 eg, the third antenna module 246 of FIG. 2
  • the wireless communication circuit 800 eg, the wireless communication module 192 of FIGS. 1 and 2
  • the processor 810 eg, the processor 120 of FIGS. 1 and 2
  • the antenna module 700 includes an antenna array 710 (eg, the antenna 248 of FIG. 2 ), a radio frequency integrate circuit (RFIC) 720 (eg, the third RFIC 226 of FIG. 2 ). )) and/or a power manage integrate circuit (PMIC) 730 .
  • RFIC radio frequency integrate circuit
  • PMIC power manage integrate circuit
  • at least one of the above-described components of the antenna module 700 may be omitted or at least two components may be integrally formed, but is not limited thereto.
  • the above-described antenna array 710 , RFIC 720 , and/or power management circuit 730 of the antenna module 700 may be disposed on a printed circuit board (not shown).
  • the antenna array 710 is disposed on a first side of the printed circuit board, and the RFIC 720 and/or the power management circuit 730 is on a second side facing away from the first side of the printed circuit board. may be disposed on, but is not limited thereto.
  • the antenna array 710 may include a plurality of antenna elements 711 , 712 , 713 , 714 arranged to form (or “beam forming”) a directional beam. have.
  • the plurality of antenna elements 711 , 712 , 713 , 714 are electrically connected to the wireless communication circuit 800 , and an antenna for transmitting and/or receiving a radio frequency (RF) signal of a first frequency band It can act as an emitter.
  • RF radio frequency
  • the plurality of antenna elements 711 , 712 , 713 , and 714 may be electrically connected to the wireless communication circuit 800 through the RFIC 720 .
  • the antenna array 710 may include a first antenna element 711 , a second antenna element 712 , a third antenna element 713 , and/or a fourth antenna element 714 .
  • the first antenna element 711 , the second antenna element 712 , the third antenna element 713 , and/or the fourth antenna element 714 is a dipole antenna element or a patch antenna It may include at least one of the elements (patch antenna element).
  • the first antenna element 711 , the second antenna element 712 , the third antenna element 713 , and/or the fourth antenna element 714 may be formed in substantially the same shape, but in the embodiment Accordingly, at least one antenna element may be formed in a shape different from that of other antenna elements.
  • the RFIC 720 may process an RF signal of a first frequency band transmitted and/or received through the antenna array 710 .
  • the first frequency band may be, for example, a millimeter wave (mmWave) frequency band (eg, about 28 GHz and/or about 39 GHz), but is not limited thereto.
  • the RFIC 720 at the time of transmission, a signal (or "IF signal (intermediate frequency)" of an intermediate frequency band (eg, about 9 GHz to about 11 GHz) obtained from the wireless communication circuit 800 It can be up-converted to an RF signal of the first frequency band.
  • IF signal intermediate frequency
  • the RFIC 720 may, upon reception, down-convert the RF signal of the first frequency band acquired through the antenna array 710 into a signal of an intermediate frequency band.
  • the converted signal may be transmitted or transmitted to the wireless communication circuit 800 .
  • the RFIC 720 transmits a baseband signal (or "BB (base band) signal" obtained from the at least one processor 810 to the RF of the first frequency band. It may be converted into a signal or, upon reception, an RF signal of the first frequency band received through the antenna array 710 may be converted into a baseband signal.
  • the converted signal may be transmitted to at least one processor 810 .
  • the RFIC 720 may include an electrical path L formed between the antenna array 710 and the wireless communication circuit 800 .
  • the RFIC 720 may electrically connect the plurality of antenna elements 711 , 712 , 713 , and 714 of the antenna array 710 through the above-described electrical path L .
  • the electrical path L is a first path L 1 , a second path L 2 , a third path L 3 and/or a fourth path L 4 at the first point P 1 . ) can be branched.
  • the first path L 1 electrically connects the wireless communication circuit 800 and the first antenna element 711
  • the second path L 2 is the wireless communication circuit 800 and the second antenna.
  • Element 712 may be electrically connected.
  • the third path L 3 electrically connects the wireless communication circuit 800 and the third antenna element 713
  • the fourth path L 4 is the wireless communication circuit 800 and the fourth antenna element. (714) may be electrically connected.
  • the RFIC 720 includes a mixer 721 , a combiner and divider 722 , at least one first switch 723 , at least one disposed on the electrical path L described above.
  • a first phase shifter 724 at least one power amplifier (PA) 725 , at least one lower noise amplifier (LNA) 726 , at least one second switch 727 and/or or at least one electrical connection member 728 .
  • the RFIC 720 may omit at least one of the above-described components or may additionally include another component (eg, a filter).
  • the at least one first phase shifter 724 is disposed in the 1-1 path L 11 , which operates as an RF signal transmission path between the first antenna element 711 and the wireless communication circuit 800 .
  • a phase shifter 724a and/or a phase shifter 724b disposed in a 1-2 th path L 12 which operates as an RF signal reception path between the first antenna element 711 and the wireless communication circuit 800 . can do.
  • the mixer 721 is disposed on the electrical path L, and may convert a frequency band of a signal transmitted between the antenna array 710 and the wireless communication circuit 800 .
  • the mixer 721 may convert a signal of an intermediate frequency band received from the wireless communication circuit 800 into a signal of a first frequency band.
  • the mixer 721 includes an I/Q signal (in-phase and quadrature signal) of an intermediate frequency band obtained from the wireless communication circuit 800 and an LO signal obtained from a local oscillator (not shown). (local oscillator signal) may be mixed to generate an RF signal of an intermediate frequency band and a first frequency band having a frequency higher than that of the LO signal.
  • the mixer 721 may convert the RF signal of the first frequency band received from the antenna array 710 into an I/Q signal of the intermediate frequency band.
  • the combiner and divider 722 may convert the transmit RF signal transmitted through the electrical path L into a plurality of signals. Alternatively, the combiner and divider 722 may combine a plurality of received RF signals into one received RF signal. For example, the combiner and divider 722 is disposed adjacent to the first point P 1 of the electrical path L during transmission, and transmits the transmit RF signal to the first path L 1 , the second path ( L 2 ), a third path L 3 , and/or a fourth path L 4 may be divided.
  • combiner and divider 722 may include a plurality of receive RFs obtained from a first path L 1 , a second path L 2 , a third path L 3 , and/or a fourth path L 4 . Signals can be combined into one received RF signal.
  • the at least one first switch 723 and/or the at least one second switch 727 may be disposed on the electrical path L.
  • the at least one first switch 723 and/or the at least one second switch 727 may form one of a receiving path of an RF signal or a receiving path of an RF signal.
  • the at least one first switch 723 is a 1-1 switch 723a, a 1-2 switch 723b, a 1-3 switch 723c, and/or a 1-4 switch ( 723d).
  • the at least one second switch 727 may include a 2-1 th switch 727a, a 2-2 th switch 727b, a 2-3 th switch 727c, and/or a 2-4 th switch 727d. ) may be included.
  • the first-first switch 723a and/or the second-first switch 727a may be located on the first path L 1 .
  • the 1-1 switch 723a and/or the 2-1 switch 727a may form a 1-1 path L 11 and/or a 1-2 th path L 12 .
  • the 1-1 path L 11 may operate as an RF signal transmission path between the first antenna element 711 and the wireless communication circuit 800 .
  • the 1-2-th path L 12 may operate as an RF signal reception path between the first antenna element 711 and the wireless communication circuit 800 .
  • the 1-2th switch 723b and/or the 2-2nd switch 727b may be located on the first path L 2 .
  • the 1-2 th switch 723b and/or the 2-2 th switch 727b may form a 2-1 th path L 21 and/or a 2-2 th path L 22 .
  • the second-first path L 21 may operate as an RF signal transmission path between the two antenna elements 712 and the wireless communication circuit 800 .
  • the second-second path L 22 may operate as an RF signal reception path between the second antenna element 712 and the wireless communication circuit 800 .
  • the 1-3 th switch 723c and/or the 2-3 th switch 727c may be located on the third path L 3 .
  • the 1-3 th switch 723c and/or the 2-3 th switch 727c may form a 3-1 th path L 31 and/or a 3-2 th path L 32 .
  • the 3-1 th path L 31 may operate as an RF signal transmission path between the third antenna element 713 and the wireless communication circuit 800 .
  • the 3-2 path L 32 may operate as an RF signal reception path between the third antenna element 713 and the wireless communication circuit 800 .
  • the 1-4th switch 723d and/or the 2-4th switch 727d may be located on the fourth path L 4 .
  • the 1-4 th switch 723d and/or the 2-4 th switch 727d may form a 4-1 th path L 41 and/or a 4-2 th path L 42 .
  • the 4-1 th path L 41 may operate as an RF signal transmission path between the fourth antenna element 714 and the wireless communication circuit 800 .
  • the 4-2 th path L 42 may operate as an RF signal reception path between the fourth antenna element 714 and the wireless communication circuit 800 .
  • the at least one first phase shifter 724 may be disposed on the electrical path L.
  • the at least one first phase shifter 724 converts the phase of the transmitted RF signal transmitted from the wireless communication circuit 800 to the antenna array 710 , or is transmitted from the antenna array 710 to the wireless communication circuit 800 . It is possible to change the phase of the received RF signal.
  • the at least one first phase shifter 724 is a 1-1 path (L 11 ), a 1-2 th path (L 12 ), a 2-1 th path (L 21 ), and a 2-2 th path in series on the path L 22 , the 3-1 path L 31 , the 3-2 path L 32 , the 4-1 path L 41 and/or the 4-2 path L 42 .
  • a series connection may be made to change the phase of the transmitted RF signal and/or the received RF signal.
  • the present invention is not limited thereto.
  • the at least one power amplifier 725 may amplify the power of the transmitted RF signal transmitted from the wireless communication circuit 800 to the antenna array 710 .
  • the at least one power amplifier 725 is a 1-1 path (L 11 ), a 2-1 path (L 21 ), a 3-1 path (L 31 ) and / or disposed in the 4-1 th path (L 41 ), the power of the transmit RF signal input to the at least one power amplifier 725 may be amplified.
  • the transmit RF signal amplified through the at least one power amplifier 725 is a first antenna element 711 , a second antenna element 712 , a third antenna element 713 , and/or a fourth antenna element (714).
  • the at least one low-noise amplifier 726 may amplify the power of the received RF signal transmitted from the antenna array 710 to the wireless communication circuit 800 .
  • the at least one low-noise amplifier 726 includes a 1-2 th path L 12 , a 2-2 th path L 22 , a 3-2 th path L 32 , and / or disposed in the 4-2 path L 42 , input from the first antenna element 711 , the second antenna element 712 , the third antenna element 713 and/or the fourth antenna element 714 . It is possible to amplify the power of the received RF signal.
  • the received RF signal amplified by the at least one low noise amplifier 726 may be delivered to the wireless communication circuit 800 via the mixer 721 , combiner and divider 722 .
  • the at least one electrical connection member 728 may be electrically connected to the antenna array 710 to transmit a transmit RF signal transmitted through the electrical path L to the antenna array 710 .
  • the at least one electrical connection member 728 may transmit the received RF signal obtained through the antenna array 710 to the electrical path L.
  • the at least one electrical connection member 728 includes a first electrical connection member 728a, a second electrical connection member 728b, a third electrical connection member 728c, and/or a fourth electrical connection member ( 728d).
  • the first electrical connection member 728a may electrically connect the first antenna element 711 and the first path L 1 .
  • the second electrical connection member 728b may electrically connect the second antenna element 712 and the second path L 2 .
  • the third electrical connection member 728c may electrically connect the third antenna element 713 and the third path L 3 .
  • the fourth electrical connection member 728d may electrically connect the fourth antenna element 714 and the fourth path L 4 .
  • the at least one electrical connection member 728 may include, for example, a transmission line (TL), but is not limited thereto.
  • the at least one electrical connection member 728 may include at least one of a coaxial cable, a C-clip, or a printed circuit board (PCB) (eg, a flexible printed circuit board (FPCB)).
  • PCB printed circuit board
  • FPCB flexible printed circuit board
  • the RFIC 720 may include a variable length element 740 configured to change the electrical length of the electrical path (L).
  • the variable-length element 740 may change the value of the input impedance (or “input impedance) input to the antenna array 710 by changing the electrical length of the electrical path L”.
  • an impedance value for impedance matching may be different according to a frequency band of an RF signal transmitted and/or received through the antenna array 710 .
  • the input impedance value is fixed, so that radiation performance in a specific frequency band may be deteriorated.
  • the electronic device 600 may adjust the input impedance value by changing the electrical length of the electrical path L using the variable-length element 740 , and as a result, the radiation of the antenna module 700 . performance can be improved.
  • variable-length element 740 is branched at at least one point of the electrical path L to be connected (or “shunt connection”) between the electrical path L and the ground.
  • variable-length element 740 is, in one example , branched at the second point P 2 between the mixer 721 and the combiner and distributor 722 of the electrical path L, the electrical path It may be connected between the second point P 2 of (L) and the ground, but is not limited thereto.
  • the processor 810 may be operatively coupled to the variable length element 740 .
  • the processor 810 may control the variable element 740 through the wireless communication circuit 800 .
  • the processor 810 may change the electrical length of the electrical path L of the variable element 740 by transmitting a control signal (eg, a control command) to the wireless communication circuit 800 .
  • a control signal eg, a control command
  • variable-length element 740 is, in another example, a first electrical connection member 728a and a second electrical connection member 728b positioned between the wireless communication circuit 800 and the antenna array 710 . , may be branched from one point of at least one of the third electrical connection member 728c and the fourth electrical connection member 728d to be connected between the aforementioned one point and the ground.
  • the variable-length element 740 is, in another example, the first path L 1 , the second path L 2 , the third path L 3 of the electrical path L, or It may be branched from one point of at least one of the fourth paths L 4 and connected between the aforementioned one point and the ground.
  • variable length element 740 includes a 1-1 switch 723a, a 1-2 switch 723b, a 1-3 switch 723c, and/or a 1-4 switch 723d and It may be branched and connected at an adjacent point, but is not limited thereto.
  • variable-length element 740 may include a fifth phase shifter.
  • the fifth phase shifter is, unlike the at least one first phase shifter 724 connected in series on the electrical path L, at a point (eg, the second point P 2 ) of the electrical path L. )), the electrical length of the electrical path L may be changed by the operation of the fifth phase converter.
  • the electrical length of the electrical path L may be increased or decreased by the phase changing operation of the fifth phase converter.
  • the fifth phase shifter may be a phase shifter having a relatively high resolution compared to the at least one first phase shifter 724 .
  • the at least one first phase shifter 724 may be a phase shifter having a first bit
  • the fifth phase shifter may be a phase shifter having a second bit greater than the first bit.
  • the electronic device 600 can more precisely adjust the electrical length of the electrical path L through the fifth phase converter having a relatively high precision, and as a result, the input terminal impedance value is more precisely changed.
  • the radiation performance of the antenna module 700 may be improved.
  • the variable-length element 740 is not limited to the above-described embodiment, and according to another embodiment (not shown), the variable-length element 740 includes a variable capacitor capable of changing a capacitance value. may include
  • variable-length element 740 may be a phase shift circuit.
  • the variable-length element 740 may be a circuit formed of at least one of a capacitor, an inductor, and/or a diode, or a combination of two or more of the above.
  • the power management circuit 730 may receive a voltage from the main PCB (not shown) to provide power required for various components of the antenna module 700 .
  • the power management circuit 730 may provide power to the RFIC 720 .
  • the antenna module 700 may further include at least one of a module interface (not shown) and/or a shielding member (not shown).
  • the antenna module 700 may be electrically connected to another printed circuit board (eg, a main PCB) through a module interface.
  • the module interface may include, but is not limited to, a coaxial cable connector, a board to board connector, an interposer, or a flexible printed circuit board (FPCB).
  • the antenna module 700 may be electrically connected to the RFIC 720 and/or the power management circuit 730 to another printed circuit board (eg, a main PCB) of the electronic device 600 .
  • the shielding member may electromagnetically shield the RFIC 720 and/or the power management circuit 730 of the antenna module 700 .
  • the shielding member may include a shield can, and may shield noise flowing into the antenna module 700 or shield noise generated in the antenna module 700 .
  • the wireless communication circuit 800 may be electrically connected to the antenna module 700 and/or at least one processor 810 .
  • the wireless communication circuit 800 may transmit an RF signal to the antenna array 710 of the antenna module 700 or receive an RF signal from the antenna array 710 .
  • the wireless communication circuit 800 may include an intermediate frequency integrated circuit (IFIC).
  • IFIC intermediate frequency integrated circuit
  • the IFIC of the wireless communication circuit 800 may convert a baseband signal obtained from the at least one processor 810 into an intermediate frequency band signal (or “IF signal”) during transmission.
  • IF signal intermediate frequency band signal
  • the IFIC of the wireless communication circuit 800 converts an intermediate frequency band signal acquired through the antenna module 700 into a baseband signal, and converts the converted signal into at least one processor 810 . can be transmitted as
  • the at least one processor 810 may be electrically connected to the wireless communication circuit 800 to control overall communication (eg, wireless communication) of the electronic device 600 .
  • the at least one processor 810 may transmit an RF signal to the wireless communication circuit 800 or receive an RF signal from the wireless communication circuit 800 .
  • the at least one processor 810 may be electrically connected to the variable-length element 740 of the antenna module 700 .
  • the at least one processor 810 may control the electrical length of the electrical path L formed between the wireless communication circuit 800 and the antenna array 710 by controlling the variable-length element 740 .
  • the at least one processor 810 may control the variable-length element 740 to increase the electrical length of the electrical path L or decrease the electrical length of the electrical path L.
  • the at least one processor 810 may adjust the input impedance value input to the antenna array 710 by adjusting the electrical length of the electrical path L. The operation of controlling the variable length element 740 of the at least one processor 810 will be described later.
  • the at least one processor 810 may include, but is not limited to, a communication processor (CP) and/or an application processor (AP). According to another embodiment, the at least one processor 810 may be one processor in which a communication processor and an application processor are combined.
  • CP communication processor
  • AP application processor
  • the electronic device 600 has an electrical length of the electrical path L formed between the wireless communication circuit 800 and the antenna array 710 of the antenna module 700 through the variable length element 740 . can be changed to adjust the input impedance value. Accordingly, the electronic device 600 may improve the performance of the antenna module 700 .
  • FIGS. 7A, 7B and/or 8 an effect of improving the performance of the antenna module 700 according to the change in the electrical length of the electrical path L will be described.
  • FIG. 7A is a graph illustrating a change in a resonance frequency of an antenna module according to a change in an electrical length of an electrical path between an antenna of an electronic device and a wireless communication circuit according to an exemplary embodiment
  • FIG. 7B is an electronic device according to another exemplary embodiment
  • It is a graph showing the change in the resonance frequency of the antenna module according to the change in the electrical length of the electrical path between the antenna and the wireless communication circuit
  • 8 is a graph illustrating a gain change of an antenna module according to a change in an electrical length of an electrical path between an antenna of an electronic device and a wireless communication circuit according to an exemplary embodiment.
  • FIG. 7A is a first antenna element (eg, the first antenna of FIGS. 6A and 6B ) according to the operation of the variable-length element (eg, the variable-length element 740 of FIGS. 6A and 6B ) in a frequency band of about 28 GHZ.
  • element 711) shows the change in antenna gain.
  • an electronic device is formed between a first antenna element and a wireless communication circuit (eg, the wireless communication circuit 800 of FIGS. 6A and 6B ) using a variable-length element.
  • a wireless communication circuit eg, the wireless communication circuit 800 of FIGS. 6A and 6B
  • the length of the electrical path eg, the first path L 1 in FIGS. 6A and 6B
  • the resonant frequency of the first antenna element when the electrical length of the electrical path is not changed using the variable-length element, the resonant frequency of the first antenna element may be about 28 GHz, and the reflection coefficient of the first antenna element at the resonant frequency (eg: S(1,1)) may be about -18 dB.
  • the electrical length of the electrical path when the electrical length of the electrical path is changed by changing the phase of the variable-length element (eg, by changing in the order of 170°, 160°, 150°, 140°), the resonant frequency of the first antenna element is about It can be seen that 28 GHz is changed to about 27.5 GHz, about 25.5 GHz, and about 24.5 GHz, and the reflection coefficient of the first antenna element is also improved compared to when the electrical length of the electrical path is not changed.
  • FIG. 7B shows a first antenna element, a second antenna element (eg, the second antenna element 712 of FIGS. 6A and 6B ), a third antenna element ( Example: shows the change in antenna gain of the third antenna element 713 of FIGS. 6A and 6B ) and/or the fourth antenna element (eg, the fourth antenna element 714 of FIGS. 6A and 6B ).
  • 8 is a gain polar plot showing changes in antenna gain of the first antenna element, the second antenna element, the third antenna element, and/or the fourth antenna element according to the operation of the variable-length element in the frequency band of about 28 GHz; ) is indicated.
  • the electronic device uses a variable-length element to connect an antenna array (eg, a first antenna element, a second antenna element, a third antenna element, and/or a fourth antenna element) and As the length of the electrical path formed between the wireless communication circuits (eg, the electrical path L in FIGS. 6A and 6B ) is changed, it can be confirmed that the radiation performance of the antenna array and/or the resonance frequency of the antenna array are shifted. have.
  • the resonant frequency of the antenna array may be about 29.5 GHz.
  • the reflection coefficient (eg, S(1,1)) of the antenna array at the resonant frequency may be about -10 dB.
  • the resonant frequency of the antenna array is about 29.5 GHz is changed from about 29 GHz to about 28.5 GHz, and it can be seen that the reflection coefficient of the antenna array is also improved compared to when the electrical length of the electrical path is not changed.
  • the antenna gain of the antenna array is improved as the electronic device uses a variable length element to change the length of an electrical path formed between the antenna array and the wireless communication circuit.
  • the antenna gain of the beam pattern of the antenna array oriented in the 90° direction may be about 3.6998 dB.
  • the antenna gain of the beam pattern of the antenna array facing the 90° direction is about It can be improved up to 6.6668 dB. That is, it can be confirmed that the antenna gain of the antenna array can be improved by about 3 dB by changing the electrical length of the electrical path through the variable length element.
  • the electronic device controls the variable-length element to change the electrical length of the electrical path between the wireless communication circuit and the antenna array, thereby resonating the antenna array. It can be confirmed that the frequency can be shifted or the performance of the antenna array (eg, radiation performance) can be improved.
  • FIG. 9 is a diagram illustrating an electrical connection relationship between components of an electronic device, according to an exemplary embodiment.
  • an electronic device 600 (eg, the electronic device 600 of FIGS. 6A and 6B ) according to an embodiment includes an antenna array 710 (eg, the antenna array 710 of FIG. 6A ). , RFIC 720 (eg, RFIC 720 of FIG. 6A ), power management circuit 730 (eg, power management circuit 730 of FIG. 6A ), and variable length element 740 (eg, FIG. 6A , FIG. 6A )
  • An antenna module 700 (eg, the antenna module 700 of FIG. 6A ), a switch circuit 750 , and a wireless communication circuit 800 (eg, the wireless communication of FIG.
  • the electronic device 600 may be an electronic device to which a switch circuit 750 is added in the electronic device 600 of FIGS. 6A and/or 6B , and a redundant description will be omitted below.
  • the switch circuit 750 may be electrically connected to the variable-length element 740 .
  • the above-described switch circuit 750 may selectively connect the variable-length element 740 to the ground or electrically open it.
  • the variable-length element 740 may be connected to the ground or may be in an electrically open state.
  • the variable length element 740 according to the electrical connection state of the switch circuit 750, an electrical path (L) formed between the antenna array 710 and the wireless communication circuit 800 (eg, Fig. 6a, The electrical length of the electrical path L of FIG. 6B may be changed.
  • the electronic device 600 may change the electrical length of the electrical path L by controlling the electrical connection state of the variable-length element 740 and/or the switch circuit 750 , and accordingly, the antenna array An input impedance value input to 710 may be changed.
  • the above-described electronic device 600 may improve the performance of the antenna module 700 and reduce the generation of interference signals by changing the input impedance value through the variable length element 740 and/or the switch circuit 750 . .
  • the switch circuit 750 may be electrically connected to at least one processor 810 , and the at least one processor 810 may control an electrical connection state of the switch circuit 750 .
  • the at least one processor 810 may control the electrical connection state of the switch circuit 750 so that the variable-length element 740 is connected to the ground.
  • the at least one processor 810 may control the electrical connection state of the switch circuit 750 so that the variable-length element 740 is in an electrically open state.
  • the switch circuit 750 may be electrically connected to the wireless communication circuit 800 , and the wireless communication circuit 800 may control the electrical connection state of the switch circuit 750 . .
  • FIG. 10 is a flowchart illustrating an operation of controlling a variable-length element of an electronic device according to an exemplary embodiment.
  • the control operation of FIG. 10 will be described with reference to the configuration shown in FIGS. 6A and/or 6B.
  • At least one processor 810 (eg, FIGS. 6A and 6B ) of an electronic device 600 (eg, the electronic device 600 of FIGS. 6A and 6B ) according to an embodiment.
  • At least one processor 810 of 6b) is to check or monitor a frequency band of an RF signal transmitted and/or received through the antenna module 700 (eg, the antenna module 700 of FIGS. 6A and 6B).
  • the at least one processor 810 uses a wireless communication circuit 800 electrically connected to the at least one processor 810 (eg, the wireless communication circuit 800 of FIGS. 6A and 6B ), A frequency band of an RF signal transmitted and/or received through the antenna module 700 may be detected.
  • the at least one processor 810 of the electronic device 600 based on the frequency band of the RF signal checked or monitored in operation 1001, the variable length element 740 (eg, FIG. The variable-length element 740 of FIGS. 6A and 6B may be controlled. Depending on the frequency band of the RF signal transmitted and/or received by the antenna module 700, an impedance value capable of achieving optimal performance (eg, radiation performance) may be different. In one example, the at least one processor 810 controls an electrical path ( The electrical length of L) (eg, the electrical path L of FIGS. 6A and 6B ) can be adjusted.
  • the electrical length of L The electrical length of L
  • the at least one processor 810 may increase or decrease the electrical length of the electrical path L to adjust the input impedance value according to the sensed RF signal.
  • the electronic device 600 may improve the radiation performance of the antenna module 700 for transmitting and/or receiving RF signals of various frequency bands through operations 1001 and/or 1002 described above. .
  • FIG. 11 is a flowchart illustrating an operation of controlling a variable-length element of an electronic device according to another exemplary embodiment. Hereinafter, the control operation of FIG. 11 will be described with reference to the configuration shown in FIGS. 6A and/or 6B.
  • At least one processor 810 (eg, FIGS. 6A and 6B ) of an electronic device 600 (eg, the electronic device 600 of FIGS. 6A and 6B ) according to an embodiment.
  • At least one processor 810 of 6b may detect whether a specified event has occurred.
  • a specific event eg, charging of the electronic device 600
  • noise may be generated during the event generation process.
  • interference between the noise generated in the event generation process and the RF signal of a specific frequency band transmitted and/or received through the antenna module 700 eg, FIGS. 6A and 6B ) occurs, so that the specific frequency band Radiation performance of the antenna module 700 may be reduced.
  • the at least one processor 810 may detect whether a specified event that may cause deterioration of the radiation performance of the antenna module 700 has occurred.
  • the designated event may mean that a situation related to the electronic device is issued or an operation is performed by a component of the electronic device.
  • the processor 810 may detect that a specified event has occurred to perform an operation to control other components, or may detect whether a specified event has occurred using a sensor included in the electronic device.
  • the specified event is a carrier aggregation (carrier aggregation) performed, a camera (eg, the camera module (305, 306, 312, 313) in FIGS. 3A and 3B) driving, an audio module (eg, FIGS.
  • Driving the audio module 303 of 3b), receiving a user input for a display (eg, the display 301 of FIG. 3A ), charging the electronic device 600, executing a specified application, or a sensor (eg, the sensor module of FIG. 1 ) (176)) may include at least one of the driving, but is not limited thereto.
  • the designated event may include a state change of the electronic device 600 .
  • a state change of the electronic device 600 may indicate that the electronic device 600 (eg, the electronic device 400 of FIG. 4 ) (or “foldable electronic device”) is converted from a folded state to an unfolded state, or is folded from an unfolded state. and/or electronic device 600 (eg, electronic device 500 of FIGS.
  • 5A-5B (or “rollable or slideable electronic device") when transitioned to a closed state (eg, electronic device of FIG. 5A ). It may include a case in which the device 500 is switched to an open state (eg, the electronic device 500 of FIG. 5B ) or is switched from an open state to a closed state.
  • the at least one processor 810 of the electronic device 600 performs the variable-length element 740 (eg, FIG. 6A ) based on the determination that the specified event in operation 1101 has occurred.
  • the variable-length element 740 of FIG. 6B may be controlled.
  • the at least one processor 810 controls the variable-length element 740 based on the occurrence of a specified event, thereby controlling the electrical path L between the wireless communication circuit 800 and the antenna module 700 (eg, : The electrical length of the electrical path (L) of FIGS. 6A and 6B can be adjusted.
  • the at least one processor 810 may increase or decrease the electrical length of the electrical path L to adjust the input impedance value.
  • the at least one processor 810 may increase or decrease the electrical length of the electrical path L to adjust the input impedance value based on the execution of a specified application.
  • the electronic device 600 may reduce performance degradation of the antenna module 700 due to noise generated in the process of generating a specified event through operations 1101 and/or 1102 described above.
  • FIG. 12 is a flowchart illustrating an operation of controlling a variable-length element of an electronic device according to another exemplary embodiment.
  • the control operation of FIG. 12 will be described with reference to the configuration shown in FIGS. 6A and/or 6B.
  • the electronic device 600 transmits and/or receives an RF signal of a first frequency band to the antenna module 700 (eg, FIG. 6B ).
  • the antenna module 700 eg, FIG. 6B
  • 6a, 6b antenna module 700 and / or transmits an RF signal of the second frequency band and / or antenna (eg, the first antenna module 242, the second antenna module 244 of Figure 2, or a third antenna module 246).
  • the first frequency band may overlap at least a portion of the second frequency band or may be substantially the same.
  • the antenna module 700 and the aforementioned antenna eg, the first antenna module 242 , the second antenna module 244 , or the third antenna module 246 of FIG.
  • the electronic device 600 adjusts an input impedance value, so that the antenna module 700 uses an RF signal transmitted and/or received from the antenna. ) can reduce the radiation performance degradation.
  • the antenna module 700 and the antenna eg, the antenna module 197 of FIG. 1
  • the antenna eg, WiFi, GPS, NFC, or bluetooth
  • communication eg, wireless communication
  • At least one processor 810 (eg, at least one processor 810 of FIGS. 6A and 6B ) of the electronic device 600 according to an embodiment performs a second frequency It may be determined whether an antenna for transmitting and/or receiving an RF signal of a band operates.
  • the radiation performance of the antenna module 700 for transmitting and/or receiving the RF signal of the first frequency band may be deteriorated by the operation of the antenna for transmitting and/or receiving the RF signal of the second frequency band.
  • the at least one processor 810 may determine whether the antenna operates.
  • the at least one processor 810 of the electronic device 600 performs the variable length element 740 (eg, FIG. 6A ) based on the determination that the antenna is operating or communicating in operation 1201 .
  • the variable-length element 740 of FIG. 6B may be controlled.
  • the at least one processor 810 controls the variable length element 740 during the operation of the antenna, thereby providing an electrical path L between the wireless communication circuit 800 and the antenna module 700 (eg, FIG.
  • the electrical length of the electrical path (L) of FIGS. 6A and 6B can be adjusted.
  • the at least one processor 810 may increase or decrease the electrical length of the electrical path L by controlling the variable-length element 740 .
  • the at least one processor 810 may adjust the impedance value of the input terminal of the antenna module 700 by controlling the electrical length of the electrical path L during the operation of the antenna.
  • the electronic device 600 transmits and/or transmits the RF signal of the second frequency band transmitted and/or received by the antenna and the antenna module 700 through the operation 1201 and/or operation 1202 described above. Interference between the received RF signals of the first frequency band may be reduced. Accordingly, the electronic device 600 may reduce radiation performance degradation of the antenna module 700 due to other antenna operations.
  • FIG. 13 is a flowchart illustrating an operation of controlling a variable-length element of an electronic device according to another exemplary embodiment. Hereinafter, the control operation of FIG. 13 will be described with reference to the configuration shown in FIGS. 6A and/or 6B.
  • the electronic device 600 (eg, the electronic device 600 of FIGS. 6A and 6B ) according to an embodiment includes a wireless antenna array 710 (eg, the antenna array 710 of FIGS. 6A and 6B ) and a wireless device. At least one agent disposed in an electrical path L (eg, the electrical path L of FIGS. 6A and 6B ) between the communication circuit 800 (eg, the wireless communication circuit 800 of FIGS. 6A and 6B ). One switch 723 and/or at least one second switch 727 may be included.
  • the electronic device 600 includes a first path formed between the wireless communication circuit 800 and the first antenna element 711 (eg, the first antenna element 711 of FIGS. 6A and 6B ).
  • the 1-1 switch 723a eg, the 1-1 switch 723a of FIGS. 6A and 6B ) and/or the wireless communication circuit 800 and the second antenna element 712
  • a 1-2 switch 723b disposed on a second path L 2 formed between eg, the second antenna element 712 of FIGS. 6A and 6B
  • the 1-1 switch 723a may be disposed adjacent to the 1-2 th switch 723b, and an isolation between the 1-1 switch 723a and the 1-2 th switch 723b ( isolation) is not secured, the radiation performance of the antenna module 700 may be deteriorated by the operation of the 1-1 switch 723a and/or the 1-2 th switch 723b.
  • the electronic device 600 adjusts the impedance value of the input terminal of the antenna module 700 based on the operation of the at least one first switch 723 and/or the at least one second switch 727 . By doing so, it is possible to reduce radiation performance degradation of the antenna module 700 due to the operation of the at least one first switch 723 and/or the at least one second switch 727 .
  • At least one processor 810 (eg, at least one processor 810 of FIGS. 6A and 6B ) of the electronic device 600 according to an embodiment includes at least one Whether the first switch 723 and/or the at least one second switch 727 operates may be checked or monitored.
  • the at least one processor 810 of the electronic device 600 activates the at least one first switch 723 and/or the at least one second switch 727 in operation 1301 . Based on the determination that it operates, the variable-length element 740 (eg, the variable-length element 740 of FIGS. 6A and 6B ) may be controlled. In one example, the at least one processor 810 controls the variable-length element 740 based on the at least one first switch 723 and/or the at least one second switch 727, whereby the electrical path ( The electrical length of L) can be adjusted.
  • the variable-length element 740 eg, the variable-length element 740 of FIGS. 6A and 6B
  • the at least one processor 810 controls the variable-length element 740 based on the at least one first switch 723 and/or the at least one second switch 727, whereby the electrical path ( The electrical length of L) can be adjusted.
  • the at least one processor 810 increases the electrical length of the electrical path L based on the operation of the 1-1 switch 723a and/or the 1-2 switch 723b, or By reducing the electrical length, the input impedance value can be adjusted.
  • the at least one processor 810 operates when the 1-1 switch 723a or the 1-2 switch 723b operates alone, and the 1-1 switch 723a and the 1-2 switch When the 723b operates simultaneously, the input impedance value can be adjusted differently.
  • the antenna by the operation of the at least one first switch 723 and/or the at least one second switch 727 It is possible to reduce performance degradation of the module 700 .
  • An electronic device (eg, the electronic device 101 of FIG. 1 , the electronic device 101 of FIG. 2 , the electronic device 101 of 3A and 3B , the electronic device 400 of FIG. 4 , and the electronic device of FIGS. 5A and 5B ) 500 , the electronic device 600 of FIGS. 6A, 6B, or 9 ) includes a plurality of antenna elements (eg, the antenna elements 711 , 712 , 713 , 714 of FIGS. 6A , 6B or 9 ). ) and a radio frequency integrated circuit (RFIC) for processing a signal of a first frequency band transmitted or received through the plurality of antenna elements (eg, the RFIC 720 of FIGS. 6A, 6B or 9).
  • RFIC radio frequency integrated circuit
  • a module (eg, the antenna module 700 of FIGS. 6A, 6B, or 9) and a wireless communication circuit electrically connected to the antenna module (eg, the wireless communication circuit 800 of FIGS. 6A, 6B or 9) may include
  • the RFIC includes a first electrical path formed between a first one of the plurality of antenna elements (eg, the antenna element 711 of FIGS. 6A, 6B or 9 ) and the wireless communication circuit, and the first electrical a first phase shifter disposed on a path and configured to transform a phase of a signal transmitted from the wireless communication circuitry to the first antenna element (eg, first phase shifter 724 of FIGS. 6A, 6B or 9 ) and a variable-length element (eg, in FIG. 6a, 6b, or 9 may include a variable-length element 740).
  • variable-length element of the electronic device may include a fifth phase converter.
  • the first phase shifter may include a first bit phase shifter
  • the fifth phase shifter may include a second bit phase shifter greater than the first bit
  • variable-length element of the electronic device may include a variable capacitor.
  • the RFIC of the electronic device is disposed on a first electrical path and is a mixer (eg, the mixer 721 of FIGS. 6A, 6B or 9 ) that converts a frequency band of a signal transmitted through the first electrical path. )) and a combiner and divider disposed on the first electrical path and configured to combine or distribute a signal transmitted through the first electrical path (eg, combiner and divider 722 of FIGS. 6A, 6B or 9 ) ))) may be further included.
  • a mixer eg, the mixer 721 of FIGS. 6A, 6B or 9
  • a combiner and divider disposed on the first electrical path and configured to combine or distribute a signal transmitted through the first electrical path
  • the electronic device further includes a switch circuit electrically connected to the variable-length element (eg, the switch circuit 750 of FIGS. 6A, 6B, or 9), wherein the switch circuit selects the variable-length element to the ground It can be configured to connect to
  • the electronic device may further include at least one processor (eg, the processor 810 of FIGS. 6A, 6B, or 9 ) electrically connected to the wireless communication circuit and the variable-length element.
  • processor eg, the processor 810 of FIGS. 6A, 6B, or 9
  • At least one processor using the wireless communication circuit, detects a frequency band of an RF signal transmitted or received by the antenna module, and based on the sensed frequency band of the RF signal, through the variable length element and may be configured to change the electrical length of the first electrical path.
  • the at least one processor may be configured to change an electrical length of the first electrical path through the variable-length element based on occurrence of a designated event.
  • the specified event may include at least one of performing carrier aggregation, driving a camera, driving an audio module, charging the electronic device, executing a specified application, driving a sensor, or receiving a user input.
  • the electronic device transmits or receives an RF signal of a second frequency band different from the first frequency band (eg, the first antenna module 242 , the second antenna module 244 of FIG. 2 , or the third antenna module) 246), wherein the at least one processor controls the operation of the antenna (eg, the first antenna module 242, the second antenna module 244, or the third antenna module 246 of FIG. 2). based on the variable length element may be configured to change the electrical length of the first electrical path.
  • the RFIC includes a first switch (a first switch 723 of FIG. 6A, FIG. 6B or FIG. 9 ) disposed on the first electrical path, and a second antenna element (eg, FIG. 6A ) of the plurality of antenna elements.
  • a second electrical path eg, a second path (L 2 ) of FIG. 6A, 6B or 9 ) formed between the second antenna element 712 of FIG. 6A, FIG. 6B or FIG. 9 and the wireless communication circuit, and
  • a second switch eg, the second switch 727 of FIGS. 6A, 6B, or 9 disposed on the second electrical path may be further included.
  • the at least one processor may be configured to change the electrical length of the first electrical path through the variable-length element based on operations of the first switch and the second switch.
  • the antenna module may further include a power management integrated circuit (eg, the power management circuit 730 of FIGS. 6A, 6B or 9 ) configured to supply power to the RFIC.
  • a power management integrated circuit eg, the power management circuit 730 of FIGS. 6A, 6B or 9 .
  • the plurality of antenna elements may include at least one of a patch antenna element and a dipole antenna element.
  • An electronic device (eg, the electronic device 101 of FIG. 1 , the electronic device 101 of FIG. 2 , the electronic device 101 of 3A and 3B , the electronic device 400 of FIG. 4 , and the electronic device of FIGS. 5A and 5B ) 500 , the electronic device 600 of FIGS. 6A, 6B, or 9 ) includes a plurality of antenna elements (eg, the antenna elements 711 , 712 , 713 , 714 of FIGS. 6A , 6B or 9 ). ) and an RFIC (eg, RFIC 720 of FIGS. 6A, 6B, or 9) for processing a signal of a first frequency band transmitted or received through the plurality of antenna elements (eg, FIG. 6A ) , the antenna module 700 of FIG. 6B or FIG. 9) and a wireless communication circuit electrically connected to the antenna module (eg, the wireless communication circuit 800 of FIGS. 6A, 6B, or 9).
  • RFIC eg, RFIC 720 of
  • an electrical path formed between the wireless communication circuit and the antenna module is branched from a first point of the electrical path to a first antenna element (eg, the antenna element of FIGS. 6A, 6B or 9 ) 711)) and a second path branched from the first point of the electrical path and connected to a second antenna element (eg, the antenna element 712 of FIGS. 6A, 6B or 9); a third path branched at the first point of the electrical path and connected to a third antenna element (eg, the antenna element 713 of FIG. 6A, FIG. 6B or FIG. 9) and branching at the first point of the electrical path and may include a fourth path connected to a fourth antenna element (eg, the antenna element 714 of FIGS. 6A, 6B, or 9 ).
  • a fourth antenna element eg, the antenna element 714 of FIGS. 6A, 6B, or 9
  • An electronic device is disposed at the first point in the electrical path and configured to combine or distribute signals transmitted through the electrical path (eg, combiner and divider 722 in FIGS. 6A, 6B or 9 ). ), a first phase converter disposed on the first path and configured to transform a phase of a signal transmitted from the wireless communication circuit to the first antenna element (eg, the first phase converter of FIG. 6A, FIG. 6B or FIG. 9 ) phase shifter 724), a second phase shifter (eg, FIGS. 6A, 6B, second phase shifter 731 of FIG. 9 ), a third phase shifter disposed on the third path and configured to transform a phase of a signal transmitted from the wireless communication circuitry to the third antenna element (eg, FIG.
  • phase shifter 732 of FIGS. 6A, 6B, and 9 a fourth phase disposed on the fourth path and configured to transform a phase of a signal transmitted from the wireless communication circuitry to the fourth antenna element a converter (eg, the fourth phase shifter 733 of FIGS. 6A, 6B, and 9 ) and branched at a second point of the electrical path and connected between the second point of the electrical path and the ground, and It may include a variable-length element (eg, the variable-length element 740 of FIGS. 6A, 6B, or 9) for changing the electrical length.
  • the variable length element may include at least one of a phase converter and a variable capacitor.
  • the electronic device further includes a wireless communication circuit and at least one processor electrically connected to the variable-length element, wherein the at least one processor is configured to control the variable-length element to change an electrical length of the electrical path can be
  • the second point may be located between the wireless communication circuit and the combiner and splitter.
  • the second point may be located on at least one of the first path, the second path, the third path, and the fourth path.

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Abstract

Est divulgué un dispositif électronique comprenant une antenne. Un dispositif électronique selon un mode de réalisation de la présente divulgation comprend : un module d'antenne comprenant une pluralité d'éléments antenne, et un circuit intégré radiofréquence (RFIC) pour traiter des signaux dans une première bande de fréquences qui sont transmis ou reçus par l'intermédiaire de la pluralité d'éléments antenne ; et un circuit de communication sans fil connecté électriquement au module d'antenne, le RFIC pouvant comprendre : un premier trajet électrique formé entre un premier élément antenne parmi la pluralité d'éléments antenne et le circuit de communication sans fil ; un premier déphaseur placé sur le premier trajet électrique et conçu pour déphaser un signal transmis entre le circuit de communication sans fil et le premier élément antenne ; et un élément de variation de longueur qui est branché à partir d'un premier point du premier trajet électrique de manière à être connecté entre le premier point du premier trajet électrique et une mise à la terre et qui change la longueur électrique du premier trajet électrique.
PCT/KR2021/008396 2020-07-13 2021-07-02 Dispositif électronique comprenant une antenne Ceased WO2022014919A1 (fr)

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JP2023157737A (ja) 2022-04-15 2023-10-26 キヤノン株式会社 アンテナ装置、通信装置、及び、撮像システム
KR20240066685A (ko) * 2022-11-08 2024-05-16 주식회사 케이티앤지 통신 및 에어로졸 모듈

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KR20180137765A (ko) * 2017-06-19 2018-12-28 삼성전자주식회사 복수의 주파수 대역을 지원하기 위한 무선 통신 회로 및 그를 포함하는 장치
KR20200076485A (ko) * 2018-12-19 2020-06-29 에스케이텔레콤 주식회사 튜너블 안테나장치 및 튜너블 안테나장치의 동작 방법

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KR20160108509A (ko) * 2014-01-21 2016-09-19 퀄컴 인코포레이티드 패시브 스위치-기반 위상 시프터
KR20180039425A (ko) * 2016-10-10 2018-04-18 삼성전자주식회사 안테나 장치 및 그것을 포함하는 전자 장치
KR20180137765A (ko) * 2017-06-19 2018-12-28 삼성전자주식회사 복수의 주파수 대역을 지원하기 위한 무선 통신 회로 및 그를 포함하는 장치
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