[go: up one dir, main page]

WO2022052842A1 - 一种光模块 - Google Patents

一种光模块 Download PDF

Info

Publication number
WO2022052842A1
WO2022052842A1 PCT/CN2021/115887 CN2021115887W WO2022052842A1 WO 2022052842 A1 WO2022052842 A1 WO 2022052842A1 CN 2021115887 W CN2021115887 W CN 2021115887W WO 2022052842 A1 WO2022052842 A1 WO 2022052842A1
Authority
WO
WIPO (PCT)
Prior art keywords
pin
laser
metal
optical
pins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2021/115887
Other languages
English (en)
French (fr)
Inventor
杨世海
张晓磊
庞广宁
陈金磊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hisense Broadband Multimedia Technology Co Ltd
Original Assignee
Hisense Broadband Multimedia Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hisense Broadband Multimedia Technology Co Ltd filed Critical Hisense Broadband Multimedia Technology Co Ltd
Publication of WO2022052842A1 publication Critical patent/WO2022052842A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements

Definitions

  • the present disclosure relates to the technical field of optical communication, and in particular, to an optical module.
  • the optical module is a tool for realizing the mutual conversion of photoelectric signals, and it is one of the key components in optical communication equipment. And with the rapid development of 5G networks, optical modules in the core position of optical communication have developed by leaps and bounds.
  • An embodiment of the present disclosure provides an optical module, including: a metal casing; an optical fiber adapter, which is electrically connected to the metal casing; a round and square tube body, which is electrically connected to the optical fiber adapter and provided with a nozzle; an optical emission sub-module, including a metal pipe
  • the metal socket is electrically connected to the square tube body; the metal socket is provided with a grounding pin and a grounding pin through hole, wherein: the grounding pin penetrates from the bottom surface of the metal socket to the metal through the grounding pin through hole On the top surface of the socket, a gap is arranged between the grounding pin and the through hole of the grounding pin, and an insulating medium is arranged in the gap; a laser is arranged on the metal socket, and the grounding end of the laser is connected with the grounding pin.
  • Fig. 1 is a schematic diagram of the connection relationship of optical communication terminals
  • FIG. 2 is a schematic structural diagram of an optical network terminal
  • FIG. 3 is a schematic structural diagram of an optical module according to an embodiment of the present disclosure.
  • FIG. 4 is a schematic diagram of an exploded structure of an optical module according to an embodiment of the present disclosure.
  • FIG. 5 is a schematic diagram of an internal structure of an optical module according to an embodiment of the present disclosure.
  • FIG. 6 is a schematic structural diagram of a light emission sub-module according to an embodiment of the present disclosure.
  • FIG. 7 is a schematic structural diagram of a heat sink provided by an embodiment of the present disclosure.
  • FIG. 8 is a schematic structural diagram of a heat sink provided by an embodiment of the present disclosure from another perspective;
  • FIG. 9 is a schematic layout diagram of each pin according to an embodiment of the present disclosure.
  • One of the core links of optical fiber communication is the mutual conversion of optical and electrical signals.
  • Optical fiber communication uses information-carrying optical signals to transmit in information transmission equipment such as optical fibers/optical waveguides.
  • the passive transmission characteristics of light in optical fibers/optical waveguides can realize low-cost, low-loss information transmission; while computers and other information processing equipment Electrical signals are used.
  • the optical module realizes the mutual conversion function of the above-mentioned optical and electrical signals in the technical field of optical fiber communication, and the mutual conversion of the optical signal and the electrical signal is the core function of the optical module.
  • the optical module realizes the electrical connection with the external host computer through the gold finger on its internal circuit board.
  • the main electrical connections include power supply, I2C signal, data information and grounding, etc.
  • the electrical connection realized by the gold finger has become the optical module.
  • the mainstream connection method of the industry based on this, the definition of pins on the gold finger has formed a variety of industry protocols/norms.
  • FIG. 1 is a schematic diagram of a connection relationship of an optical communication terminal.
  • the connection of the optical communication terminal mainly includes the interconnection between the optical network terminal 100 , the optical module 200 , the optical fiber 101 and the network cable 103 .
  • One end of the optical fiber 101 is connected to the remote server, and one end of the network cable 103 is connected to the local information processing device.
  • the connection between the local information processing device and the remote server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by The optical network terminal 100 with the optical module 200 is completed.
  • the optical port of the optical module 200 is externally connected to the optical fiber 101, and a two-way optical signal connection is established with the optical fiber 101;
  • the electrical port of the optical module 200 is externally connected to the optical network terminal 100, and a two-way electrical signal connection is established with the optical network terminal 100;
  • the optical module internally realizes the mutual conversion of optical signals and electrical signals, so as to establish an information connection between the optical fiber and the optical network terminal.
  • the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input into the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input into the optical fiber .
  • the optical network terminal has an optical module interface 102, which is used to access the optical module 200 and establish a two-way electrical signal connection with the optical module 200; Signal connection; the connection between the optical module 200 and the network cable 103 is established through the optical network terminal 100 .
  • the optical network terminal transmits the signal from the optical module to the network cable, and transmits the signal from the network cable to the optical module, and the optical network terminal serves as the upper computer of the optical module to monitor the operation of the optical module.
  • the remote server has established a two-way signal transmission channel with the local information processing equipment through optical fibers, optical modules, optical network terminals and network cables.
  • Common information processing equipment includes routers, switches, electronic computers, etc.; the optical network terminal is the host computer of the optical module, providing data signals to the optical module and receiving data signals from the optical module.
  • FIG. 2 is a schematic structural diagram of an optical network terminal.
  • the optical network terminal in the optical communication terminal of the foregoing embodiment will be described below with reference to FIG. 2; as shown in FIG. 2, the optical network terminal 100 includes a circuit board 105, and a cage 106 is provided on the surface of the circuit board 105;
  • the electrical connector is used to connect to the electrical port of the optical module such as gold finger;
  • the cage 106 is provided with a radiator 107 , and the radiator 107 has raised parts such as fins to increase the heat dissipation area.
  • the optical module 200 is inserted into the optical network terminal 100 , the electrical port of the optical module is inserted into the electrical connector inside the cage 106 , and the optical port of the optical module is connected to the optical fiber 101 .
  • the cage 106 is located on the circuit board, and the electrical connectors on the circuit board are wrapped in the cage, so that the interior of the cage is provided with electrical connectors; the optical module is inserted into the cage, the optical module is fixed by the cage, and the heat generated by the optical module is conducted to the cage. 106 and then diffuse through a heat sink 107 on the cage.
  • FIG. 3 is a schematic structural diagram of an optical module according to an embodiment of the present disclosure
  • FIG. 4 is a schematic structural diagram of an exploded structure of the optical module.
  • the optical module in the optical communication terminal of the foregoing embodiment will be described below with reference to FIG. 3 and FIG. 4 ; as shown in FIG. 3 and FIG.
  • the upper casing 201 is covered with the lower casing 202 to form a wrapping cavity with two openings; the outer contour of the wrapping cavity generally presents a square body.
  • the lower case 202 includes a main board and two side plates located on both sides of the main board and perpendicular to the main board; the upper case includes a cover plate, and the cover plate covers the two side plates of the upper case. the side plate to form a wrapping cavity; the upper shell can also include two side walls located on both sides of the cover plate and perpendicular to the cover plate, and the two side walls are combined with the two side plates to realize the upper shell 201 is closed on the lower case 202 .
  • One of the two openings is an electrical port 204, and the gold fingers of the circuit board protrude from the electrical port 204 and are inserted into a host computer such as an optical network terminal; the other opening is an optical port 205, which is used for external optical fiber access to connect
  • the optical transceiver assembly 400 inside the optical module; the circuit board 300, the optical transceiver assembly 400 and other optoelectronic devices are located in the package cavity.
  • the combination of the upper casing and the lower casing is adopted to facilitate the installation of the circuit board 300, the optical transceiver assembly 400 and other devices into the casing, and the upper casing and the lower casing form the outermost encapsulation protection casing of the module;
  • the upper casing and the lower casing are generally made of metal materials to achieve electromagnetic shielding and heat dissipation.
  • the casing of the optical module is not made into an integral part, so that when assembling circuit boards and other devices, positioning parts, heat dissipation and electromagnetic shielding parts It cannot be installed and is not conducive to production automation.
  • the unlocking part 203 is located on the outer wall of the enclosing cavity/lower casing 202, and is used to realize the fixed connection between the optical module and the upper computer, or to release the fixed connection between the optical module and the upper computer.
  • the unlocking part 203 has an engaging part matched with the cage of the upper computer; pulling the end of the unlocking part can make the unlocking part move relatively on the surface of the outer wall; the optical module is inserted into the cage of the upper computer, and the optical module is fixed by the engaging part of the unlocking part In the cage of the host computer; by pulling the unlocking part, the engaging part of the unlocking part moves along with it, thereby changing the connection relationship between the engaging part and the host computer, so as to release the engaging relationship between the optical module and the host computer, so that the optical The module is pulled out from the cage of the upper computer.
  • the circuit board 300 is provided with circuit traces, electronic components (such as capacitors, resistors, triodes, MOS tubes) and chips (such as MCU, laser driver chip, amplitude limiting amplifier chip, clock data recovery CDR, power management chip, data processing chip) DSP), etc.
  • electronic components such as capacitors, resistors, triodes, MOS tubes
  • chips such as MCU, laser driver chip, amplitude limiting amplifier chip, clock data recovery CDR, power management chip, data processing chip) DSP, etc.
  • the circuit board 300 connects the electrical components in the optical module together according to the circuit design through circuit wiring, so as to realize electrical functions such as power supply, electrical signal transmission, and grounding.
  • the circuit board is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the bearing function. For example, the rigid circuit board can carry the chip smoothly; when the optical transceiver components are located on the circuit board, the rigid circuit board can also provide Stable bearing; the rigid circuit board can also be inserted into the electrical connector in the upper computer cage.
  • metal pins/gold fingers are formed on the end surface of one side of the rigid circuit board for connecting with the electrical connector. Connector connections; these are inconvenient to implement with flexible circuit boards.
  • Flexible circuit boards are also used in some optical modules as a supplement to rigid circuit boards; flexible circuit boards are generally used in conjunction with rigid circuit boards.
  • flexible circuit boards can be used to connect the rigid circuit boards and optical transceiver components.
  • the optical transceiver assembly 400 includes two parts, an optical transmitting sub-module and an optical receiving sub-module, which are respectively used for transmitting and receiving optical signals.
  • the emission sub-module generally includes a light emitter, a lens and a light detector, and the lens and the light detector are located on different sides of the light emitter. The front and back sides of the light emitter emit light beams respectively.
  • the lens is used to converge the front of the light emitter.
  • the emitted light beam makes the light beam emitted by the light transmitter a convergent light so as to be easily coupled to an external optical fiber; the light detector is used to receive the light beam emitted from the reverse side of the light transmitter to detect the optical power of the light transmitter.
  • the light emitted by the optical transmitter enters the optical fiber after being condensed by the lens, and the light detector detects the luminous power of the optical transmitter to ensure the constancy of the emitted optical power of the optical transmitter.
  • the optical transceiver assembly 400 will be described in detail below.
  • FIG. 5 is a schematic diagram of the internal structure of an optical module provided by an embodiment of the present disclosure; as shown in FIG. 5 , the optical transceiver assembly 400 in the foregoing embodiment includes an optical transmitting sub-module 500 and an optical receiving sub-module 700, and the optical module further includes a circular The square tube body 600 and the optical fiber adapter 800.
  • the optical fiber adapter 800 is connected to the optical fiber, that is, the optical fiber adapter 800 is embedded on the round square tube body 600 for connecting the optical fiber.
  • the round tube body 600 is provided with a third nozzle 603 into which the optical fiber adapter 800 is inserted.
  • the sub-module 700 establishes an optical connection with the optical fiber adapter 800 respectively, and the light emitted and received by the optical transceiver assembly is transmitted through the same optical fiber in the optical fiber adapter, that is, the same optical fiber in the optical fiber adapter is the transmission of light in and out of the optical transceiver assembly.
  • the square tube body 600 is used to carry the light emitting sub-module 500 and the light receiving sub-module 700.
  • the round tube body 600 is made of metal material, which is beneficial to realize electromagnetic shielding and heat dissipation.
  • the round tube body 600 is provided with a first nozzle 601 and a second nozzle 602 , and the first nozzle 601 and the second nozzle 602 are respectively disposed on the adjacent side walls of the round tube body 600 .
  • the first orifice 601 is provided on the side wall of the circular square pipe body 600 in the length direction
  • the second nozzle 602 is provided on the side wall of the circular square pipe body 600 in the width direction.
  • the light-emitting sub-module 500 is embedded in the first nozzle 601, and through the first nozzle 601, the light-emitting sub-module 500 thermally contacts the round tube body 600;
  • the light-receiving sub-module 700 is embedded in the second nozzle 602, and passes through the second pipe The port 602 , the light receiving sub-module 700 thermally contacts the round tube body 600 .
  • the light-emitting sub-module 500 and the light-receiving sub-module 700 are directly press-fitted into the circular tube body 600, and the circular-square tube body 600 is in direct contact with the light-emitting sub-module 500 and the light-receiving sub-module 700, respectively or contact through a thermally conductive medium.
  • the round and square tube body can be used for the heat dissipation of the light emitting sub-module 500 and the light receiving sub-module 700 , so as to ensure the heat dissipation effect of the light emitting sub-module 500 and the light receiving sub-module 700 .
  • FIG. 6 is a schematic structural diagram of an optical emitting sub-module according to an embodiment of the present disclosure; the following describes the optical emitting sub-module in the optical transceiver assembly 400 in the foregoing embodiment with reference to FIG. 6 .
  • the light emitting sub-module 500 includes a metal tube base 501 through which the light emitting sub-module 500 is connected to the round tube body 600 .
  • the metal tube 501 is embedded in the first orifice 601 of the square tube body 600 .
  • the light emission sub-module 500 is packaged with coaxial TO, the light transmitter is a laser 502, and the light emission sub-module 500 further includes a light detector 503, a lens 504 and a heat sink 505.
  • the laser 502 and the light detector 503 are combined.
  • a lens 504 and other optoelectronic devices are placed on the surface of the metal socket 501 .
  • the laser 502 includes a laser chip and a laser ceramic heat sink, the laser chip is welded on the laser ceramic heat sink using gold-tin solder, and the laser ceramic heat sink is pasted on the side platform of the heat sink 505 using silver glue, which is used for emitting a signal beam.
  • DML Directly Modulated Laser
  • EML Electro-absorption Modulated Laser
  • EML is the electro-absorption modulator EAM
  • the integrated device of DFB laser is better than DML and consumes more power. Compared with DML, EML adds refrigerators, heat sinks, thermistors, etc.
  • the lens 504 is arranged above the laser 502, and the central axis of the lens 504 coincides with the central axis of the laser 502, and is used for converging the signal beam emitted by the laser 502, such as directly converging the signal beam emitted by the laser 502.
  • the beam is coupled into an external fiber.
  • the position of the lens 504 can be determined by the optical parameters of the lens such as the focal length and the position of the laser 502 .
  • the distance between the lens 504 and the light-emitting surface of the laser 502 can be the focal length of the lens 504 , and the lens can be determined according to the focal length of the lens 504 and the position of the laser 502 . 504, thereby securing the lens 504 over the laser 502.
  • the heat sink 505 is disposed on the top surface of the metal socket 501 .
  • the heat sink 505 can be directly fixed on the top surface of the metal socket 501 or indirectly fixed on the top surface of the metal socket 501 through other devices.
  • the heat sink 505 can be made of alloys, such as copper alloys, nickel alloys, etc., mainly for heat dissipation and bearing functions, such as for carrying the laser 502, the photodetector 503, the lens 504, etc. and assisting the laser 502, the photodetector 503, and the lens 504 heat dissipation.
  • 7 is a schematic structural diagram of a heat sink provided by an embodiment of the present disclosure, and FIG.
  • the heat sink 505 includes a first surface 505-1, a second surface 505-2, and a third surface 505-3.
  • the first surface 505-1 and the second surface 505-2 are located on the front surface of the heat sink 505, and the first surface 505-1 and the second surface 505-2 are opposite and intersect, and the third surface 505- 3 is located on the back of the heat sink 505, with the first surface 505-1 and the third surface 505-3 facing away.
  • the first surface 505-1 is perpendicular to the top surface of the metal socket 501
  • the second surface 505-2 is perpendicular to the metal socket 501
  • the top surface is nearly parallel.
  • the first surface 505-1, the second surface 505-2 and the third surface 505-3 of the heat sink 505 are the main bearing surfaces of the heat sink 505, and the first surface 505-1 and the second surface 505-2 of the heat sink 505 And the third surface 505-3 is used to carry the laser 502, the photodetector 503, the lens 504 and other devices.
  • the laser 502 is disposed on the first surface 505-1 of the heat sink 505, so that the laser beam generated by the laser 502 is along a vertical direction to the top surface of the metal stem 501 and away from the second surface 503- 2; thus, the lens 504 is also disposed on the first surface 505-1 of the heat sink 505.
  • the photodetector 503 is fixed to the surface of the heat sink 505 .
  • the light detector 503 is disposed at the backlight end of the laser 502, and is used to realize the backlight collection and feedback of the laser beam generated by the laser 502.
  • the light detector 503 is fixed to the second surface 505 - 2 of the heat sink 505 .
  • the photodetector 503 and the lens 504 are respectively located on different sides of the laser 502 .
  • both opposite sides of the laser 502 can emit light beams, and the front side of the laser 502 emits light beams whose main optical axis is perpendicular to the metal stem 501, and the light beams are converged through the lens 504; , the optical power of the light beam emitted from the back side of the laser 502 is detected by the light detector 503 , thereby detecting the size of the optical power of the light beam emitted from the front side of the laser 502 .
  • the laser 502 can be dynamically adjusted.
  • the optical detector 503 detects that the optical power becomes larger, the emitted optical power of the laser 502 becomes larger, which can be reduced by controlling the laser drive circuit.
  • the driving power applied to the laser makes the light of the laser 502 smaller; if the optical detector 503 detects that the optical power becomes smaller, the emitted light power of the laser 502 becomes smaller, and the driving current of the laser can be increased by controlling the laser driving circuit to make the laser 502 emit light.
  • the light emission of the laser 502 becomes smaller, thereby ensuring the constant emission power of the laser.
  • the light emitting sub-module 500 further includes a thermistor 506 and a TEC (thermoelectric cooler) 507 .
  • the thermistor 506 is disposed on the heat sink 505 to obtain the temperature of the heat sink 505 to monitor the working temperature of the laser 502 .
  • the TEC 507 is fixed on the top surface of the metal socket 501 , and the TEC 507 supports the heat sink 505 , that is, the heat sink 505 is fixed on the metal socket 501 through the TEC 507 .
  • one heat exchange surface of the TEC507 is directly attached to the metal socket 501, and the other heat exchange surface of the TEC507 is used to directly mount the heat sink 505, which ensures that the laser 502 and the TEC507 can be efficiently connected. heat transfer.
  • the temperature of the heat sink 505 is obtained through the thermistor 506, and the operation of the TEC 507 is controlled according to the temperature of the heat sink 505, thereby controlling the temperature of the laser 502 within the target temperature range.
  • the thermistor 506 is disposed on the third surface 505 - 3 of the heat sink 505 .
  • the light-emitting sub-module and the light-receiving sub-module in the embodiment of the present disclosure should be kept in an electrically isolated state. It is an insulating glue, so the light receiving sub-module 700 is in an electrically isolated state.
  • the metal casing of the optical module is connected with the optical fiber adapter 800 by laser welding, the optical fiber adapter 800 is connected with the circular square tube body 600 by laser welding, and the circular square tube body is welded and connected with the metal socket 501.
  • the metal casing, the optical fiber adapter 800, the circular The square tube body 600 and the metal tube base 501 are integral, and are electrically connected to each other.
  • the lasers, photodetectors and other devices need to be grounded;
  • the photodetector and other devices are connected to the metal socket, and the metal socket is connected to the grounding pin, so as to realize the grounding of the laser, etc.; however, this grounding method needs to connect the laser to the metal socket, because the metal socket is electrically If it is turned on, the laser, etc. and the metal casing are also electrically connected, and the light emitting sub-module at this time is not in an electrically isolated state.
  • the metal socket 501 is provided with a plurality of pins
  • FIG. 9 is a schematic diagram of the layout of each pin according to an embodiment of the present disclosure; as shown in FIG. 9 , the pins pass through the metal socket 501 and protrude on the surface of the metal socket 501 , and the pins are wrapped by glass to achieve insulation between the pins and the metal socket 501 .
  • several pins on the metal socket 501 are evenly distributed around the TEC 507 .
  • the metal socket 501 is provided with a ground pin 508a, a laser pin 508b, a photodetector pin 508c, a thermistor pin 508d and a TEC pin 508e.
  • the ground pin 508a passes through the ground pin
  • the through hole 509a penetrates from the bottom surface of the metal socket 501 to the top surface of the metal socket 501, and there is a gap between the ground pin 508a and the ground pin through hole 509a, and an insulating medium is arranged in the gap
  • the laser pin 508b passes through the laser
  • the pin through hole 509b penetrates from the bottom surface of the metal socket 501 to the top surface of the metal socket 501, and there is a gap between the laser pin 508b and the laser pin through hole 509b, and an insulating medium is arranged in the gap
  • the pin 508c penetrates from the bottom surface of the metal socket 501 to the top surface of the metal
  • An insulating medium is provided inside; the thermistor pin 508d penetrates from the bottom surface of the metal socket 501 to the top surface of the metal socket 501 through the thermistor pin through hole 509d, and the thermistor pin 508d is connected to the thermistor tube. There is a gap between the through holes 509d, and an insulating medium is arranged in the gap; the TEC pin 508e penetrates from the bottom surface of the metal socket 501 to the top surface of the metal socket 501 through the TEC pin through hole 509e, and the TEC pin 508e is connected to the top surface of the metal socket 501.
  • the insulating medium may be glass or ceramics; by filling the insulating medium in the gap, the insulating medium is used to connect each pin with the metal
  • the socket 501 achieves electrical isolation.
  • each pin is electrically isolated from the metal socket 501, the negative electrode of the laser 502 is connected to the ground pin 508a by wire connection, the negative electrode of the photodetector 503 is connected to the ground pin 508a by wire connection, and one end of the thermistor 506 is connected to the ground pin 508a.
  • the grounding pin 508a is connected by wire, and the negative electrode of the TEC507 is connected with the grounding pin 508a.
  • the grounding terminals of the laser 502, the photodetector 503 and other devices are directly connected to the grounding pin, so as to avoid the electrical connection between the laser and the metal socket. If connected, the laser, etc. and the metal socket are in an electrically insulated state.
  • the laser pin 508b is connected to the positive electrode of the laser 502 through a gold wire
  • the photodetector pin 508c is connected to the positive electrode of the photodetector 503 through a gold wire
  • the thermistor pin 508d is connected to one end of the thermistor 506 through a gold wire.
  • the TEC pin 508e is connected to the positive electrode of the TEC through a gold wire.
  • the optical module provided by the present disclosure includes a metal casing, an optical fiber adapter, a circular square tube body, and a light emitting sub-module.
  • the optical emitting sub-module includes a metal socket; the metal casing is electrically connected to the optical fiber adapter, and the optical fiber adapter is electrically connected to the circular square tube body.
  • the round and square tube body is electrically connected to the metal tube base;
  • the metal tube base is provided with a laser, and the metal tube base is provided with a grounding pin and a grounding pin through hole, wherein the grounding pin passes through the grounding pin through hole from the metal tube
  • the bottom surface of the socket penetrates to the top surface of the metal socket, and there is a gap between the grounding pin and the grounding pin through hole, and an insulating medium is arranged in the gap; directly connecting the grounding end of the laser to the grounding pin can realize the grounding of the laser .
  • the metal casing, the optical fiber adapter, the round square tube body and the metal tube base of the optical module are integrated, and are in a state of electrical conduction with each other; this grounding method avoids the electrical connection between the laser and the metal tube base.
  • the laser and the metal socket are in an electrically insulated state. Since the metal shell, the optical fiber adapter, the round and square tube body and the metal socket are integrated, the laser and the metal shell are also in an electrically insulated state, thereby realizing the Electrical isolation of the light emitting sub-module from the metal casing of the optical module.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

本公开提供的光模块包括金属外壳、光纤适配器、圆方管体和光发射次模块，光发射次模块包括金属管座；金属外壳与光纤适配器电导通连接，光纤适配器与圆方管体电导通连接，圆方管体与金属管座电导通连接；金属管座上设置有激光器，金属管座上设有接地管脚和接地管脚通孔，且接地管脚与接地管脚通孔间设有空隙，空隙内设有绝缘介质；将激光器的接地端直接与接地管脚连接可以实现激光器的接地。该接地方式避免了激光器与金属管座的电气连接，即激光器与金属管座之间为电绝缘状态，由于金属外壳、光纤适配器、圆方管体与金属管座是共体的，因此激光器与金属外壳之间亦为电绝缘状态，进而实现了光发射次模块与光模块金属外壳的电隔离。

Description

一种光模块
本公开要求在2020年09月08日提交中国专利局、申请号为202021955658.5、专利名称为“一种光模块”的优先权，其全部内容通过引用结合在本公开中。
技术领域
本公开涉及光通信技术领域，尤其涉及一种光模块。
背景技术
光模块是实现光电信号相互转换的工具，是光通信设备中的关键器件之一。并且随着5G网络的快速发展，处于光通信核心位置的光模块得到了长足的发展。
发明内容
本公开实施例提供一种光模块，包括：金属外壳；光纤适配器，与金属外壳电导通连接；圆方管体，与光纤适配器电导通连接，设有管口；光发射次模块，包括金属管座，金属管座与圆方管体电导通连接；金属管座上设有接地管脚和接地管脚通孔，其中：接地管脚通过接地管脚通孔从金属管座的底面贯穿至金属管座的顶面，且接地管脚与接地管脚通孔间设有空隙，空隙内设有绝缘介质；金属管座上设有激光器，激光器的接地端与接地管脚连接。
附图说明
为了更清楚地说明本公开的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，对于本领域普通技术人员而言，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为光通信终端连接关系示意图；
图2为光网络终端结构示意图；
图3为本公开实施例提供的一种光模块的结构示意图；
图4为本公开实施例提供的一种光模块的分解结构示意图；
图5为本公开实施例提供的一种光模块的内部结构示意图；
图6为本公开实施例提供的一种光发射次模块的结构示意图；
图7为本公开实施例提供的热沉的结构示意图；
图8为本公开实施例提供的热沉的另一视角的结构示意图；
图9为本公开实施例提供的各管脚的布局示意图。
具体实施方式
为了使本技术领域的人员更好地理解本公开中的技术方案，下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例 仅仅是本公开一部分实施例，而不是全部实施例。基于本公开中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都应当属于本公开保护的范围。
光纤通信的核心环节之一是光、电信号的相互转换。光纤通信使用携带信息的光信号在光纤/光波导等信息传输设备中传输，利用光在光纤/光波导中的无源传输特性可以实现低成本、低损耗的信息传输；而计算机等信息处理设备使用的是电信号，为了在光纤/光波导等信息传输设备与计算机等信息处理设备之间建立信息连接，就需要实现电信号与光信号的相互转换。
光模块在光纤通信技术领域中实现上述光、电信号的相互转换功能，光信号与电信号的相互转换是光模块的核心功能。光模块通过其内部电路板上的金手指实现与外部上位机之间的电连接，主要的电连接包括供电、I2C信号、数据信息以及接地等；采用金手指实现的电连接方式已经成为光模块行业的主流连接方式，以此为基础，金手指上引脚的定义形成了多种行业协议/规范。
图1为光通信终端连接关系示意图。如图1所示，光通信终端的连接主要包括光网络终端100、光模块200、光纤101及网线103之间的相互连接。
光纤101的一端连接远端服务器，网线103的一端连接本地信息处理设备，本地信息处理设备与远端服务器的连接由光纤101与网线103的连接完成；而光纤101与网线103之间的连接由具有光模块200的光网络终端100完成。
光模块200的光口对外接入光纤101，与光纤101建立双向的光信号连接；光模块200的电口对外接入光网络终端100中，与光网络终端100建立双向的电信号连接；在光模块内部实现光信号与电信号的相互转换，从而实现在光纤与光网络终端之间建立信息连接。在本公开的某一些实施例中，来自光纤的光信号由光模块转换为电信号后输入至光网络终端100中，来自光网络终端100的电信号由光模块转换为光信号输入至光纤中。
光网络终端具有光模块接口102，用于接入光模块200，与光模块200建立双向的电信号连接；光网络终端具有网线接口104，用于接入网线103，与网线103建立双向的电信号连接；光模块200与网线103之间通过光网络终端100建立连接。在本公开的某一些实施例中，光网络终端将来自光模块的信号传递给网线，将来自网线的信号传递给光模块，光网络终端作为光模块的上位机监控光模块的工作。
至此，远端服务器通过光纤、光模块、光网络终端及网线，与本地信息处理设备之间建立双向的信号传递通道。
常见的信息处理设备包括路由器、交换机、电子计算机等；光网络终端是光模块的上位机，向光模块提供数据信号，并接收来自光模块的数据信号，常见的光模块上位机还有光线路终端等。
图2为光网络终端结构示意图。下面结合图2对前述实施例光通信终端中的光网络终端进行说明；如图2所示，光网络终端100包括电路板105，在电路板105的表面设置笼子106；在笼子106内部设置有电连接器，用于接入金手指等光模块电口；在笼子106上设置有散热器107，散热器107具有增大散热面积的翅片等凸起部。
光模块200插入光网络终端100中，光模块的电口插入笼子106内部的电连接器，光模块的光口与光纤101连接。
笼子106位于电路板上，将电路板上的电连接器包裹在笼子中，从而使笼子内部设置有电连接器；光模块插入笼子中，由笼子固定光模块，光模块产生的热量传导给笼子106，然后通过笼子上的散热器107进行扩散。
图3为本公开实施例提供的一种光模块结构示意图，图4为该光模块分解结构示意图。下面结合图3和图4对前述实施例光通信终端中的光模块进行说明；如图3、图4所示，本公开实施例提供的光模块200包括上壳体201、下壳体202、解锁部件203、电路板300及光收发组件400。
上壳体201盖合在下壳体202上，以形成具有两个开口的包裹腔体；包裹腔体的外轮廓一般呈现方形体。在本公开的某一些实施例中，下壳体202包括主板以及位于主板两侧、与主板垂直设置的两个侧板；上壳体包括盖板，盖板盖合在上壳体的两个侧板上，以形成包裹腔体；上壳体还可以包括位于盖板两侧、与盖板垂直设置的两个侧壁，由两个侧壁与两个侧板结合，以实现上壳体201盖合在下壳体202上。
两个开口中的其中一个开口为电口204，电路板的金手指从电口204伸出，插入光网络终端等上位机中；另一个开口为光口205，用于外部光纤接入以连接光模块内部的光收发组件400；电路板300、光收发组件400等光电器件位于包裹腔体中。
采用上壳体、下壳体结合的装配方式，便于将电路板300、光收发组件400等器件安装到壳体中，由上壳体、下壳体形成模块最外层的封装保护壳体；上壳体及下壳体一般采用金属材料，以实现电磁屏蔽以及散热，一般不会将光模块的壳体做成一体部件，这样在装配电路板等器件时，定位部件、散热以及电磁屏蔽部件无法安装，也不利于生产自动化。
解锁部件203位于包裹腔体/下壳体202的外壁，用于实现光模块与上位机之间的固定连接，或解除光模块与上位机之间的固定连接。
解锁部件203具有与上位机笼子匹配的卡合部件；拉动解锁部件的末端可以使解锁部件在外壁的表面相对移动；光模块插入上位机的笼子里，由解锁部件的卡合部件将光模块固定在上位机的笼子里；通过拉动解锁部件，解锁部件的卡合部件随之移动，进而改变卡合部件与上位机的连接关系，以解除光模块与上位机的卡合关系，从而可以将光模块从上位机的笼子里抽出。
电路板300上设置有电路走线、电子元件(如电容、电阻、三极管、MOS管)及芯片(如MCU、激光驱动芯片、限幅放大芯片、时钟数据恢复CDR、电源管理芯片、数据处理芯片DSP)等。
电路板300通过电路走线将光模块中的用电器件按照电路设计连接在一起，以实现供电、电信号传输及接地等电功能。
电路板一般为硬性电路板，硬性电路板由于其相对坚硬的材质，还可以实现承载作用，如硬性电路板可以平稳的承载芯片；当光收发组件位于电路板上时，硬性电路板也可以提供平稳的承载；硬性电路板还可以插入上位机笼子中的电连接器中，在本公开的某一些实施例中，在硬性电路板一侧末端表面形成金属引脚/金手指，用于与电连接器连接；这些都 是柔性电路板不便于实现的。
部分光模块中也会使用柔性电路板，作为硬性电路板的补充；柔性电路板一般与硬性电路板配合使用，如硬性电路板与光收发组件之间可以采用柔性电路板连接。
光收发组件400包括光发射次模块及光接收次模块两部分，分别用于实现光信号的发射与光信号的接收。发射次模块一般包括光发射器、透镜与光探测器，且透镜与光探测器分别位于光发射器的不同侧，光发射器的正反两侧分别发射光束，透镜用于会聚光发射器正面发射的光束，使得光发射器射出的光束为会聚光，以方便耦合至外部光纤；光探测器用于接收光发射器反面发射的光束，以检测光发射器的光功率。在本公开的某一些实施例中，光发射器发出的光经透镜会聚后进入光纤中，同时光探测器检测光发射器的发光功率，以保证光发射器发射光功率的恒定性。下面对光收发组件400进行具体说明。
图5为本公开实施例提供的一种光模块的内部结构示意图；如图5所示，前述实施例中的光收发组件400包括光发射次模块500和光接收次模块700，光模块还包括圆方管体600、光纤适配器800，在本公开的某一些实施例中光纤适配器800连接光纤，即光纤适配器800镶嵌在圆方管体600上，用于连接光纤。在本公开的某一些实施例中，圆方管体600上设置有供所述光纤适配器800插入的第三管口603，光纤适配器800镶嵌入第三管口603，光发射次模块500和光接收次模块700分别与光纤适配器800建立光连接，光收发组件发出的光及接收的光均经由光纤适配器中的同一根光纤进行传输，即光纤适配器中的同一根光纤是光收发组件进出光的传输通道，光收发组件实现单纤双向的光传输模式。
圆方管体600用于承载光发射次模块500和光接收次模块700，在本公开实施例中，圆方管体600采用金属材料，利于实现电磁屏蔽及散热。圆方管体600上设置有第一管口601、第二管口602，第一管口601和第二管口602分别设置在圆方管体600相邻的侧壁上。在本公开的某一些实施例中的，第一管口601设置在圆方管体600长度方向的侧壁上，第二管口602设置在圆方管体600宽度方向的侧壁上。
光发射次模块500镶嵌入第一管口601，通过第一管口601，光发射次模块500导热接触圆方管体600；光接收次模块700镶嵌入第二管口602，通过第二管口602，光接收次模块700导热接触圆方管体600。在本公开的某一些实施例中，光发射次模块500和光接收次模块700直接压配到圆方管体600中，圆方管体600分别与光发射次模块500和光接收次模块700直接接触或通过导热介质接触。如此圆方管体可用于光发射次模块500和光接收次模块700的散热，保证光发射次模块500和光接收次模块700的散热效果。
图6为本公开实施例提供的一种光发射次模块的结构示意图；下面结合图6对前述实施例中光收发组件400中的光发射次模块进行说明。如图6所示，光发射次模块500包括金属管座501，通过金属管座501将光发射次模块500与圆方管体600连接，在本公开的某一些实施例中，将金属管座501嵌设于圆方管体600的第一管口601内。光发射次模块500采用同轴TO封装，光发射器为激光器502，光发射次模块500还包括光探测器503、透镜504及热沉505，本公开实施例中将激光器502、光探测器503、透镜504等光电器件放置在金属管座501的表面。
激光器502包括激光器芯片与激光器陶瓷热沉，激光器芯片使用金锡焊料焊接在激光 器陶瓷热沉上，激光器陶瓷热沉使用银胶粘贴于热沉505的侧面平台上，其用于发射信号光束。光模块的激光器目前有两种类型，一种是DML(Directly Modulated Laser，直调激光器)，另一种是EML(Electlro-absorption Modulated Laser，电吸收调制激光器)，EML为电吸收调制器EAM与DFB激光器的集成器件，比DML的效果要好，功耗也大。相比于DML，EML增加了制冷器、热沉、热敏电阻等。
透镜504设置于激光器502的上方，透镜504的中心轴线与激光器502的中心轴线相重合，用于对激光器502发射的信号光束进行会聚，如直接对激光器502发射的信号光束进行会聚，会聚后的光束耦合至外部光纤中。透镜504的位置可由透镜的光学参数如焦距及激光器502的位置而决定，如透镜504与激光器502发光面的距离可为透镜504的焦距，可根据透镜504的焦距与激光器502的位置来确定透镜504的位置，从而将透镜504固定于激光器502的上方。
热沉505设置于金属管座501的顶面，热沉505可直接固定于金属管座501的顶面，也可通过其他器件而间接固定于金属管座501的顶面。热沉505可由合金制成，如铜合金、镍合金等，主要起散热和承载作用，如用于承载激光器502、光探测器503、透镜504等并辅助激光器502、光探测器503、透镜504散热。图7为本公开实施例提供的热沉的结构示意图，图8为本公开实施例提供的热沉的另一视角的结构示意图；下面结合图7和图8对前述实施例中光发射次模块500中的热沉进行说明。如图7和图8所示，热沉505包括第一表面505-1、第二表面505-2和第三表面505-3。在本公开实施例中，第一表面505-1和第二表面505-2位于热沉505的正面，且第一表面505-1和第二表面505-2相对且相交，第三表面505-3位于热沉505的背面，第一表面505-1和第三表面505-3相背。在本公开的某一些实施例中，当热沉505设置于金属管座501上时，第一表面505-1与金属管座501的顶面垂直，第二表面505-2与金属管座501的顶面接近于平行。
热沉505的第一表面505-1、第二表面505-2和第三表面505-3为热沉505的主要承载面，热沉505的第一表面505-1、第二表面505-2和第三表面505-3用于承载激光器502、光探测器503、透镜504等器件。在本公开的某一些实施例中，激光器502设置于热沉505的第一表面505-1上，从而激光器502产生的激光束沿垂直于金属管座501的顶面并背离第二表面503-2的方向传输；如此，透镜504同样设置于热沉505的第一表面505-1上。
在本公开实施中，光探测器503固定于热沉505的表面。在本公开的某一些实施例中，光探测器503设置于激光器502的背光端，用于实现激光器502产生激光束的背光采集与反馈。在本公开的某一些实施例中，光探测器503固定于热沉505的第二表面505-2。光探测器503与透镜504分别位于激光器502的不同侧，透镜504位于激光器502正面发射光束的光路上，光探测器503位于激光器502背面发射光束的光路上。也就是说，激光器502相对的两侧均能发射光束，激光器502的正面发射主光轴垂直于金属管座501的光束，光束经由透镜504进行会聚；激光器502的背面发射光束进入光探测器503，通过光探测器503来检测激光器502背面发射光束的光功率，由此来检测激光器502正面发射光束的光功率大小。检测到激光器502正面发射光束的光功率大小后，可对激光器502进行动态调节，如光探测器503检测到光功率变大，则激光器502发射光功率变大，可通过控制激 光器驱动电路减小加给激光器的驱动电力，来使激光器502发光变小；如光探测器503检测到光功率变小，则激光器502发射光功率变小，可通过控制激光器驱动电路增加激光器的驱动电流，来使激光器502发光变小，从而保证激光器发光功率的恒定。
在本公开实施例中，所述光发射次模块500还包括热敏电阻506和TEC(热电制冷器)507。热敏电阻506设置热沉505上，用于获取热沉505的温度进而实现对激光器502工作温度的监测。TEC507固定于金属管座501的顶面，且TEC507支撑热沉505，即热沉505通过TEC507固定在金属管座501上。在本公开实施例中，TEC507的一热交换面直接贴在金属管座501上，TEC507的另一热交换面用于直接贴装热沉505，保证了激光器502与TEC507之间能够进行高效的热传递。在本公开的某一些实施例中，通过热敏电阻506获取热沉505的温度，根据热沉505的温度控制TEC507的工作，进而将激光器502的温度控制在目标温度的范围内。如图8所示，在本公开实施例中，为准确的监测激光器502的温度，热敏电阻506设置在热沉505的第三表面505-3上。
随着光模块性能的提升，要求光模块内部的光器件与光模块的金属外壳之间保持电气隔离状态，能够有效改善传导发射、静电抗扰等性能。本公开实施例中的光发射次模块和光接收次模块应均保持电隔离状态，在本公开实施例中，光接收次模块700通过UV等固化胶固定在圆方管体600上，由于固化胶为绝缘胶，因此光接收次模块700处于电隔离状态。光模块的金属外壳与光纤适配器800激光焊接连接，光纤适配器800与圆方管体600激光焊接连接，圆方管体与金属管座501焊接连接，因此本公开中金属外壳、光纤适配器800、圆方管体600与金属管座501为共体的，彼此之间电气导通，为了保证激光器、光探测器等器件正常工作，需要将激光器、光探测器等器件接地连接；通常是将激光器、光探测器等器件与金属管座连接，金属管座与接地管脚连接，从而实现激光器等的接地；但是这种接地方式需要将激光器等与金属管座连接，由于金属管座与金属外壳电气导通，那么激光器等与金属外壳亦电气导通，则此时的光发射次模块并非电隔离状态。
如图6所示，金属管座501上设有多个管脚，图9为本公开实施例提供的各管脚的布局示意图；如图9所示，管脚穿过金属管座501并突出于金属管座501的表面，且管脚由玻璃包裹，以实现管脚与金属管座501之间的绝缘。在本公开实施例中，为方便各电子器件与相应的管脚相连接，金属管座501上的若干管脚均匀的分布于TEC507的四周。
如图9所示，金属管座501上设有接地管脚508a、激光器管脚508b、光探测器管脚508c、热敏电阻管脚508d和TEC管脚508e，对应地，金属管座501上还设有接地管脚通孔509a、激光器管脚通孔509b、光探测器管脚通孔509c、热敏电阻管脚通孔509d和TEC管脚通孔509e；接地管脚508a通过接地管脚通孔509a从金属管座501的底面贯穿至金属管座501的顶面，且接地管脚508a与接地管脚通孔509a间设有空隙，空隙内设有绝缘介质；激光器管脚508b通过激光器管脚通孔509b从金属管座501的底面贯穿至金属管座501的顶面，且激光器管脚508b与激光器管脚通孔509b间设有空隙，空隙内设有绝缘介质；光探测器管脚508c通过光探测器管脚通孔509c从金属管座501的底面贯穿至金属管座501的顶面，且光探测器管脚通孔509c与接地管脚通孔509a间设有空隙，空隙内设有绝缘介质；热敏电阻管脚508d通过热敏电阻管脚通孔509d从金属管座501的底面贯穿至金属管 座501的顶面，且热敏电阻管脚508d与热敏电阻管脚通孔509d间设有空隙，空隙内设有绝缘介质；TEC管脚508e通过TEC管脚通孔509e从金属管座501的底面贯穿至金属管座501的顶面，且TEC管脚508e与TEC管脚通孔509e间设有空隙，空隙内设有绝缘介质；在本公开实施例中，绝缘介质可以为玻璃或陶瓷；通过在空隙内填充绝缘介质，利用绝缘介质将各个管脚与金属管座501实现电气的隔离。
在各个管脚与金属管座501电气隔离的基础上，激光器502的负极与接地管脚508a打线连接，光探测器503的负极与接地管脚508a打线连接，热敏电阻506的一端与接地管脚508a打线连接，TEC507的负极与接地管脚508a打线连接，如此，激光器502、光探测器503等器件的接地端直接与接地管脚连接，避免激光器等与金属管座的电气连接，则激光器等与金属管座之间为电绝缘状态，由于金属外壳、光纤适配器、圆方管体与金属管座是共体的，因此激光器等与金属外壳之间亦为电绝缘状态，进而实现了光发射次模块与光模块金属外壳的电隔离。激光器管脚508b通过金线与激光器502的正极连接，光探测器管脚508c通过金线与光探测器503的正极连接，热敏电阻管脚508d通过金线与热敏电阻506的一端连接，TEC管脚508e通过金线与TEC的正极连接。
本公开提供的光模块包括金属外壳、光纤适配器、圆方管体和光发射次模块，光发射次模块包括金属管座；金属外壳与光纤适配器电导通连接，光纤适配器与圆方管体电导通连接，圆方管体与金属管座电导通连接；金属管座上设置有激光器，金属管座上设有接地管脚和接地管脚通孔，其中接地管脚通过接地管脚通孔从金属管座的底面贯穿至金属管座的顶面，且接地管脚与接地管脚通孔间设有空隙，空隙内设有绝缘介质；将激光器的接地端直接与接地管脚连接可以实现激光器的接地。本公开实施例中光模块的金属外壳、光纤适配器、圆方管体与金属管座是共体的，彼此之间处于电气导通的状态；该接地方式避免了激光器与金属管座的电气连接，则激光器与金属管座之间为电绝缘状态，由于金属外壳、光纤适配器、圆方管体与金属管座是共体的，因此激光器与金属外壳之间亦为电绝缘状态，进而实现了光发射次模块与光模块金属外壳的电隔离。
本公开旨在涵盖本公开的任何变型、用途或者适应性变化，这些变型、用途或者适应性变化遵循本公开的一般性原理并包括本公开未公开的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的，本公开的真正范围和精神由权利要求的内容指出。
以上所述的本公开实施方式并不构成对本公开保护范围的限定。

Claims (10)

  1. 一种光模块，包括：
    金属外壳；
    光纤适配器，与所述金属外壳电导通连接；
    圆方管体，与所述光纤适配器电导通连接，设有管口；
    光发射次模块，包括金属管座，所述金属管座通过所述管口与所述圆方管体电导通连接；
    所述金属管座上设有接地管脚和接地管脚通孔，其中：
    所述接地管脚通过所述接地管脚通孔从所述金属管座的底面贯穿至所述管座的顶面，且所述接地管脚与所述接地管脚通孔间设有空隙，所述空隙内设有绝缘介质；
    所述金属管座上设有激光器，所述激光器的接地端与所述接地管脚连接。
  2. 根据权利要求1所述的光模块，所述金属外壳与所述光纤适配器激光焊接连接，所述光纤适配器与所述圆方管体激光焊接连接，所述圆方管体与所述金属管座激光焊接连接。
  3. 根据权利要求1所述的光模块，所述光发射次模块还包括热沉，所述热沉设于所述金属管座的顶面；
    所述热沉包括第一表面、第二表面和第三表面，所述第一表面和所述第二表面相对且相交，所述第三表面位于所述热沉的背面，所述第一表面和所述第三表面相背；
    所述第一表面上设有所述激光器，所述第二表面上设有光探测器，所述第三表面上设有热敏电阻。
  4. 根据权利要求3所述的光模块，所述激光器的负极与所述接地管脚打线连接，所述光探测器的负极与所述接地管脚打线连接，所述热敏电阻的一端与所述接地管脚打线连接。
  5. 根据权利要求3所述的光模块，所述金属管座和所述热沉之间设有TEC，所述TEC的一热交换面与所述金属管座连接，另一热交换面与所述热沉连接；
    所述TEC的负极与所述接地管脚打线连接。
  6. 根据权利要求3所述的光模块，所述金属管座上还设有激光器管脚、光探测器管脚、热敏电阻管脚和TEC管脚，所述激光器管脚、光探测器管脚、热敏电阻管脚和TEC管脚分别与所述激光器的正极、所述光探测器的正极、所述热敏电阻的另一端和所述TEC的正极连接。
  7. 根据权利要求6所述的光模块，所述金属管座上还设有激光器管脚通孔、光探测器管脚通孔、热敏电阻管脚通孔和TEC管脚通孔；
    所述激光器管脚、光探测器管脚、热敏电阻管脚和TEC管脚分别通过所述激光器管脚通孔、光探测器管脚通孔、热敏电阻管脚通孔和TEC管脚通孔从所述金属管座的底面贯穿至所述金属管座的顶面。
  8. 根据权利要求7所述的光模块，所述激光器管脚通孔、光探测器管脚通孔、热敏 电阻管脚通孔和TEC管脚通孔与所述金属管座之间均设有空隙，所述空隙内设有绝缘介质。
  9. 根据权利要求1所述的光模块，所述接地管脚突出所述金属管座的顶面。
  10. 根据权利要求5所述的光模块，其特征在于，所述激光器管脚、光探测器管脚、热敏电阻管脚和TEC管脚突出所述金属管座的顶面。
PCT/CN2021/115887 2020-09-08 2021-09-01 一种光模块 Ceased WO2022052842A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202021955658.5 2020-09-08
CN202021955658.5U CN213091954U (zh) 2020-09-08 2020-09-08 一种光模块

Publications (1)

Publication Number Publication Date
WO2022052842A1 true WO2022052842A1 (zh) 2022-03-17

Family

ID=75635815

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2021/115887 Ceased WO2022052842A1 (zh) 2020-09-08 2021-09-01 一种光模块

Country Status (2)

Country Link
CN (1) CN213091954U (zh)
WO (1) WO2022052842A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN213091954U (zh) * 2020-09-08 2021-04-30 青岛海信宽带多媒体技术有限公司 一种光模块
CN113721330B (zh) * 2021-08-31 2023-01-24 青岛海信宽带多媒体技术有限公司 一种高速激光器组件及光模块
CN115980944B (zh) * 2023-01-30 2025-01-10 青岛海信宽带多媒体技术有限公司 一种光模块

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107482470A (zh) * 2017-07-20 2017-12-15 广东格斯泰气密元件有限公司 5G通讯20GHz激光器双芯片封装基座及其制造方法
CN109818254A (zh) * 2019-03-28 2019-05-28 广东汉瑞通信科技有限公司 一种带光学透镜的905nm大功率激光器及封装工艺
CN210294612U (zh) * 2019-07-22 2020-04-10 青岛海信宽带多媒体技术有限公司 一种双芯片光发射器、光发射次模块及光模块
CN111239932A (zh) * 2020-03-13 2020-06-05 青岛海信宽带多媒体技术有限公司 一种光模块
CN213091954U (zh) * 2020-09-08 2021-04-30 青岛海信宽带多媒体技术有限公司 一种光模块

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107482470A (zh) * 2017-07-20 2017-12-15 广东格斯泰气密元件有限公司 5G通讯20GHz激光器双芯片封装基座及其制造方法
CN109818254A (zh) * 2019-03-28 2019-05-28 广东汉瑞通信科技有限公司 一种带光学透镜的905nm大功率激光器及封装工艺
CN210294612U (zh) * 2019-07-22 2020-04-10 青岛海信宽带多媒体技术有限公司 一种双芯片光发射器、光发射次模块及光模块
CN111239932A (zh) * 2020-03-13 2020-06-05 青岛海信宽带多媒体技术有限公司 一种光模块
CN213091954U (zh) * 2020-09-08 2021-04-30 青岛海信宽带多媒体技术有限公司 一种光模块

Also Published As

Publication number Publication date
CN213091954U (zh) 2021-04-30

Similar Documents

Publication Publication Date Title
CN211603627U (zh) 一种光模块
CN214795314U (zh) 一种光模块
US20220224073A1 (en) Optical module
CN214795313U (zh) 一种光模块
CN112398541B (zh) 一种光模块
WO2022052842A1 (zh) 一种光模块
CN213302589U (zh) 一种光模块
US20220337022A1 (en) Light Emission Assembly and an Optical Module
WO2022127072A1 (zh) 一种光模块
CN112558235B (zh) 光发射器及光模块
CN113009649B (zh) 一种光模块
CN210775925U (zh) 光发射器及光模块
CN113659441B (zh) 一种激光器组件及光模块
CN115079351B (zh) 一种光模块
CN214278492U (zh) 一种光模块
WO2022016932A1 (zh) 一种光模块
WO2021244101A1 (zh) 一种光模块
CN216248434U (zh) 一种光发射次模块及光模块
WO2022262551A1 (zh) 一种光模块
CN114637079B (zh) 一种光模块
CN214474114U (zh) 一种光模块
CN117751311A (zh) 光模块
WO2022111034A1 (zh) 一种光模块
CN210775926U (zh) 光发射器及光模块
CN217693343U (zh) 一种光模块

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21865897

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21865897

Country of ref document: EP

Kind code of ref document: A1