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WO2021205759A1 - Alliage de soudure, poudre de soudure, pâte de soudure, globule de soudure, préforme de soudure et joint de soudure - Google Patents

Alliage de soudure, poudre de soudure, pâte de soudure, globule de soudure, préforme de soudure et joint de soudure Download PDF

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Publication number
WO2021205759A1
WO2021205759A1 PCT/JP2021/006437 JP2021006437W WO2021205759A1 WO 2021205759 A1 WO2021205759 A1 WO 2021205759A1 JP 2021006437 W JP2021006437 W JP 2021006437W WO 2021205759 A1 WO2021205759 A1 WO 2021205759A1
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WIPO (PCT)
Prior art keywords
less
mass
solder
ppm
mass ppm
Prior art date
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PCT/JP2021/006437
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English (en)
Japanese (ja)
Inventor
浩由 川▲崎▼
正人 白鳥
勇司 川又
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Senju Metal Industry Co Ltd
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Senju Metal Industry Co Ltd
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Application filed by Senju Metal Industry Co Ltd filed Critical Senju Metal Industry Co Ltd
Priority to CN202180041140.1A priority Critical patent/CN115916453B/zh
Priority to KR1020227035027A priority patent/KR102557835B1/ko
Publication of WO2021205759A1 publication Critical patent/WO2021205759A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin

Definitions

  • the present invention relates to solder alloys, solder powders, solder pastes, solder balls, solder preforms and solder joints.
  • the present application claims priority based on Japanese Patent Application No. 2020-070927 filed in Japan on April 10, 2020, the contents of which are incorporated herein by reference.
  • Electronic components mounted on printed circuit boards are increasingly required to be smaller and have higher performance.
  • Examples of such electronic components include semiconductor packages.
  • a semiconductor package a semiconductor element having electrodes is sealed with a resin component. Solder bumps made of a solder material are formed on this electrode. Further, the solder material connects the semiconductor element and the printed circuit board.
  • solder materials In solder materials, the effect of ⁇ rays on soft errors becomes a problem. In order to reduce such adverse effects on the operation of semiconductor devices, low ⁇ -dose materials including solder materials are being developed.
  • the factor that becomes the ⁇ -ray source is, for example, a trace amount of radioactive elements contained in the solder alloy in the solder material, particularly the base tin (Sn) bullion.
  • the solder alloy can be produced by melting and mixing the raw material metals. In such a solder alloy, it is important to remove upstream radioactive elements such as uranium (U), thorium (Th), and polonium (Po) from the alloy composition in order to design a low ⁇ -dose material. On the other hand, it is not technically difficult to remove U, Th, and Po in the refining of Sn bullion (see, for example, Patent Document 1). Generally, Sn contains lead (Pb) and bismuth (Bi) as impurities.
  • Radioisotopes 210 Pb and 210 Bi in Pb and Bi are ⁇ -decayed to 210 Po, 210 Po is ⁇ -decayed, and ⁇ rays are generated when 206 Pb is generated.
  • This series of decay (uranium series) is said to be the main cause of ⁇ -ray generation from solder materials.
  • Cph / cm 2 is often used as the unit.
  • Cph / cm 2 is an abbreviation for “counts per hours / cm 2 ” and means the number of alpha rays counted per 1 cm 2 per hour.
  • the half-lives of Pb and Bi are as follows.
  • the half-life of 210 Bi is about 5 days.
  • the half-life of 210 Pb is about 22.3 years.
  • the degree of influence (abundance ratio) can be expressed by the following equation (see Non-Patent Document 1). That is, the influence of Bi on ⁇ -ray generation is much lower than that of Pb.
  • [ 210 Bi] represents the molar concentration of 210 Bi.
  • [ 210 Pb] represents the molar concentration of 210 Pb.
  • the ⁇ dose generated from the solder material basically increases with the passage of time. It is said that this is because radioactive Pb and radioactive Bi in the solder alloy are ⁇ -decayed to increase the amount of Po, and Po is ⁇ -decayed to generate ⁇ rays. Although the material having an extremely low ⁇ -dose contains almost no of these radioactive elements, the ⁇ -dose may increase with time due to the segregation of 210 Po. 210 Po originally emits ⁇ rays, but when the solder alloy is solidified, it segregates at the center of the solder alloy, so that the emitted ⁇ rays are shielded by the solder alloy. Then, with the passage of time, 210 Po is uniformly dispersed in the alloy and is also present on the surface where ⁇ rays are detected, so that the ⁇ dose increases with time (see Non-Patent Document 2).
  • the generated ⁇ -dose increases due to the influence of a very small amount of impurities contained in the solder alloy. For this reason, in the design of low ⁇ -dose materials, it becomes difficult to simply add various elements as in the conventional manufacturing method of solder alloys.
  • a method of adding arsenic (As) to a solder alloy is known in order to suppress the increase in viscosity of the solder paste over time (see, for example, Patent Document 2).
  • Flow soldering is usually used as an operation for mounting such electronic components. Flow soldering is a method of soldering by bringing the solder jet surface of a solder bathtub into contact with a connecting surface of a printed circuit board.
  • Patent Document 3 discloses a solder alloy containing a predetermined amount of Fe and Ge in order to suppress Fe erosion of the solder bathtub in flow soldering.
  • solder alloy containing Sn as a main component such as the solder alloy described in Patent Document 3, if a large amount of Fe is contained, acicular crystals derived from the SnFe compound may precipitate and the circuit may be short-circuited. be. Further, the solder alloy containing Sn as a main component may contain a large amount of nickel (Ni) in order to improve the wettability. If the Ni content is high, the SnCuNi compound may precipitate near the bonding interface of the solder alloy, and the mechanical strength of the solder joint may decrease.
  • Ni nickel
  • the present invention has been made in view of the above circumstances, suppresses an increase in the viscosity of the solder paste over time, is less likely to cause a short circuit in the circuit, enhances the mechanical strength of the solder joint, and has a soft error.
  • a solder alloy capable of suppressing generation a solder powder made of this solder alloy, a solder paste containing the solder powder and a flux, a solder ball made of this solder alloy, a solder preform and a solder joint. The purpose.
  • the present inventors have studied for the purpose of designing a low ⁇ -dose solder alloy capable of suppressing thickening of solder paste over time without adding As with impurities containing radioactive elements. Based on this study, Sn as a main component and a predetermined amount of Ni having a melting point of 1455 ° C. and Fe having a melting point of 1538 ° C., which are high melting point metals that are heated at a high temperature during refining or processing of the bare metal, are contained. It has been found that the above-mentioned object can be achieved by adopting an alloy composition such as that, and the present invention has been completed. That is, the present invention employs the following means in order to solve the above problems.
  • Ni and Fe each represent the content (mass ppm) in the alloy composition.
  • solder alloy according to any one of [8] to [11], wherein the alloy composition contains Ag: more than 0% by mass and 4% by mass or less.
  • the alloy composition contains at least one of Bi: 0% by mass or more and 0.3% by mass or less, and Sb: 0% by mass or more and 0.9% by mass or less [1] to [12].
  • the solder alloy according to [13] wherein the alloy composition satisfies the following formula (2). 0.03 ⁇ Bi + Sb ⁇ 1.2 (2)
  • Bi and Sb each represent the content (mass%) in the alloy composition.
  • the ⁇ -dose of a solder alloy sheet formed into a sheet having an area of 900 cm 2 on one surface after being heat-treated at 100 ° C. for 1 hour is 0.02 cf / cm 2 or less.
  • solder powder made of the solder alloy according to any one of [1] to [17].
  • the solder powder according to [18] which also has two or more types of solder alloy particle groups having different particle size distributions.
  • a solder alloy capable of suppressing an increase in the viscosity of solder paste over time, making it difficult for a circuit to short-circuit, increasing the mechanical strength of a solder joint, and suppressing the occurrence of soft errors.
  • a solder powder made of this solder alloy, a solder paste containing the solder powder and a flux, a solder ball made of this solder alloy, a solder preform and a solder joint can be provided.
  • ppb relating to the solder alloy composition is “mass ppb” unless otherwise specified.
  • Ppm is “mass ppm” unless otherwise specified.
  • % Is “mass%” unless otherwise specified.
  • solder alloy The solder alloy according to one aspect of the present invention has U: less than 5 mass ppb, Th: less than 5 mass ppb, Pb: less than 5 mass ppm, As: less than 5 mass ppm, Ni: 0 mass ppm or more and 600 mass ppm or less, And Fe: having an alloy composition of 0 mass ppm or more and 100 mass ppm or less, and the balance consisting of Sn, satisfying the following formula (1), and having an ⁇ dose of 0.02 cph / cm 2 or less. 20 ⁇ Ni + Fe ⁇ 700 (1) In the formula (1), Ni and Fe each represent the content (mass ppm) in the alloy composition.
  • the solder alloy of the present embodiment has U: less than 5 mass ppb, Th: less than 5 mass ppb, Pb: less than 5 mass ppm, As: less than 5 mass ppm, Ni: 0 mass ppm or more and 600 mass ppm or less, and Fe: It has an alloy composition of 0 mass ppm or more and 100 mass ppm or less, and the balance is Sn, and satisfies the above formula (1).
  • U and Th are radioactive elements.
  • the contents of U and Th in the solder alloy are based on the total mass (100% by mass) of the solder alloy from the viewpoint that the ⁇ dose generated from the solder alloy is 0.02 cf / cm 2 or less. , Each less than 5 ppb. From the viewpoint of suppressing the occurrence of soft errors in high-density mounting, the contents of U and Th are preferably 2 ppb or less, and the lower the better.
  • ⁇ Pb: less than 5 mass ppm Sn contains Pb as an impurity.
  • the radioactive isotope in this Pb undergoes ⁇ -decay to become 210 Po, and 210 Po undergoes ⁇ -decay to generate ⁇ -rays when 206 Pb is generated.
  • the content of Pb, which is an impurity, in the solder alloy is as small as possible.
  • the content of Pb in the solder alloy is less than 5 ppm, preferably less than 2 ppm, and more preferably less than 1 ppm with respect to the total mass (100% by mass) of the solder alloy.
  • the lower limit of the Pb content in the solder alloy may be 0 ppm or more.
  • ⁇ As less than 5 mass ppm ⁇ Adding As to the solder alloy is effective in suppressing the thickening of the solder paste over time, but with the addition of As, the alloy also contains radioactive elements, and the ⁇ dose generated from the solder material increases. It will increase.
  • An object of the present embodiment is to suppress thickening of the solder paste over time without adding As with impurities containing radioactive elements.
  • the content of As in the solder alloy is less than 5 ppm, preferably less than 2 ppm, and more preferably less than 1 ppm with respect to the total mass (100% by mass) of the solder alloy.
  • the lower limit of the As content in the solder alloy may be 0 ppm or more.
  • Ni 0 mass ppm or more and 600 mass ppm or less
  • Ni is an element that suppresses the formation of Sn-containing intermetallic compounds at the bonding interface.
  • the solder alloy contains Ni
  • the formation of the Sn-containing intermetallic compound is suppressed, and the mechanical strength of the solder joint is maintained.
  • the content of Ni in the solder alloy exceeds 600 ppm, SnNi compounds may precipitate in the vicinity of the bonding interface in the solder alloy, and the mechanical strength of the solder joint may deteriorate.
  • the content of Ni in the solder alloy is 0 ppm or more and 600 ppm or less, preferably more than 0 ppm and 600 ppm or less, and more preferably 20 ppm or more, based on the total mass (100% by mass) of the solder alloy. It is 600 ppm or less, more preferably 40 ppm or more and 600 ppm or less.
  • Fe 0 mass ppm or more and 100 mass ppm or less Fe is an element that suppresses the formation of Sn-containing intermetallic compounds at the bonding interface, similar to Ni. In addition, within a predetermined content range, precipitation of acicular crystals due to the SnFe compound is suppressed, and a short circuit of the circuit can be prevented.
  • the term "acicular crystal” as used herein refers to a crystal derived from one SnFe compound having an aspect ratio of 2 or more, which is the ratio of the major axis to the minor axis.
  • the content of Fe in the solder alloy is 0 ppm or more and 100 ppm or less, preferably more than 0 ppm and 100 ppm or less, and more preferably 20 ppm or more, based on the total mass (100% by mass) of the solder alloy. It is 100 ppm or less, more preferably 40 ppm or more and 80 ppm or less.
  • the alloy composition of the solder alloy of the present embodiment satisfies the following equation (1). 20 ⁇ Ni + Fe ⁇ 700 (1)
  • Ni and Fe each represent the content (mass ppm) in the alloy composition.
  • Both Ni and Fe in the formula (1) are elements that suppress the formation of Sn-containing intermetallic compounds at the bonding interface.
  • both Ni and Fe also contribute to the effect of suppressing the thickening of the solder paste over time.
  • the total content of Ni and Fe in the solder alloy is the total mass of the solder alloy. It is necessary to be 20 ppm or more and 700 ppm or less with respect to (100% by mass).
  • the total content of Ni and Fe is preferably 40 ppm or more and 700 ppm or less, more preferably 40 ppm or more and 600 ppm or less, and most preferably 40 ppm or more and 200 ppm or less.
  • the total content of Ni and Fe is the content of Fe when the content of Ni in the solder alloy is 0 ppm, and the content of Fe in the solder alloy is 0 ppm. Is the content of Ni, and when both Ni and Fe are present, the total content of these is obtained.
  • the ratio of Ni and Fe in the solder alloy is preferably 0.4 or more and 30 or less as the mass ratio represented by Ni / Fe, and more. It is preferably 0.4 or more and 10 or less, more preferably 0.4 or more and 5 or less, and particularly preferably 0.4 or more and 2 or less. If the mass ratio of Ni / Fe is in the above-mentioned preferable range, the effect of the present invention can be more easily obtained.
  • the alloy composition of the solder alloy of the present embodiment may contain elements other than the above-mentioned elements, if necessary.
  • elements other than the above-mentioned elements, if necessary.
  • at least one of Ag: 0% by mass or more and 4% by mass or less and Cu: 0% by mass or more and 0.9% by mass or less is further added. It may be contained.
  • Ag 0% by mass or more and 4% by mass or less
  • Ag is an arbitrary element capable of forming Ag 3 Sn at the crystal interface to improve the reliability of the solder alloy.
  • Ag is an element whose ionization tendency is noble with respect to Sn, and when it coexists with Ni and Fe, it enhances the effect of suppressing thickening of the solder paste over time.
  • the Ag content in the solder alloy is within the above range, an increase in the melting point of the alloy can be suppressed, so that it is not necessary to raise the reflow temperature excessively.
  • the content of Ag in the solder alloy is preferably 0% or more and 4% or less, more preferably more than 0% and 4% or less, based on the total mass (100% by mass) of the solder alloy. It is more preferably 0.5% or more and 3.5% or less, particularly preferably 1.0% or more and 3.0% or less, and most preferably 2.0% or more and 3.0% or less.
  • Cu 0% by mass or more and 0.9% by mass or less
  • Cu is an optional element that is used in general solder alloys and can improve the joint strength of solder joints. Further, Cu is an element whose ionization tendency is noble with respect to Sn, and when it coexists with Ni and Fe, the effect of suppressing the thickening of the solder paste over time is enhanced.
  • the content of Cu in the solder alloy is preferably 0% or more and 0.9% or less, more preferably more than 0% and 0.9% with respect to the total mass (100% by mass) of the solder alloy. It is less than or equal to, more preferably 0.1% or more and 0.8% or less, and particularly preferably 0.2% or more and 0.7% or less.
  • the ratio of Cu and Ni in the solder alloy is preferably 8 or more and 175 or less, and more preferably 10 or more as the mass ratio represented by Cu / Ni. It is 150 or less. If the mass ratio of Cu / Ni is in the above-mentioned preferable range, the effect of the present invention can be more easily obtained.
  • the ratio of Cu and Fe in the solder alloy is preferably 50 or more and 350 or less, more preferably 70 or more, as the mass ratio represented by Cu / Fe. It is 250 or less. If the Cu / Fe in such a mass ratio is in the above-mentioned preferable range, the effect of the present invention can be more easily obtained.
  • the ratio of Cu, Ni, and Fe in the solder alloy is preferably 7 or more and 350 or less as the mass ratio represented by Cu / (Ni + Fe). , More preferably 10 or more and 250 or less. If the mass ratio of Cu / (Ni + Fe) is in the above-mentioned preferable range, the effect of the present invention can be more easily obtained.
  • solder alloy In one embodiment of the solder alloy, U: less than 5 mass ppb, Th: less than 5 mass ppb, Pb: less than 5 mass ppm, As: less than 5 mass ppm, Ni: 0 mass ppm or more and 600 mass ppm or less, and Fe. : It may have an alloy composition of more than 0 mass ppm and 100 mass ppm or less and the balance of Sn, satisfying the above equation (1), and having an ⁇ dose of 0.02 cph / cm 2 or less.
  • the alloy composition of this solder alloy may further contain at least one of Ag: 0% by mass or more and 4% by mass or less, and Cu: 0% by mass or more and 0.9% by mass or less.
  • solder alloy U: less than 5 mass ppb, Th: less than 5 mass ppb, Pb: less than 5 mass ppm, As: less than 5 mass ppm, Ni: more than 0 mass ppm and 600 mass ppm or less, And Fe: at least one of more than 0% by mass and 100% by mass or less, Ag: more than 0% by mass and 4% by mass or less, and Cu: more than 0% by mass and 0.9% by mass or less, and the balance is Sn. It may have a composition, satisfy the above formula (1), and have an ⁇ dose of 0.02 cf / cm 2 or less. Further, the alloy composition in this solder alloy may be such that the ratio of Ni to Fe is 0.4 or more and 30 or less as the mass ratio represented by Ni / Fe.
  • solder alloy U: less than 5 mass ppb, Th: less than 5 mass ppb, Pb: less than 5 mass ppm, As: less than 5 mass ppm, Ni: more than 0 mass ppm and 600 mass ppm or less, And Fe: 0% by mass or more and 100% by mass or less, Cu: more than 0% by mass and 0.9% by mass or less, and the balance is Sn.
  • the ratio with Ni may be 8 or more and 175 or less as a mass ratio represented by Cu / Ni, and the ⁇ dose may be 0.02 cf / cm 2 or less.
  • the alloy composition in this solder alloy may be such that the ratio of Ni to Fe is 0.4 or more and 30 or less as the mass ratio represented by Ni / Fe.
  • the alloy composition may further contain Ag: more than 0% by mass and 4% by mass or less.
  • solder alloy U: less than 5 mass ppb, Th: less than 5 mass ppb, Pb: less than 5 mass ppm, As: less than 5 mass ppm, Ni: 0 mass ppm or more and 600 mass ppm or less, And Fe: 0% by mass or more and 100% by mass or less, Cu: more than 0% by mass and 0.9% by mass or less, and the balance is Sn.
  • the ratio of Ni to Fe may be such that the mass ratio represented by Cu / (Ni + Fe) is 7 or more and 350 or less, and the ⁇ dose is 0.02 cph / cm 2 or less.
  • the alloy composition in this solder alloy may be such that the ratio of Ni to Fe is 0.4 or more and 30 or less as the mass ratio represented by Ni / Fe.
  • the alloy composition may further contain Ag: more than 0% by mass and 4% by mass or less.
  • solder alloy U: less than 5 mass ppb, Th: less than 5 mass ppb, Pb: less than 5 mass ppm, As: less than 5 mass ppm, Ni: 0 mass ppm or more and 600 mass ppm or less, And Fe: more than 0% by mass and 100% by mass or less, Cu: more than 0% by mass and 0.9% by mass or less, and the balance is Sn.
  • the ratio to Fe may be 50 or more and 350 or less as a mass ratio expressed in Cu / Fe, and the ⁇ dose may be 0.02 cf / cm 2 or less.
  • the alloy composition in this solder alloy may be such that the ratio of Ni to Fe is 0.4 or more and 30 or less as the mass ratio represented by Ni / Fe.
  • the alloy composition may further contain Ag: more than 0% by mass and 4% by mass or less.
  • the alloy composition of the solder alloy of the present embodiment is, in addition to the above-mentioned elements, at least Bi: 0% by mass or more and 0.3% by mass or less, and Sb: 0% by mass or more and 0.9% by mass or less. It may contain one kind.
  • Bi 0% by mass or more and 0.3% by mass or less
  • Bi is an element that has low reactivity with flux and exhibits an effect of suppressing thickening of solder paste over time.
  • Bi is an element capable of suppressing deterioration of wettability because it lowers the liquidus temperature of the solder alloy and reduces the viscosity of the molten solder.
  • the Bi content in the solder alloy is preferably 0% or more and 0.3% or less, more preferably 0.0020% or more and 0.%, based on the total mass (100% by mass) of the solder alloy. It is 3% or less, more preferably 0.010% or more and 0.3% or less.
  • Sb 0% by mass or more and 0.9% by mass or less
  • Sb is an element that has low reactivity with flux and exhibits an effect of suppressing thickening of solder paste over time, like Bi. If the content of Sb in the solder alloy is too large, the wettability deteriorates. Therefore, when Sb is added, it is necessary to set the content to an appropriate level.
  • the content of Sb in the solder alloy is preferably 0% or more and 0.9% or less, more preferably 0.0020% or more and 0.%, based on the total mass (100% by mass) of the solder alloy. It is 9% or less, more preferably 0.010% or more and 0.9% or less.
  • the alloy composition of the solder alloy of the present embodiment further contains at least one of Bi: 0% by mass or more and 0.3% by mass or less and Sb: 0% by mass or more and 0.9% by mass or less
  • the alloy composition Preferably satisfies the following equation (2). 0.03 ⁇ Bi + Sb ⁇ 1.2 (2)
  • Bi and Sb each represent the content (mass%) in the alloy composition.
  • Both Bi and Sb in the formula (2) are elements that show the effect of suppressing the thickening of the solder paste over time.
  • both Bi and Sb also contribute to the wettability of the solder alloy.
  • the total content of Bi and Sb in the solder alloy is preferably 0.03% or more and 1.2% or less, more preferably 0.03% or more, based on the total mass (100% by mass) of the solder alloy. It is 0.9% or less, more preferably 0.3% or more and 0.9% or less.
  • total content of Bi and Sb is the content of Sb when the content of Bi in the solder alloy is 0%, and the content of Sb in the solder alloy is 0%. In some cases, it is the content of Bi, and in the case of having both Bi and Sb, it is the total content of these.
  • the ratio of Bi and Sb in the solder alloy is preferably 0.01 or more and 10 or less as the mass ratio represented by Sb / Bi, and more preferably. It is 0.1 or more and 5 or less. If the mass ratio of Sb / Bi is in the above-mentioned preferable range, the effect of the present invention can be more easily obtained.
  • the balance of the alloy composition of the solder alloy of the present embodiment is Sn.
  • unavoidable impurities may be contained. Even if it contains unavoidable impurities, it does not affect the above-mentioned effects.
  • the solder alloy of this embodiment has an ⁇ dose of 0.02 cf / cm 2 or less. This is an ⁇ -dose that does not cause soft errors in high-density mounting of electronic components.
  • the ⁇ dose in the solder alloy of the present embodiment is preferably 0.01 cf / cm 2 or less, more preferably 0.002 cf / cm 2 or less, from the viewpoint of suppressing soft errors in further high-density mounting. , More preferably 0.001 cf / cm 2 or less.
  • the ⁇ dose generated from the solder alloy can be measured as follows.
  • the method for measuring the ⁇ dose is based on the international standard JEDEC STANDARD.
  • a measurement sample a solder alloy sheet obtained by melting a solder alloy and forming a sheet having an area of 900 cm 2 on one surface is used.
  • the solder alloy sheet is installed as a measurement sample in the ⁇ -dosimetry device, and PR gas is purged therein.
  • PR gas For PR gas, use one that complies with the international standard JEDEC STANDARD. That is, it is assumed that the PR gas used for the measurement is the decay of radon (Rn) after 3 weeks or more have passed since the gas cylinder was filled with the mixed gas of 90% argon and 10% methane.
  • the solder alloy of the present embodiment can be produced, for example, by using a production method having a step of melting and mixing at least one of Ni and Fe and a raw material metal containing Sn. Since the purpose is to design a low ⁇ -dose solder alloy, it is preferable to use a low- ⁇ -dose material as the raw material metal. In addition, it is preferable to use the one from which U, Th and Pb have been removed.
  • a Sn produced according to the production method described in JP-A-2010-156502 (Patent Document 1) can be used.
  • the raw material metals Ni and Fe for example, those manufactured in accordance with Japanese Patent No. 5692467 can be used.
  • a conventionally known method can be used for the operation of melting and mixing the raw metal.
  • each constituent element constituting the solder alloy does not function independently, and various effects can be exhibited only when the contents of each constituent element are all within a predetermined range. ..
  • the solder alloy of the embodiment described above when the content of each constituent element is within the above range, the increase in viscosity of the solder paste over time is suppressed, the circuit is less likely to be short-circuited, and the solder joint machine.
  • the target strength can be increased and the occurrence of soft errors can be suppressed. That is, the solder alloy of the present embodiment is useful as a target low ⁇ -dose material, and by applying it to the formation of solder bumps around the memory, it is possible to suppress the occurrence of soft errors.
  • Another object of the present embodiment is to design a low ⁇ -dose solder alloy capable of suppressing thickening of solder paste over time without actively adding As.
  • the purpose is achieved by adopting a solder alloy containing Ni and Fe, which are refractory metals that are heated at a high temperature during refining or processing of the bare metal, in a specific ratio.
  • Sn for low ⁇ -dose solder alloys has a very high purity, and when the molten alloy is solidified, the crystal size of Sn becomes large. Further, the oxide film in Sn also forms a sparse oxide film corresponding to the oxide film.
  • the crystal size is reduced and a dense oxide film is formed, so that the reactivity between the alloy and the flux is suppressed, so that the solder paste can be used over time. It is possible to suppress thickening.
  • the ⁇ dose after heat treatment at 100 ° C. for 1 hour is applied to the solder alloy sheet formed into a sheet having an area of 900 cm 2 on one surface. It is preferably 0.02 cf / cm 2 or less, more preferably 0.01 cf / cm 2 or less, still more preferably 0.002 cf / cm 2 or less, and particularly preferably 0. It is 001 cph / cm 2 or less.
  • a solder alloy exhibiting such an ⁇ dose is useful because segregation of 210 Po is unlikely to occur in the alloy and the influence of changes in the ⁇ dose over time is small. By applying a solder alloy exhibiting such an ⁇ dose, the occurrence of soft errors is further suppressed, and stable operation of the semiconductor element can be more easily ensured.
  • solder powder The solder powder according to one aspect of the present invention is made of the above-mentioned solder alloy according to one aspect of the present invention.
  • the solder powder of this embodiment is suitable for the solder paste described later.
  • Solder powder is produced by known methods such as a dropping method of dropping a molten solder alloy to obtain particles, a spraying method of centrifugal spraying, an atomizing method, a submerged granulation method, and a method of crushing a bulk solder alloy. Can be adopted.
  • the dropping or spraying method the dropping or spraying is preferably carried out in an inert atmosphere or a solvent in order to form particles.
  • the solder powder of this embodiment is preferably a spherical powder.
  • the spherical powder improves the fluidity of the solder alloy.
  • the symbols 1 to 8 are satisfied, and the symbols 4 to 8 are satisfied in the powder size classification (Table 2) in JIS Z 3284-1: 2014. It is more preferable to have.
  • the particle size of the solder powder satisfies this condition, the surface area of the powder is not too large, the increase in the viscosity of the solder paste over time is suppressed, and the aggregation of the fine powder is suppressed, so that the viscosity of the solder paste increases. May be suppressed. Therefore, it is possible to solder to finer parts.
  • the solder powder of the present embodiment also has two or more kinds of solder alloy particle groups having different particle size distributions. As a result, the slipperiness of the solder paste is enhanced, and workability such as easy printing is improved.
  • the sphericity of the spherical powder is preferably 0.8 or more, more preferably 0.9 or more, further preferably 0.95 or more, and particularly preferably 0.99 or more.
  • the "spherical degree of spherical powder" referred to here shall be measured using a CNC image measurement system (Ultra Quick Vision ULT RA QV350-PRO measuring device manufactured by Mitutoyo Co., Ltd.) that uses the minimum region center method (MZC method). Can be done.
  • the sphericity represents the deviation from the sphere, and is, for example, an arithmetic mean value calculated when the diameter of each of 500 solder alloy particles is divided by the major axis, and the value is 1.00, which is the upper limit. The closer it is, the closer it is to a true sphere.
  • solder paste contains the solder powder according to one aspect of the present invention and a flux.
  • the flux used in the solder paste of the present embodiment is composed of, for example, any one of a resin component, an active component, a solvent, and other components, or a combination of two or more of these components.
  • Examples of the resin component include rosin-based resins.
  • Examples of the rosin-based resin include raw material rosins such as gum rosin, wood rosin and tall oil rosin, and derivatives obtained from the raw material rosin.
  • Examples of the derivative include purified rosin, hydrogenated rosin, disproportionated rosin, polymerized rosin and ⁇ , ⁇ unsaturated carboxylic acid modified products (acrylicated rosin, maleated rosin, fumarized rosin, etc.), and the polymerized rosin.
  • the resin components include terpene resin, modified terpene resin, terpenephenol resin, modified terpenephenol resin, styrene resin, modified styrene resin, xylene resin, modified xylene resin, acrylic resin, polyethylene resin, and acrylic. -Polyethylene copolymer resin, epoxy resin and the like can be mentioned.
  • modified terpene resin examples include aromatic modified terpene resin, hydrogenated terpene resin, hydrogenated aromatic modified terpene resin and the like.
  • modified terpene phenol resin examples include hydrogenated terpene phenol resin and the like.
  • modified styrene resin examples include styrene acrylic resin and styrene maleic acid resin.
  • modified xylene resin examples include a phenol-modified xylene resin, an alkylphenol-modified xylene resin, a phenol-modified resol-type xylene resin, a polyol-modified xylene resin, and a polyoxyethylene-added xylene resin.
  • Examples of the active ingredient include organic acids, amines, halogen-based activators, thixotropic agents, solvents, metal inactivating agents and the like.
  • organic acids include succinic acid, glutaric acid, adipic acid, pimelli acid, suberic acid, azelaic acid, sebacic acid, dimer acid, propionic acid, 2,2-bishydroxymethylpropionic acid, tartrate acid, malic acid and glycol.
  • examples thereof include acids, diglycolic acid, thioglycolic acid, dithioglycolic acid, stearic acid, 12-hydroxystearic acid, palmitic acid, oleic acid and the like.
  • amines include ethylamine, triethylamine, ethylenediamine, triethylenetetramine, 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2 -Phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-Cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimerite, 1-cyanoethyl-2-phenylimidazolium trimerite, 1-
  • halogen-based activator examples include amine hydrogen halides and organic halogen compounds.
  • Amine halide hydrohydrate is a compound obtained by reacting an amine with hydrogen halide.
  • the amine here include ethylamine, ethylenediamine, triethylamine, diphenylguanidine, ditrilguanidine, methylimidazole, 2-ethyl-4-methylimidazole and the like
  • examples of the hydrogen halide include chlorine, bromine and the like. Examples include hydrides of iodine.
  • organic halogen compound examples include trans-2,3-dibromo-2-butene-1,4-diol, triallyl isocyanurate 6 bromide, 1-bromo-2-butanol, 1-bromo-2-propanol, 3 -Bromo-1-propanol, 3-bromo-1,2-propanediol, 1,4-dibromo-2-butanol, 1,3-dibromo-2-propanol, 2,3-dibromo-1-propanol, 2, Examples thereof include 3-dibromo-1,4-butanediol and 2,3-dibromo-2-butene-1,4-diol.
  • Examples of the thixotropy include wax-based thixotropy, amide-based thixotropy, sorbitol-based thixotropy, and the like.
  • Examples of the wax-based thixotropy include castor oil and the like.
  • Examples of amido-based fatty acid agents include monoamide-based fatty acid agents, bis-amide-based fatty acid agents, and polyamide-based fatty acid agents.
  • examples of the sorbitol-based thixotropy include dibenzylidene-D-sorbitol, bis (4-methylbenzylidene) -D-sorbitol and the like.
  • Examples of the solvent include water, alcohol-based solvents, glycol ether-based solvents, terpineols and the like.
  • Examples of the alcohol solvent include isopropyl alcohol, 1,2-butanediol, isobornylcyclohexanol, 2,4-diethyl-1,5-pentanediol, 2,2-dimethyl-1,3-propanediol, and the like.
  • glycol ether-based solvent examples include diethylene glycol mono-2-ethylhexyl ether, ethylene glycol monophenyl ether, 2-methylpentane-2,4-diol, diethylene glycol monohexyl ether, diethylene glycol dibutyl ether, and triethylene glycol monobutyl ether. Can be mentioned.
  • metal inactivating agent examples include hindered phenolic compounds and nitrogen compounds.
  • the flux contains either a hindered phenolic compound or a nitrogen compound, the effect of suppressing the thickening of the solder paste can be easily enhanced.
  • the term "metal inactivating agent" as used herein refers to a compound having the ability to prevent the metal from deteriorating due to contact with a certain compound.
  • the hindered phenolic compound refers to a phenolic compound having a bulky substituent (for example, a branched or cyclic alkyl group such as a t-butyl group) at at least one of the ortho positions of the phenol.
  • the hindered phenolic compound is not particularly limited, and is, for example, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylenebis (oxyethylene)], N, N.
  • Z is an optionally substituted alkylene group.
  • R 1 and R 2 are independently optionally substituted alkyl group, aralkyl group, aryl group, heteroaryl group, cycloalkyl. It is a group or a heterocycloalkyl group.
  • R 3 and R 4 are alkyl groups that may be substituted independently of each other.
  • Examples of the nitrogen compound in the metal inactivating agent include hydrazide nitrogen compounds, amide nitrogen compounds, triazole nitrogen compounds, and melamine nitrogen compounds.
  • the hydrazide-based nitrogen compound may be any nitrogen compound having a hydrazide skeleton, and is bis dodecanoate [N2- (2-hydroxybenzoyl) hydrazide], N, N'-bis [3- (3,5-di-tert).
  • the amide-based nitrogen compound may be any nitrogen compound having an amide skeleton, and N, N'-bis ⁇ 2- [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionyloxyl] ethyl. ⁇ Oxamide and the like can be mentioned.
  • the triazole-based nitrogen compound may be any nitrogen compound having a triazole skeleton, and N- (2H-1,2,4-triazole-5-yl) salicylamide, 3-amino-1,2,4-triazole, Examples thereof include 3- (N-salicyloyl) amino-1,2,4-triazole.
  • the melamine-based nitrogen compound may be any nitrogen compound having a melamine skeleton, and examples thereof include melamine and melamine derivatives. More specifically, for example, trisaminotriazine, alkylated trisaminotriazine, alkoxyalkylated trisaminotriazine, melamine, alkylated melamine, alkoxyalkylated melamine, N2-butyl melamine, N2, N2-diethyl melamine, N, Examples thereof include N, N', N', N'', N''-hexakis (methoxymethyl) melamine and the like.
  • Examples of other components include surfactants, silane coupling agents, antioxidants, colorants and the like.
  • Examples of the surfactant include nonionic surfactants and weak cationic surfactants.
  • Examples of the nonionic surfactant include polyethylene glycol, polyethylene glycol-polypropylene glycol copolymer, aliphatic alcohol polyoxyethylene adduct, aromatic alcohol polyoxyethylene adduct, and polyhydric alcohol polyoxyethylene adduct. Be done.
  • Examples of the weak cationic surfactant include terminal diamine polyethylene glycol, terminal diamine polyethylene glycol-polypropylene glycol copolymer, aliphatic amine polyoxyethylene adduct, aromatic amine polyoxyethylene adduct, and polyvalent amine polyoxy. Examples include polyethylene adducts.
  • surfactants other than the above include polyoxyalkylene acetylene glycols, polyoxyalkylene glyceryl ethers, polyoxyalkylene alkyl ethers, polyoxyalkylene esters, polyoxyalkylene alkyl amines, polyoxyalkylene alkyl amides and the like. ..
  • the content of the flux in the solder paste of the present embodiment is preferably 5 to 95% by mass, more preferably 5 to 50% by mass, based on the total mass (100% by mass) of the solder paste. It is more preferably 5 to 15% by mass. When the flux content is in this range, the thickening suppressing effect caused by the solder powder is sufficiently exhibited.
  • the solder paste of the present embodiment can be produced by a production method common in the art.
  • a solder paste can be obtained by heating and mixing the compounding components constituting the flux to prepare a flux, and stirring and mixing the solder powder in the flux. Further, in anticipation of the effect of suppressing thickening over time, zirconium oxide powder may be further blended in addition to the solder powder.
  • solder ball The solder ball according to one aspect of the present invention is made of the above-mentioned solder alloy according to one aspect of the present invention.
  • the solder alloy of the above-described embodiment can be used as a solder ball.
  • the solder ball of the present embodiment can be manufactured by using a dropping method which is a common method in the art.
  • the particle size of the solder balls is preferably 1 ⁇ m or more, more preferably 10 ⁇ m or more, further preferably 20 ⁇ m or more, and particularly preferably 30 ⁇ m or more.
  • the particle size of the solder balls is preferably 3000 ⁇ m or less, more preferably 1000 ⁇ m or less, further preferably 600 ⁇ m or less, and particularly preferably 300 ⁇ m or less.
  • the particle size of the solder balls is, for example, preferably 1 ⁇ m or more and 3000 ⁇ m or less, more preferably 10 ⁇ m or more and 1000 ⁇ m or less, further preferably 20 ⁇ m or more and 600 ⁇ m or less, and particularly preferably 30 ⁇ m or more and 300 ⁇ m or less.
  • solder preform The solder preform according to one aspect of the present invention is made of the above-mentioned solder alloy according to one aspect of the present invention.
  • the solder alloy of the above-described embodiment can be used as a preform.
  • Examples of the shape of the preform of the present embodiment include washers, rings, pellets, discs, ribbons, wires, and the like.
  • solder joint The solder joint according to one aspect of the present invention is made of the above-mentioned solder alloy according to one aspect of the present invention.
  • the solder joint of the present embodiment is composed of an electrode and a solder joint.
  • the solder joint portion refers to a portion mainly formed of a solder alloy.
  • the solder joint of the present embodiment is formed by, for example, joining an electrode of a PKG (Package) such as an IC chip and an electrode of a substrate such as a PCB (printed circuit board) with the solder alloy of the above-described embodiment. be able to.
  • the solder joint of the present embodiment is manufactured by processing by a method common in the art, such as mounting one solder ball of the above-described embodiment on one electrode coated with flux and joining the solder joint. can do.
  • ppb for the solder alloy composition is “mass ppb”
  • ppm is “mass ppm”
  • % is “mass%”.
  • solder alloy> (Examples 1 to 370, Comparative Examples 1 to 8) The raw metal was melted and stirred to prepare solder alloys of each example having the alloy compositions shown in Tables 1A to 16B.
  • solder powder The solder alloys of each example are melted and composed of the solder alloys of each example having the alloy compositions shown in Tables 1A to 16B by the atomization method. A solder powder having a size (particle size distribution) satisfying the symbol 4 was prepared.
  • a rosin-based resin was used as the resin component.
  • a thixotropic agent, an organic acid, an amine and a halogen-based activator were used as the active ingredient.
  • a glycol ether solvent was used as the solvent. 42 parts by mass of rosin, 35 parts by mass of glycol ether solvent, 8 parts by mass of thixo agent, 10 parts by mass of organic acid, 2 parts by mass of amine, and 3 parts by mass of halogen-based activator are mixed and flux ( F0) was prepared.
  • solder paste ⁇ Manufacturing of solder paste>
  • the flux (F0) and a solder powder made of the solder alloys of each example having the alloy compositions shown in Tables 1A to 16B were mixed to produce a solder paste.
  • the solder alloys of each example were melted at 250 ° C. and cooled to 100 ° C., which is below the solid phase temperature of the entire alloy composition, in 10 minutes. With respect to the cooled solder alloy, a scanning electron microscope (SEM) was used to observe the cross section of any five places in the range of 300 ⁇ m ⁇ 300 ⁇ m, and the presence or absence of needle-like crystals derived from the SnFe compound was confirmed in the cross section SEM photograph. ..
  • the acicular crystal in this example refers to a crystal derived from one SnFe compound having an aspect ratio of 2 or more, which is the ratio of the major axis to the minor axis.
  • Verification method 1 The ⁇ -dose was measured by using an ⁇ -dose measuring device of a gas flow proportional counter and following the above-mentioned procedures (i), (ii) and (iii). As a measurement sample, a solder alloy sheet immediately after production was used. This solder alloy sheet was obtained by melting the solder alloy immediately after production and forming it into a sheet having an area of 900 cm 2 on one surface. This measurement sample was placed in an ⁇ -dose measuring device, and PR-10 gas was allowed to flow for 12 hours and allowed to stand, and then the ⁇ -dose was measured for 72 hours.
  • Verification method 2 The ⁇ dose was measured in the same manner as in (1) Verification method 1 above, except that the measurement sample was changed.
  • a measurement sample a solder alloy sheet formed by melting a solder alloy immediately after production and forming a sheet having an area of 900 cm 2 on one surface is heat-treated at 100 ° C. for 1 hour and allowed to cool. board.
  • Verification method 3 After storing the solder alloy sheet of the measurement sample whose ⁇ -dose was measured in the above (1) verification method 1 for one year, the ⁇ -dose is again followed by the above-mentioned procedures (i), (ii) and (iii). Was measured to evaluate the change in ⁇ dose over time.

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Abstract

La présente invention concerne un alliage de soudure présentant une composition d'alliage contenant moins de 5 ppb en masse de U, moins de 5 ppb en masse de Th, moins de 5 ppm en masse de Pb, moins de 5 ppm en masse d'As, 0 à 600 ppm en masse de Ni et 0 à 100 ppm en masse de Fe, le reste étant constitué de Sn. La formule (1) est satisfaite, et la quantité de rayons α est au plus de 0,02 cph/cm2.　20 ≤ Ni + Fe ≤ 700 (1) Dans la formule (1), Ni et Fe représentent le contenu (ppm en masse) dans la composition d'alliage.　Avec cet alliage de soudure, une augmentation de la viscosité de la pâte de soudure au fil du temps est supprimée, un court-circuit est moins susceptible de se produire dans un circuit, la résistance mécanique d'un joint de soudure peut être augmentée et l'apparition d'erreurs logicielles peut être supprimée.
PCT/JP2021/006437 2020-04-10 2021-02-19 Alliage de soudure, poudre de soudure, pâte de soudure, globule de soudure, préforme de soudure et joint de soudure Ceased WO2021205759A1 (fr)

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KR1020227035027A KR102557835B1 (ko) 2020-04-10 2021-02-19 땜납 합금, 땜납 분말, 솔더 페이스트, 땜납 볼, 솔더 프리폼 및 땜납 이음

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005040847A (ja) * 2003-07-25 2005-02-17 Hitachi Metals Ltd はんだボールの製造方法
JP4472752B2 (ja) * 2005-07-01 2010-06-02 日鉱金属株式会社 高純度錫又は錫合金及び高純度錫の製造方法
JP5019764B2 (ja) * 2006-03-09 2012-09-05 新日鉄マテリアルズ株式会社 鉛フリーハンダ合金、ハンダボール及び電子部材
JP6540869B1 (ja) * 2018-03-30 2019-07-10 千住金属工業株式会社 はんだペースト
JP2020055037A (ja) * 2018-09-28 2020-04-09 荒川化学工業株式会社 鉛フリーはんだフラックス、鉛フリーソルダペースト

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5019764B1 (fr) * 1971-04-30 1975-07-09
JP5030442B2 (ja) * 2006-03-09 2012-09-19 新日鉄マテリアルズ株式会社 鉛フリーハンダ合金、ハンダボール及び電子部材
JP2008168322A (ja) 2007-01-11 2008-07-24 Ishikawa Kinzoku Kk Ｆｅ浸食抑制鉛フリーはんだ合金
US9394590B2 (en) * 2010-03-16 2016-07-19 Jx Nippon Mining & Metals Corporation Low α-dose tin or tin alloy, and method for producing same
KR101645929B1 (ko) * 2013-09-19 2016-08-04 센주긴조쿠고교 가부시키가이샤 Ni 볼, Ni 핵 볼, 납땜 조인트, 폼 땜납, 납땜 페이스트
JP6717559B2 (ja) 2013-10-16 2020-07-01 三井金属鉱業株式会社 半田合金及び半田粉
JP5534122B1 (ja) * 2014-02-04 2014-06-25 千住金属工業株式会社 核ボール、はんだペースト、フォームはんだ、フラックスコート核ボールおよびはんだ継手
US10150185B2 (en) * 2014-02-04 2018-12-11 Senju Metal Industry Co., Ltd. Method for producing metal ball, joining material, and metal ball
US10400342B2 (en) * 2015-10-19 2019-09-03 Jx Nippon Mining & Metals Corporation High purity tin and method for manufacturing same
JP6678704B2 (ja) * 2018-07-20 2020-04-08 千住金属工業株式会社 はんだ材料、ソルダペースト、及びはんだ継手
CN109262163A (zh) * 2018-11-30 2019-01-25 长沙浩然医疗科技有限公司 一种无铅焊料合金及其制备方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005040847A (ja) * 2003-07-25 2005-02-17 Hitachi Metals Ltd はんだボールの製造方法
JP4472752B2 (ja) * 2005-07-01 2010-06-02 日鉱金属株式会社 高純度錫又は錫合金及び高純度錫の製造方法
JP5296269B1 (ja) * 2005-07-01 2013-09-25 Ｊｘ日鉱日石金属株式会社 高純度錫合金
JP5019764B2 (ja) * 2006-03-09 2012-09-05 新日鉄マテリアルズ株式会社 鉛フリーハンダ合金、ハンダボール及び電子部材
JP6540869B1 (ja) * 2018-03-30 2019-07-10 千住金属工業株式会社 はんだペースト
JP2020055037A (ja) * 2018-09-28 2020-04-09 荒川化学工業株式会社 鉛フリーはんだフラックス、鉛フリーソルダペースト

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