WO2021200837A1 - セル集合体、セル集合体の製造方法、太陽電池セル、及び、太陽電池セルの製造方法 - Google Patents
セル集合体、セル集合体の製造方法、太陽電池セル、及び、太陽電池セルの製造方法 Download PDFInfo
- Publication number
- WO2021200837A1 WO2021200837A1 PCT/JP2021/013333 JP2021013333W WO2021200837A1 WO 2021200837 A1 WO2021200837 A1 WO 2021200837A1 JP 2021013333 W JP2021013333 W JP 2021013333W WO 2021200837 A1 WO2021200837 A1 WO 2021200837A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- region
- solar cell
- transparent conductive
- conductive layer
- photoelectric conversion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F19/90—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers
- H10F19/902—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells
- H10F19/904—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells characterised by the shapes of the structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F10/00—Individual photovoltaic cells, e.g. solar cells
- H10F10/10—Individual photovoltaic cells, e.g. solar cells having potential barriers
- H10F10/16—Photovoltaic cells having only PN heterojunction potential barriers
- H10F10/164—Photovoltaic cells having only PN heterojunction potential barriers comprising heterojunctions with Group IV materials, e.g. ITO/Si or GaAs/SiGe photovoltaic cells
- H10F10/165—Photovoltaic cells having only PN heterojunction potential barriers comprising heterojunctions with Group IV materials, e.g. ITO/Si or GaAs/SiGe photovoltaic cells the heterojunctions being Group IV-IV heterojunctions, e.g. Si/Ge, SiGe/Si or Si/SiC photovoltaic cells
- H10F10/166—Photovoltaic cells having only PN heterojunction potential barriers comprising heterojunctions with Group IV materials, e.g. ITO/Si or GaAs/SiGe photovoltaic cells the heterojunctions being Group IV-IV heterojunctions, e.g. Si/Ge, SiGe/Si or Si/SiC photovoltaic cells the Group IV-IV heterojunctions being heterojunctions of crystalline and amorphous materials, e.g. silicon heterojunction [SHJ] photovoltaic cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F19/90—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers
- H10F19/902—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F19/90—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers
- H10F19/902—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells
- H10F19/906—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells characterised by the materials of the structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/121—The active layers comprising only Group IV materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/20—Electrodes
- H10F77/206—Electrodes for devices having potential barriers
- H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/20—Electrodes
- H10F77/206—Electrodes for devices having potential barriers
- H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
- H10F77/215—Geometries of grid contacts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/30—Coatings
- H10F77/306—Coatings for devices having potential barriers
- H10F77/311—Coatings for devices having potential barriers for photovoltaic cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- a cell aggregate that is a raw material of a solar cell that constitutes a solar cell by connecting a plurality of them in a single ring, a method for manufacturing the cell aggregate, a solar cell formed from the cell aggregate, and a solar cell.
- the present invention relates to a method for manufacturing the solar cell.
- solar cells having various structures have been proposed.
- a solar cell in order to form a solar cell string, a plurality of strip-shaped solar cells are provided, for example, with a roof plate so that the long sides of adjacent solar cells overlap each other.
- a solar module in which the ends of the solar cell are connected to each other in a lined state (Patent Document 1).
- Patent Document 1 In this solar module, by arranging the solar cells in an overlapping manner, a gap between adjacent solar cells is eliminated. As a result, the charging rate of the solar cell in the solar module can be improved, and the module efficiency can be improved.
- Patent Document 2 It is also known that a plating method is used when forming a metal electrode of a solar cell (Patent Document 2).
- a photoelectric conversion unit including a silicon substrate, a first transparent conductive layer and a transparent resin layer laminated in order on the light receiving surface side of the photoelectric conversion unit, and a second transparent conductive layer and a transparent resin layer sequentially laminated on the back surface side of the photoelectric conversion unit.
- a transparent conductive layer and a transparent resin layer are provided.
- the transparent resin layer has an opening, and a part of the surface of the first transparent conductive layer and a part of the surface of the second transparent conductive layer are exposed from the opening of the transparent resin layer.
- this solar cell includes a plated metal electrode laminated on a portion of the surface of the first transparent conductive layer or the surface of the second transparent conductive layer that is exposed from the opening of the transparent resin layer.
- the transparent resin layer functions as a mask when forming the plated metal electrode and also functions as a protective layer of the completed solar cell.
- the first transparent conductive layer and the transparent resin layer having an opening are laminated in order on the photoelectric conversion part. ..
- the shape of the opening of the transparent resin layer is formed so as to correspond to the shape of the plated metal electrode (that is, the pattern of the plated metal electrode).
- a plated metal electrode is deposited on the first transparent conductive layer exposed from the opening of the transparent resin layer by electrolytic plating. The same process is performed when forming the plated metal electrode located on the back surface side.
- the solar cell provided with the plated metal electrode to the solar module in which the solar cells are arranged in an overlapping manner as described above, that is, the solar module in which the solar cells are connected by a single ring. ..
- the transparent resin layer in the cell assembly absorbs the laser, the transparent resin layer cannot be completely cut, and it is difficult to obtain a divided solar cell.
- the present invention is a cell assembly that is a raw material of a solar cell that constitutes a solar cell by connecting a plurality of them in a single ring, and includes a metal electrode formed by a plating method and can be easily cut. It is an object of the present invention to provide a body, a method for manufacturing the cell aggregate, a solar cell formed from the cell aggregate, and a method for manufacturing the solar cell.
- the cell assembly of the solar cell of the present invention is a cell assembly of a solar cell having a plurality of small compartments which are divided into a plurality of solar cell cells and having one side in a straight line in a plan view.
- Each of the plurality of subsections is defined by a demarcation line which is a straight line substantially parallel to one side of the linear shape of the cell assembly, and has a photoelectric conversion unit having a main surface and a main surface of the photoelectric conversion unit.
- a transparent conductive layer having a first region and a second region having a position different from that of the first region, which is provided in a region corresponding to each of the plurality of subsections, and on the first region of the transparent conductive layer.
- the method for manufacturing a cell assembly of a solar cell of the present invention is a cell assembly of a solar cell having a plurality of small compartments which are divided into a plurality of solar cell cells and having one side in a straight line in a plan view. It is a method for manufacturing a cell assembly of a solar cell in which each of the plurality of subsections is defined by a demarcation line which is a straight line substantially parallel to the one side of the cell assembly.
- the transparent conductive layer includes a step of forming a transparent insulating layer having an opening in which a part of the layer is exposed and a step of forming a current collecting electrode in the transparent conductive layer exposed from the opening by a plating method.
- the step of forming, the step of forming the transparent insulating layer, and the step of forming the current collecting electrode are performed so that the photoelectric conversion portion is exposed along the demarcation line and in the demarcation region including the demarcation line. Be told.
- a solar cell can be formed by connecting a plurality of solar cells to each other by a single ring, and is a solar cell having a linear one side and a linear opposite side substantially parallel to the one side in a plan view.
- a transparent insulating layer provided on the second region of the transparent conductive layer is provided. The photoelectric conversion portion is exposed on the one side and the opposite side.
- the method for manufacturing a solar cell of the present invention is a method for manufacturing a solar cell using the cell aggregate of the solar cell, and a step of cutting the cell aggregate by irradiating the demarcation line with a laser. include.
- FIG. 1A is a plan view of a cell assembly of a solar cell according to the present embodiment.
- FIG. 1B is a bottom view of the cell assembly of the solar cell according to the present embodiment.
- FIG. 2 is an enlarged cross-sectional view taken along the line II-II of FIG. 1A.
- FIG. 3A is a plan view of the photoelectric conversion unit of the cell assembly.
- FIG. 3B is an enlarged cross-sectional view at positions III-III of FIG. 3A.
- FIG. 4A is a plan view of the photoelectric conversion unit on which the transparent conductive layer is formed.
- FIG. 4B is a bottom view of the photoelectric conversion unit on which the transparent conductive layer is formed.
- FIG. 5 is an enlarged cross-sectional view at the VV position of FIG. 4A.
- FIG. 6A is a plan view of the photoelectric conversion unit on which the transparent insulating layer is formed.
- FIG. 6B is a bottom view of the photoelectric conversion unit on which the transparent insulating layer is formed.
- FIG. 7 is an enlarged cross-sectional view at the VII-VII position of FIG. 6A.
- FIG. 8A is a plan view of the solar cell according to the present embodiment.
- FIG. 8B is a bottom view of the solar cell.
- FIG. 9 is a cross-sectional view taken along the line IX-IX of FIG. 8A.
- FIG. 10 is a schematic cross-sectional view of a solar cell string using the solar cell.
- the cell assembly 100 of the solar cells of the present embodiment (hereinafter, also simply referred to as “cell assembly 100”) is divided into a plurality of solar cell cells 1. It is a cell aggregate of a solar cell having a plurality of subsections 10 to be obtained. Further, the cell assembly 100 has one side (one side 100a) that is linear in a plan view. Each of the plurality of subsections 10 is defined by a demarcation line 11 which is a straight line substantially parallel to one side 100a of the cell assembly 100.
- the cell assembly 100 is provided in the photoelectric conversion unit 2 having the main surface 20 and the region 200 corresponding to each of the plurality of subsections 10 of the main surface 20 of the photoelectric conversion unit 2.
- the transparent conductive layer 3 and the current collecting electrode 4 provided on the first region 31 of the transparent conductive layer 3 and including the plating layer 40, and on the second region 32 whose position is different from that of the first region 31 of the transparent conductive layer 3.
- the transparent insulating layer 5 provided is provided.
- the layers are stacked in the z-axis direction in FIG.
- the photoelectric conversion unit 2 is exposed in the demarcation region 111 which is a region including the demarcation line 11 along the demarcation line 11 of the cell assembly 100.
- the main surface 20 is a main surface that constitutes the plate-like surface of the photoelectric conversion unit 2.
- the photoelectric conversion unit 2 has a side surface (end face) as an edge.
- the cell assembly 100 of the present embodiment has a plurality of demarcation lines 11 and a plurality of demarcation regions 111. Specifically, the cell assembly 100 has three demarcation lines 11 and three demarcation regions 111 (see FIGS. 1A and 1B). Further, in the cell assembly 100, the demarcation lines 11 extend along the y-axis direction and are arranged at equal intervals in the x-axis direction.
- the demarcation region 111 of this embodiment extends along the y-axis direction.
- the widths (eg, dimensions in the x-axis direction) of the plurality of defined regions 111 are all the same.
- the demarcation region 111 extends on both sides of the demarcation line 11 in the x-axis direction.
- the distance between the edge 111b located on the other side (left side in FIGS. 1A and 2) and the demarcation line 11 is the same. That is, the demarcation line 11 extends to the center of each demarcation region 111 in the width direction (for example, the x-axis direction).
- the photoelectric conversion unit 2 is, for example, a plate-shaped member. Further, the photoelectric conversion unit 2 has a pn junction or a pin junction.
- the photoelectric conversion unit 2 of the present embodiment has a conductive crystalline silicon substrate 21 (hereinafter, also referred to as “silicon substrate 21”) (see FIG. 2). Further, the photoelectric conversion unit 2 has a pn junction formed between the conductive silicon-based thin films 22 and 23. Further, the photoelectric conversion unit 2 of the present embodiment also has intrinsic silicon thin films 24 and 25 provided between the silicon substrate 21 and the conductive silicon thin films 22 and 23.
- the silicon substrate 21 is, for example, either an n-type crystalline silicon substrate or a p-type crystalline silicon substrate.
- the silicon substrate 21 of this embodiment is, for example, an n-type single crystal silicon substrate.
- a first conductive silicon-based thin film 22 is provided on the first main surface 211 (upper surface of the silicon substrate 21 in FIG. 2) of the silicon substrate 21.
- a second conductive silicon-based thin film 23 is provided on the second main surface 212 of the silicon substrate 21 (the lower surface of the silicon substrate 21 in FIG. 2).
- first conductive type silicon thin film 22 and the second conductive type silicon thin film 23 is p type, and the other is n type.
- the first conductive type silicon-based thin film 22 of the present embodiment is a p-type.
- the second conductive type silicon-based thin film 23 of the present embodiment is n-type.
- the film thicknesses of the first conductive type silicon thin film 22 and the second conductive type silicon thin film 23 are 2 nm or more and 20 nm or less, respectively.
- the transparent conductive layer 3 includes a first transparent conductive layer 33 provided on the first main surface 201 side of the photoelectric conversion unit 2, a second transparent conductive layer 34 provided on the second main surface 202 side of the photoelectric conversion unit 2, and the like. including.
- the material of the transparent conductive layer 3 is, for example, a conductive metal oxide such as ITO (indium tin oxide).
- the film thickness of the transparent conductive layer 3 is, for example, 20 nm or more and 120 nm or less.
- the current collecting electrode 4 is a patterned metal electrode.
- the current collecting electrode 4 of this embodiment is composed of a plating layer 40. Further, the current collecting electrode 4 of the present embodiment includes a first current collecting electrode 41 provided on the first main surface 201 (upper surface of the photoelectric conversion unit 2 in FIG. 2) of the photoelectric conversion unit 2 and a second main surface 202. It has a second current collecting electrode 42 provided on (the lower surface of the photoelectric conversion unit 2 in FIG. 2).
- the current collecting electrode 4 has a plurality of finger electrodes 43 extending parallel to each other and a bus bar electrode 44 extending so as to intersect (specifically, orthogonally) the finger electrodes 43 (FIGS. 1A and 1B). reference).
- the finger electrode 43 and the bus bar electrode 44 form a pattern electrode on the grid.
- the thickness of the current collecting electrode 4 is, for example, 10 ⁇ m or more and 30 ⁇ m or less.
- the shape of the second current collector electrode 42 is, for example, the same as the shape of the first current collector electrode 41.
- the shape of the second current collecting electrode 42 may be different from the shape of the first current collecting electrode 41.
- the plating layer 40 is adjacent to the demarcation region 111 where the photoelectric conversion unit 2 is exposed. Specifically, the plating layer 40 is aligned with the defined region 111 where the photoelectric conversion unit 2 is exposed in the x-axis direction.
- the transparent insulating layer 5 functions as a mask when forming the plating layer 40.
- the transparent insulating layer 5 also functions as a protective layer on the surface of the completed cell assembly 100 or the solar cell 1.
- the transparent insulating layer 5 is provided with an opening 50 including a region where the current collecting electrode 4 is formed (see FIG. 2). That is, the transparent insulating layer 5 is provided with an opening 50 that exposes the first region 31 of the transparent conductive layer 3. Further, the transparent insulating layer 5 covers one end 36 of both ends of the transparent conductive layer 3 in the extending direction of the finger electrode 43 (x-axis direction in FIG. 2), and exposes the other end 35. do.
- the material of the transparent insulating layer 5 of the present embodiment is, for example, a resin having light transmission. This material preferably has resin thermosetting or photocurability.
- the thickness of the transparent insulating layer 5 is, for example, preferably 5 ⁇ m or more and 30 ⁇ m or less, and more preferably 8 ⁇ m or more and 20 ⁇ m or less.
- the thickness of the transparent insulating layer 5 is, for example, the distance from the surface of the transparent conductive layer 3 to the surface of the transparent insulating layer 5 at the place where the thickness is the largest.
- the method for manufacturing the cell assembly 100 having the above configuration includes a step of preparing a photoelectric conversion unit 2 having a main surface 20 and a region 200 corresponding to each of a plurality of small sections of the main surface 20 of the photoelectric conversion unit 2. , A step of forming the transparent conductive layer 3, a step of forming a transparent insulating layer 5 having an opening 50 in which a part of the transparent conductive layer 3 is exposed, and a step of forming the transparent conductive layer 3 exposed from the opening. , A step of forming the current collecting electrode 4 by a plating method, and the like.
- the step of forming the transparent conductive layer 3, the step of forming the transparent insulating layer 5, and the step of forming the current collecting electrode 4 are performed so that the photoelectric conversion unit 2 is exposed in the defined region 111. It is said.
- each step will be specifically described with reference to FIGS. 3 to 8.
- the step of preparing the photoelectric conversion unit 2 includes a step of forming silicon-based thin films 22 and 23 on the silicon substrate 21.
- the step of preparing the photoelectric conversion unit 2 includes a step of forming the silicon-based thin films 24 and 25 in addition to the step of forming the silicon-based thin films 22 and 23.
- the silicon substrate 21 is, for example, a 6-inch n-type single crystal silicon substrate.
- the silicon-based thin films 22, 23, 24, and 25 are provided over the entire area of the first main surface 211 and the entire area of the second main surface 212 of the silicon substrate 21. Further, the silicon-based thin films 22, 23, 24, and 25 are formed by, for example, a plasma CVD method.
- the steps of forming the transparent conductive layer 3 are the step of forming the first transparent conductive layer 33 on the first main surface 201 of the photoelectric conversion unit 2 and the photoelectric conversion.
- a step of forming a second transparent conductive layer 34 on the second main surface 202 of the part 2 is included.
- the first transparent conductive layer 33 is formed on the side opposite to the silicon substrate 21 side (the side in contact with the silicon substrate 21) of the first conductive type silicon-based thin film 22. It includes a step of forming and a step of forming the second transparent conductive layer 34 on the side opposite to the silicon substrate 21 side (the side in contact with the silicon substrate 21) of the second conductive silicon-based thin film 23.
- the transparent conductive layer 3 is formed in a rectangular shape extending in the y-axis direction. Further, the transparent conductive layers 3 are formed so as to be arranged at intervals from each other in the x-axis direction. As a result, the transparent conductive layer 3 is formed so as to expose the portion of the photoelectric conversion unit 2 that becomes the demarcated region 111 of the cell assembly 100.
- the transparent conductive layer 3 is formed by, for example, a MOCVD method or a sputtering method.
- the steps of forming the transparent insulating layer 5 are a step of printing a resin solution on the transparent conductive layer 3 and a step of providing an opening 50 in the printed resin layer. It has a step of forming the transparent insulating layer 5.
- This resin solution is, for example, an acrylic resin solution.
- the acrylic resin solution is adjusted so that the solution viscosity at room temperature (25 ° C.) is 70 Pa ⁇ s or more and 120 Pa ⁇ s or less.
- the resin material constituting the transparent insulating layer 5 is a heat-curable or photocurable material
- a resin solution is applied onto the transparent conductive layer 3 by screen printing or the like in the step of forming the transparent insulating layer 5. After printing, it is preferable to cure the transparent insulating layer 5 before the step of forming the current collecting electrode 4.
- the transparent insulating layer 5 is formed in a rectangular shape extending in the y-axis direction. Further, the transparent insulating layer 5 is formed so as to be arranged at a distance (opening 50) from each other in the x-axis direction. As a result, the transparent insulating layer 5 is formed so as to expose the portion of the photoelectric conversion unit 2 that becomes the demarcated region 111 of the cell assembly 100.
- the step of forming the current collecting electrode 4 includes a step of forming a plating layer 40 on the transparent conductive layer 3 exposed under the opening 50 of the transparent insulating layer 5 by a plating method (FIGS. 1A, 1B, and 2). reference).
- the steps of forming the plating layer 40 include a step of precipitating the first plating layer by electrolytic plating on the transparent conductive layer 3 exposed under the opening 50 of the transparent insulating layer 5, and a step of precipitating the first plating layer on the first plating layer. It has a step of precipitating a second plating layer by electrolytic plating.
- Ni is used when precipitating the first plating layer
- Cu is used when precipitating the second plating layer.
- the current collecting electrode 4 has a plurality of finger electrodes 43 extending parallel to each other and a bus bar electrode 44 extending so as to intersect (specifically, orthogonally) the finger electrodes 43. Formed to have. Further, the current collecting electrode 4 is formed on the transparent conductive layer 3 exposed under the opening 50 of the transparent insulating layer 5. As a result, the current collecting electrode 4 is formed so as to expose the portion of the photoelectric conversion unit 2 that becomes the defined region 111 of the cell assembly 100.
- the solar cell 1 can be manufactured by cutting the cell assembly 100 manufactured by the above manufacturing method.
- the method for manufacturing the solar cell 1 includes a step of cutting the cell assembly 100 by irradiating the demarcation line 11 with a laser.
- the solar cell 1 has a linear one side 1a and a linear opposite side 1b substantially parallel to the one side 1a.
- the solar cell 1 is provided on the photoelectric conversion unit 2 having the main surface 20, the transparent conductive layer 3 provided on the main surface 20 of the photoelectric conversion unit 2, and the first region 31 of the transparent conductive layer 3, and is plated.
- a current collecting electrode 4 including the layer 40 and a transparent insulating layer 5 provided on a second region 32 different from the first region 31 of the transparent conductive layer 3 are provided, and photoelectric conversion is performed on one side 1a and the opposite side 1b. Part 2 is exposed
- the solar cell 1 of the present embodiment has a strip shape (substantially rectangular shape) in a plan view. Further, the solar cell 1 is, for example, a double-sided light receiving type solar cell.
- a plurality of solar cell cells 1 can form a solar cell string 101 by being connected to each other by a single ring.
- the single ring connection is a state in which the first current collecting electrode 41 of one of the adjacent solar cells 1 and 1 and the second collecting electrode 42 of the other solar cell 1 are overlapped with each other. Then, the adjacent solar cells 1 and 1 are connected.
- the current collecting electrodes 40 of the adjacent solar cells 1 and 1 are connected to each other by the conductive adhesive 6 (see FIG. 10).
- the conductive adhesive 6 is, for example, a metal paste, specifically, a silver paste.
- the photoelectric conversion unit 2 is exposed in the demarcation region 111 (see FIG. 2), that is, the photoelectric conversion unit 2 is exposed at the location where the demarcation line 11 is located (definition region 111). Since the main surface 20 of the above is not covered with the transparent insulating layer 5 or the plating layer 40, the cell assembly 100 can be easily cut only by irradiating the demarcation line 11 with a laser.
- the main surface 20 of the photoelectric conversion unit 2 is not covered with the transparent insulating layer 5 or the plating layer 40 at the portion where the demarcation line 11 is located (demarcation region 111). Therefore, the cell assembly 100 that can be easily cut can be manufactured only by irradiating the demarcation line 11 with a laser.
- a laser is applied to a portion of the main surface 20 of the photoelectric conversion unit 2 of the cell assembly 100 of the solar cell that is not covered by the transparent insulating layer 5 or the plating layer 40. It can be easily obtained by dividing the cell assembly 100.
- the laser is applied to a portion of the photoelectric conversion portion 2 of the cell assembly 100 of the solar cell that is not covered with the transparent insulating layer 5 or the plating layer 40.
- the solar cell 1 can be easily obtained.
- the cell assembly and the solar cell of the present invention are not limited to the above-described embodiment, and it goes without saying that various modifications can be made without departing from the gist of the present invention.
- the configuration of one embodiment can be added to the configuration of another embodiment, and a part of the configuration of one embodiment can be replaced with the configuration of another embodiment.
- some of the configurations of certain embodiments can be deleted.
- the demarcation line 11 extends to the center in the width direction (for example, the x-axis direction) of each demarcation area 111, but if it is included in each demarcation area 111, the extending position is It doesn't matter. Even when the demarcation line 11 extends to a position biased in the width direction of the demarcation region 111, the solar cell 1 can be obtained by cutting the cell assembly 100 at the demarcation line 11.
- the widths of the plurality of defined regions 111 provided in the cell assembly 100 may be different.
- each layer constituting the cell assembly 100 and the solar cell 1 are not limited to those of the above embodiment.
- the plating layer 40 of the current collecting electrode 4 has a two-layer structure, but a third plating formed by electrolytic plating or electroless plating (including replacement plating) on a second plating layer made of Cu. Layers may be provided.
- the current collecting electrode 4 may include an electrode layer formed by a method other than the plating method in addition to the plating layer 40.
- the solar cell 1 may be a single-sided light receiving type.
- the cell assembly 100 is cut by irradiating the demarcation line 11 with a laser, but the method of dividing the cell assembly 100 is not limited to cutting with a laser.
- the solar cell 1 may be obtained by forming a groove along the demarcation line 11 of the cell assembly 100 by a laser or a mechanical scribe and dividing the cell assembly 100 along the groove. Even in this case, since the transparent insulating layer 5 and the plating layer 40 are not on the demarcation line 11, the groove can be easily formed, and the cell assembly 100 can be easily divided into the solar cell 1.
- a cell aggregate which is a raw material of a solar cell constituting a solar cell by connecting a plurality of them in a single ring, and includes a metal electrode formed by a plating method and easily. It is possible to provide a cuttable cell aggregate, a method for producing the cell aggregate, a solar cell formed from the cell aggregate, and a method for producing the solar cell.
- the cell assembly of the solar cell of the present invention is a cell assembly of a solar cell having a plurality of small compartments which are divided into a plurality of solar cell cells and having one side in a straight line in a plan view.
- Each of the plurality of subsections is defined by a demarcation line which is a straight line substantially parallel to one side of the linear shape of the cell assembly, and has a photoelectric conversion unit having a main surface and a main surface of the photoelectric conversion unit.
- a transparent conductive layer having a first region and a second region having a position different from that of the first region, which is provided in a region corresponding to each of the plurality of subsections, and on the first region of the transparent conductive layer.
- the cell assembly can be easily performed simply by irradiating the demarcation line with a laser. Can be cut into.
- the method for manufacturing a cell assembly of a solar cell of the present invention is a cell assembly of a solar cell having a plurality of small compartments which are divided into a plurality of solar cell cells and having one side in a straight line in a plan view. It is a method for manufacturing a cell assembly of a solar cell in which each of the plurality of subsections is defined by a demarcation line which is a straight line substantially parallel to the one side of the cell assembly.
- the transparent conductive layer includes a step of forming a transparent insulating layer having an opening in which a part of the layer is exposed and a step of forming a current collecting electrode in the transparent conductive layer exposed from the opening by a plating method.
- the step of forming, the step of forming the transparent insulating layer, and the step of forming the current collecting electrode are performed so that the photoelectric conversion portion is exposed along the demarcation line and in the demarcation region including the demarcation line. Be told.
- the cell assembly can be easily formed by simply irradiating the demarcation line with a laser. It is possible to manufacture a cell assembly of a solar cell that can be cut.
- a plurality of solar cells can be connected to each other by a single ring to form a solar cell string, and a linear one side and a linear opposite side substantially parallel to the one side in a plan view.
- a solar cell having a main surface and a transparent conductive layer provided on the main surface of the photoelectric conversion unit and having a first region and a second region having a position different from that of the first region.
- the one side is provided with a current collecting electrode provided on the first region of the transparent conductive layer and including a plating layer, and a transparent insulating layer provided on the second region of the transparent conductive layer. And on the opposite side, the photoelectric conversion part is exposed.
- the cell assembly is divided by irradiating a laser on a portion of the main surface of the photoelectric conversion portion of the cell assembly of the solar cell that is not covered with the transparent insulating layer or the plating layer. It is easy to obtain.
- the method for manufacturing a solar cell of the present invention is a method for manufacturing a solar cell using a cell aggregate of a solar cell, and includes a step of cutting the cell aggregate by irradiating the demarcation line with a laser. ..
- the solar cell can be easily formed by irradiating a laser on a portion of the photoelectric conversion portion of the cell assembly of the solar cell that is not covered with the transparent insulating layer or the plating layer to divide the cell assembly. Obtained in.
Landscapes
- Photovoltaic Devices (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
Abstract
Description
複数が互いにシングリング接続されることで太陽電池ストリングを構成することができ、平面視において直線状の一の辺及び該一の辺に略平行な直線状の対辺を有する太陽電池セルであって、
主面を有する光電変換部と、
前記光電変換部の主面に設けられ、第一領域及び該第一領域と位置が異なる第二領域を有する透明導電層と、
前記透明導電層の前記第一領域上に設けられ、めっき層を含む集電電極と、
前記透明導電層の前記第二領域上に設けられた透明絶縁層と、を備え、
前記一の辺及び前記対辺において、前記光電変換部が露出している。
Claims (4)
- それぞれが分割されることで複数の太陽電池セルとなる複数の小区画を有し平面視直線状の1辺を有する太陽電池のセル集合体であって、
前記複数の小区画の各々は、前記セル集合体の前記直線状の1辺に略平行な直線である画定線により画定され、
主面を有する光電変換部と、
前記光電変換部の主面のうち前記複数の小区画の各々に対応する領域に設けられ、第一領域及び該第一領域と位置が異なる第二領域を有する透明導電層と、
前記透明導電層の前記第一領域上に設けられ、めっき層を含む集電電極と、
前記透明導電層の前記第二領域上に設けられた透明絶縁層と、を備え、
前記画定線に沿い且つ該画定線を含む領域である画定領域において、前記光電変換部が露出している、
太陽電池の集合セル。 - それぞれが分割されることで複数の太陽電池セルとなる複数の小区画を有し平面視直線状の1辺を有する太陽電池のセル集合体であって、前記複数の小区画の各々が、前記セル集合体の前記1辺に略平行な直線である画定線により画定される太陽電池のセル集合体の製造方法であって、
主面を有する光電変換部を準備する工程と、
前記光電変換部の主面のうち前記複数の小区画の各々に対応する領域に、透明導電層を形成する工程と、
前記透明導電層に、前記透明導電層の一部が露出する開口を有する透明絶縁層を形成する工程と、
前記開口から露出した前記透明導電層に、めっき法により集電電極を形成する工程と、
を含み、
前記透明導電層を形成する工程、前記透明絶縁層を形成する工程、及び、前記集電電極を形成する工程は、前記画定線に沿い且つ該画定線を含む画定領域において、前記光電変換部が露出するように行われる、
太陽電池のセル集合体の製造方法。 - 複数が互いにシングリング接続されることで太陽電池ストリングを構成することができ、平面視において直線状の一の辺及び該一の辺に略平行な直線状の対辺を有する太陽電池セルであって、
主面を有する光電変換部と、
前記光電変換部の主面に設けられ、第一領域及び該第一領域と位置が異なる第二領域を有する透明導電層と、
前記透明導電層の前記第一領域上に設けられ、めっき層を含む集電電極と、
前記透明導電層の前記第二領域上に設けられた透明絶縁層と、を備え、
前記一の辺及び前記対辺において、前記光電変換部が露出している、
太陽電池セル。 - 請求項1に記載の太陽電池のセル集合体を用いた太陽電池セルの製造方法であって、
前記画定線にレーザーを当てることにより、前記セル集合体を切断する工程を含む、
太陽電池セルの製造方法。
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022512221A JP7682164B2 (ja) | 2020-03-30 | 2021-03-29 | セル集合体、セル集合体の製造方法、太陽電池セル、及び、太陽電池セルの製造方法 |
| US17/907,231 US12107180B2 (en) | 2020-03-30 | 2021-03-29 | Cell assembly, method for producing cell assembly, solar cell, and method for producing solar cell |
| CN202180024877.2A CN115398652B (zh) | 2020-03-30 | 2021-03-29 | 电池单元集合体、电池单元集合体的制造方法、太阳电池单元、及太阳电池单元的制造方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020060126 | 2020-03-30 | ||
| JP2020-060126 | 2020-03-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2021200837A1 true WO2021200837A1 (ja) | 2021-10-07 |
Family
ID=77928480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2021/013333 Ceased WO2021200837A1 (ja) | 2020-03-30 | 2021-03-29 | セル集合体、セル集合体の製造方法、太陽電池セル、及び、太陽電池セルの製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US12107180B2 (ja) |
| JP (1) | JP7682164B2 (ja) |
| CN (1) | CN115398652B (ja) |
| WO (1) | WO2021200837A1 (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR3141285B1 (fr) * | 2022-10-20 | 2024-10-04 | Commissariat Energie Atomique | Augmentation de la densification de modules solaires par interconnexion superposée maximisée |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014199875A (ja) * | 2013-03-29 | 2014-10-23 | 株式会社カネカ | 太陽電池、およびその製造方法、ならびに太陽電池モジュール |
| JP2015198142A (ja) * | 2014-03-31 | 2015-11-09 | 株式会社カネカ | 結晶シリコン太陽電池およびその製法、ならびに太陽電池モジュール |
| JP2018085509A (ja) * | 2016-11-23 | 2018-05-31 | エルジー エレクトロニクス インコーポレイティド | 太陽電池及びその製造方法 |
| WO2019087590A1 (ja) * | 2017-10-30 | 2019-05-09 | 株式会社カネカ | 両面電極型太陽電池および太陽電池モジュール |
| WO2019130859A1 (ja) * | 2017-12-27 | 2019-07-04 | 株式会社カネカ | 光電変換素子の製造方法及びめっき用治具、めっき装置 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2938634B2 (ja) * | 1991-10-08 | 1999-08-23 | キヤノン株式会社 | 太陽電池モジュール |
| EP2068369A1 (en) * | 2007-12-03 | 2009-06-10 | Interuniversitair Microelektronica Centrum (IMEC) | Photovoltaic cells having metal wrap through and improved passivation |
| NL2004065C2 (en) * | 2010-01-06 | 2011-07-07 | Stichting Energie | Solar panel module and method for manufacturing such a solar panel module. |
| US8969714B2 (en) * | 2010-09-29 | 2015-03-03 | Kyocera Corporation | Solar cell module and method of manufacturing solar cell module |
| DE112011105671B4 (de) * | 2011-09-28 | 2023-08-03 | Panasonic Intellectual Property Management Co., Ltd. | Solarzelle und Verfahren zum Fertigen einer Solarzelle |
| JP6065009B2 (ja) * | 2012-06-29 | 2017-01-25 | パナソニックIpマネジメント株式会社 | 太陽電池モジュール |
| JP6311999B2 (ja) * | 2013-02-26 | 2018-04-18 | パナソニックIpマネジメント株式会社 | 太陽電池モジュールおよび太陽電池モジュールの製造方法 |
| MX377666B (es) | 2014-05-27 | 2025-03-10 | Maxeon Solar Pte Ltd | Referencia cruzada a aplicaciones relacionadas. |
| WO2019003818A1 (ja) | 2017-06-26 | 2019-01-03 | 株式会社カネカ | 太陽電池およびその製造方法、ならびに太陽電池モジュール |
| CN110277463B (zh) * | 2019-07-10 | 2024-03-15 | 通威太阳能(成都)有限公司 | 一种太阳能电池结构制作方法 |
-
2021
- 2021-03-29 WO PCT/JP2021/013333 patent/WO2021200837A1/ja not_active Ceased
- 2021-03-29 JP JP2022512221A patent/JP7682164B2/ja active Active
- 2021-03-29 US US17/907,231 patent/US12107180B2/en active Active
- 2021-03-29 CN CN202180024877.2A patent/CN115398652B/zh active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014199875A (ja) * | 2013-03-29 | 2014-10-23 | 株式会社カネカ | 太陽電池、およびその製造方法、ならびに太陽電池モジュール |
| JP2015198142A (ja) * | 2014-03-31 | 2015-11-09 | 株式会社カネカ | 結晶シリコン太陽電池およびその製法、ならびに太陽電池モジュール |
| JP2018085509A (ja) * | 2016-11-23 | 2018-05-31 | エルジー エレクトロニクス インコーポレイティド | 太陽電池及びその製造方法 |
| WO2019087590A1 (ja) * | 2017-10-30 | 2019-05-09 | 株式会社カネカ | 両面電極型太陽電池および太陽電池モジュール |
| WO2019130859A1 (ja) * | 2017-12-27 | 2019-07-04 | 株式会社カネカ | 光電変換素子の製造方法及びめっき用治具、めっき装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20230109458A1 (en) | 2023-04-06 |
| CN115398652B (zh) | 2025-06-10 |
| CN115398652A (zh) | 2022-11-25 |
| JPWO2021200837A1 (ja) | 2021-10-07 |
| JP7682164B2 (ja) | 2025-05-23 |
| US12107180B2 (en) | 2024-10-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4518973B2 (ja) | 太陽電池およびその製造方法 | |
| US8723023B2 (en) | Photovoltaic device with a discontinuous interdigitated heterojunction structure | |
| US10510907B2 (en) | Solar panel | |
| JP7146805B2 (ja) | 太陽電池およびその太陽電池を備えた電子機器 | |
| US8941160B2 (en) | Photoelectric conversion module and method of manufacturing the same | |
| WO2013046351A1 (ja) | 太陽電池及び太陽電池の製造方法 | |
| WO2012043516A1 (ja) | 太陽電池モジュール及びその製造方法 | |
| CN107318269B (zh) | 太阳能电池及其制造方法、太阳能电池模块、以及布线板 | |
| JP3449155B2 (ja) | 光電変換装置およびその製造方法 | |
| CN104638040A (zh) | 太阳能电池组 | |
| CN111868934B (zh) | 玻璃建材 | |
| WO2021200837A1 (ja) | セル集合体、セル集合体の製造方法、太陽電池セル、及び、太陽電池セルの製造方法 | |
| JP7442377B2 (ja) | 太陽電池ストリング及び太陽電池ストリングの製造方法 | |
| JP2015053303A (ja) | 太陽電池セル、太陽電池モジュール、および太陽電池セルの製造方法。 | |
| US9954122B2 (en) | Solar cell apparatus and method of fabricating the same | |
| CN113826214B (zh) | 晶体硅太阳电池 | |
| US20170092789A1 (en) | Solar cell module | |
| JP2015029069A (ja) | 太陽電池モジュール | |
| JPWO2014050078A1 (ja) | 太陽電池モジュール | |
| CN114651336A (zh) | 太阳能电池、太阳能电池模块以及太阳能电池的制造方法 | |
| US20170092797A1 (en) | Solar cell module | |
| JP2021163780A (ja) | 太陽電池セル、太陽電池モジュール及び太陽電池セル製造方法 | |
| JP2024146453A (ja) | 半製品セル集合体、太陽電池セルの製造方法、太陽電池ストリング、及び、太陽電池モジュール | |
| JP2017050476A (ja) | 薄膜化合物太陽電池、薄膜化合物太陽電池の製造方法、薄膜化合物太陽電池アレイおよび薄膜化合物太陽電池アレイの製造方法 | |
| WO2017056371A1 (ja) | 太陽電池モジュールおよび太陽電池セルの製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 21780114 Country of ref document: EP Kind code of ref document: A1 |
|
| ENP | Entry into the national phase |
Ref document number: 2022512221 Country of ref document: JP Kind code of ref document: A |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| 122 | Ep: pct application non-entry in european phase |
Ref document number: 21780114 Country of ref document: EP Kind code of ref document: A1 |
|
| WWG | Wipo information: grant in national office |
Ref document number: 202180024877.2 Country of ref document: CN |