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WO2021259123A1 - 显示面板、显示装置 - Google Patents

显示面板、显示装置 Download PDF

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Publication number
WO2021259123A1
WO2021259123A1 PCT/CN2021/100548 CN2021100548W WO2021259123A1 WO 2021259123 A1 WO2021259123 A1 WO 2021259123A1 CN 2021100548 W CN2021100548 W CN 2021100548W WO 2021259123 A1 WO2021259123 A1 WO 2021259123A1
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WO
WIPO (PCT)
Prior art keywords
light
layer
emitting layer
electrode layer
emitting
Prior art date
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Ceased
Application number
PCT/CN2021/100548
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English (en)
French (fr)
Inventor
陈福栋
闫华杰
黄清雨
焦志强
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BOE Technology Group Co Ltd
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BOE Technology Group Co Ltd
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Priority to US17/768,830 priority Critical patent/US12302712B2/en
Publication of WO2021259123A1 publication Critical patent/WO2021259123A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30Devices specially adapted for multicolour light emission
    • H10K59/32Stacked devices having two or more layers, each emitting at different wavelengths
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/124Insulating layers formed between TFT elements and OLED elements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/10OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H10K50/125OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers specially adapted for multicolour light emission, e.g. for emitting white light
    • H10K50/13OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers specially adapted for multicolour light emission, e.g. for emitting white light comprising stacked EL layers within one EL unit
    • H10K50/131OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers specially adapted for multicolour light emission, e.g. for emitting white light comprising stacked EL layers within one EL unit with spacer layers between the electroluminescent layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/10OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/10OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/19Tandem OLEDs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/1201Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/122Pixel-defining structures or layers, e.g. banks
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/131Interconnections, e.g. wiring lines or terminals
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30Devices specially adapted for multicolour light emission
    • H10K59/35Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H10K59/353Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels characterised by the geometrical arrangement of the RGB subpixels
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2101/00Properties of the organic materials covered by group H10K85/00
    • H10K2101/10Triplet emission
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301Details of OLEDs
    • H10K2102/302Details of OLEDs of OLED structures
    • H10K2102/3023Direction of light emission
    • H10K2102/3026Top emission

Definitions

  • the present disclosure relates to the field of display structure design. Specifically, the present disclosure relates to display panels and display devices.
  • the current organic light emitting diode (OLED) display pixel structure mainly includes an RGB (red, green, and blue) side-by-side structure and a white light OLED and color film (WOLED+CF) structure.
  • RGB red, green, and blue
  • WOLED+CF white light OLED and color film
  • the present disclosure proposes a display panel.
  • the display panel includes a substrate, one side of the substrate is provided with a plurality of pixel units, and each pixel unit includes a first electrode layer, a first light-emitting layer, The second electrode layer, the second light emitting layer, the third electrode layer, the third light emitting layer and the fourth electrode layer, wherein the first light emitting layer, the second light emitting layer and the third light emitting layer emit different colors
  • the first light-emitting layer and the second light-emitting layer share the second electrode layer, and the second light-emitting layer and the third light-emitting layer share the third electrode layer.
  • the first electrode layer is an anode of the first light-emitting layer
  • the second electrode layer is multiplexed as a cathode of the first light-emitting layer and an anode of the second light-emitting layer
  • the third electrode layer is multiplexed as a cathode of the second light-emitting layer and an anode of the third light-emitting layer.
  • the orthographic projection of the first light-emitting layer on the substrate, the orthographic projection of the second light-emitting layer on the substrate and the third light-emitting layer on the substrate are completely coincident.
  • the first light-emitting layer emits green light
  • the second light-emitting layer emits red light
  • the third light-emitting layer emits blue light
  • a pixel defining layer is arranged between the substrate and the first light-emitting layer, and the first electrode layer is arranged in the first opening of the pixel defining layer.
  • a first insulating layer is further provided between the second electrode layer and the third electrode layer, and the second light-emitting layer is provided in a second opening defined by the first insulating layer Neutralize part of the surface of the first insulating layer.
  • the orthographic projection of the first insulating layer on the substrate is grid-shaped.
  • the third electrode layer and the fourth electrode layer are further provided with a second insulating layer, and the third light-emitting layer is provided in a third opening defined by the second insulating layer and Part of the surface of the second insulating layer.
  • the orthographic projection of the second insulating layer on the substrate is grid-shaped.
  • the width of the first insulating layer and the second insulating layer in a direction parallel to the substrate is 2-5 microns.
  • the second electrode layer includes a light-emitting area and a second lead-out area
  • the third electrode layer includes a part located in the light-emitting area and a part located in the third lead-out area
  • the fourth electrode The layer includes a portion located in the light-emitting area and a portion located in the fourth lead-out area, and a portion located in the second lead-out area, a portion located in the third lead-out area, and a portion located in the fourth lead-out area, respectively Are arranged on different sides of the light-emitting area.
  • the material forming the second electrode layer, the third electrode layer, and the fourth electrode layer includes a transparent conductive material.
  • the display panel further includes an encapsulation layer disposed on the surface of the plurality of pixel units away from the substrate, the encapsulation layer covering the substrate and each pixel unit The fourth electrode layer and the second insulating layer.
  • the present disclosure proposes a display device.
  • the display device includes the above-mentioned display panel.
  • the present disclosure proposes a manufacturing method of a display panel, including:
  • a first electrode layer, a first light-emitting layer, a second electrode layer, a second light-emitting layer, a third electrode layer, a third light-emitting layer, and a fourth electrode layer are sequentially formed on the substrate, wherein the first light-emitting layer, The second light-emitting layer and the third light-emitting layer emit light of different colors, and the first light-emitting layer and the second light-emitting layer share the second electrode layer and are multiplexed as the first light-emitting layer
  • the cathode of the second light-emitting layer and the anode of the second light-emitting layer, and the cathode of the second light-emitting layer and the third light-emitting layer share the third electrode layer.
  • the method before forming the first electrode layer on the substrate, the method further includes:
  • each pixel unit on the substrate where the four lead-out lines are located on different sides of the pixel unit, and the first lead-out line is used to connect to the first electrode layer, The two lead wires are used to connect to the second electrode layer, the third lead wires are used to connect to the third electrode layer, and the fourth lead wires are used to connect to the fourth electrode layer.
  • the method before forming the first light-emitting layer on the substrate, the method further includes:
  • a pixel defining layer is formed on the substrate, and the first electrode layer is located in a first opening defined by the pixel defining layer.
  • the method further includes:
  • a first insulating layer is formed on the second electrode layer, and the first insulating layer is used to define a second opening for placing the second light-emitting layer.
  • the method further includes:
  • a second insulating layer is formed on the third electrode layer, and the second insulating layer is used to define a third opening for placing the third light-emitting layer.
  • the method further includes: forming an encapsulation layer on a side of the fourth electrode layer away from the substrate.
  • the mask used to make the first light-emitting layer, the mask used to make the second light-emitting layer, and the mask used to make the third light-emitting layer are the same.
  • FIG. 1 is a schematic diagram of a cross-sectional structure of a display panel according to an embodiment of the present disclosure
  • FIG. 2 is a schematic diagram of a cross-sectional structure of a display panel according to another embodiment of the present disclosure
  • FIG. 3 is a schematic diagram of the top view relationship of three electrode layers according to an embodiment of the present disclosure.
  • FIG. 4 is a schematic diagram of various steps in a manufacturing method of a display panel according to another embodiment of the present disclosure.
  • the two structures in the related art are designed with R/G/B/(W) side by side as a group of pixels, and the required light color is obtained by adjusting the relative intensity of R/G/B, although the sub-pixels are arranged side by side. It is conducive to the thin and light design of the display device, but causes its resolution to be lower.
  • the embodiment of the present disclosure proposes a vertical pixel structure design. In each pixel unit, sub-pixels emitting light of different colors are vertically stacked, and two adjacent light-emitting layers above and below share one electrode layer.
  • the pixel unit of the vertical structure The pixel density (PPI) can be increased many times, and the common electrode layer is multiplexed as the cathode of the lower light-emitting layer and the anode of the upper light-emitting layer at the same time, so that the thickness of the display panel with the vertical pixel structure design is thinner.
  • the shapes of the three light-emitting layers can be completely the same. In this way, the same mask can be used for the three light-emitting layers in the manufacturing process; and the two adjacent upper and lower electrodes are separated by an insulating layer to prevent short circuits.
  • the present disclosure proposes a display panel. It should be noted that only one pixel unit is shown in FIGS. 1 to 4 as an example, but in actual design, the substrate may be composed of hundreds or thousands of pixel units arranged in an array.
  • the display panel includes a substrate 100.
  • a plurality of pixel units P are provided on one side of the substrate 100.
  • Each pixel unit P includes a first electrode layer 210, a first electrode layer 210, The light-emitting layer 310, the second electrode layer 220, the second light-emitting layer 320, the third electrode layer 230, the third light-emitting layer 330, and the fourth electrode layer 240, wherein the first light-emitting layer 310, the second light-emitting layer 320, and the third light-emitting layer
  • the light emitting layer 330 emits light of different colors, and the first light emitting layer 310 and the second light emitting layer 320 share the second electrode layer 220, and the second light emitting layer 320 and the third light emitting layer 330 share the third electrode layer 230.
  • the three-color sub-pixel structure is vertically integrated into one sub-pixel opening, and can be individually controlled, so that the pixel density (PPI) of the display panel is increased by three times; at the same time, the two adjacent to the top and bottom emit light. Sharing the same electrode layer between layers can help reduce the total thickness of the vertical pixel structure.
  • the display panel of the embodiment of the present disclosure adopts a vertical pixel structure design, which can increase the pixel density of the display panel by at least three times, and two adjacent light-emitting layers above and below share one electrode layer, so that the middle electrode layer is multiplexed at the same time It is the cathode of the lower light-emitting layer and the anode of the upper light-emitting layer, thereby facilitating the thinning of the display panel designed with the vertical pixel structure.
  • the first electrode layer is the anode of the first light-emitting layer
  • the second electrode layer is multiplexed as the cathode of the first light-emitting layer and the cathode of the second light-emitting layer.
  • the anode, the third electrode layer is multiplexed as the cathode of the second light-emitting layer and the anode of the third light-emitting layer.
  • the orthographic projection of the first light-emitting layer 310 on the substrate 100, the orthographic projection of the second light-emitting layer 320 on the substrate 100, and the orthographic projection of the third light-emitting layer 330 on the substrate 100 All coincide completely.
  • the three light-emitting layers use the same mask during the manufacturing process, that is, the overlapping area of the three light-emitting layers is the light-emitting area A, which can effectively reduce the manufacturing cost of the display panel and improve the alignment of the manufacturing process Accuracy.
  • the first light emitting layer 310 may emit green light (G)
  • the second light emitting layer 320 may emit red light (R)
  • the third light emitting layer 330 may emit blue light (B).
  • the brightness of the green light emitted by the first light-emitting layer 310 at the bottom is the brightest, and the light intensity of the blue light emitted by the third light-emitting layer 330 at the top is the weakest. Therefore, the vertical sequence of GRB from bottom to top can make the white light emitted by the display panel more balanced and lower energy consumption.
  • the present application is not limited thereto.
  • the first light-emitting layer 310 may emit blue light (B)
  • the second light-emitting layer 320 may emit red light (R)
  • the third light-emitting layer 330 may emit green light (G).
  • a pixel defining layer 410 may be further provided between the substrate 100 and the first light-emitting layer 310, and the first electrode layer 210 may be arranged in the first opening of the pixel defining layer 410 411 in.
  • the pixel defining layer 410 can not only define the area of the first electrode layer 210, but can also insulate the first electrode layer 210 serving as the anode of the first light-emitting layer 210 from the second electrode layer 220 of the cathode, thereby avoiding the production process Short-circuit problem caused by misalignment.
  • a first insulating layer 420 may be further provided between the second electrode layer 220 and the third electrode layer 230, and the second light-emitting layer 320 may be provided on the first insulating layer 420.
  • the second opening 421 is defined and a part of the surface of the first insulating layer 420 is defined.
  • the third electrode layer 230 and the fourth electrode layer 240 may also be provided with a second insulating layer 430, and the third light-emitting layer 330 may be provided in the third opening 431 defined by the second insulating layer 430 and the second insulating layer 430. Part of the surface.
  • the first insulating layer 420 can isolate the second electrode layer 220 as the anode of the second light-emitting layer 320 from the third electrode layer 230 as the cathode, and the second insulating layer 430 can serve as The third electrode layer 230 of the anode of the third light-emitting layer 330 is isolated from the fourth electrode layer 240 of the cathode, so that the circuit safety of the vertical pixel structure is better.
  • the width of the first insulating layer 420 disposed around the light-emitting area in a direction parallel to the substrate may be 2-5 microns
  • the width of the second insulating layer 430 disposed around the light-emitting area may be 2-5 microns.
  • the width of the insulating layer is greater than the alignment accuracy for forming the light-emitting layer (generally 1.5 micrometers), the problem of short-circuiting of the cathodes of the upper and lower light-emitting layers due to the misalignment can be prevented.
  • the orthographic projections of the first insulating layer 420 and the second insulating layer 430 on the substrate 100 are both grid-shaped.
  • the second electrode layer 220 may include portions located in the light-emitting area A and the first lead-out area C1 and the third electrode layer 230 may include portions located in the light-emitting area A and the second lead-out area C2.
  • the fourth electrode layer 240 may include a portion located in the light-emitting area A and the third lead-out area C3, and a portion located in the first lead-out area C1, a portion located in the second lead-out area C2, and a portion located in the third lead-out area C3 The parts are respectively arranged on different sides of the light-emitting area A.
  • the first lead-out area C1 may be arranged above the light-emitting area A
  • the second lead-out area C2 may be arranged on the left side of the light-emitting area A
  • the third lead-out area C3 may be arranged below the light-emitting area A.
  • the right side of the light-emitting area A is left for the lead out of the first electrode layer.
  • the materials forming the second electrode layer 220, the third electrode layer 230, and the third electrode layer include transparent conductive materials, specifically, for example, a dielectric/metal/dielectric (DMD) stack structure, etc., so that not only makes transparent
  • the three electrode layers facilitate the transmission of light, and the middle two electrode layers can be reused as the cathode of the lower light-emitting layer and the anode of the upper light-emitting layer.
  • the material forming the first electrode layer 210 may include indium tin oxide (ITO), so that the luminous efficiency of the first light-emitting layer 310 may be higher.
  • ITO indium tin oxide
  • the surface of the plurality of pixel units away from the substrate 100 may also be provided with an encapsulation layer 500, and the encapsulation layer 500 covers the substrate 100 and the fourth electrode layer 240, The second insulating layer 420.
  • a plurality of pixel units F with a vertical structure design on the substrate 100 can be encapsulated by the encapsulation layer 500, so that the display panel is more resistant to oxygen and water, and the service life of the display panel is longer.
  • the present disclosure proposes a display panel with a vertical pixel structure design, which can increase the pixel density of the display panel by at least three times, and the two adjacent light-emitting layers share the same One electrode layer, in this way, the middle electrode layer is simultaneously multiplexed as the cathode of the lower light-emitting layer and the anode of the upper light-emitting layer, thereby facilitating the thinning of the display panel with the vertical pixel structure design.
  • a display device includes the above-mentioned display panel.
  • the pixel density of the display panel is high and the thickness is thinner, so that the display device has a higher definition and is also beneficial to a thinner and lighter design.
  • the specific type of the display device is not particularly limited, such as a display screen, a TV, a mobile phone, a tablet computer, or a smart watch, etc., and those skilled in the art can perform corresponding actions according to the actual use requirements of the display device. The choice is not repeated here.
  • the display device also includes other necessary components and structures. Taking the OLED display screen as an example, specifically such as touch panel, housing, control circuit board or power cord, etc., in the field Technicians can make corresponding supplements according to the function of the display device, which will not be repeated here.
  • the present disclosure proposes a display device whose display panel has a high pixel density and a thinner thickness, so that the display device has a higher definition and is also conducive to a thinner and lighter design.
  • first”, “second”, and “third” are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features.
  • the features defined with “first”, “second”, and “third” may explicitly or implicitly include at least one of the features.
  • “plurality” means at least two, such as two, three, etc., unless otherwise specifically defined.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

本公开提出了显示面板、显示装置。该显示面板包括衬底,衬底的一侧设置有多个像素单元,每个像素单元包括依次层叠设置的第一电极层、第一发光层、第二电极层、第二发光层、第三电极层、第三发光层和第四电极层,其中,三个发光层发出不同颜色的光,且上下相邻的两个发光层共用一个电极层。

Description

显示面板、显示装置
相关申请的交叉引用
本申请主张在2020年6月22日在中国提交的中国专利申请号No.202010574744.X的优先权,其全部内容通过引用包含于此。
技术领域
本公开涉及显示结构设计领域,具体的,本公开涉及显示面板、显示装置。
背景技术
现阶段的有机发光二极管(OLED)显示像素结构,主要包括RGB(红绿蓝)并排(Side-by-side)结构和白光OLED与彩膜(WOLED+CF)结构。其中,前者主要应用于小尺寸便携式装置等,而后者主要应用于大尺寸电视(TV)等装置。
发明内容
在本公开的第一方面,本公开提出了一种显示面板。
根据本公开的实施例,所述显示面板包括衬底,所述衬底的一侧设置有多个像素单元,每个所述像素单元包括依次层叠设置的第一电极层、第一发光层、第二电极层、第二发光层、第三电极层、第三发光层和第四电极层,其中,所述第一发光层、所述第二发光层和所述第三发光层发出不同颜色的光,且所述第一发光层和所述第二发光层共用所述第二电极层,所述第二发光层和所述第三发光层共用所述第三电极层。
根据本公开的实施例,所述第一电极层为所述第一发光层的阳极,所述第二电极层复用为所述第一发光层的阴极和所述第二发光层的阳极,所述第三电极层复用为所述第二发光层的阴极和所述第三发光层的阳极。
根据本公开的实施例,所述第一发光层在所述衬底上的正投影、所述第二发光层在所述衬底上的正投影与所述第三发光层在所述衬底上的正投影都 完全重合。
根据本公开的实施例,所述第一发光层发出绿光,所述第二发光层发出红光,且所述第三发光层发出蓝光。
根据本公开的实施例,所述衬底与所述第一发光层之间设置有像素界定层,且所述第一电极层设置在所述像素界定层的第一开口中。
根据本公开的实施例,所述第二电极层与所述第三电极层之间还设置有第一绝缘层,且所述第二发光层设置在所述第一绝缘层限定的第二开口中及所述第一绝缘层的部分表面。
根据本公开的实施例,所述第一绝缘层在所述衬底上的正投影为网格状。
根据本公开的实施例,所述第三电极层与所述第四电极层还设置有第二绝缘层,且所述第三发光层设置在所述第二绝缘层限定的第三开口中及所述第二绝缘层的部分表面。
根据本公开的实施例,所述第二绝缘层在所述衬底上的正投影为网格状。
根据本公开的实施例,所述第一绝缘层和所述第二绝缘层在平行于衬底的方向上的宽度为2~5微米。
根据本公开的实施例,所述第二电极层包括发光区和第二引出区,所述第三电极层包括位于所述发光区的部分和位于第三引出区的部分,所述第四电极层包括位于所述发光区的部分和位于第四引出区的部分,并且,位于所述第二引出区的部分、位于所述第三引出区的部分和位于所述第四引出区的部分分别设置在所述发光区的不同侧。
根据本公开的实施例,形成所述第二电极层、所述第三电极层和所述第四电极层的材料包括透明导电材料。
根据本公开的实施例,所述显示面板还包括封装层,设置在所述多个像素单元远离所述衬底的表面,所述封装层覆盖所述衬底和每个所述像素单元中的所述第四电极层、所述第二绝缘层。
在本公开的第二方面,本公开提出了一种显示装置。
根据本公开的实施例,所述显示装置包括上述的显示面板。
在本公开的第二方面,本公开提出了一种显示面板的制作方法,包括:
在衬底上依次形成第一电极层、第一发光层、第二电极层、第二发光层、第三电极层、第三发光层和第四电极层,其中,所述第一发光层、所述第二发光层和所述第三发光层发出不同颜色的光,且所述第一发光层和所述第二发光层共用所述第二电极层,复用为所述第一发光层的阴极和所述第二发光层的阳极,所述第二发光层的阴极和所述第三发光层共用所述第三电极层。
根据本公开的实施例,在衬底上形成第一电极层之前,所述方法还包括:
在衬底上每个像素单元中形成四个引出线,其中,所述四个引出线分别位于所述像素单元的不同侧,其中第一引出线用于与所述第一电极层连接,第二引出线用于与所述第二电极层连接,第三引出线用于与所述第三电极层连接,及第四引出线用于与所述第四电极层连接。
根据本公开的实施例,在衬底上形成第一发光层之前,所述方法还包括:
在所述衬底上形成像素界定层,所述第一电极层位于所述像素界定层限定的第一开口中。
根据本公开的实施例,在所述衬底上形成所述第二电极层之后,及在所述衬底上形成所述第二发光层之前,所述方法还包括:
在所述第二电极层上形成第一绝缘层,所述第一绝缘层用于限定出放置所述第二发光层的第二开口。
根据本公开的实施例,在所述衬底上形成所述第三电极层之后,及在所述衬底上形成所述第三发光层之前,所述方法还包括:
在所述第三电极层上形成第二绝缘层,所述第二绝缘层用于限定出放置所述第三发光层的第三开口。
根据本公开的实施例,所述方法还包括:在所述第四电极层远离所述衬底的一侧形成封装层。
根据本公开的实施例,用于制作第一发光层的掩膜板、用于制作第二发光层的掩膜板和用于制作第三发光层的掩膜板相同。
本公开的附加方面和优点将在下面的描述中部分给出,部分将从下面的描述中变得明显,或通过本公开的实践了解到。
附图说明
本公开的上述的方面结合下面附图对实施例的描述进行解释,其中:
图1是本公开一个实施例的显示面板的截面结构示意图;
图2是本公开另一个实施例的显示面板的截面结构示意图;
图3是本公开一个实施例的三个电极层的俯视关系示意图;
图4是本公开另一个实施例的显示面板的制作方法各步骤示意图。
附图标记
100 衬底
210 第一电极层
211 第一引出线
310 第一发光层
220 第二电极层
221 第二引出线
320 第二发光层
230 第三电极层
231 第三引出线
330 第三发光层
240 第四电极层
241 第四引出线
410 像素界定层
411 第一开口
420 第一绝缘层
421 第二开口
430 第三绝缘层
431 第三开口
500 封装层
具体实施方式
下面详细描述本公开的实施例,本技术领域人员会理解,下面实施例旨 在用于解释本公开,而不应视为对本公开的限制。除非特别说明,在下面实施例中没有明确描述具体技术或条件的,本领域技术人员可以按照本领域内的常用的技术或条件或按照产品说明书进行。
相关技术中的两种结构均以R/G/B/(W)并排设计为一组像素,且通过调整R/G/B的相对强度得到需要的光色,虽然将子像素水平并排排列有利于显示装置的轻薄化设计,但是造成其分辨率较低。本公开实施例提出一种垂直像素结构设计,每个像素单元中由发出不同颜色光的子像素垂直层叠设置,且上下相邻的两个发光层共用一个电极层,如此,垂直结构的像素单元的像素密度(PPI)能够提升多倍,且共用的电极层同时复用为下面发光层的阴极和上面发光层的阳极,从而使垂直像素结构设计的显示面板的厚度更薄。此外,三个发光层的形状可以完全相同,如此,三个发光层在制作过程中使用可以同一个掩模板;并且,上下相邻的两个电极间有绝缘层隔离以防止短路。
在本公开的一个方面,本公开提出了一种显示面板。需要说明的是,图1~图4中仅画出一个像素单元作为示例,而实际的设计中衬底上可以由成百上千个阵列排布的像素单元组成。
根据本公开的实施例,参考图1,显示面板包括衬底100,衬底100的一侧设置有多个像素单元P,每个像素单元P包括依次层叠设置的第一电极层210、第一发光层310、第二电极层220、第二发光层320、第三电极层230、第三发光层330和第四电极层240,其中,第一发光层310、第二发光层320和第三发光层330发出不同颜色的光,且第一发光层310和第二发光层320共用第二电极层220,第二发光层320和第三发光层330共用第三电极层230。
如此,将三种颜色的子像素结构垂直地整合到一个子像素开口中,并能够单独地进行控制,从而使显示面板的像素密度(PPI)提升三倍;同时,上下相邻的两个发光层之间共用同一个电极层,可有利于减薄垂直像素结构的总厚度。
本公开实施例的显示面板采用垂直像素结构设计,可使显示面板的像素密度提升至少三倍以上,并且,上下相邻的两个发光层共用一个电极层,如此,中间的电极层同时复用为下面发光层的阴极和上面发光层的阳极,从而有利于垂直像素结构设计的显示面板的轻薄化。
在本公开的一些实施例中,所述第一电极层为所述第一发光层的阳极,所述第二电极层复用为所述第一发光层的阴极和所述第二发光层的阳极,所述第三电极层复用为所述第二发光层的阴极和所述第三发光层的阳极。
在本公开的一些实施例中,第一发光层310在衬底100上的正投影、第二发光层320在衬底100上的正投影与第三发光层330在衬底100上的正投影都完全重合。
如此,三个发光层在制作过程中使用同一个掩模板(Mask),即三个发光层的重合区为发光区A,从而可以有效地降低显示面板的制作成本,并提升制作工艺的对位精度。
在本公开的一些实施例中,第一发光层310可以发出绿光(G),第二发光层320可以发出红光(R),且第三发光层330可以发出蓝光(B)。
如此,对于顶发射模式的OLED显示面板,在最下面的第一发光层310发出绿光的亮度是最亮的,而在最上面的第三发光层330发出蓝光的光强是最弱的,所以,采用从下至上依次为GRB的垂直顺序,可以使显示面板发出的白光更均衡且能耗更低。可以理解,本申请不限于此,例如,第一发光层310可以发出蓝光(B),第二发光层320可以发出红光(R),及第三发光层330可以发出绿光(G)。
在本公开的一些实施例中,参考图2,衬底100与第一发光层310之间还可以设置有像素界定层410,且第一电极层210可以设置在像素界定层410的第一开口411中。
如此,像素界定层410不仅能限定出第一电极层210的区域,还可以将作为第一发光层210阳极的第一电极层210与阴极的第二电极层220绝缘,从而避免由于制作工艺的对位偏差导致的短路问题。
在本公开的一些实施例中,参考图2,第二电极层220与第三电极层230之间还可以设置有第一绝缘层420,且第二发光层320可以设置在第一绝缘层420限定的第二开口421中及第一绝缘层420的部分表面。同时,第三电极层230与第四电极层240还可以设置有第二绝缘层430,且第三发光层330可以设置在第二绝缘层430限定的第三开口431中及第二绝缘层430的部分表面。
如此,与像素界定层410的作用类似,第一绝缘层420可以将作为第二发光层320阳极的第二电极层220与阴极的第三电极层230隔离,而第二绝缘层430可以将作为第三发光层330阳极的第三电极层230与阴极的第四电极层240隔离,从而使垂直像素结构的电路安全性更好。
在本公开的一些实施例中,参考图4的(e),环绕发光区设置的第一绝缘层420在平行于衬底的方向上的宽度可以为2~5微米,而参考图4的(h),环绕发光区设置的第二绝缘层430的宽度可以为2~5微米。
如此,只要绝缘层的宽度大于形成发光层的对位精度(一般为1.5微米),从而可以防止因对位偏差导致上下两层发光层阴极的短路问题。
在本公开的一些实施例中,第一绝缘层420、第二绝缘层430在衬底100上的正投影均为网格状。
在本公开的一些实施例中,第二电极层220可以包括位于发光区A和位于第一引出区C1的部分,第三电极层230可以包括位于发光区A和位于第二引出区C2的部分,且第四电极层240可以包括位于发光区A和位于第三引出区C3的部分,并且,位于第一引出区C1的部分、位于第二引出区C2的部分和位于第三引出区C3的部分分别设置在发光区A的不同侧。
具体例如,可以参考图3,第一引出区C1可以设置在发光区A的上方,第二引出区C2可以设置在发光区A的左侧,第三引出区C3可以设置在发光区A的下方,而发光区A的右侧留给第一电极层的引出。如此设计,可充分利用各个发光层四周的空间,从而使四个电极层有各自的引出方向,进而使垂直结构设计像素单元的电路设计更合理。
根据本公开的实施例,形成第二电极层220、第三电极层230和第三电极层的材料包括透明导电材料,具体例如介质/金属/介质(DMD)堆叠结构等,如此,不仅使透明的三个电极层有利于光的透过,并且,可使中间两个电极层可复用为下面发光层的阴极和上面发光层的阳极。根据本公开的实施例,形成第一电极层210的材料可以包括氧化铟锡(ITO),如此,可使第一发光层310的发光效率更高。
根据本公开的实施例,参考图2,多个像素单元远离衬底100的表面还可以设置有封装层500,且封装层500覆盖衬底100和每个像素单元中的第四 电极层240、第二绝缘层420。
如此,可以通过封装层500将衬底100上的多个垂直结构设计的像素单元F进行封装,从而使显示面板更隔氧阻水,进而使显示面板的使用寿命更长。
具体的制作工艺,可以参考图4的(a)~(j),在衬底100上每个像素单元中预先形成四个引出线,再制作出第一电极层210,且第一电极层210与右侧的第一引出线211搭接;继续形成像素定义层410,然后形成第一发光层310,且第一发光层310通过像素定义层上的第一开口与第一电极层210直接接触;再形成第二电极层220,第二电极层220完全覆盖发光区A并与左侧的第二引出线221搭接;然后形成第一绝缘层420,且第一绝缘层420环绕发光区或者呈网格状;继续使用形成第一发光层310的同一个掩模板形成第二发光层320,且第二发光层320通过第一绝缘层上的第二开口与第二电极层220直接接触;再形成第三电极层230,第三电极层230完全覆盖发光区A并与上方的第三引出线231搭接;然后形成第二绝缘层430,且第二绝缘层430环绕发光区;继续使用形成第一发光层310的同一个掩模板形成第三发光层330,且第三发光层330通过第二绝缘层上的第三开口与第三电极层230直接接触;再形成第四电极层240,第四电极层240完全覆盖发光区A并与下方的第四引出线241搭接;最后,可以在多个像素单元远离衬底100的一侧形成封装层500(图4中的虚线区)。
综上所述,根据本公开的实施例,本公开提出了一种显示面板采用垂直像素结构设计,可使显示面板的像素密度提升至少三倍以上,并且,上下相邻的两个发光层共用一个电极层,如此,中间的电极层同时复用为下面发光层的阴极和上面发光层的阳极,从而有利于垂直像素结构设计的显示面板的轻薄化。
在本公开的另一个方面,本公开提出了一种显示装置。根据本公开的实施例,显示装置包括上述的显示面板。
本公开实施例的显示装置,其显示面板的像素密度高且厚度更薄,从而使显示装置清晰度更高的同时还有利于轻薄化设计。本领域技术人员能够理 解的是,前面针对显示面板所描述的特征和优点,仍适用于该显示装置,在此不再赘述。
根据本公开的实施例,该显示装置的具体类型不受特别的限制,具体例如显示屏、电视、手机、平板电脑或智能手表等,本领域技术人员可根据显示装置的实际使用要求进行相应地选择,在此不再赘述。需要说明的是,该显示装置中除了显示面板以外,还包括其他必要的组成和结构,以OLED显示屏为例,具体例如触控面板、外壳、控制电路板或电源线,等等,本领域技术人员可根据该显示装置的功能进行相应地补充,在此不再赘述。
综上所述,根据本公开的实施例,本公开提出了一种显示装置,其显示面板的像素密度高且厚度更薄,从而使显示装置清晰度更高的同时还有利于轻薄化设计。本领域技术人员能够理解的是,前面针对显示面板所描述的特征和优点,仍适用于该显示装置,在此不再赘述。
在本公开的描述中,需要理解的是,术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”、“轴向”、“径向”、“周向”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本公开和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本公开的限制。
此外,术语“第一”、“第二”、“第三”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”、“第三”的特征可以明示或者隐含地包括至少一个该特征。在本公开的描述中,“多个”的含义是至少两个,例如两个,三个等,除非另有明确具体的限定。
在本说明书的描述中,参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本公开的至少一个实施例或示例中。在本说明书中,对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且,描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示 例中以合适的方式结合。此外,在不相互矛盾的情况下,本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。
尽管上面已经示出和描述了本公开的实施例,可以理解的是,上述实施例是示例性的,不能理解为对本公开的限制,本领域的普通技术人员在本公开的范围内可以对上述实施例进行变化、修改、替换和变型。

Claims (21)

  1. 一种显示面板,包括衬底,所述衬底的一侧设置有多个像素单元,每个所述像素单元包括依次层叠设置的第一电极层、第一发光层、第二电极层、第二发光层、第三电极层、第三发光层和第四电极层,其中,所述第一发光层、所述第二发光层和所述第三发光层发出不同颜色的光,且所述第一发光层和所述第二发光层共用所述第二电极层,所述第二发光层和所述第三发光层共用所述第三电极层。
  2. 根据权利要求1所述的显示面板,其中,所述第一电极层为所述第一发光层的阳极,所述第二电极层复用为所述第一发光层的阴极和所述第二发光层的阳极,所述第三电极层复用为所述第二发光层的阴极和所述第三发光层的阳极。
  3. 根据权利要求1所述的显示面板,其中,所述第一发光层在所述衬底上的正投影、所述第二发光层在所述衬底上的正投影与所述第三发光层在所述衬底上的正投影都完全重合。
  4. 根据权利要求1所述的显示面板,其中,所述第一发光层发出绿光,所述第二发光层发出红光,且所述第三发光层发出蓝光。
  5. 根据权利要求1所述的显示面板,其中,所述衬底与所述第一发光层之间设置有像素界定层,且所述第一电极层设置在所述像素界定层的第一开口中。
  6. 根据权利要求1所述的显示面板,其中,所述第二电极层与所述第三电极层之间还设置有第一绝缘层,且所述第二发光层设置在所述第一绝缘层限定的第二开口中及所述第一绝缘层的部分表面。
  7. 根据权利要求6所述的显示面板,其中,所述第一绝缘层在所述衬底上的正投影为网格状。
  8. 根据权利要求6所述的显示面板,其中,所述第三电极层与所述第四电极层还设置有第二绝缘层,且所述第三发光层设置在所述第二绝缘层限定的第三开口中及所述第二绝缘层的部分表面。
  9. 根据权利要求8所述的显示面板,其中,所述第二绝缘层在所述衬底 上的正投影为网格状。
  10. 根据权利要求8所述的显示面板,其中,所述第一绝缘层和/或所述第二绝缘层在平行于衬底的方向上的宽度为2~5微米。
  11. 根据权利要求3所述的显示面板,其中,所述第二电极层包括位于发光区的部分和位于第一引出区的部分,所述第三电极层包括位于所述发光区的部分和位于第二引出区的部分,所述第四电极层包括位于所述发光区的部分和位于第三引出区的部分,并且,位于所述第二引出区的部分、位于所述第三引出区的部分和位于所述第四引出区的部分分别设置在所述发光区的不同侧。
  12. 根据权利要求1所述的显示面板,其中,形成所述第二电极层、所述第三电极层和所述第四电极层的材料包括透明导电材料。
  13. 根据权利要求8所述的显示面板,还包括封装层,设置在所述多个像素单元远离所述衬底的表面,所述封装层覆盖所述衬底和每个所述像素单元中的所述第四电极层、所述第二绝缘层。
  14. 一种显示装置,包括权利要求1~13中任一项所述的显示面板。
  15. 一种显示面板的制作方法,包括:
    在衬底上依次形成第一电极层、第一发光层、第二电极层、第二发光层、第三电极层、第三发光层和第四电极层,其中,所述第一发光层、所述第二发光层和所述第三发光层发出不同颜色的光,且所述第一发光层和所述第二发光层共用所述第二电极层,复用为所述第一发光层的阴极和所述第二发光层的阳极,所述第二发光层的阴极和所述第三发光层共用所述第三电极层。
  16. 根据权利要求15所述的方法,其中,在衬底上形成第一电极层之前,所述方法还包括:
    在衬底上每个像素单元中形成四个引出线,其中,所述四个引出线分别位于所述像素单元的不同侧,其中第一引出线用于与所述第一电极层连接,第二引出线用于与所述第二电极层连接,第三引出线用于与所述第三电极层连接,及第四引出线用于与所述第四电极层连接。
  17. 根据权利要求15所述的方法,其中,在衬底上形成第一发光层之前,所述方法还包括:
    在所述衬底上形成像素界定层,所述第一电极层位于所述像素界定层限定的第一开口中。
  18. 根据权利要求15所述的方法,其中,在所述衬底上形成所述第二电极层之后,及在所述衬底上形成所述第二发光层之前,所述方法还包括:
    在所述第二电极层上形成第一绝缘层,所述第一绝缘层用于限定出放置所述第二发光层的第二开口。
  19. 根据权利要求18所述的方法,其中,在所述衬底上形成所述第三电极层之后,及在所述衬底上形成所述第三发光层之前,所述方法还包括:
    在所述第三电极层上形成第二绝缘层,所述第二绝缘层用于限定出放置所述第三发光层的第三开口。
  20. 根据权利要求19所述的方法,还包括:在所述第四电极层远离所述衬底的一侧形成封装层。
  21. 根据权利要求15所述的方法,其中,用于制作第一发光层的掩膜板、用于制作第二发光层的掩膜板和用于制作第三发光层的掩膜板相同。
PCT/CN2021/100548 2020-06-22 2021-06-17 显示面板、显示装置 Ceased WO2021259123A1 (zh)

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