WO2021131798A1 - Ultrasonic radiation tool and ultrasonic device - Google Patents

Abstract

An ultrasonic radiation tool having a plurality of plate-form elements, a support body, and a first adhesive. Each of the plurality of plate-form elements has, on the obverse or reverse surface thereof, a radiation surface that is irradiated with ultrasonic waves. The support body holds the plurality of plate-form elements in an arrangement such that the plurality of radiation surfaces are oriented toward the same position from mutually different directions. The first adhesive bonds the plurality of plate-form elements and the support body together. Each of the plurality of plate-form elements has a plurality of vibration elements that generate, at a plurality of positions within the radiation surface, vibrations for producing ultrasonic waves. The first adhesive is bonded to the side surfaces of each of the plurality of plate-form elements.

Description

Ultrasonic radiation equipment and ultrasonic equipment

The present disclosure relates to an ultrasonic radiating device that radiates ultrasonic waves toward an object such as a human body and an ultrasonic device having the ultrasonic radiating device.

An ultrasonic device that radiates ultrasonic waves toward an object such as a human body is known (for example, Patent Documents 1 and 2). Such an ultrasonic device is used, for example, as an ultrasonic therapy device for irradiating an affected area or the like with ultrasonic waves to perform treatment, or as an ultrasonic diagnostic device for acquiring a secondary cross-sectional image of the affected area or the like. There is. As an ultrasonic therapy device, for example, a device used for HIFU (High Intensity Focused Ultrasound) treatment is known. In such an ultrasonic device, the surface on which the ultrasonic waves are radiated may be formed in a concave shape so as to focus the ultrasonic waves at a predetermined position. Patent Documents 1 and 2 disclose a technique for arranging a vibrating element that generates vibration that generates ultrasonic waves along a concave surface.

Japanese Unexamined Patent Publication No. 6-261908 Japanese Patent Application Laid-Open No. 2015-516233

The ultrasonic radiating instrument according to one aspect of the present disclosure has a plurality of plate-shaped elements, a support, and a first adhesive. Each of the plurality of plate-shaped elements has a radiation surface for radiating ultrasonic waves on one of the front and back surfaces. The support holds the plurality of plate-shaped elements in an arrangement in which the plurality of radial surfaces are directed to the same position from different directions. The first adhesive adheres the plurality of plate-shaped elements to the support. Each of the plurality of plate-shaped elements has a plurality of vibrating elements that generate vibrations that generate ultrasonic waves at a plurality of positions in the radiation surface. The first adhesive is adhered to the side surface of each of the plurality of plate-shaped elements.

The ultrasonic device according to one aspect of the present disclosure includes the ultrasonic radiation device and a drive control unit that supplies AC power having a frequency within the frequency band of ultrasonic waves to the plate-shaped element.

It is a schematic diagram which shows the schematic structure of the ultrasonic apparatus which concerns on 1st Embodiment. It is a perspective view which shows the schematic structure of the ultrasonic wave generating part of the ultrasonic wave apparatus of FIG. It is a top view of the plate-shaped element of the ultrasonic wave generating part of FIG. FIG. 3 is a cross-sectional view taken along the line IV-IV of FIG. It is a perspective view which shows a part of the outer surface of the support of the ultrasonic wave generating part of FIG. It is sectional drawing which shows the fixed structure of the plate-shaped element of FIG. 7 (a) and 7 (b) are schematic views showing an example and another example of the focusing mode of ultrasonic waves. It is sectional drawing which shows the fixed structure of the plate-shaped element which concerns on 2nd Embodiment. It is sectional drawing which shows the fixed structure of the plate-shaped element which concerns on 3rd Embodiment. It is sectional drawing which shows the fixed structure of the plate-shaped element which concerns on 4th Embodiment. It is sectional drawing which shows the fixed structure of the plate-shaped element which concerns on 5th Embodiment. It is sectional drawing which shows the fixed structure of the plate-shaped element which concerns on 6th Embodiment.

Hereinafter, embodiments according to the present disclosure will be described with reference to the drawings. The drawings below are schematic. Therefore, details may be omitted. Also, the dimensional ratio does not always match the actual one. The dimensional ratios of multiple drawings do not always match. Certain dimensions may be shown larger than they really are and certain shapes may be exaggerated.

In the second and subsequent embodiments, basically, only the differences from the previously described embodiments will be described. Matters not specifically mentioned may be the same as or inferred from the embodiments described above.

<First Embodiment>
FIG. 1 is a schematic view showing a schematic configuration of the ultrasonic device 1 according to the first embodiment.

The ultrasonic device 1 is used for HIFU treatment, for example. For example, the ultrasonic device 1 focuses ultrasonic waves on the affected part 103 (or a foreign substance such as a calculus; the same applies hereinafter) of the patient 101. The affected area 103 is denatured by the heat generated by this. The ultrasonic device 1 may be configured for any part of the human body as a treatment target, or may be configured for any disease as a treatment target. In other words, the frequency and intensity of the ultrasonic waves radiated by the ultrasonic device 1 and the dimensions of each part of the ultrasonic device 1 may be appropriately set. The ultrasonic wave is generally a sound wave of 20 kHz or higher. There is no general upper limit on the frequency of ultrasonic waves, but it may be, for example, 5 GHz.

The ultrasonic device 1 is arranged adjacent to the patient 101, and is directed to the ultrasonic radiation device 3 (hereinafter, may be simply referred to as “radiation device 3”) and the radiation device 3 that directly bear the radiation of ultrasonic waves. It has a device main body 5 that supplies power and the like.

(Ultrasonic radiation equipment)
The radiating instrument 3 has a generating unit 7 that generates ultrasonic waves, and a bag 9 that is interposed between the generating unit 7 and the patient 101. The generating unit 7 emits ultrasonic waves from, for example, the concave surface 7a facing the patient 101 side. The shape of the concave surface 7a is, for example, a shape obtained by cutting out a part of a spherical surface (inner surface thereof). Therefore, the ultrasonic waves radiated from the concave surface 7a are focused near the center of the sphere (from another viewpoint, the affected portion 103). The bag 9 is filled with a liquid LQ at least when the ultrasonic device 1 is used. The liquid LQ, for example, contributes to mitigating abrupt changes in acoustic impedance between the concave surface 7a and the body surface of the patient 101.

The liquid LQ is, for example, water. Further, for example, the liquid LQ may contain water and an appropriate additive. The additive may be, for example, for adjusting the acoustic impedance. The acoustic impedance of the liquid LQ is, for example, 1 × 10 ⁶ kg / (m ² · s) or more and 2 × 10 ⁶ kg / (m ² · s) or less, or 1.3 × 10 ⁶ kg / (m ² · s). ) Or more 1.7 × 10 ⁶ kg / (m ² · s) or less. For reference, exemplifying the acoustic impedance of various substances, water: about 1.5 × 10 ⁶ kg / (m ² · s), air: about 0, fat: about 1.4 × 10 ⁶ kg / (m ^2). -S), muscle: about 1.7 x 10 ⁶ kg / (m ² · s).

(Generation part)
FIG. 2 is a schematic diagram for explaining the configuration of a main part of the generating unit 7. The upper part in FIG. 2 is the patient 101 side. That is, FIG. 2 is a perspective view of the generating portion 7 as viewed from the concave surface 7a side.

The generating unit 7 has, for example, a plurality of plate-shaped elements 11 that emit ultrasonic waves, and a support 13 that holds the plurality of plate-shaped elements 11. The support 13 has, for example, a frame shape (frame shape, skeleton structure shape), and holds the outer edges of the plurality of plate-shaped elements 11 so as to expose the plurality of plate-shaped elements 11 to the patient 101 side. In addition to this, the generation unit 7 may have, for example, a housing having an appropriate shape that covers the illustrated configuration from the side opposite to the patient 101.

(Arrangement of plate-shaped elements)
The plate-shaped element 11 is, for example, roughly formed in a flat plate shape. One of the front and back surfaces (the widest pair of surfaces) of the plate shape is a radiation surface 11a that emits ultrasonic waves toward the patient 101. The plurality of plate-shaped elements 11 are arranged in parallel with each other (in different directions) so that the radial surface 11a faces a common focusing region (affected portion 103), and constitutes the concave surface 7a described above. doing. Therefore, the concave surface 7a is not composed of a curved surface, but is composed of a combination of a plurality of planes (radiating surface 11a).

The arrangement pattern of the plurality of plate-shaped elements 11 may be appropriately set. In the illustrated example, the plurality of plate-shaped elements 11 are arranged in the circumferential direction of the concave surface 7a (direction along the outer circumference of the concave surface 7a) to form an annular element row 8 (indicated by an arrow). The element rows 8 may be provided in a plurality of rows (for example, concentrically) in a plurality of rows (double or more) in a plan view of the concave surface 7a (in the illustrated example), or may be provided in only one row. .. When the distance between the centers of adjacent plate-shaped elements 11 (for example, geometric centers in a plan view) is taken as the center-to-center spacing, the plurality of center-to-center spacing in each element row 8 may be constant (in the figure). Example), it does not have to be constant. The number of plate-shaped elements 11 included in each element row 8 may be appropriately set. Further, this number may be the same as or different from each other in the plurality of element rows 8.

In the illustrated example, the innermost region of the concave surface 7a (the central portion 65 described later) is a non-arranged region of the plate-shaped element 11. Appropriate electronic components and the like may be arranged in such a region. For example, an ultrasonic sensor for detecting the position of the affected area 103, a visual sensor for detecting the position of a marker attached to the body surface of the patient 101 to indicate the position of the affected area 103, and / or a plurality of plate-shaped elements 11. A receiving unit may be provided to receive the reflected wave of the ultrasonic wave radiated from the above. Further, the innermost region of the concave surface 7a may have an opening. The opening may be, for example, for passing visible light detected by the above-mentioned visual sensor and / or ultrasonic wave detected by the ultrasonic sensor. Further, the innermost region of the concave surface 7a may be a region for arranging the plate-shaped element 11.

(Plane shape of plate-shaped element)
FIG. 3 is a plan view of the plate-shaped element 11.

The planar shape of the plate-shaped element 11 and the dimensions of the planar shape may be appropriately set. For example, the plurality of plate-shaped elements 11 may have the same shape and size from each other, or may include two or more types of plate-shaped elements 11 having different shapes and / or sizes from each other. Further, the planar shape of the plate-shaped element 11 may be a shape in which the gap between adjacent plate-shaped elements 11 is relatively small (a shape in which a spherical surface is divided) (FIGS. 2 and 3). Example), it does not have to be such a shape. As the latter, for example, a circular shape can be mentioned.

In the examples of FIGS. 2 and 3, the planar shape of the plate-shaped element 11 is a trapezoidal shape, which is an example of a shape in which the gap between the plate-shaped elements 11 is relatively small. It should be noted that the concave surface 7a can be formed so as to reduce the gap between the plate-shaped elements 11 even with a polygon other than the trapezoidal shape, for example, of the regular polyhedron (Platonic solid), the semi-regular polyhedron (Archimedean solid), and the Platonic solid. It is clear from the three-dimensional shape and the dome shape realized in various technical fields.

More specifically, the trapezium of the plate-like element 11 has, for example, an upper base 11d inside the concave surface 7a and a lower base 11e outside the concave surface 7a, as indicated by reference numeral 3 in FIG. It is an isosceles trapezium having a pair of legs 11f of length. The length of the upper base 11d, the length of the lower base 11e, and the height of the trapezium (distance between the upper base 11d and the lower base 11e) may be appropriately set, and any length may be set with respect to the other length. It may be long.

As described above, the plurality of plate-shaped elements 11 are arranged in the circumferential direction of the concave surface 7a to form an annular element row 8. In each element row 8, trapezium-shaped legs 11f are adjacent to each other among adjacent plate-shaped elements 11. The adjacent legs 11f may or may not be parallel to each other. In the latter case, the distance between the legs 11f may be relatively wide on either the inside or the outside of the concave surface 7a. Further, in the adjacent element rows 8, the trapezium upper base 11d of the plate-shaped element 11 of one element row 8 and the trapezium lower base 11e of the plate-shaped element 11 of the other element row 8 are adjacent to each other. ..

In the following description, the four side surfaces 11s (or the side surfaces 19s or 21s constituting the side surface 11s) of the plate-shaped element 11 described later are referred to by the terms upper base 11d, lower base 11e, and pair of legs 11f. There is.

(Structure of plate-shaped element)
As shown in FIG. 3, one plate-shaped element 11 has a plurality of vibrating elements 15 (specifically, a piezoelectric element). The vibrating element 15 is a portion that generates vibration that generates ultrasonic waves. The number, position, planar shape, size, and the like of the vibrating elements 15 may be appropriately set.

In the illustrated example, the plurality of vibrating elements 15 are distributed and arranged at a substantially uniform density along the plane direction (direction along the plane; the same applies hereinafter) of the plate-shaped element 11. More specifically, when the distance between the centers of adjacent vibrating elements 15 (for example, geometric centers in a plan view) is taken as the center-to-center spacing, the plurality of vibrating elements 15 are arranged vertically and horizontally at a constant center-to-center spacing. .. However, the plurality of vibrating elements 15 may be displaced from each other by about half of the center-to-center spacing in rows adjacent to each other, may be arranged along a plurality of concentric circles, or may be arranged radially. It may be arranged at a non-uniform density. The relative relationship between the arrangement direction of the plurality of vibrating elements 15 and the direction in which each portion of the outer edge of the plate-shaped element 11 extends may also be appropriately set.

The area of the arrangement region of the plurality of vibrating elements 15 (for example, the smallest convex polygon in which the plurality of vibrating elements 15 are accommodated) is exposed from, for example, the area of the plate-shaped element 11 (or the support 13 when viewed from the patient 101 side). Area) may be 1/5 or more, 1/2 or more, 2/3 or more, or 4/5 or more. 4/5 or more may be regarded as a state in which a plurality of vibrating elements 15 are arranged on the entire surface of the plate-shaped element 11. When the plurality of vibrating elements 15 are not arranged over the entire surface of the plate-shaped element 11, the arrangement region of the plurality of vibrating elements 15 is located in an appropriate range such as the central side or the outer edge side in the plate-shaped element 11. You can do it. The shape of the arrangement area is also arbitrary.

Further, in the illustrated example, the planar shape of the vibrating element 15 is circular. From another point of view, the planar shape is a line-symmetrical or rotationally symmetric shape. However, the planar shape may be another shape such as an ellipse or a polygon, or may be an asymmetrical shape. When the planar shape of the vibrating element 15 is not circular, the relative orientation between the planar shape and the planar shape of the plate-shaped element 11 may be appropriately set.

(Laminated structure of plate-shaped elements)
FIG. 4 is a cross-sectional view taken along the line IV-IV of FIG. The lower part in FIG. 4 is the patient 101 side. In FIG. 4, in addition to one plate-shaped element 11, a part of the support 13 is also shown.

The plate-shaped element 11 is configured to include, for example, two or more layered (including plate-shaped; the same applies hereinafter) members extending along the plane direction thereof (along the radial surface 11a). Specifically, for example, the plate-shaped element 11 has an element substrate 19 having a vibrating element 15 and a cavity member 21 superposed on the element substrate 19. The plate-shaped element 11 faces, for example, the cavity member 21 side toward the patient 101 side (from another viewpoint, the support 13 side). The element substrate 19 vibrates when the region serving as the vibrating element 15 bends and deforms. This vibration is transmitted to the fluid located on the patient 101 side of the element substrate 19, and ultrasonic waves are generated. The cavity member 21 has a plurality of cavities 21c (openings, holes) individually overlapping the plurality of vibrating elements 15 in the element substrate 19. The cavity member 21 contributes to defining the fixed end of the vibrating element 15 by, for example, the edge of the cavity 21c, and thus contributes to adjusting the natural frequency (resonance frequency) of the vibrating element 15.

The main surface (the widest surface of the plate, the front and back surfaces) of the plate-shaped element 11 has irregularities and is flat due to the provision of the plurality of cavities 21c and the second electrode 33 (individual electrode) described later. It's not a big deal. As can be understood from this, when the plate-shaped element 11 is in the form of a plate or a flat plate, it does not have to be strictly a plate or a flat plate. For example, the plate-shaped element 11 may be regarded as a flat plate shape by having a flat layer (for example, 23, 25, and 27 described later) having a constant thickness as a main component. Further, for example, the plate-shaped element 11 may be regarded as a flat plate shape when the top portions (or the deepest portions of the concave portions) of the plurality of convex portions are contained in the same plane on each of the two main surfaces. Further, for example, when the arithmetic average roughness Ra of the unevenness of each main surface of the plate-shaped element 11 is 5% or less, 2% or less, or 1% or less with respect to the equivalent circle diameter obtained from the area of the plate-shaped element 11. It may be regarded as a flat plate.

(Element board)
The element substrate 19 is configured to include, for example, two or more layered members extending along its plane direction (along the radial surface 11a). Specifically, for example, the element substrate 19 includes the vibration layer 23, the first conductor layer 25, the piezoelectric layer 27, and the second conductor layer 29 in this order from the patient 101 side (from another viewpoint, the cavity member 21 side). I'm out. The first conductor layer 25 includes, for example, the first electrode 31. The second conductor layer 29 includes, for example, a plurality of second electrodes 33. The first electrode 31 and the second electrode 33 sandwich the piezoelectric layer 27. When an AC voltage is applied to these pair of electrodes, the region of the element substrate 19 which is the vibrating element 15 causes vibration accompanied by bending and deformation. In addition to the layers shown in the figure, the element substrate 19 may include an appropriate layer such as an insulating layer covering the second conductor layer 29.

In the element substrate 19, the region regarded as the vibrating element 15 may be appropriately defined. In the description of the present embodiment, for convenience, the region of the element substrate 19 that overlaps the cavity 21c (more strictly, the region that overlaps the opening surface of the cavity 21c on the element substrate 19 side) is defined as the vibrating element 15. To do. In addition, the region overlapping the second electrode 33 (individual electrode) can be defined as the vibrating element 15.

Each vibrating element 15 has a first surface 15a facing the cavity 21c side (patient 101 side) and a second surface 15b facing the opposite side of the cavity 21c. The first surface 15a is composed of, for example, a surface of the vibrating layer 23 on the cavity member 21 side. The second surface 15b is exposed from, for example, the second conductor layer 29 of the surface of the second conductor layer 29 opposite to the cavity member 21 and the surface of the piezoelectric layer 27 opposite to the cavity member 21. It is composed of the area where it is. For example, unlike the illustrated example, when an insulating layer covering the second conductor layer 29 is provided, the second surface 15b may be formed by the insulating layer. The first surface 15a is a surface that generates ultrasonic waves toward the patient 101 due to the vibration of the vibrating element 15, and constitutes a part of the radiation surface 11a of the plate-shaped element 11.

(Vibration layer)
The vibrating layer 23 is, for example, widened over a plurality of vibrating elements 15 (for example, widened over substantially the entire element substrate 19), and basically spreads without gaps. The thickness of the vibrating layer 23 is, for example, substantially constant. The vibrating layer 23, for example, as will be described later, regulates the deformation of the piezoelectric layer 27 in the plane direction and contributes to causing out-of-plane vibration.

The vibrating layer 23 is formed of, for example, an insulating material or a semiconductor material. The material of the vibrating layer 23 may be an inorganic material or an organic material. More specifically, for example, the material of the vibrating layer 23 may be the same or different piezoelectric material as the material of the piezoelectric layer 27 (described later). Further, for example, the material of the vibrating layer 23 may be silicon (Si), silicon dioxide (SiO ₂ ), silicon nitride (SiN), or sapphire (Al ₂ O ₃ ). The vibrating layer 23 may be formed by laminating a plurality of layers made of different materials.

(1st conductor layer and 1st electrode)
The first conductor layer 25 includes only the first electrode 31 in the illustrated example. The first electrode 31 is configured as, for example, a common electrode. The common electrode has, for example, a width extending over a plurality of vibrating elements 15 (a width covering substantially the entire element substrate 19), and basically spreads without gaps. The thickness of the first electrode 31 is, for example, substantially constant. The first electrode 31 is, for example, a wiring (for example, FPC (Flexible) described later) arranged on the side opposite to the bag 9 of the plate-shaped element 11 via a through conductor (not shown) penetrating the piezoelectric layer 27. It is electrically connected to the printed circuits) 35).

The material of the first conductor layer 25 may be, for example, an appropriate metal. For example, gold (Au), silver (Ag), palladium (Pd), platinum (Pt), aluminum (Al), nickel (Ni), copper (Cu) or chromium (Cr) or alloys containing these are used. Good. The first conductor layer 25 may be formed by laminating a plurality of layers made of different materials. Further, the material of the first conductor layer 25 may be obtained by firing a conductive paste containing a metal as described above. That is, the material of the first conductor layer 25 may contain additives such as glass powder and / or ceramic powder (inorganic insulating material from another viewpoint).

(Piezoelectric layer)
The piezoelectric layer 27 is, for example, widened over a plurality of vibrating elements 15 (for example, widened over substantially the entire element substrate 19), and basically spreads without gaps. The thickness of the piezoelectric layer 27 is, for example, substantially constant. However, unlike the illustrated example, the piezoelectric layer 27 may have a configuration in which a plurality of parts separated from each other are individually provided for the plurality of vibrating elements 15.

The material of the piezoelectric layer 27 may be a single crystal, a polycrystal, an inorganic material, an organic material, or a ferroelectric substance. It may or may not be a pyroelectric body. Examples of the inorganic material include a lead zirconate titanate-based material and a lead-free inorganic piezoelectric material. Examples of the lead-free inorganic piezoelectric material include a perovskite-type compound material. Examples of the organic material include PVDF (polyvinylidene fluoride).

Further, the material of the piezoelectric layer 27 may be, for example, a pressure electromagnetic plate (sintered body from another viewpoint) or a piezoelectric thin film. The piezoelectric plate is a plate-shaped inorganic polycrystal composed of a plurality of crystal particles (and grain boundaries) having piezoelectricity, and is also called a piezoelectric ceramic plate. The crystal particles constituting the piezoelectric plate usually have a small aspect ratio and are isotropically distributed. The piezoelectric thin film is a thin-film inorganic single crystal, inorganic polycrystal, or organic material (polymer) having piezoelectricity. The polycrystalline piezoelectric thin film is usually composed of columnar crystals extending in the thickness direction. Piezoelectric thin films usually have high orientation, thereby having high piezoelectric properties.

In the piezoelectric layer 27, for example, at least in a region constituting the vibrating element 15, the polarization axis (also referred to as an electric axis or an X axis in a single crystal) is in the thickness direction of the piezoelectric layer 27 (with the first electrode 31). It is substantially parallel to the second electrode 33 (opposite direction). The region of the piezoelectric layer 27 other than the region constituting the vibrating element 15 may or may not be polarized. Further, when it is polarized, it may be polarized in the same direction as the region constituting the vibrating element 15, or may be polarized in a different direction.

(2nd conductor layer and 2nd electrode)
The second conductor layer 29 may have, for example, wiring (not shown) connected to the plurality of second electrodes 33 in addition to the plurality of second electrodes 33 described above. The plurality of second electrodes 33 are arranged on the opposite side of the plate-shaped element 11 from the bag 9 via, for example, a drawing electrode (or wiring) (not shown) included in the second conductor layer 29 (not shown). For example, it is electrically connected to the FPC35) described later.

The plurality of second electrodes 33 are, for example, individual electrodes provided for each vibrating element 15. The individual electrodes referred to here mean that a plurality of electrodes have shapes that are separated from each other, and it is not necessary that potentials that are different from each other can be applied. For example, two or more second electrodes 33 (for example, all the second electrodes 33 in one plate-shaped element 11) may be electrically connected to each other. The connection may be made by, for example, a wiring (not shown) included in the second conductor layer 29, or by another means (for example, FPC35 described later). It should be noted that the plurality of second electrodes 33 may be capable of applying different potentials individually or for each group including two or more second electrodes 33.

The planar shape and size of the second electrode 33 may be an appropriate shape. For example, the planar shape of the second electrode 33 may be similar to or similar to the planar shape of the vibrating element 15 (opening shape of the cavity 21c), may be different, and may be circular or elliptical. It may be a shape or a polygon. Further, for example, in a plan view, the outer edge of the second electrode 33 may be entirely located inside the opening edge of the cavity 21c, or the entire edge may be substantially the same. , The whole may be located on the outside, or only a part may be located on the same or inside. In the present embodiment, the second electrode 33 is a circle located inside the opening edge of the circular cavity 21c.

The material of the second conductor layer 29 may be the same as or different from the material of the first conductor layer 25. Further, in any case, the description of the material of the first conductor layer 25 described above may be referred to the description of the material of the second conductor layer 29.

(Operation of vibrating element)
When an electric field is applied to the piezoelectric layer 27 sandwiched between the first electrode 31 and the second electrode 33 in the same direction as the polarization direction, the piezoelectric layer 27 contracts in the plane direction. Since this contraction is regulated by the vibrating layer 23, the vibrating element 15 bends (displaces) toward the vibrating layer 23 like a bimetal. On the contrary, when an electric field is applied in the direction opposite to the direction of polarization, the vibrating element 15 bends toward the piezoelectric layer 27 side.

Due to the displacement of the vibrating element 15 as described above, a pressure wave is formed in the medium (for example, fluid) around the vibrating element 15. Then, by inputting an electric signal (drive signal) whose voltage changes with a predetermined waveform to the first electrode 31 and the second electrode 33, the waveform of the electric signal (frequency and amplitude in another viewpoint) is reflected. Ultrasonic waves are generated.

In other words, the vibration of the above-mentioned deflection deformation is the out-of-plane vibration of the primary mode in which the center of the plan view becomes the antinode of the vibration and the outer edge (for example, near the edge of the cavity 21c) becomes the vibration node in the vibration element 15. (Bending vibration). With respect to this vibration, the vibrating element 15 is configured such that, for example, the resonance frequency is located in the frequency band of ultrasonic waves. The resonance frequency is set, for example, by selecting the material of the layers constituting the vibrating element 15 (selecting Young's modulus and density from another viewpoint), and setting the diameter of the vibrating element 15 and the thickness of each layer (from another viewpoint). It is done by setting the mass and bending rigidity). The influence of the fluid around the vibrating element 15 and the influence of the rigidity of the portion supporting the vibrating element 15 (for example, the cavity member 21) may be taken into consideration.

The electric signal may be, for example, a voltage application that displaces the vibrating element 15 toward the vibrating layer 23 side and a voltage application that displaces the vibrating element 15 toward the piezoelectric layer 27 side repeatedly. That is, the electric signal may have polarities (positive and negative) inverted (the directions of the voltage (electric field) alternate in the direction of the polarization axis of the piezoelectric layer 27). Further, for example, the electric signal may be such that only the voltage application that displaces the vibrating element 15 toward the vibrating layer 23 side or only the voltage application that displaces the vibrating element 15 toward the piezoelectric layer 27 side is repeated. In this case, ultrasonic waves are generated by repeating bending and elimination of bending by the restoring force.

(Cavity member)
The cavity member 21 is, for example, a member having a constant thickness and having a width extending over a plurality of vibrating elements 15 when the cavity 21c is ignored. The size of the cavity member 21 may be the same as or different from the size of the element substrate 19 (example of FIG. 4). In FIG. 6 and the like described later, an example in which the cavity member 21 is slightly wider than the element substrate 19 is shown, but contrary to the drawing, the element substrate 19 may be wider than the cavity member 21.

The material of the cavity member 21 is arbitrary, and may be, for example, an insulating material, a semiconductor material, a conductive material, an inorganic material, or an organic material. It may be a piezoelectric material, or it may be the same as the material of any layer in the element substrate 19. Specifically, examples of the material of the cavity member 21 include metals, resins, and ceramics. Further, the cavity member 21 may be composed of a plurality of materials or a plurality of layers. For example, the cavity member 21 may be formed by forming an insulating layer on a metal layer (including a metal plate) overlapping the element substrate 19, or may be made of a glass epoxy resin obtained by impregnating glass fibers with an epoxy resin. You may be.

The shape of the cavity 21c may be set as appropriate. For example, the shape of the cavity 21c may be such that the shape of the cross section (cross section parallel to the element substrate 19) is constant regardless of the position in the penetrating direction of the cavity 21c (illustration example), or the element substrate. The shape may have a tapered surface whose diameter increases or decreases toward the 19th side. In the description of the present embodiment, the region of the element substrate 19 that overlaps with the cavity 21c is the vibrating element 15. Therefore, the description of the planar shape of the vibrating element 15 described above is used to explain the shape of the cross section of the cavity 21c. May be done.

The depth of the cavity 21c (the length in the penetrating direction; from another point of view, the thickness of the cavity member 21) may be appropriately set. For example, the depth of the cavity 21c may be 1/20 or more, 1/10 or more, 1/2 or more, or 1 times or more the diameter of the cavity 21c (for example, a circle-equivalent diameter if it is not circular). It may be 10 times or less, 5 times or less, 1 time or less, 1/2 or less or 1/10 or less, and the above lower limit and upper limit may be appropriately combined as long as there is no contradiction.

(Support)
Returning to FIG. 2, the support 13 has, for example, a shape that holds the outer edges of the plurality of plate-shaped elements 11. More specifically, the support 13 has a shape similar to, for example, the shape of a gap (boundary in another viewpoint) between adjacent plate-shaped elements 11. In other words, the support 13 has a plurality of openings 13h that individually overlap the plurality of plate-shaped elements 11. Then, as shown in FIG. 4, the plate-shaped element 11 has its outer edge side portion overlapped with the back surface 13b of the support 13 opposite to the patient 101, and has a radial surface toward the patient 101 side through the opening 13h. 11a is exposed.

The support 13 is composed of, for example, three parts substantially concentrically formed in a plan view of the concave surface 7a. One is a lattice portion 61 which is formed in a lattice pattern by forming a plurality of openings 13h and which extends in a band shape and an annular shape over a region in which a plurality of plate-shaped elements 11 are arranged. The other one is a brim-shaped edge 63 extending outward from the outer edge of the grid 61. The remaining one is a plate-shaped central portion 65 connected to the inner edge of the lattice portion 61. The outer edge of the plurality of plate-shaped elements 11 is held by these portions.

Although not particularly shown, the support 13 has a shape that can be said to be composed of only the lattice portion 61 by forming an opening in the central portion 65 and reducing the diameter from the inner edge to the outer edge of the edge portion 63. May be. Further, as described above, the region where the central portion 65 is provided may be the arrangement region of the plate-shaped element 11 (in other words, the lattice portion 61 may spread to the center).

The shape and area of the opening 13h may be set as appropriate. For example, the shape of the opening 13h may be similar to or similar to the shape of the outer edge of the plate-shaped element 11 (example in the figure), or may be a different shape. Further, for example, the opening 13h may have a shape in which the diameter is reduced or increased from the front surface 13a on the patient 101 side to the back surface 13b on the opposite side, or a shape in which such diameter reduction or diameter is not increased. There may be. Further, for example, the area of the opening 13h (for example, the minimum area when the diameter is reduced or expanded) may be 60% or more or 80% or more of the area of the plate-shaped element 11.

The material of the support 13 may be appropriate. For example, the material of the support 13 may be metal, ceramics, resin, or a combination thereof. The metal may be, for example, stainless steel.

(Details of the shape of the support)
FIG. 5 is a perspective view showing a part of an example of the back surface 13b (the surface opposite to the affected portion 103) of the support 13. In FIG. 5, the support 13 is in a state before the plate-shaped element 11 is attached.

A recess 13r in which the plate-shaped element 11 is housed may be formed on the surface of the support 13 on which the plate-shaped element 11 is arranged (here, the back surface 13b). From another viewpoint, the support 13 is formed from the overlapping portion 13e and the overlapping portion 13e that overlap the plate-shaped element 11 (more specifically, the outer edge portion thereof in the present embodiment) in the thickness direction of the plate-shaped element 11. It has a partition portion 13f protruding toward the plate-shaped element 11. Of course, the support 13 may have a shape that does not have such a recess 13r (partition portion 13f).

The partition portion 13f is located between the plate-shaped elements 11 adjacent to each other. More specifically, in the illustrated example, the support 13 is adjacent to the partition portion 13fa located between the plate-shaped elements 11 adjacent to each other in the circumferential direction of the support 13 and to be adjacent to each other in the radial direction of the support 13. It has a partition portion 13fb located between the plate-shaped elements 11. The partition portion 13fa extends in the radial direction of the support 13, for example. The partition portion 13fb extends in the circumferential direction of the support 13, for example.

The recess 13r has, for example, a shape and size in which the plate-shaped element 11 fits, and may contribute to the positioning of the plate-shaped element 11. The term "fitting" as used herein means that, for example, there is a gap (play) between the side surface of the plate-shaped element 11 and the wall surface of the recess 13r to allow the plate-shaped element 11 to move in the plane direction. Including. This gap may contribute to, for example, the arrangement of the first adhesive 37, which will be described later. The size of the gap is, for example, such that the entire outer edge of the plate-shaped element 11 is located outside the opening 13h regardless of the position in the recess 13r in the plane direction of the plate-shaped element 11. However, the recess 13r may be larger than the size that contributes to the positioning of such a plate-shaped element 11.

The shape of the recess 13r viewed in the depth direction may be, for example, similar to the planar shape of the plate-shaped element 11 and / or the shape of the opening 13h viewed in the opening direction. Therefore, the above-mentioned description about the planar shape of the plate-shaped element 11 may be applied to the shape of the recess 13r. Further, in the shape of the recess 13r, a portion where the wall surface abuts on the side surface of the plate-shaped element 11 to position the plate-shaped element 11 and a first adhesive 37 described later are arranged away from the side surface of the plate-shaped element 11. It may have a shape having a portion forming a gap to be formed. The wall surface of the recess 13r may be a vertical wall, or may be an inclined wall that reduces or expands the diameter of the recess 13r. The depth of the recess 13r may be smaller, equal to, or larger than the thickness of the plate-shaped element 11.

The partition portion 13f may have a shape extending at a constant width and / or a constant height, may have a shape extending while changing the width and / or height, or may extend linearly. It may be bent as appropriate. Further, the plurality of partition portions 13fa may have the same shape or different shapes from each other. The same applies to the plurality of partition portions 13fb.

(Fixed structure of plate-shaped element and support)
FIG. 6 is a cross-sectional view showing a fixed structure of the plate-shaped element 11 and the support 13. FIG. 6 is a diagram showing the same cross section as that of FIG. 4, omitting the detailed illustration of the element substrate 19, and showing a slightly wider range than that of FIG. The pair of side surfaces 11s of the plate-shaped element 11 shown in FIG. 6 is a pair of legs 11f in the light of the IV-IV line of FIG. 3, but may be regarded as a combination of any of the two side surfaces. ..

As shown in FIG. 6, the plate-shaped element 11 and the support 13 are adhered to each other by the first adhesive 37 adhered to the side surface 11s of the plate-shaped element 11. More specifically, in the illustrated example, the side surface 11s of the plate-shaped element 11 includes the side surface 21s of the cavity member 21 and the side surface 19s of the element substrate 19. The first adhesive 37 is adhered only to the side surface 21s of the side surface 21s and the side surface 19s. The first adhesive 37 may be adhered to a surface other than the side surface 21s (for example, a surface opposite to the support 13) to the cavity member 21 (in the illustrated example), or is adhered to the cavity member 21. It does not have to be.

Note that the side surface is a surface connecting the front and back surfaces (the widest pair of surfaces) of the plate shape, or a surface along the thickness direction of the plate shape. The trapezoidal plate-shaped element 11 taken as an example in this embodiment has four side surfaces 11s. When the plate-shaped element 11 is circular, the number of side surfaces 11s may be regarded as one, or the plate-shaped elements 11 are appropriately divided so that there are two side surfaces 11s on both sides of the radial surface 11a. May be conceptualized.

The first adhesive 37 may be adhered to the entire side surface 21s of the cavity member 21 in the thickness direction of the plate-shaped element 11 (illustrated example), or is adhered only to a part of the side surface 21s. May be good. In the latter case, the size of the region to be bonded on the side surface 21s is arbitrary. For example, the region to be bonded may extend over half or more of the side surface 21s in the thickness direction of the plate-shaped element 11. , May be less than half. Further, when the first adhesive 37 is adhered only to a part of the side surface 21s, the part may be, for example, a part of the side surface 21s opposite to the element substrate 19. It may be a part of the element substrate 19 side. For example, in a configuration in which the overlapping portion 13e, the cavity member 21, and the element substrate 19 are overlapped in this order as shown in the drawing, the amount of the first adhesive 37 is reduced, and the first adhesive 37 is the overlapping portion 13e on the side surface 21s. It may be glued to only part of the side. Further, for example, the first adhesive 37 may be adhered only to the element substrate 19 side of the side surface 21s by allowing air to enter the overlapping portion 13e side of the first adhesive 37.

Further, the first adhesive 37 covers the entire circumference of the outer edge of the plate-shaped element 11 (in other words, over the upper base 11d, the lower base 11e, and the pair of legs 11f), and the side surface 11s (in this embodiment, the side surface). It may be adhered to 21s), or may be adhered only to a part of the outer edge of the plate-shaped element 11. In the latter case, for example, the first adhesive 37 is supplied only to a part of the outer edge while the gap between the side surface 21s and the wall surface of the recess 13r exists on the entire circumference of the outer edge of the plate-shaped element 11. May be done. Further, for example, a part of the wall surface of the recess 13r may be in direct contact with the side surface 21s, so that only a part of the outer edge may be adhered.

The first adhesive 37 may be adhered to the side surfaces 11s on both sides of the radial surface 11a (more specifically, for example, at least one vibrating element 15). Taking the trapezoidal plate-shaped element 11 as an example, the side surfaces 11s on both sides of the radial surface 11a are typically a combination of an upper base 11d and a lower base 11e, or a pair of legs 11f. is there. However, the combination of the upper base 11d and one leg 11f, or the combination of the lower base 11e and one leg 11f may also be regarded as the side surfaces 11s on both sides of the radial surface 11a. Further, for example, when the radial surface 11a is a triangle, the side surfaces on both sides may be any combination of two sides. Further, for example, when the radial surface 11a is circular, the side surfaces on both sides may be a combination of two arcs whose circumference is divided into two.

The first adhesive 37 may be adhered to an appropriate portion of the support 13. In the direction (circumferential direction) along the outer edge of the plate-shaped element 11, the adhesion range of the first adhesive 37 to the side surface 11s (side surface 21s in this embodiment) of the plate-shaped element 11 and the support 13 of the first adhesive 37. The adhesion range with respect to the above may be basically the same, for example. Therefore, for example, regarding the adhesion to the side surface 11s, it has been described that the adhesion may be made to the entire circumference or a part of the plate-shaped element 11, and the adhesion may be made to both sides of the radial surface 11a. , The description may be incorporated to a range in which the bonding range to the support 13 and / or the bonding range and the bonding range to the side surface 11s overlap each other.

In the cross-sectional view, in the illustrated example, the first adhesive 37 is applied to a region of the overlapping portion 13e on the side where the plate-shaped element 11 overlaps (bottom surface of the recess 13r) exposed from the plate-shaped element 11. Only glued. The area where the first adhesive 37 is adhered to this region may be appropriately set. For example, the first adhesive 37 may be adhered to the entire region, or may be adhered only to a part of the plate-shaped element 11 side (opening 13h side) as shown in the illustrated example. , The first adhesive 37 may be adhered only to a part on the opposite side to the plate-shaped element 11 by allowing air to enter the overlapping portion 13e side.

Further, although not particularly shown, the first adhesive 37 may be adhered to the wall surface of the recess 13r in addition to or instead of the bottom surface of the recess 13r, or the surface (partition portion) in which the recess 13r is open. It may be adhered to the top surface of 13f, etc.). When the first adhesive 37 is adhered to the wall surface of the recess 13r, the first adhesive 37 may be adhered to the entire wall surface in the height direction of the wall surface, or only to a part of the wall surface. It may be glued. In the latter case, the region to be bonded may extend over half or more of the wall surface in the height direction of the wall surface, or may be contained in less than half of the wall surface. Further, when the first adhesive 37 is adhered only to a part of the wall surface, the part may be, for example, a part of the wall surface on the bottom surface side of the recess 13r, or the bottom surface of the recess 13r. It may be part of the opposite side.

The material of the first adhesive 37 may be an organic material, an inorganic material, an insulating material, or a conductive material. For example, the first adhesive 37 may be a resin or a metal. The elastic modulus of the material of the first adhesive 37 may be appropriately set. For example, the elastic modulus of the material of the first adhesive 37 may be smaller or larger than the elastic modulus of the material of the support 13. The elastic modulus may be, for example, a longitudinal elastic modulus (Young's modulus, longitudinal elastic modulus), and may be based on, for example, a value at the center temperature of the temperature range assumed for the use of the generating portion 7 ( The same applies hereinafter.)

Further, for example, the first adhesive 37 may be an elastic body (for example, an elastic adhesive) after curing. Specifically, for example, the first adhesive 37 may be silicone-based or urethane-based. These may be one-component or two-component. Further, for example, the first adhesive 37 as an elastic body may have an elongation rate of 35% or more when torn in a tensile test after curing.

(Flexible board)
FIG. 6 shows an FPC 35 (flexible substrate) electrically connected to a plate-shaped element 11 (more specifically, an element substrate 19). The FPC 35 contributes to signal transmission between the plate-shaped element 11 and the apparatus main body 5, for example.

The FPC35 has, for example, an insulating film and a conductor layer that overlaps the film, although not particularly shown, and has flexibility as a whole. The specific structure, material, dimensions, etc. of the FPC35 may be appropriately set. Electronic components (for example, IC: Integrated Circuit) may or may not be mounted on the FPC 35.

The FPC 35 faces, for example, the element substrate 19 on the opposite side of the cavity member 21. The size of the FPC 35 may be, for example, the size of all the vibrating elements 15 included in one plate-shaped element 11. The FPC 35 may have an area that overlaps only one plate-shaped element 11 (illustrated example), or has an area that overlaps a plurality of plate-shaped elements 11 (all or a part of the generating unit 7). You may have. Further, in the former case, the size of the FPC 35 may be wider, equal to, or narrower than the size of the plate-shaped element 11. Further, the planar shape of the FPC 35 may be similar to or similar to the planar shape of the plate-shaped element 11, or may be a different shape.

The second conductor layer 29 (FIG. 4) of the element substrate 19 is, for example, displaced from a plurality of second electrodes 33 overlapping the cavity 21c to a region not overlapping the cavity 21c (in the example of FIG. 6, the second conductor layer 29 (FIG. 4) is displaced from the cavity 21c in the paper penetrating direction. It has a plurality of extraction electrodes (not shown) extending to the region). On the other hand, although not particularly shown, the FPC 35 has, for example, a plurality of pads facing the plurality of extraction electrodes. The plurality of extraction electrodes and the plurality of pads are adhered to each other by, for example, a plurality of conductive bumps 39. As a result, the plurality of second electrodes 33 and the FPC 35 are electrically connected. Although not particularly shown, the first electrode 31 of the element substrate 19 may be connected to a terminal exposed on the FPC35 side of the element substrate 19 via, for example, a through conductor penetrating the piezoelectric layer 27. Then, this terminal may be connected to the pad of the FPC 35 by the bump 39.

The bump 39 is made of, for example, solder or a conductive adhesive. Solder includes lead-free solder. The conductive adhesive is composed of, for example, a resin containing conductive particles. The specific shapes and dimensions of the extraction electrode, the pad and the bump 39 may be appropriately set.

A space 71 is formed between the element substrate 19 and the FPC 35 due to the thickness of the bump 39 (and the thickness of the pad or the like adhered to the bump 39). The thickness of the space 71 (thickness of the bump 39 or the like from another viewpoint) may be appropriately set. For example, the thickness of the space 71 is set so that the element substrate 19 and the FPC 35 do not come into contact with each other even when the maximum amount of deflection of the vibrating element 15 to the FPC35 side is assumed. Good. Further, for example, the thickness of the space 71 may be thicker than the thickness of the FPC 35, or may be equal to or less than the thickness of the FPC 35. When the thickness of the space 71 is not constant due to the deflection of the FPC 35, for example, the above example of the thickness may be applied based on the minimum thickness, the average thickness, or the maximum thickness.

(Example of dimensions, etc.)
As described above, in the radiating instrument 3, the frequency of ultrasonic waves, the dimensions of each part of the radiating instrument 3, and the like may be appropriately set. An example is given below. The frequency of the ultrasonic wave generated by the radiating instrument 3 may be 0.5 MHz or more and 2 MHz or less. The diameter of the generating portion 7 (diameter in the plane including the outer edge of the concave surface 7a) may be 50 mm or more and 200 mm or less. The equivalent circle diameter of the plate-shaped element 11 or the length of one side of the trapezium may be 5 mm or more and 20 mm or less. The equivalent circle diameter of the vibrating element 15 may be 0.2 mm or more and 2 mm or less. The thickness of the element substrate 19 may be 50 μm or more and 200 μm or less. The thickness of the vibrating layer 23 and the thickness of the piezoelectric layer 27 may be 20 μm or more and 100 μm or less within a range consistent with the thickness of the element substrate 19. The thickness of each of the first conductor layer 25 (first electrode 31) and the second conductor layer 29 (second electrode 33) may be 0.05 μm or more and 5 μm or less. The thickness of the support 13 may be equal to or greater than the thickness of the element substrate 19.

(bag)
Returning to FIG. 1, the shape, size and material of the bag 9 may be appropriately set. For example, the shape of the bag 9 may be a shape that bulges outward as a whole, such as a sphere. Further, for example, when the radiation device 3 is intended for a specific part of the human body, it has a shape having a convex portion and / or a concave portion in accordance with the concave portion and / or the convex portion of the specific portion. May be good.

The material of the bag 9 has at least the property of not allowing the liquid LQ to pass through (so-called water-shielding property) and flexibility. Further, the material of the bag 9 may be an elastic body. For example, as a material for the bag 9, a thermosetting elastomer (so-called rubber), a thermoplastic elastomer (elastomer in a narrow sense), and a resin not containing these elastomers (resin in a narrow sense, but having flexibility) are used. It's okay. Examples of the thermosetting elastomer include vulcanized rubber (rubber in a narrow sense) and a thermosetting resin-based elastomer.

As described above, the bag 9 is filled with the liquid LQ at least when the ultrasonic device 1 is used. The bag 9 (radiating device 3) may be, for example, one in which the liquid LQ is sealed at the distribution stage, or one in which the liquid LQ is sealed at the time of use. Further, the bag 9 (radiating device 3) may or may not have, for example, an openable / closable port for supplying (and / or discharging) the liquid LQ into the bag 9. It may be a thing. Various known structures may be used for the opening / closing structure of the port.

The bag 9 has an opening 9a on the generating portion 7 side. Then, a part of the generating portion 7 including the concave surface 7a is in contact with the liquid LQ in the bag 9 through the opening 9a. On the other hand, a part of the generating portion 7 including the surface opposite to the concave surface 7a is not in contact with the liquid LQ of the bag 9, but is in contact with the gas (for example, air) around the radiating instrument 3. Therefore, in the vibrating element 15, the first surface 15a on the patient 101 side is in contact with the liquid LQ, and the second surface 15b on the opposite side is in contact with the gas (for example, air). The structure for reducing the leakage of the liquid LQ from between the edge portion of the opening 9a and the generating portion 7 may be appropriate.

(Device body)
The apparatus main body 5 presents information to the user, for example, a drive control unit 41 that drives and controls the radiation device 3, a moving unit 43 that moves the radiation device 3, an input unit 45 that accepts a user's input operation, and the user. It has an output unit 47 and an output unit 47.

The drive control unit 41 is connected to the electric circuit of the generation unit 7 via, for example, a cable 49. The electric circuit includes, for example, an FPC 35. The drive control unit 41 has a drive unit 51 that inputs a signal related to the generation of ultrasonic waves to the generation unit 7, and a control unit 53 that controls the drive unit 51.

Regarding the operation of inputting drive signals to the first electrode 31 and the second electrode 33 in order to generate ultrasonic waves, the division of roles between the drive unit 51 and the electric circuit of the generation unit 7 may be appropriately set. Here, for the sake of simplicity, the electric circuit of the generating unit 7 will be described as having a role of transmitting a signal from the driving unit 51 to the first electrode 31 and the second electrode 33. However, at least a part of the functions of the drive unit 51 described below may be provided in the generation unit 7.

For example, the drive unit 51 converts power from a commercial power source or the like into AC power having a waveform (for example, frequency and voltage (amplitude)) specified by the control unit 53, and inputs the power to the first electrode 31 and the second electrode 33. To do. The drive signal is AC power having a frequency substantially equal to the frequency of the ultrasonic wave intended to be radiated and having a voltage corresponding to the amplitude of the intended ultrasonic wave. The drive signal may have an appropriate shape such as a square wave (pulse), a sine wave, a triangular wave, or a sawtooth wave.

Although not particularly shown, the control unit 53 includes a computer including a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), an external storage device, and the like. When the CPU executes a program stored in the ROM and / or the external storage device, a functional unit that performs various controls is constructed. For example, the control unit 53 sets the waveform (for example, frequency and voltage (amplitude)) of the drive signal output by the drive unit 51 based on the signal from the input unit 45, and also sets the waveform of the drive signal from the drive unit 51. Controls the start and stop of output.

Although not particularly shown, the moving unit 43 includes, for example, a holding mechanism for holding the radiating device 3 and a drive source (for example, a motor) for applying power to move the radiating device 3 to the holding mechanism. ing. Such a moving unit 43 may have the same configuration as, for example, an articulated robot, a SCARA robot, or a Cartesian robot. The moving unit 43 moves the radiating device 3 relative to the patient 101 based on a control command from the control unit 53. This relative movement may include, for example, the movement of the radiating device 3 closer to the patient 101 and / or the movement for positioning to position the focus of the ultrasound on the affected area 103. The control unit 53 controls the moving unit 43 based on a signal from the input unit 45 and / or a signal from a sensor (not shown) that identifies the position of the affected area 103 or the like. The moving unit 43 may not be provided, or the driving source of the moving unit 43 may not be provided, and the radiating instrument 3 may be transported and positioned by human power.

The input unit 45 includes, for example, a keyboard, a mouse, a mechanical switch and / or a touch panel. The input unit 45 receives, for example, an operation for setting the frequency and amplitude of the ultrasonic wave radiated from the radiating instrument 3, and an operation for instructing the start and stop of the ultrasonic wave radiation. The output unit 47 includes, for example, a display device and / or a speaker. The output unit 47 presents, for example, information on the frequency and amplitude of the ultrasonic wave currently set.

As described above, in the present embodiment, the ultrasonic radiation device 3 has a plurality of plate-shaped elements 11, a support 13, and a first adhesive 37. Each of the plurality of plate-shaped elements 11 has a radiation surface 11a for emitting ultrasonic waves on one of the front and back surfaces. The support 13 holds the plurality of plate-shaped elements 11 in an arrangement in which the plurality of radial surfaces 11a are directed to the same position (affected portion 103) from different directions. The first adhesive 37 adheres the plurality of plate-shaped elements 11 to the support 13. Each of the plurality of plate-shaped elements 11 has a plurality of vibrating elements 15 that generate vibrations that generate ultrasonic waves at a plurality of positions within the radiation surface 11a. The first adhesive 37 is adhered to the side surface 11s of each of the plurality of plate-shaped elements 11.

Therefore, for example, the concave surface 7a that emits ultrasonic waves is not integrally formed, but is composed of a plurality of plate-shaped elements 11. As a result, for example, the manufacturing method of the generating unit 7 can be facilitated. For example, when the plate-shaped element 11 has a flat plate shape, the plate-shaped element 11 can be manufactured by the same method as that for manufacturing a normal circuit board or the like.

Further, for example, since each plate-shaped element 11 has a plurality of vibrating elements 15, the degree of freedom in designing the plate-shaped element 11 is improved. Specifically, for example, it is as follows. In the case where the entire plate-shaped element 11 vibrates, the larger the area of the plate-shaped element 11, the lower the resonance frequency of the plate-shaped element 11. Therefore, the size of the plate-shaped element 11 is limited from the viewpoint of bringing the resonance frequency of the predetermined vibration mode of the plate-shaped element 11 close to the desired driving frequency of the ultrasonic wave. On the other hand, in the present embodiment, since the resonance frequency of the vibrating element 15 may be brought close to the driving frequency of the ultrasonic wave, the area of the plate-shaped element 11 can be increased.

Further, for example, since the first adhesive 37 is adhered to the side surfaces 11s of each of the plurality of plate-shaped elements 11, it is easy to efficiently focus the ultrasonic waves on the affected portion 103. Specifically, for example, it is as follows. First, unlike the present embodiment, the first adhesive 37 is not provided, and the support 13 and the plate element 11 are formed only in a region where the overlapping portion 13e of the support 13 and the plate element 11 overlap each other. Consider the aspect of being bonded (see the second adhesive 73 of FIG. 9 described later). In this aspect, the plate-shaped element 11 is restricted from being deformed in the plane direction on the overlapping portion 13e side, and is not regulated from being deformed in the plane direction on the side opposite to the overlapping portion 13e. On the other hand, any layer in the plate-shaped element 11 (for example, the element substrate 19) expands and contracts in the plane direction with vibration that generates ultrasonic waves or due to a temperature change. Therefore, for example, the entire plate-shaped element 11 is liable to bend and deform. As a result, for example, when bending deformation occurs due to vibration that generates ultrasonic waves, energy for generating ultrasonic waves is diverged. Further, for example, when bending deformation occurs regardless of any factor, the orientations of the plurality of vibrating elements 15 in each plate-shaped element 11 change from the intended orientation. As a result, the area where the ultrasonic waves are focused becomes wider than intended. On the other hand, when the first adhesive 37 is adhered to the side surface 11s of the plate-shaped element 11 as in the present embodiment, the deformation of the plate-shaped element 11 in the plane direction is restricted as compared with the above embodiment. The region is expanded in the thickness direction of the plate-shaped element 11. As a result, bending deformation is likely to be reduced. As a result, for example, energy loss is likely to be reduced, and expansion of the focusing region is likely to be reduced.

Further, in the present embodiment, each of the plurality of plate-shaped elements 11 has an element substrate 19 and a cavity member 21. The element substrate 19 extends along the radial surface 11a and has a plurality of vibrating elements 15. The cavity member 21 extends along the radial surface 11a and has a plurality of openings (cavities 21c) that individually overlap the plurality of vibrating elements 15. The element substrate 19 includes a piezoelectric layer 27 that generates stress in a direction along the radiation surface 11a. The first adhesive 37 is adhered to at least one of the side surface 21s of the cavity member 21 and the side surface 19s of the element substrate 19.

In this case, for example, since the element substrate 19 includes the piezoelectric layer 27 that generates stress in the direction along the radiation surface 11a, there is a possibility that the element substrate 19 expands and contracts in the plane direction as a whole with vibration for generating ultrasonic waves. high. As a result, the above-mentioned problems such as energy dissipation are likely to occur. Therefore, the above-mentioned effect is effectively achieved.

Further, in the present embodiment, these members are overlapped in the order of the support 13, the cavity member 21, and the element substrate 19 in the direction in which the radial surface 11a faces. The first adhesive 37 is adhered to the side surfaces 21s of the cavity member 21 on both sides of the radial surface 11a.

In this case, for example, among the members of the plate-shaped element 11, the cavity member 21 which is relatively close to the support 13 is adhered to the support 13, so that the adhesion is easy. Further, for example, since the cavity member 21 receives stress in the plane direction of the element substrate 19 from only one surface in the thickness direction, bending deformation is likely to occur. By adhering the first adhesive 37 to the side surface 21s of the cavity member 21, the above-mentioned action of reducing the deflection deformation can be effectively obtained. In particular, by restricting the displacement of the side surfaces 21s on both sides of the radial surface 11a by the first adhesive 37, the deformation (expansion and contraction) of the cavity member 21 in the plane direction can be effectively reduced.

Further, in the present embodiment, the plate-shaped element 11 has a flat plate shape.

In this case, for example, as described above, the normal circuit board manufacturing method can be applied to the plate-shaped element 11 manufacturing method, and the manufacturing method of the generating unit 7 is facilitated. Further, for example, ultrasonic waves can be applied to a relatively wide focusing area.

7 (a) and 7 (b) are schematic views for explaining the effect of irradiating the above-mentioned wide focusing region with ultrasonic waves. Specifically, FIGS. 7 (a) and 7 (b) schematically show the state of focusing of ultrasonic waves in the present embodiment and other examples.

First, as another example, consider an element 151 having a curved radial surface 151a, as shown in FIG. 7B. The radiating surface 151a is composed of, for example, a single plate-shaped lens member, and a plurality of vibrating elements 15 (strictly, those corresponding to the vibrating elements 15; not shown here) are behind the lens member. It is arranged. Then, the lens member focuses the ultrasonic waves generated by the plurality of vibrating elements 15 on the focal point P1. The focal point P1 is theoretically a point, and ultrasonic waves are focused in a relatively narrow range.

On the other hand, as shown in FIG. 7A, the ultrasonic waves radiated from the plate-shaped element 11 ideally reach the focusing region R1 with the same width (beam width) radiated from the plate-shaped element 11. Be irradiated. Then, the ultrasonic waves of the plurality of plate-shaped elements 11 are focused. Therefore, the focusing region R1 is theoretically a region having a width similar to the width of the ultrasonic wave radiated from the plate-shaped element 11. Then, within the width of the focusing region R1, the intensity of the ultrasonic waves is almost the same. Depending on the size of the affected area 103, the type of disease, and the like, the formation of such a focused region R1 is efficient and / or safe.

Here, as already described, in the present embodiment, since each plate-shaped element 11 has a plurality of vibrating elements 15, the area of the plate-shaped element 11 is the frequency of ultrasonic waves (from another viewpoint). The resonance frequency of the vibrating element 15) can be set separately. As a result, for example, it is easy to obtain a combination of a desired ultrasonic frequency and a desired beam width (area of the plate-shaped element 11). Further, since the bending deformation of the entire plate-shaped element 11 is suppressed as described above, it is easy to keep the width of the ultrasonic wave radiated from the plate-shaped element 11 constant.

<Second Embodiment>
FIG. 8 is a cross-sectional view similar to FIG. 6 showing the configuration of the generating portion 207 according to the second embodiment.

The present embodiment is different from the first embodiment in that the first adhesive 37 is adhered not only to the side surface 21s of the cavity member 21 but also to the side surface 19s of the element substrate 19. The first adhesive 37 may be adhered to a surface other than the side surface 19s (for example, a surface opposite to the support 13) with respect to the element substrate 19 (example in the figure), or is adhered to the element substrate 19. It does not have to be. Regarding the adhesion range of the first adhesive 37 to the support 13 in the direction along the outer edge of the plate-shaped element 11 and in the cross-sectional view, the description of the first embodiment may be incorporated.

The first adhesive 37 may be adhered to the entire side surface 19s of the element substrate 19 in the thickness direction of the plate-shaped element 11 (illustrated example), or is adhered only to a part of the side surface 19s. May be good. In the latter case, the size of the bonded area on the side surface 19s is arbitrary. The region to which the side surface 19s is adhered may extend over half or more of the side surface 19s or less than half in the thickness direction of the plate-shaped element 11. Further, the position of the region where the side surface 19s is adhered (whether it is on the cavity member 21 side or the opposite side, etc.) is also arbitrary.

In the illustrated example, the first adhesive 37 is adhered to both the side surface 21s of the cavity member 21 and the side surface 19s of the element substrate 19, and is adhered to the entire surface. However, unlike the illustrated example, the first adhesive 37 is adhered only to the side surface 19s (all or part thereof) or to the side surface 19s (all or part thereof) and a part of the side surface 21s. You may do it. For example, when air enters the overlapping portion 13e side of the first adhesive 37, the first adhesive 37 adheres only to the side surface 19s, or a part of the side surface 21s and a part of the side surface 19s (all or a part thereof). It may be adhered to.

The description of the bonding range of the first adhesive 37 with respect to the side surface 11s (side surface 21s) in the direction along the outer edge of the plate-shaped element 11 described in the first embodiment is incorporated into the bonding range of the first adhesive 37 with respect to the side surface 19s. You can. For example, the first adhesive 37 may be adhered to the side surface 19s over the entire circumference of the outer edge of the plate-shaped element 11, or may be adhered to the side surface 19s only at a part of the outer edge of the plate-shaped element 11. May be good. Further, for example, the first adhesive 37 may be adhered to the side surfaces 19s on both sides of the radial surface 11a (more specifically, for example, at least one vibrating element 15).

As described above, also in this embodiment, the first adhesive 37 is adhered to the side surface 11s of each of the plurality of plate-shaped elements 11. Therefore, for example, the same effect as that of the first embodiment is achieved. Specifically, for example, the bending deformation of the plate-shaped element 11 over the entire plate-shaped element 11 can be reduced, and thus the energy loss can be reduced, or the probability that the focusing region R1 becomes larger than the intended size can be reduced. can do.

Further, in the present embodiment, the first adhesive 37 is adhered not only to the side surfaces 21s of the cavity member 21 but also to the side surfaces 19s of the element substrate 19 on both sides of the radiation surface 11a.

Therefore, for example, the above effect is improved. The reason is, for example, that the adhesive area is increased as compared with the first embodiment. Further, for example, it is possible to reduce the expansion and contraction of the entire element substrate 19 (piezoelectric layer 27), which can cause the entire plate-shaped element 11 to bend and deform.

<Third Embodiment>
FIG. 9 is a cross-sectional view similar to FIG. 6, showing the configuration of the generation unit 307 according to the third embodiment.

The first aspect of the present embodiment is that not only the first adhesive 37 but also the second adhesive 73 for adhering the plate-shaped element 11 and the support 13 in the direction facing the radial surface 11a is provided. It differs from the second embodiment. In FIG. 9, the region to which the first adhesive 37 is adhered is exemplified by that of the second embodiment, but the region to which the first adhesive 37 is adhered is that of the first embodiment. There may be.

More specifically, as described above, the plate-shaped element 11 has the cavity member 21 side facing the overlapping portion 13e of the support 13, and the outer edge portion of the cavity member 21 and the overlapping portion 13e of the support 13. And overlap with each other in the direction in which the radial surface 11a faces. The second adhesive 73 intervenes between them to bond them together.

The arrangement area of the second adhesive 73 may be appropriately set. For example, the second adhesive 73 is a region in which the plate-shaped element 11 (more specifically, the cavity member 21) and the overlapping portion 13e of the support 13 overlap each other in the direction from the central side to the outer edge side of the plate-shaped element 11. It may cover the entire area or only a part of the area. In the latter case, the second adhesive 73 may be located only on the inner edge side (opening 13h side) of the above-mentioned overlapping regions, or may be located only on the outer edge side, for example. , May be located only in a range away from both the inner and outer edges. Further, for example, the second adhesive 73 may spread outward from the outer edge of the plate-shaped element 11. In this case, the second adhesive 73 may be interposed between the first adhesive 37 and the overlapping portion 13e in at least a part of the overlapping region.

In the direction along the outer edge of the plate-shaped element 11, the description of the adhesion range of the first adhesive 37 to the plate-shaped element 11 and the support 13 described in the first embodiment describes the plate-shaped element 11 of the second adhesive 73 and the plate-shaped element 73. It may be used for the adhesion range of the support 13 with respect to the overlapping portion 13e. For example, the bonding range of the second adhesive 73 may cover the entire circumference of the plate-shaped element 11, or may cover only a part of the plate-shaped element 11. Further, for example, the first adhesive 37 may be adhered to the plate-shaped element 11 and the overlapping portion 13e on both sides of the radial surface 11a (more specifically, for example, at least one vibrating element 15).

The thickness of the second adhesive 73 may also be set as appropriate. For example, the thickness of the second adhesive 73 may be more than half or less than half the thickness of the plate-shaped element 11.

The material of the second adhesive 73 may be the same as or different from the material of the first adhesive 37. Further, in any case, the description of the material of the first adhesive 37 described above may be referred to the description of the material of the second adhesive 73.

When the material of the first adhesive 37 and the material of the second adhesive 73 are different, the elastic modulus of the material of the first adhesive 37 is made larger than, for example, the elastic modulus of the material of the second adhesive 73. Good. On the contrary, the elastic modulus of the material of the first adhesive 37 may be smaller than the elastic modulus of the material of the second adhesive 73. Various combinations of a material having a relatively large elastic modulus and a material having a relatively low elastic modulus are possible. For example, the former is a general resin-based adhesive, while the latter is described above. It may be an elastic adhesive of. Further, the degree of difference in elastic modulus between the two may be appropriately set. For example, the elastic modulus of the former may be 2 times or more, 5 times or more, or 10 times or more of the elastic modulus of the latter.

As described above, also in this embodiment, the first adhesive 37 is adhered to the side surface 11s of each of the plurality of plate-shaped elements 11. Therefore, for example, the same effect as that of the first embodiment is achieved.

Further, in the present embodiment, the support 13 and the outer edges of the plurality of plate-shaped elements 11 are overlapped with each other via the second adhesive 73 in the direction in which the radial surface 11a faces.

Therefore, for example, the area where the plate-shaped element 11 is adhered to the support 13 increases. As a result, for example, the probability that the stress generated by vibration is concentrated on the first adhesive 37 is reduced, and the durability against vibration is improved.

Further, in the present embodiment, the elastic modulus of the first adhesive 37 may be made larger than the elastic modulus of the second adhesive 73.

In this case, for example, because the first adhesive 37 is relatively hard, it is easy to maintain the effect described in the first embodiment. On the other hand, since the second adhesive 73 is relatively soft, for example, the relative displacement of the overlapping surfaces of the plate-shaped element 11 and the overlapping portion 13e of the support 13 can be allowed to some extent. As a result, for example, the probability that the second adhesive 73 will peel off from the plate-shaped element 11 or the overlapping portion 13e can be reduced, and the airtightness and the bonding strength can be improved.

Further, in the present embodiment, contrary to the above, the elastic modulus of the first adhesive 37 may be smaller than the elastic modulus of the second adhesive 73.

In this case, for example, the plate-shaped element 11 is more likely to function as a fixed end at a position on the center side of the plate-shaped element 11 than the side surface 11s to which the first adhesive 37 is adhered. As a result, for example, the distance between the fixed ends is shortened, and the resonance frequencies of the various vibration modes of the plate-shaped element 11 are increased. Therefore, for example, when the resonance frequency of any of the vibration modes of the plate-shaped element 11 is located near the ultrasonic frequency and on the high frequency side, the resonance frequency is set by hardening the second adhesive 73. It can be separated from the ultrasonic frequency to the high frequency side. As a result, the influence of unnecessary vibration on ultrasonic waves can be reduced.

<Fourth Embodiment>
FIG. 10 is a cross-sectional view similar to FIG. 6 showing the configuration of the generation unit 407 according to the fourth embodiment. However, here, a range extending over two plate-shaped elements 11 adjacent to each other is shown. In FIG. 10, the difference in angle between the two plate-shaped elements 11 is not shown.

The arrangement direction (horizontal direction in the figure) of the plate-shaped elements 11 adjacent to each other in the drawing is either the radial direction or the circumferential direction of the concave surface 7a among the directions along the concave surface 7a (locally, the radial surface 11a). It may be present, or may be in another direction depending on the planar shape and arrangement mode of the plate-shaped element 11. Further, the configuration shown in the drawing may be established in any one direction, or the configuration shown in the drawing may be established in all directions (for example, both the radial direction and the circumferential direction). Further, the configuration shown in the drawing may be established for all the plate-shaped elements 11 arranged in the direction corresponding to the left-right direction in the drawing, or may be established only for some of the plate-shaped elements 11.

In the present embodiment, the side surfaces 11s of the plate-shaped elements 11 adjacent to each other are adhered to each other by the first adhesive 37. Here, the first adhesive 37 that adheres the side surfaces 11s adjacent to each other is considered as one adhesive, but the first adhesive 37 that is adhered to one side surface 11s and the other side surface. It may be considered that the first adhesive 37 adhered to 11s is adhered to each other.

In the present embodiment, since the support 13 has the partition portion 13f between the side surfaces 11s adjacent to each other, the first adhesive 37 is also adhered to the wall surface and the top surface of the partition portion 13f. Although not particularly shown, in the embodiment in which the support 13 does not have the partition portion 13f, the first adhesive 37 is not adhered to the partition portion 13f but is interposed between the side surfaces 11s adjacent to each other. Is glued to.

In the illustrated example, the first adhesive 37 is adhered to the entire wall surface of the partition portion 13f in the height direction of the wall surface, and is adhered to the side surfaces 11s adjacent to each other. However, as understood from the description of the first embodiment, the first adhesive 37 may be adhered to the side surfaces 11s adjacent to each other while being adhered only to a part of the wall surface (for example, the top side). The thickness of the first adhesive 37 (thickness including the height of the partition portion 13f in the present embodiment) between the side surfaces 11s adjacent to each other may be appropriately set. For example, the thickness of the first adhesive 37 may be equal to or greater than the thickness of the plate-shaped element 11 (in the illustrated example), or may be less than the thickness of the plate-shaped element 11.

Further, the height of the partition portion 13f may be higher than the upper surface (the surface on the FPC35 side) of the element substrate 19 constituting the plate-shaped element 11 and lower than the lower surface (the surface on the element substrate 19 side) of the FPC35. .. When the height of the partition portion 13f is such a height, the FPC35 located above the partition portion 13f is bent by the partition portion 13f while reducing the interference between the element substrates 19 in the adjacent plate-shaped elements 11. It is possible to reduce the load on the device. It is also preferable in terms of ease of handling of the FPC 35 when the FPC 35 is bonded to the element substrate 19.

In the illustrated example, the second adhesive 73 is provided as in the third embodiment. Further, as in the second embodiment, the first adhesive 37 is adhered to both the side surface 21s of the cavity member 21 and the side surface 19s of the element substrate 19. However, even if the first adhesive 37 (a mode in which the partition portion 13f is provided and a mode in which the partition portion 13f is not provided) for adhering the side surfaces 11s adjacent to each other is applied to a mode in which the second adhesive 73 is not provided. Alternatively, the first adhesive 37 may be applied to a mode in which only one of the side surface 19s and the side surface 21s is adhered, or may be applied to a combination of the above two modes.

As described above, also in this embodiment, the first adhesive 37 is adhered to the side surface 11s of each of the plurality of plate-shaped elements 11. Therefore, for example, the same effect as that of the first embodiment is obtained. Specifically, for example, it is possible to reduce the bending deformation of the entire plate-shaped element 11, thus reducing the energy loss, and reducing the probability that the focusing region R1 becomes larger than the intended size. it can.

Further, in the present embodiment, the side surfaces 11s of the plate-shaped elements 11 adjacent to each other are adhered to each other by the first adhesive 37.

In this case, for example, the effect of reducing the above-mentioned bending deformation is improved. Specifically, it is as follows. For example, usually, adjacent plate-shaped elements 11 contract or expand at the same timing as each other. Therefore, when the side surfaces 11s adjacent to each other are adhered to each other, the side surfaces 11s are attracted to each other via the first adhesive 37 when the plate-shaped element 11 contracts, and the first when the plate-shaped element 11 extends. They are pressed against each other via the adhesive 37. As a result, the displacement of the side surface 11s is reduced, and the above-mentioned effect is improved.

Further, in the present embodiment, the support 13 has a partition portion 13f located between the side surfaces 11s of the plate-shaped elements 11 adjacent to each other and to which the first adhesive 37 is adhered. There is. The elastic modulus of the support 13 may be made larger than the elastic modulus of the first adhesive 37, for example.

In this case, for example, when the side surfaces 11s adjacent to each other are pulled or pressed against each other as described above, the partition portion 13f having a higher elastic modulus than the first adhesive 37 is interposed between them. As a result, for example, the proximity and separation of the side surfaces 11s adjacent to each other are further reduced. As a result, the above-mentioned effect is improved.

<Fifth Embodiment>
FIG. 11 is a cross-sectional view similar to FIG. 6, showing the configuration of the generation unit 507 according to the fifth embodiment.

This embodiment is different from other embodiments in that the first adhesive 37 reaches the FPC 35. More specifically, the first adhesive 37 reaches the FPC 35 from the side surface 11s of the plate-shaped element 11 and is adhered to the FPC 35, so that the first adhesive 37 is formed on the outer peripheral portion of the space 71 between the plate-shaped element 11 and the FPC 35. At least part of it is blocked. For example, the first adhesive 37 closes the outer peripheral portion of the space 71 over the entire circumference of the space 71, and the space 71 is sealed.

In the embodiment in which the outer peripheral portion of the space 71 is closed in this way, the first adhesive 37 may only reach the surface of the FPC 35 on the plate-like element 11 side, or the side surface of the FPC 35 may be pressed. It may be covered, or may be covered on the surface of the FPC 35 opposite to the plate-shaped element 11 (illustrated example). Further, when the first adhesive 37 covers the surface of the FPC 35 opposite to the plate-shaped element 11, the first adhesive 37 covers the entire surface of the FPC 35 opposite to the plate-shaped element 11. It may be covered (example in the figure), or only a part (for example, the outer peripheral portion) may be covered.

When the FPC 35 is covered with the first adhesive 37, the connection between the FPC 35 and the cable 49 may be made as appropriate. For example, the FPC 35 may be partially extended to the outside of the first adhesive 37 and directly or indirectly connected to the cable 49. In the present disclosure, when it is said that the entire FPC 35 is covered with the first adhesive 37, a mode in which a part of the FPC 35 is extended may be included. Further, for example, the wiring connected to the FPC 35 and extending from the first adhesive 37 may be directly or indirectly connected to the cable 49. Further, for example, a part of the surface of the FPC 35 opposite to the plate-shaped element 11 (for example, the area on the center side of the FPC 35) is exposed from the first adhesive 37, and the pad provided in the part of the FPC 35 is directly exposed. Alternatively, it may be indirectly connected to the cable 49.

As described in the description of the first embodiment, unlike the illustrated example, the FPC 35 may extend over two or more plate-shaped elements 11. Also in this case, for example, the space 71 can be sealed by adhering the first adhesive 37 to the surface of the FPC 35 on the plate-shaped element 11 side around each plate-shaped element 11. And / or, for example, the space 71 can be sealed by adhering the first adhesive 37 to the outer edge (for example, the side surface of the FPC 35) of the FPC 35 that overlaps the two or more plate-shaped elements 11.

Further, in the present embodiment, from another viewpoint, the first adhesive 37 overlaps the FPC 35 on the side opposite to the plate-shaped element 11 in a range including at least a plurality of vibrating elements 15. In the illustrated example, the first adhesive 37 overlaps the entire FPC35. Further, the first adhesive 37 covers the entire plate-shaped element 11 from above the FPC 35. From this point of view, the space 71 may or may not be sealed.

The thickness of the first adhesive 37 on the FPC 35 may be appropriately set. For example, the thickness may be equal to or greater than the thickness of the plate-shaped element 11 or less than the thickness of the plate-shaped element 11. Further, the upper surface of the first adhesive 37 (the surface opposite to the FPC 35) may be a curved surface or a flat surface as shown in the illustrated example.

Also in the illustrated example, the height of the partition portion 13f is higher than the upper surface (the surface on the FPC35 side) of the element substrate 19 constituting the plate-shaped element 11, and the lower surface of the FPC35 (the surface on the element substrate 19 side). May be lower than. When the height of the partition portion 13f is such a height, the FPC35 located above the partition portion 13f is bent by the partition portion 13f while reducing the interference between the element substrates 19 in the adjacent plate-shaped elements 11. It is possible to reduce the load on the device. It is also preferable in terms of ease of handling of the FPC 35 when the FPC 35 is bonded to the element substrate 19.

In the illustrated example, the second adhesive 73 is provided as in the third embodiment. Further, as in the second embodiment, the first adhesive 37 is adhered to both the side surface 21s of the cavity member 21 and the side surface 19s of the element substrate 19. Further, the first adhesive 37 does not bond the side surfaces 11s of the adjacent plate-shaped elements 11 to each other, as in the first to third embodiments. However, the first adhesive 37 that is also adhered to the FPC 35 may be applied in a mode in which the second adhesive 73 is not provided, and the first adhesive 37 is applied to only one of the side surface 19s and the side surface 21s. It may be applied to the aspect in which it is adhered, it may be applied to the embodiment in which the first adhesive 37 is adhered to the side surfaces 11s adjacent to each other, or it is applied to two or more combinations of the above three aspects. May be done.

As described above, also in this embodiment, the first adhesive 37 is adhered to the side surface 11s of each of the plurality of plate-shaped elements 11. Therefore, for example, the same effect as that of the first embodiment is obtained. Specifically, for example, it is possible to reduce the bending deformation of the entire plate-shaped element 11, thus reducing the energy loss, and reducing the probability that the focusing region R1 becomes larger than the intended size. it can.

Further, in the present embodiment, the first adhesive 37 reaches the FPC 35 from the side surface 11s of the plate-shaped element 11 and is adhered to the FPC 35, whereby the outer periphery of the space 71 between the plate-shaped element 11 and the FPC 35 is formed. It blocks at least part of the department.

In this case, for example, by blocking at least a part of the outer peripheral portion of the space 71, the inflow of gas (for example, air) into the space 71 and the outflow of gas from the space 71 are suppressed. Here, the vibrating element 15 is in contact with the liquid LQ on the radiation surface 11a side. On the other hand, on the side opposite to the radiation surface 11a, it is in contact with the gas in the space 71. That is, the vibrating element 15 has different substances in contact with the front and back surfaces. As a result, for example, in the vibrating element 15, the symmetry of the deflection vibration for generating ultrasonic waves is broken, the displacement amount is reduced, and the sound pressure of the ultrasonic waves is lowered. However, by suppressing the inflow and outflow of the gas in the space 71, for example, the resistance that the vibrating element 15 receives from the gas in the space 71 increases. As a result, the difference between the resistance that the vibrating element 15 receives from the liquid LQ and the resistance that the vibrating element 15 receives from the gas in the space 71 is reduced. As a result, the asymmetry of bending vibration can be reduced.

Further, in the present embodiment, the first adhesive 37 covers the entire plate-shaped element 11 from above the FPC 35, and seals the space 71, for example.

In this case, the effect of reducing the above asymmetry is improved. The reason is, for example, that the space 71 is sealed. Further, for example, the first adhesive 37 overlaps with the FPC 35 to reduce the flexibility of the FPC 35.

<Sixth Embodiment>
FIG. 12 is a cross-sectional view similar to FIG. 6 showing the configuration of the generation unit 607 according to the sixth embodiment.

The present embodiment is different from the fifth embodiment in that a reinforcing member 75 facing the FPC 35 from the side opposite to the plate-shaped element 11 is provided. Unlike the FPC 35, the reinforcing member 75 is made of a material that does not have flexibility. Thereby, for example, the bending deformation of the FPC 35 can be suppressed, the resistance received by the vibrating element 15 from the gas in the space 71 can be increased, and the above-mentioned effect of reducing the asymmetry can be obtained.

The shape and dimensions of the reinforcing member 75 may be appropriately set. For example, the reinforcing member 75 may be in the shape of a flat plate having a certain thickness. The size of the reinforcing member 75 may be, for example, the size of all the vibrating elements 15 included in one element substrate 19. The size of the reinforcing member 75 may be narrower, equal to, or wider than the size of the FPC 35. The planar shape of the reinforcing member 75 may be, for example, a shape similar to or similar to the planar shape of the FPC 35 or the plate-shaped element 11, or may be a different shape. The thickness of the reinforcing member 75 may be thicker than the thickness of the FPC 35 (in the illustrated example), or may be equal to or less than the thickness of the FPC 35.

The material of the reinforcing member 75 is arbitrary. For example, the elastic modulus of the material of the reinforcing member 75 may be larger than the elastic modulus of the material of the first adhesive 37. Specifically, for example, the first adhesive 37 may be a resin-based adhesive, while the reinforcing member 75 may be a metal (for example, stainless steel). The material of the reinforcing member 75 may be the same as or different from the material of the support 13.

The reinforcing member 75 may, for example, overlap the FPC 35 via the first adhesive 37 (example in the figure), or may directly overlap the FPC 35. In the illustrated example, the entire surface of the reinforcing member 75 opposite to the FPC 35 is covered with the first adhesive 37. From another viewpoint, the front and back surfaces and side surfaces of the reinforcing member 75 are covered with the first adhesive 37, and are embedded in the first adhesive 37. However, unlike the illustrated example, for example, the first adhesive 37 is adhered only to the outer edge of the reinforcing member 75, and all or most of the surface of the reinforcing member 75 opposite to the FPC 35 is opposite to the FPC 35. It may be exposed to the side.

As described above, also in this embodiment, the first adhesive 37 is adhered to the side surface 11s of each of the plurality of plate-shaped elements 11. Therefore, for example, the same effect as that of the first embodiment is obtained. Specifically, for example, it is possible to reduce the bending deformation of the entire plate-shaped element 11, thus reducing the energy loss, and reducing the probability that the focusing region R1 becomes larger than the intended size. it can.

Further, in the present embodiment, the generating portion 607 has a reinforcing member 75. The reinforcing member 75 is indirectly or directly overlapped with the FPC 35 from the side opposite to the plate-shaped element 11 via the first adhesive 37, and the first adhesive 37 is adhered to the FPC 35. The elastic modulus of the reinforcing member 75 is larger than the elastic modulus of the first adhesive 37.

In this case, for example, it is easier to reduce the bending deformation of the FPC 35 than in the embodiment in which the FPC 35 is covered only with the first adhesive 37. As a result, for example, the effect described in the fifth embodiment is improved. Specifically, by reducing the bending deformation of the FPC 35, the resistance that the vibrating element 15 receives from the gas in the space 71 can be increased, and the asymmetry of the bending vibration of the vibrating element 15 can be reduced.

The technique according to the present disclosure is not limited to the above embodiments, and may be implemented in various embodiments.

The plurality of plate-shaped elements may not be arranged so as to form a concave surface. For example, the plurality of plate-shaped elements may be arranged on the same plane as a plurality of slats of a blind, and may be arranged at different angles with respect to the plane so as to face the same position. Further, the plate-shaped element may have a curved surface shape instead of a flat plate shape. In this case, the ultrasonic generator may be intended to focus the ultrasonic waves at the focal point as shown in FIG. 7 (b).

The vibrating element (plate-shaped element) is not limited to the one in which the piezoelectric body itself bends and deforms. For example, the vibrating element may have a structure including a diaphragm forming a radial surface and a piezoelectric body behind the diaphragm that expands and contracts in a direction intersecting the radial surface to bend and deform the diaphragm. Further, the vibrating element in which the piezoelectric body itself bends and deforms is not limited to the unimorph type shown in the embodiment, and may be, for example, a bimorph type in which piezoelectric bodies having different polarization directions are laminated. Further, the plate-shaped element may not have a cavity member.

In the embodiment, the support has one opening 13h that exposes a plurality of vibrating elements of one plate-shaped element. Instead of such an opening 13h, a plurality of openings individually overlapping the plurality of vibrating elements may be provided in the support. In this case, the second adhesive 73 may bond the support and the plate-shaped element around each of the plurality of openings. Even in this embodiment, by adhering the first adhesive to the side surface of the plate-shaped element, unnecessary vibration such as vibration propagating on the surface opposite to the surface overlapping the support of the plate-shaped element is unnecessary. The effect is that it is easy to reduce. Further, when the support has an opening for each vibrating element, even if the cavity member is omitted, the frequency of the vibrating element is defined by the opening of the support as in the embodiment in which the cavity member is provided. can do.

In the embodiment, the plate-shaped element 11 is superposed on the back surface 13b (the surface opposite to the patient 101) with respect to the support 13, but conversely, the front surface 13a (on the patient 101 side) with respect to the support 13. It may be overlapped on a surface) or may not have such an overlap. Further, the plate-shaped element 11 may face either the cavity member 21 side or the element substrate 19 side with respect to the support 13 and / or the patient 101 side.

1 ... Ultrasonic device, 3 ... Ultrasonic radiation device, 11 ... Plate element, 11a ... Radiation surface, 11s ... Side surface (of plate element), 13 ... Support, 15 ... Vibration element, 37 ... First adhesive , R1 ... Focusing area.

Claims (15)

A plurality of plate-shaped elements having radiation surfaces for emitting ultrasonic waves on one of the front and back surfaces, and
A support that holds the plurality of plate-shaped elements in an arrangement in which the plurality of radial surfaces are directed to the same position from different directions, and
A first adhesive that adheres the plurality of plate-shaped elements to the support,
Have and
Each of the plurality of plate-shaped elements has a plurality of vibrating elements that generate vibrations that generate ultrasonic waves at a plurality of positions in the radiation surface.
The first adhesive is an ultrasonic radiation device that is adhered to the side surface of each of the plurality of plate-shaped elements. Each of the plurality of plate-shaped elements
An element substrate that extends along the radial surface and includes the plurality of vibrating elements.
It has a cavity member that extends along the radial surface and has a plurality of openings that individually overlap the plurality of vibrating elements.
The device substrate contains a piezoelectric layer that generates stress in the direction along the radial surface.
The ultrasonic radiation device according to claim 1, wherein the first adhesive is adhered to at least one of a side surface of the cavity member and a side surface of the element substrate. In the direction in which the radial surface faces, the support, the cavity member, and the element substrate are overlapped in this order.
The ultrasonic radiation device according to claim 2, wherein the first adhesive is adhered to both side surfaces of the cavity member with the radiation surface interposed therebetween. The ultrasonic radiation device according to claim 3, wherein the first adhesive is also adhered to both side surfaces of the element substrate with the radiation surface interposed therebetween. The method according to any one of claims 1 to 4, wherein the support and the outer edges of the plurality of plate-shaped elements are overlapped with each other via a second adhesive in the direction in which the radial surface faces. Ultrasonic radiation equipment. The ultrasonic radiation device according to claim 5, wherein the elastic modulus of the first adhesive is larger than the elastic modulus of the second adhesive. The ultrasonic radiation device according to claim 5, wherein the elastic modulus of the first adhesive is smaller than the elastic modulus of the second adhesive. The ultrasonic radiating instrument according to any one of claims 1 to 7, wherein the side surfaces of the plate-shaped elements adjacent to each other are bonded to each other by the first adhesive. The support has a partition portion located between the side surfaces of the plate-shaped elements adjacent to each other and to which the first adhesive is adhered.
The ultrasonic radiation device according to any one of claims 1 to 8, wherein the elastic modulus of the support is larger than the elastic modulus of the first adhesive. It further has a flexible substrate that overlaps the plate-shaped element on the side opposite to the radial surface with a space.
Claims 1 to 9 that the first adhesive reaches at least a part of the outer peripheral portion of the space by reaching the flexible substrate from the side surface of the plate-shaped element and being adhered to the flexible substrate. The ultrasonic radiation device according to any one of the above items. The support has a partition portion that is located between the side surfaces of the plate-shaped elements that are adjacent to each other and that are adjacent to each other and to which the first adhesive is adhered.
The ultrasonic radiation device according to claim 10, wherein the height of the partition portion is higher than the upper surface of the plate-shaped element and lower than the lower surface of the flexible substrate. The ultrasonic radiation device according to claim 10 or 11, wherein the first adhesive covers the entire plate-shaped element from above the flexible substrate and seals the space. It further has a reinforcing member that overlaps the flexible substrate from the side opposite to the plate-shaped element and to which the first adhesive is adhered.
The ultrasonic radiation device according to any one of claims 10 to 12, wherein the elastic modulus of the reinforcing member is larger than the elastic modulus of the adhesive. The ultrasonic radiating instrument according to any one of claims 1 to 13, wherein the plate-shaped element has a flat plate shape. The ultrasonic radiating device according to any one of claims 1 to 14,
A drive control unit that supplies AC power having a frequency within the ultrasonic frequency band to the plate-shaped element,
Ultrasonic device that has.

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