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WO2021070782A1 - Dispositif de traitement de composant électronique - Google Patents

Dispositif de traitement de composant électronique Download PDF

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Publication number
WO2021070782A1
WO2021070782A1 PCT/JP2020/037743 JP2020037743W WO2021070782A1 WO 2021070782 A1 WO2021070782 A1 WO 2021070782A1 JP 2020037743 W JP2020037743 W JP 2020037743W WO 2021070782 A1 WO2021070782 A1 WO 2021070782A1
Authority
WO
WIPO (PCT)
Prior art keywords
unit
suction
electronic component
region
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2020/037743
Other languages
English (en)
Japanese (ja)
Inventor
一矢 大場
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ueno Seiki Co Ltd
Original Assignee
Ueno Seiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ueno Seiki Co Ltd filed Critical Ueno Seiki Co Ltd
Priority to CN202080070534.5A priority Critical patent/CN114556538B/zh
Priority to MYPI2022001837A priority patent/MY195241A/en
Publication of WO2021070782A1 publication Critical patent/WO2021070782A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H10P72/78—
    • H10P72/00—
    • H10P72/0611—
    • H10P72/30—
    • H10P72/3202—
    • H10P72/3302—
    • H10P72/3314—
    • H10P72/50—

Definitions

  • This disclosure relates to a processing device for electronic components.
  • Patent Document 1 describes a method for mounting an electronic component in which the suction nozzle and the needle are moved so that the center of the chip, the center of the suction nozzle for sucking the chip, and the center of the needle protruding toward the suction nozzle side coincide with each other. To disclose.
  • the present disclosure relates to a device effective for simplifying the configuration for aligning the position of the electronic component, the position of the suction portion for picking up the electronic component, and the position of the protrusion portion for protruding the electronic component toward the suction portion.
  • the electronic component processing apparatus is along a circular orbit that passes through a suction region that sandwiches an electronic component between a sheet holding portion that holds a sheet having an attached surface to which an electronic component is attached.
  • a swivel portion that holds the plurality of suction portions
  • a swivel drive unit that swivels the swivel portion around a rotation axis fixed along the central axis of a circular orbit, and an electronic component.
  • a protruding portion that is arranged so as to sandwich the sheet and projects the sheet toward the suction region, a sheet position adjusting portion that changes the position of the sheet holding portion in the direction along the sticking surface, and a protruding portion in the direction along the sticking surface. It is provided with a protrusion position adjusting unit for changing the position.
  • FIG. 1 is a plan view schematically showing a processing device for electronic components.
  • FIG. 2 is a side view of the pickup unit.
  • FIG. 3 is a cross-sectional view taken along the line III-III in FIG.
  • FIG. 4 is a cross-sectional view taken along the line IV-IV in FIG.
  • FIG. 5 is a block diagram illustrating a functional configuration of the controller.
  • FIG. 6 is a block diagram illustrating a hardware configuration of the controller.
  • FIG. 7 is a flowchart illustrating the calibration procedure.
  • FIG. 8 is a flowchart illustrating the pickup procedure.
  • FIG. 9 is a flowchart illustrating a delivery procedure.
  • FIG. 10 is a flowchart illustrating an imaging procedure of an electronic component.
  • the electronic component processing device 1 is a so-called die sorter, and is subjected to processing such as appearance inspection, electrical characteristic inspection, marking, etc. while transporting the electronic component W formed in the previous process such as dicing. It is a device that packs tapes, container tubes, etc. As shown in FIGS. 1 and 2, the processing device 1 includes a transport device 10, a plurality of processing units 20, and a controller 200.
  • the transport device 10 transports the electronic component W along the circular orbit CR1.
  • the electronic component W to be transported has two main surfaces Wa and Wb parallel to each other.
  • the transport device 10 includes a turntable 11, a plurality of holding units 12, a swivel drive unit 13, and a plurality of elevating drive units 18.
  • the turntable 11 is provided so as to be rotatable around the vertical rotation axis Ax1.
  • the plurality of holding portions 12 are arranged at equal intervals along the circumference centered on the rotation axis Ax1 and are fixed to the turntable 11.
  • Each of the plurality of holding portions 12 holds the electronic component W.
  • the holding unit 12 may hold the electronic component W by any method. Specific examples of the method of holding the electronic component W include vacuum suction, electrostatic suction, and gripping.
  • the holding unit 12 vacuum-sucks either the main surface Wa or Wb (for example, the main surface Wa) from one side in a direction orthogonal to the turntable 11 (a direction parallel to the rotation
  • the holding portion 12 has a suction nozzle 15, a holder 16, and a spring 17.
  • the suction nozzle 15 vacuum sucks the main surface Wa of the electronic component W from above.
  • the suction nozzle 15 is arranged vertically on the turntable 11, and the lower end portion of the suction nozzle 15 opens vertically downward.
  • the holder 16 is fixed to the outer peripheral portion of the turntable 11 and holds the suction nozzle 15 so as to be able to move up and down.
  • the spring 17 resists the lowering of the suction nozzle 15 due to its elasticity. When a downward external force is applied to the upper end of the suction nozzle 15, the spring 17 elastically deforms as the suction nozzle 15 descends. When there is no downward external force on the upper end of the suction nozzle 15, the spring 17 elastically returns and pushes the suction nozzle 15 back to the height before lowering.
  • the turning drive unit 13 uses an electric motor as a power source, for example, and turns the turntable 11 around the rotating shaft Ax1 by a direct drive without a gear. As a result, the plurality of holding portions 12 move around the horizontal circular orbit CR1 centered on the rotation axis Ax1.
  • the swivel drive unit 13 is controlled so as to repeatedly rotate and stop the turntable 11 at the same pitch as the angle pitch between the adjacent holding units 12 (the angle pitch around the rotation axis Ax1).
  • a plurality of positions where the plurality of holding units 12 are arranged when the turning drive unit 13 stops the turntable 11 are referred to as "plurality of stop positions SP1".
  • the plurality of elevating drive units 18 individually elevate and elevate the suction nozzles 15 of the plurality of holding units 12.
  • the plurality of elevating drive units 18 are fixed above the plurality of stop positions SP1 so as not to rotate together with the turntable 11.
  • the elevating drive unit 18 applies a downward force to the upper end portion of the suction nozzle 15 by using, for example, an electric motor or an air cylinder as a power source in a state where the holding unit 12 is located below the holding unit 12. As a result, the suction nozzle 15 is lowered.
  • the elevating drive unit 18 releases the state in which the upper end portion of the suction nozzle 15 is applied with a downward force, the suction nozzle 15 rises to the height before lowering due to the elasticity of the spring 17.
  • the plurality of processing units 20 are provided so as to correspond to the plurality of stop positions SP1. It should be noted that the processing unit 20 may not necessarily be provided at all the stop positions SP1. Each processing unit 20 performs a predetermined process on the electronic component W arranged at the stop position SP1 (stop position SP1 corresponding to the processing unit 20).
  • the "processing” here includes any act of changing the state of the electronic component W. For example, marking the electronic component W, holding the electronic component W in the holding unit 12, and collecting the electronic component W released by the holding unit 12 correspond to “processing". Further, correcting the holding position of the electronic component W by the holding unit 12 also corresponds to "processing". Further, executing some kind of inspection on the electronic component W also corresponds to "processing" because the inspection data changes the unknown state to the known state of the inspection data.
  • a specific example of the processing unit 20 is the pickup unit 100.
  • the pickup unit 100 picks up the electronic component W from the wafer sheet, conveys it to the vicinity of any stop position SP1, and delivers it to the holding unit 12 of the stop position SP1.
  • Other examples of the processing unit 20 include a position correction unit, an appearance inspection unit, an electrical characteristic inspection unit, a marking unit, a non-defective product collection unit, a defective product collection unit, and the like.
  • the position correction unit corrects the holding position of the electronic component W by the holding unit 12.
  • the visual inspection unit inspects the appearance of the electronic component W based on the captured image of the electronic component W.
  • the electrical characteristic inspection unit inspects the electrical characteristics of the electronic component W. Specific examples of electrical characteristics include electrical resistance between terminals, capacitance, and the like.
  • the marking portion marks the electronic component W by laser marking or the like.
  • the non-defective product collection unit stores the electronic component W, which has no abnormality in all inspections, in a tape, tray, or the like.
  • the defective product collection unit collects the electronic component W having an abnormality in any of the inspections in a box or the like.
  • the pickup unit 100 includes a seat holding unit 110, a seat position adjusting unit 120, a rotary pickup 130, a protruding unit 150, and a protruding position adjusting unit 160.
  • the sheet holding unit 110 holds a sheet having a sticking surface to which the electronic component W is stuck.
  • the sheet include a wafer sheet 91 to which the electronic component W is attached.
  • the wafer sheet 91 has an adhesive sticking surface 93 to which a semiconductor wafer is stuck.
  • the semiconductor wafer is attached to the attachment surface 93 in a state of being cut into a plurality of electronic components W (for example, semiconductor chips) by dicing.
  • the main surface Wa of the electronic component W is attached to the attachment surface 93.
  • a ring frame 92 may be attached to the peripheral edge of the wafer sheet 91.
  • the seat holding portion 110 may be configured to hold the ring frame 92.
  • the sheet holding portion 110 holds the ring frame 92 around the transport device 10 so that the sticking surface 93 stands vertically and faces the rotation axis Ax1.
  • the sheet position adjusting unit 120 changes the position of the sheet holding unit 110 in the direction along the sticking surface 93.
  • the sheet position adjusting unit 120 changes the position of the sheet holding unit 110 in two directions in the direction along the sticking surface 93.
  • the seat position adjusting unit 120 has a first driving unit 121 and a second driving unit 122.
  • the first drive unit 121 uses, for example, an electric motor or the like as a power source, and displaces the ring frame 92 in the vertical direction along the sticking surface 93.
  • the second drive unit 122 uses, for example, an electric motor or the like as a power source, and displaces the ring frame 92 in the horizontal direction along the sticking surface 93.
  • the rotary pickup 130 picks up the electronic components W one by one from the wafer sheet 91 held by the sheet holding unit 110, conveys them, and delivers them to the holding unit 12.
  • the rotary pickup 130 is arranged below the turntable 11 between the rotation shaft Ax1 and the seat holding portion 110.
  • the rotary pickup 130 has a plurality of suction portions 131, a swivel portion 132, and a swivel drive unit 133.
  • the plurality of suction portions 131 are arranged along the circular orbit CR2.
  • the circular orbit CR2 is arranged so that the electronic component W on the sticking surface 93 is located between the circular orbit CR2 and the wafer sheet 91.
  • the electronic component W to be picked up by the rotary pickup 130 is located between the suction region A1 and the wafer sheet 91.
  • the space between the suction region A1 and the wafer sheet 91 is a position for arranging the electronic component W to be picked up.
  • the circular orbit CR2 is along a vertical plane including the rotation axis Ax1.
  • the plane is perpendicular to the sticking surface 93 held by the sheet holding portion 110.
  • the plurality of suction portions 131 may be arranged at equal intervals (equal angle pitch around the rotation axis Ax1) along the circular orbit CR2.
  • FIG. 2 illustrates a case where four suction portions 131 are arranged at a pitch of 90 °, but the number of suction portions 131 is not limited to four.
  • the circular orbit CR2 further passes through the delivery area A2.
  • the delivery region A2 is aligned with the adsorption region A1 along the circular orbit CR2.
  • the delivery area A2 is located at the uppermost part of the circular orbit CR2.
  • the position of the delivery area A2 coincides with the stop position SP1 corresponding to the pickup unit 100.
  • this stop position SP1 will be referred to as "stop position SP1 for delivery”.
  • the rotary pickup 130 delivers the electronic component W from the suction portion 131 located in the delivery region A2 to the holding portion 12.
  • the transport device 10 acquires the electronic component W from any one of the suction portions 131 in the delivery region A2, and transports the electronic component W.
  • the transfer device 10 attracts the electronic component W in the transfer region A2 by the holding unit 12 arranged at the transfer stop position SP1.
  • the plurality of suction portions 131 may be arranged so that when any one of the suction portions 131 is located in the suction region A1, the other suction portion 131 is located in the delivery region A2. For example, around the center of the circular orbit CR2, the distance (angle pitch) between the adjacent suction portions 131 coincides with the distance (angle pitch) between the suction region A1 and the transfer region A2.
  • Each suction unit 131 sucks the electronic component W to be picked up.
  • the suction unit 131 may suck the electronic component W by any method. Specific examples of the method of adsorbing the electronic component W include vacuum adsorption, electrostatic adsorption, and the like.
  • the suction unit 131 has a suction nozzle 134.
  • the suction nozzle 134 opens outward in the radial direction of the circular orbit CR2, and vacuum sucks the main surface Wb of the electronic component W.
  • the swivel portion 132 holds a plurality of suction portions 131.
  • the swivel drive unit 133 swivels the swivel unit 132 around a rotation shaft Ax2 fixed along the central axis of the circular orbit CR2.
  • the swivel drive unit 133 uses, for example, an electric motor as a power source, and swivels the swivel unit 132 around the rotation shaft Ax2 by a direct drive that does not mediate a gear.
  • the swivel drive unit 133 is fixed around the rotary shaft Ax1 so that the rotary shaft Ax2 is not displaced with respect to the rotary shaft Ax1.
  • the rotary pickup 130 may further have a plurality of shock absorbers 135.
  • the plurality of shock absorbers 135 are interposed between the swivel drive unit 133 and the plurality of suction units 131, respectively.
  • Each buffer portion 135 retracts the suction portion 131 in response to an inward external force (external force toward the rotation axis Ax2) acting on the suction portion 131 (the suction portion 131 corresponding to the buffer portion 135). ..
  • the retreat here means displacement toward the rotation axis Ax2.
  • the buffer 135 has a spring 136.
  • the spring 136 resists the retreat of the suction nozzle 134 due to its elasticity.
  • the spring 136 elastically deforms in response to the retreat of the suction nozzle 134, and when the inward external force disappears, the spring 136 elastically returns to the position before the suction nozzle 134 retreats. Push back.
  • the protrusion 150 is arranged so that the wafer sheet 91 is located between the protrusion 150 and the electronic component W to be picked up.
  • the protruding portion 150 projects the wafer sheet 91 and the electronic component W to be picked up toward the suction region A1.
  • the protrusion 150 has a protrusion pin 151 that protrudes toward the back surface 94 of the wafer sheet 91 (the back surface of the sticking surface 93).
  • the protrusion pin 151 is along a line (hereinafter, referred to as “protrusion line”) 152 perpendicular to the sticking surface 93 and the back surface 94.
  • the protrusion 150 uses, for example, an electric motor or the like as a power source, and advances or retracts the protrusion pin 151 along the protrusion line 152.
  • the protrusion position adjusting portion 160 changes the position of the protrusion portion 150 in the direction along the sticking surface 93 (the direction along the plane parallel to the sticking surface 93).
  • the protrusion position adjusting unit 160 changes the position of the protrusion 150 in two directions in the direction along the sticking surface 93.
  • the protrusion position adjusting unit 160 has a first driving unit 161 and a second driving unit 162.
  • the first drive unit 161 uses, for example, an electric motor or the like as a power source, and displaces the protrusion 150 in the vertical direction along a surface parallel to the sticking surface 93.
  • the second drive unit 162 uses, for example, an electric motor or the like as a power source, and displaces the protrusion 150 in the horizontal direction along a surface parallel to the sticking surface 93.
  • the pickup unit 100 may further include a first imaging unit 170.
  • the circular orbit CR2 further passes through the first imaging region A3 to be imaged by the first imaging unit 170.
  • the first imaging region A3 is aligned with the adsorption region A1 along the circular orbit CR2.
  • the first imaging unit 170 is arranged so as to image the first imaging region A3 from the outer peripheral side of the circular orbit CR2, and images the electronic component W or the suction unit 131 located in the first imaging region A3.
  • the first imaging unit 170 has a camera 171.
  • the camera 171 includes an image pickup element such as a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary Metal Oxide Semiconductor) image sensor, and a lens for forming an image on the image pickup element.
  • the camera 171 is arranged so that the first imaging region A3 is located between the camera 171 and the rotation axis Ax2.
  • the lens of the camera 171 is directed to the first imaging region A3.
  • the first imaging region A3 is located at the lowermost part of the circular orbit CR2.
  • the pickup unit 100 may further include a second imaging unit 180.
  • the second imaging unit 180 images the suction region A1 from the inner peripheral side of the circular orbit CR2. Imaging from the inner peripheral side means that the optical path from the adsorption region A1 to the imaging position of the image captured by the second imaging unit 180 passes through a viewpoint located on the inner circumference of the circular orbit CR2. The imaging position of the image captured by the second imaging unit 180 does not necessarily have to be located on the inner circumference of the circular orbit CR2.
  • the swivel portion 132 is provided between the hollow portion formed at the center of the circular orbit CR2 and the adjacent suction portions 131 in order to provide a viewpoint for imaging the suction region A1 on the inner circumference of the circular orbit CR2. It may have a window portion that guides light from the outside of the swivel portion 132 to the cavity portion.
  • the swivel portion 132 has a tubular portion 137, a swivel plate 138, and a plurality of window portions 139.
  • the tubular portion 137 surrounds the rotation shaft Ax2 to form a cavity portion 141, and holds a plurality of suction portions 131.
  • the tubular portion 137 has a cylindrical shape, and its central axis coincides with the rotation axis Ax2.
  • the end on the swivel drive unit 133 side is referred to as a “drive end”
  • the end on the opposite side of the swivel drive unit 133 is referred to as an “open end”.
  • the swivel plate 138 closes the drive end of the tubular portion 137 and is connected to the swivel drive unit 133.
  • the plurality of window portions 139 are formed in the tubular portion 137, and are arranged alternately with the plurality of suction portions 131. In other words, each window portion 139 is formed between adjacent suction portions 131.
  • the window portion 139 is, for example, a through hole, and light is introduced into the cavity portion 141 from the outside of the tubular portion 137.
  • the second imaging unit 180 images the adsorption region A1 from the cavity portion 141 through the window portion 139.
  • the second imaging unit 180 has a mirror 181 and a camera 182.
  • the mirror 181 is provided in the cavity 141.
  • the mirror 181 reflects the light introduced into the cavity 141 from the suction region A1 side by the window portion 139 toward the open end side of the tubular portion 137.
  • the mirror 181 may be any mirror as long as it has a reflecting surface that reflects the light on the open end side of the tubular portion 137.
  • the mirror 181 may be a plate-shaped mirror, or may be a prism configured and arranged so that one surface is the reflection surface.
  • the camera 182 takes an image of the suction region A1 through the mirror 181.
  • the camera 182 has an image pickup element such as a CCD image sensor or a CMOS image sensor, and a lens for forming an image on the image pickup element.
  • the camera 182 is arranged outside the cavity 141 so that the lens faces the open end of the tubular portion 137. Therefore, the light reflected by the mirror 181 toward the open end side is incident on the lens of the camera 182.
  • the camera 182 can be arranged in any way as long as it can capture an image from a viewpoint located on the inner circumference of the circular orbit CR2.
  • the camera 182 may be arranged inside the cavity 141 or outside the circular orbit CR2.
  • the controller 200 is configured to intermittently rotate the swivel unit 132 by the swivel drive unit 133 so that the plurality of suction units 131 are sequentially arranged in the suction region A1. Further, the controller 200 is a seat position adjusting unit so as to align the position of the electronic component W with the position of the suction unit 131 each time the suction unit 131 of any one of the plurality of suction units 131 is arranged in the suction region A1. It is configured to control 120 and control the protrusion position adjusting unit 160 so as to align the position of the protrusion 150 with the position of the suction unit 131.
  • the controller 200 has a swivel control unit 211, a first imaging control unit 212, a reference position calculation unit 213, and a second as a functional configuration (hereinafter, referred to as “functional block”).
  • functional block a functional configuration
  • a suction control unit 222, a delivery control unit 223, and a transfer control unit 224 will be described. The process executed by each functional block corresponds to the process executed by the controller 200.
  • the swivel control unit 211 intermittently swivels the swivel unit 132 by the swivel drive unit 133 so that the plurality of suction units 131 are sequentially arranged in the suction region A1.
  • intermittent rotation means repeating rotation and stop.
  • the swivel control unit 211 intermittently rotates the swivel unit 132 by the swivel drive unit 133 at the same pitch as the angle pitch between the adjacent suction units 131, starting from the state where one of the suction units 131 is arranged in the suction region A1.
  • the swivel control unit 211 swivels the swivel unit 132 in a direction in which each suction unit 131 sequentially passes through the suction region A1, the first imaging region A3, and the transfer region A2 (clockwise direction in FIG. 2).
  • the first imaging control unit 212 first captures an image of the suction unit 131 of the first imaging region A3 in a state where any of the plurality of suction units 131 is located in the first imaging region A3 without holding the electronic component W.
  • the image pickup unit 170 is made to acquire the image.
  • the reference position calculation unit 213 determines the error of the actual position of the suction unit 131 with reference to the design position of the suction unit 131 in the first imaging region A3 (hereinafter, referred to as “ideal position of the suction unit 131”). calculate. After that, the reference position calculation unit 213 adds the above error to the design position of the suction unit 131 in the suction region A1 to calculate the position of the suction unit 131 in the suction region A1. For example, the reference position calculation unit 213 calculates the position of the suction unit 131 in two directions along the sticking surface 93 (along the plane parallel to the sticking surface 93).
  • the reference position calculation unit 213 calculates the position of the suction unit 131 in the vertical direction and the horizontal direction on the surface parallel to the sticking surface 93.
  • the position of the suction unit 131 may be any part of the suction unit 131.
  • the position of the suction unit 131 is the center position of the suction nozzle 134.
  • the second imaging control unit 214 causes the second imaging unit 180 to acquire an image of the electronic component W in a state where the electronic component W to be picked up is located between the suction region A1 and the wafer sheet 91.
  • the second image pickup control unit 214 causes the second image pickup unit 180 to acquire an image of the suction region A1 through the window unit 139 at the timing when the window unit 139 is located between the cavity portion 141 and the suction region A1.
  • the image of the electronic component W to be picked up is acquired by the second imaging unit 180 via the suction region A1.
  • the component position calculation unit 215 calculates the position of the electronic component W based on the image of the electronic component W acquired by the second imaging control unit 214 by the second imaging control unit 180. For example, the component position calculation unit 215 calculates the position of the electronic component W in two directions along the sticking surface 93. As an example, the component position calculation unit 215 calculates the positions of the electronic components W in the vertical direction and the horizontal direction on the sticking surface 93.
  • the position of the electronic component W may be any part of the electronic component W. For example, the position of the electronic component W is the central position of the electronic component W.
  • the third image pickup control unit 216 acquires an image of the protrusion 150 through the suction region A1 from the second image pickup unit 180 in a state where the wafer sheet 91 is not located between the second image pickup unit 180 and the protrusion 150. Let me.
  • the protrusion position calculation unit 217 calculates the position of the protrusion 150 based on the image of the protrusion 150 acquired by the third imaging control unit 216 by the second imaging unit 180. For example, the protrusion position calculation unit 217 calculates the position of the protrusion 150 in two directions along the sticking surface 93 (along the plane parallel to the sticking surface 93). As an example, the protrusion position calculation unit 217 calculates the positions of the protrusion 150 in the vertical direction and the horizontal direction on a surface parallel to the sticking surface 93.
  • the position of the protruding portion 150 may be the position of any portion of the protruding portion 150. For example, the position of the protrusion 150 is the center position of the protrusion pin 151.
  • the position information storage unit 218 stores the position calculated by the reference position calculation unit 213 for each suction unit 131, and stores the position calculated by the protrusion position calculation unit 217.
  • the fourth imaging control unit 219 first captures an image of the electronic component W in the first imaging region A3 in a state where any of the plurality of suction units 131 holds the electronic component W and is located in the first imaging region A3. Have unit 170 acquire it.
  • the image captured by the fourth imaging control unit 219 is used for visual inspection of the main surface Wa of the electronic component W and the like.
  • the alignment control unit 221 adjusts the seat position adjusting unit 120 so that the position of the electronic component W to be picked up is aligned with the position of the suction unit 131 each time any one of the suction units 131 is arranged in the suction region A1.
  • the protrusion position adjusting unit 160 is controlled so as to align the position of the protrusion portion 150 with the position of the suction portion 131.
  • the alignment control unit 221 picks up the target at the center position of the suction nozzle 134 in the direction along the sticking surface 93 based on the position calculated by the reference position calculation unit 213 and the position calculated by the component position calculation unit 215.
  • the seat position adjusting unit 120 is controlled so as to align the center position of the electronic component W of the above.
  • the alignment control unit 221 projects to the center position of the suction nozzle 134 in the direction along the sticking surface 93 based on the position calculated by the reference position calculation unit 213 and the position calculated by the protrusion position calculation unit 217.
  • the protrusion position adjusting unit 160 is controlled so as to align the center position of the pin 151.
  • the suction control unit 222 uses the protrusion pin 151 to suck the electronic component W in the suction region A1 in a state where the position of the electronic component W to be picked up and the position of the protrusion 150 are aligned with the position of the suction portion 131 of the suction region A1.
  • the protrusion 150 is controlled so as to push out to, and the rotary pickup 130 is controlled so that the electronic component W is sucked by the suction portion 131 of the suction region A1.
  • the suction control unit 222 controls the protrusion 150 so that the protrusion pin 151 is retracted in a state where the electronic component W to be picked up is sucked by the suction unit 131.
  • the wafer sheet 91 returns to its original position, leaving the electronic component W in the suction region A1.
  • the transfer control unit 223 controls the rotary pickup 130 so as to release the electronic component W in the transfer area A2 while one of the plurality of suction units 131 holds the electronic component W and is located in the transfer area A2.
  • the transfer device 10 is controlled so as to acquire the electronic component W in the delivery area A2.
  • the delivery control unit 223 lowers the holding unit 12 until it comes into contact with the electronic component W in the delivery region A2 by the elevating drive unit 18 at the transfer stop position SP1, and the holding unit 12 attracts the electronic component W.
  • the holding portion 12 is raised to the height before lowering by the raising / lowering drive portion 18.
  • the delivery control unit 223 releases the suction of the electronic component W by the suction unit 131 of the delivery region A2 by the time the holding unit 12 that has attracted the electronic component W in the delivery region A2 starts to rise.
  • the transport control unit 224 controls the transport device 10 so as to transport the electronic component W acquired in the transfer region A2 along the circular orbit CR1. For example, the transport control unit 224 rotates the turntable 11 by the swivel drive unit 13 after the holding unit 12 that has attracted the electronic component W in the delivery region A2 completes the ascent.
  • FIG. 6 is a block diagram illustrating the hardware configuration of the controller 200.
  • the controller 200 has a circuit 290.
  • Circuit 290 includes one or more processors 291 and memory 292, storage 293, and input / output ports 294.
  • the storage 293 has a computer-readable storage medium, such as a hard disk or a non-volatile semiconductor memory.
  • the storage 293 intermittently swivels the swivel portion 132 by the swivel drive unit 133 so that the plurality of suction portions 131 are sequentially arranged in the suction region A1, and the suction portion 131 of any one of the plurality of suction portions 131.
  • the sheet position adjusting unit 120 is controlled so as to align the position of the electronic component W with the position of the suction unit 131, and the position of the protrusion 150 is aligned with the position of the suction unit 131.
  • a program for controlling the protrusion position adjusting unit 160 and causing the controller 200 to execute the protrusion position adjusting unit 160 is stored.
  • the storage 293 stores a program for causing the controller 200 to configure each of the above-mentioned functional blocks.
  • the memory 292 temporarily stores the program loaded from the storage 293 and the calculation result by the processor 291.
  • the processor 291 causes the controller 200 to configure each functional block by executing the above program in cooperation with the memory 292.
  • the input / output port 294 has a swivel drive unit 133, a seat position adjustment unit 120, a protrusion position adjustment unit 160, a protrusion 150, a suction unit 131, a holding unit 12, an elevating drive unit 18, and a swivel drive unit in accordance with a command from the processor 291. Input / output of electric signals to and from 13 mag.
  • the circuit 290 is not necessarily limited to the one in which each function is configured by a program.
  • the circuit 290 may have at least a part of its functions configured by a dedicated logic circuit or an ASIC (Application Specific Integrated Circuit) that integrates the logic circuit.
  • ASIC Application Specific Integrated Circuit
  • control procedure executed by the controller 200 will be described separately as a calibration procedure, a pickup procedure, a delivery procedure, and an imaging procedure of the electronic component.
  • the calibration procedure is a control procedure for acquiring and storing the position information of each suction unit 131 in the suction region A1 and the position information of the protrusion 150 prior to the pickup of the electronic component W by the pickup unit 100.
  • the controller 200 first executes steps S01, S02, S03, S04, and S05.
  • step S01 the turning control unit 211 causes the turning drive unit 133 to start turning the turning unit 132.
  • step S02 the first imaging control unit 212 waits for the suction unit 131 that does not hold the electronic component W to be arranged in the first imaging region A3.
  • the first imaging control unit 212 causes the first imaging unit 170 to acquire the image of the suction unit 131 of the first imaging region A3.
  • the reference position calculation unit determines the position when the suction unit 131 is arranged in the suction region A1 based on the image of the suction unit 131 acquired by the first imaging control unit 212 in the first imaging unit 170. 213 calculates and records it in the position information storage unit 218.
  • step S05 it is confirmed whether the first imaging control unit 212 has calculated and recorded the positions of all the suction units 131 when they are arranged in the suction region A1.
  • step S05 If it is determined in step S05 that the suction unit 131 whose position calculation has not been completed remains, the controller 200 returns the process to step S02, and performs the next imaging of the suction unit 131 and the calculation / recording of the position. Do.
  • step S05 When it is determined in step S05 that the calculation / recording of the positions of all the suction units 131 is completed, the controller 200 executes steps S06, S07, S08, and S09.
  • step S06 the third imaging control unit 216 waits for the protruding unit 150 to be imaged by the second imaging unit 180.
  • the third imaging control unit 216 waits for the window portion 139 to be arranged between the cavity portion 141 and the suction region A1.
  • step S07 the third imaging control unit 216 causes the second imaging unit 180 to acquire the image of the protruding unit 150.
  • step S08 the protrusion position calculation unit 217 calculates the position of the protrusion 150 based on the image of the protrusion 150 acquired by the second image pickup unit 180 by the third imaging control unit 216, and the position information storage unit 218 calculates the position of the protrusion 150. Record.
  • step S09 the swivel control unit 211 causes the swivel drive unit 133 to stop the swivel of the swivel unit 132. This completes the calibration procedure.
  • the pickup procedure is a control procedure in which the pickup unit 100 sequentially executes the pickup of the electronic component W from the wafer sheet 91.
  • the controller 200 first executes steps S11, S12, S13, S14, and S15.
  • step S11 the turning control unit 211 causes the turning drive unit 133 to start turning the turning unit 132.
  • step S12 the alignment control unit 221 moves the sheet holding unit 110 by the sheet position adjusting unit 120 so that the electronic component W to be picked up is arranged between the suction region A1 and the wafer sheet 91.
  • the second image pickup control unit 214 waits for the second image pickup unit 180 of the electronic component W to be picked up to take an image.
  • the second imaging control unit 214 waits for the window portion 139 to be arranged between the cavity portion 141 and the suction region A1.
  • the second image pickup control unit 214 causes the second image pickup unit 180 to acquire an image of the electronic component W to be picked up.
  • the component position calculation unit 215 calculates the position of the electronic component W based on the image of the electronic component W acquired by the second imaging control unit 214 by the second imaging unit 180.
  • step S16 the alignment control unit 221 of the electronic component W to be picked up at the position when the next suction unit 131 is arranged in the suction region A1 (hereinafter, referred to as “the position of the next suction unit 131”).
  • the position of the next suction unit 131 Controlling the seat position adjusting unit 120 so as to align the positions and controlling the protrusion position adjusting unit 160 so as to align the position of the protrusion 150 with the position of the next suction unit 131 is started.
  • the alignment control unit 221 reads out the position of the next suction unit 131 and the position of the protrusion unit 150 from the position information storage unit 218.
  • the alignment control unit 221 moves to the position of the next suction unit 131 based on the position of the next suction unit 131 read from the position information storage unit 218 and the position of the electronic component W calculated by the component position calculation unit 215.
  • the seat position adjusting unit 120 is controlled so as to align the positions of the electronic components W.
  • the alignment control unit 221 is based on the position of the next suction unit 131 read from the position information storage unit 218 and the position of the protrusion 150 read from the position information storage unit 218, and is based on the position of the next suction unit 131.
  • the protrusion position adjusting unit 160 is controlled so as to align the position of the protrusion 150 with the position.
  • step S17 the adsorption control unit 222 waits for the next adsorption unit 131 to be arranged in the adsorption region A1.
  • step S18 the suction control unit 222 waits for the position of the electronic component W to be picked up and the position of the protrusion 150 to be aligned with the position of the next suction unit 131.
  • step S21 the suction control unit 222 controls the protrusion 150 so that the electronic component W is pushed out to the suction region A1 by the protrusion pin 151.
  • step S22 the suction control unit 222 sucks the electronic component W extruded to the suction region A1 by the suction unit 131 of the suction region A1.
  • step S23 the suction control unit 222 retracts the protrusion pin 151.
  • the wafer sheet 91 returns to its original position, leaving the electronic component W in the suction region A1.
  • the controller 200 returns the process to step S12.
  • steps S12 to S23 the plurality of electronic components W of the wafer sheet 91 are sequentially picked up by the pickup unit 100.
  • the delivery procedure is a control procedure for causing the transfer device 10 and the pickup unit 100 to deliver the electronic component W in the delivery area A2.
  • the controller 200 executes steps S31, S32, S33, S34, and S35.
  • step S31 the delivery control unit 223 waits for the suction unit 131 that has attracted the electronic component W to be arranged in the delivery region A2.
  • step S32 the transfer control unit 223 is lowered by the elevating drive unit 18 until it comes into contact with the electronic component W in the transfer area A2 at the transfer stop position SP1.
  • step S33 the transfer control unit 223 attracts the electronic component W in the transfer area A2 to the holding unit 12, and releases the adsorption of the electronic component W by the suction unit 131 in the transfer area A2.
  • step S34 the delivery control unit 223 raises the holding unit 12 that has attracted the electronic component W in the delivery region A2 to the height before lowering by the elevating drive unit 18.
  • step S35 the transport control unit 224 turns the turntable 11 by one pitch by the turning drive unit 13. As a result, the electronic component W attracted by the holding unit 12 is conveyed in the delivery region A2, and the next holding unit 12 is arranged at the stop position SP1 for delivery. After that, the controller 200 returns the process to step S31. After that, the delivery of the electronic component W in the delivery area A2 is repeated.
  • the imaging procedure of the electronic component is a control procedure in which the image of the electronic component W in the first imaging region A3 is sequentially imaged by the first imaging unit 170.
  • the controller 200 executes steps S41 and S42.
  • step S41 the fourth imaging control unit 219 waits for the adsorption unit 131 that has attracted the electronic component W to be arranged in the first imaging region A3.
  • step S42 the fourth imaging control unit 219 causes the first imaging unit 170 to acquire an image of the electronic component W in the first imaging region A3.
  • the controller 200 returns the process to step S41.
  • the imaging of the electronic component W in the first imaging region A3 is repeated.
  • the image of the electronic component W is used for visual inspection of the main surface Wa of the electronic component W and the like.
  • the processing apparatus 1 has a suction region that sandwiches the electronic component W between the sheet holding portion 110 that holds the wafer sheet 91 having the attachment surface 93 to which the electronic component W is attached and the wafer sheet 91.
  • the sheet is arranged along the sticking surface 93 with the protruding portion 150 which is arranged so as to sandwich the wafer sheet 91 between the swirling drive unit 133 which swivels 132 and the electronic component W and projects the wafer sheet 91 toward the suction region A1. It includes a sheet position adjusting unit 120 that changes the position of the holding portion 110, and a protruding position adjusting unit 160 that changes the position of the protruding portion 150 in the direction along the sticking surface 93.
  • the positions of the electronic component W and the protruding portion 150 are changed according to the individual difference in the positions of the suction portions 131, and the positions of the suction portion 131, the electronic component W and the protruding portion 150 are changed. Can be aligned. As a result, it is possible to suppress pickup defects caused by misalignment between the suction portion 131, the electronic component W, and the protrusion portion 150.
  • the processing device 1 that changes the positions of the electronic component W and the protruding portion 150 is effective in simplifying the configuration for aligning the positions of the three parties.
  • the processing device 1 may further include a first imaging unit 170 arranged so as to image the first imaging region A3 along the circular orbit CR2 along with the adsorption region A1 from the outer peripheral side of the circular orbit CR2.
  • the first imaging unit 170 can be shared for grasping the appearance of the electronic component W held by the suction unit 131 and grasping the position of the suction unit 131. Therefore, it is more effective in simplifying the device configuration.
  • the processing device 1 may further include a second imaging unit 180 that images the suction region A1 from the inner peripheral side of the circular orbit CR2.
  • the alignment can be performed based on the position of the electronic component W viewed (imaged) from the suction portion 131 side, which is a reference for aligning the positions of the three parties. Therefore, it is effective for more accurate alignment.
  • the processing device 1 includes a swivel control unit 211 that intermittently swivels the swivel unit 132 by the swivel drive unit 133 so that the plurality of suction units 131 are sequentially arranged in the suction region A1, and any one of the plurality of suction units 131.
  • a swivel control unit 211 that intermittently swivels the swivel unit 132 by the swivel drive unit 133 so that the plurality of suction units 131 are sequentially arranged in the suction region A1, and any one of the plurality of suction units 131.
  • the sheet position adjusting portion 120 is controlled so as to align the position of the electronic component W with the position of the suction portion 131, and the protrusion portion 150 is positioned at the position of the suction portion 131.
  • a positioning control unit 221 that controls the protrusion position adjusting unit 160 so as to align the positions of the above may be further provided. In this case, the positions
  • the processing device 1 is a transport device that acquires an electronic component W from any one of the plurality of suction portions 131 in the transfer region A2 alongside the suction region A1 along the circular orbit CR2, and conveys the electronic component W. 10 is further provided, and the plurality of suction portions 131 are arranged so that when any one of the suction portions 131 is located in the suction region A1, the other suction portion 131 is located in the delivery region A2. Good.
  • at least the suction of the electronic component W in the suction region A1 and the delivery of the electronic component W in the delivery region A2 are performed by utilizing a configuration in which the positions of the three parties can be aligned without displace the suction portion 131.
  • the processing time can be shortened by partially proceeding at the same time.
  • an apparatus effective for simplifying the configuration for aligning the position of the electronic component, the position of the suction portion for picking up the electronic component, and the position of the protrusion portion for protruding the electronic component toward the suction portion. Will be done.

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)

Abstract

L'invention concerne un dispositif de traitement de composant électronique comprenant : une unité de maintien de feuille pour maintenir une feuille ayant une surface de fixation sur laquelle un composant électronique est fixé ; une pluralité de parties de fixation par aspiration disposées le long d'une trajectoire circulaire passant à travers une région de fixation par aspiration ; une unité de rotation maintenant la pluralité de parties de fixation par aspiration ; une unité d'entraînement de rotation pour faire tourner l'unité de rotation ; une unité de projection pour projeter la feuille vers la région de fixation par aspiration ; une unité de réglage de position de feuille pour modifier la position de l'unité de maintien de feuille dans une direction le long de la surface de fixation ; et une unité de réglage de position de projection pour modifier la position de l'unité de projection dans la direction le long de la surface de fixation.
PCT/JP2020/037743 2019-10-11 2020-10-05 Dispositif de traitement de composant électronique Ceased WO2021070782A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202080070534.5A CN114556538B (zh) 2019-10-11 2020-10-05 电子部件的处理装置
MYPI2022001837A MY195241A (en) 2019-10-11 2020-10-05 Electronic Component Processing Device

Applications Claiming Priority (2)

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JP2019187451A JP6872261B2 (ja) 2019-10-11 2019-10-11 電子部品の処理装置
JP2019-187451 2019-10-11

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WO2021070782A1 true WO2021070782A1 (fr) 2021-04-15

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CN (1) CN114556538B (fr)
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WO (1) WO2021070782A1 (fr)

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JP7170980B1 (ja) 2022-07-27 2022-11-15 上野精機株式会社 電子部品処理装置
JP7197853B1 (ja) 2022-07-27 2022-12-28 上野精機株式会社 電子部品処理装置

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WO2011125115A1 (fr) * 2010-04-05 2011-10-13 上野精機株式会社 Dispositif d'inspection et dispositif de classification
JP2012119494A (ja) * 2010-11-30 2012-06-21 Ueno Seiki Kk ロータリー式ピックアップ機構及びそれを備えた半導体処理装置
WO2015083221A1 (fr) * 2013-12-02 2015-06-11 富士機械製造株式会社 Système de réglage de dispositif de fourniture de puce et gabarit de réglage
JP2015121456A (ja) * 2013-12-24 2015-07-02 上野精機株式会社 点灯試験装置
WO2017098980A1 (fr) * 2015-12-11 2017-06-15 上野精機株式会社 Dispositif de transfert

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JP4855347B2 (ja) * 2007-06-28 2012-01-18 ヤマハ発動機株式会社 部品移載装置
JP5059518B2 (ja) * 2007-08-10 2012-10-24 Ｊｕｋｉ株式会社 電子部品実装方法及び装置
JP2017130499A (ja) * 2016-01-19 2017-07-27 東レエンジニアリング株式会社 チップ部品ピックアップ装置およびこれを用いたニードルとコレットの位置合わせ方法

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Publication number Priority date Publication date Assignee Title
WO2011125115A1 (fr) * 2010-04-05 2011-10-13 上野精機株式会社 Dispositif d'inspection et dispositif de classification
JP2012119494A (ja) * 2010-11-30 2012-06-21 Ueno Seiki Kk ロータリー式ピックアップ機構及びそれを備えた半導体処理装置
WO2015083221A1 (fr) * 2013-12-02 2015-06-11 富士機械製造株式会社 Système de réglage de dispositif de fourniture de puce et gabarit de réglage
JP2015121456A (ja) * 2013-12-24 2015-07-02 上野精機株式会社 点灯試験装置
WO2017098980A1 (fr) * 2015-12-11 2017-06-15 上野精機株式会社 Dispositif de transfert

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MY195241A (en) 2023-01-11
CN114556538A (zh) 2022-05-27
JP6872261B2 (ja) 2021-05-19
JP2021064658A (ja) 2021-04-22
CN114556538B (zh) 2025-06-13

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