WO2020110319A1 - Substrate working machine - Google Patents

Abstract

This substrate working machine is provided with a base, a work module drawably provided on the base, and an external negative pressure supplying device. The external negative pressure supplying device is provided outside the base and supplies a negative pressure to a supply destination object inside the work module without passing through the inside of the base.

Description

Board-to-board working machine

The present specification discloses a technique related to a work machine for a board.

The substrate fixing mechanism described in Patent Document 1 includes a vacuum pump and a backup pin. The backup pin is arranged below the substrate arranged at the mounting position and sucks and holds the lower surface of the substrate by the suction force of the vacuum pump. Further, the board-to-board working system described in Patent Document 2 includes a system base and a board-to-board working device. The board working device is arranged on the system base in a state of being aligned along the board transport direction, and performs a predetermined work for the circuit board on the circuit board. Further, the negative pressure supply passage described in Patent Document 2 is connected via a joint that can be connected or disconnected with one touch on the back side of the work system for a board.

JP-A-8-18293 Japanese Patent Laid-Open No. 2004-104075

However, Patent Document 1 does not disclose a board-to-board working machine including a base and a work module that is provided on the base so as to be drawn out. Further, Patent Document 2 does not disclose a specific configuration of the negative pressure supply passage. In a work machine for a board including a base and a work module which is provided on the base so as to be drawn out, when a negative pressure is supplied to the work module from the inside of the base, the work module can be drawn out from the base. The length of the pipe for supplying the negative pressure tends to be long. In addition, it is difficult to increase the flow passage cross-sectional area of the pipe due to the contents stored in the base. As a result, the resistance in the piping may increase, and the amount of negative pressure supplied to the object to be supplied inside the work module may decrease.

In view of such circumstances, the present specification can suppress the decrease in the supply amount of the negative pressure supplied to the supply target inside the work module that can be drawn out on the base during the production of the substrate product. Disclosed is a board-to-board working machine.

The present specification discloses a board-to-board working machine that includes a base, a work module that is provided on the base so as to be pulled out, and an external negative pressure supply device. The external negative pressure supply device is provided outside the base, and supplies a negative pressure to an object to be supplied inside the work module without going through the inside of the base.

According to the above-mentioned work machine for a board, an external negative pressure supply device provided outside the base is provided. Further, the external negative pressure supply device supplies a negative pressure to the supply target inside the work module without passing through the inside of the base. Due to these, in the above-described work machine for a board, it is easier to shorten the pipe length of the pipe for supplying the negative pressure, as compared with the case where the negative pressure is supplied to the work module from the inside of the base. It is easy to increase the cross-sectional area. As a result, the above-described work machine for substrates can suppress a decrease in the supply amount of the negative pressure supplied to the supply target inside the work module during the production of the board product.

It is a block diagram which shows the structural example of the to-substrate work line WML. It is a perspective view which shows the structural example of the component mounting machine WM3. It is a schematic diagram which shows an example of the negative pressure supply method of 1st embodiment. It is a schematic diagram which shows the example of arrangement of the external piping 41 and the piping 51 in a base. It is a schematic diagram which shows an example of the negative pressure supply method of 2nd embodiment. FIG. 6 is a side view showing an example of a state of the external pipe 41 when the work module 20 is pulled out from the base 10 at the maximum work amount WA0 during maintenance of the work module 20. It is a schematic diagram which shows the example of arrangement of the external piping 41.

1. First embodiment 1-1. Example of Configuration of Work Line for Substrate WML In the work line for Substrate WML, a predetermined work for the substrate is performed on the substrate 90. There is no limitation on the type and number of the work machine WM for forming the work line for substrate WML. As shown in FIG. 1, a work line WML for a board of the present embodiment is a plurality (five) work for a board of a printing machine WM1, a printing inspection machine WM2, a component mounting machine WM3, a reflow furnace WM4, and an appearance inspection machine WM5. Equipped with machine WM. A plurality of (five) work machines WM for a substrate are arranged in this order from the upstream side, a printing machine WM1, a printing inspection machine WM2, a component mounting machine WM3, a reflow furnace WM4, and an appearance inspection machine WM5. The board 90 is carried into the printing machine WM1 located at the head of the board-to-board work line WML. Then, the substrate 90 is transported to the downstream side by a substrate transport device (not shown) on the work line for working with the substrate WML, and is unloaded from the visual inspection machine WM5 located at the end of the work line for working with the substrate WML.

The printing machine WM1 prints solder on the mounting positions of the plurality of components on the board 90. The solder printed on the substrate 90 is in a paste form and has a predetermined viscosity. The solder functions as a joining material that joins the board 90 and a plurality of components mounted on the board 90. The printing inspection machine WM2 inspects the printing state of the solder printed by the printing machine WM1. The component mounting machine WM3 mounts a plurality of components on the solder printed by the printing machine WM1. The number of component mounting machines WM3 may be one or more. When a plurality of component mounting machines WM3 are provided, the plurality of component mounting machines WM3 can share and mount a plurality of components.

The reflow furnace WM4 heats the board 90 on which a plurality of components are mounted by the component mounting machine WM3, melts the solder, and performs soldering. The appearance inspection machine WM5 inspects the mounting state of the plurality of components mounted by the component mounting machine WM3. Specifically, the appearance inspection machine WM5 recognizes the suitability of each of the plurality of components mounted on the board 90, the mounting state (X-axis coordinate, Y-axis coordinate, and mounting angle) of each of the plurality of components, It is sent to the management device WMC. In this way, the to-board work line WML uses a plurality of (five) to-to-board work machines WM to sequentially transfer the substrates 90 and execute the production process including the inspection process to produce the board product 900. You can

Note that the work-to-board work line WML can be provided with, for example, a function inspection machine that is the work-to-board machine WM. The function inspection machine performs a function inspection of the soldered substrate 90 by the reflow furnace WM4. Further, the work-to-board work line WML can appropriately add the configuration of the work-to-board work line WML, and can appropriately change the configuration, for example, according to the type of the board product 900 to be produced. The work line for substrate WML can also be provided with a work device for substrate WM such as a buffer device, a substrate supply device, a substrate reversing device, a shield mounting device, an adhesive coating device, and an ultraviolet irradiation device.

A plurality of (five) anti-board working machines WM and a management device WMC forming the anti-board working line WML are electrically connected by a communication unit LC. The communication unit LC may be wired or wireless. Also, various communication methods can be used. In the present embodiment, a plurality of (five) anti-board working machines WM and a management device WMC constitute a local information communication network (LAN: Local Area Network). Accordingly, the plurality (five) of the board-working machines WM can communicate with each other via the communication unit LC. Further, a plurality (five) of the board-working machines WM can communicate with the management device WMC via the communication unit LC.

The management device WMC controls a plurality of (five) to-board work machines WM that form the to-board work line WML, and monitors the operating status of the to-board work line WML. The management device WMC stores various control data for controlling a plurality of (five) work machines WM for a board. The management device WMC transmits the control data to each of the plurality (five) of the board working machines WM. Further, each of the plurality (five) of the board working machines WM transmits the operation status and the production status to the management device WMC.

The management device WMC can be provided with various data servers such as an image storage server and a production information server (all not shown). The image storage server can store various image data captured by the work machine WM. The production information server can store various production information regarding the production of the board 90. For example, the component data included in the production information includes information about the shape of each type of component, information about electrical characteristics, information about how to handle the component, and the like. In addition, the inspection result by the inspection machine such as the print inspection machine WM2 and the appearance inspection machine WM5 is included in the production information.

1-2. Configuration Example of Component Mounting Machine WM3 The component mounting machine WM3 mounts a plurality of components on the board 90. As shown in FIG. 2, the component mounting machine WM3 includes a base 10 and at least one (two in the figure) work module 20 provided on the base 10 so as to be drawn out. A guide rail (not shown) is provided on the upper surface of the base 10 along the pull-out direction of the work module 20 (arrow Y direction), and the lower portion of the work module 20 is rolled along the guide rail of the base 10. Movable wheels (not shown) are provided. With these, when the worker pulls out the work module 20, the work module 20 is pulled out in the pull-out direction (arrow Y direction) with respect to the base 10.

Each of the plurality (two) of work modules 20 includes a board transfer device 21, a component supply device 22, a component transfer device 23, a component camera 24, and a control device 25, which are mounted on a base 26. There is. The substrate transfer device 21 is configured by, for example, a belt conveyor, and transfers the substrate 90 in the transfer direction (arrow X direction). The board 90 is a circuit board on which at least one of an electronic circuit and an electric circuit is formed. The board transfer device 21 carries the board 90 into the component mounting machine WM3 and positions the board 90 at a predetermined position in the machine. The board transfer device 21 carries the board 90 out of the component mounter WM3 after the component mounter WM3 finishes mounting the plurality of components.

The component supply device 22 supplies a plurality of components mounted on the board 90. The component supply device 22 includes a plurality of feeders 22a provided along the conveyance direction of the substrate 90 (direction of arrow X). Each of the plurality of feeders 22a feeds a carrier tape (not shown) accommodating a plurality of components at a pitch so that the components can be collected at a supply position 22b located on the tip end side of the feeder 22a. In addition, the component supply device 22 can also supply a relatively large electronic component (for example, a lead component) compared to a chip component or the like in a state of being arranged on the tray.

The component transfer device 23 includes a head drive device 23a. The head drive device 23a includes a linear movement mechanism, and can move the movable table in the conveyance direction of the substrate 90 (direction of arrow X) and the drawing direction of the work module 20 (direction of arrow Y). A mounting head 23b is detachably (replaceable) provided on the movable table by a clamp member (not shown). The mounting head 23b uses at least one holding member to collect and hold the component supplied by the component supply device 22, and mounts the component on the substrate 90 positioned by the substrate transport device 21. As the holding member, for example, a suction nozzle or a chuck can be used.

As the component camera 24, for example, a digital image pickup device having an image pickup element can be used. As the image sensor, for example, an image sensor such as a charge coupled device (CCD: Charge Coupled Device) or a complementary metal oxide semiconductor (CMOS: Complementary Metal Oxide Semiconductor) can be used. The component camera 24 takes an image based on a control signal sent from the control device 25. The image data captured by the component camera 24 is transmitted to the control device 25.

The component camera 24 is fixed to the base 26 of the component mounting machine WM3 so that the optical axis is upward in the Z-axis direction (vertical upward direction). The component camera 24 can image the component held by the holding member from below. The work module 20 can also include a board camera. As the board camera, an imaging device similar to that of the component camera 24 can be used. However, the board camera is provided on the moving base of the component transfer device 23 so that the optical axis is downward in the Z-axis direction (downward in the vertical direction). The board camera can take an image of the board 90 from above.

The control device 25 includes a well-known central processing unit and a storage device, and a control circuit is configured (all are not shown). A central processing unit (CPU: Central Processing Unit) can perform various arithmetic processing. The storage device includes a first storage device and a second storage device. The first storage device is a volatile storage device (RAM: Random Access Memory), and the second storage device is a non-volatile storage device (ROM: Read Only Memory). Information and image data output from various sensors provided in the component mounting machine WM3 are input to the control device 25. The control device 25 sends a control signal to each device based on a control program and a predetermined mounting condition set in advance.

For example, the control device 25 causes the holding member to collect and hold the component supplied by the component supply device 22, and causes the component camera 24 to image the component held by the holding member. The control device 25 performs image processing on the image captured by the component camera 24 to recognize the holding posture of the component. The control device 25 can recognize the holding posture of the component by grasping, for example, a characteristic portion of the appearance of the component by image processing.

The control device 25 moves the holding member toward the upper side of the expected mounting position preset by the control program or the like. Further, the control device 25 corrects the planned mounting position based on the positioning state of the board 90, the holding posture of the component, and the like, and sets the mounting position where the component is actually mounted. The planned mounting position and the mounting position include a rotation angle in addition to the position (X-axis coordinate and Y-axis coordinate). The controller 25 corrects the target position (X-axis coordinate and Y-axis coordinate) and the rotation angle of the holding member according to the mounting position. The controller 25 lowers the holding member at the corrected target position at the corrected rotation angle, and mounts the component on the board 90. The controller 25 executes the mounting process for mounting a plurality of components on the board 90 by repeating the above-mentioned pick and place cycle.

1-3. Negative Pressure Supply Method FIG. 3 is a schematic view of the work module 20 provided on the base 10 as viewed from the transfer direction (arrow X direction) of the substrate 90. As shown by the broken line curve, when a negative pressure is supplied to the work module 20 from the inside of the base 10, a pipe for supplying the negative pressure (the first described later The pipe length of the second internal pipe 42b and the base internal pipe 51) tends to be long. Further, it is difficult to increase the flow passage cross-sectional area of the pipe (corresponding to the pipe 51 in the base) due to the contents (for example, the driving power source of the work module 20) housed in the base 10. As a result, the resistance in the pipe may increase, and the supply amount of the negative pressure supplied to the supply target VS0 inside the work module 20 may decrease during the production of the board product 900.

Therefore, in the present embodiment, the component mounting machine WM3, which is the working machine WM for a board, includes the external negative pressure supply device 30. The external negative pressure supply device 30 is provided outside the base 10 and supplies a negative pressure to the supply target VS0 inside the work module 20 without going through the inside of the base 10. Specifically, the negative pressure (hereinafter referred to as “external negative pressure”) supplied from the external negative pressure supply device 30 shown in FIG. 3 is directly supplied to the supply target VS0 via the pipe 40. As the pipe 40, for example, a known air hose can be used. In this specification, for convenience of description, the pipe 40 provided outside the work module 20 is referred to as an external pipe 41, and the pipe 40 provided inside the work module 20 is referred to as an internal pipe 42.

As a result, the component mounting machine WM3 of the present embodiment allows the negative pressure to be supplied from the inside of the base 10 to the work module 20 by a pipe (a first internal pipe 42a and a third internal pipe 42a described later) for supplying the negative pressure. It is easy to shorten the pipe length of the pipe 42c), and it is easy to increase the flow passage cross-sectional area of the pipe (for example, the external pipe 41). As a result, the component mounter WM3 of the present embodiment can suppress a decrease in the supply amount of the negative pressure supplied to the supply target VS0 inside the work module 20 during the production of the board product 900.

Also, as described above, the work module 20 is provided on the base 10 so as to be drawn out. The work module 20 shown by the broken line in FIG. 3 schematically shows that it can be pulled out from the base 10. It is difficult to pull out the work module 20 when there is no margin in the pipe length of the external pipe 41. On the other hand, if the pipe length of the external pipe 41 is made to have a margin, the pipe length of the external pipe 41 becomes long and the resistance in the pipe increases. Further, when the work module 20 is pulled out from the base 10 (for example, at the time of maintenance), the supply amount of the negative pressure supplied to the supply target VS0 may be smaller than that at the time of producing the substrate product 900. There are many. Therefore, it is preferable that the component mounting machine WM3, which is the working machine WB, further includes the internal negative pressure supply device 50, the pipe attaching/detaching portion 61, and the negative pressure changing device 70.

The internal negative pressure supply device 50 is provided inside the base 10 and supplies a negative pressure to the supply target VS0 via the internal pipe 42. Specifically, the negative pressure (hereinafter, referred to as “internal negative pressure”) supplied from the internal negative pressure supply device 50 is supplied to the inside of the work module 20 via the in-base pipe 51 provided inside the base 10. Supplied. The internal negative pressure supplied to the inside of the work module 20 is supplied to the supply target VS0 via the internal pipe 42 (corresponding to the second internal pipe 42b and the third internal pipe 42c described later).

The pipe attaching/detaching portion 61 is provided on the back surface 60 of the work module 20, and the external pipe 41 and the internal pipe 42 are detachably connected. The back surface 60 is a portion on the base end side in the drawing direction (arrow Y direction) when the work module 20 is drawn out from the base 10. The pipe attaching/detaching portion 61 may take various forms as long as it can detachably connect the external pipe 41 and the internal pipe 42, and the pipe attaching/detaching portion 61 is preferably an air coupler. Further, it is preferable that the air coupler is a one-touch type joint that is easily attached and detached as compared with a screw-in type, for example. Further, the air coupler preferably includes a check valve. The check valve is preferably provided on the side connected to the external pipe 41 and at least the side connected to the external pipe 41 among the sides connected to the internal pipe 42. The air coupler including the check valve can easily regulate the outflow of air when the external pipe 41 and the internal pipe 42 are separated.

The negative pressure changing device 70 of the present embodiment, when the work module 20 is pulled out from the base 10 and the external pipe 41 and the internal pipe 42 are separated at the pipe attaching/detaching portion 61, the internal negative pressure is supplied from the external negative pressure supply. Switch to negative pressure supply. The negative pressure changing device 70 may take various forms as long as it can switch the supply state of the negative pressure, and the negative pressure changing device 70 preferably includes the valve device 71.

The valve device 71 switches the selective supply to the supply target VS0, which is one of the external negative pressure and the internal negative pressure. The valve device 71 shown in FIG. 3 is a pilot-type solenoid valve (solenoid valve) with three ports and two positions. The first port 71a of the valve device 71 is connected to one end side of the first internal pipe 42a, and the other end side of the first internal pipe 42a is connected to the pipe attaching/detaching portion 61. Thereby, when the first internal pipe 42a and the external pipe 41 are connected to each other in the pipe attaching/detaching portion 61, an external negative pressure can be supplied to the first internal pipe 42a. The second port 71b of the valve device 71 is connected to one end side of the second internal pipe 42b, and the other end side of the second internal pipe 42b is connected to the in-base pipe 51. Thereby, the internal negative pressure can be supplied to the second internal pipe 42b.

The third port 71c of the valve device 71 is connected to one end side of the third internal pipe 42c, and the other end side of the third internal pipe 42c is connected to the supply target VS0. In the valve device 71 shown in the figure, when the solenoid coil is not excited, the first port 71a and the third port 71c communicate with each other and the second port 71b is sealed. In this case, the first internal pipe 42a and the third internal pipe 42c are communicated with each other, so that the external negative pressure can be supplied to the supply target VS0, and the supply of the internal negative pressure is regulated. Further, in the valve device 71, when the solenoid coil is excited, the first port 71a is sealed and the second port 71b and the third port 71c are in communication. In this case, the second internal pipe 42b and the third internal pipe 42c are communicated with each other, the internal negative pressure can be supplied to the supply target VS0, and the supply of the external negative pressure is restricted. As described above, since the negative pressure changing device 70 of the present embodiment includes the valve device 71, one of the external negative pressure and the internal negative pressure is supplied depending on whether or not the solenoid coil is excited. It can be selectively supplied to VS0, and the switching control can be simplified.

The negative pressure changing device 70 is provided with, for example, a proximity sensor or the like on the upper surface of the base 10 facing the work module 20, and based on the detection result of the proximity sensor, whether or not the work module 20 is pulled out from the base 10. It is possible to recognize whether or not there is a connection between the external pipe 41 and the internal pipe 42. The negative pressure changing device 70 stops the excitation of the solenoid coil of the valve device 71 while recognizing that the external pipe 41 and the internal pipe 42 are connected. Conversely, the negative pressure changing device 70 excites the solenoid coil of the valve device 71 while recognizing that the external pipe 41 and the internal pipe 42 are separated.

Note that when the excitation state of the solenoid coil is switched after the work module 20 is pulled out from the base 10 (the external pipe 41 and the internal pipe 42 are separated), a negative pressure is supplied to the supply target VS0. There may be no period. Therefore, it is preferable that the negative pressure changing device 70 allow the work module 20 to be pulled out after the internal negative pressure is ready to be supplied. The negative pressure changing device 70 monitors whether or not a maintenance button (not shown) provided on the work module 20 is operated by an operator, for example. When the operator operates the maintenance button, the negative pressure changing device 70 recognizes that the work module 20 may be pulled out from the base 10 and the external pipe 41 and the internal pipe 42 may be separated at the pipe attaching/detaching portion 61. To do. At this time, the negative pressure changing device 70 drives the internal negative pressure supply device 50 to make it possible to supply the internal negative pressure, and permits the work module 20 to be pulled out.

Further, the negative pressure changing device 70 supplies the external negative pressure when the work module 20 is pulled out with respect to the base 10 and there is a possibility that the external pipe 41 and the internal pipe 42 are separated at the pipe attaching/detaching portion 61. Can also be switched to the supply of internal negative pressure. Also in this case, the negative pressure changing device 70 can recognize the possibility that the external pipe 41 and the internal pipe 42 are separated, for example, depending on whether or not the operator operates the maintenance button. In the embodiment shown in FIG. 3, when the negative pressure changing device 70 recognizes the possibility that the outer pipe 41 and the inner pipe 42 are separated from each other, the negative pressure changing device 70 drives the inner negative pressure supply device 50 to bring the inner negative pressure into a state where it can be supplied. After that, the solenoid coil of the valve device 71 is excited. Then, the negative pressure changing device 70 can permit withdrawal of the work module 20 after switching from the supply of the external negative pressure to the supply of the internal negative pressure.

Further, when the work module 20 is pulled out from the base 10 and the external pipe 41 and the internal pipe 42 are separated from each other in the pipe attaching/detaching portion 61, the negative pressure changing device 70 has both the external negative pressure and the internal negative pressure. It is also possible to switch from the supply of to the supply of the internal negative pressure. Further, the negative pressure changing device 70 is configured such that when the work module 20 is pulled out with respect to the base 10 and there is a possibility that the external pipe 41 and the internal pipe 42 are separated from each other at the pipe attaching/detaching portion 61, the external negative pressure and the internal pressure are changed. It is also possible to switch from both negative pressure supplies to internal negative pressure supplies. In these cases, the valve device 71 described above is unnecessary.

As described above, the negative pressure changing device 70 has a possibility that, when the work module 20 is pulled out from the base 10 and the external pipe 41 and the internal pipe 42 are separated from each other in the pipe attaching/detaching portion 61, they may be separated. At this time, at least the external negative pressure of the external negative pressure and the internal negative pressure is switched to the internal negative pressure supply. As a result, the component mounting machine WM3, which is the work machine WM for a board, can easily minimize the pipe length of the external pipe 41.

When a plurality of work modules 20 are provided on one base 10, each of the plurality of work modules 20 includes an internal pipe 42, a pipe attaching/detaching part 61, and a negative pressure changing device 70 including a valve device 71. Is suitable. Further, FIG. 4 is a schematic diagram viewed from the back surface 60 side of the work module 20, and shows an arrangement example of the external pipe 41 and the in-base pipe 51. As shown in the figure, the internal negative pressure supply device 50 is provided inside one base 10, and a branch pipe branched from a branch portion 51 a provided in the base internal pipe 51 is an internal pipe 42 ( It is suitable if each is connected to the second internal pipe 42b). Further, it is preferable that branch pipes branched from the external pipe 41 connected to one external negative pressure supply device 30 are connected to the pipe attaching/detaching portions 61 of the respective work modules 20. Further, in the case where the pipe attaching/detaching portion 61 does not have a check valve on the side connected to the external pipe 41, it is preferable that the branch pipe branched from the external pipe 41 has a check valve.

Moreover, the external negative pressure supply device 30 and the internal negative pressure supply device 50 may take various forms as long as they can supply negative pressure. As the external negative pressure supply device 30 and the internal negative pressure supply device 50, for example, known vacuum pumps can be used. Further, the internal negative pressure supplied when the work module 20 is pulled out with respect to the base 10 and the external pipe 41 and the internal pipe 42 are separated at the pipe attaching/detaching portion 61, compared to when the substrate product 900 is produced. In many cases, the supply amount (for example, flow rate) per unit time may be small. Therefore, it is preferable that the internal negative pressure supply device 50 has a smaller supply amount of negative pressure per unit time than the external negative pressure supply device 30. As a result, the component mounting machine WM3, which is the working machine WM for a board, secures a minimum negative pressure supply amount (for example, a flow rate) necessary for maintenance or the like, and the internal negative pressure supply device 50 has a large size. Can be suppressed. The same applies to the internal negative pressure supplied when there is a possibility that the external pipe 41 and the internal pipe 42 may be separated.

2. Second Embodiment The configuration example of the to-board work line WML and the configuration example of the component mounting machine WM3 described in the first embodiment can be similarly applied to this embodiment. The component mounting machine WM3 of the present embodiment differs from the first embodiment in the negative pressure supply method.

FIG. 5 is a schematic view of the work module 20 provided on the base 10 as viewed from the transfer direction (arrow X direction) of the substrate 90. As shown in the figure, also in the present embodiment, the component mounting machine WM3, which is the working machine WM for a board, includes the external negative pressure supply device 30. The external negative pressure supply device 30 is provided outside the base 10 and supplies a negative pressure to the supply target VS0 inside the work module 20 without going through the inside of the base 10. Specifically, the external negative pressure, which is the negative pressure supplied from the external negative pressure supply device 30, is directly supplied to the supply object VS0 via the pipe 40. For the pipe 40, for example, a known air hose can be used, and for the external negative pressure supply device 30, for example, a known vacuum pump can be used. As a result, the component mounting machine WM3 of the present embodiment can obtain the same effects as the effects already described in the first embodiment.

Also, as described above, the work module 20 is provided on the base 10 so as to be drawn out. Therefore, it is conceivable to expand and contract the pipe 40 in accordance with the pulling out of the work module 20. In this case, for the pipe 40, for example, a spiral hose formed in a spiral shape can be used. However, the spiral hose is unlikely to increase the flow passage cross-sectional area of the pipe 40. Therefore, as shown in FIG. 5, it is preferable that the component mounting machine WM3, which is the working machine WM for a board, further includes a support member 80 installed in the middle of the external pipe 41. The support member 80 allows the first external pipe 41a, which is a portion of the external pipe 41 on the work module 20 side, to rotate about a horizontal axis 81 that is orthogonal to the drawing direction (arrow Y direction) of the base 10. To support. As a result, the component mounting machine WM3 can continue to supply the external negative pressure to the supply object VS0 when the work module 20 is pulled out from the base 10. The horizontal axis 81 shown in FIG. 5 is an axis extending along a direction perpendicular to the paper surface.

The supporting member 80 may take various forms as long as it can rotatably support the first external pipe 41a around the horizontal shaft 81, and the supporting member 80 is preferably a rotary joint. The rotary joint is easier to rotatably support the first external pipe 41a than, for example, a pulley device. It should be noted that the swivel joint is included in the rotary joint, and the above description regarding the rotary joint can be similarly applied to the swivel joint.

Further, it is preferable that the component mounting machine WM3, which is the work machine WM for a board, further includes a pipe fixing portion 62. The pipe fixing portion 62 is provided on the back surface 60 of the work module 20, and fixes the internal pipe 42 and the external pipe 41. A known joint can be used for the pipe fixing portion 62. FIG. 6 shows an external pipe 41 (first external pipe) when one of the plurality of (two) work modules 20 (work module 20 on the front side of the drawing) is pulled out from the base 10. 41a) shows an example of the state. This figure is a side view of the substrate 90 as viewed in the transport direction (arrow X direction). The work module 20 is pulled out from the base 10 by the maximum work amount WA0 during maintenance of the work module 20.

As shown in FIG. 6, the pipe length L11, the height H11, and the height H12 are set such that when the withdrawal amount of the work module 20 from the base 10 is the maximum withdrawal amount WA0 of the work module 20 during maintenance, the first external pipe 41a. Is preferably set so as to be separated from the upper surface of the base 10 by a predetermined height H13. The pipe length L11 is the pipe length of the first external pipe 41a, and refers to the length of the air circulation path in the first external pipe 41a. The height H11 is the height of the support member 80 from the upper surface of the base 10, and the height H12 is the height of the pipe fixing portion 62 from the upper surface of the base 10.

The predetermined height H13 may be set so that the first external pipe 41a is arranged in an arc shape (not in a straight line shape) when the withdrawal amount of the work module 20 from the base 10 is the maximum withdrawal amount WA0. Thereby, the component mounting machine WM3 can suppress the occurrence of excessive tension in the first external pipe 41a when the work module 20 is pulled out. Further, since the first external pipe 41a is separated from the upper surface of the base 10 by the predetermined height H13, the component mounting machine WM3 causes the first external pipe 41a to be wound when the work module 20 moves with respect to the base 10. Can be suppressed.

When a plurality of work modules 20 are provided on one base 10, it is preferable that each of the plurality of work modules 20 includes an internal pipe 42, a pipe fixing portion 62, and a support member 80. FIG. 7 is a schematic view of the work module 20 as viewed from the back surface 60 side, and shows an example of the arrangement of the external pipe 41. As shown in the figure, when the branch pipes branched from the external pipe 41 connected to one external negative pressure supply device 30 are respectively connected to the pipe fixing portion 62 via the support member 80 of each work module 20. It is suitable.

3. Common Matters The following matters can be applied to any of the first and second embodiments. The flow passage cross-sectional area CS1 of the external pipe 41 is preferably set to be larger than the flow passage cross-sectional area CS2 of the internal pipe 42. As a result, the component mounting machine WM3, which is the working machine WM for a board, can reduce the resistance in the external pipe 41 and suppress the decrease in the supply amount of the negative pressure supplied to the supply target VS0. Further, as the external pipe 41, a plurality of pipes can be used. In this case, the flow passage cross-sectional area CS1 of the external pipe 41 corresponds to the sum of the flow passage cross-sectional areas of the plurality of pipes. In the present specification, "negative pressure" refers to negative pressure air.

The supply target VS0 may be provided in the work module 20 and supplied with negative pressure, and may take various forms. For example, the mounting head 23b described above is included in the supply target VS0. Further, the supply target VS0 is preferably a substrate holding device that sucks and holds the back surface of the positioned substrate 90. The substrate holding device is provided in, for example, the substrate transfer device 21 shown in FIG. 2, and includes a planar backup plate having a plurality of suction ports on the upper surface. The substrate holding device supplies a negative pressure while the substrate 90 is arranged on the upper surface of the backup plate, and sucks and holds the back surface of the substrate 90 on the backup plate. For example, if an abnormality occurs during the production of the board product 900, the work module 20 may be pulled out for maintenance. In this case, since the production of the board product 900 is temporarily stopped, it is necessary to maintain the holding state of the board 90. In such cases, it is useful to apply the matters described in this specification.

4. Others The board working machine WM is not limited to the component mounting machine WM3. The substrate working machine WM may be the printing machine WM1, the printing inspection machine WM2, the reflow oven WM4, the appearance inspection machine WM5, and the like, as described above. Further, the above-mentioned substrate holding device can be used for the substrate transfer device provided therein.

5. Example of Effect of Embodiment According to the substrate working machine WM, the external negative pressure supply device 30 provided outside the base 10 is provided. Further, the external negative pressure supply device 30 supplies a negative pressure to the supply target VS0 inside the work module 20 without passing through the inside of the base 10. As a result, the to-board working machine WM can easily shorten the pipe length of the pipe that supplies the negative pressure, as compared with the case where the negative pressure is supplied to the work module 20 from the inside of the base 10. It is easy to increase the road cross-sectional area. As a result, the to-board working machine WM can suppress a decrease in the supply amount of the negative pressure supplied to the supply target VS0 inside the work module 20 during the production of the board product 900.

10: base, 20: work module, 30: external negative pressure supply device,
40: piping, 41: external piping, 41a: first external piping, 42: internal piping,
50: Internal negative pressure supply device,
60: back surface, 61: pipe attaching/detaching portion, 62: pipe fixing portion,
70: Negative pressure changing device, 71: Valve device,
80: support member, 81: horizontal axis, 90: substrate,
CS1, CS2: flow path cross-sectional area, L11: pipe length,
H11, H12: height, H13: predetermined height, WA0: maximum withdrawal amount,
VS0: supply target, WM: work machine for board,
Arrow Y direction: Drawout direction.

Claims (10)

Base,
A work module provided on the base so as to be able to be pulled out,
An external negative pressure supply device that is provided outside the base and that supplies a negative pressure to a supply target inside the work module without going through the inside of the base;
To-board working machine. An internal negative pressure supply device that is provided inside the base and that supplies a negative pressure to the supply target through an internal pipe that is a pipe provided inside the working module,
A pipe attachment/detachment portion that is provided on the back surface of the work module and that detachably connects the external pipe and the internal pipe that are pipes provided outside the work module,
The external negative pressure supply device when the work module is pulled out with respect to the base and the external pipe and the internal pipe are separated from each other in the pipe attaching/detaching portion, or when the possibility of disconnection occurs. Of at least the external negative pressure of an external negative pressure that is a negative pressure supplied to the supply target from the internal negative pressure and an internal negative pressure that is a negative pressure supplied to the supply target from the internal negative pressure supply device. A negative pressure changing device that switches from supply to supply of the internal negative pressure;
The board-to-board working machine according to claim 1, further comprising: The work machine for a board according to claim 2, wherein the negative pressure changing device includes a valve device that selectively switches the supply of the external negative pressure or the internal negative pressure to the supply target. The work machine for a board according to claim 2 or 3, wherein the pipe attaching/detaching portion is an air coupler. The anti-board working machine according to any one of claims 2 to 4, wherein the internal negative pressure supply device has a smaller supply amount of negative pressure per unit time than the external negative pressure supply device. Further comprising a support member installed in the middle of an external pipe which is a pipe provided outside the work module,
The support member rotatably supports a first external pipe, which is a portion of the external pipe on the working module side, rotatably around a horizontal axis orthogonal to the drawing direction of the base. Board working machine. Further provided on the back surface of the work module, and further includes a pipe fixing portion for fixing the internal pipe and the external pipe, which are pipes provided inside the work module,
The pipe length of the first external pipe, the height of the support member from the upper surface of the base, and the height of the pipe fixing portion from the upper surface of the base are such that the withdrawal amount of the work module from the base is the above. The work machine for a board according to claim 6, wherein the first external pipe is set so as to be separated from the upper surface of the base by a predetermined height when the work module has a maximum withdrawal amount during maintenance. The work machine for a board according to claim 6 or 7, wherein the support member is a rotary joint. The flow passage cross-sectional area of an external pipe that is a pipe provided outside the work module is set to be larger than the flow passage cross-sectional area of an internal pipe that is a pipe provided inside the work module. The work machine for a board according to any one of claims 8 to 8. The work machine for a substrate according to any one of claims 1 to 9, wherein the supply target is a substrate holding device that sucks and holds a back surface of a positioned substrate.

Images