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WO2020175619A1 - Boîtier de montage de composant électronique, dispositif électronique et dispositif électroluminescent - Google Patents

Boîtier de montage de composant électronique, dispositif électronique et dispositif électroluminescent Download PDF

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Publication number
WO2020175619A1
WO2020175619A1 PCT/JP2020/008032 JP2020008032W WO2020175619A1 WO 2020175619 A1 WO2020175619 A1 WO 2020175619A1 JP 2020008032 W JP2020008032 W JP 2020008032W WO 2020175619 A1 WO2020175619 A1 WO 2020175619A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic component
protrusion
component mounting
wiring board
mounting package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2020/008032
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English (en)
Japanese (ja)
Inventor
森　隆二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP2021502364A priority Critical patent/JPWO2020175619A1/ja
Publication of WO2020175619A1 publication Critical patent/WO2020175619A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements

Definitions

  • the present disclosure relates to an electronic component mounting package, an electronic device, and a light emitting device.
  • a base including a base having a first surface; and a protrusion having a second surface protruding from the first surface and in contact with the first surface;
  • a wiring board located on the second surface
  • the protrusion has a protrusion on the second surface
  • At least a part of the protrusion is located so as to overlap with the wiring board when viewed from a direction perpendicular to the second surface.
  • a light emitting element mounted on the wiring board ⁇ 2020/175619 2 ⁇ (:171? 2020 /008032
  • FIG. 1 An overall perspective view of an electronic device of the present embodiment.
  • FIG. 28 A diagram showing a cross section of a package for mounting electronic components.
  • FIG. 28 is a diagram showing a cross section of an electronic component mounting package.
  • FIG. 3-8 is a view showing a modified example 1 of the protrusion.
  • FIG. 38 is a diagram showing a second modification of the protrusions.
  • FIG. 3(:) is a diagram showing a modified example 3 of the protrusion.
  • FIG. 4-8 is a view showing a modified example 4 of the protrusions.
  • FIG. 48 is a diagram showing a modified example 5 of the protrusion.
  • FIG. 1 is an overall perspective view of an electronic device 1 of this embodiment.
  • the electronic device 1 includes an electronic component mounting package 100 and an electronic component 500.
  • the electronic component mounting package 100 includes a base body 11, a signal line 12, a wiring board 14, a bonding material 16, a conductive bonding material 17 and a lid 20.
  • the substrate 11 is a conductive metal.
  • the substrate 11 may have a high thermal conductivity and a high heat dissipation property.
  • the base body 11 includes a base portion 11 and a protruding portion 1 12.
  • the base 1 1 1 has, for example, a diameter of Thickness is ⁇ .
  • the base portion 1 11 has a plurality of through holes 1 1 1 3 and a first surface 1 1 1 sill. In FIG. 1, two through holes 1 1 1 1 3 are shown. One end 1 1 1 1 1 of the through hole 1 1 1 1 3 is on the first surface 1 1 1 13. The inside of the through hole 1 1 1 3 is occupied by the insulating member 1 1 1.
  • the insulating member 113 is, for example, a glass or ceramic material. The material of the insulating member 1 13 and the size of the through hole 11 13 may be determined according to the desired characteristic impedance related to signal transmission by the signal line 12.
  • the base 1 1 1 1 and the protrusion 1 1 2 may be integral.
  • Substrate 11 is a signal line 1 2 ⁇ 2020/175619 3 ⁇ (:171? 2020 /008032
  • the projecting portion 11 12 projects in the X direction from one of the first surfaces 1 11 1 of the surfaces including the ends of the through holes 1 11 13 in the base 1 11 1.
  • the projecting portion 1 12 of the base body 11 has a second surface 1 1 2 3 which is in contact with the first surface 1 11 1.
  • the protrusion 1 1 2 has a protrusion on the plane of the second surface 1 1 2 3 as described later.
  • the wiring board 14 is located above the second surface 1 1 2 3 with the bonding material 16 interposed therebetween. Above and above the object means the outward normal vector of the surface.
  • the wiring board 14 has a third surface 1 4 3 and a fourth surface 1 4 sill.
  • the wiring pattern 1 4 1 is located on the third surface 1 4 3.
  • the fourth surface 1 4 slag is the surface opposite to the third surface 1 4 3.
  • the ground layer 1 4 2 is located on the 4th surface 1 4 sill.
  • the wiring board 14 is used as, for example, a high-frequency line board.
  • the wiring board 14 is a flat insulating board, and is, for example, a resin or ceramic board.
  • the shape of the wiring pattern 1 41, the thickness and material of the wiring board 14, and particularly the relative permittivity of the wiring board 14 may be appropriately determined according to the desired characteristic impedance related to signal transmission.
  • the third surface 1 4 3 and the fourth surface 14 of the wiring board 14 are in contact with the first surface 1 1 1 of the base portion 11 1 of the base body 11 respectively.
  • the 1st surface 1 1 1 sack is located along the direction, and the 3rd surface 1 4 3 and the 4th surface 1 4 1 sack are perpendicular to the 1st surface 1 1 1 1 sack. That is, the third surface 143 and the fourth surface 143 are located along the X direction.
  • ground layer 1 42 may be, for example, a gold (hori) thin film layer.
  • Ground layer 1 4 may be, for example, a gold (hori) thin film layer.
  • the surface 2 does not have to cover the entire surface of the fourth surface 14.
  • the ground layer 1 42 may have, for example, various shapes surrounding the area of the wiring pattern 1 4 1 as viewed from above the third surface 1 4 3 along the vertical direction.
  • the bonding material 16 is used for the fourth surface 1 4 of the ground layer 1 4 2 of the wiring board 14 and the protrusion 1
  • the bonding material 16 has an appropriate viscosity in the state before bonding. Thereby, it is possible to appropriately adjust the thickness of the layer of the bonding material 16 to bond and solidify.
  • the bonding material 16 is a nanoparticle sintering type bonding material paste. Nano particle firing ⁇ 2020/175619 4 ⁇ (:171? 2020 /008032
  • the bonding agent paste contains nano-sized metal particles covered with a surface stabilizer, such as silver or copper, and an organic solvent.
  • a surface stabilizer such as silver or copper
  • an organic solvent In the nanoparticle-sintered bonding material paste, the metal particles are activated and the metal particles react with each other to bond, and at the same time, the metal particles also react with and adhere to the metal surface.
  • the organic solvent In the nanoparticle-sintered bonding material paste, the organic solvent has volatilized after it was fixed.
  • the thermal conductivity of the bonding material 16 is higher than the thermal conductivity of the base body 11.
  • the bonding material 16 may be an epoxy resin adhesive containing metal particles.
  • the wiring pattern 1 41 is electrically connected to the electronic component 500 and supplies power and a signal to the electronic component 500.
  • the wiring pattern 1 41 may be a conductive metal film having a low resistance, here, a gold thin film.
  • the wiring pattern 1 41 is bonded to the signal line 1 2 at two points via the conductive bonding material 17 here.
  • the shape, length and position of the wiring pattern 1 41 may be appropriately determined according to the size and terminal position of the electronic component 500 to be connected.
  • the wiring pattern 1 4 1 is separated from the ground layer 1 4 2 by the wiring board 1 4. That is, the wiring board 14 transmits signals by the microstrip line structure.
  • the signal line 12 is a rod-shaped conductor.
  • Signal line 1 2 is the first side of the base 1 1 1 1 1
  • the protruding signal line 12 is electrically connected to an external wiring or the like and used as a lead electrode.
  • the diameter of the signal line 12 may be, for example, about 0.1 to 1.001 01.
  • At least one of the signal lines 12 is a ground line of the base body 11 and is directly joined to the base portion 11 1.
  • the other signal line 12, here the two signal lines 12 penetrate through the different through holes 1 1 1 3 of the base 1 11 and their tips are exposed on the first surface 1 1 1 claw. There is.
  • the signal line 1 2 does not protrude from the first surface 1 1 1 13.
  • the tip may be in the same plane as the first surface 1 1 1 1 or may be recessed from the first surface 1 1 1.
  • the two signal lines 12 are insulating members that occupy separate through holes 1 1 1 3, respectively.
  • the signal line 1 2 is connected to the insulating member 1 1 3 inside the insulating member 1 1 3. It is separated from the outer base 1 1 1 by 1 3 and the signal is transmitted by the coaxial line structure in the base 1 1 1.
  • the conductive bonding material 17 electrically connects the signal line 12 exposed from the first surface 1 1 1 b and the wiring pattern 1 4 1 on the third surface 14 a.
  • the conductive bonding material 17 can be bonded not only to the signal line 12 and the wiring pattern 1 4 1 but also to the insulating insulating member 1 1 3 and the wiring board 14 in the through hole 1 1 1 a. It can be one.
  • the conductive bonding material 17 is, for example, a nanoparticle-sintered bonding material paste.
  • the above-mentioned nanoparticle-sintering-type bonding material paste has conductivity due to the bonding of the metal particles when fixed.
  • the electronic component 500 shown by the broken line is mounted on the wiring board 14.
  • the electronic component 500 is, for example, a laser diode, and in this case, the electronic device 1 is, for example, a light emitting device used as a light source.
  • a light receiving element such as a photodiode, a light emitting element other than the above laser diode such as an LED (Light Em itt tt ng Diode), a Peltier element, or various sensor elements such as various sensor elements may be used. Things may be used.
  • the lid body 20 shown by the dotted line is joined to the first surface 1 1 1 b and covers the protrusion 1 1 2, the wiring board 1 4, the wiring pattern 1 4 1 and the electronic component 5 0 0. Separate from the outside.
  • the lid 20 has a window 21.
  • the window portion 21 is made of a material that transmits the wavelength of the emitted light emitted from the electronic component 500.
  • the window portion 21 has a lens structure here (see FIG. 2B).
  • the window portion 21 may appropriately collect the emitted light from the electronic component 500, that is, the laser diode, and at least may not diffuse the emitted light.
  • FIG. 2A is a diagram showing a cross section of the electronic component mounting package 100 along a plane parallel to the first surface 1 11 b.
  • FIG. 2A is a diagram showing a cross section of the ground layer 1 42 of the electronic component mounting package 100 at a lower surface position. That is, FIG. 2A is a cross section perpendicular to the X direction, and FIG. 2A is a cross section perpendicular to the Y direction. here ⁇ 2020/175619 6 ⁇ (:171? 2020/008032
  • FIG. 28 is a cross section in a front view
  • FIG. 2 is a cross section in a plan view.
  • the protrusion 1 1 12 has a protrusion 1 1 2 1 on a part of the second surface 1 1 2 3. Then, at least a part of the protrusion 1 1 21 is located so as to overlap the wiring board 14 when seen in a plan view.
  • the protrusions 11 21 are higher than the portions of the second surface 1 12 3 other than the above portion.
  • the protrusion 1 1 2 1 is higher than the portion other than the above-mentioned part of the second surface 1 1 2 3 " here means that the protrusion 1 1 2 1 has the second surface 1 1 2 1 in the vertical direction. It means that it is located above the electronic component mounting package 100, that is, closer to the wiring board 14 than parts other than the above part of 3.
  • the highest part of the protrusion 1 1 2 1 is referred to as the apex of the protrusion 1 1 2 1.
  • the vertices of the protrusions 1 1 2 1 are below the wiring board 14 in the vertical direction. That is, the tops of the protrusions 1 1 1 2 1 are hidden by the wiring board 14 when the electronic component mounting package 100 0 is viewed in plan from the upper side in the vertical direction.
  • the protrusions 1 1 2 1 may be in direct contact with the fourth surface 14 of the ground layer 1 4 2 of the wiring board 14 and may be more Alternatively, it may be bonded to the ground layer 1 4 2 of the wiring board 14 via a thin bonding material 16.
  • the space between the portion other than the top of the protrusion 1 1 2 1 and the wiring board 14 is occupied by the bonding material 16.
  • the thickness of the bonding material 16 here is, for example, the dimension of the bonding material 16 along the vertical direction.
  • the height of the protrusion 1 1 2 1 can define the position of the wiring pattern 1 4 1.
  • the height of the protrusions 1 1 2 1 is such that the wiring pattern 1 4 1 on the third surface 1 4 3 of the wiring board 14 overlaps the through holes 1 1 1 3 and the insulating member 1 1 3 when viewed from the X direction. May be specified in.
  • the protrusion 1112 does not have to overlap with either the through hole 1113 or the insulating member 1113 when viewed from the X direction.
  • the protrusions 1 1 2 1 are entirely along the first surface 1 1 1 of the second surface 1 1 2 3 respectively. ⁇ 2020/175619 7 ⁇ (:171? 2020/008032
  • the protrusions 1 1 1 2 1 are located in the range between the outer positions of the two through-holes 1 1 1 1 3.
  • the height of the protrusion 1 1 21 here means, for example, the length of protrusion of the protrusion 1 1 2 1 from the flat surface portion of the second surface 1 1 2 3. More specifically, the height of the projection 1 1 21 1 can be, for example, the distance from the plane portion of the second surface 1 1 2 3 to the apex of the projection 1 1 2 1 in the vertical direction.
  • the protrusion 1 1 2 1 is dispersed so that they do not ride on a straight line on the second surface 1 1 2 3 in plan view. There is one.
  • the supporting surface of the wiring board 14, that is, the fixing position of the wiring board 14 is determined.
  • the heights of the protrusions 1 1 2 1 are equal to each other, and the supporting surface is perpendicular to the direction of the ridge.
  • the shape of the protrusion 1 1 2 1 is not particularly limited, but here, it may be a curved convex portion close to a hemisphere.
  • protrusions 1 1 2 1 do not overlap with the mounting position of the electronic component 500 when viewed from above the third surface 1 4 3 of the wiring board 14 along the direction of the arrow as shown in FIG. It may be a position.
  • the thermal conductivity of the bonding material 16 is higher than that of the base 11. Therefore, the mounting position of the electronic component 500 on the wiring board 14 is in contact with the protrusion 1 1 2 of the base body 11 via the bonding material 16, so that the heat of the electronic component 500 is transferred to the base body 1 1 0.
  • the thermal conductivity of the bonding material 16 is not higher than the thermal conductivity of the base body 11, or regardless of the thermal conductivity, the electronic component 5 0 is viewed from above the third surface 1 4 3.
  • the mounting position of 0 and the position of the protrusion 1 1 2 1 may overlap.
  • the protrusion 1 1 21 may be formed, for example, by driving a die having a recess corresponding to the protrusion 1 1 21 into the second surface 1 1 2 3. Or a protrusion ⁇ 2020/175619 8 ⁇ (:171? 2020 /008032
  • the through holes 1 1 1 2 1 may be obtained by forming irregularities on the second surface 1 1 2 3 with a cutting tool or the like.
  • the through holes 1 1 1 3 may also be formed by a mold.
  • the through holes 1 1 1 1 3 and the protrusions 1 1 2 1 may be arranged so as not to overlap with each other in a front view viewed from the X direction perpendicular to the first surface 1 1 1 swell. In this case, it becomes possible to process the second surface 1 1 2 3 while easily controlling the die so as not to hit the protrusion 1 1 2 1.
  • the position of the protrusion 1 1 1 2 may overlap with the position of the through hole 1 1 1 3 in a front view.
  • the protrusions 1 1 1 1 2 1 and the through holes 1 1 1 1 1 3 are formed by a cutting tool, etc.
  • the above-mentioned positional relationship between the protrusions 1 1 2 1 and the through holes 1 1 1 3 makes the processing difficult. Does not necessarily affect.
  • local changes in the characteristic impedance at the connection between the signal line 1 2 and the wiring pattern 1 4 1, especially the increase in the characteristic impedance are reduced, and the loss due to signal reflection is reduced. Can be made.
  • the protrusions 1 1 2 1 When the protrusions 1 1 2 1 are formed, a portion of the second surface 1 1 2 3 lower than the apex of the protrusions 1 1 2 1 is filled with a bonding material 16 and then the wiring board 14 is attached. Place the bonding material 16 and the protrusions 1 1 2 1 on top of each other, and heat to fix the bonding material 16. At this time, the bonding material 16 that adheres shrinks due to heat, but the wiring board 14 reduces the deviation from the position defined by the projection 1 1 2 1 due to the projection 1 1 2 1. ..
  • Figs. 38 to 3 are views showing modified examples 1 to 3 of the protrusions, respectively. These figures show the same cross section as in Figure 2.
  • the protrusion 1 1 2 1 3 of Modification 1 shown in FIG. 38 has a linear first portion that is linearly connected at a constant height.
  • the constant height of the first portion here means that the height of the highest portion (vertex) of the protrusions 1 1 1 2 1 3 is constant.
  • the protrusions 1 1 2 1 3 are a plurality of (2) linear shapes positioned in parallel.
  • the cross section in front view is the same as in Fig. 28. According to this modification, the wiring board 14 is supported more stably than the four-point support by the four protrusions 1 1 2 1 above. ⁇ 2020/175619 9 ⁇ (: 171-1?2020/008032
  • the protrusion 1 1 2 1 of the modified example 2 shown in Fig. 3 has a single linear shape, is bent at two locations, and is positioned so as to surround the electronic component 500. That is, the three sides of the area surrounded by the above-mentioned four-point protrusions 1 1 2 1 are supported, and the wiring board 14 is further stably supported. Further, the projections 1 1 2 1 0 of Modification 3 shown in FIG. 3 ( 3 are a combination of linear portions and dotted portions.
  • FIG. 48 is a diagram showing a modified example 4 of the protrusions.
  • FIG. 4 is a diagram showing a modified example 5 of the protrusion. These figures have the same cross section as Figure 28.
  • the highest portion is a line of two rows like the protrusion 1 1 2 1 3 of the modification 1.
  • the height of the part ⁇ between the linear parts of these two rows is lower than the linear parts of these two rows and higher than the outside of the linear parts.
  • this protrusion 1 1 2 1 has a multi-step protrusion shape in which the highest part is outwardly protruded as the top of the second step from the first step of the planar step here.
  • the ridge 1 1 2 1 has a planar first stage second portion and two rows of linear second stage tops.
  • the partial port forming the planar portion of the first stage does not support the wiring board 14.
  • the bonding material 16 is thinner than the outside of the linear portion of the second step.
  • the height of this partial mouth may vary depending on the distance from the first surface 1 1 1 sill.
  • the highest apex portion spreads in a plane at a constant height. That is, a part of the ground layer 1 4 2 of the wiring board 14 contacts the apex portion of the planar protrusion 1 1 2 1 6.
  • the flat top portion and the wiring board 14 may be in direct contact with each other, or a very thin film of the bonding material 16 is present between the flat top portion and the wiring board 14. Good.
  • the bonding material 1 6 is located between the wiring board 14 and the second surface 1 1 2 3 in the area other than the planar apex of the protrusion 1 1 2 1 6 and wiring is performed via the bonding material 1 6. Substrate 14 and second side 1 And are joined.
  • the electronic component mounting package 100 of the present embodiment has the first surface ⁇ 2020/175619 10 boxes (:171? 2020 /008032
  • Base 1 having a base 1 1 1 and a projection 1 1 2 having a second surface 1 1 2 3 protruding from the first surface 1 1 1 1 1 and a wiring board 14 located on the second surface 1 1 2 3 .
  • the protrusion 1 1 2 has a protrusion 1 1 2 1 on the second surface 1 1 2 3, and at least a part of the protrusion 1 1 2 1 is viewed from a direction perpendicular to the second face 1 1 2 3. And is positioned so as to overlap the wiring board 14.
  • the bonding material 1 1 can be heated by the bonding material 1 6 and the like. Even if contraction occurs in 6, the position of the wiring board 14 is regulated by the projections 1 1 2 1 to 1 1 1 2 1 6 and the displacement is reduced. This effect is particularly noticeable when the bonding material 16 is thick. Therefore, the position of the wiring board 14 is fixed at a desired position, and accordingly, the positional deviation of the electronic component 500 mounted on the wiring board 14 is also reduced.
  • the electronic component 500 is a light emitting element such as a laser diode, especially one having a strong directivity, this makes it possible to accurately determine the light emission direction. That is, according to the electronic component mounting package 100, it is possible to further improve the positional accuracy of the electronic component.
  • the protrusion 1 12 may have three or more protrusions 1 1 21.
  • the position of the wiring board 14 is precisely defined by these protrusions 1 1 2 1 and is supported stably.
  • the protrusions 1 12 are linear protrusions 1 1 2 1 3,
  • a plurality of linear protrusions 1 1 2 1 3 may be included.
  • the wiring board 14 can be supported more stably.
  • the protrusions 1 1 2 1 3 can be easily formed by the mold. As a result, in the electronic component mounting package 100 ⁇ 2020/175619 1 1 ⁇ (: 171-1?2020/008032
  • the wiring board 14 can be efficiently held at a desired position with higher accuracy while reducing the cost increase.
  • the protrusions are planar protrusions 1 1 2 having a constant height.
  • the part of 101, 1 1 2 1 6 may be included. In this case, by increasing the total volume of the protrusions, it is possible to hold the wiring board 14 at a desired position with higher accuracy while reducing the amount of the bonding material 16 used.
  • the protrusion 1 1 2 1 may have a top portion further protruding outward from the second portion, which is a planar protrusion.
  • the wiring board 14 is supported by lines and/or points, and the other parts are also projected in a planar manner, thereby improving the positional accuracy of the wiring board 14 and the amount of the bonding material 16 used. Can also be reduced.
  • the protruding portion 1 12 may have a plurality of protrusions 1 1 21 1, and the heights of the protrusions 1 1 1 2 1 may be equal to each other.
  • the wiring board 14 is positioned so as to be in contact with these projections 1 1 2 1, so that the wiring board 14 is parallel to the plane portion of the second surface 1 1 2 3 excluding the projections 1 1 2 1.
  • the second surface 1 1 2 3 is perpendicular to the first surface 1 1 1 claw, the orientation of the wiring board 14 depending on the posture of the first surface 1 1 1 of the base 1 11 1, that is, the electronic component 5 The direction of 0 0 can be easily and accurately determined.
  • the base body 11 includes a base portion 1 1 1 having a first surface 1 1 1 1 and a second surface 1 1 2 protruding from the first surface 1 1 1 1 1 And a protrusion 1 1 2 having 3 .
  • the base 1 1 1 has a through hole 1 1 1 3 with one end 1 1 1 1 on the first surface 1 1 1 1 and the projection 1 1 2 1 3 is one perpendicular to the first surface 1 1 1 1 It is located so as not to overlap the through holes 1 1 1 3 when viewed from the direction.
  • the protrusions 1 1 1 2 1 do not become an obstacle when the through-holes 1 1 1 1 3 are formed by a mold, and it is possible to reduce the cost and increase in labor.
  • the base 1 11 has a plurality of through holes 1 1 1 3, and the plurality of through holes 1 1 1 3 extend along the first face 1 1 1 claw of the second face 1 1 2 3.
  • this electronic component mounting package 100 can obtain high positional accuracy of the electronic component 500 while maintaining compactness.
  • the wiring board 14 has the through holes 1 1
  • the distance between the signal line 1 2 passing through the through-hole 1 1 1 1 3 and the ground layer 1 4 2 is appropriately reduced, and the local connection at the connection between the signal line 1 2 and the wiring pattern 1 4 1 is made. It is possible to reduce a change in characteristic impedance, particularly an increase in characteristic impedance. Also in this case, the positional relationship between the signal line 12 and the wiring board 14 can be accurately defined by the projections 1 1 1 2 1 and therefore the signal loss can be effectively reduced. In addition, the height of the wiring board 14 is adjusted by the protrusions 1 1 1 2 1 to more easily determine the positional relationship between the wiring board 1 4 and the signal line 1 2.
  • the position of the wiring board 14 can be adjusted only by the thickness of the bonding material 16, and the thickness of the wiring board 14 as well as between the signal line 1 2 and the through hole 1 1 1 3 and the second surface 1 1 2 3 can be adjusted. It is not necessary to change the positional relationship to change the characteristic impedance setting.
  • the wiring board 14 may be bonded to the second surface 1 1 2 3 via a bonding material 16 containing a metal.
  • the metal contained in the bonding material 16 may be metal particles before the bonding.
  • the bonding material 16 having high thermal conductivity can be obtained, and the heat at the time of bonding and the heat generation of the electronic component 500 can be effectively dissipated.
  • a nanoparticle-sintered bonding material paste containing nanometal particles an epoxy resin adhesive in which metal particles are dispersed in an epoxy resin, and the like, the temperature rise during bonding can be reduced. As a result, it is possible to reduce the influence of heat load on other parts of the electronic component mounting package 100.
  • the above metal may be silver or copper.
  • the above metal may be silver or copper.
  • the bonding material 16 may be a nanoparticle-sintered bonding material paste. This is because the nanoparticle-sintered bonding material paste has an appropriate viscosity before being fixed, so that the gap between the protrusions 1 1 2 1 can be appropriately filled. Also, with the above-mentioned nanoparticle sintering type bonding material paste containing silver or copper, it is not necessary to raise the heating temperature at the time of fixing compared with other metals, etc. It is possible to reduce the influence of the heat load on the part.
  • the electronic component mounting package 100 includes the wiring board 14 (and the protrusion 1
  • the lid body 20 may be handled in combination with the base body 11 without being bonded to the base body 11 as a product of the electronic component mounting package 100 which is not mounted with the electronic component 500. ..
  • the lid 20 may have a window portion 21 through which light passes.
  • 500 is a laser diode and/or a photodiode or the like, by having the window portion 21, it is possible to appropriately input and output light. Further, by improving the positional accuracy of the wiring board 14 and the electronic component 500 by the above configuration, the positional relationship between the electronic component 500, particularly the laser diode and the window 21 and especially the lens structure can be accurately measured. It becomes easy to match. As a result, it becomes possible to easily emit light in a more appropriate condensed state.
  • the electronic device 1 of the present embodiment is provided with the electronic component mounting package 10 described above.
  • the electronic component 500 includes a light emitting element, particularly a laser diode.
  • a light emitting element particularly a laser diode.
  • the plurality of protrusions may not have the same height as long as the plane is defined as a whole. That is, the fourth surface 14 of the wiring board 14 and the portion other than the protrusion of the second surface 1 1 2 3 do not have to be parallel. In this case, depending on the shape of the protrusion, the highest position of the protrusion may not contact the wiring board 14.
  • the projections 1 1 1 2 1 are described as being curved convex portions, they may have various shapes such as a cylinder (including an ellipse), a prism, a truncated cone, or a truncated pyramid.
  • the protrusions may be cones or pyramids, and the vertices of these cones or pyramids may be in contact with the ground layer 1 4 2 of the wiring board 14.
  • the inclination angle of the inclined portion of the protrusion having a shape such as a curved surface, a cone, a truncated cone, a pyramid, or a truncated pyramid may be appropriately determined, and may be different depending on the direction from the apex.
  • the plurality of protrusions may not be separated from each other.
  • the plurality of protrusions may have the same shape or different shapes.
  • two linear protrusions 11 are used as the linear protrusions.
  • the number of protrusions may be 3 or more, or may be curvilinear.
  • the plurality of linear protrusions may not be parallel to each other, and may be positioned such that, for example, the distance becomes wider as the distance from the first surface 1 1 1 swell increases.
  • one or a plurality of linear protrusions may be connected in a ring shape or a frame shape. The highest portion of the linear protrusion may have a width, and the width does not have to be constant.
  • the two-step structure having the linear projection or the dot-shaped projection on the planar projection part is described, but the structure may have three or more steps. Further, it is possible to further provide a dot-shaped projection on the linear projection.
  • the protrusions 1 1 2 1 may be outside the range.
  • the nanoparticle-sintered bonding material paste is described as an example of the bonding material 16, but the bonding material 16 is not limited to this.
  • the bonding material 16 may not have electrical conductivity.
  • the electronic component mounting package having the lid 20 is provided.
  • the electronic component mounting package 100 may not have the lid 20.
  • the window portion 21 depending on the electronic component 500 may not be a lens structure but may be a simple window that does not converge light.
  • the signal line 12 is not projected from the first surface 1 1 1 swell to the outside of the base 1 1 1 1 1 and the through hole 1 1 1 3 1
  • the wiring pattern 1 4 1 and the third surface 1 4 3 are positioned so as to overlap with each other.
  • the signal line 12 may be located above the wiring pattern 1 41 and the third surface 1 4 3 . In this case, the signal line 12 may protrude from the first surface 1 1 1 urn to the outside of the base 1 1 1.
  • three signal lines 12 are provided, one is for grounding the base body 11, and the other two are electronic components 5 0 via the wiring pattern 1 4 1. Although described as being connected to 0, it is not limited to this. Three or more signal lines may be connected to an electronic component, or if one is grounded, only one signal line may be dedicated to the electronic component. When there are two or more electronic components, the electronic component mounting package 100 may have as many signal lines 12 as required for each electronic component.
  • the present disclosure can be used for an electronic component mounting package, an electronic device, and a light emitting device.

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Light Receiving Elements (AREA)
  • Led Device Packages (AREA)
  • Semiconductor Lasers (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

Un boîtier de montage de composant électronique de la présente invention comprend : une base qui comprend une partie de base ayant une première surface, et une partie saillante qui fait saillie à partir de la première surface et a une seconde surface en contact avec la première surface ; et une carte de câblage qui est positionnée sur la seconde surface. La partie saillante a une saillie au niveau de la seconde surface, et au moins une partie de la saillie est positionnée de façon à chevaucher la carte de câblage lorsqu'elle est vue depuis une direction perpendiculaire à la seconde surface.
PCT/JP2020/008032 2019-02-28 2020-02-27 Boîtier de montage de composant électronique, dispositif électronique et dispositif électroluminescent Ceased WO2020175619A1 (fr)

Priority Applications (1)

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JP2021502364A JPWO2020175619A1 (ja) 2019-02-28 2020-02-27 電子部品搭載用パッケージ、電子装置及び発光装置

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JP2019036162 2019-02-28
JP2019-036162 2019-02-28

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WO2020175619A1 true WO2020175619A1 (fr) 2020-09-03

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