WO2020038068A1 - Imaging device and electronic apparatus - Google Patents

Abstract

An imaging device (100), comprising a time-of-flight module (20) and a dual-camera module (10). The time-of-flight module (20) comprises a light transmitter (23) and a light receiver (24). The dual-camera module (10) comprises two cameras (11, 12). The center of the light transmitter (23), the center of the light receiver (24), and the center of the dual-camera module (10) are located on the same straight line; or the center of the light transmitter (23), the center of the light receiver (24), and the center of a camera of the dual-camera module (10) are located on the same straight line.

Description

Imaging device and electronic equipment

Priority information

This application claims the priority and rights of the patent application filed with the State Intellectual Property Office of China on August 22, 2018, with a patent application number of 201810962517.7, which is hereby incorporated by reference in its entirety.

Technical field

The present application relates to the field of three-dimensional imaging technology, and more particularly, to an imaging device and an electronic device.

Background technique

The mobile phone can be equipped with a camera module and a structured light module at the same time. The camera module can obtain the color information of the measured object. The structured light module can use structured light to obtain the depth information of the measured object. The combination of information can construct a three-dimensional image of the measured object. However, the structured light module has poor accuracy when acquiring depth information of a measured object that is far away or has a small volume.

Summary of the Invention

Embodiments of the present application provide an imaging device and an electronic device.

The imaging device according to the embodiment of the present application includes a time-of-flight module and a dual camera module, and the time-of-flight module includes a light transmitter and a light receiver. The dual camera module includes two cameras. The center of the light transmitter, the center of the light receiver, and the center of the dual camera module are located on the same straight line; or the center of the light transmitter, the center of the light receiver, and a center The center of the camera is located on the same straight line.

The electronic device according to the embodiment of the present application includes a casing and the imaging device according to the embodiment of the present application. The casing is provided with a light through hole. The imaging device is mounted on the casing and aligned with the light through hole.

Additional aspects and advantages of the embodiments of the present application will be partially given in the following description, and part of them will become apparent from the following description, or be learned through the practice of the embodiments of the present application.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

1 is a schematic front view of an electronic device according to some embodiments of the present application;

2 is a schematic rear view of an electronic device according to some embodiments of the present application;

3 to 6 are schematic diagrams of an arrangement manner of imaging devices in some embodiments of the present application;

7 is a schematic plan view of a lens and an imaging device according to some embodiments of the present application;

FIG. 8 is a perspective structural diagram of a time-of-flight module according to some embodiments of the present application; FIG.

9 is a schematic top view of a time-of-flight module according to some embodiments of the present application;

10 is a schematic bottom view of a time-of-flight module according to some embodiments of the present application;

11 is a schematic side view of a time-of-flight module according to some embodiments of the present application;

12 is a schematic cross-sectional view of the time-of-flight module shown in FIG. 9 along the XII-XII line;

FIG. 13 is an enlarged schematic view of the XIII part in the time-of-flight module shown in FIG. 12; FIG.

14 is a schematic front view of a time-of-flight module according to some embodiments of the present application when the flexible circuit board is not bent;

15 to 18 are schematic structural diagrams of a light emitter according to some embodiments of the present application.

detailed description

The embodiments of the present application are further described below with reference to the accompanying drawings. The same or similar reference numerals in the drawings represent the same or similar elements or elements having the same or similar functions throughout.

In addition, the embodiments of the present application described below with reference to the drawings are exemplary, and are only used to explain the embodiments of the present application, and should not be construed as limiting the present application.

The imaging device 100 according to the embodiment of the present application includes a time-of-flight module 20 and a dual-camera module 10. The time of flight module 20 includes a light transmitter 23 and a light receiver 24, and the dual camera module 10 includes two cameras 11 and 12. The center C1 of the light transmitter 23, the center C2 of the light receiver 24, and the center C3 of the dual camera module 10 are located on the same straight line. Or the center C1 of the light transmitter 23, the center C2 of the light receiver 24, and the center C4 or C5 of a camera 11 or 12 are located on the same straight line.

In some embodiments, the center C1 of the light transmitter 23, the center C2 of the light receiver 24, the center C3 of the dual camera module 10, and the centers C4 and C5 of the two cameras 11, 12 are located on the same straight line L1.

In some embodiments, the dual camera module 10 includes a main camera 11 and a sub camera 12, a center C1 of the light transmitter 23, a center C2 of the light receiver 24, and a center C4 of the main camera 11 on the same straight line L2; Or the center C1 of the light transmitter 23, the center C2 of the light receiver 24, and the center C5 of the sub camera 12 are located on the same straight line L3.

In some embodiments, the time-of-flight module 20 further includes a substrate assembly 21 and a pad 22. The substrate assembly 21 includes a substrate 211 and a flexible circuit board 212 connected to each other. The spacer 22 is disposed on the substrate 211. The light transmitter 23 is configured to emit an optical signal outward. The light transmitter 23 is disposed on the cushion block 22. The flexible circuit board 212 is bent and one end of the flexible circuit board 212 is connected to the substrate 211 and the other end is connected to the light emitter 23. The light receiver 24 is provided on a substrate 211.

In some embodiments, the light receiver 24 includes a housing 241 and an optical element 242 disposed on the housing 241. The housing 241 is integrally formed with the cushion block 22.

In some embodiments, the cushion block 22 includes a protruding portion 225 protruding from the side edge 2111 of the substrate 211, and the flexible circuit board 212 is bent around the protruding portion 225.

In some embodiments, the outer surface 2251 of the protrusion 225 is a smooth curved surface.

In some embodiments, a receiving cavity 223 is defined on a side where the cushion block 22 is combined with the substrate 211. The time-of-flight module 20 further includes an electronic component 25 disposed on the substrate 211, and the electronic component 25 is contained in the receiving cavity 223.

The electronic device 1000 according to the embodiment of the present application includes: a casing 200 and the imaging device 100 according to any one of the foregoing embodiments. The casing 200 is provided with a through-hole 201. The imaging device 100 is installed on the casing 200. The imaging device 100 and The light passing holes 201 are aligned.

In some embodiments, the electronic device 1000 further includes a light transmitting lens 500. The lens 500 is mounted on the cabinet 200. The lens 500 covers the light-passing hole 201. An area of the lens 500 corresponding to the time-of-flight module 20 is provided with an infrared transmitting ink 501. The infrared transmitting ink 501 is used to transmit only infrared light.

In some embodiments, the casing 200 includes a front surface 204 and a back surface 205 opposite to each other, and the light through hole 201 penetrates the front surface 204 or the back surface 205.

In some embodiments, the dual camera module 10 includes a wide-angle camera 11 and a telephoto camera 12, and the electronic device 1000 further includes a processor 600. The processor 600 is configured to obtain a current distance between the target object and the electronic device 1000 in real time. When the current distance is less than a preset distance threshold, the wide-angle camera 11 collects image information of the target object. When the current distance is greater than or equal to the distance threshold, the telephoto camera 12 collects image information of the target object.

In some embodiments, the dual camera module 10 includes a color camera 11 and a black and white camera 12. The electronic device 1000 further includes a processor 600, which is configured to obtain the ambient light brightness of the current environment in real time. When the ambient light brightness is less than a preset brightness threshold, the black and white camera 12 collects image information of the current environment. When the ambient light brightness is greater than or equal to the brightness threshold, the color camera 11 collects image information of the current environment.

1 and FIG. 2, an electronic device 1000 according to an embodiment of the present application includes a casing 200 and an imaging device 100. The electronic device 1000 may be a mobile phone, a tablet computer, a game console, a smart watch, a headset device, a drone, etc. The embodiment of the present application is described using the electronic device 1000 as a mobile phone. It can be understood that the specific form of the electronic device 1000 is Not limited to mobile phones.

The case 200 can be used as a mounting carrier for the functional elements of the electronic device 1000. The case 200 can provide protection for the functional elements from dust, water, and drop. The functional elements can be the display screen 300, the receiver 400, and the like. The cabinet 200 includes a front surface 204 and a back surface 205 opposite to each other. The display screen 300 may be disposed on the front surface 204. The housing 200 is provided with a light-through hole 201. After the light passes through the light-through hole 201, it can enter the external environment from the inside of the housing 200, and the light in the external environment can also pass through the light-through hole 201 and enter the housing 200.

As shown in FIG. 1, in the embodiment of the present application, the cabinet 200 includes a main body 202 and a movable bracket 203. The movable bracket 203 can be moved relative to the main body 202 under the driving of a driving device. For example, the movable bracket 203 can be relatively The main body 202 slides to slide into or out of the main body 202. Some functional elements (such as the display 300) can be installed on the main body 202, and other functional elements (such as the imaging device 100 and the receiver 400) can be installed on the movable support 203. The movement of the movable support 203 can drive the other functional elements Retracted into or extended from the main body 202. In the embodiment shown in FIG. 1, the light through hole 201 is opened on the movable bracket 203.

The imaging device 100 is mounted on the casing 200, and the imaging device 100 is aligned with the light-passing hole 201. In the embodiment shown in FIG. 1, the imaging device 100 is mounted on a movable bracket 203. When a user needs to use the imaging device 100, the user can trigger the movable bracket 203 to slide out from the main body 202 to drive the imaging device 100 from the main body. Extending from 202, when the imaging device 100 is not needed, the movable bracket 203 can be triggered to slide into the main body 202 to drive the imaging device 100 to retract into the main body 202. Of course, FIG. 1 is only an example of a specific form of the cabinet 200 and cannot be understood as a limitation on the cabinet 200 of the present application. For example, in the example shown in FIG. The light hole 201 may be fixed, and the imaging device 100 is fixedly disposed and aligned with the light passing hole 201. In another example, the imaging device 100 is fixedly disposed below the display screen 300.

Referring to FIGS. 1-3, the imaging device 100 includes a time-of-flight module 20 and a dual-camera module 10. The time of flight module 20 includes a light transmitter 23 and a light receiver 24, and the dual camera module 10 includes two cameras 11 and 12. The center C1 of the light transmitter 23, the center C2 of the light receiver 24, and the center C3 of the dual camera module 10 are located on the same straight line (as shown in Figs. 3 and 4). Or the center C1 of the light transmitter 23, the center C2 of the light receiver 24, and the center C4 or C5 of a camera 11 or 12 are located on the same straight line (as shown in Figs. 5 and 6).

In the imaging device 100 and the electronic device 1000 according to the embodiments of the present application, the time-of-flight module 20 can obtain the depth information of the measured object through the principle of time-of-flight, and then combine it with the image information of the measured object obtained by the dual-camera module 10. When constructing a three-dimensional image of the measured object, since the time-of-flight module 20 acquires depth information through the principle of time of flight, the depth information obtained for a distanced or small-sized object is still highly accurate.

In addition, since the center C1 of the light transmitter 23, the center C2 of the light receiver 24, and the center C3 of the dual camera module 10 are located on the same straight line; or the center C1 of the light transmitter 23 and the center C2 of the light receiver 24, And the center C4 or C5 of one camera 11 or 12 is located on the same straight line; the overall arrangement of the imaging device 100 is beautiful and the structure is compact.

Specifically, please refer to FIG. 3. In some embodiments, the center C1 of the light transmitter 23, the center C2 of the light receiver 24, the center C3 of the dual camera module 10, and the center C4 of the two cameras 11 and 12. C5 is on the same straight line L1. Specifically, the light transmitter 23, the light receiver 24, and the two cameras 11, 12 are arranged along the extending direction of the straight line L1, and the width of the imaging device 100 in the direction perpendicular to the straight line L1 is small, which facilitates the installation of the imaging device 1000 Inside the case 200. In one example, the imaging device 1000 may be installed in the casing 200 such that the straight line L1 is parallel to the bottom wall 206 of the casing 200 (as shown in FIG. 1), or the straight line L1 is parallel to the side wall 207 of the casing 200 (such as figure 2).

Of course, as shown in FIG. 4, the arrangement of the imaging device 100 may also be the center C1 of the light transmitter 23, the center C2 of the light receiver 24, and the center C3 of the dual camera module 10 on the same straight line, and the straight line It does not pass through the centers C4, C5 of the two cameras 11, 12 at this time, the line may be perpendicular to the line connecting the centers C4, C5 of the two cameras 11, 12 or at an acute angle to make the center of the light receiver 24 The line connecting C2 and the centers C4 and C5 of the two cameras 11 and 12 can form a triangle.

Please refer to FIG. 5. In some embodiments, the dual camera module 10 includes a main camera 11 and a sub camera 12. The center C1 of the light transmitter 23, the center C2 of the light receiver 24, and the center C4 of the main camera 11 are located. On the same straight line L2 (as shown in Figure 5). At this time, the connection line between the center C4 of the main camera 11 and the center C5 of the sub camera 12 may be perpendicular to the straight line L2.

Alternatively, the center C1 of the light transmitter 23, the center C2 of the light receiver 24, and the center C5 of the sub camera 12 are located on the same straight line L3 (as shown in FIG. 6). At this time, the connection line between the center C4 of the main camera 11 and the center C5 of the sub camera 12 may be perpendicular to the straight line L3.

Specifically, the straight line L2 or the straight line L3 may be parallel to the bottom wall 206 of the cabinet 200, or may be parallel to the side wall 207 of the cabinet 200.

It should be noted that, in the description of the embodiments of the present application, the center refers to the front view when the imaging device 100 is mounted on the casing 200 (front view in the direction in which the front surface 204 points to the back surface 205 or in the direction in which the back surface 205 points to the front surface 204). The position of the geometric center of each element when the imaging device 100 is viewed from the front. For example, the center C1 of the light receiver 24 is the geometric center of the light receiver 24 when the imaging device 100 is viewed from the front.

Please refer to FIG. 1 and FIG. 3. In some embodiments, the light through hole 201 penetrates the front side 204 of the casing 200. At this time, the optical signal emitted by the light transmitter 23 can pass through the front face 204 of the electronic device 1000 to be transmitted to the outside, and the dual camera module 10 can be used as a front camera of the electronic device 1000. The depth information obtained by the time-of-flight module 20 can be used for functions such as ranging, unlocking, and payment, and the image information obtained by the dual-camera module 10 can be used for functions such as selfies.

Please refer to FIG. 2 and FIG. 3. In some embodiments, the through-hole 201 passes through the back surface 205 of the casing 200. At this time, the optical signal emitted by the light transmitter 23 can pass through the back surface 205 of the electronic device 1000 to be transmitted to the outside, and the dual camera module 10 can be used as a rear camera of the electronic device 1000. The depth information obtained by the time-of-flight module 20 can be used for functions such as ranging and modeling, and the image information obtained by the dual-camera module 10 can be used for functions such as shooting scenes.

With reference to FIG. 2 and FIG. 7, in some embodiments, the electronic device 1000 further includes a light transmitting lens 500. The lens 500 is mounted on the cabinet 200. The lens 500 covers the light-passing hole 201. An area (such as the shaded area in FIG. 7) corresponding to the time-of-flight module 20 on the lens 500 is provided with an infrared transmitting ink 501. The infrared transmitting ink 501 is used to transmit only infrared light.

Specifically, the infrared transmissive ink 501 has a high transmittance to infrared light, for example, the transmittance can reach 85% or more, while the transmittance to light other than infrared light is low or makes light other than infrared light Impervious at all. In the case where the light transmitter 23 emits infrared light and the light receiver 24 receives infrared light, infrared light can pass through the infrared transmission ink 501, and light other than infrared light (such as visible light) can hardly pass through the infrared transmission The ink 501, therefore, it is difficult for a user to see the time-of-flight module 20 inside the casing 200 through the light-through hole 201, and the appearance of the electronic device 1000 is more beautiful.

Please refer to FIG. 1 and FIG. 3. In some embodiments, the dual camera module 10 includes a wide-angle camera 11 and a telephoto camera 12 (the wide-angle camera 11 and the telephoto camera 12 can serve as the main camera 11 and the sub-camera 12), The electronic device 1000 further includes a processor 600. The processor 600 is configured to obtain a current distance between the target object and the electronic device 1000 in real time. When the current distance is less than a preset distance threshold, the wide-angle camera 11 collects image information of the target object. When the current distance is greater than or equal to the distance threshold, the telephoto camera 12 collects image information of the target object.

It should be noted that "wide-angle" and "telephoto" are relative terms. The wide-angle camera 11 has a larger field of view relative to the telephoto camera 12, and the telephoto camera 11 has a longer focal distance and a longer shooting distance than the wide-angle camera 12. Specifically, since the processor 600 acquires the current distance between the target object and the electronic device 1000 in real time, the electronic device 1000 can switch the camera used to collect image information in real time according to the current distance.

Assume that the distance threshold is d0. At the first moment, the processor 600 obtains the current distance between the target object and the electronic device 1000 as d1, where d1 <d0. At this time, the wide-angle camera 11 collects image information of the target object, and the image information is a wide-angle image at this time. The processor 600 may construct a three-dimensional image of the target object according to the depth information and the wide-angle image. At the second moment, the processor 600 obtains a current distance between the target object and the electronic device 1000 as d2, where d2> d0. The focus camera 12 collects image information of the target object again. At this time, the image information is a telephoto image. The processor 600 may construct a three-dimensional image of the target object based on the depth information and the telephoto image. The electronic device 1000 includes a wide-angle camera 11 and a telephoto camera 12 at the same time. The processor 600 can switch the wide-angle camera 11 or the telephoto camera 12 according to the actual situation to collect image information of the target object, thereby constructing two types of three-dimensional, wide-angle and telephoto Images, which will help improve the photo experience.

The processor 600 may obtain depth information collected by the time-of-flight module 20. The current distance acquired by the processor 600 may also be acquired by the time-of-flight module 20 or other functional modules, such as the current distance acquired by a structured light module or a proximity sensor.

Please refer to FIG. 1 and FIG. 3, the dual camera module 10 includes a color camera (ie, an RGB camera) 11 and a black and white camera (ie, a Mono camera) 12 (the color camera 11 and the black and white camera 12 can be used as the main camera 11 and the sub camera 12) . The electronic device 1000 further includes a processor 600, which is configured to obtain the ambient light brightness of the current environment in real time. When the ambient light brightness is less than a preset brightness threshold, the black and white camera 12 collects image information of the current environment. When the ambient light brightness is greater than or equal to the brightness threshold, the color camera 11 collects image information of the current environment.

It can be understood that, compared with the color camera 11, the black and white camera 12 can improve the shooting quality of low-light / night scene images. Therefore, when the ambient light brightness is less than the brightness threshold, image information can be collected by the black and white camera 12. When the ambient light brightness is greater than or equal to the brightness threshold, image information may be collected by the color camera 11. Assume that the brightness threshold is Q0. At the first moment, the ambient light brightness obtained by the processor 600 is Q1, where Q1 <Q0. At this time, the black and white camera 12 collects image information of the current environment. This image information is a Mono image. The processor 600 can construct a three-dimensional image of the current environment according to the depth information and the Mono image. At the second moment, the ambient light brightness obtained by the processor 600 is Q2, where Q2> Q0. At this time, the color camera 11 collects an image of the current environment again. Information, this image information is an RGB image, and the processor 600 may construct a three-dimensional image of the current environment according to the depth information and the RGB image. The electronic device 1000 includes both a color camera 11 and a black-and-white camera 12. The processor 600 can switch the color camera 11 or the black-and-white camera 12 according to the actual situation to collect image information of the current environment, thereby constructing two different types of three-dimensional images, RGB and Mono. Conducive to improving the photo experience.

Please refer to FIGS. 8 to 11. The time-of-flight module 20 includes a substrate assembly 21, a spacer 22, a light transmitter 23 and a light receiver 24. The substrate assembly 21 includes a substrate 211 and a flexible circuit board 212 connected to each other. The spacer 22 is disposed on the substrate 211. The light transmitter 23 is configured to emit an optical signal outward. The light transmitter 23 is disposed on the cushion block 22. The flexible circuit board 212 is bent and one end of the flexible circuit board 212 is connected to the substrate 211 and the other end is connected to the light emitter 23. The light receiver 24 is disposed on the substrate 211. The light receiver 24 is used to receive the light signal emitted by the reflected light transmitter 23. The light receiver 24 includes a housing 241 and an optical element 242 disposed on the housing 241. The housing 241 is integrally connected with the cushion block 22.

Specifically, the substrate assembly 21 includes a substrate 211 and a flexible circuit board 212. The substrate 211 may be a printed circuit board or a flexible circuit board, and the control circuit of the time-of-flight module 20 may be laid on the substrate 211. One end of the flexible circuit board 212 can be connected to the substrate 211, and the flexible circuit board 212 can be bent at a certain angle, so that the relative positions of the devices connected at both ends of the flexible circuit board 212 can be selected.

Referring to FIGS. 8 and 12, the pad 22 is disposed on the substrate 211. In one example, the spacer 22 is in contact with the substrate 211 and is carried on the substrate 211. Specifically, the spacer 22 may be combined with the substrate 211 by means of adhesion or the like. The material of the spacer 22 may be metal, plastic, or the like. In the embodiment of the present application, a surface where the pad 22 is combined with the substrate 211 may be a flat surface, and a surface opposite to the combined surface of the pad 22 may also be a flat surface, so that the light emitter 23 has a comparatively high quality when it is disposed on the pad 22. Good smoothness.

The light transmitter 23 is configured to emit an optical signal outwards. Specifically, the light signal may be infrared light, and the light signal may be a lattice spot emitted to the object to be measured. The light signal is emitted from the light transmitter 23 at a certain divergence angle. . The light transmitter 23 is disposed on the spacer 22. In the embodiment of the present application, the light transmitter 23 is disposed on the side of the spacer 22 opposite to the substrate 211, or the spacer 22 includes the substrate 211 and the light transmitter. 23 are spaced apart so that a height difference is formed between the light emitter 23 and the substrate 211. The light transmitter 23 is also connected to the flexible circuit board 212, and the flexible circuit board 212 is bent. One end of the flexible circuit board 212 is connected to the substrate 211, and the other end is connected to the light transmitter 23, so as to transfer the control signal of the light transmitter 23 from the substrate 211. The signal is transmitted to the optical transmitter 23, or a feedback signal of the optical transmitter 23 (for example, time information, frequency information of the optical signal transmitted by the optical transmitter 23, temperature information of the optical transmitter 23, etc.) is transmitted to the substrate 211.

Referring to FIG. 8, FIG. 9 and FIG. 11, the light receiver 24 is used for receiving an optical signal emitted by the reflected light transmitter 23. The light receiver 24 is disposed on the substrate 211, and the contact surface of the light receiver 24 and the substrate 211 is substantially flush with the contact surface of the pad 22 and the substrate 211 (that is, the installation starting points of the two are on the same plane). Specifically, the light receiver 24 includes a housing 241 and an optical element 242. The casing 241 is disposed on the substrate 211, and the optical element 242 is disposed on the casing 241. The casing 241 may be a lens holder and a lens barrel of the light receiver 24, and the optical element 242 may be a lens or other elements disposed in the casing 241. . Further, the light receiver 24 may further include a photosensitive chip (not shown). The optical signal reflected by the measured object is irradiated into the photosensitive chip through the optical element 242, and the photosensitive chip responds to the optical signal. The time-of-flight module 20 calculates the time difference between the light signal emitted by the light transmitter 23 and the light sensor receiving the light signal reflected by the measured object, and further obtains the depth information of the measured object, which can be used for distance measurement, For generating depth images or for 3D modeling. In the embodiment of the present application, the housing 241 and the cushion block 22 are integrally connected. Specifically, the housing 241 and the spacer 22 may be integrally formed. For example, the materials of the housing 241 and the spacer 22 are the same and are integrally formed by injection molding, cutting or the like; or the materials of the housing 241 and the spacer 22 are different, both Integrated molding by two-color injection molding. The housing 241 and the spacer 22 may also be separately formed, and the two form a matching structure. When assembling the time-of-flight module 20, the housing 241 and the spacer 22 may be first integrated into one body, and then jointly disposed on the substrate 211; Alternatively, one of the housing 241 and the pad 22 may be disposed on the substrate 211, and then the other may be disposed on the substrate 211 and connected together.

In the electronic device 1000 according to the embodiment of the present application, since the light emitter 23 is disposed on the pad 22, the pad 22 can raise the height of the light emitter 23, thereby increasing the height of the light emitting surface of the light emitter 23, and the light emitter 23 The emitted light signal is not easily blocked by the light receiver 24, so that the light signal can be completely irradiated on the measured object. The exit surface of the light transmitter 23 may be flush with the entrance surface of the light receiver 24, or the exit surface of the light transmitter 23 may be slightly lower than the entrance surface of the light receiver 24, or it may be the exit surface of the light transmitter 23 Slightly higher than the incident surface of the light receiver 24.

Please refer to FIG. 10 and FIG. 12. In some embodiments, the substrate assembly 21 further includes a reinforcing plate 213. The reinforcing plate 213 is coupled to a side of the substrate 211 opposite to the pad 22. The reinforcing plate 213 may cover one side of the substrate 211, and the reinforcing plate 213 may be used to increase the strength of the substrate 211 and prevent deformation of the substrate 211. In addition, the reinforcing plate 213 may be made of a conductive material, such as a metal or an alloy. When the time-of-flight module 20 is installed on the electronic device 1000, the reinforcing plate 213 and the casing 200 may be electrically connected to make the reinforcing plate 213. Grounding and effectively reducing the interference of static electricity from external components on the time of flight module 20.

Please refer to FIGS. 12 to 14. In some embodiments, the cushion block 22 includes a protruding portion 225 protruding from the side edge 2111 of the substrate 211, and the flexible circuit board 212 is bent around the protruding portion 225. Specifically, a part of the cushion block 22 is directly carried on the substrate 211, and another part is not in direct contact with the substrate 211, and protrudes from the side edge 2111 of the substrate 211 to form a protruding portion 225. The flexible circuit board 212 may be connected to the side edge 2111, and the flexible circuit board 212 is bent around the protrusion 225, or the flexible circuit board 212 is bent so that the protrusion 225 is located in a space surrounded by the flexible circuit board 212. Inside, when the flexible circuit board 212 is subjected to an external force, the flexible circuit board 212 will not collapse inward and cause excessive bending, which will cause damage to the flexible circuit board 212.

Further, as shown in FIG. 13, in some embodiments, the outer surface 2251 of the protruding portion 225 is a smooth curved surface (for example, the outer surface of a cylinder, etc.), that is, the outer surface 2251 of the protruding portion 225 does not form a curvature. Suddenly, even if the flexible circuit board 212 is bent over the outer side 2251 of the protruding portion 225, the degree of bending of the flexible circuit board 212 will not be too large, which further ensures the integrity of the flexible circuit board 212.

Please refer to FIG. 8 to FIG. 10. In some embodiments, the time-of-flight module 20 further includes a connector 26 connected to the substrate 211. The connector 26 is used to connect the substrate assembly 21 and an external device. The connector 26 and the flexible circuit board 212 are respectively connected to opposite ends of the substrate 211. The connector 26 may be a connection socket or a connector. When the time-of-flight module 20 is installed in the casing 200, the connector 26 may be connected to the main board of the electronic device 1000 so that the time-of-flight module 20 is electrically connected to the main board. The connector 26 and the flexible circuit board 212 are respectively connected to opposite ends of the substrate 211. For example, the connectors 26 and the flexible circuit board 212 may be respectively connected to the left and right ends of the substrate 211, or respectively connected to the front and rear ends of the substrate 211.

Please refer to FIG. 9 and FIG. 10. In some embodiments, the light transmitter 23 and the light receiver 24 are arranged along a straight line L, and the connector 26 and the flexible circuit board 212 are located on opposite sides of the straight line L, respectively. It can be understood that, since the light transmitter 23 and the light receiver 24 are arranged in an array, the size of the time-of-flight module 20 may be larger in the direction of the straight line L. The connector 26 and the flexible circuit board 212 are respectively disposed on opposite sides of the straight line L, which will not increase the size of the time-of-flight module 20 in the direction of the straight line L, thereby facilitating the installation of the time-of-flight module 20 on the electronic device 1000. On the chassis 200.

Please refer to FIG. 12 and FIG. 13. In some embodiments, a receiving cavity 223 is defined on a side where the cushion block 22 is combined with the substrate 211. The time-of-flight module 20 further includes an electronic component 25 disposed on the substrate 211, and the electronic component 25 is contained in the receiving cavity 223. The electronic component 25 may be a capacitor, an inductor, a transistor, a resistor, or the like. The electronic component 25 may be electrically connected to a control line laid on the substrate 211 and used to drive or control the operation of the light transmitter 23 or the light receiver 24. The electronic component 25 is contained in the containing cavity 223, and the space in the cushion block 22 is used reasonably. It is not necessary to increase the width of the substrate 211 to set the electronic component 25, which is beneficial to reducing the overall size of the time-of-flight module 20. The number of the receiving cavities 223 may be one or more, and the plurality of receiving cavities 223 may be spaced apart from each other. When the pad 22 is installed, the positions of the receiving cavity 223 and the electronic component 25 may be aligned and the pad 22 may be disposed at On the substrate 211.

Please refer to FIG. 12 and FIG. 14. In some embodiments, the cushion block 22 is provided with an avoiding through hole 224 communicating with at least one receiving cavity 223, and at least one electronic component 25 extends into the avoiding through hole 224. It can be understood that when the electronic component 25 needs to be contained in the containing cavity 223, the height of the electronic component 25 is required to be not higher than the height of the containing cavity 223. For the electronic component 25 having a height higher than the receiving cavity 223, an avoiding through hole 224 corresponding to the receiving cavity 223 may be provided, and the electronic component 25 may partially extend into the avoiding through hole 224, so as not to increase the height of the spacer 22 The electronic component 25 is arranged.

Referring to FIG. 12, in some embodiments, the light emitter 23 includes an emission substrate assembly 231, a light source assembly 232, and a housing 233. The emission substrate assembly 231 is disposed on the pad 22, and the emission substrate assembly 231 is connected to the flexible circuit board 212. The light source assembly 232 is disposed on the emission substrate assembly 231, and the light source assembly 232 is configured to emit an optical signal. The casing 233 is disposed on the emission substrate assembly 231. The casing 233 is formed with a receiving space 2331. The receiving space 2331 can be used for receiving the light source module 232. The flexible circuit board 212 may be detachably connected to the transmitting substrate assembly 231. The light source assembly 232 is electrically connected to the emission substrate assembly 231. The housing 233 may be bowl-shaped as a whole, and the opening of the housing 233 is downwardly covered on the emitting substrate assembly 231 to receive the light source assembly 232 in the receiving space 2331. In the embodiment of the present application, a light outlet 2332 corresponding to the light source component 232 is provided on the housing 233. The optical signal emitted from the light source component 232 passes through the light outlet 2332 and is emitted. The light signal can pass directly through the light outlet 2332. It can also pass through the optical outlet 2332 after changing the optical path through other optical devices.

Please continue to refer to FIG. 12. In some embodiments, the emitting substrate assembly 231 includes a emitting substrate 2311 and a reinforcing member 2312. The emission substrate 2311 is connected to a flexible circuit board 212. The light source assembly 232 and the reinforcing member 2312 are disposed on opposite sides of the emission substrate 2311. The specific type of the transmitting substrate 2311 may be a printed circuit board or a flexible circuit board, and a control circuit may be laid on the transmitting substrate 2311. The reinforcing member 2312 may be fixedly connected to the emitting substrate 2311 by means of gluing, riveting, or the like. The reinforcing member 2312 may increase the overall strength of the emitting substrate assembly 231. When the light emitter 23 is disposed on the pad 22, the reinforcing member 2312 can directly contact the pad 22, the emission substrate 2311 is not exposed to the outside, and does not need to be in direct contact with the pad 22, and the emission substrate 2311 is not susceptible to dust, etc. Pollution.

In the embodiment shown in FIG. 12, the reinforcing member 2312 and the cushion block 22 are formed separately. When assembling the time-of-flight module 20, the spacer 22 may be first mounted on the substrate 211. At this time, two ends of the flexible circuit board 212 are respectively connected to the substrate 211 and the emitting substrate 2311, and the flexible circuit board 212 may not be bent first ( (As shown in Figure 14). The flexible circuit board 212 is then bent, so that the reinforcing member 2312 is disposed on the cushion block 22.

Of course, in other embodiments, the reinforcing member 2312 and the spacer 22 may be integrally formed, for example, integrally formed by a process such as injection molding. When assembling the time-of-flight module 20, the spacer 22 and the light emitter 23 may be installed together. On the substrate 211.

Referring to FIG. 14, in some embodiments, a first positioning member 2313 is formed on the reinforcing member 2312. The cushion block 22 includes a body 221 and a second positioning member 222. The second positioning member 222 is formed on the body 221. When the emission substrate assembly 231 is disposed on the cushion block 22, the first positioning member 2313 cooperates with the second positioning member 222. Specifically, after the first positioning member 2313 cooperates with the second positioning member 222, the relative movement between the emitting substrate assembly 231 and the pad 22 can be effectively restricted. The specific types of the first positioning member 2313 and the second positioning member 222 can be selected according to needs. For example, the first positioning member 2313 is a positioning hole formed in the reinforcing member 2312, and the second positioning member 222 is a positioning column. Protrude into the positioning hole so that the first positioning member 2313 and the second positioning member 222 cooperate with each other; or the first positioning member 2313 is a positioning column formed on the reinforcing member 2312, and the second positioning member 222 is a positioning hole and the positioning column Project into the positioning hole so that the first positioning member 2313 and the second positioning member 222 cooperate with each other; or the number of the first positioning member 2313 and the second positioning member 222 are multiple, and part of the first positioning member 2313 is a positioning hole, Part of the second positioning member 222 is a positioning column, part of the first positioning member 2313 is a positioning column, and part of the second positioning member 222 is a positioning hole. The positioning column projects into the positioning hole so that the first positioning member 2313 and the second positioning member 222 work cooperatively.

The structure of the light source component 232 will be described as an example below:

Referring to FIG. 15, the light source assembly 232 includes a light source 60, a lens barrel 70, a diffuser 80 and a protective cover 90. The light source 60 is connected to the emitting substrate assembly 231. The lens barrel 70 includes a first surface 71 and a second surface 72 opposite to each other. The lens barrel 11 defines a storage cavity 75 that penetrates the first surface 71 and the second surface 72. The first surface 71 The second surface 72 is recessed to form a mounting groove 76 communicating with the storage cavity 75. The diffuser 80 is installed in the mounting groove 76. The protective cover 90 is mounted on the side where the first surface 71 of the lens barrel 70 is located, and the diffuser 80 is sandwiched between the protective cover 90 and the bottom surface 77 of the mounting groove 76.

The protective cover 90 can be mounted on the lens barrel 70 by means of screw connection, engagement, and fastener connection. For example, referring to FIG. 15, when the protective cover 90 includes a top wall 91 and a protective side wall 92, the protective cover 90 (protective side wall 92) is provided with internal threads and the lens barrel 70 is provided with external threads. At this time, the protective cover The internal thread of 90 is screwed with the external thread of the lens barrel 70 to mount the protective cover 90 on the lens barrel 70; or, referring to FIG. 16, when the protective cover 90 includes a top wall 91, the protective cover 90 (top wall 91) A locking hole 95 is opened, and a hook 73 is provided at an end of the lens barrel 70. When the protective cover 90 is provided on the lens barrel 70, the hook 73 is inserted into the locking hole 95 so that the protective cover 90 is mounted on the lens barrel 70. 17; when the protective cover 90 includes a top wall 91 and a protective side wall 92, the protective cover 90 (protective side wall 92) is provided with a locking hole 95, and a hook 73 is provided on the lens barrel 70. When the protective cover 90 is disposed on the lens barrel 70, the hook 73 is inserted into the hole 95 to mount the protective cover 90 on the lens barrel 70; or, referring to FIG. 18, when the protective cover 90 includes the top wall 91, The end of the lens barrel 70 is provided with a first positioning hole 74, the protective cover 90 (top wall 91) is provided with a second positioning hole 93 corresponding to the first positioning hole 74, and the fastener 94 passes through the second positioning hole 93 And locked A first positioning hole 74 to the protective cover 90 is mounted on the lens barrel 70. When the protective cover 90 is mounted on the lens barrel 70, the protective cover 90 is in contact with the diffuser 80 and the diffuser 80 is in contact with the bottom surface 77, so that the diffuser 80 is sandwiched between the protective cover 90 and the bottom surface 77.

The light source assembly 232 is provided with a mounting groove 76 on the lens barrel 70 and the diffuser 80 is installed in the mounting groove 76, and is mounted on the lens barrel 70 through a protective cover 90 to clamp the diffuser 80 between the protective cover 90 and the installation. Between the bottom surfaces 77 of the grooves 76, the diffuser 80 is actually fixed to the lens barrel 70. And avoid using glue to fix the diffuser 80 on the lens barrel 70, so as to prevent the glue from diffusing and solidifying on the surface of the diffuser 80 and affecting the microstructure of the diffuser 80 after the glue is volatilized to a gaseous state, and can prevent connection and diffusion When the glue of the lens holder 70 and the lens barrel 70 decreases due to aging, the diffuser 80 falls off from the lens barrel 70.

In the description of this specification, reference is made to the terms "certain embodiments", "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples" The description means that a specific feature, structure, material, or characteristic described in combination with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, the schematic expressions of the above terms do not necessarily refer to the same implementation or example. Moreover, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more implementations or examples.

In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "plurality" is at least two, for example, two, three, unless specifically defined otherwise.

Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limitations on the present application. Those skilled in the art may, within the scope of the present application, understand the above. The embodiments are subject to change, modification, replacement, and modification, and the scope of the present application is defined by the claims and their equivalents.

Claims (20)

An imaging device, comprising: Time-of-flight module, said time-of-flight module comprising a light transmitter and a light receiver; and Dual camera module, which includes two cameras; The center of the light transmitter, the center of the light receiver, and the center of the dual camera module are located on the same straight line; or the center of the light transmitter, the center of the light receiver, and a center The center of the camera is located on the same straight line. The imaging device according to claim 1, wherein the center of the light transmitter, the center of the light receiver, the center of the dual camera module, and the centers of the two cameras are on the same straight line. on. The imaging device according to claim 1, wherein the dual camera module comprises a main camera and a sub camera, The center of the light transmitter, the center of the light receiver, and the center of the main camera are on the same straight line; or The center of the light transmitter, the center of the light receiver, and the center of the sub camera are located on the same straight line. The imaging device according to any one of claims 1 to 3, wherein the time-of-flight module further comprises a substrate assembly and a pad, the substrate assembly comprising a substrate and a flexible circuit board connected to each other, the pad A block is disposed on the substrate, The light transmitter is disposed on the pad, the flexible circuit board is bent and one end of the flexible circuit board is connected to the substrate, the other end is connected to the light transmitter, and the light receiver is disposed on the pad. On the substrate. The imaging device according to claim 4, wherein the light receiver comprises a housing and an optical element disposed on the housing, and the housing is integrally formed with the pad. The imaging device according to claim 4, wherein the pad includes a protruding portion protruding from a side edge of the substrate, and the flexible circuit board is bent around the protruding portion. The imaging device according to claim 6, wherein an outer side surface of the protruding portion is a smooth curved surface. The imaging device according to claim 4, wherein a storage cavity is provided on a side where the pad is combined with the substrate, and the time-of-flight module further includes electronic components disposed on the substrate, and The electronic components are contained in the containing cavity. An electronic device is characterized by comprising a casing and an imaging device, the casing is provided with a light through hole, the imaging device is installed on the casing and aligned with the light through hole, The imaging device includes: Time-of-flight module, said time-of-flight module comprising a light transmitter and a light receiver; and Dual camera module, which includes two cameras; The center of the light transmitter, the center of the light receiver, and the center of the dual camera module are located on the same straight line; or the center of the light transmitter, the center of the light receiver, and a center The center of the camera is located on the same straight line. The electronic device according to claim 9, wherein the center of the light transmitter, the center of the light receiver, the center of the dual camera module, and the centers of the two cameras are located on the same straight line. on. The electronic device according to claim 9, wherein the dual camera module comprises a main camera and a sub camera, The center of the light transmitter, the center of the light receiver, and the center of the main camera are on the same straight line; or The center of the light transmitter, the center of the light receiver, and the center of the sub camera are located on the same straight line. The electronic device according to claim 9, wherein the time-of-flight module further comprises a substrate assembly and a pad, the substrate assembly comprising a substrate and a flexible circuit board connected to each other, and the pad is disposed on the On the substrate, The light transmitter is disposed on the pad, the flexible circuit board is bent and one end of the flexible circuit board is connected to the substrate, the other end is connected to the light transmitter, and the light receiver is disposed on the pad. On the substrate. The electronic device according to claim 12, wherein the light receiver comprises a casing and an optical element disposed on the casing, and the casing is integrally formed with the cushion block. The electronic device according to claim 12, wherein the pad includes a protruding portion protruding from a side edge of the substrate, and the flexible circuit board is bent and disposed around the protruding portion. The electronic device according to claim 14, wherein an outer surface of the protruding portion is a smooth curved surface. The electronic device according to claim 12, wherein a receiving cavity is provided on a side where the pad is combined with the substrate, and the time-of-flight module further includes electronic components disposed on the substrate, and The electronic components are contained in the containing cavity. The electronic device according to any one of claims 9 to 16, wherein the electronic device further comprises a light-transmitting lens, the lens is mounted on the casing and covers the light-passing hole, and An area on the lens corresponding to the time-of-flight module is provided with an infrared transmitting ink, and the infrared transmitting ink is used to transmit only infrared light. The electronic device according to any one of claims 9 to 16, wherein the casing comprises a front surface and a back surface opposite to each other, and the light through hole penetrates the front surface or the back surface. The electronic device according to any one of claims 9 to 16, wherein the dual-camera module includes a wide-angle camera and a telephoto camera, and the electronic device further includes a processor, which is configured to acquire a target in real time. The current distance between the object and the electronic device; When the current distance is less than a preset distance threshold, the wide-angle camera collects image information of the target object; When the current distance is greater than or equal to the distance threshold, the telephoto camera collects image information of the target object. The electronic device according to any one of claims 9 to 16, wherein the dual-camera module includes a color camera and a black-and-white camera, and the electronic device further includes a processor, which is configured to obtain a current environment in real time. Ambient light; When the ambient light brightness is less than a preset brightness threshold, the black and white camera collects image information of the current environment; When the ambient light brightness is greater than or equal to the brightness threshold, the color camera collects image information of the current environment.

Images