[go: up one dir, main page]

WO2020038057A1 - 深度采集模组及电子设备 - Google Patents

深度采集模组及电子设备 Download PDF

Info

Publication number
WO2020038057A1
WO2020038057A1 PCT/CN2019/090070 CN2019090070W WO2020038057A1 WO 2020038057 A1 WO2020038057 A1 WO 2020038057A1 CN 2019090070 W CN2019090070 W CN 2019090070W WO 2020038057 A1 WO2020038057 A1 WO 2020038057A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
acquisition module
depth acquisition
disposed
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/090070
Other languages
English (en)
French (fr)
Inventor
韦怡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Oppo Mobile Telecommunications Corp Ltd
Original Assignee
Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong Oppo Mobile Telecommunications Corp Ltd filed Critical Guangdong Oppo Mobile Telecommunications Corp Ltd
Publication of WO2020038057A1 publication Critical patent/WO2020038057A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/40—Transceivers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/11—Arrangements specific to free-space transmission, i.e. transmission through air or vacuum
    • H04B10/114—Indoor or close-range type systems
    • H04B10/116—Visible light communication
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly

Definitions

  • the present application relates to the field of three-dimensional imaging technology, and more particularly, to a depth acquisition module and electronic equipment.
  • Time of flight (TOF) imaging system can calculate the depth information of the measured object by calculating the time difference between the time when the light transmitting device emits the optical signal and the time when the light receiving device receives the optical signal.
  • the overall size of the time imaging system can be set close to the light emitting device and the light receiving device.
  • the embodiments of the present application provide a depth acquisition module and an electronic device.
  • the depth acquisition module includes a first substrate assembly, a pad, a first optical device, and a second optical device.
  • the first substrate assembly includes a first substrate and a flexible circuit board connected to each other.
  • the pad is disposed on the first substrate, and the pad includes a protruding portion protruding from a side edge of the first substrate.
  • the first optical device is disposed on the pad, the flexible circuit board is bent around the protrusion, and one end of the flexible circuit board is connected to the first substrate and the other end is connected to the first substrate.
  • the second optical device is disposed on the first substrate.
  • the electronic device includes a casing and the depth acquisition module according to the embodiment of the present application.
  • the depth acquisition module is installed on the casing.
  • FIG. 1 is a schematic perspective structural diagram of a state of an electronic device according to some embodiments of the present application.
  • FIG. 2 is a schematic perspective structural view of another state of an electronic device according to some embodiments of the present application.
  • FIG. 3 is a perspective structural diagram of a depth acquisition module according to some embodiments of the present application.
  • FIG. 4 is a schematic top view of a depth acquisition module according to some embodiments of the present application.
  • FIG. 5 is a schematic bottom view of a depth acquisition module according to some embodiments of the present application.
  • FIG. 6 is a schematic side view of a depth acquisition module according to some embodiments of the present application.
  • FIG. 7 is a schematic cross-sectional view of the depth acquisition module shown in FIG. 4 along the line VII-VII;
  • FIG. 8 is an enlarged schematic diagram of a portion VIII in the depth acquisition module shown in FIG. 7;
  • FIG. 9 is a schematic diagram of the front structure of the depth acquisition module in some embodiments of the present application when the flexible circuit board is not bent;
  • 10 to 13 are schematic structural diagrams of a light transmitter according to some embodiments of the present application.
  • the depth acquisition module 20 includes a first substrate assembly 21, a pad 22, a first optical device 23, and a second optical device 24.
  • the first substrate assembly 21 includes a first substrate 211 and a flexible circuit board 212 connected to each other.
  • the spacer 22 is disposed on the first substrate 211.
  • the spacer 22 includes a protruding portion 225 protruding from a side edge 2111 of the first substrate 211.
  • the first optical device 23 is disposed on the cushion block 22.
  • the flexible circuit board 212 is bent around the protruding portion 225, and one end of the flexible circuit board 212 is connected to the first substrate 211 and the other end is connected to the first optical device 23.
  • the second optical device 24 is disposed on the first substrate 211.
  • the outer surface 2251 of the protrusion 225 is a smooth curved surface.
  • the first optical device 23 is a light transmitter 23, the light transmitter 23 is used to emit optical signals outward, the second optical device 24 is a light receiver 24, and the light receiver 24 is used to receive the reflected light.
  • the light emitter 23 includes a second substrate assembly 231, a light source assembly 232, and a housing 233.
  • the second substrate assembly 231 is disposed on the pad 22, and the second substrate assembly 231 is connected to the flexible circuit board 212.
  • the light source assembly 232 is disposed on the second substrate assembly 231, and the light source assembly 232 is configured to emit a light signal.
  • the casing 233 is disposed on the second substrate assembly 231.
  • the casing 233 is formed with a receiving space 2331, and the receiving space 2331 is used for receiving the light source module 232.
  • the second substrate assembly 231 includes a second substrate 2311 and a reinforcing member 2312.
  • the second substrate 2311 is connected to the flexible circuit board 212.
  • the light source assembly 232 and the reinforcing member 2312 are disposed on opposite sides of the second substrate 2311.
  • the reinforcing member 2312 is integrally formed with the cushion block 22; or the reinforcing member 2312 and the cushion block 22 are formed separately.
  • a first positioning member 2313 is formed on the reinforcing member 2312.
  • the cushion block 22 includes a body 221 and a second positioning member 222.
  • the second positioning member 222 is formed on the body 221.
  • the first positioning member 2313 cooperates with the second positioning member 222.
  • a receiving cavity 223 is defined on a side where the cushion block 22 is combined with the first substrate 211.
  • the depth acquisition module 20 further includes an electronic component 25 disposed on the first substrate 211, and the electronic component 25 is contained in the receiving cavity 223.
  • the cushion block 22 is provided with an avoiding through hole 224 communicating with the at least one receiving cavity 223, and at least one electronic component 25 extends into the avoiding through hole 224.
  • the first substrate assembly 21 further includes a reinforcing plate 213, and the reinforcing plate 213 is coupled to a side of the first substrate 211 opposite to the pad 22.
  • the depth acquisition module 20 further includes a connector 26 connected to the first substrate 211.
  • the connector 26 is used to connect the first substrate assembly 21 and an external device.
  • the connector 26 and the protruding portion 225 are respectively located at opposite ends of the first substrate 211.
  • the light transmitter 23 and the light receiver 24 are arranged along a straight line L, and the connector 26 and the protruding portion 225 are located on opposite sides of the straight line L, respectively.
  • the electronic device 100 includes a casing 10 and a depth acquisition module 20 according to any embodiment of the present application.
  • the depth acquisition module 20 is mounted on the casing 10.
  • an electronic device 100 includes a casing 10 and a depth acquisition module 20.
  • the electronic device 100 may be a mobile phone, a tablet computer, a game console, a smart watch, a headset device, a drone, etc.
  • the embodiment of the present application is described using the electronic device 100 as a mobile phone. It can be understood that the specific form of the electronic device 100 is Not limited to mobile phones.
  • the casing 10 can serve as a mounting carrier for the functional components of the electronic device 100.
  • the casing 10 can provide protection for the functional components from dust, water, and drop.
  • the functional components can be the display screen 30, the visible light camera 40, and the receiver 50, etc. .
  • the cabinet 10 includes a main body 11 and a movable support 12.
  • the movable support 12 can move relative to the main body 11 under the driving of a driving device.
  • the movable support 12 can slide relative to the main body 11 to slide. Enter into the main body 11 (as shown in FIG. 1) or slide out from the main body 11 (as shown in FIG. 2).
  • Some functional elements can be installed on the main body 11, and other functional elements (such as the depth acquisition module 20, the visible light camera 40, and the receiver 50) can be installed on the movable bracket 12, and the movable bracket 12 can be moved.
  • the other part of the functional element is driven to retract into or protrude from the main body 11.
  • the depth acquisition module 20 is mounted on the casing 10. Specifically, the casing 10 may be provided with an acquisition window, and the depth acquisition module 20 is installed in alignment with the acquisition window so that the depth acquisition module 20 acquires depth information.
  • the depth acquisition module 20 is installed on the movable bracket 12.
  • the user can trigger the movable bracket 12 to slide out from the main body 11 to drive the depth acquisition module 20. Extending from the main body 11, when the depth acquisition module 20 is not needed, the movable bracket 12 can be triggered to slide into the main body 11 to drive the depth acquisition module 20 to retract into the main body 11.
  • the acquisition window opened on the casing 10 The depth acquisition module 20 may be fixed and aligned with the acquisition window. In another example, the depth acquisition module 20 is fixed below the display screen 30.
  • the depth acquisition module 20 includes a first substrate assembly 21, a pad 22, a first optical device 23 and a second optical device 24.
  • the first substrate assembly 21 includes a first substrate 211 and a flexible circuit board 212 connected to each other.
  • the spacer 22 is disposed on the first substrate 211.
  • the spacer 22 includes a protruding portion 225 protruding from a side edge 2111 (see FIG. 8) of the first substrate 211.
  • the first optical device 23 is disposed on the cushion block 22.
  • the flexible circuit board 212 is bent around the protruding portion 225, and one end of the flexible circuit board 212 is connected to the first substrate 211 and the other end is connected to the first optical device 23.
  • the second optical device 24 is disposed on the first substrate 211.
  • the existing light-emitting device and the light-receiving device are close to each other, since the height difference between the light-emitting device and the light-receiving device may be large, the light emitted by the light-emitting device may be directly irradiated on the housing of the light-receiving device, resulting The light emitted by the light emitting device cannot be completely irradiated on the measured object, or the external light may be blocked by the light emitting device before entering the light receiving device.
  • the spacer 22 can raise the height of the first optical device 23, so that the first optical device 23 and the second optical device 24 The difference in height is reduced to prevent one of the two (the first optical device 23 and the second optical device 24) from being blocked by the other when transmitting or receiving an optical signal.
  • the first optical device 23 is a light transmitter 23 and the second optical device 24 is a light receiver 24, the light signal emitted by the light transmitter 23 is not easily blocked by the light receiver 24, so that the light signal can be completely irradiated to the measured object.
  • the flexible circuit board 212 When the first optical device 23 is a light receiver and the second optical device 24 is a light transmitter, external light signals will not be blocked by the light transmitter before entering the light receiver. In addition, since the flexible circuit board 212 is bent around the protruding portion 225, when the flexible circuit board 212 is subjected to an external force, the flexible circuit board 212 does not collapse inward and the degree of bending is excessive, resulting in the flexible circuit board 212 damage.
  • the first optical device 23 may be a light transmitter 23
  • the second optical device 24 may be a light transmitter. Since the light transmitter 23 is disposed on the pad 22, the pad 22 can raise the height of the light transmitter 23, thereby increasing the height of the light emitting surface of the light transmitter 23, and the light signal emitted by the light transmitter 23 cannot be easily received by the light receiver 24. Blocking, so that the light signal can be completely irradiated on the measured object.
  • the first substrate assembly 21 includes a first substrate 211 and a flexible circuit board 212.
  • the first substrate 211 may be a printed circuit board or a flexible circuit board, and the control circuit of the depth acquisition module 20 may be laid on the first substrate 211.
  • One end of the flexible circuit board 212 can be connected to the first substrate 211, and the flexible circuit board 212 can be bent at a certain angle, so that the relative positions of the devices connected at both ends of the flexible circuit board 212 can be selected.
  • the pad 22 is disposed on the first substrate 211.
  • the pad 22 is in contact with the first substrate 211 and is carried on the first substrate 211.
  • the pad 22 may be combined with the first substrate 211 by means of adhesion or the like.
  • the material of the spacer 22 may be metal, plastic, or the like.
  • a surface where the pad 22 is combined with the first substrate 211 may be a flat surface, and a surface opposite to the combined surface of the pad 22 may also be a flat surface, so that when the light emitter 23 is disposed on the pad 22 Has better stability.
  • a part of the cushion block 22 is directly carried on the first substrate 211, and another part is not in direct contact with the first substrate 211, and protrudes from the side edge 2111 of the first substrate 211 to form a protrusion 225.
  • the flexible circuit board 212 may be connected to the side edge 2111, and the flexible circuit board 212 is bent around the protrusion 225, or the flexible circuit board 212 is bent so that the protrusion 225 is located in a space surrounded by the flexible circuit board 212. Inside, when the flexible circuit board 212 is subjected to an external force, the flexible circuit board 212 will not collapse inward and cause excessive bending, which will cause damage to the flexible circuit board 212.
  • the light transmitter 23 is configured to emit an optical signal outwards.
  • the optical signal may be infrared light, and the optical signal may be a lattice light spot emitted to the measured object.
  • the angle emerges from the light emitter 23.
  • the light transmitter 23 is disposed on the spacer 22.
  • the light transmitter 23 is disposed on the side of the spacer 22 opposite to the first substrate 211, or in other words, the spacer 22 connects the first substrate 211.
  • the light emitter 23 is spaced apart from the light emitter 23 so that a height difference is formed between the light emitter 23 and the first substrate 211.
  • the light transmitter 23 is also connected to the flexible circuit board 212.
  • the flexible circuit board 212 is bent around the protruding portion 225. One end of the flexible circuit board 212 is connected to the first substrate 211, and the other end is connected to the light transmitter 23 to connect the light transmitter.
  • the control signal of 23 is transmitted from the first substrate 211 to the light transmitter 23, or the feedback signal of the light transmitter 23 (for example, time information, frequency information of the light signal emitted by the light transmitter 23, temperature information of the light transmitter 23, etc. ) Is transferred to the first substrate 211.
  • the optical receiver 24 is configured to receive an optical signal emitted by the reflected optical transmitter 23.
  • the light receiver 24 is disposed on the first substrate 211, and the contact surface between the light receiver 24 and the first substrate 211 is substantially flush with the contact surface between the pad 22 and the first substrate 211 (that is, the installation starting point of the two is On the same plane).
  • the light receiver 24 includes a housing 241 and an optical element 242.
  • the casing 241 is disposed on the first substrate 211, and the optical element 242 is disposed on the casing 241.
  • the casing 241 may be a lens holder and a lens barrel of the light receiver 24, and the optical element 242 may be a lens disposed in the casing 241. And other components.
  • the light receiver 24 may further include a photosensitive chip (not shown).
  • the optical signal reflected by the measured object is irradiated into the photosensitive chip through the optical element 242, and the photosensitive chip responds to the optical signal.
  • the depth acquisition module 20 calculates the time difference between the light signal emitted by the light transmitter 23 and the light sensor receiving the light signal reflected by the measured object, and further obtains the depth information of the measured object.
  • the depth information can be used for ranging, For generating depth images or for 3D modeling.
  • the housing 241 and the pad 22 may be connected into a single body. Specifically, the housing 241 and the spacer 22 may be integrally formed, and the housing 241 and the spacer 22 may be mounted on the first substrate 211 together for easy installation.
  • the housing 241 and the spacer 22 are made of the same material and are injection-molded. Integrated cutting, cutting, etc .; or the materials of the housing 241 and the pad 22 are different, and the two are integrated through two-color injection molding.
  • the housing 241 and the spacer 22 may also be separately formed, and the two form a cooperative structure.
  • the housing 241 and the spacer 22 may be connected into one body, and then be disposed on the first substrate 211 together It is also possible to firstly arrange one of the housing 241 and the pad 22 on the first substrate 211, and then arrange the other on the first substrate 211 and connect them as a whole.
  • the cushion block 22 can heighten the height of the light emitter 23, thereby increasing the height of the exit surface of the light emitter 23, and the light emitter 23
  • the emitted light signal is not easily blocked by the light receiver 24, so that the light signal can be completely irradiated on the measured object.
  • the exit surface of the light transmitter 23 may be flush with the entrance surface of the light receiver 24, or the exit surface of the light transmitter 23 may be slightly lower than the entrance surface of the light receiver 24, or it may be the exit surface of the light transmitter 23 Slightly higher than the incident surface of the light receiver 24.
  • the flexible circuit board 212 is bent around the protruding portion 225, when the flexible circuit board 212 is subjected to an external force, the flexible circuit board 212 does not collapse inward and the degree of bending is excessive, resulting in the flexible circuit board 212 damage.
  • the outer surface 2251 of the protruding portion 225 is a smooth curved surface (for example, the outer surface of a cylinder, etc.), that is, the outer surface 2251 of the protruding portion 225 does not form a sudden change in curvature, even if it is flexible.
  • the outer surface 2251 of the circuit board 212 attached to the protruding portion 225 is bent, and the degree of bending of the flexible circuit board 212 is not too large, which further ensures the integrity of the flexible circuit board 212.
  • the first substrate assembly 21 further includes a reinforcing plate 213.
  • the reinforcing plate 213 is coupled to a side of the first substrate 211 opposite to the pad 22.
  • the reinforcing plate 213 may cover one side of the first substrate 211, and the reinforcing plate 213 may be used to increase the strength of the first substrate 211 and prevent deformation of the first substrate 211.
  • the reinforcing plate 213 may be made of a conductive material, such as a metal or an alloy.
  • the reinforcing plate 213 may be electrically connected to the casing 10 to make the reinforcing plate 213. Grounding and effectively reducing the interference of the static electricity of external components on the depth acquisition module 20.
  • the depth acquisition module 20 further includes a connector 26 connected to the first substrate 211.
  • the connector 26 is used to connect the first substrate assembly 21 and an external device.
  • the connector 26 and the protruding portion 225 are respectively located at opposite ends of the first substrate 211.
  • the connector 26 may be a connection base or a connector.
  • the connector 26 may be connected to the motherboard of the electronic device 100 so that the depth acquisition module 20 is electrically connected to the motherboard.
  • the connector 26 and the protruding portion 225 are respectively located at opposite ends of the first substrate 211, and may be connected to the left and right ends of the first substrate 211, respectively, or the front and back ends of the first substrate 211, respectively.
  • the light transmitter 23 and the light receiver 24 are arranged along a straight line L, and the connector 26 and the protruding portion 225 are located on opposite sides of the straight line L, respectively. It can be understood that, since the light transmitter 23 and the light receiver 24 are arranged in an array, the size of the depth acquisition module 20 may be larger in the direction of the straight line L.
  • the connector 26 and the protruding portion 225 are respectively disposed on opposite sides of the straight line L, which will not increase the size of the depth acquisition module 20 along the straight line L direction, thereby facilitating the installation of the depth acquisition module 20 on the electronic device 100 On the chassis 10.
  • a receiving cavity 223 is defined on a side where the cushion block 22 is combined with the first substrate 211.
  • the depth acquisition module 20 further includes an electronic component 25 disposed on the first substrate 211, and the electronic component 25 is contained in the receiving cavity 223.
  • the electronic component 25 may be an element such as a capacitor, an inductor, a transistor, a resistor, etc.
  • the electronic component 25 may be electrically connected to a control line laid on the first substrate 211 and used to drive or control the operation of the light transmitter 23 or the light receiver 24.
  • the electronic component 25 is contained in the containing cavity 223, and the space in the pad 22 is used reasonably.
  • the number of the receiving cavities 223 may be one or more, and the plurality of receiving cavities 223 may be spaced apart from each other.
  • the positions of the receiving cavity 223 and the electronic component 25 may be aligned and the pad 22 may be disposed at On the first substrate 211.
  • the cushion block 22 is provided with an avoiding through hole 224 communicating with at least one receiving cavity 223, and at least one electronic component 25 extends into the avoiding through hole 224.
  • the height of the electronic component 25 is required to be not higher than the height of the containing cavity 223.
  • an avoiding through hole 224 corresponding to the receiving cavity 223 may be provided, and the electronic component 25 may partially extend into the avoiding through hole 224, so as not to increase the height of the spacer 22
  • the electronic component 25 is arranged.
  • the light emitter 23 includes a second substrate assembly 231, a light source assembly 232, and a housing 233.
  • the second substrate assembly 231 is disposed on the pad 22, and the second substrate assembly 231 is connected to the flexible circuit board 212.
  • the light source assembly 232 is disposed on the second substrate assembly 231, and the light source assembly 232 is configured to emit a light signal.
  • the casing 233 is disposed on the second substrate assembly 231.
  • the casing 233 is formed with a receiving space 2331.
  • the receiving space 2331 can be used for receiving the light source module 232.
  • the flexible circuit board 212 may be detachably connected to the second substrate assembly 231.
  • the light source assembly 232 is electrically connected to the second substrate assembly 231.
  • the casing 233 may be bowl-shaped as a whole, and the opening of the casing 233 is disposed on the second substrate assembly 231 downwardly, so as to receive the light source assembly 232 in the accommodation space 2331.
  • a light outlet 2332 corresponding to the light source component 232 is provided on the housing 233.
  • the optical signal emitted from the light source component 232 passes through the light outlet 2332 and is emitted.
  • the light signal can pass directly through the light outlet 2332. It can also pass through the optical outlet 2332 after changing the optical path through other optical devices.
  • the second substrate assembly 231 includes a second substrate 2311 and a reinforcing member 2312.
  • the second substrate 2311 is connected to the flexible circuit board 212.
  • the light source assembly 232 and the reinforcing member 2312 are disposed on opposite sides of the second substrate 2311.
  • a specific type of the second substrate 2311 may be a printed circuit board or a flexible circuit board, and a control circuit may be laid on the second substrate 2311.
  • the reinforcing member 2312 may be fixedly connected to the second substrate 2311 by means of gluing, riveting, or the like.
  • the reinforcing member 2312 may increase the overall strength of the second substrate assembly 231.
  • the reinforcing member 2312 can directly contact the spacer 22, the second substrate 2311 is not exposed to the outside, and does not need to be in direct contact with the spacer 22, and the second substrate 2311 is not easily affected. Contamination by dust, etc.
  • the reinforcing member 2312 and the cushion block 22 are formed separately.
  • the spacer 22 may be first mounted on the first substrate 211.
  • the two ends of the flexible circuit board 212 are respectively connected to the first substrate 211 and the second substrate 2311, and the flexible circuit board 212 may Do not bend first (state shown in Figure 9).
  • the flexible circuit board 212 is then bent, so that the reinforcing member 2312 is disposed on the cushion block 22.
  • the reinforcing member 2312 and the spacer 22 may be integrally formed, for example, integrally formed by a process such as injection molding.
  • the spacer 22 and the light emitter 23 may be installed together.
  • the first substrate 211 On the first substrate 211.
  • a first positioning member 2313 is formed on the reinforcing member 2312.
  • the cushion block 22 includes a body 221 and a second positioning member 222.
  • the second positioning member 222 is formed on the body 221.
  • the first positioning member 2313 cooperates with the second positioning member 222.
  • the relative movement between the second substrate assembly 231 and the cushion block 22 can be effectively restricted.
  • the specific types of the first positioning member 2313 and the second positioning member 222 can be selected according to needs.
  • the first positioning member 2313 is a positioning hole formed in the reinforcing member 2312
  • the second positioning member 222 is a positioning column. Protrude into the positioning hole so that the first positioning member 2313 and the second positioning member 222 cooperate with each other; or the first positioning member 2313 is a positioning column formed on the reinforcing member 2312, and the second positioning member 222 is a positioning hole and the positioning column Project into the positioning hole so that the first positioning member 2313 and the second positioning member 222 cooperate with each other; or the number of the first positioning member 2313 and the second positioning member 222 are multiple, and part of the first positioning member 2313 is a positioning hole, Part of the second positioning member 222 is a positioning column, part of the first positioning member 2313 is a positioning column, and part of the second positioning member 222 is a positioning hole.
  • the positioning column projects into the positioning hole so that the first positioning member 2313 and the second positioning member 222 work cooperatively.
  • the structure of the light source component 232 will be described as an example below:
  • the light source assembly 232 includes a light source 60, a lens barrel 70, a diffuser 80 and a protective cover 90.
  • the light source 60 is connected to the second substrate assembly 231.
  • the lens barrel 70 includes a first surface 71 and a second surface 72 opposite to each other.
  • the lens barrel 11 defines a storage cavity 75 penetrating the first surface 71 and the second surface 72.
  • the first surface 71 is recessed toward the second surface 72 to form a mounting groove 76 communicating with the storage cavity 75.
  • the diffuser 80 is installed in the mounting groove 76.
  • the protective cover 90 is mounted on the side where the first surface 71 of the lens barrel 70 is located, and the diffuser 80 is sandwiched between the protective cover 90 and the bottom surface 77 of the mounting groove 76.
  • the protective cover 90 can be mounted on the lens barrel 70 by means of screw connection, engagement, and fastener connection.
  • the protective cover 90 when the protective cover 90 includes a top wall 91 and a protective side wall 92, the protective cover 90 (protective side wall 92) is provided with internal threads and the lens barrel 70 is provided with external threads.
  • the protective cover The internal thread of 90 is screwed with the external thread of the lens barrel 70 to mount the protective cover 90 on the lens barrel 70; or, referring to FIG. 11, when the protective cover 90 includes a top wall 91, the protective cover 90 (top wall 91) A locking hole 95 is opened, and a hook 73 is provided at an end of the lens barrel 70.
  • the hook 73 is inserted into the locking hole 95 so that the protective cover 90 is mounted on the lens barrel 70. 12; when the protective cover 90 includes a top wall 91 and a protective side wall 92, the protective cover 90 (protective side wall 92) is provided with a locking hole 95, and the lens barrel 70 is provided with a hook 73.
  • the protective cover 90 is disposed on the lens barrel 70, the hook 73 is inserted into the card hole 95 so that the protective cover 90 is mounted on the lens barrel 70; or, referring to FIG.
  • the protective cover 90 when the protective cover 90 includes the top wall 91, The end of the lens barrel 70 is provided with a first positioning hole 74, the protective cover 90 (top wall 91) is provided with a second positioning hole 93 corresponding to the first positioning hole 74, and the fastener 94 passes through the second positioning hole 93 And locked A first positioning hole 74 to the protective cover 90 is mounted on the lens barrel 70.
  • the protective cover 90 is mounted on the lens barrel 70, the protective cover 90 is in contact with the diffuser 80 and the diffuser 80 is in contact with the bottom surface 77, so that the diffuser 80 is sandwiched between the protective cover 90 and the bottom surface 77.
  • the light source assembly 232 is provided with a mounting groove 76 on the lens barrel 70 and the diffuser 80 is installed in the mounting groove 76, and is mounted on the lens barrel 70 through a protective cover 90 to clamp the diffuser 80 between the protective cover 90 and the installation. Between the bottom surfaces 77 of the grooves 76, the diffuser 80 is actually fixed to the lens barrel 70. And avoid using glue to fix the diffuser 80 on the lens barrel 70, so that after the glue becomes a gaseous state, the gaseous glue can diffuse and solidify on the surface of the diffuser 80 and affect the microstructure of the diffuser 80, and can avoid connecting the diffuser When the glue of 80 and the lens barrel 70 deteriorates due to aging, the diffuser 80 falls off from the lens barrel 70.
  • first and second are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as “first” and “second” may explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "plurality” is at least two, for example, two, three, unless specifically defined otherwise.

Landscapes

  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Endoscopes (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

一种深度采集模组(20)，深度采集模组(20)包括第一基板组件(21)、垫块(22)、第一光学器件(23)及第二光学器件(24)。第一基板组件(21)包括互相连接的第一基板(211)及柔性电路板(212)。垫块(22)设置在第一基板(211)上，垫块(22)包括伸出第一基板(211)的侧边缘(2111)的凸出部(225)。第一光学器件(23)设置在垫块(22)上。柔性电路板(212)绕凸出部(225)弯折设置，且柔性电路板(212)的一端连接第一基板(211)，另一端连接第一光学器件(23)。第二光学器件(24)设置在第一基板(211)上。

Description

深度采集模组及电子设备
优先权信息
本申请请求2018年08月22日向中国国家知识产权局提交的、专利申请号为201810962803.3的专利申请的优先权和权益，并且通过参照将其全文并入此处。
技术领域
本申请涉及三维成像技术领域，更具体而言，涉及一种深度采集模组及电子设备。
背景技术
飞行时间(time of flight,TOF)成像系统可通过计算光发射装置发射光信号的时刻，与光接收装置接收到光信号的时刻之间的时间差来计算被测物体的深度信息，为了减小飞行时间成像系统的整体尺寸，可以将光发射装置与光接收装置靠近设置。
发明内容
本申请实施方式提供一种深度采集模组及电子设备。
本申请实施方式的深度采集模组包括第一基板组件、垫块、第一光学器件及第二光学器件。所述第一基板组件包括互相连接的第一基板及柔性电路板。所述垫块设置在所述第一基板上，所述垫块包括伸出所述第一基板的侧边缘的凸出部。所述第一光学器件设置在所述垫块上，所述柔性电路板绕所述凸出部弯折设置，且所述柔性电路板的一端连接所述第一基板，另一端连接所述第一光学器件。所述第二光学器件设置在所述第一基板上。
本申请实施方式的电子设备包括机壳及本申请实施方式所述的深度采集模组。所述深度采集模组安装在所述机壳上。
本申请的实施方式的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本申请的实施方式的实践了解到。
附图说明
本申请的上述和/或附加的方面和优点从结合下面附图对实施方式的描述中将变得明显和容易理解，其中：
图1是本申请某些实施方式的电子设备的一个状态的立体结构示意图；
图2是本申请某些实施方式的电子设备的另一个状态的立体结构示意图；
图3是本申请某些实施方式的深度采集模组的立体结构示意图；
图4是本申请某些实施方式的深度采集模组的俯视示意图；
图5是本申请某些实施方式的深度采集模组的仰视示意图；
图6是本申请某些实施方式的深度采集模组的侧视示意图；
图7是图4所示的深度采集模组沿VII-VII线的截面示意图；
图8是图7所示的深度采集模组中VIII部分的放大示意图；
图9是本申请某些实施方式的深度采集模组在柔性电路板未弯折时的正面结构示意图；
图10至图13是本申请某些实施方式的光发射器的结构示意图。
具体实施方式
以下结合附图对本申请的实施方式作进一步说明。附图中相同或类似的标号自始至终表示相同或类似的元件或具有相同或类似功能的元件。
另外，下面结合附图描述的本申请的实施方式是示例性的，仅用于解释本申请的实施方式，而不能理解为对本申请的限制。
本申请实施方式的深度采集模组20包括第一基板组件21、垫块22、第一光学器件23及第二光学器件24。第一基板组件21包括互相连接的第一基板211及柔性电路板212。垫块22设置在第一基板211上，垫块22包括伸出第一基板211的侧边缘2111的凸出部225。第一光学器件23设置在垫块22上。柔性电路板212绕凸出部225弯折设置，且柔性电路板212的一端连接第一基板211，另一端连接第一光学器件23。第二光学器件24设置在第一基板211上。
在某些实施方式中，凸出部225的外侧面2251为平滑的曲面。
在某些实施方式中，第一光学器件23为光发射器23，光发射器23用于向外发射光信号，第二光学器件24为光接收器24，光接收器24用于接收被反射回的光发射器23发射的光信号。
在某些实施方式中，光发射器23包括第二基板组件231、光源组件232及外壳233。第二基板组件231设置在垫块22上，第二基板组件231与柔性电路板212连接。光源组件232设置在第二基板组件231上，光源组件232用于发射光信号。外壳233设置在第二基板组件231上，外壳233形成有收容空间2331，收容空间2331用于收容光源组件232。
在某些实施方式中，第二基板组件231包括第二基板2311及补强件2312。第二基板2311与柔性电路板212连接。光源组件232及补强件2312设置在第二基板2311的相背的两侧。
在某些实施方式中，补强件2312与垫块22一体成型；或补强件2312与垫块22分体成型。
在某些实施方式中，补强件2312上形成有第一定位件2313。垫块22包括本体221及第二定位件222，第二定位件222形成在本体221上。第二基板组件231设置在垫块22上时，第一定位件2313与第二定位件222配合。
在某些实施方式中，垫块22与第一基板211结合的一侧开设有收容腔223。深度采集模组20还包括设置在第一基板211上的电子元件25，电子元件25收容在收容腔223内。
在某些实施方式中，垫块22开设有与至少一个收容腔223连通的避让通孔224，至少一个电子元件25伸入避让通孔224内。
在某些实施方式中，第一基板组件21还包括加强板213，加强板213结合在第一基板211的与垫块22相背的一侧。
在某些实施方式中，深度采集模组20还包括连接器26，连接器26连接在第一基板211上。连接器26用于连接第一基板组件21及外部设备。连接器26与凸出部225分别位于第一基板211的相背的两端。
在某些实施方式中，光发射器23与光接收器24沿一直线L排列，连接器26与凸出部225分别位于直线L的相背的两侧。
本申请实施方式的电子设备100包括机壳10及本申请任一实施方式的深度采集模组20，深度采集模组20安装在机壳10上。
请参阅图1及图2，本申请实施方式的电子设备100包括机壳10及深度采集模组20。电子设备100可以是手机、平板电脑、游戏机、智能手表、头显设备、无人机等，本申请实施方式以电子设备100为手机为例进行说明，可以理解，电子设备100的具体形式并不限于手机。
机壳10可以作为电子设备100的功能元件的安装载体，机壳10可以为功能元件提供防尘、防水、防摔等的保护，功能元件可以是显示屏30、或可见光摄像头40、受话器50等。在本申请实施例中，机壳10包括主体11及可动支架12，可动支架12在驱动装置的驱动下可以相对于主体11运动，例如可动支架12可以相对于主体11滑动，以滑入主体11(如图1所示)内部或从主体11中滑出(如图2所示)。部分功能元件(例如显示屏30)可以安装在主体11上，另一部分功能元件(例如深度采集模组20、可见光摄像头40、受话器50)可以安装在可动支架12上，可动支架12运动可带动该另一部分功能元件缩回主体11内或从主体11中伸出。
深度采集模组20安装在机壳10上。具体地，机壳10上可以开设有采集窗口，深度采集模组20与采集窗口对准安装以使深度采集模组20采集深度信息。在本申请实施例中，深度采集模组20安装在可动支架12上，用户在需要使用深度采集模组20时，可以触发可动支架12从主体11中滑出以带动深度采集模组20从主体11中伸出，在不需要使用深度 采集模组20时，可以触发可动支架12滑入主体11以带动深度采集模组20缩回到主体11中。当然，图1及图2所示仅是对机壳10的一种具体形式的举例，不能理解为对本申请的机壳10的限制，例如在另一个例子中，机壳10上开设的采集窗口可以是固定不动的，深度采集模组20固定设置且与采集窗口对准；在又一个例子中，深度采集模组20固定设置在显示屏30的下方。
请参阅图3至图6，深度采集模组20包括第一基板组件21、垫块22、第一光学器件23及第二光学器件24。第一基板组件21包括互相连接的第一基板211及柔性电路板212。垫块22设置在第一基板211上，垫块22包括伸出第一基板211的侧边缘2111(如图8)的凸出部225。第一光学器件23设置在垫块22上。柔性电路板212绕凸出部225弯折设置，且柔性电路板212的一端连接第一基板211，另一端连接第一光学器件23。第二光学器件24设置在第一基板211上。
现有的光发射装置与光接收装置靠得较近时，由于光发射装置与光接收装置的高度差可能较大，光发射装置发射的光可能会直接照射在光接收装置的外壳上，导致光发射装置发射的光不能完全照射到被测物体上，或者外界的光在进入光接收装置前，可能被光发射装置阻挡。
本申请实施方式的电子设备100中，由于第一光学器件23设置在垫块22上，垫块22可以垫高第一光学器件23的高度，进而使得第一光学器件23与第二光学器件24的高度差减小，避免二者(第一光学器件23与第二光学器件24)中的一个发射或接收光信号时被另一个遮挡。当第一光学器件23为光发射器23，第二光学器件24为光接收器24时，光发射器23发射的光信号不易被光接收器24遮挡，使得光信号能够完全照射到被测物体上；当第一光学器件23为光接收器，第二光学器件24为光发射器时，外界的光信号在进入光接收器前，不会被光发射器阻挡。另外，由于柔性电路板212绕凸出部225弯折设置，当柔性电路板212受到外力的作用时，柔性电路板212不会向内塌陷而导致弯折的程度过大，造成柔性电路板212损坏。
下面将以第一光学器件23为光发射器23，第二光学器件24为光接收器24为例进行举例说明。可以理解，在其他实施方式中，第一光学器件23可以为光接收器，第二光学器件24可以为光发射器。由于光发射器23设置在垫块22上，垫块22可以垫高光发射器23的高度，进而提高光发射器23的出射面的高度，光发射器23发射的光信号不易被光接收器24遮挡，使得光信号能够完全照射到被测物体上。
具体地，第一基板组件21包括第一基板211及柔性电路板212。第一基板211可以是印刷线路板或柔性线路板，第一基板211上可以铺设有深度采集模组20的控制线路等。柔性电路板212的一端可以连接在第一基板211上，柔性电路板212可以发生一定角度的弯 折，使得柔性电路板212两端连接的器件的相对位置可以有较多选择。
请参阅图3及图7，垫块22设置在第一基板211上。在一个例子中，垫块22与第一基板211接触且承载在第一基板211上，具体地，垫块22可以通过胶粘等方式与第一基板211结合。垫块22的材料可以是金属、塑料等。在本申请实施例中，垫块22与第一基板211结合的面可以是平面，垫块22与该结合的面相背的面也可以是平面，使得光发射器23设置在垫块22上时具有较好的平稳性。
请参阅图7及图8，垫块22的一部分直接承载在第一基板211上，另一部分未与第一基板211直接接触，且相对第一基板211的侧边缘2111伸出形成凸出部225。柔性电路板212可以连接在该侧边缘2111，柔性电路板212绕凸出部225弯折，或者说，柔性电路板212弯折以使凸出部225位于柔性电路板212弯折围成的空间内，当柔性电路板212受到外力的作用时，柔性电路板212不会向内塌陷而导致弯折的程度过大，造成柔性电路板212损坏。
请参阅图3及图7，光发射器23用于向外发射光信号，具体地，光信号可以是红外光，光信号可以是向被测物体发射的点阵光斑，光信号以一定的发散角从光发射器23中射出。光发射器23设置在垫块22上，在本申请实施例中，光发射器23设置在垫块22的与第一基板211相背的一侧，或者说，垫块22将第一基板211及光发射器23间隔开，以使光发射器23与第一基板211之间形成高度差。光发射器23还与柔性电路板212连接，柔性电路板212绕凸出部225弯折设置，柔性电路板212的一端连接第一基板211，另一端连接光发射器23，以将光发射器23的控制信号从第一基板211传输到光发射器23，或将光发射器23的反馈信号(例如光发射器23的发射光信号的时间信息、频率信息，光发射器23的温度信息等)传输到第一基板211。
请参阅图3、图4及图6，光接收器24用于接收被反射回的光发射器23发射的光信号。光接收器24设置在第一基板211上，且光接收器24和第一基板211的接触面与垫块22和第一基板211的接触面基本齐平设置(即，二者的安装起点是在同一平面上)。具体地，光接收器24包括壳体241及光学元件242。壳体241设置在第一基板211上，光学元件242设置在壳体241上，壳体241可以是光接收器24的镜座及镜筒，光学元件242可以是设置在壳体241内的透镜等元件。进一步地，光接收器24还可以包括感光芯片(图未示)，由被测物体反射回的光信号通过光学元件242作用后照射到感光芯片中，感光芯片对该光信号产生响应。深度采集模组20计算光发射器23发出光信号与感光芯片接收经被测物体反射该光信号之间的时间差，并进一步获取被测物体的深度信息，该深度信息可以用于测距、用于生成深度图像或用于三维建模等。在一个例子中，壳体241与垫块22可以连接成一体。具体地，壳体241与垫块22可以是一体成型，壳体241与垫块22可以一并安装在第一基 板211上，便于安装，例如壳体241与垫块22的材料相同并通过注塑、切削等方式一体成型；或者壳体241与垫块22的材料不同，二者通过双色注塑成型等方式一体成型。壳体241与垫块22也可以是分别成型，二者形成配合结构，在组装深度采集模组20时，可以先将壳体241与垫块22连接成一体，再共同设置在第一基板211上；也可以先将壳体241与垫块22中的一个设置在第一基板211上，再将另一个设置在第一基板211上且连接成一体。
本申请实施方式的电子设备100中，由于光发射器23设置在垫块22上，垫块22可以垫高光发射器23的高度，进而提高光发射器23的出射面的高度，光发射器23发射的光信号不易被光接收器24遮挡，使得光信号能够完全照射到被测物体上。光发射器23的出射面可以与光接收器24的入射面齐平，也可以是光发射器23的出射面略低于光接收器24的入射面，还可以是光发射器23的出射面略高于光接收器24的入射面。另外，由于柔性电路板212绕凸出部225弯折设置，当柔性电路板212受到外力的作用时，柔性电路板212不会向内塌陷而导致弯折的程度过大，造成柔性电路板212损坏。
请参阅图8，在某些实施方式中，凸出部225的外侧面2251为平滑的曲面(例如圆柱的外侧面等)，即凸出部225的外侧面2251不会形成曲率突变，即使柔性电路板212贴覆着凸出部225的外侧面2251弯折，柔性电路板212的弯折程度也不会过大，进一步确保柔性电路板212的完好。
请参阅图5及图7，在某些实施方式中，第一基板组件21还包括加强板213，加强板213结合在第一基板211的与垫块22相背的一侧。加强板213可以覆盖第一基板211的一个侧面，加强板213可以用于增加第一基板211的强度，避免第一基板211发生形变。另外，加强板213可以由导电的材料制成，例如金属或合金等，当深度采集模组20安装在电子设备100上时，可以将加强板213与机壳10电连接，以使加强板213接地，并有效地减少外部元件的静电对深度采集模组20的干扰。
请参阅3至图5，在某些实施方式中，深度采集模组20还包括连接器26，连接器26连接在第一基板211上。连接器26用于连接第一基板组件21及外部设备。连接器26与凸出部225分别位于第一基板211的相背的两端。连接器26可以是连接座或连接头，当深度采集模组20安装在机壳10内时，连接器26可以与电子设备100的主板连接，以使得深度采集模组20与主板电连接。连接器26与凸出部225分别位于第一基板211的相背的两端，例如可以是分别连接在第一基板211的左右两端，或者分别连接在第一基板211的前后两端。
请参阅图4及图5，在某些实施方式中，光发射器23与光接收器24沿一直线L排列，连接器26与凸出部225分别位于直线L的相背的两侧。可以理解，由于光发射器23与光 接收器24排列设置，因此沿直线L的方向上，深度采集模组20的尺寸可能已经较大。连接器26与凸出部225分别设置在直线L的相背的两侧，不会再增加深度采集模组20沿直线L方向上的尺寸，进而便于将深度采集模组20安装在电子设备100的机壳10上。
请参阅图7及图8，在某些实施方式中，垫块22与第一基板211结合的一侧开设有收容腔223。深度采集模组20还包括设置在第一基板211上的电子元件25，电子元件25收容在收容腔223内。电子元件25可以是电容、电感、晶体管、电阻等元件，电子元件25可以与铺设在第一基板211上的控制线路电连接，并用于驱动或控制光发射器23或光接收器24工作。电子元件25收容在收容腔223内，合理地利用了垫块22内的空间，不需要增加第一基板211的宽度来设置电子元件25，利于减小深度采集模组20的整体尺寸。收容腔223的数量可以是一个或多个，多个收容腔223可以是互相间隔的，在安装垫块22时，可以将收容腔223与电子元件25的位置对准并将垫块22设置在第一基板211上。
请参阅图7及图9，在某些实施方式中，垫块22开设有与至少一个收容腔223连通的避让通孔224，至少一个电子元件25伸入避让通孔224内。可以理解，需要将电子元件25收容在收容腔223内时，要求电子元件25的高度不高于收容腔223的高度。而对于高度高于收容腔223的电子元件25，可以开设与收容腔223对应的避让通孔224，电子元件25可以部分伸入避让通孔224内，以在不提高垫块22高度的前提下布置电子元件25。
请参阅图7，在某些实施方式中，光发射器23包括第二基板组件231、光源组件232及外壳233。第二基板组件231设置在垫块22上，第二基板组件231与柔性电路板212连接。光源组件232设置在第二基板组件231上，光源组件232用于发射光信号。外壳233设置在第二基板组件231上，外壳233形成有收容空间2331，收容空间2331可用于收容光源组件232。柔性电路板212可以是可拆装地连接在第二基板组件231上。光源组件232与第二基板组件231电连接。外壳233整体可以呈碗状，且外壳233的开口向下罩设在第二基板组件231上，以将光源组件232收容在收容空间2331内。在本申请实施例中，外壳233上开设有与光源组件232对应的出光口2332，从光源组件232发出的光信号穿过出光口2332后发射到出去，光信号可以直接从出光口2332穿出，也可以经其他光学器件改变光路后从出光口2332穿出。
请继续参阅图7，在某些实施方式中，第二基板组件231包括第二基板2311及补强件2312。第二基板2311与柔性电路板212连接。光源组件232及补强件2312设置在第二基板2311的相背的两侧。第二基板2311的具体类型可以是印刷线路板或柔性线路板等，第二基板2311上可以铺设有控制线路。补强件2312可以通过胶粘、铆接等方式与第二基板2311固定连接，补强件2312可以增加第二基板组件231整体的强度。光发射器23设置在垫块22上时，补强件2312可以与垫块22直接接触，第二基板2311不会暴露在外部，且 不需要与垫块22直接接触，第二基板2311不易受到灰尘等的污染。
在如图7所示的实施例中，补强件2312与垫块22分体成型。在组装深度采集模组20时，可以先将垫块22安装在第一基板211上，此时柔性电路板212的两端分别连接第一基板211及第二基板2311，且柔性电路板212可以先不弯折(如图9所示的状态)。然后再将柔性电路板212弯折，使得补强件2312设置在垫块22上。
当然，在其他实施例中，补强件2312与垫块22可以一体成型，例如通过注塑等工艺一体成型，在组装深度采集模组20时，可以将垫块22及光发射器23一同安装在第一基板211上。
请参阅图9，在某些实施方式中，补强件2312上形成有第一定位件2313。垫块22包括本体221及第二定位件222，第二定位件222形成在本体221上。第二基板组件231设置在垫块22上时，第一定位件2313与第二定位件222配合。具体地，第一定位件2313与第二定位件222配合后，能有效地限制第二基板组件231与垫块22之间的相对运动。第一定位件2313及第二定位件222的具体类型可以依据需要进行选择，例如第一定位件2313为形成在补强件2312上的定位孔，同时第二定位件222为定位柱，定位柱伸入定位孔内以使第一定位件2313与第二定位件222相互配合；或者第一定位件2313为形成在补强件2312上的定位柱，第二定位件222为定位孔，定位柱伸入定位孔内以使第一定位件2313与第二定位件222相互配合；或者第一定位件2313及第二定位件222的数量均为多个，部分第一定位件2313为定位孔，部分第二定位件222为定位柱，部分第一定位件2313为定位柱，部分第二定位件222为定位孔，定位柱伸入定位孔内以使第一定位件2313与第二定位件222相互配合。
下面将对光源组件232的结构进行举例说明：
请参阅图10，光源组件232包括光源60、镜筒70、扩散器(diffuser)80及保护罩90。光源60连接在第二基板组件231上，镜筒70包括相背的第一面71及第二面72，镜筒11开设贯穿第一面71与第二面72的收纳腔75，第一面71朝第二面72凹陷形成与收纳腔75连通的安装槽76。扩散器80安装在安装槽76内。保护罩90安装在镜筒70的第一面71所在的一侧，扩散器80夹设在保护罩90与安装槽76的底面77之间。
保护罩90可以通过螺纹连接、卡合、紧固件连接的方式安装在镜筒70上。例如，请参阅图10，当保护罩90包括顶壁91及保护侧壁92时，保护罩90(保护侧壁92)上设置有内螺纹，镜筒70上设置有外螺纹，此时保护罩90的内螺纹与镜筒70的外螺纹螺合以将保护罩90安装在镜筒70上；或者，请参阅图11，当保护罩90包括顶壁91时，保护罩90(顶壁91)开设有卡孔95，镜筒70的端部设置有卡勾73，当保护罩90设置在镜筒70上时，卡勾73穿设在卡孔95内以使保护罩90安装在镜筒70上；或者，请参阅图12，当保 护罩90包括顶壁91及保护侧壁92时，保护罩90(保护侧壁92)开设有卡孔95，镜筒70上设置有卡勾73，当保护罩90设置在镜筒70上时，卡勾73穿设在卡孔95内以使保护罩90安装在镜筒70上；或者，请参阅图13，当保护罩90包括顶壁91时，镜筒70的端部开设有第一定位孔74，保护罩90(顶壁91)上开设有与第一定位孔74对应的第二定位孔93，紧固件94穿过第二定位孔93并锁紧在第一定位孔74内以将保护罩90安装在镜筒70上。当保护罩90安装在镜筒70上时，保护罩90与扩散器80抵触并使扩散器80与底面77抵触，从而使扩散器80被夹设在保护罩90与底面77之间。
光源组件232通过在镜筒70上开设安装槽76，并将扩散器80安装在安装槽76内，以及通过保护罩90安装在镜筒70上以将扩散器80夹持在保护罩90与安装槽76的底面77之间，从而现实将扩散器80固定在镜筒70上。且避免使用胶水将扩散器80固定在镜筒70上，从而能够避免胶水成气态后，气态的胶水扩散并凝固在扩散器80的表面而影响扩散器80的微观结构，并能够避免连接扩散器80和镜筒70的胶水因老化而使粘着力下降时扩散器80从镜筒70上脱落。
在本说明书的描述中，参考术语“某些实施方式”、“一个实施方式”、“一些实施方式”、“示意性实施方式”、“示例”、“具体示例”、或“一些示例”的描述意指结合所述实施方式或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施方式或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个所述特征。在本申请的描述中，“多个”的含义是至少两个，例如两个，三个，除非另有明确具体的限定。
尽管上面已经示出和描述了本申请的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本申请的限制，本领域的普通技术人员在本申请的范围内可以对上述实施例进行变化、修改、替换和变型，本申请的范围由权利要求及其等同物限定。

Claims (24)

  1. 一种深度采集模组，其特征在于，包括：
    第一基板组件，所述第一基板组件包括互相连接的第一基板及柔性电路板；
    垫块，所述垫块设置在所述第一基板上，所述垫块包括伸出所述第一基板的侧边缘的凸出部；
    第一光学器件，所述第一光学器件设置在所述垫块上，所述柔性电路板绕所述凸出部弯折设置，且所述柔性电路板的一端连接所述第一基板，另一端连接所述第一光学器件；及
    第二光学器件，所述第二光学器件设置在所述第一基板上。
  2. 根据权利要求1所述的深度采集模组，其特征在于，所述凸出部的外侧面为平滑的曲面。
  3. 根据权利要求1或2所述的深度采集模组，其特征在于，所述第一光学器件为光发射器，所述光发射器用于向外发射光信号，所述第二光学器件为光接收器，所述光接收器用于接收被反射回的所述光发射器发射的光信号。
  4. 根据权利要求3所述的深度采集模组，其特征在于，所述光发射器包括：
    第二基板组件，所述第二基板组件设置在所述垫块上，所述第二基板组件与所述柔性电路板连接；
    设置在所述第二基板组件上的光源组件，所述光源组件用于发射所述光信号；及
    设置在所述第二基板组件上的外壳，所述外壳形成有收容空间以收容所述光源组件。
  5. 根据权利要求4所述的深度采集模组，其特征在于，所述第二基板组件包括第二基板及补强件，所述第二基板与所述柔性电路板连接，所述光源组件及所述补强件设置在所述第二基板的相背的两侧。
  6. 根据权利要求5所述的深度采集模组，其特征在于，所述补强件与所述垫块一体成型；或所述补强件与所述垫块分体成型。
  7. 根据权利要求5所述的深度采集模组，其特征在于，所述补强件上形成有第一定位 件，所述垫块包括本体及形成在所述本体上的第二定位件，所述第二基板组件设置在所述垫块上时，所述第一定位件与所述第二定位件配合。
  8. 根据权利要求1或2所述的深度采集模组，其特征在于，所述垫块与所述第一基板结合的一侧开设有收容腔，所述深度采集模组还包括设置在所述第一基板上的电子元件，所述电子元件收容在所述收容腔内。
  9. 根据权利要求8所述的深度采集模组，其特征在于，所述垫块开设有与至少一个所述收容腔连通的避让通孔，至少一个所述电子元件伸入所述避让通孔内。
  10. 根据权利要求1或2所述的深度采集模组，其特征在于，所述第一基板组件还包括加强板，所述加强板结合在所述第一基板的与所述垫块相背的一侧。
  11. 根据权利要求3所述的深度采集模组，其特征在于，所述深度采集模组还包括连接器，所述连接器连接在所述第一基板上，并用于连接所述第一基板组件及外部设备，所述连接器与所述凸出部分别位于所述第一基板的相背的两端。
  12. 根据权利要求11所述的深度采集模组，其特征在于，所述光发射器与所述光接收器沿一直线排列，所述连接器与所述凸出部分别位于所述直线的相背的两侧。
  13. 一种电子设备，其特征在于，包括机壳及深度采集模组，所述深度采集模组安装在所述机壳上，所述深度采集模组包括：
    第一基板组件，所述第一基板组件包括互相连接的第一基板及柔性电路板；
    垫块，所述垫块设置在所述第一基板上，所述垫块包括伸出所述第一基板的侧边缘的凸出部；
    第一光学器件，所述第一光学器件设置在所述垫块上，所述柔性电路板绕所述凸出部弯折设置，且所述柔性电路板的一端连接所述第一基板，另一端连接所述第一光学器件；及
    第二光学器件，所述第二光学器件设置在所述第一基板上。
  14. 根据权利要求13所述的电子设备，其特征在于，所述凸出部的外侧面为平滑的曲面。
  15. 根据权利要求13或14所述的电子设备，其特征在于，所述第一光学器件为光发射器，所述光发射器用于向外发射光信号，所述第二光学器件为光接收器，所述光接收器用于接收被反射回的所述光发射器发射的光信号。
  16. 根据权利要求15所述的电子设备，其特征在于，所述光发射器包括：
    第二基板组件，所述第二基板组件设置在所述垫块上，所述第二基板组件与所述柔性电路板连接；
    设置在所述第二基板组件上的光源组件，所述光源组件用于发射所述光信号；及
    设置在所述第二基板组件上的外壳，所述外壳形成有收容空间以收容所述光源组件。
  17. 根据权利要求16所述的电子设备，其特征在于，所述第二基板组件包括第二基板及补强件，所述第二基板与所述柔性电路板连接，所述光源组件及所述补强件设置在所述第二基板的相背的两侧。
  18. 根据权利要求17所述的电子设备，其特征在于，所述补强件与所述垫块一体成型；或所述补强件与所述垫块分体成型。
  19. 根据权利要求17所述的电子设备，其特征在于，所述补强件上形成有第一定位件，所述垫块包括本体及形成在所述本体上的第二定位件，所述第二基板组件设置在所述垫块上时，所述第一定位件与所述第二定位件配合。
  20. 根据权利要求13或14所述的电子设备，其特征在于，所述垫块与所述第一基板结合的一侧开设有收容腔，所述深度采集模组还包括设置在所述第一基板上的电子元件，所述电子元件收容在所述收容腔内。
  21. 根据权利要求20所述的电子设备，其特征在于，所述垫块开设有与至少一个所述收容腔连通的避让通孔，至少一个所述电子元件伸入所述避让通孔内。
  22. 根据权利要求13或14所述的电子设备，其特征在于，所述第一基板组件还包括加强板，所述加强板结合在所述第一基板的与所述垫块相背的一侧。
  23. 根据权利要求15所述的电子设备，其特征在于，所述深度采集模组还包括连接器，所述连接器连接在所述第一基板上，并用于连接所述第一基板组件及外部设备，所述连接器与所述凸出部分别位于所述第一基板的相背的两端。
  24. 根据权利要求23所述的电子设备，其特征在于，所述光发射器与所述光接收器沿一直线排列，所述连接器与所述凸出部分别位于所述直线的相背的两侧。
PCT/CN2019/090070 2018-08-22 2019-06-05 深度采集模组及电子设备 Ceased WO2020038057A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201810962803.3A CN109039461A (zh) 2018-08-22 2018-08-22 深度采集模组及电子设备
CN201810962803.3 2018-08-22

Publications (1)

Publication Number Publication Date
WO2020038057A1 true WO2020038057A1 (zh) 2020-02-27

Family

ID=64627966

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/090070 Ceased WO2020038057A1 (zh) 2018-08-22 2019-06-05 深度采集模组及电子设备

Country Status (2)

Country Link
CN (1) CN109039461A (zh)
WO (1) WO2020038057A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109039461A (zh) * 2018-08-22 2018-12-18 Oppo广东移动通信有限公司 深度采集模组及电子设备
CN109737868A (zh) * 2018-12-21 2019-05-10 华为技术有限公司 飞行时间模组及电子设备

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150229912A1 (en) * 2014-02-10 2015-08-13 Microsoft Corporation Vcsel array for a depth camera
CN108174075A (zh) * 2018-02-28 2018-06-15 信利光电股份有限公司 一种tof摄像模组以及电子设备
CN207518758U (zh) * 2017-12-14 2018-06-19 技嘉科技股份有限公司 影像获取装置
CN108390969A (zh) * 2018-04-10 2018-08-10 Oppo广东移动通信有限公司 支架、输入输出组件和终端
CN108769326A (zh) * 2018-08-22 2018-11-06 Oppo广东移动通信有限公司 深度采集模组及移动终端
CN109039461A (zh) * 2018-08-22 2018-12-18 Oppo广东移动通信有限公司 深度采集模组及电子设备
CN109061603A (zh) * 2018-08-22 2018-12-21 Oppo广东移动通信有限公司 深度获取模组及电子装置
CN109164432A (zh) * 2018-09-14 2019-01-08 Oppo广东移动通信有限公司 深度获取模组及电子装置
CN109286806A (zh) * 2018-09-11 2019-01-29 Oppo广东移动通信有限公司 深度采集模组及移动终端

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101932127B1 (ko) * 2012-09-19 2018-12-26 삼성디스플레이 주식회사 표시장치 및 그 제조방법
CN207135351U (zh) * 2017-05-24 2018-03-23 广东欧珀移动通信有限公司 电子元器件支架、电子元器件组件和移动终端
CN207663696U (zh) * 2017-11-17 2018-07-27 南京粤讯电子科技有限公司 显示装置及移动终端
CN207704030U (zh) * 2017-12-08 2018-08-07 余姚舜宇智能光学技术有限公司 一种小型化tof电路模块及tof模组
CN108254968B (zh) * 2017-12-14 2024-04-26 苏州东山精密制造股份有限公司 背光模组
CN108259724A (zh) * 2018-03-13 2018-07-06 欧菲影像技术（广州）有限公司 摄像模组及其支架结构
CN108390971B (zh) * 2018-04-10 2024-04-09 Oppo广东移动通信有限公司 支架、输入输出组件和终端

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150229912A1 (en) * 2014-02-10 2015-08-13 Microsoft Corporation Vcsel array for a depth camera
CN207518758U (zh) * 2017-12-14 2018-06-19 技嘉科技股份有限公司 影像获取装置
CN108174075A (zh) * 2018-02-28 2018-06-15 信利光电股份有限公司 一种tof摄像模组以及电子设备
CN108390969A (zh) * 2018-04-10 2018-08-10 Oppo广东移动通信有限公司 支架、输入输出组件和终端
CN108769326A (zh) * 2018-08-22 2018-11-06 Oppo广东移动通信有限公司 深度采集模组及移动终端
CN109039461A (zh) * 2018-08-22 2018-12-18 Oppo广东移动通信有限公司 深度采集模组及电子设备
CN109061603A (zh) * 2018-08-22 2018-12-21 Oppo广东移动通信有限公司 深度获取模组及电子装置
CN109286806A (zh) * 2018-09-11 2019-01-29 Oppo广东移动通信有限公司 深度采集模组及移动终端
CN109164432A (zh) * 2018-09-14 2019-01-08 Oppo广东移动通信有限公司 深度获取模组及电子装置

Also Published As

Publication number Publication date
CN109039461A (zh) 2018-12-18

Similar Documents

Publication Publication Date Title
WO2020038068A1 (zh) 成像装置及电子设备
TWI737295B (zh) 電子裝置及用於組裝該電子裝置之方法
WO2020038060A1 (zh) 激光投射模组及其控制方法、图像获取设备和电子装置
US11233924B2 (en) Electronic device including camera
CN108769326B (zh) 深度采集模组及移动终端
WO2020125388A1 (zh) 飞行时间模组及电子设备
CN111698494B (zh) 电子装置
CN208489881U (zh) 深度采集模组及移动终端
KR102622558B1 (ko) 거리 검출 센서 모듈을 포함하는 전자 장치
WO2020038053A1 (zh) 飞行时间模组及其控制方法、控制器和电子装置
WO2020038061A1 (zh) 飞行时间模组及其控制方法、控制器和电子装置
CN108873221A (zh) 激光投射装置、tof深度相机和电子设备
WO2020052289A1 (zh) 深度获取模组及电子装置
CN108390969A (zh) 支架、输入输出组件和终端
CN109194781B (zh) 支架、输入输出组件和移动设备
CN108390970B (zh) 支架、输入输出组件和终端
CN108390971B (zh) 支架、输入输出组件和终端
WO2020052288A1 (zh) 深度采集模组及移动终端
WO2020038056A1 (zh) 飞行时间组件及电子设备
CN109061603A (zh) 深度获取模组及电子装置
CN108712533B (zh) 支架结构、输入输出组件和电子装置
WO2020038057A1 (zh) 深度采集模组及电子设备
CN108873222A (zh) 激光投射装置、tof深度相机和电子设备
CN108989507B (zh) 输入输出组件和移动设备
CN110568418A (zh) 光电模组及电子装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19851962

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19851962

Country of ref document: EP

Kind code of ref document: A1