WO2020031478A1 - Compact optical transceiver - Google Patents

Abstract

[Problem] To provide a compact optical transistor. [Solution] An optical transistor which: includes a first substrate 3, a vertical-cavity surface-emitting laser (VCSEL) array 5 provided on the surface of the first substrate 3, and a first multicore fiber (MCF) 7 which is adhered to the rear surface of the first substrate at a position corresponding to the VCSEL array 5, wherein the first substrate 3 is a semiconductor substrate through which light emitted by the VCSEL array 5 passes; and also includes a second substrate 13, a photodetector (PD) array 15 provided on the surface of the second substrate, and a second multicore fiber (MCF) 17 adhered to the rear surface of the second substrate at a position corresponding to the PD array, wherein the second substrate 13 is a semiconductor substrate through which light which is incident on the PD array 15 passes.

Description

Small optical transceiver

<< The present invention relates to a small optical transceiver. More specifically, the present invention relates to an ultra-small optical transceiver in which a laser array and a PD array are directly attached to an end face of a multi-core fiber, and an application example of the transceiver.

(4) With the development of various Internet services, high-performance mobile services, and cloud services, the amount of information flying around data centers has been increasing year by year, and data centers have been increasing in size and capacity. On the other hand, in the future, if all things are connected to the Internet (IoT) and the advanced traffic system (ITS) such as autonomous driving progresses, it is necessary to process such information in a conventional large-scale data center located in the suburbs. A large delay time occurs and becomes a problem. Therefore, small-scale micro data centers are distributed around metro networks, and low-latency edge computing technology is being studied there. As described above, data centers are indispensable to our daily lives, and their high speed, low delay, and low power consumption have become major issues.

(4) Although the network in the data center is basically constructed by Ethernet (registered trademark), its transmission speed continues to increase year by year, and standardization of 400 GbE is stipulated at the end of December 2017. FIG. 1 is a conceptual diagram illustrating a configuration example of a data center network. In the future, as shown in FIG. 1, it is expected that a 25G signal from a server will be converted to 100G by a ToR switch and converted to 400G by a Leaf switch, and large capacity transmission will be performed.

FIG. 2 is a conceptual diagram showing a configuration example of a leaf / spine switch device. As shown in FIG. 2, such a switch device is composed of a plurality of switch ASICs (LSIs). However, the scale of the ASIC is expanding year by year, and the number of optical transceivers that can be accommodated in one ASIC is also increasing. are doing. In addition, with the increase in the scale of the data center (increase in the number of servers), the scale of the switch device itself is also required (increase in the number of ports). However, in current optical transceivers (electrical-optical signal conversion devices), the size of the optical transceiver limits the number of optical transceivers that can be mounted on one switch board.

(4) Further, the wiring between the boards divided in this way is generally connected by an electric cable. However, as the size of the switch increases, the wiring becomes extremely complicated and leads to an increase in the size of the switch device. In addition, wiring between ASIC chips placed on one board also has a serious problem such as an increase in propagation loss with an increase in signal speed. Therefore, research on optical interconnection technology between these boards and between chips is being advanced, but it is difficult to achieve high-density mounting with the current optical transceiver technology.

(3) FIG. 3 is a conceptual diagram showing a configuration example of an optical transceiver for 400 GbE. As shown in FIG. 3, there are many types of optical transceivers for 400 GbE. The 400 GBase-SR 16 is an optical transceiver for short distances within 100 m, and realizes 400 Gb / s transmission by using 25 Gbaud (NRZ) x 16 parallel. Here, 16 multi-mode fibers (MMFs) are used for the input and output optical fibers, each of which is shaped like a ribbon. The light source and the light receiving element are 16 surface emitting laser (VCSEL) arrays (wavelength: 850 nm) and 16 PIN-PD arrays are used. Since MMF has a larger core system than single mode fiber (SMF), lens-free coupling is possible by bringing these optical elements close to MMF.

The 400 GBase-DR4 is an optical transceiver for medium distances within 500 m, and realizes 400 Gb / s transmission using 50 Gbaud $ x PAM4 (four-level multilevel signal) x $ 4 parallel. Here, four SMFs are used for the input and output optical fibers, respectively, a waveguide type laser ray (wavelength: 1.3 um) is generally used for the light source, and a lens array is used for coupling them. Further, an encoder / decoder is required to convert the (0,1) digital data into (0,1,2,3) PAM4 data.

The # 400 GBase-LR8 is an optical transceiver for a long distance of 10 km, and achieves 400 Gb / s transmission with 25 Gbaud x PAM4 x 8 wavelengths. Here, eight different lasers having different wavelengths are used, and these lights are multiplexed by a MUX circuit and transmitted by one SMF. When receiving, the optical signals of each wavelength are separated by a DEMUX circuit, and then received by eight PD arrays.

As described above, although the form of the optical signal differs depending on the type of the optical transceiver, the switch ASIC and the optical transceiver are all shared and exchanged by 25G × 16 parallel electric signals. Further, since the waveform of the electric signal is deteriorated during that time, an identification reproducing IC generally called a retimer is built in.
These optical transceivers are manufactured as small modules conforming to a form factor called CFP8 or QSFP-DD, and as shown in FIG. 4 (a), are detachably mounted on the front (or rear) panel of the switch device. Generally it is. The size of the optical transceiver module is being reduced year by year, but at present, only about 36 modules can be installed even if the front and rear panels are used. Furthermore, at this time, the distance between the optical switch ASIC and the optical transceiver becomes longer, which makes it difficult to transmit a 25G electric signal with a normally used inexpensive PCB. Become.

(4) FIG. 4 is a conceptual diagram showing an example of mounting an optical transceiver. In order to solve the above problem, an On-Board type (also referred to as Mid-Board) optical transceiver as shown in FIG. 4B has been developed. At this time, the retimer placed at the middle point of the board can be deleted, which is advantageous in terms of power consumption and cost. Furthermore, the optical transceiver is connected to the connector on the front panel by an optical fiber, and is connected to another device by an optical fiber via the connector. Since the connectors can be mounted in any number of layers in the height direction of the panel, it is possible to mount as many optical transceivers as the area on the board permits.

(4) Further, as shown in FIG. 4 (c), on-package type (MCM: also referred to as \ Multi-Chip \ Module) optical transceiver has been actively developed in recent years. The optical transceiver is mounted close to the same package as the switch ASIC, and high-speed 25G electrical signals are transmitted only on the high-performance internal board inside the package. As a result, the retimer section of the optical transceiver can be eliminated, and only the opto-electric (OE) conversion section can be mounted, thereby further reducing the size and power consumption. However, achieving this requires the development of extremely small optical transceivers.

Furthermore, as the ultimate goal, the On-Chip type research shown in FIG. Here, the OE converter of the optical transceiver is integrated on a switch ASIC in a monolithic or hybrid manner using silicon photonics technology. As a result, further miniaturization and lower power consumption are expected, but there are many problems to be solved, such as difficulty in laser oscillation due to the generation of huge heat from a large-scale switch ASIC.

Japanese Patent Application Laid-Open No. 2011-193449 describes an MCF transmission system including a network component using a multi-core fiber (MCF).

JP 2011-193449 A

提供 Provide a small optical transceiver.

According to the present invention, an ultra-small optical transceiver (for example, a few mm square) can be achieved by attaching a laser array and a PD array to the end face of a multi-core fiber, and mounting in an ASIC package (MCM) is possible. Based on the finding that it can be applied to optical interconnection between chips and between boards.

The first invention disclosed in this specification relates to the optical transceiver 1. The optical transceiver 1 includes a first substrate 3, a vertical cavity surface emitting laser (VCSEL) array 5 provided on the surface of the first substrate 3, and a VCSEL array 5 on the back surface of the first substrate. And a first multi-core fiber (MCF) 7 bonded to a position corresponding to
The first substrate 3 is a semiconductor substrate that transmits light emitted from the VCSEL array 5.

This optical transceiver is bonded to a second substrate 13, a photodetector (PD) array 15 provided on the front surface of the second substrate, and a position corresponding to the PD array on the back surface of the second substrate. And a second multi-core fiber (MCF) 17. The second substrate 13 is preferably a semiconductor substrate that transmits light incident on the PD array 15. Further, it is preferable that the first and second multi-core fibers 7 and 17 are fixed by the third substrate 19.

The next invention disclosed in this specification relates to a package 21 for a switch application specific integrated circuit (ASIC). The package 21 includes a plurality of optical transceivers described above. The switch ASIC package is configured to include an application specific integrated circuit (ASIC) 23 and a plurality of optical transceivers 1 installed around the ASIC 23.

The following invention disclosed in this specification relates to an optical connection device. Assuming that the specific configuration of the optical connection device includes the first package 21a and the second package 21b, the optical transceivers 1a and 1b of the first package and the second package are connected by a common MCF 25. Then, information can be exchanged between the respective ASICs through a common MCF. Note that the common MCF 25 that is the MCF connecting the two transceivers is usually two (or a plurality of) MCFs.

The following invention disclosed in this specification relates to the switch device 31. The switch device 31 is configured such that the first optical transceiver of the first package 21a of the plurality of packages 21 is connected to the optical transceiver of the second package 21b by a common MCF 35, and the first package is transmitted through the common MCF 35. Information is exchanged between the ASIC of the second package and the ASIC of the second package, and the second optical transceiver of the first package is connected to the external device 37. The common MCF 35 which is the MCF connecting the two transceivers is usually two (or a plurality of) MCFs.

The following invention disclosed in this specification relates to a network in a data center. The network 41 in the data center is a network including the switch device 31 described above. The external device 37 is a server, and the server is connected to one of the cores of the MCF via a single mode fiber.

According to the present invention and its preferred embodiments, it is possible to provide an ultra-small on-package type optical transceiver of several mm square having low power consumption, low cost, and long-distance transmission capability.

FIG. 1 is a conceptual diagram showing a configuration example of a data center network (conventional example). FIG. 2 is a conceptual diagram showing a configuration example of a leaf / spine switch device (conventional example). FIG. 3 is a conceptual diagram showing a configuration example of an optical transceiver for 400 GbE (conventional example). FIG. 4 is a conceptual diagram showing an implementation example of an optical transceiver (reference example). FIG. 5 is a conceptual diagram showing a configuration example of the optical transceiver of the present invention. FIG. 6 is a conceptual diagram showing a switch-specific integrated circuit package of the present invention. FIG. 7 is a conceptual diagram for explaining the optical connection device of the present invention. FIG. 8 is a conceptual diagram for explaining the switch device of the present invention. FIG. 9 is a conceptual diagram showing a configuration example of a micro optical transceiver using the MCF of the present invention. FIG. 10 is a conceptual diagram showing another configuration example of the microminiature optical transceiver using the MCF of the present invention. FIG. 11 is a conceptual diagram showing an example in which the micro optical transceiver of the present invention is applied to an optical interconnection between chips. FIG. 12 is a conceptual diagram showing an example in which the micro optical transceiver according to the present invention is applied to an ultra multi-port switch device. FIG. 13 is a conceptual diagram showing an example in which the super multi-port switch device of FIG. 12 is applied to a micro data center.

Hereinafter, embodiments for implementing the present invention will be described with reference to the drawings. The present invention is not limited to the embodiments described below, but includes those appropriately modified by those skilled in the art from the following embodiments.

Optical Transceiver FIG. 5 is a conceptual diagram showing a configuration example of an optical transceiver. As shown in FIG. 5, the optical transceiver 1 comprises a first substrate 3, a vertical cavity surface emitting laser (VCSEL) array 5 provided on the surface of the first substrate 3, and a first substrate 3. And a first multi-core fiber (MCF) 7 bonded to a position corresponding to the VCSEL array 5. The optical transceiver (or optical transceiver module) is preferably small. An example of the shape of the optical transceiver is a square or a rectangle. The size of the optical transceiver may be appropriately adjusted according to the application. A specific side (the long side in the rectangle) is, for example, 0.5 mm or more It may be adjusted within a range of 7 mm or less.

The optical transceiver is a known device as described in, for example, Japanese Patent No. 6350308 and Japanese Patent No. 6170527. What is necessary is just to employ | adopt what is used for an optical transceiver as a board | substrate, However, In this specification, the 1st board | substrate 3 is a semiconductor substrate which permeate | transmits the light radiate | emitted from the VCSEL array 5. FIG. The surface of the first substrate 3 is one surface of the first substrate on which the VCSEL array 5 is provided. The back surface of the first substrate means a surface opposite to the surface on which the VCSEL array 5 is provided. The first multi-core fiber (MCF) 7 is bonded to the back surface of the first substrate at a position corresponding to the VCSEL array 5. The position corresponding to the VCSEL array 5 means that each core included in the MCF is located at a position where it can exchange light with the VCSEL included in the VCSEL array 5 via the first substrate. Means The VCSEL array 5 preferably has a VCSEL at a position similar to the position of the core of the multi-core fiber. However, corresponding VCSELs do not need to exist for all the cores of the multi-core fiber. Some cores of the multi-core fiber may be used for detection and other uses, not for communications. The multi-core fiber may adopt a layer configuration such as a central core, a first layer around the core, and a second layer around the first layer.

This optical transceiver is bonded to a second substrate 13, a photodetector (PD) array 15 provided on the front surface of the second substrate, and a position corresponding to the PD array on the back surface of the second substrate. And a second multi-core fiber (MCF) 17.
The second substrate 13 is preferably a semiconductor substrate that transmits light incident on the PD array 15. The second substrate 13 may be the same as the first substrate 3. Further, the first substrate 3 and the second substrate 13 do not need to be separate substrates, and one substrate may serve as both the first substrate 3 and the second substrate 13. The photodetector (PD) array 15 is provided in the same direction as the VCSEL array 5. The second multi-core fiber (MCF) 17 is provided in the same direction as the first MCF 17.

It is preferable that the first and second multi-core fibers 7 and 17 are fixed by the third substrate 19. An example of the third substrate 19 is a V-groove substrate, and a glass V-groove substrate can be preferably used. By setting the first and second multi-core fibers 7 and 17 in the grooves of the V-groove substrate, alignment can be easily achieved.

In the example shown in FIG. 5, each light emitted from the VCSEL array 5 passes through the first substrate 3 and enters the corresponding core of the first MCF 7. Then, the light propagates to another optical element via the first MCF 7. On the other hand, light passing through each core of the second MCF 17 passes through the second substrate 13 and is received by the corresponding PD in the PD array 15.

Switch Specific Application Integrated Circuit (ASIC) Package FIG. 6 is a conceptual diagram showing a switch specific application integrated circuit package. As shown in FIG. 6, this package 21 includes a plurality of optical transceivers 1 described above. The switch ASIC package is configured to include an application specific integrated circuit (ASIC) 23 and a plurality of optical transceivers 1 installed around the ASIC 23. The ASIC 23 is connected so that information can be exchanged with each optical transceiver 1. In the example of FIG. 6, an ASIC is installed on the interior substrate, and wiring is performed with each transceiver 1. Each transceiver can be connected to elements other than the ASIC. The switch specific application integrated circuit package is an ASIC (application specific integrated circuit) chip (communication component / communication element) used for the switch device.

Optical Connection Device FIG. 7 is a conceptual diagram for explaining the optical connection device. The optical connection device shown in FIG. 7 includes a first package 21a and a second package 21b. The optical transceiver 1a of the first package and the optical transceiver 1b of the second package are connected by a common MCF 25 so that information can be exchanged through the common MCF. Note that the common MCF 25 that is the MCF connecting the two transceivers is usually two (or a plurality of) MCFs. The same applies to other packages in this optical connection device.

Switch Device FIG. 8 is a conceptual diagram for explaining the switch device. As shown in FIG. 8, the switch device 31 includes a plurality of packages 21a and 21b, and one of the packages is connected so as to be able to exchange information with an external device 37. In the example of FIG. 8, the first optical transceiver of the first package 21a among the plurality of packages 21 is connected to the optical transceiver of the second package 21b by the common MCF 35. Then, information can be exchanged between the ASICs of the first package and the ASIC of the second package through the common MCF 35. The common MCF 35 which is the MCF connecting the two transceivers is usually two (or a plurality of) MCFs.
The second optical transceiver of the first package (the transceiver that is not connected to the optical transceiver of the second package) is connected to the external device 37. Then, the external device 37 and the first package can exchange information.

Network in Data Center This network in the data center is a network including the switch device 31 described above (see FIG. 8). In the data center network, the external device 37 in FIG. 8 is a server, and the single mode fiber connected to the server is connected to one of the cores of the MCF via a fan-in / out device. is there. The data center is a facility for installing and operating a computer network such as a server computer for providing functions and services to the outside.

Hereinafter, the present invention will be specifically described with reference to examples. The present invention is not limited to the following embodiments, but also includes those employing known configurations and known conditions as appropriate.

FIG. 9 is a conceptual diagram showing a configuration example of a micro optical transceiver using an MCF. FIG. 9A is a conceptual diagram illustrating a configuration example of an optical transceiver. The first point of this transceiver is to use a multi-core fiber (MCF) in which a plurality of cores are integrated into one optical fiber, instead of using a ribbon fiber as in the related art. FIG. 9B is a conceptual diagram showing a cross-sectional view of the multi-core fiber. As shown in FIG. 9B, for example, in a 19-core MCF, 19 single-mode cores having a diameter of 10 μm are covered with a cladding having a diameter of 250 μm to form one optical fiber.

The second point of this optical transceiver is that the back surface of the VCSEL and PD array substrate is directly attached to the end faces of two MCFs fixed with glass substrates or the like in V-grooves. FIG. 9C is a conceptual diagram showing an example of the arrangement of a PD or VCSEL array. The element arrangement of the PD and VCSEL arrays is made to match the core arrangement of the MCF. As shown in FIG. 9C, for example, to perform 400 Gb / s optical transmission using a 19-core MCF, 16 cores may be used at 25 Gb / s per core, and the remaining cores may be used. The part can be used for monitoring. FIG. 9D is a conceptual diagram showing a connection example between a PD or VCSEL array and a CMOS circuit. As shown in FIG. 9D, a CMOS circuit (a TIA for amplifying and identifying the PD output) is used by not using the device at the position corresponding to the center of the MCF but using the device as the ground terminal of the electric wiring. It can be directly flip-chip bonded onto a limiting amplifier, a driver amplifier for driving a VCSEL, etc.). These components are packaged as a small module as shown in FIG. 9A to protect the strength of the joint, and are mounted on an internal board in a switch ASIC package.

FIG. 10 is a conceptual diagram showing another example of the configuration of the micro optical transceiver using the MCF. A switch package is provided on the printed wiring board. A package interior substrate is provided on the upper part, a switch ASIC, various amplifiers and drivers are provided, and an optical transceiver is formed on the amplifier. As shown in FIG. 10, by exposing the CMOS circuit portion to the outside of the module, the module in the PD / VCSEL array portion can be significantly reduced in size.

The purpose of this ultra-small optical transceiver is not an existing pluggable module type, but an on-package type optical transceiver that is installed near the switch ASIC, eliminating the need for all regeneration ICs such as retimers. Contributes to low power consumption and miniaturization.

(2) This optical transceiver can be realized as an extremely small optical transceiver by directly attaching a PD / VCSEL array with high density integration to the end face of the MCF without using a lens array. In particular, further miniaturization is possible by separating the CMOS circuit for driving the PD / VCSEL outside the module.

With this optical transceiver, for example, 400 Gb / s optical transmission can be realized by using 16 cores with a 25 Gb / s non-return to zero (NRZ) signal. That is, it is not necessary to use a ribbon fiber such as SR16 or DR4 of the conventional optical transceiver shown in FIG. 3, and the fiber wiring becomes easy. Furthermore, there is no need to use the 50 Gbaud high-speed signal used in DR4, and there is no need to use PAM4 such as DR4 or LR8 as the modulation format, and the simplest NRZ can be used. It becomes unnecessary. Further, since it is not necessary to use wavelength multiplexing unlike the LR8, a MUX / DEMUX circuit is not required, and the wavelength fluctuation of the VCSEL array with respect to the temperature is greatly allowed, and the temperature control by a Peltier or the like is not required. In addition, the MCF core used is single-mode, similar to DR4 and LR8, so that long-distance transmission is possible.

As described above, this optical transceiver does not require a retimer, a lens array, a DSP, a temperature control, a MUX / DEMUX circuit, and the like, so that significant miniaturization, low power consumption, and low cost can be achieved.

Next, an application example of the optical transceiver will be described.
The size of switch ASICs is increasing year by year, and it is expected that throughput exceeding 25 Tb / s will be realized on a single chip in the near future. At that time, one switch ASIC can accommodate 32 ports of a 400G optical transceiver, but it is extremely difficult to mount the conventional pluggable module type. The microminiature optical transceiver disclosed in this specification is extremely small, so that a large number of optical transceivers can be mounted on-package.

Further, as described above with reference to FIG. 2, a leaf / spine (Leaf / Spine) switch device in a data center network is composed of many switch ASICs. However, the mounting density of a conventional pluggable module type optical transceiver is limited. Therefore, it is necessary to divide the switch board into a plurality of switch boards. Therefore, it is necessary to connect a switch ASIC between the boards, which is a major problem. Furthermore, when the signal speed becomes as high as 400G, electrical wiring becomes extremely difficult even between ASICs on the same board.

FIG. 11 is a conceptual diagram showing an example of application of a micro optical transceiver to optical interconnection between chips. As shown in FIG. 11, when an ultra-small optical transceiver (on-package type) is used, optical connection between ASICs can be realized very easily, and all the indispensable retimers between remote ASICs are unnecessary. , Which contributes to lower power consumption.

FIG. 12 is a conceptual diagram showing an example in which a micro optical transceiver is applied to a super multi-port switch device. As shown in Fig. 12, the use of an ultra-small optical transceiver makes it possible to mount a large number of optical transceivers on a switch ASIC package at a high density, and to use it for optical connection between ASICs. Therefore, it is possible to realize a compact super multi-port switch device in which many switch ASICs are mounted on one board.

FIG. 13 is a conceptual diagram showing an example in which the super multi-port switch device of FIG. 12 is applied to a micro data center. As shown in FIG. 13, this switch device is composed of 16 switch ASICs, and each ASIC is mounted with 32 optical transceivers of the present invention (16 of which are for chip-to-chip connection). It is assumed that 16 optical transceivers are connected by a 25-core 16-core MCF (400 G in total). The MCF for external connection is equipped with a fan-out connector, and one MCF is separated into 16 SMFs, each connected to a different server.

Conventional optical transceivers (DR4, LR8, etc.) convert input 400G electrical signals (25G, 16 parallel electrical signals) into various format conversions (NRZ → PAM4, 25G → 50G, 8λ WDM), It is output as an optical signal. In other words, 16 parallel signals of 25G are regarded as one block, and the independence of 16 parallel signals is not guaranteed. However, ultra-small optical transceivers convert OE conversion of the input 16 parallel 25G electrical signals as they are, and can treat each of the 16 25G electrical signals as an independent different signal. Therefore, a 25G optical path is formed between arbitrary servers, and the signal output from the server is transferred to the destination server while maintaining the 25G signal form. At this time, the single switch device can be expanded to 16 × 16 × 16 = 4096 servers. In other words, if it is a general micro data center of the order of one thousand, a network can be constructed with one switch device.

(1) Further, as described with reference to FIG. 1, in a network in a data center, signals output from a server are generally collected by a leaf switch and transferred while converting the speed. Therefore, the input signal needs to be temporarily stored in the buffer of the switch device (Store @ & @ Forward), which causes a large delay time. In a large data center of several hundred thousand units, this method is reasonable to guarantee data transfer between a large number of servers, but in a micro data center of 1,000 units, it is extremely inefficient. . In a micro data center, high-speed signal processing related to automatic driving and the like is required, and low-delay communication between servers is indispensable. For this, cut-through operation (switch signals are stored in a buffer) in a switch device Do not transfer them as is). When this switch device is used, the signal can be transferred in the same signal form without any signal speed conversion or format conversion between servers, making it ideal for cut-through operation and a network with extremely low delay. Can be constructed.

The present invention can be used in the field of optical information communication.

Reference Signs List 1 optical transceiver 3 first substrate 5 vertical cavity surface emitting laser array 7 first multi-core fiber 13 second substrate 15 photodetector array 17 second multi-core fiber 19 third substrate

Claims (6)

A first substrate (3), a vertical cavity surface emitting laser (VCSEL) array (5) provided on the surface of the first substrate (3), and the VCSEL array on the back surface of the first substrate; An optical transceiver (1) including a first multi-core fiber (MCF) (7) bonded to a position corresponding to (5),
An optical transceiver, wherein the first substrate (3) is a semiconductor substrate that transmits light emitted from the VCSEL array (5). The optical transceiver according to claim 1, wherein
A second substrate (13), a photodetector (PD) array (15) provided on the front surface of the second substrate, and a photo-detector (PD) array adhered to the back surface of the second substrate at a position corresponding to the PD array; A second multi-core fiber (MCF) (17),
The second substrate (13) is a semiconductor substrate that transmits light incident on the PD array (15),
The first and second multi-core fibers (7, 17) are fixed by a third substrate (19).
Optical transceiver. A package (21) for a switch application specific integrated circuit (ASIC) comprising a plurality of optical transceivers (1) according to claim 2, wherein:
The switch ASIC package includes an application specific integrated circuit (ASIC) (23) and a plurality of the optical transceivers (1) installed around the ASIC (23). An optical connection device comprising a first package (21a) and a second package (21b), each of which is the package according to claim 3.
An optical connection device in which the optical transceivers (1a, 1b) of the first package and the second package are connected by a common MCF (25). A switching device (31) comprising a plurality of packages (21) according to claim 3, wherein:
The first optical transceiver of the first package (21a) of the plurality of packages (21) is connected to the optical transceiver of the second package (21b) by a common MCF (35),
Information is exchanged between the ASICs of the first package and the second package through the common MCF (35),
A switch device, wherein the second optical transceiver of the first package is connected to an external device (37). A network in a data center including the switch device (31) according to claim 5,
The external device (37) is a server,
Data center network.

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