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WO2020008693A1 - Pâte de cuivre et procédé de formation de film conducteur - Google Patents

Pâte de cuivre et procédé de formation de film conducteur Download PDF

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Publication number
WO2020008693A1
WO2020008693A1 PCT/JP2019/014118 JP2019014118W WO2020008693A1 WO 2020008693 A1 WO2020008693 A1 WO 2020008693A1 JP 2019014118 W JP2019014118 W JP 2019014118W WO 2020008693 A1 WO2020008693 A1 WO 2020008693A1
Authority
WO
WIPO (PCT)
Prior art keywords
copper
copper paste
fine particles
resin
paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2019/014118
Other languages
English (en)
Japanese (ja)
Inventor
祐一 川戸
聡 南原
英俊 有村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ishihara Chemical Co Ltd
Original Assignee
Ishihara Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ishihara Chemical Co Ltd filed Critical Ishihara Chemical Co Ltd
Publication of WO2020008693A1 publication Critical patent/WO2020008693A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/12—Stencil printing; Silk-screen printing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns

Definitions

  • the present invention relates to a copper paste suitable for screen offset printing and screen pad printing, and a conductive film forming method for forming a conductive film using the copper paste.
  • Printing techniques include screen offset printing (see Patent Document 1) and screen pad printing (see Patent Document 2). Then, a method is known in which a conductive paste is printed on a base material by screen offset printing or screen pad printing, and the printed conductive paste is baked to form a conductive film on the base material (for example, a patent is known). Reference 3).
  • the conductive paste contains conductive particles, a binder resin, and an organic solvent.
  • the conductive particles are metal particles such as silver and copper. Copper is less expensive than silver. In the case where the conductive particles are copper particles (copper paste), it has been confirmed that the mixing is performed for those having a center particle diameter (d50) of 5 ⁇ m and 0.5 ⁇ m (see Tables 2 and 3 of Patent Document 1).
  • the ratio of the binder resin is about 5 to 30% by volume, preferably about 7 to 25% by volume, and more preferably about 10 to 20% by volume, based on the whole conductive paste (see paragraph [0055] of Patent Document 1). ]reference). If the proportion of the binder resin is too small, the film is broken and cannot be transferred when the film of the conductive paste is transferred onto the substrate in screen offset printing or the like.
  • the binder resin contained in the conductive paste has a problem of increasing the electric resistance of the formed conductive film.
  • the present invention is to solve the above problem, in a copper paste for forming a conductive film by firing, while printing on the substrate by screen offset printing or screen pad printing, the amount of resin contained The purpose is to reduce.
  • the copper paste of the present invention has copper fine particles, a dispersion medium containing the copper fine particles, a dispersant for dispersing the copper fine particles in the dispersion medium, and a resin, wherein the copper fine particles are
  • the dispersion medium contains an organic solvent having a hydroxy group, and the resin is a resin soluble in the organic solvent, and has a median diameter of 10 nm or more and 100 nm or less. % By weight or less.
  • the organic solvent is preferably an alcohol or an alcohol derivative
  • the resin is preferably a resin soluble in the alcohol or the alcohol derivative.
  • the resin is preferably an acrylic resin.
  • the conductive film forming method of the present invention is a method of forming a conductive film on a substrate, a step of forming a copper paste film on a blanket by screen printing using the copper paste, The method includes a step of transferring from a blanket onto a substrate and a step of baking the copper paste film transferred onto the substrate to form a conductive film.
  • the particle size includes small copper particles
  • the hydrogen bonding between the copper particles and the organic solvent improves the rheological properties required for screen offset printing or screen pad printing.
  • the amount of resin is reduced.
  • the copper paste has copper fine particles, a dispersion medium containing the copper fine particles, a dispersant, and a resin.
  • the dispersant disperses copper fine particles in a dispersion medium.
  • Copper fine particles are copper fine particles, and include those having a median diameter (d50) of 10 nm or more and 100 nm or less.
  • the dispersion medium contains an organic solvent having a hydroxy group.
  • the resin is a resin soluble in the organic solvent, and accounts for 2% by weight or more and 4% by weight or less based on the entire copper paste.
  • the organic solvent contained in the dispersion medium is an alcohol or an alcohol derivative.
  • the alcohol derivative is, for example, acetate.
  • the resin is a resin that is soluble in the alcohol or alcohol derivative.
  • the resin is an acrylic resin.
  • This copper paste is a conductive paste containing copper fine particles as conductive particles, and is suitable for screen offset printing and screen pad printing.
  • a copper paste pattern is formed on a blanket by screen printing, and the pattern is transferred from the blanket onto a substrate to be printed.
  • the blanket is a transfer body having high smoothness and absorbing a dispersion medium in the copper paste to some extent.
  • a copper paste pattern is formed on a blanket by screen printing, and the pattern is transferred (pad printed) from the blanket onto a substrate to be printed.
  • the blanket has a cushion layer and a surface layer made of silicone rubber.
  • the surface layer has high smoothness and absorbs the dispersion medium in the copper paste to some extent.
  • the copper fine particles may have the same median diameter alone or may be a mixture of two or more median diameters.
  • the concentration of the copper fine particles is set to a value at which a sufficient amount of copper fine particles for forming a conductive film is obtained.
  • Resin is also called a binder resin, when copper paste is used for screen offset printing or screen pad printing, in order to prevent the copper paste film from being broken when transferring the copper paste pattern from the blanket to the base material, Is added to adjust the rheological properties (viscoelasticity) of the copper paste so as to be suitable for screen offset printing or screen pad printing.
  • the copper fine particles are dispersed in the dispersion medium because the surface is covered with the dispersant molecules.
  • the dispersion medium contains an organic solvent having a hydroxy group. For this reason, in the copper paste, a hydrogen bond is generated between the oxygen atom of the copper oxide of the surface oxide film and the hydrogen atom of the hydroxy group of the organic solvent.
  • the particle size of the copper fine particles is small, the influence of hydrogen bonding in each copper fine particle increases.
  • the median diameter of the copper fine particles is 10 nm or more and 100 nm or less, appropriate hydrogen bonding occurs.
  • the copper paste contains copper fine particles having a small particle size
  • the rheological properties required for screen offset printing or screen pad printing are improved by hydrogen bonding between the copper fine particles and the organic solvent, and the resin is made of resin. Is reduced.
  • the electric resistance of the conductive film formed by firing the copper paste is reduced.
  • the copper fine particles having a small particle diameter reduce the gap between the copper fine particles, and further reduce the electric resistance of the formed conductive film.
  • This conductive film forming method is a method of forming a conductive film on a base material. First, a copper paste film is formed on a blanket by screen printing using a copper paste. Next, the copper paste film is transferred from the blanket onto the substrate. Next, the copper paste film transferred onto the base material is fired to form a conductive film.
  • a copper paste film is formed on a substrate by screen offset printing or screen pad printing using a copper paste, and the copper paste film is fired to form a conductive film.
  • the base material is formed by molding an insulator, has a printable surface by screen offset printing or screen pad printing, and is, for example, a flexible substrate or a rigid substrate.
  • the sintering of the copper paste film is thermal sintering and is performed under a reducing atmosphere or an inert atmosphere. Since the copper paste contains fine copper particles having a small particle diameter, the temperature required for firing is lower and the time is shorter than in the case where a conventional conductive paste is used. Since the amount of the resin contained in the copper paste is small, the electric resistance of the formed conductive film is low.
  • a copper paste as an example of the present invention and a copper paste for comparison were prepared, and screen pad printing on a substrate and firing of the printed copper paste were attempted.
  • a three-dimensionally molded LCP (liquid crystal polymer) was used as a substrate.
  • the copper paste was prepared by the following method. The dispersion medium, dispersant, and resin measured at a predetermined concentration were kneaded by a rotation orbit mixer or a three-roll mill while gradually adding copper fine particles, and then mixed and stabilized by a disperser such as a disper or a mill. . Copper fine particles having two types of median diameters were used. Copper fine particles having a small particle diameter are main copper fine particles for generating a hydrogen bond with a hydroxy group.
  • Copper fine particles having a large particle size are secondary copper fine particles for increasing the thickness of a conductive film formed after firing.
  • the copper fine particles had a median diameter of 40-50 nm for small copper particles, 26.0% by weight based on the entire copper paste (hereinafter, the same applies in terms of% by weight), and copper fine particles of large diameters had a median diameter of 1 ⁇ m and 55. It was 2% by weight.
  • the ratio of the copper fine particles in the copper paste is 81.2% by weight in total.
  • As a dispersion medium an alcohol (hexylene glycol, 1.8% by weight) not absorbed by the blanket for screen pad printing and an alcohol (tripropylene glycol mono-n-butyl ether, 7.2% by weight) absorbed by the blanket are mixed. It was used.
  • a phosphate ester trade name "DISPERBYK (registered trademark) -111", manufactured by Big Chemie, 6.5% by weight
  • the resin was an acrylic resin and was 3.3% by weight.
  • a copper paste film was formed on a blanket by screen printing using the produced copper paste, and the copper paste film was transferred (pad printed) from the blanket onto a substrate. Screen pad printing was possible even when the resin was 3.3% by weight. Then, the copper paste film transferred onto the substrate was fired in a formic acid atmosphere (reducing atmosphere). The firing temperature was 200 ° C., the heating rate was 250 ° C./min, and the firing time was 10 minutes. Firing of the copper paste was possible.
  • the copper fine particles of the copper paste were such that the copper fine particles having a small particle diameter were 40-50 nm and 55.2% by weight, and the copper fine particles having a large particle diameter were 1 ⁇ m and 26.0% by weight.
  • the ratio of the copper fine particles in the copper paste is 81.2% by weight in total. That is, unlike Example 1, the ratio of the fine copper particles having a small particle diameter was larger than the ratio of the fine copper particles having a large particle diameter.
  • Example 1 As a dispersion medium, an alcohol that is not absorbed by a blanket for screen pad printing (manufactured by Nippon Terpen Chemical Co., Ltd., trade name “Telsolve MTPH”, 2.4% by weight) and an alcohol derivative (alcohol acetate) that is absorbed by the blanket (Nippon Terpene) (Trade name: “Telsolve THA-90”, manufactured by Chemical Co., Ltd., 9.8% by weight).
  • the same phosphoric acid ester as in Example 1 was used in an amount of 3.3% by weight, which was smaller than that in Example 1. This is because the ratio of the copper fine particles having a small particle diameter is larger than that in Example 1.
  • the resin was the same as in Example 1.
  • a copper paste film was formed on a blanket by screen printing using the prepared copper paste, and the copper paste film was transferred (pad printed) from the blanket onto a substrate. Screen pad printing was possible. Then, the copper paste film transferred onto the substrate was fired in a formic acid atmosphere. The firing temperature, heating rate, and firing time were the same as in Example 1. Firing of the copper paste was possible.
  • the formed conductive film had a thickness of 15 ⁇ m and an electric resistivity of 7.5 ⁇ cm. This result was the best among Examples 1 to 5.
  • the copper fine particles of the copper paste were the same as those in Example 2 with the fine copper particles having a small particle diameter, and the copper fine particles having a large particle diameter were 500 nm in median diameter and 26.0% by weight.
  • the ratio of the copper fine particles in the copper paste is 81.2% by weight in total.
  • As a dispersion medium an alcohol (hexylene glycol, 2.4% by weight) not absorbed by the blanket for screen pad printing and an alcohol (tripropylene glycol mono-n-butyl ether, 9.8% by weight) absorbed by the blanket are mixed. It was used.
  • the dispersant and resin were the same as in Example 2.
  • a copper paste film was formed on a blanket by screen printing using the prepared copper paste, and the copper paste film was transferred (pad printed) from the blanket onto a substrate. Screen pad printing was possible. Then, the copper paste film transferred onto the substrate was fired in a formic acid atmosphere. The firing temperature, heating rate, and firing time were the same as in Example 2. Firing of the copper paste was possible. Note that the formed conductive film was thinner than that in Example 2.
  • the copper fine particles of the copper paste were such that the copper fine particles having a small particle diameter were 40-50 nm and 55.9% by weight, and the copper fine particles having a large particle diameter were 1 ⁇ m and 26.3% by weight.
  • the ratio of the copper fine particles in the copper paste is 82.3% by weight in total.
  • As a dispersion medium the same alcohol (2.4% by weight) as in Example 2 and the same alcohol derivative (9.9% by weight) as in Example 2 were mixed and used.
  • the dispersant was the same as in Example 2.
  • the resin was the same acrylic resin as in Example 2, and was reduced to 2.0% by weight.
  • a copper paste film was formed on a blanket by screen printing using the prepared copper paste, and the copper paste film was transferred (pad printed) from the blanket onto a substrate. Even when the resin was reduced to 2.0% by weight, screen pad printing was possible. Then, the copper paste film transferred onto the substrate was fired in a formic acid atmosphere. The firing temperature, heating rate, and firing time were the same as in Example 2. Firing of the copper paste was possible.
  • the copper fine particles of the copper paste were such that the fine copper particles had a median diameter of 40-50 nm, 54.8% by weight, and the fine copper particles had a median diameter of 1 ⁇ m, 25.8% by weight.
  • the ratio of the copper fine particles in the copper paste is 80.6% by weight in total.
  • As a dispersion medium the same alcohol (2.4% by weight) as in Example 2 and the same alcohol derivative (9.7% by weight) as in Example 2 were mixed and used.
  • the dispersant was the same as in Example 2.
  • the resin was the same acrylic resin as in Example 2 and was 4.0% by weight.
  • a copper paste film was formed on a blanket by screen printing using the prepared copper paste, and the copper paste film was transferred (pad printed) from the blanket onto a substrate. Screen pad printing was possible. Then, the copper paste film transferred onto the substrate was fired in a formic acid atmosphere. The firing temperature, heating rate, and firing time were the same as in Example 2. Firing of the copper paste was possible.
  • a base material was prepared by using a copper paste having copper fine particles having a small particle size and having a resin (binder resin) amount of 4% by weight or less, which is smaller than that of a conventional conductive paste.
  • a conductive film could be formed thereon. Further, the copper paste could be fired at a lower temperature than the conventional conductive paste.
  • Example 1 A copper paste was prepared in which the resin was completely omitted.
  • the copper fine particles of the copper paste were 56.4% by weight with a median diameter of 40-50 nm, and 26.6% by weight with a median diameter of 1 ⁇ m.
  • the ratio of the copper fine particles in the copper paste is 83.0% by weight in total.
  • the same alcohol (6.8% by weight) as in Example 2 and the same alcohol derivative (6.8% by weight) as in Example 2 were mixed and used.
  • the dispersant was the same as in Example 2.
  • a copper paste film was formed on a blanket by screen printing using the prepared copper paste, but the copper paste film could not be transferred from the blanket onto the substrate. That is, if the resin was completely omitted from the copper paste, screen pad printing could not be performed.
  • Example 2 Contrary to Comparative Example 1, a copper paste was prepared in which the amount of resin was larger than in Examples 1 to 5.
  • the copper fine particles of the copper paste small-sized copper fine particles had a median diameter of 40-50 nm and 53.5% by weight, and large-sized copper fine particles had a median diameter of 1 ⁇ m and 25.2% by weight.
  • the ratio of the copper fine particles in the copper paste is 78.7% by weight in total.
  • the same alcohol (2.4% by weight) as in Example 2 and the same alcohol derivative (9.5% by weight) as in Example 2 were mixed and used.
  • the same dispersant as in Example 2 was used at 3.1% by weight.
  • the resin was the same acrylic resin as in Example 2, and was 6.3% by weight.
  • a copper paste film was formed on a blanket by screen printing using the prepared copper paste, and the copper paste film was transferred (pad printed) from the blanket onto a substrate. Screen pad printing was possible. Then, the copper paste film transferred onto the substrate was fired in a formic acid atmosphere.
  • the firing temperature, heating rate, and firing time were the same as in Example 2. However, the electrical resistivity of the film formed by firing was higher than that of the example.
  • a copper paste was prepared in which the amount of the resin was significantly smaller than that of the example.
  • the copper fine particles of the copper paste the copper fine particles having a small particle diameter were 40-50 nm and 56.2% by weight, and the copper fine particles having a large particle diameter were 1 ⁇ m and 26.5% by weight.
  • the ratio of the copper fine particles in the copper paste is 82.7% by weight in total.
  • the same alcohol (2.5% by weight) as in Example 2 and the same alcohol derivative (10.0% by weight) as in Example 2 were mixed and used.
  • the dispersant was the same as in Example 2.
  • the resin was the same acrylic resin as in Example 2 and was 1.6% by weight.
  • a copper paste film was formed on a blanket by screen printing using the prepared copper paste, but the copper paste film could not be transferred from the blanket onto the substrate.
  • Example 4 A copper paste from which copper fine particles having a small particle size were omitted was prepared.
  • the copper fine particles of the copper paste were a mixture of large fine copper particles having a median diameter of 500 nm and 55.2% by weight and a median diameter of 1 ⁇ m and 26.0% by weight.
  • the ratio of the copper fine particles in the copper paste is 81.2% by weight in total.
  • the dispersion medium, dispersant and resin were the same as in Example 3.
  • a copper paste film was formed on a blanket by screen printing using the prepared copper paste, but the copper paste film could not be transferred from the blanket onto the substrate.
  • Comparative Example 5 Another copper paste was prepared without copper fine particles.
  • copper fine particles of the copper paste copper fine particles having a large particle diameter were 1 ⁇ m in median diameter and 85.0% by weight.
  • a dispersion medium the same alcohol (1.6% by weight) as in Comparative Example 4 and the same alcohol derivative (6.6% by weight) as in Comparative Example 4 were mixed and used.
  • the same dispersant as in Comparative Example 4 was used at 3.4% by weight.
  • the resin was the same acrylic resin as in Comparative Example 4, and was 3.4% by weight.
  • a copper paste film was formed on a blanket by screen printing using the prepared copper paste, but the copper paste film could not be transferred from the blanket onto the substrate.
  • the present invention is not limited to the configuration of the above embodiment, and various modifications can be made without departing from the spirit of the invention.
  • the proportions of alcohol and the like not absorbed by the blanket for screen pad printing and alcohol and the like absorbed by the blanket are appropriately adjusted according to the absorbency of the blanket.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Conductive Materials (AREA)
  • Printing Methods (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Electric Cables (AREA)

Abstract

Dans la pâte de cuivre formant un film conducteur lors de la cuisson, l'impression sur un substrat par impression offset à l'écran ou impression de pavé d'écran peut être effectuée et la teneur en résine dans celle-ci est réduite. La pâte de cuivre a des particules fines de cuivre, un milieu de dispersion qui contient les fines particules de cuivre, un agent de dispersion qui amène les fines particules de cuivre à être dispersées dans le milieu de dispersion, et une résine. Les fines particules de cuivre comprennent des particules fines de cuivre ayant un diamètre médian de 10 à 100 nm. Le milieu de dispersion comprend un solvant organique contenant un groupe hydroxy. La résine se dissout dans ce solvant organique, et est contenue à 1-4 % en masse par rapport à la pâte de cuivre globale. Ainsi, les propriétés rhéologiques de la pâte de cuivre sont améliorées par liaison hydrogène entre les fines particules de cuivre et le solvant organique.
PCT/JP2019/014118 2018-07-04 2019-03-29 Pâte de cuivre et procédé de formation de film conducteur Ceased WO2020008693A1 (fr)

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JP2018127252A JP6544840B1 (ja) 2018-07-04 2018-07-04 銅ペースト及び導電膜形成方法
JP2018-127252 2018-07-04

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Cited By (1)

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CN115298269A (zh) * 2020-03-25 2022-11-04 日本石原化学株式会社 用于形成导电膜的铜墨和方法

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Publication number Priority date Publication date Assignee Title
JP7553846B2 (ja) * 2022-06-27 2024-09-19 日亜化学工業株式会社 配線基板及び発光装置並びにそれらの製造方法

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Publication number Priority date Publication date Assignee Title
JP2017089000A (ja) * 2015-11-10 2017-05-25 旭硝子株式会社 銅粒子およびその製造方法、導電膜形成用ペースト、ならびに物品
WO2017159611A1 (fr) * 2016-03-15 2017-09-21 石原ケミカル株式会社 Liquide de dispersion de fines particules de cuivre, procédé de formation de film électroconducteur, et carte de circuit imprimé
JP6348241B1 (ja) * 2017-02-14 2018-06-27 バンドー化学株式会社 グラビアオフセット印刷用導電性ペースト、導電性パターンの形成方法、及び、導電性基板の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017089000A (ja) * 2015-11-10 2017-05-25 旭硝子株式会社 銅粒子およびその製造方法、導電膜形成用ペースト、ならびに物品
WO2017159611A1 (fr) * 2016-03-15 2017-09-21 石原ケミカル株式会社 Liquide de dispersion de fines particules de cuivre, procédé de formation de film électroconducteur, et carte de circuit imprimé
JP6348241B1 (ja) * 2017-02-14 2018-06-27 バンドー化学株式会社 グラビアオフセット印刷用導電性ペースト、導電性パターンの形成方法、及び、導電性基板の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115298269A (zh) * 2020-03-25 2022-11-04 日本石原化学株式会社 用于形成导电膜的铜墨和方法

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