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WO2020005268A1 - Sélections de profil thermique basées sur l'orientation - Google Patents

Sélections de profil thermique basées sur l'orientation Download PDF

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Publication number
WO2020005268A1
WO2020005268A1 PCT/US2018/040219 US2018040219W WO2020005268A1 WO 2020005268 A1 WO2020005268 A1 WO 2020005268A1 US 2018040219 W US2018040219 W US 2018040219W WO 2020005268 A1 WO2020005268 A1 WO 2020005268A1
Authority
WO
WIPO (PCT)
Prior art keywords
computing device
orientation
thermal profile
processor
operating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2018/040219
Other languages
English (en)
Inventor
Sheng-Lung LIAO
Charlie SHAVER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Development Co LP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co LP filed Critical Hewlett Packard Development Co LP
Priority to PCT/US2018/040219 priority Critical patent/WO2020005268A1/fr
Publication of WO2020005268A1 publication Critical patent/WO2020005268A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • G06F1/1694—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being a single or a set of motion sensors for pointer control or gesture input obtained by sensing movements of the portable computer
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management

Definitions

  • computing devices such as thin clients
  • computing devices may be operated in various orientations, for example, according to the preference of users.
  • thin clients may be operated in horizontal or vertical orientations, or even disposed behind a monitor (bezel orientation).
  • the stress associated with components disposed within the computing device may vary, based on the orientation it is desirable to avoid extreme temperatures for the components, in order to avoid premature failure of the computing device.
  • FIG. 1 illustrates a computing device for selecting a thermal profile, based on an orientation of the computing device, according to an example
  • FIG. 2 illustrates a method at a computing device for selecting a thermal profile for operating the computing device, based on the orientation of the computing device, according to an example
  • FIG. 3 is a flow diagram in accordance with an example of the present disclosure.
  • Examples disclosed herein provide the ability to select a thermal profile for operating the computing device, based on the orientation of the computing device.
  • thermal profile By selecting a thermal profile based on the orientation of the computing device, performance of the computing device may be optimized while operating in that particular orientation.
  • settings that may be adjusted for a thermal profile include, but are not limited to, tuning throttle points, central processing unit (CPU) boost frequencies, and a fan speed profile.
  • tuning throttle points By adjusting these settings, based on the orientation of the computing device, quieter operations may be possible, In addition to improved CPU performance.
  • stress associated with the components disposed within the computing device may also be reduced when the appropriate thermal profile is selected, resulting in more reliable and prolonged use of the computing device.
  • FIG. 1 illustrates a computing device 100 for selecting a thermal profile, based on an orientation of the computing device 100, according to an example.
  • sensor 102 disposed within the computing device 100 for example, on the motherboard, may be used for determining the orientation of the computing device 100.
  • the computing device 100 depicts a processor 104 and a memory device 108 and, as an example of the computing device 100 performing its operations, the memory device 106 may include instructions 108-1 10 that are executable by the processor 104.
  • memory device 106 can be said to store program instructions that, when executed by processor 104, implement the components of the computing device 100
  • the executable program instructions stored in the memory device 106 include, as an example, instructions to determine orientation (108) and instructions to select thermal profile (1 10).
  • Instructions to determine orientation (108) represent program instructions that when executed by the processor 104 cause the computing device 100 to determine an orientation of the computing device 100.
  • the sensor 102 may be used to determine the system orientation. For example, upon reading data from the sensor 102, the computing device 100 may determine its orientation based on the data read.
  • the sensor 102 may be an accelerometer, but could also be another type of sensor that determines orientation.
  • the computing device 100 may have at least six different operating orientations.
  • the first two may correspond to horizontal orientations, with a particular side of the computing device 100 facing up in one of the orientations (H+), then facing down in the other orientation (H-).
  • the sensor 102 may be able to distinguish between H+ and H-.
  • the next two orientations may correspond to vertical orientations, with the particular side of the computing device 100 facing left in one of the orientations (V+), then facing right in the other orientation (V-).
  • the sensor 102 may be able to distinguish between V+ and V-.
  • the last two orientations may correspond to bezel orientations, where, for example, the computing device 100 is disposed behind a monitor.
  • the bezel orientations may vary from the vertical orientations by being rotated 90 degrees, for example, in order to have accessibility to the power button on the computing device.
  • the power button may be facing up in one of the orientations (B+), then facing down in the other orientation (B-).
  • the sensor 102 may be able to distinguish between B+ and B-.
  • the sensor 102 may be able to distinguish when the computing device 100 is in either one of the vertical orientations or bezel orientations.
  • thermal profile selected may be for the orientation producing the least desirable thermal environment.
  • factors such as the fan speed, CPU boost frequency, and throttle points, may be set sub optimally for the other five orientations, which may not be desirable.
  • the frequency that the computing device 100 determines its orientation may vary.
  • the orientation may be determined once upon startup, for example, during a power-on self-test (POST).
  • POST power-on self-test
  • the orientation may be determined dynamically, even after a POST. This may be particularly useful if the orientation of the computing device 100 is changed often after it is powered on. As a result, the thermal profile may be changed dynamically, as will be further described.
  • Instructions to select thermal profile (1 10) represent program instructions that when executed by the processor 104 cause the computing device 100 to select a thermal profile for operating the computing device 100, based on the orientation of the computing device 100.
  • the frequency that the thermal profile is changed may be dependent on the frequency that the orientation is determined. For example, if the orientation is determined only during a POST, the thermal profile selected will be based on orientation of the computing device 100 when it is powered on. However, if the orientation is determined dynamically, for example, anytime a user changes the orientation of the computing device 100, such as switching from a horizontal orientation to a vertical orientation, the appropriate thermal profile may be selected dynamically as well.
  • factors such as the throttle points, CPU boost frequencies, and fan speed profile may be tuned to optimize performance of the computing device 100 when in that particular orientation.
  • the computing device 100 may receive input from a user indicating an orientation of the computing device 100.
  • the user may be able to select the system orientation in the BIOS (e.g., F10 setup).
  • the computing device 100 may select a thermal profile for operating the computing device 100, based on the orientation indicated by the user.
  • Memory device 106 represents generally any number of memory components capable of storing instructions that can be executed by processor 104.
  • Memory device 106 is non-transitory in the sense that it does not encompass a transitory signal but instead is made up of at least one memory component configured to store the relevant instructions.
  • the memory device 106 may be a non- transitory computer-readable storage medium.
  • Memory device 106 may be implemented in a single device or distributed across devices.
  • processor 104 represents any number of processors capable of executing instructions stored by memory device 106.
  • Processor 104 may be integrated in a single device or distributed across devices. Further, memory device 106 may be fully or partially integrated in the same device as processor 104, or it may be separate but accessible to that device and processor 104.
  • the program instructions 108-1 10 can be part of an installation package that when installed can be executed by processor 104 to implement the components of the computing device 100.
  • memory device 108 may be a portable medium such as a CD, DVD, or flash drive or a memory maintained by a server from which the installation package can be downloaded and installed in another example, the program instructions may be part of an application or applications already installed.
  • memory device 108 can include integrated memory such as a hard drive, solid state drive, or the like.
  • FIG. 2 illustrates a method 200 at a computing device for selecting a thermal profile for operating the computing device, based on the orientation of the computing device, according to an example.
  • a computing device such as a thin client, may have at least six different operating orientations (e.g., H+, H-, V+, V-, B+, B-).
  • H+, H-, V+, V-, B+, B- operating orientations
  • performance of the computing device may be optimized while operating in that particular orientation.
  • FIG. 2 reference may be made to the example computing device 100 illustrated in FIG. 1. Such reference is made to provide contextual examples and not to limit the manner in which method 200 depicted by FIG. 2 may be implemented.
  • Method 200 begins at 202, where the computing device determines an orientation of the computing device.
  • sensor 102 disposed within the computing device 100 may be used for determining the orientation of the computing device 100.
  • the frequency that the computing device determines its orientation may vary.
  • the orientation may be determined once upon startup, for example, during a POST.
  • the orientation may be determined dynamically, even after a POST, as will be illustrated at 208. This may be particularly useful if the orientation of the computing device is changed often after it is powered on.
  • the computing device selects a thermal profile for operating the computing device, based on the determined orientation.
  • settings that may be adjusted for a thermal profile include, but are not limited to, tuning throttle points, CPU boost frequencies, and a fan speed profile. By adjusting these settings, based on the orientation of the computing device, quieter operations may be possible, in addition to improved CPU performance.
  • stress associated with the components disposed within the computing device may also be reduced when the appropriate thermal profile is selected, resulting in more reliable and prolonged use of the computing device.
  • the thermal profile selected for a particular orientation may provide ideal operating conditions for the components within the computing device, while in that orientation, avoiding extreme
  • the computing device determines whether the orientation of the computing device has changed, for example, from a first orientation to a second orientation. If so, the computing device returns to 204, to select the thermal profile for operating the computing device while in the second orientation. As an example, the thermal profile for operating the computing device while in the second orientation may be different from the thermal profile for operating the computing device while in the first orientation. As a result, performance of the computing device may be dynamically optimized, based on the orientation that the computing device is currently in.
  • FIG. 3 is a flow diagram 300 of steps taken by a computing device to implement a method for selecting a thermal profile for operating the computing device, based on the orientation of the computing device, according to an example.
  • the flow diagram of FIG. 3 shows a specific order of execution, the order of execution may differ from that which is depicted. For example, the order of execution of two or more blocks or arrows may be scrambled relative to the order shown. Also, two or more blocks shown in succession may be executed
  • the computing device reads data from a sensor disposed within the computing device.
  • the computing device may read data from the sensor during a POST. Otherwise, the computing device may read data from the sensor continuously, or at certain intervals, in order to determine anytime there is a change in the orientation.
  • the computing device determines an orientation of the computing device (e.g., first orientation).
  • the computing device may have at least six different operating orientations (e.g , H+, H-, V+, V-, B+, B ⁇ ).
  • the sensor may be able to distinguish when the computing device is in either one of the vertical orientations or bezel orientations.
  • the computing device selects a first thermal profile for operating the computing device.
  • Settings adjusted for the first thermal profile generally include tuning throttle points, CPU boost frequencies, and a fan speed profile, for example, to optimize performance of the computing device while in the first orientation.
  • the computing device may determine a change in orientation of the computing device from the first orientation to a second orientation, for example, upon reading data from the sensor. Based on the second orientation, the computing device selects a second thermal profile, different from the first thermal profile, for operating the computing device while in the second orientation. Similar to the first thermal profile, settings adjusted for the second thermal profile generally include tuning the throttle points, the CPU boost frequencies, and the fan speed profile, to optimize performance of the computing device while in the second orientation.
  • the computing device may also receive input from a user, indicating an orientation of the computing device (e.g., via BIOS). Based on the orientation indicated by the user, the computing device selects a thermal profile for operating the computing device.

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Dans un exemple de mise en oeuvre selon des aspects de la présente invention, un procédé peut comprendre la lecture de données à partir d'un capteur disposé à l'intérieur d'un dispositif informatique et, sur la base des données provenant du capteur, la détermination d'une orientation du dispositif informatique. Sur la base de l'orientation, le dispositif informatique sélectionne un profil thermique pour faire fonctionner le dispositif informatique.
PCT/US2018/040219 2018-06-29 2018-06-29 Sélections de profil thermique basées sur l'orientation Ceased WO2020005268A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/US2018/040219 WO2020005268A1 (fr) 2018-06-29 2018-06-29 Sélections de profil thermique basées sur l'orientation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2018/040219 WO2020005268A1 (fr) 2018-06-29 2018-06-29 Sélections de profil thermique basées sur l'orientation

Publications (1)

Publication Number Publication Date
WO2020005268A1 true WO2020005268A1 (fr) 2020-01-02

Family

ID=68986761

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2018/040219 Ceased WO2020005268A1 (fr) 2018-06-29 2018-06-29 Sélections de profil thermique basées sur l'orientation

Country Status (1)

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WO (1) WO2020005268A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6029119A (en) * 1996-01-16 2000-02-22 Compaq Computer Corporation Thermal management of computers
US20110273378A1 (en) * 2010-05-05 2011-11-10 Rachid Alameh Mobile device with temperature sensing capability and method of operating same
US20130109371A1 (en) * 2010-04-26 2013-05-02 Hu-Do Ltd. Computing device operable to work in conjunction with a companion electronic device
US20150348226A1 (en) * 2014-05-30 2015-12-03 Apple Inc. Selective gpu throttling
US20160360970A1 (en) * 2015-06-14 2016-12-15 Facense Ltd. Wearable device for taking thermal and visual measurements from fixed relative positions

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6029119A (en) * 1996-01-16 2000-02-22 Compaq Computer Corporation Thermal management of computers
US20130109371A1 (en) * 2010-04-26 2013-05-02 Hu-Do Ltd. Computing device operable to work in conjunction with a companion electronic device
US20110273378A1 (en) * 2010-05-05 2011-11-10 Rachid Alameh Mobile device with temperature sensing capability and method of operating same
US20150348226A1 (en) * 2014-05-30 2015-12-03 Apple Inc. Selective gpu throttling
US20160360970A1 (en) * 2015-06-14 2016-12-15 Facense Ltd. Wearable device for taking thermal and visual measurements from fixed relative positions

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