WO2020004573A1 - Apparatus temperature adjusting device - Google Patents

Abstract

This apparatus temperature adjusting device, provided with a thermosiphon (10) that has a first circulation circuit (100) through which a first heat medium circulates, is provided with a refrigeration cycle (20) that has a second circulation circuit (200) through which a second heat medium circulates. A condenser (16) of the thermosiphon has an inflow port (163) through which the second heat medium flows in and an outflow port (164) through which the second heat medium flows out. When the operation of a compressor (23) of the refrigeration cycle is stopped, the inflow of the second heat medium due to gravity from a heat exchanger for heat radiation in the refrigeration cycle to the condenser is suppressed.

Description

Equipment temperature controller Cross-reference to related application

This application is based on Japanese Patent Application No. 2018-124857 filed on June 29, 2018 and Japanese Patent Application No. 2019-103924 filed on June 3, 2019, wherein The description is incorporated by reference.

The present disclosure relates to a device temperature controller.

Conventionally, there is a cooling device described in Patent Document 1. This device uses two systems, a mechanical compression circuit that operates a compressor that circulates refrigerant and circulates a working fluid, and a thermosiphon that cools equipment to be cooled by circulating refrigerant naturally. It is configured as a secondary loop refrigeration circuit that exchanges heat via an exchanger.

JP 2008-96084 A

According to the study of the inventor, it is conceivable that the device described in Patent Document 1 is applied to a vehicle-mounted cooling device that cools a cooling target device mounted on a vehicle. However, in this case, the following problem occurs. In winter when the outside air temperature is low, the operation of the compressor is stopped in order to stop the cooling of the device to be cooled by the thermosiphon. However, in the device described in Patent Document 1, when the operation of the compressor is stopped, the refrigerant in the condenser flows into the heat exchanger that exchanges heat between the two circuits through the expansion valve.

凝縮 The condenser is cooled by outside air. At this time, the temperature of the condenser falls more rapidly than the heat exchanger which exchanges heat between the compressor and the two circuits.

For this reason, even if the operation of the compressor is stopped, the condensation of the refrigerant is promoted in the condenser, and the condensed refrigerant flows into the heat exchanger that exchanges heat between the two circuits through the expansion valve. . Therefore, the cooling of the cooling target device by the thermosiphon cannot be stopped, and the cooling target device cannot be kept warm.

The present disclosure aims to suppress cooling of a device to be cooled by a thermosiphon when the operation of a compressor is stopped.

According to one aspect of the present disclosure, an apparatus temperature controller includes a thermosiphon having a first circulation circuit that circulates a first heat medium, and a target apparatus is provided by a phase change between a liquid phase and a gas phase of the first heat medium. A device for controlling the temperature of the device, a second circulation circuit for circulating a second heat medium, a compressor for compressing and discharging the second heat medium inside the second circulation circuit, and A radiating heat exchanger for exchanging heat with the discharged second heat medium and air to radiate heat of the second heat medium, and an expansion valve for decompressing the second heat medium flowing out of the radiating heat exchanger. A thermosiphon is provided in the first circulation circuit, and is configured to be capable of exchanging heat between the target device and the first heat medium such that the first heat medium evaporates when the target device is cooled. Heat exchanger, second heat medium depressurized by expansion valve and heat exchanger for equipment And a condenser for exchanging heat with the evaporated first heat medium to condense the first heat medium, wherein the condenser has an inlet for flowing in the second heat medium and a flow outlet for flowing out the second heat medium. An outlet, wherein the heat-dissipating heat exchanger has an inlet for inflow of the second heat medium, and an outlet for outflow of the second heat medium, and the compressor sucks the second heat medium. And a discharge port for discharging the second heat medium, and the second circulation circuit is connected to a first connection pipe for connecting between an outlet of the heat radiating heat exchanger and an inlet of the condenser. And a second connection pipe for connecting between the outlet of the condenser and the inlet of the heat exchanger for heat dissipation, wherein when the compressor stops operating, the heat exchanger for heat dissipation is connected to the condenser. The second heat medium is configured to be prevented from flowing into the heat medium due to gravity.

Therefore, when the compressor stops operating, the liquid-phase second heat medium condensed in the heat-radiating heat exchanger is prevented from flowing into the condenser by gravity due to gravity. it can. Therefore, the cooling of the target device by the thermosiphon 10 when the operation of the compressor is stopped can be suppressed.

According to another aspect of the present disclosure, an apparatus temperature controller includes a thermosiphon having a first circulation circuit that circulates a first heat medium, and the thermosiphon has a liquid phase and a gaseous phase change of the first heat medium. A device temperature control device for adjusting a temperature of a target device, comprising: a second circulation circuit for circulating a second heat medium; a compressor for compressing and discharging the second heat medium inside the second circulation circuit; A heat exchanger for radiating heat by exchanging heat with the second heat medium discharged from the machine to radiate heat of the second heat medium; and an expansion valve for decompressing the second heat medium flowing out of the heat exchanger for heat radiation. The thermosiphon is disposed in the first circulation circuit, and the target device and the first heat medium are configured to be capable of exchanging heat so that the first heat medium evaporates when the target device is cooled. Equipment heat exchanger, heat exchange for equipment with second heat medium depressurized by expansion valve And a condenser for exchanging heat with the first heat medium evaporated by the first heat medium to condense the first heat medium. The condenser includes a second circuit in which the second heat medium flows, and a second circuit in the secondary circuit. Discharge of the second heat medium flowing into the secondary circuit from the inlet of the secondary circuit, having an inlet for flowing the heat medium and an outlet for discharging the second heat medium from the secondary circuit. Has an emission suppression structure that suppresses the occurrence of air pollution.

According to the configuration described above, since the discharge of the second heat medium flowing into the secondary circuit from the inlet of the secondary circuit is suppressed, when the compressor stops operating, the heat exchanger for radiating heat is used. The second heat medium in the liquid phase condensed by the flow can be prevented from flowing into the condenser by gravity. Therefore, it is possible to suppress the cooling of the cooling target device by the thermosiphon 10 when the operation of the compressor is stopped.

Note that reference numerals in parentheses attached to the respective components and the like indicate an example of the correspondence between the components and the like and specific components and the like described in the embodiments described later.

It is a lineblock diagram of an apparatus temperature control device of a 1st embodiment. It is a block diagram which disassembled the cooler and secondary battery of a thermosiphon. It is a figure for explaining a flow of a refrigerant in a condenser of a thermosiphon. It is the figure which showed the mode that the apparatus temperature control apparatus of 1st Embodiment inclined. It is a figure showing a situation of a refrigerant when a refrigerant flows into a secondary circuit of a condenser of a thermosiphon. It is a lineblock diagram of an apparatus temperature controller of a 2nd embodiment. It is a lineblock diagram of an apparatus temperature controller of a 3rd embodiment. It is a lineblock diagram of an apparatus temperature controller of a 4th embodiment. It is a lineblock diagram of an apparatus temperature control device of a 5th embodiment. It is a lineblock diagram of an apparatus temperature controller of a 6th embodiment. It is a lineblock diagram of an apparatus temperature controller of a 7th embodiment. It is a block diagram of the apparatus temperature control apparatus of 8th Embodiment. It is a block diagram of the apparatus temperature controller of 9th Embodiment. It is a lineblock diagram of an apparatus temperature controller of a 10th embodiment. It is a flow chart of ECU of a 10th embodiment. It is a block diagram of the apparatus temperature controller of 11th Embodiment. It is a flowchart of the ECU of the eleventh embodiment. It is a lineblock diagram of an apparatus temperature controller of a 12th embodiment. It is a lineblock diagram of an apparatus temperature controller of a 13th embodiment. It is a lineblock diagram of an apparatus temperature controller of a 14th embodiment. It is a lineblock diagram of an apparatus temperature control device of a 15th embodiment. It is a figure showing the capacitor of the device temperature controller concerning a 16th embodiment. It is the figure which showed the capacitor | condenser of the apparatus temperature controller which concerns on 17th Embodiment. It is the figure which showed the capacitor | condenser of the apparatus temperature controller which concerns on 18th Embodiment. It is a lineblock diagram of an apparatus temperature controller of a 19th embodiment. It is the XXVI part enlarged view in FIG. It is a lineblock diagram of an apparatus temperature controller of a 20th embodiment. It is the XXVIII part enlarged view in FIG. It is a lineblock diagram of an apparatus temperature controller of a 21st embodiment. It is a lineblock diagram of an apparatus temperature controller of a 22nd embodiment. It is a schematic structure figure of the secondary side circuit of the condenser of a 23rd embodiment. It is a schematic structure figure of the secondary side circuit of the condenser of a 24th embodiment. It is a schematic structure figure of the secondary side circuit of the condenser of a 25th embodiment. It is a schematic structure figure of the secondary side circuit of the condenser of a 26th embodiment. It is a schematic structure figure of the secondary side circuit of the condenser of a 27th embodiment. It is a schematic structure figure of the secondary side circuit of the condenser of a 28th embodiment. FIG. 37 is a diagram showing a configuration of a secondary battery according to a twenty-ninth embodiment. FIG. 37 is a diagram showing a configuration of a secondary battery according to a thirtieth embodiment. FIG. 37 is a diagram showing a configuration of a secondary battery according to a thirty-first embodiment. It is a flowchart of ECU of the 32nd embodiment. It is a flowchart of ECU of the 33rd embodiment. It is a flowchart of ECU of the 34th embodiment. It is a flowchart of the ECU of the 35th embodiment. It is a flowchart of the ECU of the 36th embodiment. It is a flowchart of ECU of the 37th embodiment. It is a figure showing composition of a condenser of other embodiments. It is a figure showing composition of a condenser of other embodiments. It is a figure showing composition of a condenser of other embodiments. It is a figure showing composition of a condenser of other embodiments.

Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In the following embodiments, portions that are the same or equivalent are denoted by the same reference numerals in the drawings.

(1st Embodiment)
An apparatus temperature controller according to a first embodiment will be described with reference to FIGS. 1 is mounted on a vehicle such as an electric vehicle or a hybrid vehicle. Then, in the present embodiment, the device temperature controller cools the secondary batteries 12a and 12b shown in FIG. That is, the objects to be cooled by the device temperature controller of the present embodiment are the secondary batteries 12a and 12b mounted on the electric vehicle. In each of the drawings, the arrow DR1 indicates the up-down direction. In the arrow DR1, the up arrow indicates the upper side in the up-down direction of the vehicle, and the down arrow indicates the lower side in the up-down direction of the vehicle.

車 両 In a vehicle equipped with a device temperature controller, the electric power stored in the power storage device including the secondary batteries 12a and 12b as components is supplied to an electric motor via an inverter circuit or the like, whereby the vehicle runs. The secondary batteries 12a and 12b generate heat when outputting electric power to the electric motor via the inverter.

When the temperature of the secondary batteries 12a and 12b becomes excessively high, the deterioration of the battery cells 13 constituting the secondary batteries 12a and 12b is promoted. There is a need to limit input.

Therefore, in order to secure the output and the input of the battery cell 13, a cooling device for maintaining the secondary batteries 12a and 12b at a predetermined temperature or lower is required.

電池 Also, the battery temperature rises not only while the vehicle is running but also during parking in summer. In addition, the power storage device is often arranged under the floor of the vehicle, under a trunk room, or the like, and although the amount of heat given to the secondary batteries 12a and 12b per unit time is small, the battery temperature gradually rises by leaving the battery for a long time. .

If the secondary batteries 12a, 12b are left in a high temperature state, the life of the secondary batteries 12a, 12b is greatly reduced. Therefore, the battery temperature is maintained at a low temperature by cooling the secondary batteries 12a, 12b even while the vehicle is left. It is desired.

The secondary batteries 12a and 12b of the present embodiment are configured as an assembled battery in which a plurality of battery cells 13 are stacked in the traveling direction of the vehicle. The deterioration is biased, and the performance of the power storage device is reduced.

This is because the input / output characteristics of the power storage device are determined according to the characteristics of the battery cell 13 that has deteriorated the most. Therefore, in order for the power storage device to exhibit desired performance over a long period of time, it is important to equalize the temperature to reduce temperature variations among the plurality of battery cells 13.

Further, as another cooling device for cooling the secondary batteries 12a and 12b, air blowing by a blower or a direct cooling system using a refrigeration cycle has been generally used, but the blower blows air in a vehicle compartment. Therefore, the cooling capacity of the blower is low.

In addition, in the blowing by the blower, the secondary batteries 12a and 12b are cooled by the sensible heat of the air, so that the temperature difference between the upstream and downstream of the air flow becomes large, and the temperature variation between the battery cells 13 cannot be sufficiently suppressed. .

Further, air cooling using cold air generated in a refrigeration cycle, or water cooling using cold water has a high cooling capacity, but the heat exchange part with the battery cell 13 is sensible heat cooling in either air cooling or water cooling. Temperature variation between the battery cells 13 cannot be sufficiently suppressed.

From these backgrounds, in the device temperature controller of the present embodiment, a thermosiphon system is used in which the refrigerant for thermosiphon is cooled using a refrigeration cycle and the secondary batteries 12a and 12b are cooled by natural circulation of the refrigerant for thermosiphon. Has been adopted.

機器 The device temperature controller of the present embodiment includes a thermosiphon 10 and a refrigeration cycle 20, as shown in FIG.

The thermosiphon 10 includes a cooler 14, a condenser 16, and a first circulation circuit 100 that circulates a thermosiphon refrigerant as a first heat medium. The temperature of the secondary batteries 12a and 12b as target devices is adjusted by the phase change. The first circulation circuit 100 has an outgoing pipe 101 and a return pipe 102.

The condenser 16 has a primary side circuit 16a and a secondary side circuit 16b. As shown in FIG. 3, the condenser 16 has a primary circuit 16a having a condenser inlet 161 through which a thermosiphon refrigerant flows into the primary circuit 16a and a condenser which discharges a thermosiphon refrigerant from the primary circuit 16a. An outlet 162 is formed. The secondary circuit 16b of the condenser 16 has an inlet 163 through which the refrigerant for the refrigeration cycle flows into the secondary circuit 16b, and an outlet 164 through which the refrigerant for the refrigeration cycle flows out of the secondary circuit 16b. Have been.

The primary circuit 16a of the condenser 16, the outgoing pipe 101, the cooler 14, and the return pipe 102 are connected in a ring shape to form a thermosiphon circuit in which a refrigerant for thermosiphon circulates.

冷媒 The first circulation circuit 100 of the present embodiment is filled with a thermosiphon refrigerant. The refrigerant for the thermosiphon circulates through the first circulation circuit 100 by natural circulation, and the device temperature controller adjusts the temperature of the secondary batteries 12a and 12b by a phase change between the liquid phase and the gas phase of the refrigerant for the thermosiphon. I do. Specifically, the secondary batteries 12a and 12b are cooled by the phase change of the refrigerant for the thermosiphon.

The refrigerant charged in the first circulation circuit 100 is, for example, a chlorofluorocarbon-based refrigerant such as HFO-1234yf or HFC-134a. Alternatively, various working fluids other than the chlorofluorocarbon-based refrigerant such as water and ammonia may be used as the refrigerant.

When the refrigerant for thermosiphon in the main body 143 of the cooler 14 evaporates by heat exchange with the secondary batteries 12a and 12b and becomes a gaseous refrigerant, the gaseous refrigerant flows from the outlet 142 through the return pipe 102 to the condenser. The refrigerant flows into the primary circuit 16a of the condenser 16 from the 16 condenser inlets 161.

The thermosyphon refrigerant flowing into the primary circuit 16a is condensed by heat exchange with the refrigeration cycle refrigerant inside the secondary circuit 16b of the condenser 16 to become a liquid-phase refrigerant. Then, the air flows into the main body 143 of the cooler 14 from the inlet 141 formed in the main body 143 of the cooler 14 from the condenser outlet 162 of the primary circuit 16 a of the condenser 16 through the outward pipe 101.

(4) A liquid-phase refrigerant having a relatively high specific gravity is stored below the main body 143 of the cooler 14, and a gas-phase refrigerant having a relatively low specific gravity is stored above the main body 143 of the cooler 14. Therefore, the gas-phase refrigerant in the main body 143 is exclusively discharged from the outlet 142 out of the inlet 141 and the outlet 142.

冷却 As shown in FIG. 2, the cooler 14 is disposed between the secondary batteries 12a and 12b. The cooler 14 corresponds to an equipment heat exchanger. The cooler 14 cools the secondary batteries 12a and 12b by exchanging heat between the heat of the secondary batteries 12a and 12b and the heat of the thermosiphon refrigerant. The cooler 14 has a main body 143 made of, for example, a metal having high thermal conductivity.

The main body 143 of the cooler 14 has an inlet 141 through which the thermosyphonic refrigerant flows and an outlet 142 through which the thermosiphonic refrigerant flows out. The outlet 142 is arranged above the inlet 141 in the up-down direction. The outward pipe 101 connects between a condenser outlet 162 formed in the primary circuit 16 a of the condenser 16 and an inflow port 141 formed in the main body 143 of the cooler 14. The return pipe 102 connects between an outlet 142 formed in the main body 143 of the cooler 14 and a condenser inlet 161 formed in the primary circuit 16 a of the condenser 16.

(4) The refrigeration cycle 20 constitutes a vapor compression refrigeration cycle including a circulation circuit 200 in which a refrigeration cycle refrigerant as a second heat medium circulates, a compressor 23, a condenser 21, and an expansion valve 22. The refrigeration cycle 20 includes a second circulation circuit 200 that circulates the refrigerant for the refrigeration cycle, and a compressor 23 that compresses and discharges the refrigerant for the refrigeration cycle in the second circulation circuit 200. Further, the refrigeration cycle 20 includes a condenser 21 for exchanging heat between the refrigeration cycle refrigerant discharged from the compressor 23 and the outside air to radiate the refrigeration cycle refrigerant discharged from the compressor 23. Further, an expansion valve 22 is provided for reducing the pressure of the refrigerant for the refrigeration cycle flowing out of the condenser 21 and flowing the refrigerant into the secondary circuit 16 b of the condenser 16. The condenser 21 corresponds to a radiating heat exchanger that exchanges heat between the refrigeration cycle refrigerant discharged from the compressor 23 and air and radiates heat of the refrigeration cycle refrigerant.

The circulation circuit 200 connects the compressor 23, the condenser 21, the expansion valve 22, and the secondary circuit 16b of the condenser 16 in a ring shape. The circulation circuit 200 has a first connection pipe 201 that supplies the refrigerant for the refrigeration cycle flowing out of the condenser 21 to the secondary circuit 16 b of the condenser 16. Further, a second connection pipe 202 for supplying the refrigerant for the refrigeration cycle flowing out of the secondary circuit 16 b of the condenser 16 to the condenser 21 is provided. The secondary circuit 16b of the condenser 16 acts as an evaporator of the refrigeration cycle 20, and cools the thermosiphon refrigerant in the first circulation circuit 100.

As shown in FIG. 4, the condenser 16 of the present embodiment is located above the cooler 14 in the vertical direction even when the vehicle traveling direction or the vehicle width direction is inclined with respect to the horizontal direction. It is installed to be located.

で は In the present embodiment, the condenser 16 is housed in a front storage room or a trunk room. The front storage room is a room that is disposed on the front side in the vehicle traveling direction with respect to the vehicle interior of the vehicle and houses a traveling engine and a traveling electric motor. The trunk room is a storage room that is disposed rearward in the vehicle traveling direction with respect to the vehicle interior of the vehicle and stores luggage and the like.

(4) A return pipe 102 is connected to the upper part of the condenser 16 in the vertical direction. Specifically, the return pipe 102 is connected to the condenser 16 at an upper side in the vertical direction than the outward pipe 101.

By the way, when the outside air temperature is low, the internal resistance of the secondary batteries 12a and 12b increases. In order to suppress such an increase in the internal resistance, it is necessary to suppress the cooling of the device to be cooled by the thermosiphon 10 when the outside air temperature is low.

Therefore, when the outside air temperature is low, the device temperature control device of the present embodiment stops the operation of the compressor 23 of the refrigeration cycle 20, thereby suppressing the cooling of the device to be cooled by the thermosiphon 10.

と き At this time, the first heat medium of the first circulation circuit 100 has substantially the same temperature as the secondary batteries 12a and 12b. Therefore, the temperature of the thermosiphon refrigerant in the primary circuit 16a in the condenser 16 is also substantially the same as that of the target device. On the other hand, when the operation of the compressor 23 is stopped, the condenser 21 of the second circulation circuit 200 is cooled to the outside air.

Here, when the battery temperature is higher than the outside air temperature, the condenser 16 that has received heat from the thermosiphon refrigerant in the first circulation circuit 100 becomes higher than the outside air temperature. On the other hand, the condenser 21 is cooled to the outside air temperature. Therefore, condensation occurs in the condenser 21 with the refrigerant for the refrigeration cycle. In particular, when the outside air temperature decreases with respect to daytime, such as in the evening or at night, or when the temperature of the secondary batteries 12a, 12b rises due to self-heating of the secondary batteries 12a, 12b during winter driving. Further, when the battery temperature is higher than the outside air temperature, the above-described event occurs.

When the liquid refrigerant condensed in the condenser 21 flows into the condenser 16, the heat exchange between the refrigeration cycle refrigerant and the thermosiphon refrigerant in the condenser 16 drives the thermosiphon, and the secondary battery 12a and 12b are cooled. Therefore, it is necessary to prevent the liquid-phase refrigerant of the refrigeration cycle refrigerant condensed in the condenser 21 from flowing into the condenser 16.

In the device temperature controller of the present embodiment, when the operation of the compressor 23 of the refrigeration cycle 20 is stopped, the flow of the refrigeration cycle refrigerant from the condenser 21 to the secondary circuit 16b of the condenser 16 is suppressed. It is configured as follows.

Specifically, the secondary circuit 16b of the condenser 16 has an inlet 163 through which the refrigerant for the refrigeration cycle flows. Further, the second circulation circuit 200 has a first connection pipe 201 that supplies the refrigerant for the refrigeration cycle flowing out of the condenser 21 to the inflow port 163 of the secondary circuit 16 b of the condenser 16. A part of the first connection pipe 201 is disposed below the inlet 163 of the secondary circuit 16b of the condenser 16 in the vertical direction.

Thereby, the refrigerant for the refrigeration cycle flowing out of the condenser 21 accumulates in the first connection pipe 201. Therefore, when the operation of the compressor 23 of the refrigeration cycle 20 is stopped, the refrigerant flows from the condenser 21 to the secondary circuit 16b of the condenser 16. Of the refrigeration cycle refrigerant is suppressed.

Furthermore, the condenser 16 of the present embodiment includes a secondary circuit 16b through which the refrigeration cycle refrigerant flows, an inflow port 163 for allowing the refrigeration cycle refrigerant to flow into the secondary circuit 16b, and a secondary side of the condenser 16 And an outlet 164 through which the refrigerant for the refrigeration cycle flows out of the circuit 16b. Then, when the operation of the compressor 23 of the refrigeration cycle 20 is stopped, the discharge of the refrigeration cycle refrigerant flowing into the secondary circuit 16b from the inlet 163 of the secondary circuit 16b of the condenser 16 is suppressed. Has an emission control structure.

Specifically, the inside of the secondary side circuit 16b of the condenser 16 exchanges heat with the refrigerant of the thermosiphon 10 while the refrigerant flowing from the inlet 163 of the condenser 16 flows upward once, and then makes a U-turn. It flows down. Further, the heat is exchanged again with the refrigerant of the thermosiphon 10, and the flow is discharged from the outlet 164. When the compressor 23 is stopped, the flow path configuration having the U-turn portion functions as a gas storage portion X for storing a gas-phase refrigeration cycle refrigerant vertically above the inlet 163 and the outlet 164 of the condenser 16. .

Specifically, as shown in FIG. 5A, the direction of the refrigeration cycle refrigerant flowing from the inlet 163 of the secondary circuit 16b is changed inside the secondary circuit 16b of the condenser 16. A turn portion 165 to be formed is formed. When the refrigerant for the refrigeration cycle flows into the secondary circuit 16b from the inlet 163 of the secondary circuit 16b of the condenser 16, the refrigerant for the refrigeration cycle flowing into the secondary circuit 16b evaporates inside the secondary circuit 16b. I do. At this time, if the compressor 23 is stopped, the evaporated refrigerant is not discharged and accumulates in the gas reservoir X.

(5) Then, as shown in FIG. 5B, the inside of the secondary circuit 16b is filled with the evaporated refrigerant gas for the refrigeration cycle. At this time, since the density of the gas refrigerant is lower than the density of the liquid refrigerant, it is difficult for the liquid refrigerant for the refrigeration cycle to flow.

Therefore, when the outside air temperature is low and the operation of the compressor 23 of the refrigeration cycle 20 is stopped, the discharge of the refrigeration cycle refrigerant flowing into the secondary circuit 16b is suppressed, and the gas refrigerant is held inside the condenser 16. You. This makes it difficult for the liquid refrigerant for the refrigeration cycle to flow, so that cooling of the cooling target device by the thermosiphon 10 is suppressed.

機器 The device temperature controller of the present embodiment includes the thermosiphon 10 having the first circulation circuit 100 for circulating the first heat medium, and the second circulation circuit 200 for circulating the second heat medium. Further, the compressor 23 compresses and discharges the second heat medium inside the second circulation circuit 200, and exchanges heat between the second heat medium discharged from the compressor 23 and air to reduce the heat of the second heat medium. And a condenser 21 for radiating heat. Further, it has an expansion valve 22 for reducing the pressure of the second heat medium flowing out of the condenser 21.

Further, the thermosiphon 10 is arranged in the first circulation circuit 100, and is configured such that the target device and the first heat medium can exchange heat so that the first heat medium evaporates when the batteries 12a and 12b as the target devices are cooled. The cooler 14 is provided. Further, the condenser 16 has a condenser 16 for exchanging heat between the second heat medium depressurized by the expansion valve 22 and the first heat medium evaporated by the cooler 14 to condense the first heat medium.

The condenser 16 has an inlet 163 for inflow of the second heat medium and an outlet 164 for outflow of the second heat medium, and the condenser 21 has an inlet 211 for inflow of the second heat medium. And an outlet 212 for flowing out the second heat medium. The compressor 23 has a suction port 231 for sucking the second heat medium, and a discharge port 232 for discharging the second heat medium. The second circulation circuit 200 includes a first connection pipe 201 that connects between the outlet 212 of the condenser 21 and the inlet 163 of the condenser 16, an outlet 164 of the condenser 16, and an inlet 211 of the condenser 21. And a second connection pipe 202 that connects between the two. When the compressor 23 stops operating, the second heat medium is prevented from flowing from the condenser 21 to the condenser 16 by gravity.

{Circle around (2)} When the compressor 23 stops operating, if the temperature of the condenser 21 is lower than the other components constituting the second circulation circuit 200, the second heat medium is condensed by the condenser 21.

Particularly, when the temperature of the target device is higher than the temperature of the capacitor 21, the first heat medium of the first circulation circuit has substantially the same temperature as the target device. At this time, the condenser 16 becomes higher than the temperature of the condenser 21 by receiving heat from the first heat medium in the primary side circuit 16a. Therefore, since a temperature difference occurs between the condenser 21 and the condenser 16, the second heat medium is easily condensed in the condenser 21.

When the liquid-phase second heat medium condensed by the condenser 21 reaches the condenser 16 under the influence of gravity, the liquid-phase second heat medium in the secondary-side circuit 16b and the primary-side circuit Heat exchange occurs between the liquid heat medium 16a and the second heat medium, and the thermosiphon 10 is driven.

However, the device temperature controller of the present embodiment is configured such that the station refrigerant of the second heat medium condensed by the condenser 21 does not flow into the condenser 16 due to the influence of gravity. Therefore, no heat exchange occurs in the condenser 16. Therefore, the cooling of the device to be cooled by the thermosiphon when the operation of the compressor 23 is stopped can be suppressed.

As described above, the device temperature control apparatus of the present embodiment includes the thermosiphon 10 having the first circulation circuit 100 that circulates the first heat medium, and the phase change between the liquid phase and the gas phase of the first heat medium. To adjust the temperature of the batteries 12a and 12b as target devices.

The device temperature control device further includes a second circulation circuit 200 that circulates the second heat medium, and a compressor 23 that compresses and discharges the second heat medium inside the second circulation circuit 200. A condenser 21 for exchanging heat with the second heat medium discharged from the compressor 23 to radiate heat of the second heat medium; an expansion valve 22 for reducing the pressure of the second heat medium flowing out of the condenser 21; It has.

Further, the thermosiphon 10 is arranged in the first circulation circuit 100, and is configured such that the target device and the first heat medium can exchange heat so that the first heat medium evaporates when the batteries 12a and 12b as the target devices are cooled. The cooler 14 is provided. Further, the condenser 16 has a condenser 16 for exchanging heat between the second heat medium depressurized by the expansion valve 22 and the first heat medium evaporated by the cooler 14 to condense the first heat medium.

The condenser 16 has an inlet 163 for inflow of the second heat medium and an outlet 164 for outflow of the second heat medium, and the condenser 21 has an inlet 211 for inflow of the second heat medium. And an outlet 212 for flowing out the second heat medium. The compressor 23 has a suction port 231 for sucking the second heat medium, and a discharge port 232 for discharging the second heat medium. The second circulation circuit 200 includes a first connection pipe 201 that connects between the outlet 212 of the condenser 21 and the inlet 163 of the condenser 16, an outlet 164 of the condenser 16, and an inlet 211 of the condenser 21. And a second connection pipe 202 that connects between the two. When the compressor 23 stops operating, the second heat medium is prevented from flowing from the condenser 21 to the condenser 16 by gravity.

Therefore, when the compressor 23 stops operating, when the compressor 23 stops operating, the liquid-phase second heat medium condensed by the condenser 21 as a heat-radiating heat exchanger is discharged by the condenser due to gravity. Can be suppressed from flowing in. Further, the cooling of the cooling target device by the thermosiphon when the operation of the compressor 23 is stopped can be suppressed.

Specifically, in the device temperature controller of the present embodiment, a part of the first connection pipe 201 is disposed below the inlet 163 of the condenser 16 in the vertical direction.

Thereby, when the operation of the compressor 23 is stopped, the refrigerant for the refrigeration cycle, which is condensed in the condenser 21 and flows out, accumulates in the first connection pipe 201. Therefore, the inflow of the refrigerant for the refrigeration cycle from the condenser 21 to the secondary circuit 16b of the condenser 16 due to gravity can be suppressed, and the operation of the cooling target device by the thermosiphon 10 when the operation of the compressor 23 is stopped. Cooling can be suppressed.

In addition, in the device temperature controller of the present embodiment, a part of the second connection pipe 202 is disposed above the inlet 211 of the condenser 21 in the vertical direction.

Accordingly, when the operation of the compressor 23 is stopped, the refrigerant for the refrigeration cycle that has condensed in the condenser 21 and has flowed out is blocked by the second connection pipe 202. Therefore, it is also possible to prevent the refrigerant for the refrigeration cycle from flowing from the condenser 21 to the secondary circuit 16b of the condenser 16 through the second connection pipe 202.

In addition, in the device temperature controller of the present embodiment, the condenser 16 has the secondary circuit 16b through which the refrigerant for the refrigeration cycle flows. And it has the discharge | emission suppression structure which suppresses discharge | emission of the refrigerant | coolant for a refrigeration cycle which flowed into the secondary circuit 16b from the inflow port 163 of the secondary circuit 16b.

Therefore, when the compressor stops operating, it is possible to prevent the liquid-phase second heat medium condensed in the condenser 21 serving as a heat-radiating heat exchanger from flowing into the condenser 16 due to gravity. . Therefore, cooling of the cooling target device by the thermosiphon 10 can be suppressed.

Specifically, refrigerant flows into the inside of the secondary circuit 16b from an inlet 163 formed in the secondary circuit 16b, flows once upward, makes a U-turn, flows downward, and flows out of the outlet 164. It has a channel structure that flows to When the flow path configuration is at the stop of the compression section 23, the refrigerant for the gas-phase refrigeration cycle is stored vertically above the inlet 163 formed in the secondary circuit 16b and the outlet 164 formed in the secondary circuit 16b. It functions as a gas reservoir X.

When the operation of the compressor is stopped, the refrigerant for the refrigeration cycle accumulates in the gas reservoir X, so that the refrigerant for the refrigeration cycle flowing into the secondary circuit 16b from the inlet 163 of the secondary circuit 16b is discharged. The suppression makes it difficult for the liquid refrigerant for the refrigeration cycle to flow.

The cooler 14 is mounted on the vehicle, and the condenser 21 exchanges heat between the refrigeration cycle refrigerant and the outside air of the vehicle. As described above, the condenser 21 may be configured as a heat-radiating heat exchanger that exchanges heat between the refrigerant for the refrigeration cycle and the outside air of the vehicle.

(2nd Embodiment)
An apparatus temperature controller according to the second embodiment will be described with reference to FIG. The device temperature controller of the present embodiment is different from the device temperature controller of the first embodiment in the arrangement of the condenser 21 and the compressor 23 with respect to the condenser 16.

The condenser 21 has an inlet 211 for flowing the refrigerant for the refrigeration cycle and an outlet 212 for flowing the refrigerant for the refrigeration cycle. The compressor 23 is disposed in the second connection pipe 202. In addition, a part of the second connection pipe 202 is disposed below the outlet 164 of the secondary circuit 16b of the condenser 16 in the vertical direction.

Therefore, when the compressor stops operating, the refrigeration cycle liquid refrigerant condensed in the condenser 21 is affected by gravity and flows through the outlet 164 of the compressor 23 and the secondary circuit 16b of the condenser 16. It can also be prevented from flowing into the secondary side circuit 16b of the condenser 16 through the above. Therefore, the cooling of the target device by the thermosiphon 10 when the operation of the compressor is stopped can be suppressed.

圧 縮 The compressor 23 is provided at a portion of the second connection pipe 202 that is disposed below the outlet 164 of the condenser 16 in the vertical direction.

Therefore, when the operation of the compressor 23 is stopped, the liquid refrigerant for the refrigeration cycle condensed in the condenser 21 is prevented from flowing into the secondary circuit 16b of the condenser 16 under the influence of gravity. be able to. Therefore, the cooling of the target device when the operation of the compressor is stopped can be suppressed.

The inlet 163 of the secondary circuit 16b of the condenser 16 and the outlet 164 of the secondary circuit 16b of the condenser 16 are connected to the inlet 231 of the compressor 23, the outlet 232 of the compressor 23, the expansion valve 22. It is arranged so as to be located more vertically upward. Further, the inlet 163 of the secondary circuit 16b of the condenser 16 and the outlet 164 of the secondary circuit 16b of the condenser 16 are positioned above the inlet 211 of the condenser 21 and the outlet 212 of the condenser 21 in the vertical direction. It is arranged to be.

Therefore, when the compressor stops operating, the refrigeration cycle liquid refrigerant further condensed in the condenser 21 is condensed through the inlet 163 of the secondary circuit 16 b of the condenser 16 under the influence of gravity. It can also be prevented from flowing into the secondary circuit 16b of the vessel 16.

(Third embodiment)
An apparatus temperature controller according to a third embodiment will be described with reference to FIG. The device temperature control device of the present embodiment differs from the device temperature control device of the first embodiment in the arrangement of the compressor 23 and the expansion valve 22.

機器 The device temperature controller of the present embodiment is arranged such that a part of the first connection pipe 201 is located at a position lower than the inlet 163 of the secondary circuit 16 b of the condenser 16.

Specifically, the first connection pipe 201 connects between the outlet 212 of the condenser 21 and the inlet 163 of the secondary circuit 16 b of the condenser 16. The central portion of the first connection pipe 201 is arranged so as to pass vertically below the outlet 212 of the condenser 21 and the inlet 163 of the secondary circuit 16 b of the condenser 16.

The expansion valve 22 is also disposed below the outlet 212 of the condenser 21 and the inlet 163 of the secondary circuit 16b of the condenser 16 in the vertical direction.

When the operation of the compressor 23 of the refrigeration cycle 20 is stopped, the liquid refrigerant of the refrigeration cycle condensed in the condenser 21 flows out under the influence of gravity, but accumulates in the first connection pipe 201. Therefore, it is possible to suppress the inflow of the condenser 16 from the condenser 21 into the secondary circuit 16b. Therefore, the cooling of the target device by the thermosiphon 10 when the operation of the compressor is stopped can be suppressed.

(Fourth embodiment)
An apparatus temperature controller according to a fourth embodiment will be described with reference to FIG. In the device temperature controller of the present embodiment, the inlet 163 of the secondary circuit 16b of the condenser 16 and the outlet 164 of the secondary circuit 16b of the condenser 16 are arranged in a direction above and below the target liquid level of the refrigerant for the refrigeration cycle. It is arranged on the upper side. The target liquid level is the liquid level of the refrigerant for the refrigeration cycle when the second circulation circuit 200 of the refrigeration cycle 20 is filled with the refrigerant for the refrigeration cycle. When filling the second circulation circuit 200 of the refrigeration cycle 20 with the refrigerant for the refrigeration cycle, the worker fills the refrigerant for the refrigeration cycle so that the liquid level of the refrigerant for the refrigeration cycle becomes a predetermined target liquid level. It has become.

As described above, the inlet 163 of the secondary circuit 16b of the condenser 16 and the outlet 164 of the secondary circuit 16b of the condenser are connected to the refrigeration when the second connection pipe 202 is filled with the refrigeration cycle refrigerant. It is arranged above the target liquid level of the cycle refrigerant in the vertical direction.

Therefore, when the operation of the compressor 23 of the refrigeration cycle 20 is stopped, the flow of the refrigeration cycle refrigerant from the condenser 21 to the secondary circuit 16b of the condenser 16 can be suppressed.

(Fifth embodiment)
A device temperature controller according to a fifth embodiment will be described with reference to FIG. The device temperature control device of the present embodiment is different from the device temperature control device of the first embodiment in the arrangement of the outlet 164 of the secondary circuit 16b of the condenser 16.

機器 In the device temperature controller of the present embodiment, the outlet 164 of the secondary circuit 16 b of the condenser 16 is arranged vertically above the inlet 211 of the condenser 21.

一部 Also, a part of the second connection pipe 202 is arranged above the inlet 211 of the condenser 21 in the vertical direction.

Therefore, when the operation of the compressor 23 of the refrigeration cycle 20 is stopped, the liquid refrigerant of the refrigeration cycle condensed by the condenser 21 flows from the inlet 211 to the outlet 164 of the secondary circuit 16 b of the condenser 16. Can be suppressed. Therefore, the cooling of the target device by the thermosiphon 10 when the operation of the compressor is stopped can be suppressed.

(Sixth embodiment)
An apparatus temperature controller according to a sixth embodiment will be described with reference to FIG. The apparatus temperature controller of the present embodiment is different from the apparatus temperature controller of the first embodiment in the height of the inlet 211 and the outlet 212 of the condenser 21 and the arrangement of the expansion valve 22.

In the device temperature controller of the present embodiment, the positions of the inlet 211 and the outlet 212 of the condenser 21 are arranged above the condenser 21 in the vertical direction. Specifically, the positions of the inflow port 211 and the outflow port 212 of the condenser 21 are arranged above the vertical center of the space inside the condenser 21 where the refrigerant for the refrigeration cycle is stored.

Therefore, when the operation of the compressor is stopped, the refrigerant for the refrigeration cycle accumulates in the condenser 21 and is hardly discharged from the inlet 211 and the outlet 212 of the condenser 21.

Therefore, when the operation of the compressor 23 is stopped, the liquid refrigerant of the refrigeration cycle condensed by the condenser 21 is suppressed from flowing into the secondary circuit 16 b of the condenser 16 from the inlet 211 and the outlet 212. can do. Therefore, the cooling of the target device by the thermosiphon 10 when the operation of the compressor is stopped can be suppressed.

(Seventh embodiment)
An apparatus temperature controller according to a seventh embodiment will be described with reference to FIG. The device temperature controller of the present embodiment is different from the device temperature controller of the first embodiment in the height of the inlet and the outlet of the condenser 21 and the arrangement of the expansion valve 22.

In the apparatus temperature controller of the present embodiment, the positions of the inlet 211 and the outlet 212 of the condenser 21 are arranged slightly above the vertical center of the space inside the condenser 21 where the refrigerant for the refrigeration cycle is stored. .

As described above, the positions of the inflow port 211 and the outflow port 212 of the condenser 21 may be arranged slightly above the vertical center of the space inside the condenser 21 in which the refrigerant for the refrigeration cycle is stored. Also in this case, when the compressor 23 stops operating, the liquid refrigerant of the refrigeration cycle condensed by the condenser 21 can be prevented from flowing into the secondary circuit 16b of the condenser 16. Therefore, the cooling of the target device by the thermosiphon 10 when the operation of the compressor is stopped can be suppressed.

(Eighth embodiment)
An apparatus temperature controller according to an eighth embodiment will be described with reference to FIG. The device temperature controller of the present embodiment is different from the device temperature controller of the first embodiment in the arrangement of the first connection pipe 201 and the second connection pipe 202 and the arrangement of the expansion valve 22.

機器 In the device temperature controller of the present embodiment, a part of the first connection pipe 201 is disposed above the outlet 212 of the condenser 21 in the vertical direction.

Specifically, after the first connection pipe 201 extends in the horizontal direction from the outlet 212 formed in the condenser 21, the first connection pipe 201 faces upward in the up-down direction so as to be at a position higher than the outlet 212 formed in the condenser 21. Extending. Further, after extending in the horizontal direction, the first connection pipe 201 extends upward in the vertical direction to a position substantially equal to the height of the inflow port 163 of the secondary circuit 16b of the condenser 16, and thereafter extends horizontally. And extends to the inlet 163 of the secondary circuit 16 b of the condenser 16.

As described above, a part of the first connection pipe 201 is disposed at a position higher than the outlet 212 formed in the condenser 21 and the inlet 163 of the secondary circuit 16 b of the condenser 16.

Therefore, when the compressor stops operating, the liquid refrigerant of the refrigeration cycle condensed in the condenser 21 tries to flow to the secondary circuit 16 b of the condenser 16, but is blocked by the first connection pipe 201. . Therefore, the inflow of the refrigerant for the refrigeration cycle from the condenser 21 to the secondary circuit 16b of the condenser 16 can be suppressed. Therefore, cooling of the cooling target device by the thermosiphon 10 can be suppressed.

(Ninth embodiment)
A device temperature controller according to a ninth embodiment will be described with reference to FIG. The apparatus temperature control device of the present embodiment includes a mechanical expansion valve in the first connection pipe 201 that supplies the refrigerant for the refrigeration cycle flowing out of the outlet 212 of the condenser 21 to the inlet 163 of the secondary circuit 16 b of the condenser 16. 33 are provided. The mechanical expansion valve is configured such that when the compressor 23 stops operating, the valve is mechanically fully closed.

Therefore, when the compressor stops operating, the mechanical expansion valve 33 mechanically fully closes the valve, so that the liquid refrigerant of the refrigeration cycle condensed in the condenser 21 flows from the outlet 212 to the condenser 16. Flow into the secondary circuit 16b can be suppressed. Therefore, it is possible to suppress the cooling of the cooling target device by the thermosiphon 10 when the operation of the compressor is stopped.

(Tenth embodiment)
An apparatus temperature controller according to a tenth embodiment will be described with reference to FIGS. The apparatus temperature controller according to the present embodiment is configured to open and close the first connection pipe 201 that supplies the refrigerant for the refrigeration cycle flowing out of the condenser 21 to the inlet 163 of the secondary circuit 16b of the condenser 16 under the control of the ECU 50. A valve 34 is provided.

ＥＣＵ The ECU 50 of the present embodiment periodically executes the processing shown in FIG. First, in S100, ECU 50 determines whether or not to turn off the refrigeration cycle based on whether or not a signal for instructing to turn off the refrigeration cycle has been input. Here, when a signal for instructing to turn off the refrigeration cycle has not been input, the ECU 50 controls the electromagnetic valve 34 to fully open the valve in S102, and returns to the main routine.

When a signal instructing to turn off the refrigeration cycle is input, ECU 50 determines in S104 whether or not the target device needs to be kept warm based on a signal from a temperature sensor that detects the temperature of the target device. I do. Here, if it is determined that the target device needs to be kept warm, the ECU 50 controls the electromagnetic valve 34 so that the valve opening is fully closed in S108, and returns to the main routine.

If the ECU 50 determines in S104 that it is not necessary to keep the target device warm, the ECU 50 controls the electromagnetic valve 34 to fully open the valve in S106, and returns to the main routine.

Therefore, when the operation of the compressor 23 is stopped, the electromagnetic valve 34 is controlled so as to fully close the valve opening, so that the liquid refrigerant of the refrigeration cycle condensed in the condenser 21 The flow into the side circuit 16b can be suppressed. Therefore, it is possible to suppress the cooling of the cooling target device by the thermosiphon 10 when the operation of the compressor is stopped.

(Eleventh embodiment)
The device temperature controller according to the eleventh embodiment will be described with reference to FIGS. As shown in FIG. 16, the device temperature control device of this embodiment includes an expansion valve 35 with a fully closed function. The expansion valve 35 opens and closes according to an instruction from the ECU 50. The expansion valve 35 is disposed in the first connection pipe 201 and corresponds to a flow area changing part that changes the flow area of the flow path of the refrigeration cycle refrigerant flowing through the first connection pipe 201.

ＥＣＵ The ECU 50 of the present embodiment periodically executes the processing shown in FIG. First, in S100, ECU 50 determines whether or not to turn off the refrigeration cycle based on whether or not a signal for instructing to turn off the refrigeration cycle has been input. Here, when the signal instructing to turn off the refrigeration cycle is not input, the ECU 50 normally operates the expansion valve 35 in S202. Specifically, the expansion valve 35 is controlled so that the valve opening reaches a predetermined target opening, and the process returns to the main routine.

When a signal instructing to turn off the refrigeration cycle is input, ECU 50 determines in S104 whether or not the target device needs to be kept warm based on a signal from a temperature sensor that detects the temperature of the target device. I do. Here, if it is determined that the target device needs to be kept warm, the ECU 50 controls the expansion valve 35 to fully close the valve opening in S208, and returns to the main routine.

If the ECU 50 determines in S104 that it is not necessary to keep the target device warm, the ECU 50 stops the operation of the expansion valve 35 in S206. Specifically, the expansion valve 35 is controlled so that the immediately preceding valve opening is maintained, and the process returns to the main routine.

Therefore, when the operation of the compressor 23 is stopped, the expansion valve 35 is controlled so as to fully open the valve, so that the liquid refrigerant of the refrigeration cycle condensed in the condenser 21 is discharged to the secondary side of the condenser 16. The flow into the circuit 16b is suppressed. Therefore, it is possible to suppress the cooling of the cooling target device by the thermosiphon 10 when the operation of the compressor is stopped.

As described above, the device temperature control device of the present embodiment includes, in the first connection pipe 201, a flow path area changing unit (flow area change section) that changes the flow path area of the flow path of the refrigeration cycle refrigerant flowing through the first connection pipe 201. 33 to 35) are provided.

Therefore, when the compressor 23 stops operating, the liquid refrigerant of the refrigeration cycle condensed in the condenser 21 is prevented from flowing into the secondary circuit 16 b of the condenser 16. Therefore, it is possible to suppress the cooling of the cooling target device by the thermosiphon 10 when the operation of the compressor is stopped.

The device temperature controller of the present embodiment determines whether the compressor 23 has stopped operating and determines whether the target device needs to be kept warm. When it is determined that the operation of the compressor 23 has stopped and it is determined that the target device needs to be kept warm, the flow path of the refrigeration cycle refrigerant flowing through the first connection pipe 201 is completely closed. The expansion valve 35 is controlled as follows. Therefore, the liquid refrigerant of the refrigeration cycle condensed by the condenser 21 is prevented from flowing into the secondary circuit 16 b of the condenser 16. Therefore, the cooling of the target device when the operation of the compressor is stopped can be suppressed.

(Twelfth embodiment)
A device temperature controller according to a twelfth embodiment will be described with reference to FIG. The device temperature controller of the present embodiment is different from the device temperature controller of the first embodiment in the shape of the first connection pipe 201.

In the device temperature controller of the present embodiment, after the first connection pipe 201 extends in the horizontal direction from the outlet 212 formed in the condenser 21, the height of the inlet 163 of the secondary circuit 16 b of the condenser 16 is determined. It extends downward in the up-down direction so as to have the same height. Further, after extending in the horizontal direction, the first connection pipe 201 extends upward in the vertical direction to a position higher than the height of the inflow port 163 of the secondary circuit 16b of the condenser 16. After that, the first connection pipe 201 extends in the horizontal direction and is connected to the inlet 163 of the secondary circuit 16b of the condenser 16.

As described above, a part of the first connection pipe 201 is arranged at a position higher than the inlet 163 of the secondary circuit 16 b of the condenser 16.

Therefore, when the compressor 23 stops operating, the refrigeration cycle liquid refrigerant that is condensed by the condenser 21 and flows to the secondary circuit 16 b of the condenser 16 is blocked by the first connection pipe 201. Therefore, the inflow of the liquid refrigerant for the refrigeration cycle from the condenser 21 to the secondary circuit 16b of the condenser 16 can be suppressed. Therefore, it is possible to suppress the cooling of the cooling target device by the thermosiphon 10 when the operation of the compressor is stopped.

The condenser 16 of the present embodiment includes a secondary circuit 16b through which the refrigerant for the refrigeration cycle flows, an inlet 163 for allowing the refrigerant for the refrigeration cycle to flow into the secondary circuit 16b, and a secondary side of the condenser 16. And an outlet 164 through which the refrigerant for the refrigeration cycle flows out of the circuit 16b. Then, when the operation of the compressor 23 of the refrigeration cycle 20 is stopped, the discharge of the refrigeration cycle refrigerant flowing into the secondary circuit 16b from the inlet 163 of the secondary circuit 16b of the condenser 16 is suppressed. Has an emission control structure.

Specifically, the inside of the secondary circuit 16b of the condenser 16 exchanges heat with the refrigerant of the thermosiphon 10 while the refrigerant flowing from the inlet 163 of the condenser 16 flows upward once, and then makes a U-turn. It flows down. The heat exchanges again with the refrigerant of the thermosiphon 10, and the flow is discharged from the outlet 164. In the flow path configuration having the U-turn portion, when the compressor 23 is stopped, the vapor phase refrigeration cycle refrigerant evaporated inside the condenser is not discharged, and the refrigerant flows upward and downward from the inlet 163 and the outlet 164 of the refrigerant condenser 16. Since it accumulates on the upper side in the direction, it functions as a gas accumulation part X.

Therefore, when the operation of the compressor 23 is stopped, the discharge of the refrigeration cycle refrigerant flowing into the secondary circuit 16b of the condenser 16 is suppressed, so that the gas refrigerant is retained inside the condenser 16. This makes it difficult for the liquid refrigerant for the refrigeration cycle to flow in, and the cooling of the cooling target device by the thermosiphon 10 is suppressed.

(Thirteenth embodiment)
A device temperature controller according to a thirteenth embodiment will be described with reference to FIG. In the device temperature control device of the present embodiment, the liquid reservoir 30 is provided in the first connection pipe 201 that supplies the refrigerant for the refrigeration cycle flowing out of the condenser 21 to the inlet 163 of the secondary circuit 16 b of the condenser 16. I have.

The liquid reservoir 30 stores the liquid-phase refrigeration cycle refrigerant that has flowed out of the outlet 212 formed in the condenser 21.

Therefore, when the operation of the compressor 23 is stopped, the refrigerant for the refrigeration cycle, which has been condensed in the condenser 21 and flowed out, is stored in the liquid reservoir 30, so that the secondary circuit 16b of the condenser 16 Refrigeration cycle refrigerant can be suppressed from flowing into the refrigeration cycle. Therefore, it is possible to suppress the cooling of the cooling target device by the thermosiphon 10 when the operation of the compressor is stopped.

(14th embodiment)
A device temperature controller according to a fourteenth embodiment will be described with reference to FIG. In the device temperature control device of the present embodiment, the first connection pipe 201 is disposed above the second connection pipe 202 in the vertical direction.

The compressor 23 compresses and discharges the refrigerant for the refrigeration cycle from the condenser 16. The refrigerant for the refrigeration cycle discharged from the compressor 23 is introduced into the condenser 21.

The expansion valve 22 reduces the pressure of the refrigerant for the refrigeration cycle flowing out of the condenser 21. The refrigeration cycle refrigerant flowing out of the expansion valve 22 is introduced into the condenser 16.

よ う As described above, the first connection pipe 201 may be arranged vertically above the second connection pipe 202. Even in this case, when the compressor 23 stops operating, the liquid-phase refrigeration cycle refrigerant condensed in the condenser 21 flows into the secondary circuit 16 b of the condenser 16. Can be suppressed. In addition, the compressor 23 is arranged on the path of the second connection pipe 202. By arranging the components of the refrigeration cycle in this way, it is possible to inhibit the flow of the liquid-phase refrigerant into the condenser 16. Therefore, it is possible to suppress the cooling of the cooling target device by the thermosiphon 10 when the operation of the compressor is stopped.

(Fifteenth embodiment)
A device temperature controller according to a fifteenth embodiment will be described with reference to FIG. The device temperature controller of the present embodiment is different from the device temperature controller of the fourteenth embodiment in further including a check valve 31 in the first connection pipe 201.

The check valve 31 is arranged between the compressor 23 and the condenser 21. The check valve 31 prevents the refrigerant for the refrigeration cycle from flowing from the condenser 21 to the compressor 23.

Therefore, when the operation of the compressor 23 is stopped, the liquid refrigerant for the refrigeration cycle condensed by the condenser 21 can flow into the condenser. Therefore, it is possible to suppress the cooling of the cooling target device by the thermosiphon 10 when the operation of the compressor is stopped.

(Sixteenth embodiment)
The capacitor 21 of the device temperature controller according to the sixteenth embodiment will be described with reference to FIG. The condenser 21 of the present embodiment is arranged such that the refrigerant for the refrigeration cycle flows in the heat exchange part in the condenser 21 in the lateral direction. Further, the condenser 21 of the present embodiment has two inlets and outlets 213 forming an inlet 211 for flowing the refrigerant for the refrigeration cycle and an outlet 212 for flowing the refrigerant for the refrigeration cycle. The two entrances 213 are arranged at different positions in the vertical direction. The first connection pipe 201 of the present embodiment includes the inlet 213 of the condenser 16, the inlet 213 of the condenser 21, the inlet 213 of the condenser 21, which is disposed vertically above the inlet 213 which is disposed vertically below the inlet 213. Are connected between.

For example, when the inlet / outlet 213 of the inlet / outlet 213 of the condenser 21 and the inlet / outlet 163 of the secondary circuit 16b of the condenser 16 are connected by the first connection pipe 201, The condensed liquid-phase refrigeration cycle refrigerant easily flows into the condenser 16.

However, in the device temperature control device of the present embodiment, the first connection pipe 201 is connected to the inlet / outlet 213 of the condenser 21 which is disposed vertically above the inlet / outlet 213 which is disposed at the lower side in the vertical direction. It is connected between the inflow port 163 of the 16 secondary circuits 16b. Therefore, the liquid-phase refrigeration cycle refrigerant condensed by the condenser 21 can be made less likely to flow into the condenser 16. Therefore, it is possible to suppress the cooling of the cooling target device by the thermosiphon 10 when the operation of the compressor is stopped.

(Seventeenth embodiment)
The capacitor 21 of the device temperature controller according to the seventeenth embodiment will be described with reference to FIG. The condenser 21 of the present embodiment is arranged such that the refrigerant for the refrigeration cycle flows in the heat exchange part in the condenser 21 in the lateral direction. Further, the condenser 21 of the present embodiment is provided with three entrances 213 at different positions.

The first connection pipe 201 is provided between the inlet / outlet 213 of the condenser 21 and the secondary side circuit 16 b of the condenser 16, the inlet / outlet 213 disposed vertically above the inlet / outlet 213 disposed at the lowermost side in the vertical direction. The connection with the entrance 163 is established. Therefore, the liquid-phase refrigeration cycle refrigerant condensed in the condenser 21 can be made more difficult to flow into the condenser 16. Therefore, it is possible to suppress the cooling of the cooling target device by the thermosiphon 10 when the operation of the compressor is stopped.

(Eighteenth embodiment)
The capacitor 21 of the device temperature controller according to the eighteenth embodiment will be described with reference to FIG. The condenser 21 of the present embodiment is arranged such that the refrigerant for the refrigeration cycle flows in the heat exchange section in the condenser 21 in the vertical direction. Further, the condenser 21 of the present embodiment is provided with two entrances 213 at the upper part and one entrance 213 at the lower part.

The first connection pipe 201 is provided between the inlet / outlet 213 of the condenser 21 and the secondary side circuit 16 b of the condenser 16, the inlet / outlet 213 disposed vertically above the inlet / outlet 213 disposed at the lowermost side in the vertical direction. The connection with the entrance 163 is established. Therefore, the liquid-phase refrigeration cycle refrigerant condensed in the condenser 21 can be made more difficult to flow into the condenser 16. Therefore, it is possible to suppress the cooling of the cooling target device by the thermosiphon 10 when the operation of the compressor is stopped.

(19th embodiment)
A device temperature controller according to a nineteenth embodiment will be described with reference to FIGS. The condenser 21 of the present embodiment has an inlet 211 through which the refrigeration cycle refrigerant flows, and an outlet 212 through which the refrigeration cycle refrigerant flows out. In addition, the condenser 16 has an inlet 163 through which the refrigerant for the refrigeration cycle flows, and an outlet 164 through which the refrigerant for the refrigeration cycle flows out.

In addition, the circulation circuit 200 has a third connection that connects between a first branch portion M provided in the middle of the first connection pipe 201 and a second branch portion N provided in the middle of the second connection pipe 202. A pipe 203 is provided.

Further, the third connection pipe 203 has a valve 51, a decompression unit 52 for depressurizing the refrigerant for the refrigeration cycle flowing from the condenser 21, and a heat exchange between the refrigerant for the refrigeration cycle decompressed by the decompression unit 52 and air. And a refrigeration cycle evaporator 40 for cooling the refrigeration cycle.

A part of the flow path between the outlet 164 of the condenser 16 and the second branch portion N in the second connection pipe 202 is arranged so as to be located vertically above the second branch portion N. .

If it is determined that the equipment to be cooled needs to be kept warm and heat exchange in the refrigeration cycle evaporator 40 is necessary, the compressor 23 is driven, the valve 34 is closed, and the valve 51 is opened, the third connection pipe A part of the refrigerant flows into the refrigerant 203 as a liquid-phase refrigerant without being evaporated by the evaporator 40 for the refrigeration cycle. Then, as shown in FIG. 26, the liquid-phase refrigeration cycle refrigerant flowing from the refrigeration cycle evaporator 40 into the second branch N has a higher density than the gas-phase refrigeration cycle refrigerant. It accumulates on the lower surfaces of the second connection pipe 202 and the third connection pipe 203.

Therefore, it is possible to prevent the refrigerant for the refrigeration cycle from flowing into the second branch portion N from the evaporator 40 for the refrigeration cycle from flowing into the outlet 164 of the condenser 16. Therefore, cooling of the cooling target device by the thermosiphon 10 can be suppressed.

(4) When a mechanism is provided for maintaining the lubrication of the compressor 23 by the oil circulating in the refrigeration cycle, low-temperature oil also flows into the third connection pipe 203. Then, as shown in FIG. 26, the oil flowing into the second branch portion N from the refrigeration cycle evaporator 40 has a higher density than the refrigerant for the gas phase refrigeration cycle. It accumulates on the lower surface of the connection pipe 203.

Therefore, it is possible to suppress the low-temperature oil flowing from the refrigeration cycle evaporator 40 into the second branch portion N from flowing into the outlet 164 of the condenser 16. Therefore, it is possible to suppress the cooling of the cooling target device by the thermosiphon 10 when the operation of the compressor is stopped.

(Twentieth embodiment)
A device temperature controller according to a twentieth embodiment will be described with reference to FIGS. In the device temperature control device of the present embodiment, the flow path between the outlet 41 of the refrigeration cycle evaporator 40 and the second branch portion N in the third connection pipe 203 extends from the second branch portion N to the refrigeration cycle evaporation device. As it approaches the outlet 41 of the vessel 40, it is inclined upward in the vertical direction.

As shown in FIG. 28, in the refrigeration cycle evaporator 40, the liquid-phase refrigeration cycle refrigerant that has flowed into the second branch portion N without evaporating is provided on the lower surfaces of the second connection pipe 202 and the third connection pipe 203. Accumulate in

Therefore, it is possible to prevent the refrigerant for the refrigeration cycle from flowing into the second branch portion N from the evaporator 40 for the refrigeration cycle from flowing into the outlet 164 of the condenser 16. Further, it is also possible to suppress the refrigerating cycle refrigerant flowing from the refrigerating cycle evaporator 40 into the second branch portion N from returning to the refrigerating cycle evaporator 40 side. Therefore, it is possible to suppress the cooling of the cooling target device by the thermosiphon 10 when the operation of the compressor is stopped.

Further, similarly to the nineteenth embodiment, when a mechanism for maintaining the lubrication of the compressor 23 by the oil circulating in the refrigeration cycle is provided, low-temperature oil also flows into the third connection pipe 203, and It accumulates on the lower surfaces of the pipe 202 and the third connection pipe 203.

Therefore, it is possible to suppress the low-temperature oil flowing from the refrigeration cycle evaporator 40 into the second branch portion N from flowing into the outlet 164 of the condenser 16. Therefore, it is possible to suppress the cooling of the cooling target device by the thermosiphon 10 when the operation of the compressor is stopped.

(Twenty-first embodiment)
A device temperature controller according to a twenty-first embodiment will be described with reference to FIG. After the compressor 23 is operated and heat exchange is performed in the refrigeration cycle evaporator 40, when the compressor 23 is stopped, the temperature of the refrigeration cycle evaporator 40 is the lowest. Therefore, the refrigeration cycle refrigerant is easily condensed in the refrigeration cycle evaporator 40. That is, in the present embodiment, condensation of the refrigeration cycle refrigerant is likely to occur in the refrigeration cycle evaporator 40 in addition to the condenser 21 when the compressor 23 is stopped.

In the device temperature controller of the present embodiment, a part of the flow path between the first branch portion M in the first connection pipe 201 and the inlet 163 of the condenser 16 is more vertically arranged than the inlet 163 of the condenser 16. It is located on the lower side.

Thereby, it is possible to suppress the liquid-phase refrigeration cycle refrigerant condensed in the refrigeration cycle evaporator 40 or the condenser 21 from flowing into the inlet 163 of the condenser 16. Therefore, the cooling of the target device by the thermosiphon 10 when the operation of the compressor is stopped can be suppressed.

(Twenty-second embodiment)
An appliance temperature controller according to a twenty-second embodiment will be described with reference to FIG. Also in the present embodiment, condensation of the refrigeration cycle refrigerant is likely to occur in both the condenser 21 and the refrigeration cycle evaporator 40 when the compressor 23 is stopped. In the device temperature controller of the present embodiment, a part of the flow path between the first branch portion M in the first connection pipe 201 and the inlet 163 of the condenser 16 is more vertically arranged than the inlet 163 of the condenser 16. It is located on the lower side. Further, at a portion of the first connection pipe 201 that is disposed below the inflow port 163 of the condenser 16 in the vertical direction, a protruding portion 2010 that protrudes upward and downward in the vertical direction is formed. Therefore, the cooling of the target device by the thermosiphon 10 when the operation of the compressor is stopped can be suppressed.

突出 The refrigeration cycle refrigerant flowing out of the refrigeration cycle evaporator 40 is blocked by the protrusion 2010. Further, the refrigerant for the refrigeration cycle flowing out of the condenser 21 is blocked and the inflow of the refrigerant for the refrigeration cycle to the inlet 163 of the condenser 16 can be suppressed.

(Twenty-third embodiment)
The device temperature controller according to the twenty-third embodiment will be described with reference to FIG. In the present embodiment, a turn portion 165 that changes the direction of the refrigerant for the refrigerating cycle flowing from the inlet 163 of the secondary circuit 16b is disposed inside the secondary circuit 16b of the condenser 16. By this turn part 165, after extending upward in the vertical direction from the inlet 163 of the secondary circuit 16 b inside the secondary circuit 16 b of the condenser 16, vertically downward toward the outlet 164. An extending channel is formed.

向 き Thus, the direction of the refrigeration cycle refrigerant is changed by the turn portion 165. As a result, when the liquid-phase refrigeration cycle refrigerant flowing from the inflow port 163 into the secondary circuit 16b of the condenser 16 evaporates inside the condenser 16, this is hatched in FIG. The portion functions as a gas reservoir X. Then, discharge of the gas-phase refrigerant generated by the evaporation is suppressed. Therefore, it becomes difficult for the liquid refrigerant for the refrigeration cycle to flow in, and it is possible to suppress the cooling of the device to be cooled by the thermosiphon 10 when the operation of the compressor is stopped. Further, the gas reservoir X provides a heat insulating effect.

(5) The internal pressure of the secondary circuit 16b of the condenser 16 is slightly increased by the turn portion 165. For this reason, it is also possible to suppress the flow of the refrigeration cycle liquid phase refrigerant into the secondary circuit 16b of the condenser 16.

(24th embodiment)
A device temperature controller according to a twenty-fourth embodiment will be described with reference to FIG. The device temperature control device of the present embodiment includes turn portions 166 and 167 that change the direction of the refrigeration cycle refrigerant flowing from the inlet 163 of the secondary circuit 16b into the secondary circuit 16b of the condenser 16. Is arranged. Then, the directions of the refrigerant for the refrigerating cycle change so as to meander by the turn portions 166 and 167. When the liquid-phase refrigeration cycle refrigerant that has flowed into the secondary circuit 16b of the condenser 16 from the inlet 163 evaporates inside the condenser 16, the portion hatched in FIG. Functions as a unit. Then, discharge of the gas-phase refrigerant generated by the evaporation is suppressed. Therefore, it becomes difficult for the liquid refrigerant for the refrigeration cycle to flow when the operation of the compressor is stopped, and it is possible to suppress the cooling of the device to be cooled by the thermosiphon 10. Further, the gas reservoir has a heat insulating effect.

(4) The internal pressure of the secondary circuit 16b of the condenser 16 is slightly increased by the turn parts 166 and 167. For this reason, it is also possible to suppress the flow of the refrigeration cycle liquid phase refrigerant into the secondary circuit 16b of the condenser 16.

(25th embodiment)
A device temperature controller according to a twenty-fifth embodiment will be described with reference to FIG. In the device temperature controller of the present embodiment, a turn portion 168 that changes the direction of the refrigeration cycle refrigerant flowing from the inlet 163 of the secondary circuit 16b is disposed inside the secondary circuit 16b of the condenser 16. Have been. The inflow port 163 of the secondary circuit 16b of the condenser 16 is disposed above the vertical center of the space for storing the refrigerant for the refrigeration cycle inside the secondary circuit 16b of the condenser 16.

The liquid-phase refrigeration cycle refrigerant flowing into the secondary circuit 16b of the condenser 16 from the inlet 163 of the secondary circuit 16b of the condenser 16 evaporates inside the secondary circuit 16b of the condenser 16. An attempt is made to flow back to the inlet side of the secondary circuit 16b of the condenser 16 as indicated by the arrow RF. Thus, the discharge of the refrigeration cycle refrigerant flowing into the secondary circuit 16b of the condenser 16 from the inlet 163 of the secondary circuit 16b of the condenser 16 is suppressed. Therefore, it becomes difficult for the liquid refrigerant for the refrigeration cycle to flow in, and it is possible to suppress the cooling of the device to be cooled by the thermosiphon 10 when the operation of the compressor is stopped. Also, since the refrigerant flows backward, only a part of the secondary circuit 16b, which is a heat exchanger, is used for heat exchange instead of the entire area.

As described above, it is possible to suppress the discharge of the refrigeration cycle refrigerant flowing from the inlet 163 of the secondary circuit 16b of the condenser 16 into the secondary circuit 16b of the condenser 16.

(Twenty-sixth embodiment)
The device temperature controller according to the twenty-sixth embodiment will be described with reference to FIG. In the device temperature controller of the present embodiment, the refrigerant for the refrigeration cycle flows into the secondary circuit 16b of the condenser 16 from both the condenser 21 and the evaporator 40 for the refrigeration cycle.

The secondary circuit 16b of the condenser 16 has an inlet 1631 through which the refrigerant for the refrigeration cycle flows in from the condenser 21 and an inlet 1632 through which the refrigerant for the refrigeration cycle flows from the evaporator 40 for the refrigeration cycle. .

流 The inlet 1631 and the inlet 1632 of the secondary circuit 16 b of the condenser 16 are arranged below the secondary circuit 16 b of the condenser 16. Specifically, the inflow port 1631 and the inflow port 1632 of the secondary circuit 16b of the condenser 16 are located closer to the vertical center of the space in the secondary circuit 16b of the condenser 16 where the refrigerant for the refrigeration cycle is stored. It is located below.

タ ー ン A turn part 165 that changes the direction of the refrigerant for the refrigeration cycle flowing from the inlet 163 of the secondary circuit 16b is disposed inside the secondary circuit 16b of the condenser 16.

When the liquid-phase refrigeration cycle refrigerant flows from the condenser 21 into the secondary circuit 16b of the condenser 16 via the inlet 1631 of the secondary circuit 16b of the condenser 16, the refrigerant evaporates inside the condenser 16. It becomes a gas-phase refrigerant. Then, the hatched portion in FIG. 34 functions as a gas reservoir by the turn portion 165. Then, discharge of the refrigeration cycle refrigerant flowing into the secondary circuit 16b from the inlet 1631 of the secondary circuit 16b of the condenser 16 is suppressed.

When the liquid-phase refrigeration cycle refrigerant flows into the secondary circuit 16b of the condenser 16 via the inlet 1631 of the secondary circuit 16b of the condenser 16, the refrigerant evaporates inside the condenser and is vapor-phase refrigerant. 34, the hatched portion in FIG. 34 functions as a gas reservoir by the turn portion 165. Thereby, discharge of the refrigerant for the refrigeration cycle flowing into the secondary circuit 16b from the inlet 1632 of the secondary circuit 16b of the condenser 16 is suppressed.

{Circle around (4)} Due to this gas accumulation, the internal pressure of the secondary circuit 16b of the condenser 16 slightly increases. For this reason, the inflow of the refrigerant for the refrigeration cycle into the secondary circuit 16b of the condenser 16 can also be suppressed.

(Twenty-seventh embodiment)
An appliance temperature controller according to a twenty-seventh embodiment will be described with reference to FIG. The device temperature controller of the present embodiment is different from the device temperature controller of the twenty-sixth embodiment in the arrangement of the inflow port 1632 of the secondary circuit 16b of the condenser 16 and the configuration of the turn parts 166 and 167. .

流 The inlet 1632 of the secondary circuit 16 b of the condenser 16 is arranged below the secondary circuit 16 b of the condenser 16. Specifically, the inflow port 1632 of the secondary circuit 16b of the condenser 16 is disposed above the vertical center of the space for storing the refrigeration cycle refrigerant inside the secondary circuit 16b of the condenser 16. ing.

Further, the device temperature controller of the present embodiment makes the refrigeration cycle refrigerant flowing from the inlet 163 of the secondary circuit 16b meander into the secondary circuit 16b of the condenser 16 by meandering. Turn portions 166 and 167 that form a flow path that reaches the outflow port 164 are disposed.

When the liquid-phase refrigeration cycle refrigerant flows into the secondary circuit 16b of the condenser 16 from the condenser 21 through the inlet 1631 of the secondary circuit 16b of the condenser 16, the refrigerant evaporates inside the condenser and the vapor phase It becomes a refrigerant, and the hatched portion in FIG. 35 functions as a gas reservoir by the turn part 166. Thereby, the discharge of the refrigeration cycle refrigerant flowing into the secondary circuit 16b from the inlet 1631 of the secondary circuit 16b of the condenser 16 is suppressed. Further, the gas reservoir has a heat insulating effect.

{Circle around (4)} Due to this gas accumulation, the internal pressure of the secondary circuit 16b of the condenser 16 slightly increases. For this reason, the inflow of the refrigerant for the refrigeration cycle into the secondary circuit 16b of the condenser 16 can also be suppressed.

When the liquid-phase refrigeration cycle refrigerant flows from the refrigeration cycle evaporator 40 to the secondary circuit 16b of the condenser 16 via the inlet 1632 of the secondary circuit 16b of the condenser 16, this refrigeration cycle The refrigerant for use evaporates in the flow path formed by the turn part 167. Then, as indicated by an arrow RF in FIG. 35, the flow tends to flow backward to the inlet 1632 of the secondary circuit 16b of the condenser 16. That is, between the turn part 167 and the inflow port 1632, the liquid refrigerant and the gas refrigerant pass through the same path. As a result, the discharge of the refrigeration cycle refrigerant flowing into the secondary circuit 16b of the condenser 16 is suppressed.

(Twenty-eighth embodiment)
An appliance temperature controller according to a twenty-eighth embodiment will be described with reference to FIG. The device temperature controller of the present embodiment is different from the device temperature controller of the twenty-sixth embodiment in the arrangement of the inlets 1631 and 1632 of the secondary circuit 16b of the condenser 16 and the configuration of the turn part 168. .

流 The inlet 1632 of the secondary circuit 16 b of the condenser 16 is arranged above the secondary circuit 16 b of the condenser 16. Specifically, the inflow port 1631 and the inflow port 1632 of the secondary circuit 16b of the condenser 16 are located closer to the vertical center of the space in the secondary circuit 16b of the condenser 16 where the refrigerant for the refrigeration cycle is stored. It is located above.

Further, in the device temperature controller of the present embodiment, the turn part 168 for changing the direction of the refrigeration cycle refrigerant flowing from the inlet 163 of the secondary circuit 16b is provided inside the secondary circuit 16b of the condenser 16. Are located.

When the liquid-phase refrigeration cycle refrigerant flows into the secondary circuit 16b of the condenser 16 from the condenser 21 via the inlet 1631 of the secondary circuit 16b of the condenser 16, the refrigerant for the refrigeration cycle is turned into a turn part. Evaporate in the flow path formed by 168. Then, as indicated by an arrow RF1 in FIG. 36, an attempt is made to flow backward to the inlet 1631 side of the secondary circuit 16b of the condenser 16. That is, between the turn part 168 and the inflow port 1631, the liquid refrigerant and the gas refrigerant pass through the same path. As a result, the discharge of the refrigeration cycle refrigerant flowing into the secondary circuit 16b of the condenser 16 is suppressed.

When the liquid-phase refrigeration cycle refrigerant flows into the secondary circuit 16b of the condenser 16 from the refrigeration cycle evaporator 40 through the inlet 1632 of the secondary circuit 16b of the condenser 16, this refrigeration cycle The refrigerant for use evaporates in the flow path formed by the turn part 168. Then, as indicated by an arrow RF2 in FIG. 36, the flow tends to flow backward to the inlet 1632 of the secondary circuit 16b of the condenser 16. That is, between the turn part 168 and the inflow port 1632, the liquid refrigerant and the gas refrigerant pass through the same path. Thus, the discharge of the refrigerant for the refrigeration cycle flowing into the secondary circuit 16b of the condenser 16 can be suppressed.

(Twenty-ninth embodiment)
A device temperature controller according to a twenty-ninth embodiment will be described with reference to FIG. The cooler 14 of the present embodiment has a heat exchange core 14a and tanks 14b and 14c. The tank 14c is connected to the outbound piping 101, and the tank 14b is connected to the inbound piping 102. Heat exchange core 14a is arranged between batteries 12a and 12b.

Battery 12a and battery 12b have terminals T1 and T2, respectively. In the device temperature controller of the present embodiment, terminals T1 and T2 are arranged on the side surfaces of the batteries 12a and 12b.

(4) Thermosyphon refrigerant is introduced from the condenser 16 into the tank 14c via the return pipe 102. The heat exchange core 14a cools the batteries 12a and 12b by exchanging heat between the refrigerant for the refrigeration cycle and the refrigerant for the thermosiphon. At this time, the refrigerant for the thermosiphon evaporates inside the heat exchange core 14a, and the evaporated refrigerant for the thermosiphon is introduced into the condenser 16 via the return pipe 102.

(Thirtieth embodiment)
An appliance temperature controller according to a thirtieth embodiment will be described with reference to FIG. In the device temperature controller of the twenty-ninth embodiment, terminals T1 and T2 are arranged on the side surfaces of the batteries 12a and 12b. On the other hand, in the device temperature controller of the present embodiment, terminals T1 and T2 are arranged on the upper surfaces of the batteries 12a and 12b.

(Thirty-first embodiment)
The device temperature controller according to the thirty-first embodiment will be described with reference to FIG. In the device temperature controller of the present embodiment, the heat exchange core 14a of the cooler 14 is arranged on the lower surfaces of the batteries 12a and 12b. That is, the battery 12a and the battery 12b are arranged only on one surface of the heat exchange core 14a.

(Thirty-second embodiment)
A device temperature controller according to a thirty-second embodiment will be described with reference to FIG. The configuration of the device temperature controller of the present embodiment is the same as that of the device temperature controller of the tenth embodiment. The device temperature control device of the present embodiment is different from the device temperature control device of the tenth embodiment in the processing of the ECU 50 after S104.

ＥＣＵ The ECU 50 of the present embodiment periodically executes the processing shown in FIG. First, in S100, ECU 50 determines whether or not to turn off the refrigeration cycle based on whether or not a signal for instructing to turn off the refrigeration cycle has been input.

Here, when a signal instructing to turn off the refrigeration cycle is input, the ECU 50 determines in S104 whether or not the target device needs to be kept warm based on a signal from the temperature sensor that detects the temperature of the target device. judge.

Specifically, if the temperature of the target device is equal to or higher than the first threshold, the ECU 50 determines that the target device does not need to be kept warm, and if the temperature of the target device is less than the first threshold, the target device needs to be kept warm. It is determined that there is.

Here, when it is determined that the target device does not need to be kept warm, the ECU 50 determines in S302 whether it is necessary to increase the cooling capacity. Specifically, when the temperature of the target device is equal to or higher than a second threshold value higher than the first threshold value, it is determined that the cooling capacity of the target device needs to be increased. If the temperature of the target device is less than the second threshold, it is determined that it is not necessary to increase the cooling capacity of the target device.

Here, if the temperature of the target device is equal to or higher than the second threshold, the ECU 50 turns on the refrigeration cycle in S304. Specifically, the compressor 23 is operated. Further, the electromagnetic valve 34 is controlled so that the valve opening is fully opened, and the process returns to the main routine.

If the temperature of the target device is lower than the second threshold, the ECU 50 controls the electromagnetic valve 34 to fully open the valve in S106 without operating the compressor 23. Return.

As described above, even if it is determined that the compressor 23 has stopped operating and that it is determined that the target device does not need to be kept warm, the ECU 50 of the device temperature control device of the present embodiment can control the cooling capacity of the target device. If it is determined that the increase is necessary, the compressor 23 is operated in S304.

In other words, when it is determined that the cooling capacity of the target device needs to be increased, the first heat medium can be forced to flow into the condenser 16 and the cooling performance can be increased.

(4) If it is determined that the cooling capacity of the target device does not need to be increased, the compressor 23 is not operated, so that power for driving the compressor 23 can be prevented from being consumed.

In the present embodiment, it is determined whether the cooling capacity of the target device needs to be increased based on whether the temperature of the target device is equal to or higher than the second threshold. On the other hand, when the user instructs to increase the cooling capacity of the target device, it may be determined that the cooling capability of the target device needs to be increased.

(Thirty-third embodiment)
An appliance temperature controller according to a thirty-third embodiment will be described with reference to FIG. The configuration of the device temperature control device of the present embodiment is the same as the device temperature control devices of the tenth and thirty-second embodiments. The device temperature control device of the present embodiment is different from the above-described thirty-second embodiment in the processing of the ECU 50 after S302.

(4) In S302, the ECU 50 determines whether it is necessary to increase the cooling capacity. Specifically, when the temperature of the target device is equal to or higher than the second threshold, it is determined that the cooling capacity of the target device needs to be increased. If the temperature of the target device is less than the second threshold, it is determined that it is not necessary to increase the cooling capacity of the target device.

Here, if the temperature of the target device is equal to or higher than the second threshold, the ECU 50 determines in S308 whether or not to allow an increase in the cooling capacity of the target device. For example, when the target device is the secondary batteries 12a and 12b that supply power to the compressor 23, when the secondary batteries 12a and 12b are being charged or when it is estimated that the charging of the secondary batteries 12a and 12b is started. It is determined that the increase in the cooling capacity of the target device is permitted. When the secondary batteries 12a and 12b are not being charged or when it is estimated that the charging of the secondary batteries 12a and 12b is not started, it is determined that the increase in the cooling capacity of the target device is not permitted.

Here, if it is estimated that the secondary batteries 12a and 12b are being charged or that the charging of the secondary batteries 12a and 12b is to be started, the ECU 50 turns on the refrigeration cycle in S304. Specifically, the compressor 23 is operated. Further, the electromagnetic valve 34 is controlled so that the valve opening is fully opened, and the process returns to the main routine.

If the secondary batteries 12a and 12b are not being charged, or if it is estimated that the charging of the secondary batteries 12a and 12b will not be started, the ECU 50 sets the valve opening to fully open in S306. Controls the electromagnetic valve 34 and returns to the main routine.

As described above, if it is determined in S302 that the cooling capacity of the target device needs to be increased, the ECU 50 of the device temperature control device of the present embodiment increases the cooling capability of the target device in S308. It is determined whether to permit.

{Circle around (4)} In S308, when the permission determining unit determines that the increase of the cooling capacity of the target device is permitted, the compressor is operated in S304. That is, when it is determined that the increase of the cooling capacity of the target device is permitted, the first heat medium can be forced to flow into the condenser 16 and the cooling performance can be increased.

(4) When it is not determined that the increase of the cooling capacity of the target device is permitted, the compressor 23 is not operated, so that the power for driving the compressor 23 can be prevented from being consumed. Here, since the electromagnetic valve 34 is open, the cooling capacity can be secured.

In addition, the ECU 50 of the device temperature controller of the present embodiment, when estimating that the secondary batteries 12a and 12b are being charged or that the charging of the secondary batteries 12a and 12b is to be started, increases the cooling capacity of the target device. It is determined to be permitted. Therefore, since power for driving the compressor 23 can be secured, it is possible to suppress a decrease in the cruising distance due to the secondary batteries 12a and 12b during the next traveling.

(34th embodiment)
An appliance temperature controller according to a thirty-fourth embodiment will be described with reference to FIG. The configuration of the device temperature controller of the present embodiment is the same as that of the device temperature controller of the eleventh embodiment. The device temperature control device of the present embodiment is different from the device temperature control device of the eleventh embodiment in the processing of the ECU 50 after S104.

(4) The ECU 50 of the present embodiment periodically executes the processing shown in FIG. First, in S100, ECU 50 determines whether or not to turn off the refrigeration cycle based on whether or not a signal for instructing to turn off the refrigeration cycle has been input.

Here, when a signal instructing to turn off the refrigeration cycle is input, the ECU 50 determines in S104 whether or not the target device needs to be kept warm based on a signal from the temperature sensor that detects the temperature of the target device. judge. Specifically, if the temperature of the target device is equal to or higher than the first threshold, the ECU 50 determines that the target device does not need to be kept warm, and if the temperature of the target device is less than the first threshold, the target device needs to be kept warm. It is determined that there is.

Here, when it is determined that the target device does not need to be kept warm, the ECU 50 determines in S302 whether it is necessary to increase the cooling capacity. Specifically, when the temperature of the target device is equal to or higher than a second threshold value higher than the first threshold value, it is determined that the cooling capacity of the target device needs to be increased. If the temperature of the target device is less than the second threshold, it is determined that it is not necessary to increase the cooling capacity of the target device.

Here, if the temperature of the target device is equal to or higher than the second threshold, the ECU 50 turns on the refrigeration cycle in S404. Specifically, the compressor 23 is operated. Further, the expansion valve 35 is normally operated. Specifically, the expansion valve 35 is controlled so that the valve opening reaches a predetermined target opening, and the process returns to the main routine.

If the temperature of the target device is lower than the second threshold value, the ECU 50 controls the expansion valve 35 so as to close the valve fully without operating the compressor 23 in S206. Return to

As described above, if it is determined in S302 that the cooling capacity of the target device needs to be increased, the ECU 50 of the device temperature control device of the present embodiment operates the compressor 23 in S304.

In other words, when it is determined that the cooling capacity of the target device needs to be increased, the first heat medium can be forced to flow into the condenser 16 and the cooling performance can be increased.

(4) If it is determined that the cooling capacity of the target device does not need to be increased, the compressor 23 is not operated, so that power for driving the compressor 23 can be prevented from being consumed. Here, since the expansion valve 35 is fully opened, the cooling capacity can be secured.

In the present embodiment, it is determined whether the cooling capacity of the target device needs to be increased based on whether the temperature of the target device is equal to or higher than the second threshold. On the other hand, when an increase in the cooling capacity of the target device is instructed from a user operation, it may be determined that the cooling capability of the target device needs to be increased.

(Thirty-fifth embodiment)
An apparatus temperature controller according to a thirty-fifth embodiment will be described with reference to FIG. The configuration of the device temperature control device of the present embodiment is the same as the device temperature control devices of the eleventh and thirty-fourth embodiments. The device temperature controller of the present embodiment is different from the above-described thirty-fourth embodiment in the processing of the ECU 50 after S302.

(4) In S302, the ECU 50 determines whether it is necessary to increase the cooling capacity. Specifically, when the temperature of the target device is equal to or higher than the second threshold, it is determined that the cooling capacity of the target device needs to be increased, and when the temperature of the target device is lower than the second threshold, the cooling capability of the target device is determined. It is determined that no increase is necessary.

Here, if the temperature of the target device is equal to or higher than the second threshold, the ECU 50 determines in S308 whether or not to allow an increase in the cooling capacity of the target device. For example, when the target device is the secondary batteries 12a and 12b, when it is estimated that the secondary batteries 12a and 12b are being charged or the charging of the secondary batteries 12a and 12b is started, the cooling capacity of the target device is increased. It is determined to be permitted.

If the secondary batteries 12a and 12b are not being charged, or if it is estimated that the charging of the secondary batteries 12a and 12b will not be started, it is determined that the increase in the cooling capacity of the target device is not permitted.

Here, if it is estimated that the secondary batteries 12a and 12b are being charged or that the charging of the secondary batteries 12a and 12b is to be started, the ECU 50 turns on the refrigeration cycle in S404. Specifically, the compressor 23 is operated. Further, the expansion valve 35 is normally operated. Specifically, the expansion valve 35 is controlled so that the valve opening reaches a predetermined target opening, and the process returns to the main routine.

When the secondary batteries 12a and 12b are not being charged or when it is estimated that the charging of the secondary batteries 12a and 12b is not started, the ECU 50 does not turn on the refrigeration cycle, and in S406, The expansion valve 35 is controlled to fully open the valve. Then, the process returns to the main routine.

As described above, if it is determined in S302 that the cooling capacity of the target device needs to be increased, the ECU 50 of the device temperature control device of the present embodiment increases the cooling capability of the target device in S308. It is determined whether to permit.

{Circle around (4)} In S308, when the permission determination unit determines that the increase of the cooling capacity of the target device is permitted, the compressor is operated in S404. That is, when it is determined that the increase of the cooling capacity of the target device is permitted, the first heat medium can be forced to flow into the condenser 16 and the cooling performance can be increased.

(4) When it is not determined that the increase of the cooling capacity of the target device is permitted, the compressor 23 is not operated, so that the power for driving the compressor 23 can be prevented from being consumed. Here, since the electromagnetic valve 34 is open, the cooling capacity can be secured.

In addition, the ECU 50 of the device temperature controller of the present embodiment, when estimating that the secondary batteries 12a and 12b are being charged or that the charging of the secondary batteries 12a and 12b is to be started, increases the cooling capacity of the target device. It is determined to be permitted. Therefore, since electric power for driving the compressor 23 can be secured, a decrease in the cruising distance due to the secondary batteries 12a and 12b during the next traveling can be suppressed.

(Thirty-sixth embodiment)
The device temperature controller according to the thirty-sixth embodiment will be described with reference to FIG. The configuration of the device temperature control device of the present embodiment is the same as the device temperature control devices of the eleventh, thirty-fourth, and thirty-fifth embodiments. In the thirty-fourth embodiment, in S100, the ECU 50 determines whether or not to turn off the refrigeration cycle. If it is determined that the refrigeration cycle is to be turned off, the processing from S104 is performed. In contrast, in the present embodiment, in S1001, the ECU 50 determines whether or not the vehicle has stopped traveling, and if it is determined that the vehicle has stopped traveling, performs the processing from S104.

First, in S1001, the ECU 50 determines whether or not the vehicle has stopped traveling. Here, when the vehicle is running, the process returns to the main routine without performing any special processing. If the vehicle has stopped traveling, the ECU 50 determines in S104 whether or not the target device needs to be kept warm. Here, when it is determined that the target device needs to be kept warm, the ECU 50 turns off the refrigeration cycle in S2081. Specifically, the compressor 23 is stopped. Further, the expansion valve 35 is controlled so that the valve opening is fully closed, and the process returns to the main routine.

{Circle around (4)} In S104, if it is determined that the target device does not need to be kept warm, the ECU 50 determines in S302 whether it is necessary to increase the cooling capacity. Here, when it is determined that it is not necessary to increase the cooling capacity, the ECU 50 turns off the refrigeration cycle in S2061. Specifically, the compressor 23 is stopped. Further, the expansion valve 35 is controlled so that the valve opening is fully opened, and the process returns to the main routine.

{Circle around (4)} In S302, when it is determined that the cooling capacity needs to be increased, the ECU 50 turns on the refrigeration cycle in S4041. Specifically, the compressor 23 is operated. Further, the expansion valve 35 is normally operated. Specifically, the expansion valve 35 is controlled so that the valve opening reaches a predetermined target opening, and the process returns to the main routine.

As described above, the ECU 50 determines that the vehicle is stopped, determines that the target device does not need to be kept warm, and determines that it is necessary to increase the cooling capacity. The refrigeration cycle is turned on, and the expansion valve 35 is operated normally. Therefore, the first heat medium can flow into the condenser 16, and the cooling performance can be increased.

(37th embodiment)
The device temperature controller according to the thirty-seventh embodiment will be described with reference to FIG. The configuration of the device temperature control device of the present embodiment is the same as the device temperature control devices of the eleventh, thirty-fourth, thirty-fifth, and thirty-sixth embodiments. In the thirty-fifth embodiment, in S100, the ECU 50 determines whether or not to turn off the refrigeration cycle. If it is determined that the refrigeration cycle is to be turned off, the processing from S104 is performed. In contrast, in the present embodiment, in S1001, the ECU 50 determines whether or not the vehicle has stopped traveling, and if it is determined that the vehicle has stopped traveling, performs the processing from S104.

First, in S1001, the ECU 50 determines whether or not the vehicle has stopped traveling. Here, when the vehicle is running, the process returns to the main routine without performing any special processing. If the vehicle has stopped traveling, the ECU 50 determines in S104 whether or not the target device needs to be kept warm. Here, when it is determined that the target device needs to be kept warm, the ECU 50 turns off the refrigeration cycle in S2081. Specifically, the compressor 23 is stopped. Further, the expansion valve 35 is controlled so that the valve opening is fully closed, and the process returns to the main routine.

{Circle around (4)} In S104, if it is determined that the target device does not need to be kept warm, the ECU 50 determines in S302 whether it is necessary to increase the cooling capacity. Here, when it is determined that it is not necessary to increase the cooling capacity, the ECU 50 turns off the refrigeration cycle in S2061. Specifically, the compressor 23 is stopped. Further, the expansion valve 35 is controlled so that the valve opening is fully opened, and the process returns to the main routine.

{Circle around (4)} In S302, when it is determined that the cooling capacity needs to be increased, the ECU 50 determines in S308 whether or not to allow the cooling capacity of the target device to be increased. Here, when it is determined that the increase in the cooling capacity of the target device is not permitted, the ECU 50 controls the expansion valve 35 in S4061 to turn off the refrigeration cycle and fully open the valve opening similarly to S2061. I do. On the other hand, when it is determined that the increase in the cooling capacity of the target device is permitted, the ECU 50 turns on the refrigeration cycle in S4041. Specifically, the compressor 23 is operated. Further, the expansion valve 35 is normally operated. Specifically, the expansion valve 35 is controlled so that the valve opening reaches a predetermined target opening, and the process returns to the main routine.

(4) If it is determined that the increase in the cooling capacity of the target device is not permitted, the ECU 50 turns off the refrigeration cycle in S4061. Specifically, the compressor 23 is stopped. Further, the expansion valve 35 is controlled so that the valve opening is fully opened, and the process returns to the main routine.

As described above, the ECU 50 determines that the vehicle is stopped, determines that it is not necessary to keep the target device warm, and determines that the cooling capacity needs to be increased. When it is determined to permit, the ECU 50 turns on the refrigeration cycle. Further, the expansion valve 35 is normally operated. Therefore, the first heat medium can flow into the condenser 16, and the cooling performance can be increased.

(Other embodiments)
(1) In the first to thirtieth embodiments, as shown in FIGS. 2 and 37, the cooler 14 is arranged between the secondary batteries 12a and 12b, and the terminals are extended from the lateral direction. . In the thirtieth embodiment, as shown in FIG. 38, the cooler 14 is arranged between the secondary batteries 12a and 12b, and the terminals are extended from above. In the thirty-first embodiment, the secondary battery 12a is arranged on one side of the cooler 14 as shown in FIG. However, the shape and arrangement of the cooler 14 and the secondary batteries 12a and 12b are not limited to those described in the above embodiments.

(2) In the above embodiment, a configuration in which a part of the first connection pipe 201 is arranged below the inflow port 163 of the condenser 16 in the vertical direction, and a part of the first connection pipe 201 is Above the outlet 212 in the vertical direction.

On the other hand, at least a part of the first connection pipe 201 may be disposed below the inlet 163 of the condenser 16, and at least a part of the first connection pipe 201 It is also possible to adopt a configuration arranged above the outlet 212 in the up-down direction.

(3) In each of the above embodiments, a configuration in which a part of the second connection pipe 202 is disposed below the outlet 164 of the condenser 16 in the vertical direction, and a part of the second connection pipe 202 is 21 shows a configuration arranged above the inflow port 211 in the vertical direction.

On the other hand, at least a part of the second connection pipe 202 may be arranged below the outlet 164 of the condenser 16 in the vertical direction. In addition, at least a part of the second connection pipe 202 may be configured to be disposed above the inlet 211 of the condenser 21 in the up-down direction.

(4) In the twenty-third embodiment, the turn part 165 extending in the vertical direction is formed inside the secondary circuit 16b of the condenser 16. Then, the turn portion 165 extends inside the secondary circuit 16 b of the condenser 16 from the inlet 163 of the secondary circuit 16 b upward in the vertical direction, and then extends downward in the vertical direction toward the outlet 164. A channel extending to the side is formed. On the other hand, as shown in FIGS. 46 to 49, a turn portion 169 extending in the horizontal direction can be formed inside the secondary circuit 16b of the condenser 16. In particular, in the configuration shown in FIG. 47, the positions of the inflow port 163 and the outflow port 164 are low, and the refrigerant for the refrigeration cycle that flows into the secondary circuit 16b and evaporates is difficult to escape, so that the discharge of the refrigeration cycle refrigerant is suppressed. Can be easier to do. Also in the configuration shown in FIG. 49, the positions of the inflow port 1631 and the inflow port 1632 are low, and the refrigerant for the refrigeration cycle that flows into the secondary circuit 16b and evaporates becomes difficult to escape, thereby suppressing the discharge of the refrigeration cycle refrigerant. Can be easier to do.

(5) In the thirteenth embodiment, the liquid reservoir 30 is provided in the first connection pipe 201 for supplying the refrigerant for the refrigeration cycle flowing out of the condenser 21 to the inlet 163 of the secondary circuit 16b of the condenser 16. Alternatively, the condenser 21 and the liquid reservoir 30 may be provided integrally.

(6) In each of the above embodiments, the capacitor 21 is arranged vertically, but the capacitor 21 may be arranged horizontally.

(7) In each of the above embodiments, the rechargeable batteries 12a and 12b mounted on the electric vehicle are set as the objects to be cooled by the device temperature control device. However, those other than the rechargeable batteries 12a and 12b are set as the objects to be cooled. You can also.

Note that the present disclosure is not limited to the above-described embodiment, and can be appropriately modified. The above embodiments are not irrelevant to each other, and can be appropriately combined unless a combination is clearly not possible. In each of the above embodiments, it is needless to say that elements constituting the embodiments are not necessarily essential, unless otherwise clearly indicated as essential or in principle considered to be clearly essential. No. In each of the above embodiments, when a numerical value such as the number, numerical value, amount, range, or the like of the constituent elements of the exemplary embodiment is mentioned, it is particularly limited to a specific number when it is clearly stated that it is essential and in principle The number is not limited to the specific number unless otherwise specified. Further, in each of the above embodiments, when referring to the material, shape, positional relationship, and the like of the components and the like, unless otherwise specified, and in principle, it is limited to a specific material, shape, positional relationship, and the like. However, the material, shape, positional relationship, and the like are not limited.

(Summary)
According to a first aspect shown in a part or all of each of the above embodiments, the device temperature control device includes a thermosiphon having a first circulation circuit that circulates a first heat medium, The temperature of the target device is adjusted by the phase change between the liquid phase and the gas phase. In addition, the device temperature control device includes a second circulation circuit that circulates the second heat medium, and a compressor that compresses and discharges the second heat medium inside the second circulation circuit. Further, a heat radiating heat exchanger that exchanges heat with the second heat medium discharged from the compressor and radiates heat of the second heat medium, and depressurizes the second heat medium flowing out of the heat radiating heat exchanger. An expansion valve; Further, the thermosiphon is provided in the first circulation circuit, and includes a device heat exchanger configured to be able to exchange heat between the target device and the first heat medium such that the first heat medium evaporates when the target device is cooled. Have. In addition, there is provided a condenser for exchanging heat between the second heat medium depressurized by the expansion valve and the first heat medium evaporated by the equipment heat exchanger to condense the first heat medium. Further, the condenser has an inlet for flowing in the second heat medium, and an outlet for flowing out the second heat medium, and the heat-radiating heat exchanger has an inlet for flowing in the second heat medium; And an outlet for flowing out the second heat medium. Further, the compressor has a suction port for sucking the second heat medium, and a discharge port for discharging the second heat medium. In addition, the second circulation circuit has a first connection pipe that connects between an outlet of the heat exchanger for heat radiation and an inlet of the condenser. In addition, it has a second connection pipe that connects between the outlet of the condenser and the inlet of the heat exchanger for heat radiation. And when a compressor stops operation | movement, it becomes the structure which suppresses the 2nd heat medium flowing into a condenser from a heat-radiating heat exchanger by gravity.

According to the second aspect, at least a portion of the first connection pipe is disposed below the inlet of the condenser in the vertical direction. Therefore, when the compressor stops operating, the second heat medium can be prevented from flowing from the heat-radiating heat exchanger to the condenser due to gravity, and the thermosiphon when the compressor stops operating can be suppressed. The cooling of the cooling target device due to the above can be suppressed.

According to the third aspect, at least a portion of the first connection pipe is disposed vertically above the outlet of the heat-radiating heat exchanger. Therefore, when the compressor stops operating, the second heat medium can be prevented from flowing from the heat-radiating heat exchanger to the condenser due to gravity, and the thermosiphon when the compressor stops operating can be suppressed. The cooling of the cooling target device due to the above can be suppressed.

According to the fourth aspect, at least a part of the second connection pipe is disposed below the inlet of the condenser in the vertical direction. Therefore, when the compressor stops operating, the second heat medium can be prevented from flowing from the heat-radiating heat exchanger to the condenser due to gravity, and the thermosiphon when the compressor stops operating can be suppressed. The cooling of the cooling target device due to the above can be suppressed.

According to the fifth aspect, at least a part of the second connection pipe is disposed vertically above the inflow port of the heat radiation heat exchanger. Therefore, when the compressor stops operating, the second heat medium can be prevented from flowing from the heat-radiating heat exchanger to the condenser due to gravity, and the thermosiphon when the compressor stops operating can be suppressed. The cooling of the cooling target device due to the above can be suppressed.

According to the sixth aspect, the inlet of the condenser and the outlet of the condenser are the inlet of the compressor, the outlet of the compressor, the expansion valve, the inlet of the heat exchanger for heat dissipation, and the heat of heat dissipation. It is arranged so as to be located vertically above the outlet of the exchanger.

Therefore, when the compressor stops operating, the second heat medium can be prevented from flowing from the heat-radiating heat exchanger to the condenser due to gravity, and the thermosiphon when the compressor stops operating can be suppressed. The cooling of the cooling target device due to the above can be suppressed.

According to the seventh aspect, the inflow port of the condenser and the outflow port of the condenser are arranged vertically above and below the target liquid level of the second heat medium when the second circulation medium is filled with the second heat medium. It is arranged on the upper side.

Therefore, when the compressor stops operating, the second heat medium can be prevented from flowing from the heat-radiating heat exchanger to the condenser due to gravity, and the thermosiphon when the compressor stops operating can be suppressed. The cooling of the cooling target device due to the above can be suppressed.

Further, according to the eighth aspect, the inlet of the heat-radiating heat exchanger and the outlet of the heat-radiating heat exchanger are located at the center in the vertical direction of the space where the second heat medium inside the heat-radiating heat exchanger is stored. Are also located above.

Therefore, when the operation of the compressor is stopped, the second heat medium inside the heat radiating heat exchanger can hardly flow out from the inlet of the heat radiating heat exchanger and the outlet of the heat radiating heat exchanger. Further, when the operation of the compressor is stopped, it is also possible to suppress the second heat medium from flowing into the condenser from the heat radiation heat exchanger by gravity.

According to a ninth aspect, the device temperature control device further includes a liquid storage section that is disposed in the first connection pipe and stores the second heat medium that has flowed out of the outlet of the heat-radiating heat exchanger. When the operation of the compressor is stopped, the second heat medium accumulates in the liquid reservoir, and when the compressor stops operating, the second heat medium flows into the condenser from the heat-radiating heat exchanger into the condenser. Can be suppressed.

According to the tenth aspect, the compressor is provided in a portion of the second connection pipe that is disposed below the outlet of the condenser in the vertical direction. In this way, by providing the compressor at a portion of the second connection pipe disposed vertically below the outlet of the condenser, the second heat is supplied from the heat-radiating heat exchanger to the condenser through the compressor. The inflow of the medium can be suppressed.

According to the eleventh aspect, the heat-radiating heat exchanger has at least two ports (213) forming an inlet for flowing in the second heat medium and an outlet for flowing out the second heat medium. I have. In addition, the entrance and exit of the heat exchanger for heat radiation are arranged at different positions in the vertical direction.

And the 1st connection piping connects between the entrance and exit arranged in the up-and-down direction above the entrance and exit arranged in the up-and-down direction most among the entrances and exits of the heat exchanger for heat dissipation, and the inflow of the condenser. I have.

Therefore, when the compressor stops operating, the second heat medium can be prevented from flowing from the heat-radiating heat exchanger to the condenser by gravity, and the thermosiphon when the compressor stops operating can be suppressed. The cooling of the cooling target device due to the above can be suppressed.

According to a twelfth aspect, at least one of the first connection pipe and the second connection pipe has a flow path of a flow path of the second heat medium flowing through at least one of the first connection pipe and the second connection pipe. A channel area changing section for changing the area is provided. Therefore, when the compressor stops operating, the second heat medium can be prevented from flowing from the heat-radiating heat exchanger to the condenser due to gravity, and the thermosiphon when the compressor stops operating can be suppressed. The cooling of the cooling target device due to the above can be suppressed.

According to the thirteenth aspect, the flow path area changing portion is an expansion valve. As described above, the flow path area changing portion can be configured by the expansion valve, and the number of components can be reduced.

According to the fourteenth aspect, the flow path area changing unit is a valve that opens and closes the flow path of the second heat medium. In this way, the flow path area changing portion can be configured by the valve that opens and closes the flow path of the second heat medium.

According to the fifteenth aspect, the device temperature control device includes an operation determination unit that determines whether the compressor has stopped operating and a heat retention determination that determines whether the target device needs to be kept warm. And a unit. In addition, when the operation determining unit determines that the compressor has stopped operating and the heat retention determining unit determines that the target device needs to be kept warm, the flow of the second heat medium flowing through the first connection pipe is determined. A flow path control unit that controls the valve so as to reduce the flow path area of the path.

Therefore, when the compressor stops operating, the second heat medium can be prevented from flowing from the heat-radiating heat exchanger to the condenser due to gravity, and the thermosiphon when the compressor stops operating can be suppressed. The cooling of the cooling target device due to the above can be suppressed.

According to the sixteenth aspect, the device temperature control device is mounted on the vehicle, and the heat radiation heat exchanger exchanges heat between the second heat medium and the outside air of the vehicle. Thus, the heat-radiating heat exchanger can be configured to perform heat exchange between the second heat medium and the outside air of the vehicle.

According to a seventeenth aspect, the heat exchanger for heat dissipation has an inlet for inflow of the second heat medium and an outlet for outflow of the second heat medium, and the condenser includes the second heat medium. It has an inlet for flowing the medium and an outlet for flowing the second heat medium.

In addition, the second circulation circuit includes a first branch part provided in the middle of the first connection pipe, and a third connection pipe connecting between the second branch part provided in the middle of the second connection pipe, have.

The third connection pipe has a decompression unit for decompressing the second heat medium flowing from the heat exchanger for heat radiation, and a refrigeration unit for exchanging air with the second heat medium decompressed by the decompression unit to cool the air. A cycle evaporator.

At least a part of the flow path between the outlet of the condenser and the second branch portion in the second connection pipe is disposed so as to be located vertically above the second branch portion.

Therefore, it is possible to prevent the refrigerant for the refrigeration cycle from flowing into the second branch portion N from the refrigeration cycle evaporator 40 from flowing into the outlet of the condenser.

According to an eighteenth aspect, an apparatus temperature controller includes a thermosiphon having a first circulation circuit that circulates a first heat medium, and the target apparatus is controlled by a phase change between a liquid phase and a gas phase of the first heat medium. Adjust the temperature of the. In addition, the device temperature control device includes a second circulation circuit that circulates the second heat medium, and a compressor that compresses and discharges the second heat medium inside the second circulation circuit. Further, a heat radiating heat exchanger that exchanges heat with the second heat medium discharged from the compressor and radiates heat of the second heat medium, and depressurizes the second heat medium flowing out of the heat radiating heat exchanger. An expansion valve;

In addition, the thermosiphon is provided in the first circulation circuit, and includes a device heat exchanger configured to be able to exchange heat between the target device and the first heat medium such that the first heat medium evaporates when the target device is cooled. Have. In addition, a condenser is provided for exchanging heat between the second heat medium depressurized by the expansion valve and the first heat medium evaporated by the equipment heat exchanger to condense the first heat medium.

In addition, the condenser includes a secondary circuit through which the second heat medium flows, an inlet through which the second heat medium flows into the secondary circuit, an outlet through which the second heat medium flows out of the secondary circuit, have. And it has the discharge | emission suppression structure which suppresses discharge | emission of the 2nd heat medium which flowed into the secondary circuit from the inflow port of the secondary circuit.

According to the nineteenth aspect, a turn portion (165 to 167) for changing the direction of the second heat medium flowing from the inlet of the secondary circuit is disposed inside the secondary circuit. . Then, the direction of the second heat medium is changed by the turn portion, so that the discharge of the second heat medium flowing into the secondary circuit from the inflow port is suppressed. Thus, it is possible to suppress the discharge of the second heat medium that has flowed into the secondary circuit.

According to the twentieth aspect, the inside of the secondary circuit is provided with a second gaseous phase above and below the inlet formed in the secondary circuit and the outlet formed in the secondary circuit. A gas reservoir (X) for storing the heat medium is formed. In addition, since the second heat medium is accumulated in the gas reservoir, the discharge of the second heat medium that has flowed into the secondary circuit from the inflow port is suppressed. Thus, it is possible to suppress the discharge of the second heat medium that has flowed into the secondary circuit.

According to the twenty-first aspect, a turn portion (168) for changing the direction of the second heat medium flowing from the inflow port formed in the secondary circuit is disposed inside the secondary circuit. I have. The inflow port of the secondary circuit is disposed above the vertical center of the space in the secondary circuit where the second heat medium is stored.

Therefore, the second heat medium that has flowed into the secondary circuit evaporates inside the secondary circuit and tends to flow back to the inlet side of the secondary circuit. Thereby, the discharge of the refrigerant for the refrigeration cycle flowing into the secondary circuit of the condenser from the inlet of the secondary circuit of the condenser is suppressed. Thus, it is possible to suppress the discharge of the second heat medium that has flowed into the secondary circuit.

According to the twenty-second aspect, the device temperature control device includes the heat retention determining unit that determines whether the target device needs to be kept warm. In addition, there is provided a capacity increase determination unit that determines whether the cooling capacity of the target device needs to be increased.

Also, when the heat retention determining unit determines that the target device does not need to be kept warm, and when the capacity increase determination unit determines that the cooling capacity of the target device needs to be increased, a compressor operating unit that operates the compressor. It has.

Therefore, even when it is determined that the compressor has stopped operating and that it is determined that the target device does not need to be kept warm, the compressor operating unit needs to increase the cooling capacity of the target device by the capacity increase determination unit. If it is determined that there is, the compressor is operated.

In other words, when it is determined that the cooling capacity of the target device needs to be increased, the first heat medium can be forced to flow into the condenser, and the cooling performance can be increased.

According to the twenty-third aspect, when the temperature of the target device is equal to or higher than the first threshold, the heat retention determination unit determines that the target device needs to be kept warm, and the temperature of the target device is lower than the first threshold. In this case, it is determined that the target device need not be kept warm.

In addition, when the temperature of the target device is equal to or higher than a second threshold value higher than the first threshold value, the capacity increase determination unit determines that the cooling capacity of the target device needs to be increased, and the temperature of the target device becomes the second threshold value. If less than, it is determined that it is not necessary to increase the cooling capacity of the target device.

As described above, when the temperature of the target device is equal to or higher than the first threshold, the heat retention determining unit determines that the target device needs to be kept warm, and the capacity increase determination unit determines that the temperature of the target device is higher than the first threshold. If it is equal to or higher than the high second threshold, it is preferable to determine that the cooling capacity of the target device needs to be increased.

According to the twenty-fourth aspect, when the capacity increase determination unit determines that the cooling capacity of the target device needs to be increased, the permission determination for determining whether to permit the increase of the cooling capacity of the target device is performed. It has a part.

{Circle around (4)} When the permission determining unit determines that the increase in the cooling capacity of the target device is permitted, the compressor operating unit operates the compressor.

As described above, it is determined whether or not the increase in the cooling capacity of the target device is permitted. If it is determined that the increase in the cooling capability of the target device is permitted, the compressor can be operated.

According to the twenty-fifth aspect, the target device is a secondary battery that supplies power to the compressor, and the permission determination unit determines that the secondary battery is being charged or that the charging of the secondary battery is started. When it is estimated, it is determined that the increase of the cooling capacity of the target device is permitted. Therefore, since electric power for driving the compressor 23 can be secured, it is possible to suppress a decrease in the cruising distance due to the secondary battery in the next traveling.

処理 Note that the processing of S304, S404, and S4041 corresponds to the compressor operating unit, and the processing of S100 corresponds to the operation determining unit. Further, the processing of S302 corresponds to a capacity increase determination unit, the processing of S104 corresponds to a heat retention determination unit, and the processing of S108 corresponds to a flow path control unit.

Claims (25)

A thermosiphon (10) having a first circulation circuit (100) for circulating a first heat medium is provided, and a temperature of a target device (12a, 12b) is adjusted by a phase change between a liquid phase and a gas phase of the first heat medium. Device temperature control device,
A second circulation circuit (200) for circulating a second heat medium, a compressor (23) for compressing and discharging the second heat medium inside the second circulation circuit, and a compressor (23) discharged from the compressor. A heat-dissipating heat exchanger (21) for exchanging heat with the second heat medium and air to radiate heat of the second heat medium; and an expansion valve for decompressing the second heat medium flowing out of the heat-dissipating heat exchanger. (22, 33, 35).
The thermosiphon,
A device heat exchanger (14) that is arranged in the first circulation circuit and configured to allow heat exchange between the target device and the first heat medium such that the first heat medium evaporates when the target device is cooled. )When,
A condenser (16) for exchanging heat between the second heat medium depressurized by the expansion valve and the first heat medium evaporated by the equipment heat exchanger to condense the first heat medium. And
The condenser has an inlet (163) through which the second heat medium flows, and an outlet (164) through which the second heat medium flows,
The heat-radiating heat exchanger has an inlet (211) through which the second heat medium flows, and an outlet (212) through which the second heat medium flows,
The compressor has a suction port (231) for sucking the second heat medium, and a discharge port (232) for discharging the second heat medium,
The second circulation circuit includes a first connection pipe (201) that connects the outlet of the heat exchanger for heat dissipation and the inlet of the condenser, and the outlet of the condenser and the heat sink. A second connection pipe (202) for connecting with the inflow port of the heat exchanger.
An apparatus temperature control device configured to prevent the second heat medium from flowing from the heat-radiating heat exchanger to the condenser by gravity when the compressor stops operating. 2. The apparatus temperature control device according to claim 1, wherein at least a part of the first connection pipe is disposed vertically below the inflow port of the condenser. The device temperature control device according to claim 1 or 2, wherein at least a part of the first connection pipe is disposed vertically above the outflow port of the heat exchanger for heat radiation. 4. The apparatus temperature control device according to claim 1, wherein at least a part of the second connection pipe is disposed vertically below the outlet of the condenser. 5. The apparatus temperature control device according to any one of claims 1 to 4, wherein at least a part of the second connection pipe is disposed vertically above the inflow port of the heat-radiating heat exchanger. The inlet of the condenser and the outlet of the condenser are the inlet of the compressor, the outlet of the compressor, the expansion valve, the inlet of the heat exchanger for heat radiation, and the heat radiation. The apparatus temperature control device according to claim 1, wherein the device temperature control device is disposed so as to be located vertically above the outlet of the heat exchanger for use. The inflow port of the condenser and the outflow port of the condenser are arranged vertically above a target liquid level of the second heat medium when the second circulation medium is filled with the second heat medium. The apparatus temperature controller according to any one of claims 1 to 6, wherein: The inflow port of the heat radiation heat exchanger and the outflow port of the heat radiation heat exchanger are arranged above a vertical center of a space where the second heat medium is stored inside the heat radiation heat exchanger. The apparatus temperature controller according to any one of claims 1 to 7, wherein: 9. The liquid storage section according to claim 1, further comprising a liquid storage section disposed in the first connection pipe and configured to store the second heat medium flowing out from the outlet of the heat-radiating heat exchanger. 10. Equipment temperature controller. 5. The apparatus temperature controller according to claim 4, wherein the compressor is provided in a portion of the second connection pipe that is disposed below the outlet of the condenser in a vertical direction. 6. The heat-radiating heat exchanger has at least two ports (213) constituting the inflow port for inflow of the second heat medium and the outflow port for outflow of the second heat medium,
The entrance and exit of the heat exchanger for heat radiation are arranged at different positions in the vertical direction,
The first connection pipe is provided between the inlet and outlet of the condenser and the inlet and outlet of the condenser, which are arranged vertically above the inlet and outlet arranged at the most vertically lower side of the heat exchanger. The device temperature controller according to any one of claims 1 to 10, wherein the devices are connected to each other. A flow path that changes a flow area of a flow path of the second heat medium flowing through at least one of the first connection pipe and the second connection pipe in at least one of the first connection pipe and the second connection pipe. The device temperature controller according to any one of claims 1 to 11, further comprising an area changing unit (33 to 35). The device temperature control device according to claim 12, wherein the flow path area changing portion is the expansion valve (33). The device temperature controller according to claim 12, wherein the flow path area changing unit is a valve (34, 35) for opening and closing the flow path of the second heat medium. An operation determining unit (S100) for determining whether or not the compressor has stopped operating;
A heat retention determining unit (S104) for determining whether the target device needs to be kept warm;
The first connection pipe and the second connection pipe when the operation determination unit determines that the compressor has stopped operating and the heat retention determination unit determines that the target device needs to be kept warm. The apparatus temperature control device according to claim 14, further comprising: a flow path control unit (S108) that controls the valve so as to reduce a flow path area of the flow path of the second heat medium flowing through at least one of the flow paths. The device temperature controller is mounted on a vehicle,
The device temperature controller according to any one of claims 1 to 15, wherein the heat radiation heat exchanger performs heat exchange between the second heat medium and outside air of the vehicle. The heat-radiating heat exchanger has an inlet (211) through which the second heat medium flows, and an outlet (212) through which the second heat medium flows,
The condenser has an inlet (163) through which the second heat medium flows, and an outlet (164) through which the second heat medium flows,
The second circulation circuit connects a first branch (M) provided in the middle of the first connection pipe and a second branch (N) provided in the middle of the second connection pipe. A third connection pipe (203) to be
The third connection pipe has a decompression unit (42) for decompressing the second heat medium flowing from the heat exchanger for heat dissipation, and heat exchanges the air with the second heat medium decompressed by the decompression unit. And a refrigerating cycle evaporator (40) for cooling the air.
At least a part of a flow path between the outlet of the condenser and the second branch portion in the second connection pipe is arranged to be located vertically above the second branch portion. Item 2. An apparatus temperature controller according to Item 1. A thermosiphon (10) having a first circulation circuit (100) for circulating a first heat medium is provided, and a temperature of a target device (12a, 12b) is adjusted by a phase change between a liquid phase and a gas phase of the first heat medium. Device temperature control device,
A second circulation circuit (200) for circulating a second heat medium, a compressor (23) for compressing and discharging the second heat medium inside the second circulation circuit, and a compressor (23) discharged from the compressor. A heat-dissipating heat exchanger (21) for exchanging heat with the second heat medium and air to dissipate heat of the second heat medium; and an expansion valve for decompressing the second heat medium flowing out of the heat-dissipating heat exchanger. (22) and a refrigeration cycle (20) having
The thermosiphon,
A device heat exchanger (14) that is arranged in the first circulation circuit and configured to allow heat exchange between the target device and the first heat medium such that the first heat medium evaporates when the target device is cooled. )When,
A condenser (16) for exchanging heat between the second heat medium depressurized by the expansion valve and the first heat medium evaporated by the equipment heat exchanger to condense the first heat medium. And
The condenser includes a secondary circuit (16b) through which the second heat medium flows, an inlet (163) through which the second heat medium flows into the secondary circuit, and the second circuit from the secondary circuit. An outlet (164) through which the heat medium flows out, and
An apparatus temperature control device having a discharge suppression structure that suppresses discharge of the second heat medium flowing into the secondary circuit from the inflow port of the secondary circuit. Inside the secondary circuit, a turn portion (165 to 167) for changing the direction of the second heat medium flowing from the inflow port of the secondary circuit is disposed.
19. The device temperature controller according to claim 18, wherein the direction of the second heat medium is changed by the turn portion, so that the discharge of the second heat medium flowing into the secondary circuit is suppressed. Inside the secondary circuit, the gaseous second heat medium is stored vertically above the inflow port formed in the secondary circuit and the outflow port formed in the secondary circuit. A gas reservoir (X) is formed,
19. The device temperature control device according to claim 18, wherein the second heat medium is stored in the gas reservoir, thereby suppressing discharge of the second heat medium that has flowed into the secondary circuit. Inside the secondary circuit, turn portions (165 to 168) for changing the direction of the second heat medium flowing from the inflow port formed in the secondary circuit are arranged.
19. The device temperature controller according to claim 18, wherein the inflow port of the secondary circuit is disposed above a vertical center of a space in which the second heat medium is stored inside the secondary circuit. . A heat retention determining unit (S104) for determining whether the target device needs to be kept warm;
A capacity increase determination unit (S302) for determining whether the cooling capacity of the target device needs to be increased;
When it is determined that the target device does not need to be kept warm by the heat retention determining unit, and when it is determined that the cooling capacity of the target device needs to be increased by the capacity increase determining unit, the compression for operating the compressor is performed. The apparatus temperature controller according to claim 1 or 18, further comprising: a machine operating unit (S304, S404, S4041). When the temperature of the target device is equal to or higher than a first threshold, the heat retention determining unit determines that the target device needs to be kept warm, and when the temperature of the target device is lower than the first threshold, the target device. Judge that it is not necessary to keep warm,
When the temperature of the target device is equal to or higher than a second threshold value higher than the first threshold value, the capacity increase determination unit determines that the cooling capacity of the target device needs to be increased, and the temperature of the target device is higher. 23. The device temperature controller according to claim 22, wherein when the value is less than the second threshold value, it is determined that the cooling capacity of the target device does not need to be increased. When the capacity increase determination unit determines that the cooling capacity of the target device needs to be increased, a permission determination unit (S308) that determines whether to increase the cooling capacity of the target device is provided,
24. The device temperature control device according to claim 22, wherein the compressor operating unit operates the compressor when the permission determining unit determines that the increase of the cooling capacity of the target device is permitted. The target device is a secondary battery that supplies power to the compressor,
The device according to claim 24, wherein the permission determination unit determines that an increase in the cooling capacity of the target device is permitted when the secondary battery is being charged or when it is estimated that charging of the secondary battery is started. Temperature control device.

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