WO2020001676A1 - Procédé et dispositif de revêtement d'un module par dépôt physique en phase vapeur - Google Patents
Procédé et dispositif de revêtement d'un module par dépôt physique en phase vapeur Download PDFInfo
- Publication number
- WO2020001676A1 WO2020001676A1 PCT/DE2019/100417 DE2019100417W WO2020001676A1 WO 2020001676 A1 WO2020001676 A1 WO 2020001676A1 DE 2019100417 W DE2019100417 W DE 2019100417W WO 2020001676 A1 WO2020001676 A1 WO 2020001676A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- coating
- component
- ion source
- sputtering
- cathode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/021—Cleaning or etching treatments
- C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
Definitions
- the invention relates to a method for coating a component by means of physical vapor deposition, wherein impurities are removed from a surface of the component in a cleaning step by means of an ion beam and one in a coating step by sputtering
- Another object of the invention is a device for coating a component by means of physical vapor deposition, the device being a
- Ion source for removing contaminants from a surface of the component and a sputtering cathode for coating the surface of the component.
- Starting material is converted into a gaseous phase, which then condenses on a substrate, for example on the surface of a component, and in this way produces a coating of the surface.
- the transition to the gaseous state can take place, for example, by thermal evaporation, bombardment with electron or laser beams, arc evaporation or by
- Sputtering can be effected.
- the evaporation or atomization and the subsequent condensation take place under greatly reduced pressure, usually in an evacuated chamber.
- the evaporation or atomization and the subsequent condensation take place under greatly reduced pressure, usually in an evacuated chamber.
- Gas separation often involves additional process steps to ensure that the coating is as error-free and effective as possible.
- the surface is usually thermally activated by heating before the coating is applied.
- the component can then be cleaned, for example, in which the surface is freed of disruptive impurities.
- the various individual steps each require specific conditions for an optimal process of the physical involved Processes such as different pressure or temperature conditions or a specific composition of the gas atmosphere.
- Lock systems require a significantly more complex manufacturing structure for inline production.
- the task is to provide a coating process that enables effective and inexpensive process control.
- the object is achieved by a method for coating a component by means of physical vapor deposition, with in a cleaning step an ion beam impurities are removed from a surface of the component and in a coating step by sputtering
- Coating is deposited on the surface of the component, the
- the cleaning can be carried out by means of ion bombardment, in which an ion beam is accelerated in the direction of the substrate by an electric field and, when it hits the surface, detaches the contaminants present there.
- ions can also be used which knock out of a solid starting material, a so-called target, atoms or atomic clusters, which subsequently adhere to the surface of the
- a strong electric field can be generated between the target and the workpiece by an applied voltage, the target forming the negatively charged cathode and the workpiece forming the positively charged anode.
- positively charged ions are accelerated towards the target, where they impinge upon impact on the target surface and trigger a collision cascade that tears atoms or atomic clusters out of the surface.
- the ions themselves can be generated, for example, by ionizing the gas atmosphere in the chamber.
- the electrical field between the cathode and anode electrons are accelerated, which then switch to neutral with correspondingly high kinetic energy
- the component is positioned in the cleaning step in the vicinity of an ion source and in the coating step in the vicinity of an atomizing cathode, the component being between the cleaning step and the coating step
- Means of transport, in particular by a conveyor belt, is transported from the ion source to the sputtering cathode.
- the ion source and the sputtering cathode are moved by a shielding device, in particular by a ferromagnetic diaphragm,
- the shielding advantageously eliminates or at least reduces mutual interference between the cleaning and coating processes. Especially with a form of
- the shielding device also shields electrostatic fields, so that the field profile between the electrodes of the cleaning and coating device is not disturbed or distorted by the electrodes of the other device.
- the ion beam is generated by a flall effect ion source and / or the coating is deposited on the surface of the component by magnetron sputtering.
- a flall effect ion source the ions are generated by a plasma that is ignited between a cathode and an anode.
- a magnetic field is applied in addition to the electric field, which forces the electrons flowing towards the anode onto helical paths and thus increases their ionization capability in the plasma region.
- the ions are generated by an end-fall ion source. This design, known from the prior art, has proven to be particularly suitable for surface treatment and in particular
- magnetron sputtering also magnetron sputtering
- the release of the ions for the sputtering process is increased by a magnetic field in a manner similar to a Hall-effect ion source.
- a magnet attached behind the target forces the electrons onto screw tracks, so that the probability of collision with neutral atoms increases and the ionization above the target is increased accordingly.
- Magnetic fields are therefore used for ion formation both in the Hall effect ion source and in the magnetron sputtering.
- these two techniques are combined with a shielding mechanism by means of which a mutual influence by the respective magnetic fields is prevented
- the component is processed in one step, the cleaning step and the
- Heating step, the cleaning step and the coating step are carried out in the same gas atmosphere and under the same pressure.
- Heating of the workpiece to be coated is advantageously achieved that the diffusion on the surface is accelerated by thermal activation. In this way there is an increased during the coating
- a process gas for generating the gas atmosphere in the region of the sputtering cathode is supplied to the method. Since the ions for bombarding the target by ionization form from the neutral gas atoms, it is advantageous if the gas inlet is arranged in the vicinity of the sputtering cathode, so that the introduced gas is immediately available for ionization. In this way, local conditions are created within the common chamber, under which the respective physical processes can run optimally.
- a pressure below 1 mTorr is necessary, while a pressure above 1 mTorr is required for stable magnetron sputtering.
- both processes can advantageously be carried out under the same pressure conditions.
- the gas flow introduced into the chamber is the transport movement of the workpieces
- Atomizing cathode is steered. It is also conceivable that the gas flow is guided in such a way that the gas flows from the inlet opening to the
- Sputtering cathode flows and is directed from there via the cleaning device to an outlet opening.
- the gas atmosphere is formed by noble gases, in particular argon, neon or flelium, or by a mixture of noble gases and reactive gases, in particular nitrogen, oxygen or hydrogen.
- Another object of the invention is a device for coating a component by means of physical vapor deposition, the device having an ion source for removing contaminants from a surface of the component and a sputtering cathode for coating the surface of the component, the ion source and the sputtering cathode in a common one gas-filled chamber are arranged.
- the cleaning and coating of the workpieces can advantageously be combined in a common chamber Carry out without the need for separate chambers for the two steps, each with its own pressure conditions.
- the workpieces are fed in and out via a lock system, so that the combined cleaning and coating station can advantageously be used as part of a continuous system.
- the combined cleaning and coating station can advantageously be used as part of a continuous system.
- Workpieces are fed in and out via a loading system.
- the device has a shielding device, in particular a ferromagnetic diaphragm, which is arranged between the ion source and the sputtering cathode.
- a shielding device in particular a ferromagnetic diaphragm, which is arranged between the ion source and the sputtering cathode.
- Possible materials for this are ferromagnetic pure metals such as iron, nickel or cobalt, as well as ferromagnetic alloys based on these metals.
- the shielding advantageously creates a mutual interference between the ion source and the sputtering cathode.
- the device has a heating device, in particular an infrared heating device, in the common gas-filled chamber.
- a heating device in particular an infrared heating device
- the thermal pretreatment of the surface can thus advantageously be carried out within the same chamber.
- the device has a transport means, in particular a conveyor belt, the transport means being designed such that the component moves from the heating device to the ion source and / or from the ion source to
- Atomizing cathode is transported. According to a further advantageous embodiment of the invention
- the device has a gas supply, the gas supply in the
- Fig. 1 shows an embodiment of the device according to the invention in a
- Process steps are carried out in a common chamber 8, the device 10 being designed such that the physical ones involved
- Processes can run optimally under the same physical conditions, especially under the same pressure.
- the components 7 to be coated are inside the chamber 8 with a
- the components 7 are heated to the processing temperature by a heating device 7, for example an infrared heating device 7. This ensures an increased surface diffusion during the coating, so that the material deposited on the surface of the components 7 is distributed as homogeneously as possible on the surface and any defects that may occur are also healed.
- the heated components 7 are transported to an ion source 1, for example an end Hall ion source 1, where by the ion radiation
- Contaminants are detached from the surface of the components 7.
- the components 7 prepared in this way become a magnetron
- Sputtering cathode 2 transported.
- the coating material is removed from the sputtering cathode 2 by sputtering a target.
- the sputtered material condenses on the components 7 and forms a layer there on the
- a shielding device 5 in the form of a ferromagnetic shield 5 is arranged, through which it is prevented that the magnetic fields lead to interference in the other component.
- Sputtering cathode 2 ensures that the gas supplied is immediately available for the ion formation of the sputtering process on the sputtering cathode 2. Certain components of the gas introduced are through this
- the process is partially consumed, so that the gas with a different composition flows on to the cleaning unit 1, where a lower ionization rate is required to generate the cleaning jet.
- the device 10 described above for coating a component 7 by means of physical vapor deposition has an ion source 1
- the device 10 described is suitable for carrying out a method for coating a component 7 by means of physical vapor deposition which contaminants are removed from a surface of the component 7 in a cleaning step by means of an ion beam, and a coating is deposited on the surface of the component 7 in a coating step by cathode sputtering, the cleaning step and the coating step being carried out in the same gas atmosphere and under the same pressure.
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
L'invention concerne un procédé de revêtement d'un module (7) par dépôt physique en phase vapeur, des impuretés étant éliminées d'une surface du module (7) par un rayon ionique lors d'une étape de nettoyage et un revêtement étant déposé sur la surface du module (7) par pulvérisation cathodique lors d'une étape de revêtement, l'étape de nettoyage et l'étape de revêtement étant mises en œuvre dans la même atmosphère gazeuse et à la même pression. Un autre objet de l'invention est un dispositif (10) de revêtement d'un module (7) par dépôt physique en phase vapeur.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102018115404.6A DE102018115404A1 (de) | 2018-06-27 | 2018-06-27 | Verfahren und Vorrichtung zur Beschichtung eines Bauteils mittels physikalischer Gasphasenabscheidung |
| DE102018115404.6 | 2018-06-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2020001676A1 true WO2020001676A1 (fr) | 2020-01-02 |
Family
ID=66630065
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/DE2019/100417 Ceased WO2020001676A1 (fr) | 2018-06-27 | 2019-05-09 | Procédé et dispositif de revêtement d'un module par dépôt physique en phase vapeur |
Country Status (2)
| Country | Link |
|---|---|
| DE (1) | DE102018115404A1 (fr) |
| WO (1) | WO2020001676A1 (fr) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115558893A (zh) * | 2022-12-07 | 2023-01-03 | 泰州光丽光电科技有限公司 | 一种基于物理气相沉积技术的渐变镀膜设备 |
| WO2024170287A1 (fr) | 2023-02-15 | 2024-08-22 | Flooring Technologies Ltd. | Panneau de matériau en bois à bords carrés et/ou biseautés revêtus et scellés |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6886244B1 (en) * | 2002-02-25 | 2005-05-03 | Seagate Technology Llc | Segmented pallet for disk-shaped substrate electrical biassing and apparatus comprising same |
| US6893544B2 (en) | 2001-08-14 | 2005-05-17 | Samsung Corning Co., Ltd. | Apparatus and method for depositing thin films on a glass substrate |
| EP2565291A1 (fr) | 2011-08-31 | 2013-03-06 | Hauzer Techno Coating BV | Appareil de revêtement par aspiration et procédé de dépôt de revêtements nano-composites |
| US8661776B2 (en) | 2011-09-09 | 2014-03-04 | Iwis Motorsysteme Gmbh & Co., Kg | Link chain with chain joints coated with a hard material |
| WO2015108432A1 (fr) | 2014-01-14 | 2015-07-23 | Айрат Хамитович ХИСАМОВ | Procédé d'application de revêtement en film fin et chaîne industrielle pour sa mise en œuvre |
| EP2905355A1 (fr) | 2012-10-01 | 2015-08-12 | Nissan Motor Co., Ltd. | Dispositif de revêtement en ligne, procédé de revêtement en ligne et séparateur |
| WO2017194088A1 (fr) * | 2016-05-09 | 2017-11-16 | Applied Materials, Inc. | Procédé et appareil pour traitement sous vide |
-
2018
- 2018-06-27 DE DE102018115404.6A patent/DE102018115404A1/de not_active Withdrawn
-
2019
- 2019-05-09 WO PCT/DE2019/100417 patent/WO2020001676A1/fr not_active Ceased
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6893544B2 (en) | 2001-08-14 | 2005-05-17 | Samsung Corning Co., Ltd. | Apparatus and method for depositing thin films on a glass substrate |
| US6886244B1 (en) * | 2002-02-25 | 2005-05-03 | Seagate Technology Llc | Segmented pallet for disk-shaped substrate electrical biassing and apparatus comprising same |
| EP2565291A1 (fr) | 2011-08-31 | 2013-03-06 | Hauzer Techno Coating BV | Appareil de revêtement par aspiration et procédé de dépôt de revêtements nano-composites |
| US20130056348A1 (en) | 2011-08-31 | 2013-03-07 | Hauzer Techno Coating Bv | Vacuum coating apparatus and method for depositing nanocomposite coatings |
| US8661776B2 (en) | 2011-09-09 | 2014-03-04 | Iwis Motorsysteme Gmbh & Co., Kg | Link chain with chain joints coated with a hard material |
| EP2905355A1 (fr) | 2012-10-01 | 2015-08-12 | Nissan Motor Co., Ltd. | Dispositif de revêtement en ligne, procédé de revêtement en ligne et séparateur |
| WO2015108432A1 (fr) | 2014-01-14 | 2015-07-23 | Айрат Хамитович ХИСАМОВ | Procédé d'application de revêtement en film fin et chaîne industrielle pour sa mise en œuvre |
| WO2017194088A1 (fr) * | 2016-05-09 | 2017-11-16 | Applied Materials, Inc. | Procédé et appareil pour traitement sous vide |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115558893A (zh) * | 2022-12-07 | 2023-01-03 | 泰州光丽光电科技有限公司 | 一种基于物理气相沉积技术的渐变镀膜设备 |
| WO2024170287A1 (fr) | 2023-02-15 | 2024-08-22 | Flooring Technologies Ltd. | Panneau de matériau en bois à bords carrés et/ou biseautés revêtus et scellés |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102018115404A1 (de) | 2020-01-02 |
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