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WO2020075611A1 - Composition de résine époxy - Google Patents

Composition de résine époxy Download PDF

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Publication number
WO2020075611A1
WO2020075611A1 PCT/JP2019/039054 JP2019039054W WO2020075611A1 WO 2020075611 A1 WO2020075611 A1 WO 2020075611A1 JP 2019039054 W JP2019039054 W JP 2019039054W WO 2020075611 A1 WO2020075611 A1 WO 2020075611A1
Authority
WO
WIPO (PCT)
Prior art keywords
group
carbon atoms
formula
epoxy resin
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2019/039054
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English (en)
Japanese (ja)
Inventor
充孝 尾▲崎▼
思博 郭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honshu Chemical Industry Co Ltd
Original Assignee
Honshu Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honshu Chemical Industry Co Ltd filed Critical Honshu Chemical Industry Co Ltd
Priority to CN201980062849.2A priority Critical patent/CN112752781B/zh
Priority to JP2020550529A priority patent/JP7355304B2/ja
Priority to KR1020217009209A priority patent/KR102776524B1/ko
Publication of WO2020075611A1 publication Critical patent/WO2020075611A1/fr
Anticipated expiration legal-status Critical
Priority to JP2023145263A priority patent/JP2023158145A/ja
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates

Definitions

  • Epoxy resin becomes a cured product with excellent mechanical properties, adhesion, water resistance, chemical resistance, heat resistance, electrical insulation, etc. when cured with a curing agent, so adhesives, paints, laminates It is used in a wide range of fields, including molding materials and casting materials.
  • Patent Documents 1 and 2 by using a bisphenol A type polycarbonate oligomer as a curing agent, it is possible to obtain an epoxy resin foam having excellent flexibility, flexibility and heat resistance and improved mechanical properties.
  • the performance such as heat resistance has not been sufficient in view of the level required in recent years.
  • the present invention has been made under the circumstances described above, and an object thereof is to provide an epoxy resin composition which is excellent not only in heat resistance but also in dielectric properties.
  • the present invention is as follows. 1.
  • Mw weight average molecular weight
  • B a polyepoxy compound having two or more epoxy groups in one molecule, which is an epoxy resin composition.
  • R 1 , R 2 , R 3 and R 4 are each independently a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, or 5 to 8 carbon atoms.
  • X is a single bond, an alkylene group having 1 to 15 carbon atoms, or 5 carbon atoms
  • cycloalkyl group having 15 to 15 carbon atoms alkylidene group having 2 to 15 carbon atoms, cycloalkylidene group having 5 to 15 carbon atoms
  • phenylene group, adamantane-1,3-ylene group, adamantane-2-ylidene group oxygen atom
  • n is an integer of 1 or more, provided that R 1 , R 2 , R 3 and R 4 are all hydrogen atoms and X is With isopropylidene group Except in the case that.) 2.1.
  • the epoxy resin composition according to the present invention contains a polycarbonate oligomer represented by the formula (1) and / or the formula (2) and / or the formula (3) and having a specific weight average molecular weight as a curing agent, and The characteristics are improved and industrially advantageous effects are exhibited. Further, the cured product obtained by curing the epoxy resin composition according to the present invention has a high glass transition temperature and excellent heat resistance, and thus is suitable as an industrial material requiring heat resistance.
  • X is a single bond, an alkylene group having 1 to 15 carbon atoms, or 5 carbon atoms
  • X is a single bond, an alkylene group having 1 to 15 carbon atoms, or 5 carbon atoms
  • alkylidene group having 2 to 15 carbon atoms alkylidene group having 5 to 15 carbon atoms
  • phenylene group, adamantane-1,3-ylene group, adamantane-2-ylidene group oxygen atom
  • n is an integer of 1 or more, provided that R 1 , R 2 , R 3 and R 4 are all hydrogen atoms and X is With isopropylidene group Except in the case that.)
  • R 1 , R 2 , R 3 and R 4 in the above formulas (1) to (3) is an alkoxy group having 1 to 8 carbon atoms
  • the alkoxy group is preferably carbon. It is a linear or branched alkoxy group having 1 to 4 atoms, and specific examples thereof include a methoxy group and an ethoxy group.
  • Such an alkoxy group may have a substituent such as a phenyl group or an alkoxy group having 1 to 4 carbon atoms as long as the effect of the present application is not impaired.
  • R 1 , R 2 , R 3 and R 4 is an aromatic hydrocarbon group having 6 to 12 carbon atoms
  • an aromatic hydrocarbon group Specific examples thereof include a phenyl group and a naphthyl group.
  • Such an aromatic hydrocarbon group contains, for example, an alkyl group having 1 to 4 carbon atoms and / or an alkoxy group having 1 to 4 carbon atoms in an amount of 1 to 3 within a range that does not impair the effects of the present invention. It may be replaced.
  • the alkylene group is preferably a linear or branched alkylene group having 1 to 8 carbon atoms. And more preferably a linear or branched alkylene group having 1 to 4 carbon atoms, and specific examples thereof include a methylene group, an ethylene group, a propylene group and a butylene group.
  • Such an alkylene group may have a substituent such as an aromatic hydrocarbon group or an alkoxy group as long as the effects of the present invention are not impaired, and examples thereof include a phenylmethylene group and a diphenylmethylene group. .
  • the cycloalkylene group is preferably a cycloalkylene group having 5 to 7 carbon atoms.
  • Such a cycloalkylene group may be substituted with, for example, an alkyl group having 1 to 4 carbon atoms in an amount of about 1 to 3 as long as the effect of the present invention is not impaired.
  • a preferable alkylidene group is a linear or branched alkylidene group having 2 to 15 carbon atoms.
  • ethylidene group propane-1-ylidene group, isopropylidene group, butane-1-ylidene group, butane-2-ylidene group, 2-methylpropane-1-ylidene group, pentane-2.
  • a 3-methylcyclohexane-1-ylidene group and a 3,3,5-trimethylcyclohexane-1-ylidene group examples thereof include a 3-methylcyclohexane-1-ylidene group and a 3,3,5-trimethylcyclohexane-1-ylidene group.
  • an aromatic hydrocarbon group may be condensed with such a cycloalkylidene group within a range that does not impair the effects of the present invention.
  • Specific examples thereof include a fluorene-9-ylidene group and the like.
  • X is a phenylene group
  • specific examples of the phenylene group include a 1,4-phenylene group and a 1,3-phenylene group.
  • Such a phenylene group may have a substituent such as an aromatic hydrocarbon group, an alkyl group or an alkoxy group as long as the effects of the present invention are not impaired.
  • preferred examples of X include a single bond, an alkylene group having 1 to 4 carbon atoms which may have a substituent, and a carbon atom which may have a substituent.
  • Examples thereof include an alkylidene group having 1 to 4 and a cycloalkylidene group having 5 to 15 carbon atoms which may have a substituent.
  • X a single bond, a methylene group, an ethylene group, an ethylidene group, a propylidene group, an isopropylidene group, a butylidene group, a phenylmethylidene group, a 1-phenylethane-1-ylidene group, a cyclopentylidene group.
  • polycarbonate oligomer represented by the formula (1) and / or the formula (2) and / or the formula (3) those produced by any conventionally known production method can be used. Specific examples thereof include an interfacial polymerization method, a melt transesterification method, a pyridine method, a ring-opening polymerization method of a cyclic carbonate compound, and a solid-state transesterification method of a prepolymer. Above all, it is industrially advantageous to use the interfacial polymerization method, the melt transesterification method, and the solid-phase transesterification method of the prepolymer.
  • the melt transesterification method which does not use phosgene and the solid-state transesterification method of the prepolymer by the melt transesterification method are particularly preferable.
  • the above production method is performed using a dihydroxy compound represented by the following formula (4) and a carbonic acid ester forming agent.
  • R 1 to R 4 and X in the formula (4) are the same as those in the above formulas (1), (2) and (3).
  • the dihydroxy compound represented by the formula (4) may be used alone or in combination of two or more kinds at an arbitrary ratio.
  • the proportion of the hydroxy compound copolymerization raw material other than the dihydroxy compound represented by the formula (4) in the wholly aromatic dihydroxy compound is , 0 to 90 mol%, preferably 0 to 85 mol%, more preferably 0 to 80 mol%.
  • the mixing ratio of the dihydroxy compound represented by the formula (4) and the carbonic acid ester forming agent is With respect to 1 mol of the dihydroxy compound represented by the formula (4), the carbonic acid ester-forming agent is usually 0.2 to 5 mol times, preferably 0.3 to 3.3 mol times, and more preferably 0.4 to 2 mol times. Use 0.5 molar times. In the melt transesterification reaction, a transesterification catalyst is used if necessary in order to increase the reaction rate.
  • the transesterification catalyst is not particularly limited, and examples thereof include inorganic alkali metal compounds such as lithium, sodium and cesium hydroxides, carbonates, hydrogen carbonate compounds, alcoholates, organic alkali metal compounds such as organic carboxylates, and the like.
  • Examples of the polyepoxy compound represented by the above formula (5) include compounds obtained by reacting a polyhydroxy compound corresponding to the chemical structure of the polyepoxy compound with an epihalohydrin such as epichlorohydrin.
  • component (B) polyepoxy compound in the present invention include, for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, biphenyl type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, xylene novolac type.
  • epoxy resins triglycidyl isocyanurate, alicyclic epoxy resins, dicyclopentadiene novolac type epoxy resins, biphenyl novolac type epoxy resins, known epoxy resins, for example, the following described in JP-A No. 01-98613
  • An epoxy resin represented by the formula may be used. In the formula below, a independently represents an integer of 1 or more, and b represents a positive number of 1 or less. These epoxy resins may be used alone or in combination of two or more.
  • a raw material polyhydroxy compound is dissolved in epihalohydrin such as epichlorohydrin, a polar solvent such as methanol or ethanol is added, and an alkali metal hydroxide solid such as sodium hydroxide or potassium hydroxide is added, or Method of reacting while adding, 3) Using an aqueous solution of an alkali metal hydroxide, successively adding an alkali metal hydroxide and distilling water and epihalohydrin continuously from the reaction system under reduced pressure or under normal pressure, and distilling this Liquid, water is removed and epihalohydrin is continuously returned to the reaction system.
  • epihalohydrin such as epichlorohydrin
  • a polar solvent such as methanol or ethanol
  • an alkali metal hydroxide solid such as sodium hydroxide or potassium hydroxide
  • any of these methods may be used, or a method other than this may be used.
  • the polyepoxy compound of the present invention is produced, a small amount of dimer, trimer, tetramer and other oligomers are by-produced as the epoxidation reaction progresses, but in the present invention, the polyepoxy compound used is an oligomer. May be included in small amounts.
  • the polyepoxy compound used in the present invention may contain a small amount of a compound containing a terminal group having hydrolyzable chlorine in which the formation of the epoxy group is not completed during the epoxidation reaction.
  • the epoxy resin composition of the present invention may contain any component as long as the effects of the present invention are not significantly impaired.
  • the optional component include a curing accelerator, a coupling agent, a flame retardant, an inorganic filler, a resin, a catalyst, a leveling agent, a defoaming agent, an ion scavenger, a stress relaxation agent, a dye and a colorant.
  • One of these optional components may be contained alone, or two or more of them may be contained in any ratio and combination.
  • Any curing accelerator may be used as long as it does not significantly impair the effects of the present invention.
  • examples thereof include epoxysilane, aminosilane, ureidosilane, vinylsilane, alkylsilane, organic titanate, and aluminum alkylate.
  • the flame retardant any one may be used as long as the effect of the present invention is not significantly impaired, and examples thereof include red phosphorus, phosphoric acid, phosphoric acid ester, melamine, melamine derivatives, compounds having a triazine ring, cyanuric acid derivatives, isocyanuric acid.
  • Nitrogen-containing compounds of acid derivatives such as cyclophosphazene, metal compounds such as zinc oxide, iron oxide, molybdenum oxide and ferrocene, antimony trioxide, antimony tetroxide, antimony pentoxide and other antimony oxides, brominated epoxies Resin etc. are mentioned.
  • any one can be used as long as the effect of the present invention is not significantly impaired, but for example, fused silica, crystalline silica, alumina, zircon, calcium silicate, calcium carbonate, potassium titanate, silicon carbide, Examples thereof include powders of aluminum nitride, boron nitride, beryllia, zircon, fosterite, stearite, spinel, mullite, titania, and the like, and spherical beads, glass fibers and the like.
  • any one can be used as long as the effects of the present invention are not significantly impaired, but examples thereof include hydrotalcites, hydrous oxides of elements such as magnesium, aluminum, titanium, zirconium, and bismuth. Can be mentioned.
  • an ion scavenger By containing an ion scavenger, it is possible to improve the humidity resistance and high-temperature storage characteristics (heat resistance) of electronic equipment using the obtained epoxy resin composition.
  • the stress relaxation agent any one may be used as long as the effect of the present invention is not significantly impaired, and examples thereof include silicone rubber powder.
  • the colorant any colorant can be used as long as the effect of the present invention is not significantly impaired, and examples thereof include carbon black.
  • the epoxy resin composition of the present invention contains the component (A) polycarbonate oligomer as a curing agent, but a known epoxy curing agent may be used in combination within a range that does not impair the effects of the present invention.
  • known epoxy curing agents include phenols such as phenol novolac resin, cresol novolac resin, bisphenol A, bisphenol F, and acid anhydrides such as methyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, and pyromellitic anhydride.
  • examples thereof include amines such as diaminodiphenylmethane, diaminodiphenylsulfone and dicyandiamide.
  • the epoxy resin composition of the present invention contains a polycarbonate oligomer represented by the formula (1) and / or the formula (2) and / or the formula (3) and having a specific weight average molecular weight, The dielectric properties are improved and industrially advantageous effects are exhibited.
  • the epoxy resin composition of the present invention is a semiconductor encapsulating material, an electrical insulating material, a copper-clad laminate resin, a resist, an electronic component encapsulating resin, a liquid crystal color filter resin, a paint, various coating agents, and adhesives. It is useful as a build-up laminated plate material and FRP.
  • Polystyrene standard Tosoh Corporation A-500, A-2500, A-5000, F-1, F-2, F-4 2. Measurement of terminal hydroxyl concentration Using 1 H-NMR, using TCE (1,1,1,2-tetrachloroethane) as an internal standard and using bisphenol A and bisphenol C as standards, prepare a calibration curve of the weight ratio with TCE. did. It quantified by the method of calculating
  • Device AscendTM 400 manufactured by BRUKER Measurement conditions: room temperature, number of integrations 120 times 3. Dynamic viscoelasticity measurement measuring device: EXSTAR DMS6100 (manufactured by Hitachi High-Tech Science Co., Ltd.) 4.
  • Relative permittivity / dielectric loss tangent measuring device PNA-L network analyzer N5230A (manufactured by Agilent Technologies) Cavity resonator 1GHz CP431 (Kanto Electronics Development Co., Ltd.)
  • Epoxy resin composition using the polycarbonate oligomer of "Reference Example 1" 100 g of a bisphenol A type epoxy resin having an epoxy equivalent of 184 to 194 (manufacturer: Mitsubishi Chemical Corporation) and the polycarbonate oligomer obtained in Reference Example 1 149 g was weighed and heated and mixed at about 150 ° C. for about 6 hours using a planetary mixer. After cooling to room temperature, 50 g of this mixture was divided and put into a two-roll mill at 110 ° C. 0.4 g of triphenylphosphine was added thereto, and kneading was performed for 3 minutes.
  • This mixture was charged into a 100 mm ⁇ 100 mm indentation die and pressed by a compression molding machine under the conditions of 180 ° C. ⁇ 30 minutes ⁇ 6 MPa.
  • the formed plate was post-cured for 4 hours in a hot air circulating oven at 180 ° C.
  • the prepared hardened plate was cut and the physical properties were measured.
  • the glass transition temperature (Tg) was 175 ° C. as a result of dynamic viscoelasticity measurement of the cured plate according to JIS K7171.
  • the relative permittivity and the dielectric loss tangent were measured with reference to ASTM D 250. As a result, the relative permittivity was 2.68 and the dielectric loss tangent was 0.0132.
  • Epoxy resin composition using the polycarbonate oligomer of "Reference Example 2" 100 g of a bisphenol A type epoxy resin having an epoxy equivalent of 184 to 194 (manufacturer: Mitsubishi Chemical Corporation) and the polycarbonate oligomer obtained in Reference Example 2 114 g was weighed and heated and mixed at about 150 ° C. for about 6 hours using a planetary mixer. After cooling to room temperature, 50 g of this mixture was divided and put into a two-roll mill at 110 ° C. 0.4 g of triphenylphosphine was added thereto, and kneading was performed for 3 minutes. This mixture was placed in a hot air circulation oven at 130 ° C. and held for 25 minutes to thicken it.
  • This mixture was charged into a 100 mm ⁇ 100 mm indentation die and pressed by a compression molding machine under the conditions of 180 ° C. ⁇ 30 minutes ⁇ 6 MPa.
  • the formed plate was post-cured for 4 hours in a hot air circulating oven at 180 ° C.
  • the prepared hardened plate was cut and the physical properties were measured.
  • the glass transition temperature (Tg) was 122 ° C. as a result of dynamic viscoelasticity measurement of the cured plate according to JIS K7171.
  • the relative permittivity was 2.82 and the dielectric loss tangent was 0.0150.

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyesters Or Polycarbonates (AREA)

Abstract

La présente invention aborde le problème de la fourniture d'une composition de résine époxy qui est exceptionnelle non seulement en matière de résistance à la chaleur mais également de propriétés diélectriques. Comme moyen pour résoudre ledit problème, la présente invention propose un oligomère de polycarbonate caractérisé en ce qu'il est représenté par la formule (1) et/ou la formule (2) et/ou la formule (3) et a une masse moléculaire moyenne en poids (Mw) dans la plage de 500 à 10 000, et une composition de résine époxy caractérisée en ce qu'elle contient (B) un composé polyépoxy ayant deux groupes époxy ou plus par molécule.
PCT/JP2019/039054 2018-10-12 2019-10-03 Composition de résine époxy Ceased WO2020075611A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN201980062849.2A CN112752781B (zh) 2018-10-12 2019-10-03 环氧树脂组合物
JP2020550529A JP7355304B2 (ja) 2018-10-12 2019-10-03 エポキシ樹脂組成物
KR1020217009209A KR102776524B1 (ko) 2018-10-12 2019-10-03 에폭시 수지 조성물
JP2023145263A JP2023158145A (ja) 2018-10-12 2023-09-07 エポキシ樹脂組成物

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2018193020 2018-10-12
JP2018-193020 2018-10-12
JP2018247436 2018-12-28
JP2018-247436 2018-12-28

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WO2020075611A1 true WO2020075611A1 (fr) 2020-04-16

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JP (2) JP7355304B2 (fr)
KR (1) KR102776524B1 (fr)
CN (1) CN112752781B (fr)
TW (1) TWI809208B (fr)
WO (1) WO2020075611A1 (fr)

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JP2022133793A (ja) * 2021-03-02 2022-09-14 味の素株式会社 樹脂組成物
JP2022133794A (ja) * 2021-03-02 2022-09-14 味の素株式会社 樹脂組成物
WO2023048209A1 (fr) * 2021-09-24 2023-03-30 三菱ケミカル株式会社 Composition de résine, produit durci, feuille de résine, couche isolante, composant électrique/électronique, carte de circuit imprimé et agent de durcissement pour résine époxydique
EP4382549A1 (fr) * 2022-12-09 2024-06-12 Swancor Innovation & Incubation Co., Ltd. Oligomère de polycarbonate, son procédé de fabrication, composition durcissable, produit réticulé époxy et procédé de dégradation de produit réticulé époxy par aminolyse
EP4578889A1 (fr) * 2023-12-27 2025-07-02 Swancor Innovation & Incubation Co., Ltd. Copolymère carbonate-époxy, composition de carbonate durcissable et procédé de fabrication de celle-ci
US12486355B2 (en) * 2021-09-28 2025-12-02 Swancor Innovation & Incubation Co., Ltd. Carbonate-containing epoxy resin, manufacturing method thereof, epoxy curable product prepared thereby and method for degrading epoxy curable product
JP7806389B2 (ja) 2021-03-02 2026-01-27 味の素株式会社 樹脂組成物

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AU2022472898A1 (en) * 2022-08-02 2025-03-13 Swancor Innovation & Incubation Co., Ltd. Carbonate ester-containing epoxy resin, preparation method therefor, epoxy cured product prepared therefrom, and method for degrading epoxy cured product
WO2024119458A1 (fr) * 2022-12-09 2024-06-13 上纬创新育成股份有限公司 Oligomère de polycarbonate et son procédé de préparation, composition durcissable, produit durci époxy et procédé de dégradation d'un produit durci époxy au moyen d'une aminolyse
EP4682196A1 (fr) 2023-05-09 2026-01-21 Swancor Innovation & Incubation Co., Ltd. Oligomère de polycarbonate ayant des doubles liaisons insaturées, son procédé de préparation, composition durcissable et procédé de préparation de produit durci à faible diélectrique
TWI886717B (zh) * 2023-12-27 2025-06-11 上緯創新育成股份有限公司 可固化的碳酸酯組成物、其製備方法與碳酸酯固化物
WO2025137910A1 (fr) * 2023-12-27 2025-07-03 上纬创新育成股份有限公司 Composition de carbonate durcissable, son procédé de préparation et produit durci à base de carbonate

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