WO2020075356A1 - 切削工具及びその製造方法 - Google Patents
切削工具及びその製造方法 Download PDFInfo
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- WO2020075356A1 WO2020075356A1 PCT/JP2019/027269 JP2019027269W WO2020075356A1 WO 2020075356 A1 WO2020075356 A1 WO 2020075356A1 JP 2019027269 W JP2019027269 W JP 2019027269W WO 2020075356 A1 WO2020075356 A1 WO 2020075356A1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B27/00—Tools for turning or boring machines; Tools of a similar kind in general; Accessories therefor
- B23B27/14—Cutting tools of which the bits or tips or cutting inserts are of special material
- B23B27/148—Composition of the cutting inserts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23C—MILLING
- B23C5/00—Milling-cutters
- B23C5/16—Milling-cutters characterised by physical features other than shape
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/021—Cleaning or etching treatments
- C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0641—Nitrides
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0664—Carbonitrides
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/067—Borides
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/04—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/04—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
- C23C28/044—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material coatings specially adapted for cutting tools or wear applications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
- C23C28/347—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with layers adapted for cutting tools or wear applications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
- C23C30/005—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process on hard metal substrates
Definitions
- the present disclosure relates to a cutting tool and a manufacturing method thereof.
- This application claims the priority based on Japanese Patent Application No. 2018-191737, which is a Japanese patent application filed on October 10, 2018. The entire contents described in the Japanese patent application are incorporated herein by reference.
- Patent Document 2 an A layer made of a nitride containing Al and Cr and a nitride containing Ti and Al for the purpose of performing dry processing with high processing efficiency.
- a surface-coated cutting tool is disclosed that includes a coating layer that includes alternating layers of alternating B layers of material.
- a cutting tool comprising a base material and a coating formed on the base material,
- the coating film includes a first layer formed on the base material and a second layer formed on the first layer,
- the first layer is made of a boride containing zirconium as a constituent element
- the second layer is made of a nitride containing zirconium as a constituent element.
- a method of manufacturing a cutting tool A method of manufacturing the above cutting tool, A step of preparing the base material, Forming the first layer on the substrate using a physical vapor deposition method; Forming the second layer on the first layer using a physical vapor deposition method; including.
- FIG. 1 is a schematic enlarged cross-sectional view of a cutting tool according to an embodiment of the present disclosure.
- FIG. 2 is a schematic enlarged cross-sectional view of a cutting tool according to another embodiment of the present disclosure.
- FIG. 3 is a schematic enlarged sectional view of a cutting tool according to another embodiment of the present disclosure.
- FIG. 4 is a schematic enlarged cross-sectional view of a cutting tool according to another embodiment of the present disclosure.
- FIG. 5 is a schematic sectional view of the magnetron sputtering apparatus used in the examples.
- FIG. 6 is a schematic plan view of the magnetron sputtering apparatus shown in FIG.
- titanium alloys which are often used in the medical and aircraft industries, are called difficult-to-cut materials and have the following features. (1) High temperature strength results in high cutting temperature, and (2) low thermal conductivity causes heat to accumulate at the cutting edge and is chemically active, which facilitates adhesion wear. When such a titanium alloy is cut, the life of the cutting tool may be shortened due to heat generated by the cutting, or chatter vibration may occur during the cutting, resulting in deterioration of the working accuracy.
- a cutting tool comprising a base material and a coating formed on the base material,
- the coating film includes a first layer formed on the base material and a second layer formed on the first layer,
- the first layer is made of a boride containing zirconium as a constituent element
- the second layer is made of a nitride containing zirconium as a constituent element.
- the above cutting tool can achieve a long life when processing a work material containing titanium.
- the thickness of the first layer is 0.5 ⁇ m or more and 10 ⁇ m or less. According to this, the above cutting tool can achieve a longer life in processing a work material containing titanium.
- the thickness of the second layer is 0.5 ⁇ m or more and 10 ⁇ m or less. According to this, the above cutting tool can achieve a longer life in processing a work material containing titanium.
- the boride contains ZrB 2 . According to this, since the film hardness is high and the thermal conductivity is high, the thermal permeability of the cutting tool as a whole is further improved, so that the cutting heat is applied to the base material (when the cutting tool is a cutting tool, It can be released to a fixed holder), and in particular, wear resistance of the cutting tool during continuous cutting is improved.
- the nitride contains ZrN. According to this, the adhesion to the work material is reduced, and in particular, the wear resistance of the cutting tool during continuous cutting is improved.
- the boride further contains titanium as a constituent element. This allows the coating to have a high hardness.
- the boride further contains silicon as a constituent element, When the total number of metal atoms constituting the boride is 1, the atomic ratio of silicon is more than 0 and 0.2 or less. This allows the coating to have a high hardness.
- the nitride further contains silicon as a constituent element, When the total number of metal atoms constituting the nitride is 1, the atomic ratio of silicon is more than 0 and 0.2 or less. This allows the coating to have a high hardness.
- the boride further contains vanadium as a constituent element, When the total number of metal atoms constituting the boride is 1, the atomic ratio of vanadium is more than 0 and 0.2 or less. When vanadium is contained in the boride, a low-melting point oxide is generated and lubricity is improved, so that the friction and wear characteristics of the boride are improved.
- the nitride further contains vanadium as a constituent element,
- the atomic ratio of vanadium is more than 0 and 0.2 or less. According to this, the coating can have high lubricity on the surface.
- the coating further includes a surface layer formed on the second layer,
- the surface layer is made of carbonitride containing zirconium as a constituent element. According to this, the cutting tool has improved anti-adhesion performance and can achieve a longer life.
- the coating further includes a base layer formed between the base material and the first layer,
- the underlayer is made of a metal or compound containing at least one element selected from the group consisting of titanium and chromium as a constituent element. According to this, the cutting tool has excellent adhesion.
- a method of manufacturing a cutting tool according to an aspect of the present disclosure is the method of manufacturing a cutting tool according to any one of (1) to (12) above, A step of preparing the base material, Forming the first layer on the substrate using a physical vapor deposition method; Forming the second layer on the first layer using a physical vapor deposition method; including.
- a film formed using a physical vapor deposition method has high crystallinity and can have excellent wear resistance. Therefore, the obtained cutting tool can achieve a long life.
- this embodiment is not limited to this.
- the same reference numerals represent the same or corresponding parts.
- the notation in the form of "AB” means the upper and lower limits of the range (that is, A or more and B or less), and when A has no unit, B only has a unit. The unit of B and the unit of B are the same.
- the chemical formula when a compound is represented by a chemical formula in which the composition ratio of constituent elements is not limited, such as “ZrN”, the chemical formula is represented by any conventionally known composition ratio (element ratio). Shall be included.
- the above chemical formula includes not only the stoichiometric composition but also the non-stoichiometric composition.
- the chemical formula “ZrN” includes not only the stoichiometric composition “Zr 1 N 1 ”, but also a non-stoichiometric composition such as “Zr 1 N 0.8 ”. This also applies to the description of compounds other than "ZrN".
- the surface-coated cutting tool according to the present embodiment (hereinafter sometimes simply referred to as “cutting tool”) is A cutting tool comprising a base material and a coating formed on the base material,
- the coating film includes a first layer formed on the base material and a second layer formed on the first layer,
- the first layer is made of a boride containing zirconium as a constituent element
- the second layer is made of a nitride containing zirconium as a constituent element.
- the above cutting tool can achieve a long life when processing a work material containing titanium.
- the “working material containing titanium” means a working material made of metallic titanium or a working material made of an alloy containing titanium as a constituent element. Examples of the alloy containing titanium include Ti6AL-4V alloy.
- the cutting tool according to the present embodiment includes, in a coating, a first layer made of a boride containing zirconium as a constituent element and a second layer made of a nitride containing zirconium as a constituent element. Since the first layer has high thermal conductivity, the heat permeability of the cutting tool as a whole is improved, and the cutting heat generated during cutting can be released to the base material. Therefore, in particular, the wear resistance of the cutting tool during continuous cutting is improved and the life is extended.
- the coating film when a coating film is formed on a base material of a cutting tool, the coating film has a higher hardness than the base material. Therefore, of the layers constituting the coating film, the layers closer to the hardness of the base material are laminated in order. Then, a layer having high hardness was formed on the surface side.
- the present inventors focused on the high thermal conductivity of “borides containing zirconium as a constituent element”, and in order to quickly release the cutting heat accumulated in the coating to the base material side, the boride was first For the first time, the inventors have found a configuration in which a "nitride containing zirconium as a constituent element" having a hardness lower than that of the boride is formed on the first layer as a layer.
- the first layer tends to have high compressive residual stress, high hardness, and low toughness.
- the second layer tends to have lower stress, lower hardness, and higher toughness than the first layer. Since the first layer and the second layer have different properties as described above, the property of the first layer having low toughness is complemented by the second layer having high toughness, and the compressive residual stress of the second layer. The property of being small is complemented by the first layer having a large compressive residual stress. Therefore, it is considered that the toughness, hardness, and compressive residual stress are improved in a good balance in the entire coating, and the life of the cutting tool is extended in processing a work material containing titanium.
- the cutting tool is a cutting tool suitable for processing a work material containing titanium, it can also be used for processing other conventionally known materials such as iron, steel, cast iron, and stainless steel.
- FIG. 1 is a schematic enlarged cross-sectional view of a cutting tool according to an embodiment of the present disclosure.
- a cutting tool 1 includes a base material 2 and a coating film 3 formed on the base material 2.
- the coating film 3 preferably covers the entire surface of the base material 2, but even if a part of the base material 2 is not covered with the coating film 3 or the structure of the coating film 3 is partially different, It does not deviate from the range.
- the cutting tool of the present embodiment includes a drill, an end mill, a cutting edge exchangeable cutting tip for a drill, a cutting edge exchangeable cutting tip for an end mill, a cutting edge exchangeable cutting tip for milling, a cutting edge exchangeable cutting tip for turning, a metal saw, and a gear cutting. It can be suitably used as a cutting tool such as a tool, a reamer, and a tap.
- any base material conventionally known as this type of base material can be used.
- cemented carbide for example, tungsten carbide (WC) -based cemented carbide, cemented carbide containing Co in addition to WC, cemented carbide containing carbonitrides such as Ti, Ta, and Nb in addition to WC).
- Cermet having TiC, TiN, TiCN, etc.
- high speed steel high speed steel, ceramics (titanium carbide, silicon carbide, silicon nitride, aluminum nitride, aluminum oxide, etc.), cubic boron nitride sintered body (cBN) It is preferably any one selected from the group consisting of a sintered body) and a diamond sintered body.
- ceramics titanium carbide, silicon carbide, silicon nitride, aluminum nitride, aluminum oxide, etc.
- cBN cubic boron nitride sintered body It is preferably any one selected from the group consisting of a sintered body) and a diamond sintered body.
- WC-based cemented carbide and cermet particularly TiCN-based cermet. Since these base materials have an excellent balance between hardness and strength, especially at high temperatures, when used as a base material for a cutting tool, they can contribute to prolonging the life of the cutting tool.
- the coating 3 included in the cutting tool 1 of the present embodiment includes a first layer 31 formed on the base material 2 and a second layer 32 formed on the first layer 31 (FIG. 1). .
- the coating 3 may include other layers in addition to the first layer 31 and the second layer 32. Examples of the other layer include a surface layer 33 (FIG. 2) formed on the second layer 32, and a base layer 34 (formed between the base material 2 and the first layer 31). 3), an intermediate layer 35 (FIG. 4) formed between the first layer 31 and the second layer 32, and the like.
- the surface layer 33, the base layer 34, and the intermediate layer 35 will be described later.
- the coating 3 has the function of improving various characteristics such as wear resistance and fracture resistance of the cutting tool and prolonging the life of the cutting tool.
- the coating film has a total thickness of 1 ⁇ m or more and 15 ⁇ m or less. If the total thickness of the coating is less than 1 ⁇ m, the coating may be too thin to achieve the desired effect. On the other hand, if the total thickness of the coating exceeds 15 ⁇ m, the coating tends to chip at the initial stage of cutting and the life of the cutting tool tends to be shortened.
- the total thickness of the coating can be measured by observing the cross section of the coating with a SEM (scanning electron microscope).
- the observation magnification of the cross-section sample is set to 5000 to 10000 times, the observation area is set to 100 to 500 ⁇ m 2 , and the thickness at three locations in one visual field is measured, and the average value thereof is defined as “thickness”. The same applies to the thickness of each layer described below unless otherwise specified.
- the absolute value of the compressive residual stress of the coating is preferably 6 GPa or less.
- the compressive residual stress of the coating is a type of internal stress (intrinsic strain) existing in the entire coating and is represented by a numerical value of “ ⁇ ” (minus) (unit: “GPa” is used in this embodiment). Refers to stress. Therefore, the concept of “large compressive residual stress” indicates that the absolute value of the numerical value becomes large. Further, the concept of "small compressive residual stress” means that the absolute value of the numerical value becomes small. That is, "the absolute value of the compressive residual stress is 6 GPa or less” means that the residual stress of the coating film is -6 GPa or more and less than 0 GPa.
- the residual stress of the coating exceeds 0 GPa, it becomes tensile residual stress, and it tends to be difficult to suppress the development of cracks generated from the outermost surface of the coating.
- the absolute value of the compressive residual stress exceeds 6 GPa, the compressive residual stress is too large, and the coating tends to peel off from the edge portion of the cutting tool before the start of cutting, and the life of the cutting tool tends to be shortened.
- the compressive residual stress is measured by the 2 ⁇ -sin 2 ⁇ method using an X-ray residual stress device (see pages 54 to 66 of “X-ray stress measurement method” (Japan Society of Materials, 1981, Yokendo Co., Ltd.)). can do.
- the hardness of the film is preferably 29 GPa or more and 60 GPa or less, and more preferably 40 GPa or more and 60 GPa or less. According to this, the coating has sufficient hardness.
- the hardness of the entire coating can be measured by a method using a nano indenter (for example, Nano Indenter XP manufactured by MTS). Specifically, the hardness of three points on the surface of the coating film is measured, and the average value thereof is defined as "hardness".
- the first layer is formed on the base material.
- the first layer may be formed in direct contact with the surface of the base material, or may be formed on the base material via a base layer described later.
- the first layer is made of a boride containing Zr (zirconium) as a constituent element. According to this, the first layer has high film hardness and high thermal conductivity. Therefore, the heat permeability of the cutting tool as a whole is improved, and the cutting heat can be released to the base material. In particular, in machining a difficult-to-cut material whose cutting edge temperature becomes high during machining, the wear resistance of the cutting tool is improved and a long life can be achieved.
- Examples of the boride include ZrB 2 , ZrB, ZrSiB 2 , and ZrVB 2 .
- the boride preferably contains ZrB 2 .
- the boride may be used alone or in combination of two or more.
- composition of the first layer and the atomic number ratio of each atom (Zr, and Si and V described later) to the total number of metal atoms in the first layer were determined by using an X-ray photoelectron spectroscopy analyzer (XPS). Can be measured. Specifically, by irradiating the sample surface with X-rays and measuring the kinetic energy of photoelectrons emitted from the sample surface, the composition and chemical bond state of the elements constituting the sample surface are analyzed.
- the composition of each layer including the second layer, the underlayer, the surface layer, and the intermediate layer, which will be described later, and the atomic ratio of each atom (Ti, Cr, Zr, Si, V) to the total number of metal atoms in each layer are also the same. , X-ray photoelectron spectroscopy analyzer (XPS).
- metal atom means hydrogen, helium, neon, argon, krypton, xenon, radon, fluorine, chlorine, bromine, iodine, astatine, oxygen, sulfur, selenium, tellurium, nitrogen, phosphorus, arsenic, Refers to atoms of elements other than antimony, carbon, and boron.
- the boride is preferably hexagonal.
- the c-axis of the crystal is perpendicular to the main surface of the base material, and the strength tends to increase and the abrasion resistance tends to improve.
- the crystal structure in the first layer can be analyzed by an X-ray diffractometer known in the art.
- the boride preferably contains Ti (titanium) as a constituent element.
- Ti titanium
- the atomic ratio of Ti is preferably more than 0 and 0.5 or less.
- the boride include Zr 1-x Ti x B 2 (where x is more than 0 and 0.5 or less).
- the boride may include Si (silicon) as a constituent element. That is, the boride further contains silicon as a constituent element, and when the total number of metal atoms constituting the boride is 1, the atomic ratio of silicon is more than 0 and not more than 0.2. preferable.
- Examples of the boride include Zr 1-y Si y B 2 (where y is more than 0 and 0.2 or less).
- the first layer becomes brittle and wear tends to be accelerated. Further, when an alloy target serving as a metal raw material of the boride is produced by hot isostatic pressing, the alloy target is cracked during firing, and a material strength usable for forming the first layer is obtained. Tends to be difficult.
- the atomic ratio of silicon is 0.01 or more when the total number of metal atoms constituting the boride is 1. It is more preferably 0.15 or less, further preferably 0.05 or more and 0.15 or less.
- the boride can contain V (vanadium) as a constituent element. That is, the boride further contains vanadium as a constituent element, and when the total number of metal atoms constituting the boride is 1, the atomic ratio of vanadium is more than 0 and not more than 0.2. preferable.
- the boride include Zr 1-z V z B 2 (where z is more than 0 and 0.2 or less). In this case, even if the surface of the first layer is oxidized in the high temperature environment during cutting, the oxide of vanadium has a low melting point and thus acts as a lubricant during cutting, and can suppress the adhesion of the work material.
- the atomic ratio of vanadium exceeds 0.2, the hardness of the first layer tends to decrease.
- the atomic ratio of vanadium is more than 0 and not more than 0.15 when the total number of metal atoms constituting the boride is 1. It is preferably 0.05 or more and 0.15 or less.
- the first layer may contain inevitable impurities other than Zr, B, Ti, Si and V. That is, "the first layer is made of a boride containing zirconium as a constituent element" does not only mean that the first layer is made of a boride containing zirconium as a constituent element, as long as the effects of the present disclosure are exhibited.
- the first layer is a concept including a boride containing zirconium as a constituent element and a case where unavoidable impurities are mixed therein. Inevitable impurities include, for example, oxygen and carbon.
- the content ratio of the total unavoidable impurities in the first layer is preferably more than 0 atom% and less than 1 atom%.
- atomic% means the ratio (%) of the number of atoms to the total number of atoms constituting the first layer.
- the ratio (%) of the number of atoms to the total number of atoms forming the first layer can be measured using the XPS analysis described above.
- the thickness of the first layer is preferably 0.5 ⁇ m or more and 10 ⁇ m or less, and more preferably 0.5 ⁇ m or more and 4 ⁇ m or less.
- the thickness of the first layer can be measured by observing the cross section of the coating with a SEM (scanning electron microscope).
- the second layer is formed on the first layer.
- the second layer may be formed in direct contact with the surface of the first layer, or may be formed on the first layer via an intermediate layer described later.
- the second layer is made of a nitride containing Zr (zirconium) as a constituent element. Since the second layer contains zirconium as a constituent element, the second layer has an excellent balance of wear resistance, oxidation resistance and toughness. Further, when Cr (chrome) and Ti are not contained in the second layer, the damage of the coating does not proceed due to the diffusion of the element of the work material. Therefore, the cutting tool including the second layer can achieve a long life.
- nitride examples include ZrN, ZrSiN, ZrVN and the like.
- the nitride preferably contains ZrN.
- the above nitrides may be used alone or in combination of two or more.
- the above-mentioned nitride is preferably cubic type.
- the crystal structure of the nitride is cubic and has (111) orientation, which is the dense surface of the crystal, the strength is increased and the wear resistance is improved.
- the crystal structure in the second layer can be analyzed by an X-ray diffractometer known in the art.
- the nitride can contain Si (silicon) as a constituent element. That is, the nitride further contains silicon as a constituent element, and when the total number of metal atoms constituting the nitride is 1, the atomic ratio of silicon is more than 0 and not more than 0.2. preferable. Examples of the nitride include Zr 1-v Si v N (where v is more than 0 and 0.2 or less).
- the second layer becomes brittle and wear tends to be accelerated. Further, when an alloy target serving as a metal raw material of the above-mentioned nitride is produced by hot isostatic pressing, the alloy target is cracked during firing, and a material strength usable for forming the second layer is obtained. Tends to be difficult.
- the atomic ratio of silicon is 0.01 when the total number of metal atoms constituting the nitride is 1. It is more preferably not less than 0.15 and is more preferably not less than 0.05 and not more than 0.15.
- the nitride can contain V (vanadium) as a constituent element. That is, the nitride further contains vanadium as a constituent element, and when the total number of metal atoms constituting the nitride is 1, the atomic ratio of vanadium is more than 0 and not more than 0.2. preferable.
- the nitride include Zr 1-w V w N (where w is more than 0 and 0.2 or less). In this case, even if the surface of the second layer is oxidized in the high temperature environment during cutting, the oxide of V has a low melting point and thus acts as a lubricant during cutting and can suppress the adhesion of the work material.
- the atomic ratio of vanadium exceeds 0.2, the hardness of the second layer tends to decrease.
- the atomic ratio of vanadium is 0 when the total number of metal atoms constituting the nitride is 1. It is more preferably more than 0.15 and is more preferably 0.05 or more and 0.15 or less.
- the second layer can contain inevitable impurities other than Zr, Si, V and N. That is, "the second layer is made of a nitride containing zirconium as a constituent element” does not only mean that the second layer is made of a nitride containing zirconium as a constituent element, but also as long as the effect of the present disclosure is exhibited. This is a concept including a nitride in which the second layer contains zirconium as a constituent element and a case where unavoidable impurities are mixed therein. Inevitable impurities include, for example, oxygen and carbon.
- the content ratio of the total unavoidable impurities in the second layer is preferably more than 0 atom% and less than 1 atom%. The ratio (%) of the number of atoms to the total number of atoms forming the second layer can be measured using the XPS analysis described above.
- the thickness of the second layer is preferably 0.5 ⁇ m or more and 10 ⁇ m or less, and more preferably 0.5 ⁇ m or more and 4 ⁇ m or less.
- the thickness of the second layer can be measured by observing the cross section of the coating with a SEM (scanning electron microscope).
- the total thickness of the first layer and the second layer is preferably 1 ⁇ m or more and 20 ⁇ m or less, more preferably 1 ⁇ m or more and 15 ⁇ m or less, and further preferably 2 ⁇ m or more and 7 ⁇ m or less. If the thickness is less than 1 ⁇ m, abrasion resistance tends to be insufficient in continuous machining, and if it exceeds 20 ⁇ m, chipping resistance tends to be unstable in intermittent cutting.
- the coating 3 included in the cutting tool 1 of the present embodiment may include other layers in addition to the first layer 31 and the second layer 32.
- Other layers include, for example, a surface layer 33 (FIG. 2) formed on the second layer 32, and a base layer 34 (FIG. 2) formed between the base material 2 and the first layer 31. 3) and the intermediate layer 35 (FIG. 4) formed between the first layer 31 and the second layer 32.
- the surface layer 33 is formed on the second layer 32 (FIG. 2).
- the surface layer 33 may be a single layer or a multilayer.
- the surface layer 33 is preferably made of carbonitride containing zirconium as a constituent element. Examples of the carbonitride include ZrCN, ZrSiCN, ZrVCN and the like.
- the carbonitrides may be used alone or in combination of two or more.
- carbonitrides tend to have a lower coefficient of friction for work materials than nitrides. It is considered that such a decrease in the coefficient of friction is due to the contribution of carbon atoms.
- the coating includes the surface layer, the coefficient of friction of the coating with respect to the work material decreases, and the cutting tool has a long life.
- a predetermined color can be imparted to the surface layer by adjusting the composition ratio of N and C. Thereby, the appearance of the cutting tool can be provided with designability and distinctiveness, which is industrially useful.
- the above carbonitride preferably further contains silicon as a constituent element.
- the ratio of the number of silicon atoms is preferably more than 0 and 0.2 or less, and 0.05 or more and 0.15 or less. Is more preferable. According to this, the hardness of the surface layer is increased, and the oxidation resistance is improved.
- the above carbonitride preferably further contains vanadium as a constituent element.
- the ratio of the number of vanadium atoms when the total number of metal atoms constituting the carbonitride is 1 is preferably more than 0 and 0.2 or less, and more than 0 and 0.15 or less. Is more preferable. According to this, the adhesion resistance of the surface layer is improved.
- the above carbonitride preferably further contains B (boron) as a constituent element.
- B boron
- the ratio of the number of boron atoms is preferably more than 0 and 0.5 or less, and 0 And more preferably 0.2 or less. According to this, the film hardness is improved.
- the thickness of the surface layer is preferably 0.1 ⁇ m or more. If the thickness of the surface layer is less than 0.1 ⁇ m, the effect of imparting lubricity by the surface layer tends to be difficult to obtain. On the other hand, the upper limit of the thickness of the surface layer is not particularly limited, but even if it exceeds 2 ⁇ m, the effect of imparting the above-mentioned lubricity tends to remain unchanged. Therefore, in consideration of cost, the thickness of the surface layer is preferably 2 ⁇ m or less. The thickness of the surface layer can be measured by observing the cross section of the coating with a SEM (scanning electron microscope).
- the base layer 34 is formed between the base material 2 and the first layer 31 (FIG. 3).
- the base layer 34 may be a single layer or a multilayer.
- the underlayer 34 is preferably made of a metal or a compound containing at least one element selected from the group consisting of Ti (titanium) and Cr (chromium) as a constituent element.
- the metal include titanium metal, chromium metal, and alloys containing titanium and chromium as constituent elements.
- the compound include CrN and TiN.
- the thickness of the underlayer is preferably 2 nm or more and 0.5 ⁇ m or less, more preferably 2 nm or more and 0.1 ⁇ m or less.
- the thickness of the underlayer can be measured by observing the cross section of the coating with a SEM (scanning electron microscope) or a TEM (transmission electron microscope).
- a method for manufacturing a cutting tool according to an embodiment of the present disclosure described above is a method for manufacturing the cutting tool, A step of preparing the base material (hereinafter, sometimes referred to as “first step”); A step of forming the first layer on the base material by using a physical vapor deposition method (hereinafter, sometimes referred to as “second step”); A step of forming the second layer on the first layer using a physical vapor deposition method (hereinafter, sometimes referred to as “third step”); including.
- the physical vapor deposition method is a vapor deposition method in which a raw material (also referred to as an evaporation source or a target) is vaporized by utilizing a physical action and the vaporized raw material is attached onto a substrate.
- the physical vapor deposition method used in this embodiment is preferably at least one selected from the group consisting of a cathode arc ion plating method, a balanced magnetron sputtering method and an unbalanced magnetron sputtering method.
- the surface of the base material can be subjected to a metal ion bombardment cleaning treatment before forming the coating film, so that the cleaning time can be shortened.
- a base material is installed in the apparatus and a target is installed as a cathode, and then a high current is applied to the target to cause arc discharge.
- the atoms forming the target are evaporated and ionized, and the atoms are deposited on the substrate to which the negative bias voltage is applied to form a film.
- a base material is installed in the apparatus and a target is installed on a magnetron electrode equipped with a magnet that forms a balanced magnetic field, and high frequency power is applied between the magnetron electrode and the base material. Is applied to generate gas plasma. A film is formed by causing the ions of the gas generated by the generation of this gas plasma to collide with the target to ionize the atoms emitted from the target and deposit them on the substrate.
- the unbalanced magnetron sputtering method forms a film by making the magnetic field generated by the magnetron electrodes in the above balanced magnetron sputtering method non-equilibrium.
- the base material is prepared.
- a cemented carbide base material is prepared as the base material.
- the cemented carbide base material may be a commercially available product or may be manufactured by a general powder metallurgy method.
- a WC powder and a Co powder are mixed by a ball mill or the like to obtain a mixed powder.
- the mixed powder is dried, it is molded into a predetermined shape to obtain a molded body. Further, by sintering the formed body, a WC—Co based cemented carbide (sintered body) is obtained.
- the sintered body is subjected to predetermined cutting edge processing such as honing treatment to manufacture a base material made of a WC-Co based cemented carbide.
- predetermined cutting edge processing such as honing treatment to manufacture a base material made of a WC-Co based cemented carbide.
- a step of cleaning the base material can be performed before the second step described below.
- the surface of the base material can be subjected to ion bombardment treatment.
- the soft binder phase can be removed from the surface of the base material.
- the underlying layer can be formed by the ion bombardment treatment itself. That is, by using a target containing an element of chromium, titanium or a combination thereof in the ion bombardment treatment, these elements can be attached to the surface of the base material as an underlayer while cleaning the surface of the base material. . Then, by performing a step of forming a first layer, which is a second step described later, on the surface to which these elements adhere, an underlayer having excellent adhesion can be formed together with the first layer. .
- the element used for the ion bombardment treatment and contained in the underlayer is more preferably chromium. Since chromium is a sublimable element, the generation of molten particles (droplets) during the ion bombardment treatment is small, and the surface roughness of the substrate can be prevented.
- the first step and the subsequent steps of cleaning the base material can be performed as follows. First, a chip having an arbitrary shape is prepared as the base material 2 (first step). Next, the substrate 2 is mounted in the chamber 130 of the film forming apparatus 120. For example, to explain using the film forming apparatus 120 shown in FIG. 5, the base material 2 is attached to the outer surface of the base material holder 122 on the rotary table 121 rotatably provided in the center of the chamber 130. A bias power source 142 is attached to the base material holder 122.
- an evaporation source 131 for forming a first layer and an evaporation source 132 for forming a second layer, which correspond to an alloy target which is a metal raw material of the coating, are provided at predetermined positions in the chamber 130. It is attached to an evaporation source 133 for ion bombardment and an evaporation source 134 for forming a surface layer, respectively.
- a pulse power supply 141 is attached to the evaporation source 131 for forming the first layer and the evaporation source 132 for forming the second layer, and a pulse power source (evaporation source 133 for ion bombardment) and an evaporation source 134 for forming the surface layer are also provided ( (Not shown).
- a gas introduction port 123 for introducing an atmospheric gas is provided in the chamber 130, and a gas exhaust port 124 for exhausting the atmospheric gas from the chamber 130 is provided.
- the ambient gas in the chamber 130 can be sucked from the gas outlet 124 by a vacuum pump.
- argon gas is introduced as an atmospheric gas (sputtering gas) from the gas introduction port 123, the pressure in the chamber 130 is maintained at 1.0 to 4.0 Pa, and the voltage of the bias power source 142 is gradually increased to ⁇ 1000.
- the surface of the base material 2 is cleaned for 15 to 90 minutes at an ionization voltage of ⁇ 400 V (ion bombardment treatment with argon ions). Thereby, when the base material 2 is a cemented carbide base material, the binder phase can be removed from the surface.
- the first layer is formed on the base material.
- various methods are used depending on the composition of the first layer to be formed. For example, zirconium, boron, titanium, silicon, vanadium, and the like, the method of using an alloy target in which the particle diameters are changed, the method of using a plurality of targets having different compositions, the bias voltage applied during film formation is a pulse voltage Method, a method of changing the gas flow rate during film formation, a method of adjusting the rotation speed of the substrate holder that holds the substrate in the film forming apparatus, and the like.
- the first layer can be formed by combining these methods.
- the second step can be performed as follows. That is, following the cleaning of the base material 2, Ar is introduced as an atmospheric gas while the base material 2 is rotated in the center of the chamber 130. Further, the evaporation source for forming the first layer is maintained while maintaining the temperature of the base material 2 at 400 to 700 ° C., the gas pressure at 0.3 to 0.5 Pa, and the voltage of the bias power source 142 within the range of ⁇ 30 to ⁇ 100V.
- a pulse power supply 141 is used for 131 to supply electric power of 5.5 to 7.5 kW.
- the second layer is formed on the first layer.
- various methods are used depending on the composition of the second layer to be formed.
- zirconium a method of using an alloy target having different particle diameters such as silicon and vanadium, a method of using a plurality of targets having different compositions, a method of using a bias voltage applied during film formation as a pulse voltage, A method of changing the gas flow rate, a method of adjusting the rotation speed of the substrate holder that holds the substrate in the film forming apparatus, and the like can be mentioned.
- the second layer can be formed by combining these methods.
- the third step can be performed as follows. That is, following the step of forming the first layer, argon gas is introduced as a sputtering gas and nitrogen gas is introduced as a reaction gas in a state where the substrate 2 on which the first layer is formed is rotated in the center of the chamber 130. . Further, with the substrate 2 kept at a temperature of 400 to 700 ° C., the reaction gas pressure of 0.3 to 1 Pa, and the voltage of the bias power source 142 in the range of ⁇ 30 to ⁇ 100 V, evaporation for forming the second layer. By supplying 5.5 to 7.5 kW of electric power from the pulse power source 141 to the source 132, metal ions are generated from the evaporation source 132. After that, when a predetermined time has elapsed, the power supply from the pulse power supply 141 is stopped, and the second layer is formed on the first layer. Furthermore, the thickness of the second layer is adjusted within a predetermined range by adjusting the film formation time.
- a step of forming a surface layer can be performed after the third step.
- the step of forming the surface layer is performed as follows. That is, subsequently to the step of forming the second layer, argon gas is introduced as a sputtering gas and nitrogen gas is introduced as a reaction gas in a state in which the base material 2 on which the second layer is formed is rotated in the center of the chamber 130. . Further, while maintaining the substrate 2 at a temperature of 400 to 700 ° C., a reaction gas pressure of 0.3 to 1 Pa, and a bias power supply 142 voltage of ⁇ 30 to ⁇ 100 V, a surface layer is formed.
- a pulsed power supply supplies 5.5 to 7.5 kW of power to the evaporation source 134.
- metal ions are generated from the evaporation source 134, and when a predetermined time has elapsed, the supply of power from the pulse power supply is stopped and a surface layer is formed on the second layer.
- the evaporation layer 132 for forming the second layer may be used instead of the evaporation source 134 for forming the surface layer to form the surface layer.
- compressive residual stress may be applied to the coating. This is because the toughness is improved.
- the compressive residual stress can be applied by, for example, a blast method, a brush method, a barrel method, an ion implantation method, or the like.
- a surface coating cutting tool comprising a substrate and a coating formed on the substrate,
- the coating film includes a first layer formed on the base material and a second layer formed on the first layer,
- the first layer is made of a boride containing Zr as a constituent element
- the second layer is a surface-coated cutting tool, which is made of a nitride containing Zr as a constituent element.
- Appendix 2 The surface-coated cutting tool according to Appendix 1, wherein the first layer has a thickness of 0.5 ⁇ m or more and 10 ⁇ m or less.
- the nitride further contains Si as a constituent element, 8.
- the boride further contains V as a constituent element, 9.
- the nitride further contains V as a constituent element, 10.
- the coating further includes a surface layer formed on the second layer, 11.
- the coating further includes a base layer formed between the base material and the first layer, 12.
- Appendix 13 The method for producing a surface-coated cutting tool according to any one of appendices 1 to 12, Preparing the substrate, Forming the first layer on the substrate using a physical vapor deposition method; Forming the second layer on the first layer using a physical vapor deposition method; A method for producing a surface-coated cutting tool, comprising:
- the thickness of each of the coating film, the first layer, the second layer, and the surface layer described later is a value obtained by the following method. That is, the cross section obtained by cutting the manufactured cutting tool is observed by using the SEM (scanning electron microscope) according to the procedure described above, and the value obtained by averaging the thickness measured in each cross section is used. is there.
- FIG. 5 is a schematic cross-sectional view of the film forming apparatus (magnetron sputtering apparatus) used in this example.
- FIG. 6 is a schematic plan view of the film forming apparatus used in this example.
- First step step of preparing a base material
- the base material 2 a grade of cemented carbide of JIS standard P30, a shape of which is CNMG120408 of JIS standard and SEMT13T3AGSN manufactured by Sumitomo Electric Hard Metal Co., Ltd., and a radius end mill ( ⁇ 12 mm), respectively. It prepared (process which prepares a base material).
- the base material 2 was attached to the outer surface of the base material holder 122 on the rotary table 121 rotatably provided in the center of the chamber 130 of the film forming apparatus 120.
- an evaporation source for forming a first layer which is an alloy target serving as a metal raw material for the coating (an alloy evaporation source including a metal raw material having a composition forming the first layer) 131.
- An evaporation source for forming a second layer (an evaporation source made of an alloy of a metal raw material having a composition forming the second layer) 132, and an evaporation source for forming a surface layer (an alloy made of a metal raw material having a composition of a surface layer) Evaporation source) 134 was attached.
- a pulse power source 141 was attached to the evaporation source 131 for forming the first layer and the evaporation source 132 for forming the second layer. Further, a pulse power source (not shown) was also attached to the evaporation source 133 for ion bombardment and the evaporation source 134 for forming the surface layer.
- a bias power source 142 was attached to the base material holder 122.
- a gas introduction port 123 for introducing an atmospheric gas is provided in the chamber 130, and a gas exhaust port 124 for exhausting the atmospheric gas from the chamber 130 is provided. Therefore, a vacuum pump is provided from the gas exhaust port 124. Thus, the atmospheric gas in the chamber 130 can be sucked and exhausted.
- the inside of the chamber 130 was decompressed by the vacuum pump, and the base 2 of the base holder 122 was rotated by rotating the rotary table 121. Then, the surface temperature of the base material 2 is heated to 600 ° C. by a heater (not shown) installed in the apparatus 120, and a vacuum is evacuated until the pressure in the chamber 130 reaches 1.0 ⁇ 10 ⁇ 4 Pa. I did.
- argon gas is introduced as a sputtering gas from the gas introduction port 123, the pressure in the chamber 130 is maintained at 3.0 Pa, the voltage of the bias power source 142 is gradually increased to ⁇ 1000 V, and the surface of the substrate 2 is exposed.
- a treatment for removing the binder phase from the surface of the base material 2 ion bombardment treatment with argon ions was performed.
- argon gas was exhausted from the inside of the chamber 130 (step of cleaning the base material).
- Comparative Example 1 and Comparative Example 5 a ZrN layer (a layer made of a compound represented by ZrN, the same applies hereinafter) was prepared as a layer corresponding to the first layer.
- a ZrN layer (a layer made of a compound represented by ZrN, the same applies hereinafter) was prepared as a layer corresponding to the first layer.
- Comparative Example 3 and Comparative Example 4 an AlTiN layer and an AlCrN layer having the compositions shown in Table 1 were produced as layers corresponding to the first layer.
- Comparative Examples 1 to 4 are examples in which the second layer is not formed, as will be described later. Thereby, the 2nd process was implemented.
- Comparative Examples 1 to 4 the second layer was not formed.
- Comparative Example 5 a ZrB 2 layer was formed as the second layer.
- a surface layer having the composition and thickness shown in Table 2 was formed subsequent to the step of forming the second layer.
- the substrate 2 having the second layer formed thereon was rotated in the center of the chamber 130, and Ar was introduced as an atmosphere gas and both nitrogen and methane gas were introduced as reaction gases.
- the reaction gas pressure was 0.4 Pa, and the bias power source 142 voltage was ⁇ 150 V, 6 kW of power was supplied to the surface layer forming evaporation source 134.
- metal ions were generated from the evaporation source 134, power supply was stopped when a predetermined time had elapsed, and a surface layer was formed on the second layer.
- the cutting tools of Examples 1 to 10 and Comparative Examples 1 to 5 were manufactured as described above.
- the thickness of the entire coating in Table 2 includes the thickness of the surface layer.
- composition of the first layer and the second layer in Table 1 and the “composition” of the surface layer in Table 2 are measured using XPS (X-ray photoelectron spectroscopy analyzer).
- the “hardness” of the entire coating in Table 2 is the value confirmed by a nano indenter (Nano Indenter XP manufactured by MTS).
- the “compressive residual stress” of the entire coating in Table 2 is the 2 ⁇ -sin 2 ⁇ method using the X-ray residual stress measuring device (“X-ray stress measuring method” (Japan Society for Materials, 1981, issued by Yokendo Co., Ltd.) Pp. 54-66).
- Examples 1 to 10 have a significantly longer tool life in end milling of titanium alloys than Comparative Examples 1 to 5.
- 1 cutting tool 2 base material, 3 coating, 31 1st layer, 32 2nd layer, 33 surface layer, 34 base layer, 35 intermediate layer, 120 film forming apparatus, 121 rotary table, 122 base material holder, 123 gas introduction Mouth, 124 gas outlet, 130 chamber, 131, 132, 133, 134 evaporation source, 141 pulse power supply, 142 bias power supply.
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Abstract
Description
基材と、上記基材上に形成されている被膜とを含む切削工具であって、
上記被膜は、上記基材上に形成されている第1層と上記第1層上に形成されている第2層とを含み、
上記第1層は、ジルコニウムを構成元素として含むホウ化物からなり、
上記第2層は、ジルコニウムを構成元素として含む窒化物からなる。
上記切削工具の製造方法であって、
上記基材を準備する工程と、
物理的蒸着法を用いて、上記基材上に上記第1層を形成する工程と、
物理的蒸着法を用いて、上記第1層上に上記第2層を形成する工程と、
を含む。
航空機のエンジン等に用いられるインコネル(登録商標)等に代表される耐熱合金の多くは、Crを含有する。硬質被膜にCrを含有する切削工具を用いてCrを含有する耐熱合金を切削した場合、被覆層中のCrと被削材中のCrとが相互拡散して、被覆層の損傷が加速される場合がある。
[本開示の効果]
上記態様によれば、チタンを含む被削材の加工において、長寿命を達成することができる切削工具及びその製造方法を提供することが可能となる。
最初に本開示の実施態様を列記して説明する。
基材と、上記基材上に形成されている被膜とを含む切削工具であって、
上記被膜は、上記基材上に形成されている第1層と上記第1層上に形成されている第2層とを含み、
上記第1層は、ジルコニウムを構成元素として含むホウ化物からなり、
上記第2層は、ジルコニウムを構成元素として含む窒化物からなる。
上記ホウ化物を構成する金属原子の総数を1としたとき、上記ケイ素の原子数比は0を超えて0.2以下である。これによると、被膜は高い硬度を有することができる。
上記窒化物を構成する金属原子の総数を1としたとき、上記ケイ素の原子数比は0を超えて0.2以下である。これによると、被膜は高い硬度を有することができる。
(9)上記ホウ化物は、バナジウムを構成元素として更に含み、
上記ホウ化物を構成する金属原子の総数を1としたとき、上記バナジウムの原子数比は0を超えて0.2以下である。上記ホウ化物にバナジウムが含まれると低融点酸化物が生成され潤滑性が向上するため、上記ホウ化物の摩擦摩耗特性が向上する。
(10)上記窒化物は、バナジウムを構成元素として更に含み、
上記窒化物を構成する金属原子の総数を1としたとき、上記バナジウムの原子数比は0を超えて0.2以下である。これによると、被膜は表面に高い潤滑性を有することができる。
上記表面層は、ジルコニウムを構成元素として含む炭窒化物からなる。これによると、切削工具は、耐凝着性能が向上し、より長寿命を達成することができる。
上記下地層は、チタン及びクロムからなる群より選ばれる少なくとも1つの元素を構成元素として含む金属又は化合物からなる。これによると、密着性に優れる切削工具となる。
上記基材を準備する工程と、
物理的蒸着法を用いて、上記基材上に上記第1層を形成する工程と、
物理的蒸着法を用いて、上記第1層上に上記第2層を形成する工程と、
を含む。
以下、本開示の一実施形態(以下「本実施形態」と記す。)について説明する。ただし、本実施形態はこれに限定されるものではない。なお以下の実施形態の説明に用いられる図面において、同一の参照符号は、同一部分又は相当部分を表わす。本明細書において「A~B」という形式の表記は、範囲の上限下限(すなわちA以上B以下)を意味し、Aにおいて単位の記載がなく、Bにおいてのみ単位が記載されている場合、Aの単位とBの単位とは同じである。
本実施形態に係る表面被覆切削工具(以下、単に「切削工具」という場合がある。)は、
基材と、上記基材上に形成されている被膜とを含む切削工具であって、
上記被膜は、上記基材上に形成されている第1層と上記第1層上に形成されている第2層とを含み、
上記第1層は、ジルコニウムを構成元素として含むホウ化物からなり、
上記第2層は、ジルコニウムを構成元素として含む窒化物からなる。
本実施形態の切削工具1に用いられる基材2は、この種の基材として従来公知のものであればいずれも使用することができる。例えば、超硬合金(例えば炭化タングステン(WC)基超硬合金、WCの他にCoを含む超硬合金、WCの他にTi、Ta、Nb等の炭窒化物を添加した超硬合金等)、サーメット(TiC、TiN、TiCN等を主成分とするもの)、高速度鋼、セラミックス(炭化チタン、炭化珪素、窒化珪素、窒化アルミニウム、酸化アルミニウム等)、立方晶型窒化硼素焼結体(cBN焼結体)及びダイヤモンド焼結体からなる群より選ばれるいずれかであることが好ましい。
本実施形態の切削工具1に含まれる被膜3は、基材2上に形成されている第1層31と上記第1層31上に形成されている第2層32とを含む(図1)。被膜3は、上記第1層31及び上記第2層32に加えて、他の層を含むことができる。当該他の層としては、例えば、上記第2層32上に形成されている表面層33(図2)、上記基材2と上記第1層31との間に形成されている下地層34(図3)、上記第1層31と上記第2層32との間に形成されている中間層35(図4)等を挙げることができる。上記表面層33、上記下地層34及び上記中間層35については後述する。
上記第1層は、上記基材上に形成されている。ここで、上記第1層は、上記基材の表面に直接接して形成されていてもよいし、後述する下地層を介して基材上に形成されていてもよい。上記第1層は、Zr(ジルコニウム)を構成元素として含むホウ化物からなる。これによると、上記第1層は膜硬度が高く、さらに熱伝導率が高い。そのため、切削工具全体としての熱浸透性が向上し、切削熱を基材へ逃がすことができる。特に、加工時に刃先温度が高くなる難削材の加工において、切削工具の耐摩耗性が向上し、長寿命を達成することができる。
上記第2層は、上記第1層上に形成されている。ここで、上記第2層は、上記第1層の表面に直接接して形成されていてもよいし、後述する中間層を介して第1層上に形成されていてもよい。上記第2層は、Zr(ジルコニウム)を構成元素として含む窒化物からなる。ジルコニウムを構成元素として含むため第2層は、耐摩耗性と耐酸化性と靭性とのバランスに優れる。また、第2層中にCr(クロム)及びTiを含まない場合、被削材の元素が拡散することで被膜の損傷が進むことがない。よって、第2層を含む切削工具は、長寿命を達成することができる。
本実施形態の切削工具1に含まれる被膜3は、上記第1層31及び上記第2層32に加えて、他の層を含むことができる。他の層としては、例えば、上記第2層32上に形成されている表面層33(図2)、上記基材2と上記第1層31との間に形成されている下地層34(図3)、上記第1層31と上記第2層32との間に形成されている中間層35(図4)等を挙げることができる。
本実施形態に係る表面層33は、上記第2層32上に形成されている(図2)。上記表面層33は単層であってもよいし、多層であってもよい。上記表面層33は、ジルコニウムを構成元素として含む炭窒化物からなることが好ましい。上記炭窒化物としては、例えば、ZrCN、ZrSiCN、ZrVCN等が挙げられる。上記炭窒化物は、1種類を単独で用いてもよく、複数種類を組み合わせて用いてもよい。
本実施形態に係る下地層34は、上記基材2と上記第1層31との間に形成されている(図3)。上記下地層34は、単層であってもよいし、多層であってもよい。上記下地層34は、Ti(チタン)及びCr(クロム)からなる群より選ばれる少なくとも1つの元素を構成元素として含む金属又は化合物からなることが好ましい。上記下地層を設けることによって、上記基材1と上記第1層31との密着力が向上する傾向にある。当該金属としては、例えば、金属チタン、金属クロム、チタン及びクロムを構成元素として含む合金等が挙げられる。当該化合物としては、例えば、CrN、TiN等が挙げられる。
上述の本開示の一実施の形態に係る切削工具の製造方法は、上記切削工具の製造方法であって、
上記基材を準備する工程(以下、「第1工程」という場合がある。)と、
物理的蒸着法を用いて、上記基材上に上記第1層を形成する工程(以下、「第2工程」という場合がある。)と、
物理的蒸着法を用いて、上記第1層上に上記第2層を形成する工程(以下、「第3工程」という場合がある。)と、
を含む。
第1工程では基材が準備される。例えば、基材として超硬合金基材が準備される。超硬合金基材は、市販品を用いてもよく、一般的な粉末冶金法で製造してもよい。一般的な粉末冶金法で製造する場合、例えば、ボールミル等によってWC粉末とCo粉末等とを混合して混合粉末を得る。該混合粉末を乾燥した後、所定の形状に成形して成形体を得る。さらに該成形体を焼結することにより、WC-Co系超硬合金(焼結体)を得る。次いで該焼結体に対して、ホーニング処理等の所定の刃先加工を施すことにより、WC-Co系超硬合金からなる基材を製造することができる。第1工程では、上記以外の基材であっても、この種の基材として従来公知の基材であればいずれも準備可能である。
後述する第2工程の前に、基材を洗浄する工程を行なうことができる。例えば、第2工程においてマグネトロンスパッタリング法を用いて第1層を形成する前に、基材の表面に対してイオンボンバードメント処理を施すことができる。これにより例えば、基材として超硬合金基材を用いた場合、基材の表面から軟質な結合相を除去することができる。その後、基材上に第1層又は下地層を形成することにより、第1層又は下地層と基材とが接する部分における硬質粒子の占有率を高めることができる。このとき基材における第1層又は下地層と接する面積のうち80%以上がWCであることがより好ましい。
さらにイオンボンバードメント処理自体により、下地層を形成することができる。すなわちイオンボンバードメント処理においてクロム、チタン又はこれらの組合せの元素を含むターゲットを使用することにより、基材の表面を洗浄しながら、これらの元素を下地層として基材の表面に付着させることができる。そして、これらの元素が付着した表面上に、後述する第2工程である第1層を形成する工程を行なうことにより、密着力に優れる下地層を、第1層と併せて形成することができる。イオンボンバードメント処理に使用され、かつ下地層に含まれる元素としては、クロムであることがより好ましい。クロムは昇華性の元素であるため、イオンボンバードメント処理の際に溶融粒子(ドロップレット)の発生が少なく、基材の表面荒れを防止できるからである。
第2工程では、上記基材上に第1層が形成される。その方法としては、形成しようとする第1層の組成に応じて、各種の方法が用いられる。例えば、ジルコニウム、ホウ素、チタン、ケイ素及びバナジウム等の粒径をそれぞれ変化させた合金製ターゲットを使用する方法、それぞれ組成の異なる複数のターゲットを使用する方法、成膜時に印可するバイアス電圧をパルス電圧とする方法、成膜時にガス流量を変化させる方法、又は、成膜装置において基材を保持する基材ホルダの回転速度を調整する方法等を挙げることができる。これらの方法を組み合わせて第1層を形成することもできる。
<第3工程:第2層を形成する工程>
第3工程では、上記第1層上に第2層が形成される。その方法としても第2工程と同様に、形成しようとする第2層の組成に応じて、各種の方法が用いられる。例えば、ジルコニウム、ケイ素及びバナジウム等の粒径をそれぞれ変化させた合金製ターゲットを使用する方法、それぞれ組成の異なる複数のターゲットを使用する方法、成膜時に印可するバイアス電圧をパルス電圧とする方法、ガス流量を変化させる方法、又は、成膜装置において基材を保持する基材ホルダの回転速度を調整する方法等を挙げることができる。これらの方法を組み合わせて第2層を形成することもできる。
上記第3工程の後に、表面層を形成する工程を行なうことができる。例えば、表面層を形成する工程は以下のようにして行われる。すなわち、第2層を形成する工程に引き続き、第2層が形成された基材2をチャンバ130内の中央で回転させた状態で、スパッタリングガスとしてアルゴンガスを、反応ガスとして窒素ガスを導入する。さらに、当該基材2を温度400~700℃に、反応ガス圧を0.3~1Paの範囲に、バイアス電源142の電圧を-30~-100Vの範囲に維持したまま、表面層形成用の蒸発源134にパルス電源より5.5~7.5kWの電力を供給する。これにより、当該蒸発源134から金属イオンを発生させ、所定の時間が経過したところでパルス電源からの電力の供給を止めて、第2層上に表面層を形成する。なお、表面層の組成によっては、表面層形成用の蒸発源134の代わりに第2層形成用の蒸発源132を用いて、表面層を形成してもよい。
第1層及び第2層を形成した後、被膜に圧縮残留応力を付与してもよい。靭性が向上するからである。圧縮残留応力は、例えばブラスト法、ブラシ法、バレル法、イオン注入法等によって付与することができる。
(付記1)
基材と、前記基材上に形成されている被膜とを含む表面被覆切削工具であって、
前記被膜は、前記基材上に形成されている第1層と前記第1層上に形成されている第2層とを含み、
前記第1層は、構成元素としてZrを含むホウ化物からなり、
前記第2層は、構成元素としてZrを含む窒化物からなる、表面被覆切削工具。
(付記2)
前記第1層は、その厚さが0.5μm以上10μm以下である、付記1に記載の表面被覆切削工具。
(付記3)
前記第2層は、その厚さが0.5μm以上10μm以下である、付記1又は付記2に記載の表面被覆切削工具。
(付記4)
前記ホウ化物は、ZrB2を含む、付記1~付記3のいずれかに記載の表面被覆切削工具。
(付記5)
前記窒化物は、ZrNを含む、付記1~付記4のいずれかに記載の表面被覆切削工具。
(付記6)
前記ホウ化物は、構成元素としてTiを更に含む、付記1~付記5のいずれかに記載の表面被覆切削工具。
(付記7)
前記ホウ化物は、構成元素としてSiを更に含み、
前記ホウ化物を構成する金属原子の総数を1としたとき、前記Siの原子数比は0を超えて0.2以下である、付記1~付記6のいずれかに記載の表面被覆切削工具。
(付記8)
前記窒化物は、構成元素としてSiを更に含み、
前記窒化物を構成する金属原子の総数を1としたとき、前記Siの原子数比は0を超えて0.2以下である、付記1~付記7のいずれかに記載の表面被覆切削工具。
(付記9)
前記ホウ化物は、構成元素としてVを更に含み、
前記ホウ化物を構成する金属原子の総数を1としたとき、前記Vの原子数比は0を超えて0.2以下である、付記1~付記8のいずれかに記載の表面被覆切削工具。
(付記10)
前記窒化物は、構成元素としてVを更に含み、
前記窒化物を構成する金属原子の総数を1としたとき、前記Vの原子数比は0を超えて0.2以下である、付記1~付記9のいずれかに記載の表面被覆切削工具。
(付記11)
前記被膜は、前記第2層上に形成されている表面層を更に含み、
前記表面層は、構成元素としてZrを含む炭窒化物からなる、付記1~付記10のいずれかに記載の表面被覆切削工具。
(付記12)
前記被膜は、前記基材と前記第1層との間に形成されている下地層を更に含み、
前記下地層は、Ti及びCrからなる群より選ばれる少なくとも1つの元素を構成元素として含む金属又は化合物からなる、付記1~付記11のいずれかに記載の表面被覆切削工具。
(付記13)
付記1~付記12のいずれかに記載の表面被覆切削工具の製造方法であって、
前記基材を準備する工程と、
物理的蒸着法を用いて、前記基材上に前記第1層を形成する工程と、
物理的蒸着法を用いて、前記第1層上に前記第2層を形成する工程と、
を含む、表面被覆切削工具の製造方法。
図5は、本実施例で用いた成膜装置(マグネトロンスパッタリング装置)の模式断面図である。図6は、本実施例で用いた成膜装置の模式平面図である。
本実施例では、基材2としてグレードがJIS規格P30の超硬合金であって、形状がJIS規格のCNMG120408及び住友電工ハードメタル株式会社製SEMT13T3AGSNであるチップ、並びに、ラジアスエンドミル(φ12mm)それぞれを準備した(基材を準備する工程)。
次に、ガス導入口123からスパッタリングガスとしてアルゴンガスを導入し、チャンバ130内の圧力を3.0Paに保持し、バイアス電源142の電圧を徐々に上げながら-1000Vとし、基材2の表面のクリーニング(15分間)に加え、基材2の表面から結合相を除去する処理(アルゴンイオンによるイオンボンバードメント処理)を行なった。その後、チャンバ130内からアルゴンガスを排気した(基材を洗浄する工程)。
実施例1~実施例10及び比較例2においては、上記の基材2の洗浄に引き続き、基材2をチャンバ130内の中央で回転させた状態で、雰囲気ガスとしてAr(アルゴン)を導入した。さらに、基材2を温度600℃に、ガス圧を0.5Paに、バイアス電源142の電圧を-50V~-100Vの範囲の一定値にそれぞれ維持したまま第1層形成用の蒸発源131に6kWの電力を供給した。これにより、蒸発源131から金属イオン及びホウ素のイオンを発生させ、所定の時間が経過したところで電力の供給を止めて、基材2上に表1に示す組成の第1層を形成した。このとき第1層は、表1に示す厚さを有するように、電力供給の時間を調整しながら作製した。
次に、実施例1~実施例10において、基材2の温度、ガス圧及びバイアス電圧を上記のまま維持し、第2層形成用の蒸発源132に6kWの電力を供給することによって、蒸発源132から金属イオンを発生させた。このとき反応ガスとして窒素を用いた。所定の時間が経過したところで電力の供給を止めて、第1層上に表1に示す組成の第2層を形成した。このとき第2層は、表1に示す厚さを有するように、電力供給の時間を調整しながら作製した。
ここで実施例2~実施例4及び実施例7~実施例9においては、上記第2層を形成する工程に引き続き、表2に示す組成及び厚さを有する表面層を形成した。具体的には、第2層を形成した基材2をチャンバ130の中央で回転させた状態で、雰囲気ガスとしてAr、反応ガスとして窒素及びメタンガスの両方を導入して行なった。さらに、基材2を温度400℃に、反応ガス圧を0.4Paに、バイアス電源142の電圧を-150Vに維持したまま、表面層形成用の蒸発源134に6kWの電力を供給した。これにより、当該蒸発源134から金属イオンを発生させ、所定の時間が経過したところで電力の供給を止めて、第2層上に表面層を形成した。
(旋削試験:切削試験1~切削試験3)
実施例1~実施例10及び比較例1~比較例5のCNMG120408形状の刃先交換型切削チップそれぞれについて、合金鋼(SCM440)とニッケル基の超合金(インコネル(登録商標)718)とに対して表3に示す条件で湿式の連続旋削試験(切削試験1、切削試験3)及び断続旋削試験(切削試験2)を行ない、刃先の逃げ面摩耗量が0.2mmになるまでの時間を測定した。結果を表4に示す。表4において、切削時間の長い方がより長い寿命であることを示している。なお、インコネル(登録商標)718は、チタンを微量しか含まないため、本明細書における「チタンを含む被削材」には該当しない。
実施例1~実施例10及び比較例1~比較例5のSEMT13T3AGSN形状の刃先交換型切削チップそれぞれについて、難削材(SKD11又はFCD700)からなる幅150mmの板の中心線と、それより幅の広いφ160mmのカッターの中心を合わせて、表面フライス削りを、表5に示す乾式のフライス試験の条件で行ない、刃先の逃げ面摩耗量が0.2mmになるまでの切削長を測定した。結果を表6に示す。なお、表6において、切削長の長い方がより長い寿命であることを示している。
(エンドミル試験:切削試験6)
実施例1~実施例10及び比較例1~比較例5のφ12mmのラジアスエンドミルそれぞれについて、表5に示す湿式のエンドミル試験の条件で行ない、刃先の逃げ面摩耗量が0.2mmになるまでの切削長を測定した。結果を表6に示す。なお、表6において、切削長の長い方がより長い寿命であることを示している。
Claims (13)
- 基材と、前記基材上に形成されている被膜とを含む切削工具であって、
前記被膜は、前記基材上に形成されている第1層と前記第1層上に形成されている第2層とを含み、
前記第1層は、ジルコニウムを構成元素として含むホウ化物からなり、
前記第2層は、ジルコニウムを構成元素として含む窒化物からなる、切削工具。 - 前記第1層の厚さは、0.5μm以上10μm以下である、請求項1に記載の切削工具。
- 前記第2層の厚さは、0.5μm以上10μm以下である、請求項1又は請求項2に記載の切削工具。
- 前記ホウ化物は、ZrB2を含む、請求項1から請求項3のいずれか一項に記載の切削工具。
- 前記窒化物は、ZrNを含む、請求項1から請求項4のいずれか一項に記載の切削工具。
- 前記ホウ化物は、チタンを構成元素として更に含む、請求項1から請求項5のいずれか一項に記載の切削工具。
- 前記ホウ化物は、ケイ素を構成元素として更に含み、
前記ホウ化物を構成する金属原子の総数を1としたとき、前記ケイ素の原子数比は0を超えて0.2以下である、請求項1から請求項6のいずれか一項に記載の切削工具。 - 前記窒化物は、ケイ素を構成元素として更に含み、
前記窒化物を構成する金属原子の総数を1としたとき、前記ケイ素の原子数比は0を超えて0.2以下である、請求項1から請求項7のいずれか一項に記載の切削工具。 - 前記ホウ化物は、バナジウムを構成元素として更に含み、
前記ホウ化物を構成する金属原子の総数を1としたとき、前記バナジウムの原子数比は0を超えて0.2以下である、請求項1から請求項8のいずれか一項に記載の切削工具。 - 前記窒化物は、バナジウムを構成元素として更に含み、
前記窒化物を構成する金属原子の総数を1としたとき、前記バナジウムの原子数比は0を超えて0.2以下である、請求項1から請求項9のいずれか一項に記載の切削工具。 - 前記被膜は、前記第2層上に形成されている表面層を更に含み、
前記表面層は、ジルコニウムを構成元素として含む炭窒化物からなる、請求項1から請求項10のいずれか一項に記載の切削工具。 - 前記被膜は、前記基材と前記第1層との間に形成されている下地層を更に含み、
前記下地層は、チタン及びクロムからなる群より選ばれる少なくとも1つの元素を構成元素として含む金属又は化合物からなる、請求項1から請求項11のいずれか一項に記載の切削工具。 - 請求項1から請求項12のいずれか一項に記載の切削工具の製造方法であって、
前記基材を準備する工程と、
物理的蒸着法を用いて、前記基材上に前記第1層を形成する工程と、
物理的蒸着法を用いて、前記第1層上に前記第2層を形成する工程と、
を含む、切削工具の製造方法。
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| CN201980066361.7A CN112805109A (zh) | 2018-10-10 | 2019-07-10 | 切削工具及其制造方法 |
| EP19871201.0A EP3865233A4 (en) | 2018-10-10 | 2019-07-10 | CUTTING TOOL AND METHOD OF MANUFACTURE THEREOF |
| US16/635,248 US20200406365A1 (en) | 2018-10-10 | 2019-07-10 | Cutting tool and method for manufacturing same |
| JP2019562668A JP6641610B1 (ja) | 2018-10-10 | 2019-07-10 | 切削工具及びその製造方法 |
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| US9820433B2 (en) | 2012-12-28 | 2017-11-21 | Positec Power Tools (Suzhou Co., Ltd.) | Auto mowing system |
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| CN118880275B (zh) * | 2024-09-30 | 2025-04-29 | 赣州澳克泰工具技术有限公司 | 一种多层交替涂层刀具及其制备方法 |
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