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WO2020067016A1 - Composition de résine d'étanchéité, dispositif à composant électronique et procédé de fabrication de dispositif à composant électronique - Google Patents

Composition de résine d'étanchéité, dispositif à composant électronique et procédé de fabrication de dispositif à composant électronique Download PDF

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Publication number
WO2020067016A1
WO2020067016A1 PCT/JP2019/037281 JP2019037281W WO2020067016A1 WO 2020067016 A1 WO2020067016 A1 WO 2020067016A1 JP 2019037281 W JP2019037281 W JP 2019037281W WO 2020067016 A1 WO2020067016 A1 WO 2020067016A1
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WIPO (PCT)
Prior art keywords
resin composition
sealing resin
epoxy resin
mass
electronic component
Prior art date
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PCT/JP2019/037281
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English (en)
Japanese (ja)
Inventor
実佳 田中
格 山浦
徹 馬場
児玉　俊輔
貴大 齋藤
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Resonac Corp
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Hitachi Chemical Co Ltd
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Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP2020549216A priority Critical patent/JP7396290B2/ja
Publication of WO2020067016A1 publication Critical patent/WO2020067016A1/fr
Anticipated expiration legal-status Critical
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H10W74/10—
    • H10W74/40—

Definitions

  • the present invention relates to a sealing resin composition, an electronic component device, and a method for manufacturing an electronic component device.
  • Patent Literature 1 describes a sealing epoxy resin composition in which 60% by volume or more of an inorganic filler is alumina in order to enhance thermal conductivity.
  • the amount of transmission loss caused by the radio wave transmitted for communication being thermally converted in the dielectric is expressed as the product of the frequency, the square root of the relative permittivity, and the dielectric loss tangent.
  • a transmission signal is likely to change into heat in proportion to the frequency. Therefore, in order to suppress transmission loss, a material of a communication member is required to have a lower dielectric property in a higher frequency band.
  • the present disclosure is directed to a sealing resin composition having an excellent balance between heat dissipation properties and dielectric properties of a cured product, an electronic component device sealed using the same, and an electronic component device sealed using the same. It is an object of the present invention to provide a method for manufacturing the same.
  • An electronic device comprising: a support member; an element disposed on the support member; and a cured product of the sealing resin composition according to ⁇ 1> or ⁇ 2>, which seals the element. Parts equipment.
  • a method for manufacturing an electronic component device comprising: a step of disposing an element on a support member; and a step of sealing the element with the sealing resin composition according to ⁇ 1> or ⁇ 2>.
  • a sealing resin composition having an excellent balance between the heat dissipation properties and dielectric properties of a cured product, an electronic component device sealed using the same, and the production of an electronic component device sealed using the same A method is provided.
  • the term "step” includes, in addition to a step independent of other steps, even if the purpose of the step is achieved even if it cannot be clearly distinguished from the other steps, the step is also included.
  • the numerical ranges indicated by using “to” include the numerical values described before and after “to” as the minimum value and the maximum value, respectively.
  • the upper limit or lower limit described in one numerical range may be replaced with the upper limit or lower limit of the numerical range described in other stages.
  • the upper limit or the lower limit of the numerical range may be replaced with the value shown in the embodiment.
  • each component may include a plurality of corresponding substances.
  • the content or content of each component is, unless otherwise specified, the total content or content of the plurality of substances present in the composition. Means quantity.
  • a plurality of types of particles corresponding to each component may be included.
  • the particle size of each component means a value of a mixture of the plurality of types of particles present in the composition unless otherwise specified.
  • the sealing resin composition of the present disclosure is a sealing resin composition containing an epoxy resin, a curing agent containing an active ester compound, and an inorganic filler containing alumina.
  • a cured product obtained by curing the sealing resin composition having the above configuration is compared with a cured product of a conventional sealing resin composition using an epoxy resin and a curing agent. It was found that the cured product had an excellent balance between heat dissipation and dielectric properties. The reason is not necessarily clear, but is considered as follows.
  • the sealing resin composition of the present disclosure contains alumina as an inorganic filler. Thereby, higher thermal conductivity is achieved as compared with the case where the sealing resin composition contains other inorganic filler such as silica. Furthermore, the resin composition for sealing of the present disclosure contains an active ester compound as a curing agent. A phenol curing agent, an amine curing agent, and the like generally used as a curing agent for an epoxy resin generate a secondary hydroxyl group in a reaction with the epoxy resin. On the other hand, in the reaction between the epoxy resin and the active ester compound, an ester group is generated instead of the secondary hydroxyl group.
  • the sealing resin composition of the present disclosure is compared with a sealing resin composition containing only a curing agent that generates a secondary hydroxyl group as a curing agent.
  • the dielectric loss tangent of the cured product can be kept low. As a result, even if the relative dielectric constant increases by using alumina as the inorganic filler, an increase in transmission loss can be suppressed.
  • Epoxy resin The type of epoxy resin contained in the encapsulating resin composition of the present disclosure is not particularly limited. Specific examples of the epoxy resin include at least one selected from the group consisting of phenol compounds such as phenol, cresol, xylenol, resorcin, catechol, bisphenol A and bisphenol F and naphthol compounds such as ⁇ -naphthol, ⁇ -naphthol and dihydroxynaphthalene.
  • Novolak epoxy resin obtained by epoxidizing a novolak resin obtained by condensing or co-condensing a phenolic compound of a type with an aliphatic aldehyde compound such as formaldehyde, acetaldehyde, propionaldehyde, etc. under an acidic catalyst.
  • an aromatic aldehyde compound such as benzaldehyde or salicylaldehyde under an acidic catalyst or Is a triphenylmethane-type epoxy resin obtained by epoxidizing a triphenylmethane-type phenol resin obtained by co-condensation
  • Copolymer type epoxy resin obtained by epoxidation of resin diphenylmethane type epoxy resin which is diglycidyl ether such as bisphenol A and bisphenol F; biphenyl type epoxy resin which is diglycidyl ether of alkyl-substituted or unsubstituted biphenol; stilbene Stilbene type epoxy resin which is a diglycidyl ether of a phenolic compound; epoxy resin containing a sulfur atom which is a diglycidyl ether such as bisphenol S; butanediol, polyethylene glycol, polypropylene Epoxy resin which is a glycidyl ether of alcohols such as glycol; glycidyl ester type epoxy resin which is a glycidyl ester of a polycarboxylic acid compound such as phthalic acid, isophthalic acid and tetrahydrophthalic acid; nitrogen such as aniline, diaminodiphenylmethane and isocyanuric acid A
  • the epoxy equivalent (molecular weight / number of epoxy groups) of the epoxy resin is not particularly limited. From the viewpoint of the balance of various properties such as moldability, reflow resistance and electrical reliability, it is preferably from 100 g / eq to 1000 g / eq, more preferably from 150 g / eq to 500 g / eq.
  • the epoxy equivalent of the epoxy resin is a value measured by a method according to JIS K7236: 2009.
  • the epoxy resin is a solid, its softening point or melting point is not particularly limited.
  • the temperature is preferably from 40 ° C. to 180 ° C. from the viewpoints of moldability and reflow resistance, and more preferably from 50 ° C. to 130 ° C. from the viewpoint of handleability in preparing the sealing resin composition.
  • the melting point or softening point of the epoxy resin is a value measured by a differential scanning calorimetry (DSC) or a method (ring and ball method) according to JIS K 7234: 1986.
  • the content of the epoxy resin in the encapsulating resin composition is preferably 0.5% by mass to 50% by mass, and more preferably 2% by mass to 30% by mass in view of strength, fluidity, heat resistance, moldability and the like. % Is more preferable.
  • the sealing resin composition of the present disclosure contains at least an active ester compound as a curing agent.
  • the sealing resin composition of the present disclosure may include a curing agent other than the active ester compound.
  • the active ester compound in the present disclosure refers to a compound having one or more ester groups in one molecule that reacts with an epoxy group, and has a curing action of an epoxy resin.
  • the sealing resin composition of the present disclosure can reduce the dielectric loss tangent of a cured product by using an active ester compound as a curing agent.
  • the polar group in the cured product enhances the water absorption of the cured product.
  • the concentration of the polar group in the cured product can be suppressed, and the water absorption of the cured product can be suppressed. it can.
  • the dielectric loss tangent of the cured product can be further reduced.
  • the water absorption of the cured product is preferably 0% to 0.35%, more preferably 0% to 0.30%, and still more preferably 0% to 0.25%.
  • the water absorption of the cured product is a mass increase rate determined by a pressure cooker test (121 ° C., 2.1 atm, 24 hours).
  • the type of the active ester compound is not particularly limited as long as it has at least one ester group in the molecule that reacts with the epoxy group.
  • the active ester compound examples include a phenol ester compound, a thiophenol ester compound, an N-hydroxyamine ester compound, an esterified product of a heterocyclic hydroxy compound, and the like.
  • the active ester compound examples include an ester compound obtained from at least one kind of aliphatic carboxylic acid and aromatic carboxylic acid and at least one kind of aliphatic hydroxy compound and aromatic hydroxy compound.
  • An ester compound containing an aliphatic compound as a component of polycondensation tends to have excellent compatibility with an epoxy resin due to having an aliphatic chain.
  • An ester compound containing an aromatic compound as a component of polycondensation tends to have excellent heat resistance due to having an aromatic ring.
  • the active ester compound examples include an aromatic ester obtained by a condensation reaction between an aromatic carboxylic acid and a phenolic hydroxyl group.
  • an aromatic carboxylic acid component in which 2 to 4 hydrogen atoms of an aromatic ring such as benzene, naphthalene, biphenyl, diphenylpropane, diphenylmethane, diphenyl ether, and diphenylsulfonic acid are substituted with a carboxy group
  • a mixture of an aromatic carboxylic acid and a phenolic hydroxyl group is obtained by using a mixture of a monohydric phenol in which one of the above is substituted with a hydroxyl group and a polyhydric phenol in which 2 to 4 of the hydrogen atoms of the aromatic ring are substituted with a hydroxyl group as a raw material.
  • Aromatic esters obtained by a condensation reaction are preferred. That is, an aromatic ester having a structural unit derived from the aromatic carboxylic acid component, a structural unit derived from the monohydric phenol, and a structural unit derived from the polyhydric phenol is preferable.
  • the active ester compound examples include a phenol resin having a molecular structure in which a phenol compound is knotted via an aliphatic cyclic hydrocarbon group, described in JP-A-2012-246467, and an aromatic dicarboxylic acid or An active ester resin having a structure obtained by reacting the halide with an aromatic monohydroxy compound is exemplified.
  • the active ester resin a compound represented by the following structural formula (1) is preferable.
  • R 1 is an alkyl group having 1 to 4 carbon atoms
  • X is a benzene ring, a naphthalene ring, a benzene ring or a naphthalene ring substituted with an alkyl group having 1 to 4 carbon atoms, or a biphenyl group
  • Y is a benzene ring, a naphthalene ring, or a benzene ring or a naphthalene ring substituted with an alkyl group having 1 to 4 carbon atoms
  • k is 0 or 1
  • n is an average of the number of repetitions. 25 to 1.5.
  • Specific examples of the compound represented by the structural formula (1) include, for example, the following exemplified compounds (1-1) to (1-10).
  • T-Bu in the structural formula is a tert-butyl group.
  • active ester compound examples include a compound represented by the following structural formula (2) and a compound represented by the following structural formula (3) described in JP-A-2014-114352. No.
  • R 1 and R 2 are each independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms
  • Z is a benzoyl group, a naphthoyl group
  • An ester-forming structural site (z1) selected from the group consisting of a benzoyl group or a naphthoyl group substituted with an alkyl group of Formulas 1 to 4, and an acyl group having 2 to 6 carbon atoms, or a hydrogen atom (z2); At least one is an ester forming structural site (z1).
  • R 1 and R 2 are each independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms
  • Z is a benzoyl group, a naphthoyl group
  • An ester-forming structural site (z1) selected from the group consisting of a benzoyl group or a naphthoyl group substituted with an alkyl group of Formulas 1 to 4, and an acyl group having 2 to 6 carbon atoms, or a hydrogen atom (z2); At least one is an ester forming structural site (z1).
  • Specific examples of the compound represented by the structural formula (2) include, for example, the following exemplified compounds (2-1) to (2-6).
  • Specific examples of the compound represented by the structural formula (3) include, for example, the following exemplified compounds (3-1) to (3-6).
  • active ester compound A commercial product may be used as the active ester compound.
  • Commercially available active ester compounds include "EXB9451”, “EXB9460”, “EXB9460S”, “HPC-8000-65T” (manufactured by DIC Corporation) as active ester compounds having a dicyclopentadiene-type diphenol structure; "EXB9416-70BK”, “EXB-8", “EXB-9425” (manufactured by DIC Corporation) as an active ester compound having a structure; “DC808” (Mitsubishi Chemical Corporation) as an active ester compound containing an acetylated product of phenol novolak "YLH1026” (manufactured by Mitsubishi Chemical Corporation) as an active ester compound containing benzoylated phenol novolak.
  • the active ester compound may be used alone or in combination of two or more.
  • the ester equivalent of the active ester compound is not particularly limited. From the viewpoint of the balance of various characteristics such as moldability, reflow resistance, and electrical reliability, 150 g / eq to 400 g / eq is preferable, 170 g / eq to 300 g / eq is more preferable, and 200 g / eq to 250 g / eq is preferable. More preferred.
  • the ester equivalent of the active ester compound is a value measured by a method according to JIS K 0070: 1992.
  • the equivalent ratio of the epoxy resin to the active ester compound is preferably 0.9 or more, more preferably 0.95 or more, and 0.97 or more, from the viewpoint of keeping the dielectric loss tangent of the cured product low. Is more preferred.
  • the equivalent ratio (ester group / epoxy group) between the epoxy resin and the active ester compound is preferably 1.1 or less, more preferably 1.05 or less, from the viewpoint of suppressing the unreacted component of the active ester compound. 03 or less is more preferable.
  • the curing agent may contain other curing agents other than the active ester compound.
  • the type of the other curing agent is not particularly limited, and can be selected according to the desired characteristics of the sealing resin composition.
  • Other curing agents include phenol curing agents, amine curing agents, acid anhydride curing agents, polymercaptan curing agents, polyaminoamide curing agents, isocyanate curing agents, and blocked isocyanate curing agents.
  • phenol curing agent examples include polyphenol compounds such as resorcin, catechol, bisphenol A, bisphenol F, and substituted or unsubstituted biphenol; phenol, cresol, xylenol, resorcin, catechol, bisphenol A, bisphenol F, and phenylphenol.
  • Phenolic compounds such as aminophenols, aminophenols and the like and at least one phenolic compound selected from the group consisting of naphthol compounds such as ⁇ -naphthol, ⁇ -naphthol and dihydroxynaphthalene, and aldehyde compounds such as formaldehyde, acetaldehyde and propionaldehyde
  • Novolak-type phenolic resin obtained by condensation or co-condensation under the following conditions: the above-mentioned phenolic compound, dimethoxyparaxylene, bis (methoxymethyl) biffe Phenol aralkyl resins such as phenol aralkyl resins, naphthol aralkyl resins, etc .; para-xylylene-modified phenol resins, meta-xylylene-modified phenol resins; melamine-modified phenol resins; terpene-modified phenol resins; A dicyclopentadiene-type phenol
  • the functional group equivalent of other curing agents is not particularly limited. From the viewpoint of the balance of various properties such as moldability, reflow resistance, and electrical reliability, it is preferably from 70 g / eq to 1000 g / eq, more preferably from 80 g / eq to 500 g / eq.
  • the temperature is preferably from 40 ° C. to 180 ° C., and from the viewpoint of handleability during the production of the sealing resin composition, it is more preferably from 50 ° C. to 130 ° C. .
  • the melting point or softening point of the curing agent is a value measured in the same manner as the melting point or softening point of the epoxy resin.
  • the number of functional groups is not particularly limited. From the viewpoint of minimizing the amount of each unreacted component, it is preferably set in the range of 0.5 to 2.0, and more preferably in the range of 0.6 to 1.3. From the viewpoint of moldability and reflow resistance, it is more preferable to set the ratio in the range of 0.8 to 1.2.
  • the content of the active ester compound with respect to the total mass of the active ester compound and other curing agents is preferably 80% by mass or more, more preferably 85% by mass or more, from the viewpoint of keeping the dielectric loss tangent of the cured product low. More preferably, it is 90% by mass or more.
  • the total content of the epoxy resin and the active ester compound with respect to the total mass of the epoxy resin, the active ester compound and the other curing agent is preferably 80% by mass or more, and more preferably 85% by mass, from the viewpoint of suppressing the dielectric loss tangent of the cured product to be low. %, More preferably 90% by mass or more.
  • the sealing resin composition may include a curing accelerator.
  • the type of the curing accelerator is not particularly limited, and can be selected according to the type of the epoxy resin or the curing agent, the desired characteristics of the sealing resin composition, and the like.
  • curing accelerator examples include diazabicycloalkenes such as 1,5-diazabicyclo [4.3.0] nonene-5 (DBN) and 1,8-diazabicyclo [5.4.0] undecene-7 (DBU); Cyclic amidine compounds such as 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-heptadecylimidazole; derivatives of the cyclic amidine compounds; phenol novolak salts of the cyclic amidine compounds or derivatives thereof; To maleic anhydride, 1,4-benzoquinone, 2,5-toluquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1 , 4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, phenyl-1 Quinone compounds such as 4-benzo
  • a phosphine compound such as 1,4-benzoquinone, 2,5-toluquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, Quinone compounds such as 3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone and phenyl-1,4-benzoquinone; and compounds having a ⁇ bond such as diazophenylmethane.
  • a halogenated phenol compound such as di-tert-butylphenol, 4-chloro-1
  • the amount is preferably from 0.1 to 30 parts by mass based on 100 parts by mass of the resin component (the total amount of the epoxy resin and the curing agent). And more preferably 1 to 15 parts by weight.
  • the amount of the curing accelerator is 0.1 parts by mass or more based on 100 parts by mass of the resin component, the curing tends to be performed well in a short time. If the amount of the curing accelerator is 30 parts by mass or less based on 100 parts by mass of the resin component, the curing rate tends to be too high and a good molded product tends to be obtained.
  • the sealing resin composition of the present disclosure contains alumina as an inorganic filler.
  • alumina By including alumina, an improvement in the thermal conductivity of the cured product can be expected.
  • the inorganic filler other than alumina include inorganic materials such as fused silica, crystalline silica, glass, talc, clay, and mica.
  • An inorganic filler having a flame-retardant effect may be used.
  • Examples of the inorganic filler having a flame-retardant effect include aluminum hydroxide, magnesium hydroxide, a composite metal hydroxide such as a composite hydroxide of magnesium and zinc, and zinc borate.
  • silica such as fused silica is preferable from the viewpoint of reducing the coefficient of linear expansion.
  • One inorganic filler may be used alone, or two or more inorganic fillers may be used in combination.
  • Examples of the form of the inorganic filler include powder, beads obtained by making the powder spherical, fibers, and the like.
  • the average particle size is not particularly limited.
  • the average particle size is preferably from 0.2 ⁇ m to 100 ⁇ m, more preferably from 0.5 ⁇ m to 50 ⁇ m.
  • the average particle size is 0.2 ⁇ m or more, an increase in the viscosity of the sealing resin composition tends to be further suppressed.
  • the average particle size is 100 ⁇ m or less, the filling properties tend to be further improved.
  • the average particle size of the inorganic filler is determined as a volume average particle size (D50) by a laser scattering diffraction particle size distribution analyzer.
  • the proportion of alumina occupied by the inorganic filler contained in the sealing resin composition is not particularly limited.
  • the content is preferably 50% by mass or more, more preferably 60% by mass or more, and even more preferably 70% by mass or more.
  • the content is preferably 90% by mass or less.
  • the content of the inorganic filler contained in the sealing resin composition is not particularly limited. From the viewpoints of fluidity and strength, the content is preferably 30% by volume to 90% by volume, more preferably 35% by volume to 80% by volume, and more preferably 40% by volume to 70% by volume of the entire sealing resin composition. % Is more preferable.
  • the content of the inorganic filler is 30% by volume or more of the entire sealing resin composition, properties such as a thermal expansion coefficient, a thermal conductivity, and an elastic modulus of the cured product tend to be further improved.
  • the content of the inorganic filler is 90% by volume or less of the entire sealing resin composition, an increase in the viscosity of the sealing resin composition is suppressed, the flowability is further improved, and the moldability is more improved. Tend to be.
  • the sealing resin composition may contain various additives such as a coupling agent, an ion exchanger, a release agent, a flame retardant, and a coloring agent exemplified below, in addition to the above components.
  • the sealing resin composition may contain various additives known in the art as needed, in addition to the additives exemplified below.
  • the sealing resin composition may include a coupling agent.
  • the sealing resin composition preferably contains a coupling agent.
  • the coupling agent include known coupling agents such as silane compounds such as epoxy silane, mercapto silane, amino silane, alkyl silane, ureido silane, and vinyl silane, titanium compounds, aluminum chelate compounds, and aluminum / zirconium compounds. .
  • the amount of the coupling agent is preferably 0.05 to 5 parts by mass, and more preferably 0.1 part by mass, based on 100 parts by mass of the inorganic filler. More preferably, it is 2.5 parts by mass.
  • the amount of the coupling agent is 0.05 parts by mass or more based on 100 parts by mass of the inorganic filler, the adhesiveness to the frame tends to be further improved.
  • the amount of the coupling agent is 5 parts by mass or less based on 100 parts by mass of the inorganic filler, the moldability of the package tends to be further improved.
  • the sealing resin composition may include an ion exchanger.
  • the sealing resin composition preferably contains an ion exchanger from the viewpoint of improving the moisture resistance and high-temperature storage characteristics of the electronic component device including the element to be sealed.
  • the ion exchanger is not particularly limited, and a conventionally known ion exchanger can be used. Specific examples include a hydrotalcite compound and a hydrated oxide of at least one element selected from the group consisting of magnesium, aluminum, titanium, zirconium and bismuth.
  • One type of ion exchanger may be used alone, or two or more types may be used in combination. Among them, hydrotalcite represented by the following general formula (A) is preferable.
  • the sealing resin composition contains an ion exchanger
  • its content is not particularly limited as long as it is an amount sufficient to capture ions such as halogen ions.
  • the amount is preferably from 0.1 to 30 parts by mass, more preferably from 1 to 10 parts by mass, per 100 parts by mass of the resin component (total amount of the epoxy resin and the curing agent).
  • the sealing resin composition may include a release agent from the viewpoint of obtaining good releasability from a mold during molding.
  • the release agent is not particularly limited, and a conventionally known release agent can be used. Specific examples include carnauba wax, higher fatty acids such as montanic acid and stearic acid, higher fatty acid metal salts, ester waxes such as montanic acid esters, and polyolefin waxes such as polyethylene oxide and non-oxidized polyethylene.
  • One type of release agent may be used alone, or two or more types may be used in combination.
  • the amount is preferably from 0.01 to 10 parts by mass, more preferably from 0.1 to 10 parts by mass, per 100 parts by mass of the resin component (total amount of the epoxy resin and the curing agent). More preferred is from 5 parts by mass to 5 parts by mass.
  • the amount of the release agent is 0.01 part by mass or more based on 100 parts by mass of the resin component, there is a tendency that sufficient releasability is obtained.
  • the amount is 10 parts by mass or less, better adhesiveness tends to be obtained.
  • the sealing resin composition may contain a flame retardant.
  • the flame retardant is not particularly limited, and a conventionally known one can be used. Specifically, an organic or inorganic compound containing a halogen atom, an antimony atom, a nitrogen atom or a phosphorus atom, a metal hydroxide and the like can be mentioned.
  • the flame retardants may be used alone or in combination of two or more.
  • the sealing resin composition contains a flame retardant
  • its amount is not particularly limited as long as it is an amount sufficient to obtain a desired flame retardant effect.
  • it is preferably from 1 to 30 parts by mass, more preferably from 2 to 20 parts by mass, based on 100 parts by mass of the resin component (total amount of the epoxy resin and the curing agent).
  • the sealing resin composition may include a coloring agent.
  • the coloring agent include known coloring agents such as carbon black, organic dyes, organic pigments, titanium oxide, lead red, and red iron oxide.
  • the content of the coloring agent can be appropriately selected according to the purpose and the like.
  • the colorant may be used alone or in combination of two or more.
  • the method for preparing the sealing resin composition is not particularly limited.
  • a general method there can be mentioned a method in which components of a predetermined compounding amount are sufficiently mixed by a mixer or the like, then melt-kneaded by a mixing roll, an extruder, or the like, cooled, and pulverized. More specifically, for example, a method of uniformly stirring and mixing predetermined amounts of the above-described components, kneading with a kneader, roll, extruder or the like which has been heated to 70 ° C. to 140 ° C., cooling, and pulverizing. Can be mentioned.
  • the sealing resin composition is preferably solid at normal temperature and normal pressure (for example, 25 ° C. and atmospheric pressure).
  • the shape when the sealing resin composition is a solid is not particularly limited, and examples thereof include powder, granules, and tablets.
  • the resin composition for sealing is in the form of a tablet, it is preferable from the viewpoint of handleability that the dimensions and the mass be such as to match the molding conditions of the package.
  • An electronic component device includes an element, and a cured product of the sealing resin composition of the present disclosure that seals the element.
  • Electronic component devices include supporting members such as lead frames, wired tape carriers, wiring boards, glass, silicon wafers, and organic substrates, as well as active elements such as semiconductor chips, transistors, diodes, and thyristors, capacitors, and resistors.
  • a passive element such as a coil
  • a sealing resin composition More specifically, after fixing an element on a lead frame, connecting a terminal part of the element such as a bonding pad and a lead part by wire bonding, a bump or the like, and then performing transfer molding or the like using a sealing resin composition.
  • an element is mounted on the surface of a support member having wiring board connection terminals formed on the back surface, and the element and the support member are bumped or wire-bonded.
  • BGA Bit Grid Array
  • CSP Chip Size Package
  • MCP Multi Chip Package
  • the sealing resin composition can also be suitably used for a printed wiring board.
  • the method for manufacturing an electronic component device includes a step of disposing an element on a support member, and a step of sealing the element with the sealing resin composition of the present disclosure.
  • the method of performing each of the above steps is not particularly limited, and can be performed by a general method. Further, the types of the support members and the elements used for manufacturing the electronic component device are not particularly limited, and the support members and the elements generally used for manufacturing the electronic component device can be used.
  • Examples of a method for sealing an element using the sealing resin composition of the present disclosure include a low-pressure transfer molding method, an injection molding method, and a compression molding method. Among these, the low pressure transfer molding method is common.
  • Epoxy resin 1 biphenyl aralkyl type epoxy resin, epoxy equivalent 275 g / eq (Nippon Kayaku Co., Ltd., product name "NC-3000")
  • Epoxy resin 2 biphenyl type epoxy resin, epoxy equivalent 192 g / eq (Mitsubishi Chemical Corporation, product name "YX-4000”)
  • Curing agent 1 Biphenyl aralkyl type phenol resin, hydroxyl equivalent 199 g / eq (Air Water Co., Ltd., product name "HE200C-10")
  • Curing agent 2 Active ester compound (DIC Corporation)
  • Curing accelerator 1 p-benzoquinone adduct of triphenylphosphine
  • Coupling agent 1 3-methacryloxypropyltrimethoxysilane (Shin-Etsu Chemical Co., Ltd., product name “KBM-503”)
  • Coupling agent 2 3-mercaptopropyltrimethoxysilane (Shin-Etsu Chemical Co., Ltd., product name “KBM-803”)
  • Inorganic filler 1 Silica filler (Denka Corporation, product name “FB-9454FC”, average particle size 18 ⁇ m)
  • Inorganic filler 2 Silica filler (Denka Corporation, product name “FB-9454”, average particle size 19 ⁇ m)
  • a test piece for thermal conductivity evaluation (length 10 mm ⁇ width 10 mm ⁇ ) was prepared by using a vacuum hand press molding machine under the conditions of a mold temperature of 175 ° C. to 180 ° C., a molding pressure of 250 kPa, and a curing time of 600 seconds. 0.8 mm).
  • the thermal diffusivity in the thickness direction of the molded test piece was measured.
  • the measurement of the thermal diffusivity was performed by a laser flash method (apparatus: LFA467 nanoflash, manufactured by NETZSCH).
  • the pulse light irradiation was performed under the conditions of a pulse width of 0.31 (ms) and an applied voltage of 247 V. The measurement was performed at an ambient temperature of 25 ° C.
  • ⁇ ⁇ ⁇ Cp ⁇ ⁇ Expression (1) (Where ⁇ is the thermal conductivity (W / (m ⁇ K)), ⁇ is the thermal diffusivity (m 2 / s), Cp is the specific heat (J / (kg ⁇ K)), and ⁇ is the density (D: kg / m 3 ).
  • the encapsulating resin composition is charged into a transfer molding machine, molded under the conditions of a mold temperature of 180 ° C., a molding pressure of 6.9 MPa, and a curing time of 90 seconds, and post-curing is performed at 175 ° C. for 6 hours to obtain a rod-shaped cured product ( 0.8 mm long, 0.6 mm wide, and 90 mm thick).
  • a cavity resonator Kerato Electronics Application Development Co., Ltd., “CP561”
  • a network analyzer Keysight Technology, Inc., “PNA E8364B”
  • Example 1 As shown in Table 1, the sealing resin compositions of Example 1 and Comparative Example 3 using alumina as the inorganic filler were harder than Comparative Examples 1 and 2 not using alumina as the inorganic filler. The thermal conductivity of the object was high. On the other hand, the relative dielectric constants of Example 1 and Comparative Example 3 were higher than those of Comparative Examples 1 and 2. However, in Example 1 in which the active ester compound was used as the curing agent, the transmission loss was suppressed because the dielectric loss tangent was lower than in Comparative Example 3 in which the phenol resin was used as the curing agent. The balance of characteristics was excellent.
  • Example 1 and Comparative Example 2 the use of an active ester having a lower viscosity than that of the phenol resin as the curing agent improved the fluidity as compared with Comparative Examples 1 and 3 using the phenol resin as the curing agent.
  • the effect of improving the fluidity of Example 1 using alumina as the inorganic filler was larger than that of Comparative Example 3 not using alumina as the inorganic filler.
  • the gel time is shorter than in Comparative Examples 1 to 3.
  • Alumina generally causes a delay in the curing reaction, but it is considered that the curability is improved because the reactivity between the active ester compound and the epoxy resin is higher than the reactivity between the phenol resin and the epoxy resin.

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

L'invention concerne une composition de résine d'étanchéité contenant : une résine époxyde ; un agent de durcissement comprenant un composé ester actif ; et une charge inorganique comprenant de l'alumine.
PCT/JP2019/037281 2018-09-27 2019-09-24 Composition de résine d'étanchéité, dispositif à composant électronique et procédé de fabrication de dispositif à composant électronique Ceased WO2020067016A1 (fr)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021210384A1 (fr) * 2020-04-14 2021-10-21 サンアプロ株式会社 Composition de résine époxyde

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010184993A (ja) * 2009-02-12 2010-08-26 Nippon Steel Chem Co Ltd エポキシ樹脂組成物および硬化物
JP2017103329A (ja) * 2015-12-01 2017-06-08 味の素株式会社 樹脂シート
WO2018008416A1 (fr) * 2016-07-06 2018-01-11 Dic株式会社 Composition d'ester actif, et produit durci de celle-ci
JP2018058959A (ja) * 2016-10-03 2018-04-12 味の素株式会社 樹脂組成物
JP2018159028A (ja) * 2017-03-23 2018-10-11 味の素株式会社 樹脂組成物

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010184993A (ja) * 2009-02-12 2010-08-26 Nippon Steel Chem Co Ltd エポキシ樹脂組成物および硬化物
JP2017103329A (ja) * 2015-12-01 2017-06-08 味の素株式会社 樹脂シート
WO2018008416A1 (fr) * 2016-07-06 2018-01-11 Dic株式会社 Composition d'ester actif, et produit durci de celle-ci
JP2018058959A (ja) * 2016-10-03 2018-04-12 味の素株式会社 樹脂組成物
JP2018159028A (ja) * 2017-03-23 2018-10-11 味の素株式会社 樹脂組成物

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021210384A1 (fr) * 2020-04-14 2021-10-21 サンアプロ株式会社 Composition de résine époxyde
JPWO2021210384A1 (fr) * 2020-04-14 2021-10-21
JP7650865B2 (ja) 2020-04-14 2025-03-25 サンアプロ株式会社 エポキシ樹脂組成物

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