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WO2020066210A1 - Composition de résine, préimprégné, film pourvu de résine, feuille métallique pourvue de résine, carte stratifiée plaquée de métal et carte de circuit imprimé - Google Patents

Composition de résine, préimprégné, film pourvu de résine, feuille métallique pourvue de résine, carte stratifiée plaquée de métal et carte de circuit imprimé Download PDF

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Publication number
WO2020066210A1
WO2020066210A1 PCT/JP2019/026872 JP2019026872W WO2020066210A1 WO 2020066210 A1 WO2020066210 A1 WO 2020066210A1 JP 2019026872 W JP2019026872 W JP 2019026872W WO 2020066210 A1 WO2020066210 A1 WO 2020066210A1
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WO
WIPO (PCT)
Prior art keywords
resin
composition
resin composition
mass
cured product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2019/026872
Other languages
English (en)
Japanese (ja)
Inventor
学 大塚
章裕 山内
孝 新保
洋之 藤澤
中村　善彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Priority to CN201980061967.1A priority Critical patent/CN112739771B/zh
Priority to KR1020217007648A priority patent/KR20210062632A/ko
Publication of WO2020066210A1 publication Critical patent/WO2020066210A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/315—Compounds containing carbon-to-nitrogen triple bonds
    • C08K5/3155—Dicyandiamide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/04—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to rubbers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02—Polyalkylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
    • C08L83/12—Block- or graft-copolymers containing polysiloxane sequences containing polyether sequences
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Definitions

  • the component (B) may contain only dicyandiamide, or may contain both dicyandiamide and a curing agent component other than dicyandiamide.
  • the component (B) may contain both dicyandiamide and a phenolic curing agent.
  • the composition (X) preferably contains (F) a core-shell rubber (hereinafter, referred to as a (F) component).
  • the component (F) can impart flexibility to the prepreg and the cured product made from the composition (X) without significantly affecting the glass transition temperature of the cured product of the composition (X). For this reason, powder fall of the prepreg produced from the composition (X) is reduced.
  • the composition (X) contains the component (F)
  • the composition (X) has a good impregnation property to the substrate, and the prepreg produced from the composition (X) has a good prepreg. It can have moldability.
  • the composition (X) preferably contains (G) an inorganic filler (hereinafter, referred to as a (G) component).
  • a (G) component an inorganic filler
  • the cured product of the composition (X) may have a lower coefficient of thermal expansion.
  • the composition (X) contains the component (F)
  • the cured product of the composition (X) tends to have a high coefficient of thermal expansion, but the composition (X) contains the component (F) and the component (G).
  • the composition contains (X) the cured product of the composition (X) can have a low coefficient of thermal expansion, so that deformation such as warpage and generation of cracks are easily suppressed even when subjected to thermal stress.
  • the component (G) may be subjected to a surface treatment with a coupling agent or the like. Thereby, the adhesion of the cured product of the composition (X) to the substrate can be increased.
  • a coupling agent for example, a silane coupling agent such as an epoxy silane coupling agent and a mercapto silane coupling agent can be used.
  • the content of the component (G) is preferably in the range of 5 parts by mass or more and 100 parts by mass or less based on 100 parts by mass of the component (A). When the content of the component (G) is within this range, the coefficient of thermal expansion of the cured product of the composition (X) can be reduced without adversely affecting the powder-fallability of the prepreg produced from the composition (X). can do.
  • the content of the component (G) is more preferably in the range of 10 parts by mass to 70 parts by mass with respect to 100 parts by mass of the component (A).
  • the prepreg 1 includes the fiber base material 12 and the composition (X) impregnated in the fiber base material 12 or the semi-cured material 11 of the composition (X).
  • the fiber base 12 is not particularly limited, and for example, a woven base such as a plain woven base in which the warp and the weft are woven so as to be substantially orthogonal can be used.
  • a woven base made of inorganic fibers for example, a woven base made of organic fibers, or the like can be used.
  • the woven fabric base made of inorganic fibers for example, glass cloth and the like can be mentioned.
  • Examples of the woven fabric base made of organic fibers include aramid cloth and polyester cloth.
  • the prepreg 1 When the resin component in the composition (X) undergoes sequential polymerization (for example, polyaddition), the prepreg 1 has a semi-cured product 11 of the composition (X) impregnated in the fiber base material 12.
  • the composition (X) impregnated in the fiber base material 12 is originally in a B-stage state, that is, a semi-cured state, and reaches the C-stage by heat to become a cured product.
  • the resin-attached film 2 has the support film 21 and the resin layer 13.
  • the resin layer 13 includes the composition (X) or the semi-cured product 11 of the composition (X).
  • the resin-attached film 2 has a two-layer configuration including the resin layer 13 and one support film 21 provided on one surface of the resin layer 13, but is not limited thereto.
  • the resin-attached film 2 may have a three-layer configuration including a resin layer 13 and two support films 21 provided on both surfaces of the resin layer 13.
  • the resin layer 13 contains the semi-cured product 11 of the composition (X).
  • the resin layer 13 is originally in the B-stage state, that is, in a semi-cured state, and reaches the C-stage by heat to become a cured product.
  • the resin-attached film 2 can be produced, for example, by laminating one or more prepregs 1 having a semi-cured product of the composition (X) on one side or both sides of a laminate. In this case, the prepreg 1 becomes the resin layer 13.
  • the film with resin 2 may be manufactured without using the prepreg 1.
  • it can be formed by directly applying the varnish-like composition (X) to the surface of the support film 21 and heating and drying it until it becomes a semi-cured state.
  • the temperature condition and time for the semi-cured state can be, for example, 170 to 200 ° C. and 30 to 90 minutes.
  • the resin-attached film 2 can be formed by directly applying the varnish-like composition (X) to the surface of the support film 21 and drying the composition.
  • the resin-attached film 2 thus formed is formed using the composition (X), as described above, the resin layer 13 not only has high adhesion to the base material, Has good surface appearance. In addition, the resin-attached film 2 is less likely to fall off during handling and during production of the laminate.
  • the resin-attached metal foil 3 includes the metal foil 22 and the resin layer 13.
  • the resin layer 13 includes the semi-cured material 11 of the composition (X).
  • the resin-attached metal foil 3 has a two-layer configuration including a resin layer 13 and one metal foil 22 provided on one surface of the resin layer 13.
  • the resin layer 13 contains the semi-cured product 11 of the composition (X).
  • the resin layer 13 is originally in the B-stage state, that is, in a semi-cured state, and reaches the C-stage by heat to become a cured product.
  • the resin-attached metal foil 3 may be manufactured using the prepreg 1.
  • the prepreg 1 having a semi-cured product of the composition (X) can be produced by laminating one or more prepregs 1 with a metal foil 22 on one surface. In this case, the prepreg 1 becomes the resin layer 13.
  • the resin-attached metal foil 3 thus formed is formed using the composition (X), as described above, the resin layer 13 not only has high adhesion to the base material, but also has , Has a good surface appearance. Further, the resin-attached metal foil 3 is less likely to fall off during handling and during production of the laminate.
  • Metal-clad laminate according to the present embodiment The metal-clad laminate 4 according to the present embodiment will be described with reference to FIG.
  • the metal layer 20 is provided on at least one surface of the insulating layer 10. That is, the configuration of the metal-clad laminate 4 may be a two-layer configuration including the insulating layer 10 and the metal layer 20 disposed on one surface of the insulating layer 10. A three-layer configuration including two metal layers 20 arranged on both surfaces may be employed.
  • FIG. 4 is a sectional view of the metal-clad laminate 4 having a three-layer structure.
  • the metal-clad laminate 4 is formed by laminating one or more prepregs 1 each having a semi-cured product of the composition (X) on one side or both sides, and molding by heating and pressing. It can be manufactured by forming The lamination molding can be performed by heating and pressing using, for example, a multi-stage vacuum press, a hot press, a double belt, or the like. In this case, the insulating layer 10 is produced by curing the prepreg 1.
  • the printed wiring boards 5 and 6 include the insulating layer 10 and the conductor wiring 30 provided on the insulating layer 10.
  • the insulating layer 10 includes a cured product of the composition (X) or a cured product of the prepreg 1.
  • the printed wiring board 6 is configured by alternately forming the insulating layers 10 and the conductor wirings 30 alternately on the surface of the core material 500 on which the conductor wirings 30 are formed, and the conductor wiring 31 is formed on the outermost layer. It is a printed wiring board having a structure. In the printed wiring board 6 having a multilayer structure, at least one of the plurality of insulating layers 10 contains a cured product of the composition (X). In the printed wiring board 6 having a multilayer structure, it is preferable that all of the plurality of insulating layers 10 include a cured product of the composition (X).
  • FIG. 5B is a cross-sectional view of the printed wiring board 6 having a multilayer structure including three insulating layers 10 and four conductive wires 30. In the printed wiring board 6 having a multilayer structure, through holes, via holes, and the like may be formed as necessary.
  • the method of manufacturing the printed wiring board 5 having a single-layer structure is not particularly limited.
  • a subtractive method of forming a conductor wiring 30 by removing a part of the metal layer 20 of the metal-clad laminate 4 by etching Forming a thin electroless plating layer by electroless plating on one or both sides of an unclad plate comprising an insulating layer 10 containing a cured product of the composition (X), protecting a non-circuit-forming portion with a plating resist,
  • the method for manufacturing the printed wiring board 6 having a multilayer structure is not particularly limited, and includes, for example, a build-up process.
  • the flex-rigid printed wiring board 7 according to the first embodiment includes a plurality of rigid portions 51, a flex portion 52 connecting the plurality of rigid portions 51, and at least one of the plurality of rigid portions 51 and the flex portion 52. And a conductor wiring 30 (32) provided. At least one of the plurality of rigid portions 51 includes a cured product of the composition (X). Specifically, the flex-rigid printed wiring board 7 according to the first embodiment has two rigid portions 51, one flex portion 52, and the conductor wiring 30 (32). At least one of the plurality of insulating layers 10 provided in the rigid portion 51 includes a cured product of the composition (X).
  • the rigid portion 51 is a rigid portion having hardness and strength that can withstand the weight of the mounted component and can be fixed to the housing.
  • the flex portion 52 is a flexible portion having flexibility that can be bent.
  • the flex-rigid printed wiring board 7 is used in a small and lightweight device such as a portable electronic device by being bent in the flex portion 52 and accommodated in a housing or the like.
  • the thickness of the flex portion 52 is preferably, for example, in the range of 5 ⁇ m or more and 300 ⁇ m or less. In this case, the flex portion 52 has good flexibility.
  • the flex-rigid printed wiring board 7 uses, for example, a single-layer flexible printed wiring board 200 having one insulating layer 50 and two conductor wirings 30 as a core material (hereinafter, may be referred to as a core material 200). Can be manufactured.
  • the rigid part 51 is formed by multilayering the core material 200 except for the part that becomes the flex part 52. That is, a part of the core material 200 becomes the flex part 52, and the other part of the core material 200 becomes the rigid part 51.
  • the material of the insulating layer 50 in the core material 200 is not particularly limited as long as it is a flexible material, and may include a flexible resin such as polyimide. Further, the technique for multi-layering is not particularly limited, and a known technique is used.
  • a multilayer structure can be formed by a build-up method using the metal foil 3 with resin having the metal foil 22 and the resin layer 13 containing the semi-cured composition (X).
  • the metal foil 3 with resin is overlapped on both surfaces of the core material 200, and the resin foil of the metal foil 3 with resin is formed by heating and pressing in this state.
  • the layer 13 adheres to the core material 200 and the resin layer 13 is cured, so that the insulating layer 10 of the rigid portion 51 is formed.
  • the metal foil 22 of the metal foil 3 with resin is subjected to an etching process or the like, so that the conductor wiring 32 is formed in the rigid portion 51.
  • the rigid portion 51 is formed, and the flex portion 52 connecting the rigid portions 51 is formed.
  • the rigid part 51 includes a part of the core material 200, the insulating layer 10 provided on the core material 200, and the conductor wiring 32 provided on the insulating layer 10. , but is not limited thereto.
  • the rigid portion 51 may include, for example, a solder resist layer provided on the outermost layer.
  • the rigid part 51 may have a structure in which two or more insulating layers 10 and two or more conductor wirings 32 are alternately provided on both sides of the core material 200. That is, the rigid portion 51 may be further multilayered by a build-up method or the like. A through hole, a via hole, and the like may be formed in the rigid portion 51 as necessary.
  • the flex portion 52 includes the insulating layer 50 which is a part of the core material 200. That is, the flex portion 52 is a part of the insulating layer 50.
  • the configuration of the flex section 52 is not limited to this, and the flex section 52 may include, for example, the conductor wiring 30. That is, the conductor wiring 30 may be formed on the insulating layer 50 of the flex portion 52. Further, a cover lay covering the conductor wiring 30 of the core material 200 may be provided. In this case, the flex portion 52 includes the insulating layer 50, the conductor wiring 30, and the cover lay.
  • the insulating layer 50 may have a single-layer structure including one insulating layer, or may have a multilayer structure in which a plurality of insulating layers are stacked.
  • the flex portion 52 may have a multilayer structure. In this case, for example, by using a flexible printed wiring board having a multilayer structure as a core material, a rigid flex printed wiring board is formed. Can be produced.
  • At least one of the plurality of insulating layers 10 contains a cured product of the composition (X). That is, at least one of the plurality of rigid portions 51 includes a cured product of the composition (X).
  • a flex-rigid printed wiring board 8 according to the second embodiment will be described with reference to FIG.
  • the same components as those of the flex-rigid printed wiring board 7 according to the first embodiment are denoted by the same reference numerals in the drawings, and detailed description will be omitted.
  • the flex-rigid printed wiring board 8 according to the second embodiment includes a plurality of rigid portions 51, a flex portion 52 connecting the plurality of rigid portions 51, and at least one of the plurality of rigid portions 51 and the flex portion 52. And a conductor wiring 30 (32) provided. At least one of the plurality of rigid portions 51 includes a cured product of the composition (X). Specifically, the flex-rigid printed wiring board 8 according to the second embodiment has two rigid portions 51, one flex portion 52, and the conductor wiring 30 (32). At least one of the plurality of insulating layers 10 provided in the rigid portion 51 includes a cured product of the composition (X).
  • the solder resist layer 60 is provided on the outermost layer of the rigid portion 51. Further, a cover lay 40 that covers the conductor wiring 30 of the core material 200 is provided. Further, a through-hole 101 and a buried via hole 102 are formed in the rigid portion 51.
  • the configuration of the flex-rigid printed wiring board 8 is not limited to this, and the flex-rigid printed wiring board 8 may not have the solder resist layer 60. Further, the flex-rigid printed wiring board 8 may not have the coverlay 40. A blind via hole may be further formed in the rigid portion 51 as necessary.
  • the flex-rigid printed wiring board 8 can be manufactured by using, for example, a single-layered flexible printed wiring board 200 having one insulating layer 50 and two conductor wirings 30 as a core material.
  • the material of the insulating layer 50 in the core material 200 is not particularly limited as long as it is a flexible material, and may include a flexible resin such as polyimide.
  • a cover lay 40 that covers the conductor wiring 30 is formed by laminating a cover lay film on both surfaces of the core material 200. Thereby, the flexible printed wiring board 300 having the core material 200 and the coverlay 40 is manufactured.
  • the rigid portion 51 is formed by multilayering the flexible printed wiring board 300 except for the portion that becomes the flex portion 52.
  • a part of the flexible printed wiring board 300 becomes the flex part 52, and another part of the flexible printed wiring board 300 becomes the rigid part 51.
  • the technique for multilayering is not particularly limited, and a known technique is used.
  • multilayering can be performed by the same method as the above-described flex-rigid printed wiring board 7 of the first embodiment. Specifically, it can be multilayered by a build-up method using the metal foil 3 with resin having the metal foil 22 and the resin layer 13 containing the semi-cured composition (X). In a plurality of regions of the flexible printed wiring board 300 where the rigid portions 51 are formed, the metal foil with resin 3 is overlapped on each of both surfaces of the flexible printed wiring board 300, and is heated and pressed in this state to form a metal with resin.
  • the resin layer 13 of the foil 3 adheres to the flexible printed wiring board 300 and the resin layer 13 containing the composition (X) is cured, so that the insulating layer 10 is formed in the rigid portion 51.
  • the metal foil 22 of the metal foil 3 with resin is subjected to an etching process or the like, so that the conductor wiring 32 is formed in the rigid portion 51.
  • the formation of the insulating layer 10 and the formation of the conductor wiring 32 are alternately repeated to form the solder resist layer 60 as the outermost layer.
  • the rigid portion 51 is formed, and the flex portion 52 connecting the rigid portions 51 is formed.
  • the through hole 101 and the buried via hole 102 can be formed by a known method.
  • An opening is formed in the prepreg 1 by punching out the prepreg 1 by die processing or the like. This opening corresponds to the flex portion 52 of the flex-rigid printed wiring board 8.
  • the prepreg 1 having an opening is superimposed on the flexible printed wiring board 300 and is molded under heat and pressure in this state, whereby the prepreg 1 is cured, and the insulating layer 10 containing the cured product of the composition (X) is formed into the rigid portion 51. Formed.
  • the insulating layer 10 is not formed in the flex portion 52.
  • the conductor wiring 32 is formed on the insulating layer 10 by a known method. The formation of the insulating layer 10 using the prepreg 1 having the opening and the formation of the conductor wiring 32 are alternately repeated to form the solder resist layer 60 as the outermost layer. As a result, the rigid portion 51 is formed, and the flex portion 52 connecting the rigid portions 51 is formed.
  • a flex-rigid printed wiring board 9 according to the third embodiment will be described with reference to FIG.
  • the same components as those of the flex-rigid printed wiring board 7 according to the first embodiment and the flex-rigid printed wiring board 8 according to the second embodiment are denoted by the same reference numerals in the drawings, and detailed description thereof will be omitted.
  • the flex-rigid printed wiring board 9 according to the third embodiment includes a plurality of rigid portions 51, a flex portion 52 connecting the plurality of rigid portions 51, and at least one of the plurality of rigid portions 51 and the flex portion 52. And a conductor wiring 30 (32) provided. At least one of the plurality of rigid portions 51 includes a cured product of the composition (X). Specifically, the flex-rigid printed wiring board 9 according to the third embodiment has two rigid portions 51, one flex portion 52, and the conductor wiring 30 (32). At least one of the plurality of bonding sheets 70 provided on the rigid portion 51 includes a cured product of the composition (X).
  • a coverlay 40 that covers the conductor wiring 30 of the core material 200 is provided. Further, a through hole 101 and a blind via hole 103 are formed in the rigid portion 51.
  • the configuration of the flex-rigid printed wiring board 9 is not limited to this, and the flex-rigid printed wiring board 9 may not have the cover lay 40. Further, a buried via hole may be further formed in the rigid portion 51 as necessary. Further, the rigid portion 51 may include a solder resist layer provided on the outermost layer.
  • the flex-rigid printed wiring board 9 includes, for example, a flexible printed wiring board 300 and a rigid printed wiring board 400 similar to those used for manufacturing the flex-rigid printed wiring board 8 of the second embodiment, as shown in FIG. It can be manufactured using the prepreg 1.
  • the flexible printed wiring board 300 includes a core material 200 including one insulating layer 50 and two conductor wirings 30, and two coverlays 40.
  • the rigid printed wiring board 400 is a multilayer printed wiring board having two insulating layers 10 and three conductor wirings 32, and has blind via holes 103 formed by a known method. First, an opening is formed in the prepreg 1 by punching out the prepreg 1 by die processing or the like.
  • This opening corresponds to the flex portion 52 of the flex-rigid printed wiring board 9.
  • the prepreg 1 having an opening is stacked on the flexible printed wiring board 300, and the rigid printed wiring board 400 is stacked on each of the prepregs 1.
  • the prepreg 1 is cured by heating and pressing to form the bonding sheet 70 containing the composition (X), and the flexible printed wiring board 300 and the rigid printed wiring board 400 form the bonding sheet 70. Glued through. Thereafter, the through hole 101 can be formed by a known method. Since the opening of the prepreg 1 corresponds to the flex portion 52, the bonding sheet 70 is not formed in the flex portion 52.
  • the structure of the rigid printed wiring board 400 is not limited to the structure shown in FIG.
  • the rigid printed wiring board 400 may have a configuration similar to that of the single-layer printed wiring board 5 shown in FIG. 5A having one insulating layer 10 and two conductor wirings 30, for example.
  • the rigid printed wiring board 400 may have the same configuration as the multilayer printed wiring board 6 shown in FIG. 5B having three insulating layers 10 and four conductor wirings 30. And five conductor wirings 30.
  • the insulating layer 10 of the rigid printed wiring board 400 may or may not include a cured product of the composition (X).
  • Epoxy resin A phosphorus-modified epoxy resin, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., part number FX-289
  • Epoxy resin B polyfunctional epoxy resin, KOLON INDUSTRIES, INC. Made, product number KET-4131 ⁇ Curing agent: Dicyandiamide, manufactured by Nippon Carbide Industry Co., Ltd.
  • Phenoxy resin A manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., product number YP-50, weight average molecular weight 70,000, tensile elongation 33%
  • Phenoxy resin B manufactured by Nippon Steel & Sumitomo Metal Corporation, part number YP-50S, weight average molecular weight 60000, tensile elongation 30%
  • Phenoxy resin C manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., product number ZX-1356-2, weight average molecular weight 70000, tensile elongation 12% -Surface conditioner A: polyether-modified polydimethylsiloxane, manufactured by BYK Japan KK, part number BYK-333 -Surface conditioner B: hydroxyl group-containing polyester-modified polydimethylsiloxane, manufactured by BYK Japan KK, part number BYK-370 Defoamer A: Acrylic copolymer solution, manufactured by BYK
  • a resin plate (length 15 cm, width 1 mm, thickness 100 ⁇ m) of each of the phenoxy resins A to C was prepared, and the tensile elongation of the resin plate was measured using an autograph (model number AG-IS, manufactured by Shimadzu Corporation). At a temperature of 23 ⁇ 2 ° C. and a tensile speed of 1 mm / min.
  • Preparation of Prepreg The resin varnish of each Example and Comparative Example was impregnated into glass cloth (manufactured by Nitto Boseki Co., Ltd., # 1078 type, WEA1078) so that the thickness after curing became 80 ⁇ m, and the melt viscosity at 170 ° C. was 60000.
  • the prepreg containing the resin composition in a semi-cured state was obtained by heating and drying until it reached 150150,000 Poise.
  • the melt viscosity was measured using a Koka type flow tester (CFT-100, manufactured by Shimadzu Corporation) at a temperature of 130 ° C. and a pressure of 1.96 MPa (20 kgf / cm 2 ).
  • the nozzle was 1 mm in diameter and 1 mm in thickness.
  • Evaluation test 3-1 Powder Fallability
  • the prepregs of Examples and Comparative Examples produced in the above 2 were cut into a size of 11 ⁇ 10 cm (length ⁇ width), and a test was performed using them as test pieces. First, deposits such as powder and dust were removed from the ten test pieces using a handy mop. Next, the weight of ten test pieces was measured. Subsequently, 10 cuts each having a length of 10 cm were cut into each of the 10 test pieces at regular intervals using a cutter knife (available from NTT Corporation, A-type cutter replacement blade), and the 10 cut test pieces were cut. Deposits such as powder and dust were removed from the pieces. Then, the weight of the ten test pieces with the cuts was measured.
  • the value obtained by subtracting the weight of the ten test pieces after making the cut from the weight of the ten test pieces before making the cut was defined as the amount of powder falling off.
  • the percentage of the amount of powder falling with respect to the weight of the ten test pieces before making the cut was defined as the powder falling property.

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  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

Cette composition de résine contient : une résine époxy ; un agent de durcissement ; une résine phénoxy ayant un poids moléculaire moyen en poids compris dans une plage de 30000 à 100000 ; un conditionneur de surface ; et un agent antimousse. Le conditionneur de surface contient un polydiméthylsiloxane modifié par polyéther. L'agent antimousse contient un copolymère acrylique.
PCT/JP2019/026872 2018-09-27 2019-07-05 Composition de résine, préimprégné, film pourvu de résine, feuille métallique pourvue de résine, carte stratifiée plaquée de métal et carte de circuit imprimé Ceased WO2020066210A1 (fr)

Priority Applications (2)

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CN201980061967.1A CN112739771B (zh) 2018-09-27 2019-07-05 树脂组合物、预浸料、带树脂的膜、带树脂的金属箔、覆金属层叠板及印刷布线板
KR1020217007648A KR20210062632A (ko) 2018-09-27 2019-07-05 수지 조성물, 프리프레그, 수지 부착 필름, 수지 부착 금속박, 금속 클래드 적층판, 및 프린트 배선판

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JP2018-182929 2018-09-27

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TW202012534A (zh) 2020-04-01
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CN112739771B (zh) 2023-06-27
TWI822812B (zh) 2023-11-21
CN112739771A (zh) 2021-04-30

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