WO2020060933A1

WO2020060933A1 - Electronic device with housing having stiffener

Info

Publication number: WO2020060933A1
Application number: PCT/US2019/051329
Authority: WO
Inventors: Valentin DE LA FUENTE
Original assignee: Google LLC
Current assignee: Google LLC
Priority date: 2018-09-20
Filing date: 2019-09-16
Publication date: 2020-03-26
Anticipated expiration: 2021-03-20

Abstract

An electronic device includes: a housing formed substantially from a first material; a stiffener mounted to the housing, the stiffener formed substantially from a second material different from the first material; and an electronic component mounted to the stiffener, the stiffener forming a ground path between the electronic component and the housing.

Description

ELECTRONIC DEVICE WITH HOUSING HAVING

STIFFENER

CROSS-REFERENCE TO RELATED APPLICATION

[0001] This application is a continuation of, and claims priority to, U.S. Provisional Patent Application No. 62/734,105, filed on September 20, 2018, and entitled

“ELECTRONIC DEVICE WITH HOUSING HAVING STIFFENER,” the disclosure of which is incorporated by reference herein in its entirety.

TECHNICAL FIELD

[0002] This document relates, generally, to an electronic device with a housing having a stiffener.

BACKGROUND

[0003] Electronic devices such as smartphones and tablets are sometimes designed so that an enclosure is formed by a housing and a display of the electronic device joined to each other. The housing provides a degree of protection for the electronics of the device contained within the enclosure. The development of new device designs can place additional demands on the enclosure in this or other regards.

SUMMARY

[0004] In a first aspect, an electronic device includes: a housing formed substantially from a first material; a stiffener mounted to the housing, the stiffener formed substantially from a second material different from the first material; and an electronic component mounted to the stiffener, the stiffener forming a ground path between the electronic component and the housing.

[0005] Implementations can include any or all of the following features. The electronic device has substantially a rectangular shape and wherein the stiffener is positioned parallel to a short side of the rectangular shape. The electronic device includes multiple stiffeners mounted to the housing. The multiple stiffeners are evenly spaced from each other. The multiple stiffeners are aligned parallel to each other. The stiffener has substantially a rectangular shape that faces the housing. The rectangular shape has at least an 8: 1 aspect ratio. The stiffener extends for at least 75% of a width of the housing at a location of the stiffener. The housing and a display mounted to the housing form an enclosure of the electronic device, and wherein the stiffener is positioned inside the enclosure and parallel to the display. The first material comprises aluminum. The second material comprises metal. The electronic device further comprises an insulating coating on a surface of the housing, wherein the insulating coating is not present at an interface between the of the stiffener and the housing. The electronic device further comprises an adhesive layer that couples the stiffener and the housing to each other, the adhesive layer comprising a structural adhesive in contact with the housing and the stiffener, the adhesive layer further comprising a conductive adhesive in contact with the housing and the stiffener.

[0006] In a second aspect, a system includes: an electronic device comprising a housing, a stiffener mounted to the housing, and an electronic component mounted to the stiffener; and a stand for the electronic device, the stand comprising an element coupled to a first member, wherein first magnetic attraction between the element and the stiffener facilitates selective placement of the first member in at least a first or second orientation relative to the stiffener, the first or second orientation corresponding to a first or second inclination of the electronic device, respectively.

[0007] Implementations can include any or all of the following features. The electronic device is the device of claim 1. The electronic device is in a landscape orientation when subjected to each of the first and second inclinations, and wherein the stiffener extends between a top edge and a bottom edge of the electronic device in the landscape orientation. The element comprises a magnet and the stiffener is formed substantially from a

ferromagnetic material, the system further comprising a first detent magnet mounted to the housing adjacent the stiffener such that second magnetic attraction between the first detent magnet and the element is provided. The system further comprises a second detent magnet mounted to the housing adjacent the stiffener, the first and second detent magnets forming respective endpoints for the selective placement of the first member relative to the stiffener. The stand comprises a keyboard folio including a keyboard for the electronic device, the keyboard folio including a second member connected to the keyboard, the first member and the second member coupled by a first hinge, the first member and the element coupled by a second hinge, wherein the first and second hinges facilitate the selective placement of the first member in at least the first or second orientation relative to the stiffener.

[0008] In a third aspect, a method includes: removing an anodic layer from at least an area of a housing for an electronic device, the housing formed substantially from a first material; mounting a stiffener at the area of the housing, the stiffener formed substantially from a second material different from the first material; and mounting an electronic component to the stiffener, the stiffener forming a ground path between the electronic component and the housing.

[0009] Implementations can include any or all of the following features. The method is applied to manufacture the electronic device of claim 1. Mounting the stiffener further comprises applying an adhesive layer that couples the stiffener and the housing to each other, the adhesive layer comprising a structural adhesive in contact with the housing and the stiffener, the adhesive layer further comprising a conductive adhesive in contact with the area of the housing and the stiffener. Mounting the electronic component further comprises applying a conductive adhesive layer that couples the electronic component and the stiffener to each other.

BRIEF DESCRIPTION OF DRAWINGS

[0010] FIG. 1 shows an exploded view of an example of an electronic device.

[0011] FIG. 2 shows an example of the electronic device of FIG. 1 in a partially assembled state.

[0012] FIG. 3 shows an example cross-section of an electronic device.

[0013] FIG. 4 shows an exploded view of an example of a stiffener stack.

[0014] FIG. 5 schematically shows an example cross-section of a housing stack including a stiffener.

[0015] FIGS. 6A-B show a side view of an example of a system including an electronic device and a stand for the electronic device.

[0016] FIG. 7 shows an example of a method that can be used in assembling an electronic device.

[0017] FIG. 8 shows an example of a computer device and a mobile computer device that can be used to implement the techniques described here.

[0018] Like reference symbols in the various drawings indicate like elements.

DETAILED DESCRIPTION

[0019] This document describes examples of electronic devices having one or more stiffeners included of a different material than the housing. Currently, device manufacturers may be introducing new designs of electronic devices such as smartphones and tablets that seek to achieve thinness, larger size and constrained weight more than has been done in some earlier products. For example, one approach may be to make the device thinner while maintaining current screen dimensions or even adding a larger screen. Sometimes an effort is also made to simultaneously include more features in the device, which can create the need to fit more components within the device enclosure.

[0020] These and other developments can create new challenges in device design.

The structural design should ensure product quality and robustness so as to protect the device against damage. Also, customer experience usually improves when the device exhibits a certain stiffness because it is associated with the premium feel that the customer may have come to expect.

[0021] In some implementations, an electronic device has a housing made from aluminum which can provide a weight reduction. The electronic device can also be provided with one or more stainless steel stiffeners for the aluminum housing. Such stiffener(s) can provide multiple distinct advantages in the device design, for example as will be described below.

[0022] FIG. 1 shows an exploded view of an example of an electronic device 100.

The electronic device 100 can be used with one or more other examples described herein.

The electronic device 100 is here shown in an incomplete state for illustrative purposes. For example, the electronic device 100 when completely assembled can operate in accordance with one or more of the examples described with reference to FIG. 8.

[0023] The electronic device 100 here includes a housing 102. The housing 102 here includes a wall 104 that is framed by respective sides 106 (e.g., on the longer sides of the wall 104) and sides 108 (e.g., on the shorter sides of the wall 104). In some implementations, the housing 102 can together with a touchscreen or other display (not shown) form an enclosure that is to contain the components of the electronic device 100. In such examples, the wall 104 can be considered a rear wall of the electronic device 100 depending on how the user is positioning the electronic device 100.

[0024] The electronic device 100 can be made of any suitable material. In some implementations, the housing 102 can be formed substantially from a light metal material.

For example, the housing 102 can be formed substantially from aluminum (e.g., an alloy predominantly based on aluminum). The housing 102 can be formed using any suitable technique, including, but not limited to, casting, machining and/or forging.

[0025] The electronic device 100 can include one or multiple stiffeners. Here, stiffeners 110, 112 and 114 are shown before being mounted to the housing 102. The stiffeners 110 and 114 are to be positioned near the respective sides 108 and the stiffener 112 is to be placed substantially in the center of the device. The stiffeners 110, 112 and 114 can have the same or different orientations. Here, the stiffeners 110, 112 and 114 are aligned parallel to each other. For example, the stiffeners 110, 112 and 114 are here within the same plane and aligned with each other. As another example, the stiffeners 110, 112 and 114 are here aligned parallel to each other based on alignment of respective longitudinal lines that extend through each of the stiffeners 110, 112 and 114. The stiffeners 110, 112 and 114 can be provided at the housing 102 (e.g., by being mounted to the wall 104) so as to increase stiffness and robustness of the electronic device 100.

[0026] The stiffeners 110, 112 and 114 can be made of any suitable material. In some implementations, the stiffeners 110, 112 and/or 114 can be formed substantially from a stiff metal material. For example, the stiffeners 110, 112 and/or 114 can be formed substantially from stainless steel. The stiffeners 110, 112 and 114 can be formed using any suitable technique, including, but not limited to, casting, machining and/or forging.

[0027] The electronic device 100 can include one or more electronic components. Here, a circuit board 116 and a circuit board 118 are shown, each of which includes at least one electronic component. The circuit boards 116 and 118 are to be mounted to one or more of the stiffeners 110, 112 and 114. For example, the circuit board 116 can be configured to be mounted to the stiffener 110. As another example, the circuit board 118 can be configured to be mounted to the stiffener 114.

[0028] FIG. 2 shows an example of the electronic device 100 of FIG. 1 in a partially assembled state. The electronic device 100 as assembled in the present illustration can be used with one or more other examples described herein. Here, the stiffeners 110, 112 and 114 have been mounted to the wall 104 of the housing 102. The stiffeners 110 and 114 are obscured by the circuit boards 116 and 118, respectively, and are indicated by dashed reference lines. The stiffener 112, on the other hand, is not presently covered by any circuit board or other electronic component.

[0029] The electronic device 100 here has substantially a rectangular shape, and the current orientation can be characterized as a landscape orientation of the electronic device 100. For example, when a user views the electronic device 100 in the orientation shown in the present illustration, the user might refer to an edge 106A as a top edge, and an edge 106B, opposite the edge 106 A, as a bottom edge. As another example, when a user views the electronic device 100 in the orientation shown in the present illustration, the user might refer to an edge 108A as a left edge, and an edge 108B, opposite the edge 108A, as a right edge.

In some implementations, the stiffeners 110, 112 and/or 114 can extend between the edges 106A-B that are the top and bottom edges, respectively, in the landscape orientation of the electronic device 100 in the present illustration. In some implementations, the stiffeners 110, 112 and/or 114 can be parallel to the edges 108A-B that are the left and right edges, respectively, in the landscape orientation of the electronic device 100 in the present illustration. As another example, each of the sides 108A-B can be characterized as a short side in the rectangular shape of the electronic device 100. The stiffener 110, 112 and/or 114 can then be positioned parallel to the short side of the rectangular shape.

[0030] Approaches described herein can provide advantages relevant to electronic devices. In some implementations, the stiffeners 110, 112 and/or 114 can include a material that is multiple times as stiff as the material of the housing 102 and/or that has significantly higher yield strength. Stiffness can be quantified based on a force applied to the stiffener and the displacement produced by the force. For example, for a given force, the displacement of the stiffeners 110, 112 and/or 114 can be multiple times less than the displacement of the material of the housing 102 under the same force. As another example, the stiffeners 110,

112 and/or 114 can be subject to a force multiple times greater than a force applied to the material of the housing 102 while the displacement of the stiffeners 110, 112 and/or 114 can be substantially the same as the displacement of the material of the housing 102. The stiffeners 110, 112 and/or 114 can be made from a metal, including, but not limited to, stainless steel. For example, the housing 102 can be made of a lighter metal, including, but not limited to, an aluminum alloy. This can help provide a "premium feel stiffness" in the electronic device 100, which can enhance a customer's experience in using the product. For example, approaches described herein can achieve substantial product stiffness and robustness against drop impacts, as compared with, say, a housing that uses merely aluminum for the housing. Also, approaches described herein can provide a significantly lighter device than, say, one whose housing is made entirely from steel. As another example, the stiffener 110, 112 and/or 114 can provide a ground path between the circuit board 116 and/or 118 and the housing 102. In some implementations, the housing 102 may generally be covered by one or more types of oxide that prevent, reduce or complicate conduction into the housing, and the stiffener 110, 112 and/or 114 can be placed in an area free of such coating and can therefore improve the electrical contact and prevent formation of new coatings in that area, for example as will be described below.

[0031] The electronic device 100 is an example of an electronic device that includes a housing (e.g., the housing 102) formed substantially from a first material (e.g., an aluminum alloy). The electronic device includes a stiffener (e.g., the stiffener 110, 112 and/or 114) mounted to the housing, the stiffener formed substantially from a second material (e.g., stainless steel) different from the first material. The electronic device includes an electronic component (e.g., the circuit board 116 and/or 118) mounted to the stiffener, the stiffener forming a ground path between the electronic component and the housing.

[0032] The stiffeners 110, 112 and/or 114 can be positioned with any of multiple types of spacing relating to another of the stiffeners 110, 112 and/or 114. For example, the stiffeners 110, 112 and 114 are here evenly spaced from each other in that the distance between the stiffeners 110 and 112 is approximately the same as the distance between the stiffeners 112 and 114. Here, the stiffeners 110, 112 and 114 are parallel to each other.

[0033] The stiffeners 110, 112 and/or 114 can have any suitable shape. Here, the stiffener 112 has substantially a rectangular shape that is defined by respective sides 112A-D of the stiffener 112. The rectangular shape formed by the sides 112A-D here faces the housing 102. For example, the rectangular shape of the stiffener 112 abuts the wall 104 of the housing 102. The stiffeners 110 and 114, moreover, here also have substantially a rectangular shape while they may conform to certain form aspects of the circuit boards 116 and 118, respectively. The stiffeners 110, 112 and/or 114 can have any proportions between, say, their length and width. In some implementations, the stiffeners 110, 112 and/or 114 have a length (e.g., as measured in the direction from the edge 106A to the edge 106B) that is at least eight times its width (e.g., as measured in the direction from the edge 108A to the edge 108B). For example, the stiffeners 110, 112 and/or 114 can have an aspect ratio (e.g., the proportion between length and width) that is at least 8: 1. As another example, the stiffeners 110, 112 and/or 114 can extend across some or substantially all of the width of the electronic device 100 in some direction. Here, the stiffeners 110 and 114 extend over more than half of the width from the edge 106A to the edge 106B. For example, the stiffeners 110 and/or 114 can extend for at least 75% of the width of the housing 102 at a location of the stiffener, the direction of the width in this example indicated by the position of the stiffeners 110 and 114 in FIG. 2.

[0034] The stiffeners 110, 112 and/or 114 can be used in positioning or orienting the electronic device 100, for example in combination with a stand, as is exemplified below. For these or other purposes, one or more magnets can be provided with the electronic device 100. Here, detent magnets 120 and 122 are positioned adjacent the stiffener 114, and detent magnets 124 and 126 are positioned adjacent the stiffener 110. The detent magnets 120, 122, 124 and/or 126 can include any type of magnets. For example, the detent magnets 120-126 are permanent magnets. The detent magnets 120-126 will be exemplified below.

[0035] FIG. 3 shows an example cross-section of an electronic device 300. The electronic device 300 can be used with one or more other examples described herein. Elements that correspond to features described in other examples can serve the same or a similar purpose in the electronic device 300. Only a portion of the electronic device 300 is shown here for simplicity.

[0036] The electronic device 300 includes an enclosure 302 that may present the exterior surface(s) of the electronic device 300 that are visible and touchable by the user. In some implementations, the enclosure 302 is formed by a housing 304 (e.g., compare with the housing 102 in FIG. 1) and a display 306 mounted to the housing 304. In some

implementations, the display 306 can include a display device covered by a coverglass. For example, the display 306 can provide touchscreen functionality for the electronic device 300.

[0037] The electronic device 300 here includes a circuit board 308. For example, the circuit board includes one or more electronic components for the electronic device 300. The electronic device 300 includes a stiffener 310. The stiffener 310 is positioned adjacent a wall 312 of the housing 304. The stiffener 310 can be positioned in the electronic device 300 so as to be inside the enclosure 302 and parallel to the display 306. For example, a longitudinal line through the stiffener 310 can he in a plane that is parallel to a main surface of the display 306 (e.g., the main surface where content is presented on the display 306).

[0038] A conductive layer 314 can be positioned between the circuit board 308 and the stiffener 310. In some implementations, the conductive layer 314 includes an adhesive layer of a conductive material. For example, the conductive layer 314 can include a conductive adhesive, including, but not limited to a conductive pressure-sensitive adhesive (PSA). A conductive layer 316 can be positioned between the stiffener 310 and the wall 312. In some implementations, the conductive layer 316 includes an adhesive layer of a conductive material. For example, the conductive layer 316 can include a conductive adhesive, including, but not limited to a conductive PSA. The stiffener 310 and the conductive layers 314 and 316 can provide a ground path between the circuit board 308 and the housing 304.

[0039] FIG. 4 shows an exploded view of an example of a stiffener stack 400. The stiffener stack 400 can be used with one or more other examples described herein. The stiffener stack 400 includes a stiffener 402. For example, the stiffener 402 can be substantially planar and be made from a metal such as stainless steel. The stiffener stack 400 includes a conductive layer 404. In some implementations, the conductive layer 404 can be placed on a main surface 402A of the stiffener 402. For example, the conductive layer 404 can include a conductive adhesive, including, but not limited to, a conductive PSA. The conductive layer 404 can have one or more cutouts and/or openings. Here, an opening 406 is provided in the conductive layer 404.

[0040] The stiffener stack 400 includes a structural layer 408. In some

implementations, the structural layer 408 can ensure better bonding (than, say, the conductive layer 404) to another surface such as that of a housing in an electronic device. For example, the structural layer 408 can include a structural adhesive, including, but not limited to, a structural PSA. The structural layer 408 can bond better to, say a surface of an aluminum alloy than does the conductive layer 404. The structural layer 408 can have a shape that can be accommodated within the opening 406 of the conductive layer 404. For example, this can allow the structural layer 408 to be placed within the opening 406 such that the conductive layer 404 and the structural layer 408 will both be in contact with the stiffener 402 and the surface that the stiffener stack 400 is being mounted to (e.g., a wall of the housing of an electronic device).

[0041] FIG. 5 schematically shows an example cross-section of a housing stack 500 including a stiffener 502. The housing stack 500 can be used with one or more other examples described herein. The housing stack 500 here includes a housing 504 that can extend in either or both directions from the housing stack 500 and is here truncated for simplicity. The housing can be made from a relatively light metal material, including, but not limited to, an alloy such as an aluminum alloy. For example, the housing 504 can be a wall of the enclosure of an electronic device.

[0042] The housing 504 can have one or more coatings or other layers. Here, a layer 506 and a layer 508 are provided on surfaces 504A and 504B, respectively, that are opposite each other at the housing 504. In some implementations, the layers 506 and/or 508 can result from a process performed on the material of the housing 504. For example, an anodization process can be performed on the housing 504 and the layers 506 and/or 508 can then be an anodic layer that covers the external surface of the material of the housing 504, here the surfaces 504A-B, respectively.

[0043] The layers 506 and/or 508 can reduce or eliminate electric conductivity through the surfaces 504A-B, respectively. The layers 506 and/or 508 can therefore be considered an insulating coating. To provide, say a ground path to or from the housing 504, an opening 510 can be formed in one or more of them, here shown in the layer 506. The opening 510 can be formed before the stiffener 502 or any other aspect of the housing stack 500 is positioned on the housing 504. Any process suitable for removing an insulating coating and/or an anodic layer can be used. For example, a laser etching process can be performed to generate the opening 510 in the layer 506. The removal of the material for creating the opening 510 can define an area 512 on the surface 504A of the housing 504.

[0044] Here, the housing stack 500 includes a conductive layer 514 placed against the surface 504 A. The conductive layer 514 can be placed within the opening 510 in the layer 506. In some implementations, the conductive layer 514 includes a conductive adhesive layer. For example, the conductive layer 514 includes a conductive PSA. In some implementations, a structural layer can also be provided at the surface 504A (e.g., compare with the conductive layer 404 and structural layer 408 in FIG. 4).

[0045] The stiffener 502 can be placed adjacent the conductive layer 514. For example, the stiffener 502 can be directly coupled to the conductive layer 514. As another example, the conductive layer 514 can be disposed between the surface 504A and the stiffener 502. A conductive layer 516 can be placed adjacent the stiffener 502 at a surface that is opposite the surface where the conductive layer 514 is positioned. For example, the conductive layer 516 can be directly coupled to the stiffener 502. In some implementations, the stiffener 502 can be disposed between the conductive layer 516 and the conductive layer 514. In some implementations, the conductive layer 516 includes a conductive adhesive layer. For example, the conductive layer 516 includes a conductive PSA.

[0046] An electronic component 518 can be placed adjacent the conductive layer 516. For example, the electronic component 518 can be directly coupled to the conductive layer 516. As another example, the conductive layer 516 can be disposed between the electronic component 518 and the stiffener 502. In some implementations, the electronic component can be in form of a circuit board having one or more discrete components installed.

[0047] The housing stack 500 can serve to provide a ground path for the electronic component 518. In some implementations, one or more electrodes of the electronic component 518 can be exposed to, and in contact with, the conductive layer 516. The conductive layer 516, moreover, is in electrical contact with the stiffener 502 which can be formed from a conductive material (e.g., metal). The stiffener 502 is also in electrical contact with the conductive layer 514, which in turn is in electrical contact with the surface 504A of the housing 504. As such, a ground path can be formed between the electronic component 518 and the housing 504.

[0048] Particularly, the removal of material to form the opening 510 in the layer 506 can facilitate that the layer 506 (which may be an insulating layer and/or an anodic layer) does not prevent electrical conduction in the area 512 of the housing 504. As such, the path between the electronic component 518 and the housing 504 is not electrically interrupted (e.g., insulated) by the layer 506 but rather the path can serve as a ground path for the electronic component 518. Moreover, the part of the housing stack 500 that covers the area 512 can prevent oxidation of the material in the housing 504 that may otherwise occur and degrade electrical conductivity. Here, oxide 520 is illustrated as having formed on the surface 504A as exposed by the opening 510, except in the area 512 covered by the conductive layer 514. As such, either or both of the layer 506 and the oxide 520 can be considered an insulating coating of the housing 504. Moreover, such insulating coating (e.g., the layer 506 and/or the oxide 520) is not present at an interface between the housing 504 and the stiffener 502 (e,g., in the area 512.)

[0049] FIGS. 6A-B show a side view of an example of a system 600 including an electronic device 602 and a stand 604 for the electronic device 602. The system 600 can be used with one or more other examples described herein. In the present example, the electronic device 602 is placed in a landscape orientation using the stand 604. For example, a housing 606 of the electronic device 602 can have edges 106 A' and 106B' (e.g., compare with edges 106A and 106B, respectively, in FIG. 2).

[0050] The stand 604 can be a keyboard folio for the electronic device 602. In some implementations, the stand 604 can include a keyboard 608 that can be supported by the same underlying surface (e.g., a desk or other tabletop) as the rest of the stand 604. For example, the keyboard 608 can have a wired and/or wireless connection to the electronic device 602.

[0051] The stand 604 can include a member 610 configured to rest against the underlying surface. The member 610 can be coupled to the keyboard 608. For example, a hinge 612 can couple the member 610 and the keyboard 608 to each other. The member 610 can be made from any suitable material. In some implementations, the member 610 is formed from a fabric of sufficient stiffness to support the electronic device 602.

[0052] The stand 604 can include a member 614 configured to extend away from the underlying surface. The member 614 can be coupled to the member 610. In some implementations, a hinge 616 can couple the member 614 and the member 610 to each other. For example, the hinge 616 can be a living hinge. The member 614 can be made from any suitable material. In some implementations, the member 614 is formed from a fabric of sufficient stiffness to support the electronic device 602.

[0053] The stand 604 can include an element 618 configured to abut the housing 606 of the electronic device 602. The element 618 is coupled to the member 614. In some implementations, a hinge 620 can couple the element 618 and the member 614 to each other. For example, the hinge 620 can be a living hinge. The element 618 can be configured so that magnetic attraction is provided between the element 618 and a stiffener (e.g., the stiffener 110, 112 and/or 114 in FIG. 2) of the electronic device 602. The element 618 can include a magnet and the stiffener can include a ferromagnetic material, or vice versa, to name just two examples.

[0054] The position of the element 618 on the housing 606 can be adjusted to multiple positions along the length of the stiffener inside the housing 606. Different positions of the element 618 correspond to different orientations of the member 614 relative to the stiffener inside the housing 606. Such different orientations of the member 614, moreover, correspond to different inclinations of the electronic device 602, for example as will now be described.

[0055] FIG. 6 A shows the element 618 having a position along the length of the stiffener inside the housing 606 (e.g., compare with the stiffener 114 in FIG. 2) that corresponds to the member 614 forming an angle 622 with respect to the member 610 and/or with respect to the underlying surface of the stand 604. This orientation of the member 614 corresponds to an inclination of the electronic device 602 by an angle 624 with respect to the member 610 and/or with respect to the underlying surface of the stand 604. The inclination of the electronic device 602 in FIG. 6A can be considered a relatively less upright position than in FIG. 6B, to name just one example.

[0056] FIG. 6B shows the element 618 having a position along the length of the stiffener inside the housing 606 (e.g., compare with the stiffener 114 in FIG. 2) that corresponds to the member 614 forming an angle 626 with respect to the member 610 and/or with respect to the underlying surface of the stand 604. This orientation of the member 614 corresponds to an inclination of the electronic device 602 by an angle 628 with respect to the member 610 and/or with respect to the underlying surface of the stand 604. The inclination of the electronic device 602 in FIG. 6B can be considered a relatively less upright position than in FIG. 6A, to name just one example.

[0057] Due to the magnetic attraction between the element 618 and the stiffener inside the housing 606 the element 618 can be placed in any of virtually an infinite number of positions along the length of the stiffener. This can provide substantial flexibility and ease in adjusting the stand 604 for operating the electronic device 602 in a multitude of inclinations.

[0058] One or more endpoints can be defined for the positioning of the element 618 along the length of the stiffener inside the housing 606. With reference again to FIG. 2, one or more of the detent magnets 120-126 can be provided adjacent the stiffener(s) inside the housing 606. Assume that the stand 604 is used with the electronic device 100 and that there is magnetic attraction between the element 618 and the stiffener 114 inside the housing 102 of the electronic device 100. For example, the element 618 can include a permanent magnet and the stiffener can include a ferromagnetic material such as stainless steel. This can provide a certain amount of magnetic attraction between the element 618 and the stiffener 114. For example, the amount of magnetic attraction between the element 618 and the stiffener 114 can allow the element 618 to be slid along the housing 102 by way of applying a certain force for a continuous adjustment of the inclination of the electronic device 100.

[0059] Magnetic attraction can also be formed between the element 618 and one or more of the detent magnets 120 or 122. The detent magnet 120 or 122 can then be positioned so that its pole facing in the direction of the element 618 is the opposite of the pole of the element 618 that faces toward the detent magnet 120 or 122. For example, the element 618 can have a sufficient width to overlap both the width of the stiffener 114 and the detent magnet 120 or 122. The magnetic attraction between the element 618 and the detent magnet 120 or 122 can be greater than the magnetic attraction between the element 618 and the stiffener 114. For example, if the element 618 slides along the housing 102 by way of the certain force being applied and reaches the detent magnet 120 or 122, the magnetic attraction between the element 618 and the detent magnet 120 or 122 can stop or reduce the sliding motion of the element 618. That is, the detent magnet 120 or 122 can form an endpoint for selective placement of the element 618 along the length of the stiffener 114, which corresponds to an endpoint for selective placement of the member 614 relative to the stiffener 114. Similarly, the detent magnet 124 or 126 can form an endpoint for the selective placement of the member 614 relative to the stiffener 110. As such, the detent magnet 120 or 124, and the detent magnet 122 or 126, can form respective endpoints for the selective placement of the member 614.

[0060] The system 600 is an example of a system that includes an electronic device (e.g., the electronic device 602 or 100) comprising a housing (e.g., the housing 606 or 102), a stiffener (e.g., the stiffener 110 or 114) mounted to the housing, and an electronic component (e.g., the circuit board 116 or 118) mounted to the stiffener. The system includes a stand (e.g., the stand 604) for the electronic device. The stand includes an element (e.g., the element 618) coupled to a first member (e.g., the member 614). First magnetic attraction between the element and the stiffener facilitates selective placement of the first member in at least a first or second orientation (e.g., as shown in FIG. 6A or FIG. 6B, respectively) relative to the stiffener. The first or second orientation corresponds to a first or second inclination of the electronic device, respectively.

[0061] The system 600 is an example of a system where the stand comprises a keyboard folio (e.g., as shown in FIGS. 6A-B) including a keyboard (e.g., the keyboard 608) for the electronic device. The keyboard folio includes a second member (e.g., the member 610) connected to the keyboard. The first member and the second member are coupled by a first hinge (e.g., the hinge 616). The first member and the element are coupled by a second hinge (e.g., the hinge 620). The first and second hinges facilitate the selective placement of the first member in at least the first and second orientation relative to the stiffener.

[0062] FIG. 7 shows an example of a method 700 that can be used in assembling an electronic device. The method 700 can be used with one or more other examples described herein. More or fewer operations than shown in the method 700 can be performed. Two or more of the operations of the method 700 can be performed in a different order unless otherwise indicated.

[0063] At 710, anodization can be removed. This can involve removing from some surface an anodic layer that was formed in an anodization process. In some implementations, the layer 506 (FIG. 5) can be removed at the area 512 to create the opening 510. For example, the anodization can be removed by performing laser etching.

[0064] At 720, an adhesive can be applied. For example, the conductive layer 514 (FIG. 5) can be applied to the stiffener 502. As another example, the conductive layer 514 can be applied to the housing 504 at the area 512. As another example, the conductive layer 404 (FIG. 4) and/or the structural layer 408 can be applied, to the stiffener 402 and/or to the housing 504 at the area 512.

[0065] At 730, a stiffener can be mounted at the area of the housing. For example, the stiffener 502 (FIG. 5) can be mounted at the area 512 of the housing 504.

[0066] At 740, an adhesive can be applied. For example, the conductive layer 314 (FIG. 3) can be applied to the stiffener 310 and/or to the circuit board 308.

[0067] At 750, an electronic component can be mounted to the stiffener, the stiffener forming a ground path between the electronic component and the housing. For example, the circuit board 116 or 118 (FIG. 1) can be mounted to the stiffener 110 or 114, respectively.

As another example, the electronic component 518 (FIG. 5) can be mounted to the stiffener 502.

[0068] A number of approaches are encompassed within the method 700. For example, the electronic component 518 (FIG. 5), the conductive layer 516, the stiffener 502 and the conductive layer 514 can be assembled into a unit that is subsequently mounted at the area 512 of the housing 504 where an anodic layer (e.g., the layer 506) was removed.

[0069] FIG. 8 shows an example of a generic computer device 800 and a generic mobile computer device 850, which may be used with the techniques described here.

Computing device 800 is intended to represent various forms of digital computers, such as laptops, desktops, tablets, workstations, personal digital assistants, televisions, servers, blade servers, mainframes, and other appropriate computing devices. Computing device 850 is intended to represent various forms of mobile devices, such as personal digital assistants, cellular telephones, smart phones, and other similar computing devices. The components shown here, their connections and relationships, and their functions, are meant to be exemplary only, and are not meant to limit implementations of the inventions described and/or claimed in this document.

[0070] Computing device 800 includes a processor 802, memory 804, a storage device 806, a high-speed interface 808 connecting to memory 804 and high-speed expansion ports 810, and a low speed interface 812 connecting to low speed bus 814 and storage device 806. The processor 802 can be a semiconductor-based processor. The memory 804 can be a semiconductor-based memory. Each of the components 802, 804, 806, 808, 810, and 812, are interconnected using various busses, and may be mounted on a common motherboard or in other manners as appropriate. The processor 802 can process instructions for execution within the computing device 800, including instructions stored in the memory 804 or on the storage device 806 to display graphical information for a GUI on an external input/output device, such as display 816 coupled to high speed interface 808. In other implementations, multiple processors and/or multiple buses may be used, as appropriate, along with multiple memories and types of memory. Also, multiple computing devices 800 may be connected, with each device providing portions of the necessary operations (e.g., as a server bank, a group of blade servers, or a multi-processor system).

[0071] The memory 804 stores information within the computing device 800. In one implementation, the memory 804 is a volatile memory unit or units. In another

implementation, the memory 804 is a non-volatile memory unit or units. The memory 804 may also be another form of computer-readable medium, such as a magnetic or optical disk.

[0072] The storage device 806 is capable of providing mass storage for the computing device 800. In one implementation, the storage device 806 may be or contain a computer- readable medium, such as a floppy disk device, a hard disk device, an optical disk device, or a tape device, a flash memory or other similar solid state memory device, or an array of devices, including devices in a storage area network or other configurations. A computer program product can be tangibly embodied in an information carrier. The computer program product may also contain instructions that, when executed, perform one or more methods, such as those described above. The information carrier is a computer- or machine-readable medium, such as the memory 804, the storage device 806, or memory on processor 802.

[0073] The high speed controller 808 manages bandwidth-intensive operations for the computing device 800, while the low speed controller 812 manages lower bandwidth intensive operations. Such allocation of functions is exemplary only. In one implementation, the high-speed controller 808 is coupled to memory 804, display 816 (e.g., through a graphics processor or accelerator), and to high-speed expansion ports 810, which may accept various expansion cards (not shown). In the implementation, low-speed controller 812 is coupled to storage device 806 and low-speed expansion port 814. The low-speed expansion port, which may include various communication ports (e.g., USB, Bluetooth, Ethernet, wireless Ethernet) may be coupled to one or more input/output devices, such as a keyboard, a pointing device, a scanner, or a networking device such as a switch or router, e.g., through a network adapter.

[0074] The computing device 800 may be implemented in a number of different forms, as shown in the figure. For example, it may be implemented as a standard server 820, or multiple times in a group of such servers. It may also be implemented as part of a rack server system 824. In addition, it may be implemented in a personal computer such as a laptop computer 822. Alternatively, components from computing device 800 may be combined with other components in a mobile device (not shown), such as device 850. Each of such devices may contain one or more of computing device 800, 850, and an entire system may be made up of multiple computing devices 800, 850 communicating with each other.

[0075] Computing device 850 includes a processor 852, memory 864, an input/output device such as a display 854, a communication interface 866, and a transceiver 868, among other components. The device 850 may also be provided with a storage device, such as a microdrive or other device, to provide additional storage. Each of the components 850, 852, 864, 854, 866, and 868, are interconnected using various buses, and several of the components may be mounted on a common motherboard or in other manners as appropriate.

[0076] The processor 852 can execute instructions within the computing device 850, including instructions stored in the memory 864. The processor may be implemented as a chipset of chips that include separate and multiple analog and digital processors. The processor may provide, for example, for coordination of the other components of the device 850, such as control of user interfaces, applications run by device 850, and wireless communication by device 850.

[0077] Processor 852 may communicate with a user through control interface 858 and display interface 856 coupled to a display 854. The display 854 may be, for example, a TFT LCD (Thin-Film-Transistor Liquid Crystal Display) or an OLED (Organic Light Emitting Diode) display, or other appropriate display technology. The display interface 856 may comprise appropriate circuitry for driving the display 854 to present graphical and other information to a user. The control interface 858 may receive commands from a user and convert them for submission to the processor 852. In addition, an external interface 862 may be provided in communication with processor 852, so as to enable near area communication of device 850 with other devices. External interface 862 may provide, for example, for wired communication in some implementations, or for wireless communication in other implementations, and multiple interfaces may also be used.

[0078] The memory 864 stores information within the computing device 850. The memory 864 can be implemented as one or more of a computer-readable medium or media, a volatile memory unit or units, or a non-volatile memory unit or units. Expansion memory 874 may also be provided and connected to device 850 through expansion interface 872, which may include, for example, a SIMM (Single In Line Memory Module) card interface. Such expansion memory 874 may provide extra storage space for device 850, or may also store applications or other information for device 850. Specifically, expansion memory 874 may include instructions to carry out or supplement the processes described above, and may include secure information also. Thus, for example, expansion memory 874 may be provided as a security module for device 850, and may be programmed with instructions that permit secure use of device 850. In addition, secure applications may be provided via the SIMM cards, along with additional information, such as placing identifying information on the SIMM card in a non-hackable manner.

[0079] The memory may include, for example, flash memory and/or NVRAM memory, as discussed below. In one implementation, a computer program product is tangibly embodied in an information carrier. The computer program product contains instructions that, when executed, perform one or more methods, such as those described above. The information carrier is a computer- or machine-readable medium, such as the memory 864, expansion memory 874, or memory on processor 852, that may be received, for example, over transceiver 868 or external interface 862.

[0080] Device 850 may communicate wirelessly through communication interface 866, which may include digital signal processing circuitry where necessary. Communication interface 866 may provide for communications under various modes or protocols, such as GSM voice calls, SMS, EMS, or MMS messaging, CDMA, TDMA, PDC, WCDMA, CDMA2000, or GPRS, among others. Such communication may occur, for example, through radio-frequency transceiver 868. In addition, short-range communication may occur, such as using a Bluetooth, WiFi, or other such transceiver (not shown). In addition, GPS (Global Positioning System) receiver module 870 may provide additional navigation- and location- related wireless data to device 850, which may be used as appropriate by applications running on device 850.

[0081] Device 850 may also communicate audibly using audio codec 860, which may receive spoken information from a user and convert it to usable digital information. Audio codec 860 may likewise generate audible sound for a user, such as through a speaker, e.g., in a handset of device 850. Such sound may include sound from voice telephone calls, may include recorded sound (e.g., voice messages, music files, etc.) and may also include sound generated by applications operating on device 850.

[0082] The computing device 850 may be implemented in a number of different forms, as shown in the figure. For example, it may be implemented as a cellular telephone 880. It may also be implemented as part of a smart phone 882, personal digital assistant, or other similar mobile device.

[0083] Various implementations of the systems and techniques described here can be realized in digital electronic circuitry, integrated circuitry, specially designed ASICs

(application specific integrated circuits), computer hardware, firmware, software, and/or combinations thereof. These various implementations can include implementation in one or more computer programs that are executable and/or interpretable on a programmable system including at least one programmable processor, which may be special or general purpose, coupled to receive data and instructions from, and to transmit data and instructions to, a storage system, at least one input device, and at least one output device.

[0084] These computer programs (also known as programs, software, software applications or code) include machine instructions for a programmable processor, and can be implemented in a high-level procedural and/or object-oriented programming language, and/or in assembly/machine language. As used herein, the terms“machine-readable medium” “computer-readable medium” refers to any computer program product, apparatus and/or device (e.g., magnetic discs, optical disks, memory, Programmable Logic Devices (PLDs)) used to provide machine instructions and/or data to a programmable processor, including a machine-readable medium that receives machine instructions as a machine-readable signal. The term“machine-readable signal” refers to any signal used to provide machine instructions and/or data to a programmable processor.

[0085] To provide for interaction with a user, the systems and techniques described here can be implemented on a computer having a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user and a keyboard and a pointing device (e.g., a mouse or a trackball) by which the user can provide input to the computer. Other kinds of devices can be used to provide for interaction with a user as well; for example, feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form, including acoustic, speech, or tactile input.

[0086] The systems and techniques described here can be implemented in a computing system that includes a back end component (e.g., as a data server), or that includes a middleware component (e.g., an application server), or that includes a front end component (e.g., a client computer having a graphical user interface or a Web browser through which a user can interact with an implementation of the systems and techniques described here), or any combination of such back end, middleware, or front end components. The components of the system can be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include a local area network (“LAN”), a wide area network (“WAN”), and the Internet.

[0087] The computing system can include clients and servers. A client and server are generally remote from each other and typically interact through a communication network. The relationship of client and server arises by virtue of computer programs running on the respective computers and having a client-server relationship to each other.

[0088] A number of embodiments have been described. Nevertheless, it will be understood that various modifications may be made without departing from the spirit and scope of the invention.

[0089] In addition, the logic flows depicted in the figures do not require the particular order shown, or sequential order, to achieve desirable results. In addition, other steps may be provided, or steps may be eliminated, from the described flows, and other components may be added to, or removed from, the described systems. Accordingly, other embodiments are within the scope of the following claims.

Claims

WHAT IS CLAIMED IS:

1. An electronic device comprising:

a housing formed substantially from a first material;

a stiffener mounted to the housing, the stiffener formed substantially from a second material different from the first material; and

an electronic component mounted to the stiffener, the stiffener forming a ground path between the electronic component and the housing.

2. The electronic device of claim 1, wherein the electronic device has substantially a rectangular shape and wherein the stiffener is positioned parallel to a short side of the rectangular shape.

3. The electronic device of claim 1 or 2, wherein the electronic device includes multiple stiffeners mounted to the housing.

4. The electronic device of claim 3, wherein the multiple stiffeners are evenly spaced from each other.

5. The electronic device of claim 3 or 4, wherein the multiple stiffeners are aligned parallel to each other.

6. The electronic device of any of the preceding claims, wherein the stiffener has substantially a rectangular shape that faces the housing.

7. The electronic device of claim 6, wherein the rectangular shape has at least an 8: 1 aspect ratio.

8. The electronic device of any of the preceding claims 1, wherein the stiffener extends for at least 75% of a width of the housing at a location of the stiffener.

9. The electronic device of any of the preceding claims 1, wherein the housing and a display mounted to the housing form an enclosure of the electronic device, and wherein the stiffener is positioned inside the enclosure and parallel to the display.

10. The electronic device of any of the preceding claims 1, wherein the first material comprises aluminum.

11. The electronic device of claim 10, wherein the second material comprises metal.

12. The electronic device of claim 11, further comprising an insulating coating on a surface of the housing, wherein the insulating coating is not present at an interface between the of the stiffener and the housing.

13. The electronic device of any of the preceding claims, further comprising an adhesive layer that couples the stiffener and the housing to each other, the adhesive layer comprising a structural adhesive in contact with the housing and the stiffener, the adhesive layer further comprising a conductive adhesive in contact with the housing and the stiffener.

14. A system comprising:

an electronic device comprising a housing, a stiffener mounted to the housing, and an electronic component mounted to the stiffener; and

a stand for the electronic device, the stand comprising an element coupled to a first member, wherein first magnetic attraction between the element and the stiffener facilitates selective placement of the first member in at least a first or second orientation relative to the stiffener, the first or second orientation corresponding to a first or second inclination of the electronic device, respectively.

15. The system of claim 14, wherein the electronic device is in a landscape orientation when subjected to each of the first and second inclinations, and wherein the stiffener extends between a top edge and a bottom edge of the electronic device in the landscape orientation.

16. The system of claim 14 or 15, wherein the element comprises a magnet and the stiffener is formed substantially from a ferromagnetic material, the system further comprising a first detent magnet mounted to the housing adjacent the stiffener such that second magnetic attraction between the first detent magnet and the element is provided.

17. The system of claim 16, further comprising a second detent magnet mounted to the housing adjacent the stiffener, the first and second detent magnets forming respective endpoints for the selective placement of the first member relative to the stiffener.

18. The system of any of claims 14 to 17, wherein the stand comprises a keyboard folio including a keyboard for the electronic device, the keyboard folio including a second member connected to the keyboard, the first member and the second member coupled by a first hinge, the first member and the element coupled by a second hinge, wherein the first and second hinges facilitate the selective placement of the first member in at least the first or second orientation relative to the stiffener.

19. A method comprising:

removing an anodic layer from at least an area of a housing for an electronic device, the housing formed substantially from a first material;

mounting a stiffener at the area of the housing, the stiffener formed substantially from a second material different from the first material; and

mounting an electronic component to the stiffener, the stiffener forming a ground path between the electronic component and the housing.

20. The method of claim 19, wherein mounting the stiffener further comprises applying an adhesive layer that couples the stiffener and the housing to each other, the adhesive layer comprising a structural adhesive in contact with the housing and the stiffener, the adhesive layer further comprising a conductive adhesive in contact with the area of the housing and the stiffener.

21. The method of claim 19 or 20, wherein mounting the electronic component further comprises applying a conductive adhesive layer that couples the electronic component and the stiffener to each other.