WO2019230410A1 - Connection device and method for manufacturing connection device - Google Patents

Abstract

This connection device is used for inspecting a semiconductor element having an electrical signal terminal through which an electrical signal is propagated and having an optical signal terminal through which an optical signal is propagated, and is provided with: optical connectors (100) that are optically connected to the optical signal terminal; and an electrical connector (200) that is electrically connected to the electrical signal terminal.

Description

Connection apparatus and manufacturing method thereof

The present invention relates to a connection device used for inspecting characteristics of an object to be inspected.

Using silicon photonics technology, a semiconductor element (hereinafter referred to as “optical device”) having an electric circuit through which an electric signal propagates and an optical circuit through which an optical signal propagates is formed on a silicon substrate or the like. In order to inspect the characteristics of the optical device in the wafer state, an optical fiber or the like is used as an optical connector for connecting the optical device and the inspection apparatus.

For example, a method of acquiring the characteristics of an optical device to be inspected by bringing the tip of an optical fiber held on the probe body close to each other is disclosed (see Patent Document 1).

US Patent Application Publication No. 2006 / 0008226A1

In the inspection of an optical device, an optical connector that propagates an electrical signal is connected to the optical device, and a connection device that connects the optical connector that propagates an optical signal to the optical device is used to connect the optical device and the inspection apparatus. It is effective. However, development of such a connection device has not progressed.

An object of the present invention is to provide a connection apparatus capable of connecting both an electrical connector for propagating an electrical signal and an optical connector for propagating an optical signal to an optical device, and a method for manufacturing the same.

According to one aspect of the present invention, there is provided a connection device used for inspection of a semiconductor element having an electric signal terminal through which an electric signal propagates and an optical signal terminal through which an optical signal propagates, and is optically connected to the optical signal terminal There is provided a connection device including an optical connector that performs electrical connection and an electrical connector that is electrically connected to an electrical signal terminal.

According to another aspect of the present invention, there is provided a method of manufacturing a connection device used for inspection of a semiconductor device having an electrical signal terminal through which an electrical signal propagates and an optical signal terminal through which an optical signal propagates, the optical signal terminal comprising: With the optical connection end of the optical connector to be optically connected exposed on the main surface of the block, the step of fixing the optical connector to the block, and the main surface of the block being exposed, Attaching the block to the circuit board and referring to the positional information of the optical connection end, the electrical connector is installed on the circuit board so that the electrical connection end of the electrical connector is placed at a predetermined position. There is provided a method for manufacturing a connecting device.

According to the present invention, it is possible to provide a connection apparatus that can connect both an electrical connector that propagates an electrical signal and an optical connector that propagates an optical signal to an optical device, and a method for manufacturing the same.

It is a schematic diagram which shows the structure of the connection apparatus which concerns on embodiment of this invention. It is a typical perspective view which shows the example of the position adjustment mechanism of the connection apparatus which concerns on embodiment of this invention. It is a schematic diagram for demonstrating the manufacturing method of the connection apparatus which concerns on embodiment of this invention (the 1). It is a schematic diagram for demonstrating the manufacturing method of the connection apparatus which concerns on embodiment of this invention (the 2). It is a typical top view showing an example of arrangement of an optical connector and an electrical connector of a connecting device concerning an embodiment of the present invention. It is a typical perspective view showing the example of the structure of the stiffener of the connecting device concerning the embodiment of the present invention. It is a perspective view which shows the structure of the connection apparatus which concerns on embodiment of this invention. It is a typical perspective view showing the example of composition which fixed the block and capillary of the connecting device concerning the embodiment of the present invention. It is a top view which shows the area | region A of FIG. It is a perspective view which shows the shape of the pillar material for fixation of the structural example shown in FIG. It is a top view which shows the shape of the block of the structural example shown in FIG. It is sectional drawing perpendicular | vertical to the thickness direction which shows the shape of the capillary of the structural example shown in FIG.

Next, an embodiment of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, it should be noted that the drawings are schematic, and the thickness ratio of each part is different from the actual one. Moreover, it is a matter of course that portions having different dimensional relationships and ratios are included between the drawings. The following embodiments exemplify apparatuses and methods for embodying the technical idea of the present invention, and the embodiments of the present invention describe the material, shape, structure, arrangement, etc. of components as follows. It is not something specific.

1 is used for inspection of an optical device having an electrical signal terminal through which an electrical signal propagates and an optical signal terminal through which an optical signal propagates. Although it does not specifically limit as an optical device, A silicon photonics chip | tip, VCSEL, etc. can be assumed. 1 includes an optical connector 100 that is optically connected to an optical signal terminal of an optical device, and an electrical connector 200 that is electrically connected to an electrical signal terminal of the optical device. The optical connector 100 and the electrical connector 200 are arranged close to a position corresponding to the distance between the optical signal terminal and the electrical signal terminal of one optical device. When the optical connector 100 is optically connected to the optical signal terminal, an optical signal propagates between the optical signal terminal and the optical connector 100. Usually, the optical signal terminal and the optical connector 100 are optically connected in a non-contact state close to each other. The timing at which the optical connector 100 is connected to the optical signal terminal and the timing at which the electrical connector 200 is connected to the electrical signal terminal may be the same or may cause a time difference. In short, it is only necessary that both the optical connector 100 and the electrical connector 200 can be simultaneously connected to the optical device.

The connection device functions as a probe card that connects the inspection device to the optical device to be inspected. Although not shown, the optical device to be inspected is a connecting device in which the surface on which the optical signal terminal and the electrical signal terminal (hereinafter collectively referred to as “signal terminal”) are formed faces downward in FIG. It is arrange | positioned facing. When measuring the optical device, the optical connection end 101 of the optical connector 100 and the optical signal terminal of the optical device are optically connected, and the electrical connection end 201 of the electrical connector 200 is connected to the electrical signal terminal of the optical device. Connect electrically. Thereby, for example, an electrical signal is input to the optical device from the electrical connection end 201 of the electrical connector 200 and an optical signal output from the optical device is input to the optical connection end 101 of the optical connector 100. The optical signal is detected by a measuring device such as a tester (not shown).

An optical fiber or the like is preferably used for the optical connector 100. For example, an optical signal is incident from an optical signal terminal of an optical device to an end face of an optical fiber disposed in the vicinity of the optical signal terminal. However, not only the optical fiber but also an optical component having an optical waveguide can be used for the optical connector 100. Optical waveguides such as optical fibers are all formed with a refractive index equivalent to that of optical devices. For example, in order to correspond to a silicon photonics device, the optical connector on the probe card side is also formed of a material matching the refractive index of silicon.

For the electrical connector 200, a probe made of a conductive material is preferably used. For example, a cantilever type probe is used for the electrical connector 200. However, the type of probe that can be used for the electrical connector 200 is not limited to the cantilever type, and any type of probe can be used.

As shown in FIG. 1, the connection device includes a block 10 that fixes the optical connector 100 in a state where the optical connection end portion 101 of the optical connector 100 is exposed to the main surface (first main surface), and a block 10. Is provided with a circuit board 20 attached thereto. An electric circuit that is electrically connected to the electric connector 200 is formed on the circuit board 20. A printed circuit board (PCB board) or the like is preferably used for the circuit board 20. The electrical connector 200 is electrically connected to the bonding pad 21 provided on the circuit board 20 and installed on the circuit board 20.

The bonding pad 21 is connected to a connection terminal 23 arranged on the circuit board 20 through an electric circuit (not shown) formed on the circuit board 20. The connection terminal 23 is arranged on the main surface opposite to the main surface on which the electric connector 200 of the circuit board 20 is installed. The connection terminal 23 is electrically connected to the inspection device.

Also, the other end of the optical connector 100 that is optically coupled by the optical connection end 101 and the optical waveguide is connected to the inspection apparatus. The optical connector 100 is connected to the inspection apparatus via components such as an optical connector, for example. At this time, the optical signal may be converted into an electrical signal in accordance with the specification of the inspection apparatus, or the optical signal may be input to the inspection apparatus as it is.

The optical connector 100 and the electrical connector 200 are installed in the connection device with a predetermined positional accuracy so as to be accurately connected to the signal terminal of the optical device to be inspected at the time of inspection. That is, when the relative positional relationship between the optical connection end 101 of the optical connector 100 and the electrical connection end 201 of the electrical connector 200 is within a predetermined range, and the connection device and the optical device are aligned. The optical connector 100 and the electrical connector 200 are accurately connected to the signal terminal of the optical device. Here, “accurately connecting” means that the optical connector 100 and the electrical connector 200 are connected to the signal terminal of the optical device to be inspected so as to obtain a predetermined measurement accuracy.

Regarding the positions of the electrical connector 200 and the optical connector 100, there is an allowable range in the position (hereinafter referred to as “optimum position”) where a predetermined measurement accuracy can be obtained by connecting to the signal terminal of the optical device. The allowable range of the optimum position is a range in which a signal can be acquired with desired accuracy and intensity when the electrical connector 200 and the optical connector 100 are located in the range. This allowable range is appropriately set according to the accuracy required for inspection, the performance of the connector, and the like. For example, when an optical fiber is used for the optical connector 100, the allowable range of the position of the optical connector 100 is set according to the numerical aperture NA of the optical fiber.

The tolerance of the optimum position of the optical connector 100 is narrower than the tolerance of the optimum position of the electrical connector 200. In the manufacture of the connection device shown in FIG. 1, as will be described later, after the optical connector 100 having a small allowable range is aligned, the electrical connector 200 is aligned according to the position of the optical connector 100. I do.

In the connection apparatus shown in FIG. 1, the optical connector 100 is fixed to the block 10 by fitting the capillary 15 that is fixed in a state where the optical connector 100 is passed through the block 10. That is, a through hole is formed in the capillary 15 with a required positional accuracy, and the optical connector 100 inserted into the through hole is fixed. Thereby, the optical connector 100 can be installed in the block 10 with a predetermined positional accuracy.

The number of through holes formed in the capillary 15 is arbitrary. For example, in the case where one optical device has four optical signal terminals, a capillary 15 having four through holes is prepared for each optical device. Alternatively, when one optical device has one optical signal terminal, a capillary 15 in which four through holes are formed for every four optical devices may be prepared.

If the optical connector 100 can be arranged in the block 10 with the required positional accuracy, the capillary 15 need not be used. For example, the block 10 is divided into two parts, and V-shaped grooves for arranging the optical connector 100 are formed on the mating surfaces of the divided parts. The V-shaped groove has an opening on the mating surface, and is formed so that the opening coincides when the divided portions are overlapped. The optical connector 100 can be fixed inside the block 10 by overlapping the two portions in a state where the optical connector 100 is disposed in the V-shaped groove. The V-shaped groove is easier to process than forming a through hole, and the dimensional accuracy can be increased. Note that a V-shaped groove may be formed only in one part of the divided block 10.

The stiffener 30 having higher rigidity than the circuit board 20 is fixed to the circuit board 20. The stiffener 30 secures the mechanical strength of the connecting device so that the circuit board 20 does not bend and is used as a support for fixing each component of the connecting device.

Further, a guide plate 60 through which the optical connector 100 passes is disposed on the first main surface of the block 10. A guide pin 70 fixed to the stiffener 30 is inserted into a through hole provided in the guide plate 60. Thereby, the position of the guide plate 60 is defined. The guide plate 60 has an opening region so that the alignment mark 22 formed on the circuit board 20 can be seen. By disposing the guide plate 60 on the first main surface of the block 10, the position of the alignment mark 22 used when the block 10 is installed on the circuit board 20 can be easily confirmed.

In the connection apparatus shown in FIG. 1, the block 10 is attached to the circuit board 20 so as to be movable along a direction perpendicular to the first main surface (hereinafter referred to as “thickness direction”). That is, the block 10 is not fixed to the circuit board 20. A gap is provided between the guide plate 60 and the circuit board 20. Therefore, the block 10 is movable in the thickness direction with respect to the stiffener 30 and the circuit board 20 fixed to the stiffener 30. Further, by providing a gap between the guide plate 60 and the circuit board 20, it is possible to suppress the influence on the guide plate 60 when the surface of the circuit board 20 is not flat.

1 includes a position adjustment mechanism 40 that adjusts the relative position of the block 10 with respect to the circuit board 20. The position adjusting mechanism 40 includes a plate-like tension spring 41 that pulls the block 10 toward one side in the thickness direction, and a plate-like push spring 42 that pushes the block 10 in a direction opposite to the direction in which the tension spring 41 is pulled. ing. The position of the block 10 in the thickness direction is defined by the balance between the pulling force F1 by the pulling spring 41 and the pressing force F2 of the pressing spring 42. In order to stabilize the block 10 at a predetermined position, elastic forces of the tension spring 41 and the push spring 42 are set in advance.

As shown in FIG. 1, the central portion of the tension spring 41 is fixed to the second major surface of the block 10 that faces the first major surface, and both ends of the tension spring 41 are pressed against the stiffener 30 to make elastic contact. Yes. More specifically, as shown in FIG. 2, the first bolt 51 passes through the central portion of the tension spring 41 and is fixed to the second main surface of the block 10.

On the other hand, as shown in FIG. 2, one end portion of the push spring 42 is fixed to the stiffener 30 by the second bolt 52, and the other end portion is pressed against the second main surface of the block 10 to make elastic contact. ing. The tension spring 41 and the push spring 42 are fixed to the circuit board 20 via the stiffener 30.

For example, the position of the block 10 in the thickness direction can be finely adjusted by screwing the second bolt 52 to the stiffener 30 and adjusting the screw tightening method. Thus, the combination of the tension spring 41 and the push spring 42 functions as a position adjustment mechanism that moves the block 10 relative to the stiffener 30 and the circuit board 20.

Hereinafter, a method for manufacturing the connection device shown in FIG. 1 will be described. Hereinafter, a case where an optical fiber is used for the optical connector 100 and a cantilever probe is used for the electrical connector 200 will be described as an example.

First, an optical fiber whose end is subjected to terminal processing is prepared as an optical connector 100. “Terminal processing” includes lens processing, polishing, stripping processing, and processing for attaching an optical connector to the other end of the optical connection end 101.

Then, as shown in FIG. 3, the optical connector 100 is installed in the block 10 so that the optical connection end portion 101 is exposed on the first main surface of the block 10. For example, the capillary 15 penetrating the optical connector 100 is fixed to the block 10. At this time, the protruding amount of the optical connector 100 was adjusted so that the optical connection end portion 101 was exposed from the first main surface of the block 10 at a predetermined height, and the optical connector 100 was installed at a predetermined position. After confirming this, the capillary 15 is fixed.

Next, the guide plate 60 is attached to the first main surface of the block 10. Then, the block 10 is attached to a predetermined position of the circuit board 20. For example, the block 10 is inserted into a cavity formed at a predetermined position of the circuit board 20. At this time, the block 10 is attached to the circuit board 20 while positioning with the alignment mark 22 formed on the circuit board 20 as a mark. By arranging the guide plate 60 provided with the opening region for exposing the alignment mark 22 in the block 10, it is easy to align the block 10 and the circuit board 20.

Then, the stiffener 30 is fixed to the circuit board 20. At this time, the position of the guide plate 60 is set by the guide pins 70 fixed to the stiffener 30 as shown in FIG.

Next, as shown in FIG. 2, the tension spring 41 and the push spring 42 are attached to the block 10 and the stiffener 30. Then, the positions of the tension spring 41 and the push spring 42 are fixed. At this time, not only adjustment of the position in the thickness direction but also adjustment in a direction parallel to the thickness direction is performed. The reference for position adjustment is the main surface of the circuit board 20.

Next, the electrical connector 200 is installed on the circuit board 20. At this time, the electrical connector 200 is positioned with reference to the position information of the optical connector 100 as described below.

First, the positional information of the optical connector 100 is analyzed, and the amount of deviation of the position of the optical connection end 101 from the preset setting position (hereinafter simply referred to as “deviation amount”) is detected. Then, the optimum position of the electrical connection end 201 of the electrical connector 200 is calculated with reference to the amount of displacement of the position of the optical connection end 101.

For example, a predetermined set coordinate regarding the optical connection end 101 of the optical connector 100 is compared with a coordinate of the optical connection end 101 of the optical connector 100 actually installed in the block 10 to determine the optical connection. A displacement amount of the position of the end portion 101 is detected. Then, the coordinates of the position of the electrical connection end 201 are set so that the amount of displacement of the position from the predetermined set coordinate regarding the electrical connection end 201 is the same as the amount of displacement of the position of the optical connection end 101. decide.

At this time, the position of the electrical connection end 201 of the electrical connector 200 may be determined by statistically processing the amount of deviation. For example, a histogram of variations in the amount of deviation is created, and an average value or variation (deviation) of the amount of deviation is calculated. Then, the position of the electrical connection end 201 of the electrical connector 200 is calculated so as to have a predetermined relative position with respect to the optical connection end 101 of the optical connector 100.

After that, the electrical connector 200 is joined to the joining pad 21 of the circuit board 20 so that the electrical connection end 201 is arranged at the calculated position. Thus, the connection device shown in FIG. 1 is completed.

FIG. 5 shows an example of the positions of the optical connection end 101 of the optical connector 100 and the electrical connection end 201 of the electrical connector 200. In the example shown in FIG. 5, the electrical connection ends 201 of the four electrical connectors 200 are arranged so as to be paired with the optical connection ends 101 of the four optical connectors 100. Thereby, for example, for an optical device having one electrical signal terminal and one optical signal terminal as a pair, four optical devices can be inspected continuously or simultaneously.

Thus, in response to the inspection of a wafer on which a plurality of optical devices are formed, it is possible to provide a connection apparatus having an optical connector 100 and an electrical connector 200 for simultaneously connecting two or more optical devices to signal terminals. it can. Alternatively, an optical device having four optical signal terminals and four electrical signal terminals can be inspected using four optical connectors 100 and four electrical connectors 200. Thereby, since the optical signals of a plurality of optical devices can be collected and measured, the inspection efficiency can be improved and the inspection time can be shortened.

By installing the electrical connector 200 on the circuit board 20 with reference to the positional information of the optical connector 100 as described above, the relative positional relationship between the optical connection end portion 101 and the electrical connection end portion 201 can be determined. It can be within the range of desired position accuracy. Thereby, the optical connector 100 and the electrical connector 200 can be simultaneously connected to the signal terminal of the optical device with high accuracy. As a result, accurate measurement of the optical device is possible.

Note that the bonding pad 21 and the alignment mark 22 are preferably formed simultaneously in the same process step when the circuit board 20 is formed. Thereby, the precision of the relative position of the joining pad 21 and the alignment mark 22 can be made high according to the precision of manufacture of a process process. As a result, when the alignment mark 22 is used for alignment, the bonding pad 21 can be aligned with high accuracy.

In order to obtain the mechanical strength of the connecting device, the stiffener 30 is formed with a certain thickness. On the other hand, when the block 10 is thickened, it becomes difficult to arrange the optical connector 100. For this reason, for example, as shown in FIG. 6, a recess for arranging the block 10 is formed in the stiffener 30. FIG. 6 shows an example in which four openings 300 in which the blocks 10 are respectively arranged are formed in one recess formed in the stiffener 30. FIG. 7 shows an example in which the four blocks 10 each having the guide plate 60 are arranged on the circuit board 20 fixed to the stiffener 30. In FIG. 7, illustration of components such as the optical connector 100, the electrical connector 200, and the connection terminal 23 disposed on the upper surface of the circuit board 20 is omitted.

The size of each recess of the stiffener 30 and the number of blocks 10 disposed therein can be arbitrarily set depending on the mechanical strength required for the stiffener 30 and the size of the block 10. By fixing the plurality of blocks 10 to the stiffener 30, a plurality of optical devices can be inspected simultaneously, or a large area optical device can be inspected.

The capillary 15 is pressed and fixed to the block 10 by a fixing column 16 inserted between the block 10 and the capillary 15 as shown in FIGS. 8 to 9, for example. FIG. 9 is a plan view of region A in FIG. As shown in FIG. 10, the fixing column member 16 has a cylindrical shape, and an insertion hole into which the fixing column member 16 is inserted is formed in the block 10. The insertion hole extends in the thickness direction of the block 10 in parallel with the cavity into which the capillary 15 is fitted. That is, as shown in FIG. 11, an insertion hole 12 extending in parallel with the cavity 11 is formed in the block 10 around the cavity 11 into which the capillary 15 is fitted. The insertion hole 12 is continuously formed along the longitudinal direction of the cavity 11, and the capillary 15 fitted in the cavity 11 and the side surface of the fixing column member 16 fitted in the insertion hole 12 come into contact with each other.

FIG. 12 shows a cross-sectional view perpendicular to the thickness direction of the capillary 15. The capillary 15 has a through-hole 150 through which the optical connection end 101 passes, and a groove 151 that fits with the fixing column 16 is formed in the thickness direction on the side surface. After the capillary 15 is fitted into the cavity 11, the fixing column material 16 is fitted into the fitting hole 12, whereby the capillary 15 is fixed to the block 10. In the above, the example in which the capillary 15 is fixed to the block 10 by the three fixing column members 16 has been shown.

The alignment of the capillary 15 and the block 10 is performed as follows, for example. The capillary 15 and the block 10 are set in a jig designed so that the outer shape of the block 10 and the reference hole 152 formed in the capillary 15 are within a predetermined accuracy. At this time, the reference hole 152 is inserted into the reference pin attached to the jig and the capillary 15 is set. Thereafter, the capillary 15 is rotated and adjusted so that the position of the optical connector 100 and the outer shape of the block 10 fall within the allowable range in design. When the outer shape of the block 10 and the position of the optical connector 100 can be adjusted, the fixing pillar 16 is inserted to fix the capillary 15. Thereafter, the block 10 to which the capillary 15 is fixed is removed from the jig.

(Other embodiments)
As described above, the present invention has been described according to the embodiments. However, it should not be understood that the descriptions and drawings constituting a part of this disclosure limit the present invention. From this disclosure, various alternative embodiments, examples and operational techniques will be apparent to those skilled in the art. That is, it goes without saying that the present invention includes various embodiments not described herein.

Claims (17)

A connection device used for inspection of a semiconductor element having an electric signal terminal through which an electric signal propagates and an optical signal terminal through which an optical signal propagates,
An optical connector optically connected to the optical signal terminal;
A connection device comprising: an electrical connector electrically connected to the electrical signal terminal. The substrate on which a plurality of the semiconductor elements are formed includes the optical connector and the electrical connector that are connected to the electrical signal terminal and the optical signal terminal, respectively, for two or more of the semiconductor elements at the same time. Item 2. The connection device according to Item 1. A block for fixing the optical connector in a state where an optical connection end portion optically connected to the optical signal terminal of the optical connector is exposed on a main surface;
A circuit board in which the block is inserted and an electrical circuit electrically connected to the electrical connector is formed;
The connection device according to claim 1, wherein the electrical connector is installed on the circuit board. Further comprising a capillary for fixing the optical connector in a penetrating state;
The connection device according to claim 3, wherein the capillary is fitted into the block. A fixing column that is inserted into an insertion hole formed by extending in parallel with the cavity around the cavity of the block into which the capillary is fitted, and that the side faces the capillary and presses the capillary against the block to be fixed. The connection device according to claim 4, further comprising a material. The block is attached to the circuit board so as to be movable along a thickness direction perpendicular to the main surface;
The connection device according to claim 3, further comprising a position adjustment mechanism that adjusts a relative position of the block with respect to the circuit board. The position adjusting mechanism is
A plate-like tension spring that pulls the block toward one side in the thickness direction;
A plate-like push spring that pushes the block in a direction opposite to the pulling direction of the pull spring;
The connecting device according to claim 6, wherein a position of the block in the thickness direction is defined by a balance between a pulling force by the pulling spring and a pressing force of the pressing spring. A stiffener that is fixed to the circuit board and is more rigid than the circuit board;
The tension spring fixed to the block elastically contacts the stiffener;
The connection device according to claim 7, wherein the push spring fixed to the stiffener elastically contacts the block. A guide plate disposed on the main surface of the block, through which the optical connector passes,
The connecting device according to claim 8, wherein a guide pin fixed to the stiffener is inserted into a through hole provided in the guide plate. A method for manufacturing a connection device used for inspection of a semiconductor element having an electrical signal terminal through which an electrical signal propagates and an optical signal terminal through which an optical signal propagates,
Fixing the optical connector to the block in a state where the optical connection end of the optical connector optically connected to the optical signal terminal is exposed on the main surface of the block;
Attaching the block to the circuit board so that the main surface of the block is exposed;
Placing the electrical connector on the circuit board so that the electrical connection end of the electrical connector is disposed at a predetermined position with reference to the position information of the optical connection end. A method for manufacturing a connecting device. Installing the electrical connector on the circuit board;
Detecting the amount of deviation from the set position for the position of the optical connection end;
Calculating the position of the electrical connection end with reference to the amount of displacement;
The method of claim 10, further comprising: installing the electrical connector on the circuit board so that the electrical connection end is disposed at a position calculated with reference to the shift amount. The manufacturing method of the connection apparatus of description. 12. The method of manufacturing a connection device according to claim 11, wherein the position of the electrical connection end is calculated by statistically processing the shift amount. 13. The optical connector according to claim 10, wherein the optical connector is fixed to the block by fixing a capillary that fixes the optical connector in a state of penetrating the optical connector. A method for manufacturing a connection device. A fixing pillar is inserted into a fitting hole formed by extending in parallel with the cavity around the cavity of the block into which the capillary is fitted, and a side surface of the fixing pillar is brought into contact with the capillary, thereby the capillary. The method of manufacturing a connection device according to claim 13, wherein the connector is pressed and fixed to the block. The block is attached to the circuit board so as to be movable along a thickness direction perpendicular to the main surface,
15. The manufacturing method of a connection device according to claim 10, further comprising a step of fixing to the circuit board a position adjusting mechanism for adjusting a relative position of the block with respect to the circuit board. Method. The position adjusting mechanism;
A plate-like tension spring that pulls the block toward one side in the thickness direction;
A plate-like push spring that pushes the block in a direction opposite to the pulling direction of the pull spring,
The method of manufacturing a connection device according to claim 15, wherein the position of the block in the thickness direction is defined by a balance between a pulling force by the pulling spring and a pressing force of the pressing spring. A step of fixing a stiffener having a higher rigidity than the circuit board to the circuit board;
The tension spring fixed to the block is brought into elastic contact with the stiffener;
The method of manufacturing a connection device according to claim 16, wherein the push spring fixed to the stiffener is elastically brought into contact with the block.

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