WO2019227768A1 - Camera structure, pan-tilt and unmanned aerial vehicle - Google Patents

Abstract

A camera structure (10), a pan-tilt (100) and an unmanned aerial vehicle (1000). The camera structure (10) is formed with a back surface (112) and a side surface (114). The camera structure (10) comprises a sensor circuit board (12), an inertia measurement circuit board (14), and an inertia measurement unit (15). The inertia measurement unit (15) is provided on the inertia measurement circuit board (14) and is used for obtaining attitude data of a camera. One of the sensor circuit board (12) and the inertia measurement circuit board (14) is provided on the side surface (114), and the other one is provided on the back surface (112). In the camera structure (10), the pan-tilt (100) and the unmanned aerial vehicle (1000), one of the sensor circuit board (12) and the inertia measurement circuit board (14) is provided on the side surface (114), and the other one is provided on the back surface (112), so that the whole volume utilization is higher, thereby greatly saving the installation space.

Description

Camera structure, gimbal and drone Technical field

Embodiments of the present invention relate to the field of photography, and in particular, to a camera structure, a gimbal, and an unmanned aerial vehicle.

Background technique

In addition to the sensor circuit board, the camera of the gimbal also needs an inertial measurement circuit board for setting an inertial measurement unit, where the inertial measurement unit is used to obtain the camera's attitude data. However, the sensor circuit board and the inertial measurement circuit board are generally independently mounted on the camera, and occupy a large space.

Summary of the Invention

Embodiments of the present invention provide a camera structure, a gimbal and a drone.

The camera structure according to the embodiment of the present invention is formed with a connected back and sides, and the camera structure includes:

Sensor circuit board

Inertial measurement circuit board; and

An inertial measurement unit, the inertial measurement unit is disposed on the inertial measurement circuit board and is used to acquire attitude data of the camera;

One of the sensor circuit board and the inertial measurement circuit board is disposed on the side surface, and the other is disposed on the back surface.

In some embodiments, the camera structure further includes:

An image sensor disposed on the sensor circuit board.

In some embodiments, the sensor circuit board and the inertial measurement circuit board are connected to a camera internal component through a flexible circuit board; or

The sensor circuit board and the inertial measurement circuit board are connected to each other through a flexible circuit board.

In some embodiments, the sensor circuit board, the inertial measurement circuit board, and the flexible circuit board are integrated circuit board structures.

In some embodiments, the flexible circuit board is located on the back; or

The flexible circuit board is located on the side; or

The flexible circuit board is located on the back surface and the side surface.

In some embodiments, the back surface is a back surface of the lens, and the side surface is perpendicular to the back surface.

In some embodiments, the inertial measurement circuit board includes a mounting portion and an extension portion, and the extension portion is connected to the mounting portion in one direction.

In some embodiments, the camera structure further includes a vibration reduction element, and when the inertial measurement circuit board is disposed on the side, the vibration reduction element is located between the extension and the side; When the inertial measurement circuit board is disposed on the back surface, the damping element is located between the extension portion and the back surface.

In some embodiments, when the inertial measurement circuit board is disposed on the side surface, a groove corresponding to the extension is formed on the side surface; when the inertial measurement circuit board is disposed on the back surface, A groove corresponding to the extension is formed on the back surface;

The shock absorbing element is filled in the groove.

The pan / tilt according to the embodiment of the present invention includes:

Gimbal body; and

The camera structure according to any one of the above embodiments, the camera structure is disposed on the gimbal body.

In some implementations, the pan / tilt head further includes an electrical adjustment board, and the sensor circuit board and / or the inertial measurement circuit board is connected to the electrical adjustment board.

In some embodiments, the drone is characterized by comprising:

Airframe; and

The pan / tilt head according to any one of the above embodiments, the pan / tilt head is disposed on the fuselage.

In the camera structure, the gimbal and the drone of the embodiment of the present invention, one of the sensor circuit board and the inertial measurement circuit board is disposed on the side, and the other is disposed on the back. The overall volume utilization rate is high, which greatly saves installation space. .

Additional aspects and advantages of the embodiments of the present invention will be partially given in the following description, and part of them will become apparent from the following description, or be learned through practice of the embodiments of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and / or additional aspects and advantages of the embodiments of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, wherein:

1 is a schematic structural diagram of a camera structure according to some embodiments of the present invention;

2 is a partial structural schematic diagram of a camera structure according to some embodiments of the present invention, wherein a circuit board structure of the camera structure is a first perspective;

3 is a partial structural diagram of a camera structure according to some embodiments of the present invention, in which a circuit board structure of the camera structure is a second perspective;

4 is a partial structural diagram of a camera structure according to some embodiments of the present invention;

5 is a schematic structural diagram of a camera structure according to some embodiments of the present invention;

6 is a partial structural diagram of a camera structure according to some embodiments of the present invention;

7 is a schematic structural diagram of an unmanned aerial vehicle according to some embodiments of the present invention;

8 is a schematic structural diagram of a part of a drone according to some embodiments of the present invention;

FIG. 9 is a partial structural schematic diagram of a drone according to some embodiments of the present invention; FIG.

FIG. 10 is a partial structural schematic diagram of a drone according to some embodiments of the present invention; FIG.

Description of main components and symbols:

Camera structure 10, lens 11, back 112, side 114, first side 1141, second side 1142, third side 1143, fourth side 1144, groove 1145, light incident surface 116, sensor circuit board 12, image sensor 13 , Inertial measurement circuit board 14, mounting portion 142, extension 144, first side 1441, second side 1442, third side 1443, fourth side 1444, cutout 1445, inertial measurement unit 15, screw 16, The flexible circuit board 17, the camera internal component 18, the vibration damping component 19, the gimbal body 30, the electric adjustment plate 50, the gimbal 100, the main body 200, the core board 300, and the drone 1000.

Detailed ways

The embodiments of the present invention are described in detail below. Examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals indicate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary, and are only used to explain the embodiments of the present invention, but should not be construed as limiting the embodiments of the present invention.

In the description of the embodiments of the present invention, it should be understood that the terms “center”, “longitudinal”, “transverse”, “length”, “width”, “thickness”, “upper”, “lower”, and “front” , "Back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc. The orientation or position relationship is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the embodiments of the present invention and simplified description. It does not indicate or imply that the device or element referred to must have a specific orientation, a specific orientation The structure and operation cannot be understood as a limitation to the embodiments of the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as “first” and “second” may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present invention, the meaning of “a plurality” is two or more, unless it is specifically and specifically defined otherwise.

In the description of the embodiments of the present invention, it should be noted that, unless otherwise specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it may be a fixed connection or a Removable connection, or integral connection; can be mechanical connection, electrical connection or can communicate with each other; can be directly connected, or indirectly connected through an intermediate medium, can be the internal communication of the two components or the two components Interaction. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present invention may be understood according to specific situations.

The following disclosure provides many different implementations or examples for implementing different structures of the embodiments of the present invention. To simplify the disclosure of the embodiments of the present invention, the components and settings of specific examples are described below. Of course, they are merely examples and are not intended to limit the embodiments of the present invention. In addition, embodiments of the present invention may repeat reference numbers and / or reference letters in different examples, and such repetition is for the purpose of simplicity and clarity, and does not itself indicate the relationship between the various implementations and / or settings discussed. In addition, the embodiments of the present invention provide examples of various specific processes and materials, but those skilled in the art can be aware of the application of other processes and / or the use of other materials.

Referring to FIG. 1, an embodiment of the present invention provides a camera structure 10. The camera structure 10 is formed with a back surface 112 and a side surface 114 connected to each other. The back surface 112 is the back surface 112 of the lens 11 of the camera structure 10. The lens 11 further includes a light incident surface 116. External light is incident from the light incident surface 116 and passes through a lens group (not shown) of the lens 11. The light incident surface 116 and the back surface 112 are located on opposite sides of the lens group.

2 and FIG. 3, the camera structure 10 includes a sensor circuit board 12, an image sensor 13, an inertial measurement circuit board 14, and an inertial measurement unit 15.

The image sensor 13 is provided on a sensor circuit board 12. The image sensor 13 may be a Complementary Metal-Oxide Semiconductor (CMOS) image sensor or a Charge Coupled Device (CCD) image sensor. The image sensor 13 is electrically connected to the sensor circuit board 12 and is used to perform photoelectric conversion on the light incident from the light incident surface 116 to obtain image data. The image data can be transmitted to the outside through the sensor circuit board 12.

The inertial measurement unit 15 is provided on an inertial measurement circuit board 14. The inertial measurement unit 15 may include at least one of a gyroscope, an accelerometer, a magnetometer, and a pressure sensor. The inertial measurement unit 15 is used to acquire the attitude data of the camera, such as Euler angle, quaternion, matrix, axis angle, etc., and output the acquired attitude data through the inertial measurement circuit board 14 to implement attitude control.

One of the sensor circuit board 12 and the inertial measurement circuit board 14 is disposed on the side surface 114 and the other is disposed on the back surface 112. For example, the sensor circuit board 12 is disposed on the side surface 114, and the inertial measurement circuit board 14 is disposed on the back surface 112; Specifically, the sensor circuit board 12 and the inertial measurement circuit board 14 may be fixed to the back surface 112 or the side surface 114 by screws 16 or other methods such as welding, snapping, and bonding. Compared with the sensor circuit board 12 and the inertial measurement circuit board 14 stacked on the back surface 112 of the camera structure 10, or the sensor circuit board 12 and the inertial measurement circuit board 14 stacked on the side surface 114 of the camera structure 10, the present invention In the camera structure 10 of the embodiment, one of the sensor circuit board 12 and the inertial measurement circuit board 14 is disposed on the side 114 and the other is disposed on the back 112, which does not cause the camera body to be too thick, and the overall volume utilization rate is high. The earth saves installation space.

In some embodiments, the side 114 is perpendicular to the back 112. In this way, the sensor circuit board 12 (or the inertial measurement circuit board 14 provided on the back surface 112) and the inertial measurement circuit board 14 (or the sensor circuit board 12 provided on the side 114) are arranged vertically. , Further saving installation space. The side surface 114 may be a ring structure and surround the lens group of the lens 11. Specifically, it may be a substantially circular ring structure (as shown in Figs. 1 and 4, the top and bottom of the circular ring structure are notched) or a square ring structure ( As shown in Figs. 5 and 6, the side surface 114 at this time includes four side surfaces connected end to end).

Please refer to FIG. 1 and FIG. 4 together. In some embodiments, the side surface 114 includes a first side surface 1141, a second side surface 1142, a third side surface 1143, and a fourth side surface 1144 which are sequentially connected. The first side 1141 is opposed to the third side 1143, and the second side 1142 is opposed to the fourth side 1144. The first side surface 1141, the second side surface 1142, the third side surface 1143 and the fourth side surface 1144 are all perpendicular to the back surface 112. When the sensor circuit board 12 is disposed on the side 114, the sensor circuit board 12 may be disposed on the first side 1141, the second side 1142, the third side 1143, or the fourth side 1144; when the inertial measurement circuit board 14 is disposed on the side 114, The inertial measurement circuit board 14 may be disposed on the first side surface 1141, the second side surface 1142, the third side surface 1143, or the fourth side surface 1144.

Of course, in other embodiments, the side surface 114 and the back surface 112 may also be at an acute angle or an obtuse angle. At this time, the lens 11 of the camera has a circular table shape. For example, the angle between the side surface 114 and the back surface 112 is 80 degrees, so that the area of the light incident surface 116 of the lens 11 is smaller than the area of the back surface 112 of the lens 11; The area of the light incident surface 116 is larger than the area of the back surface 112 of the lens 11.

Referring to FIG. 1, in some embodiments, the sensor circuit board 12 and the inertial measurement circuit board 14 may be connected to each other through a flexible circuit board 17. The image data obtained by the image sensor 13 can be transmitted to the inertial measurement circuit board 14 through the sensor circuit board 12 and the flexible circuit board 17, and then the inertial measurement circuit board 14 can transmit the image data and / or attitude data to the inertial measurement circuit via signal transmission lines (such as axes). Other processing modules perform processing; or the attitude data obtained by the inertial measurement unit 15 can be transmitted to the sensor circuit board 12 through the inertial measurement circuit board 14 and the flexible circuit board 17, and the sensor circuit board 12 transmits the image data and / or attitude through the signal transmission line The data is passed to other processing modules for processing. In this way, the sensor circuit board 12 and the inertial measurement circuit board 14 do not need to be provided with signal transmission lines to transmit image data and posture data, respectively, which is beneficial to reducing the volume of the camera structure 10. Of course, it can also be: the image data obtained by the image sensor 13 can be transmitted to the inertial measurement circuit board 14 through the sensor circuit board 12 and the flexible circuit board 17, and then the inertial measurement circuit board 14 transmits the image data and / or attitude through the wireless transmission module The data is transmitted to other processing modules for processing; or the attitude data obtained by the inertial measurement unit 15 can be transmitted to the sensor circuit board 12 through the inertial measurement circuit board 14 and the flexible circuit board 17, and the sensor circuit board 12 transmits the image data through the wireless transmission module And / or posture data is passed to other processing modules for processing. In this way, the sensor circuit board 12 and the inertial measurement circuit board 14 do not need to be respectively provided with a wireless transmission module to transfer image data and attitude data. In addition, the use of the flexible circuit board 17 facilitates the connection between the sensor circuit board 12 on the back 112 and the inertial measurement circuit board 14 on the side 114; The sensor circuit board 12 on the side 114.

Further, in conjunction with FIG. 2 and FIG. 3, the sensor circuit board 12, the inertial measurement circuit board 14, and the flexible circuit board 17 may be an integrated circuit board structure. The circuit board structure may be a rigid-flex board, the sensor circuit board 12 and the inertial measurement circuit board 14 are printed circuit boards (PCBs) in a rigid-flex board, and the flexible circuit board 17 is a rigid-flex board. Flexible circuit board (Flexible Printed Circuit, FPC). The flexible circuit board 17 may be located on the back surface 112, or the flexible circuit board 17 is located on the side surface 114; or the flexible circuit board 17 spans the back surface 112 and the side surface 114.

Of course, in other embodiments, the sensor circuit board 12 and the inertial measurement circuit board 14 may also be connected to the camera internal components 18 (as shown in FIG. 1) through the flexible circuit board 17. The camera internal element 18 may be, for example, a camera internal circuit, a motor, or the like. Specifically, the sensor circuit board 12 is connected to the first camera internal component, the inertial measurement unit 15 is connected to the second camera internal component, and the first camera internal component and the second camera internal component are connected through the flexible circuit board 17.

In the embodiment of the present invention, the sensor circuit board 12 and the inertial measurement circuit board 14 are connected to each other through a flexible circuit board 17, and the sensor circuit board 12 is disposed on the back surface 112 and the inertial measurement circuit board 14 is disposed on the side surface 114 as an example.

Please refer to FIGS. 1 and 2 together. The inertial measurement circuit board 14 includes a mounting portion 142 and an extension portion 144. The mounting portion 142 is connected to the flexible circuit board 17 and fixed to the side 114 by screws 16. The extension portion 144 extends from the mounting portion 142. The extension portion 144 is connected to the mounting portion 142 in one direction, and the other three directions are free ends. Peninsula structure. The inertial measurement unit 15 is located at the extension 144. In this way, the peninsula structure is beneficial to reduce the stress on the inertial measurement unit 15 on the extension 144 caused by the deformation of each circuit board during the installation (for example, when the screw 16 is driven), thereby avoiding the attitude acquired by the inertial measurement unit 15. The data has large errors. Referring to FIG. 2, the extending direction of the mounting portion 142 includes a first direction ①, a second direction ②, a third direction ③, a fourth direction ④, a fifth direction ⑤, a sixth direction ⑥, and a seventh distributed in a counterclockwise direction. Direction ⑦ and eighth direction ⑧. The first direction ① and the fifth direction ⑤ are parallel to the optical axis direction of the lens group, and the third direction ③ and the seventh direction 第七 are perpendicular to the optical axis direction of the lens group. The extension 144 may be in any one of the first direction ①, the second direction ②, the third direction ③, the fourth direction ④, the fifth direction ⑤, the sixth direction ⑥, the seventh direction ⑦, and the eighth direction ⑧. It is connected to the mounting portion 142. Preferably, the extension portion 144 is connected to the mounting portion 142 in the second direction ② or the eighth direction ⑧. The distance between the inertial measurement unit 15 on the extension 144 and the sensor circuit board 12 and the flexible circuit board 17 is relatively long, which is beneficial to further reducing the stress effect on the inertial measurement unit 15 when the circuit board is deformed.

Referring to FIG. 1, in some embodiments, the camera structure 10 further includes a vibration reduction element 19. The size of the shock absorbing element 19 cooperates with the extending portion 144. When the inertial measurement circuit board 14 is disposed on the side surface 114, the shock absorbing element 19 is located between the extension portion 144 and the side surface 114; when the inertial measurement circuit board 14 is disposed on the back surface 112, the shock absorbing element 19 is located between the extension portion 144 and the back surface 112 between. In the embodiment of the present invention, the material of the shock absorbing element 19 is a damping grease, and the shock absorbing element 19 is used to play a role of shock isolation and buffer, so as to reduce the impact of the stress on the inertial measurement unit 15 when the circuit board is deformed. Of course, in other embodiments, the material of the shock absorbing element 19 may also be other shock-absorbing material, which is not limited here.

In some embodiments, when the inertial measurement circuit board 14 is disposed on the side surface 114, the side surface 114 is formed with a groove 1145 corresponding to the extending portion 144 (as shown in FIG. 4); when the inertial measurement circuit board 14 is disposed on the back surface 112 At this time, the back surface 112 is formed with a groove 1145 corresponding to the extending portion 144. The shock absorbing element 19 is filled in the groove 1145. The extension portion 144 is partially received in the groove 1145 through the shock absorbing element 19.

Specifically, the groove 1145 may be formed by recessing the side surface 114 in a direction close to the optical axis of the camera structure 10; or the groove 1145 may be surrounded by a structure protruding from the side surface 114 in a direction away from the optical axis of the camera structure 10; or concave The groove 1145 is formed by recessing the back surface 112 in a direction close to the light incident surface 116; or the groove 1145 is surrounded by a structure protruding from the back surface 112 in a direction away from the light incident surface 116.

With reference to FIG. 2, in some embodiments, the extension portion 144 includes a first side edge 1441, a second side edge 1442, a third side edge 1443, and a fourth side edge 1444 that are connected in order. The three sides 1443 are opposite, the second side 1442 is opposite to the fourth side 1444, the second side 1442 and the third side 1443 are located in the groove 1145, the first side 1441 and the fourth side 1444 and the mounting portion 142 are connected to form cutouts 1445 with the mounting portions 142, respectively, and the cutouts 1445 cooperate with the grooves 1145.

Referring to FIG. 7, an embodiment of the present invention further provides a PTZ 100. The gimbal 100 includes a gimbal body 30 and a camera structure 10 according to any one of the above embodiments. The camera structure 10 is disposed on the gimbal body 30.

Specifically, the head 100 can be a single-axis head, a two-axis head, or a three-axis head. The gimbal 100 can be a handheld gimbal or a mounted gimbal used on a drone 1000. When the camera structure 10 is mounted on the gimbal body 30, the gimbal body 30 can stabilize the camera structure 10 and can change the orientation, angle, etc. of the camera structure 10, so that the camera structure 10 can realize the functions of stable shooting and adjusting the shooting angle.

Please refer to FIG. 8 to FIG. 10. In some embodiments, the pan / tilt head 100 further includes an ESC 50. The sensor circuit board 12 and / or the inertial measurement circuit board 14 are connected to the ESC board 50. The ESC 50 is also connected to the core board 300 of the drone 1000 through a flexible circuit board.

Referring to FIG. 8, when the sensor circuit board 12 is connected to the ESC board 50, the attitude data obtained by the inertial measurement unit 15 can be transmitted to the sensor circuit board 12 through the inertial measurement circuit board 14 and the flexible circuit board 17, and then by the sensor circuit board 12 Pass the posture data and / or image data to the ESC 50 through a signal transmission line or wireless transmission module. The ESC 50 is used to process the posture data and transmit the image data to the core board of the UAV 1000 through a flexible circuit board. 300 for processing.

Please refer to FIG. 9, when the inertial measurement circuit board 14 is connected to the ESC board 50, the image data obtained by the image sensor 13 can be transmitted to the inertial measurement circuit board 14 through the sensor circuit board 12 and the flexible circuit board 17, and then transmitted by the inertial measurement circuit The board 14 transmits the posture data and / or image data to the ESC 50 through a signal transmission line or a wireless transmission module. The ESC 50 is used to process the posture data and transmit the image data to the core of the drone 1000 through a flexible circuit board. The board 300 is processed.

Please refer to FIG. 10, when the sensor circuit board 12 and the inertial measurement circuit board 14 are both connected to the ESC board 50, the image data acquired by the image sensor 13 can be transmitted to the ESC board 50 via a signal transmission line or a wireless transmission module. The inertial measurement unit The acquired attitude data can be transmitted to the ESC 50 through a signal transmission line or a wireless transmission module. The ESC 50 is used to process the attitude data and transmit the image data to the core board 300 of the drone 1000 through a flexible circuit board for processing. .

Referring to FIG. 7, an embodiment of the present invention further provides a drone 1000. The drone 1000 includes a fuselage 200 and a gimbal 100 according to any one of the above embodiments. The gimbal 100 is disposed on the body 200.

In the description of this specification, the description with reference to the terms “one embodiment”, “some embodiments”, “exemplary embodiments”, “examples”, “specific examples” or “some examples” and the like means in combination with the implementation The specific features, structures, materials, or characteristics described in the manners or examples are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms do not necessarily refer to the same implementation or example. Moreover, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Any process or method description in a flowchart or otherwise described herein can be understood as representing a module, fragment, or portion of code that includes one or more executable instructions for implementing a particular logical function or step of a process And, the scope of the preferred embodiments of the present invention includes additional implementations in which the functions may be performed out of the order shown or discussed, including performing the functions in a substantially simultaneous manner or in the reverse order according to the functions involved, which should It is understood by those skilled in the art to which the embodiments of the present invention pertain.

The logic and / or steps represented in the flowchart or otherwise described herein, for example, a sequenced list of executable instructions that can be considered to implement a logical function, can be embodied in any computer-readable medium, For use by instruction execution systems, devices, or devices (such as computer-based systems, systems including processing modules, or other systems that can fetch and execute instructions from instruction execution systems, devices, or devices), or in combination with these instruction execution systems, devices, or devices Or equipment. For the purposes of this specification, a "computer-readable medium" may be any device that can contain, store, communicate, propagate, or transmit a program for use by or in connection with an instruction execution system, apparatus, or device. More specific examples (non-exhaustive list) of computer-readable media include the following: electrical connections (IPM overcurrent protection circuits) with one or more wirings, portable computer disk enclosures (magnetic devices), random access memory ( RAM), read-only memory (ROM), erasable and editable read-only memory (EPROM or flash memory), fiber optic devices, and portable optical disk read-only memory (CDROM). In addition, the computer-readable medium may even be paper or other suitable medium on which the program can be printed, because, for example, by optically scanning the paper or other medium, followed by editing, interpretation, or other suitable Processing to obtain the program electronically and then store it in computer memory.

It should be understood that each part of the embodiments of the present invention may be implemented by hardware, software, firmware, or a combination thereof. In the above embodiments, multiple steps or methods may be implemented by software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, it may be implemented using any one or a combination of the following techniques known in the art: Discrete logic circuits, application specific integrated circuits with suitable combinational logic gate circuits, programmable gate arrays (PGA), field programmable gate arrays (FPGA), etc.

A person of ordinary skill in the art can understand that all or part of the steps carried by the methods in the foregoing embodiments may be implemented by a program instructing related hardware. The program may be stored in a computer-readable storage medium. The program is When executed, one or a combination of the steps of the method embodiment is included.

In addition, each functional unit in each embodiment of the present invention may be integrated into one processing module, or each unit may exist separately physically, or two or more units may be integrated into one module. The above integrated modules can be implemented in the form of hardware or software functional modules. If the integrated module is implemented in the form of a software functional module and sold or used as an independent product, it may also be stored in a computer-readable storage medium.

The aforementioned storage medium may be a read-only memory, a magnetic disk, or an optical disk.

Although the embodiments of the present invention have been shown and described above, it can be understood that the foregoing implementations are exemplary and cannot be understood as limitations on the embodiments of the present invention. Those skilled in the art are within the scope of the embodiments of the present invention. Changes, modifications, substitutions, and variations can be made to the above-described embodiments.

Claims (29)

A camera structure is characterized in that the camera structure is formed with connected back and sides, and the camera structure includes: Sensor circuit board Inertial measurement circuit board; and An inertial measurement unit, the inertial measurement unit is disposed on the inertial measurement circuit board and is used to acquire attitude data of the camera; One of the sensor circuit board and the inertial measurement circuit board is disposed on the side surface, and the other is disposed on the back surface. The camera structure according to claim 1, wherein the camera structure further comprises: An image sensor disposed on the sensor circuit board. The camera structure according to claim 1, wherein the sensor circuit board and the inertial measurement circuit board are connected to internal components of the camera through a flexible circuit board; or The sensor circuit board and the inertial measurement circuit board are connected to each other through a flexible circuit board. The camera structure according to claim 3, wherein the sensor circuit board, the inertial measurement circuit board, and the flexible circuit board are integrated circuit board structures. The camera structure according to claim 3, wherein The flexible circuit board is located on the back surface; or The flexible circuit board is located on the side; or The flexible circuit board is located on the back surface and the side surface. The camera structure according to claim 1, wherein the back surface is a back surface of the lens, and the side surface is perpendicular to the back surface. The camera structure according to claim 1, wherein the inertial measurement circuit board includes a mounting portion and an extension portion, and the extension portion is connected to the mounting portion in one direction. The camera structure according to claim 7, wherein the camera structure further comprises a vibration reduction element, and when the inertial measurement circuit board is disposed on the side, the vibration reduction element is located between the extension and the extension. When the inertial measurement circuit board is disposed on the back surface, the shock absorbing element is located between the extension portion and the back surface. The camera structure according to claim 8, characterized in that when the inertial measurement circuit board is provided on the side, a groove corresponding to the extension is formed on the side; when the inertial measurement circuit board is When provided on the back surface, a groove corresponding to the extension portion is formed on the back surface; The shock absorbing element is filled in the groove. A gimbal is characterized in that it comprises: a gimbal body and a camera structure, the camera structure is arranged on the gimbal body; the camera structure is formed with connected back and sides, and the camera structure includes: Sensor circuit board Inertial measurement circuit board; and An inertial measurement unit, the inertial measurement unit is disposed on the inertial measurement circuit board and is used to acquire attitude data of the camera; One of the sensor circuit board and the inertial measurement circuit board is disposed on the side surface, and the other is disposed on the back surface. The gimbal of claim 10, wherein the camera structure further comprises: An image sensor disposed on the sensor circuit board. The gimbal of claim 10, wherein the sensor circuit board and the inertial measurement circuit board are connected to internal components of the camera through a flexible circuit board; or The sensor circuit board and the inertial measurement circuit board are connected to each other through a flexible circuit board. The gimbal according to claim 12, wherein the sensor circuit board, the inertial measurement circuit board, and the flexible circuit board are integrated circuit board structures. The pan / tilt head according to claim 12, wherein: The flexible circuit board is located on the back surface; or The flexible circuit board is located on the side; or The flexible circuit board is located on the back surface and the side surface. The gimbal of claim 10, wherein the back surface is a back surface of the lens, and the side surface is perpendicular to the back surface. The gimbal of claim 10, wherein the inertial measurement circuit board includes a mounting portion and an extension portion, and the extension portion is connected to the mounting portion in one direction. The gimbal according to claim 16, wherein the camera structure further comprises a vibration reduction element, and when the inertial measurement circuit board is disposed on the side, the vibration reduction element is located at the extension and the When the inertial measurement circuit board is disposed on the back surface, the shock absorbing element is located between the extension portion and the back surface. The gimbal according to claim 17, wherein when the inertial measurement circuit board is provided on the side, a groove corresponding to the extension is formed on the side; when the inertial measurement circuit board is When provided on the back surface, a groove corresponding to the extension portion is formed on the back surface; The shock absorbing element is filled in the groove. The pan / tilt head according to any one of claims 10 to 18, wherein the pan / tilt head further comprises an electrical adjustment board, and the sensor circuit board and / or the inertial measurement circuit board are connected to the electrical adjustment board . An unmanned aerial vehicle is characterized in that it includes a fuselage and a pan / tilt, the pan / tilt is disposed on the fuselage; and the pan / tilt includes: A gimbal body and a camera structure, the camera structure is disposed on the gimbal body; the camera structure is formed with a connected back and side, and the camera structure includes: Sensor circuit board Inertial measurement circuit board; and An inertial measurement unit, the inertial measurement unit is disposed on the inertial measurement circuit board and is used to acquire attitude data of the camera; One of the sensor circuit board and the inertial measurement circuit board is disposed on the side surface, and the other is disposed on the back surface. The drone according to claim 20, wherein the camera structure further comprises: An image sensor disposed on the sensor circuit board. The drone according to claim 20, wherein the sensor circuit board and the inertial measurement circuit board are connected to internal components of the camera through a flexible circuit board; or The sensor circuit board and the inertial measurement circuit board are connected to each other through a flexible circuit board. The drone according to claim 22, wherein the sensor circuit board, the inertial measurement circuit board, and the flexible circuit board are integrated circuit board structures. The drone according to claim 22, wherein: The flexible circuit board is located on the back surface; or The flexible circuit board is located on the side; or The flexible circuit board is located on the back surface and the side surface. The drone according to claim 20, wherein the back surface is a back surface of the lens, and the side surface is perpendicular to the back surface. The drone according to claim 20, wherein the inertial measurement circuit board includes a mounting portion and an extension portion, and the extension portion is connected to the mounting portion in one direction. The drone according to claim 26, wherein the camera structure further comprises a vibration reduction element, and when the inertial measurement circuit board is disposed on the side, the vibration reduction element is located on the extension portion and Between the sides; when the inertial measurement circuit board is disposed on the back surface, the shock absorbing element is located between the extension and the back surface. The drone according to claim 27, wherein when the inertial measurement circuit board is disposed on the side, a groove corresponding to the extension is formed on the side; when the inertial measurement circuit When the board is disposed on the back surface, a groove corresponding to the extension portion is formed on the back surface; The shock absorbing element is filled in the groove. The drone according to any one of claims 20 to 28, wherein the pan / tilt head further comprises an electric adjustment board, the sensor circuit board and / or the inertial measurement circuit board and the electric adjustment board connection.

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