WO2019225601A1 - Electronic apparatus - Google Patents

Abstract

This electronic apparatus comprises: a substrate on which an electronic component is mounted; a heat-dissipation member for causing heat transfer between the heat-dissipation member and the electronic component on the substrate; a guide member which supports at least one of the substrate and the heat-dissipation member in a movable manner; and a pressing mechanism for pressing an object to be pressed, which is one of the substrate and the heat-dissipation member being supported by the guide member, in a direction for reducing the distance between the substrate and the heat-dissipation member.

Description

Electronics

The present invention relates to an electronic device including an electronic component that requires temperature management.

¡Electronic components mounted on electronic devices generate heat due to power loss when energized. Most electronic components have an operating temperature range and require temperature management. Some electronic components may exceed the maximum junction temperature. For this reason, some electronic devices are provided with heat sinks for electronic components that require temperature management.

¡The temperature inside the electronic equipment rises due to the heat generated by the electronic parts. This temperature increase may cause the electronic component to exceed the maximum junction temperature of the component. Therefore, in such a case, the heat sink is used to remove the amount of heat in the electronic device. On the other hand, in an electronic device that is used in a low-temperature environment, the heat radiating plate is used for heat dissipation so that the inside of the electronic device is within the operating temperature range.

Regardless of removal or heat dissipation, in order to more efficiently transfer heat to the electronic component, it is necessary to narrow the distance between the electronic component and the heat dissipation plate. When the electronic component is brought into direct contact with the heat sink, the efficiency of heat transfer is best. For this reason, conventionally, for each electronic component mounted on a substrate, a projecting portion that comes into contact with or approaches the electronic component is provided on the heat dissipation plate (see, for example, Patent Document 1).

JP 2007-81047 A

The protruding portion that is brought into contact with the electronic component is used for positioning of the heat sink (see, for example, paragraph 0053 of Patent Document 1). However, there are dimensional tolerances in the manufacture of components, not limited to electronic components and heat sinks. When an electronic component is mounted on a substrate, an error corresponding to the mounting accuracy occurs in the positional relationship between the electronic component and the substrate. In an electronic device, an error corresponding to the mounting accuracy also occurs. For this reason, the actual situation is that the protrusion used for positioning by contact with the electronic component cannot always be brought into contact with the electronic component. Even if the projecting portion can be brought into contact with the electronic component, there is a risk that excessive pressure is applied to the electronic component from the projecting portion.

If the protruding part cannot be brought into contact with the electronic component to be brought into contact with, the temperature of the electronic component may not be properly controlled. When an excessive pressure is applied to the electronic component, the electronic component, the protruding portion, the substrate on which the electronic component is mounted, or the like may be deformed or damaged. For this reason, in order to more appropriately manage the temperature of the electronic component, it is also important to appropriately manage the interval between the heat sink and the electronic component.

The present invention has been made to solve such a problem, and an object of the present invention is to provide an electronic device capable of more appropriately managing the temperature of the mounted electronic component.

The electronic device according to the present invention is capable of moving at least one of the substrate, the heat dissipation member, the heat dissipation member for causing heat transfer between the substrate on which the electronic component is mounted, and the electronic component on the substrate. A guide member that is supported by the guide member, and a pressing mechanism that presses the target to be pressed in a direction in which the distance between the substrate and the heat radiating member is reduced. Have.

According to the present invention, the temperature management of the mounted electronic component can be performed more appropriately.

It is a perspective view which shows the electronic device which concerns on Embodiment 1 of this invention. It is a top view which shows the electronic device which concerns on Embodiment 1 of this invention. It is a figure explaining the example of the attachment method to the rail of each board | substrate and each heat sink. It is sectional drawing which shows the state of the rail at the time of attaching a board | substrate. It is a figure explaining the other example of the attachment method to the rail of each board | substrate and each heat sink. It is a figure explaining the error on the external form which exists in each component. It is sectional drawing which shows the example of a state before performing position adjustment of each board | substrate of the electronic device which concerns on Embodiment 1 of this invention, and each heat sink. It is sectional drawing which shows the state after performing position adjustment of each board | substrate of the electronic device which concerns on Embodiment 1 of this invention, and each heat sink. It is a figure which shows the example of the position adjuster which is a press mechanism. It is a figure which shows the other example of the position adjuster which is a press mechanism. It is a figure which shows the further another example of the position adjuster which is a press mechanism. It is a figure explaining the function requested | required of the position adjuster of the type which makes a pressure act automatically. It is a top view which shows the electronic device which concerns on Embodiment 2 of this invention. It is a figure explaining the press mechanism employ | adopted as the electronic device which concerns on Embodiment 3 of this invention. It is a figure which shows another example of a rail provided in the plate-shaped member which comprises a housing | casing.

Hereinafter, an embodiment of an electronic apparatus according to the present invention will be described with reference to the drawings.

Embodiment 1 FIG.
1 is a perspective view showing an electronic apparatus according to Embodiment 1 of the present invention.

The electronic device 1 is a device equipped with electronic components that require temperature management. As shown in FIG. 1, the electronic device 1 is mounted on the heat exchange device 2 because it is necessary to remove the amount of heat due to heat generation or supply a necessary amount of heat.

As shown in FIG. 1, the electronic apparatus 1 has four plate-like members 4a to 4d as a casing 4, and these plate-like members 4a to 4d are assembled in a rectangular shape. A plurality of substrates 5 and a plurality of heat sinks 6 are housed in the housing 4. In FIG. 1, two substrates 5 a and 5 b are shown as the substrate 5. As the heat radiating plate 6 which is a heat radiating member, two heat radiating plates 6a and 6b are shown. Two position adjusters 7 are arranged between the plate-like member 4b and the heat radiating plate 6a. The position adjuster 7 corresponds to the pressing mechanism in the first embodiment.

Each of the plate-like members 4a to 4d constituting the housing 4 is manufactured using a high heat conductive member such as aluminum, iron, copper or the like. Similarly, the heat radiating plate 6 is also made using a high thermal conductive member. The board | substrate 5 and the heat sink 6 are alternately arrange | positioned between the plate-shaped member 4b and the plate-shaped member 4d.

On the other hand, as shown in FIG. 1, the heat exchanging device 2 includes a medium inlet 21, a medium outlet 22, and a flow path 23 therebetween, and the heat medium flowing from the medium inlet 21 passes through the flow path 23 to the medium outlet. 22 is a structure that flows out of the tank 22. Thereby, heat transfer with the electronic device 1 is performed via the upper surface 24 of the heat exchange device 2. The temperature of the heat medium supplied to the medium inlet 21 is managed according to the usage environment of the electronic device 1. In FIG. 1, the vertical direction is indicated by an arrow.

When the electronic device 1 is used in an environment where the temperature is relatively low, that is, when the electronic device 1 is used in an environment where the inside of the electronic device 1 is lower than the operating temperature range, the heat exchanger 2 to the electronic device 1 is used as a heat medium. A medium that assumes heat transfer is used. As the temperature, a temperature at which a necessary amount of heat can be transmitted is set. On the other hand, when the electronic device 1 is used in an environment where the temperature is relatively high, for example, when used in an environment where the electronic device 1 is within the operating temperature range, the electronic device 1 is transferred from the electronic device 1 to the heat exchange device 2 as a heat medium. A medium that assumes heat transfer is used. As the temperature, a temperature at which a necessary amount of heat can be removed is set. Here, for convenience of explanation, unless otherwise specified, it is assumed that heat is transmitted from the electronic device 1 to the heat exchange device 2, that is, a case where the amount of heat generated in the electronic device 1 is removed.

FIG. 2 is a top view showing the electronic apparatus according to Embodiment 1 of the present invention, that is, a view from the vertical direction indicated by an arrow in FIG. As shown in FIG. 2, electronic components 12a and 12b are mounted on the surface of the substrate 5a on the plate-like member 4b side as electronic components 12 that require temperature control, and the electronic component 12c is mounted on the opposite surface. ing. In the substrate 5b, the electronic component 12d is mounted on the surface on the plate-like member 4b side, and the electronic component 12e is mounted on the opposite surface, that is, the surface on the plate-like member 4d side.

The electronic component 12 is, for example, an LSI (Large-Scale Integration), an IC (Integrated Circuit), a semiconductor element, a coil, or the like, and generates heat due to a resistance component or the like when energized. FIG. 2 shows only a total of five electronic components 12a to 12e, but the type and number of electronic components 12 are not particularly limited. A semiconductor electronic component such as a transistor, a bus bar, a capacitor, a resistor, and the like are also mounted on the substrate 5.

As shown in FIG. 2, a plate-like member 4 e that constitutes a housing 4 and is in contact with the upper surface 24 of the heat exchange device 2 is assembled to the bottom of the electronic device 1. On the upper surface of the plate-like member 4e, two rails 10 as guide members for supporting the substrate 5 and the heat radiating plate 6 in a movable manner are provided. A claw member 11 formed in accordance with the shape of the rail 10 is attached to each substrate 5 and each radiator plate 6. Thereby, each board | substrate 5 and each heat sink 6 can move the upper surface of the plate-shaped member 4e along the longitudinal direction of the rail 10. As shown in FIG.

As shown in FIG. 2, the two rails 10 are provided on the plate-like member 4e so that the longitudinal directions thereof are parallel or substantially parallel to the plate-like members 4a and 4c. The longitudinal direction is a direction that is perpendicular or substantially perpendicular to the surfaces of the substrates 5 and the heat sinks 6. Therefore, the positional relationship between the two can be changed so that the heat sink 6a is in contact with the electronic component 12 on the substrate 5a. This also applies to the positional relationship between the substrate 5a and the heat sink 6b and the positional relationship between the heat sink 6b and the substrate 5b.

FIG. 3 is a diagram for explaining an example of a method of attaching each board and each heat sink to the rail. As shown in FIG. 3, each substrate 5 and each heat sink 6 are provided. Two attachment fittings 31 are attached, and the claw member 11 is attached to each attachment fitting 31.

The mounting bracket 31 has an L-shape, and a hole 313 is provided in the flat portion 311 on the side in contact with the substrate 5. The substrate 5 is also provided with a hole having the same size as the hole 313. Thereby, the mounting bracket 31 is fixed to the substrate 5 by passing the screw 32 through the hole 313 and the hole provided in the substrate 5 and fitting the nut by the screw action. The claw member 11 is attached to the flat portion 312 that is the bottom of the mounting bracket 31 by, for example, welding or a screw (not shown).

FIG. 4 is a cross-sectional view showing the state of the rail when the board is attached. As shown in FIG. 4, the claw member 11 has an inverted T-shape, and is roughly divided into two parts: an upper part 111 that is an upper part and a lower part 112 that is a lower part. .

As shown in FIGS. 2 and 3, the rail 10 provided on the plate-like member 4e has a narrow portion 10a and a wide portion 10b. In the narrow portion 10a of the rail 10, as shown in FIG. 4, a rectangular space having a wider cross section is formed adjacent to the lower portion of the narrow portion 10a. Thereby, the overall cross-sectional shape is an inverted T-shape.

From such a cross-sectional shape, the wide portion 10b is a portion where only this rectangular space is exposed by removing the narrow portion 10a. Therefore, the width of the rectangular space matches the width of the wide portion 10b. From such a relationship, in FIG. 4, “10b” is attached to the rectangular space as a code. Hereinafter, the narrow portion 10a is referred to as a “narrow width portion 10a”, and the wide portion 10b is referred to as a “wide portion 10b”.

The upper portion 111 of the claw member 11 is a portion whose width is narrower than the width of the narrow width portion 10a. The lower side portion 112 is a portion whose width is larger than the width of the narrow width portion 10a and smaller than the width of the wide width portion 10b. Therefore, when the lower side portion 112 is inserted into the wide width portion 10b and the claw member 11 is moved to the narrow width portion 10a, the lower side portion 112 interferes with the narrow width portion 10a, and the claw member 11 is removed from the rail 10. It becomes impossible to pull out.

As shown in FIG. 4, the length of the upper portion 111 in the vertical direction is equal to or greater than the depth of the narrow width portion 10a, but is substantially the same as the depth. The rail 10 is formed below the plate thickness direction from the upper surface of the plate-like member 4e. As shown in FIG. 2, the substrate 5 is attached to two rails 10. For this reason, the bottom surface of the substrate 5 can be brought into stable contact with the plate-like member 4e. This means that the heat amount of the substrate 5 can be efficiently transmitted to the upper surface of the heat exchange device 2 via the plate-like member 4e. Since the board 5 is attached to the two rails 10, the two rails 10 are hereinafter also referred to as “one set of rails 10”.

The heat radiating plate 6 is also supported so as to be movable along the pair of rails 10 along the pair of rails 10 in the same manner as the substrate 5. Therefore, the heat quantity of the heat sink 6 can also be efficiently transmitted to the upper surface of the heat exchange device 2 via the plate-like member 4e.

In the first embodiment, the claw member 11 is attached to each substrate 5 and each heat sink 6 using the attachment metal 31, but the attachment method is not limited to the method using the attachment metal 31. For example, as shown in FIG. 5, the claw member 11 may be attached directly to the substrate 5 and the heat radiating plate 6 using solder, an adhesive, or the like.

The wide portion 10b is provided in the vicinity of the plate-like member 4b as shown in FIG. More specifically, the wide width portion 10b is provided in a range where the position adjuster 7 exists from the plate-like member 4b toward the plate-like member 4d. This is because the position adjuster 7 whose one end is in contact with the plate-like member 4b pushes each substrate 5 and each heat sink 6 that are movably supported by a set of rails 10 toward the plate-like member 4d. It is because it is doing. For that purpose, it is preferable that the wide width portion 10b is provided at a position where it is easy to support the substrate 5 and the heat sink 6 to be mounted by the narrow width portion 10a.

As described above, in the first embodiment, each substrate 5 and each heat radiating plate 6 are movably supported on one set of rails 10 so that the positional relationship between them can be adjusted. 7, the actual adjustment is performed. This is for the following reason. A specific description will be given with reference to FIG.

FIG. 6 is a diagram for explaining an error in the external shape existing in each part. FIG. 6 shows only three components, that is, the substrate 5a, the electronic component 12a, and the heat sink 6a.

Even if the design value of the width of the heat sink 6a is A, there are individual differences depending on manufacturing conditions, processing accuracy, etc., and the actual width is usually different from A. When the range of individual differences is assumed to be ± a, the actual width is A ± a. Similarly, for the substrate 5a, assuming that the design value is B and the range of individual differences is ± b, the actual width is B ± b. In the electronic component 12a, assuming that the design value is C and the range of individual differences is ± b, the actual height is C ± c.

The distance including each width between the substrate 5a and the heat radiating plate 6a is D + d when the design value is D and the range of individual differences is +/- d. The individual difference here includes the mounting accuracy and the like. For this reason, “A” to “D” in FIG. 6 represent design values, and “a” to “d” represent individual differences.

When removing the amount of heat generated in the electronic component 12a, it is desirable to make the distance L between the heat sink 6a and the electronic component 12a smaller. When the distance L is 0, that is, when the heat radiating plate 6a is brought into contact with the electronic component 12a, heat transfer from the electronic component 12a to the heat radiating plate 6a can be performed most efficiently. However, as described above, there are individual differences in parts regardless of the type. The distance L is influenced by individual differences due to mounting accuracy in addition to individual differences of related parts.

In FIG. 6, the distance L is minimum when the distance D ± d is minimum, and the widths Aa ± a, B ± b, and the height C ± c are maximum. At this time, the distance L is L = (D−d) − ((A + a) + (B + b) + (C + c))
= (D−A−B−C) − (d + a + b + c)
It becomes. On the other hand, the maximum distance L is L = (D + d) − ((A−a) + (B−b) + (C−c))
= (D−A−B−C) + (d + a + b + c)
It becomes. Accordingly, the distance L changes within a range of ± (d + a + b + c). In other words, the distance L has a difference of 2 (d + a + b + c) between the maximum and the minimum.

It is very difficult to set the distance L to 0 due to the existence of individual differences at this distance L. By assuming the minimum distance L, the electronic component 12a can be brought into contact with the heat sink 6a. However, in that case, pressure is applied to the electronic component 12a, the substrate 5a, the heat sink 6a, and the like according to the difference from the actual distance L. When excessive pressure is applied, problems such as the heat sink 6a and the substrate 5a being deformed and the electronic component 12a being damaged are likely to occur.

On the other hand, in the present first embodiment, as described above, each substrate 5 and each heat sink 6 are movably supported using one set of rails 10. By supporting in such a manner, it is possible to avoid the necessity of applying a pressure that causes a problem in each substrate 5, each heat sink 6, and each electronic component mounted on each substrate 5. This is because it is not necessary to apply excessive pressure to move each substrate 5 and each heat sink 6. Therefore, it is easy to appropriately manage the distance between the electronic component 12 and the housing 4 and the distance between the electronic component 12 and the heat sink 6 without causing a problem caused by applying unnecessary pressure. Can be done. By appropriately managing this interval, it is possible to appropriately remove heat from the electronic component 12 that requires temperature management. More efficient heat removal can be easily realized.

FIG. 7 is a cross-sectional view showing a state example before the position adjustment of each substrate and each heat sink of the electronic device according to the first embodiment of the present invention, and FIG. 8 relates to the first embodiment of the present invention. It is sectional drawing which shows the state after adjusting each board | substrate of an electronic device, and each heat sink. 7 and 8 are both cross-sectional views taken along the line xx shown in FIG. Next, with reference to FIG. 7 and FIG. 8, the position adjustment method of each board | substrate 5 and each heat sink 6, ie, the assembly method of the electronic device 1, is demonstrated concretely.

7 and 8, before and after the position adjustment, the substrate 5b, the heat radiating plate 6b, the substrate 5a, and the heat radiating plate 6a are arranged in this order from the plate member 4d side. Each board 5 and each heat sink 6 are supported by one set of rails 10 by inserting the lower part 112 of the claw member 11 into the wide part 10b in this order. FIG. 7 shows an example of the state after each substrate 5 and the heat sink 6 are all supported by one set of rails 10 in this way.

After that, the operator leaves an interval in which the position adjuster 7 can be inserted between the plate-like member 4b and the heat radiating plate 6a, and inserts the position adjuster 7 into the gap. The position adjuster 7 can change the length. From this, the space | interval which can be inserted is securable by moving the heat sink 6a to the plate-shaped member 4d side, or making the length of the position adjuster 7 shorter.

As shown in FIGS. 7 and 8, the plate-like member 4 e provided with the rail 10 is in contact with the upper surface 24 of the heat exchange device 2, and a heat medium is provided in the flow path 23 formed below the upper surface 24. 25 is flowing. For this reason, the heat quantity of each board | substrate 5 and each heat sink 6 is efficiently removed by being transmitted to the heat medium 25 via the plate-shaped member 4e and the upper surface 24. FIG.

The position adjuster 7 has a structure in which planar support members 72 are attached to both ends of the adjustment rod 71 as shown in FIG. By using this planar support member 72, it is possible to avoid applying a strong pressure in a narrow range to the plate member 4b and the heat radiating plate 6a.

FIG. 9 is a diagram illustrating an example of a position adjuster that is a pressing mechanism. Now referring to FIG. 9 further, the position adjuster 7 will be described in detail.

The position adjuster 7 has a structure in which the distance between the two support members 72 is adjusted by an adjusting rod 71 as shown in FIG. The adjustment rod 71 includes two mandrels 711 and an adjustment screw 712. The two mandrels 711 have different shaft diameters, one being a male screw and the other being a female screw. Thereby, the amount of insertion of the male screw into the female screw can be changed according to the rotation direction of the adjusting screw 712. For example, when the adjustment screw 712 is rotated clockwise as shown on the left side of FIG. 9, the insertion amount is increased and the adjustment bar 71 is shortened, and when turned counterclockwise as shown on the right side of FIG. The amount of insertion becomes smaller and the adjustment rod 71 becomes longer. For this reason, the distance between the two support members 72 can be adjusted by the rotation of the adjustment screw 712.

Returning to the explanation of FIG. When the position adjuster 7 is inserted, there is a margin for enabling the position adjuster 7 to be inserted. From this, after inserting the position adjuster 7, the operator rotates the adjusting screw 712 in a direction in which the adjusting rod 71 is lengthened. By the rotation, between the plate-like member 4d and the electronic component 12e, between the electronic component 12d and the heat sink 6b, between the heat sink 6b and the electronic component 12c, and between the electronic component 12a and the heat sink 6a. The total amount of intervals gradually decreases. When the total amount disappears, the load for rotating the adjusting screw 712 increases rapidly.

When the total amount of voids is 0, contact between the plate-like member 4d constituting the housing 4 and the electronic component 12e, contact between the electronic component 12d and the heat sink 6b, contact between the heat sink 6b and the electronic component 12c, and This is a state where all the contact between the electronic component 12a and the heat sink 6a is realized. By realizing this state, an environment in which the amount of heat generated in the electronic components 12e, 12d, 12c, and 12a can be efficiently removed is realized. In addition, in order to avoid applying excessive pressure, the length adjustment of the position adjuster 7 by rotating the adjustment screw 712 is also terminated. At the end of the length adjustment, the positions of the substrates 5 and the heat sinks 6 are also fixed, and the state at the end of the length adjustment is stably maintained.

Thus, when each substrate 5 and each heat sink 6 are movably supported by one set of rails 10 and are positioned using the position adjuster 7, individual differences in parts, assembly accuracy, etc. Regardless, it is possible to reliably realize an optimum environment for removing heat. Even if an unexpected error occurs, it can be handled as long as the length of the position adjuster 7 can be adjusted. It is possible to reliably avoid applying excessive pressure. From these things, the temperature management of the electronic component 12 mounted in the electronic device 1 can also be performed reliably and appropriately.

In the first embodiment, the position adjuster 7 employs a type in which the operator adjusts the length by rotating the adjustment screw 712. However, the position adjuster 7 that can be employed is of this type. It is not limited to. For example, as shown in FIG. 10, the position adjuster 7 is a type in which a spring 75 that is an elastic member is provided in a mandrel 711 and pressure is applied in the direction in which the adjustment rod 71 becomes longer by the elastic force of the spring 75. May be. Alternatively, as shown in FIG. 11, the position adjuster 7 encloses the gas 76 as a fluid in the mandrel 711, and the adjustment rod 71 becomes longer due to the pressure generated because the gas 76 has the same pressure as the outside air. It is also possible to use a type in which pressure is applied. In the case of this type, a packing 77 for sealing the gas 76 is attached between the two mandrels 711.

FIG. 12 is a diagram for explaining functions required for a position adjuster of a type that automatically applies pressure.

In the position adjuster 7 of the type as shown in FIGS. 10 and 11, a pressure corresponding to the length is automatically applied to each support member 72. However, as shown in FIG. 12, the pressure needs to be at a level at which each substrate 5 and each heat sink 6 can be moved and the substrate 5, the electronic component 12, etc. do not cause a problem. Therefore, the position adjuster 7 that automatically applies pressure needs to satisfy the conditions shown in FIG. That is, the pressure to be applied is at a level that does not cause a problem when the length is minimum, and the position adjuster 7 that maintains a level at which each substrate 5 and each heat sink 6 can be moved even when the length is maximum. It is necessary to adopt. In the type using the pressure of the gas 76 as shown in FIG. 11, the pressure can be adjusted by injecting or removing the gas 76. The maximum length and the minimum length may be those of the position adjuster 7 itself, but may be assumed at the time of use.

Embodiment 2. FIG.
The heights of the electronic components 12 requiring temperature management are not all the same. Therefore, as shown in FIGS. 2 and 8, it is difficult to bring all the electronic components 12 that require temperature management into contact with the heat sink 6. Of the electronic components 12 mounted on one substrate 5, it is usually limited to the highest electronic component 12 that can be brought into contact with the heat sink 6. For this reason, in the second embodiment, more electronic components 12 can be brought into contact with the heat sink 6. By bringing more electronic components 12 into contact with the heat sink 6, the temperature management of the electronic components 12 mounted on the electronic device 1 can be performed more appropriately. Here, the same reference numerals are given to the same or corresponding components as those in the first embodiment, and different parts from the first embodiment will be described in detail.

FIG. 13 is a top view showing an electronic apparatus according to Embodiment 2 of the present invention. As shown in FIG. 13, in this Embodiment 2, the two heat sinks 6a1 and 6a2 are employ | adopted instead of the heat sink 6a. In order to support the two heat sinks 6a1 and 6a2 so as to be movable at two locations, one rail 10 is added between one set of rails 10. Each of the heat radiating plates 6a1 and 6a2 is made to act on the plate member 4d by the position adjuster 7 respectively. As a result, the heat sink 6a1 is in contact with the electronic component 12a, and the heat sink 6a2 is in contact with the electronic component 12b. Thereby, compared with the said Embodiment 1, the removal of the calorie | heat amount which generate | occur | produced in the electronic component 12b can be performed more efficiently.

Embodiment 3 FIG.
In the said Embodiment 1 and 2, the position adjuster 7 from which a length changes is employ | adopted manually or automatically. On the other hand, this Embodiment 3 uses the press mechanism which generate | occur | produces the pressure which moves the heat sink 6 toward the plate-shaped member 4d, without employ | adopting the structure from which length changes. Here, the same or corresponding components as those in the first embodiment are denoted by the same reference numerals, and different portions from the first embodiment will be described in detail.

FIG. 14 is a diagram for explaining a pressing mechanism employed in an electronic apparatus according to Embodiment 3 of the present invention, and FIG. 15 shows another example of rails provided on a plate-like member constituting the housing. FIG.

As shown in FIG. 14, in this Embodiment 3, it is a rod-shaped and the fixed bar provided with the inclination which length becomes short from the upper direction to the lower side in the perpendicular direction in the edge part by the side of the heat sink 6a 140. The surface 61 on the plate-like member 4b side of the heat radiating plate 6a is also provided with an inclination that makes contact with the end of the fixing rod 140 as a whole.

On the other hand, the plate-like member 4b constituting the housing 4 is provided with two rails 141 similar to the rail 10 as shown in FIG. Each rail 141 is a guide member for supporting one fixed bar 140 movably in the vertical direction. Thereby, in the third embodiment, there are two fixing rods 140. Each rail 141 has a narrow width portion 141a and a wide width portion 141b, like the rail 10.

Therefore, the other end of the fixing rod 140, that is, the end on the plate-like member 4b side is, for example, a claw, and the claw can be inserted from the wide portion 141b. By the insertion, the fixed bar 140 is supported so as to be movable in the vertical direction in the narrow width portion 141a.

In order to maintain the inclination of the end of the fixing rod 140 on the heat radiating plate 6a side, the shape of the claw is a rectangular shape that matches the planar shape in the rail 141, for example, that the fixing rod 140 does not rotate around the axis. ing. Accordingly, the fixing rod 140 is configured to push the heat radiating plate 6a away from the plate-like member 4b by a length corresponding to the downward movement amount.

For this reason, the pressing mechanism in the third embodiment includes the fixing rod 140 and the rail 141 in a narrow sense. In a broad sense, it further includes a heat sink 6a. This pressing mechanism can be used in place of the position adjuster 7 employed in the first and second embodiments because it can move the heat radiating plate 6a away from the plate-like member 4b.

In the third embodiment, the weight of the fixing rod 140 is used as the pressure for pressing the heat sink 6a. However, other than the fixing rod 140 may be used for the use of the own weight. In other words, the pressing mechanism may be a mechanism that uses, for example, a pulley or the like to change the force in the vertical direction due to its own weight to the force in the horizontal direction and move each substrate 5 and each heat sink 6. Various modifications including this are possible.

In the first to third embodiments, as shown in FIGS. 2 and 13, the two substrates 5 and the two heat sinks 6 are the objects to be moved, but the object to be moved may be one. . That is, the number of movement targets may be one or more. This is because the substrate 5 or the electronic component 12 on the substrate 5 can be brought into contact with the housing 4 or the heat sink 6 even if there is only one moving object.

The rail 10 assumes that the electronic component 12 on the substrate 5 is brought into contact with the housing 4 or the heat sink 6. However, the rail 10 may be used to make the distance between the electronic component 12 and the housing 4 or the distance between the electronic component 12 and the heat sink 6 equal to or less than a predetermined distance. This is because, as a result, it is only necessary to appropriately manage the temperature of the electronic component 12. The rail 10 may be provided as a part of the plate-like member 4e, not as a single component. The same applies to the rail 141.

In the first and second embodiments, only two position adjusters 7 are used, but three or more position adjusters 7 may be used. Taking the top view shown in FIG. 2 as an example, for example, the substrate 5a is fixed, the heat sink 6a is moved toward the substrate 5a by the two position adjusters 7, and the heat sink 6b and the substrate 5b are movably supported. The heat radiating plate 6b may be moved by the two position adjusters 7. In this way, when the number of substrates 5 and heat sinks 6 to be contacted is dispersed, the amount of heat generated per unit area can be further suppressed, so that it can be expected that the temperature management of the electronic component 12 can be performed more appropriately. .

Depending on the number of position adjusters 7, the number of pressing objects to which the position adjusters 7 actually apply pressure can be increased. As the number of pressing objects increases, more accurate temperature management becomes possible. However, the space where the substrate 5 or the heat sink 6 cannot be installed becomes wider. The position adjuster 7 basically needs to fix one end, and may need to be provided with a mechanism for the fixing. In view of the above, the position adjuster is actually considered in consideration of the number of electronic components 12 that are highly necessary to perform temperature management, the level of necessity, and restrictions on the external shape required for the electronic device 1. It is necessary to determine the number of 7, that is, the number of pressing objects. For this reason, the number and arrangement of the position adjusters 7 need to be variously modified as required.

1 Electronic device, 2 Heat exchange device, 4 Housing, 4a to 4e Plate member, 5, 5a, 5b Substrate, 6, 6a, 6b, 6a1, 6a2 Heat radiation plate (heat radiation member), 7 Position adjuster, 10 Rail (Guide member) 10a Narrow width part, 10b Wide part, 11 Claw member, 12, 12a-12e Electronic parts, 140 fixed rod, 141 rail (other guide members).

Claims (10)

A board on which electronic components are mounted;
A heat dissipating member for conducting heat transfer with the electronic component on the substrate;
A guide member that movably supports at least one of the substrate and the heat dissipation member;
One of the substrate and the heat radiating member supported by the guide member is a pressing target, and a pressing mechanism that presses the pressing target in a direction to reduce the distance between the substrate and the heat radiating member;
Electronic equipment having The pressing mechanism includes an adjustment rod whose length can be adjusted,
The electronic device according to claim 1. The adjustment rod has an adjustment screw for adjusting the length, and changes the length according to the rotation of the adjustment screw.
The electronic device according to claim 2. The adjusting rod applies pressure in a direction that is elongated by one of an elastic member and a fluid;
The electronic device according to claim 2. The adjustment bar is disposed between a housing and the pressing object.
The electronic device according to any one of claims 2 to 4. The heat radiating member performs heat transfer with a heat exchange device used for at least one of supply of heat amount and removal of the heat amount via a housing.
The electronic device according to claim 1. The pressing mechanism is
A fixed rod provided with an inclination at its end that can be moved in the vertical direction by another guide member, and whose length decreases as it goes downward in the vertical direction;
The heat radiation member provided on the surface facing the end, the inclination being in contact with the end where the inclination is provided and the end provided with the inclination,
The electronic device according to any one of claims 1 to 6, wherein: The guide member movably supports one or more substrates and one or more heat dissipation members,
One or more of the pressing mechanisms move the heat dissipating member as the pressing target to bring the electronic component on the substrate into contact with one of the housing and the heat dissipating member.
The electronic device according to any one of claims 1 to 7. A plurality of the pressing mechanisms;
Moving the different pressing object for each pressing mechanism;
The electronic device according to any one of claims 1 to 8. A plurality of the guide members;
The substrate and the heat dissipation member are movably supported by two or more guide members,
The electronic device according to any one of claims 1 to 9.

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