WO2019223109A1 - Flexible nanoimprint template and manufacturing method therefor - Google Patents

Abstract

A flexible nanoimprint template and a manufacturing method therefor. The flexible nanoimprint template is formed by compounding an amorphous alloy layer (1) and a nickel base layer (2). The flexible nanoimprint template combines the increased hardness and great extensibility of nickel metal and the advantages of the amorphous alloy being smooth and corrosion resistant, has an arithmetic average roughness of 1 nm or less, is convenient to demold, has great flexibility, provides great mechanical performance and resistance against light and acid corrosion, and is particularly suitable for a nanoimprint of a small-sized, high-precision pattern.

Description

Flexible nano-imprint template and preparation method thereof Technical field

The disclosure belongs to the technical field of nano-imprint templates, for example, relates to a flexible nano-imprint template and a preparation method thereof.

Background technique

Nano-imprint technology is a new method of nano-pattern replication first proposed by Stephen Y. Chou of Princeton University in the 1990s. This technology applies the traditional template replication principle to the field of micro-manufacturing. It overcomes the limitations and requirements of traditional optical lithography on special exposure beam sources, high-precision focusing systems, and extremely short-wavelength lens systems. It has ultra-high resolution and high yield. And low cost. Nano-imprint technology is mainly used in the manufacturing process of integrated nano-structure devices, such as integrated circuits, high-density magnetic memory electrophoresis chips, waveguide polarizers, quantum devices, and polarized light navigation sensors.

The most critical technology of nano-imprint lithography is the preparation of nano-imprint templates, which is also different from lithography. The quality of the nano-imprint template directly determines the quality of the embossed graphics. Therefore, to produce high-precision graphics, a high-quality nano-imprint template is required first. Currently, the most widely used template for nanoimprinting is silicon templates. The silicon template manufacturing process is to first prepare the nano-pattern through homogenization, photolithography, and then dry or wet etching. The surface of the silicon template is smooth, but its material is brittle, which makes it difficult to guarantee the life of the silicon template. Scientists such as Hirai found that silicon templates rarely withstand 20 repeated imprints. Therefore, silicon templates are not suitable for industrial production, which has also become a key factor limiting the development of nanoimprint technology. Nowadays, roll-to-roll nanoimprinting is the preferred method to enable large-scale, high-throughput production in industry. This makes the preparation of high-quality flexible nanoimprint templates particularly critical.

At present, the most widely used flexible nanoimprint template is a nickel template. A typical manufacturing method of a nickel template is to sputter a conductive seed layer on a mother template (silicon template or polymer template), then thicken it by electroplating, and finally release the nickel template from the mother template to obtain a nickel template. Nickel template has high strength and hardness, high melting point and good thermal conductivity.

However, nickel templates usually have a roughness of a few nanometers, which makes it difficult to release the nickel template, especially for UV-cured nano-imprinting. Generally, the surface of the nickel template needs to be subjected to hydrophobic treatment. Printing progresses poorly. When the roll-to-roll embossing machine performs UV curing embossing, the nickel template is in contact with the nano-imprinting glue for a long time. The photoacid contained in the glue will slowly corrode the nickel template, which will affect the graphic accuracy of the nickel template and the imprinting effect. In addition, due to the grain size and roughness of the nickel template, the minimum size of the micro-nano pattern produced on the template is difficult to be less than 20 nanometers. These factors have affected the application of nickel templates in roll-to-roll nanoimprinting to a certain extent, especially in the field of small-size and high-precision nanoimprinting.

CN104308452A discloses a method for preparing an amorphous alloy micro-nano structure embossing mold, which includes the following steps: Step 1: Preparation of an amorphous alloy sheet; Step 2: Surface treatment of the amorphous alloy sheet: Non-obtained in step 1 One side (or cut surface) of the crystalline alloy wafer is ground and polished to obtain an amorphous alloy wafer with a smooth surface on one side; Step 3: Preparation of a template: using lithography or laser interference etching to prepare a template, and polishing the surface of the silicon wafer The designed pattern is etched and used as the micro-nano structure of the micro-nano embossing mold on the metal surface to be used as a template for the thermoplastic molding or embossing of the amorphous alloy sheet; Embossed template; step 4: thermoplastic compression molding: the polished surface of the amorphous alloy sheet polished on one side in step 2 is opposite to the side of the mold with a micro-nano structure described in step 3, and placed in contact with each other In the mold, heat to the supercooled liquid temperature region of the amorphous alloy sheet and keep it warm, and then apply a certain pressure to hold it for a period of time; Step 5: Unload: Unload The applied pressure cools the mold and removes the template and the amorphous alloy sheet. At this time, the surface of the amorphous alloy sheet is attached to the template and forms a micro-nano structure corresponding to the template; step 6: demolding: The amorphous alloy sheet and the template obtained in step 5 are placed in a KOH or NaOH solution, so that the template is corroded, so that the amorphous alloy sheet and the template are separated, and an amorphous alloy micro-nano structure embossing mold is obtained. The invention proposes to use a high-performance amorphous alloy material with high strength, high hardness, and good corrosion resistance as a mold material for micro-nano structure molding. Using its precise molding characteristics, a thermoplastic compression molding technology is proposed to prepare micro-nano structures and sizes. Uniform forming mold, and using the mold for embossing molding of various metals, embossing molding of polymer materials and rapid embossing molding, to prepare metal materials and polymer materials with micro-nano structure. However, using an amorphous alloy sheet as a template cannot be made into a flexible template, and its mechanical properties need to be further improved; in addition, using an amorphous alloy sheet alone as a template is costly: its demolding method chooses to corrode the silicon template, which means that The master template can only be used once, and the cost of preparing a silicon template (especially a large-scale nano-scale silicon template) is very high; therefore, templates made of amorphous alloy wafers are embossed at roll-to-roll nanometers, especially at high sizes. Applications in the field of precision nanoimprinting are limited.

Summary of the Invention

The following is an overview of the topics detailed in this article. This summary is not intended to limit the scope of protection of the claims.

The present disclosure provides a flexible nano-imprint template and a method for preparing the same. The flexible nano-imprint template has an arithmetic average roughness (Ra) of less than 1 nm, is convenient for demolding, has good flexibility, has good mechanical properties, and is resistant to photoacid corrosion. It can be used for nano-imprinting of small size and high-precision graphics.

In a first aspect, the present disclosure provides a flexible nano-imprint template, which is composed of an amorphous alloy layer and a nickel base layer.

The present disclosure applies an amorphous alloy to a nano-imprint template. The amorphous alloy has a series of excellent properties, such as: lower roughness, high corrosion and abrasion resistance, higher strength and hardness, etc .; the nickel template has Higher strength and hardness, high melting point and good thermal conductivity. However, if an amorphous alloy is simply used as a template, there are several disadvantages: 1. High cost; 2. It is difficult to make a flexible template; 3. It is difficult to make a limit nano-size template in a large area. Therefore, the nano-imprint template made of the composite of amorphous alloy and nickel in this disclosure is flexible and can be applied to roll-to-roll nano-imprint of high-throughput production. While ensuring the excellent performance of amorphous alloys, Adequate mechanical properties.

In an embodiment herein, the amorphous alloy layer is prepared by a magnetron sputtering process.

In one embodiment of the present invention, the nickel base layer is prepared by a plating process.

In an embodiment herein, the thickness of the amorphous alloy layer is 1 to 2 μm, for example, the thickness of the amorphous alloy layer is 1 μm, 1.1 μm, 1.2 μm, 1.3 μm, 1.4 μm, 1.5 μm, 1.6 μm, 1.7 μm, 1.8 μm, 1.9 μm, or 2 μm.

In an embodiment herein, the thickness of the nickel base layer is 100-200 μm, for example, the thickness of the nickel base layer is 100 μm, 110 μm, 120 μm, 130 μm, 140 μm, 150 μm, 160 μm, 170 μm, 180 μm, 190 μm, or 200 μm.

In an embodiment herein, the amorphous alloy layer is selected from a zirconium-based amorphous alloy, a copper-based amorphous alloy, a magnesium-based amorphous alloy, a titanium-based amorphous alloy, a palladium-based amorphous alloy, and an iron-based amorphous alloy. One of them.

In a second aspect, the present disclosure provides a method for preparing a flexible nano-imprint template, including the following steps:

1) Magnetron sputtering an amorphous alloy layer on the master template;

2) magnetron sputtering a nickel seed layer on the surface of the amorphous alloy layer obtained in step 1);

3) electroplating a nickel thickened layer on the surface of the nickel seed layer obtained in step 2) to obtain a composite template having an amorphous alloy layer and a nickel base layer;

4) The mother template is removed from the composite template obtained in step 3) to obtain the flexible nano-imprint template.

In an embodiment of the present invention, in step 1), the mother template is selected from one of a silicon template, a polymer sheet template, an ITO (indium tin oxide) conductive glass template, an alumina template, and a quartz template.

In an embodiment of the present invention, in step 1), the magnetron sputtering process for preparing the amorphous alloy layer is: magnetron sputtering using a multi-component alloy target, and firstly using low power sputtering of 40 to 60W to ensure Better coverage of graphics accuracy. For example, first use 40W, 45W, 50W, 55W, or 60W low-power sputtering, and then use a large current of 110 to 120W to thicken the sputtering, such as 110W, 111W, 112W, 113W, 114W. , 115W, 116W, 117W, 118W, 119W or 120W for thickening.

In an embodiment of the present invention, the pressure of the sputtered Ar (argon) gas in step 1) is 0.5 to 1.0 Pa. For example, the sputtered atmosphere is Ar gas, and the pressure of the Ar gas is 0.5 Pa, 0.6 Pa, 0.7Pa, 0.8Pa, 0.9Pa or 1Pa.

In an embodiment herein, the thickness of the amorphous alloy layer is 1 to 2 μm, for example, the thickness of the amorphous alloy layer is 1 μm, 1.1 μm, 1.2 μm, 1.3 μm, 1.4 μm, 1.5 μm, 1.6 μm, 1.7 μm, 1.8 μm, 1.9 μm, or 2 μm.

Due to the poor conductivity of the amorphous alloy, the use of an amorphous alloy layer as the seed layer to thicken nickel plating is prone to non-uniform plating, so it is necessary to prepare a nickel seed layer.

In an embodiment of the present invention, in step 2), the magnetron sputtering process parameters for preparing the nickel seed layer are: the sputtering power is 200-400W, for example, the sputtering power is 200W, 250W, 300W, 350W, or 400W, The high-power 200 ～ 400W magnetron sputtering nickel seed layer can strengthen the bonding force between nickel and amorphous alloy layer, so that the final demolding can be successful; the atmosphere of the sputtering is Ar gas, and the pressure of the Ar gas is 0.5 ～ 1.0 Pa, for example, the sputtering Ar gas pressure is 0.5 Pa, 0.6 Pa, 0.7 Pa, 0.8 Pa, 0.9 Pa, or 1 Pa.

In an embodiment herein, the thickness of the nickel seed layer is 110-130 nm, for example, the thickness of the nickel seed layer is 110 nm, 115 nm, 120 nm, 125 nm, or 130 nm.

In an embodiment of the present invention, in step 3), the electroplating process of the nickel thickened layer is: electroplating and thickening in a nickel sulfamate bath, and the temperature of the electroplating is 50-55 ° C. The temperature is 50 ° C, 51 ° C, 52 ° C, 53 ° C, 54 ° C or 55 ° C.

In an embodiment of the present invention, the plating of the nickel thickened layer is performed by a three-step direct current method. The first and second steps are performed with a small current density growth, and the third step is performed with a large current density for rapid thickening.

In an embodiment of the present invention, the current density of the first plating is 0.3 to 0.5 A / dm ² , for example, the current density of the first plating is 0.3 A / dm ² , 0.35 A / dm ² , 0.4 A / dm ^2. 0.45A / dm ² or 0.5A / dm ² ; the plating time of the first plating is 1600-2000s, for example, the plating time of the first plating is 1600s, 1650s, 1700s, 1750s, 1800s, 1850s, 1900s , 1950s or 2000s.

In an embodiment of the present invention, the current density of the second step plating is 0.7-0.9A / dm ² , for example, the current density of the second step plating is 0.7A / dm ² , 0.75A / dm ² , 0.8A / dm ^2. 0.85A / dm ² or 0.9A / dm ² ; the plating time of the second step plating is 1600-2000s, for example, the plating time of the second step plating is 1600s, 1650s, 1700s, 1750s, 1800s, 1850s, 1900s , 1950s or 2000s.

In one embodiment described herein, the current density of the third step of plating 0.9 ~ 1.2A / dm ^2, for example, electroplating current density of the third step of ^{0.9A / dm 2, 0.95A / dm} 2, 1A / dm 2 Or 1.2A / dm ² ; the plating time of the third step plating is 14000 ~ 15000s, for example, the plating time of the third step plating is 14000s, 14100s, 14200s, 14300s, 14400s, 14500s, 14600s, 14700s, 14800s, 14900s or 15000s.

In an embodiment herein, the thickness of the nickel thickened layer is 80-120 μm, for example, the thickness of the nickel thickened layer is 80 μm, 85 μm, 90 μm, 95 μm, 100 μm, 105 μm, 110 μm, 115 μm, or 120 μm.

In an embodiment herein, the preparation method includes the following steps:

1) Magnetron sputtering using a multiple alloy target, first with a low power sputtering of 40 to 60W, followed by thickening with a large current of 110 to 120W, and magnetron sputtering a layer of 1 to 2 μm on the master template Thick amorphous alloy layer;

2) The surface of the amorphous alloy layer obtained in step 1) is magnetron sputtered with a nickel seed layer having a thickness of 110 to 130 nm, wherein the sputtering power is 200 to 400 W, and the sputtering atmosphere is Ar gas. The pressure of the Ar gas is 0.5 to 1.0 Pa;

3) The surface of the nickel seed layer obtained in step 2) is electroplated with a nickel thickened layer having a thickness of 80 to 120 μm using a three-step DC method to obtain a composite template having an amorphous alloy layer and a nickel base layer, wherein, The current density of the first plating is 0.3 to 0.5 A / dm ² , the plating time of the first plating is 1600 to 2000 s, and the current density of the second plating is 0.7 to 0.9 A / dm ² , the The plating time of the second step plating is 1600 to 2000s, the current density of the third step plating is 0.9 to 1.2A / dm ² , and the plating time of the third step plating is 14000 to 15000s;

4) The mother template is removed from the composite template obtained in step 3) to obtain the flexible nano-imprint template.

Compared with the related technology, the flexible nano-imprint template provided by the present disclosure has excellent performance, combines the advantages of higher hardness of nickel metal, good ductility, and smooth corrosion resistance of amorphous alloy, and has arithmetic below 1nm. Average roughness (Ra), easy to demold, good flexibility, good mechanical properties and resistance to photoacid corrosion:

(1) The flexible nano-imprint template provided in the present disclosure has a relatively low roughness, and the arithmetic average roughness is less than 1 nm, while the roughness of a common nickel template is generally several nanometers;

(2) The flexible nano-imprint template provided by the present disclosure has good mechanical properties, for example, the Young's modulus of the flexible nano-imprint template when using a zirconium-based amorphous alloy layer is about 113 GPa and the hardness is about 2.9 GPa;

(3) The flexible nanoimprint template provided by the present disclosure has strong resistance to photoacid corrosion. Since the amorphous alloy has no grain boundaries, the template made with it has good corrosion resistance. In the process of ultraviolet curing nanoimprint lithography, The nano-imprinting adhesive will generate photoacid under ultraviolet light. Compared with the traditional nickel template, the flexible nano-imprinting template provided by the present disclosure has stronger photo-acid corrosion resistance;

(4) The process provided by the present disclosure is simple, and it is convenient to produce a limit nano-size template in a large area. The size of the micro-nano pattern embossed with the flexible nano-imprint template prepared by the present disclosure can be less than 20 nm.

After reading and understanding the drawings and detailed description, other aspects can be understood.

BRIEF DESCRIPTION OF THE DRAWINGS

1 is a schematic structural diagram of a flexible nano-imprint template provided by an embodiment of the present disclosure;

FIG. 2 is a flowchart of a process for manufacturing a flexible nano-imprint template according to Embodiment 1 of the present disclosure; FIG.

3 is a flowchart of a process for manufacturing a flexible nano-imprint template according to Embodiment 2 of the present disclosure;

4 is a flowchart of a process for manufacturing a flexible nano-imprint template according to Embodiment 3 of the present disclosure;

5 (a) is a SEM image of the flexible nanoimprint template prepared in Example 1 of the present disclosure;

5 (b) is an AFM image of a flexible nano-imprint template prepared in Example 1 of the present disclosure;

6 (a) is a SEM image of a flexible nanoimprint template prepared in Example 2 of the present disclosure;

6 (b) is an AFM image of a flexible nano-imprint template prepared in Example 2 of the present disclosure;

7 is a flow chart of a manufacturing process of a nickel template of a comparative example of the present disclosure;

FIG. 8 (a) is a SEM image of a flexible nanoimprint template without photo-acid etching;

8 (b) is a SEM image of a nickel template that has not been photo-etched;

FIG. 9 (a) is a SEM image of a flexible nano-imprint template after 10 h of photoacid etching;

FIG. 9 (b) is a SEM image of a nickel template after 10 h of photoacid etching.

The reference signs are as follows:

1-amorphous alloy layer; 2-nickel base layer.

Detailed ways

The technical solutions of the present disclosure will be further described below with reference to the accompanying drawings and specific embodiments.

As shown in FIG. 1, the flexible nanoimprint template of the present disclosure is composed of an amorphous alloy layer 1 and a nickel base layer 2.

Example 1

Put 10 microliters of FDTS (1H, 1H, 2H, 2H-perfluorodecyltrichlorosilane) into 20 ml of heptane, and then soak the prepared silicon template for 10 minutes, and then remove the silicon template with pure It was washed with heptane, and finally baked on a hot plate at 100 ° C for 10 minutes to complete the hydrophobic treatment of the silicon template. Next, magnetron sputtering was performed, and a single target of Zr ₅₅ Cu ₃₀ Ni ₅ Al ₁₀ component was used to sputter a 1 micron thick amorphous alloy film on a silicon template at a power of 70 W. Next, a layer of nickel of about 100 nm is sputtered as a seed layer, and then thickened to about 100 microns by electroplating in a nickel sulfamate solution. Finally, the amorphous alloy layer and the nickel base layer are peeled off from the silicon template to make a flexible nano-imprint template. The manufacturing process of the flexible nano-imprint template in this embodiment is shown in FIG. 2.

FIG. 5 (a) is an SEM (scanning electron microscope) image of the flexible nanoimprint template prepared in this embodiment, and FIG. 5 (b) is an AFM (atomic force microscope) image of the flexible nanoimprint template prepared in this embodiment . It can be seen from FIG. 5 (a) that the flexible nano-imprint template prepared in this embodiment is a square pillar flexible nano-imprint template; as can be seen from FIG. 5 (b), the flexible nano-imprint prepared by this embodiment The arithmetic mean roughness (Ra) of the template is only 0.386 nm.

Example 2

A silicon template with a 600-nm line-width grating was hot-embossed at 175 ° C with a pressure of 500 Mpa. Next, magnetron sputtering was performed in the next step. A single target of Zr ₅₅ Cu ₃₀ Ni ₅ Al ₁₀ composition was used at a power of 70 W to sputter an approximately 1 micron thick amorphous alloy film on the patterned PC wafer. Next, a layer of nickel of about 100 nm is sputtered as a seed layer, and then thickened to about 100 microns by electroplating in a nickel sulfamate solution. Finally, the amorphous alloy layer and the nickel base layer are peeled off from the PC sheet to make a flexible nano-imprint template. The manufacturing process of the flexible nano-imprint template in this embodiment is shown in FIG. 3.

FIG. 6 (a) is a SEM image of the flexible nano-imprint template prepared in this embodiment, and FIG. 6 (b) is an AFM image of the flexible nano-imprint template prepared in this embodiment. It can be seen from FIG. 6 (a) that the flexible nano-imprint template prepared in this embodiment is a grating flexible nano-imprint template. As can be seen from FIG. 6 (b), the flexible nano-imprint template prepared by this embodiment The arithmetic mean roughness (Ra) is 0.7 nm.

Example 3

A layer of electron beam photoresist HSQ is spin-coated on a silicon wafer or ITO conductive glass, and then a nanoscale pattern is written on the silicon wafer or ITO glass wafer with an electron beam on the HSQ. After development, magnetron sputtering is used, and Zr _{55 is used.} A single target with a composition of Cu ₃₀ Ni ₅ Al ₁₀ with a power of 70 W is sputtered on the ITO or silicon template with a thickness of 1 micron of an amorphous alloy film. Next, a layer of nickel of about 100 nm is sputtered as a seed layer, and then thickened to about 100 microns by electroplating in a nickel sulfamate solution. Finally, the amorphous alloy layer and the nickel base layer are peeled off from the silicon template or the ITO template to make a flexible nano-imprint template. The manufacturing process of the flexible nano-imprint template in this embodiment is shown in FIG. 4.

The flexible nano-imprint template prepared in Examples 1-3 was tested by a nano-indenter, and the Young's modulus was 112.9 GPa and the hardness reached 2.91 GPa.

Example 4

The difference between this embodiment and Embodiment 3 is that in this embodiment, a single-target magnetron sputtering amorphous alloy thin film composed of Cu ₅₈ Zr ₂₀ Ti ₂₀ Mo _{2 is} used. Other preparation processes are the same as those in Embodiment 3. The arithmetic average roughness (Ra) of the flexible nano-imprint template prepared in the example was 0.8 nm. The flexible nano-imprint template prepared was tested by a nano-indenter, and the Young's modulus was 102 GPa and the hardness was 1.8 GPa.

Example 5

The difference between this embodiment and Embodiment 3 is that in this embodiment, a single-target magnetron sputtered amorphous alloy film with a composition of Mg ₆₉ Ni ₁₅ Gd ₁₀ Ag _{6 is} used. Other preparation processes are the same as those in Embodiment 3. This embodiment The arithmetic average roughness (Ra) of the flexible nano-imprint template prepared in the example was 0.75 nm. The flexible nano-imprint template prepared was tested by a nano-indenter, and the Young's modulus was 55 GPa and the hardness was 1.5 Gpa.

Example 6

The difference between this embodiment and Embodiment 3 is that the amorphous alloy thin film of this embodiment uses a single target of Ti ₄₀ Zr ₂₅ Cu ₉ Ni ₈ Be ₁₈ composition, and other preparation processes are the same as those of Embodiment 3. This embodiment The arithmetic average roughness (Ra) of the prepared flexible nano-imprint template was 0.86 nm. The flexible nano-imprint template was tested by a nano-indenter, and the Young's modulus was 68 GPa and the hardness reached 5.6 GPa.

Example 7

The difference between this embodiment and Embodiment 2 is that the thickness of the amorphous alloy thin film in this embodiment is 1.5 micrometers, and the thickness of the nickel base layer is 150 micrometers. Other preparation processes are the same as those in Embodiment 2.

The arithmetic average roughness (Ra) of the flexible nano-imprint template prepared in this embodiment is 0.5 nm. The flexible nano-imprint template prepared is tested by a nano-indenter, and the Young's modulus is 110 GPa and the hardness reaches 3.1 GPa. .

Example 8

This embodiment is different from Embodiment 2 in that the thickness of the amorphous alloy thin film in this embodiment is 2 micrometers, and the thickness of the nickel base layer is 200 micrometers. The other preparation processes are the same as those in Embodiment 2.

The arithmetic average roughness (Ra) of the flexible nano-imprint template prepared in this embodiment is 0.8 nm. The flexible nano-imprint template prepared is tested by a nano-indenter, and the Young's modulus is 113 GPa and the hardness reaches 3.0 GPa. .

Comparative example

The template of this comparative example is a simple nickel template, and the preparation process is as follows:

First, photolithographic etching is performed on a silicon wafer, and a micro-nano structure is fabricated on the surface, as shown in FIG. 7. After the fabrication is completed, a nickel seed layer with a thickness of about 100 nm is plated on the silicon template by electron beam evaporation or magnetron sputtering, and then thickened to about 100 μm by electroplating in a nickel sulfamate solution. Finally, The nickel template was peeled from the silicon template.

The performance of the nickel template prepared in this comparative example is as follows:

AFM characterizes the arithmetic mean roughness Ra = 2.5 nm of the nickel template.

The flexible nanoimprint template prepared in the example and the nickel template prepared in the comparative example were subjected to a photoacid corrosion resistance experiment. The SEM image of the original template without photoacid corrosion is shown in FIG. 8, where FIG. 8 (a) is SEM image of the original flexible nano-imprinted template etched by photoacid, Figure 8 (b) is the SEM image of the original nickel template not etched by photoacid, as can be seen from the figure, the surface of the flexible nano-imprinted template and nickel template All are smooth. After the flexible nano-imprint template and nickel template were photo-etched for 10 hours, the SEM images of the flexible nano-imprint template and nickel template were shown in FIG. 9. As can be seen from FIG. 9 (a), after photo-acid etching, The flexible nano-imprint template still maintains a smooth surface. As can be seen from Fig. 9 (b), dense corrosion pits have appeared on the surface of the nickel template after photoacid etching. Therefore, the photoacid corrosion resistance of the flexible nanoimprint template prepared in the embodiment of the present disclosure is stronger than the photoacid corrosion resistance of the nickel template.

In summary, the flexible nanoimprint template provided by the present disclosure has an arithmetic average roughness of less than 1nm, which is convenient for demolding, has good flexibility, has good mechanical properties and photoacid corrosion resistance, and uses the flexible nanoimprint provided by the present disclosure. The micro-nano pattern size of the imprint template can be less than 20nm, which can be used for nano-imprint of small size and high-precision graphics.

Claims (20)

A flexible nano-imprint template is composed of an amorphous alloy layer and a nickel base layer. The flexible nano-imprint template according to claim 1, wherein the amorphous alloy layer is prepared by a magnetron sputtering process. The flexible nano-imprint template according to claim 1 or 2, wherein the nickel base layer is prepared by electroplating the amorphous alloy layer by a plating process. The flexible nano-imprint template according to any one of claims 1-3, wherein a thickness of the amorphous alloy layer is 1 to 2 μm. The flexible nano-imprint template according to any one of claims 1-4, wherein the thickness of the nickel base layer is 100-200 μm. The flexible nano-imprint template according to any one of claims 1 to 5, wherein the amorphous alloy layer is selected from a zirconium-based amorphous alloy, a copper-based amorphous alloy, a magnesium-based amorphous alloy, and a titanium-based amorphous alloy. , Palladium-based amorphous alloy and iron-based amorphous alloy. A method for preparing a flexible nano-imprint template according to any one of claims 1-6, comprising the following steps: 1) Magnetron sputtering an amorphous alloy layer on the master template; 2) magnetron sputtering a nickel seed layer on the surface of the amorphous alloy layer obtained in step 1); 3) electroplating a nickel thickened layer on the surface of the nickel seed layer obtained in step 2) to obtain a composite template having an amorphous alloy layer and a nickel base layer; 4) The mother template is removed from the composite template obtained in step 3) to obtain the flexible nano-imprint template. The preparation method according to claim 7, wherein in step 1), the mother template is selected from one of a silicon template, a polymer sheet template, an ITO conductive glass template, an alumina template, and a quartz template. The preparation method according to claim 7 or 8, wherein in step 1), the magnetron sputtering process for preparing the amorphous alloy layer is: using a multiple alloy target for magnetron sputtering, first using a 40-60W Low-power sputtering, followed by thickening with a large current of 110-120W. The preparation method according to any one of claims 7 to 9, wherein the atmosphere of the sputtering in step 1) is Ar gas, and the pressure of the Ar gas is 0.5 to 1.0 Pa. The method according to any one of claims 7 to 10, wherein the thickness of the amorphous alloy layer is 1 to 2 μm. The preparation method according to any one of claims 7 to 11, wherein in step 2), the magnetron sputtering process parameters for preparing the nickel seed layer are: sputtering power is 200-400W, and the sputtering atmosphere It is Ar gas, and the pressure of the Ar gas is 0.5 to 1.0 Pa. The method according to claim 7, wherein the thickness of the nickel seed layer is 110-130 nm. The preparation method according to any one of claims 7 to 13, wherein in step 3), the electroplating process for preparing the nickel thickened layer is: electroplating thickening in a nickel sulfamate bath, and the electroplating The temperature is 50 to 55 ° C. The preparation method according to claim 7, wherein the nickel thickened layer is electroplated using a three-step direct current method, the first and second electroplating are performed with small current density growth, and the third electroplating is performed with High current density increases rapidly. The manufacturing method according to claim 15, wherein the current density of the first plating is 0.3 to 0.5 A / dm ² , and the plating time of the first plating is 1600 to 2000 s. The preparation method according to claim 15, wherein the current density of the second step plating is 0.7 to 0.9 A / dm ² , and the plating time of the second step plating is 1600 to 2000 s. The preparation method according to claim 15, wherein a current density of the third step plating is 0.9 to 1.2 A / dm ² , and a plating time of the third step plating is 14000 to 15000 s. The preparation method according to any one of claims 7 to 15, wherein the thickness of the nickel thickened layer is 80 to 120 μm. The preparation method according to claim 7, wherein the preparation method comprises the following steps: 1) Magnetron sputtering using a multiple alloy target, first with a low power sputtering of 40 to 60W, followed by thickening with a large current of 110 to 120W, and magnetron sputtering a layer of 1 to 2 μm on the master template Thick amorphous alloy layer; 2) The surface of the amorphous alloy layer obtained in step 1) is magnetron sputtered with a nickel seed layer having a thickness of 110 to 130 nm, wherein the sputtering power is 200 to 400 W, and the sputtering atmosphere is Ar gas. The pressure of the Ar gas is 0.5 to 1.0 Pa; 3) The surface of the nickel seed layer obtained in step 2) is electroplated with a nickel thickened layer having a thickness of 80 to 120 μm using a three-step DC method to obtain a composite template having an amorphous alloy layer and a nickel base layer, wherein, The current density of the first plating is 0.3 to 0.5 A / dm ² , the plating time of the first plating is 1600 to 2000 s, and the current density of the second plating is 0.7 to 0.9 A / dm ² , the The plating time of the second step plating is 1600 to 2000s, the current density of the third step plating is 0.9 to 1.2A / dm ² , and the plating time of the third step plating is 14000 to 15000s; 4) The mother template is removed from the composite template obtained in step 3) to obtain the flexible nano-imprint template.

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