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WO2019218337A1 - Film de phosphore à deux couches pour led - Google Patents

Film de phosphore à deux couches pour led Download PDF

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Publication number
WO2019218337A1
WO2019218337A1 PCT/CN2018/087461 CN2018087461W WO2019218337A1 WO 2019218337 A1 WO2019218337 A1 WO 2019218337A1 CN 2018087461 W CN2018087461 W CN 2018087461W WO 2019218337 A1 WO2019218337 A1 WO 2019218337A1
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WO
WIPO (PCT)
Prior art keywords
layer
phosphor
moisture barrier
microns
barrier layer
Prior art date
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Ceased
Application number
PCT/CN2018/087461
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English (en)
Inventor
Anna Ya Ching FENG
Lu Zou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Silicones Corp
DuPont Electronic Materials International LLC
Original Assignee
Rohm and Haas Electronic Materials LLC
Dow Silicones Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials LLC, Dow Silicones Corp filed Critical Rohm and Haas Electronic Materials LLC
Priority to PCT/CN2018/087461 priority Critical patent/WO2019218337A1/fr
Publication of WO2019218337A1 publication Critical patent/WO2019218337A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/18—Coatings for keeping optical surfaces clean, e.g. hydrophobic or photo-catalytic films

Definitions

  • the present invention relates to a two-layer phosphor film for LED and a method of making the same as well as a method of making LED.
  • Lamination of Phosphor film on LED chips is an innovative way to simplify LED production, which may lower total cost of the LED production and improve color quality (e.g., uniform phosphor dispersion) of the LED as produced.
  • phosphor film is sometimes not convenient in dicing, since the phosphor film, particularly, KSF phosphor film, is not hard enough.
  • KSF (K 2 SiF 6 : Mn 4+ ) phosphor is a new type of Phosphor which is approved to boost color saturations on the display.
  • some phosphor film, e.g., KSF phosphor film is not stable once it is in exposure to moisture during LED production, as KSF phosphor is sensitive to moisture.
  • An objective of an exemplary embodiment of the present invention is to overcome the above and/or other deficiencies in the prior art.
  • the inventors unexpectedly find that by applying a moisture barrier layer (e.g., a silicone layer) on the phosphor layer (e.g., KSF phosphor layer) , the dicing performance and stability of the phosphor film may be improved.
  • a moisture barrier layer e.g., a silicone layer
  • the phosphor layer e.g., KSF phosphor layer
  • an exemplary embodiment of the present invention provides a two-layer phosphor film, comprising:
  • a phosphor layer comprising a KSF phosphor layer
  • the moisture barrier layer has a transmittance of at least about 85%in visible spectrum as measured according to ASTM F1316.
  • the moisture barrier layer has a Shore hardness D from about 30 to about 100.
  • the moisture barrier layer has a thickness of about 10-200 microns.
  • the phosphor layer has a thickness from about 40-300 microns.
  • Another exemplary embodiment of the present invention provides a method of making a two-layer phosphor film, which comprises:
  • the phosphor layer comprises a KSF phosphor layer
  • the moisture barrier layer comprises a silicone layer
  • the applying comprises: spraying coating, spin coating, slit coating, or a combination thereof.
  • the method further comprises: forming the moisture barrier layer and the phosphor layer on a substrate separately before applying the moisture barrier layer on the phosphor layer,
  • the method further comprises: forming the moisture barrier layer on a substrate before applying the phosphor layer on the moisture barrier layer.
  • the phosphor layer before applying the moisture barrier layer on the phosphor layer, the phosphor layer is laminated with a LED substrate.
  • Another exemplary embodiment of the present invention provides a method of making LED, which comprises:
  • the phosphor layer comprises a KSF phosphor layer
  • the moisture barrier layer comprises a silicone layer
  • the moisture barrier layer has a transmittance of at least about 85%in visible spectrum as measured according to ASTM F1316.
  • the moisture barrier layer has a Shore hardness D from about 30 to about 100.
  • the moisture barrier layer has a thickness of about 10-200 microns.
  • the phosphor layer has a thickness from about 40-300 microns.
  • FIG. 1 is a schematic diagram showing a method for laminating a KSF phosphor film with LED substrate in the prior art.
  • FIG. 2 is a schematic diagram showing a method for making a two-layer KSF phosphor film and laminating the two-layer KSF phosphor film with LED substrate in an exemplary embodiment according to the present invention.
  • FIG. 3 is a schematic diagram showing a method for making a two-layer KSF phosphor film and laminating the two-layer KSF phosphor film with LED substrate in another exemplary embodiment according to the present invention.
  • FIG. 4 is a schematic diagram showing a method for making a two-layer KSF phosphor film and making a LED in another exemplary embodiment according to the present invention.
  • FIG. 5 is a schematic diagram showing an exemplary embodiment (Example 1) of a laminated structure of LED substrate and two-layer KSF phosphor film as made according to the present invention.
  • FIG. 6 is a schematic diagram showing an exemplary embodiment (Example 2) of a laminated structure of LED substrate and two-layer KSF phosphor film as made according to the present invention.
  • applying comprises, but not limited to, addition, coating (e.g., spray coating) , covering and etc, and it is not limited to being in direct contact or indirect contact with the objects as to be applied, not limited to partially applying or fully applying.
  • coating e.g., spray coating
  • a moisture barrier layer i.e., a silicone layer
  • the phosphor layer i.e., KSF phosphor layer
  • the dicing performance and stability of the phosphor film may be improved.
  • a thin e.g., having a thickness from 10 -200 ⁇ m
  • hard e.g., with > Shore D of 30-80
  • transparent e.g., having a transmittance of at least 85%in visible spectrum
  • silicone layer e.g., a high reflective Index optical encapsulant material commercially avaiblable from Dow Corning Corp.
  • a substrate e.g., a PET substrate
  • a KSF phosphor film is applied onto the thin, hard and transparent silicone layer, so as to provide a two-layer KSF phosphor film used for film lamination with a LED substrate.
  • the two-layer phosphor film comprises, essentially consists of or consists of: (1) a phosphor layer (i.e., KSF phosphor layer) ; and (2) a moisture barrier layer (i.e., a silicone layer) which is applied on the phosphor layer.
  • a phosphor layer i.e., KSF phosphor layer
  • a moisture barrier layer i.e., a silicone layer
  • the moisture barrier layer may be hard, and in general it may have a Shore hardness D (H D ) selected from a group consisting of: from about 30 to about 100, from about 40 to about 100, from about 50 to about 100, from about 60 to about 100, from about 70 to about 100, from about 80 to about 100, from about 90 to about 100, from about 30 to about 90, from about 40 to about 90, from about 50 to about 90, from about 60 to about 90, from about 70 to about 90, from about 80 to about 90, from about 30 to about 80, from about 40 to about 80, from about 50 to about 80, from about 60 to about 80, from about 70 to about 80, from about 30 to about 70, from about 40 to about 70, from about 50 to about 70, from about 60 to about 70, from about 30 to about 60, from about 40 to about 60, from about 50 to about 60, from about 30 to about 50, from about 40 to about 50, from about 30 to about 40 and any combinations thereof.
  • H D Shore hardness D
  • the moisture barrier layer may be thin, and in general it may have a thickness selected from a group consisting of: about 10-200 microns, about 20-200 microns, about 50-200 microns, about 80-200 microns, about 100-200 microns, about 140-200 microns, about 180-200 microns, about 10-180 microns, about 20-180 microns, about 50-180 microns, about 80-180 microns, about 100-180 microns, about 140-180 microns, about 10-140 microns, about 20-140 microns, about 50-140 microns, about 80-140 microns, about 100-140 microns, about 10-100 microns, about 20-100 microns, about 50-100 microns, about 80-100 microns, about 10-80 microns, about 20-80 microns, about 50-80 microns, about 10-50 microns, about 20-50 microns, about 10-50 microns, and any combinations thereof.
  • the thickness of the moisture barrier layer is less than 10 microns, it would not provide desired dicing preformance and would not prevent moisture from the phosphor layer enough.
  • the thickness of the moisture barrier layer may be greater than 200 microns, it would greatly increase thickness of the final LED device, thereby waste valuable space as desired.
  • the moisture barrier layer is a high reflective index optical material, which may generally have a transmittance of at least about 85%in visible spectrum as measured according to ASTM F1316. In some embodiments, the moisture barrier layer has a transmittance of at least about 85%, about 90%, about 95%, about 97%and even 100%, in visible spectrum as measured according to ASTM F1316.
  • the moisture barrier layer may be made of a silicone composition (i.e., a silicone layer in two-layer phosphor film) .
  • the silicone composition may comprise one or more of silicones and optionally a cure catalyst, or a hydrosilylation curable organosiloxane composition.
  • the silicones may be selected from any silicones known in the art to form organosiloxane copolymer.
  • the silicones may be solved in an organic solvent.
  • the silicones may be those as described in WO 2013/134018, which is incorporated by reference as if fully set forth herein.
  • the silicones comprise Dow LF-1020 Phosphor Film Binder (commercially available from DOW CORNING CORPORATION) .
  • the cure catalyst may be selected from any catalyst known in the art to effect condensation cure of organosiloxanes, such as various tin or titanium catalysts.
  • Examples include, but are not limited to basic compounds, such as trimethylbenzylammonium hydroxide, tetramethylammonium hydroxide, n-hexylamine, tributylamine, diazabicycloundecene (DBU) and dicyandiamide; and metal-containing compounds such as tetraisopropyl titanate, tetrabutyl titanate, titanium acetylacetonate, aluminum triisobutoxide, aluminum triisopropoxide, zirconium tetra (acetylacetonato) , zirconium tetrabutylate, cobalt octylate, cobalt acetylacetonato, iron acetylacetonato, tin acetylacetonato, dibutyltin octylate, dibutyltin laurate, zinc octylate, zinc bezoate, zinc p-tert-but
  • the curing catalysts include zinc octylate, zinc bezoate, zinc p-tert-butylbenzoate, zinc laurate, zinc stearate, aluminium phosphate, and aluminum triisopropoxide. See, e.g., U.S. Patent No. 8,193,269, the entire disclosure of which is incorporated by reference as if fully set forth herein.
  • curing catalysts include, but are not limited to aluminum alkoxides, antimony alkoxides, barium alkoxides, boron alkoxides, calcium alkoxides, cerium alkoxides, erbium alkoxides, gallium alkoxides, silicon alkoxides, germanium alkoxides, hafnium alkoxides, indium alkoxides, iron alkoxides, lanthanum alkoxides, magnesium alkoxides, neodymium alkoxides, samarium alkoxides, strontium alkoxides, tantalum alkoxides, titanium alkoxides, tin alkoxides, vanadium alkoxide oxides, yttrium alkoxides, zinc alkoxides, zirconium alkoxides, titanium or zirconium compounds, especially titanium and zirconium alkoxides, and chel
  • Double metal alkoxides are alkoxides containing two different metals in a particular ratio.
  • the curing catalysts include titanium tetraethylate, titanium tetrapropylate, titanium tetraisopropylate, titanium tetrabutylate, titanium tetraisooctylate, titanium isopropylate tristearoylate, titanium truisopropylate stearoylate, titanium diisopropylate distearoylate, zirconium tetrapropylate, zirconium tetraisopropylate, zirconium tetrabutylate. See, e.g., U.S. Patent No.
  • the curing catalysts include titanates, zirconates and hafnates as described in DE 4427528 C2 and EP 0 639 622 B1, both of which are incorporated by reference as if fully set forth herein.
  • the curing catalyst comprises Dow LF-9000 Film Encapsulant Catalyst (commercially available from DOW CORNING CORPORATION) .
  • treatment agent is used when handling specific phosphors like red one and etc.
  • Treatment agent is similar with catalyst in effective composition while it is around 2-10 times higher concentration.
  • the silicones may comprise a hydrosilylation curable organosiloxane composition.
  • the hydrosilylation curable organosiloxane composition comprises Dow LF-1112 Phosphor Film Binder A&B Kit (commercially available from DOW CORNING CORPORATION) and etc.
  • the hydrosilylation curable organosiloxane composition may be those as described in WO 2016/022332A1, which is incorporated by reference as if fully set forth herein.
  • the phosphor comprises a KSF phosphor such as K 2 SiF 6 : Mn 4+ , however, the phosphor may further comprise any phosphor known in the art. Examples thereof include, but are not limited to, YAG 04 phosphor (commercially available from Intematix Corporation) , NYAG4454-L phosphor (commercially available from Intematix Corporation) , BR-102L Phosphor (commercially available from Mitsubishi Chemical Corporation) , GAL 550 Phosphor (commercially available from Intematix Corporation) or any combinations thereof.
  • the phosphor layer may have a thickness selected from a group consisting of: about 40-300 microns, about 40-250 microns, about 40-200 microns, about 40-150 microns, about 40-100 microns, about 40-80 microns, about 40-50 microns, about 40-300 microns, about 40-250 microns, about 40-200 microns, about 40-150 microns, about 40-100 microns, about 40-80 microns, about 40-50 microns, about 50-300 microns, about 50-250 microns, about 50-200 microns, about 50-150 microns, about 50-100 microns, about 50-80 microns, about 50-50 microns, about 50-300 microns, about 50-250 microns, about 50-200 microns, about 50-150 microns, about 50-100 microns, about 50-80 microns, about 50-50 microns, about 50-300 microns, about 50-250 microns
  • the phosphor may be pre-treated with a treatment agent, particularly when red or green phosphor is involved in phosphor layer.
  • the treatment agent is identical to the cure catalyst as used.
  • the pre-treatment method comprises: (1) contacting the phosphor with treatment agent for a period time so as to ensure a good dispersion of phosphor in the treatment agent; and (2) drying the phosphor coated with the treatment agent, which is ready to be used with the silicone binder.
  • Phosphor pre-treatment is one way to lower down the impact of phosphor on silicone binder cure performance.
  • the pre-treatment method comprises:
  • the method of making a two-layer phosphor film may comprise: (1) applying a phosphor layer on a moisture barrier layer, so as to provide the two-layer phosphor film.
  • the method may further comprise: before step (1) , applying the moisture barrier layer on a substrate, for example, a PET substrate.
  • the two-layer phosphor film may be laminated with a LED substrate.
  • the LED substrate may comprise walls between the LEDs on the substrate, and said walls are utilized to separate the LEDs and fill the voids between the LEDs. As to those LED substrates with said walls, the phosphor layer is more easy to be laminated with them.
  • a thin (e.g., a thickness of 20-100 ⁇ m) , hard (> Shore D 50-60) and transparent silicone composition is coated on a PET substrate, so as to form a transparent silicone layer.
  • a KSF phosphor layer e.g., a thickness of 50-200 ⁇ m is coated on the transparent silicone layer with a PET substrate, so as to form a two-layer KSF phosphor film.
  • the two-layer KSF phosphor film may be laminated with a LED substrate, subsequently, so as to form a LED device, with KSF phosphor layer facing with the LED substrate and the transparent silicone layer (and a PET substrate, if any) facing away from LED substrate.
  • the method of making a two-layer phosphor film may comprise: (1) applying a moisture barrier layer on a phosphor layer, so as to provide the two-layer phosphor film; or applying a phosphor layer on a moisture barrier layer, so as to provide the two-layer phosphor film.
  • the method may further comprise: before step (1) , forming the moisture barrier layer and the phosphor layer on a substrate, for example, a PET substrate, separately.
  • the two-layer phosphor film may be laminated with a LED substrate, similar to above said.
  • the phosphor layer and moisture barrier layer may be successively stacked on a LED substrate, with the phosphor layer being sandwiched between the moisture barrier layer and the LED substrate, after the PET substrates are peeled off.
  • the LED substrate may comprise walls between the LEDs on the substrate, and said walls are utilized to separate the LEDs and fill the voids between the LEDs.
  • the phosphor layer is more easy to be laminated with them.
  • the phosphor layer should be filled into the voids between the LEDs. In this circumstance, it may require 1-3 layers of phosphor layers to be laminated, which depends on phosphor layer thickness and LED’s height.
  • a thin (e.g., a thickness of 2-100 ⁇ m) , hard (> Shore D 50-60) and transparent silicone composition is coated on a PET substrate, so as to form a transparent silicone layer.
  • a KSF phosphor layer e.g., a thickness of 50-200 ⁇ m
  • the PET substrates are peeled off before they are stacked on the LED substrate.
  • the transparent silicone layer, KSF phosphor layer and PET substrates are laminted to provide a LED device, the KSF phosphor layer being sandwiched between the transparent silicone layer and the LED substrate.
  • an unique pathway is to prepare a KSF phosphor layer and a transparent silicone layer, separately.
  • two layers are stacked together on the LED substrate for sequentiall lamination.
  • it may form a more uniform phosphor layer, since it is more difficult to control thickness uniformityof a second layer (i.e., a phosphor film applied on the moisture barrier layer) , when it is coated on a first layer (i.e., a moisture barrier layer) , as shown in Fig. 2.
  • the method of making a two-layer phosphor film may comprise: (1) applying a moisture barrier layer on a phosphor layer, so as to provide the two-layer phosphor film.
  • the method may further comprise: before step (1) , a phosphor layer has already been laminated on a LED substrate.
  • the phosphor layer may be applied on a substrate, for example, a PET substrate. Before lamination, the phosphor layer, together with or without the PET substrate, is disposed on the LED substrate. Of course, the PET substrate must be peeled off before the moisture barrier layer is applied on the phosphor layer.
  • the moisture barrier layer is spray coated or spin coated on the phosphor layer.
  • the LED substrate may comprise walls between the LEDs on the substrate, and said walls are utilized to separate the LEDs and fill the voids between the LEDs.
  • the phosphor layer is more easy to be laminated with them.
  • the phosphor layer should be filled into the voids between the LEDs. In this circumstance, it may require 1-3 layers of phosphor layers to be laminated, which depends on phosphor layer thickness and LED’s height.
  • a KSF phosphor layer (e.g., a thickness of 50-200 ⁇ m) is coated on a PET substrate, so as to form a KSF phosphor layer. Together with the PET substrate, the KSF phosphor layer is disposed on a LED substrate. After lamination with the LED substrate, the PET substrate is peeled off. Through spray coating, spin coating, slit coating, or a combination thereof, a thin (e.g., a thickness of 20-100 ⁇ m) , hard (> Shore D 50-60) and transparent silicone composition is applyed on a PET substrate, so as to form a transparent silicone layer. The transparent silicone layer, KSF phosphor layer and PET substrates are laminted to provide a LED device, with the KSF phosphor layer being sandwiched between the transparent silicone layer and the LED substrate.
  • a thin e.g., a thickness of 20-100 ⁇ m
  • hard > Shore D 50-60
  • an unique pathway is that: a KSF phosphor layer is first laminated with a LED substrate and then a second layer of transparent silicone layer is coated on the KSF phosphor layer.
  • the KSF phosphor layer and transparent silicone layer are coated firstly and then laminated with the LED substrate in one step.
  • the inventors find that the methods as shown in Figs. 2-4 may utilize any hard, high transpatent moisture barrier layer, not limited to a thin, hard and transparent silicone barrier layer. Also, the methods as shown in Figs. 2-4 utilizing the KSF phosphor layer may be extended to other phosphor layers for dicing performance improvement.
  • the method of making LED may comprise: laminating the two-layer phosphor film as described above or the two-layer phosphor film as made according to the above methods together with a LED substrate using above mentioned methods or any other methods known by those skilled in the art.
  • the method of making LED comprises: (1) laminating a phosphor layer with a LED Substrate; and (2) applying a moisture barrier layer to the phosphor layer.
  • the moisture barrier layer comprises a silicone layer as described above.
  • the phosphor layer comprises a KSF phosphor layer.
  • the moisture barrier layer has a transmittance of at least 85%or those as described above in visible spectrum as measured according to ASTM F1316; the moisture barrier layer has a Shore hardness D from 30 to 100 or those as described above; and the moisture barrier layer has a thickness of 10-200 microns or those as described above. In some embodiments, the phosphor layer has a thickness from 40-300 microns or those as described above.
  • said thin, hard and transparent silicone layers may improve dicing performance (Easy for dicing) of a KSF phosphor film layer, and improve stability of a KSF phosphor film.
  • silicone layer is not best in moisture barrier, but it is still much better than a KSF phosphor film without a silicone layer (i.e., being direct exposure to moisture) .
  • Ranges can be expressed herein as from “about” one particular value, and/or to “about” another particular value. When such a range is expressed, examples include from the one particular value and/or to the other particular value. Similarly, when values are expressed as approximations, by use of the antecedent “about, ” it will be understood that the particular value forms another aspect. It will be further understood that the endpoints of each of the ranges are significant both in relation to the other endpoint, and independently of the other endpoint.
  • a transparent silicone layer is formed by applying a silicone composition (trade name: Dow OE-7662 Optical Encapsulant, commercially available from DOW CORNING CORPORATION) onto a PET substrate or release liner.
  • a silicone composition trade name: Dow OE-7662 Optical Encapsulant, commercially available from DOW CORNING CORPORATION
  • the transparent silicone layer has a transmittance of 93%in visible spectrum as measured according to ASTM F1316, a Shore hardness D of 80, and a thickness of 57 microns.
  • Silicone binder 1 Dow LF-1112 Phosphor Film Binder Part A + Part B (1: 1) , 5g, commercially available from DOW CORNING CORPORATION;
  • Phosphor 1 KSF Phosphor 680F, commercially available from Intematix Corporation..
  • the ratio of Silicone binder 1 to Phosphor 1 is 100: 75.
  • the KSF phosphor layer as prepared is first attached onto a LED substrate, and then the transparent silicone layer (OE-7662 layer) is attached onto the KSF phosphor layer.
  • the LED substrate, KSF phosphor layer and transparent silicone layer are laminated with the following conditions:
  • the laminated structures as prepared in above Section 1.3 is cured at 120°C for 1 hour and then at 160°C for 2 hours, so as to provide a LED device.
  • KSF phosphor layer and transparent silicone layer are successfully laminated on LED substrate in one step film lamination, which exhibits uniform phosphor dispersion and better color quality. Also, Fig. 5 shows that the LED device comprising KSF phosphor layer and transparent silicone layer may exhibit excellent dicing performance and good stability.
  • Silicone binder 1 Dow LF-1112 Phosphor Film Binder Part A + Part B (1: 1) , 5g, commercially available from DOW CORNING CORPORATION;
  • Phosphor 1 KSF Phosphor 680F, commercially available from Intematix Corporation..
  • the ratio of Silicone binder 1 to Phosphor 1 is 100: 75.
  • the KSF phosphor layer as prepared, together with the PET release liner, is first attached onto a LED substrate, and then the PET release liner is peeled off.
  • the LED substrate and KSF phosphor layer are laminated with the following conditions:
  • a transparent silicone layer is formed by spin coating a silicone composition (trade name: Dow OE-7662 Optical Encapsulant, commercially available from DOW CORNING CORPORATION) onto the KSF phosphor layer of the laminated structure as prepared in above Section 2.2.
  • a silicone composition trade name: Dow OE-7662 Optical Encapsulant, commercially available from DOW CORNING CORPORATION
  • the spin coating is conducted according to the following conditions: using SAN-YAN SYSC-100A spin coating equipment, increasing the speed of spin coating in 2 seconds from 0 to 1500 rpm and then keeping for 1 minute.
  • the laminated structures as prepared in above Section 2.3 is cured at 80°C for 1 hour, at 120°C for 1 hour and then at 160°C for 2 hours, so as to provide a LED device.
  • the transparent silicone layer has a transmittance of 93%in visible spectrum as measured according to ASTM F1316, a Shore hardness D of 70, and a thickness of 49 microns.
  • KSF phosphor layer is successfully laminated on LED substrate, and then transparent silicone layer are spin coated on the KSF phosphor layer before curing.
  • the laminated structure as prepared exhibits uniform phosphor dispersion and better color quality.
  • Fig. 6 shows that the LED device comprising KSF phosphor layer and transparent silicone layer may exhibit excellent dicing performance and good stability.

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Laminated Bodies (AREA)
  • Led Device Packages (AREA)

Abstract

L'invention se rapporte à un nouveau film de phosphore à deux couches qui comprend : (1) une couche de phosphore incluant une couche de phosphore KSF ; et (2) une couche barrière contre l'humidité appliquée sur la couche de phosphore, la couche barrière contre l'humidité comportant une couche de silicone. L'invention a trait également à un procédé de fabrication du film de phosphore. Ledit film de phosphore à deux couches présente de bonnes performances de découpage en dés et une grande stabilité. Le coût total du procédé de fabrication du film de phosphore est moindre et son efficacité est élevée.
PCT/CN2018/087461 2018-05-18 2018-05-18 Film de phosphore à deux couches pour led Ceased WO2019218337A1 (fr)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN205193308U (zh) * 2015-10-22 2016-04-27 河南众一光电科技有限公司 一种2.5D ogs-3D高清防蓝光膜
JP2017090625A (ja) * 2015-11-09 2017-05-25 日本碍子株式会社 光学部品及びその製造方法
WO2017094832A1 (fr) * 2015-12-04 2017-06-08 東レ株式会社 Feuille fluorescente, élément électroluminescent utilisant celle-ci, unité de source de lumière, affichage et procédé de production d'élément électroluminescent
CN106950632A (zh) * 2017-05-26 2017-07-14 深圳市国显科技有限公司 一种量子点滤蓝光膜及其显示器
JP2017134254A (ja) * 2016-01-28 2017-08-03 凸版印刷株式会社 波長変換シート用保護フィルム
CN107430303A (zh) * 2015-04-02 2017-12-01 凸版印刷株式会社 量子点保护膜以及使用其而得到的波长变换片及背光单元

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107430303A (zh) * 2015-04-02 2017-12-01 凸版印刷株式会社 量子点保护膜以及使用其而得到的波长变换片及背光单元
CN205193308U (zh) * 2015-10-22 2016-04-27 河南众一光电科技有限公司 一种2.5D ogs-3D高清防蓝光膜
JP2017090625A (ja) * 2015-11-09 2017-05-25 日本碍子株式会社 光学部品及びその製造方法
WO2017094832A1 (fr) * 2015-12-04 2017-06-08 東レ株式会社 Feuille fluorescente, élément électroluminescent utilisant celle-ci, unité de source de lumière, affichage et procédé de production d'élément électroluminescent
JP2017134254A (ja) * 2016-01-28 2017-08-03 凸版印刷株式会社 波長変換シート用保護フィルム
CN106950632A (zh) * 2017-05-26 2017-07-14 深圳市国显科技有限公司 一种量子点滤蓝光膜及其显示器

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