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WO2019128645A1 - 电子组件及电子设备 - Google Patents

电子组件及电子设备 Download PDF

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Publication number
WO2019128645A1
WO2019128645A1 PCT/CN2018/119164 CN2018119164W WO2019128645A1 WO 2019128645 A1 WO2019128645 A1 WO 2019128645A1 CN 2018119164 W CN2018119164 W CN 2018119164W WO 2019128645 A1 WO2019128645 A1 WO 2019128645A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
receiver
electronic device
electronic component
display area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2018/119164
Other languages
English (en)
French (fr)
Inventor
任志国
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Oppo Mobile Telecommunications Corp Ltd
Original Assignee
Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong Oppo Mobile Telecommunications Corp Ltd filed Critical Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority to EP18894752.7A priority Critical patent/EP3734939B1/en
Priority to US16/756,331 priority patent/US11057507B2/en
Publication of WO2019128645A1 publication Critical patent/WO2019128645A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/22—Illumination; Arrangements for improving the visibility of characters on dials
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/3827—Portable transceivers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0274—Details of the structure or mounting of specific components for an electrical connector module
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0206—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings
    • H04M1/0208—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings characterized by the relative motions of the body parts
    • H04M1/0235—Slidable or telescopic telephones, i.e. with a relative translation movement of the body parts; Telephones using a combination of translation and other relative motions of the body parts
    • H04M1/0237—Sliding mechanism with one degree of freedom
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M2250/00—Details of telephonic subscriber devices
    • H04M2250/12—Details of telephonic subscriber devices including a sensor for measuring a physical value, e.g. temperature or motion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector

Definitions

  • the present application relates to the field of electronic devices, and in particular, to an electronic component and an electronic device.
  • the present application provides an electronic component and an electronic device with high space utilization.
  • An embodiment of the present application provides an electronic component including a receiver, a first circuit board, a flash, a second circuit board, and a sensor, the first circuit board including opposite first and second faces, the receiver is configured The first circuit board is electrically connected to the first circuit board, the flash is disposed on the second surface and electrically connected to the first circuit board, and the second circuit board is disposed on the receiver away from the On one side of the first circuit board, the sensor is disposed on a side of the second circuit board away from the receiver and electrically connected to the second circuit board.
  • an embodiment of the present application further provides an electronic device including the above electronic component.
  • an embodiment of the present application further provides an electronic device including a sensor, a receiver, a flash, and a display screen, wherein the sensor, the receiver, and the flash are stacked in a thickness direction of the display screen, A recess is provided at the edge of the display screen, and the sensor and the receiver at least partially face the recess.
  • FIG. 1 is a schematic diagram of an electronic device provided by an embodiment of the present application.
  • FIG. 2 is a schematic illustration of the electronic components of the electronic device of Figure 1;
  • FIG. 3 is a schematic illustration of another angle of the electronic component of Figure 2;
  • Figure 4 is an exploded view of the electronic component shown in Figure 2;
  • Figure 5 is a schematic view of a first circuit board of the electronic component shown in Figure 2;
  • Figure 6 is a schematic view of a further angle of the electronic component shown in Figure 2;
  • Figure 7 is a cross-sectional view of the electronic component of Figure 6 taken along line A-A;
  • Figure 8 is a schematic view showing the positional relationship of the receiver, the flash lamp and the first circuit board of the electronic component shown in Figure 2;
  • FIG. 9 is a schematic view of the first circuit board of the electronic component shown in FIG. 2 mated with the bracket;
  • FIG. 10 is a schematic view of the electronic component of the electronic device shown in FIG. 1 mated with a main circuit board;
  • Figure 11 is a schematic view of another angle of the structure shown in Figure 10;
  • FIG. 12 is a schematic diagram showing a positional relationship between a receiver, a sensor, and a second circuit board of the electronic component shown in FIG. 2;
  • FIG. 13 is a schematic view showing another positional relationship of the receiver, the sensor, and the second circuit board of the electronic component shown in FIG. 2;
  • FIG. 14 is a schematic diagram showing still another positional relationship of the receiver, the sensor, and the second circuit board of the electronic component shown in FIG. 2;
  • Figure 15 is a schematic illustration of another electronic component of the electronic device of Figure 1;
  • Figure 16 is a schematic view showing a portion of the structure of the electronic component shown in Figure 15 taken along line B-B;
  • FIG. 17 is a schematic diagram of still another electronic component of the electronic device shown in FIG. 1;
  • Figure 18 is a schematic view showing a portion of the structure of the electronic component shown in Figure 17 taken along line C-C;
  • Figure 19 is a cross-sectional view of the electronic component of Figure 6 taken along line D-D;
  • Figure 20 is a schematic view showing still another angle of the structure shown in Figure 10;
  • FIG. 21 is a schematic diagram of a display module of the electronic device shown in FIG. 1 mated with an electronic component;
  • FIG. 22 is a schematic diagram of a display screen of the electronic device shown in FIG. 1 mated with an electronic device;
  • Figure 23 is a cross-sectional view showing a portion of the structure of the electronic component shown in Figure 1 taken along line E-E;
  • Figure 24 is a cross-sectional view showing a portion of the structure of the electronic component shown in Figure 1 taken along line F-F.
  • an embodiment of the present application provides an electronic component 100 .
  • the electronic component 100 can be applied to the electronic device 200.
  • the electronic device 200 may be a smart device such as a tablet computer, a mobile phone, a camera, a personal computer, a notebook computer, an in-vehicle device, or a wearable device.
  • the embodiment of the present application is defined by referring to the viewing angle shown in FIG. 1 of the electronic device 200.
  • the width direction of the electronic device 200 is shown by the X direction in FIG. 1 , and the length direction of the electronic device 200 is shown.
  • the thickness direction of the electronic device 200 is as shown in the Z direction in FIG.
  • the electronic component 100 includes a receiver 1, a first circuit board 2, a flash 3, a second circuit board 4, and a sensor 5.
  • the first circuit board 2 includes opposite first and second faces 2a, 2b.
  • the receiver 1 is disposed on the first surface 2a and electrically connected to the first circuit board 2.
  • the flash lamp 3 is disposed on the second surface 2b and electrically connected to the first circuit board 2.
  • the second circuit board 4 is disposed on a side of the receiver 1 away from the first circuit board 2.
  • the sensor 5 is disposed on a side of the second circuit board 4 away from the receiver 1 and electrically connected to the second circuit board 4.
  • the receiver 1, the first circuit board 2, the flash 3, the second circuit board 4, and the sensor 5 are sequentially stacked so that the components of the electronic component 100 are interposed.
  • Compact layout and high space utilization When the electronic component 100 is applied to the electronic device 200, since the components in the electronic component 100 are relatively compact, the space occupied by the electronic component 100 inside the electronic device 200 is small, and the electronic device 200 is small. It is possible to arrange more other electronic devices in its internal space, so that the space utilization of the electronic device 200 is higher, and the functions of the electronic device 200 are more diverse.
  • the receiver 1, the first circuit board 2, the flash unit 3, the second circuit board 4, and the sensor 5 may be stacked in the thickness direction Z of the electronic device 200 in order to enable The size in the width direction X and the length direction Y of the electronic device 200 occupied by the electronic component 100 is reduced.
  • the first circuit board 2 is a flexible circuit board.
  • the first circuit board 2 includes opposing first and second portions 21 and 22 and a third portion 23 that is bent between the first portion 21 and the second portion 22.
  • the first face 2a is a surface of the first portion 21 away from the second portion 22.
  • the receiver 1 is electrically connected to the first portion 21.
  • the second face 2b is a surface of the second portion 22 away from the first portion 21.
  • the flasher 3 is electrically connected to the second portion 22.
  • the first portion 21 is parallel to the second portion 22.
  • the area D1 of the orthographic projection of the flash lamp 3 on the first portion 21 is located in the area D2 of the orthographic projection of the receiver 1 on the first portion 21.
  • the flash lamp 3 is completely superposed on the receiver 1, and the size in the width direction X or the length direction Y of the electronic device 200 occupied by the electronic component 100 can be further reduced.
  • the electronic component 100 further includes a bracket 6.
  • the bracket 6 includes a carrier portion 61 and a leg 62 that connects the carrier portion 61.
  • the legs 62 are used to achieve positioning.
  • the carrier portion 61 is located between the first portion 21 and the second portion 22.
  • the bracket 6 is fixed relative to the main circuit board 7 , and the bearing portion is fixed.
  • the first portion 21 and the second portion 22 are carried by 61.
  • the number of the legs 62 may be multiple.
  • the remaining legs 62 may also be fixed to the housing (such as the middle frame) of the electronic device 200.
  • the stability of the bracket 6 is increased to make the electronic component 100 more stable.
  • the first portion 21 is provided with a first reinforcing plate (not shown) facing the surface of the second portion 22, and the second portion 22 faces one of the first portions 21.
  • a second reinforcing plate is provided on the side. The arrangement of the first reinforcing plate facilitates the electrical connection of the receiver 1 with the first portion 21. The arrangement of the second reinforcing plate enables the flash lamp 3 to be stably and firmly welded and fixed to the second portion 22.
  • the first circuit board 2 further includes a fourth portion 24.
  • the fourth portion 24 is coupled to a side of the second portion 22 that is away from the third portion 23.
  • the fourth portion 24 is staggered from the receiver 1. In other words, the fourth portion 24 does not overlap with the receiver 1, and the fourth portion 24 extends from the second portion 22 to be connected to other components in the electronic device 200 (such as the main circuit board 7). ).
  • the fourth portion 24 is provided with an electrical connector 8 away from the end of the second portion 22, and the first circuit board 2 is electrically connected to the main circuit board 7 via the electrical connector 8.
  • the receiver 1 is electrically connected to the main circuit board 7 via the first portion 21, the third portion 23, the second portion 22, the fourth portion 24, and the electrical connector 8 to implement Signal transmission.
  • the flash lamp 3 is electrically connected to the main circuit board 7 via the second portion 22, the fourth portion 24, and the electrical connector 8 to effect signal transmission.
  • the receiver 1 and the flash unit 3 are electrically connected to the first circuit board 2 and the electrical connector 8 to the main circuit board 7, thereby saving the electronic component.
  • the material of 100 makes the cost of the electronic component 100 low.
  • the area D3 of the orthographic projection of the sensor 5 on the second circuit board 4 is located in the area of the orthographic projection of the receiver 1 on the second circuit board 4. D4.
  • the sensor 5 is completely overlapped on the receiver 1 , and the sensor 5 and the flash lamp 3 are completely overlapped on opposite sides of the receiver 1 , and the electronic component 100 can be further reduced.
  • the orthographic projection area D3 of the sensor 5 on the second circuit board 4 and the orthographic projection of the receiver 1 on the second circuit board 4 The area D4 is partially overlapped; or, as shown in FIG. 14, the orthographic projection area D3 of the sensor 5 on the second circuit board 4 and the orthographic projection of the receiver 1 on the second circuit board 4
  • the areas D4 are staggered from each other, and so on.
  • the receiver 1 is substantially rectangular, and the intermediate portion of the receiver 1 is the vibrating portion 11.
  • the vibrating portion 11 is generally hermetically connected to other members or structural members to form a vibrating cavity, and the acoustic wave generated by the vibrating portion 11 can be propagated by opening on the member or the structural member.
  • the receiver 1 propagates a sound signal through a sound channel, which corresponds to a structure that is a passage from the vibrating portion 11 to the opening between the member or the structural member.
  • the sealed vibration chamber vibrates, and the sound signal passes through the opening in the component or the structural member.
  • the sound channel of the receiver 1 has various forms, for example:
  • the second circuit board 4 partially covers and hermetically connects the receiver 1.
  • the electronic component 100 further includes a seal 9 spliced with the second circuit board 4.
  • the seal 9 covers and seals the remaining portion of the receiver 1.
  • the sealing member 9 defines a receiving hole 91 to form a sound passage 12 between the vibrating portion 11 of the receiver 1 and the receiving hole 91 of the sealing member 9.
  • the sealing member 9 and the second circuit board 4 together seal the receiver 1 to form a vibration cavity, and the sealing member 9 defines a receiving hole 91, and the sound signal emitted by the receiver 1 is The receiving hole 91 of the sealing member 9 is transmitted.
  • the sealing member 9 is a rectangular foam.
  • the seal 9 can absorb manufacturing tolerances and assembly tolerances of the electronic component 100.
  • the sealing member 9 may also be a reinforcing plate made of metal or plastic.
  • the orthographic projection of the vibrating portion 11 on the sealing member 9 at least partially covers the receiving hole 91 of the sealing member 9, so that the receiving hole 91 of the sealing member 9 can output a sound signal better.
  • the electronic component 100 further includes a seal 9 that covers and sealably connects the receiver 1.
  • the seal 9 has a first seal portion 92 and a second seal portion 93 that are sequentially connected.
  • the first sealing portion 92 and the second sealing portion 93 are arranged side by side.
  • the thickness of the second sealing portion 93 is greater than the thickness of the first sealing portion 92.
  • the second circuit board 4 is laminated on the first sealing portion 92.
  • the second circuit board 4 is located on a side of the first sealing portion 92 away from the receiver 1.
  • the second sealing portion 93 defines a receiving hole to form a sound passage between the vibrating portion 11 of the receiver 1 and the receiving hole 91 of the sealing member 9.
  • the thickness of the second sealing portion 93 is greater than the thickness of the first sealing portion 92, so that the second sealing portion 93 forms a step with the first sealing portion 92, and the second circuit board 4 is disposed at the Said the steps.
  • the sealing member 9 can also be a flat plate-like structure.
  • the sealing member 9 is provided to seal the receiver 1 to form a sound chamber, the electronic component 100 can be prevented from being overly dependent on the structure of the second circuit board 4 to perform the receiver 1 on the receiver 1. Carrying and sealing further optimizes the structure of the electronic component 100.
  • the size of the second circuit board 4 is substantially the same as the size of the sensor 5, that is, the space of the second circuit board 4 is not too large, and the space in the electronic device 200 is not occupied.
  • the sensor 5 is preferably carried on the second circuit board 4, ie the second circuit board 4 entirely covers the sensor 5.
  • the orthographic projection of the vibrating portion 11 on the sealing member 9 at least partially covers the receiving hole 91 of the sealing member 9, so that the receiving hole 91 of the sealing member 9 can output a sound signal better.
  • the second circuit board 4 covers and hermetically connects the receiver 1.
  • the second circuit board 4 seals the receiver 1 to form a vibration chamber.
  • the second circuit board 4 defines a receiving hole 41 to form a sound channel 12 between the vibrating portion 11 of the receiver 1 and the receiving hole 41 of the second circuit board 4.
  • the sound channel 12 of the receiver 1 passes over or through the second circuit board 4 to the outside, so that after the receiver 1 converts the audio signal into a sound signal, the sound signal can be propagated through the sound channel 12 to external.
  • the second circuit board 4 as a carrier for stacking the sensor 5 and the receiver 1 together as part of the sound channel 12 of the receiver 1 reduces the The device component of the electronic component 100 makes the electronic component 100 more compact, saves the size of the electronic component 100 in the thickness direction Z of the electronic device 200, and improves space utilization.
  • the second circuit board 4 and the receiver 1 are connected (for example, bonded) by a foam 42.
  • the foam 42 has a hollow annular shape and is disposed on a side of the second circuit board 4 facing the receiver 1.
  • the foam 42 is just enclosed at the edge of the vibrating portion 11 of the receiver 1, such that the vibrating portion 11 of the receiver 1 after the second circuit board 4 is sealingly connected to the receiver 1
  • the cavity formed between the second circuit board 4 is part of the sound channel 12 of the receiver 1.
  • the second circuit board 4 and the receiver 1 can also be sealed and connected by various means such as welding or gluing.
  • the orthographic projection of the vibrating portion 11 on the second circuit board 4 at least partially covers the receiving hole 41 of the second circuit board 4, so that the receiving hole 41 of the second circuit board 4 can be further Output sound signals well.
  • the second circuit board 4 is a flexible circuit board.
  • the second circuit board 4 includes a sealing portion 43 and a connecting portion 44.
  • the sealing portion 43 is sealingly connected to the receiver 1.
  • the connecting portion 44 is connected to one side of the sealing portion 43.
  • the connecting portion 44 is arranged in a staggered manner with the receiver 1. In other words, the connecting portion 44 does not overlap with the receiver 1, and the connecting portion 44 extends from the sealing portion 43 to be connected to other components (such as the main circuit board 7) in the electronic device 200.
  • the sensor 5 is electrically connected to the main circuit board 7 via the sealing portion 43 and the connecting portion 44 to effect signal transmission.
  • a pad 441 is disposed at an end of the connecting portion 44 away from the sealing portion 43.
  • the main circuit board 7 is provided with a resilient piece 442.
  • the elastic piece 442 abuts the pad 441 for electrical connection.
  • the connecting portion 44 can also be electrically connected to the main circuit board 7 through an electrical connector.
  • the senor 5 includes at least one of a distance sensor, a light sensor, or a photoelectric sensor.
  • the sensor 5 is a light sensor.
  • the light sensor is disposed proximate to the screen of the electronic device 200 to facilitate adjusting the brightness of the screen of the electronic device 200 according to the light of the environment in which the electronic device 200 is located.
  • the medium sensed by the light sensor is light, and the electronic device 200 does not need to be specially drilled or provided with a special structure to pass the light, and the sensor 5 in the electronic component 100 is set as a light sensor, and the receiver 1 stacking in the thickness direction Z of the electronic device 200 further optimizes the structure of the electronic device 200, so that the space utilization of the electronic device 200 is high, which is advantageous for reducing the width of the electronic device 200.
  • the dimension in the direction X and the length direction Y is light, and the electronic device 200 does not need to be specially drilled or provided with a special structure to pass the light, and the sensor 5 in the electronic component 100 is set as a light sensor, and the receiver 1 stacking in the thickness direction Z of the electronic device 200 further optimizes the structure of the electronic device 200, so that the space utilization of the electronic device 200 is high, which is advantageous for reducing the width of the electronic device 200.
  • the dimension in the direction X and the length direction Y is light, and the electronic device 200 does not need to be specially drilled or provided
  • the main circuit board 7 and the receiver 1 are arranged in the longitudinal direction Y of the electronic device 200, and the receiver 1 is opposite to the main body.
  • the circuit board 7 is near the top of the electronic device 200.
  • the fourth portion 24 of the first circuit board 2 extends along the length direction Y of the electronic device 200 to be connected to the back surface 71 of the main circuit board 7.
  • the connecting portion 44 of the second circuit board 4 extends along the length direction Y of the electronic device 200 to be connected to the front surface 72 of the main circuit board 7.
  • the sensor 5 is located on a side of the second circuit board 4 where the sealing portion 43 is away from the connecting portion 44.
  • the receiving hole 41 is opened on a side of the sealing portion 43 away from the connecting portion 44.
  • the sensor 5 and the receiving hole 41 are sequentially arranged in the width direction X of the electronic device 200.
  • an embodiment of the present application provides an electronic device 200 .
  • the electronic device 200 includes the electronic component 100 described above.
  • the electronic component 100 is received in the electronic device 200 to implement functions such as receiving the electronic device 200.
  • the electronic device 200 may be a smart device such as a tablet computer, a mobile phone, a camera, a personal computer, a notebook computer, an in-vehicle device, or a wearable device.
  • the electronic device 200 Since the components in the electronic component 100 are relatively compact, the space occupied by the electronic component 100 inside the electronic device 200 is small, and the electronic device 200 can arrange more other spaces in its internal space.
  • the electronic device makes the space utilization of the electronic device 200 high, and the functions of the electronic device 200 are more diverse. Furthermore, the receiver 1, the first circuit board 2, the flash unit 3, the second circuit board 4, and the sensor 5 are sequentially stacked in the thickness direction Z of the electronic device 200, thereby being capable of being reduced The size of the electronic device 200 occupied by the electronic device 200 in the width direction X and the length direction Y is small.
  • the electronic device 200 further includes a display module 300.
  • the display module 300 has a non-display area 301.
  • the non-display area 301 opens a call window 302. At least a portion of the electronic component 100 is facing the non-display area 301, and the sound of the receiver 1 is sent through the receiving window 302.
  • the receiving hole (91, 41) opened on the sealing member 9 (or the second circuit board 4) faces the receiving window 302 so that the sound of the receiver 1 is smoothly transmitted.
  • the sensor 5 is disposed substantially side by side with the receiving holes (91, 41) and faces the non-display area 301. Since the sensor 5 and the receiving hole (91, 41) are arranged compactly, the area of the non-display area 301 can be reduced, thereby increasing the screen ratio of the electronic device 200.
  • the display module 300 further has a display area 303 adjacent to the non-display area 301. As shown in FIG. 1, the display area 303 half surrounds the non-display area 301. At least a portion of the electronic component 100 is disposed in overlap with the display area 303. Since the electronic component 100 at least partially overlaps the display area 303, the area of the non-display area 301 can be further reduced, so that the screen ratio of the electronic device 200 is larger.
  • the electronic device 200 further includes a main circuit board 7 .
  • the main circuit board 7 is disposed to overlap with the display area 303.
  • the main circuit board 7 is provided with a escaping area 73, and the receiver 1 is disposed in the escaping area 73.
  • the first circuit board 2 and the second circuit board 4 are electrically connected to the main circuit board 7.
  • the receiver 1 and the main circuit board 7 are arranged substantially side by side in the thickness direction Z of the electronic device 200 to reduce the space in the thickness direction Z of the electronic device 200 occupied by the electronic component 100. .
  • the first circuit board 2 is electrically connected to the back surface 71 of the main circuit board 7
  • the second circuit board 4 is electrically connected to the front surface 72 of the main circuit board 7 .
  • the main circuit board 7 is located substantially between the first circuit board 2 and the second circuit board 4. The electronic component 100 and the main circuit board 7 can better utilize the space inside the electronic device 200 to improve space utilization.
  • the main circuit board 7 and the receiver 1 are arranged in the longitudinal direction Y of the electronic device 200, and the receiver 1 is adjacent to the top of the electronic device 200 with respect to the main circuit board 7.
  • the fourth portion 24 of the first circuit board 2 extends along the length direction Y of the electronic device 200 to be connected to the back surface 71 of the main circuit board 7.
  • the connecting portion 44 of the second circuit board 4 extends along the length direction Y of the electronic device 200 to be connected to the front surface 72 of the main circuit board 7.
  • the sensor 5 is located on a side of the sealing portion 43 of the second circuit board 4 away from the connecting portion 44, so that the sensor 5 is close to the top of the electronic device 200, thereby reducing the non-display area
  • the size of 301 increases the screen ratio of the electronic device 200.
  • the receiving hole (91, 41) is opened on a side of the sealing portion 43 of the second circuit board 4 away from the connecting portion 44, so that the receiving window 302 is close to the electronic device 200.
  • the top portion thereby reducing the size of the non-display area 301, increases the screen ratio of the electronic device 200.
  • the sensor 5 and the receiving holes (91, 41) are sequentially arranged in the width direction X of the electronic device 200, so that the non-display area 301 is more regular, and the display area 303 has a larger area.
  • the screen of the electronic device 200 is relatively large.
  • the senor 5 at least partially overlaps with the non-display area 301, and the sensor 5 is allowed to interact with the outside world via the non-display area 301.
  • the receiver 1 at least partially overlaps the non-display area 301, and the receiver 1 is capable of propagating a sound signal outside the electronic device 200.
  • the display module 300 includes a cover plate 30 a and a display screen 30 b .
  • the light emitting surface of the display screen 30b is attached to the cover plate 30a.
  • the cover plate 30a may be a glass cover plate.
  • the display screen 30b has two short sides 30c disposed opposite to each other and two long sides 30d disposed opposite to each other.
  • the two long sides 30d are respectively connected between the two short sides 30c.
  • the extending direction of the two long sides 30d is parallel to the length direction Y of the electronic device 200.
  • the extending direction of the two short sides 30c is parallel to the width direction X of the electronic device 200.
  • a partial region of one of the short sides 30c is recessed toward the other of the short sides 30c to form a recess 30e.
  • a display area 303 of the display module 300 is formed between the two short sides 30c and the two long sides 30d, and an area other than the display area 303 is the non-display area 301.
  • the non-display area 301 covers the groove 30e.
  • the cover 30a opens the receiving window 302.
  • the receiving window 302 faces the recess 30e.
  • the cover plate 30a is further provided with a light transmitting area 30f, and the light transmitting area 30f faces the groove 30e.
  • the sensor 5 faces the light transmitting region 30f.
  • the sensor 5 is housed in the recess 30e.
  • the receiving hole (91, 41) faces the groove 30e.
  • the receiver 1 is partially opposite the groove 30e and partially overlaps the display area 303.
  • the flasher 3 at least partially overlaps the display area 303. Since the portion of the receiver 1 overlaps the display area 303, the size of the recess 30e in the length direction Y of the electronic device 200 is small, so that the electronic device 200 has a large screen ratio.
  • the sensor 5 overlaps with the receiver 1, the distance between the receiving window 302 and the light transmitting area 30f is small, and the arrangement is more compact, so that the groove 30e can be reduced.
  • the area of the electronic device 200 is relatively large.
  • the receiving window 302 and the transparent area 30f are arranged in the width direction X of the electronic device 200, and the compact arrangement of the two can reduce the width of the recess 30e in the electronic device 200.
  • the dimension of the groove 30e in the direction of the short side 30c is larger than the dimension of the groove 30e in the direction of the long side 30d.
  • the groove 30e is substantially rectangular.
  • the display screen 30b can be a touch screen.
  • an embodiment of the present application further provides an electronic device 200 .
  • the electronic device 200 includes the electronic component 100 described above.
  • the electronic device 200 includes a sensor 5, a receiver 1, a flash 3, and a display screen 30b.
  • the sensor 5, the receiver 1 and the flasher 3 are stacked in the thickness direction of the display screen 30b.
  • a groove 30e is provided at an edge of the display screen 30b.
  • the sensor 5 and the receiver 1 at least partially face the recess 30e.
  • the components of the electronic device 200 are arranged more compactly, occupying more space.
  • the electronic device 200 is able to arrange more other electronic devices in its internal space, so that the space utilization of the electronic device 200 is higher, and the functions of the electronic device 200 are more diverse.
  • the sensor 5 is at least partially facing the recess 30e, and the sensor 5 is allowed to interact with the outside via the recess 30e.
  • the receiver 1 is at least partially facing the recess 30e, and the receiver 1 is capable of transmitting a sound signal to the outside of the electronic device 200. Since the sensor 5 overlaps with the receiver 1, the arrangement of the two is compact, so that the area of the recess 30e can be reduced, so that the screen occupation of the electronic device 200 is relatively large.

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Abstract

本申请公开了一种电子组件，所述电子组件包括受话器、第一电路板、闪光灯、第二电路板以及传感器，第一电路板包括相背的第一面和第二面，受话器设于第一面且电连接第一电路板，闪光灯设于第二面且电连接第一电路板，第二电路板设于受话器远离第一电路板的一侧，传感器设于第二电路板远离受话器的一侧且电连接第二电路板。上述电子组件的空间利用率高。本申请还公开一种电子设备。

Description

电子组件及电子设备 技术领域
本申请涉及电子设备领域，尤其涉及一种电子组件及电子设备。
背景技术
随着电子设备技术的日趋发展，人们希望手机中能够集成更多的器件，以实现更多样化的功能。然而，由于现有手机中的器件排布方式对空间利用率较低，现有手机中的可用空间较小，因此在现有手机中增设新器件的难度很大，不利于实现手机功能多样化的需求。
发明内容
本申请提供了一种空间利用率较高的电子组件和电子设备。
本申请实施方式提供了一种电子组件，包括受话器、第一电路板、闪光灯、第二电路板以及传感器，所述第一电路板包括相背的第一面和第二面，所述受话器设于所述第一面且电连接所述第一电路板，所述闪光灯设于所述第二面且电连接所述第一电路板，所述第二电路板设于所述受话器远离所述第一电路板的一侧，所述传感器设于所述第二电路板远离所述受话器的一侧且电连接所述第二电路板。
另一方面，本申请实施方式还提供了一种电子设备，包括上述电子组件。
再一方面，本申请实施方式还提供了一种电子设备，包括传感器、受话器、闪光灯以及显示屏，所述传感器、所述受话器以及所述闪光灯在所述显示屏的厚度方向上堆叠，所述显示屏的边缘处设有凹槽，所述传感器及所述受话器至少部分正对所述凹槽。
附图说明
为了更清楚地说明本申请的技术方案，下面将对实施方式中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施方式，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以如这些附图获得其他的附图。
图1是本申请实施方式提供的一种电子设备的示意图；
图2是图1所示电子设备的电子组件的示意图；
图3是图2所示电子组件的另一角度的示意图；
图4是图2所示电子组件的分解图；
图5是图2所示电子组件的第一电路板的示意图；
图6是图2所示电子组件的再一角度的示意图；
图7是图6所示电子组件沿A-A线的剖视图；
图8是图2所示电子组件的受话器、闪光灯及第一电路板的位置关系示意图；
图9是图2所示电子组件的第一电路板与支架配合的示意图；
图10是图1所示电子设备的电子组件与主电路板配合的示意图；
图11是图10所示结构的另一角度的示意图；
图12是图2所示电子组件的受话器、传感器及第二电路板的一种位置关系示意图；
图13是图2所示电子组件的受话器、传感器及第二电路板的另一种位置关系示意图；
图14是图2所示电子组件的受话器、传感器及第二电路板的再一种位置关系示意图；
图15是图1所示电子设备的另一种电子组件的示意图；
图16是图15所示电子组件沿B-B线处的部分结构的示意图；
图17是图1所示电子设备的再一种电子组件的示意图；
图18是图17所示电子组件沿C-C线处的部分结构的示意图；
图19是图6所示电子组件沿D-D线的剖视图；
图20是图10所示结构的再一角度的示意图；
图21是图1所示电子设备的显示模组与电子组件配合的示意图；
图22是图1所示电子设备的显示屏与电子设备配合的示意图；
图23是图1所示电子组件沿E-E线的部分结构的剖视图；
图24是图1所示电子组件沿F-F线的部分结构的剖视图。
具体实施方式
下面将结合本申请实施方式中的附图，对本申请实施方式中的技术方案进行清楚、完整地描述。
为了能够更清楚地理解本申请的上述目的、特征和优点，下面结合附图和具体实施方式对本申请进行详细描述。需要说明的是，在不冲突的情况下，本申请的实施方式及实施方式中的特征可以相互组合。
在下面的描述中阐述了很多具体细节以便于充分理解本申请，所描述的实施方式仅仅是本申请一部分实施方式，而不是全部的实施方式。基于本申请中的实施方式，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施方式，都属于本申请保护的范围。
请参阅图1，本申请实施方式提供一种电子组件100。所述电子组件100可应用于电子设备200中。所述电子设备200可以是平板电脑、手机、照相机、个人计算机、笔记本电脑、车载设备、可穿戴设备等智能设备。为了便于描述，本申请实施方式以所述电子设备200处于图1所示视角为参照进行定义，所述电子设备200的宽度方向如图1中X方向所示，所述电子设备200的长度方向如图1中Y方向所示，所述电子设备200的厚度方向如图1中Z方向所示。可以理解的是，本申请中所提到的方向用语，例如，“长度”、“宽度”、“厚度”等，仅是参考附加图式的方向，因此，使用的方向用语是为了更好、更清楚地说明及理解本申请，而不是指示或暗指所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
请继续参阅图2至图4，所述电子组件100包括受话器1、第一电路板2、闪光灯3、第二电路板4以及传感器5。所述第一电路板2包括相背的第一面2a和第二面2b。所述受话器1设于所述第一面2a且电连接所述第一电路板2。所述闪光灯3设于所述第二面2b且电连接所述第一电路板2。所述第二电路板4设于所述受话器1远离所述第一电路板2的一侧。所述传感器5设于所述第二电路板4远离所述受话器1的一侧且电连接所述第二电路板4。
在本实施方式中，所述受话器1、所述第一电路板2、所述闪光灯3、所述第二电路板4以及所述传感器5依次堆叠设置，使得所述电子组件100各个部件之间排布紧凑，空间利用率较高。所述电子组件100应用于电子设备200时，由于所述电子组件100中部件排布较为紧凑，因此所述电子组件100在所述电子设备200内部所占用的空间较小，所述电子设备200得以在其内部空间中排布更多的其他电子器件，使得所述电子设备200的空间利用率较高，所述电子设备200的功能更为多样化。再者，所述受话器1、所述第一电路板2、所述闪光灯3、所述第二电路板4以及所述传感器5可依次在所述电子设备200的厚度方向Z上堆叠，从而能够减小所述电子组件100所占据的所述电子设备200的宽度方向X和长度方向Y上尺寸。
一种实施方式中，请继续参阅图4至图7，所述第一电路板2为柔性电路板。所述第一电路板2包括相对的第一部分21和第二部分22以及弯折连接在所述第一部分21和所述第二 部分22之间的第三部分23。所述第一面2a为所述第一部分21远离所述第二部分22的表面。所述受话器1电连接所述第一部分21。所述第二面2b为所述第二部分22远离所述第一部分21的表面。所述闪光灯3电连接所述第二部分22。
一种实施方式中，请继续参阅图3、图7以及图8，所述第一部分21平行于所述第二部分22。所述闪光灯3在所述第一部分21上的正投影的区域D1位于所述受话器1在所述第一部分21上的正投影的区域D2中。在本实施方式中，所述闪光灯3完全重叠在所述受话器1上，能够进一步缩小所述电子组件100所占用的所述电子设备200的宽度方向X或长度方向Y的尺寸。
一种实施方式中，请继续参阅图4、图7以及图9，所述电子组件100还包括支架6。所述支架6包括承载部61和连接所述承载部61的支脚62。所述支脚62用于实现定位。所述承载部61位于所述第一部分21与所述第二部分22之间。
请继续参阅图9至图11，所述支脚62固定在所述电子设备200中的其他部件时(如主电路板7)，所述支架6相对所述主电路板7固定，所述承载部61得以承载所述第一部分21和所述第二部分22。当然，所述支脚62的数量可以为多个，部分所述支脚62固定于所述主电路板7后，其余支脚62还可固定于所述电子设备200的壳体(如中框)，以增加所述支架6的稳固度，以使所述电子组件100更为稳固。
一种实施方式中，所述第一部分21朝向所述第二部分22的表面上设有第一补强板(图中未示出)，所述第二部分22朝向所述第一部分21的一侧设有第二补强板。所述第一补强板的设置有利于实现所述受话器1与所述第一部分21的电连接。所述第二补强板的设置使得所述闪光灯3能够稳定且牢固地焊接固定于所述第二部分22。
一种实施方式中，请接续参阅图4、图5以及图11，所述第一电路板2还包括第四部分24。所述第四部分24连接在所述第二部分22远离所述第三部分23的一侧。所述第四部分24与所述受话器1错开排布。换言之，所述第四部分24与所述受话器1不重叠，所述第四部分24自所述第二部分22延伸出，得以连接至所述电子设备200中的其他部件(如主电路板7)。
其中，所述第四部分24远离所述第二部分22的端部处设电连接器8，所述第一电路板2经所述电连接器8电连接所述主电路板7。所述受话器1经所述第一部分21、所述第三部分23、所述第二部分22、所述第四部分24及所述电连接器8电连接至所述主电路板7，以实现信号传输。所述闪光灯3经所述第二部分22、所述第四部分24及所述电连接器8电连接至所述主电路板7，以实现信号传输。
在本实施方式中，所述受话器1及所述闪光灯3共同与所述第一电路板2及所述电连接器8实现与所述主电路板7的电连接，从而能够节约所述电子组件100的物料，使得所述电子组件100的成本较低。
一种实施方式中，请继续参阅图12，所述传感器5在所述第二电路板4上的正投影的区域D3位于所述受话器1在所述第二电路板4上的正投影的区域D4中。在本实施方式中，所述传感器5完全重叠在所述受话器1上，所述传感器5和所述闪光灯3完全重叠地设置于所述受话器1的相对两侧，能够进一步缩小所述电子组件100所占用的所述电子设备200的宽度方向X或长度方向Y的尺寸。
当然，其它实施方式中，如图13所示，所述传感器5在所述第二电路板4上的正投影的区域D3与所述受话器1在所述第二电路板4上的正投影的区域D4部分重叠；或，如图14所示，所述传感器5在所述第二电路板4上的正投影的区域D3与所述受话器1在所述第二电路板4上的正投影的区域D4相互错开，等。
请参阅图4，所述受话器1大致呈矩状，所述受话器1的中间区域为振动部11。所述振动部11一般与其它部件或结构件密闭连接以形成振动腔，通过在部件或结构件上开口，即可将由所述振动部11振动所产生的音波传播出来。所述受话器1通过声音通道传播声音信号， 所述声音通道对应到结构上即为自所述振动部11至部件或结构件上开口之间的通道。所述受话器1接收到音频信号后，被密闭形成的振动腔随之振动，声音信号自部件或结构件上的开口穿过。
所述受话器1的声音通道有多种形式，例如：
一种实施方式中，请继续参阅图15和图16，所述第二电路板4部分覆盖且密封连接所述受话器1。所述电子组件100还包括与所述第二电路板4相拼接的密封件9。所述密封件9覆盖且密封连接所述受话器1余下的部分。所述密封件9开设受话孔91，以使所述受话器1的振动部11至所述密封件9的受话孔91之间形成声音通道12。
在本实施方式中，所述密封件9与所述第二电路板4共同密封所述受话器1以形成振动腔，所述密封件9开设受话孔91，所述受话器1发出的声音信号自所述密封件9的受话孔91传出。
其中，所述密封件9为矩形的泡棉。所述密封件9可吸收所述电子组件100的制作公差和组装公差。当然，在其它实施方式中，所述密封件9还可以为金属或塑胶等材质的补强板。
其中，所述振动部11在所述密封件9上的正投影至少部分覆盖所述密封件9的受话孔91，使得所述密封件9的受话孔91能够更好地输出声音信号。
另一种实施方式中，请继续参阅图17和图18，所述电子组件100还包括密封件9，所述密封件9覆盖且密封连接所述受话器1。所述密封件9具有依次连接的第一密封部92和第二密封部93。所述第一密封部92和所述第二密封部93并排设置。所述第二密封部93的厚度大于所述第一密封部92的厚度。所述第二电路板4层叠于所述第一密封部92。所述第二电路板4位于所述第一密封部92远离所述受话器1的一侧。所述第二密封部93开设受话孔，以使所述受话器1的振动部11至所述密封件9的受话孔91之间形成声音通道。
所述第二密封部93的厚度大于所述第一密封部92的厚度，以使所述第二密封部93与所述第一密封部92形成台阶，所述第二电路板4设于所述台阶。当然，在其他实施方式中，所述密封件9也可为平直的板状结构。
可以理解的是，由于设置所述密封件9用以密封所述受话器1以形成音腔，因此能够避免所述电子组件100过度依赖所述第二电路板4的结构来对所述受话器1进行承载和密封，进一步优化了所述电子组件100的结构。
其中，所述第二电路板4的尺寸与所述传感器5的尺寸大致相同，即不因所述第二电路板4的尺寸过大而占据所述电子设备200内过多的空间，亦可以使所述传感器5较佳的承载于所述第二电路板4上，即所述第二电路板4整个覆盖住所述传感器5。
其中，所述振动部11在所述密封件9上的正投影至少部分覆盖所述密封件9的受话孔91，使得所述密封件9的受话孔91能够更好地输出声音信号。
另一种实施方式中，请继续参阅图6和图19，所述第二电路板4覆盖且密封连接所述受话器1。所述第二电路板4密封所述受话器1以形成振动腔。所述第二电路板4开设受话孔41以使所述受话器1的振动部11至所述第二电路板4的受话孔41之间形成声音通道12。所述受话器1的声音通道12越过或经过所述第二电路板4连通至外部，以使得所述受话器1将音频信号转换为声音信号后，所述声音信号能够经所述声音通道12传播至外部。
在本实施方式中，所述第二电路板4即作为将所述传感器5和所述受话器1堆叠在一起的承载件，又作为所述受话器1的声音通道12组成的一部分，减少了所述电子组件100的器件组件，使得所述电子组件100更为紧凑，节省了所述电子组件100于电子设备200厚度方向Z上的尺寸，提高了空间利用率。
其中，所述第二电路板4与所述受话器1之间通过泡棉42连接(例如粘接)。所述泡棉42为中空的环状，设置于所述第二电路板4的朝向所述受话器1的一侧。所述泡棉42刚好围接于所述受话器1的所述振动部11的边缘处，如此所述第二电路板4与所述受话器1密封连接后，所述受话器1的所述振动部11与所述第二电路板4之间形成的腔体则为所述受话器 1的声音通道12的一部分。当然，在其它实施方式中，所述第二电路板4与所述受话器1还可以通过焊接或胶接等多种方式密封连接。
其中，所述振动部11在所述第二电路板4上的正投影至少部分覆盖所述第二电路板4的受话孔41，使得所述第二电路板4的受话孔41能够更好地输出声音信号。
一种实施方式中，请继续参阅图3和图10，所述第二电路板4为柔性电路板。所述第二电路板4包括密封部43和连接部44。所述密封部43密封连接所述受话器1。所述连接部44连接于所述密封部43的一侧。所述连接部44与所述受话器1错开排布。换言之，所述连接部44与所述受话器1不重叠，所述连接部44自所述密封部43延伸出，得以连接至所述电子设备200中的其他部件(如主电路板7)。所述传感器5经所述密封部43和所述连接部44电连接至所述主电路板7，以实现信号传输。
其中，所述连接部44远离所述密封部43的端部处设有焊盘441，所述主电路板7上设有弹片442，所述弹片442抵持所述焊盘441以实现电连接。当然，在其他实施方式中，所述连接部44也可通过电连接器电连接所述主电路板7。
一种实施方式中，所述传感器5包括距离传感器、光线传感器或光电传感器中的至少一种。本实施方式中，所述传感器5为光线传感器。光线传感器靠近所述电子设备200的屏幕设置，以便于根据所述电子设备200所处环境的光线来调节所述电子设备200的屏幕的亮度。光线传感器感应的介质为光线，所述电子设备200并不需特别进行钻孔或设置特别的结构来通过光线，将所述电子组件100中的所述传感器5设置为光线传感器，与所述受话器1一并在所述电子设备200的厚度方向Z上堆叠，进一步优化了所述电子设备200的结构，使所述电子设备200的空间利用率高，有利于减小所述电子设备200在宽度方向X和长度方向Y上的尺寸。
请继续参阅图10和图11，在所述电子设备200中，所述主电路板7及所述受话器1在所述电子设备200的长度方向Y上排布，所述受话器1相对所述主电路板7靠近所述电子设备200的顶部。所述第一电路板2的所述第四部分24沿所述电子设备200的长度方向Y延伸，从而连接至所述主电路板7的背面71。所述第二电路板4的所述连接部44沿所述电子设备200的长度方向Y延伸，从而连接至所述主电路板7的正面72。所述传感器5位于所述第二电路板4的所述密封部43远离所述连接部44的一侧。所述受话孔41开设于所述密封部43的远离所述连接部44的一侧。所述传感器5与所述受话孔41在所述电子设备200的宽度方向X上依次排布。
请一并参阅图1至图19，本申请实施方式提供一种电子设备200。所述电子设备200包括前文所述电子组件100。所述电子组件100收容于电子设备200的内部，用以实现所述电子设备200的受话等功能。所述电子设备200可以是平板电脑、手机、照相机、个人计算机、笔记本电脑、车载设备、可穿戴设备等智能设备。
由于所述电子组件100中部件排布较为紧凑，因此所述电子组件100在所述电子设备200内部所占用的空间较小，所述电子设备200得以在其内部空间中排布更多的其他电子器件，使得所述电子设备200的空间利用率较高，所述电子设备200的功能更为多样化。再者，所述受话器1、所述第一电路板2、所述闪光灯3、所述第二电路板4以及所述传感器5依次在所述电子设备200的厚度方向Z上堆叠，从而能够减小所述电子设备200所占据的所述电子设备200的宽度方向X和长度方向Y上尺寸。
一种实施方式中，所述电子设备200还包括显示模组300。所述显示模组300具有非显示区301。所述非显示区301开设受话窗口302。至少部分所述电子组件100正对所述非显示区301，且所述受话器1的声音经所述受话窗口302发出。
所述密封件9(或所述第二电路板4)上开设的受话孔(91、41)正对所述受话窗口302，以使所述受话器1的声音顺利传出。所述传感器5与所述受话孔(91、41)大致并排设置，并正对所述非显示区301。由于所述传感器5与所述受话孔(91、41)排布紧凑，因此能够 缩小所述非显示区301的面积，从而增加所述电子设备200的屏占比。
其中，所述显示模组300还具有显示区303，所述显示区303邻接所述非显示区301。如图1所示，所述显示区303半包围所述非显示区301。至少部分所述电子组件100与所述显示区303重叠设置。由于所述电子组件100至少部分与所述显示区303重叠，因此能够进一步减小所述非显示区301的面积，使得所述电子设备200的屏占比更大。
一种实施方式中，请继续参阅图1、图10、图11以及图20，所述电子设备200还包括主电路板7。所述主电路板7与所述显示区303重叠设置。所述主电路板7设有避让区73，所述受话器1设于所述避让区73。所述第一电路板2和所述第二电路板4电连接所述主电路板7。此时，所述受话器1与所述主电路板7在所述电子设备200的厚度方向Z大致并排设置，以降低所述电子组件100所占用的所述电子设备200的厚度方向Z上的空间。
其中，请继续参阅图10和图11，所述第一电路板2电连接所述主电路板7的背面71，所述第二电路板4电连接所述主电路板7的正面72。换言之，在所述电子设备200的厚度方向Z上，所述主电路板7大致位于所述第一电路板2与所述第二电路板4之间。所述电子组件100与所述主电路板7能够更好地利用所述电子设备200内部的空间，提高空间利用率。
所述主电路板7及所述受话器1在所述电子设备200的长度方向Y上排布，所述受话器1相对所述主电路板7靠近所述电子设备200的顶部。所述第一电路板2的所述第四部分24沿所述电子设备200的长度方向Y延伸，从而连接至所述主电路板7的背面71。所述第二电路板4的所述连接部44沿所述电子设备200的长度方向Y延伸，从而连接至所述主电路板7的正面72。所述传感器5位于所述第二电路板4的所述密封部43远离所述连接部44的一侧，使得所述传感器5靠近所述电子设备200的顶部，从而减少了所述非显示区301的尺寸，增加所述电子设备200的屏占比。所述受话孔(91、41)开设于所述第二电路板4的所述密封部43的远离所述连接部44的一侧，使得所述受话窗口302靠近所述电子设备200的顶部，从而减少了所述非显示区301的尺寸，增加所述电子设备200的屏占比。所述传感器5与所述受话孔(91、41)在所述电子设备200的宽度方向X上依次排布，使得所述非显示区301更为规整，所述显示区303面积较大，所述电子设备200的屏占比较大。
一种实施方式中，所述传感器5至少部分与所述非显示区301重叠，所述传感器5得以经所述非显示区301与外界进行信息交互。所述受话器1至少部分与所述非显示区301重叠，所述受话器1得以将声音信号传播至所述电子设备200外。
一种实施方式中，请继续参阅图1、图21至图24，所述显示模组300包括层叠连接的盖板30a和显示屏30b。所述显示屏30b的出光面贴合所述盖板30a。所述盖板30a可为玻璃盖板。所述显示屏30b具有相背设置的两条短边30c及相背设置的两条长边30d。所述两条长边30d分别连接于所述两条短边30c之间。所述两条长边30d的延伸方向平行于所述电子设备200的长度方向Y。所述两条短边30c的延伸方向平行于所述电子设备200的宽度方向X。一条所述短边30c的部分区域朝向另一条所述短边30c的方向凹陷形成凹槽30e。所述两条短边30c及所述两条长边30d之间形成所述显示模组300的显示区303，所述显示区303以外的区域为所述非显示区301。所述非显示区301覆盖所述凹槽30e。所述盖板30a开设所述受话窗口302。所述受话窗口302正对所述凹槽30e。所述盖板30a上还设有透光区30f，所述透光区30f正对所述凹槽30e。所述传感器5正对所述透光区30f。
在本实施方式中，所述传感器5收容于所述凹槽30e。所述受话孔(91、41)正对所述凹槽30e。所述受话器1部分正对所述凹槽30e，部分与所述显示区303重叠。所述闪光灯3至少部分与所述显示区303重叠。由于所述受话器1部分与所述显示区303重叠，因此所述凹槽30e在所述电子设备200的长度方向Y上的尺寸较小，使得所述电子设备200具有较大的屏占比。并且，由于所述传感器5与所述受话器1重叠，因此所述受话窗口302与所述透光区30f之间的间距较小，排布更为紧凑，因此能够减小所述凹槽30e的面积，使得所述电子设备200的屏占比较大。其中，所述受话窗口302与所述透光区30f在所述电子设备200 的宽度方向X上排布，两者紧凑排布能够减小所述凹槽30e在所述电子设备200的宽度方向X上的尺寸。
其中，所述凹槽30e在所述短边30c方向上的尺寸大于所述凹槽30e在所述长边30d方向上的尺寸。所述凹槽30e大致呈矩形。所述显示屏30b可为触控屏。
请参阅图1至图24，本申请实施方式还提供一种电子设备200。所述电子设备200包括前文所述电子组件100。所述电子设备200包括传感器5、受话器1、闪光灯3以及显示屏30b。所述传感器5、所述受话器1以及所述闪光灯3在所述显示屏30b的厚度方向上堆叠。所述显示屏30b的边缘处设有凹槽30e。所述传感器5及所述受话器1至少部分正对所述凹槽30e。
在本实施方式中，由于所述传感器5、所述受话器1以及所述闪光灯3在所述显示屏30b的厚度方向上堆叠，因此所述电子设备200中部件排布较为紧凑，占用的空间较小，所述电子设备200得以在其内部空间中排布更多的其他电子器件，使得所述电子设备200的空间利用率较高，所述电子设备200的功能更为多样化。所述传感器5至少部分正对所述凹槽30e，所述传感器5得以经所述凹槽30e与外界进行信息交互。所述受话器1至少部分正对所述凹槽30e，所述受话器1得以将声音信号传播至所述电子设备200外。由于所述传感器5与所述受话器1重叠，两者排布紧凑，因此能够减小所述凹槽30e的面积，使得所述电子设备200的屏占比较大。
可以理解的是，本实施方式所述电子设备200的其他部分可参阅前述电子设备300进行设置，本实施方式不再进行赘述。
以上是本申请实施例的实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本申请实施例原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也视为本申请的保护范围。

Claims (20)

  1. 一种电子组件，其特征在于，包括受话器、第一电路板、闪光灯、第二电路板以及传感器，所述第一电路板包括相背的第一面和第二面，所述受话器设于所述第一面且电连接所述第一电路板，所述闪光灯设于所述第二面且电连接所述第一电路板，所述第二电路板设于所述受话器远离所述第一电路板的一侧，所述传感器设于所述第二电路板远离所述受话器的一侧且电连接所述第二电路板。
  2. 根据权利要求1所述的电子组件，其特征在于，所述第一电路板为柔性电路板，所述第一电路板包括相对的第一部分和第二部分以及弯折连接在所述第一部分和所述第二部分之间的第三部分，所述第一面为所述第一部分远离所述第二部分的表面，所述第二面为所述第二部分远离所述第一部分的表面。
  3. 根据权利要求2所述的电子组件，其特征在于，所述第一部分平行于所述第二部分，所述闪光灯在所述第一部分上的正投影的区域位于所述受话器在所述第一部分上的正投影的区域中。
  4. 根据权利要求2所述的电子组件，其特征在于，所述电子组件还包括支架，所述支架包括承载部和连接所述承载部的支脚，所述支脚用于实现定位，所述承载部位于所述第一部分与所述第二部分之间。
  5. 根据权利要求2所述的电子组件，其特征在于，所述第一电路板还包括第四部分，所述第四部分连接在所述第二部分远离所述第三部分的一侧，所述第四部分与所述受话器错开排布。
  6. 根据权利要求2至5任一项所述的电子组件，其特征在于，所述传感器在所述第二电路板上的正投影的区域位于所述受话器在所述第二电路板上的正投影的区域中。
  7. 根据权利要求6所述的电子组件，其特征在于，所述第二电路板部分覆盖且密封连接所述受话器，所述电子组件还包括与所述第二电路板相拼接的密封件，所述密封件覆盖且密封连接所述受话器余下的部分，所述密封件开设受话孔，以使所述受话器的振动部至所述密封件的受话孔之间形成声音通道。
  8. 根据权利要求6所述的电子组件，其特征在于，所述电子组件还包括密封件，所述密封件覆盖且密封连接所述受话器，所述密封件具有依次连接的第一密封部和第二密封部，所述第二密封部的厚度大于所述第一密封部的厚度，所述第二电路板层叠于所述第一密封部，所述第二密封部开设受话孔，以使所述受话器的振动部至所述密封件的受话孔之间形成声音通道。
  9. 根据权利要求6所述的电子组件，其特征在于，所述第二电路板覆盖且密封连接所述受话器，所述第二电路板开设受话孔，以使所述受话器的振动部至所述第二电路板的受话孔之间形成声音通道。
  10. 根据权利要求9所述的电子组件，其特征在于，所述振动部在所述第二电路板上的正投影至少部分覆盖所述受话孔。
  11. 根据权利要求6所述的电子组件，其特征在于，所述第二电路板为柔性电路板，所述第二电路板包括密封部和连接部，所述密封部密封连接所述受话器，所述连接部连接于所述密封部的一侧，所述连接部与所述受话器错开排布。
  12. 一种电子设备，其特征在于，包括传感器、受话器、闪光灯以及显示屏，所述传感器、所述受话器以及所述闪光灯在所述显示屏的厚度方向上堆叠，所述显示屏的边缘处设有凹槽，所述传感器及所述受话器至少部分正对所述凹槽。
  13. 根据权利要求12所述的电子设备，其特征在于，所述电子设备包括第一电路板，所述第一电路板为柔性电路板，所述第一电路板包括相对的第一部分和第二部分以及弯折连接 在所述第一部分和所述第二部分之间的第三部分，所述受话器设于所述第一部分远离所述第二部分的表面且电连接所述第一电路板，所述闪光灯设于所述第二部分远离所述第一部分的表面且电连接所述第一电路板。
  14. 根据权利要求12或13所述的电子设备，其特征在于，所述电子设备包括显示模组，所述显示模组具有显示区及非显示区，所述显示区邻接所述非显示区，所述受话器、所述闪光灯至少部分与所述显示区重叠设置，所述非显示区覆盖所述凹槽。
  15. 一种电子设备，其特征在于，包括显示模组及电子组件，所述显示模组具有非显示区，至少部分所述电子组件正对所述非显示区，所述非显示区开设受话窗口，所述电子组件包括受话器、第一电路板、闪光灯、第二电路板以及传感器，所述受话器的声音经所述受话窗口发出，所述第一电路板包括相背的第一面和第二面，所述受话器设于所述第一面且电连接所述第一电路板，所述闪光灯设于所述第二面且电连接所述第一电路板，所述第二电路板设于所述受话器远离所述第一电路板的一侧，所述传感器设于所述第二电路板远离所述受话器的一侧且电连接所述第二电路板。
  16. 根据权利要求15所述的电子设备，其特征在于，所述显示模组还具有显示区，所述显示区邻接所述非显示区，至少部分所述电子组件与所述显示区重叠设置，所述电子设备还包括主电路板，所述主电路板与所述显示区重叠设置，所述主电路板设有避让区，所述受话器设于所述避让区，所述第一电路板和所述第二电路板电连接所述主电路板。
  17. 根据权利要求16所述的电子设备，其特征在于，所述第一电路板电连接所述主电路板的背面，所述第二电路板电连接所述主电路板的正面。
  18. 根据权利要求16所述的电子设备，其特征在于，所述传感器至少部分与所述非显示区重叠，所述受话器至少部分与所述非显示区重叠。
  19. 根据权利要求15至18中任一项所述的电子设备，其特征在于，所述第一电路板为柔性电路板，所述第一电路板包括相对的第一部分和第二部分以及弯折连接在所述第一部分和所述第二部分之间的第三部分，所述第一面为所述第一部分远离所述第二部分的表面，所述第二面为所述第二部分远离所述第一部分的表面。
  20. 根据权利要求15至18中任一项所述的电子设备，其特征在于，所述显示模组包括层叠连接的盖板和显示屏，所述显示屏具有相背设置的两条短边及相背设置的两条长边，所述两条长边分别连接于所述两条短边之间，一条所述短边的部分区域朝向另一条所述短边的方向凹陷形成凹槽，所述非显示区覆盖所述凹槽，所述盖板开设所述受话窗口。
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