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WO2019112400A1 - Dispositif de rayonnement de chaleur destiné à un élément électronique - Google Patents

Dispositif de rayonnement de chaleur destiné à un élément électronique Download PDF

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Publication number
WO2019112400A1
WO2019112400A1 PCT/KR2018/015619 KR2018015619W WO2019112400A1 WO 2019112400 A1 WO2019112400 A1 WO 2019112400A1 KR 2018015619 W KR2018015619 W KR 2018015619W WO 2019112400 A1 WO2019112400 A1 WO 2019112400A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
unit
cover
heat radiating
radiating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2018/015619
Other languages
English (en)
Korean (ko)
Inventor
김덕용
양준우
여진수
유창우
박민식
김혜연
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KMW Inc
Original Assignee
KMW Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KMW Inc filed Critical KMW Inc
Priority to CN201880079396.XA priority Critical patent/CN111788876B/zh
Priority to JP2020530655A priority patent/JP7045457B2/ja
Priority claimed from KR1020180158227A external-priority patent/KR102147658B1/ko
Publication of WO2019112400A1 publication Critical patent/WO2019112400A1/fr
Priority to US16/893,394 priority patent/US11266041B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to a heat dissipating device for an electric component, and more particularly, to a heat dissipating device capable of achieving a light weight of the entire product, To a heat dissipation device for an electric element.
  • the electric field element generates heat during operation, and when the heat in the space in which the electric element is accumulated is accumulated without being radiated to the outside, the operating performance of the electric element can be degraded.
  • FIG. 1 is an exploded perspective view showing a general heat dissipation device of an electric field element according to the related art.
  • a conventional heat dissipating device for a full-field device includes a substrate case 10 for accommodating a printed circuit board 20 on which a full-length device (not shown) is mounted on one surface, And a cover 30 coupled to the substrate case 10 while covering the printed circuit board 20 housed in the cover case 30 and having a plurality of heat dissipating ribs 31 integrally formed on the outer surface thereof.
  • the inner surface of the cover 30 is arranged to be placed on the other surface of the printed circuit board 20, so that heat generated from the electric elements of the printed circuit board 20 is transferred to the inner surface of the cover 30 , And radiates outwardly through a plurality of heat-radiating ribs (31) integrally formed on the outer surface of the cover (30).
  • the outer surface of the unit heat dissipating rib 31 may be formed by finely waving the wavy grooves 32 as shown in Fig. 1 so as to increase the heat dissipating area of the plurality of heat dissipating ribs 31 It is an undesirable solution because the additional processing of the heat radiation area at the fixed portion as described above is limited.
  • the plurality of heat-radiating ribs 31 are formed to be long in the vertical direction so as to flow only in the vertical direction, and spaced apart from each other by a predetermined distance in the lateral direction. There is a limit to performance.
  • Another object of the present invention is to provide a heat dissipation device for an electric component which can improve the heat dissipation performance by designing air to flow into a plurality of radiant heat dissipators in various directions.
  • An embodiment of a heat dissipation device of an electric device includes a printed circuit board on which a plurality of electric elements are mounted, the substrate case having the printed circuit board, And at least one of the heat radiating covers protruding from the outer surface of the heat radiating cover, each of the heat radiating covers extending upwardly inclined, and receives heat generated from the printed circuit board And a plurality of radial heat radiating elements radiating heat to the outside.
  • the plurality of radial heaters may include a plurality of unit heat pipes, one end of which is coupled to the outer surface of the heat radiation cover so as to be partially recessed, and the other end of which is bent toward the one end, And a plurality of heat radiating ribs radially extended radially outward from a part or all of the outer circumferential surface of the other end of each of the plurality of unit heat pipes.
  • a plurality of heat conduction grooves may be formed on the outer surface of the heat dissipation cover to correspond to the number of the plurality of unit heat pipes.
  • the plurality of thermally conductive grooves may be formed such that the heat conductive grooves vertically adjacent to each other are spaced apart from each other by a predetermined distance.
  • the plurality of heat conduction grooves may be formed such that a plurality of rows are formed long in the vertical direction, and the rows adjacent to the right and left sides are spaced apart from each other by a predetermined distance.
  • the plurality of heat conduction grooves and the plurality of unit heat pipes may be arranged so that the height of the heat conduction grooves adjacent to the right and left sides and the unit heat pipes are different from each other.
  • the plurality of heat dissipating ribs formed on the outer circumferential surfaces of the other end portions of the plurality of unit heat pipes may be formed such that the distal end spaced apart from the outer circumferential surface of the other end portion of the unit heat pipe is not upward at least.
  • the plurality of radiant heaters may include a plurality of unit heat pipes coupled to an outer surface of the heat radiating cover so as to surround an outer circumferential surface of one end of the plurality of unit heat pipes not recessed on the outer surface of the heat radiating cover. And a pipe fixing block for fixing the pipe.
  • One end of the plurality of unit heat pipes and the pipe fixing block among the plurality of radial heat radiating elements may be provided at positions corresponding to positions of a plurality of electric elements arranged on the inner surface of the heat radiating cover have.
  • the plurality of radiating ribs may be spaced apart from the outer surface of the radiating cover by a predetermined distance.
  • each of the ends of the plurality of radiating ribs of the plurality of radial heat radiating elements may be formed to have the same distance from the outer surface of the radiating cover.
  • the plurality of unit heat pipes may be filled with a heat transfer fluid which is vaporized by the heat transferred to the heat radiating cover rotor and then transferred to the plurality of heat dissipating ribs and then liquefied.
  • the plurality of unit heat pipes may be located at a lower side than the other end where the heat radiating ribs are provided, at one end coupled to the outer surface of the heat radiating cover.
  • the entire product can be lightened.
  • FIG. 1 is an exploded perspective view showing a general heat dissipation device of an electric field element according to the related art
  • FIG. 2 is a perspective view illustrating an embodiment of a heat dissipation device for electrical components according to the present invention
  • Fig. 3 is an exploded perspective view of Fig. 2,
  • FIG. 4 is a cross-sectional view taken along the line A-A in Fig. 2,
  • Fig. 5 is a perspective view showing a unit radial heat radiator in the configuration of Fig. 2,
  • Fig. 6 is an exploded perspective view of Fig. 5,
  • FIG. 7 is a perspective view showing another embodiment of the heat dissipating device of the electric element according to the present invention.
  • FIG. 8 is an exploded perspective view of FIG. 7,
  • FIG. 9 is a cross-sectional view taken along the line B-B in Fig. 7,
  • FIG. 10 is a cross-sectional view and a partially enlarged perspective view showing still another embodiment of the heat dissipation device for electric field element according to the present invention.
  • Radial heat sink 140 Unit heat pipe
  • FIG. 2 is a perspective view showing an embodiment of a heat dissipation device for electric field elements according to the present invention
  • Fig. 3 is an exploded perspective view of Fig. 2
  • Fig. 4 is a cross-
  • Fig. 6 is an exploded perspective view of Fig. 5.
  • the heat dissipating device 100 includes a plurality of electric elements 125, each of which generates at least one heat during operation, And a circuit board (120).
  • the printed circuit board 120 is limited to being mounted so that a plurality of electric elements 125 are mounted on only one side, but a two-sided type in which the electric elements 125 are mounted on both sides is also a category Of course.
  • the plurality of electric element devices 125 include all the heat generating elements that generate a predetermined heat while being electrically operated.
  • the plurality of electric element devices 125 include a power supply unit (PSU) (Field Programmable Gate Array) device, and the like.
  • PSU power supply unit
  • the device structure that can degrade the performance due to heat generation is also considered.
  • an embodiment of the present invention includes a substrate case 105 (see Figs. 7 and 8) and a substrate case 105 that accommodates the above-described printed circuit board 120, And a heat radiating cover 110 that is in close contact with the other surface of the heat sink 120.
  • the heat dissipation cover 110 also corresponds to the housing of the antenna device. If the heat dissipation cover 110 is configured to protect the antenna elements, the PSU, and the FPGA device mounted on the printed circuit board 120 from the outside and radiate heat to the outside It can be a concept that includes both despite its name.
  • the heat dissipation cover 110 protects the printed circuit board 120 accommodated in the substrate case 105 from the outside and transmits heat generated from the plurality of electric elements 125 mounted on the printed circuit board 120 to the outside It is preferable to be provided with a conductive material. Although not shown in the drawing, a plurality of radiant heaters 130, which will be described later, may be further provided with a plurality of radiating fins formed integrally with the outer surface separately from the radiating cover 110.
  • At least one of the heat dissipating apparatus 100 may include at least one heat radiating cover 110 protruding from the outer surface of the heat radiating cover 110, And a plurality of radial heat dissipators 130 for radiating heat to the outside.
  • the plurality of radial heat radiating bodies 130 may be in direct contact with the heat radiating cover 110 in a state in which the plurality of radiating fins are removed, Respectively.
  • the plurality of radial heat sinks 130 include a plurality of unit heat pipes 140 coupled to the outer surface of the heat dissipation cover 110 and a plurality of heat dissipation ribs 150 formed in each of the plurality of unit heat pipes 140 can do.
  • the plurality of heat dissipating ribs 150 may be formed on the circumferential surface of the unit heat pipe 140, And may be formed to extend radially outwardly, respectively.
  • the plurality of heat dissipating ribs 150 correspond to the heat dissipating ribs 30 integrally formed on the outer surface of the conventional heat dissipating cover 10 shown in FIG. It is possible to improve the effective heat dissipation area because it is manufactured in a smaller space.
  • the flow path of the external air for cooling can be variously formed, It is possible to prevent the stagnation of the flowing air between the sieves 130, thereby maximizing the heat radiation performance.
  • a plurality of radial heat dissipators 130 are proposed to overcome the limit of the detailed processing of the grooves with respect to the unit heat dissipating ribs, It should be noted that the concept of completely eliminating the processing of the groove shape for each of the plurality of heat dissipating ribs 150 is not considered. In this case, it is preferable that the shape of the groove for each of the plurality of heat dissipating ribs 150 is formed in a size or shape as long as the flow stagnation of the air flowing between the plurality of radiant heat emitting bodies 130 does not occur Do.
  • the plurality of unit heat pipes 140 are vaporized by the heat transmitted from the heat radiating cover 110 to the inside, and when the heat is radiated to the outside by the plural radiating ribs 150, the heat transfer fluid which is liquefied is filled .
  • the heat transfer fluid is vaporized by the heat transmitted from the heat radiation cover 110 at one end 141 of the unit heat pipe 140 and is moved to the upper side of the other end 142 of the unit heat pipe 140, And is a medium that performs heat transfer in such a manner that it is moved outward from the heat radiating cover 110 and then liquefied near the other end 142 of the unit heat pipe 140.
  • the plurality of unit heat pipes 140 are arranged in such a manner that a side of the heat source (one end 141 of the unit heat pipe 140 in the embodiment of the present invention) The other end 142 of the pipe 140). That is, the heat transfer fluid is based on the principle that it moves upward when the temperature is high due to the fluid movement principle.
  • one end of the plurality of unit heat pipes 140 coupled to the outer surface of the heat dissipating cover 110 should be positioned below the other end provided with the plurality of heat dissipating ribs 150.
  • the heat transfer fluid filled in the plurality of unit heat pipes 140 when the heat transfer fluid filled in the plurality of unit heat pipes 140 is vaporized, the heat transfer fluid is moved upward by the fluid movement principle, The heat source is moved to the heat source.
  • the heat conductive grooves 111 in which the one end portion 141 of the plurality of unit heat pipes 140 are coupled to the outer surface of the heat dissipation cover 110 are formed to correspond to the number of the plurality of unit heat pipes 140 And a plurality of them may be formed.
  • a plurality of heat dissipation fins are integrally formed on the outer surface of the heat dissipation cover 110 as described above, a part of the plurality of heat dissipation fins may be removed or removed so as not to interfere with the plurality of unit heat pipes 140 Has already been described.
  • the thermally conductive grooves 111 are formed such that the thermally conductive grooves 111 that are vertically adjacent to each other are spaced apart from each other by a predetermined distance in the vertical direction.
  • the plurality of heat conduction grooves 111 may be formed so as to have a plurality of long lines in the up-and-down direction, while the adjacent heat lines may be spaced apart from each other by a predetermined distance.
  • one end 141 of the plurality of unit heat pipes 140 may be coupled one-to-one. Therefore, since the outside air flows into the space separated in the up-and-down direction and the left-right direction, the flow path of air for heat radiation can be variously designed.
  • the plurality of radial heaters 130 are coupled to the outer surface of the heat radiating cover 110 so that the outer surface of the heat radiating cover 110 is connected to the outer surface of the heat radiating cover 110.
  • the pipe fixing block 160 has a thermal conductive property for collecting the heat of the electrical component 125 transmitted to the outer surface of the heat dissipating cover 110 and effectively transmitting the heat to the one end 141 of the plurality of unit heat pipes 140 It is preferable that it is made of an excellent material.
  • One end 141 of one end 141 of the plurality of unit heat pipes 140 is received in close contact with the heat conduction groove 111 formed on the outer surface of the heat dissipating cover 110, The other side of the outer circumferential surface is accommodated so as to be in close contact with the pipe fixing block 160 so that the heat generated from the electric element 125 is transmitted to the one end portion 141 of the plurality of unit heat pipes 140 as much as possible.
  • One end 141 of the plurality of unit heat pipes 140 and the pipe fixing block 160 among the plurality of radial heat radiating elements 130 constitute a plurality of electric fields disposed on the inner surface of the heat radiating cover 110 It is preferable that they are provided at positions corresponding to the positions of the elements 125, respectively.
  • the plurality of unit heat pipes 140 are arranged such that the heat generated from the electric field elements 125 is not directly transmitted to the pipe fixing block 160 to be transmitted through the medium.
  • the plurality of radiating ribs 150 of the plurality of radial heat sinks 130 are formed such that an end portion of the plurality of radiating ribs 150 located close to the outer surface of the heat radiating cover 110 is spaced apart from the outer surface of the heat radiating cover 110 by a predetermined distance .
  • the plurality of heat dissipating ribs 150 may be formed in a predetermined thickness from the outer surface of the heat dissipating cover 110 by a pipe fixing block 160 provided outside the heat dissipating cover 110, 160 and the ends of the plurality of heat-radiating ribs 150, which are located close to the outer surface of the heat-radiating ribs 160, 160, are spaced apart from each other by a predetermined distance.
  • the heat generated during operation of the electrical component 125 from one side of the printed circuit board 120 on which the electrical component 125 is mounted is transferred to the other side of the printed circuit board 120, To the inner surface of the heat dissipation cover 110 closely arranged on the other surface of the heat dissipation cover 110.
  • the heat transmitted to the inner surface of the heat dissipating cover 110 is transmitted to the outer surface of the heat dissipating cover 110 while the heat is transmitted through the space between the outer surface of the heat dissipating cover 110 and the plurality of heat dissipating ribs 150
  • the remaining heat is supplied to the first ends 141 of the plurality of unit heat pipes 140 through the heat conductive grooves 111 formed on the outer surface of the heat dissipating cover 110 and the pipe fixing block 160, .
  • the heat transfer fluid filled in the plurality of unit heat pipes 140 is vaporized and is moved to the other end 142 of the plurality of unit heat pipes 140 located on the upper side, And is radiated through the ribs 150 in a second order.
  • the vaporized heat transfer fluid is condensed and re-liquefied in the course of heat transfer to the plurality of heat dissipating ribs 150, and is repeatedly vaporized by the heat transferred from the printed circuit board 120 while moving in the gravity direction, The heat generated from the element 125 is dissipated to the outside.
  • the plurality of radial heat radiators 130 are protruded upward with respect to the heat radiating cover 110 so that the upward flow is guided outward by the plurality of radiant heat emitting bodies 130 provided on the upper side even if the radiated air forms a rising air flow, It is possible to prevent the heat radiating performance of the plurality of radial heat radiators 130 provided on the upper side from being lowered by the primary or secondary radiated heat of the plurality of radial heat radiators 130 that are formed.
  • a plurality of radial heat radiating elements 130 adjacent to each other are spaced apart from each other by a predetermined distance so that the heat radiating ribs 150, the inflow amount of the air increases greatly compared with the conventional one, so that the heat radiation performance can be improved.
  • FIG. 7 is a perspective view showing another embodiment of the heat dissipating device of the electric field element according to the present invention
  • FIG. 8 is an exploded perspective view of FIG. 7
  • FIG. 9 is a sectional view taken along line B-B of FIG.
  • a plurality of radiant heat emitting bodies 130 are basically separated from each other by a predetermined distance on the outer surface of the heat radiating cover 110 The same technical features are assumed to be the same.
  • a plurality of heat conduction grooves 111 and a plurality of unit heat pipes 140 are formed on the left and right sides of the heat dissipating device 100 '
  • the adjacent heat conduction grooves 111 and the unit heat pipes 140 may be arranged to have different heights.
  • the plurality of radial heat radiators 130 are arranged in a plurality of rows in the vertical direction, and each radial heat radiator 130 is disposed at a different height from the adjacent heat radiator,
  • the air flow path can be more variously secured.
  • each of the ends of the plurality of heat dissipating ribs 150 among the plurality of radiant heat emitting elements 130 is formed to have the same distance from the outer surface of the heat dissipating cover 110 . That is, each of the front ends of the heat radiating ribs 150 of the plurality of radial heat radiating elements 130 has an advantage in that it is easy to design the exposure to the outside by forming a front end surface parallel to the outer surface of the heat radiating cover 110.
  • a rib protection cover may be separately provided in which a plurality of flow holes through which the air of the heat dissipating ribs 150 flows. It is preferable that the rib protecting cover is manufactured in a suitable form capable of performing a function for preventing breakage during installation by an operator so long as the heat radiation performance is not lowered.
  • FIG. 10 is a cross-sectional view and a partially enlarged perspective view showing still another embodiment of the heat dissipating device 100 of the electric field element according to the present invention.
  • a plurality of heat dissipating ribs (not shown) formed on the outer circumferential surface of the other end portion 142 of the plurality of unit heat pipes 140 150 may be formed such that the distal end spaced apart from the outer circumferential surface of the other end 142 of the unit heat pipe 140 is not at least upward.
  • the outer circumferential surface of the other end 142 of the unit heat pipe 140 refers to an outer circumferential surface of a bar shape arranged with an upward inclination, and the tips of the plurality of heat dissipating ribs 150 are connected to the other end 142 of the unit heat pipe 140, Refers to the end portions of the plurality of heat dissipating ribs 150 farthest from the outer circumferential surface.
  • the tip of the plurality of heat dissipating ribs 150 is formed so as not to be upward from the outer circumferential surface of the plurality of unit heat pipes 140, it means that half of the outer circumferential surface of the other end portion 142 of the plurality of unit heat pipes 140 And a plurality of radiating heaters 130 are provided in a shape that does not include a plurality of radiating ribs 150 in the other half portion will be.
  • Embodiments of the heat dissipation device of the electric field element according to the present invention can be used particularly in an antenna device having an electric field element with high heat generation.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La présente invention concerne un dispositif de rayonnement de chaleur destiné à un élément électronique, comprenant : une carte de circuit imprimé présentant une surface sur laquelle sont montés une pluralité d'éléments électroniques, au moins un élément de la pluralité d'éléments électroniques produisant et émettant de la chaleur pendant le fonctionnement ; un boîtier de carte contenant la carte de circuit imprimé ; un couvercle de rayonnement de chaleur qui recouvre le boîtier de carte et présente une surface interne qui est en contact étroit avec l'autre surface de la carte de circuit imprimé ; et une pluralité de corps de rayonnement de chaleur radiale, dont au moins un est disposé de façon à faire saillie depuis la surface externe du couvercle de rayonnement de chaleur, et dont chacun s'étend de manière inclinée dans la direction montante, reçoit de la chaleur produite provenant de la carte de circuit imprimé, et émet la chaleur reçue à vers l'extérieur. Par conséquent, la présente invention peut considérablement améliorer les performances de rayonnement de chaleur en augmentant une zone de rayonnement de chaleur efficace dans une zone de rayonnement de chaleur limitée.
PCT/KR2018/015619 2017-12-08 2018-12-10 Dispositif de rayonnement de chaleur destiné à un élément électronique Ceased WO2019112400A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201880079396.XA CN111788876B (zh) 2017-12-08 2018-12-10 电子元件的散热装置
JP2020530655A JP7045457B2 (ja) 2017-12-08 2018-12-10 電装素子の放熱装置
US16/893,394 US11266041B2 (en) 2017-12-08 2020-06-04 Cooling apparatus for electronic element

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2017-0168698 2017-12-08
KR20170168698 2017-12-08
KR1020180158227A KR102147658B1 (ko) 2017-12-08 2018-12-10 전장소자의 방열 장치
KR10-2018-0158227 2018-12-10

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US16/893,394 Continuation US11266041B2 (en) 2017-12-08 2020-06-04 Cooling apparatus for electronic element

Publications (1)

Publication Number Publication Date
WO2019112400A1 true WO2019112400A1 (fr) 2019-06-13

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PCT/KR2018/015619 Ceased WO2019112400A1 (fr) 2017-12-08 2018-12-10 Dispositif de rayonnement de chaleur destiné à un élément électronique

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114071964A (zh) * 2021-11-16 2022-02-18 北京华电力拓能源科技有限公司 一种矿用防爆兼本安的5g无线基站散热装置
CN114791098A (zh) * 2022-06-09 2022-07-26 上海阿卡得电子有限公司 一种led驱动电源的散热装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07283564A (ja) * 1994-04-05 1995-10-27 Hitachi Ltd 電子装置
JPH1154680A (ja) * 1997-07-30 1999-02-26 Hitachi Ltd 放熱構造とこれを用いた電子装置
US6807059B1 (en) * 1998-12-28 2004-10-19 James L. Dale Stud welded pin fin heat sink
KR20140126438A (ko) * 2013-04-23 2014-10-31 주식회사 그린와이드 하이브리드 방열파이프 및 이를 이용한 방열모듈
US20170194751A1 (en) * 2015-12-31 2017-07-06 Foxconn Interconnect Technology Limited Plug connecetor with a metallic enclosure having heat sink member thereon

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07283564A (ja) * 1994-04-05 1995-10-27 Hitachi Ltd 電子装置
JPH1154680A (ja) * 1997-07-30 1999-02-26 Hitachi Ltd 放熱構造とこれを用いた電子装置
US6807059B1 (en) * 1998-12-28 2004-10-19 James L. Dale Stud welded pin fin heat sink
KR20140126438A (ko) * 2013-04-23 2014-10-31 주식회사 그린와이드 하이브리드 방열파이프 및 이를 이용한 방열모듈
US20170194751A1 (en) * 2015-12-31 2017-07-06 Foxconn Interconnect Technology Limited Plug connecetor with a metallic enclosure having heat sink member thereon

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114071964A (zh) * 2021-11-16 2022-02-18 北京华电力拓能源科技有限公司 一种矿用防爆兼本安的5g无线基站散热装置
CN114071964B (zh) * 2021-11-16 2024-05-31 北京华电力拓能源科技有限公司 一种矿用防爆兼本安的5g无线基站散热装置
CN114791098A (zh) * 2022-06-09 2022-07-26 上海阿卡得电子有限公司 一种led驱动电源的散热装置

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